TWI701749B - Check method for marking - Google Patents

Abstract

The subject of the present invention is to determine whether a crack line is properly formed.

A scribe line SL is provided on the first surface SF1 of the brittle substrate 4, and the scribe line SL has a groove line TL extending along the extending direction at a position on the first surface SF1. The incident light LI generated by the laser is irradiated from the outside of the brittle substrate 4 through the first surface SF1 to directly below a position of the first surface SF1 of the brittle substrate 4. The optical axis direction of the incident light LI has an oblique component, and the oblique component is oriented in a direction perpendicular to the extending direction on the first surface SF1 when the direction perpendicular to the first surface SF1 is used as a reference. The incident light LI is reflected by the crack line CL to generate the reflected light LR toward the second surface SF2. By reflecting the reflected light LR, the outgoing light LO from the second surface SF2 to the outside of the brittle substrate 4 through the first surface SF1 is generated. Measure the intensity of the emitted light LO.

Description

Inspection method for marking

The present invention relates to a method for inspecting scribe lines formed on a brittle substrate.

In the manufacture of electrical equipment such as flat display panels or solar cell panels, it is often necessary to break fragile substrates such as glass substrates. First, a scribe line is formed on the substrate, and then the substrate is divided along the scribe line. The scribe line can be formed by mechanically processing the substrate using a cutting tool. By sliding or rolling the cutting tool on the substrate, a groove caused by plastic deformation is formed on the substrate, and at the same time, a vertical crack is formed directly under the groove. Thereafter, the stress imparting called the fracture step is completed. By the breaking step, the crack is completely advanced in the thickness direction, thereby breaking the substrate.

In most cases, the step of dividing the substrate is performed immediately after the step of forming the scribe line on the substrate. However, it is also proposed to process the substrate between the step of forming the scribe line and the step of breaking. The step of processing the substrate is, for example, the step of placing certain components on the substrate.

For example, according to the technology of International Publication No. 2002/104078, in the manufacturing method of organic EL (Electroluminescence) displays, before the sealing cover is installed, each area that becomes each organic EL display is formed on the glass substrate. line. Therefore, it is possible to avoid contact between the sealing cover and the glass cutter, which may be a problem when the scribe line is formed on the glass substrate after the sealing cover is installed.

In addition, for example, according to the technology of International Publication No. 2003/006391, in the method of manufacturing a liquid crystal display panel, two glass substrates are bonded after forming a scribe line. Thereby, two brittle substrates can be simultaneously broken by one breaking step.

[Prior Technical Literature] [Patent Literature]

[Patent Document 1] International Publication No. 2002/104078

[Patent Document 2] International Publication No. 2003/006391

According to the above-mentioned prior art, the brittle substrate is processed after the scribe line is formed, and then the fracture step is performed by applying stress. The above situation means that there are vertical cracks in the processing of brittle substrates. There may be situations in which the vertical cracks unexpectedly expand further in the thickness direction during processing, and the brittle substrates that should be integrated during processing are separated. Moreover, even when the substrate processing step is not performed between the scribing formation step and the substrate breaking step, it is usually necessary to carry or store the substrate after the scribing formation step and before the substrate breaking step. At this time, the substrate may be accidentally broken.

In order to solve the above-mentioned problems, the inventors developed a unique breaking technology. According to this technology, as a line that defines the position for breaking the brittle substrate, first, a groove line that does not have a crack directly under it is formed. The location of the brittle substrate is defined by forming the groove line. After that, as long as the state where there are no cracks directly under the groove line (hereinafter also referred to as the "crack-free state") is maintained, it is not easy to break along the groove line. By using this state, it is possible to predetermine the position of the brittle substrate to be broken, and to prevent the brittle substrate from being accidentally broken before the time when it should be broken. However, when a crack line is formed after maintaining a crack-free state, it is relatively easy to produce defective crack line formation. Therefore, a method is sought to easily determine the presence or absence of defective crack lines.

In addition, even in the case where the scribe line is formed by a normal method that does not accompany the non-crack state, a method can be sought to easily determine the presence or absence of the formation of the crack line. For example, when the scribe line is formed by the rolling of the cutting tool, the depth of the crack line The verticality of the upward extension is easily messy. As a result, there may be situations that hinder the breaking step along the crack line.

The present invention was completed in order to solve the above problems, and its object is to provide an inspection method that can determine whether a scribe line with a crack line is properly formed.

The scribing inspection method of the present invention is an underscribing inspection method and has the following steps. The scribing line has a groove line and a crack line extending along the groove line directly under the groove line. Prepare a brittle substrate having a first surface and a second surface opposite to the first surface. A scribe line is provided on the first surface, and the scribe line has a groove line extending along the extending direction at a position on the first surface. The incident light generated by the laser is irradiated from the outside of the brittle substrate through the first surface directly below a position of the first surface of the brittle substrate. The optical axis direction of the incident light has an oblique component, and the oblique component is oriented in a direction perpendicular to the extending direction on the first surface when the direction perpendicular to the first surface is used as a reference. The incident light is reflected by the crack line to generate the reflected light toward the second surface. The reflected light is reflected to generate outgoing light from the second surface to the outside of the brittle substrate through the first surface. Measure the intensity of the emitted light.

According to the present invention, the intensity of the emitted light depends on whether the crack line is properly formed. Therefore, by measuring the intensity of the emitted light, it can be determined whether the crack line is properly formed.

4‧‧‧Glass substrate

10‧‧‧Reflective member

11‧‧‧Substrate pressing device

12‧‧‧Platform

20‧‧‧Laser head

21‧‧‧Light source

22‧‧‧Sensor

28‧‧‧Head position adjustment part

29‧‧‧Amplifier

40‧‧‧Checking device

50‧‧‧Cutting equipment

51‧‧‧tip

52‧‧‧Handle

A1‧‧‧Arrow

A2‧‧‧Arrow

A3‧‧‧Arrow

AL‧‧‧Auxiliary Line

AX‧‧‧axial

CA, CL‧‧‧Crack line

DA‧‧‧direction

DB‧‧‧direction

DC‧‧‧direction

DT‧‧‧Thickness direction

ED1‧‧‧edge

ED2‧‧‧edge

LI‧‧‧ incident light

LO‧‧‧Outgoing light

LR‧‧‧reflected light

LT‧‧‧Transmitted light

N1‧‧‧Location

N2‧‧‧Location

N3‧‧‧Location

PP‧‧‧Protrusion

PS‧‧‧Side

SA, SL‧‧‧underline

SC‧‧‧Scan direction

SD1‧‧‧Top surface

SD2‧‧‧Side

SD3‧‧‧Side

SF1‧‧‧Upper surface (1st side)

SF2‧‧‧Bottom surface (Second side)

SP‧‧‧Spot

TL‧‧‧Trench line

XVI‧‧‧Arrow

Fig. 1 is a flowchart schematically showing the structure of the marking inspection method in the first embodiment of the present invention.

Fig. 2 is a plan view schematically showing one step of the marking inspection method in the first embodiment of the present invention.

Fig. 3 is a partial cross-sectional view schematically showing the structure of the scribe line including the normal crack line.

Figure 4 schematically shows the structure of the scribe line including the vertical chaotic crack line Sectional view.

Fig. 5 is a partial cross-sectional view schematically showing the structure of a scribe line without a crack line.

Fig. 6 is a cross-sectional view schematically showing the structure of an inspection device used in the inspection method of marking in the first embodiment of the present invention.

Fig. 7 is a cross-sectional view schematically showing one step of the marking inspection method in the first embodiment of the present invention.

Fig. 8 is a plan view schematically showing the steps of Fig. 7.

Fig. 9 is a cross-sectional view schematically showing one step of the marking inspection method in the first embodiment of the present invention.

Fig. 10 is a plan view schematically showing the steps of Fig. 9.

FIG. 11 is a partial cross-sectional view schematically showing the progress of light when performing the inspection method of the marking in Embodiment 1 of the present invention on a normal marking.

FIG. 12 is a partial cross-sectional view schematically showing the progress of light when performing the inspection method of the scribe line in the first embodiment of the present invention on a scribe line with a vertical disordered crack line.

FIG. 13 is a partial cross-sectional view schematically showing the progress of light when performing the inspection method of the scribe line in the first embodiment of the present invention on a scribe line without a crack line.

Fig. 14 is a flowchart schematically showing the structure of a method for forming a scribe line in the second embodiment of the present invention.

Fig. 15 is a side view schematically showing the structure of a device used in the method of breaking a brittle substrate in the second embodiment of the present invention.

Fig. 16 is a schematic plan view from the point of view of arrow XVI in Fig. 15.

Fig. 17 is a plan view schematically showing a step of forming a groove line in the second embodiment of the present invention.

Fig. 18 is a plan view schematically showing the steps of forming a crack line in the second embodiment of the present invention.

Hereinafter, an embodiment of the present invention will be described based on the drawings. Furthermore, in the following drawings, the same or equivalent parts are denoted with the same reference numbers, and the description is not repeated.

(Embodiment 1)

In this embodiment, a case where the scribe line is formed by a normal method that does not involve a crack-free state will be described.

Fig. 1 is a flowchart schematically showing the structure of the marking inspection method in this embodiment. Hereinafter, referring to FIG. 1, the inspection method of marking will be described.

2 and 3, first, prepare a glass substrate 4 (brittle substrate) having a flat upper surface SF1 (first surface) and a flat lower surface SF2 (second surface opposite to the first surface) (Figure 1: Step S10). A scribe line SL is provided on the upper surface SF1.

The scribing line SL has a trench line TL and a crack line CL extending along the trench line TL directly below the trench line TL. The trench line TL extends along the extension direction (lateral direction in FIG. 2). Furthermore, the groove line TL is typically linear, but a curved groove line may also be formed. In this case, at least one position of the groove line on the upper surface SF1 extends along an extension direction. The crack line CL is a crack extending from the recess of the groove line TL into the glass substrate 4 along the thickness direction DT perpendicular to the upper surface SF1.

The glass substrate 4 is directly below the trench line TL due to the crack line CL, and cuts off the continuous connection in the direction DC (FIG. 3) intersecting the extending direction of the trench line TL. In other words, the so-called "continuous connection" here is a connection that is not interrupted by a crack. Furthermore, in the state where the continuous connection is cut off as described above, the parts of the glass substrate 4 may be in contact with each other through the crack of the crack line CL.

In this embodiment, the scribing line SL can be formed by a normal scribing method. Specifically, a cutting tool such as a diamond cutter is used to slide or roll on the upper surface SF1 of the glass substrate 4 to form a groove caused by plastic deformation on the glass substrate 4. At the same time, a groove is formed in the groove A vertical crack formed directly below.

Depending on the situation, there may be cases where the scribe line SL (FIG. 3) with the normal crack line CL is not formed on the upper surface SF1 due to some reasons. Specifically, there may be a case where a scribe line SA with a vertical disorder (curved or inclined) crack line CA is formed as shown in FIG. 4. Or, there may be cases where the scribe line does not have the crack line CL (FIG. 3) as shown in FIG. 5. Therefore, an inspection is performed to determine whether the scribe line SL is properly formed.

6, an inspection device 40 is prepared for the purpose of the above inspection. The inspection device 40 includes a reflection member 10, a substrate pressing device 11, a stage 12, a laser head 20, a head position adjustment unit 28, and an amplifier 29. The laser head 20 has a light source 21 and a sensor 22.

The platform 12 supports the glass substrate 4 through the reflective member 10. In addition, the platform 12 is one that displaces the glass substrate 4, for example, one that adjusts the horizontal position and the inclination angle of the glass substrate 4 as shown by arrows A1 and A2 in the figure, respectively. The substrate pressing device 11 presses the glass substrate 4 onto the platform 12. The deflection of the glass substrate 4 can be corrected by pressing against the substrate pressing device 11. Thereby, the glass substrate 4 and the reflective member 10 are brought into closer contact with each other. Therefore, it is difficult to form a gap between the two.

The light source 21 emits light generated by laser as incident light LI to the glass substrate 4 which is the inspection object. The wavelength of the laser is selected so that the incident light LI can easily pass through the glass substrate 4. In the case where the inspection object is the glass substrate 4 as in this embodiment, for example, a wavelength in the visible light region can be used. The sensor 22 detects the light LO emitted from the glass substrate 4. The signal detected by the sensor 22 is processed by the amplifier 29 to measure the intensity of the emitted light LO. The head position adjustment part 28 is a device that displaces the laser head 20, for example, it is a device that adjusts the height position parallel to the thickness direction of the glass substrate 4 as shown by the arrow A3 in the figure. By displacing the laser head 20, the light source 21 and the sensor 22 of the laser head are moved together.

The reflective member 10 has a surface that can efficiently reflect the laser light from the light source 21. Therefore, the surface of the reflective member 10 preferably has a flat shape and a high reflectivity in the wavelength region of the above-mentioned laser light. When using laser light in the visible light region, do For the reflective member 10, for example, a silicon wafer with a polished surface can be used.

7 and 9 are cross-sectional views showing the state of inspection using the inspection device 40 (FIG. 6). Figures 8 and 10 are top views schematically showing the steps of Figures 7 and 9 respectively. In addition, in FIG. 8 and FIG. 10, five scribe lines SL are illustrated, but in FIG. 7 and FIG. 9, only one of them is illustrated for simplicity.

Referring to FIG. 7, first, the lower surface SF2 of the glass substrate 4 is placed on the reflective member 10. Then, the glass substrate 4 is pressed against the platform 12 via the reflective member 10 by the substrate pressing device 11. The incident light LI radiated from the light source 21 to the glass substrate 4. Thereby, the spot SP (FIGS. 7 and 8) of the incident light LI is partially irradiated onto the upper surface SF1 of the glass substrate 4. The direction of the optical axis of the incident light LI has an oblique component, and the oblique component is based on the direction perpendicular to the upper surface SF1 (the longitudinal direction in FIG. 7), and faces the extending direction of the groove line TL on the upper surface SF1 (FIG. 7 in the direction perpendicular to the paper surface) perpendicular to the direction (lateral in Figure 7). Preferably, the direction of the optical axis of the incident light LI is based on the direction perpendicular to the upper surface SF1 (longitudinal direction in FIG. 7) and faces the extending direction of the groove line TL on the upper surface SF1 (in FIG. 7 and the paper surface). The vertical direction) is inclined in the vertical direction (lateral direction in Figure 7).

The upper surface SF1 is scanned with the spot SP of the incident light LI along the direction intersecting the groove line TL (the lateral direction in FIG. 9 and the scanning direction SC in FIG. 10). Thereby, the incident light LI is irradiated from the outside of the glass substrate 4 through the upper surface SF1 to the upper surface SF1 and the groove line TL of the upper surface SF1 extends directly below a position in the extending direction (FIG. 1: step S20). For the phenomenon caused by this, the following is divided into three situations to explain.

Referring to FIG. 11, first: when a substantially vertical normal crack line CL is formed on the upper surface SF1, the incident light LI is reflected by the crack line CL to generate the reflected light LR toward the lower surface SF2. Furthermore, a part of the incident light LI can also be used as the transmitted light LT to pass through the crack line CL. The reflective member 10 disposed on the lower surface SF2 reflects the reflected light LR, thereby generating the outgoing light LO from the lower surface SF2 to the outside of the glass substrate 4 through the upper surface SF1 (FIG. 1: step S30). The sensor 22 (FIG. 9) detects the emitted light LO, thereby measuring the intensity of the emitted light LO (Figure 1: Step S40). The strength is sufficiently high due to the existence of the crack line CL.

Referring to FIG. 12, No. 2: In the case of forming a vertical chaotic (curved) crack line CA, the crack line CA diffuses the incident light LI, so it is impossible to obtain a sufficiently high reflected light LR as in the case of FIG. As a result, the measured intensity of the emitted light LO is smaller than the case where the crack line CL (Figure 11) is formed. Similarly, when an inclined crack line is formed, reflected light with a different reflection angle is generated compared to the case where a normal crack line CL is formed. In this case, the emitted light is not received by the sensor 22 that is set to receive the reflected light of the normal crack line CL, so the measured intensity of the emitted light LO is less than the case where the crack line CL is formed (Figure 11) .

Referring to FIG. 13, third: when there is no crack line CL directly under the trench line TL, no reflected light LR is generated (FIG. 11). As a result, the measured intensity of the emitted light LO becomes substantially zero.

According to this embodiment, referring to FIGS. 11 to 13, as described above, the intensity of the emitted light LO obtained from the reflected light LR depends on whether the crack line CL that generates the reflected light LR is appropriately formed (FIG. 11 ). Therefore, by measuring the intensity of the emitted light LO, it can be determined whether the crack line CL is properly formed. Thereby, the formation steps of the crack line CL can be managed. By forming an appropriate crack line CL, the subsequent breaking of the glass substrate 4 along the crack line CL, that is, the yield of the breaking step can be improved.

The step of irradiating the incident light LI can be performed by scanning the upper surface SF1 with the spot SP (FIG. 10) of the incident light LI along the direction crossing the scribe line SL. Thereby, the incident light LI can be reliably incident on the crack line CL located directly below the trench line TL.

The light source 21 and the sensor 22 (FIG. 6) included in the laser head 20 can be moved together by the movement of the laser head 20. In this case, the relative relationship between the generation position of the incident light LI and the observation position of the outgoing light LO is maintained. Therefore, the path of the specific light can be easily maintained in the optical measurement system. Therefore, stable measurement can be easily performed.

Furthermore, instead of the substrate pressing device 11 (Figure 6), the glass can be The substrate 4 is fixed. For example, vacuum suction or tape can also be used. Moreover, as long as the clutter of the optical path does not become a problem, a space may be provided between the glass substrate 4 and the reflection member 10. In addition, the displacement of the laser head 20 and the platform 12 is performed to adjust the relative position between the two. Therefore, part or all of the displacement of one of the laser head 20 and the platform 12 can be replaced by the displacement of the other.

(Embodiment 2)

In this embodiment, the case where the step (FIG. 1: step S10) of preparing the glass substrate 4 with the scribe line SL (FIG. 3) includes the step (FIG. 14) accompanied by a crack-free state will be described.

15 and 16, first, the cutting tool 50 used to form the groove line TL (FIG. 5) (FIG. 14: step S11) in a crack-free state will be described. The cutting tool 50 has a blade tip 51 and a handle 52.

The tip 51 is held by being fixed to the handle 52 as a holder. The tip 51 is provided with a top surface SD1 and a plurality of surfaces surrounding the top surface SD1. These plural faces include side SD2 and side SD3. The top surface SD1, the side surfaces SD2 and SD3 face different directions and are adjacent to each other. The blade edge 51 has an apex where the top surface SD1, the side surfaces SD2, and SD3 converge, and this apex forms the protrusion PP of the blade edge 51. In addition, the side surfaces SD2 and SD3 form the ridgeline of the side PS of the blade edge 51. The side portion PS extends linearly from the protrusion PP. In addition, since the side portion PS is a ridgeline as described above, it has a convex shape extending linearly. The tip 51 is preferably a diamond tip. That is, in terms of reducing the hardness and surface roughness, the tip 51 is preferably made of diamond. The tip 51 is more preferably made of single crystal diamond. In terms of crystallography, it is more preferable that the top surface SD1 is a {001} plane, and the side surfaces SD2 and SD3 are respectively {111} planes. In this case, although the side faces SD2 and SD3 have different orientations, they are crystallographically equivalent crystal faces. Furthermore, diamonds that are not single crystals can also be used. For example, polycrystalline diamonds synthesized by CVD (Chemical Vapor Deposition) method can also be used. Alternatively, sintered diamond formed by combining polycrystalline diamond particles with iron group elements and other bonding materials can also be used. The polycrystalline diamond particles are made of fine particles of graphite or non-graphite Shaped carbon is sintered without binding materials such as iron group elements.

The shank 52 extends along the axial direction AX. The tip 51 is preferably installed on the shank 52 in such a way that the normal direction of the top surface SD1 is substantially along the axial direction AX.

Next, the formation of the groove line TL using the cutting tool 50 (FIG. 14: Step S11) will be described below.

Referring to FIG. 17, first, a glass substrate 4 for forming trench lines TL is prepared. The glass substrate 4 has a flat upper surface SF1. The edge surrounding the upper surface SF1 includes sides ED1 and ED2 facing each other. In the example shown in Fig. 17, the edge is rectangular. Therefore, the sides ED1 and ED2 are parallel to each other. Also, in the example shown in FIG. 17, the sides ED1 and ED2 are the short sides of the rectangle.

Then, the tip 51 (FIG. 15) is pressed against the upper surface SF1 at the position N1 (FIG. 17). The details of position N1 are described below. 15, the pressing of the blade tip 51 is to arrange the protrusion PP of the blade tip 51 on the upper surface SF1 of the glass substrate 4 between the side ED1 and the side PS, and to set the side of the blade tip 51 The part PS is arranged between the protrusion PP and the edge ED2.

Then, the cutting tool 50 slides on the upper surface SF1. This sliding is performed between the position N1 and the position N3. The position N2 is located between the positions N1 and N3. Therefore, the trench line TL is formed between the positions N1 and N2 and between the positions N2 and N3. The positions N1 and N3 may be located at positions away from the edge of the upper surface SF1 of the glass substrate 4 as shown in FIG. 17, or one or both of them may be located at the edge of the upper surface SF1. The formed trench line TL is separated from the edge of the glass substrate 4 in the former case, and is in contact with the edge of the glass substrate 4 in the latter case. The position N1 in the positions N1 and N2 is closer to the edge ED1, and the position N2 in the positions N1 and N2 is closer to the edge ED2. Furthermore, in the example shown in Figure 17, the position N1 is closer to the side ED1 of the sides ED1 and ED2, and the position N2 is closer to the side ED2 of the sides ED1 and ED2. However, both positions N1 and N2 may be located at Near either side ED1 or ED2.

In this embodiment, the tool tip 51 is shifted from position N1 to position N2, and then self-positioned Set N2 to shift to position N3. That is, referring to FIG. 15, the cutting edge 51 is displaced in the direction DA from the side ED1 toward the side ED2. The direction DA is substantially parallel to the direction in which the side portion PS is projected on the upper surface SF1, and is substantially in the direction in which the axial direction AX extending from the tip 51 to the shank 52 is projected onto the upper surface SF1. In this situation, the tip 51 is dragged and slid on the upper surface SF1 by the handle 52. That is, the pressed blade edge 51 is slid on the upper surface SF1 of the glass substrate 4 (refer to the arrow in FIG. 17). The sliding causes plastic deformation on the upper surface SF1 of the glass substrate 4. By this plastic deformation, a groove line TL having a groove shape is formed on the upper surface SF1. At this time, the glass substrate 4 may be slightly cut, but fragments may be generated accompanying this, so it is preferable to make such cutting as little as possible.

The above-mentioned steps of forming the trench line TL are to obtain a state in which the glass substrate 4 directly below the trench line TL is continuously connected in the direction DC (FIG. 5) intersecting the extending direction of the trench line TL, that is, a state without cracks. Way to proceed. In the non-cracked state, although the groove line TL caused by plastic deformation is formed, no crack along the groove line TL is formed. Therefore, even if an external force such as a bending moment is simply applied to the glass substrate 4 as in the previous breaking step, it is not easy to break along the groove line TL. Therefore, the cutting step along the trench line TL is not performed in a crack-free state. In order to obtain a crack-free state, the load applied to the blade tip 51 is small to the extent that no cracks are generated, and to the extent that plastic deformation occurs.

The crack-free state is maintained for the necessary time (FIG. 14: Step S12). In order to maintain a crack-free state, it is only necessary to avoid operations such as applying excessive stress to the glass substrate 4 in the trench line TL, such as avoiding the application of large external stress that causes damage to the substrate or heating accompanied by large temperature changes OK. While maintaining the crack-free state, the glass substrate 4 can be transported, and the glass substrate 4 can also be processed.

Referring to FIG. 18, after maintaining the crack-free state, in other words, after the trench line TL is formed, the cracks of the glass substrate 4 in the thickness direction DT (FIG. 3) are extended along the trench line TL with a time difference. Specifically, along the groove line TL from the position N2 to the direction N1 (refer to the dotted arrow in the figure), the crack of the glass substrate 4 in the thickness direction DT is extended. borrow Thus, a crack line CL extending along the trench line TL is formed (FIG. 14: Step S13). The formation of the crack line CL starts when the auxiliary line AL and the groove line TL cross each other at the position N2. For this purpose, the auxiliary line AL is formed after the trench line TL is formed. The auxiliary line AL is a normal scribe line accompanied by a crack in the thickness direction DT, and is a deflection that eliminates internal stress near the groove line TL. The method of forming the auxiliary line AL is not particularly limited, and as shown in FIG. 18, it may be formed using the edge of the upper surface SF1 as a base point.

Furthermore, it is more difficult to form the crack line CL in the direction from the position N2 to the position N3 than in the direction from the position N2 to the position N1. That is, the ease of extension of the crack line CL is direction-dependent. Therefore, the crack line CL is formed between the positions N1 and N2 but not between the positions N2 and N3. This embodiment aims at the separation along the glass substrate 4 between the positions N1 and N2, and does not aim at the separation along the glass substrate 4 between the positions N2 and N3. Therefore, it is necessary to form a crack line CL between the positions N1 and N2. On the other hand, it is not a problem that the crack line CL is difficult to form between the positions N2 and N3.

As described above, it is intended to form the crack line CL to form the auxiliary line AL. However, there may be cases where the crack line CL is not formed even if the auxiliary line AL is formed, or an abnormal crack line CL (FIG. 4) is formed. Therefore, after the auxiliary line AL is formed, as described in the first embodiment, the inspection method of scribing is performed. In the case where the crack line CL is formed after maintaining the crack-free state as in the present embodiment, the reliability of forming the crack line CL is reduced compared to the case where the crack line CL is not formed through the crack-free state. According to the inspection method of marking described in the first embodiment, the presence or absence of such a formation defect can be easily determined.

Furthermore, when the groove line TL is formed, instead of shifting the tip 51 from the position N1 to the position N3 as shown by the arrow in FIG. 17, and shifting it from the position N3 to the position N1. In this case, the tool tip 51 is displaced in the direction DB instead of the direction DA in FIG. 15. In addition, the tool used to form the groove line TL is not limited to the tip 51 (FIG. 15 ), and a conical tip may also be used. Also, instead of sliding blade tips, rolling blade tips can be used. In this case, the scroll direction is preferably set to a direction equivalent to the direction DB (FIG. 15).

In addition, the crack line CL can be started by applying a stress to the glass substrate 4 on the trench line TL such as deflection of the internal stress near the trench line TL. In order to generate greater stress, the glass substrate 4 can also be divided along the auxiliary line AL. Also, instead of forming the auxiliary line AL, external stress may be applied by pressing the blade tip on or near the formed groove line TL again, or heating may be performed by irradiating laser light or the like.

In addition, the sides ED1 and ED2 of the edge of the glass substrate 4 are the short sides of the rectangle in FIG. 17, but they may also be the long sides of the rectangle. In addition, the shape of the edge is not limited to a rectangle, and may be a square, for example. In addition, the sides ED1 and ED2 are not limited to straight ones, and may be curved. In addition, the upper surface SF1 of the glass substrate 4 is not limited to a flat one, and may be curved.

In addition, the case where the glass substrate 4 is used as a brittle substrate is described in detail, but the brittle substrate is not limited to a glass substrate. For example, a ceramic, silicon, compound semiconductor, sapphire, or quartz substrate may be used. The wavelength of the laser light and the material of the reflective member 10 can be appropriately selected according to the material of the brittle substrate. For example, when the brittle substrate is a silicon substrate, it is preferable to use an infrared laser.

10‧‧‧Reflective member

11‧‧‧Substrate pressing device

12‧‧‧Platform

20‧‧‧Laser head

21‧‧‧Light source

22‧‧‧Sensor

28‧‧‧Head position adjustment part

29‧‧‧Amplifier

CL‧‧‧Crack Line

LI‧‧‧ incident light

LO‧‧‧Outgoing light

LR‧‧‧reflected light

SF1‧‧‧Upper surface (1st side)

SF2‧‧‧Bottom surface (Second side)

SL‧‧‧Scribe

TL‧‧‧Trench line

Claims (6)

A scribing inspection method, which is an inspection method with a groove line and a crack line extending along the groove line directly under the groove line, and a step of preparing a brittle substrate. The substrate has a first surface and a second surface opposite to the first surface. The scribing line is provided on the first surface, and the scribing line has the scribe line extending in the extending direction at a position on the first surface. Groove lines, and further include the following step of irradiating incident light: making incident light generated by a laser from the outside of the fragile substrate pass through the first surface directly below the one position of the first surface of the fragile substrate Irradiation, wherein the optical axis direction of the incident light has an oblique component inclined to a direction perpendicular to the extending direction on the first surface based on a direction perpendicular to the first surface, and the crack line reflects the Incident light to generate reflected light toward the second surface, and further comprising: by reflecting the reflected light, the step of generating outgoing light from the second surface through the first surface to the outside of the brittle substrate; and The step of measuring the intensity of the emitted light; and the step of irradiating the incident light is performed by scanning the first surface with the incident light in a direction crossing the groove line. The inspection method for scribing according to claim 1, wherein the step of generating the emitted light is performed by reflecting the reflected light by the reflecting member disposed on the second surface. The inspection method for scribing according to claim 1, wherein the step of generating the emitted light is performed by reflecting the reflected light by the reflecting member disposed on the second surface. An inspection method for scribing according to any one of claims 1 to 3, wherein the step of irradiating incident light is performed by radiating laser light from a light source, and the step of measuring the intensity of the emitted light is detected by a sensor Above outgoing light And proceed, and further include a step of moving the light source and the sensor together. The scribing inspection method according to any one of claims 1 to 3, wherein the step of preparing a brittle substrate includes the step of forming groove lines on the first surface of the brittle substrate in a manner to obtain a crack-free state; The step of maintaining the above crack-free state; and the step of forming a crack line extending along the groove line. The scribing inspection method of claim 4, wherein the step of preparing the brittle substrate includes: forming groove lines on the first surface of the brittle substrate to obtain a crack-free state; maintaining the crack-free state Step; and the step of forming a crack line extending along the groove line.

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