TWM606487U - Illuminated keyboard - Google Patents

Illuminated keyboard Download PDF

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Publication number
TWM606487U
TWM606487U TW109212221U TW109212221U TWM606487U TW M606487 U TWM606487 U TW M606487U TW 109212221 U TW109212221 U TW 109212221U TW 109212221 U TW109212221 U TW 109212221U TW M606487 U TWM606487 U TW M606487U
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Taiwan
Prior art keywords
light
guide plate
light guide
perforation
keyboard according
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TW109212221U
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Chinese (zh)
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陳昱光
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華碩電腦股份有限公司
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Priority to TW109212221U priority Critical patent/TWM606487U/en
Publication of TWM606487U publication Critical patent/TWM606487U/en

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Abstract

An illuminated keyboard comprises a base plate, a plurality of key structures, and a backlight module. The base plate comprises a plurality of first openings. The key structures are disposed on the first openings of the base plate. The backlight module is disposed under the base plate and comprises a light guide plate, a first circuit film, an illuminating unit, and a reflective film. The light guide plate comprises a plurality of first through holes aligning to the first openings and a second through hole located between neighboring first through holes. The first circuit film is disposed on a lower surface of the light guide plate and covers the second through hole. The illuminating unit is located in the second through hole and electrically connected to the first circuit film. The reflective film is disposed on an upper surface of the light guide plate and covers the second through hole.

Description

發光鍵盤Illuminated keyboard

本案係關於一種鍵盤,特別是關於一種發光鍵盤。This case is about a keyboard, especially a luminous keyboard.

隨著筆記型電腦的日漸普及,發光鍵盤也逐漸應用在筆記型電腦。筆記型電腦上的發光鍵盤中,背光模組通常都會設計散熱孔以提升筆記型電腦的散熱效果。散熱孔的面積越大、數量越多則進風量越大,散熱效果越好。但是,過多的散熱孔會阻礙導光路徑,影響鍵盤發光的亮度與均勻性。With the increasing popularity of notebook computers, illuminated keyboards are gradually being used in notebook computers. In the illuminated keyboard on the notebook computer, the backlight module is usually designed with heat dissipation holes to improve the heat dissipation effect of the notebook computer. The larger the area and number of radiating holes, the greater the air intake and the better the heat dissipation effect. However, too many heat dissipation holes will hinder the light guide path and affect the brightness and uniformity of the keyboard light.

本案提供一種發光鍵盤。此發光鍵盤包含一底板、複數按鍵結構與一背光模組。其中,底板包含複數第一開孔。複數按鍵結構設置於底板上,且分別對應這些第一開孔。背光模組設置於底板下。This case provides a luminous keyboard. The luminous keyboard includes a bottom plate, a plurality of key structures and a backlight module. Wherein, the bottom plate includes a plurality of first openings. The multiple key structures are arranged on the bottom plate and correspond to the first openings respectively. The backlight module is arranged under the bottom plate.

此背光模組包含一導光板、一第一電路薄膜、一發光單元以及一光反射薄膜。其中,導光板包含複數第一穿孔與一第二穿孔。這些第一穿孔係分別對準這些第一開孔。第二穿孔係位於相鄰第一穿孔之間。第一電路薄膜係設置於導光板之一下表面,且覆蓋第二穿孔。發光單元係設置於第二穿孔內,且電性連接第一電路薄膜。光反射薄膜係設置於導光板之一上表面,且覆蓋第二穿孔。The backlight module includes a light guide plate, a first circuit film, a light-emitting unit and a light reflection film. Wherein, the light guide plate includes a plurality of first through holes and a second through hole. The first through holes are respectively aligned with the first openings. The second perforation is located between adjacent first perforations. The first circuit film is arranged on a lower surface of the light guide plate and covers the second perforation. The light emitting unit is arranged in the second through hole and is electrically connected to the first circuit film. The light reflection film is arranged on an upper surface of the light guide plate and covers the second perforation.

本案所提供之發光鍵盤係在底板對應於按鍵結構的位置形成多個第一開孔,並在導光板上形成複數第一穿孔分別對準這些第一開孔,發光單元則是設置於導光板的第二穿孔內。發光單元產生的光線可透過導光板由多個第一穿孔向上穿出,以改善發光均勻度。此外,這些第一開孔與第一穿孔並可作為散熱孔,以因應電子裝置之散熱需求。The light-emitting keyboard provided in this case is formed with a plurality of first openings on the bottom plate corresponding to the key structure, and a plurality of first holes are formed on the light guide plate to align with these first openings, and the light emitting unit is arranged on the light guide plate Within the second perforation. The light generated by the light-emitting unit can pass through the light guide plate and pass upward through the plurality of first through holes to improve the uniformity of light emission. In addition, these first openings and first through holes can be used as heat dissipation holes to meet the heat dissipation requirements of the electronic device.

下面將結合示意圖對本案的具體實施方式進行更詳細的描述。根據下列描述和申請專利範圍,本案的優點和特徵將更清楚。需說明的是,圖式均採用非常簡化的形式且均使用非精準的比例,僅用以方便、明晰地輔助說明本案實施例的目的。The specific implementation of this case will be described in more detail below in conjunction with the schematic diagram. According to the following description and the scope of patent application, the advantages and features of this case will be clearer. It should be noted that the drawings are in a very simplified form and all use imprecise proportions, which are only used to conveniently and clearly assist in explaining the purpose of the embodiments of this case.

第一圖係本案發光鍵盤一實施例之剖面示意圖。圖中顯示此發光鍵盤之二相鄰按鍵間的結構以便於說明。如圖中所示,此發光鍵盤100包含一底板120、複數按鍵結構140、一背光模組160與一框體180。The first figure is a schematic cross-sectional view of an embodiment of the illuminated keyboard in this case. The figure shows the structure between the two adjacent keys of the illuminated keyboard for ease of description. As shown in the figure, the illuminated keyboard 100 includes a bottom plate 120, a plurality of key structures 140, a backlight module 160 and a frame 180.

請一併參照第二圖,第二圖係第一圖中之底板一實施例之俯視示意圖。如圖中所示,底板120包含複數第一開孔122(圖中以二個第一開孔122為例)與一第二開孔124。第二開孔124係位於相鄰二第一開孔122之間。Please also refer to the second figure, which is a schematic top view of an embodiment of the bottom plate in the first figure. As shown in the figure, the bottom plate 120 includes a plurality of first openings 122 (two first openings 122 are taken as an example in the figure) and a second opening 124. The second opening 124 is located between two adjacent first openings 122.

按鍵結構140係設置於底板120上,且對應至底板120上的第一開孔122。這些按鍵結構140在底板120上的設置位置係對準底板120上的第一開孔122的位置。底板120上可覆蓋一軟性電路板(未圖示)以接收按鍵結構140產生之壓按訊號。在一實施例中,此底板120可以是一金屬板。The key structure 140 is disposed on the bottom plate 120 and corresponds to the first opening 122 on the bottom plate 120. The position of the key structure 140 on the bottom plate 120 is aligned with the position of the first opening 122 on the bottom plate 120. A flexible circuit board (not shown) can be covered on the bottom plate 120 to receive the pressing signal generated by the button structure 140. In an embodiment, the bottom plate 120 may be a metal plate.

背光模組160係設置於底板120下方。框體180係設置於底板120上,且包含複數開口182,以露出前述多個按鍵結構140。The backlight module 160 is disposed under the bottom plate 120. The frame 180 is disposed on the bottom plate 120 and includes a plurality of openings 182 to expose the plurality of key structures 140.

背光模組160包含一導光板162、一第一電路薄膜164、一發光單元166以及一光反射薄膜168。導光板162包含複數第一穿孔1622(圖中以二個第一穿孔1622為例)與一第二穿孔1624。這些第一穿孔1622係分別對準底板120上的第一開孔122。第二穿孔1624係位於二個第一穿孔1622之間,且對準底板120上的第二開孔124。The backlight module 160 includes a light guide plate 162, a first circuit film 164, a light emitting unit 166, and a light reflection film 168. The light guide plate 162 includes a plurality of first perforations 1622 (two first perforations 1622 are taken as an example in the figure) and a second perforation 1624. The first through holes 1622 are respectively aligned with the first openings 122 on the bottom plate 120. The second through hole 1624 is located between the two first through holes 1622 and is aligned with the second hole 124 on the bottom plate 120.

導光板具有一上表面162a與一下表面162b。第一電路薄膜164係設置於導光板162之下表面162b,且覆蓋第二穿孔1624。此第一電路薄膜164係電性連接發光單元166,以對發光單元166進行供電。在一實施例中,第一電路薄膜164可透過黏貼方式固定於導光板162之下表面。在一實施例中,第一電路薄膜164可以是一軟性電路板。The light guide plate has an upper surface 162a and a lower surface 162b. The first circuit film 164 is disposed on the lower surface 162 b of the light guide plate 162 and covers the second through hole 1624. The first circuit film 164 is electrically connected to the light-emitting unit 166 to supply power to the light-emitting unit 166. In an embodiment, the first circuit film 164 can be fixed to the lower surface of the light guide plate 162 by pasting. In an embodiment, the first circuit film 164 may be a flexible circuit board.

第一電路薄膜164包括一導電圖案層1642與一反光層1644。導電圖案層1642係位於第一電路薄膜164朝向導光板162之一側,以電性連接發光單元166。反光層1644係位於第一電路薄膜164背對導光板之一側,以提供光反射效果,避免光線向下外漏影響發光鍵盤的發光效果。在一實施例中,導電圖案層1642可以是一銀膠塗層。在一實施例中,反光層1644可以是一金屬塗層或是一白色塗層。The first circuit film 164 includes a conductive pattern layer 1642 and a reflective layer 1644. The conductive pattern layer 1642 is located on the side of the first circuit film 164 facing the light guide plate 162 to electrically connect the light emitting unit 166. The light-reflecting layer 1644 is located on the side of the first circuit film 164 facing away from the light guide plate to provide a light reflection effect and prevent light from leaking downward to affect the light-emitting effect of the light-emitting keyboard. In an embodiment, the conductive pattern layer 1642 may be a silver paste coating. In one embodiment, the reflective layer 1644 may be a metal coating or a white coating.

光反射薄膜168係設置於導光板162之上表面162a,且覆蓋第二穿孔1624。光反射薄膜168可確保光線在導光板162內的反射效率,避免光線外漏。在一實施例中,光反射薄膜168可透過黏貼方式固定於導光板162之上表面162a。在一實施例中,光反射薄膜168可包括一光反射層1682與一光遮蔽層1684,光遮蔽層1684係疊合於光反射層1682上。The light reflection film 168 is disposed on the upper surface 162 a of the light guide plate 162 and covers the second perforation 1624. The light reflection film 168 can ensure the reflection efficiency of the light in the light guide plate 162 and prevent the light from leaking. In one embodiment, the light reflective film 168 can be fixed to the upper surface 162a of the light guide plate 162 by pasting. In one embodiment, the light reflective film 168 may include a light reflective layer 1682 and a light shielding layer 1684, and the light shielding layer 1684 is laminated on the light reflective layer 1682.

也就是說,光反射層1682係位於光反射薄膜168朝向導光板162之一側,光遮蔽層1684係位於光反射薄膜168背對導光板162之一側。如此,即可提供有效的光反射效果,同時避免光線外漏而影響發光鍵盤的發光效果。在一實施例中,光反射層1682可以是一白色塗層,光遮蔽層1684可以是一黑色塗層。In other words, the light reflective layer 1682 is located on the side of the light reflective film 168 facing the light guide plate 162, and the light shielding layer 1684 is located on the side of the light reflective film 168 facing away from the light guide plate 162. In this way, an effective light reflection effect can be provided, and at the same time, the leakage of light can be avoided to affect the light-emitting effect of the light-emitting keyboard. In an embodiment, the light reflection layer 1682 may be a white coating, and the light shielding layer 1684 may be a black coating.

發光單元166係設置於第二穿孔1624內,且電性連接第一電路薄膜164。在一實施例中,考量到導光板162的厚度以及本案發光鍵盤100中發光單元166所需提供的點亮範圍,此發光單元166可以是一微發光二極體(micro LED)或其他小型的固態光源。The light emitting unit 166 is disposed in the second through hole 1624 and is electrically connected to the first circuit film 164. In one embodiment, considering the thickness of the light guide plate 162 and the lighting range required by the light-emitting unit 166 in the light-emitting keyboard 100 of this application, the light-emitting unit 166 may be a micro LED or other small Solid state light source.

以微發光二極體為例,如圖中所示,發光單元166包含一發光二極體晶片1662與一透明膠層1664。發光二極體晶片1662直接固定於第一電路薄膜164,且電性連接第一電路薄膜164以取得供電。在一實施例中,發光二極體晶片1662可透過表面黏貼技術(Surface mount technology, SMT)或是裸晶封裝技術(chip on board, COB)固定且電性連接於第一電路薄膜164上。Taking the micro light emitting diode as an example, as shown in the figure, the light emitting unit 166 includes a light emitting diode chip 1662 and a transparent glue layer 1664. The light emitting diode chip 1662 is directly fixed to the first circuit film 164 and is electrically connected to the first circuit film 164 to obtain power. In one embodiment, the light-emitting diode chip 1662 can be fixed and electrically connected to the first circuit film 164 through surface mount technology (SMT) or chip on board (COB) technology.

透明膠層1664係形成於第一電路薄膜164上且包覆發光二極體晶片1662,有效將發光二極體晶片1662與外界隔絕。在一實施例中,如圖中所示,此發光單元166的整體高度略大於導光板162之厚度。在此情況下,透明膠層1664會突出於導光板162之上表面162a。相對應於此,光反射薄膜168在對應於第二穿孔1624處會形成一上凸部分168a以容納此透明膠層1664的突出部分。此上凸部分168a係延伸至底板120之第二開孔124內。如此,即可避免透明膠層1664受到底板120擠壓而向下推擠第一電路薄膜164,使第一電路薄膜164脫離導光板162。在一實施例中,底板120上之第二開孔124之大小係略大於導光板162之第二穿孔1624之大小,以容納光反射薄膜168之上凸部分168a。The transparent adhesive layer 1664 is formed on the first circuit film 164 and covers the light-emitting diode chip 1662, which effectively isolates the light-emitting diode chip 1662 from the outside. In one embodiment, as shown in the figure, the overall height of the light emitting unit 166 is slightly larger than the thickness of the light guide plate 162. In this case, the transparent adhesive layer 1664 will protrude from the upper surface 162 a of the light guide plate 162. Correspondingly, the light reflective film 168 will form an upper convex portion 168a at the position corresponding to the second perforation 1624 to accommodate the protruding portion of the transparent adhesive layer 1664. The upper convex portion 168 a extends into the second opening 124 of the bottom plate 120. In this way, the transparent adhesive layer 1664 can be prevented from being squeezed by the bottom plate 120 to push the first circuit film 164 downward, so that the first circuit film 164 is separated from the light guide plate 162. In one embodiment, the size of the second opening 124 on the bottom plate 120 is slightly larger than the size of the second perforation 1624 of the light guide plate 162 to accommodate the convex portion 168 a of the light reflection film 168.

發光單元166所產生之光線係透過導光板162由第二穿孔1624橫向傳遞至第一穿孔1622處再透過底板120的第一開孔122向上投射。The light generated by the light emitting unit 166 is transmitted through the light guide plate 162 from the second perforation 1624 to the first perforation 1622 and then projected upward through the first opening 122 of the bottom plate 120.

在一實施例中,為了提升背光模組160的發光效率,如圖中所示,導光板162之下表面162b可包括複數表面微結構1626,這些表面微結構1626且位於各個第一穿孔1622之周圍。表面微結構1626可對於導光板162內的光線進行反射與散射,以破除導光板162內的全反射,使光線透過底板120的第一開孔122向上射出。In one embodiment, in order to improve the luminous efficiency of the backlight module 160, as shown in the figure, the lower surface 162b of the light guide plate 162 may include a plurality of surface microstructures 1626. These surface microstructures 1626 are located in each of the first through holes 1622. around. The surface microstructure 1626 can reflect and scatter the light in the light guide plate 162 so as to break the total reflection in the light guide plate 162 so that the light is emitted upward through the first opening 122 of the bottom plate 120.

在一實施例中,此表面微結構1626可以是V溝微結構或是網點微結構。又,為了避免導光板162向上投射的光線直接投射至使用者的眼睛而造成不適,在一實施例中,底板120之第一開孔122的範圍係涵蓋於按鍵結構140之鍵帽的投影範圍內,且導光板162之第一穿孔1622之寬度係小於按鍵結構140之鍵帽寬度。In one embodiment, the surface microstructure 1626 may be a V-groove microstructure or a dot microstructure. In addition, in order to prevent the light projected upward from the light guide plate 162 from being directly projected to the user’s eyes and causing discomfort, in one embodiment, the range of the first opening 122 of the bottom plate 120 covers the projection range of the key cap of the key structure 140 The width of the first through hole 1622 of the light guide plate 162 is smaller than the width of the key cap of the key structure 140.

值得注意的是,第一圖係顯示本案發光鍵盤之二相鄰按鍵間的結構以便於說明本案之技術特徵。在實際應用上,第一圖的結構可應用於發光鍵盤上任何需要提供背光照明的區域。在一實施例中,可在發光鍵盤之任二個相鄰按鍵間,均設置如本案第一圖所示的結構以提供均勻的照明。It is worth noting that the first figure shows the structure between the two adjacent keys of the illuminated keyboard in this case in order to illustrate the technical features of this case. In practical applications, the structure of the first figure can be applied to any area on the illuminated keyboard that needs to be backlit. In one embodiment, a structure as shown in the first figure of this case can be arranged between any two adjacent keys of the illuminated keyboard to provide uniform illumination.

第三圖係本案發光鍵盤另一實施例之剖面示意圖。如圖中所示,本實施例之發光鍵盤200與第一圖之發光鍵盤100的主要差異在於,本實施例對於發光單元266的尺寸進行控制,使透明膠層2664之上表面齊平於導光板162之上表面162a或是位於第二穿孔1624內,避免透明膠層2664突出導光板162之上表面162a。The third figure is a schematic cross-sectional view of another embodiment of the illuminated keyboard of the present invention. As shown in the figure, the main difference between the light-emitting keyboard 200 of this embodiment and the light-emitting keyboard 100 of the first figure is that this embodiment controls the size of the light-emitting unit 266 so that the upper surface of the transparent adhesive layer 2664 is flush with the guide. The upper surface 162a of the light plate 162 may be located in the second through hole 1624 to prevent the transparent adhesive layer 2664 from protruding from the upper surface 162a of the light guide plate 162.

也就是說,不同於第一圖之實施例中,透明膠層1664突出導光板162之上表面162a,本實施例之透明膠層2664係完全位於第二穿孔1624內。由於透明膠層2664係完全位於第二穿孔1624內,全面覆蓋導光板162與第二穿孔1624的光反射薄膜268會呈現平整的外型。此外,本實施例之底板220上也不需如第一圖之實施例形成第二開孔124以容納光反射薄膜168的突出部分。本實施例之發光鍵盤200的其他部分相同於第一圖之發光鍵盤100,在此不予贅述。That is, different from the embodiment in the first figure, the transparent adhesive layer 1664 protrudes from the upper surface 162a of the light guide plate 162, and the transparent adhesive layer 2664 of this embodiment is completely located in the second perforation 1624. Since the transparent adhesive layer 2664 is completely located in the second perforation 1624, the light reflection film 268 covering the light guide plate 162 and the second perforation 1624 will have a flat appearance. In addition, the bottom plate 220 of this embodiment does not need to form a second opening 124 to accommodate the protruding portion of the light reflection film 168 as in the embodiment of the first figure. The other parts of the illuminated keyboard 200 in this embodiment are the same as the illuminated keyboard 100 in the first figure, and will not be repeated here.

本案所提供之發光鍵盤100, 200係在底板120, 220對應於按鍵結構140的位置形成多個第一開孔122,並在導光板162上形成複數第一穿孔1622分別對準這些第一開孔122,發光二極體晶片1662則是設置於導光板162的第二穿孔1624內。發光二極體晶片1662產生的光線可透過導光板162由多個第一穿孔1622向上穿出,以改善發光均勻度。此外,這些第一開孔122與第一穿孔1622並可作為散熱孔,以因應電子裝置之散熱需求。The light-emitting keyboard 100, 200 provided in this case is formed with a plurality of first openings 122 on the bottom plate 120, 220 corresponding to the key structure 140, and a plurality of first holes 1622 are formed on the light guide plate 162 to align with these first openings. The hole 122 and the light-emitting diode chip 1662 are disposed in the second through hole 1624 of the light guide plate 162. The light generated by the light emitting diode chip 1662 can pass through the light guide plate 162 and pass upward through the plurality of first through holes 1622 to improve the uniformity of light emission. In addition, these first openings 122 and first through holes 1622 can be used as heat dissipation holes to meet the heat dissipation requirements of the electronic device.

上述僅為本案較佳之實施例而已,並不對本案進行任何限制。任何所屬技術領域的技術人員,在不脫離本案的技術手段的範圍內,對本案揭露的技術手段和技術內容做任何形式的等同替換或修改等變動,均屬未脫離本案的技術手段的內容,仍屬於本案的保護範圍之內。The above are only preferred embodiments of this case and do not impose any limitation on this case. Any person skilled in the technical field who makes any form of equivalent substitution or modification to the technical means and technical content disclosed in this case within the scope of the technical means of this case is not deviated from the technical means of this case. It still falls within the scope of protection of this case.

100, 200:發光鍵盤 120, 220:底板 140:按鍵結構 160:背光模組 180:框體 122:第一開孔 124:第二開孔 162:導光板 164:第一電路薄膜 1642:導電圖案層 1644:反光層 166, 266:發光單元 168, 268:光反射薄膜 1622:第一穿孔 1624:第二穿孔 162a:上表面 162b:下表面 1682:光反射層 1684:光遮蔽層 1662:發光二極體晶片 1664, 2664:透明膠層 168a:上凸部分 1626:表面微結構 182:開口 100, 200: illuminated keyboard 120, 220: bottom plate 140: Button structure 160: backlight module 180: frame 122: first opening 124: second opening 162: light guide plate 164: The first circuit film 1642: conductive pattern layer 1644: reflective layer 166, 266: light-emitting unit 168, 268: light reflective film 1622: first perforation 1624: second piercing 162a: upper surface 162b: lower surface 1682: light reflection layer 1684: light shielding layer 1662: LED chip 1664, 2664: transparent glue layer 168a: convex part 1626: Surface microstructure 182: open

第一圖係本案發光鍵盤一實施例之剖面示意圖; 第二圖係第一圖中之底板一實施例之俯視示意圖;以及 第三圖係本案發光鍵盤另一實施例之剖面示意圖。 The first figure is a schematic cross-sectional view of an embodiment of the illuminated keyboard in this case; The second figure is a schematic top view of an embodiment of the bottom plate in the first figure; and The third figure is a schematic cross-sectional view of another embodiment of the illuminated keyboard of the present invention.

100:發光鍵盤 100: illuminated keyboard

120:底板 120: bottom plate

140:按鍵結構 140: Button structure

160:背光模組 160: backlight module

180:框體 180: frame

122:第一開孔 122: first opening

124:第二開孔 124: second opening

162:導光板 162: light guide plate

164:第一電路薄膜 164: The first circuit film

1642:導電圖案層 1642: conductive pattern layer

1644:反光層 1644: reflective layer

166:發光單元 166: light-emitting unit

168:光反射薄膜 168: light reflective film

1622:第一穿孔 1622: first perforation

1624:第二穿孔 1624: second piercing

162a:上表面 162a: upper surface

162b:下表面 162b: lower surface

1682:光反射層 1682: light reflection layer

1684:光遮蔽層 1684: light shielding layer

1662:發光二極體晶片 1662: LED chip

1664:透明膠層 1664: transparent glue layer

168a:上凸部分 168a: convex part

1626:表面微結構 1626: Surface microstructure

182:開口 182: open

Claims (11)

一種發光鍵盤,包含: 一底板,包含複數第一開孔; 複數按鍵結構,設置於該底板上,且分別對應該些第一開孔; 一背光模組,設置於該底板下,該背光模組包括: 一導光板,包含複數第一穿孔與一第二穿孔,該些第一穿孔係分別對準該些第一開孔,該第二穿孔係位於相鄰該第一穿孔之間; 一第一電路薄膜,設置於該導光板之一下表面,且覆蓋該第二穿孔; 一發光單元,設置於該第二穿孔內,且電性連接該第一電路薄膜;以及 一光反射薄膜,設置於該導光板之一上表面,且覆蓋該第二穿孔。 A luminous keyboard, including: A bottom plate including a plurality of first openings; A plurality of button structures are arranged on the bottom plate and correspond to the first openings respectively; A backlight module is arranged under the bottom plate, and the backlight module includes: A light guide plate comprising a plurality of first perforations and a second perforation, the first perforations are respectively aligned with the first openings, and the second perforation is located between the adjacent first perforations; A first circuit film disposed on a lower surface of the light guide plate and covering the second perforation; A light-emitting unit disposed in the second through hole and electrically connected to the first circuit film; and A light reflection film is arranged on an upper surface of the light guide plate and covers the second perforation. 如請求項1所述之發光鍵盤,其中,該導光板之該下表面包括複數表面微結構,且位於該些第一穿孔之周圍。The illuminated keyboard according to claim 1, wherein the lower surface of the light guide plate includes a plurality of surface microstructures and is located around the first perforations. 如請求項1所述之發光鍵盤,其中,該發光單元係一微發光二極體(micro LED)。The light-emitting keyboard according to claim 1, wherein the light-emitting unit is a micro LED. 如請求項1所述之發光鍵盤,其中,該光反射薄膜包括一光反射層與一光遮蔽層,該光遮蔽層係疊合於該光反射層上。The luminous keyboard according to claim 1, wherein the light reflective film includes a light reflective layer and a light shielding layer, and the light shielding layer is laminated on the light reflective layer. 如請求項1所述之發光鍵盤,其中,該第一電路薄膜包括一反光層,該反光層係位於該第一電路薄膜背對該導光板之一側。The light-emitting keyboard according to claim 1, wherein the first circuit film includes a light-reflecting layer, and the light-reflecting layer is located on a side of the first circuit film back to the light guide plate. 如請求項1所述之發光鍵盤,更包括一框體,設置於該底板上,且包含複數開口,以露出該些按鍵結構。The illuminated keyboard according to claim 1, further comprising a frame, which is arranged on the bottom plate and includes a plurality of openings to expose the key structures. 如請求項1所述之發光鍵盤,其中,該發光單元包含一發光二極體晶片與一透明膠層,該發光二極體晶片係電性連接該第一電路薄膜,該透明膠層係形成於該第一電路薄膜上且包覆該發光二極體晶片。The light-emitting keyboard according to claim 1, wherein the light-emitting unit comprises a light-emitting diode chip and a transparent glue layer, the light-emitting diode chip is electrically connected to the first circuit film, and the transparent glue layer is formed Covering the light emitting diode chip on the first circuit film. 如請求項7所述之發光鍵盤,其中,該透明膠層係完全位於該第二穿孔內。The luminous keyboard according to claim 7, wherein the transparent adhesive layer is completely located in the second perforation. 如請求項7所述之發光鍵盤,其中,該透明膠層係突出於該導光板之該上表面,該光反射薄膜在對應於該第二穿孔處包含一上凸部分,以容納該透明膠層。The luminous keyboard according to claim 7, wherein the transparent adhesive layer protrudes from the upper surface of the light guide plate, and the light reflection film includes an upper convex portion corresponding to the second perforation to accommodate the transparent adhesive Floor. 如請求項9所述之發光鍵盤,其中,該底板更包括一第二開孔,該第二開孔係位於相鄰二該第一開孔間,以容納該上凸部分。The illuminated keyboard according to claim 9, wherein the bottom plate further includes a second opening, and the second opening is located between two adjacent first openings to accommodate the upper convex portion. 如請求項1所述之發光鍵盤,其中,該第一穿孔之寬度小於該按鍵結構之鍵帽寬度。The illuminated keyboard according to claim 1, wherein the width of the first perforation is smaller than the width of the keycap of the key structure.
TW109212221U 2020-09-17 2020-09-17 Illuminated keyboard TWM606487U (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11366263B1 (en) 2021-08-12 2022-06-21 Chicony Power Technology Co., Ltd. Backlight module
TWI769917B (en) * 2021-09-03 2022-07-01 茂林光電科技股份有限公司 Thin direct type backlight module
US11550094B1 (en) 2022-03-08 2023-01-10 Chicony Power Technology Co., Ltd. Backlight module and method of manufacturing the same

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11366263B1 (en) 2021-08-12 2022-06-21 Chicony Power Technology Co., Ltd. Backlight module
TWI780860B (en) * 2021-08-12 2022-10-11 群光電能科技股份有限公司 Backlight module
TWI769917B (en) * 2021-09-03 2022-07-01 茂林光電科技股份有限公司 Thin direct type backlight module
US11550094B1 (en) 2022-03-08 2023-01-10 Chicony Power Technology Co., Ltd. Backlight module and method of manufacturing the same
TWI790137B (en) * 2022-03-08 2023-01-11 群光電能科技股份有限公司 Backlight module and method of manufacturing the same

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