TWI692897B - In-line system for mass production of organic optoelectronic device and manufacturing method using the same - Google Patents

Abstract

An in-line system for mass production of organic optoelectronic device is disclosed. The in-line system includes a first chamber, a second chamber, and a patterned holder. A substrate is held by the patterned holder. The substrate is covered with a first electrode layer and a contact electrode layer. The first electrode layer and the contact electrode layer are partially shielded with the patterned holder. The first chamber is for forming an organic layer on portions of the first electrode layer and the contact electrode layer which are not shielded with the patterned holder. The second chamber, aligned with the first chamber, is for forming a second electrode layer on the organic layer.

Description

Continuous mass production equipment and use of organic photoelectric elements Manufacturing method of continuous mass production equipment

This disclosure relates to a continuous mass production device for organic photovoltaic elements, and to a method for manufacturing an organic photovoltaic element.

Light emitting devices such as organic light emitting diodes (OLEDs) are made by depositing organic materials and metal materials on the substrate. Traditionally, cluster deposition equipment is used to deposit various materials. As shown in FIG. 1, the cluster deposition apparatus 20 includes a robot arm 710 and a plurality of vacuum chambers 720 arranged radially around the robot arm 710. The robot arm 710 is configured to place the substrate in the vacuum chamber 720 to deposit various materials to make a light-emitting device.

However, using such a cluster deposition apparatus 20 to deposit various materials is time-consuming and costly. The reason is that, when the substrate is placed in the vacuum chamber 720 to deposit various materials, the deposition material in the vacuum chamber 720 and the corresponding mask must be replaced. In addition, various materials must be deposited After it is on the substrate, it must be removed and placed into the next substrate. Therefore, the development of a device that can effectively reduce the manufacturing hours and production costs of light-emitting devices is a subject studied by all parties.

An aspect of the present disclosure provides a continuous mass production device for organic optoelectronic devices, including a first cavity, a second cavity, and a patterned carrier. The patterned carrier carries a substrate, wherein the substrate is covered with a first electrode layer and a contact electrode layer, and wherein the patterned carrier can partially shield the first electrode layer and the contact electrode layer. The first cavity is used to form an organic layer on the first electrode layer and the contact electrode layer not covered by the patterned carrier. The second cavity is linearly arranged behind the first cavity to form a second electrode layer on the organic layer.

In an embodiment of the present disclosure, the first cavity may be a first vacuum evaporation cavity. The second cavity may also be a second vacuum evaporation cavity.

In an embodiment of the present disclosure, when forming the second electrode layer and the organic layer, the patterned carrier can be used as a mask, partially shielding the first electrode layer and the contact electrode layer, so there is no need to replace other masks cover.

In an embodiment of the present disclosure, the continuous mass production device of the present invention may further include a first vacuum channel, wherein after the organic layer is formed, the substrate may be transported to the second cavity through the first vacuum channel, The second electrode layer is formed.

In one embodiment of the disclosure, the invention is continuous The mass production equipment may further include a second vacuum channel, and a laser source is disposed in the second vacuum channel, which may be used to form an electrical connection member, which is electrically connected to the second electrode layer and the contact electrode layer.

In an embodiment of the present disclosure, the continuous mass production device of the present invention may further include a third cavity linearly arranged behind the second cavity, wherein a laser source is provided in the third cavity, which can be used to An electrical connector is formed to electrically connect the second electrode layer and the contact electrode layer. The third cavity may be a third vacuum evaporation cavity.

Another aspect of the present disclosure is to provide a method for manufacturing an organic optoelectronic device, including providing a substrate covered with a first electrode layer and a contact electrode layer; using the aforementioned continuous mass production equipment, the first electrode layer and the contact electrode On the layer, an organic layer is formed; and on the organic layer, a second electrode layer is formed. The manufacturing method of the present invention may further include forming an electrical connection member to electrically connect the second electrode layer and the contact electrode layer.

The above description will be described in detail in the following embodiments, and the technical solutions of the present disclosure will be further explained.

10‧‧‧Continuous mass production equipment for organic optoelectronic components

20‧‧‧Cluster deposition equipment

100‧‧‧Vacuum evaporation chamber

100a‧‧‧First vacuum evaporation chamber (first chamber)

100b‧‧‧Second vacuum evaporation chamber (second chamber)

100c‧‧‧Third vacuum evaporation chamber (third chamber)

110‧‧‧Evaporation source

120‧‧‧ entrance

130‧‧‧Export

140‧‧‧Exhaust Department

150‧‧‧ Entrance gate

160‧‧‧ Exit gate

200‧‧‧Vacuum channel

200a‧‧‧First vacuum channel

200b‧‧‧Second vacuum channel

300‧‧‧Conveying unit

400‧‧‧patterned vehicle

400a‧‧‧ opening

500‧‧‧Laser processing chamber

520‧‧‧ entrance

530‧‧‧Export

610‧‧‧First electrode layer

620‧‧‧ organic layer

630‧‧‧Second electrode layer

640‧‧‧Electrical connector

650‧‧‧Contact electrode layer

710‧‧‧Robot

720‧‧‧Vacuum chamber

800‧‧‧Loading cavity

820‧‧‧ entrance

830‧‧‧Export

840‧‧‧Exhaust Department

850‧‧‧ Entrance gate

860‧‧‧ Exit gate

900‧‧‧Buffer cavity

920‧‧‧ entrance

930‧‧‧Export

940‧‧‧Exhaust Department

950‧‧‧ Entrance gate

960‧‧‧ Exit gate

S‧‧‧Substrate

LS‧‧‧Laser source

TH‧‧‧Perforation

L1, L2‧‧‧Length

D1‧‧‧Conveying direction

D2, D3‧‧‧Distance

Figure 1 is a schematic top view of a traditional cluster deposition equipment.

FIG. 2 is a schematic cross-sectional view of a continuous mass production device for an organic photovoltaic element according to the first embodiment of the present disclosure.

FIG. 3 is a schematic cross-sectional view of a continuous mass production device for an organic photovoltaic element according to a second embodiment of the present disclosure.

FIG. 4 is a schematic cross-sectional view of a continuous mass production device for an organic photovoltaic element according to a third embodiment of the present disclosure.

FIG. 5 is a schematic cross-sectional view of a continuous mass production device for an organic photovoltaic element according to a fourth embodiment of the present disclosure.

FIG. 6 is a schematic cross-sectional view of a continuous mass production device for an organic photovoltaic element according to a fifth embodiment of the present disclosure.

FIG. 7 is a schematic cross-sectional view of a continuous mass production device for an organic photovoltaic element according to a sixth embodiment of the present disclosure.

8 to 9 are cross-sectional schematic diagrams at various stages of a method of manufacturing a light-emitting device according to an embodiment of the present disclosure.

In order to make the description of this disclosure more detailed and complete, the following provides an illustrative description of the implementation and specific embodiments of this disclosure; however, this is not the only way to implement or use specific embodiments of this disclosure. The embodiments disclosed below can be combined or replaced with each other under beneficial circumstances, and other embodiments can be added to an embodiment without further description or description. In the following description, many specific details will be described in detail to enable the reader to fully understand the following embodiments. However, embodiments of the present disclosure may be practiced without these specific details.

Furthermore, the relative terms of space, such as "below", "below", "below", "upper", "above", "above", etc., are for the convenience of describing one element or feature and another element or feature The relative relationship between. The true meaning of these spatial relative terms includes other orientations. For example, when the picture When the formula is turned upside down by 180 degrees, the relationship between one component and another component may change from "below", "below", "below" to "up", "above", "above". In addition, the relative spatial description used in this article should also be interpreted in the same way.

Please refer to FIG. 2, which is a schematic cross-sectional view of the continuous mass production device 10 of the organic photoelectric device according to the first embodiment of the present disclosure. The continuous mass production apparatus 10 for organic photoelectric elements includes a loading chamber 800, a plurality of vacuum evaporation chambers 100, a plurality of vacuum channels 200, and a conveying unit 300. The continuous mass production device 10 of organic optoelectronic components can be used for continuously vapor-depositing multiple layers of materials on a substrate S to manufacture electronic or optoelectronic components, such as solar cells or organic light-emitting diode devices and other electronic components.

In some embodiments, the substrate S is, for example, a GaAs substrate, a Ge substrate, or a silicon substrate, but other suitable substrates for vapor deposition of organic materials or metal materials may also be used.

The plurality of vacuum evaporation chambers 100 are configured to deposit multiple layers of materials on the substrate S. Specifically, each vacuum evaporation chamber 100 has an evaporation source 110, an inlet 120, an outlet 130, an inlet gate 150 at the inlet 120, and an outlet gate 160 at the outlet 130. The vapor deposition source 110 is, for example, a heater having a stable plating rate. As needed, various vapor deposition materials are put into the respective vacuum vapor deposition chambers 100, so that when the continuous mass production device 10 of the organic photovoltaic element is operated, each vapor deposition material can be heated to vaporization by the vapor deposition source 110, In order to attach and form a multilayer material on the lower surface of the substrate S. The vapor deposition material may be any material known in the art suitable for forming an electrode layer or an organic layer. for example, As shown in FIG. 2, the continuous mass production device 10 of organic photovoltaic elements includes three vacuum evaporation chambers 100, and in the three vacuum evaporation chambers 100, the first organic material layer and the second An organic material layer and an electrode material layer are on the lower surface of the substrate S.

It should be noted that although only three vacuum evaporation chambers 100 are shown in FIG. 2, in other embodiments, the continuous mass production apparatus 10 of organic photovoltaic elements may include more than three vacuum evaporation chambers 100. For example, the organic layer of the light-emitting device to be formed is a multilayer structure (for example, including a hole injection layer (HIL), a hole transport layer (HTL), an emission layer (EML), an electron transport layer (ETL), an electron injection layer In the case of (EIL) etc.), the continuous mass production device 10 of organic photovoltaic elements may include more than three vacuum evaporation chambers 100 to vapor-deposit corresponding organic material layers on the substrate S, respectively. In addition, other processing chambers, such as etching processing chambers, may be additionally inserted between the vacuum evaporation chambers 100 as needed.

In some embodiments, the vacuum evaporation chamber 100 has a suction part 140. The pumping part 140 is coupled to a vacuum pumping device (not shown) to pump out the gas in the vacuum evaporation chamber 100. In some embodiments, in order to achieve a high degree of vacuum (eg, ~10 ^-7 torr), when the gas in the vacuum evaporation chamber 100 is evacuated, the inlet gate 150 and the outlet gate 160 of each vacuum evaporation chamber 100 are closed.

In one embodiment, a vacuum channel is passed between the outlet 830 of the loading chamber 800 and the inlet 120 of the vacuum evaporation chamber 100 adjacent thereto 200 is connected, and two adjacent vacuum evaporation chambers 100 are connected through a vacuum channel 200.

It is worth mentioning that the vacuum channel 200 is configured so that when the multilayer material is vapor-deposited on the substrate S, the vacuum channel 200 communicates with the vacuum vapor deposition chamber 100 to which it is connected (that is, the inlet gate 150 and the outlet gate 160 are opened). In detail, the distance D2 between the evaporation source 110 and the inlet 120 of the vacuum evaporation chamber 100 and the distance D3 between the evaporation source 110 and the outlet 130 can be adjusted according to actual conditions. After the vapor deposition material is heated to vaporization by the vapor deposition source 110, the vapor deposition material only exists in the vacuum vapor deposition chamber 100. According to this, the gaseous vapor deposition material will not be scattered into the adjacent vacuum channel 200 and the adjacent vacuum evaporation cavity 100, thereby avoiding the pollution problem. In addition, when the continuous mass production equipment 10 of the organic photoelectric element is operated, since it is not necessary to open and close the entrance gate 150 and the exit gate 160, the transportation time of the substrate S can be saved, so that the manufacturing time of the light emitting device can be effectively reduced.

In some embodiments, the continuous mass production device 10 of organic photovoltaic elements further includes a patterned carrier 400. The patterned carrier 400 is configured to carry the substrate S. As shown in FIG. 2, in one embodiment, the patterning carrier 400 has an opening 400a, and the shape of the multilayer material formed on the substrate S corresponds to the shape of the opening 400a. Specifically, the patterned carrier 400 may serve as a mask to shield a part of the lower surface of the substrate S, and the opening 400a exposes another part of the lower surface of the substrate S. Therefore, the vapor deposition material heated by the vapor deposition source 110 until vaporized adheres only to the exposed portion of the lower surface of the substrate S.

The loading chamber 800 has an inlet 820, an outlet 830, a suction part 840, an inlet gate 850 at the inlet 820, and an outlet gate 860 at the outlet 830. The pumping part 840 is coupled to a vacuum pumping device (not shown) to pump the gas in the loading chamber 800. Specifically, the outlet 830 of the loading chamber 800 is connected to the inlet 120 of the vacuum evaporation chamber 100 adjacent thereto.

It should be understood that the loading chamber 800 is configured such that when a substrate S is placed into the loading chamber 800 from the inlet 820 of the loading chamber 800, the loading chamber 800 is not in communication with its adjacent vacuum evaporation chamber 100 (ie, the exit gate 860 is closed). According to this, when the substrate S is placed in the loading chamber 800, the high vacuum degree of each vacuum evaporation chamber 100 will not be affected. After the substrate S is placed in the loading chamber 800, the entrance gate 850 is closed, and the gas in the loading chamber 800 is evacuated by a vacuum exhaust device (not shown) to make the loading chamber 800 reach the vacuum evaporation chamber The high vacuum degree of the body 100 is similar. Subsequently, the outlet gate 860 is opened to convey the substrate S from the outlet 830 of the loading chamber 800 to the inlet 120 of the vacuum evaporation chamber 100. That is, by setting the loading chamber 800, the substrate S can be fed into the continuous mass production apparatus 10 of the organic photoelectric element without affecting the high vacuum degree of each vacuum evaporation chamber 100.

The conveying unit 300 is located in the loading chamber 800 and each vacuum evaporation chamber 100. In an embodiment, the conveying unit 300 includes conveying rollers, conveying rollers, or conveying chains, but not limited thereto. The conveying unit 300 is configured to convey the substrate S from the inlet 820 to the outlet 830 of the loading chamber 800 in a conveying direction D1, and convey the substrate S from the outlet 830 through the vacuum channel 200 to the adjacent one The inlet 120 of the vacuum evaporation chamber 100. In addition, the transport unit 300 is configured to transport the substrate S in the transport direction D1 from the inlet 120 to the outlet 130 of each vacuum evaporation chamber 100 and from the outlet 130 through the vacuum channel 200 to the vacuum evaporation chamber adjacent thereto The entrance 120 of the body 100.

As shown in FIG. 2, in an embodiment of the present disclosure, the transport unit 300 may be located only in the loading chamber 800 and each vacuum evaporation chamber 100, but not in the vacuum channel 200. In detail, in one embodiment, in the conveying direction D1, a ratio of a length L1 of the vacuum channel 200 to a length L2 of the patterned carrier 400 is 1:2~1:4. In other words, the length L2 of the patterning carrier 400 is greater than the length L1 of the vacuum channel 200, so that the patterning carrier 400 can traverse the vacuum channel 200 from the transport unit 300 located in a vacuum evaporation chamber 100 to another vacuum evaporation The transport unit 300 in the plating chamber 100. In addition, it should be noted that although in the second figure, only one patterned carrier 400 (or one substrate S) is provided on the conveying unit 300 in one vacuum evaporation chamber 100, in other embodiments, one The conveying unit 300 in the vacuum evaporation chamber 100 may have multiple patterned carriers 400 (or multiple substrates S) at the same time. In other words, the conveying unit 300 located in a vacuum evaporation chamber 100 can simultaneously convey a plurality of substrates S, so that the plurality of substrates S are simultaneously vapor-deposited.

In some embodiments, the continuous mass production device 10 of organic photovoltaic elements further includes a control unit (not shown). The control unit is configured to control the transport unit 300 to remove the substrate S from the entrance of each vacuum evaporation chamber 100 120 Time to deliver to outlet 130. According to this, the thickness of each layer formed on the substrate S is controlled by controlling the transport time of the substrate S in each vacuum evaporation chamber 100 (that is, the time of being evaporated).

Please refer to FIG. 3, which is a schematic cross-sectional view of a continuous mass production device 10a of an organic optoelectronic device according to a second embodiment of the present disclosure. It should be noted that in FIG. 3, elements that are the same as or similar to FIG. 2 are given the same symbols, and related descriptions are omitted. The continuous mass production device 10a of the organic photovoltaic element in FIG. 3 is similar to the continuous mass production device 10 of the organic photovoltaic element in FIG. 2, the difference is that the continuous mass production device 10a of the organic photovoltaic element in FIG. 3 further includes一Buffer cavity 900. The buffer chamber 900 has an inlet 920, an outlet 930, a suction part 940, an inlet gate 950 at the inlet 920, and an outlet gate 960 at the outlet 830.

Specifically, the pumping portion 940 is coupled to a vacuum pumping device (not shown) to pump the gas in the buffer cavity 900. The inlet 920 of the buffer chamber 900 is connected to the outlet 830 of the loading chamber 800, and the outlet 930 of the buffer chamber 900 is connected to the inlet 120 of the vacuum evaporation chamber 100 adjacent thereto. More specifically, the transport unit 300 is located in the buffer chamber 900, and the transport unit 300 is configured to transport the substrate S from the outlet 830 of the loading chamber 800 through the vacuum channel 200 to the inlet 920 of the buffer chamber 900 in the transport direction D1 . In addition, the transport unit 300 is configured to transport the substrate S in the transport direction D1 from the inlet 920 to the outlet 930 of the buffer chamber 900 and from the outlet 930 through the vacuum channel 200 to the vacuum evaporation chamber 100 adjacent thereto Entrance 120.

It should be understood that the buffer cavity 900 is configured such that when the substrate S enters the buffer cavity 900 and the gas in the buffer cavity 900 is evacuated, the buffer cavity 900 is not in communication with the loading cavity 800 and each vacuum evaporation cavity 100. In detail, in order to quickly feed the substrate S into each vacuum evaporation chamber 100 without affecting the high vacuum degree of each vacuum evaporation chamber 100, the characteristics of the high vacuum degree can be quickly achieved by using the buffer chamber 900 , The substrate S can be fed into each vacuum evaporation chamber 100 faster.

In more detail, when there is no buffer chamber 900 (as shown in FIG. 2 of the continuous mass production apparatus 10 for organic photoelectric elements), in order to transport the substrate S from the loading chamber 800 to the vacuum evaporation chamber 100 , The gas in the loading chamber 800 must be evacuated to achieve a high vacuum degree close to the vacuum evaporation chamber 100. However, when the inlet 820 of the loading chamber 800 is opened to place the substrate S, the loading chamber 800 is in a normal pressure state. Since it is time-consuming to extract the gas from the normal pressure state to reach a high vacuum degree, the first vacuum degree can be achieved first in the loading chamber 800 by the setting of the buffer chamber 900, and the The second vacuum degree of the vacuum evaporation chamber 100 is similar. For example, the vacuum degree of each vacuum evaporation chamber 100 is about 10 ^-7 torr. After the substrate S is put into the loading chamber 800, the inlet gate 850 and the outlet gate 860 of the loading chamber 800 are closed, and the gas in the loading chamber 800 is extracted to achieve a vacuum of about ^10-2 torr. Next, the exit gate 860 of the loading chamber 800 is opened to convey the substrate S into the buffer chamber 900 (at this time, the exit gate 960 of the buffer chamber 900 is closed). Subsequently, the inlet gate 950 of the buffer chamber 900 is closed, and the gas in the buffer chamber 900 is evacuated to achieve a vacuum of about 10 ^-6 torr.

Please refer to FIG. 4, which is a schematic cross-sectional view of a continuous mass production device 10 b of an organic optoelectronic device according to a third embodiment of the present disclosure. It should be noted that in FIG. 4, elements that are the same as or similar to those in FIG. 2 are given the same symbols, and related descriptions are omitted. The continuous mass production device 10b of the organic photovoltaic element in FIG. 4 is similar to the continuous mass production device 10 of the organic photovoltaic element in FIG. 2, the difference is that the continuous mass production device 10b of the organic photovoltaic element in FIG. 4 further includes One laser processing cavity 500.

The laser processing chamber 500 has a laser source LS, an inlet 520, and an outlet 530. The inlet 520 of the laser processing chamber 500 is connected to the outlet 530 of a vacuum evaporation chamber 100 through a vacuum channel 200. The laser source LS is configured to emit a laser beam through one or more layers of material formed on the substrate S.

Please refer to FIG. 5. FIG. 5 is a schematic cross-sectional view of a continuous mass production device 10c of an organic optoelectronic device according to a fourth embodiment of the present disclosure. The continuous mass production device 10c of the organic photovoltaic element in FIG. 5 is similar to the continuous mass production device 10b of the organic photovoltaic element in FIG. 4, except that the continuous mass production device 10c of the organic photovoltaic element in FIG. 5 The injection processing chamber 500 is disposed between two vacuum evaporation chambers 100. According to this, after the laser beam penetrates one or more layers of materials, other layers of materials can be continuously deposited in the next vacuum evaporation chamber 100.

Please refer to FIG. 6, which illustrates the fifth implementation of the disclosure 10d is a schematic cross-sectional view of a continuous mass production device 10d of organic photovoltaic elements. The continuous mass production device 10d of the organic photovoltaic element in FIG. 6 is similar to the continuous mass production device 10 of the organic photovoltaic element in FIG. 2, and one of the differences is that the continuous mass production device of the organic photovoltaic element in FIG. 6 In 10d, one of the third vacuum evaporation chambers 100c further includes a laser source LS. That is, in some embodiments, the laser source LS may be directly disposed in the vacuum evaporation chamber 100 to emit a laser beam through one or more layers of material formed on the substrate S.

Please refer to FIG. 7, which is a schematic cross-sectional view of a continuous mass production device 10 e of an organic optoelectronic device according to a sixth embodiment of the disclosure. The continuous mass production device 10e of the organic photovoltaic element in FIG. 7 is similar to the continuous mass production device 10 of the organic photovoltaic element in FIG. 2, one of the differences is that the continuous mass production device of the organic photovoltaic element in FIG. 7 In 10e, one of the second vacuum channels 200b is provided with a laser source LS. According to this, in some embodiments, when the substrate S is transferred from one second vacuum evaporation chamber 100b to another vacuum evaporation chamber 100, the laser can be emitted by the laser source LS in the vacuum channel 200 In order to break down one or more layers of material on the substrate S.

The disclosure also provides a method of manufacturing a light-emitting device. 8 to 9 are schematic cross-sectional views of various stages of a method of manufacturing a light-emitting device according to an embodiment of the present disclosure.

Please also refer to Figure 8 ~ Figure 9. In various embodiments, a method of manufacturing a light-emitting device includes (i) providing a substrate S, wherein a first electrode layer 610 and a contact electrode layer 650 are provided on the substrate S; (ii) on the substrate S Sequentially forming the organic layer 620 and the second electrode layer 630 (as shown in FIG. 8); and (iii) using a laser to penetrate the second electrode layer 630 and the organic layer 620 below it The through hole TH of the two-electrode layer 630 (as shown in FIG. 9).

Specifically, operations (ii) and (iii) can be performed by the aforementioned continuous mass production device 10b, 10c, 10d, or 10e of an organic photovoltaic element. For example, a continuous mass production device 10b of an organic photovoltaic element as shown in FIG. 4 may be used to sequentially form an organic layer 620 and a second electrode layer on a substrate S in a plurality of vacuum evaporation chambers 100 630. Next, in the laser processing chamber 500, a laser is used to penetrate the second electrode layer 630 and the organic layer 620 therebelow, thereby generating a through hole TH penetrating the organic layer 620 and the second electrode layer 630.

Alternatively, referring to FIG. 7, the continuous mass production device 10e of the present invention may include a first cavity 100a, a second cavity 100b, and a patterned carrier 400, which is carried by the patterned carrier 400 One substrate S.

Please refer to FIG. 9, the substrate S is covered with a first electrode layer 610 and a contact electrode layer 650, and the patterned carrier 400 (FIG. 7) can partially shield the first electrode layer 610 (FIG. 9) and the contact electrode Layer 650.

Referring to FIG. 7, the first cavity 100 a is used to form an organic layer 620 on the first electrode layer 610 (FIG. 9) and the contact electrode layer 650 that are not shielded by the patterned carrier 400. The second cavity 100b (FIG. 7) is linearly arranged behind the first cavity 100a to form a second electrode layer 630 on the organic layer 620 (FIG. 9).

Please refer to FIG. 7. In one embodiment, the patterned carrier 400 has an opening 400 a and a second electrode layer formed on the substrate S The shape of 630 (FIG. 9) and the organic layer 620 correspond to the shape of the opening 400a (FIG. 7). Specifically, the patterned carrier 400 may serve as a mask to shield a part of the lower surface of the substrate S, and the opening 400a exposes another part of the lower surface of the substrate S.

In some embodiments, the first cavity 100a may be a first vacuum evaporation cavity. The second cavity 100b can also be a second vacuum evaporation cavity, so that the present invention can form an organic layer and a second electrode layer completely in an in-line vacuum equipment to avoid external pollution, Improve the mass production speed and quality of components.

When forming the second electrode layer 630 (Figure 9) and the organic layer 620, the patterned carrier 400 (Figure 7) can be used as a mask to partially shield the first electrode layer 610 and the contact electrode layer 650, so There is no need to replace other masks, and there is no need to use a mechanical arm to replace the mask, which can effectively reduce the number of masks used and the number of positioning, greatly reduce the time required for the manufacturing process, and avoid possible pollution caused by replacing the mask. Yield and speed of mass production.

Please refer to FIG. 7, the continuous mass production equipment of the present invention may further include a first vacuum channel 200a. After the organic layer 620 (FIG. 9) is formed, the substrate 400 (FIG. 7) may be transported to the second cavity 100b through the first vacuum channel 200a to form the second electrode layer 630 (FIG. 9).

Please refer to FIG. 7, the continuous mass production equipment of the present invention may further include a second vacuum channel 200b. A laser source LS may be provided in the second vacuum channel 200b to form an electrical connection member 640 (FIG. 9) to electrically connect the second electrode layer 630 and the contact electrode layer 650. In the second vacuum channel 200b (Figure 7), the formation of the electrical connector 640 (Figure 9) can make the present invention completely In an In-Line vacuum equipment, an organic layer, a second electrode layer, and electrical connectors are formed to avoid external pollution and improve the quality and speed of component quantities.

Alternatively, referring to FIG. 6, the continuous mass production device 10d of the present invention may further include a third cavity 100c, which is linearly arranged behind the second cavity 100b, wherein a laser is disposed in the third cavity 100c The source LS can be used to form an electrical connection 640 (FIG. 9), which is electrically connected to the second electrode layer 630 and the contact electrode layer 650. The third cavity 100c (Figure 6) may be a third vacuum evaporation cavity.

Another aspect of the present disclosure is to provide a method for manufacturing an organic optoelectronic device, including providing a substrate S covered with a first electrode layer 610 (Figure 9) and a contact electrode layer 650; using the continuous mass production equipment described above, in On the first electrode layer 610 and the contact electrode layer 650, an organic layer 620 is formed; and on the organic layer 620, a second electrode layer 630 is formed. The manufacturing method of the present invention may further include forming an electrical connector 640 on the sidewall of the through hole TH. The electrical connector 640 is electrically connected to the second electrode layer 630 and the contact electrode layer 650.

The formation method of the through hole TH is, for example, in a vacuum channel 200b provided with a laser source LS (Figure 7), a laser is used to penetrate the second electrode layer 630 and the organic layer 620 underneath, to produce a through organic layer 620 and The through hole TH of the second electrode layer 630. In some embodiments, when a laser is used to penetrate the second electrode layer 630 and the organic layer 620, an electrical connection 640 is generated on the sidewall of the through hole TH.

Since the present invention can form an organic layer, a second electrode layer, and electrical connectors completely in an in-line vacuum equipment, external pollution can be avoided, and the quality and speed of the components can be improved. In addition, use this post In the continuous mass production equipment of the Ming Dynasty, when forming the second electrode layer and the organic layer, the patterned carrier itself can be used as a carrier or a mask to partially shield the first electrode layer and the contact electrode layer, so there is no need Replacing other masks greatly reduces the time required for the manufacturing process, avoids the pollution that may be caused when replacing the mask, and improves the yield and speed of mass production. Furthermore, when one substrate is forming an electrical connection member, another substrate can form a second electrode layer, and the other substrate can form an organic layer to achieve the effect of rapid mass production. On the other hand, the present invention does not require the use of a mechanical arm for mask replacement, which can effectively reduce the number of masks used and the number of positioning times.

In other words, since the vacuum evaporation chambers, laser processing chambers, and other processing chambers in the continuous mass production equipment for organic optoelectronic elements disclosed herein are interconnected, multiple substrates can be simultaneously carried by the transport unit Transport and perform processes such as vapor deposition and laser in each cavity, thereby reducing the manufacturing time of the light-emitting device. In addition, compared with the traditional cluster deposition equipment, the continuous mass production equipment of the organic photoelectric device disclosed herein uses a patterned carrier as a mask, and the mask pattern is suitable for each vacuum evaporation chamber, Therefore, the time for replacing the mask and positioning is effectively reduced.

Although the present disclosure has been disclosed as above, other embodiments are also possible. Therefore, the spirit and scope of the requested items are not limited to the description contained in the embodiments herein.

Anyone who is familiar with this skill can understand that various changes and modifications can be made without departing from the spirit and scope of this disclosure. Therefore, the scope of protection of this disclosure shall be subject to the scope defined in the attached patent application.

10e‧‧‧Continuous mass production equipment for organic optoelectronic components

100‧‧‧Vacuum evaporation chamber

100a‧‧‧First vacuum evaporation chamber (first chamber)

100b‧‧‧Second vacuum evaporation chamber (second chamber)

110‧‧‧Evaporation source

120‧‧‧ entrance

130‧‧‧Export

140‧‧‧Exhaust Department

150‧‧‧ Entrance gate

160‧‧‧ Exit gate

200‧‧‧Vacuum channel

200a‧‧‧First vacuum channel

200b‧‧‧Second vacuum channel

300‧‧‧Conveying unit

400‧‧‧patterned vehicle

400a‧‧‧ opening

800‧‧‧Loading cavity

820‧‧‧ entrance

830‧‧‧Export

840‧‧‧Exhaust Department

850‧‧‧ Entrance gate

860‧‧‧ Exit gate

S‧‧‧Substrate

D1‧‧‧Conveying direction

LS‧‧‧Laser source

Claims (10)

A continuous mass production device for organic optoelectronic components, comprising: a patterned carrier carrying a substrate, wherein the substrate is covered with a first electrode layer and a contact electrode layer, and wherein the patterned carrier shields the first electrode A layer and a part of the contact electrode layer; a first cavity for forming an organic layer on the other part of the first electrode layer and the contact electrode layer not covered by the patterned carrier; a second The cavity is linearly arranged behind the first cavity to form a second electrode layer on the organic layer; a first vacuum channel in which the substrate can pass through the first after the organic layer is formed The vacuum channel is transported to the second cavity to form the second electrode layer; a transport unit is located in the first cavity and the second cavity, but does not exist in the first vacuum channel; and wherein The length of the patterned carrier is greater than the length of the first vacuum channel. The continuous mass production device for organic photoelectric elements according to claim 1, wherein the first cavity is a first vacuum evaporation cavity. The continuous mass production device for organic photoelectric elements according to claim 2, wherein the second cavity is a second vacuum evaporation cavity. The continuous mass production device for organic optoelectronic devices according to claim 1, wherein when forming the second electrode layer and forming the organic layer, the patterned carrier can be used as a mask to partially shield the first electrode Layer and the contact electrode layer, there is no need to replace other masks. The continuous mass production device for organic photovoltaic elements according to claim 1, wherein the length of the first vacuum channel and the patterned carrier The ratio of the length is 1:2~1:4. The continuous mass production device for organic photoelectric elements according to claim 5, further comprising a second vacuum channel, a laser source is provided in the second vacuum channel, which can be used to form an electrical connection part, which is electrically connected to the The second electrode layer and the contact electrode layer. The continuous mass production device for organic photovoltaic elements according to claim 1, further comprising a third cavity linearly arranged behind the second cavity, wherein a laser source is provided in the third cavity, available In order to form an electrical connector, the second electrode layer and the contact electrode layer are electrically connected. The continuous mass production device for organic photoelectric elements according to claim 7, wherein the third cavity is a third vacuum evaporation cavity. A method for manufacturing an organic optoelectronic component, comprising: providing a substrate covered with a first electrode layer and a contact electrode layer; using the continuous mass production equipment described in any one of claims 1 to 8, in the first An organic layer is formed on the electrode layer and the contact electrode layer; and the second electrode layer is formed on the organic layer. A method for manufacturing an organic optoelectronic component, comprising: providing a substrate covered with a first electrode layer and a contact electrode layer; using the first cavity of the continuous mass production device as described in claim 7, to form the organic layer Forming the second electrode layer on the organic layer; and using the laser source arranged in the third cavity linearly behind the second cavity to form the electrical connector, electrically connected The second The electrode layer and the contact electrode layer.

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