TWI688018B - Method and device for attaching radiating rubber pad - Google Patents

Abstract

The invention provides a method and a device for bonding a heat-dissipating rubber pad, including: providing an object to be attached; setting the heat-dissipating rubber pad on a material tape; providing a bonding device for setting the material tape; The mechanism applies the heat dissipation rubber pad on the material tape to the object to be attached; the attachment mechanism indirectly contacts the heat dissipation rubber pad by rolling, from the other side of the heat dissipation rubber pad to the object to be attached, The heat dissipation rubber pad is attached to the object; thereby, the heat dissipation rubber pad can be attached to the object in an automated manner.

Description

Method and device for attaching radiating rubber pad

The invention relates to a laminating method and mechanism, in particular to a laminating method and device for attaching a heat-dissipating rubber pad to an object.

Press, in the general chip packaging process, a glue is usually applied on a substrate, and then a die is adhered to the substrate, and a layer of heat dissipation glue must be coated on the die, and then a heat sink is adhered to The heat dissipation glue is overlaid on the die and the substrate; recently, the heat dissipation glue has been gradually replaced by a heat dissipation glue pad with heat dissipation function. The top and bottom surfaces of each heat dissipation rubber pad are covered with a layer of film. The operator first tears off a layer of film, and then sticks the surface of the heat dissipation rubber pad that has no film on the upper surface of the die , And then tear off the film on the other side, and then stick the heat sink above the heat dissipation pad.

In the prior art, the heat-dissipating rubber pad is used to replace the heat-dissipating glue. Although the process of applying the heat-dissipating glue can be reduced, the adhesion of each piece of the heat-dissipating glue pad by man-made method cannot improve the efficiency of the process, and each piece of the heat-dissipating glue The quality of the pads is different, and it is not economical for mass production.

It is the object of the present invention to provide a method for attaching a heat-dissipating rubber pad to the object to be attached.

Another object of the present invention is to provide a device for attaching a heat-dissipating rubber pad to an object to be attached.

Another object of the present invention is to provide an apparatus for performing the method for attaching the heat dissipation rubber pad.

The method for bonding heat-dissipating rubber pads according to the purposes of the present invention includes: providing an object to be attached; setting the heat-dissipating rubber pads on a tape; providing a bonding device to set the tape; the bonding device using a bonding mechanism Apply the heat-dissipating rubber pad on the material tape to the object to be attached; the attachment mechanism indirectly contacts the heat-dissipating rubber pad by rolling, from the other side of the heat-dissipating rubber pad opposite the object to be attached The heat dissipation rubber pad is attached to the object.

According to another object of the present invention, a heat-dissipating rubber pad bonding device includes: a bonding mechanism, which can be driven to move up and down and interlock with a fixed plate; and a material belt, which is provided on the fixed plate, and which is provided on the material belt There is a heat dissipation rubber pad, the heat dissipation rubber pad is covered by a first envelope and a second envelope to form the tape, the heat dissipation adhesive pad is adhered under the second envelope, and the heat dissipation adhesive pad faces Pass down one of the fitting mechanisms and stick it under the head.

A heat-dissipating rubber pad bonding device according to another object of the present invention includes: a device for performing the heat-dissipating rubber pad bonding method as described above.

The method and device for bonding the heat-dissipating rubber pads according to the embodiments of the present invention, since the bonding operator can no longer work by humans, the automatic bonding operation improves production efficiency, increases accuracy and has consistent quality, and has substantial benefits.

A: Attached

A1: substrate

A2: grain

A3: Thermal pad

A31: The first envelope

A32: second envelope

A321: Pinhole

A4: Heat sink

A5: Strip

A6: material roll

A61: Shaft hole

A62: Sleeve

B: Laminating device

B1: Fitting organization

B11: Carrier

B12: Swing seat

B121: Upper swing seat

B122: hem seat

B13: deflection mechanism

B131: pivot

B132: pivot

B133: Driver

B134: fixings

B135: output shaft

B136: Swing arm

B137: connector

B14: Lifting seat

B141: fixing

B142: Slide rail

B143: Driver

B144: connector

B145: fine-tuning parts

B15: close to the head

B151: Wheel seat

B151: Wheel seat

B152: Slide rail

B153: rack

B154: Driver

B155: fixed frame

B156: Gear

B16: Displacement guide

B161: Driver

B162: Slide rail

B2: fixed plate

B21: Sculpting interval

B22: Fixed part

B23: Guide rod

B24: fixed guide

B3: rail seat

B4: Alignment inspection unit

B5: Drive mechanism

B51: Driver

B52: belt

B53: Drive shaft

B531: convex key

B54: Needle wheel

B541: Groove

B542: Inlay

B55: Shaft

B551: coupling piece

B56: Inlay parts

B57: spacer

B58: Pressure belt mechanism

B581: Drive parts

B582: Pressing pieces

B583: Hollow section

B584: Rod shaft wheel

B59: Hole position detection unit

B591: Adjustment lever

B592: detector

B6: material pulley

B61: distance sensor

B62: belt

B7: The first reel

B71: Driver

B72: Belt

B8: The second reel

FIG. 1 is a schematic diagram of an object to be attached in an embodiment of the present invention.

FIG. 2 is an exploded schematic view of a heat-dissipating rubber pad and a heat-radiating fin attached to an object in the embodiment of the present invention.

FIG. 3 is a three-dimensional schematic diagram of a material roll formed with a heat-dissipating rubber pad in an embodiment of the present invention.

FIG. 4 is a schematic perspective view of a bonding device in an embodiment of the present invention.

FIG. 5 is a schematic rear perspective view of one side of the bonding device in the embodiment of the present invention.

6 is a schematic perspective view of the rear side of the other side of the bonding device in the embodiment of the present invention.

FIG. 7 is a perspective schematic view of the bonding mechanism of the bonding device in the embodiment of the present invention.

FIG. 8 is a perspective schematic view of the lifting mechanism and the underlying mechanism of the attaching mechanism in the embodiment of the present invention.

FIG. 9 is a perspective schematic view of the lifting seat and the underlying mechanism of the bonding mechanism in the embodiment of the present invention.

10 is a schematic perspective view of the mechanism of the abutment head and the position below the lifting base in the embodiment of the present invention.

11 is a perspective schematic view of the driving mechanism in the embodiment of the present invention.

12 is a schematic side view of the driving mechanism in the embodiment of the present invention.

FIG. 13 is a schematic diagram of the bonding device winding the material tape in the embodiment of the present invention.

FIG. 14 is a schematic diagram of the lowering of the bonding mechanism for bonding the heat-dissipating rubber pad in the embodiment of the present invention.

FIG. 15 is a schematic diagram of the upward movement of the bonding mechanism in the embodiment of the present invention to separate the second envelope and the heat dissipation rubber pad from one side.

Please refer to FIG. 1, the heat dissipation adhesive pad bonding method according to the embodiment of the present invention uses the object shown in the figure that has the die A2 adhered to the substrate A1 as the object to be attached A, when performing the heat dissipation adhesive pad bonding method of the present invention , A piece of heat-dissipating rubber pad A3 will be pasted on the die A2 of the object A as shown in FIG. 2, as in the subsequent manufacturing process, the heat sink A4 will be attached to the heat-dissipating rubber pad A3 to cover the substrate A1 and The grain A2 is not discussed in the present invention.

Please refer to FIG. 3, the heat dissipating rubber pad bonding method of the embodiment of the present invention will make the heat dissipating rubber pad A3 covered with a long strip-shaped first envelope A31 and a second envelope A32 to form a material strip A5, A plurality of the heat-dissipating rubber pads A3 are successively arranged at regular intervals in sequence, and the upper and lower surfaces of each of the heat-dissipating rubber pads A3 are adhesive and adhere to the inner layers of the first envelope A31 and the second envelope A32, wherein, Each side of the second envelope A32 has a row of a plurality of pinholes A321 continuously arranged at equal intervals, and the two rows of pinholes A321 are separated by a gap that is greater than the width of the heat dissipating rubber pad A3 and is provided for the dispersion The hot glue pad A3 is glued therein, and the material tape A5 can be wound on a sleeve A62 provided with a shaft hole A61 to form a ring-shaped material roll A6.

Please refer to FIGS. 4-6. The whole bonding device B can be driven to move up and down and left and right. The bonding device B is fixed by a carrier B11 of a bonding mechanism B1 through an engraving section B21 of a fixing plate B2 The Z-axis rail seat B3 is provided on the rear side of the fixing plate B2, and the attaching mechanism B1 is fixed to the fixing plate B2 by a swing seat B12, thereby enabling the attaching mechanism B1 to use the carrier B11 When driven by the rail base B3 for Z-axis displacement, the fixed plate B2 can be linked together for Z-axis synchronous displacement; the swing seat B12 includes upper swing seats B121 respectively located above and below the carrier B11 And the hem base B122; one side of the fitting mechanism B1 is provided with an alignment inspection unit B4 for inspection from top to bottom, the alignment inspection unit B4 is not disposed on the fixing plate B2, but is located on the fixing plate One side of B2 is fixed with a fixing member B41 and the rail base B3 on the rear side of the fixing plate B2 at a distance, and is interlocked by the rail base B3; the front surface of the fixing plate B2 is provided with: a driving mechanism B5, Set on the other side of the bonding mechanism B1 relative to the alignment inspection unit B4; the driving mechanism B5 is driven by a driving member B51 on the rear side of the fixing plate B2 by a belt B52 to link the tape as shown in FIG. 3 The second envelope A32 of A5 is driven by traction; a material pulley B6 is provided above the bonding mechanism B1, and is driven by a driving member B61 on the rear side of the fixing plate B2 driven by a belt B62 to rotate. The material pulley B6 is used to sleeve the material roll A6 as shown in FIG. 3, and a distance sensor B61 is provided on the front surface of the fixing plate B2 to detect the change in the distance from the circumference of the material roll A6 to calculate Test whether the material roll A6 should be replaced after it is used up; A first reel B7 is provided on the other side of the bonding mechanism B1 relative to the alignment inspection unit B4, and is located above the driving mechanism B5, which is driven by a driving member B71 on the rear side of the fixing plate B2. Rotation; used to wind up the first envelope A31 of the tape A5 as shown in FIG. 3; a second reel B8 is provided on the other side of the bonding mechanism B1 relative to the alignment inspection unit B4, and is located on the Between the upper part of the driving mechanism B5 and the lower part of the first reel B7, the belt B72 driven by the driving member B71 on the rear side of the fixing plate B2 rotates synchronously with the first reel B7; 3 The second envelope A32 of the tape A5.

Please refer to FIG. 7, a deflection mechanism B13 is provided between the carrier B11 and the swing base B12 of the bonding mechanism B1, and the deflection mechanism B13 is formed on the upper swing base B121 and the lower swing seat of the carrier B11 and the swing base B12 A pivot axis B131 is arranged in series with the Z axis between the B122. On both sides of the upper swing base B121 of the swing base B12 on both sides of the pivot axis B131, two outwardly protruding two pivoting portions B132 are respectively formed by a motor. The driving element B133 is fixed on the front side of the carrier B11 by a fixing element B134, and its output shaft B135 and a swing arm B136 are fixed in the center, and a connecting member B137 and the two pivoting parts are respectively arranged on both sides of the swing arm B136 B132 is pivotally arranged, so that the swing arm B136, the two connecting members B137, and the two pivoting parts B132 together form a four-bar linkage mechanism. When the driving member B133 drives the output shaft B135 to rotate, the fixed shaft fixed to the output shaft B135 The swing arm B136 will swing horizontally, so that the two connecting pieces B137 pivoted on both sides form a front and back misalignment, so that the two pivoting parts B132 link the upper swing seat B121 of the swing seat B12 to make The fixing plate B2 fixed on the swing seat B121 and the lower swing seat B122 uses the pivot B131 as the axis to link the components on it for deflection; a lifting seat B14 that can move up and down in the Z axis is provided below the carrier B11 There is an abutment head B15 under the lifting seat B14. The abutment head B15 is composed of a rod-shaped wheel body with a central axis in the X axis direction. The fixing plate B2 on the abutment head B15 side is marked with X A displacement guide bar B16 parallel to the abutting head B15 is provided in the axial direction. The displacement guide bar B15 is driven by a driving member B161 composed of a cylinder at the rear of the fixing plate B2 shown in FIG. Axial slide rail B162 moves up and down.

Please refer to FIGS. 8-9. The lifting seat B14 is provided with a fixing member B141 on the two Z-axis slide rails B142 on the front side of the fixing plate B2, and is supported by the two fixing portions on the fixing plate B2 on both sides of the carrier B11 The two driving members B143 fixed under the B22 can be driven to move up and down. The lifting seat B14 and the hem base B122 are fixed by a connecting member B144, and a through hole (not shown) is screwed from the bottom of the lifting seat B14. A fine adjustment part B145 composed of a screw is connected to the connection part A144; the lifting base B14 can be deflected in conjunction with the deflection of the fixing plate B2, and the lower limit displacement distance of the lifting base B14 can be finely adjusted by the fine adjustment part B145.

Please refer to FIG. 10, the contact head B15 is disposed on the X-axis slide rail B152 at a distance from the bottom of the lifting seat B14 by a wheel base B151, and a rack B153 is fixed on the front side of the wheel base B151 with the Y axis fixed, A driving member B154 composed of a motor is fixed on the front side of the lifting base B14 by a fixing frame 155, the driving member B154 engages the rack B153 with a gear B156, thereby driving the rack B153 to link the wheel base B151 and the The abutment head B15 is displaced in the Y axis to the left and right.

11 and 12, the driving mechanism B5 is provided with two needle wheels B54 which are coaxially spaced and spaced apart from a driving shaft B53 in the X axis. The driving shaft B53 is provided with a radial convex key B531. The convex key The axial length of B531 exceeds the spacing between the two needle wheels B54. The two needle wheels are embedded by the convex key B531 and are restricted from rotating in the radial direction relative to the drive shaft B53. The two needle wheels B54 are in the axial direction of the drive shaft B53 It can move freely along the X axis or close to or away from the X axis; the drive shaft B53 can be driven to rotate and rotate the two needle wheels B54 synchronously. Each ring of the needle wheel B54 is provided with a V-shaped ring A plurality of convex inlays B542 arranged in the concave groove B541 and the equal-distance annular row, wherein the concave groove B54 provided by the two rings on the two-pin wheel B5 are located opposite to each other, and the inlay B542 arranged in the two-ring row Relatively on the opposite outer side; the upper and lower sides of the driving shaft B53 are respectively provided with a shaft B55 parallel to each other, and each shaft B55 is respectively coaxially spaced with a space between the two inserting parts B56, the inserting parts B56 It is a disc-shaped wheel body, and its circular periphery forms an inverted V shape matching the shape of the groove B541 of the pin wheel B54, which is located under the driving shaft B53 On one side of the shaft B55, a spacer B57 is pivotally sleeved between the two engaging parts B56, and then locked and fixed, and the shaft B55 on the other side above the driving shaft B53 is engaged on the second part The piece B56 can freely perform X-axis displacement on the shaft B55; the fitting pieces B56 on each shaft B55 are respectively fitted with the peripheral edges of the pinwheel B54 on the driving shaft B53 on the outer circumference Corresponding concave groove B541; a coupling member B551 is provided between the front ends of the two shafts B55; the spacer B57 can be replaced according to the width specification of the material strip A5 in FIG. 1, when changing the width specification of the material strip A5, only need to change The spacer B57 also changes the spacing between the second fittings B56 on the shaft B55 under the driving shaft B53, and when adjusting the two fittings B56, the two needle wheels B54 on the driving shaft B53 and above the driving shaft B53 The two engaging pieces B56 on the shaft B55 will be adjusted in conjunction with each other; the side of the two pinwheel B54 on the driving shaft B53 is provided with a belt pressing mechanism B58, which is provided with a The driving member B581 is driven by a pressing member B582 whose Y axis moves toward or away from the two needle wheels B54 on the driving shaft B53. The pressing member B582 and the driving shaft B53 are spaced apart and parallel to each other. The pressing member B582 It has a rectangular frame shape and is provided with a hollow section B583. The hollow section B583 has rod-shaped axle wheels B584 above and below, respectively. The pressing member B582 can be driven close to the second needle wheel B54 on the drive shaft B53 , So that the two-pin wheel B54 can partially lean into the hollow section B583, and when the two-pin wheel B54 pulls a ribbon, the ribbon is pressed from the side of the two-pin wheel B54 on the driving shaft B53 By a force applied by the pin wheel B54; the fixing plate B2 above the two pin wheels B54 on the driving shaft B53 is provided with a hole position detection unit B59, which is provided with an X axis at intervals of 3 In the two rows of the pinhole A321 of the material strip A5, there are two detectors B592 located on an adjustment rod B591 under the width interval of the pinhole A321. The detector B592 is used to detect the position of the pinhole A321 of the tape A5 to confirm Whether the material belt A5 between the two needle wheels B54 on the driving shaft B53 and the pressing member B582 of the belt pressing mechanism B58 corresponds to the pinhole A321 and the inlay B542 on the needle wheel B54 to transmit a message to control the The pressing member B582 of the belt pressing mechanism B58 is driven to move toward the two-pin wheel B54 on the driving shaft B53.

Please refer to FIGS. 3 and 13, the material belt A5 on the material belt wheel B6 is on the laminating device B, the first coating film A31 is first dialed to be wound on the first winding wheel B7, and The second envelope A32 to which the heat-dissipating rubber pad A3 is still attached is guided along the plurality of X-axis guides on the fixing plate B2 in such a manner that the heat-dissipating rubber pad A3 faces the side of the alignment inspection unit B4 The rod B23 is pulled and wound around the bonding head B15 of the bonding mechanism B1 through the bonding mechanism B1 and the alignment inspection unit B4, so that the heat-dissipating rubber pad A3 is downward and the bonding operation is completed to complete the bonding Only the second envelope A32 remaining around passes through the pin wheel B54 of the driving mechanism B5 and the pressing member B582, and is wound around the second under the detection of the hole detection unit B59 Reel B8.

When bonding the heat dissipating rubber pad A3, when the bonding device B is moved above the object A, the alignment inspection unit B4 will first inspect the object A to obtain the object If the orientation of the object A does not correspond to the orientation of the heat-dissipating rubber pad A3, the deflection mechanism B13 will drive the bonding device B to execute the entire fixing plate B2 to link the components on it The seat B11 deflects to deflect the orientation of the heat dissipating rubber pad A3 attached to the lower surface of the second envelope A32 to adjust to correspond to the orientation of the object A, and then drive the rail seat B3 in the Z axis direction The carrier B11 moves the bonding mechanism B1 and the fixing plate B2 and the components thereon downward, so that the heat-dissipating rubber pad A3 that adheres the lower surface of the second envelope A32 is adhered and attached to the On the object A; the lower limit displacement distance of the Z axis on the rail base B3 when the fitting mechanism B1 moves down can be adjusted by the lifting base B14 driven by the two driving parts B143 up and down displacement in conjunction with the fine adjustment Make minor adjustments under B145.

Please refer to FIG. 14, on both sides of the abutting head B15 of the bonding mechanism B1 are respectively provided with a fixed guide bar B24 which is fixed on the entrance side according to the conveying direction and fixed and cannot be displaced, and is located The displacement guide bar B16 on the output side can be moved up and down; the width of the heat dissipation rubber pad A3 adhered to the lower surface of the second envelope A32 is between the fixed guide bar B24 and the displacement guide bar B16. When the rubber pad A3 is adhered and attached to the object A, the displacement guide bar B16 is driven to be lowered to the same level as the fixed guide bar B24, and the sticking head B15 is positioned slightly lower than the horizontal height; When the heat dissipating rubber pad A3 touches the object A, the sticking head B15 is driven to roll with its rod-shaped wheel body to indirectly contact the heat dissipating adhesive through the lower envelope A32 of the second envelope A32 that adheres the heat dissipating rubber pad A3 In the manner of the pad A3, from the other side of the heat dissipation rubber pad A3 relative to the object A, the fixed guide bar B24 is moved toward the displacement guide bar B16 by a roller displacement, so that the heat dissipation rubber pad A3 is adhered to On the object A.

Please refer to FIG. 15, when the adhesive bonding of the heat dissipating rubber pad A3 is completed, the abutment head B15 is driven to return from the displacement guide bar B16 to the direction of the fixed guide bar B24, at this time it is attached to the second envelope A32 The displacement guide bar B16 is driven to move up by the displacement guide bar B16, so that the second coating film A32 on the side of the heat dissipation pad A3 on the displacement guide bar B16 side is first adhered and attached to the quilt The surface of the heat dissipation adhesive pad A3 on the sticker A is peeled off, and when the attachment mechanism B1 is driven to move up, the second envelope A32 and the heat dissipation adhesive pad that has been adhered and attached to the object A are attached A3 is completely separated.

The method and device for bonding the heat-dissipating rubber pads according to the embodiments of the present invention, since the bonding operator can no longer work by humans, the automatic bonding operation improves production efficiency, increases accuracy and has consistent quality, and has substantial benefits.

However, the above are only the preferred embodiments of the present invention, which should not be used to limit the scope of the implementation of the present invention, that is, simple equivalent changes and modifications made according to the scope of the patent application of the present invention and the description of the invention, All of them are still covered by the patent of the present invention.

A3: Thermal pad

A31: The first envelope

A32: second envelope

A5: Strip

B1: Fitting organization

B15: close to the head

B23: Guide rod

B4: Alignment inspection unit

B5: Drive mechanism

B54: Needle wheel

B582: Pressing pieces

B59: Hole position detection unit

B6: material pulley

B7: The first reel

B8: The second reel

Claims (18)

A bonding method of heat-dissipating rubber pads includes: providing a to-be-attached object; setting the heat-dissipating rubber pads on a material tape; providing a bonding device to set the material tape; the bonding device using a bonding mechanism to apply the material tape The heat dissipation rubber pad on the cover is attached to the object; the bonding mechanism indirectly contacts the heat dissipation rubber pad by rolling, from the other side of the heat dissipation rubber pad opposite the object to be attached, the heat dissipation rubber pad Paste on the object. The method for bonding the heat-dissipating rubber pad as described in item 1 of the patent application range, wherein the bonding head is composed of a rod-shaped wheel body with a central axis in the X-axis direction. As described in item 1 of the patent application scope, the method for attaching a heat-dissipating rubber pad is characterized in that the object to be attached is an object that has a die attached to the substrate. As described in item 1 of the patent application scope, the bonding method of the heat-dissipating rubber pad, wherein the bonding device can perform a deflection of the orientation of the heat-dissipating rubber pad to adjust to correspond to the orientation of the object. The method for bonding heat-dissipating rubber pads as described in item 1 of the patent application scope, wherein the material tape includes a first envelope and a second envelope in the form of a long strip, and the heat-dissipating rubber pad is covered by the first envelope and the second Covered by the second envelope; when the bonding is performed, the first envelope is peeled off, and only the heat dissipation adhesive pad is adhered under the second envelope. The method for bonding heat-dissipating rubber pads as described in item 5 of the patent application scope, wherein, when the heat-dissipating rubber pads are adhered and pasted, the second envelope on one side of the heat-dissipating rubber pads is first adhered and pasted to the pasted The surface of the heat-dissipating rubber pad on the object is peeled off, and when the attaching mechanism is driven to move up, the second envelope is completely separated from the heat-dissipating rubber pad that has been adhered and attached to the object. A heat-dissipating rubber pad fitting device, including: A fitting mechanism can be driven to move up and down and interlock with a fixed plate; a material belt is provided on the fixed plate, and the material belt is provided with a heat dissipation rubber pad, which is covered by a first coating and The material tape is covered by a second envelope, the heat dissipation rubber pad is adhered under the second envelope, and the heat dissipation rubber pad is wound downwardly and pasted under one of the bonding mechanisms. As described in item 7 of the patent application scope, a heat dissipating rubber pad bonding device, wherein a side of the bonding mechanism is provided with an alignment inspection unit for inspection from top to bottom, the alignment inspection unit is not provided in the fixed The board is located on the side of the fixed board at a distance, and is fixed by a fixing member and a rail seat in the Z axis direction of the rear side of the fixed board and is linked by the rail seat. As described in item 7 of the patent application scope, the heat-dissipating rubber pad bonding device, wherein the bonding mechanism is provided with a carrier seat on the Z-axis rail seat, and a swing seat is fixed to the fixing plate, the When the mounting mechanism is driven by the rail base to perform displacement, the fixing plate is linked to perform simultaneous displacement. As described in claim 9 of the patent application scope, the heat-dissipating rubber pad bonding device is characterized in that the carrier is fixed on the rail seat through a cut-out section of the fixing plate. As described in item 9 of the patent application scope, a heat-dissipating rubber pad bonding device, wherein a deflection mechanism is provided between the carrier and the swing seat of the bonding mechanism, and the deflection mechanism is attached to one of the carrier and the swing seat A pivot shaft is connected in series between the swing seat and the lower swing seat, two protruding two pivoting portions are provided on both sides of the swing seat on both sides of the pivot shaft, and a driving member is fixed on the carrier, and its output The shaft is fixed with a swing arm, and two sides of the swing arm are respectively pivotally provided with a connecting member and the two pivoting parts. As described in item 9 of the patent application scope, a heat-dissipating rubber pad bonding device, wherein a lifting seat capable of displacement is provided under the carrier, and a sticking head is provided under the lifting seat. As claimed in item 12 of the patent application scope, the heat-dissipating rubber pad bonding device, wherein the abutment head is formed by a rod-shaped wheel body with a central axis in the X-axis direction, and the abutment head is provided on the lift by a wheel seat On the slide rail at the bottom of the seat, a rack is fixed on the front side of the wheel seat, and a driving member engages the rack with a gear to move the wheel seat and the abutment head for displacement. As described in claim 12 of the patent application scope, a heat dissipating rubber pad fitting device, wherein the fixing plate on the side of the abutting head is provided with a displacement guide rod, which can be displaced up and down. As claimed in item 12 of the patent application scope, the heat-dissipating rubber pad bonding device, wherein the lifting seat is provided on a slide rail of the fixing plate with a fixing member, and is driven by two fixing plates on both sides of the carrier The component can be driven to move up and down; the lifting seat fine-adjusts the lower limit displacement distance of the lifting seat by a fine-tuning component. As described in Item 7 of the patent application scope, the heat-dissipating rubber pad bonding device, wherein the fixing plate is provided with: a material belt wheel, a driving member driving and nesting a ring-shaped material roll formed by the material belt; A first reel, driven by a driving member, can be used to rotate and rewind the first envelope of the tape; a second reel, driven by a driving member to rotate and rewind the second tape of the tape Envelope; a drive mechanism, which is driven by a drive member to drive the second envelope of the tape. As described in Item 16 of the patent application scope, a heat dissipating rubber pad bonding device, wherein a distance sensor is provided on the fixing plate to detect a change in the distance from the circumference of the material roll on the material pulley to estimate Know whether the roll should be replaced. A heat-dissipating rubber pad bonding device, comprising: a device for performing the heat-dissipating rubber pad bonding method described in any one of items 1 to 6 of the patent application.

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