TWI701325B - Thermal phase change heat storage module - Google Patents

Abstract

A thermal phase change heat storage module includes a heat conducting outer layer and a heat storage structure. The thermally conductive outer layer is suitable for contacting at least one heat source. The heat storage structure is arranged in the heat conducting outer layer and includes a fiber base material and a thermal phase change material. The fibrous base material is arranged in the thermally conductive outer layer, and the thermal phase change material is attached to it. The thermal phase change material can maintain a specific temperature during the phase change process and absorb heat.

Description

Thermal phase change heat storage module

The invention relates to a heat storage module, in particular to a thermal phase change heat storage module.

Nowadays, the operating functions of electronic devices are becoming more and more complex, so it is necessary to install many high-performance components to realize the device functions. However, high-performance components usually operate under high-power conditions, which will generate a large amount of heat energy and cause the temperature of the electronic device to increase. In addition, the development trend of lighter and thinner electronic devices also makes it difficult for the heat generated in specific parts of the electronic devices to escape. Therefore, certain components inside electronic devices, such as processing chips, power modules, and battery modules, often have local overheating problems, which affects the performance of the device, and may even cause damage to the components and ignition problems.

Therefore, one of the objectives of the present invention is to provide a thermal phase change heat storage module that can solve the aforementioned problems.

Therefore, in some embodiments, the thermal phase change heat storage module of the present invention includes a thermally conductive outer layer and a heat storage structure. The thermally conductive outer layer is suitable for contacting at least one heat source. The heat storage structure is arranged in the heat conducting outer layer and includes a fiber base material and a thermal phase change material. The fibrous base material is arranged in the thermally conductive outer layer, and the thermal phase change material is attached to it. The thermal phase change material can maintain a specific temperature during the phase change process and absorb heat.

In some embodiments, the material of the fiber substrate includes one of non-woven fabric, polyester fiber, glass fiber, metal fiber, and carbon fiber.

In some embodiments, the thickness of the fibrous substrate is between 0.01 mm and 0.5 mm.

In some embodiments, the material of the thermally conductive outer layer includes one of copper, aluminum, polyethylene terephthalate, and polyimide.

In some embodiments, the thermally conductive outer layer includes a surrounding wall suitable for contacting the heat source, and the thickness of the surrounding wall is not greater than 0.5 mm.

In some embodiments, the material of the thermal phase change material includes paraffin and carbon nanomaterials with radiant thermal conductivity.

In some embodiments, the thickness of the thermal phase change material is not less than 0.3 mm.

The present invention has at least the following effects: the thermal phase change heat storage module can be used as a heat reservoir for absorbing or releasing heat energy to a certain extent by the arrangement of the thermal phase change material, so the thermal phase change heat storage module After contacting a heat source with a higher temperature, the heat energy of the heat source can be absorbed to produce a phase change reaction, and the temperature will be maintained at a specific temperature during the phase change reaction without increasing, so the problem of excessive heat source temperature or local overheating can be suppressed. In addition, since the thermal phase change material may have fluidity in different states, the arrangement of the fibrous substrate can ensure that the thermal phase change material is still located at the position after the thermally conductive outer layer is changed to a different orientation or angle. The predetermined position in the thermally conductive outer layer allows specific parts of the thermally conductive outer layer to contact the heat source to smoothly conduct heat energy to the thermal phase change material, thereby achieving a stable heat absorption or heat release effect.

1 is an embodiment of the thermal phase change heat storage module 100 of the present invention. The thermal phase change heat storage module 100 is suitable for contacting one or more heat sources 200. In this embodiment, the multiple heat sources 200 are used as Illustrated by way of example, but not limited to the implementation of multiple heat sources 200. The heat sources 200 are, for example, batteries in a battery module. The thermal phase change heat storage module 100 is sandwiched between the heat sources 200 as an example. However, depending on actual needs, the thermal phase change heat storage module 100 can be used for temperature control of various heat sources 200, and is not limited to the implementation of the battery module.

The thermal phase change heat storage module 100 includes a heat conducting outer layer 1 and a heat storage structure 2 disposed in the heat conducting outer layer 1. The thermally conductive outer layer 1 includes a surrounding wall 11 suitable for contacting the heat sources 200. Both ends of the surrounding wall 11 are sealed, and the material includes metal materials such as copper and aluminum or polyethylene terephthalate (PET). , Polyimide (PI) and other materials. In the embodiment in which the thermally conductive outer layer 1 is made of materials such as copper, aluminum, etc., through the selection of such a highly thermally conductive material, the thermally conductive outer layer 1 can have good thermal conductivity characteristics. In the embodiment where the thermally conductive outer layer 1 is made of materials such as polyethylene terephthalate, polyimide, etc., it is convenient to shape and has the advantages of low cost. In this embodiment, the thermally conductive outer layer 1 has a flat hollow structure, and the preferred thickness of the surrounding wall 11 is not greater than 0.5 mm. Therefore, the thermally conductive outer layer 1 as a whole has an extremely thin structure, suitable for clamping Between the heat sources 200, the space occupied by the thermal phase change heat storage module 100 is not excessively increased. However, according to actual needs, the thermally conductive outer layer 1 can be implemented as a hollow structure of any shape, and the thickness of the surrounding wall 11 can be adjusted as needed, which is not limited to a specific embodiment. In addition, in one embodiment, the surface of the thermally conductive outer layer 1 can also be provided with an adhesive layer and a release layer not shown in the figure, so as to fix the thermal phase change heat storage module 100 on the heat sources 200 .

The heat storage structure 2 includes a fibrous base material 21 arranged in the thermally conductive outer layer 1 and a thermal phase change material 22 that can be attached to the fibrous base material 21. The material of the fibrous substrate 21 includes one of non-woven fabric, polyester fiber (Terylene), glass fiber, metal fiber, carbon fiber, and preferably has a thickness of 0.01 mm to 0.05 mm, so that the thermal phase change storage The thermal module 100 is suitable for implementing a thin structure. Since the thermal phase change material 22 may change between different states such as solid state and colloidal state, and produce fluidity when in the colloidal state, the arrangement of the fibrous base material 21 allows the thermal phase change material 2 to adhere On the fibrous substrate 21, even if the thermal phase change material 22 turns into a colloidal state after the phase change, its position in the thermally conductive outer layer 1 will not be greatly changed due to fluidity. Therefore, the thermally conductive outer layer 1 changes differently. After the orientation or angle, the thermal phase change material 22 can still be maintained at a predetermined position in the thermally conductive outer layer 1 according to its characteristics of being attached to the fibrous base material 21, so that various parts of the thermally conductive outer layer 1 After contacting the heat sources 200, the thermal energy can be smoothly transferred to the thermal phase change material 22, and the thermal phase change material 22 at a specific location will not flow to other locations in the thermally conductive outer layer 1. 1 There is a lack of the thermal phase change material 22 in a local area, so the thermal phase change heat storage module 100 can achieve a stable heat absorption or heat release effect. The material of the thermal phase change material 22 in this embodiment includes paraffin wax and carbon nanomaterials with radiant thermal conductivity. Paraffin wax is a material with high latent heat storage density during the phase change process, and is thermochemically stable with small temperature changes. Good performance, suitable for use as a heat storage material, and the addition of carbon nanomaterials can improve the overall thermal conductivity of the thermal phase change material 22, so that the thermal phase change material 22 can be effectively maintained at a specific temperature during the phase change process Absorb heat or release heat, and to a certain extent can be used as a heat reservoir for absorbing or releasing heat energy. In addition, the preferred thickness of the thermal phase change material 22 in this embodiment is not less than 0.3 mm, so that the thermal phase change material 22 has enough volume to serve as a heat reservoir. Accordingly, after the thermal phase change heat storage module 100 contacts the higher temperature heat sources 200, the thermal phase change material 22 can absorb the thermal energy of the heat sources 200 to generate a phase change reaction, and the thermal phase change material During the phase change reaction process, the temperature is maintained at a specific temperature without increasing, so that the problem of excessively high temperature or local overheating of the heat sources 200 can be suppressed. When the heat sources 200 are the cells of the battery module, the configuration of the thermal phase change heat storage module 100 helps to maintain the cells to operate at a specific temperature, so as to improve their performance and avoid excessively high cell temperature Explosion caused by time. Of course, the related applications of the thermal phase change heat storage module 100 are not limited to the battery module. The above description is only an example of this embodiment, and should not be used to limit the scope of this embodiment.

Based on the above, the thermal phase change heat storage module 100 of the present invention can be used as a heat reservoir for absorbing or releasing heat energy to a certain extent through the arrangement of the thermal phase change material 22, so the thermal phase change heat storage module 100 After contacting the heat source 200 with a higher temperature, it can absorb the heat energy of the heat source 200 to produce a phase change reaction, and during the phase change reaction process, it will be maintained at a certain temperature without increasing, so the problem of the heat source 200 being too high or local overheating can be suppressed , To ensure the stability of the heat source 200. In addition, since the thermal phase change material 22 may have fluidity under different conditions, the arrangement of the fibrous base material 21 can ensure that the thermal phase change material 22 changes to different orientations or angles on the thermally conductive outer layer 1 Afterwards, it is still located at a predetermined position in the thermally conductive outer layer 1, so that all parts of the thermally conductive outer layer 1 contact the heat source 200 to smoothly conduct heat to the thermal phase change material 22, thereby achieving a stable heat absorption or heat release effect . Therefore, the thermal phase change heat storage module 100 of the present invention can indeed achieve the objective of the present invention.

However, the above are only examples of the present invention. When the scope of implementation of the present invention cannot be limited by this, all simple equivalent changes and modifications made in accordance with the scope of the patent application of the present invention and the content of the patent specification still belong to This invention patent covers the scope.

100: Thermal phase change heat storage module 200: heat source 1: Thermally conductive outer layer 11: Wall 12: Partition wall 13: separate space 2: Heat storage structure 21: Fibre substrate 22: Thermal phase change material

Other features and effects of the present invention will be clearly presented in the embodiments with reference to the drawings, in which: FIG. 1 is a schematic side sectional view illustrating an embodiment of the thermal phase change heat storage module of the present invention.

100: Thermal phase change heat storage module

200: heat source

1: Thermally conductive outer layer

11: Wall

2: Heat storage structure

21: Fibre substrate

22: Thermal phase change material

Claims (7)

A thermal phase change heat storage module includes: a thermally conductive outer layer suitable for contacting at least one heat source; and a heat storage structure arranged in the thermally conductive outer layer and including a fiber substrate and a thermal phase change material. The fiber The substrate has a layered structure and is arranged in the thermally conductive outer layer, and allows the thermal phase change material to adhere to it. The thermal phase change material can maintain a specific temperature during the phase change process to absorb heat. The thermal phase change heat storage module according to claim 1, wherein the material of the fiber substrate includes one of non-woven fabric, polyester fiber, glass fiber, metal fiber, and carbon fiber. The thermal phase change heat storage module according to claim 1, wherein the thickness of the fiber base material is between 0.01 mm and 0.5 mm. The thermal phase change heat storage module according to claim 1, wherein the material of the thermally conductive outer layer includes one of copper, aluminum, polyethylene terephthalate, and polyimide. The thermal phase change heat storage module according to claim 1, wherein the thermally conductive outer layer includes a surrounding wall suitable for contacting the heat source, and the thickness of the surrounding wall is not greater than 0.5 mm. According to the thermal phase change heat storage module of claim 1, the material of the thermal phase change material includes paraffin wax and carbon nanomaterials with radiant thermal conductivity. The thermal phase change heat storage module according to claim 1, wherein the thickness of the thermal phase change material is not less than 0.3 mm.

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