TWI697400B - 樹脂體接合品的製造方法及樹脂體接合品 - Google Patents
樹脂體接合品的製造方法及樹脂體接合品 Download PDFInfo
- Publication number
- TWI697400B TWI697400B TW108113842A TW108113842A TWI697400B TW I697400 B TWI697400 B TW I697400B TW 108113842 A TW108113842 A TW 108113842A TW 108113842 A TW108113842 A TW 108113842A TW I697400 B TWI697400 B TW I697400B
- Authority
- TW
- Taiwan
- Prior art keywords
- resin
- resin body
- lens
- laser beam
- thermosetting adhesive
- Prior art date
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/16—Laser beams
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Health & Medical Sciences (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018-103598 | 2018-05-30 | ||
JP2018103598A JP6988695B2 (ja) | 2018-05-30 | 2018-05-30 | 樹脂体接合品の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW202003207A TW202003207A (zh) | 2020-01-16 |
TWI697400B true TWI697400B (zh) | 2020-07-01 |
Family
ID=68696947
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW108113842A TWI697400B (zh) | 2018-05-30 | 2019-04-19 | 樹脂體接合品的製造方法及樹脂體接合品 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP6988695B2 (ja) |
TW (1) | TWI697400B (ja) |
WO (1) | WO2019230241A1 (ja) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200629258A (en) * | 2004-12-17 | 2006-08-16 | Matsushita Electric Ind Co Ltd | Optical unit and method for manufacturing same |
CN101441877A (zh) * | 2007-11-07 | 2009-05-27 | 日立视听媒体股份有限公司 | 光拾波器装置 |
CN101645284A (zh) * | 2008-08-08 | 2010-02-10 | 日立视听媒体股份有限公司 | 光拾取装置及光学部件的激光熔敷构造 |
TW201139026A (en) * | 2010-02-04 | 2011-11-16 | Nitto Denko Corp | Method for laser welding resin members and laser welded body of resin members |
CN104364620A (zh) * | 2012-06-15 | 2015-02-18 | 日立汽车系统株式会社 | 流量传感器及其制造方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030201059A1 (en) * | 2002-04-24 | 2003-10-30 | Holman Thomas J. | Selective manipulation of material for medical devices and methods and devices made therefrom |
JP4752364B2 (ja) * | 2005-07-13 | 2011-08-17 | 住友ベークライト株式会社 | プラスチックの接合方法、及びその方法を利用して製造されたバイオチップ又はマイクロ分析チップ |
JP4864913B2 (ja) * | 2008-02-25 | 2012-02-01 | アール・ビー・コントロールズ株式会社 | 防水ケースの水密構造 |
JP5653652B2 (ja) * | 2010-05-13 | 2015-01-14 | 浜松ホトニクス株式会社 | 熱硬化性樹脂接合方法及び熱硬化性樹脂接合装置 |
-
2018
- 2018-05-30 JP JP2018103598A patent/JP6988695B2/ja active Active
-
2019
- 2019-04-19 WO PCT/JP2019/016746 patent/WO2019230241A1/ja active Application Filing
- 2019-04-19 TW TW108113842A patent/TWI697400B/zh active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200629258A (en) * | 2004-12-17 | 2006-08-16 | Matsushita Electric Ind Co Ltd | Optical unit and method for manufacturing same |
CN101441877A (zh) * | 2007-11-07 | 2009-05-27 | 日立视听媒体股份有限公司 | 光拾波器装置 |
CN101645284A (zh) * | 2008-08-08 | 2010-02-10 | 日立视听媒体股份有限公司 | 光拾取装置及光学部件的激光熔敷构造 |
TW201139026A (en) * | 2010-02-04 | 2011-11-16 | Nitto Denko Corp | Method for laser welding resin members and laser welded body of resin members |
CN104364620A (zh) * | 2012-06-15 | 2015-02-18 | 日立汽车系统株式会社 | 流量传感器及其制造方法 |
Also Published As
Publication number | Publication date |
---|---|
TW202003207A (zh) | 2020-01-16 |
WO2019230241A1 (ja) | 2019-12-05 |
JP2019206140A (ja) | 2019-12-05 |
JP6988695B2 (ja) | 2022-01-05 |
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