TWI694611B - The measurement and repair flow for micro light-emitting diodes and image sensors - Google Patents

Abstract

The measurement and repair flows of Micro light-emitting diodes and image sensors include the following steps. Using existing substrate removement method transfers huge amounts of LEDs and image sensors into test board which is made by wafer. All transferred micro devices are sucked on the test board by electrostatic force. This test board measures the specifications of all micro devices. The defect micro devices are removed by releasing the electrostatic force at corresponded location. After all of micro devices pass the set specifications, the test results of each micro devices are recorded. And, all tested micro devices are moved out from and packaged. The packaged micro devices are transferred to the final assembly material.

Description

Test and repair process of miniature light-emitting diodes and image sensing elements

The invention relates to verifying, screening and repairing non-conforming components through the test board for miniature light-emitting diodes and image sensing components to improve the yield after final assembly.

The known technique is to verify the characteristics after assembling the miniature diodes. If the diodes fail or the characteristics do not meet the requirements, they must be removed and assembled to other unverified diodes, or they can be shielded. The opportunity to damage the assembly interface also wastes assembly time.

On the other hand, the micro-component manufacturer is required to control the component consistency and yield, but the process and parameter control of the process of producing micro-components using wafers has inherent problems of consistency and yield, and precise control will still have a certain percentage of yield The problem, the yield problem is related to the time series of mass production.

The present invention aims to provide a method for miniaturized components using test boards in the most Verify and record characteristics before post-assembly to reduce post-assembly repair and improve post-assembly yield.

A method for testing and repairing micro-elements according to an embodiment of the present invention includes the following steps. A test board is provided for placing the micro-device into the test hole using the micro-device substrate detachment method. The micro-component placed in the test hole is electrostatically attracted until the component placement is completed.

According to an embodiment of the present invention, the placed micro-components are pressed and fixed by the test lens and static electricity is removed for micro-component testing.

According to an embodiment of the present invention, the non-compliant micro-devices tested have no electrostatic adsorption capacity, and can be removed by inversion or suction. And reposition new micro-components.

According to an embodiment of the present invention, all compatible micro-devices are glued and encapsulated using glue on a hard board. In the final assembly stage, heat is used to transfer all micro-elements to the final substrate. On the final device, you will not see the assembly line assembled from the small device into the large device.

According to an embodiment of the present invention, since the final assembly may include an image sensing element, the final assembly object may be planned to include a camera lens.

In summary, the method for testing and repairing miniature components according to an embodiment of the present invention eliminates the need for repeated repairs of the final device through the test and repair of the test board, so that the yield and bonding interface of the final device will not be damaged.

The above description of the content of the invention and the following embodiments is to explain the spirit of the present invention.

10, 11: Laser

20: Growth substrate

30, 31, 32, 33, 34, 35, 36, 37, 38, 81, 83, 84, 87, 88, 96, 98, 102, 103: micro components

40, 41: test board

42, 43: Test hole

46: Integrated circuit

48: Metal wiring

50, 52: metal gasket

60, 61, 63: Probe

72: Test lens

85: Static neutralization gas

86: Nozzle

92, 93: hard board with colloid

95: final substrate

Fig. 1 is a related object of the present invention.

Figure 2 is a schematic diagram of a test board.

3 to 5 are schematic diagrams of the transfer of micro-devices from the growth substrate to the test board.

Fig. 6 illustrates the micro-element after the test transfer is completed.

Figure 7 is for removing micro-devices that do not meet specifications.

Figure 8 shows the removal of all miniature components that meet the specifications.

Figure 9 shows the transfer of packaged micro-elements to the final substrate.

The features and advantages of the present invention are described in detail in the following embodiments. The content is sufficient for anyone familiar with the relevant art to understand and implement the technical content of the present invention, and to understand the purpose and advantages of the present invention.

First, a method for testing and repairing a micro device according to an embodiment of the present invention will be described. Please refer to FIGS. 1 to 9. FIG. 1 is a related object according to an embodiment of the invention. FIG. 2 is a test board according to an embodiment of the invention. Figures 3 to 5 are used in an embodiment of the invention The micro-device substrate removal method places different micro-devices into the test hole. FIG. 6 is a schematic diagram of micro-device testing according to an embodiment of the invention. 7 is a schematic diagram of removing non-compliant micro-devices according to an embodiment of the invention. FIG. 8 is a schematic diagram of removing and packaging all tested micro-elements in an embodiment of the present invention. FIG. 9 shows the transfer of the packaged micro-devices to the final device according to an embodiment of the invention.

As shown in FIG. 2, the test board 41 includes test holes 42 and 43 for testing micro-elements, in which the metal traces 48 transmit control signals from the integrated circuit 46 (such as a control chip) for controlling and collecting micro-elements For switches and signals, the control chip 46 can also be placed on other test boards made of PCB to save the cost of micro-component test boards, and the test signals are provided through probes.

Next, as shown in FIG. 3, the laser 10 is used to place the micro-component 31 connected to the growth substrate 20 into the test board 40, and the micro-component 30 that is not placed in the coordinate is not moved or released. The micro-element 31 placed in the test board 40 is attracted by the static electricity provided by the probe 61. In FIG. 4, for different types of micro-elements 32 and 33, the laser 11 is inserted into the corresponding test hole. Once all the micro-elements 35, 36, 37 and 38 are placed in the corresponding positions, as shown in Figure 5, and the monitoring screen shows that the placement is complete, the first stage of transfer is completed.

As shown in FIG. 6, a test lens 72 (for example, a lens of a detector) is used to press down all the micro components in the test hole and remove the static electricity accumulated on the metal pad 52 provided by the probe 61. Then, the characteristics of the micro-devices are tested in sequence.

For the verification of the micro-components that cannot meet the specifications, they must be removed. As shown in FIG. 7, the inverted test board 40 uses the nozzle 86 to blow out the static neutralizing gas 85 to the micro-component 81 that cannot meet the specifications, so the micro-component 81 loses static electricity Absorbed while being thrown out.

Repeat the steps in Figures 3 to 6 for the vacated test hole until all the micro-devices meet the specifications. Each micro-device verification data will be retained and used on the final device.

Once all the micro-components that meet the specifications have been placed and verified, as shown in FIG. 8, all micro-components 83, 84, 87, and 88 are removed by the hard board 92 containing colloid and packaged and fixed.

The packaged and fixed micro-components are sent to the final assembly plant, and the hard board 93 is heated so that the micro-components 96, 98, 102, and 103 are detached and adhered to the final substrate 95. In the end, only small components are left on the substrate 95, and even if it is assembled into a large device multiple times, there will be no assembly line.

Although an embodiment disclosed in the present invention is not intended to limit the present invention, any changes or modifications made without departing from the spirit and scope of the present invention belong to the patent protection scope of the present invention. For the definition scope of the present invention, please refer to the appended patent application scope below.

10: Laser

20: Growth substrate

30: Micro components

40: Test board

50: Metal gasket

60: Probe

Claims (6)

A test and repair process for micro-components is suitable for measuring at least one micro-component. The test and repair process for micro-components includes: providing a test board containing an integrated circuit providing related tests and a test hole for micro-components with adsorption capability The test hole with adsorption capacity contains metal electrodes to provide test signals to the micro-components. The metal pad behind the test board is used to provide static electricity to attract the micro-components. The test and repair process of the micro-components as in claim 1, wherein the integrated circuit of the test board tests and adjusts and verifies the set value for each micro-component; in order to save the price of the test board, the test integrated circuit It can be moved from the micro-component test board to the PCB test board containing the control circuit to provide related test signals through the probe. For example, in the test and repair process of the micro-component of claim 1, the micro-component is removed from the substrate, the micro-component is placed into the test hole, and the placement is confirmed on the monitor screen. For example, the testing and repair process of the micro-components in claim 2, for the micro-components that can not meet the specifications after adjustment and verification, use the electrostatic neutralization or electrostatic guidance method to make the corresponding micro-components have no electrostatic adsorption capacity and are removed or dropped. Or use a suction force greater than the electrostatic adsorption capacity to remove it. For example, in the test and repair process of the micro-component of claim 1, the test value of the micro-component that has been tested and repaired after the completion of the test and repair is recorded. This record is used on the final device to save the re-test time of each micro-component. As in the test and repair process of the micro-component of claim 1, the test and repair of the micro-component that meets the specifications are completed and taken out and packaged. The packaged micro-component is separated from the package structure and assembled on the final device.

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