TWI697131B - White light-emitting diode structure and manufacturing method thereof - Google Patents

Abstract

The present invention discloses a white light-emitting diode structure and a manufacturing method thereof. The white light-emitting diode structure comprises a base having a recessed portion and an opening, a light-emitting diode chip disposed at a bottom of the recessed portion, an encapsulant gel filled in the recessed portion for encapsulating the light-emitting diode chip, and a fluorescent glass covering the opening of the base. The encapsulant gel comprises a first fluorescent material and a silicone material, and the fluorescent glass is prepared by sintering a mixture having glass powders and a second fluorescent material at a low temperature. Accordingly, the white light-emitting diode structure of the present invention has a continuous and flat spectrum in the range of visible light.

Description

White light emitting diode structure and manufacturing method thereof

The invention relates to a white light emitting diode structure and a manufacturing method thereof, which have a continuous and flat spectrum in the visible light band.

Light-emitting diode (LED) is a light-emitting semiconductor electronic component that can convert electrical energy into light energy; current methods of making white light-emitting diodes include the use of blue-light-emitting diode grain excitation to include Encapsulation glue or fluorescent glass of yellow fluorescent material. After being excited by blue light, the yellow fluorescent material will emit yellow light. The yellow light is then mixed with unabsorbed blue light and complementary to form white light, for example, TW I396303(B) The invention patent is a method for manufacturing a substrate with phosphor powder and a white LED light source element. The method for manufacturing a substrate with phosphor powder includes uniformly mixing and firing the phosphor powder and flux to form a semi-melted glass body. Grind the glass body into phosphor powder and coat it on a substrate, and heat the phosphor powder to make it into a fluorescent film. After the fluorescent film is excited by the blue LED die, it will emit white light; but this method The color temperature of the generated white light is high, and because the red light spectrum is weak, the color rendering is poor, and the average color rendering index (CRI) is low.

In addition, another method for manufacturing white light-emitting diodes is to add multi-color phosphors to the encapsulant of the light-emitting diodes. For example, mix a certain proportion of blue phosphors and green phosphors in the transparent encapsulant Light pink or red phosphor, and excited by blue light-emitting diode grains to produce white light; for example, Chinese Patent No. CN109659420(A) Patent Publication is a white LED light source with high color rendering and wide spectrum, disclosed Mixing blue-green phosphors, green phosphors with different wave crests and red phosphors in silicone rubber to obtain an LED fluorescent glue; but this white light-emitting diode has insufficient luminous efficiency, and the encapsulation glue or It is the lack of fluorescent glue that is prone to aging.

Now, in view of the shortcomings of the existing white light-emitting diodes, the inventor is a tireless spirit, which is supplemented by his rich professional knowledge and many years of practical experience, and improved according to this research. this invention.

The invention relates to a white light emitting diode structure and a manufacturing method thereof. The white light emitted by the white light emitting diode structure has a continuous and flat spectrum in the visible light band.

The white light-emitting diode structure of the present invention includes a base, a first electrode and a second electrode, a light-emitting diode chip, an encapsulant and a fluorescent glass; the base includes a receiving groove and an opening ; The first electrode and the second electrode are disposed in the containing groove, the light-emitting diode chip is placed in the containing groove, and is electrically connected to the first electrode and the second electrode; the packaging gel is filled in the containing groove , And encapsulates the light-emitting diode chip, the encapsulant contains a first phosphor material and silicone material; and the fluorescent glass cover is set in the opening of the accommodating groove, and the fluorescent glass is a glass powder and a first The two phosphor materials are made through a low temperature sintering step.

The manufacturing method of the white light emitting diode structure of the present invention includes the following steps: Step 1, fix a light emitting diode chip to the bottom of a receiving groove of a base, and electrically connect the light emitting diode chip to the first electrode And the second electrode, wherein the base is provided with an opening; step two, a packaging gel is filled into the accommodating groove of the base, and the light-emitting diode chip is covered, wherein the packaging gel includes a silicone material and the first phosphor Materials; and step three, a fluorescent glass cover is placed on the opening of the base, wherein the fluorescent glass is made by a glass frit and a second phosphor material through a low temperature sintering step.

In one embodiment of the invention, the light-emitting diode chip is a blue light-emitting diode chip.

In an embodiment of the invention, the encapsulating colloid includes 10-30 wt% of the first phosphor material and the remaining percentage of silicone material.

In one embodiment of the present invention, the first phosphor material includes a green phosphor, a cyan phosphor, and a red phosphor.

In one embodiment of the present invention, the first phosphor material includes 10wt% green phosphor powder, 3wt% cyan phosphor powder and 0.8wt% red phosphor powder.

In one embodiment of the present invention, the peak wavelength of the green phosphor is 515 nm, the average particle size is 12 nm, the peak wavelength of the cyan phosphor of the cyan phosphor is 495 nm, and the average particle size is 20 nm, and The peak value of the red phosphor is 660 nm, and the average particle size is 14 nm.

In an embodiment of the invention, the second phosphor material is a yttrium aluminum garnet (YAG) phosphor material.

In one embodiment of the present invention, the light output flux of the white light emitting diode is 100 to 150 lumens, the relative color temperature is 4000 to 4500K, the color rendering index (CRI) R9 is greater than 70, and the average color rendering index (Ra ) Greater than 90.

In this way, the white light emitting diode structure and its manufacturing method of this case, by using encapsulating colloid and fluorescent glass at the same time, and using the optimal ratio of fluorescent material combination, to produce a continuous and flat spectrum in the visible light band White light emitting diode structure.

1: pedestal

11: accommodating slot

12: opening

2: the first electrode

3: second electrode

4: LED chip

41: Silver plastic

5: encapsulating colloid

51: Green phosphor

52: Cyan phosphor

53: Red phosphor

6: Fluorescent glass

7: conductive metal wire

The first picture: the cross-sectional view of the white light emitting diode structure in this case.

Figure 2: The flow chart of the white light emitting diode structure in this case.

Third figure: Visible light spectrum analysis diagram of light-emitting diodes containing encapsulating colloids of green phosphors in different proportions in this case.

Fourth figure: Visible light spectrum analysis diagram of the light-emitting diode of the encapsulating colloid containing 10wt% green phosphor and different proportion of cyan phosphor in this case.

Fifth figure: Visible light spectrum analysis diagram of the light-emitting diode of the encapsulating colloid containing 10wt% green phosphor powder, 3wt% cyan phosphor powder and different proportion of red phosphor powder in this case.

Sixth figure: Visible light spectrum analysis diagram of the light-emitting diode of the encapsulating colloid containing 10wt% green phosphor powder, 3wt% cyan phosphor powder and 0.8wt% phosphor powder in this case.

The purpose of the present invention and its structural and functional advantages will be explained based on the following figures and in conjunction with specific embodiments, so that the reviewers can have a more in-depth and specific understanding of the present invention.

The invention relates to a white light emitting diode structure and a method for manufacturing the same. The white light emitting diode structure has a continuous and flat spectrum in the visible light band.

Please refer to the first figure, the white light emitting diode structure of the present invention includes a base (1), a first electrode (2), a second electrode (3), a light emitting diode chip (4), a Encapsulation gel (5) and a fluorescent Glass (6). The base (1) includes an accommodating groove (11) and an opening (12). The first electrode (2) and the second electrode (3) are disposed at the bottom of the accommodating groove (11), and the light-emitting diode chip ( 4) It is also arranged at the bottom of the accommodating groove (11) and is electrically connected to the first electrode (2) and the second electrode (3); the encapsulant (5) is filled in the accommodating groove (11) and covered Housing the first electrode (2), the second electrode (3) and the light emitting diode chip (4), the encapsulating colloid (5) contains the first phosphor material and the silicon gel, and the first phosphor material contains the green phosphor Light powder (51), cyan phosphor (52) and red phosphor (53); the fluorescent glass (6) is covered and fixed to the opening (12) of the base (1), wherein the fluorescent glass (6) ) Is prepared by a glass frit and a second phosphor material through a low temperature sintering step.

In addition, the following specific examples can further prove the practical application of the present invention, but it is not intended to limit the scope of the present invention in any form.

1. Manufacture of white light emitting diode structure

(1) Manufacturing of fluorescent glass

The fluorescent glass used in this case is a mixture of glass powder and yttrium aluminum garnet (YAG) fluorescent powder in a weight ratio of 87:13. After being extruded by a machine, it is sintered at a temperature of 650°C to produce Into a fluorescent slab; further slicing, grinding and polishing the fluorescent slab, and finally using laser cutting technology to cut it into the required size. In this embodiment, the cut size is 5×5mm ² .

(Two), white light emitting diode structure manufacturing

Please refer to the first picture and the second picture together, first fix the first electrode (2) and the second electrode (3) on the bottom of the base (1), wherein the first electrode (2) and the second electrode ( 3) Opposite electrodes, for example, when the first electrode (2) is an anode, the second electrode (3) is a cathode (cathode); the light-emitting diode wafer (4) is fixed with silver glue (41) On the first electrode (2) or the second electrode (3), in this embodiment, the light-emitting diode wafer (4) is fixed on the second electrode (3) with silver glue (41); then, the light-emitting diode The diode wafer (4) is connected with a conductive metal wire (7), such as a conductive gold wire, and is correspondingly connected to the first electrode (2), so that the light-emitting diode wafer (4), the first One electrode (2) is electrically connected to the second electrode (3); then, an encapsulating colloid (5) is prepared. The encapsulating colloid (5) used in this case contains silicone and 10~30wt% of the first fluorescent light Powder material, evenly mix the first phosphor material and the silicone rubber to obtain the encapsulating colloid (5), and then fill the encapsulating colloid (5) into the accommodating groove (11) of the base (1), for example, by dispensing Inject into the accommodating tank (11), and then apply the encapsulating colloid (5) at 150 ℃ for 4 hours to dry the encapsulating colloid (5); finally, the glass powder and yttrium aluminum garnet (YAG) fluorescent powder The prepared fluorescent glass (6) covers and is fixed to the opening (12) of the base (1) to complete the white light emitting diode structure in this case.

The light-emitting diode chip (4) used in this embodiment is an indium gallium nitride (InGaN) blue light-emitting diode chip with a size of 45×45mm ² , the visible light emitted has a blue wavelength of 460nm, and the operating current is 350mA; in this case, the blue light emitted from the light-emitting diode chip (4) is used to excite the first phosphor material in the encapsulation gel (5) and the YAG phosphor in the fluorescent glass (6) to generate white light.

(3) First phosphor material

(1) Green phosphor

In this test, the luminescence spectrum of the white light-emitting diode structure prepared with the encapsulating colloid containing 10wt%, 15wt% or 20wt% green phosphor powder, the peak wavelength of the green phosphor powder used is 515nm, and the average particle size 12nm, which can be but not limited to aluminate phosphor material; please refer to the third figure, the white light emitting diode structure made of green phosphor (Green _P ) encapsulating colloid, the spectrum emitted There are two distinct peaks. The main peak of the first peak falls at 460nm, and the main peak of the second peak falls at about 550nm. In addition, with the addition of 10wt% green phosphor (Green _P ), the intensity of the first peak It is stronger, so the packaging gel with 10wt% green phosphor (Green _P ) added will be used later.

(2) Cyan phosphor

In this experiment, the encapsulating colloid containing 0.5wt%, 1.0wt% and 3wt% cyan phosphor and 10wt% green phosphor was used. The spectrum of the white light emitting diode structure prepared; the cyan used in this example The peak wavelength of the phosphor is 495nm, and the average particle size is 20nm, which can be but not limited to Nitrogen oxides (NO _X ) materials; see the fourth figure, 0.5wt% cyan phosphor (Cyan _P ) group And 1.0wt% cyan phosphor (Cyan _P ) group, the emitted spectrum has two peaks, the main peak of the first peak falls at 460nm, the second peak is about 550nm; add 3wt% cyan phosphor (Cyan Group _P ), whose main peak range is between 500~600nm and has a relatively flat spectrum, so choose packages containing 10wt% green phosphor (Green _P ) and 3wt% cyan phosphor (Cyan _P ) Colloid, continue with the following test.

(3) Red phosphor

In this test, the encapsulation colloids containing 0.5wt%, 0.8wt% and 1wt% of red phosphor, 10wt% green phosphor and 3wt% cyan phosphor were used to prepare the spectrum of white light emitting diode structure; The red phosphor used in the examples has a peak wavelength of 660 nm and an average particle size of 14 nm, which can be, but is not limited to, a nitride (Nitride) material; please refer to the fifth and sixth figures, although adding 0.5 wt%, For the three groups of 0.8wt% and 1wt% red phosphor (Red _P ), the peak range of their light emission tends to expand, but with the addition of 0.8wt% red phosphor (Red _P ) group, which is in the visible light range, The luminous intensity is relatively consistent, and has a continuous and flat luminous spectrum, and the visible light has a wide color gamut, which is a better addition ratio.

The white light emitting diode structure prepared in this embodiment has a size of 5×5mm ² , a light output flux of 104.3 lumens (lm), and a color temperature of 4200K, which belongs to warm white light; in addition, the white light emitting diode prepared in this embodiment Polar body structure, R9 of color rendering index (CRI) is 73, and average color rendering index (Ra) is 90.9.

It can be seen from the above implementation description that the present invention has the following advantages:

1. The white light emitting diode structure of the present invention has both encapsulating colloid and fluorescent glass containing fluorescent powder, and the encapsulating colloid and fluorescent glass contain different kinds of fluorescent powder, so the white light emitted is colored Good ability, and has a wide color gamut range.

2. In the white light emitting diode structure of the present invention, green phosphor powder, cyan phosphor powder and red phosphor powder are added to the encapsulating colloid at the same time, and the spectrum of the blue light emitting diode chip is continuous and flat in the visible light band. Spectrum.

3. The fluorescent glass used in the white light-emitting diode structure of the present invention is made by mixing glass powder and fluorescent powder and sintering at low temperature, which can effectively avoid the lack of precipitation of fluorescent powder and achieve better space light Uniformity of color distribution.

In summary, the white light emitting diode structure of the present invention and its manufacturing method can indeed achieve the expected use effect by the embodiments disclosed above, and the present invention has not been disclosed before the application. Comply with the provisions and requirements of the Patent Law. I filed an application for an invention patent in accordance with the law, pleaded for the review, and granted the patent.

However, the above disclosure is only a preferred embodiment of the present invention, and is not intended to limit the scope of protection of the present invention; those who are familiar with this skill, according to the characteristic scope of the present invention, make other equivalent changes Or modification should be regarded as not departing from the design scope of the present invention.

1: pedestal

11: accommodating slot

12: opening

2: the first electrode

3: second electrode

4: LED chip

41: Silver plastic

5: encapsulating colloid

51: Green phosphor

52: Cyan phosphor

53: Red phosphor

6: Fluorescent glass

7: conductive metal wire

Claims (9)

A white light emitting diode structure includes: a base with a receiving groove and an opening; a first electrode and a second electrode are arranged in the receiving groove; a light emitting diode chip is a Disposed in the accommodating groove and electrically connecting the first electrode and the second electrode; an encapsulant is filled in the accommodating groove and covers the blue light-emitting diode chip, wherein the encapsulant includes a 10 ~30wt% of the first phosphor material and one percent of the remaining silicone material; and a fluorescent glass covering the opening of the base, wherein the fluorescent glass is a glass powder and a second fluorescent The powder material is prepared through a sintering step. According to the white light emitting diode structure described in item 1 of the patent application scope, the first phosphor material includes a green phosphor, a cyan phosphor, and a red phosphor. The white light emitting diode structure as described in item 2 of the patent application scope, wherein the first phosphor material includes 10wt% green phosphor powder, 3wt% cyan phosphor powder and 0.8wt% red phosphor powder. The white light emitting diode structure as described in item 2 of the patent application scope, wherein the peak wavelength of the green phosphor is 515 nm, the average particle size is 12 nm, and the peak wavelength of the cyan phosphor of the cyan phosphor is 495nm, the average particle size is 20nm, and the peak of the red phosphor is a wavelength of 660nm, and the average particle size is 14nm. The white light emitting diode structure as described in item 1 of the patent application scope, wherein the second phosphor material of the fluorescent glass is a yttrium aluminum garnet (YAG) phosphor material. The white light emitting diode structure as described in item 1 of the patent scope has a light output flux of 100 to 150 lumens, a relative color temperature of 4000 to 4500K, a color rendering index (CRI) R9 greater than 70, and an average color rendering The index (Ra) is greater than 90. A method for manufacturing a white light-emitting diode structure includes: Step 1: fix a light-emitting diode chip to the bottom of a receiving groove of a base, and electrically connect the light-emitting diode chip to a first An electrode and a second electrode, wherein the base is provided with an opening; step 2: filling an encapsulant into the accommodating groove of the base and covering the light-emitting diode chip, wherein the encapsulant system Containing a 10~30wt% of the first phosphor material and a remaining percentage of silicone material; and Step 3: a fluorescent glass cover is placed on the opening of the base, wherein the fluorescent glass is a glass powder It is prepared with a second phosphor material through a sintering step. The method for manufacturing a white light emitting diode structure as described in item 7 of the patent application range, wherein the first phosphor material of the encapsulating colloid includes a green phosphor, a cyan phosphor and a red phosphor Powder, and the second phosphor material of the fluorescent glass is a yttrium aluminum garnet (YAG) phosphor material. The method for manufacturing a white light emitting diode structure as described in item 8 of the patent application scope, the first phosphor material includes 10wt% green phosphor powder, 3wt% cyan phosphor powder and 0.8wt% red phosphor powder And the peak wavelength of the green phosphor is 515nm, the average particle size is 12nm, the peak wavelength of the cyan phosphor of the cyan phosphor is 495nm, the average particle size is 20nm, and the The peak value is 660nm and the average particle size is 14nm.

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