TWI696590B - Manufacturing method of glass substrate for display - Google Patents
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- TWI696590B TWI696590B TW105120828A TW105120828A TWI696590B TW I696590 B TWI696590 B TW I696590B TW 105120828 A TW105120828 A TW 105120828A TW 105120828 A TW105120828 A TW 105120828A TW I696590 B TWI696590 B TW I696590B
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B17/00—Forming molten glass by flowing-out, pushing-out, extruding or drawing downwardly or laterally from forming slits or by overflowing over lips
- C03B17/06—Forming glass sheets
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B17/00—Forming molten glass by flowing-out, pushing-out, extruding or drawing downwardly or laterally from forming slits or by overflowing over lips
- C03B17/06—Forming glass sheets
- C03B17/067—Forming glass sheets combined with thermal conditioning of the sheets
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B17/00—Forming molten glass by flowing-out, pushing-out, extruding or drawing downwardly or laterally from forming slits or by overflowing over lips
- C03B17/06—Forming glass sheets
- C03B17/064—Forming glass sheets by the overflow downdraw fusion process; Isopipes therefor
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B25/00—Annealing glass products
- C03B25/04—Annealing glass products in a continuous way
- C03B25/10—Annealing glass products in a continuous way with vertical displacement of the glass products
- C03B25/12—Annealing glass products in a continuous way with vertical displacement of the glass products of glass sheets
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
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- Optics & Photonics (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
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Abstract
本發明提供一種與先前相比可減小玻璃基板之熱收縮率之顯示器用玻璃基板之製造方法。 The present invention provides a method for manufacturing a glass substrate for a display that can reduce the thermal shrinkage of the glass substrate compared to the prior art.
於製造顯示器用玻璃基板時,進行冷卻直至藉由成形步驟而成形之平板玻璃之寬度方向的中心部之溫度達到300℃為止。此時,中央區域之冷卻速度即上述中心部之溫度未達450℃且為300℃以上之溫度區域中的平均冷卻速度,小於上述冷卻步驟中的上述溫度區域以外之溫度區域中之上述中央區域之平均冷卻速度,上述中央區域係位於較平板玻璃之寬度方向之兩端部更靠上述平板玻璃之寬度方向內側且包含上述中心部之區域。 When manufacturing the glass substrate for a display, it cools until the temperature of the center part of the width direction of the flat glass formed by the forming process reaches 300 degreeC. At this time, the cooling rate of the central region, that is, the average cooling rate in the temperature region where the temperature of the central portion does not reach 450°C and above 300°C, is lower than the central region in the temperature region other than the temperature region in the cooling step For the average cooling rate, the central region is a region located on the inner side in the width direction of the sheet glass than both ends in the width direction of the sheet glass and including the central part.
Description
本發明係關於一種顯示器用玻璃基板之製造方法。 The invention relates to a method for manufacturing a glass substrate for display.
於製造顯示器之步驟中,顯示器用玻璃基板會因熱處理而進行熱收縮。此時,若玻璃基板之熱收縮率大,則容易產生形成於玻璃基板表面之元件之配置偏移之間距偏移。因此,根據減少間距偏移之觀點,對於顯示器用玻璃基板,要求熱處理時之熱收縮率小。 In the process of manufacturing the display, the glass substrate for display undergoes heat shrinkage due to heat treatment. At this time, if the thermal shrinkage rate of the glass substrate is large, it is easy to cause a shift in the arrangement offset of the elements formed on the surface of the glass substrate. Therefore, from the viewpoint of reducing the pitch deviation, the glass substrate for display is required to have a small heat shrinkage rate during heat treatment.
作為減小玻璃基板之熱收縮率之方法,可列舉(1)藉由對玻璃組成進行調整而使玻璃之應變點升高;(2)降低成形步驟後之平板玻璃之冷卻速度等。例如,作為減小玻璃基板之熱收縮率之技術,已知有以使應變點達到680℃以上之方式而對玻璃組成進行改良之技術(專利文獻1)。 As a method of reducing the thermal shrinkage rate of the glass substrate, (1) the strain point of the glass is increased by adjusting the glass composition; (2) the cooling rate of the flat glass after the forming step is reduced. For example, as a technique for reducing the thermal shrinkage rate of a glass substrate, there is known a technique for improving the glass composition so that the strain point reaches 680° C. or higher (Patent Document 1).
又,將冷卻步驟分為第1冷卻步驟、第2冷卻步驟及第3冷卻步驟,上述第1冷卻步驟對平板玻璃進行冷卻,直至成形後之平板玻璃之中央區域之溫度達到緩冷點為止,上述第2冷卻步驟對平板玻璃進行冷卻,直至中央區域之溫度自緩冷點達到應變點-50℃為止,上述第3冷卻步驟對平板玻璃進行冷卻,直至中央區域之溫度自應變點-50℃達到應變點-200℃為止。此時,已知有如下技術,該技術使第1冷卻步驟中之平均冷卻速度較第3冷卻步驟中之平均冷卻速度更快,且使第3冷卻步驟中之平均冷卻速度較第2冷卻步驟中之平均冷卻速度更快(專利文獻2)。 In addition, the cooling step is divided into a first cooling step, a second cooling step, and a third cooling step. The first cooling step cools the sheet glass until the temperature of the central area of the sheet glass after forming reaches the slow cooling point. The above second cooling step cools the sheet glass until the temperature in the central region reaches the strain point -50°C from the slow cooling point, and the above third cooling step cools the sheet glass until the temperature in the central region is from the strain point -50°C It reaches the strain point -200℃. At this time, a technique is known that makes the average cooling rate in the first cooling step faster than the average cooling rate in the third cooling step, and makes the average cooling rate in the third cooling step lower than the second cooling step The average cooling rate is faster (Patent Document 2).
[專利文獻1]日本專利特表2003-503301號公報 [Patent Document 1] Japanese Patent Special Publication No. 2003-503301
[專利文獻2]日本專利第5153965號公報 [Patent Document 2] Japanese Patent No. 5153965
然而,根據專利文獻1,若以使應變點升高之方式而對組成進行調整,則容易產生失透及難熔解之問題,因此,於使應變點升高之方面存在極限。又,存在如下問題:當利用溢流下拉法製作玻璃基板時,若於成形步驟後進行之冷卻步驟中減小平板玻璃之冷卻速度,則緩冷路徑延長,緩冷裝置之成本增大。 However, according to Patent Document 1, if the composition is adjusted to increase the strain point, problems of devitrification and refractory melting are likely to occur, so there is a limit in raising the strain point. In addition, there is a problem that when a glass substrate is produced by the overflow down-draw method, if the cooling rate of the flat glass is reduced in the cooling step performed after the forming step, the slow cooling path is extended, and the cost of the slow cooling device increases.
又,根據專利文獻2,存在如下問題:即便使第1冷卻步驟中之平均冷卻速度較第3冷卻步驟中之平均冷卻速度更快,且使第3冷卻步驟中之平均冷卻速度較第2冷卻步驟中之平均冷卻速度更快,於減小熱收縮率之方面存在極限而不充分。 Further, according to Patent Document 2, there is a problem that even if the average cooling rate in the first cooling step is faster than the average cooling rate in the third cooling step, and the average cooling rate in the third cooling step is lower than the second cooling The average cooling rate in the step is faster, and there is a limit to reducing the heat shrinkage rate.
行動電話等行動設備所搭載之顯示器愈發需要高精細化及低耗電化。因此,近年來,愈發需要進一步減小於顯示器之製造步驟中之熱處理時所產生的玻璃基板之熱收縮率。 The displays mounted on mobile devices such as mobile phones are increasingly demanding higher definition and lower power consumption. Therefore, in recent years, there is an increasing need to further reduce the heat shrinkage rate of the glass substrate generated during the heat treatment in the manufacturing process of the display.
因此,本發明之目的在於提供如下顯示器用玻璃基板之製造方法,其於成形後進行之冷卻步驟中,與先前相比可減小玻璃基板之熱收縮率。 Therefore, an object of the present invention is to provide a method for manufacturing a glass substrate for a display, which can reduce the thermal shrinkage rate of the glass substrate in the cooling step performed after forming compared with the prior art.
本發明之第1態樣為顯示器用玻璃基板之製造方法。該製造方法包括:成形步驟,其藉由下拉法而使熔融玻璃成形為平板玻璃;及冷卻步驟,其於使成形後之上述平板玻璃流動時,進行冷卻直 至與上述平板玻璃之流動方向正交的寬度方向之中心部之溫度達到300℃為止。 The first aspect of the present invention is a method for manufacturing a glass substrate for a display. The manufacturing method includes: a forming step which forms the molten glass into a flat glass by a down-draw method; and a cooling step which cools the flat glass after forming to flow Until the temperature in the center of the width direction orthogonal to the flow direction of the above-mentioned flat glass reaches 300°C.
於上述冷卻步驟中,中央區域之冷卻速度即上述中心部之溫度未達450℃且為300℃以上之溫度區域中的平均冷卻速度,小於上述冷卻步驟中的上述溫度區域以外之溫度區域中之上述中央區域之平均冷卻速度,上述中央區域係位於較上述平板玻璃之寬度方向之兩端部更靠上述平板玻璃之上述寬度方向之內側且包含上述中心部之區域。 In the above cooling step, the cooling rate in the central region, that is, the average cooling rate in the temperature region where the temperature of the central portion does not reach 450°C and above 300°C, is lower than that in the temperature region other than the above temperature region in the cooling step The average cooling rate of the central region, the central region is a region that is located inside the width direction of the sheet glass and includes the center portion at both ends in the width direction of the sheet glass.
較佳為上述冷卻步驟包含:第1冷卻步驟,其於成形為上述平板玻璃之後,上述平板玻璃之上述寬度方向之中心部之溫度為緩冷點以上時,以第1平均冷卻速度對中央區域進行冷卻,該中央區域係位於較上述平板玻璃之寬度方向之兩端部更靠上述平板玻璃之寬度方向內側且包含上述中心部之區域;第2冷卻步驟,其於上述中心部之溫度未達上述緩冷點且為450℃以上時,以第2平均冷卻速度對上述中央區域進行冷卻;及第3冷卻步驟,其於上述中心部之溫度未達450℃且為300℃以上時,以第3平均冷卻速度對上述中央區域進行冷卻,上述第3平均冷卻速度小於上述第1平均冷卻速度及上述第2平均冷卻速度。 It is preferable that the cooling step includes: a first cooling step, after forming the sheet glass, when the temperature of the central portion of the sheet glass in the width direction is above the slow cooling point, the central area is subjected to the first average cooling rate Cooling, the central area is located in the widthwise inner side of the sheet glass than the both ends of the width direction of the sheet glass and includes the central portion; the second cooling step, the temperature in the central portion is not reached When the slow cooling point is above 450°C, the central region is cooled at the second average cooling rate; and the third cooling step, when the temperature at the central portion is not above 450°C and above 300°C, use the 3 The average cooling rate cools the central region, and the third average cooling rate is less than the first average cooling rate and the second average cooling rate.
較佳為上述冷卻步驟進而包含第4冷卻步驟,該第4冷卻步驟於上述中心部之溫度未達300℃且為100℃以上時,以第4平均冷卻速度對上述中央區域進行冷卻,上述第4平均冷卻速度大於上述第3平均冷卻速度。 Preferably, the cooling step further includes a fourth cooling step, which cools the central region at a fourth average cooling rate when the temperature of the central portion does not reach 300°C and is above 100°C. 4 The average cooling rate is greater than the third average cooling rate described above.
又,本發明之第2態樣為用以按照特定之處理溫度實施熱處理而於表面形成薄膜的顯示器用玻璃基板之製造方法。該製造方法包括:成形步驟,其藉由下拉法而使熔融玻璃成形為平板玻璃;及 冷卻步驟,其於使成形後之上述平板玻璃流動時,進行冷卻直至與上述平板玻璃之流動方向正交的寬度方向之中心部之溫度達到較上述處理溫度低250℃之溫度即(上述處理溫度-250℃)為止。 In addition, the second aspect of the present invention is a method for manufacturing a glass substrate for a display by performing heat treatment at a specific processing temperature to form a thin film on the surface. The manufacturing method includes: a forming step of forming molten glass into flat glass by a down-draw method; and In the cooling step, when the sheet glass after forming is flowed, cooling is performed until the temperature of the central portion in the width direction orthogonal to the flow direction of the sheet glass reaches a temperature lower than the processing temperature by 250° C. (the processing temperature -250℃).
於上述冷卻步驟中,中央區域之冷卻速度即上述中心部之溫度未達較上述處理溫度低100℃之溫度即未達(上述處理溫度-100℃)且為較上述處理溫度低250℃之溫度以上即(上述處理溫度-250℃)以上之溫度區域中的平均冷卻速度,小於上述冷卻步驟中的上述溫度區域以外之溫度區域中之上述中央區域之平均冷卻速度,上述中央區域係位於較上述平板玻璃之寬度方向之兩端部更靠上述平板玻璃之上述寬度方向之內側且包含上述中心部之區域。 In the above cooling step, the cooling rate of the central area, that is, the temperature of the central portion does not reach the temperature lower than the treatment temperature by 100°C (that is, the treatment temperature is -100°C) and is 250°C lower than the treatment temperature The average cooling rate in the temperature range above (the processing temperature-250°C) or higher is lower than the average cooling rate in the central region in the temperature region other than the temperature region in the cooling step, the central region is located above the Both ends of the width direction of the sheet glass are closer to the inner side of the sheet glass in the width direction and include the region of the center portion.
較佳為上述冷卻步驟包含:第1冷卻步驟,其於成形為上述平板玻璃之後,上述平板玻璃之寬度方向之中心部之溫度為緩冷點以上時,以第1平均冷卻速度對中央區域進行冷卻,該中央區域係位於較上述平板玻璃之寬度方向之兩端部更靠上述平板玻璃之寬度方向內側且包含上述中心部之區域;第2冷卻步驟,其於上述中心部之溫度未達上述緩冷點且為較上述處理溫度低100℃之溫度以上即(上述處理溫度-100℃)以上時,以第2平均冷卻速度對上述中央區域進行冷卻;及第3冷卻步驟,其於上述中心部之溫度未達較上述處理溫度低100℃之溫度即未達(上述處理溫度-100℃)且為較上述處理溫度低250℃之溫度以上即(上述處理溫度-250℃)以上時,以第3平均冷卻速度對上述中央區域進行冷卻,上述第3平均冷卻速度小於上述第1平均冷卻速度及上述第2平均冷卻速度。
Preferably, the cooling step includes: a first cooling step, which is performed on the central area at the first average cooling rate when the temperature of the central portion of the width direction of the flat glass is above the slow cooling point after forming the flat glass Cooling, the central region is located in the widthwise inner side of the sheet glass than the both ends of the width direction of the sheet glass and includes the central part; the second cooling step, the temperature in the central part does not reach the above When the slow cooling point is a
較佳為上述冷卻步驟進而包含第4冷卻步驟,該第4冷卻步驟於上述中心部之溫度未達較上述處理溫度低250℃之溫度即未達上述處 理溫度(℃)-250℃且為較上述處理溫度低450℃之溫度以上即上述處理溫度(℃)-450℃以上時,以第4平均冷卻速度對上述中央區域進行冷卻,上述第4平均冷卻速度大於上述第3平均冷卻速度。 It is preferable that the cooling step further includes a fourth cooling step that does not reach the above-mentioned point when the temperature in the center portion does not reach 250°C lower than the processing temperature If the treatment temperature (°C)-250°C is above 450°C lower than the treatment temperature, that is, the treatment temperature (°C)-450°C or above, the central region is cooled at the fourth average cooling rate, and the fourth average The cooling rate is greater than the third average cooling rate.
於上述第1態樣及第2態樣中,上述第1平均冷卻速度均較佳為大於上述第2平均冷卻速度。 In both the first aspect and the second aspect, the first average cooling rate is preferably greater than the second average cooling rate.
於上述第1態樣及第2態樣中,上述第3平均冷卻速度均較佳為5.0℃/秒以下。 In both the first aspect and the second aspect, the third average cooling rate is preferably 5.0° C./sec or less.
於上述第1態樣及第2態樣中,上述玻璃基板之熱收縮率均較佳為15ppm以下。 In both the first aspect and the second aspect, the thermal shrinkage of the glass substrate is preferably 15 ppm or less.
其中,上述熱收縮率係使用實施以500℃保持30分鐘之熱處理後之玻璃基板之收縮量,根據以下之式子求出之值。 Here, the above-mentioned thermal shrinkage rate is a value obtained by using the shrinkage amount of the glass substrate after heat treatment maintained at 500° C. for 30 minutes, according to the following formula.
熱收縮率(ppm)={熱處理後之玻璃基板之收縮量/熱處理前之玻璃基板之長度}×106 Thermal shrinkage (ppm)={shrinkage of glass substrate after heat treatment/length of glass substrate before heat treatment}×10 6
於上述第1態樣及第2態樣中,上述玻璃基板之應變點均較佳為680℃以上。 In the first aspect and the second aspect, the strain point of the glass substrate is preferably 680° C. or higher.
根據上述顯示器用玻璃基板之製造方法,與先前相比可減小熱收縮率。 According to the manufacturing method of the glass substrate for displays mentioned above, the heat shrinkage rate can be reduced compared with the past.
11‧‧‧熔融裝置 11‧‧‧ melting device
12‧‧‧澄清裝置 12‧‧‧Clarification device
20‧‧‧成形體室 20‧‧‧Forming room
23‧‧‧上游管 23‧‧‧Upstream
24‧‧‧下游管 24‧‧‧ Downstream pipe
30‧‧‧第1冷卻室 30‧‧‧The first cooling room
40‧‧‧成形裝置 40‧‧‧Forming device
41‧‧‧成形體 41‧‧‧Formed body
41a‧‧‧下端部 41a‧‧‧Lower end
41b‧‧‧頂部 41b‧‧‧Top
41c‧‧‧側面(表面) 41c‧‧‧Side (surface)
42‧‧‧流入口 42‧‧‧Inflow
43‧‧‧槽 43‧‧‧slot
50‧‧‧分隔構件 50‧‧‧Partition
51‧‧‧冷卻輥 51‧‧‧cooling roller
60‧‧‧溫度調整單元 60‧‧‧Temperature adjustment unit
61‧‧‧冷卻單元 61‧‧‧cooling unit
80‧‧‧第2冷卻室 80‧‧‧Second cooling room
80a‧‧‧頂板 80a‧‧‧Top plate
80b‧‧‧隔熱構件 80b‧‧‧Insulation component
81a~81g‧‧‧下降輥 81a~81g‧‧‧ descending roller
82a~82g‧‧‧加熱器 82a~82g‧‧‧heater
90‧‧‧切斷裝置 90‧‧‧cutting device
91‧‧‧控制裝置 91‧‧‧Control device
100‧‧‧玻璃基板製造裝置 100‧‧‧Glass substrate manufacturing equipment
380‧‧‧熱電偶 380‧‧‧thermocouple
381‧‧‧主電源開關 381‧‧‧Main power switch
390‧‧‧冷卻輥驅動馬達 390‧‧‧cooling roller drive motor
391‧‧‧下降輥驅動馬達 391‧‧‧Lower roller drive motor
392‧‧‧切斷裝置驅動馬達 392‧‧‧cutting device drive motor
A~E‧‧‧時間點 A~E‧‧‧time
C‧‧‧中心部 C‧‧‧Central Department
CA‧‧‧中央區域 CA‧‧‧Central area
FG‧‧‧熔融玻璃 FG‧‧‧Molten glass
L、R‧‧‧兩端部 L, R‧‧‧ both ends
P1~P5‧‧‧點 P1~P5‧‧‧ point
R1‧‧‧第1溫度區域 R1‧‧‧1st temperature zone
R2‧‧‧第2溫度區域 R2‧‧‧Second temperature zone
R3‧‧‧第3溫度區域 R3‧‧‧The third temperature zone
R4‧‧‧第4溫度區域 R4‧‧‧4th temperature zone
S1‧‧‧熔融步驟 S1‧‧‧ melting step
S2‧‧‧澄清步驟 S2‧‧‧Clarification steps
S3‧‧‧成形步驟 S3‧‧‧Forming steps
S4‧‧‧冷卻步驟 S4‧‧‧cooling step
SG‧‧‧平板玻璃 SG‧‧‧Flat glass
T1~T3‧‧‧溫度歷程 T1~T3‧‧‧Temperature history
TP1~TP10‧‧‧溫度分佈 TP1~TP10‧‧‧Temperature distribution
圖1係表示本實施形態之顯示器用玻璃基板之製造方法之步驟的一例之圖。 FIG. 1 is a diagram showing an example of the steps of the method for manufacturing a glass substrate for a display of this embodiment.
圖2係本實施形態之顯示器用玻璃基板之製造方法中所使用之玻璃基板製造裝置的一例之模式圖。 FIG. 2 is a schematic diagram of an example of a glass substrate manufacturing apparatus used in the method for manufacturing a glass substrate for a display of this embodiment.
圖3係表示本實施形態之顯示器用玻璃基板之製造方法中之成形 裝置的一例之剖面圖。 FIG. 3 shows the forming in the manufacturing method of the glass substrate for a display of this embodiment A cross-sectional view of an example of the device.
圖4係表示本實施形態之顯示器用玻璃基板之製造方法中所使用之成形裝置的一例之側面圖。 FIG. 4 is a side view showing an example of a molding apparatus used in the method for manufacturing a glass substrate for a display of this embodiment.
圖5係表示本實施形態之顯示器用玻璃基板之製造方法中所使用之控制裝置的構成之一例之圖。 5 is a diagram showing an example of the configuration of a control device used in the method for manufacturing a glass substrate for a display of this embodiment.
圖6係表示本實施形態之顯示器用玻璃基板之製造方法之冷卻步驟中所使用的溫度分佈之例子之圖。 6 is a diagram showing an example of the temperature distribution used in the cooling step of the manufacturing method of the glass substrate for a display of the present embodiment.
圖7係表示本實施形態之顯示器用玻璃基板之製造方法中之平板玻璃的沿著流動方向之溫度歷程之一例的圖。 7 is a diagram showing an example of the temperature history of the flat glass in the flow direction in the method of manufacturing a glass substrate for a display according to this embodiment.
圖8係顯示器用玻璃基板之製造方法中所使用之平板玻璃之冷卻步驟中的複數個溫度歷程之例子之模式圖。 8 is a schematic diagram of an example of a plurality of temperature histories in the cooling step of the flat glass used in the method of manufacturing a glass substrate for a display.
以下,對本實施形態之顯示器用玻璃基板之製造方法進行說明。於本實施形態之顯示器用玻璃基板之製造方法中,使用溢流下拉法而製造玻璃基板。再者,於本說明書中,(處理溫度-X℃)表示較處理溫度(℃)低X℃之溫度(X為正數)。 Hereinafter, a method of manufacturing the glass substrate for a display of this embodiment will be described. In the manufacturing method of the glass substrate for displays of this embodiment, the glass substrate is manufactured using the overflow down-draw method. In addition, in this specification, (treatment temperature-X°C) means a temperature that is X°C lower than the treatment temperature (°C) (X is a positive number).
(1)玻璃基板之製造方法之概要 (1) Overview of the manufacturing method of glass substrate
首先,參照圖1及圖2,對顯示器用玻璃基板製造方法中所含之複數個步驟及複數個步驟中所使用之玻璃基板製造裝置100進行說明。圖1係表示本實施形態之顯示器用玻璃基板之製造方法之步驟的一例之圖,圖2係本實施形態之顯示器用玻璃基板之製造方法中所使用之玻璃基板製造裝置的一例之模式圖。
First, referring to FIGS. 1 and 2, a plurality of steps included in a method for manufacturing a glass substrate for a display and a glass
如圖1所示,玻璃基板製造方法主要包含熔融步驟S1、澄清步驟S2、成形步驟S3、及冷卻步驟S4。 As shown in FIG. 1, the glass substrate manufacturing method mainly includes a melting step S1, a clarification step S2, a forming step S3, and a cooling step S4.
熔融步驟S1為使玻璃原料熔融之步驟。玻璃原料係以達到所期望之組成之方式而經調製之後,投入至熔融裝置11。玻璃原料於熔融
裝置11中熔融而成為熔融玻璃FG。根據玻璃之種類而調整熔融溫度。於本實施形態中,以使熔融步驟S1中之熔融玻璃FG之最高溫度達到1500℃~1650℃之方式進行加熱。熔融玻璃FG經由上游管23而被送至澄清裝置12。
The melting step S1 is a step of melting the glass raw material. The glass raw material is prepared in such a way as to achieve the desired composition, and then charged into the
澄清步驟S2為將熔融玻璃FG中之氣泡除去之步驟。其後,於澄清裝置12內除去氣泡後之熔融玻璃FG經由下游管24而被送向成形裝置40。
The clarification step S2 is a step of removing bubbles in the molten glass FG. Thereafter, the molten glass FG after removing bubbles in the
成形步驟S3為使熔融玻璃FG成形為片狀玻璃即平板玻璃SG之步驟。具體而言,熔融玻璃FG連續供給至成形裝置40中所含之成形體41(參照圖3)之後,自成形體41溢流。溢流之熔融玻璃FG沿成形體41之表面流下。其後,熔融玻璃FG於成形體41之下端部合流而成形為平板玻璃SG。
The forming step S3 is a step of forming the molten glass FG into sheet glass, that is, sheet glass SG. Specifically, after the molten glass FG is continuously supplied to the molded body 41 (refer to FIG. 3) included in the
冷卻步驟S4為對平板玻璃SG進行冷卻之步驟。玻璃片材經由冷卻步驟S4而被冷卻至接近於室溫之溫度。再者,根據冷卻步驟S4中之冷卻狀態,決定玻璃基板之厚度(板厚度)、玻璃基板之翹曲量、及玻璃基板之平面應變之值。 The cooling step S4 is a step of cooling the flat glass SG. The glass sheet is cooled to a temperature close to room temperature through the cooling step S4. Furthermore, the thickness of the glass substrate (plate thickness), the amount of warpage of the glass substrate, and the plane strain of the glass substrate are determined according to the cooling state in the cooling step S4.
再者,亦可於冷卻步驟S4之後設置切斷步驟。例如,切斷步驟為於切斷裝置90中,將溫度接近於室溫之平板玻璃SG切斷為特定大小之步驟。
In addition, the cutting step may be provided after the cooling step S4. For example, the cutting step is a step of cutting the flat glass SG whose temperature is close to room temperature into a specific size in the
再者,於切斷步驟中被切斷為特定大小之平板玻璃SG,其後,經由端面加工等步驟而成為玻璃基板。玻璃基板經包裝之後,被出貨至面板廠商等。面板廠商於玻璃基板之表面形成元件而製造顯示器。 In addition, in the cutting step, the flat glass SG is cut into a specific size, and thereafter, it becomes a glass substrate through steps such as end surface processing. After being packaged, the glass substrate is shipped to panel manufacturers and the like. Panel manufacturers form devices on the surface of glass substrates to manufacture displays.
再者,亦可不於冷卻步驟S4之後設置切斷步驟。即,於冷卻步驟S4中經冷卻之平板玻璃SG亦可直接經包裝之後,被出貨至面板廠商等。於該情形時,面板廠商於平板玻璃SG之表面形成元件之後,將平板玻璃SG切斷為特定大小而進行端面加工,藉此製造顯示器。 Furthermore, it is not necessary to provide a cutting step after the cooling step S4. That is, the flat glass SG cooled in the cooling step S4 may be directly packaged and then shipped to the panel manufacturer or the like. In this case, after the panel manufacturer forms an element on the surface of the flat glass SG, the flat glass SG is cut to a specific size and subjected to end surface processing, thereby manufacturing a display.
以下,參照圖3~圖5對玻璃基板製造裝置100中所含之成形裝置40之構成進行說明。再者,於本實施形態中,所謂平板玻璃SG之寬度方向,係指平板玻璃SG之表面之面內方向中的與平板玻璃SG流下之方向(流動方向)交叉之方向,即水平方向。
Hereinafter, the configuration of the forming
(2)成形裝置之構成 (2) Structure of the forming device
首先,圖3及圖4中表示成形裝置40之概略構成。圖3係成形裝置40之剖面圖。圖4係成形裝置40之側面圖。
First, FIGS. 3 and 4 show the schematic configuration of the
成形裝置40具有平板玻璃SG所通過之路徑、與包圍路徑之空間。包圍通路之空間例如係由成形體室20、第1冷卻室30、及第2冷卻室80構成。
The forming
於本實施形態中,當平板玻璃SG自如下位置向下方流動時,沿著平板玻璃SG之流動方向之溫度區域中,平板玻璃SG之中心部C(參照圖4)之溫度未達450℃且為300℃以上之溫度區域中的平均冷卻速度如下所述,小於冷卻步驟S4中的中心部C之溫度未達450℃且為300℃以上之溫度區域以外之溫度區域中的平均冷卻速度,上述位置為熔融玻璃FG於成形體41之下端部41a合流而形成平板玻璃SG之位置。該內容將後述。再者,平均冷卻速度與中心部C之溫度未達450℃且為300℃以上之溫度區域之平均冷卻速度作比較之溫度區域例如係上游側與下游側之溫度差為至少10℃以上之溫度區域。
In this embodiment, when the sheet glass SG flows downward from the following position, in the temperature region along the flow direction of the sheet glass SG, the temperature of the central portion C (see FIG. 4) of the sheet glass SG does not reach 450°C and The average cooling rate in the temperature range of 300°C or higher is as follows, which is lower than the temperature of the central portion C in the cooling step S4 that does not reach 450°C and is the average cooling rate in a temperature range other than the temperature range of 300°C or higher, above The position is a position where the molten glass FG merges at the
再者,所謂平板玻璃SG之寬度方向之兩端部,係指自平板玻璃SG之兩側端至向平板玻璃SG之寬度方向之內側前進200mm的位置為止的寬度方向之範圍內之區域,將兩端部之寬度方向之內側之區域稱為平板玻璃SG之中央區域CA(參照圖4)。平板玻璃SG之兩端部R、L為包含製造後被切斷除去之對象之部分的區域,與此相對,平板玻璃SG之中央區域CA為包含使板厚度均勻之對象之部分的區域。平板玻璃SG之中央區域CA處於平板玻璃SG之寬度方向之寬度中的自平板玻 璃SG之寬度方向之中心算起之一半寬度例如85%以內之範圍。所謂中心部C,係指平板玻璃SG之寬度方向之中心位置。所謂平均冷卻速度,係指包含中心部C之中央區域CA之平均冷卻速度,其為將已決定之溫度區域中的相同寬度方向之位置處之流動方向之溫度差,除以平板玻璃SG通過該溫度區域之通過時間所得之值。於如未達450℃且為300℃以上之溫度區域般表示為未達X1℃且為X2℃以上之溫度區域中,中心部C之溫度差被視為X1-X2(℃),算出中心部C之平均冷卻速度。中央區域CA之中心部C以外之部分之平均冷卻速度亦為將上述溫度區域中之溫度差除以通過時間所得之值。 In addition, the both ends of the width direction of the sheet glass SG refer to the area in the width direction from the both ends of the sheet glass SG to the position that advances 200 mm inward in the width direction of the sheet glass SG. The area on the inner side in the width direction of both end portions is called the central area CA of the sheet glass SG (refer to FIG. 4 ). Both end portions R and L of the sheet glass SG are regions that include parts that are cut off and removed after manufacture, while the central region CA of the sheet glass SG is a region that includes parts that make the plate thickness uniform. The central area CA of the flat glass SG is a self-flat glass whose width in the width direction of the flat glass SG The half of the width of the center of the glass SG in the width direction is within 85%, for example. The central portion C refers to the center position of the sheet glass SG in the width direction. The so-called average cooling rate refers to the average cooling rate of the central area CA including the central portion C, which is the temperature difference in the flow direction at the position of the same width direction in the determined temperature area, divided by the plate glass SG passing through The value obtained by the passage time of the temperature range. In the temperature range below X1°C and above X2°C, as in the temperature range below 450°C and above 300°C, the temperature difference at the center C is regarded as X1-X2(°C), and the center is calculated The average cooling rate of C. The average cooling rate of the portion other than the central portion C of the central area CA is also a value obtained by dividing the temperature difference in the temperature area by the passage time.
成形體室20為使自上述澄清裝置12所輸送之熔融玻璃FG成形為平板玻璃SG之空間。
The molded
第1冷卻室30為配置於成形體室20之下方,且用以對平板玻璃SG之厚度及翹曲量進行調整之空間。於第1冷卻室30中,對平板玻璃SG之中心部C之溫度高於緩冷點之狀態下的平板玻璃SG進行冷卻。平板玻璃SG之中心部C為平板玻璃SG之寬度方向之中心。
The
第2冷卻室80為配置於成形體室20及第1冷卻室30之下方,且用以對平板玻璃SG之翹曲、熱收縮率及應變值進行調整之空間。於第2冷卻室80中,通過第1冷卻室30內之平板玻璃SG經由緩冷點、應變點而至少被冷卻至低於應變點100℃之溫度。然而,於第2冷卻室80中,平板玻璃SG亦可被冷卻至室溫附近之溫度為止。再者,第2冷卻室80之內部亦可藉由隔熱構件80b而被劃分為複數個空間。複數個隔熱構件80b於複數個下降輥81a~81g各自之間,配置於平板玻璃SG之厚度方向之兩側。藉此,可精度更佳地對平板玻璃SG進行溫度管理。
The
又,成形裝置40例如包括成形體41、分隔構件50、冷卻輥51、溫度調整單元60、下降輥81a~81g、及加熱器82a~82g。進而,成形裝置40包括控制裝置91(參照圖5)。控制裝置91對成形裝置40中所含
之各構成之驅動部進行控制。
The
以下,詳細地對成形裝置40中所含之各構成進行說明。
Hereinafter, each configuration included in the
(2-1)成形體 (2-1) Shaped body
成形體41設置於成形體室20內。成形體41藉由使熔融玻璃FG溢流而使熔融玻璃FG成形為片狀玻璃即平板玻璃SG。如圖3所示,成形體41具有剖面形狀呈大致五邊形之形狀(類似於楔形之形狀)。大致五邊形之前端相當於成形體41之下端部41a。
The molded
又,成形體41於第1端部具有流入口42(參照圖4)。於成形體41之上表面形成有槽43。流入口42與上述下游管24連接,自澄清裝置12流出之熔融玻璃FG自流入口42流入至槽43。流入至成形體41之槽43之熔融玻璃FG自成形體41之一對頂部41b、41b溢流,且沿成形體41之一對側面(表面)41c、41c流下。其後,熔融玻璃FG於成形體41之下端部41a合流而成為平板玻璃SG。
In addition, the molded
(2-2)分隔構件 (2-2) Partition member
分隔構件50為阻斷熱自成形體室20向第1冷卻室30移動之構件。分隔構件50配置於熔融玻璃FG之合流點附近。又,如圖3所示,分隔構件50配置於在合流點合流之熔融玻璃FG(平板玻璃SG)之厚度方向兩側。分隔構件50例如為隔熱材。分隔構件50將熔融玻璃FG之合流點之上側環境及下側環境分隔,藉此,阻斷分隔構件50之上側與下側之間的熱移動。
The
(2-3)冷卻輥 (2-3) Cooling roller
冷卻輥51設置於第1冷卻室30內。更具體而言,冷卻輥51配置於分隔構件50之正下方。又,冷卻輥51配置於平板玻璃SG之厚度方向兩側,且配置於平板玻璃SG之寬度方向之兩端部R、L之位置。配置於平板玻璃SG之厚度方向兩側之冷卻輥51成對地進行動作。即,平板玻璃SG之寬度方向兩端部由兩對冷卻輥51夾持。
The cooling
例如,冷卻輥51由通入至內部之空冷管或水冷管冷卻。冷卻輥51與平板玻璃SG之兩端部R、L接觸,藉由熱傳導而對平板玻璃SG之兩端部R、L進行急速冷卻。與冷卻輥51接觸之平板玻璃SG之兩端部R、L之黏度例如為109.0泊以上。
For example, the cooling
冷卻輥51由冷卻輥驅動馬達390(參照圖5)旋轉驅動。冷卻輥51亦具有如下功能,即,對平板玻璃SG之兩端部R、L進行冷卻,並且使平板玻璃SG向下方下降。再者,冷卻輥51對於平板玻璃SG之兩端部R、L之冷卻會對平板玻璃SG之寬度及平板玻璃SG之厚度之均勻化造成影響。
The cooling
(2-4)溫度調整單元 (2-4) Temperature adjustment unit
溫度調整單元60為設置於第1冷卻室30內,且將平板玻璃SG冷卻至緩冷點附近為止之單元。溫度調整單元60配置於分隔構件50之下方,且配置於第2冷卻室80之頂板80a之上方。
The
溫度調整單元60對平板玻璃SG進行冷卻,直至平板玻璃SG之中心部C之溫度達到緩冷點附近為止。其後,平板玻璃SG之中心部C於第2冷卻室80內,經由緩冷點、應變點而被冷卻至室溫附近之溫度為止。
The
溫度調整單元60亦可具有冷卻單元61。於平板玻璃SG之寬度方向上配置複數個(此處為3個)冷卻單元61,及於該平板玻璃SG之流動方向上配置複數個冷卻單元61。具體而言,以與平板玻璃SG之兩端部R、L之各表面相對向之方式而逐個地配置冷卻單元61,且以與後述之中央區域CA(參照圖4)之各表面相對向之方式而配置一個冷卻單元61。
The
(2-5)下降輥 (2-5) Lowering roller
下降輥81a~81g設置於第2冷卻室80內,且使通過第1冷卻室30內之平板玻璃SG向平板玻璃SG之流動方向下降。下降輥81a~81g於第2
冷卻室80之內部,沿流動方向隔開特定間隔地配置。下降輥81a~81g於平板玻璃SG之厚度方向兩側(參照圖3)、及平板玻璃SG之寬度方向之兩端部R、L之位置(參照圖4)配置有複數個。即,下降輥81a~81g一面與平板玻璃SG之寬度方向之兩端部R、L之位置接觸,且與平板玻璃SG之厚度方向之兩側接觸,一面使平板玻璃SG向下方下降。
The descending
下降輥81a~81g由下降輥驅動馬達391(參照圖5)驅動。較佳為下降輥81a~81g設置得越靠下游側,則使下降輥81a~81g之周速度越大。即,複數個下降輥81a~81g中,下降輥81a之周速度最小,下降輥81g之周速度最大。配置於平板玻璃SG之厚度方向兩側之下降輥81a~81g成對地進行動作,成對之下降輥81a、81a、…使平板玻璃SG向下方向下降。
The descending
(2-6)加熱器 (2-6) Heater
加熱器82a~82g設置於第2冷卻室80之內部,且對第2冷卻室80之內部空間之溫度進行調整。具體而言,加熱器82a~82g於平板玻璃SG之流動方向及平板玻璃SG之寬度方向配置有複數個。例如,於平板玻璃SG之流動方向上配置7個加熱器,於平板玻璃之寬度方向上配置3個加熱器。配置於寬度方向之3個加熱器分別對平板玻璃SG之中央區域CA、與平板玻璃SG之兩端部R、L進行溫度控制。加熱器82a~82g之輸出由後述之控制裝置91控制。藉此,對通過第2冷卻室80內部之平板玻璃SG附近之環境溫度進行控制。藉由加熱器82a~82g而對第2冷卻室80內之環境溫度進行控制,藉此,對平板玻璃SG進行溫度控制。又,藉由溫度控制,平板玻璃SG自黏性區域經由黏彈性區域而向彈性區域變遷。如此,藉由加熱器82a~82g之控制,於第2冷卻室80中,平板玻璃SG之溫度自緩冷點附近之溫度冷卻至室溫附近之溫度為止。
The
再者,亦可於平板玻璃SG之附近設置對環境溫度進行檢測之環
境溫度檢測機構(於本實施形態中為熱電偶)380(參照圖5)。例如,熱電偶380於平板玻璃SG之流動方向及平板玻璃SG之寬度方向配置有複數個。熱電偶380可對平板玻璃SG表面之溫度進行檢測。例如,熱電偶380分別對平板玻璃SG之中心部C之溫度、與平板玻璃SG之兩端部R、L之溫度進行檢測。加熱器82a~82g之輸出基於熱電偶380所檢測出之環境溫度而受到控制。
Furthermore, a ring for detecting the ambient temperature can also be provided near the flat glass SG
Ambient temperature detection mechanism (thermocouple in this embodiment) 380 (refer to FIG. 5). For example, a plurality of
(2-7)切斷裝置 (2-7) Cutting device
切斷裝置90將已於第2冷卻室80內被冷卻至室溫附近之溫度為止之平板玻璃SG切斷為特定尺寸。藉此,平板玻璃SG成為複數個玻璃板。切斷裝置90由切斷裝置驅動馬達392(參照圖5)驅動。再者,切斷裝置90亦可未必設置於第2冷卻室80之正下方。又,平板玻璃SG亦可不由切斷裝置90切斷,亦可將平板玻璃SG捲繞為卷狀而製作卷狀之平板玻璃。
The cutting
(2-8)控制裝置 (2-8) Control device
圖5係表示控制裝置91之構成之一例之圖。
FIG. 5 is a diagram showing an example of the configuration of the
控制裝置91包含CPU(Central Processing Unit,中央處理單元)、RAM(Random Access Memory,隨機存取記憶體)、ROM(Read Only Memory,唯讀記憶體)、及硬碟等,對玻璃基板製造裝置100中所含之各種設備進行控制。具體而言,如圖5所示,控制裝置91接收玻璃基板製造裝置100中所含之各種感測器(例如熱電偶380)或開關(例如主電源開關381)等之信號,對溫度調整單元60、加熱器82a~82g、冷卻輥驅動馬達390、下降輥驅動馬達391、切斷裝置驅動馬達392等進行控制。
The
(3)溫度管理 (3) Temperature management
於本實施形態之玻璃基板之製造方法之冷卻步驟S4中,中央區域CA之冷卻速度即中心部C之溫度未達450℃且為300℃以上之溫度區
域中之平均冷卻速度,小於冷卻步驟S4中的中心部C之溫度未達450℃且為300℃以上之上述溫度區域以外之溫度區域中的中央區域CA之平均冷卻速度。即,於冷卻步驟S4中,於中心部C之溫度未達450℃且為300℃以上之溫度區域中,中央區域CA中之平均冷卻速度最小。以上述方式調整平均冷卻速度,藉此,可於玻璃基板之製造線上實現極低之熱收縮率。於該情形時,使用上述冷卻輥51、溫度調整單元60、及加熱器82a~82g而對平均冷卻速度進行調整。當然,此時,將如圖6所示之平板玻璃SG之寬度方向之溫度分佈TP1~TP10設為流動方向之各溫度區域中之目標溫度分佈,對第1冷卻室30及第2冷卻室80之溫度進行控制,藉此,可對平板玻璃SG之厚度、翹曲量、及應變進行調整。
In the cooling step S4 of the manufacturing method of the glass substrate of the present embodiment, the cooling rate of the central area CA, that is, the temperature of the central portion C does not reach 450°C and is a temperature range of 300°C or higher
The average cooling rate in the region is less than the average cooling rate of the central region CA in the temperature region other than the above-mentioned temperature region where the temperature of the central portion C in the cooling step S4 does not reach 450°C and is 300°C or higher. That is, in the cooling step S4, in the temperature region where the temperature of the central portion C does not reach 450°C and is 300°C or higher, the average cooling rate in the central region CA is the smallest. By adjusting the average cooling rate in the above manner, an extremely low heat shrinkage rate can be achieved on the manufacturing line of the glass substrate. In this case, the average cooling rate is adjusted using the cooling
圖6係對冷卻步驟中之目標溫度分佈之一例即溫度分佈TP1~TP10進行說明之圖。於溫度分佈TP1中,平板玻璃SG之中央區域CA之溫度均勻,平板玻璃SG之兩端部R、L低於中央區域CA之溫度。以使平板玻璃SG達到上述溫度分佈TP1之方式,使用成形後之冷卻輥51而對平板玻璃SG之兩端部R、L進行冷卻。於溫度分佈TP2~TP5中,一面降低平板玻璃SG整體之溫度,一面使中央區域CA之溫度分佈自矩形形狀成為向上凸起之大致拋物線形狀,且逐步減小大致拋物線形狀之凸起程度。於溫度分佈TP6中,使兩端部R、L及中央區域CA中之溫度固定。其後,於溫度分佈TP7~TP10中,形成向下凸起之大致拋物線形狀之溫度分佈,一面降低平板玻璃SG整體之溫度,一面增大使中央區域CA之溫度分佈向下凸起之程度。以使平板玻璃SG之溫度達到如上所述之溫度分佈之方式,使用冷卻單元61及加熱器82a~82g而對第1冷卻室30及第2冷卻室80進行溫度調整。
FIG. 6 is a diagram illustrating temperature distributions TP1 to TP10 as an example of the target temperature distribution in the cooling step. In the temperature distribution TP1, the temperature of the central area CA of the sheet glass SG is uniform, and both end portions R, L of the sheet glass SG are lower than the temperature of the central area CA. Both ends R and L of the sheet glass SG are cooled using the
再者,於對第1冷卻室30及第2冷卻室80進行溫度調整之情形時,平板玻璃SG之溫度可使用平板玻璃SG之溫度之實測值,又,亦
可使用基於受到加熱器82a~82g控制之平板玻璃SG之環境溫度而藉由模擬算出的值。
In addition, when the temperature of the
圖7係表示本實施形態中之中心部C之平板玻璃SG的沿著流動方向之溫度歷程(溫度之時間變化)之一例的圖。於圖7中,於時間點A,於成形體41之下端部41a形成平板玻璃SG。此時之平板玻璃SG之溫度例如為1200℃。於時間點B,平板玻璃SG之溫度達到緩冷點(玻璃黏度為1013泊時之溫度例如775℃),於時間點C,平板玻璃SG之溫度達到450℃。於時間點D,平板玻璃SG之溫度達到300℃,於時間點E,平板玻璃SG之溫度達到200℃以下,該平板玻璃SG由切斷裝置90切斷。此時,將自時間點A至時間點B為止之平板玻璃SG之溫度區域(形成平板玻璃SG之後,緩冷點以上之溫度區域)設為第1溫度區域R1,將經過時間點B後直至時間點C為止之平板玻璃SG之溫度區域(緩冷點未達450℃以上之溫度區域)設為第2溫度區域R2,將經過時間點C後直至時間點D為止之平板玻璃SG之溫度區域(未達450℃且為300℃以上之溫度區域)設為第3溫度區域R3,將經過時間點D後直至時間點E為止之平板玻璃SG之溫度區域(未達300℃且為100℃以上之溫度區域)設為第4溫度區域R4。此時,於第1溫度區域R1~第4溫度區域R4中,第3溫度區域R3中之第3平均冷卻速度小於其他第1溫度區域R1、第2溫度區域R2、第4溫度區域R4之第1平均冷卻速度、第2平均冷卻速度、第4平均冷卻速度。第1溫度區域R1中之平板玻璃SG之冷卻步驟為第1冷卻步驟,第2溫度區域R2~第4溫度區域R4中之平板玻璃SG之冷卻步驟分別為第2冷卻步驟~第4冷卻步驟。
7 is a diagram showing an example of the temperature history (temporal change in temperature) of the sheet glass SG at the central portion C in the present embodiment along the flow direction. In FIG. 7, at time point A, sheet glass SG is formed on the
於本實施形態中,即使於任意地劃分溫度區域R3以外之範圍而決定溫度區域(具有10℃以上之溫度差之溫度區域)之情形時,溫度區域R3中之第3平均冷卻速度亦最小。 In the present embodiment, even when the temperature region (temperature region having a temperature difference of 10° C. or higher) is arbitrarily divided into ranges other than the temperature region R3, the third average cooling rate in the temperature region R3 is the smallest.
再者,考慮到可有效地減小熱收縮率,較佳為第1溫度區域R1中 之第1平均冷卻速度大於第2溫度區域中之第2平均冷卻速度。具體而言,根據有效地減小熱收縮率之觀點,為迅速進行第1溫度區域R1中之玻璃之緩和,較佳為使第2溫度區域R2~第4溫度區域R4之冷卻速度較第1溫度區域R1之冷卻速度更慢。 Furthermore, considering that the heat shrinkage rate can be effectively reduced, it is preferably in the first temperature region R1 The first average cooling rate is greater than the second average cooling rate in the second temperature region. Specifically, from the viewpoint of effectively reducing the heat shrinkage rate, in order to quickly relax the glass in the first temperature region R1, it is preferable to make the cooling rate of the second temperature region R2 to the fourth temperature region R4 lower than that of the first The cooling rate in the temperature region R1 is slower.
又,考慮到無需對冷卻步驟S4之平板玻璃SG之路徑之長度進行變更,及抑制玻璃基板之生產效率之降低,較佳為第4冷卻步驟之第4溫度區域R4中之第4平均冷卻速度大於第3溫度區域中之第3平均冷卻速度。 In addition, considering that there is no need to change the length of the path of the plate glass SG in the cooling step S4 and to suppress the reduction in the production efficiency of the glass substrate, the fourth average cooling rate in the fourth temperature region R4 of the fourth cooling step is preferred Greater than the third average cooling rate in the third temperature range.
又,考慮到可減小熱收縮率,第3溫度區域R3中之第3平均冷卻速度較佳為5℃/秒以下。又,第3平均冷卻速度之下限並無特別限制,但考慮到不對平板玻璃SG之路徑之長度進行變更,或考慮到可抑制玻璃基板之生產效率之降低,上述第3平均冷卻速度之下限例如較佳為0.5℃/秒以上。進而,根據保持生產性且減小熱收縮率之觀點,第3平均冷卻速度較佳為1℃/秒~4.5℃/秒。 In addition, in consideration of reducing the heat shrinkage rate, the third average cooling rate in the third temperature region R3 is preferably 5° C./sec or less. In addition, the lower limit of the third average cooling rate is not particularly limited, but considering that the length of the path of the plate glass SG is not changed, or considering that the reduction in the production efficiency of the glass substrate can be suppressed, the lower limit of the third average cooling rate is, for example, It is preferably 0.5°C/sec or more. Furthermore, from the viewpoint of maintaining productivity and reducing the heat shrinkage rate, the third average cooling rate is preferably 1°C/sec to 4.5°C/sec.
又,第1溫度區域R1中之第1平均冷卻速度例如較佳為5℃/秒~50℃/秒,更佳為15℃/秒~35℃/秒。第2溫度區域R2中之第2平均冷卻速度例如為5℃/秒以下,較佳為1℃/秒~5℃/秒,更佳為2℃/秒~5℃/秒。 In addition, the first average cooling rate in the first temperature region R1 is preferably, for example, 5°C/sec to 50°C/sec, and more preferably 15°C/sec to 35°C/sec. The second average cooling rate in the second temperature region R2 is, for example, 5°C/sec or less, preferably 1°C/sec to 5°C/sec, more preferably 2°C/sec to 5°C/sec.
又,如本實施形態般,考慮到不延長平板玻璃SG之路徑而降低熱收縮率,較佳為中心部C之溫度未達300℃且為100℃以上之第4溫度區域R4中之第4平均冷卻速度大於第3溫度區域R3中之第3平均冷卻速度。 In addition, as in the present embodiment, in consideration of lowering the heat shrinkage rate without extending the path of the sheet glass SG, it is preferable that the temperature in the central portion C does not reach 300°C and is the fourth in the fourth temperature region R4 of 100°C or more The average cooling rate is greater than the third average cooling rate in the third temperature region R3.
圖7所示之溫度歷程為中心部C處之溫度歷程,但對於偏離中心部C之中央區域CA之其他部分的寬度方向之相同位置之溫度之時間歷程而言,同樣,第3溫度區域R3中之平均冷卻速度亦最小。 The temperature history shown in FIG. 7 is the temperature history at the center portion C, but for the time history of the temperature at the same position in the width direction of the other parts of the center area CA of the center portion C, similarly, the third temperature area R3 The average cooling rate is also the smallest.
第1溫度區域R1~第4溫度區域R4中之第1平均冷卻速度~第4平
均冷卻速度為可藉由對第1冷卻室30及第2冷卻室80之環境溫度進行調整而獲得者,其為較常溫下之自然冷卻更小之速度。
The first average cooling rate in the first temperature region R1 to the fourth temperature region R4 to the fourth level
The average cooling rate is obtained by adjusting the ambient temperature of the
一般而言,玻璃為非晶質,對於高溫之玻璃而言,其分子構造會因熱而向最佳構造發生變化,即,進行熱緩和而收縮。因此,為了製作熱收縮率小之玻璃基板,較佳為以使平板玻璃SG之熱緩和充分地進行之方式而緩慢地進行冷卻。若平板玻璃SG之冷卻速度快,未充分地進行熱緩和而對平板玻璃SG進行冷卻,則於熱緩和之途中,玻璃內之分子構造之變化會因高黏性而被抑制或阻止。因此,若為了熱處理而對由如上所述之平板玻璃SG獲得之玻璃基板進行再加熱,則對於熱緩和之抑制或阻止被解除,從而會自熱緩和之途中再次開始熱緩和。 Generally speaking, glass is amorphous, and for high-temperature glass, its molecular structure changes to its optimal structure due to heat, that is, thermal relaxation and shrinkage. Therefore, in order to produce a glass substrate with a small heat shrinkage rate, it is preferable to cool slowly so that the heat of the sheet glass SG is sufficiently relaxed. If the cooling rate of the sheet glass SG is fast and the sheet glass SG is cooled without sufficient thermal relaxation, the change in molecular structure in the glass will be suppressed or prevented due to high viscosity during the thermal relaxation. Therefore, if the glass substrate obtained from the flat glass SG as described above is reheated for the purpose of heat treatment, the suppression or prevention of the heat relaxation is released, and the heat relaxation starts again from the way of the heat relaxation.
然而,玻璃具有速度不同之複數種緩和,玻璃之緩和可由具有不同緩和速度之緩和之重合表示(以下,將緩和速度不同之緩和稱為緩和之「成分」)。如上所述,作為玻璃之緩和成分,存在迅速進行熱緩和而進行收縮之成分、平穩地進行熱緩和而進行收縮之成分、進而以中間速度進行熱緩和而進行收縮之成分等多種成分。因此,於冷卻步驟中,較佳為設定如下溫度歷程,該溫度歷程使得熱緩和於全部之上述成分中充分地進行。然而,如圖4所示,冷卻步驟S4中之平板玻璃SG之路徑為自成形裝置40之鉛垂上方朝向下方之路徑,且設置於建築物等構造物內,因此,必需對建築物等構造物進行改建、擴建等而延長路徑,故而難以延長路徑。因此,較佳為於現有之搬送路徑中,適當地進行平板玻璃SG之溫度歷程,從而效率良好地減小冷卻步驟S4中之玻璃基板之熱收縮率。於本實施形態中,使第3溫度區域R3中之平均冷卻速度小於冷卻步驟S4中的第3溫度區域R3以外之溫度區域中之平均冷卻速度,藉此,可效率良好地減小玻璃基板之熱收縮率。該理由係以如下方式假定。
However, glass has multiple types of relaxations with different speeds, and the relaxation of glass can be expressed by the coincidence of relaxations with different relaxation speeds (hereinafter, the relaxations with different relaxation speeds are called "components" of relaxation). As described above, as the glass relaxing component, there are various components such as a component that rapidly thermally relaxes and shrinks, a component that smoothly thermally relaxes and shrinks, and a component that further thermally relaxes and shrinks at an intermediate speed. Therefore, in the cooling step, it is preferable to set a temperature history that sufficiently relaxes heat in all the above-mentioned components. However, as shown in FIG. 4, the path of the sheet glass SG in the cooling step S4 is a path from the vertical upward direction to the downward direction of the forming
圖8係橫軸表示時間、縱軸表示溫度之冷卻步驟S4中的平板玻璃SG於冷卻步驟中之溫度歷程T1~T3(實線)之模式圖。圖中之時間點A、E對應於圖7中之時間點A、E。此處,溫度歷程T1為本實施形態之溫度歷程之一例,溫度歷程T2為如下形態,即,於高溫狀態下,相對於溫度歷程T1而減小冷卻速度,其後,相對於溫度歷程T1而增大冷卻速度,其後,使冷卻速度成為與溫度歷程T1同等之冷卻速度之形態,溫度歷程T3為如下形態,即,於高溫狀態下達到與溫度歷程T1同等之冷卻速度,其後,相對於溫度歷程T1而減小冷卻速度,其後,相對於溫度歷程T1而增大冷卻速度。 8 is a schematic diagram of the temperature history T1 to T3 (solid line) in the cooling step of the sheet glass SG in the cooling step S4 in which the horizontal axis represents time and the vertical axis represents temperature. Time points A and E in the figure correspond to time points A and E in FIG. 7. Here, the temperature history T1 is an example of the temperature history of the embodiment, and the temperature history T2 is a form in which the cooling rate is reduced relative to the temperature history T1 in a high temperature state, and thereafter, relative to the temperature history T1 Increase the cooling rate, and then make the cooling rate equal to the cooling rate of the temperature history T1. The temperature history T3 is in the form of reaching the cooling rate equivalent to the temperature history T1 in a high temperature state. The cooling rate is decreased during the temperature history T1, and thereafter, the cooling rate is increased relative to the temperature history T1.
對於溫度歷程T1、T3而言,上述平穩地進行熱緩和而進行收縮之成分(將該成分稱為成分X)無法追隨高溫狀態下之冷卻速度,於點P1處,與成分X相關之分子構造之變化因黏性而被抑制或阻止。對於溫度歷程T2而言,高溫狀態之冷卻速度小,因此,於點P2處,與成分X相關之分子構造之變化因黏性而被抑制或阻止。 For the temperature histories T1 and T3, the above-mentioned component that thermally relaxes and shrinks smoothly (this component is referred to as component X) cannot follow the cooling rate in a high-temperature state, and at point P1, the molecular structure related to component X The change is suppressed or prevented due to viscosity. For the temperature history T2, the cooling rate in the high-temperature state is small. Therefore, at the point P2, the change in molecular structure related to the component X is suppressed or prevented due to the viscosity.
另一方面,對於溫度歷程T1而言,迅速進行熱緩和而進行收縮之成分(將該成分稱為成分Y)於點P3處無法追隨冷卻速度,於點P3處,與成分Y相關之分子構造之變化(熱緩和)因黏性而被抑制或阻止。對於溫度歷程T2而言,成分Y於點P4處無法追隨冷卻速度,於點P4處,與成分Y相關之分子構造之變化(熱緩和)因黏性而被抑制或阻止。對於溫度歷程T3而言,成分Y於點P5處無法追隨冷卻速度,於點P5處,與成分Y相關之分子構造之變化(熱緩和)因黏性而被抑制或阻止。 On the other hand, in the temperature history T1, a component that rapidly thermally relaxes and shrinks (this component is referred to as component Y) cannot follow the cooling rate at point P3, and at point P3, the molecular structure related to component Y The change (heat relaxation) is suppressed or prevented due to viscosity. For temperature history T2, component Y cannot follow the cooling rate at point P4, and at point P4, the molecular structure change (heat relaxation) related to component Y is suppressed or prevented due to viscosity. For temperature history T3, component Y cannot follow the cooling rate at point P5, and at point P5, the molecular structure change (heat relaxation) related to component Y is suppressed or prevented due to viscosity.
對於如上所述之溫度歷程T1~T3而言,點P1、P2處之分子構造之變化(熱緩和)被抑制或阻止時之溫度於點P1、P2之間並無太大不同,但與成分Y相關之分子構造之變化受到抑制之點P3~P5處的溫度大不相同。具體而言,點P3處之溫度最低。因此,對於溫度歷程T1 ~T3而言,抑制或阻止熱緩和之溫度越低,則熱緩和越快,因此,與成分Y相關之分子構造之變化被抑制或阻止之時間點之溫度越低,則可使熱收縮率越小。因此,溫度歷程T1~T3中,以最低溫度抑制或阻止與成分Y相關之分子構造之變化之溫度歷程T1可於平板玻璃SG被切斷之前,充分地進行熱緩和,藉此,可提供效率良好地減小了熱收縮率之平板玻璃SG。 For the temperature history T1~T3 as described above, the temperature at which the molecular structure change (heat relaxation) at points P1 and P2 is suppressed or prevented is not much different between points P1 and P2, but it is different from the composition The temperature at points P3~P5 where the changes in the molecular structure related to Y are suppressed is very different. Specifically, the temperature at the point P3 is the lowest. Therefore, for the temperature history T1 In terms of ~T3, the lower the temperature for suppressing or preventing thermal relaxation, the faster the thermal relaxation. Therefore, the lower the temperature at the time point when the molecular structure change related to component Y is suppressed or prevented, the thermal shrinkage rate can be The smaller. Therefore, in the temperature history T1 to T3, the temperature history T1 that suppresses or prevents the change of the molecular structure related to the component Y at the lowest temperature can sufficiently thermally relax before the flat glass SG is cut, thereby providing efficiency Flat glass SG with a good thermal shrinkage reduction.
再者,可以使平板玻璃SG之熱收縮率達到特定之目標值之方式而設定第1溫度區域~第4溫度區域中之第1平均冷卻速度~第4平均冷卻速度。例如,於複數種冷卻條件下,實際對平板玻璃SG之熱收縮率進行測定,基於所獲得之測定值而製成校準曲線。進而,可以使平板玻璃SG之熱收縮率達到特定之目標值之方式,使用製成之校準曲線,對所設定之平板玻璃SG之寬度方向之成為目標之溫度分佈TP1~TP10的沿著流動方向之溫度分佈進行調整,藉此,設定第1溫度區域~第4溫度區域中之第1平均冷卻速度~第4平均冷卻速度。 In addition, the first average cooling rate to the fourth average cooling rate in the first temperature range to the fourth temperature range may be set such that the thermal shrinkage rate of the sheet glass SG reaches a specific target value. For example, under a plurality of cooling conditions, the thermal shrinkage rate of the flat glass SG is actually measured, and a calibration curve is prepared based on the obtained measured value. Furthermore, the thermal shrinkage of the plate glass SG can reach a specific target value, using the calibration curve made, along the flow direction of the target temperature distribution TP1~TP10 in the width direction of the set plate glass SG The temperature distribution is adjusted to thereby set the first average cooling rate to the fourth average cooling rate in the first temperature range to the fourth temperature range.
於本實施形態中,將第3溫度區域R3之溫度範圍設為未達450℃且為300℃以上,但當應用於用以按照特定之處理溫度實施熱處理而於表面形成薄膜之顯示器用玻璃基板時,亦可將第3溫度區域R3設為未達(處理溫度-100℃)且為(上述處理溫度-250℃)以上之溫度區域。於該情形時,處理溫度較佳為300℃以上,更佳為400℃以上。 In the present embodiment, the temperature range of the third temperature region R3 is set to not more than 450°C and not less than 300°C, but when it is applied to a glass substrate for a display for forming a thin film on the surface by performing heat treatment at a specific processing temperature In this case, the third temperature region R3 may be set to a temperature region not exceeding (treatment temperature-100°C) and not less than (the treatment temperature-250°C). In this case, the treatment temperature is preferably 300°C or higher, and more preferably 400°C or higher.
例如,於玻璃基板之表面形成低溫多晶矽TFT(Thin Film Transistor,薄膜電晶體)等TFT、或IGZO(銦、鎵、鋅、氧)等氧化物半導體所代表之薄膜。當形成該半導體等薄膜時,例如以300℃以上或400℃以上之處理溫度而對玻璃基板進行熱處理。因此,對於玻璃基板而言,可根據上述熱處理之處理溫度而決定第3溫度區域R3之溫度範圍。再者,形成薄膜時之熱處理之處理溫度例如為300℃~700℃或400℃~650℃。 For example, TFTs such as low-temperature polysilicon TFT (Thin Film Transistor) and thin films represented by oxide semiconductors such as IGZO (Indium, Gallium, Zinc, Oxygen) are formed on the surface of a glass substrate. When forming a thin film such as a semiconductor, for example, the glass substrate is heat-treated at a processing temperature of 300°C or higher or 400°C or higher. Therefore, for the glass substrate, the temperature range of the third temperature region R3 can be determined according to the processing temperature of the heat treatment. Furthermore, the processing temperature of the heat treatment when forming the thin film is, for example, 300°C to 700°C or 400°C to 650°C.
於上述情形時,當於形成平板玻璃SG之後,將中心部C之溫度為緩冷點以上之溫度區域設為第1溫度區域R1,且將中心部C之溫度未達緩冷點(處理溫度(℃)-100℃)以上之溫度區域設為第2溫度區域R2時,較佳為第3溫度區域R3中之第3平均冷卻速度小於第1溫度區域R1中之第1平均冷卻速度及第2溫度區域R2中之第2平均冷卻速度。 In the above case, after forming the sheet glass SG, the temperature region where the temperature of the central portion C is above the slow cooling point is set as the first temperature region R1, and the temperature of the central portion C is not reached the slow cooling point (processing temperature (℃)-100℃) When the temperature region above is set as the second temperature region R2, it is preferable that the third average cooling rate in the third temperature region R3 is lower than the first average cooling rate and the first in the first temperature region R1 2 The second average cooling rate in the temperature region R2.
又,將中心部C之溫度未達(處理溫度(℃)-250℃)且為(處理溫度(℃)-450℃)以上之溫度區域設為第4溫度區域R4,考慮到不延長搬送路徑而減小熱收縮率,較佳為第4溫度區域R4中之第4平均冷卻速度大於第3溫度區域R3中之第3平均冷卻速度。 In addition, the temperature region of the temperature of the central portion C that does not reach (processing temperature (°C)-250°C) and above (processing temperature (°C)-450°C) is set as the fourth temperature region R4, considering that the conveying path is not extended In order to reduce the heat shrinkage rate, it is preferable that the fourth average cooling rate in the fourth temperature region R4 is greater than the third average cooling rate in the third temperature region R3.
於本實施形態中,考慮到可提供適合作為顯示器用玻璃基板之玻璃基板,較佳為於冷卻步驟S4中決定如上所述之溫度歷程,藉此,將玻璃基板之熱收縮率設為15ppm以下。更佳為將玻璃基板之熱收縮率設為10ppm以下。 In this embodiment, in consideration of providing a glass substrate suitable as a glass substrate for a display, it is preferable to determine the temperature history as described above in the cooling step S4, thereby setting the thermal shrinkage rate of the glass substrate to 15 ppm or less . More preferably, the thermal shrinkage rate of the glass substrate is 10 ppm or less.
又,根據減小玻璃基板之熱收縮率之觀點,玻璃基板之應變點(玻璃黏度為1014.5泊時之溫度)較佳為680℃以上,更佳為700℃以上,進而較佳為720℃以上。然而,若以使應變點升高之方式而對玻璃組成進行調整,則存在失透溫度升高之傾向,因此,玻璃基板之應變點之上限較佳為780℃以下,更佳為760℃以下。 In addition, from the viewpoint of reducing the thermal shrinkage rate of the glass substrate, the strain point of the glass substrate (the temperature at which the glass viscosity is 10 14.5 poise) is preferably 680°C or higher, more preferably 700°C or higher, and further preferably 720°C the above. However, if the glass composition is adjusted to increase the strain point, the devitrification temperature tends to increase. Therefore, the upper limit of the strain point of the glass substrate is preferably 780°C or less, and more preferably 760°C or less .
再者,失透溫度較佳為1280℃以下,根據兼顧熱收縮率之減小與耐失透性之觀點,較佳為1100℃~1270℃,更佳為1150℃~1240℃。 In addition, the devitrification temperature is preferably 1280° C. or lower. From the viewpoint of taking into consideration the reduction in heat shrinkage rate and devitrification resistance, it is preferably 1100° C. to 1270° C., and more preferably 1150° C. to 1240° C.
(玻璃組成) (Glass composition)
作為本實施形態所製造之玻璃基板之玻璃組成,例如以莫耳%顯示而例示以下之玻璃組成。 As the glass composition of the glass substrate manufactured in this embodiment, for example, the following glass compositions are exemplified in mole %.
包含SiO2 55%~80%、 B2O3 0%~18%、Al2O3 3%~20%、MgO 0%~20%、CaO 0%~20%、SrO 0%~20%、BaO 0%~20%、RO 5%~25%(其中,R為選自Mg、Ca、Sr及Ba之至少一種元素)、R'2O 0%~2.0%(其中R'為選自Li、Na及K之至少一種元素)。 Including SiO 2 55%~80%, B 2 O 3 0%~18%, Al 2 O 3 3%~20%, MgO 0%~20%, CaO 0%~20%, SrO 0%~20%, BaO 0% ~ 20%, RO 5% ~ 25% ( wherein, R is at least one element selected from Mg, Ca, Sr, and Ba of), R '2 O 0% ~ 2.0% ( wherein R' is selected from Li , Na and K at least one element).
熔融玻璃中之價數變動之金屬之氧化物的合計含有率並無特別限制,例如亦可含有0.05%~1.5%。又,較佳為實質上不含有As2O3、Sb2O3及PbO。 The total content rate of the metal oxides in which the price value in the molten glass changes is not particularly limited. For example, it may contain 0.05% to 1.5%. Furthermore, it is preferable that As 2 O 3 , Sb 2 O 3 and PbO are not substantially contained.
(玻璃基板之應用例) (Application example of glass substrate)
本實施形態之玻璃基板之製造方法所製造之玻璃基板尤其適合作為液晶顯示器、電漿顯示器、有機EL顯示器等之顯示器用玻璃基板或保護顯示器之覆蓋玻璃。使用顯示器用玻璃基板之顯示器中,除了包含顯示器表面平坦之平板顯示器之外,亦包含有機EL顯示器、液晶顯示器即顯示器表面彎曲之曲面顯示器。玻璃基板較佳為用作高精細顯示器用玻璃基板,例如用作液晶顯示器用玻璃基板、有機EL(Electro-Luminescence,有機電致發光)顯示器用玻璃基板、LTPS(Low Temperature Poly-silicon,低溫多晶矽)薄膜半導體、或使用有IGZO(Indium、Gallium、Zinc、Oxide,銦鎵鋅氧化物)等氧化物半導體之顯示器用玻璃基板。 The glass substrate manufactured by the manufacturing method of the glass substrate of this embodiment is particularly suitable as a glass substrate for a display of a liquid crystal display, a plasma display, an organic EL display, etc., or a cover glass for protecting a display. A display using a glass substrate for a display includes, in addition to a flat display with a flat display surface, an organic EL display, a liquid crystal display, or a curved display with a curved display surface. The glass substrate is preferably used as a glass substrate for high-definition displays, for example, as a glass substrate for liquid crystal displays, a glass substrate for organic EL (Electro-Luminescence) displays, and LTPS (Low Temperature Poly-silicon) ) Thin-film semiconductors, or glass substrates for displays using oxide semiconductors such as IGZO (Indium, Gallium, Zinc, Oxide, indium gallium zinc oxide).
可使用無鹼玻璃或含有微量鹼之玻璃作為顯示器用玻璃基板。顯示器用玻璃基板於高溫時之黏性高。例如,具有102.5泊之黏性之熔 融玻璃之溫度為1500℃以上。再者,無鹼玻璃為實質上不含有鹼金屬氧化物(R'2O)之組成之玻璃。所謂實質上不含有鹼金屬氧化物,係指除了自原料等混入之雜質之外,未添加鹼金屬氧化物作為玻璃原料之組成之玻璃,例如鹼金屬氧化物之含有量未達0.1質量%。 Alkali-free glass or glass containing a small amount of alkali can be used as a glass substrate for displays. The glass substrate for display has high viscosity at high temperature. For example, the temperature of molten glass with a viscosity of 10 2.5 poise is above 1500°C. Furthermore, the alkali-free glass is a glass that does not substantially contain a composition of alkali metal oxide (R′ 2 O). The term "substantially does not contain alkali metal oxides" refers to glass that does not contain alkali metal oxides as a glass raw material except for impurities mixed from raw materials. For example, the content of alkali metal oxides is less than 0.1% by mass.
(熱收縮率) (Heat shrinkage)
進行熱處理而測定本實施形態中之熱收縮率。 Heat treatment was performed to measure the heat shrinkage rate in this embodiment.
將玻璃基板切割為特定尺寸之長方形,於長邊兩端部劃上刻劃線,於短邊中央部進行切斷而一分為二,獲得兩個玻璃樣本。對其中之一玻璃樣本進行熱處理(500℃、30分鐘)。測量未進行熱處理之另一玻璃樣本之長度。進而,對照經熱處理之玻璃樣本與未處理之玻璃樣本,利用雷射顯微鏡等對刻劃線之偏移量進行測定,求出玻璃樣本之長度之差分,藉此,可求出樣本之熱收縮量。使用該熱收縮量即差分與熱處理前之玻璃樣本之長度,根據以下之式子而求出熱收縮率。將該玻璃樣本之熱收縮率設為玻璃基板之熱收縮率。 The glass substrate was cut into rectangles of a specific size, scored on both ends of the long side, cut at the center of the short side, and divided into two to obtain two glass samples. One of the glass samples was heat-treated (500°C, 30 minutes). Measure the length of another glass sample without heat treatment. Furthermore, by comparing the heat-treated glass sample and the untreated glass sample, the deviation of the scribed line is measured using a laser microscope, etc., and the difference in the length of the glass sample is obtained, whereby the thermal shrinkage of the sample can be obtained the amount. Using the heat shrinkage amount, that is, the difference and the length of the glass sample before heat treatment, the heat shrinkage rate was determined according to the following formula. The thermal contraction rate of this glass sample is set as the thermal contraction rate of the glass substrate.
熱收縮率(ppm)=(差分)/(熱處理前之玻璃樣本之長度)×106 Thermal shrinkage (ppm) = (differential) / (length of glass sample before heat treatment) × 10 6
使用上述玻璃基板製造裝置100及玻璃基板之製造方法,於以下之條件下製造實施例1~3及比較例之玻璃基板。玻璃之組成(莫耳%)為SiO2 70.5%、B2O3 7.2%、Al2O3 11.0%、K2O 0.2%、CaO 11.0%、SnO2 0.09%、Fe2O3 0.01%。玻璃之失透溫度為1206℃,液相黏度為1.9×105dPa‧s。玻璃之緩冷點為758℃,應變點為699℃。又,平板玻璃SG之寬度設為1600mm,厚度設為0.7mm(實施例1、比較例1)、0.5mm(實施例2、比較例2)、0.4mm(實施例3、比較例3)。又,用以於玻璃基板形成薄膜之熱處理溫度為550℃。
Using the glass
將平板玻璃SG之寬度方向之中心部C之溫度為緩冷點以上時的平均冷卻速度設為第1平均冷卻速度,將中心部C之溫度未達緩冷點且 為450℃以上時之平均冷卻速度設為第2平均冷卻速度,將中心部C之溫度未達450℃且為300℃以上時之平均冷卻速度設為第3平均冷卻速度。於實施例1~3中,第3平均冷卻速度較第1平均冷卻速度及第2平均冷卻速度更慢。另一方面,於比較例1~3中,使第2平均冷卻速度較實施例1~3之第2平均冷卻速度更慢,且使第3平均冷卻速度較實施例1~3之第3平均冷卻速度更快,因此,比較例1~3之第2平均冷卻速度較比較例1~3之第3平均冷卻速度更慢。其結果,實施例1~3之熱收縮率為15ppm以下,但比較例1~3之熱收縮率超過15ppm。 The average cooling rate when the temperature of the central portion C in the width direction of the sheet glass SG is equal to or higher than the slow cooling point is set as the first average cooling rate, and the temperature of the central portion C does not reach the slow cooling point and The average cooling rate when the temperature is 450° C. or higher is the second average cooling rate, and the average cooling rate when the temperature of the central portion C is 450° C. or less and 300° C. or higher is the third average cooling rate. In Examples 1 to 3, the third average cooling rate is slower than the first average cooling rate and the second average cooling rate. On the other hand, in Comparative Examples 1 to 3, the second average cooling rate is slower than the second average cooling rate of Examples 1 to 3, and the third average cooling rate is lower than the third average of Examples 1 to 3 The cooling rate is faster, so the second average cooling rate of Comparative Examples 1 to 3 is slower than the third average cooling rate of Comparative Examples 1 to 3. As a result, the thermal shrinkage of Examples 1 to 3 is 15 ppm or less, but the thermal shrinkage of Comparative Examples 1 to 3 exceeds 15 ppm.
根據上述內容,本實施形態之效果顯而易見。 Based on the above, the effect of this embodiment is obvious.
以上,詳細地對本發明之玻璃基板之製造方法進行了說明,但本發明並不限定於上述實施形態及實施例,當然亦可於不脫離本發明宗旨之範圍內進行各種改良或變更。 The method of manufacturing the glass substrate of the present invention has been described in detail above, but the present invention is not limited to the above-mentioned embodiments and examples, and of course various improvements or changes can be made without departing from the scope of the present invention.
A~E‧‧‧時間點 A~E‧‧‧time
R1‧‧‧第1溫度區域 R1‧‧‧1st temperature zone
R2‧‧‧第2溫度區域 R2‧‧‧Second temperature zone
R3‧‧‧第3溫度區域 R3‧‧‧The third temperature zone
R4‧‧‧第4溫度區域 R4‧‧‧4th temperature zone
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