TWI695299B - Touch panel sensor and touch panel - Google Patents

Abstract

The invention aims to reduce the decreasing over time in the electrical conductivity of at least the wire on the outermost side. A touch panel sensor 4 has a wire group comprising at least wires 21~26 and wires 31~36 provided around the electrodes 10 on a substrate surface 91a and connecting with respective electrode 10, and wires 41~46 and wires 51~56 provided around the electrodes 11 on a substrate surface 92a and connecting with respective electrode 11. The outside wire 61 on the outer most side of the substrate surface 91a provided with at least wire group, and the outside wire 62 on the outer most side of the substrate surface 92a provided with at least wire group are formed by metals of which the electrical conductivity drop due to combination with the constituents intruding through the clearance between the substrate surface and adhesive agent 93, and the outside wires 61 and 62 have slits.

Description

Touch panel sensor and touch panel

The present invention relates to a touch panel sensor and a touch panel that output a signal, and the signal corresponds to a position where an external object performs an input operation.

In the past, the following touch panel is known: it detects a position input by an external object such as a finger and operates, and outputs a signal corresponding to the detected position. For such a touch panel, there are a resistive film method and an electrostatic capacitance method according to the detection method of the position subjected to the input operation.

A touch panel such as a resistive film method and an electrostatic capacitance method includes: an insulating substrate; a plurality of electrodes provided on the insulating substrate and arranged in mutually orthogonal directions; and a wiring pattern connected to each electrode and being insulated The substrate is formed so as to surround the periphery of the electrode from each electrode to a wiring substrate (also referred to as a connector tail) that is a lead-out portion that extracts a signal to the outside.

Such a wiring pattern, depending on the metal forming the wiring pattern, is combined with components such as sulfur contained in the atmosphere, and the conductivity is impaired. On the other hand, in the above-mentioned touch panel, since the protective layer is provided on the electrode and the wiring pattern, and the insulating substrate and the protective layer are laminated by bonding, the entire wiring pattern does not come into contact with the atmosphere.

However, since the outer edges of the insulating substrate, the protective layer, etc. are in contact with the atmosphere, the wiring pattern exposed from the outer edge or the wiring pattern close to the outer edge may be used in an environment where there is a lot of moisture and gas around. In this way, the metal forming the wiring pattern is combined with the components contained in the atmosphere, and a compound that hinders conductivity is gradually generated toward the inside as time passes, so the conductivity is impaired.

In response to this, Patent Document 1 discloses a touch panel having a structure in which a portion where an electrode is exposed to the outside is encapsulated with an elastic adhesive. According to the touch panel disclosed in Patent Document 1, the portion where the electrode is exposed to the outside is covered with an elastic adhesive, so it can be suppressed even when it is used in an environment where there is a lot of moisture and gas around The combination of the metal forming the wiring pattern and the components in the atmosphere. [Prior Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Unexamined Patent Publication No. 2007-156600

[Problems to be Solved by the Invention] However, Patent Document 1 has the following problem: In order not to affect the performance or appearance of the product, it is necessary to apply the elastic adhesive uniformly, and it is necessary to accurately manage the amount of application of the elastic adhesive . In particular, in the case where a wiring pattern is provided around the electrode, in the structure of Patent Document 1, it is necessary to widely apply an elastic adhesive along the outermost wiring pattern that is easily in contact with components in the atmosphere, so that The problem is obvious and difficult to realize, and further there is a problem that the combination of the metal forming the wiring pattern and the components in the atmosphere cannot be suppressed, and the wiring pattern cannot be maintained in a state having a predetermined conductivity.

An object of the present invention is to provide a touch panel sensor and a touch panel which can at least suppress the combination of at least the metal forming the outermost wiring around the electrode provided on the substrate surface and the components in the atmosphere The conductivity of the outermost wiring decreases with time. [How to solve the problem]

The touch panel sensor of the present invention is a touch panel sensor for a touch panel. The touch panel outputs a signal corresponding to a position input by an external object. It has: an insulating substrate; Electrodes arranged on the substrate surface of the insulating substrate in an insulated state; a wiring group provided around the electrode on the substrate surface and including at least wiring connected to the electrode; and an insulating coating layer The electrode and the wiring group are covered; and at least the wiring located on the outermost side of the substrate surface where the wiring group is provided in the wiring group is caused by the conductivity and the component invading from between the substrate surface and the cladding layer The metal that is lowered by compounding is formed and has a slit.

The touch panel of the present invention is a touch panel. The touch panel outputs a signal corresponding to a position input by an external object. The touch panel has: an insulating substrate; and a plurality of electrodes, which are arranged in the insulated state in a mutually insulated state A substrate surface of the substrate; a wiring group provided around the electrode on the substrate surface and including at least wiring connected to the electrode; and an insulating coating covering the electrode and the wiring group; and at least the wiring The wiring located on the outermost side of the substrate surface on which the wiring group is provided in the group is formed of a metal whose conductivity is reduced due to a compound that invades between the substrate surface and the cladding layer and has a slit.

The components in the atmosphere that invade the interior from between the substrate surface of the insulating substrate and the cladding layer reach the outermost wiring, so the metal forming the outermost wiring is combined with the components in the atmosphere from the outer edge side of the outermost wiring The end of the is gradually formed toward the inside of the compound that hinders conductivity. In this process, at least the slit is used to hinder the combination of the metal forming the outermost wiring and the components in the atmosphere, thereby suppressing at least the formation of the outermost wiring All or most of the metal is combined with components in the atmosphere. [Effect of invention]

According to the present invention, by at least suppressing the combination of the metal forming the outermost wiring around the electrode provided on the substrate surface and the components in the atmosphere, at least the conductivity of the outermost wiring can be suppressed from decreasing with time.

[Best Mode for Carrying Out the Invention] Hereinafter, the touch panel sensor and the touch panel according to the embodiments of the present invention will be described in detail with reference to the drawings. In the figure, the x-axis, y-axis, and z-axis form a three-axis orthogonal coordinate system, with the positive direction of the y-axis as the front, the negative direction of the y-axis as the rear, the x-axis direction as the left-right direction, and the z-axis The positive direction is referred to as upward, and the negative direction of the z axis is referred to as downward.

(First Embodiment) <Structure of Electronic Device> Hereinafter, the structure of an electronic device 1 according to a first embodiment of the present invention will be described in detail with reference to FIG. 1.

The electronic device 1 is a mobile terminal, a car navigation device, or the like. The electronic device 1 has a housing 2, a display panel 3, a touch panel sensor 4, a wiring substrate 5, an adhesive 6 and a protective plate 7. The touch panel sensor 4, the wiring substrate 5, and peripheral circuits (not shown) provided around the touch panel sensor 4 constitute a touch panel.

The case 2 is formed of synthetic resin, and the display panel 3 and the touch panel sensor 4 are mounted.

The display panel 3 can display images such as maps by execution of display control processing in a microcomputer or the like (not shown). Here, the display panel 3 is an example of a liquid crystal display panel.

The touch panel sensor 4 is disposed above the display panel 3. The touch panel sensor 4 has an input operation area, and receives input operations from external objects such as a finger or a pen via the protective plate 7 and the adhesive 6. The touch panel sensor 4 has a structure in which a transparent substrate and a transparent electrode are fixed and laminated with a transparent adhesive, and the display panel 3 can be observed and confirmed from above.

The touch panel sensor 4 detects the position subjected to the input operation by means of electrostatic capacitance, and outputs a signal corresponding to the position subjected to the input operation to the wiring substrate 5. Specifically, the touch panel sensor 4 detects a change in the electrostatic capacitance between the object and the electrode that increases when the object approaches for the input operation, and detects the position subjected to the input operation based on the change. In addition, the structure of the touch panel sensor 4 will be described in detail below.

The wiring substrate 5 is connected to the touch panel sensor 4 and outputs a signal output from the touch panel sensor 4 to the outside.

The adhesive 6 adheres the protection plate 7 above the touch panel sensor 4. The adhesive 6 is a transparent adhesive, and the display panel 3 and the touch panel sensor 4 can be confirmed from above.

The protective plate 7 is installed above the touch panel sensor 4 with an adhesive 6 to protect the touch panel sensor 4. The protective plate 7 is formed of a transparent material, and the display panel 3 and the touch panel sensor 4 can be observed and confirmed through the adhesive 6 from above.

<Structure of Touch Panel Sensor> Hereinafter, the structure of the touch panel sensor 4 according to the first embodiment of the present invention will be described in detail with reference to FIGS. 2 to 4. In addition, in FIGS. 3 and 4, the description of the slits provided in the outer wiring 61 and the outer wiring 62 is omitted.

The touch panel sensor 4 has a lower insulating substrate 91, an upper insulating substrate 92, and an adhesive 93.

The lower insulating substrate 91 is a translucent substrate such as a glass substrate. The electrode 10, the wirings 21 to 26, the wirings 31 to 36, and the outer wiring 61 are provided on the substrate surface 91a of the lower insulating substrate 91.

The electrode 10 is a transparent electrode formed on the substrate surface 91a of the lower insulating substrate 91 using a transparent conductive material, and is arranged in the front-rear direction and the left-right direction under the input operation area by an external object. The electrodes 10 arranged in the left-right direction are connected to each other, but the illustration is omitted. The electrodes 10 arranged in the front-rear direction are insulated from each other. Here, an example of a transparent conductive material is ITO (Indium Tin Oxide, indium tin oxide).

The wirings 21 to 26 are insulated from each other, and include external connection portions 21 a to 26 a connected to the wiring board 5. The wirings 21 to 26 are respectively connected to the electrodes 10 arranged at one end in the left-right direction, and are provided so as to surround the electrodes 10 around the substrate surface 91 a of the lower insulating substrate 91 from the electrodes 10 to the external connection portions 21 a to 26 a. The wirings 21 to 26 are formed of a metal whose conductivity is reduced by a compound that invades from between the substrate surface 91a and the adhesive 93, and is formed to the substrate surface 91a by printing. Here, the component combined with the metal forming the wirings 21 to 26 is typically a sulfur component or an oxygen component. The wirings 21 to 26 are preferably made of silver (Ag) or copper (Cu). In addition, the formation of the wirings 21 to 26 by printing is an example, and a thin film can also be formed by sputtering, and the wirings 21 to 26 can also be formed by methods such as photolithography.

The wirings 31 to 36 are insulated from each other and the wirings 21 to 26, and include external connection portions 31a to 36a connected to the wiring board 5. The wirings 31 to 36 are respectively connected to the electrodes 10 arranged at the other end in the left-right direction, and are provided so as to surround the electrodes 10 on the substrate surface 91 a of the lower insulating substrate 91 from the electrodes 10 to the external connection portions 31 a to 36 a. . The wirings 31 to 36 are formed of a metal whose conductivity is reduced by combining with components that invade from between the substrate surface 91a and the adhesive 93, and are formed to the substrate surface 91a by printing. Here, the component combined with the metal forming the wirings 31 to 36 is typically a sulfur component or an oxygen component. The wirings 31 to 36 are preferably made of silver or copper.

The outer wiring 61 is provided so as to surround the periphery of the electrode 10 on the substrate surface 91a of the lower insulating substrate 91, and is provided at a position outside the wirings 21 to 26 and the wirings 31 to 36 along the outer edge of the substrate surface 91a. The outer wiring 61 is provided on the outermost side of the wiring arranged on the substrate surface 91a. The width of the outer wiring 61, that is, the length in the direction orthogonal to the extending direction and parallel to the substrate surface 91a is larger than the width of the wirings 21 to 26 and larger than the width of the wirings 31 to 36. The outer wiring 61 is grounded, and is provided to prevent extraneous noise generated on the wiring 21 to 26, the wiring 31 to 36, or the electrode 10. In the capacitive touch panel sensor 4 in which a low-level signal flows from the electrode 10 to the wirings 21 to 26 and the wirings 31 to 36, by providing a grounded outer wiring 61, the detection performance can be improved.

The outer wiring 61 is formed of a metal whose conductivity is reduced by combining with a component that penetrates between the substrate surface 91a and the adhesive 93, and is formed on the substrate surface 91a by printing. Here, the component combined with the metal forming the outer wiring 61 is typically a sulfur component or an oxygen component. The outer wiring 61 is preferably made of silver or copper.

The upper insulating substrate 92 is a translucent substrate such as a glass substrate. The electrode 11, the wirings 41 to 46, the wirings 51 to 56 and the outer wiring 62 are provided on the substrate surface 92 a of the upper insulating substrate 92.

The electrode 11 is a transparent electrode formed on the substrate surface 92a of the lower insulating substrate 91 using a transparent conductive material, and is arranged in the front-rear direction and the left-right direction under the input operation area using an external object. The electrodes 11 arranged in the front-rear direction are connected to each other, but illustration is omitted for this. The electrodes 11 arranged in the left-right direction are insulated from each other. The electrode 11 is insulated from the electrode 10 by the adhesive 93, and is arranged in a matrix together with the electrode 10 when viewed from above.

The wirings 41 to 46 are insulated from each other and insulated from the wirings 21 to 26 and the wirings 31 to 36 by the adhesive 93, and have external connection portions 41a to 46a connected to the wiring board 5. The wirings 41 to 46 are respectively connected to the electrodes 11 arranged at one end in the front-rear direction, and are provided from each electrode 11 to the external connection portions 41 a to 46 a so as to surround the periphery of the electrode 11 on the substrate surface 92 a of the lower insulating substrate 91. The wirings 41 to 46 are formed of a metal whose conductivity is reduced by combining with a component that invades from between the substrate surface 92a and the adhesive 93, and is formed by printing the substrate surface 92a. Here, the component combined with the metal forming the wirings 41 to 46 is typically a sulfur component or an oxygen component. The wirings 41 to 46 are preferably made of silver or copper.

The wirings 51 to 56 are insulated from each other and from the wirings 41 to 46, and are insulated from the wirings 21 to 26 and the wirings 31 to 36 by the adhesive 93. The wirings 51 to 56 include external connection portions 51 a to 56 a connected to the wiring board 5. The wirings 51 to 56 are respectively connected to the electrodes 11 arranged at the other end in the front-rear direction, and are provided so as to surround the electrodes 11 around the substrate surface 92 a of the lower insulating substrate 91 from the electrodes 11 to the external connection portions 51 a to 56 a. The wirings 51 to 56 are formed of a metal whose conductivity is reduced by combining with components that invade between the substrate surface 92a and the adhesive 93, and are formed by printing the substrate surface 92a. Here, the component combined with the metal forming the wirings 51 to 56 is typically a sulfur component or an oxygen component. The wirings 51 to 56 are preferably made of silver or copper.

The outer wiring 62 is provided so as to surround the periphery of the electrode 11 on the substrate surface 92a of the upper insulating substrate 92, and is provided at a position outside the wirings 41 to 46 and the wirings 51 to 56 along the outer edge of the substrate surface 92a. The outer wiring 62 is arranged on the outermost side of the wiring arranged on the substrate surface 92a. The width of the outer wiring 62 is larger than the width of the wirings 41 to 46 and larger than the width of the wirings 51 to 56. The outer wiring 62 is insulated from the outer wiring 61 by the adhesive 93. The outer wiring 62 is grounded and provided to prevent extraneous noise generated on the wirings 41 to 46, the wirings 51 to 56 or the electrode 11. In the capacitive touch panel sensor 4 in which a low-level signal flows from the electrode 11 to the wirings 41 to 46 and the wirings 51 to 56, the grounding outer wiring 62 can be provided to improve the detection performance.

The outer wiring 62 is formed of a metal whose conductivity is reduced by a compound that invades from between the substrate surface 92a and the adhesive 93, and is formed to the substrate surface 92a by printing. Here, the component combined with the metal forming the outer wiring 62 is typically a sulfur component or an oxygen component. The outer wiring 62 is preferably made of silver or copper.

The adhesive 93 is made of an insulating material, adheres to and fixes the lower insulating substrate 91 and the upper insulating substrate 92, and serves to coat and protect the electrode 10, the electrode 11, the wirings 21 to 26, the wiring 31 to 36, The coating layers of the wirings 41 to 46, the wirings 51 to 56, the outer wiring 61, and the outer wiring 62 function. In addition, the adhesive 93 does not necessarily have to function as a coating layer, and the protective electrode 10, the electrode 11, the wirings 21 to 26, the wirings 31 to 36, the wirings 41 to 46, the wirings 51 to 56, and the outer wirings may be formed first 61 and the coating layer for the purpose of the outer wiring 62, and then the adhesive 93 is used to bond the lower insulating substrate 91 and the upper insulating substrate 92.

In the touch panel sensor 4 having the above structure, the wirings 21 to 26, the wirings 31 to 36 and the outer wiring 61 provided on the substrate surface 91 a of the lower insulating substrate 91 and the substrate surface provided on the upper insulating substrate 92 are used The wiring 41 to 46, the wiring 51 to 56 and the outer wiring 62 of 92a constitute a wiring group.

<Structure of Outer Wiring> By minimizing the amount of metal used in the outer wiring 61 or the outer wiring 62, the touch panel sensor 4 and the touch panel can be manufactured at low cost. In particular, in the case where the outer wiring 61 or the outer wiring 62 is formed of an expensive metal such as silver, by reducing the amount of the expensive metal used in the outer wiring 61 or the outer wiring 62, it is possible to manufacture a touch panel sensor inexpensively 4 and touch panel.

In the conventional touch panel sensor and touch panel, by reducing the width of the wiring and reducing the amount of metal used, it is made cheap. The outer wiring 61 or the outer wiring 62 of this embodiment does not only reduce the width to reduce the amount of metal used as in the past, but in addition to reducing the amount of metal usage, it also includes a metal and atmosphere that suppress the formation of the outer wiring 61 or the outer wiring 62 The combined structure of the ingredients. Furthermore, in this embodiment, by suppressing the combination of the metal forming the outer wiring 61 or the outer wiring 62 and the components in the atmosphere, the resistance value of the outer wiring 61 or the outer wiring 62 does not increase, so even if the outer wiring is suppressed In the case of 61 or the amount of metal used for the outer wiring 62, it is also possible to prevent the performance against foreign noise from deteriorating with time.

Hereinafter, the structure of the outer wiring 61 according to the first embodiment of the present invention will be described in detail with reference to FIG. 5. FIG. 5 shows a part of the section R1 of the outer wiring 61 shown in FIG. 3. In addition, the outer wiring 61 has a configuration in which the shape of FIG. 5 is continuous along the extending direction of the outer wiring 61, but the illustration is omitted.

The outer wiring 61 includes an outer edge portion 611, an inner edge portion 612, an intermediate portion 613, a connection portion 614, and a slit 615.

The outer edge portion 611 is provided on the outermost side of the substrate surface 91a of the lower insulating substrate 91, and is provided along the extending direction of the outer wiring 61 (front-rear direction in FIG. 5).

The inner edge portion 612 is provided at a position inside the substrate surface 91a more than the outer edge portion 611, and is provided parallel to the outer edge portion 611 along the direction in which the outer wiring 61 extends. The width of the inner edge portion 612 is the same as the width of the outer edge portion 611.

The intermediate portion 613 is provided between the outer edge portion 611 and the inner edge portion 612 of the substrate surface 91a, and is provided parallel to the outer edge portion 611 and the inner edge portion 612 along the extending direction of the outer wiring 61.

The connection portion 614 is provided in a direction crossing the extending direction of the outer wiring 61, and connects the outer edge portion 611, the intermediate portion 613, and the inner edge portion 612. The connection portion 614 is typically provided in a direction orthogonal to the extending direction of the outer wiring 61.

The slit 615 is provided along the extending direction of the outer wiring 61 and is provided between the outer edge portion 611 and the intermediate portion 613 and between the inner edge portion 612 and the intermediate portion 613. The width of the slit 615 is the same as the width of the outer edge portion 611 and the width of the inner edge portion 612.

In addition, the structure of the outer wiring 62 is the same as the structure of the outer wiring 61, so the description thereof is omitted.

<Generation of Compound in Outer Wiring> Hereinafter, the generation of the compound in the outer wiring 61 of the first embodiment of the present invention will be described in detail.

The components contained in the atmosphere flow from the gap S1 between the outer edge of the lower insulating substrate 91 and the outer edge of the adhesive 93 shown in FIG. 2 and between the substrate surface 91a of the lower insulating substrate 91 and the adhesive 93. It penetrates into the interior and penetrates into the interior from the gap S2 between the outer edge of the upper insulating substrate 92 and the outer edge of the adhesive 93, and between the substrate surface 92a of the upper insulating substrate 92 and the adhesive 93.

When the outer wiring 61 has the shape shown in FIG. 5, as for the metal forming the outer wiring 61, as the component invading from between the substrate surface 91 a and the adhesive 93 moves inward, the distance from the bottom The edge of the outer edge portion 611 of the outermost edge portion 611 of the outermost edge of the insulating substrate 91 (the end in the negative direction of the x-axis) toward the inside (in the positive direction of the x-axis) gradually contacts the substrate surface 91a and the adhesive Compounds invading between 93 are combined. Therefore, in the outer wiring 61, a compound that hinders the conductivity of the outer wiring 61 is generated from the end on the outer edge side of the outer edge portion 611 closest to the outer edge of the lower insulating substrate 91 toward the inner side.

Secondly, as for the metal forming the outer wiring 61, the combination with the component invading from between the substrate surface 91a and the adhesive 93 is blocked by the slit 615 between the outer edge portion 611 and the intermediate portion 613, so The component that has invaded from between the substrate surface 91a and the adhesive 93 is combined at the intermediate portion 613, and then gradually contacts the substrate surface 91a from the connection portion between the outer edge portion 611 and the connection portion 614 toward the inside of the connection portion 614 It is combined with the components invading between the adhesive 93. Therefore, in the outer wiring 61, a compound that hinders the conductivity of the outer wiring 61 is generated from the connecting portion between the outer edge portion 611 and the connecting portion 614 toward the inner side of the connecting portion 614.

Next, the metal forming the outer wiring 61 and the component that penetrates between the substrate surface 91 a and the adhesive 93 are combined at the intermediate portion 613. Therefore, in the outer wiring 61, a compound that hinders the conductivity of the outer wiring 61 is generated in the intermediate portion 613.

In addition, the metal forming the outer wiring 61 is blocked by the slit 615 between the intermediate portion 613 and the inner edge portion 612 due to the combination of the component invading from between the substrate surface 91a and the adhesive 93. The component invading from between the substrate surface 91a and the adhesive 93 is compounded at the inner edge portion 612, and gradually moves from the connecting portion between the intermediate portion 613 and the connecting portion 614 toward the inside of the connecting portion 614 with the substrate surface The components invading between 91a and the adhesive 93 are combined. Therefore, in the outer wiring 61, a compound that hinders the conductivity of the outer wiring 61 is generated from the connecting portion between the intermediate portion 613 and the connecting portion 614 toward the inside of the connecting portion 614.

When the outer wiring 61 is formed of silver, the silver constituting the outer wiring 61 becomes silver sulfide (Ag ₂ S) that hinders the conductivity of the outer wiring 61 due to sulfidation combined with a sulfur component. Sulfur gas such as hydrogen sulfide or sulfur dioxide in the atmosphere contains sulfur components. Therefore, the conductor resistance value of the outer wiring 61 before vulcanization gradually increases as the vulcanization progresses. For example, the resistance value of the outer wiring 61 before vulcanization 5.0×10 ^-5 (Ω·cm) gradually increases as the vulcanization progresses.

In addition, when the outer wiring 61 is formed of copper, the copper constituting the outer wiring 61 becomes copper oxide (Cu ₂ O or CuO) that hinders the conductivity of the outer wiring 61 due to oxidation combined with an oxygen component. Therefore, the conductor resistance value of the outer wiring 61 before oxidation gradually increases as the oxidation proceeds.

In this way, by providing the slit 615 in the outer wiring 61, compared with the case where the slit 615 is not provided, the combination of the metal forming the outer wiring 61 and the component invading from between the substrate surface 91a and the adhesive 93 can be suppressed. Therefore, it is possible to prevent the generation of the compound that hinders conductivity in the outer wiring 61, so that the predetermined conductivity of the outer wiring 61 can be maintained.

Here, according to the inventor's experiment, for the resistance value of the outer wiring 61 in the case where the progress of vulcanization in the outer wiring 61 is suppressed to one-half the width direction of the outer wiring 61, the slit is not provided In the conventional outer wiring of the same width as that of the present embodiment of 615, the vulcanization proceeds to one-half of the resistance value when the vulcanization proceeds to seven-eighths in the width direction.

In addition, regarding the combination of the metal forming the outer wiring 62 and the component that invades from between the substrate surface 92a and the adhesive 93 and the generation of the compound thus obtained, the metal forming the outer wiring 61 and the substrate surface 91a are bonded The combination of components that invade between the agents 93 and the formation of the compound thus obtained are the same, so their explanation is omitted.

<Modified Example 1 of Structure of Outer Wiring> Hereinafter, a modified example 1 of the structure of the outer wiring according to the first embodiment of the present invention will be described in detail with reference to FIG. 6. FIG. 6 shows a part of the section R1 shown in FIG. 3 of the external wiring. In addition, the outer wiring has a configuration in which the shape of FIG. 6 is continuous along the extending direction of the outer wiring, but the illustration is omitted. In addition, the structure of the first modification of the present embodiment other than the excluded wiring 70 is the same as the structure of FIGS. 1 to 4, and therefore the description thereof is omitted.

The outer wiring 70 includes an outer edge portion 711, an inner edge portion 712, a connection portion 713, and a slit 715.

The outer edge portion 711 is provided on the outermost side of the substrate surface 91a of the lower insulating substrate 91, and is provided along the extending direction of the outer wiring 70 (front-rear direction in FIG. 6).

The inner edge portion 712 is provided on the inner side of the lower insulating substrate 91 than the outer edge portion 711, and is provided parallel to the outer edge portion 711 along the extending direction of the outer wiring 70.

The connection portion 713 is provided in a direction crossing the extending direction of the outer wiring 70, and connects the outer edge portion 711 and the inner edge portion 712. The connection portion 713 is typically provided in a direction orthogonal to the extending direction of the outer wiring 70.

The slit 715 is provided in a direction crossing the extending direction of the outer wiring 70 and is provided between the outer edge portion 611 and the inner edge portion 612. The slit 715 is typically provided in a direction orthogonal to the extending direction of the outer wiring 70.

<Generation of Compound in Outer Wiring of Modification 1> Hereinafter, the generation of the compound in outer wiring 70 of Modification 1 of the first embodiment of the present invention will be described in detail.

In the case where the outer wiring 70 has the shape shown in FIG. 6, the metal forming the outer wiring 70 moves inward as the component intruding from between the substrate surface 91 a and the adhesive 93 moves inward The edge of the outer edge portion 711 of the outermost edge of the insulating substrate 91 closest to the outer edge (end in the negative direction of the x-axis) toward the inner side (positive direction of the x-axis) gradually contacts the substrate surface 91a and the adhesive Compounds invading between 93 are combined. Therefore, in the outer wiring 70, a compound that hinders the conductivity of the outer wiring 70 is generated from the end on the outer edge side of the outer edge portion 711 closest to the outer edge of the lower insulating substrate 91 toward the inner side.

Secondly, as for the metal forming the outer wiring 70, the combination with the component invading from between the substrate surface 91a and the adhesive 93 is blocked by the slit 715, so the connection portion between the outer edge portion 711 and the connection portion 713 The component that enters from the inside of the connection portion 713 is gradually combined with the component that invades from between the substrate surface 91 a and the adhesive 93. Therefore, in the outer wiring 70, a compound that hinders the conductivity of the outer wiring 70 is generated from the connecting portion between the outer edge portion 711 and the connecting portion 713 toward the inner side of the connecting portion 713.

Secondly, as for the metal forming the outer wiring 70, the combination with the component invading from between the substrate surface 91a and the adhesive 93 is still blocked by the slit 715, so it does not interact with the substrate surface 91a and the adhesive 93. The invading component is combined at the inner edge portion 712, and the component invading from between the substrate surface 91a and the adhesive 93 is gradually combined toward the inside of the connecting portion 713. Therefore, in the outer wiring 70, a compound that blocks the conductivity of the outer wiring 70 is generated toward the inside of the connection portion 713.

When the outer wiring 70 is formed of silver, the silver constituting the outer wiring 70 becomes silver sulfide that hinders the conductivity of the outer wiring 70 due to sulfidation. Therefore, the conductor resistance value of the outer wiring 70 before vulcanization gradually increases as the vulcanization progresses. Further, when the outer wiring 70 is formed of copper, the copper constituting the outer wiring 70 becomes copper oxide that hinders the conductivity of the outer wiring 70 due to oxidation. Therefore, the resistance value of the conductor of the outer wiring 70 before oxidation gradually increases as the oxidation proceeds.

In this way, by providing the slit 715 in the outer wiring 70, compared with the case where the slit 715 is not provided, the combination of the metal forming the outer wiring 70 and the component invading from between the substrate surface 91a and the adhesive 93 can be suppressed. Therefore, it is possible to prevent the formation of the compound that inhibits the conductivity in the outer wiring 70, so that the conductivity of the outer wiring 70 is not impaired, and the predetermined conductivity of the outer wiring 70 can be maintained.

<Modified Example 2 of Structure of Outer Wiring> The structure of modified example 2 of the outer wiring according to the first embodiment of the present invention will be described in detail below with reference to FIG. 7. FIG. 7 shows a part of the section R1 of the outer wiring 61 shown in FIG. 3. In addition, the outer wiring has a configuration in which the shape of FIG. 7 is continuous along the extending direction of the outer wiring, but the illustration is omitted. In addition, the structure of the second modification of the present embodiment except for the side wiring 80 is the same as the structure of FIGS. 1 to 4, and therefore its description is omitted.

The outer wiring 80 includes an outer edge portion 811, an inner edge portion 812, an intermediate portion 813, a connection portion 814, a connection portion 815, a slit 816, and a slit 817.

The outer edge portion 811 is provided on the outermost side of the substrate surface 91a of the lower insulating substrate 91, and is provided along the extending direction of the outer wiring 80 (front-rear direction in FIG. 7).

The inner edge portion 812 is provided at a position inside the substrate surface 91a more than the outer edge portion 811, and is provided parallel to the outer edge portion 811 along the extending direction of the outer wiring 80. The width of the inner edge portion 812 is the same as the width of the outer edge portion 811.

The intermediate portion 813 is provided between the outer edge portion 811 and the inner edge portion 812 of the substrate surface 91a, and is provided in parallel with the outer edge portion 811 and the inner edge portion 812 along the extending direction of the outer wiring 80.

The connection portion 814 is provided in a direction crossing the extending direction of the outer wiring 80, and connects the outer edge portion 811, the intermediate portion 813, and the inner edge portion 812. The connection portion 814 is typically provided in a direction orthogonal to the extending direction of the outer wiring 80.

The connecting portion 815 is provided in a direction crossing the extending direction of the outer wiring 80, and connects the outer edge portion 811 and the inner edge portion 812. The connection portion 815 is typically provided in a direction orthogonal to the extending direction of the outer wiring 80.

The slit 816 is provided along the extending direction of the outer wiring 80, and is provided between the outer edge portion 811 and the intermediate portion 813 and between the inner edge portion 812 and the intermediate portion 813. The width of the slit 816 is the same as the width of the outer edge portion 811 and the width of the inner edge portion 812.

The slit 817 is provided in a direction crossing the extending direction of the outer wiring 80 and is provided between the outer edge portion 811 and the inner edge portion 812. The slit 817 is typically provided in a direction orthogonal to the extending direction of the outer wiring 80.

In addition, for the combination of the metal forming the outer wiring 80 and the component that invades from between the substrate surface 91a and the adhesive 93 and the generation of the resulting compound, the part with the same shape as in FIG. The parts that are the same and have the same shape as in FIG. 6 are the same as those in FIG. 6, so their explanations are omitted.

In this way, according to the present embodiment, the metal whose conductivity is reduced by combining with the component invading from the substrate surface 91a and the adhesive 93 and the component invading from the substrate surface 92a and the adhesive 93 is used At least the outer wiring 61 and the outer wiring 62 are formed, and the slits are provided in the outer wiring 61 and the outer wiring 62 to at least suppress the combination of the metal forming the outer wiring 61 and the outer wiring 62 with the components in the atmosphere, so at least the outer wiring can be suppressed The conductivity of 61 and the outer wiring 62 decreases with time.

Furthermore, according to the present embodiment, by providing slits in the outer wiring 61 and the outer wiring 62, the amount of metal used in the outer wiring 61 and the outer wiring 62 can be suppressed, so that the touch panel sensor and Touch panel.

Furthermore, according to the present embodiment, since the slits are provided in the grounded outer wiring 61 and the outer wiring 62, at least the combination of the metal forming the outer wiring 61 and the outer wiring 62 with the components in the atmosphere is suppressed, thereby suppressing the conductivity from passing over time Reduce, so it can prevent the anti-foreign noise performance from decreasing with time.

Further, according to the present embodiment, the wirings 21 to 26, the wirings 31 to 36, and the outer wiring 61 are formed on the substrate surface 91a by printing, and the wirings 41 to 46 and the wiring 51 to 56 are formed on the substrate surface 92a by printing. Since the outer wiring 62 is formed by sputtering and etching, it can be formed inexpensively.

In this embodiment, the outer wiring is provided on both the lower insulating substrate 91 and the upper insulating substrate 92, but the outer wiring may be provided only on either of the lower insulating substrate 91 and the upper insulating substrate 92.

Furthermore, in the present embodiment, slits are provided on both the outer wiring 61 and the outer wiring 62, but the slit may be provided only on any one of the outer wiring 61 and the outer wiring 62 which is relatively susceptible to the influence of the components in the atmosphere .

Furthermore, in the present embodiment, the outer wiring 61 and the outer wiring 62 are in any of the shapes shown in FIGS. 5 to 7, but the wirings 21 to 26, the wirings 31 to 36, the wirings 41 to 46, and the wiring 51 may also be used. 56. All or a part selected sequentially from the outside is set to any one of FIGS. 5 to 7.

(Second Embodiment) The structure of an electronic device according to a second embodiment of the present invention is to provide a touch panel sensor 100 instead of the touch panel sensor 4, except for the same structure as that of FIG. 1, it is omitted. Its description.

<Structure of Touch Panel Sensor> Hereinafter, the structure of the touch panel sensor 100 according to the second embodiment of the present invention will be described in detail with reference to FIG. 8.

In addition, in FIG. 8, parts having the same configuration as those in FIGS. 2 to 4 are denoted by the same symbols, and their descriptions are omitted.

The touch panel sensor 100 has a structure in which the outer wiring 61 and the outer wiring 62 are deleted from the touch panel sensor 4, and the wiring 21 and the wiring 31 become the wiring arranged on the outermost side on the substrate surface 91a, and The wiring 46 on the substrate surface 92a becomes the wiring arranged on the outermost side.

The touch panel sensor 100 detects the position subjected to the input operation by means of electrostatic capacitance. Specifically, the touch panel sensor 100 has a lower insulating substrate 91, an upper insulating substrate 92, and an adhesive 93.

The electrode 10, the wirings 21 to 26, and the wirings 31 to 36 are provided on the substrate surface 91a of the lower insulating substrate 91.

The wiring 21 is provided along the outer edge of the lower insulating substrate 91 at a position outside the wirings 22 to 26. The wiring 21 is arranged on the outermost side among the wirings 21 to 26 arranged on the substrate surface 91a. The wiring 21 has the shape described in any one of FIGS. 5 to 7.

The wiring 31 is provided along the outer edge of the lower insulating substrate 91 at a position outside the wirings 32 to 36. The wiring 31 is arranged on the outermost side of the wirings 31 to 36 arranged on the substrate surface 91a. The wiring 31 has the shape described in any of FIGS. 5 to 7.

The electrode 11, the wirings 41 to 46 and the wirings 51 to 56 are provided on the substrate surface 92 a of the upper insulating substrate 92.

The wiring 46 is provided along the outer edge of the lower insulating substrate 92 at a position outside the wirings 41 to 45. The wiring 46 is arranged on the outermost side of the wirings 41 to 46 arranged on the substrate surface 92a. The wiring 46 has the shape described in any of FIGS. 5 to 7.

In the touch panel sensor 100 having the above structure, the wirings 21 to 26 and the wirings 31 to 36 provided on the substrate surface 91 a of the lower insulating substrate 91 and the wiring 41 provided on the substrate surface 92 a of the upper insulating substrate 92 are used ~46 and wiring 51~56 constitute the wiring group.

In addition, the combination of the metal forming the wiring 21, the wiring 31, and the wiring 46 with the component intruding from between the substrate surface 91a and the adhesive 93, and the component invading from the substrate surface 92a and the adhesive 93, and therefore The formation of the obtained compound is the same as that of the outer wiring 61 and the outer wiring 62 of the first embodiment described above, so the explanation is omitted.

In this way, according to this embodiment, the conductivity is reduced by combining with the component invading from the substrate surface 91a and the adhesive 93 and the component invading from the substrate surface 92a and the adhesive 93 At least the wiring 21, the wiring 31, and the wiring 46 are formed of metal, and the slit 615 is provided in the wiring 21, the wiring 31, and the wiring 46, so that at least the combination of the metal forming the wiring 21, the wiring 31, and the wiring 46 with the components in the atmosphere can be suppressed Thus, it is possible to suppress at least the conductivity of the wiring 21, the wiring 31, and the wiring 46 from decreasing with time.

Furthermore, according to the present embodiment, by providing slits in the wiring 21, the wiring 31, and the wiring 46, the amount of metal used in the wiring 21, the wiring 31, and the wiring 46 can be suppressed, and the touch panel sensing can be manufactured at low cost Device and touch panel.

Moreover, according to the present embodiment, since the wirings 21 to 26 and the wirings 31 to 36 are formed by printing on the substrate surface 91a, and the wirings 41 to 46 and the wirings 51 to 56 are formed by printing on the substrate surface 92a, the sputtering Compared with the case where the wiring and the outer wiring are formed by etching, it can be formed inexpensively.

In addition, the type, arrangement, number, etc. of the members of the present invention are not limited to the above-mentioned embodiments, and of course, its constituent elements can be appropriately replaced with elements having equivalent effects, etc., without departing from the gist of the invention. It can be changed appropriately within the scope.

In the first and second embodiments described above, the electrodes 10 and 11 are provided on different substrate surfaces of an insulating substrate. However, the electrodes 10 and 11 may be provided on different substrate surfaces of the same insulating substrate or On the same substrate surface of the same insulating substrate.

In addition, in the first and second embodiments described above, the shape of the outermost wiring is set to any one of FIGS. 5 to 7, but the shape of the outermost wiring may also be set as shown in FIG. The shape of the slits other than 5 to 7. For example, the outermost wiring may have a shape in which a slit is extended in a direction having a predetermined angle other than 90 degrees with respect to the extending direction of the outermost wiring.

In addition, in the first embodiment and the second embodiment described above, the shape of the slit is rectangular, but the shape of the slit may also be a circle such as a perfect circle or an ellipse, or a rhombus, square or Polygons other than rectangles such as triangles.

In addition, in the first and second embodiments described above, the touch panel sensor that detects the position subjected to the input operation by the electrostatic capacitance method is used, but it may also be set to be received by the resistive film method. Touch panel sensor to detect the input operation position.

Furthermore, in the first and second embodiments described above, the outer wiring provided on the outermost side of the substrate surface or the wiring connected to the electrode is provided with a slit, but the outer wiring and the electrode may be connected Other wirings provided on the outermost side of the substrate surface other than the wirings are provided with slits. [Industry availability]

The present invention is suitable for a touch panel sensor and a touch panel that output a signal, and the signal corresponds to a position input by an external object.

1‧‧‧Electronic equipment 2‧‧‧Case 3‧‧‧Display panel 4‧‧‧Touch panel sensor 5‧‧‧Wiring board 6‧‧‧Adhesive 7‧‧‧Protection board 10‧‧ ‧Electrode 11‧‧‧Electrode 21~26‧‧‧Wiring 21a~26a‧‧‧External connection part 31~36‧‧‧Wiring 31a~36a‧‧‧External connection part 41~46‧‧‧Wiring 41a~46a‧ ‧‧External connection 51~56‧‧‧Wiring 51a~56a‧‧‧‧External connection 61 61‧‧‧Outside wiring 62‧‧‧Outside wiring 70‧‧‧Outside wiring 80‧‧‧Outside wiring 91‧‧‧Lower Insulating substrate 91a‧‧‧Substrate surface 92‧‧‧ Upper insulating substrate 92a‧‧‧Substrate surface 93‧‧‧ Adhesive 100‧‧‧Touch panel sensor 611‧‧‧Outer edge part 612‧‧‧Inner Edge part 613‧‧‧Intermediate part 614‧‧‧Connecting part 615‧‧‧Slit 711‧‧‧Outer edge part 712‧‧‧Inner edge part 713‧‧‧Connecting part 715‧‧‧Slit 811‧‧‧ Outer edge part 812‧‧‧Inner edge part 813‧‧‧Intermediate part 814‧‧‧Connecting part 815‧‧‧Connecting part 816‧‧‧Slit 817‧‧‧Slit R1‧‧‧Slots S1, S2‧‧ ‧Gap

Fig. 1 is an exploded perspective view of an electronic device according to a first embodiment of the present invention. [FIG. 2] It is the A-A sectional view of FIG. 3 is a plan view of the lower substrate of the touch panel sensor according to the first embodiment of the present invention. 4 is a bottom view of the upper substrate of the touch panel sensor according to the first embodiment of the present invention. 5 is a plan view of the outermost wiring in the first embodiment of the present invention. 6 is a plan view of Modification 1 of the outermost wiring in the first embodiment of the present invention. 7 is a plan view of Modification 2 of the outermost wiring in the first embodiment of the present invention. 8 is a cross-sectional view of a touch panel sensor according to a second embodiment of the present invention.

4‧‧‧Touch panel sensor

10‧‧‧electrode

21~26‧‧‧Wiring

31~36‧‧‧Wiring

41~46‧‧‧Wiring

61‧‧‧Outside wiring

62‧‧‧Outside wiring

91‧‧‧Lower insulating substrate

92‧‧‧Upper insulating substrate

93‧‧‧adhesive

S1, S2‧‧‧Gap

Claims (4)

A touch panel sensor is used for a touch panel. The touch panel outputs a signal corresponding to a position input by an external object. The touch panel sensor is characterized by having: an insulating substrate; A plurality of electrodes are arranged on the substrate surface of the insulating substrate in an insulated state; a wiring group is provided around the electrode on the substrate surface and includes at least wiring connected to the electrode; and an insulating coating layer covering The electrode and the wiring group; wherein at least the wiring in the wiring group that is located at the outermost side of the substrate surface on which the wiring group is provided is due to conductivity and intrusion from between the substrate surface and the cladding layer The metal formed by the combination of the components is lowered, and the outermost wiring includes: an outer edge portion, which is provided along the extending direction of the outermost wiring; an inner edge portion, which is more inward than the outer edge portion , Arranged along the extended routing direction; the middle portion, between the outer edge portion and the inner edge portion, along the extended routing direction; the connecting portion, connecting the outer edge portion, the middle portion and the inner Three of the edge portions; and a first slit between the outer edge portion and the middle portion, and between the inner edge portion and the middle portion, along the extending direction; wherein the first 1 The length of the slit in the extending layout direction is longer than the length of the first slit in the direction crossing the extending layout direction. A touch panel sensor as claimed in item 1 of the patent application, which further includes a second slit provided from the outer edge portion to the inner edge portion, the second slit being located between the outer edge portion and the inner edge The two parts are arranged in a direction crossing the extending direction. A touch panel outputs a signal corresponding to a position input by an external object. The touch panel is characterized by having: an insulating substrate; a plurality of electrodes arranged on the substrate of the insulating substrate in a mutually insulated state Wiring group, which is provided around the electrode on the substrate surface and includes at least the wiring connected to the electrode; and an insulating coating layer covering the electrode and the wiring group; and at least the wiring group is located The outermost wiring of the substrate surface on which the wiring group is provided is formed of a metal whose conductivity is reduced by a compound that invades from between the substrate surface and the cladding layer and the outermost wiring includes: The outer edge portion is provided along the extending direction of the outermost wiring; the inner edge portion is provided along the extending direction at a position more inside than the outer edge portion; the middle portion is provided at the outer edge portion Between the inner edge portion and the extending direction; the connecting portion connects the outer edge portion, the middle portion and the inner edge portion; and the first slit at the outer edge portion Between the middle portion, and between the inner edge portion and the middle portion, are provided along the extending layout direction; wherein the length of the first slit in the extending layout direction is compared to that of the The length of the first slit in the direction crossing the extending direction is longer. As in the touch panel of claim 3, the outermost wiring is grounded.

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