KR20170022866A - Method for inspecting scribe line - Google Patents

Abstract

The present invention provides a method for inspecting a scribe line to determine whether a crack line has been generated appropriately. On a first side (SF1) of a brittle substrate (4), a scribe line (SL) having a trench line (TL) extended in an extension direction in one location on the first side (SF1) is formed. Incident light (LI) of laser from the outside of the brittle substrate (4) is emitted immediately under the one location of the first side (SF1) of the brittle substrate (4) through the first side (SF1). An optical axis direction of the incident light (LI) has an inclination element in the direction perpendicular to the extension direction on the first side (SF1) with respect to the direction, as a reference, perpendicular to the first side (SF1). Reflected light (LR) directed to a second side (SF2) is generated as a crack line (CL) reflects the incident light (LI). As the reflected light (LR) is reflected, outgoing light (LO) directed to the outside of the brittle substrate (4) from the second side (SF2) through the first side (SF1) is generated.

Description

[0001] METHOD FOR INSPECTING SCRIBE LINE [0002]

The present invention relates to a method of inspecting a scribe line formed on a brittle substrate.

In the production of electric devices such as a flat display panel or a solar cell panel, it is often necessary to separate a brittle substrate such as a glass substrate. First, a scribe line is formed on the substrate, and then the substrate is divided along the scribe line. The scribe line can be formed by mechanically processing the substrate using a cutting mechanism. A trench due to plastic deformation is formed on the substrate by sliding or rolling the cutting mechanism over the substrate and a vertical crack is formed immediately below the trench. Thereafter, a stress application called a braking process is performed. By fully advancing the crack in the thickness direction by the breaking process, the substrate is divided.

The step of dividing the substrate is often performed immediately after the step of forming the scribe line on the substrate. However, it has also been proposed to perform a step of processing the substrate between the step of forming the scribe line and the step of breaking. The step of processing the substrate is, for example, a step of forming any member on the substrate.

For example, according to the technique of International Publication No. 2002/104078, in the method of manufacturing an organic EL display, a scribe line is formed on a glass substrate for each region to be an organic EL display before mounting the sealing cap. Therefore, it is possible to avoid the contact between the sealing cap and the glass cutter, which may become a problem when the scribe line is formed on the glass substrate after the sealing cap is provided.

Further, for example, according to the technique of International Publication No. 2003/006391, in the method of manufacturing a liquid crystal display panel, two glass substrates can be bonded after the scribe lines are formed. As a result, two brittle substrates can be simultaneously braked by one braking process.

WO 2002104078 A WO 2003006391 A

According to the above conventional technique, the brittle substrate is processed after the formation of the scribe line, and then the braking process is performed by applying the stress. This means that a vertical crack already exists in the processing on the brittle substrate. Further progress in the thickness direction of the vertical cracks occurred unintentionally during processing, so that the brittle substrate, which should be a single piece, could be separated during processing. In addition, even when the substrate processing step is not performed between the scribing line forming step and the substrate breaking step, it is usually necessary to transport or store substrates after the scribing line forming step and before the breaking step of the substrate, The substrate may be unintentionally divided.

In order to solve the above problems, the inventors of the present invention have developed unique separation techniques. According to this technique, as a line defining the position where the brittle substrate is divided, first, a trench line having no crack is formed immediately below the line. By forming the trench line, the position at which the brittle substrate is divided is defined. Thereafter, when a state in which no crack is present immediately below the trench line (hereinafter also referred to as a " crack-free state ") is maintained, division along the trench line is difficult to occur easily. By using this state, it is possible to prevent the brittle substrate from being unintentionally divided before the time when the brittle substrate should be divided, while stipulating in advance the position where the brittle substrate is divided. However, when a crack line is formed after the crack-free state is maintained, defective formation of a crack line is relatively easy to occur. Therefore, there has been a demand for a method for easily identifying the presence or absence of defective formation of crack lines.

In addition, even when a scribe line is formed by a conventional method not involving a crack-free state, a method of easily discriminating the presence or absence of defective formation of a crack line can be demanded. For example, when the scribe line is formed by rolling the cutting mechanism, the perpendicularity of the growth in the depth direction of the crack line is likely to be disturbed. As a result, the brake process along the crack line could be hindered.

SUMMARY OF THE INVENTION The present invention has been made in order to solve the above problems, and an object of the present invention is to provide a scribe line inspection method capable of discriminating whether or not a crack line is appropriately formed.

An inspection method of a scribe line of the present invention is a method of inspecting a scribe line having a trench line and a crack line extending along a trench line immediately below the trench line. A brittle substrate having a first side and a second side opposite to the first side is prepared. A scribe line having a trench line extending in the extending direction at one position on the first surface is formed on the first surface. Incident light from the laser is irradiated from the outside of the brittle substrate through the first surface and just below one position of the first surface of the brittle substrate. The direction of the optical axis of the incident light has a tilt component in a direction perpendicular to the extending direction on the first surface with reference to a direction perpendicular to the first surface. The crack line reflects incident light, so that reflected light toward the second surface is generated. By reflecting the reflected light, emitted light directed from the second surface to the outside of the brittle substrate via the first surface is generated. The intensity of the outgoing light is measured.

According to the present invention, the intensity of the outgoing light depends on whether or not the crack line is appropriately formed. Therefore, by measuring the intensity of the outgoing light, it is possible to judge whether or not a crack line is properly formed.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a flowchart schematically showing a configuration of a scribing line inspection method according to Embodiment 1 of the present invention; FIG.
2 is a plan view schematically showing one step of a scribing line inspection method according to Embodiment 1 of the present invention;
FIG. 3 is a partial cross-sectional view schematically showing a configuration of a scribe line having a normal crack line; FIG.
4 is a partial cross-sectional view schematically showing the configuration of a scribe line having a crack line with disturbed verticality;
5 is a partial cross-sectional view schematically showing a structure of a scribe line lacking a crack line;
6 is a cross-sectional view schematically showing a configuration of an inspection apparatus used in a scribe line inspection method according to Embodiment 1 of the present invention;
7 is a cross-sectional view schematically showing a step of a scribing line inspection method according to Embodiment 1 of the present invention;
Figure 8 is a plan view schematically illustrating the process of Figure 7;
9 is a cross-sectional view schematically showing a step of a scribing line inspection method according to Embodiment 1 of the present invention;
FIG. 10 is a plan view schematically showing the process of FIG. 9; FIG.
11 is a partial cross-sectional view schematically showing progress of light when a scribe line inspection method according to Embodiment 1 of the present invention is performed on a normal scribe line;
12 is a partial cross-sectional view schematically showing progress of light when a scribe line inspection method according to Embodiment 1 of the present invention is performed on a scribe line having a crack line with disturbed verticality;
13 is a partial sectional view schematically showing progress of light when a scribe line inspection method according to Embodiment 1 of the present invention is performed on a scribe line lacking a crack line;
14 is a flowchart schematically showing a configuration of a scribing line forming method according to Embodiment 2 of the present invention;
15 is a side view schematically showing the structure of a mechanism used in the method of dividing a brittle substrate according to Embodiment 2 of the present invention;
FIG. 16 is a schematic plan view at the time of the arrow XVI in FIG. 15; FIG.
17 is a plan view schematically showing a step of forming a trench line in Embodiment 2 of the present invention;
18 is a plan view schematically showing a step of forming a crack line in Embodiment 2 of the present invention.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following drawings, the same or corresponding parts are denoted by the same reference numerals, and description thereof is not repeated.

(Embodiment 1)

In the present embodiment, a case where a scribe line is formed by a conventional method not accompanied by a crack free state will be described.

1 is a flowchart schematically showing a configuration of a scribe line inspection method in the present embodiment. Hereinafter, a method of inspecting a scribe line will be described with reference to Fig.

2 and 3, a glass substrate 4 (first surface) having a flat upper surface SF1 (first surface) and a flat lower surface SF2 (a second surface opposite to the first surface) Brittle substrate) is prepared (Fig. 1: step S10). A scribe line SL is formed on the upper surface SF1.

The scribe line SL has a trench line TL and a crack line CL extending along the trench line TL immediately below the trench line TL. The trench line TL extends in the extending direction (the lateral direction in Fig. 2). Although the trench line TL is typically a straight line, a curved trench line may be formed. In this case, the trench line is formed in one extension direction at at least one position on the upper surface SF1 It is extended. The crack line CL is a crack extending from the concave portion of the trench line TL in the glass substrate 4 in the thickness direction DT perpendicular to the upper surface SF1.

The glass substrate 4 is disconnected from the continuous line in the direction DC (FIG. 3) intersecting the extending direction of the trench line TL immediately below the trench line TL by the crack line CL . Here, " continuous continuous " means, in other words, continuous continuous unblocked by cracks. In the state where the continuous relationship is broken as described above, portions of the glass substrate 4 may be in contact with each other through a crack of the crack line CL.

In the present embodiment, the scribe line SL can be formed by a normal scribing method. Specifically, a cutting mechanism such as a diamond cutter slides or rolls over the upper surface SF1 of the glass substrate 4, thereby forming a trench by plastic deformation on the glass substrate 4, Vertical cracks are formed below.

In some cases, there may be a case where a scribe line SL (FIG. 3) having a normal crack line CL is not formed on the upper surface SF1 due to some factor. Specifically, as shown in Fig. 4, a scribe line SA having a crack line CA having disturbed vertical (curved or inclined) may be formed. Alternatively, as shown in Fig. 5, the scribe line may lack the crack line CL (Fig. 3). Thus, a check is made to determine whether or not the scribe line SL is appropriately formed.

Referring to FIG. 6, the inspection apparatus 40 is prepared for the purpose of the inspection. The inspection apparatus 40 includes a reflection member 10, a substrate pressing section 11, a table 12, a laser head 20, a head position adjustment section 28, and an amplifier 29 have. The laser head 20 includes a light source 21 and a sensor 22.

The table 12 supports the glass substrate 4 with the reflective member 10 interposed therebetween. The table 12 displaces the glass substrate 4 and adjusts the horizontal position and the inclination angle of the glass substrate 4 as shown by, for example, arrows A1 and A2 in the figure. The substrate pressing section 11 presses the glass substrate 4 onto the table 12. [ By being pressed by the substrate pressing portion 11, the warping of the glass substrate 4 can be corrected. Thereby, the glass substrate 4 and the reflecting member 10 are brought into close contact with each other. Therefore, it is difficult to form a gap therebetween.

The light source 21 emits light by a laser as incident light LI to the glass substrate 4 to be inspected. The wavelength of the laser is selected such that incident light LI is easily transmitted through the glass substrate 4. [ When the object to be inspected is the glass substrate 4 as in the present embodiment, for example, the wavelength of the visible light region can be used. The sensor 22 detects emitted light LO from the glass substrate 4. The signal detected by the sensor 22 is processed by the amplifier 29 so that the intensity of the emitted light LO is measured. The head position adjustment unit 28 displaces the laser head 20 and adjusts a height position parallel to the thickness direction of the glass substrate 4 as indicated by an arrow A3 in the figure . As the laser head 20 is displaced, the light source 21 and the sensor 22 provided therewith are moved together.

The reflecting member 10 has a surface capable of efficiently reflecting the laser beam from the light source 21. Therefore, the surface of the reflecting member 10 preferably has a flat shape and a high reflectance in the wavelength region of the laser light. When a laser beam in a visible light region is used, for example, a silicon wafer having a polished surface can be used as the reflecting member 10.

Figs. 7 and 9 are cross-sectional views showing aspects of the inspection using the inspection apparatus 40 (Fig. 6). Each of Figs. 8 and 10 is a plan view schematically showing the process of Figs. 7 and 9. Fig. 8 and 10, five scribe lines SL are illustrated, but only one of them is shown in Figs. 7 and 9 for the sake of simplification.

Referring to Fig. 7, the lower surface SF2 of the glass substrate 4 is placed on the reflective member 10 first. Next, the glass substrate 4 is pressed onto the table 12 via the reflective member 10 by the substrate pressing unit 11. Next, Incident light (LI) onto the glass substrate (4) is radiated from the light source (21). As a result, the spot light SP (FIG. 7 and FIG. 8) of the incident light LI is locally applied on the upper surface SF1 of the glass substrate 4. The direction of the optical axis of the incident light LI is defined by the direction of extension of the trench line TL on the upper surface SF1 with reference to the direction perpendicular to the upper surface SF1 (The direction perpendicular to the paper surface in Fig. 7) (the transverse direction in Fig. 7). Preferably, the direction of the optical axis of the incident light LI is the direction of the optical axis of the trench line TL on the upper surface SF1 with reference to the direction perpendicular to the upper surface SF1 (the longitudinal direction in Fig. 7) And is inclined toward a direction perpendicular to the extending direction (the direction perpendicular to the paper surface in Fig. 7) (the lateral direction in Fig. 7).

The upper surface SF1 is scanned with the spot light SP of the incident light LI along the direction intersecting the trench line TL (the transverse direction in Fig. 9, the scanning direction SC in Fig. 10) do. Thereby, the incident light (LI) is incident on the upper surface SF1 of the glass substrate 4 from the outside of the glass substrate 4 via the upper surface SF1 immediately below one position where the trench line TL extends in the extending direction (Fig. 1: step S20). The phenomenon caused by this will be described below in three cases.

11, when a normal crack line CL is formed substantially perpendicular to the upper surface SF1, the crack line CL reflects the incident light LI, thereby forming the lower surface SF2 Reflected light LR is generated. It is also possible that a part of the incident light LI passes through the crack line CL as the transmitted light LT. The reflection member 10 disposed on the lower surface SF2 reflects the reflected light LR and thereby the emitted light LO directed from the lower surface SF2 to the outside of the glass substrate 4 via the upper surface SF1, (Fig. 1: step S30). The emitted light LO is detected by the sensor 22 (FIG. 9), so that the intensity of the emitted light LO is measured (FIG. 1: step S40). By the presence of the crack line CL, this strength becomes sufficiently high.

Referring to FIG. 12, when the vertically disordered (curved) crack line CA is formed, since the crack line CA diffuses the incident light LI, The reflected light LR is not obtained. As a result, the intensity of the emitted light LO to be measured becomes smaller than that in the case where the crack line CL (FIG. 11) is formed. Likewise, when inclined crack lines are formed, reflected light having different reflection angles is generated as compared with the case where a normal crack line CL is formed. In this case, the outgoing light is not received by the sensor 22 set to receive the reflected light of the normal crack line CL, and the intensity of the outgoing light LO to be measured is set to the crack line CL (FIG. 11) Compared with the case where there is.

Referring to Fig. 13, thirdly, when the crack line CL is lacked immediately below the trench line TL, the reflected light LR (Fig. 11) does not occur. As a result, the intensity of the emitted light LO to be measured becomes substantially zero.

According to the present embodiment, as described above with reference to Figs. 11 to 13, the intensity of the emitted light LO obtained from the reflected light LR is the same as that of the crack line CL (Fig. 11) Is suitably formed. Therefore, by measuring the intensity of the emitted light (LO), it is possible to judge whether or not the crack line CL is appropriately formed. Thus, the formation process of the crack line CL can be managed. By forming an appropriate crack line CL, it is possible to increase the yield of the breaking process of the glass substrate 4, that is, the breaking process, along the crack line CL to be subsequently performed.

The step of irradiating the incident light LI can be performed by scanning the upper surface SF1 with the spot light SP of the incident light LI (Fig. 10) along the direction intersecting with the scribe line SL. Thus, the incident light LI can be reliably incident on the crack line CL immediately below the trench line TL.

The light source 21 and the sensor 22 (FIG. 6) included in the laser head 20 can be moved together by the movement of the laser head 20. In this case, the relative relationship between the position at which the incident light LI is generated and the position at which the emitted light LO is observed is maintained. Therefore, a predetermined light path can be easily maintained in the optical measurement system. Therefore, stable measurement can be easily performed.

Instead of the substrate pressing portion 11 (Fig. 6), the glass substrate 4 may be fixed by other means. For example, a vacuum adsorption or adhesive tape may be used. In addition, a gap may be formed between the glass substrate 4 and the reflecting member 10 as long as disturbance of the optical path is not a problem. The displacement of the laser head 20 and the table 12 is performed in order to adjust the relative position between them. Therefore, it is possible to replace part or all of the displacement of one of the laser head 20 and the table 12 by the other displacement.

(Embodiment 2)

In the present embodiment, when the process (FIG. 1: step S10) of preparing the glass substrate 4 having the scribe line SL (FIG. 3) includes the process Will be described.

15 and 16, a cutting mechanism 50 for forming a trench line TL (FIG. 5) without cracks (FIG. 14: step S11) will be described first. The cutting mechanism 50 has a knife end 51 and a shank 52.

The knife end 51 is held by being fixed to the bag portion 52 as its holder. A plurality of surfaces surrounding the ceiling face SD1 and the ceiling face SD1 are formed at the knife edge 51. These plural surfaces include a side surface SD2 and a side surface SD3. The ceiling face SD1 and the side faces SD2 and SD3 are oriented in different directions and are adjacent to each other. The knife end 51 has a vertex at which the ceiling face SD1, the side faces SD2 and SD3 join together and the protrusion PP of the knife edge 51 is formed by this vertex. Further, the side faces SD2 and SD3 form a ridge constituting the side portion PS of the knife end 51. The side portion PS extends linearly from the protruding portion PP. Since the side portion PS is a ridgeline as described above, it has a convex shape extending in a linear shape. The knife end 51 is preferably a diamond point. That is, it is preferable that the knife end 51 is made of diamond in that it can reduce hardness and surface roughness. More preferably, the knife end 51 is made of single crystal diamond. More preferably, the ceiling face SD1 is a {001} plane and each of side faces SD2 and SD3 is a {111} plane. In this case, the side faces SD2 and SD3 are crystal planes which have different orientations but are equivalent to each other in terms of crystallography. Alternatively, a diamond other than a single crystal may be used. For example, a polycrystalline diamond synthesized by a CVD (Chemical Vapor Deposition) method may be used. Alternatively, a sintered diamond in which polycrystalline diamond grains sintered without containing a binder such as an iron family element are bonded from a fine graphite or non-graphite carbon by a binding material such as an iron family element may be used.

The bag portion 52 extends along the axial direction AX. The knife end 51 is preferably attached to the bag portion 52 such that the normal direction of the ceiling face SD1 substantially follows the axial direction AX.

Next, the formation of the trench line TL (Fig. 14: step S11) using the cutting mechanism 50 will be described below.

Referring to Fig. 17, first, a glass substrate 4 on which a trench line TL is to be formed is prepared. The glass substrate 4 has a flat upper surface SF1. The edge surrounding the upper surface SF1 includes edges ED1 and ED2 opposite to each other. In the example shown in Fig. 17, the edge has a rectangular shape. Therefore, sides ED1 and ED2 are parallel sides. In the example shown in Fig. 17, sides ED1 and ED2 are rectangular short sides.

Next, the knife end 51 (Fig. 15) is pressed at the position N1 (Fig. 17) on the upper surface SF1. Details of the position N1 will be described later. 15, the protruding portion PP of the knife end 51 on the upper surface SF1 of the glass substrate 4 is disposed between the side ED1 and the side PS So that the side PS of the knife edge 51 is arranged between the projection PP and the edge ED2.

Next, the cutting mechanism 50 is slid on the upper surface SF1. This sliding is performed between the position N1 and the position N3. A position N2 is located between the positions N1 and N3. Therefore, the trench line TL is formed between the positions N1 and N2 and between the positions N2 and N3. The positions N1 and N3 may be located apart from the edge of the upper surface SF1 of the glass substrate 4 as shown in Fig. 17 or may be located at the edge of the upper surface SF1 do. The trench line TL to be formed is spaced apart from the edge of the glass substrate 4 in the case of electrons and in contact with the edge of the glass substrate 4 in the latter case. The middle position N1 of the positions N1 and N2 is closer to the side ED1 and the position N2 of the positions N1 to N2 is closer to the side ED2. 17, the position N1 is close to the side ED1 of the sides ED1 and ED2 and the position N2 is close to the side ED2 of the sides ED1 and ED2, N2 may be located near either one of the sides ED1 or ED2.

In the present embodiment, the knife end 51 is displaced from the position N1 to the position N2, and is also displaced from the position N2 to the position N3. That is, referring to Fig. 15, the knife end 51 is displaced in the direction DA from the side ED1 toward the side ED2. The direction DA is substantially parallel to the direction in which the side PS is projected onto the upper surface SF1 and extends in the axial direction AX extending from the knife end 51 to the bag portion 52 on the upper surface SF1 The projection direction is generally directed. In this case, the knife end 51 is dragged on the upper surface SF1 by the bag portion 52. [ That is, the pressed knife end 51 is slid on the upper surface SF1 of the glass substrate 4 (see arrows in Fig. 17). Plastic deformation occurs on the upper surface SF1 of the glass substrate 4 by this sliding. By this plastic deformation, a trench line TL having a groove shape is formed on the upper surface SF1. At this time, the glass substrate 4 may be slightly scraped off, but fragments may be generated accordingly. Therefore, it is preferable that such scraping be as small as possible.

The above process of forming the trench line TL is performed in a continuous manner in the direction DC (FIG. 5) in which the glass substrate 4 intersects the extending direction of the trench line TL immediately below the trench line TL Crack-free state is obtained. In the crack-free state, the trench line TL due to plastic deformation is formed, but no crack is formed. Therefore, even if an external force such as a bending moment or the like is simply applied to the glass substrate 4 as in the conventional breaking process, division according to the trench line TL does not easily occur. Therefore, in the crack-free state, the division process along the trench line TL is not performed. In order to obtain a crack-free state, the load applied to the knife end 51 is small enough to prevent occurrence of cracks and large enough to cause plastic deformation.

The crack-free state is maintained over the necessary time (Fig. 14: step S12). In order to maintain the crack-free state, it is necessary to perform an operation such that excessive stress is applied to the glass substrate 4 in the trench line TL, for example, application of a large external stress such as breakage to the substrate, It is only necessary to avoid the heating accompanied by the change. While the crack-free state is maintained, the glass substrate 4 may be conveyed, or the glass substrate 4 may be processed.

Referring to FIG. 18, after the crack-free state is maintained, in other words, the glass substrate in the thickness direction DT (FIG. 3) along the trench line TL with a time lag from the formation of the trench line TL, (4) is spread. Specifically, cracks of the glass substrate 4 in the thickness direction DT are spread from the position N2 to the position N1 (see the broken line arrow in the figure) along the trench line TL. As a result, a crack line CL extending along the trench line TL is formed (Fig. 14: step S13). The formation of the crack line CL is initiated by the intersection of the auxiliary line AL and the trench line TL at the position N2. For this purpose, the auxiliary line AL is formed after forming the trench line TL. The auxiliary line AL is a normal scribe line along the crack in the thickness direction DT and releases the distortion of the internal stress in the vicinity of the trench line TL. The method of forming the auxiliary line AL is not particularly limited, but it may be formed starting from the edge of the upper surface SF1 as shown in Fig.

In addition, the crack line CL is hardly formed in the direction from the position N2 to the position N3, as compared with the direction from the position N2 to the position N1. That is, there is a direction dependency on the easiness of extension of the crack line CL. Therefore, there may occur a phenomenon that the crack line CL is formed between the positions N1 to N2 and not between the positions N2 to N3. The present embodiment aims at the division of the glass substrate 4 along the positions N1 to N2 and does not aim at the separation of the glass substrate 4 along the positions N2 and N3 . Therefore, it is required that the crack line CL be formed between the positions N1 and N2, while the difficulty of forming the crack line CL between the positions N2 and N3 is not a problem.

As described above, the auxiliary line AL is formed by the purpose of forming the crack line CL. However, there may be cases where the crack line CL is not formed or the abnormal crack line CL (FIG. 4) is formed even if the auxiliary line AL is formed. Therefore, after the auxiliary line AL is formed, the scribe line inspection method is performed as described in the first embodiment. In the case where the crack line CL is formed after the crack-free state is maintained as in the present embodiment, as compared with the case where the crack line CL is formed without passing through the crack-free state, The certainty is deteriorated. The presence or absence of such defective formation can be easily determined by the inspection method of the scribe line described in the first embodiment.

When the trench line TL is formed, the knife end 51 is displaced from the position N3 to the position N1 instead of being displaced from the position N1 to the position N3 as shown by the arrow in Fig. . In this case, the knife end 51 is displaced in the direction DB instead of the direction DA in Fig. The mechanism for forming the trench line TL is not limited to the knife end 51 (Fig. 15), but a conical knife edge may be used. Also, instead of the end of the sliding knife, a driven end of the knife may be used. In this case, it is preferable that the electric direction is a direction corresponding to the direction DB (Fig. 15).

The crack line CL can also be initiated by applying stress to the glass substrate 4 on the trench line TL to release the distortion of the internal stress near the trench line TL. In order to generate a larger stress, the glass substrate 4 along the auxiliary line AL may be divided. Further, instead of forming the auxiliary line AL, for example, even if external stress is applied by pressing the end of the knife on or near the formed trench line TL, or heating by laser light irradiation or the like is performed do.

The edges ED1 and ED2 of the edge of the glass substrate 4 are short sides of a rectangle in FIG. 17, but may be long sides of a rectangle. The shape of the edge is not limited to a rectangle, but may be square, for example. The sides ED1 and ED2 are not limited to being linear, but may be curved. Further, the upper surface SF1 of the glass substrate 4 is not limited to being flat, but may be curved.

Although the case where the glass substrate 4 is used as the brittle substrate has been described in detail, the brittle substrate is not limited to the glass substrate, and for example, ceramics, silicon, compound semiconductor, sapphire or quartz substrate may be used. The wavelength of the laser beam and the material of the reflecting member 10 can be appropriately selected depending on the material of the brittle substrate. For example, when the brittle substrate is a silicon substrate, it is preferable to use an infrared laser.

4: glass substrate (brittle substrate) 10: reflective member
12: Table 20: Laser head
21: light source 22: sensor
28: Head position adjusting section 29: Amplifier
40: inspection apparatus 50: cutting mechanism
51: Knife end 52: Sack portion
AL: auxiliary line CA, CL: crack line
LI: incident light LO: outgoing light
LR: reflected light LT: transmitted light
SA, SL: scribe line SF1: upper surface (first surface)
SF2: Lower surface (second surface) SP spot light
TL trench line

Claims (5)

1. A method for inspecting a scribe line having a trench line and a crack line extending along the trench line immediately below the trench line,
A method of manufacturing a brittle substrate having a first surface and a second surface opposite to the first surface, the method comprising the steps of: forming on the first surface a trench line extending in an extending direction at a location on the first surface, Forming a brittle substrate on which the scribe line is formed;
Irradiating an incident beam of laser light from the outside of the brittle substrate to the first surface of the brittle substrate immediately below the one position of the brittle substrate via the first surface, And the inclined component in a direction perpendicular to the extending direction is formed on the first surface with reference to a direction perpendicular to the surface of the first surface, and the reflected light, which is reflected toward the second surface, Irradiating the incident light;
Reflecting the reflected light to generate outgoing light from the second surface to the outside of the brittle substrate via the first surface; And
And measuring the intensity of the outgoing light. The inspection method of a scribe line according to claim 1, wherein the step of irradiating the incident light is performed by scanning the first surface with the incident light along a direction intersecting with the trench line. The inspection method of a scribe line according to claim 1, wherein the step of generating the outgoing light is performed by reflecting members of the reflection member arranged on the second surface. The method according to any one of claims 1 to 3, wherein the step of irradiating the incident light is performed by radiating laser light from a light source,
The step of measuring the intensity of the outgoing light is performed by detecting the outgoing light by the sensor,
Wherein the method further comprises moving the light source and the sensor together. The method of manufacturing a brittle substrate according to any one of claims 1 to 3, wherein the step of preparing the brittle substrate includes the steps of forming a trench line on the first surface of the brittle substrate so as to obtain a state without cracks, And a step of forming a crack line extending along the trench line.

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