TWI697967B - Thin die separation method and apparatus thereof - Google Patents

Abstract

A thin die separation apparatus comprises: a seat unit; a negative pressure unit coupled to the seat unit; and a scraper unit installed on top of the seat unit; wherein, the scraper unit is raised and lowered relative to the seat unit, and the scraper unit reciprocates from a side end of the seat unit toward a center of the seat unit. The thin die separation apparatus supports the ends of the thin die attached to the film, the film at the bottom end of the thin die is removed so that the thin wafer can maintain its integrity when the thin die and the film are separated from each other. A thin die separation method is also disclosed.

Description

Thin wafer separation method and device

A method and device for separating thin wafers, especially a method and device capable of separating thin wafers and membranes from each other.

Nowadays, various electronic products such as mobile phones, digital cameras, or chip cards are under the demand for thinness and diversification. Various manufacturers continue to develop multi-functional substrate circuits and large-capacity memory. However, the volume of the multi-functional base circuit or the large-capacity memory is developing towards the demand of lightness, thinness and shortness in accordance with the current trend.

This trend or demand causes the packaging technology of the base circuit to face great challenges. Therefore, the thinning of the chip has become the development trend of various manufacturers. Thinned wafers are also called thin wafers.

However, the existing chip processing method is to adhere a plurality of chips to a film body, and then move the chips to the next process. If it is desired to separate the chip and the membrane from each other, a thimble is pushed up from the bottom end of the membrane, and an upward pushing force is used to separate the wafer and the membrane from each other.

The above-mentioned processing method is applied to wafers with considerable thickness. If the ejector pin is ejected, the above-mentioned thin wafer cannot withstand the upward pushing force of the ejector pin, and the thin wafer will be damaged or broken. Therefore, various manufacturers Everyone thinks about how the thin chip will not be damaged or broken when the thin chip and the film body are separated from each other.

In view of the above-mentioned problems, the object of the present invention is to provide a thin wafer separation method and device, which raises both ends of the thin wafer attached to the film body, and then lifts the film body located at the bottom end of the thin wafer Removal, so that when the thin wafer and the film body are separated from each other, the thin wafer can maintain its integrity.

In order to achieve the above objective, the technical means of the present invention is to provide a thin wafer separation method, the steps of which include: At least one thin chip is attached to a film system, and the position of the film body relative to the two ends of the thin chip is supported by a rising squeegee unit; and The squeegee unit moves from both ends of the thin wafer toward the center of the thin wafer to scrape the film body from the bottom end of the thin wafer to separate the thin wafer and the film body from each other.

The present invention further provides a thin wafer separation device, which includes: A body unit A negative pressure unit, which is coupled to the base unit; and A scraper unit, which is arranged at the top of the base unit; Wherein, the scraper unit is raised and lowered relative to the base unit, and the scraper unit reciprocates from both sides of the base unit toward the center of the base unit.

In summary, the thin wafer separation method and device of the present invention uses a squeegee unit to lift both ends of the thin wafer attached to the film body, and then uses the squeegee unit to transfer the film body at the bottom end of the thin wafer Scrape, thereby separating the film and the thin wafer from each other, and maintain the integrity of the thin wafer.

The following is a specific embodiment to illustrate the implementation of the present invention. Those skilled in the art can easily understand the other advantages and effects of the present invention from the contents disclosed in this specification.

Please refer to FIGS. 1 to 3 together. The present invention is a thin wafer separation device, which includes a connecting rod 10, a connecting rod seat 11, a negative pressure unit 12, a negative pressure seat 13, and a lower seat 14. , A power unit 15, an upper base 16, a support base 17, a scraper unit 18, a linkage unit 19 and a cover 20. The connecting rod seat 11, the negative pressure seat 13, the lower seat 14, the upper seat 16 and the support seat 17 can be regarded as a single body unit.

Please refer to Fig. 4, one end of the connecting rod 10 is coupled to a drive unit 30. The drive unit 30 can be a cam assembly, a motor unit, a gear box assembly, a hydraulic cylinder assembly or A steam pressure cylinder assembly. The other end of the connecting rod 10 passes through the connecting rod seat 11.

The connecting rod seat 11 has a connecting rod hole 110 for the other end of the connecting rod 10 to pass through.

The negative pressure unit 12 is arranged at the top of the connecting rod base 10, and the negative pressure unit 12 is two negative pressure tubes 120, and the two negative pressure tubes 120 are coupled to a negative pressure device, and the negative pressure device is an exhaust motor.

The negative pressure seat 13 is arranged between the negative pressure units 12, and the negative pressure seat 13 is coupled to the other end of the connecting rod 10. Both ends of the negative pressure seat 13 are respectively provided with a groove 130 for receiving the negative pressure tube 120.

The lower base 14 is coupled to the top end of the negative pressure base 13, the bottom end of the lower base 14 has a receiving groove 140, the top end of the lower base 14 has a power groove 141, and the bottom end of the power groove 141 has a power hole 142. The power hole 142 makes the power groove 141 communicate with the receiving groove 140. The lower base 14 further has two lower holes 143, and each of the lower holes 143 is for one end of each negative pressure tube 120 to penetrate.

The power unit 15 is arranged in the receiving groove 140, and one end of the power unit 15 extends from the power hole 141 to the power groove 141. The power unit 15 is a motor.

The upper seat 16 is set at the top of the lower seat 14. The upper base 16 further has two upper holes 160, and each upper hole 160 is for one end of each negative pressure tube 120 to penetrate.

The supporting base 17 is disposed at the top end of the upper base 17, and the supporting base 17 has at least one guide hole 170.

The scraper unit 18 has two scrapers 180. The two scrapers 180 are respectively disposed at two ends of the support base 17. One end of each scraper 180 extends through the guide hole 170 to the power groove 141.

The linkage unit 19 is arranged in the power slot 141, and the linkage unit 19 is two racks 190 meshing with each other. Each rack 190 is coupled to its corresponding scraper 180. The two racks 190 are further coupled to the power unit 15 and extend to one end of the power groove 141.

The cover 20 covers one end of the connecting rod 10, the connecting rod seat 11, the negative pressure unit 12, the negative pressure seat 13, the lower seat 14, the power unit 15, the upper seat 16, the supporting seat 17, the scraper unit 18 and the linkage unit 19. The top end of the cover 20 has a seat hole 200, and the seat hole 200 is for the support seat 17 to extend into it. The top end of the cover 20 further has a plurality of communicating negative pressure grooves 201, and the negative pressure groove 201 is coupled to one end of the negative pressure tube 120.

As shown in FIG. 1, FIG. 2 and FIG. 5, if at least one thin chip 40 is attached to a film body 41, the film body 41 is disposed on the top end of the cover body 20. The negative pressure unit 12 provides a negative pressure, and the negative pressure is distributed in the negative pressure groove 201 to adsorb the film body 41. The aforementioned film body 41 to which the thin chip 40 is attached is located above the support base 17.

Please refer to Fig. 4, Fig. 5 and Fig. 6, when the driving unit 30 drives the connecting rod 10 to raise the squeegee unit 18, the two squeegees 180 support the film body 41 with the thin wafer 40 attached. . The power unit 15 drives the linkage unit 19 so that the scraper 180 is guided by the two ends of the support base 17 and guided by the guide hole 170, and moves toward the center of the support base 17, while the scraper 180 moves toward the center of the support base 17 , In order to scrape the film body 41 from the bottom end of the thin wafer 40, so that the thin wafer 41 and the film body 40 are separated from each other.

If the thin wafer 40 and the film body 41 have been separated from each other, the power unit 15 drives the scraper 180 back to the two ends of the support base 17. The drive unit 30 returns to the initial position so that the scraper 180 is lowered, so that the next operation of scraping the film 41 can be performed again.

The present invention is a method for separating thin wafers. The steps include:

Please refer to FIG. 1 and FIG. 5 together. At least one thin chip 40 is attached to a film body 41. The membrane 41 is placed on the top of the lid 20, and the negative pressure unit 12 provides a negative pressure gas to the top of the lid 20 to adsorb the membrane 41 on the top of the lid 20.

The film body 41 to which the thin chip 40 is attached is located above a support base 17, and the support base 17 is provided at the top of the cover 20.

As shown in Figs. 5 and 6, a squeegee unit 18 is raised to support both ends of the film body 41 to which the thin wafer 40 is attached. The squeegee unit 18 is supported by both ends of the support base 17 facing toward The center of the seat 17 moves to scrape the film body 41 from the bottom end of the thin wafer 40 to separate the thin wafer 40 and the film body 41 from each other.

Please refer to Figure 6 again. When the squeegee unit 18 moves from the ends of the support base 17 toward the center of the support base 17, the film body 41 at the bottom end of the thin wafer 40 starts to face from the end of the thin wafer 40 The center hangs down, that is, the film body 41 starts to separate from the end of the thin wafer 40 toward the center.

Please cooperate with Figures 7 and 2, when the scraper unit 18 is located in the center of the support base 17, one scraper 180 of the two scrapers 180 can maintain the original position, and the other scraper 180 can be lowered to a position, thereby making it thin The wafer 40 and the film body 41 are separated from each other.

If the thin wafer 40 and the film body 41 are separated from each other, the squeegee unit 18 is returned to the initial position from the center of the support base 17, and after returning to the initial position, the squeegee unit 18 is lowered.

In summary, in the present invention, the thin wafer 40 attached to the film body 41 is first set on the top of the support base 17, the squeegee unit 18 supports the thin wafer 40, and the rear squeegee unit 18 is supported by the thin wafer 40 The two ends move toward the center of the thin wafer 40 to scrape off the film body 41 located at the bottom end of the thin wafer 40. With the method and device of the present invention, when the thin wafer 40 and the film body 41 are separated from each other, the thin The chip 40 can maintain its integrity.

The specific embodiments described above are only used to illustrate the features and effects of the present invention, not to limit the scope of implementation of the present invention. Any use of the present invention does not deviate from the spirit and technical scope of the present invention. The equivalent changes and modifications of the disclosed content of the invention shall still be covered by the following patent application scope.

10: connecting rod

11: Connecting rod seat

110: connecting rod hole

12: Negative pressure unit

120: negative pressure tube

13: Negative pressure seat

130: Groove

14: Lower seat

140: container

141: Power Slot

142: power hole

143: lower hole

15: Power unit

16: go up

160: upper hole

17: Support seat

170: pilot hole

18: Scraper unit

180: scraper

19: Linkage unit

190: rack

20: Lid

200: seat hole

201: negative pressure tank

30: drive unit

40: thin wafer

41: membrane body

Figure 1 is a perspective view of a thin wafer separation device of the present invention. Figure 2 is a three-dimensional exploded schematic view of the thin wafer separation device of the present invention. Figure 3 is another three-dimensional exploded schematic view of the thin wafer separation device of the present invention. Figure 4 is a schematic diagram of the thin wafer separation device and a driving unit of the present invention. Fig. 5 is a schematic diagram of the action of a squeegee unit of the present invention supporting a film with a thin wafer. Figure 6 is a schematic diagram of the action of the squeegee unit of the present invention to scrape the film from the thin wafer. Figure 7 is a schematic diagram of another action of the squeegee unit of the present invention to scrape the film from the thin wafer.

10: connecting rod

11: Connecting rod seat

110: connecting rod hole

12: Negative pressure unit

120: negative pressure tube

13: Negative pressure seat

130: Groove

14: Lower seat

140: container

141: Power Slot

142: power hole

143: lower hole

15: Power unit

16: go up

160: upper hole

17: Support seat

170: pilot hole

18: Scraper unit

180: scraper

19: Linkage unit

190: rack

20: Lid

200: seat hole

201: negative pressure tank

Claims (13)

A method for separating thin wafers, the steps include: attaching at least one thin wafer to a membrane system, the membrane system to which the thin wafer is attached is located above a support seat, and the support seat is arranged on the top of a cover , A negative pressure unit provides a negative pressure gas to the top of the cover to adsorb the film to the top of the cover, and the position of the film relative to the two ends of the thin wafer is lifted by a scraper unit And the squeegee unit is moved from the two ends of the thin wafer toward the center of the thin wafer to scrape the film from the bottom end of the thin wafer, so that the thin wafer and the film are mutually Separation. The thin wafer separation method described in the first item of the patent application, wherein the squeegee unit is moved from the two ends of the support base toward the center of the support base to scrape the film from the bottom end of the thin wafer If the thin wafer and the film are separated from each other, the squeegee unit is returned to an initial position from the center of the support base, and after returning to the initial position, the squeegee unit is lowered. The thin wafer separation method described in claim 1, wherein the squeegee unit has two squeegees, and the squeegees move from both ends of the support base toward the center of the support base, and one of the squeegees maintains the original position , The other squeegee is lowered to a position, thereby separating the thin wafer and the film body from each other. A thin wafer separation device, comprising: a base unit with a support base; a negative pressure unit coupled to the base unit; A cover body covering the negative pressure unit, the top end of the cover body is for the support seat to accommodate, the film system attached with the thin wafer is located above the support seat, and the negative pressure unit provides a negative pressure Gas is given to the top of the cover to absorb the film on the top of the cover; and a scraper unit is arranged on the top of the base unit; wherein the scraper unit is lifted and lowered relative to the base unit , And the scraper unit reciprocates from both sides of the base unit toward the center of the base unit. For the thin wafer separation device described in item 4 of the scope of patent application, wherein the base unit has a lower base, an upper base and the support base, the lower base is arranged between the negative pressure unit, and the upper base is arranged on the The top of the lower seat, the support seat is arranged on the top of the upper seat, and the scraper unit is arranged on both ends of the support seat. For example, the thin wafer separation device described in item 5 of the scope of patent application has a connecting rod, one end of the connecting rod is coupled to a driving unit; the base unit further has a connecting rod seat, the connecting rod seat is Coupled to the negative pressure unit, the connecting rod seat has a connecting rod hole for the other end of the connecting rod to penetrate; the cover system covers the connecting rod seat, the lower seat, the upper seat, the support seat and the scraper unit. For the thin wafer separation device described in item 6 of the scope of patent application, the driving unit can be a cam assembly, a motor unit, a gear box assembly, a hydraulic cylinder assembly, or a gas cylinder assembly. The thin wafer separation device described in item 6 of the scope of patent application, wherein the base unit further has a negative pressure seat, the negative pressure seat is arranged between the negative pressure unit, and the negative pressure seat is connected to the connecting rod The other end is coupled; the lower seat is coupled to the top end of the negative pressure seat. The thin wafer separation device described in item 8 of the scope of patent application, wherein the negative pressure unit is two negative pressure tubes, and the two negative pressure tubes are coupled to a negative pressure device; both ends of the negative pressure seat are respectively provided with a concave Slot for the two negative pressure tubes to be accommodated; the lower seat has two lower holes, each of the lower holes is for one end of the negative pressure tube to penetrate; the upper seat has two upper holes, each of the upper holes for each One end of the negative pressure pipe penetrates; the top end of the cover has a plurality of communicating negative pressure grooves, and the negative pressure groove is coupled to one end of the negative pressure pipe. The thin wafer separation device described in item 5 of the scope of patent application, wherein the bottom end of the lower base has a receiving groove, the top end of the lower base has a power groove, the bottom end of the power groove has a power hole, and the power hole The power slot is connected to the receiving slot; the receiving slot has a power unit, one end of the power unit extends from the power hole to the power slot; the power slot has a linkage unit, and the linkage unit is respectively The scraper unit and the power unit are coupled to each other and extend to one end of the power groove. In the thin wafer separation device described in claim 9, wherein the power unit is a motor; the squeegee unit has two squeegees; the interlocking unit is two mutually meshing racks, and each rack is coupled to it The corresponding scraper is coupled to the power unit and extends to one end of the power groove. The thin wafer separation device described in item 5 of the scope of patent application, wherein the support base has at least one guide hole, and one end of the scraper unit extends from the guide hole to the lower base; the top of the cover has a hole, The seat hole is for the support seat to extend into, and the top end of the cover body further has a plurality of communicating negative pressure grooves, and the negative pressure grooves are coupled to the negative pressure unit. The thin wafer separation device described in claim 11, wherein the positions of the film body relative to the two ends of the thin wafer are supported by the rising squeegee unit, and the squeegees are supported by both ends of the support base Moving toward the center of the support base, one of the squeegee blades maintains the original position, and the other squeegee blade is lowered to a position, thereby separating the thin wafer and the film body from each other.

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