TWI700530B - Method for protecting camera hole - Google Patents

Abstract

This invention provides to a method for protecting a camera hole. A sealing layer is applied on a periphery of each camera hole unit on a color filter substrate. An ultraviolet film is coated on the sealing layer, and the ultraviolet film is located above the camera hole of the camera hole unit. A thin film transistor substrate is correspondingly covered on the color filter substrate. A drilling area which is corresponding to the camera hole is drilled in a drilling area of the thin film transistor substrate. After drilling, the scraps of the thin film transistor substrate dropped on the color filter substrate are cleaned. Finally, the ultraviolet film is removed. The problem that the camera hole is stained and scratched is effectively solved, and then the subsequent anti-reflection film can be attached to the camera.

Description

How to protect the lens hole

The present invention relates to a method for protecting a lens hole, and refers to a technical field of protecting the lens hole from dirt and scratches by coating and removing UV glue film.

According to the rapid development trend of technology, notebook computers have met human needs for "mobile" information. In addition, notebook computers have gradually increased their portability design, performance, and the added value of peripherals and software. Compared with desktop PCs, the gap in the price-to-feature ratio has gradually narrowed. In addition, notebook computers with additional wireless transmission functions, CD-RW and PC-Camera and other hardware products and software value-added applications have gradually upgraded the notebook computer from the role of traditional information products to an integrated application platform for information home appliances. , The attractiveness to consumers has gradually increased.

Continuing, after the penetration rate of notebook computers has gradually increased, the use of video communication methods is also quite popular, and the use of NB Camera is mostly based on video requirements. Among them, in the NB Camera AR Film bonding process, the part of the TFT glass substrate corresponding to the lens hole position needs to be drilled out, and then the AR Film is bonded. However, during the drilling process of the TFT glass substrate, the debris of the protective layer on the surface of the TFT glass substrate will fall to the surface of the CF substrate and the lens hole, and stick to the inner surface of the lens hole. It is difficult to clean the lens hole. Dirty problem; in addition, the glass debris generated during the drilling of the TFT glass substrate falls onto the surface of the CF substrate and the lens hole, which will also cause the lens hole to be scratched during the cleaning process. Therefore, how to solve the problem of dirt and scratches of the lens hole in the manufacturing process is an urgent problem to be solved.

In view of this, the present invention addresses the above-mentioned shortcomings of the prior art and proposes a lens hole protection method to effectively overcome the above-mentioned problems.

The main purpose of the present invention is to provide a method for protecting the lens hole, which uses the dispensing method to coat the UV film and the curing process in the mass production of the lens hole unit to protect the lens hole, which can effectively avoid chipping during the drilling process. Swarf falls in the lens hole and causes the problem of dirt and difficulty in cleaning, and even worse, the problem of defective rate of scratches. After drilling, the UV film can be removed after a simple cleaning operation, which is convenient for the next process The process can actually achieve the protective effect of the lens hole.

To achieve the above objectives, the present invention provides a method for protecting a lens hole, which uses a lens module of an electronic device. The method for protecting the lens hole includes the following steps: providing a color filter substrate with a plurality of lens holes Unit; Coat a sealing layer on the periphery of each lens hole unit; Dot coat a UV adhesive film on the sealing layer, and is located above the lens hole of the lens hole unit; Cover a thin film transistor substrate corresponding to the color filter On the chip substrate; drill holes in one of the drilling areas of the thin film transistor substrate, the drilling area corresponding to the lens hole; cleaning the thin film transistor substrate after drilling the debris on the color filter substrate; and Remove the UV film, and finally attach an anti-reflection film on the top of the lens hole to complete the lens hole protection without dirt and scratches.

Among them, a protective layer is deposited on the thin film transistor substrate, which is located between the thin film transistor substrate and the color filter substrate, and the protective layer is Poly Aluminium Chloride (PAC).

Among them, after the step of coating the ultraviolet adhesive film, a step of dropping a liquid crystal onto the color filter substrate is further included.

Wherein, after the step of covering the color filter substrate with the thin film transistor substrate, an ultraviolet curing step is further included.

Wherein, after the step of removing the ultraviolet glue film, it further includes a step of attaching an anti-reflection film above the lens hole.

Among them, the color filter substrate further includes a plurality of supporting elements, which are located on a light-shielding layer of the color filter substrate, and these supporting elements serve as a support between the thin film transistor substrate and the color filter substrate , It can avoid scratching the light shielding layer by the dropped substrate block when drilling the thin film transistor substrate.

Wherein, the drilling area of the thin film transistor substrate is drilled with a drill bit to form an opening.

Among them, the ultraviolet film is an ultraviolet curing film or an ultraviolet hydrolyzing film.

The above description can only be used to illustrate the problem to be solved by the present invention, the technical means to solve the problem, and the effects produced by it, etc. The specific details of the present invention will be described in detail in the following embodiments and related drawings.

The present invention is eager to improve and innovate, and after years of painstaking research, a lens hole protection method has been developed, which can break through the bottlenecks such as dirt and scratches caused by the existing lens hole in the process of laminating anti-reflection film. . Hereinafter, multiple embodiments of the present invention will be disclosed in the form of drawings. For clear description, many practical details will be described in the following description. However, it should be understood that these practical details should not be used to limit the present invention. That is to say, in the embodiments of the present invention, some conventionally used structures and elements will be shown in a simple schematic manner in the drawings. It.

Please refer to Figure 1, which is a flowchart of the steps of the present invention. The method for protecting the lens hole is to use a lens module of an electronic device. Please also refer to FIGS. 2A to 2D, which are a flow chart of the manufacturing steps of the present invention. The method for protecting the lens hole includes the following steps: in step S10, a color filter substrate 10 is provided with a plurality of lens hole units 102 thereon, as shown in FIG. 2A. The color filter substrate 10 is a key component for the color liquid crystal display (LCD) to change from gray to color. The backlight module inside the LCD provides the light source, and the driver IC and liquid crystal control are used to form a gray scale display. The photoresist color layer of the color filter forms a color display screen. The basic structure of the color filter (Color Filter) is composed of a glass substrate (Glass Substrate), a black matrix (Black Matrix), a color layer (Color Layer), a protective layer (Over Coat) and an ITO conductive film. The composition structure of the optical sheet substrate 10 has been the existing general technology, so it will not be repeated here. There are more than ten manufacturing methods for color filter substrates. The more commonly used technologies include pigment dispersion, dyeing, printing, and electrical writing. The pigment dispersion method has high reliability, high resolution, and high temperature resistance. The characteristics are widely adopted by the industry. Of course, it can be changed appropriately according to actual design requirements, so the present invention is not limited to this.

Following step S12, a sealant 12 is coated on the periphery of each lens hole unit 102; then, in step S14, a UV adhesive film 14 is dot-coated on the sealing layer 12, as shown in Figure 2B, The adhesive film 14 is an ultraviolet curing adhesive film or an ultraviolet hydrolyzable adhesive film, and the ultraviolet adhesive film 14 is located above the lens hole of the lens hole unit 102 (detailed later). Ultraviolet hydrolyzable adhesive film (also known as UV hydrolyzed adhesive) is a light-hardening resin that can dissolve in water. It is a material with high water absorption. It has excellent flexibility, yellowing resistance, fast curing speed, good adhesion to glass, and continuous glue. , No residual glue, maintain the smoothness of the original glass, bring great protection to the glass before and after processing, and no corrosion to the glass substrate, so the present invention takes the application of ultraviolet hydrolyzable film as an example here as the lens hole manufacturing process The temporary protection during the process, of course, is not limited to the material of the ultraviolet film 14 used here.

In step S16, the liquid crystal 16 is dropped on the color filter substrate 10, which is an ODE (one-drop filling process) process, as shown in FIG. 2C. In step S18, a thin film transistor substrate 18 is correspondingly covered on the color filter substrate 10, as shown in FIG. 2D. In terms of the TFT-LCD panel manufacturing process, a layer of liquid crystal 16 is sandwiched between the thin film transistor substrate 18 and the color filter substrate 10, and the periphery of each lens hole unit 102 is coated with a sealing layer 12, which seals the liquid crystal 16 Within. When the current passes through the transistor, the electric field changes, causing the liquid crystal molecules to deflect, thereby changing the polarization of the light, and then using the polarizer to determine the light and dark state of the pixels; in addition, the color filter substrate 10 forms each pixel containing red and blue. The three colors of red, blue, and green form the image on the panel. In other words, the thin film transistor substrate 18 can present color images by relying on the color filter substrate 10. The backlight is controlled by the liquid crystal 16 and the driver IC to form a gray-scale light source, and the color filter substrate 10 is coated with red , Green and blue color photoresist, the light source passes through the color filter to form red, green and blue light, and finally mixed to form a color image in the human eye.

Following step S20, UV curing is performed. The UV adhesive film 14 is mainly applied to the lens hole as a temporary fixation and protection to prevent damage caused by the intermediate process. Therefore, the UV adhesive film 14 is irradiated with ultraviolet light after being glued and can be used in a few seconds. The glue is cured within, generally the curing time is quite short, generally according to the difference of UV energy, such as 365nm, 500-1000 mJ/cm2, the irradiation time is 10 seconds to 60 seconds, it can be cured, and the operation is convenient. Here, the UV The curing system is cured together with the sealing layer 12.

Next, in order to further explain how the present invention achieves the protection effect, please refer to FIGS. 3A to 3F at the same time, which is a flowchart of another production step of the present invention, taking the protection process of manufacturing a lens hole unit as an example. As shown in Figure 3A, the color filter substrate 10 further includes a plurality of supporting elements 20, which are located on a light-shielding layer 104 of the color filter substrate 10. These supporting elements 20 serve as the thin film transistor substrate 18 and The supporting function between the color filter substrates 10. A protective layer 22 is further deposited on the thin film transistor substrate 18, which is located between the thin film transistor substrate 18 and the color filter substrate 10. The protective layer 22 is polyaluminium chloride ((Poly Aluminium Chloride, PAC). The adhesive film 14 is formed above the lens hole 106 of the lens hole unit 102, and the area of the ultraviolet adhesive film 14 is larger than the lens hole 106, so it can completely cover the lens hole 106. As step S22, drill on one of the thin film transistor substrates 18 The hole area 182 is drilled with a drill bit 24 to form an opening. The drilled area 182 corresponds to the top of the lens hole 106, as shown in Fig. 3B. As shown in Fig. 3C, the film extracted after drilling The blocks of the transistor substrate 18 can be directly removed. Among them, the protective layer 22 deposited on the thin film transistor substrate 18 will also be partially removed. At this time, many thin film transistor substrates 18 will be produced after drilling. The debris dropped from the protective layer 22 and the color filter substrate 10 are dropped and distributed on the surfaces of the supporting elements 20 and the ultraviolet film 14.

Following step S24, cleaning the debris dropped on the color filter substrate 10 after drilling the thin film transistor substrate 18, as shown in Figure 3D, can be washed with water or ultrasonic waves to dissolve the ultraviolet film 14 In the water or let the ultraviolet film 14 play a role of dissolving the glue and detach from the lens hole 106, if the warm hydrolyzed glue is used, the whole process can achieve environmental protection effect, and the process efficiency can be improved. Finally, in step S26, the ultraviolet adhesive film 14 is removed. If the ultraviolet adhesive film 14 is used to release the glue and detach from the lens hole 106, as shown in FIG. 3E, the ultraviolet adhesive film 14 can be removed from The lens hole 106 is glued and removed, so that the lens hole protection effect without dirt and scratches can be completed. Then you can proceed to the next process. As shown in Figure 3F, an anti-reflection film 28 is attached to the top of the lens hole 106. The anti-reflection coating (Anti Reflection Coating) 28, also known as AR coating, uses the incident light and reflected light to interact with each other. The effect of dry radiation and offset to reduce the reflection of light and increase the transmittance of glass or transparent substrate.

Wherein, in step S22, after the drilling area 182 of the thin film transistor substrate 18 is drilled by a drill bit 24, the area of the thin film transistor substrate 18 may be directly dropped. Falling on the color filter substrate 10, therefore, as shown in Figure 4, the design of the present invention is provided with these supporting elements 20 on the color filter substrate 10 as the thin film transistor substrate 18 and the color filter substrate 10 The supporting effect between the TFT substrate 18 is also used as a protective effect. Specifically, the area of the thin film transistor substrate 18 will directly fall onto the supporting elements 20. The supporting elements 20 have the effect of reducing the impact force, thereby preventing The section slices of the thin film transistor substrate 18 scratch the light shielding layer 104 on the color filter substrate 10, which affects the appearance of the product and the process yield.

In summary, in the mass production of lens hole units, the present invention utilizes the dispensing method to coat the UV film and the curing process to protect the lens hole, which can effectively prevent debris from falling into the lens hole during the drilling process. This causes the problem of dirt and difficulty to clean, and even worse, the problem of defective rate of scratches. After drilling, the UV film can be removed after a simple cleaning operation, which is convenient for the next process and can actually reach the lens hole. The protective effect of this can actually increase the convenience of the manufacturing process and effectively reduce the cost.

Only the above are merely preferred embodiments of the present invention, and are not used to limit the scope of the present invention. Therefore, all equivalent changes or modifications made in accordance with the characteristics and spirit of the application scope of the present invention shall be included in the patent application scope of the present invention.

10: Color filter substrate 102: lens hole unit 104: shading layer 106: lens hole 12: Sealing layer 14: UV film 16: LCD 18: Thin film transistor substrate 182: Drilling area 20: Support element 22: protective layer 24: Drill 26: Sticky stick 28: Anti-reflective film

Figure 1 is a flowchart of the steps of the present invention. Figures 2A to 2D are flow charts of the production steps of the present invention. Figures 3A to 3F are flowcharts of another production step of the present invention. Figure 4 is a cross-sectional view of the protective structure of the present invention.

Claims (10)

A method for protecting a lens hole is applied to a lens module of an electronic device. The method for protecting the lens hole includes the following steps: Provide a color filter substrate with a plurality of lens hole units; Coating a sealing layer on the periphery of each lens hole unit; Spot-coating an ultraviolet adhesive film on the sealing layer and located above the lens hole of the lens hole unit; Correspondingly cover a thin film transistor substrate on the color filter substrate; Drill a hole in a drilling area of the thin film transistor substrate, and the drilling area corresponds to the top of the lens hole; Cleaning the thin film transistor substrate dropped on the color filter substrate after the drilling; and Remove the UV film. The lens hole protection method according to claim 1, wherein a protective layer is further deposited on the thin film transistor substrate, which is located between the thin film transistor substrate and the color filter substrate. The lens hole protection method according to claim 2, wherein the protection layer is polyaluminum chloride. The lens hole protection method according to claim 1, wherein after the step of coating the ultraviolet film, a step of dropping a liquid crystal onto the color filter substrate is further included. The method for protecting the lens hole according to claim 1, wherein after the step of covering the color filter substrate with the thin film transistor substrate, an ultraviolet curing step is further included. The method for protecting the lens hole according to claim 1, wherein after the step of removing the ultraviolet adhesive film, it further comprises a step of attaching an anti-reflection film above the lens hole. The lens hole protection method according to claim 1, wherein the color filter substrate further comprises a plurality of supporting elements. The method for protecting the lens aperture according to claim 7, wherein the supporting elements are located on a light-shielding layer of the color filter substrate. The lens hole protection method according to claim 1, wherein the drilling area of the thin film transistor substrate is drilled with a drill bit to form an opening. The method for protecting the lens aperture according to claim 1, wherein the ultraviolet film is an ultraviolet curing film or an ultraviolet hydrolyzing film.

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