TWI693405B - 用於具有改良之影像光束穩定性及詢問之帶電粒子顯微鏡之方法及系統 - Google Patents

用於具有改良之影像光束穩定性及詢問之帶電粒子顯微鏡之方法及系統 Download PDF

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TWI693405B
TWI693405B TW105109322A TW105109322A TWI693405B TW I693405 B TWI693405 B TW I693405B TW 105109322 A TW105109322 A TW 105109322A TW 105109322 A TW105109322 A TW 105109322A TW I693405 B TWI693405 B TW I693405B
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detector
electron
mesh element
analyzer assembly
radiance
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TW105109322A
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TW201704753A (zh
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道格拉斯Ｋ 馬薩納海提
蓋伯 托斯
大衛 泰瑞斯
羅希 布思拉
葛瑞斯 淑玲 陳
瑞尼爾 克尼普梅耶
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美商克萊譚克公司
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/26—Electron or ion microscopes; Electron or ion diffraction tubes
    • H01J37/28—Electron or ion microscopes; Electron or ion diffraction tubes with scanning beams
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/20—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by using diffraction of the radiation by the materials, e.g. for investigating crystal structure; by using scattering of the radiation by the materials, e.g. for investigating non-crystalline materials; by using reflection of the radiation by the materials
    • G01N23/203—Measuring back scattering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
    • H01J37/10—Lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/244—Detectors; Associated components or circuits therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2223/00—Investigating materials by wave or particle radiation
    • G01N2223/60—Specific applications or type of materials
    • G01N2223/611—Specific applications or type of materials patterned objects; electronic devices
    • G01N2223/6116—Specific applications or type of materials patterned objects; electronic devices semiconductor wafer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/004—Charge control of objects or beams
    • H01J2237/0041—Neutralising arrangements
    • H01J2237/0044—Neutralising arrangements of objects being observed or treated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/004—Charge control of objects or beams
    • H01J2237/0048—Charging arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/05—Arrangements for energy or mass analysis
    • H01J2237/057—Energy or mass filtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/244—Detection characterized by the detecting means
    • H01J2237/2446—Position sensitive detectors
    • H01J2237/24465—Sectored detectors, e.g. quadrants
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/244—Detection characterized by the detecting means
    • H01J2237/24475—Scattered electron detectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/244—Detection characterized by the detecting means
    • H01J2237/2448—Secondary particle detectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/244—Detection characterized by the detecting means
    • H01J2237/24485—Energy spectrometers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/244—Detection characterized by the detecting means
    • H01J2237/2449—Detector devices with moving charges in electric or magnetic fields
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/26—Electron or ion microscopes
    • H01J2237/28—Scanning microscopes
    • H01J2237/2803—Scanning microscopes characterised by the imaging method
    • H01J2237/2804—Scattered primary beam
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/26—Electron or ion microscopes
    • H01J2237/28—Scanning microscopes
    • H01J2237/2803—Scanning microscopes characterised by the imaging method
    • H01J2237/2806—Secondary charged particle

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  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
TW105109322A 2015-03-24 2016-03-24 用於具有改良之影像光束穩定性及詢問之帶電粒子顯微鏡之方法及系統 TWI693405B (zh)

Applications Claiming Priority (10)

Application Number Priority Date Filing Date Title
US201562137229P 2015-03-24 2015-03-24
US62/137,229 2015-03-24
US201562166682P 2015-05-27 2015-05-27
US62/166,682 2015-05-27
US201562214737P 2015-09-04 2015-09-04
US62/214,737 2015-09-04
US201662277670P 2016-01-12 2016-01-12
US62/277,670 2016-01-12
US15/079,046 2016-03-24
US15/079,046 US10643819B2 (en) 2015-03-24 2016-03-24 Method and system for charged particle microscopy with improved image beam stabilization and interrogation

Publications (2)

Publication Number Publication Date
TW201704753A TW201704753A (zh) 2017-02-01
TWI693405B true TWI693405B (zh) 2020-05-11

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TW109111326A TWI722855B (zh) 2015-03-24 2016-03-24 用於具有改良之影像光束穩定性及詢問之帶電粒子顯微鏡之方法及系統
TW110105824A TWI751911B (zh) 2015-03-24 2016-03-24 用於具有改良之影像光束穩定性及詢問之帶電粒子顯微鏡之方法及系統
TW105109322A TWI693405B (zh) 2015-03-24 2016-03-24 用於具有改良之影像光束穩定性及詢問之帶電粒子顯微鏡之方法及系統

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TW110105824A TWI751911B (zh) 2015-03-24 2016-03-24 用於具有改良之影像光束穩定性及詢問之帶電粒子顯微鏡之方法及系統

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US (2) US10643819B2 (enExample)
JP (2) JP6701228B2 (enExample)
KR (1) KR20170131583A (enExample)
IL (2) IL254332B (enExample)
SG (2) SG11201707201SA (enExample)
TW (3) TWI722855B (enExample)
WO (1) WO2016154484A1 (enExample)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2594619T3 (es) 2005-11-18 2016-12-21 Mevion Medical Systems, Inc. Radioterapia con partículas cargadas
JP6425096B2 (ja) * 2015-05-14 2018-11-21 国立大学法人 東京大学 電子顕微鏡および測定方法
DE102015210893B4 (de) * 2015-06-15 2019-05-09 Carl Zeiss Microscopy Gmbh Analyseeinrichtung zur Analyse der Energie geladener Teilchen und Teilchenstrahlgerät mit einer Analyseeinrichtung
US10460905B2 (en) 2015-09-23 2019-10-29 Kla-Tencor Corporation Backscattered electrons (BSE) imaging using multi-beam tools
US10840056B2 (en) * 2017-02-03 2020-11-17 Kla Corporation Multi-column scanning electron microscopy system
US11373838B2 (en) * 2018-10-17 2022-06-28 Kla Corporation Multi-beam electron characterization tool with telecentric illumination
DE102019107327A1 (de) * 2019-03-21 2020-09-24 Specs Surface Nano Analysis Gmbh Vorrichtung und Verfahren zum Elektronentransfer von einer Probe zu einem Energieanalysator und Elektronen-Spektrometervorrichtung
KR102625536B1 (ko) * 2019-05-08 2024-01-17 주식회사 히타치하이테크 하전 입자빔 시스템, 및 하전 입자선 장치에 있어서의 관찰 조건을 결정하는 방법
WO2021007463A1 (en) * 2019-07-09 2021-01-14 Varex Imaging Corporation Electron gun driver
US11417492B2 (en) 2019-09-26 2022-08-16 Kla Corporation Light modulated electron source
JP7250661B2 (ja) 2019-10-31 2023-04-03 株式会社日立ハイテク 荷電粒子線装置
US20210305007A1 (en) * 2020-03-30 2021-09-30 Fei Company Dual beam bifocal charged particle microscope
US11460419B2 (en) 2020-03-30 2022-10-04 Fei Company Electron diffraction holography
US11239043B2 (en) * 2020-05-19 2022-02-01 ICT Integrated Circuit Testing Gesellschaft für Halbleiterprüftechnik mbH Charged particle beam device and method for inspecting and/or imaging a sample
US11183361B1 (en) 2020-05-19 2021-11-23 ICT Integrated Circuit Testing Gesellschaft für Halbleiterprüftechnik mbH Charged particle beam device and method for inspecting and/or imaging a sample
EP4009348A1 (en) * 2020-12-01 2022-06-08 ASML Netherlands B.V. Charged particle inspection tool and method
WO2022136064A1 (en) * 2020-12-23 2022-06-30 Asml Netherlands B.V. Charged particle optical device
EP4067888A1 (en) * 2021-03-31 2022-10-05 FEI Company Multiple image segmentation and/or multiple dynamic spectral acquisition for material and mineral classification
US11749495B2 (en) * 2021-10-05 2023-09-05 KLA Corp. Bandpass charged particle energy filtering detector for charged particle tools
TW202439366A (zh) * 2021-10-28 2024-10-01 德商卡爾蔡司Ｓｍｔ有限公司 提供拓樸資訊的高解析度低能量電子顯微鏡與光罩檢查方法
KR20230068893A (ko) * 2021-11-11 2023-05-18 삼성전자주식회사 주사 전자 현미경(Scannig Electron Microscope, 이하 SEM), SEM을 동작시키는 방법 및 이를 이용한 반도체 소자를 제조하는 방법
US20240194440A1 (en) * 2022-12-09 2024-06-13 Kla Corporation System and method for multi-beam electron microscopy using a detector array
US20240271996A1 (en) * 2023-02-09 2024-08-15 Kla Corporation Optical beam sensor with center transmissive cut-out
DE112023004643T5 (de) * 2023-02-28 2025-10-02 Hitachi High-Tech Corporation Ladungsträgerstrahlvorrichtung
US20240387140A1 (en) * 2023-05-16 2024-11-21 Applied Materials Israel Ltd. Multiple electron beam optics
WO2025172004A1 (en) * 2024-02-16 2025-08-21 Asml Netherlands B.V. Systems and methods of energy-based filtering and detection of charged particles

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070221846A1 (en) * 2000-03-31 2007-09-27 Hideo Todokoro Scanning electron microscope
US20140124666A1 (en) * 2011-06-16 2014-05-08 Hitachi High-Technologies Corporation Charged Particle Beam Device
US20140175277A1 (en) * 2012-12-21 2014-06-26 Ict Integrated Circuit Testing Gesellschaft Fur Halbleiterpruftechnik Gmbh Secondary electron optics and detection device
US20140353498A1 (en) * 2013-06-04 2014-12-04 Kla-Tencor Corporation System and Method of SEM Overlay Metrology
US20150034836A1 (en) * 2013-07-31 2015-02-05 Hitachi High-Technologies Corporation Electron beam equipment

Family Cites Families (65)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4179604A (en) * 1978-09-29 1979-12-18 The United States Of America As Represented By The Secretary Of The Navy Electron collector for forming low-loss electron images
JPS607049A (ja) 1983-06-24 1985-01-14 Hitachi Ltd 電位測定装置
US4864228A (en) 1985-03-15 1989-09-05 Fairchild Camera And Instrument Corporation Electron beam test probe for integrated circuit testing
US5097127A (en) 1990-02-23 1992-03-17 Ibm Corporation Multiple detector system for specimen inspection using high energy backscatter electrons
US5210487A (en) 1991-06-04 1993-05-11 Schlumberger Technologies Inc. Double-gated integrating scheme for electron beam tester
JPH1012684A (ja) 1996-06-26 1998-01-16 Hitachi Ltd 半導体装置の検査方法及びその装置
US6570154B1 (en) 1998-09-08 2003-05-27 Kla-Tencor Technologies Corporation Scanning electron beam microscope
US6344750B1 (en) 1999-01-08 2002-02-05 Schlumberger Technologies, Inc. Voltage contrast method for semiconductor inspection using low voltage particle beam
US6627886B1 (en) 1999-05-14 2003-09-30 Applied Materials, Inc. Secondary electron spectroscopy method and system
EP1063677B1 (en) * 1999-06-23 2005-03-16 ICT Integrated Circuit Testing Gesellschaft für Halbleiterprüftechnik mbH Charged particle beam device
JP2001076990A (ja) 1999-08-31 2001-03-23 Canon Inc 荷電粒子線露光装置及びその制御方法
US6787772B2 (en) 2000-01-25 2004-09-07 Hitachi, Ltd. Scanning electron microscope
WO2001060456A1 (en) 2000-02-19 2001-08-23 Ion Diagnostics, Inc. Multi-beam multi-column electron beam inspection system
US6545277B1 (en) 2000-08-15 2003-04-08 Applied Materials, Inc. High efficiency, enhanced detecting in-lens light guide scintillator detector for SEM
JP4491977B2 (ja) * 2001-02-27 2010-06-30 株式会社島津製作所 Ｅｚフィルタ分光方法及びその装置
US6627884B2 (en) * 2001-03-19 2003-09-30 Kla-Tencor Technologies Corporation Simultaneous flooding and inspection for charge control in an electron beam inspection machine
AU2002259094A1 (en) * 2001-04-30 2002-11-11 Nptest, Inc Voltage acquisition with open-loop charged-particle-beam probe system
US6784425B1 (en) 2001-06-29 2004-08-31 Kla-Tencor Technologies Corporation Energy filter multiplexing
KR100825130B1 (ko) 2001-07-06 2008-04-24 어플라이드 머티어리얼스, 인코포레이티드 금속 에칭 공정 동안 플라즈마 에칭 챔버내에서 파티클을감소시키는 방법
EP1556881B1 (en) 2002-10-30 2013-08-28 Mapper Lithography Ip B.V. Electron beam exposure system
US6797955B1 (en) 2003-01-30 2004-09-28 Kla-Tencor Technologies Corporation Filtered e-beam inspection and review
CN101630623B (zh) 2003-05-09 2012-02-22 株式会社荏原制作所 基于带电粒子束的检查装置及采用了该检查装置的器件制造方法
US6979824B1 (en) 2003-06-26 2005-12-27 Kla-Tencor Technologies Corporation Filtered e-beam inspection and review
US7041976B1 (en) 2003-11-03 2006-05-09 Kla-Tencor Technologies Corporation Automated focusing of electron image
GB2411763B (en) * 2004-03-05 2009-02-18 Thermo Electron Corp Flood gun for charge neutralization
EP1605492B1 (en) 2004-06-11 2015-11-18 ICT Integrated Circuit Testing Gesellschaft für Halbleiterprüftechnik mbH Charged particle beam device with retarding field analyzer
US7019292B1 (en) 2004-06-15 2006-03-28 Kla-Tencor Technologies Corporation E-beam detection of defective contacts/vias with flooding and energy filter
US7335879B2 (en) 2004-08-16 2008-02-26 Hermes-Microvision, Inc. System and method for sample charge control
US7141791B2 (en) 2004-09-07 2006-11-28 Kla-Tencor Technologies Corporation Apparatus and method for E-beam dark field imaging
JP3929459B2 (ja) 2004-11-11 2007-06-13 株式会社日立ハイテクノロジーズ 荷電粒子線露光装置
EP1657736B1 (en) 2004-11-15 2016-12-14 ICT Integrated Circuit Testing Gesellschaft für Halbleiterprüftechnik mbH High current density particle beam system
EP1703537B9 (en) 2005-03-17 2008-10-22 ICT Integrated Circuit Testing Gesellschaft für Halbleiterprüftechnik mbH Analysing system and charged particle beam device
US7276694B1 (en) 2005-03-29 2007-10-02 Kla-Tencor Technologies Corporation Defect detection using energy spectrometer
US7683317B2 (en) 2005-10-20 2010-03-23 Applied Materials Israel, Ltd. Method and system for detecting hidden defects
US20070090288A1 (en) 2005-10-20 2007-04-26 Dror Shemesh Method and system for enhancing resolution of a scanning electron microscope
JP4812484B2 (ja) 2006-03-24 2011-11-09 株式会社日立ハイテクノロジーズ ボルテージコントラストを伴った欠陥をレビューする方法およびその装置
US7705301B2 (en) 2006-07-07 2010-04-27 Hermes Microvision, Inc. Electron beam apparatus to collect side-view and/or plane-view image with in-lens sectional detector
JP4914180B2 (ja) 2006-11-08 2012-04-11 株式会社日立ハイテクノロジーズ 時定数測定機能を搭載した走査型電子顕微鏡
JP4969231B2 (ja) 2006-12-19 2012-07-04 株式会社日立ハイテクノロジーズ 試料電位情報検出方法及び荷電粒子線装置
GB0700754D0 (en) * 2007-01-15 2007-02-21 Oxford Instr Analytical Ltd Charged particle analyser and method
US20110163229A1 (en) * 2007-02-22 2011-07-07 Applied Materials Israel, Ltd. High throughput sem tool
US7755043B1 (en) 2007-03-21 2010-07-13 Kla-Tencor Technologies Corporation Bright-field/dark-field detector with integrated electron energy spectrometer
JP5525128B2 (ja) 2007-11-29 2014-06-18 株式会社日立ハイテクノロジーズ 荷電粒子線応用装置及び試料観察方法
US7838833B1 (en) 2007-11-30 2010-11-23 Kla-Tencor Technologies Corporation Apparatus and method for e-beam dark imaging with perspective control
TWI473140B (zh) * 2008-04-11 2015-02-11 Ebara Corp 試料觀察方法與裝置，及使用該方法與裝置之檢查方法與裝置
US7714287B1 (en) 2008-06-05 2010-05-11 Kla-Tencor Corporation Apparatus and method for obtaining topographical dark-field images in a scanning electron microscope
EP2194565A1 (en) 2008-12-03 2010-06-09 FEI Company Dark field detector for use in a charged-particle optical apparatus
US8884224B2 (en) 2009-04-08 2014-11-11 Hermes Microvision, Inc. Charged particle beam imaging assembly and imaging method thereof
US9991147B2 (en) 2009-09-01 2018-06-05 Hermes Microvision, Inc. Wafer grounding and biasing method, apparatus, and application
WO2011124352A1 (en) 2010-04-09 2011-10-13 Carl Zeiss Smt Gmbh Charged particle detection system and multi-beamlet inspection system
US20130292568A1 (en) 2010-12-16 2013-11-07 Daisuke Bizen Scanning electron microscope and length measuring method using the same
JP5584159B2 (ja) 2011-03-24 2014-09-03 株式会社日立ハイテクノロジーズ 荷電粒子線装置及びパターン測定方法
NL2007604C2 (en) 2011-10-14 2013-05-01 Mapper Lithography Ip Bv Charged particle system comprising a manipulator device for manipulation of one or more charged particle beams.
WO2013012616A2 (en) * 2011-07-15 2013-01-24 Orbotech Ltd. Electrical inspection of electronic devices using electron-beam induced plasma probes
JP2013200182A (ja) * 2012-03-23 2013-10-03 Toshiba Corp 欠陥検査装置および欠陥検査方法
EP2654069B1 (en) * 2012-04-16 2016-02-24 ICT Integrated Circuit Testing Gesellschaft für Halbleiterprüftechnik mbH Multi channel detector, optics therefore and method of operating thereof
US8759764B2 (en) 2012-06-29 2014-06-24 Fei Company On-axis detector for charged particle beam system
US9000395B2 (en) 2013-03-25 2015-04-07 Hermes Microvision, Inc. Energy filter for charged particle beam apparatus
JP6295027B2 (ja) 2013-04-03 2018-03-14 株式会社日立ハイテクノロジーズ 荷電粒子線装置およびそれを用いた計測方法
US9048062B1 (en) 2013-05-14 2015-06-02 Hermes Microvision, Inc. Method for improving performance of an energy filter
US9048063B1 (en) 2013-05-14 2015-06-02 Hermes Microvision, Inc. Electron beam apparatus
EP2827136B1 (en) 2013-07-19 2020-02-26 ICT Integrated Circuit Testing Gesellschaft für Halbleiterprüftechnik mbH Switchable multi perspective detector, optics therefore and method of operating thereof
JP6270369B2 (ja) 2013-08-06 2018-01-31 コイト電工株式会社 交通信号制御機、交通信号装置、表示制御装置及び情報表示装置
US9165742B1 (en) 2014-10-10 2015-10-20 Kla-Tencor Corporation Inspection site preparation
US10460905B2 (en) 2015-09-23 2019-10-29 Kla-Tencor Corporation Backscattered electrons (BSE) imaging using multi-beam tools

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070221846A1 (en) * 2000-03-31 2007-09-27 Hideo Todokoro Scanning electron microscope
US20140124666A1 (en) * 2011-06-16 2014-05-08 Hitachi High-Technologies Corporation Charged Particle Beam Device
US20140175277A1 (en) * 2012-12-21 2014-06-26 Ict Integrated Circuit Testing Gesellschaft Fur Halbleiterpruftechnik Gmbh Secondary electron optics and detection device
US20140353498A1 (en) * 2013-06-04 2014-12-04 Kla-Tencor Corporation System and Method of SEM Overlay Metrology
US20150034836A1 (en) * 2013-07-31 2015-02-05 Hitachi High-Technologies Corporation Electron beam equipment

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