TWI704017B - Double-rotation nozzle for cleaning wafer surface particles - Google Patents

Double-rotation nozzle for cleaning wafer surface particles Download PDF

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Publication number
TWI704017B
TWI704017B TW108123586A TW108123586A TWI704017B TW I704017 B TWI704017 B TW I704017B TW 108123586 A TW108123586 A TW 108123586A TW 108123586 A TW108123586 A TW 108123586A TW I704017 B TWI704017 B TW I704017B
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inert gas
nozzle
inner core
ring cavity
outer ring
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TW108123586A
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Chinese (zh)
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TW202041292A (en
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彭博
李檀
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大陸商瀋陽芯源微電子設備股份有限公司
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B7/00—Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas
    • B05B7/02—Spray pistols; Apparatus for discharge
    • B05B7/04—Spray pistols; Apparatus for discharge with arrangements for mixing liquids or other fluent materials before discharge
    • B05B7/0416—Spray pistols; Apparatus for discharge with arrangements for mixing liquids or other fluent materials before discharge with arrangements for mixing one gas and one liquid
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)

Abstract

本發明關於一種晶圓表面顆粒清洗雙旋噴嘴，包括噴嘴外殼及內芯，內芯上開設有液體通道及惰性氣體旋轉內、外環腔，惰性氣體旋轉內、外環腔分別連通有惰性氣體空間，惰性氣體空間開設於內芯上或由內芯與噴嘴外殼內壁之間形成；內芯上開設有用於連通惰性氣體空間與惰性氣體旋轉內環腔以及用於連通惰性氣體空間與惰性氣體旋轉外環腔的佈風孔，惰性氣體空間內的惰性氣體藉由佈風孔呈旋轉狀向惰性氣體旋轉內、外環腔內進氣；噴嘴外殼上分別開設有向惰性氣體旋轉內、外環腔通入惰性氣體的惰性氣體進氣口。本發明藉由改變惰性氣體旋轉方向產生雙螺旋或同向螺旋氣流及控制惰性氣體加速度，同時配合清洗化學液流量，可以達到既對晶圓損傷小，又可以高效清洗晶圓的目的。 The invention relates to a double-rotation nozzle for cleaning wafer surface particles, comprising a nozzle shell and an inner core. The inner core is provided with a liquid channel and inert gas rotating inner and outer ring cavities. The inert gas rotating inner and outer ring cavities are respectively connected with inert gas Space, the inert gas space is opened on the inner core or formed between the inner core and the inner wall of the nozzle shell; the inner core is provided with a cavity for communicating the inert gas space with the inert gas rotating inner ring cavity and for communicating the inert gas space with the inert gas Rotate the air distribution hole of the outer ring cavity, the inert gas in the inert gas space rotates through the air distribution hole to enter the inert gas rotating inner and outer ring cavity; the nozzle shell is provided with the inert gas rotating inner and outer cavity respectively An inert gas inlet for inert gas is introduced into the ring cavity. By changing the rotation direction of the inert gas to generate a double spiral or the same spiral air flow and controlling the acceleration of the inert gas, the invention can achieve the purpose of not only small damage to the wafer, but also efficient cleaning of the wafer.

Description

一種晶圓表面顆粒清洗雙旋噴嘴 Double-rotation nozzle for cleaning wafer surface particles

本發明關於晶圓清洗領域，具體地說是一種晶圓表面顆粒清洗雙旋噴嘴。 The invention relates to the field of wafer cleaning, in particular to a double-rotation nozzle for cleaning wafer surface particles.

晶片製造領域，從90奈米以下起，晶片製造的良率就開始有所下降，主要原因之一就在於矽片上的顆粒物污染難以清洗。 In the field of wafer manufacturing, the yield of wafer manufacturing has begun to decline from below 90 nanometers. One of the main reasons is that the particle contamination on the silicon wafer is difficult to clean.

隨著線越做越細，到了45奈米以下，基本上整個製程中，每兩步就要做一次清洗；如果想得到較高良率，幾乎每步程序都離不開清洗。 As the line gets thinner and thinner, to below 45nm, basically the entire process requires cleaning every two steps; if you want a higher yield, almost every step of the process is inseparable from cleaning.

隨著半導體製程由2D走向3D，矽片清洗提出了新挑戰，圖形結構晶圓清洗相較於平坦表面的清洗，技術和要求都要複雜得多。 As the semiconductor manufacturing process moves from 2D to 3D, silicon wafer cleaning poses new challenges. Compared with the cleaning of flat surfaces, the technology and requirements of pattern structure wafer cleaning are much more complicated.

隨著線寬減小，深寬比的增加，清洗技術難度也迅速增大，矽片清洗的重要程度日益凸顯。 As the line width decreases and the aspect ratio increases, the difficulty of cleaning technology increases rapidly, and the importance of silicon wafer cleaning has become increasingly prominent.

為了提高晶圓製程的良率，急需一種既對晶圓損傷小，又可以高效清洗晶圓表面的清洗裝置。 In order to improve the yield of the wafer process, there is an urgent need for a cleaning device that not only does little damage to the wafer, but also can efficiently clean the surface of the wafer.

為了滿足晶圓表面清洗要求、提高晶圓製程的良率，本發明的目的在於提供一種晶圓表面顆粒清洗雙旋噴嘴。 In order to meet the requirements of wafer surface cleaning and improve the yield of the wafer process, the purpose of the present invention is to provide a dual-rotation nozzle for cleaning wafer surface particles.

本發明的目的是藉由以下技術方案來實現的： The purpose of the present invention is achieved by the following technical solutions:

本發明包括噴嘴外殼及內芯，該內芯的部分或全部插設於噴嘴外殼內，該內芯上開設有液體通道、惰性氣體旋轉內環腔及惰性氣體旋轉外環腔，該惰性氣體旋轉內環腔與惰性氣體旋轉外環腔分別位於該液體通道的內外兩側；該惰性氣體旋轉內環腔及惰性氣體旋轉外環腔分別連通有相互獨立的惰性氣體空間，該惰性氣體空間開設於內芯上或由內芯與噴嘴外殼內壁之間形成；該內芯上開設有用於連通惰性氣體空間與惰性氣體旋轉內環腔以及用於連通惰性氣體空間與惰性氣體旋轉外環腔的佈風孔，該惰性氣體空間內的惰性氣體藉由佈風孔呈旋轉狀向惰性氣體旋轉內環腔及惰性氣體旋轉外環腔內進氣，惰性氣體進入該惰性氣體旋轉內環腔及惰性氣體旋轉外環腔內的旋向相同或相反；該噴嘴外殼上分別開設有向惰性氣體旋轉內環腔及惰性氣體旋轉外環腔通入惰性氣體的惰性氣體進氣口；由該惰性氣體旋轉內環腔及惰性氣體旋轉外環腔噴出的惰性氣體對由液體通道噴出的液體在噴嘴外殼的外部混合、進行霧化，晶圓表面藉由被霧化後的液體進行清洗；其中：與該惰性氣體旋轉外環腔連通的佈風孔以及與該惰性氣體旋轉內環腔連通的佈風孔均為多個，沿圓周方向均佈，每個佈風孔均呈「L」形，該「L」形的豎邊沿該內芯的軸向開設，「L」形的橫邊沿內芯的徑向開設，且該「L」形的橫邊傾斜於「L」形的豎邊；與該惰性氣體旋轉外環腔連通的各佈風孔的「L」形橫邊的傾斜方向均相同，與該惰性氣體旋轉內環腔連通的各佈風孔的「L」形橫邊的傾斜方向均相同，惰性氣體空間內的惰性氣體以順時針旋轉或逆時針旋轉向惰性氣 體旋轉外環腔或惰性氣體旋轉內環腔內進氣；該內芯分為噴嘴上部內芯、噴嘴中部內芯及噴嘴下部內芯，該噴嘴中部內芯容置於噴嘴外殼內，該噴嘴上部內芯的一端與噴嘴外殼的一端相連，並與該噴嘴中部內芯的一端密封抵接，該噴嘴外殼另一端內部連接有噴嘴下部內芯，該噴嘴下部內芯位於噴嘴外殼與噴嘴中部內芯之間；該噴嘴下部內芯的一端與噴嘴中部內芯之間、另一端外側與噴嘴外殼之間分別留有惰性氣體空間A、惰性氣體空間B，該噴嘴外殼上分別開設有與惰性氣體空間A和惰性氣體空間B相連通的惰性氣體進氣口B及惰性氣體進氣口A；該噴嘴上部內芯上開設有液體通道A，該噴嘴中部內芯一端內部設有與該液體通道A連通的液體腔，該噴嘴中部內芯另一端與該噴嘴下部內芯另一端內側之間形成與液體腔連通的液體通道B，液體由該液體通道A進入，經液體腔後由該液體通道B噴出；該噴嘴中部內芯另一端內部設有惰性氣體旋轉內環腔，該噴嘴中部內芯上開設有連通於惰性氣體空間A與惰性氣體旋轉內環腔的佈風孔A，該惰性氣體空間A內的惰性氣體藉由該佈風孔A呈旋轉狀向惰性氣體旋轉內環腔內進氣；該噴嘴下部內芯另一端內外側之間設有惰性氣體旋轉外環腔，該噴嘴下部內芯上開設有連通於惰性氣體空間B與惰性氣體旋轉外腔的佈風孔B，該惰性氣體B內的惰性氣體藉由該佈風孔B呈旋轉狀向惰性氣體旋轉外環腔內進氣；該惰性氣體旋轉內環腔與惰性氣體旋轉外環腔分別位於液體通道B的內外兩側；該噴嘴中部內芯上設有進液孔，該進液孔的一端與該液體腔連通，另一端與該液體通道B連通；該進液孔為多個，沿圓周方向均佈，每個進液孔均位於相鄰兩該佈風孔B的中間； 該噴嘴中部內芯的一端分別設有凹槽及環形槽，該凹槽內容置有與該噴嘴上部內芯一端密封抵接的密封圈A，該環形槽中容置有與噴嘴外殼內壁密封抵接的密封圈B；該噴嘴中部內芯上設有法蘭盤，該法蘭盤的下表面沿圓周方向均佈有多個支撐板，該支撐板與噴嘴下部內芯抵接；該噴嘴中部內芯的另一端為圓柱，該圓柱內開設有惰性氣體旋轉內環腔；該噴嘴下部內芯呈階梯圓柱狀，上部的內部為惰性氣體空間A，下部為套筒，該套筒外側為該惰性氣體旋轉外環腔；該噴嘴上部內芯、噴嘴中部內芯、噴嘴下部內芯與噴嘴外殼之間螺紋連接或過盈配合。 The present invention includes a nozzle shell and an inner core. Part or all of the inner core is inserted into the nozzle shell. The inner core is provided with a liquid channel, an inert gas rotating inner ring cavity and an inert gas rotating outer ring cavity, and the inert gas rotates. The inner ring cavity and the inert gas rotating outer ring cavity are respectively located on the inner and outer sides of the liquid channel; the inert gas rotating inner ring cavity and the inert gas rotating outer ring cavity are respectively connected with independent inert gas spaces, and the inert gas spaces are opened in On the inner core or formed between the inner core and the inner wall of the nozzle housing; the inner core is provided with a cloth for connecting the inert gas space with the inert gas rotating inner ring cavity and for connecting the inert gas space with the inert gas rotating outer ring cavity The air hole, the inert gas in the inert gas space is rotated into the inert gas rotating inner ring cavity and the inert gas rotating outer ring cavity through the air distribution hole, the inert gas enters the inert gas rotating inner ring cavity and the inert gas The direction of rotation in the rotating outer ring cavity is the same or opposite; the nozzle shell is provided with inert gas inlets for introducing inert gas into the inert gas rotating inner ring cavity and the inert gas rotating outer ring cavity; The inert gas sprayed from the ring cavity and the inert gas rotating outer ring cavity mixes and atomizes the liquid sprayed from the liquid channel on the outside of the nozzle housing, and the surface of the wafer is cleaned by the atomized liquid; where: with the inert gas The air distribution holes connected to the outer ring cavity of the gas rotation and the air distribution holes connected to the inner ring cavity of the inert gas rotation are multiple, evenly distributed along the circumferential direction. Each air distribution hole is in the shape of "L". The vertical side of the “L” shape is opened along the axial direction of the inner core, the horizontal side of the “L” shape is opened along the radial direction of the inner core, and the horizontal side of the “L” shape is inclined to the vertical side of the “L” shape; and the inert gas The inclination directions of the "L"-shaped horizontal sides of the air distribution holes communicating with the rotating outer ring cavity are all the same, and the inclination directions of the "L"-shaped horizontal sides of the air distribution holes communicating with the inert gas rotating inner ring cavity are all the same. The inert gas in the inert gas space rotates clockwise or counterclockwise to the inert gas The body rotates the outer ring cavity or the inert gas rotates the inner ring cavity to enter the air; the inner core is divided into the upper inner core of the nozzle, the middle inner core of the nozzle and the lower inner core of the nozzle. The middle inner core of the nozzle is contained in the nozzle shell. One end of the upper inner core is connected with one end of the nozzle shell and is in sealing contact with one end of the nozzle middle inner core. The other end of the nozzle shell is connected with the nozzle lower inner core, and the nozzle lower inner core is located in the nozzle shell and the middle of the nozzle. Inert gas space A and inert gas space B are respectively reserved between one end of the lower inner core of the nozzle and the middle inner core of the nozzle, and between the outside of the other end and the nozzle shell. The nozzle shell is provided with inert gas The inert gas inlet B and the inert gas inlet A communicated between the space A and the inert gas space B; the upper inner core of the nozzle is provided with a liquid channel A, and one end of the inner core of the middle of the nozzle is provided with the liquid channel A A connected liquid cavity. A liquid channel B communicating with the liquid cavity is formed between the other end of the inner core in the middle of the nozzle and the inner side of the other end of the inner core of the lower part of the nozzle. The liquid enters through the liquid channel A, and then passes through the liquid channel B. Out; the other end of the inner core of the nozzle center is provided with an inert gas rotating inner ring cavity, and the nozzle center inner core is provided with an air distribution hole A connected to the inert gas space A and the inert gas rotating inner ring cavity. The inert gas space The inert gas in A is fed into the inert gas rotating inner ring cavity in a rotating shape through the air distribution hole A; an inert gas rotating outer ring cavity is provided between the inner and outer sides of the other end of the lower inner core of the nozzle. The core is provided with an air distribution hole B communicating with the inert gas space B and the inert gas rotating outer cavity. The inert gas in the inert gas B rotates into the inert gas rotating outer ring cavity through the air distribution hole B. The inert gas rotating inner ring cavity and the inert gas rotating outer ring cavity are respectively located on the inner and outer sides of the liquid channel B; the inner core of the nozzle middle is provided with a liquid inlet, one end of the liquid inlet communicates with the liquid cavity, and the other One end is in communication with the liquid channel B; the liquid inlet holes are multiple, evenly distributed along the circumferential direction, and each liquid inlet hole is located in the middle of two adjacent air distribution holes B; One end of the inner core in the middle of the nozzle is respectively provided with a groove and an annular groove. The groove is provided with a sealing ring A that sealingly abuts against one end of the upper inner core of the nozzle. The annular groove is accommodated in the inner wall of the nozzle housing for sealing Abutting sealing ring B; a flange is provided on the inner core of the middle of the nozzle, and a plurality of support plates are evenly distributed on the lower surface of the flange along the circumferential direction, and the support plates abut against the lower inner core of the nozzle; the nozzle The other end of the middle inner core is a cylinder with an inert gas rotating inner ring cavity; the lower inner core of the nozzle is a stepped cylinder, the upper part is the inert gas space A, the lower part is the sleeve, and the outside of the sleeve is The inert gas rotates the outer ring cavity; the upper inner core of the nozzle, the middle inner core of the nozzle, the lower inner core of the nozzle and the nozzle shell are threaded or interference fit.

本發明的優點與積極效果為： The advantages and positive effects of the present invention are:

本發明藉由改變惰性氣體旋轉方向產生雙螺旋或同向螺旋氣流及控制惰性氣體加速度，同惰配合清洗化學液流量，可以達到既對晶圓損傷小，又可以高效清洗晶圓的目的。 By changing the rotation direction of the inert gas to generate a double spiral or co-directional spiral airflow and controlling the acceleration of the inert gas, the invention can cooperate with the inert gas to clean the chemical liquid flow, so as to achieve the purpose of not only small damage to the wafer, but also efficient cleaning of the wafer.

1‧‧‧噴嘴上部內芯 1‧‧‧Upper nozzle inner core

2‧‧‧噴嘴中部內芯 2‧‧‧Middle inner core of nozzle

3‧‧‧密封圈A 3‧‧‧Seal ring A

4‧‧‧液體腔 4‧‧‧Liquid chamber

5‧‧‧惰性氣體進氣口A 5‧‧‧Inert gas inlet A

6‧‧‧佈風孔A 6‧‧‧Clothing hole A

7‧‧‧液體通道A 7‧‧‧Liquid channel A

8‧‧‧噴嘴外殼 8‧‧‧Nozzle housing

9‧‧‧惰性氣體進氣口B 9‧‧‧Inert gas inlet B

10‧‧‧噴嘴下部內芯 10‧‧‧The lower inner core of the nozzle

11‧‧‧惰性氣體旋轉外環腔 11‧‧‧Inert gas rotating outer ring cavity

12‧‧‧噴液口 12‧‧‧Liquid nozzle

13‧‧‧液體通道B 13‧‧‧Liquid channel B

14‧‧‧惰性氣體旋轉內環腔 14‧‧‧Inert gas rotating inner ring cavity

15‧‧‧惰性氣體空間A 15‧‧‧Inert gas space A

16‧‧‧惰性氣體空間B 16‧‧‧Inert gas space B

17‧‧‧佈風孔B 17‧‧‧cloth wind hole B

18‧‧‧進液孔 18‧‧‧Inlet hole

19‧‧‧法蘭盤 19‧‧‧Flange

20‧‧‧支撐板 20‧‧‧Support plate

21‧‧‧密封圈B 21‧‧‧Seal ring B

22‧‧‧凹槽 22‧‧‧Groove

23‧‧‧環形槽 23‧‧‧Annular groove

24‧‧‧圓柱 24‧‧‧Cylinder

25‧‧‧套筒 25‧‧‧Sleeve

圖1為本發明的整體結構主視圖；圖2為圖1中的A-A剖視圖；圖3為本發明噴嘴中部內芯的立體結構示意圖之一；圖4為本發明噴嘴中部內芯的立體結構示意圖之二；圖5為本發明噴嘴中部內芯的結構主視圖；圖6為圖5中的B-B剖視圖；圖7為本發明噴嘴中部內芯的結構仰視圖；圖8為本發明噴嘴下部內芯的立體結構示意圖； 圖9為本發明噴嘴下部內芯的結構主視圖；圖10為本發明噴嘴下部內芯的結構仰視圖。 Fig. 1 is a front view of the overall structure of the present invention; Fig. 2 is a cross-sectional view of AA in Fig. 1; Fig. 3 is one of the three-dimensional structure diagrams of the middle inner core of the nozzle of the present invention; Fig. 4 is a three-dimensional structure diagram of the middle inner core of the nozzle of the present invention Bis; Figure 5 is a front view of the structure of the central core of the nozzle of the present invention; Figure 6 is a cross-sectional view of BB in Figure 5; Figure 7 is a bottom view of the structure of the central core of the nozzle of the present invention; Figure 8 is the lower core of the nozzle of the present invention Schematic diagram of the three-dimensional structure; Fig. 9 is a front view of the structure of the lower inner core of the nozzle of the present invention; Fig. 10 is a bottom view of the structure of the lower inner core of the nozzle of the present invention.

下面結合圖式對本發明作進一步詳述。 The present invention will be described in further detail below in conjunction with the drawings.

如圖1、圖2所示，本發明包括噴嘴外殼8及內芯，該內芯的部分或全部插設於噴嘴外殼8內，內芯上開設有液體通道、惰性氣體旋轉內環腔14及惰性氣體旋轉外環腔11，該惰性氣體旋轉內環腔14與惰性氣體旋轉外環腔11分別位於液體通道的內外兩側；惰性氣體旋轉內環腔14及惰性氣體旋轉外環腔11分別連通有相互獨立的惰性氣體空間，該惰性氣體空間開設於內芯上或由內芯與噴嘴外殼8內壁之間形成。 As shown in Figures 1 and 2, the present invention includes a nozzle housing 8 and an inner core. Part or all of the inner core is inserted into the nozzle housing 8. The inner core is provided with a liquid channel, an inert gas rotating inner ring cavity 14 and The inert gas rotating outer ring cavity 11, the inert gas rotating inner ring cavity 14 and the inert gas rotating outer ring cavity 11 are respectively located on the inner and outer sides of the liquid channel; the inert gas rotating inner ring cavity 14 and the inert gas rotating outer ring cavity 11 are respectively connected There are mutually independent inert gas spaces, which are opened on the inner core or formed between the inner core and the inner wall of the nozzle housing 8.

內芯上開設有用於連通惰性氣體空間與惰性氣體旋轉內環腔14以及用於連通惰性氣體空間與惰性氣體旋轉外環腔11的佈風孔，該惰性氣體空間內的惰性氣體藉由佈風孔呈旋轉狀向惰性氣體旋轉內環腔14及惰性氣體旋轉外環腔11內進氣，惰性氣體進入該惰性氣體旋轉內環腔14及惰性氣體旋轉外環腔11內的旋向相同或相反。 The inner core is provided with air distribution holes for communicating the inert gas space with the inert gas rotating inner ring cavity 14 and for connecting the inert gas space with the inert gas rotating outer ring cavity 11. The inert gas in the inert gas space is distributed by the air The hole rotates into the inert gas rotating inner ring cavity 14 and the inert gas rotating outer ring cavity 11, and the inert gas enters the inert gas rotating inner ring cavity 14 and the inert gas rotating outer ring cavity 11 in the same or opposite direction. .

噴嘴外殼8上分別開設有向惰性氣體旋轉內環腔14及惰性氣體旋轉外環腔11通入惰性氣體的惰性氣體進氣口；由惰性氣體旋轉內環腔14及惰性氣體旋轉外環腔11噴出的惰性氣體對由液體通道噴出的液體在噴嘴外殼8的外部混合、進行霧化，晶圓表面藉由被霧化後的液體進行清洗。 The nozzle housing 8 is provided with inert gas inlets for introducing inert gas into the inert gas rotating inner ring cavity 14 and the inert gas rotating outer ring cavity 11; the inner ring cavity 14 and the inert gas rotating outer ring cavity 11 are rotated by the inert gas The sprayed inert gas mixes and atomizes the liquid sprayed from the liquid channel on the outside of the nozzle housing 8, and the surface of the wafer is cleaned by the atomized liquid.

本實施例的內芯分為噴嘴上部內芯1、噴嘴中部內芯2及噴嘴下部內芯10，該噴嘴中部內芯2容置於噴嘴外殼8內，噴嘴上部內芯1的一端(下端)插設於噴嘴外殼8的一端(上端)內、與噴嘴外殼8的一端螺紋連 接或過盈配合(本實施例為螺紋連接)；並且，噴嘴上部內芯1的一端與噴嘴中部內芯2的一端(上端)密封抵接。 The inner core of this embodiment is divided into a nozzle upper inner core 1, a nozzle middle inner core 2 and a nozzle lower inner core 10. The nozzle middle inner core 2 is housed in the nozzle housing 8, and one end (lower end) of the nozzle upper inner core 1 Inserted in one end (upper end) of the nozzle housing 8 and threadedly connected with one end of the nozzle housing 8 Connection or interference fit (threaded connection in this embodiment); and, one end (upper end) of the inner core 1 of the upper part of the nozzle is in sealing contact with one end (upper end) of the inner core 2 of the middle part of the nozzle.

噴嘴外殼8另一端(下端)內部螺紋連接或過盈配合(本實施例為過盈配合)有噴嘴下部內芯10，該噴嘴下部內芯10位於噴嘴外殼8與噴嘴中部內芯2之間。 The other end (lower end) of the nozzle housing 8 is internally threaded or interference fit (in this embodiment, interference fit) is provided with a lower nozzle inner core 10 located between the nozzle housing 8 and the middle inner core 2 of the nozzle.

噴嘴下部內芯10的一端(上端)與噴嘴中部內芯2之間、另一端(下端)外側與噴嘴外殼8之間分別留有惰性氣體空間A15、惰性氣體空間B16，該噴嘴外殼8上分別開設有與惰性氣體空間A15和惰性氣體空間B16相連通的惰性氣體進氣口B9及惰性氣體進氣口A5。 An inert gas space A15 and an inert gas space B16 are respectively reserved between one end (upper end) of the lower inner core 10 of the nozzle and the inner core 2 of the middle of the nozzle, and between the outer side of the other end (lower end) and the nozzle shell 8. An inert gas inlet B9 and an inert gas inlet A5 are provided in communication with the inert gas space A15 and the inert gas space B16.

噴嘴上部內芯1上沿軸向開設有液體通道A7，噴嘴中部內芯2一端(上端)內部設有位於液體通道A7下方、與液體通道A7連通的液體腔4，該噴嘴中部內芯2另一端(下端)與噴嘴下部內芯10另一端(下端)內側之間形成與液體腔4連通的液體通道B13，液體由液體通道A7進入，經液體腔4後由液體通道B13噴出。 The upper inner core 1 of the nozzle is provided with a liquid channel A7 along the axial direction. One end (upper end) of the inner core 2 in the middle of the nozzle is provided with a liquid cavity 4 located below the liquid channel A7 and communicating with the liquid channel A7. A liquid channel B13 communicating with the liquid chamber 4 is formed between one end (lower end) and the other end (lower end) of the inner core 10 of the lower part of the nozzle. Liquid enters through the liquid channel A7 and ejects from the liquid channel B13 after passing through the liquid chamber 4.

噴嘴中部內芯2另一端(下端)內部設有惰性氣體旋轉內環腔14，該噴嘴中部內芯2上沿圓周方向均勻開設有多個連通於惰性氣體空間A15與惰性氣體旋轉內環腔14的佈風孔A6，惰性氣體空間A15內的惰性氣體藉由各佈風孔A6呈旋轉狀向惰性氣體旋轉內環腔14內進氣。 The other end (lower end) of the inner core 2 in the middle of the nozzle is provided with an inert gas rotating inner ring cavity 14. The inner core 2 in the middle of the nozzle is evenly provided with a plurality of inert gas spaces A15 and the inert gas rotating inner ring cavity 14 along the circumferential direction. The air distribution holes A6, the inert gas in the inert gas space A15 enters the inert gas rotating inner ring cavity 14 in a rotating shape through the air distribution holes A6.

噴嘴下部內芯10另一端內外側之間設有惰性氣體旋轉外環腔11，該噴嘴下部內芯10上沿圓周方向均勻開設有多個連通於惰性氣體空間B16與惰性氣體旋轉外腔11的佈風孔B17，惰性氣體B16內的惰性氣體藉由各佈風孔B17呈旋轉狀向惰性氣體旋轉外環腔11內進氣。 The lower inner core 10 of the nozzle is provided with an inert gas rotating outer ring cavity 11 between the inner and outer sides. The lower inner core 10 of the nozzle is evenly provided with a plurality of inert gas spaces B16 and the inert gas rotating outer cavity 11 along the circumferential direction. The air distribution holes B17, the inert gas in the inert gas B16 is fed into the inert gas rotating outer ring cavity 11 in a rotating shape through the air distribution holes B17.

惰性氣體旋轉內環腔14與惰性氣體旋轉外環腔11分別位於液體通道B13的內外兩側。 The inert gas rotating inner ring cavity 14 and the inert gas rotating outer ring cavity 11 are respectively located on the inner and outer sides of the liquid channel B13.

如圖3~7所示，噴嘴中部內芯2的一端(上端)分別設有凹槽22及環形槽23，該凹槽22內容置有與噴嘴上部內芯1一端(下端)密封抵接的密封圈A3，環形槽23中容置有與噴嘴外殼8內壁密封抵接的密封圈B21。 As shown in Figures 3 to 7, one end (upper end) of the inner core 2 in the middle of the nozzle is provided with a groove 22 and an annular groove 23 respectively. The groove 22 is provided with a sealing contact with one end (lower end) of the upper inner core 1 of the nozzle. For the sealing ring A3, the annular groove 23 contains a sealing ring B21 which is in sealing contact with the inner wall of the nozzle housing 8.

噴嘴中部內芯2上設有法蘭盤19，該法蘭盤19的下表面沿圓周方向均佈有多個支撐板20，支撐板20與噴嘴下部內芯10一端(上端)內部開設的惰性氣體空間A15的底面抵接，法蘭盤19的外側面與噴嘴下部內芯10的內壁抵接。 A flange 19 is provided on the inner core 2 in the middle of the nozzle. The lower surface of the flange 19 is evenly distributed with a plurality of support plates 20 along the circumferential direction. The support plates 20 and the inner end (upper end) of the lower inner core 10 of the nozzle are provided with inert The bottom surface of the gas space A15 is in contact with each other, and the outer surface of the flange 19 is in contact with the inner wall of the nozzle lower core 10.

噴嘴中部內芯2的另一端為圓柱24，該圓柱24內開設有惰性氣體旋轉內環腔14。 The other end of the inner core 2 in the middle of the nozzle is a cylinder 24 in which an inert gas rotating inner ring cavity 14 is opened.

在噴嘴中部內芯2上沿圓周方向設有多個進液孔18，每個進液孔18的一端(上端)均與液體腔4連通，另一端與均液體通道B13連通。 A plurality of liquid inlet holes 18 are provided on the inner core 2 in the middle of the nozzle along the circumferential direction. One end (upper end) of each liquid inlet hole 18 is communicated with the liquid cavity 4, and the other end is communicated with the liquid equalizing channel B13.

每個進液孔18均位於相鄰兩佈風孔B17的中間。 Each liquid inlet 18 is located in the middle of two adjacent air distribution holes B17.

如圖8~10所示，噴嘴下部內芯10呈階梯圓柱狀，上部的內部為惰性氣體空間A15，下部為套筒25，該套筒25外側為惰性氣體旋轉外環腔11，套筒25的內壁與噴嘴中部內芯2下端圓柱24的外表面之間形成液體通道B13。 As shown in Figures 8-10, the lower inner core 10 of the nozzle is in a stepped cylindrical shape, the upper part is the inert gas space A15, the lower part is the sleeve 25, and the outer side of the sleeve 25 is the inert gas rotating outer ring cavity 11, the sleeve 25 A liquid channel B13 is formed between the inner wall of the nozzle and the outer surface of the lower end cylinder 24 of the inner core 2 in the middle of the nozzle.

本發明者佈風孔A6及佈風孔B17均呈「L」形，該「L」形的豎邊沿噴嘴中部內芯2、噴嘴下部內芯10的軸向開設，「L」形的橫邊沿噴嘴中部內芯2、噴嘴下部內芯10的徑向開設，且該「L」形的橫邊傾斜於「L」形的豎邊。 The air distribution hole A6 and the air distribution hole B17 of the present inventor are both in an "L" shape. The vertical edge of the "L" shape is opened along the axial direction of the inner core 2 in the middle of the nozzle and the inner core 10 in the lower part of the nozzle, and the horizontal edge of the "L" is The inner core 2 in the middle of the nozzle and the inner core 10 in the lower part of the nozzle are radially opened, and the horizontal side of the "L" shape is inclined to the vertical side of the "L" shape.

與惰性氣體旋轉外環腔11連通的各佈風孔B17的「L」形橫邊的傾斜方向均相同，與惰性氣體旋轉內環腔14連通的各佈風孔A6的「L」形橫邊的傾斜方向均相同，這兩個傾斜方向可相同也可不同；惰性氣體空間A15內的惰性氣體以順時針旋轉或逆時針旋轉向惰性氣體旋轉內環腔14內進氣，惰性氣體空間B16內的惰性氣體以順時針旋轉或逆時針旋轉向惰性氣體旋轉外環腔11內進氣，進而在液體通道B13的內外側環繞成雙螺紋惰性氣體出口。 The inclination directions of the "L"-shaped lateral sides of the air distribution holes B17 connected with the inert gas rotating outer ring cavity 11 are all the same, and the "L"-shaped lateral sides of the air distribution holes A6 connected with the inert gas rotating inner ring cavity 14 The inert gas inert gas space A15 rotates clockwise or counterclockwise to enter the inert gas rotating inner ring cavity 14, and the inert gas space B16 The inert gas rotates clockwise or counterclockwise to enter the inert gas rotating outer ring cavity 11, and then surrounds the inner and outer sides of the liquid channel B13 into a double-threaded inert gas outlet.

雙旋噴嘴噴出端的端部為錐形結構。 The end of the ejection end of the double-rotation nozzle has a tapered structure.

本發明的惰性氣體進氣口A5及惰性氣體進氣口B9分別位於軸向截面的左右兩側，且分別藉由管路與惰性氣體源相連，並在每根管路上均設置了閥門，閥門藉由自動控制系統(本發明的自動控制系統為現有技術)精確控制惰性氣體的流量。 The inert gas inlet A5 and the inert gas inlet B9 of the present invention are respectively located on the left and right sides of the axial section, and are respectively connected to the inert gas source by pipelines, and each pipeline is provided with a valve. The flow of inert gas is precisely controlled by an automatic control system (the automatic control system of the present invention is a prior art).

發明的雙旋噴嘴採用聚四氟乙烯材質。 The invented double-rotation nozzle is made of polytetrafluoroethylene.

本發明的雙旋噴嘴以小於90°的傾斜角度設置於晶圓的上方，也可垂直設置於晶圓上方；雙旋噴嘴距離晶圓表面的高度要小於或等於20mm。 The double-rotation nozzle of the present invention is arranged above the wafer with an inclination angle of less than 90°, and can also be installed vertically above the wafer; the height of the double-rotation nozzle from the surface of the wafer is less than or equal to 20 mm.

液體通道A7內的液體流量小於1000ml/min，液體通道B13內的液體流量小於1000ml/min。 The liquid flow rate in the liquid channel A7 is less than 1000 ml/min, and the liquid flow rate in the liquid channel B13 is less than 1000 ml/min.

惰性氣體旋轉內環腔14及惰性氣體旋轉外環腔11內通入的惰性氣體的壓力為小於或等於1Mpa，流量小於500L/min。 The pressure of the inert gas introduced into the inert gas rotating inner ring cavity 14 and the inert gas rotating outer ring cavity 11 is less than or equal to 1Mpa, and the flow rate is less than 500L/min.

清洗晶圓時，液體由液體通道A7的上端進入，流入液體腔4後，由與液體腔4連通的進液孔18流入液體通道B13，再由液體通道B13的下 端噴出。 When cleaning the wafer, the liquid enters from the upper end of the liquid channel A7. After flowing into the liquid chamber 4, it flows into the liquid channel B13 from the liquid inlet 18 connected with the liquid chamber 4, and then from the bottom of the liquid channel B13. The end spouts.

藉由惰性氣體進氣口A5及惰性氣體進氣口B9分別向惰性氣體空間B16及惰性氣體空間A15內通入惰性氣體，惰性氣體空間A15與惰性氣體空間B16相對獨立，惰性氣體空間A15中的惰性氣體藉由各佈風孔A6後以順時針或逆時針的旋轉方向進入惰性氣體旋轉內環腔14，惰性氣體空間B16中的惰性氣體藉由各佈風孔B17後以順時針或逆時針的旋轉方向進入惰性氣體旋轉外環腔11，在液體通道B13的內外兩側呈環繞雙螺旋或同向螺旋狀噴出，並與噴液口12噴出的液體混合，液體被霧化後對晶圓的表面顆粒進行清洗。 Inert gas is introduced into the inert gas space B16 and the inert gas space A15 through the inert gas inlet A5 and the inert gas inlet B9, respectively. The inert gas space A15 and the inert gas space B16 are relatively independent. The inert gas enters the inert gas rotating inner ring cavity 14 in a clockwise or counterclockwise direction after passing through the cloth holes A6. The inert gas in the inert gas space B16 passes through the cloth holes B17 and then moves clockwise or counterclockwise. The direction of rotation of the inert gas enters the outer ring cavity 11 of the inert gas, and is sprayed in a double spiral or in the same direction on the inner and outer sides of the liquid channel B13, and is mixed with the liquid sprayed from the liquid nozzle 12, and the liquid is atomized to the wafer The surface particles are cleaned.

1‧‧‧噴嘴上部內芯 1‧‧‧Upper nozzle inner core

2‧‧‧噴嘴中部內芯 2‧‧‧Middle inner core of nozzle

3‧‧‧密封圈A 3‧‧‧Seal ring A

4‧‧‧液體腔 4‧‧‧Liquid chamber

5‧‧‧惰性氣體進氣口A 5‧‧‧Inert gas inlet A

6‧‧‧佈風孔A 6‧‧‧Clothing hole A

8‧‧‧噴嘴外殼 8‧‧‧Nozzle housing

9‧‧‧惰性氣體進氣口B 9‧‧‧Inert gas inlet B

10‧‧‧噴嘴下部內芯 10‧‧‧The lower inner core of the nozzle

11‧‧‧惰性氣體旋轉外環腔 11‧‧‧Inert gas rotating outer ring cavity

12‧‧‧噴液口 12‧‧‧Liquid nozzle

13‧‧‧液體通道B 13‧‧‧Liquid channel B

14‧‧‧惰性氣體旋轉內環腔 14‧‧‧Inert gas rotating inner ring cavity

15‧‧‧惰性氣體空間A 15‧‧‧Inert gas space A

16‧‧‧惰性氣體空間B 16‧‧‧Inert gas space B

17‧‧‧佈風孔B 17‧‧‧cloth wind hole B

18‧‧‧進液孔 18‧‧‧Inlet hole

21‧‧‧密封圈B 21‧‧‧Seal ring B

Claims (10)

一種晶圓表面顆粒清洗雙旋噴嘴，其包括一噴嘴外殼(8)及一內芯，該內芯的部分或全部插設於一噴嘴外殼(8)內，該內芯上開設有一液體通道、一惰性氣體旋轉內環腔(14)及一惰性氣體旋轉外環腔(11)，該惰性氣體旋轉內環腔(14)與該惰性氣體旋轉外環腔(11)分別位於該液體通道的內外兩側；該惰性氣體旋轉內環腔(14)及該惰性氣體旋轉外環腔(11)分別連通有相互獨立的一惰性氣體空間，該惰性氣體空間開設於該內芯上或由該內芯與該噴嘴外殼(8)內壁之間形成；該內芯上開設有用於連通該惰性氣體空間與該惰性氣體旋轉內環腔(14)以及用於連通該惰性氣體空間與該惰性氣體旋轉外環腔(11)的一佈風孔，該惰性氣體空間內的惰性氣體藉由該佈風孔呈旋轉狀向該惰性氣體旋轉內環腔(14)及該惰性氣體旋轉外環腔(11)內進氣，惰性氣體進入該惰性氣體旋轉內環腔(14)及該惰性氣體旋轉外環腔(11)內的旋向相同或相反；該噴嘴外殼(8)上分別開設有向該惰性氣體旋轉內環腔(14)及該惰性氣體旋轉外環腔(11)通入惰性氣體的一惰性氣體進氣口；由該惰性氣體旋轉內環腔(14)及該惰性氣體旋轉外環腔(11)噴出的惰性氣體對由該液體通道噴出的液體在該噴嘴外殼(8)的外部混合、進行霧化，該晶圓表面藉由被霧化後的液體進行清洗。 A double-rotation nozzle for cleaning wafer surface particles, comprising a nozzle housing (8) and an inner core, part or all of the inner core is inserted in a nozzle housing (8), and a liquid channel is opened on the inner core, An inert gas rotating inner ring cavity (14) and an inert gas rotating outer ring cavity (11), the inert gas rotating inner ring cavity (14) and the inert gas rotating outer ring cavity (11) are respectively located inside and outside the liquid channel On both sides; the inert gas rotating inner ring cavity (14) and the inert gas rotating outer ring cavity (11) are respectively connected with an inert gas space independent of each other, the inert gas space is opened on the inner core or by the inner core It is formed between the inner wall of the nozzle housing (8); the inner core is provided with a cavity (14) for communicating the inert gas space with the inert gas rotating inner ring cavity (14) and for connecting the inert gas space with the inert gas rotating outer An air distribution hole in the ring cavity (11), through which the inert gas in the inert gas space rotates toward the inert gas rotating inner ring cavity (14) and the inert gas rotating outer ring cavity (11) The inert gas enters the inert gas rotating inner ring cavity (14) and the inert gas rotating outer ring cavity (11) in the same or opposite direction of rotation; the nozzle shell (8) is respectively provided with the inert gas The rotating inner ring cavity (14) and the inert gas rotating outer ring cavity (11) pass an inert gas inlet for inert gas; the inert gas rotating inner ring cavity (14) and the inert gas rotating outer ring cavity ( 11) The sprayed inert gas mixes and atomizes the liquid sprayed from the liquid channel on the outside of the nozzle housing (8), and the wafer surface is cleaned by the atomized liquid. 如請求項1所述之晶圓表面顆粒清洗雙旋噴嘴，其中，與該惰性氣體旋轉外環腔(11)連通的該佈風孔以及與該惰性氣體旋轉內環腔(14)連通的該佈風孔均為多個，沿圓周方向均佈，每個該佈風孔均呈「L」形，該「L」形的豎邊沿該內芯的軸向開設，該「L」形的橫邊沿該內芯的徑向開設，且該「L」形的橫邊傾斜於該「L」形的豎邊。 The wafer surface particle cleaning double-rotation nozzle according to claim 1, wherein the air distribution hole connected with the inert gas rotating outer ring cavity (11) and the inert gas rotating inner ring cavity (14) There are multiple air-distributing holes, evenly distributed along the circumferential direction. Each air-distributing hole is in an "L" shape. The vertical edge of the "L" shape is opened along the axial direction of the inner core. The edge is opened along the radial direction of the inner core, and the horizontal side of the "L" shape is inclined to the vertical side of the "L" shape. 如請求項2所述之晶圓表面顆粒清洗雙旋噴嘴，其中，與該惰性氣體旋轉外環腔(11)連通的各該佈風孔的該「L」形橫邊的傾斜方向均相同，與該惰性氣體旋轉內環腔(14)連通的各該佈風孔的該「L」形橫邊的傾斜方向均相同，該惰性氣體空間內的惰性氣體以順時針旋轉或逆時針旋轉向該惰性氣體旋轉外環腔(11)或該惰性氣體旋轉內環腔(14)內進氣。 The wafer surface particle cleaning double-rotation nozzle according to claim 2, wherein the inclination directions of the "L"-shaped lateral sides of the air distribution holes communicating with the inert gas rotating outer ring cavity (11) are all the same, The inclination directions of the "L"-shaped lateral sides of the air distribution holes connected to the inert gas rotating inner ring cavity (14) are all the same, and the inert gas in the inert gas space rotates clockwise or counterclockwise toward the The inert gas rotates into the outer ring cavity (11) or the inert gas rotates to enter the inner ring cavity (14). 如請求項1所述之晶圓表面顆粒清洗雙旋噴嘴，其中，該內芯分為一噴嘴上部內芯(1)、一噴嘴中部內芯(2)及一噴嘴下部內芯(10)，該噴嘴中部內芯(2)容置於該噴嘴外殼(8)內，該噴嘴上部內芯(1)的一端與該噴嘴外殼(8)的一端相連，並與該噴嘴中部內芯(2)的一端密封抵接，該噴嘴外殼(8)另一端內部連接有該噴嘴下部內芯(10)，該噴嘴下部內芯(10)位於該噴嘴外殼(8)與該噴嘴中部內芯(2)之間。 The wafer surface particle cleaning dual-rotation nozzle according to claim 1, wherein the inner core is divided into a nozzle upper inner core (1), a nozzle middle inner core (2) and a nozzle lower inner core (10), The middle inner core (2) of the nozzle is contained in the nozzle housing (8), and one end of the upper inner core (1) of the nozzle is connected with one end of the nozzle housing (8), and is connected to the middle inner core (2) of the nozzle One end of the nozzle housing (8) is sealed and abutted, and the other end of the nozzle housing (8) is connected with the lower inner core (10) of the nozzle. The lower inner core (10) of the nozzle is located between the nozzle housing (8) and the middle inner core (2) of the nozzle. between. 如請求項4所述之晶圓表面顆粒清洗雙旋噴嘴，其中，該噴嘴下部內芯(10)的一端與該噴嘴中部內芯(2)之間、另一端外側與該噴嘴外殼(8)之間分別留有一惰性氣體空間A(15)、一惰性氣體空間B(16)，該噴嘴外殼(8)上分別開設有與該惰性氣體空間A(15)和該惰性氣體空間B(16)相連通的一惰性氣體進氣口B(9)及一惰性氣體進氣口A(5)；該噴嘴上部內芯(1)上開設有一液體通道A(7)，該噴嘴中部內芯(2)一端內部設有與該液體通道A(7)連通的一液體腔(4)，該噴嘴中部內芯(2)另一端與該噴嘴下部內芯(10)另一端內側之間形成與該液體腔(4)連通的一液體通道B(13)，液體由該液體通道A(7)進入，經該液體腔(4)後由該液體通道B(13)噴出；該噴嘴中部內芯(2)另一端內部設有該惰性氣體旋轉內環腔(14)，該噴嘴中部內芯(2)上開設有連通於該惰性氣體空間A(15)與該惰性氣體旋轉內環腔(14)的一佈風孔A(6)，該惰性氣體空 間A(15)內的惰性氣體藉由該佈風孔A(6)呈旋轉狀向該惰性氣體旋轉內環腔(14)內進氣；該噴嘴下部內芯(10)另一端內外側之間設有該惰性氣體旋轉外環腔(11)，該噴嘴下部內芯(10)上開設有連通於該惰性氣體空間B(16)與該惰性氣體旋轉外環腔(11)的一佈風孔B(17)，該惰性氣體空間B(16)內的惰性氣體藉由該佈風孔B(17)呈旋轉狀向該惰性氣體旋轉外環腔(11)內進氣；該惰性氣體旋轉內環腔(14)與該惰性氣體旋轉外環腔(11)分別位於該液體通道B(13)的內外兩側。 The wafer surface particle cleaning double-rotation nozzle according to claim 4, wherein one end of the lower inner core (10) of the nozzle and the middle inner core (2) of the nozzle, and the outer side of the other end and the nozzle shell (8) An inert gas space A (15) and an inert gas space B (16) are respectively left between, and the nozzle housing (8) is respectively provided with the inert gas space A (15) and the inert gas space B (16) An inert gas inlet B (9) and an inert gas inlet A (5) are connected; the upper inner core (1) of the nozzle is provided with a liquid channel A (7), and the middle inner core (2) of the nozzle ) One end is provided with a liquid cavity (4) communicating with the liquid channel A (7), and the inner core (2) of the middle part of the nozzle and the inner side of the other end of the lower inner core (10) of the nozzle are formed with the liquid A liquid channel B (13) communicated with the cavity (4), the liquid enters through the liquid channel A (7), and is ejected from the liquid channel B (13) after passing through the liquid cavity (4); the inner core (2) of the nozzle ) The inert gas rotating inner ring cavity (14) is arranged inside the other end, and the inner core (2) in the middle of the nozzle is provided with a communication between the inert gas space A (15) and the inert gas rotating inner ring cavity (14) A ventilation hole A(6), the inert gas The inert gas in the space A (15) is rotated into the inert gas rotating inner ring cavity (14) through the air distribution hole A (6); the inner and outer sides of the inner core (10) of the lower part of the nozzle The inert gas rotating outer ring cavity (11) is interposed therebetween, and the lower inner core (10) of the nozzle is provided with an air distribution connecting the inert gas space B (16) and the inert gas rotating outer ring cavity (11) Hole B (17), the inert gas in the inert gas space B (16) is rotated into the inert gas rotating outer ring cavity (11) through the air distribution hole B (17); the inert gas rotates The inner ring cavity (14) and the inert gas rotating outer ring cavity (11) are respectively located on the inner and outer sides of the liquid channel B (13). 如請求項5所述之晶圓表面顆粒清洗單旋噴嘴，其中，該噴嘴中部內芯(2)上設有一進液孔(18)，該進液孔(18)的一端與該液體腔(4)連通，另一端與該液體通道B(13)連通。 The wafer surface particle cleaning single-rotation nozzle according to claim 5, wherein a liquid inlet (18) is provided on the inner core (2) of the nozzle, and one end of the liquid inlet (18) is connected to the liquid cavity ( 4) Connected, the other end is connected to the liquid channel B (13). 如請求項6所述之晶圓表面顆粒清洗單旋噴嘴，其中，該進液孔(18)為多個，沿圓周方向均佈，每個該進液孔(18)均位於相鄰兩該佈風孔B(17)的中間。 The wafer surface particle cleaning single-rotation nozzle according to claim 6, wherein the liquid inlet holes (18) are multiple, evenly distributed along the circumferential direction, and each liquid inlet hole (18) is located in two adjacent The middle of the air hole B (17). 如請求項4所述之晶圓表面顆粒清洗單旋噴嘴，其中，該噴嘴中部內芯(2)的一端分別設有一凹槽(22)及一環形槽(23)，該凹槽(22)內容置有與該噴嘴上部內芯(1)一端密封抵接的一密封圈A(3)，該環形槽(23)中容置有與該噴嘴外殼(8)內壁密封抵接的一密封圈B(21)；該噴嘴中部內芯(2)上設有一法蘭盤(19)，該法蘭盤(19)的下表面沿圓周方向均佈有多個支撐板(20)，該支撐板(20)與該噴嘴下部內芯(10)抵接；該噴嘴中部內芯(2)的另一端為一圓柱(24)，該圓柱(24)內開設有該惰性氣體旋轉內環腔(14)。 The wafer surface particle cleaning single-rotation nozzle according to claim 4, wherein one end of the inner core (2) of the nozzle is respectively provided with a groove (22) and an annular groove (23), and the groove (22) A sealing ring A (3) sealingly abutting against one end of the inner core (1) of the upper part of the nozzle is arranged in the content, and a sealing ring A (3) sealingly abutting against the inner wall of the nozzle housing (8) is accommodated in the annular groove (23) Ring B (21); a flange (19) is provided on the inner core (2) in the middle of the nozzle, and the lower surface of the flange (19) is evenly distributed with a plurality of support plates (20) along the circumferential direction. The support The plate (20) abuts against the inner core (10) of the lower part of the nozzle; the other end of the inner core (2) in the middle of the nozzle is a cylinder (24), and the inert gas rotating inner ring cavity ( 14). 如請求項4所述之晶圓表面顆粒清洗單旋噴嘴，其中，該噴嘴下部內芯(10)呈階梯圓柱狀，上部的內部為一惰性氣體空間A(15)，下部為一套筒(25)， 該套筒(25)外側為該惰性氣體旋轉外環腔(11)。 The single-rotation nozzle for cleaning wafer surface particles according to claim 4, wherein the lower inner core (10) of the nozzle is a stepped cylindrical shape, the upper part is an inert gas space A (15), and the lower part is a sleeve ( 25), The outer side of the sleeve (25) is the inert gas rotating outer ring cavity (11). 如請求項4所述之晶圓表面顆粒清洗單旋噴嘴，其中，該噴嘴上部內芯(1)、該噴嘴中部內芯(2)、該噴嘴下部內芯(10)與該噴嘴外殼(8)之間螺紋連接或過盈配合。 The wafer surface particle cleaning single-rotation nozzle according to claim 4, wherein the upper inner core (1) of the nozzle, the middle inner core (2) of the nozzle, the lower inner core (10) and the nozzle shell (8) ) Threaded connection or interference fit.
TW108123586A 2019-05-14 2019-07-04 Double-rotation nozzle for cleaning wafer surface particles TWI704017B (en)

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