TWI684393B - Connecting method and joined structure - Google Patents

Connecting method and joined structure Download PDF

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Publication number
TWI684393B
TWI684393B TW104100297A TW104100297A TWI684393B TW I684393 B TWI684393 B TW I684393B TW 104100297 A TW104100297 A TW 104100297A TW 104100297 A TW104100297 A TW 104100297A TW I684393 B TWI684393 B TW I684393B
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Taiwan
Prior art keywords
ceramic substrate
anisotropic conductive
conductive film
terminal
electronic component
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TW104100297A
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Chinese (zh)
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TW201536142A (en
Inventor
小高良介
佐藤大祐
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日商迪睿合股份有限公司
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Publication of TW201536142A publication Critical patent/TW201536142A/en
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Publication of TWI684393B publication Critical patent/TWI684393B/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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Abstract

本發明為一種連接方法，其係為將陶瓷基板的端子及電子組件的端子作各向異性導電連接的連接方法，包含：貼附製程，將各向異性導電薄膜貼附於該陶瓷基板的端子上；載置製程，將該電子組件載置於該各向異性導電薄膜上；加熱加壓製程，將該電子組件藉由加熱加壓構件以未滿2MPa的加壓力加熱加壓；其中，該陶瓷基板的高度偏差為20μm以上；該各向異性導電薄膜含有自由基聚合物質、熱自由基開始劑、及平均粒徑為13μm以上的導電性粒子。 The invention is a connection method, which is an anisotropic conductive connection method of a terminal of a ceramic substrate and a terminal of an electronic component, including: a bonding process, and attaching an anisotropic conductive film to the terminal of the ceramic substrate Mounting process, the electronic component is placed on the anisotropic conductive film; heat and pressure process, the electronic component is heated and pressurized by a heating and pressing member under a pressure of less than 2MPa; wherein, the The height deviation of the ceramic substrate is 20 μm or more; the anisotropic conductive film contains a radical polymer substance, a thermal radical starter, and conductive particles having an average particle size of 13 μm or more.

Description

連接方法及接合體 Connection method and joint body

本發明係關於連接方法及接合體。 The present invention relates to a connection method and a joined body.

環氧系的各向異性導電接著薄膜或自由基聚合系的各向異性導電接著薄膜係作為電子組件用的接著劑來被使用(例如，參照專利文獻1-3)。 Epoxy-based anisotropic conductive adhesive films or radical polymerization-based anisotropic conductive adhesive films are used as adhesives for electronic components (for example, refer to Patent Documents 1-3).

而且，為了提高接著劑成分和陶瓷的接著力，疏水性二氧化矽表面將以二硫化物系矽烷耦合劑來表面處理的二氧化矽粒子配合於各向異性導電薄膜(例如，參照專利文獻4)。 In addition, in order to improve the adhesion between the adhesive component and the ceramic, the surface of the hydrophobic silica is compounded with an anisotropic conductive film by silica particles surface-treated with a disulfide-based silane coupling agent (for example, see Patent Document 4 ).

各向異性導電接著薄膜使用於攜帶機器的相機模組與基板之連接。但是，於相機模組使用陶瓷基板的情況下，若不是以非常低的壓力，會有基板容易破裂、電子組件故障等的問題。而且，一般的陶瓷基板，其端子高度之偏差大，在習知的各向異性導電接著薄膜中對應此偏差係困難的。 The anisotropic conductive adhesive film is used to connect the camera module of the portable device and the substrate. However, when a ceramic substrate is used for the camera module, if the pressure is not very low, the substrate may be easily broken or the electronic components may malfunction. Moreover, in general ceramic substrates, the variation in terminal height is large, and it is difficult to cope with this variation in the conventional anisotropic conductive adhesive film.

該端子高度之偏差，於壓接後的可撓基板形成大的凹凸，於壓接後會產生反彈力。在普通自由基聚合系的各向異性導電接著薄膜，因為內聚力小，無法抵抗此反彈力，故可能會使導體電阻變大，降低連接信賴性。 The difference in height of the terminal forms large irregularities on the flexible substrate after crimping, and a rebound force will be generated after crimping. In the anisotropic conductive adhesive film of the ordinary radical polymerization system, because the cohesion force is small, it cannot resist this rebound force, so the resistance of the conductor may be increased and the connection reliability may be reduced.

而且，近年，伴隨著電子組件的多樣化，維修的要求逐漸增高，環氧系的各向異性導電接著薄膜因為內聚力大，雖然連接信賴性優異，但維修 不充分。 Furthermore, in recent years, with the diversification of electronic components, the maintenance requirements have gradually increased. Because of the cohesive force of the anisotropic conductive adhesive film of the epoxy system, although the connection reliability is excellent, the maintenance insufficient.

因此，目前正冀求一種即使陶瓷基板的端子高度有偏差，仍易於維修且連接信賴性優異的連接方法及接合體。 Therefore, a connection method and a bonded body that are easy to maintain and have excellent connection reliability even if the terminal height of the ceramic substrate is uneven are currently being sought.

[先前技術文獻] [Prior Technical Literature] [專利文獻] [Patent Literature]

[專利文獻1]特開2003-238925號公報 [Patent Document 1] JP 2003-238925

[專利文獻2]特開2002-146325號公報 [Patent Document 2] JP 2002-146325

[專利文獻3]特開2002-012842號公報 [Patent Document 3] JP 2002-012842

[專利文獻4]特開2011-049186號公報 [Patent Document 4] JP 2011-049186

本發明係以解決習知的前述多個問題來達成以下的目的，以作為課題。即，本發明之目的係提供一種即使陶瓷基板的端子高度有偏差，仍易於維修且連接信賴性優異的連接方法及接合體連接方法及接合體。 The present invention solves the above-mentioned conventional problems to achieve the following objects as a problem. That is, an object of the present invention is to provide a connection method and a connection body connection method and a connection body that are easy to maintain and have excellent connection reliability even if the terminal height of the ceramic substrate varies.

作為用於解決前述課題的手段，如以下所述。即， The means for solving the aforementioned problems are as follows. which is,

<1>一種連接方法，其係為將陶瓷基板的端子及電子組件的端子作各向異性導電連接的連接方法，包含：貼附製程，將各向異性導電薄膜貼附於該陶瓷基板的端子上；載置製程，將該電子組件載置於該各向異性導電薄膜上；加熱加壓製程，將該電子組件藉由加熱加壓構件以未滿2MPa的加壓力加熱加壓； 其中，該陶瓷基板的高度偏差為20μm以上；該各向異性導電薄膜含有自由基聚合物質、熱自由基開始劑、及平均粒徑為13μm以上的導電性粒子。 <1> A connection method, which is an anisotropic conductive connection method of a terminal of a ceramic substrate and a terminal of an electronic component, including: a bonding process, and attaching an anisotropic conductive film to the terminal of the ceramic substrate Mounting process, the electronic component is placed on the anisotropic conductive film; heat and pressure process, the electronic component is heated and pressurized by the heating and pressing member under a pressure of less than 2MPa; Wherein, the height deviation of the ceramic substrate is 20 μm or more; the anisotropic conductive film contains a radical polymer substance, a thermal radical starter, and conductive particles having an average particle size of 13 μm or more.

<2>如前述<1>所述之連接方法，其中，導電性粒子的平均粒徑(μm)為陶瓷基板的高度偏差(μm)之35%-100%。 <2> The connection method according to the aforementioned <1>, wherein the average particle diameter (μm) of the conductive particles is 35%-100% of the height deviation (μm) of the ceramic substrate.

<3>如前述<1>至<2>中任一項所述之連接方法，其中，各向異性導電薄膜的表面含有3質量%-20質量%之具有有機基的二氧化矽粒子。 <3> The connection method according to any one of <1> to <2>, wherein the surface of the anisotropic conductive film contains 3-20% by mass of silicon dioxide particles having an organic group.

<4>如前述<3>所述之連接方法，其中，有機基為乙烯基或丙烯醯基之任一者。 <4> The connection method according to the aforementioned <3>, wherein the organic group is either vinyl group or acryl group.

<5>如前述<1>至<7>中任一項所述之連接方法，其中，陶瓷基板為相機模組。 <5> The connection method according to any one of the aforementioned <1> to <7>, wherein the ceramic substrate is a camera module.

<6>一種接合體，使用前述<1>至<5>中任一項所述之連接方法來製作。 <6> A bonded body produced using the connection method described in any one of <1> to <5>.

根據本發明，能解決習知的前述多個問題，達成前述目的，提供一種即使陶瓷基板的端子高度有偏差，仍易於維修且連接信賴性優異的連接方法及接合體。 According to the present invention, it is possible to solve the above-mentioned conventional problems and achieve the foregoing object, and to provide a connection method and a bonded body that are easy to maintain and have excellent connection reliability even if the terminal height of the ceramic substrate varies.

1‧‧‧端子 1‧‧‧terminal

2‧‧‧陶瓷基板 2‧‧‧Ceramic substrate

〔圖1〕圖1係顯示陶瓷基板的一例之概略圖。 [FIG. 1] FIG. 1 is a schematic diagram showing an example of a ceramic substrate.

〔圖2〕圖2係顯示冀求高度偏差之曲線的一例之圖。 [FIG. 2] FIG. 2 is a diagram showing an example of a curve for seeking a height deviation.

(連接方法及接合體) (Connection method and joint body)

本發明的連接方法至少包含貼附製程、載置製程、加熱加壓製程，更因應必要，包含其他的製程。 The connection method of the present invention includes at least an attaching process, a placing process, a heating and pressurizing process, and further includes other processes as necessary.

該連接方法係為將陶瓷基板的端子及電子組件的端子作各向異性導電連接的連接方法。 This connection method is an anisotropic conductive connection method for connecting the terminals of the ceramic substrate and the terminals of the electronic component.

本發明的接合體系藉由本發明的連接方法來製造。 The joining system of the present invention is manufactured by the joining method of the present invention.

<貼附製程> <Attach Process>

就附製程而言，只要是將各向異性導電薄膜貼附於陶瓷基板的端子上之製程，並未特別限制，可因應目的適宜選擇。 As far as the attachment process is concerned, as long as it is a process of attaching the anisotropic conductive film to the terminals of the ceramic substrate, it is not particularly limited, and can be appropriately selected according to the purpose.

<<陶瓷基板>> <<Ceramic substrate>>

就陶瓷基板而言，並未特別限制，可因應目的適宜選擇，舉例來說，如相機模組、調諧器模組、功率放大器模組等。 As far as the ceramic substrate is concerned, it is not particularly limited, and can be appropriately selected according to the purpose, for example, such as a camera module, a tuner module, and a power amplifier module.

-高度偏差- -Altitude deviation-

該陶瓷基板的高度偏差於本發明的連接方法中為20μm以上。於本發明的連接方法中，即使使用高度偏差為20μm以上的陶瓷基板，仍能取得易於維修且連接信賴性優異的連接方法。 The height deviation of the ceramic substrate is 20 μm or more in the connection method of the present invention. In the connection method of the present invention, even if a ceramic substrate having a height deviation of 20 μm or more is used, a connection method that is easy to maintain and has excellent connection reliability can be obtained.

-高度偏差的測定- -Determination of height deviation-

陶瓷基板的高度偏差舉例來說，使用表面粗糙計(小坂研究所製作，Surf coda SE-400)來測定。 For example, the height deviation of the ceramic substrate is measured using a surface roughness meter (manufactured by Kosaka Research Institute, Surf coda SE-400).

具體而言，如圖1所示，對具有端子1的陶瓷基板2，將表面粗糙計的觸針朝端子1上的圖1之箭頭方向進行掃描。藉此，依據端子1的凹凸排列之陶瓷基板的應變，得到如圖2所示的掃描曲線。所得到的曲線之大起伏的上部及下部之差來測定偏差。詳細的來說，於該上部中的短距離來看時之小起伏的上部及於該下部中的短距離來看時之小起伏的上部之差，來測定陶瓷基板的高度偏差。 Specifically, as shown in FIG. 1, on the ceramic substrate 2 having the terminal 1, the contact pins of the surface roughness meter are scanned in the direction of the arrow of FIG. 1 on the terminal 1. In this way, according to the strain of the ceramic substrate in which the concavities and convexities of the terminal 1 are arranged, a scanning curve as shown in FIG. 2 is obtained. The difference between the upper and lower parts of the large undulation of the obtained curve was used to measure the deviation. In detail, the difference in the height of the ceramic substrate is measured by the difference between the small undulating upper portion when viewed at a short distance in the upper portion and the small undulating upper portion when viewed at a short distance in the lower portion.

<<各向異性導電薄膜>> <<Anisotropic conductive film>>

該各向異性導電薄膜至少含有導電性粒子、自由基聚合物質、熱自由基開始劑，更佳含有二氧化矽粒子，更因應必要，含有其他成分。 The anisotropic conductive film contains at least conductive particles, radical polymer materials, thermal radical starters, more preferably silica particles, and other components as necessary.

-導電性粒子- -Conductive particles-

就該導電性粒子而言，並未特別限制，可因應目的適宜選擇，舉例來說，如銅、鐵、鎳、金、銀、鋁、鋅、不鏽鋼、氧化鐵(Fe2O3)、四氧化三鐵(Fe3O4)、以一般式：MFe2O4、MO．nFe2O3(兩式中，M係表示為2價的金屬，舉例來說，如Mn、Co、Ni、Cu、Zn、Ba、Mg。n為正整數。而且該M於第二次出現時，可為同種，亦可為不同種。)所表示的各種鐵氧磁體、矽鋼粉、鎳鐵、鈷基非晶質合金、鐵矽鋁合金、鋁鐵高導磁合金、鎳鐵鉬超導磁合金、高導磁合金、波曼德合金、波尼瓦恆磁導率合金等的各種金屬粉、及其合金粉等。而且，如將金屬鍍敷於丙烯酸樹脂、丙烯腈-苯乙烯(AS)樹脂、苯胍胺樹脂、二乙烯苯系樹脂、苯乙烯系樹脂等粒子的表面，或更將絕緣薄膜鍍敷於這些例子的表面等。於其中，由連接信賴性的觀點來看，丙烯酸樹脂的粒子表面為Ni-Au鍍敷的粒子為較佳。 The conductive particles are not particularly limited, and can be appropriately selected according to the purpose, for example, such as copper, iron, nickel, gold, silver, aluminum, zinc, stainless steel, iron oxide (Fe 2 O 3 ), four Ferric oxide (Fe 3 O 4 ), in the general formula: MFe 2 O 4 , MO. nFe 2 O 3 (In both formulas, M is represented as a divalent metal, for example, such as Mn, Co, Ni, Cu, Zn, Ba, Mg. n is a positive integer. And this M appears for the second time It can be the same kind or different kinds.) Various ferrite magnets, silicon steel powder, nickel iron, cobalt-based amorphous alloy, iron silicon aluminum alloy, aluminum iron high permeability magnetic alloy, nickel iron molybdenum super Various metal powders such as permeable alloys, high-permeability alloys, Bowman alloys, Boniwa constant permeability alloys, etc., and their alloy powders. Moreover, if the metal is plated on the surface of particles such as acrylic resin, acrylonitrile-styrene (AS) resin, benzoguanamine resin, divinylbenzene-based resin, styrene-based resin, or more, an insulating film is plated on these Examples of surfaces, etc. Among them, from the viewpoint of connection reliability, the surface of the acrylic resin particles is preferably Ni-Au-plated particles.

這些導電性粒子可使用單獨一種，亦可併用兩種以上。 These conductive particles may be used alone or in combination of two or more.

該導電性粒子的平均粒徑為13μm以上，更佳為15μm-30μm。 The average particle diameter of the conductive particles is 13 μm or more, and more preferably 15 μm to 30 μm.

而且，該導電性粒子的平均粒徑(μm)為該陶瓷基板的高度偏差(μm)之35%-100%，在確保導通的點來看是好的。 In addition, the average particle diameter (μm) of the conductive particles is 35% to 100% of the height deviation (μm) of the ceramic substrate, which is good from the point of ensuring conduction.

該導電性粒子的粒徑能藉由掃描型電子顯微鏡(SEM)來測定。關於該導電性粒子的粒徑，係測定任意100個的算術平均數之平均粒徑。 The particle size of the conductive particles can be measured by a scanning electron microscope (SEM). About the particle diameter of this electroconductive particle, the average particle diameter of arbitrary 100 arithmetic average is measured.

就該各向異性導電薄膜中之導電性粒子的含有量而言，並未特別限制，可因應目的適宜選擇，相對各向異性導電薄膜100質量份，導電 性粒子較佳為1質量份至10質量份。 The content of the conductive particles in the anisotropic conductive film is not particularly limited, and can be appropriately selected according to the purpose. It is conductive relative to 100 parts by mass of the anisotropic conductive film. The sex particles are preferably 1 part by mass to 10 parts by mass.

-自由基聚合物質- -Free radical polymer-

就該自由基聚合物質而言，只要是可藉由該熱自由基開始劑作用之自由基聚合物質，並未特別限制，可因應目的適宜選擇，舉例來說，如環氧丙烯酸酯、聚氨酯丙烯酸酯、聚酯丙烯酸酯等。 As far as the radical polymer substance is concerned, it is not particularly limited as long as it is a radical polymer substance that can act by the thermal radical initiator, and can be appropriately selected according to the purpose, for example, such as epoxy acrylate, polyurethane acrylic Ester, polyester acrylate, etc.

該自由基聚合物質可使用單獨一種，亦可併用兩種以上，而且可為適宜合成物，亦可為市售品。 The radical polymer substance may be used alone or in combination of two or more, and may be a suitable composition or a commercially available product.

就該各向異性導電薄膜中之自由基聚合物質的含有量而言，並未特別限制，可因應目的適宜選擇，相對各向異性導電薄膜100質量份，自由基聚合物質較佳為10質量份至60質量份，更佳為30質量份至60質量份。 The content of the radical polymer substance in the anisotropic conductive film is not particularly limited, and can be appropriately selected according to the purpose. The radical polymer substance is preferably 10 parts by mass relative to 100 parts by mass of the anisotropic conductive film. To 60 parts by mass, more preferably 30 to 60 parts by mass.

-熱自由基開始劑- -Hot radical starter-

就該熱自由基開始劑而言，並未特別限制，可因應目的適宜選擇，舉例來說，如有機過酸化物等。 The thermal radical starter is not particularly limited, and can be appropriately selected according to the purpose, for example, such as organic peracid.

就該有機酸過化物而言，並未特別限制，可因應目的適宜選擇，舉例來說，如過氧化縮酮類、二醯基過氧化物類、過氧二碳酸鹽類、過氧化酯類、二烷基過氧化物類、氫過氧化物類、甲矽烷基過氧化物類等。 The organic acid peroxide is not particularly limited, and can be appropriately selected according to the purpose, for example, such as peroxyketals, diacyl peroxides, peroxydicarbonates, and peroxyesters , Dialkyl peroxides, hydroperoxides, silyl peroxides, etc.

該熱自由基開始劑可使用單獨一種，亦可併用兩種以上，而且可為適宜合成物，亦可為市售品。 The thermal radical starter may be used alone or in combination of two or more, and may be a suitable composition or a commercially available product.

就該各向異性導電薄膜中之熱自由基開始劑的含有量而言，並未特別限制，可因應目的適宜選擇，相對各向異性導電薄膜100質量份，熱自由基開始劑較佳為0.5質量份至20質量份。 The content of the thermal radical initiator in the anisotropic conductive film is not particularly limited, and can be appropriately selected according to the purpose. The thermal radical initiator is preferably 0.5 based on 100 parts by mass of the anisotropic conductive film. Mass parts to 20 parts by mass.

-二氧化矽粒子- -Silica dioxide particles-

就該二氧化矽粒子而言，並未特別限制，可因應目的適宜選擇，較佳 具有有機基。 The silicon dioxide particles are not particularly limited, and can be appropriately selected according to the purpose, preferably Has an organic group.

就該有機基而言，並未特別限制，可因應目的適宜選擇，乙烯基、丙烯醯基在與自由基聚合物質反應性的點來看是好的。 The organic group is not particularly limited, and can be appropriately selected according to the purpose. The vinyl group and the propylene amide group are good in terms of reactivity with free radical polymers.

就該各向異性導電薄膜中之二氧化矽粒子的含有量而言，並未特別限制，可因應目的適宜選擇，相對各向異性導電薄膜，二氧化矽粒子為3質量%-20質量%，在熔融黏度的調整之點來看是好的。 The content of silicon dioxide particles in the anisotropic conductive film is not particularly limited, and can be appropriately selected according to the purpose. The silicon dioxide particles are 3% to 20% by mass relative to the anisotropic conductive film. From the point of view of adjustment of melt viscosity, it is good.

-其他成分- -Other ingredients-

就該其他成分而言，並未特別限制，可因應目的適宜選擇，舉例來說，如膜形成樹脂、矽烷耦合劑等。 The other components are not particularly limited, and can be appropriately selected according to the purpose, for example, film-forming resins, silane coupling agents, and the like.

--膜形成樹脂-- --Film forming resin--

就該膜形成樹脂而言，並未特別限制，可因應目的適宜選擇，舉例來說，如苯氧基樹脂、聚酯樹脂、聚氨酯樹脂、聚酯胺基甲酸酯樹脂、丙烯酸系樹脂、聚醯亞胺樹脂、丁醛樹脂等，由膜形成狀態、連接信賴性的觀點來看，以苯氧基樹脂為較佳。 The film forming resin is not particularly limited, and can be appropriately selected according to the purpose, for example, such as phenoxy resin, polyester resin, polyurethane resin, polyester urethane resin, acrylic resin, poly Phenoxy resins, butyral resins, etc. are preferably phenoxy resins from the viewpoint of film formation state and connection reliability.

此等膜形成樹脂可使用單獨一種，亦可併用二種以上，而且可為適宜合成物，亦可為市售品。 These film-forming resins may be used alone or in combination of two or more, and may be a suitable composition or a commercially available product.

--矽烷耦合劑-- --Silane Coupling Agent--

就該矽烷耦合劑而言，並未特別限制，可因應目的適宜選擇，舉例來說，如環氧基系矽烷耦合劑、丙烯酸系矽烷耦合劑、硫醇系矽烷耦合劑、胺系矽烷耦合劑等。 The silane coupling agent is not particularly limited, and can be appropriately selected according to the purpose, for example, epoxy silane coupling agent, acrylic silane coupling agent, thiol silane coupling agent, amine silane coupling agent Wait.

就該各向異性導電薄膜中的矽烷耦合劑之含有量而言，並未特別限制，可因應目的適宜選擇。 The content of the silane coupling agent in the anisotropic conductive film is not particularly limited, and can be appropriately selected according to the purpose.

就該各向異性導電薄膜的平均厚度而言，並未特別限制，可因應目的適宜選擇，較佳為20μm至35μm，更佳為20μm至30μm。 The average thickness of the anisotropic conductive film is not particularly limited, and can be appropriately selected according to the purpose, preferably 20 μm to 35 μm, more preferably 20 μm to 30 μm.

<載置製程> <Mounting process>

就該載置製程而言，只要是將該電子組件載置於該各向異性導電薄膜上的製程，並未特別限制，可因應目的適宜選擇。 The mounting process is not particularly limited as long as it is a process of mounting the electronic component on the anisotropic conductive film, and can be appropriately selected according to the purpose.

通常，此時，沒有進行各向異性導電連接。 Normally, at this time, an anisotropic conductive connection is not made.

<<電子組件>> <<Electronic Components>>

就該電子組件而言，成為各向異性導電連接的對象，只要是具有端子的電子組件，並未特別限制，可因應目的適宜選擇，舉例來說，如IC晶片、標記膠帶(TAB帶)、液晶面板、撓性基板等。 As far as the electronic component is concerned, it is an object of anisotropic conductive connection, as long as it is an electronic component with a terminal, it is not particularly limited, and can be appropriately selected according to the purpose, for example, such as IC chips, marking tape (TAB tape), Liquid crystal panels, flexible substrates, etc.

就該IC晶片而言，舉例來說，如平板顯示器(FPD)中的液晶畫面控制用IC晶片等。 As for this IC wafer, for example, an IC wafer for liquid crystal screen control in a flat panel display (FPD) and the like.

<加熱加壓製程> <heating and pressing process>

就該加熱加壓製程而言，只要是將該電子組件藉由加熱加壓構件以未滿2MPa的加壓力加熱加壓的製程，並未特別限制，可因應目的適宜選擇。 The heat and pressure process is not particularly limited as long as it is a process of heating and pressurizing the electronic component with a heat and pressure member under a pressure of less than 2 MPa, and can be appropriately selected according to the purpose.

就該加熱加壓構件而言，並未特別限制，可因應目的適宜選擇，舉例來說，如具有加熱機構的加壓構件等。就具有加熱機構的加壓構件而言，並未特別限制，可因應目的適宜選擇，舉例來說，如加熱工具等。 The heating and pressing member is not particularly limited, and can be appropriately selected according to the purpose, for example, a pressing member having a heating mechanism and the like. The pressing member having a heating mechanism is not particularly limited, and can be appropriately selected according to the purpose, for example, such as a heating tool.

就該加熱之溫度而言，並未特別限制，可因應目的適宜選擇，較佳為140℃~200℃。 The heating temperature is not particularly limited, and can be appropriately selected according to the purpose, and is preferably 140°C to 200°C.

就該加壓之壓力而言，只要未滿2MPa，並未特別限制，可因應目的適宜選擇，較佳為0.5MPa至1.5MPa。 The pressure of this pressurization is not particularly limited as long as it is less than 2 MPa, and can be appropriately selected according to the purpose, and is preferably 0.5 MPa to 1.5 MPa.

就該加熱及加壓之時間而言，並未特別限制，可因應目的適宜選擇，舉例來說，如0.1秒至120秒之間。 The heating and pressurizing time is not particularly limited, and can be appropriately selected according to the purpose, for example, between 0.1 second and 120 seconds.

【實施例】 【Example】

以下，說明本發明的實施例，本發明並不被此等實施例所限 定。 Hereinafter, the embodiments of the present invention will be described, and the present invention is not limited to these embodiments. set.

(實施例1) (Example 1) <各向異性導電薄膜的製作> <Fabrication of anisotropic conductive film>

將雙酚A苯氧基樹脂(商品名：YP 50，新日鐵柱金劃學股份公司製作)40質量份、雙官能基環氧丙烯酸酯(商品名：3002A，共榮社化學股份公司製作)15質量份、雙官能基丙烯酸酯(商品名：DCP，新中村化學工業股份公司製作)16質量份、丙烯腈丁二烯橡膠(商品名：XER-91，JSR股份公司製作)15質量份、含氫氧基的丙烯酸橡膠(商品名：SG-80H，Nagase ChemteX股份公司製作)4質量份、丙烯醯基表面處理二氧化矽(商品名：YA010C-SM1，admatechs股份公司製作)3質量份、脂肪族系二醯基過氧化物(商品名：PEROYL，日油股份公司製作)4質量份、及平均粒徑15μm的Ni/Au鍍敷丙烯醯樹脂粒子(日本化學股份公司製作)3質量份配合而得到合計100質量份的各向異性導電組成物。 40 parts by mass of bisphenol A phenoxy resin (trade name: YP 50, manufactured by Nippon Steel & Steel Co., Ltd.), bifunctional epoxy acrylate (trade name: 3002A, manufactured by Kyoeisha Chemical Co., Ltd.) ) 15 parts by mass, bifunctional acrylate (trade name: DCP, manufactured by Shin Nakamura Chemical Industry Co., Ltd.) 16 parts by mass, acrylonitrile butadiene rubber (trade name: XER-91, manufactured by JSR Corporation) 15 parts by mass 、Hydroxy-containing acrylic rubber (trade name: SG-80H, manufactured by Nagase ChemteX Co., Ltd.) 4 parts by mass, acrylic surface-treated silicon dioxide (trade name: YA010C-SM1, manufactured by admatechs) 3 parts by mass , Aliphatic diacyl peroxide (trade name: PEROYL, manufactured by NOF Corporation) 4 parts by mass, and Ni/Au plated acrylic resin particles (manufactured by Nippon Chemical Co., Ltd.) with an average particle size of 15 μm 3 mass 100 parts by mass of the anisotropic conductive composition was obtained.

將所得到的各向異性導電組成物塗佈於離型聚對苯二甲酸乙二酯(PET,polyethylene terephthalate)上後，以80℃乾燥，得到平均厚度25μm的各向異性導電薄膜。 The obtained anisotropic conductive composition was coated on release polyethylene terephthalate (PET) and dried at 80°C to obtain an anisotropic conductive film with an average thickness of 25 μm.

<連接方法及接合體之製造> <Connection method and manufacturing of joint body>

就評價基材而言，使用撓性印刷基板(銅配線：線/空間(L/S)=100μm/100μm；端子高度：12μm；配向膜厚度：25μm)與氧化鋁製陶瓷基板(鎢配線：線/空間(L/S)=100μm/100μm；配線高度：10μm；基板厚度：0.4mm)，進行各向異性導電連接。 For the evaluation of the base material, a flexible printed circuit board (copper wiring: line/space (L/S)=100 μm/100 μm; terminal height: 12 μm; alignment film thickness: 25 μm) and an alumina ceramic substrate (tungsten wiring: Line/space (L/S)=100μm/100μm; wiring height: 10μm; substrate thickness: 0.4mm), anisotropic conductive connection.

將各向異性導電薄膜貼附於陶瓷基板的端子上，將該電子組件載置於該各向異性導電薄膜，將該電子組件藉由加熱加壓構件以140℃、10秒、1MPa的加壓力加熱及加壓而得到接合體。 The anisotropic conductive film is attached to the terminal of the ceramic substrate, the electronic component is placed on the anisotropic conductive film, and the electronic component is heated at 140°C for 10 seconds at a pressure of 1 MPa by a heating and pressing member Heat and pressure are applied to obtain a joined body.

<電阻的測定> <Measurement of resistance>

關於各接合體，初期的連接電阻值、及以溫度80℃/濕度85%/500hr投入後的連接電阻值，使用數位萬用電表(34401A，Agilent Technologies股份公司製作)來測定。就測定方法而言，使用四端子法，流過電流1mA來進行。 For each bonded body, the initial connection resistance value and the connection resistance value after input at a temperature of 80° C./humidity of 85%/500 hr were measured using a digital multimeter (34401A, manufactured by Agilent Technologies Co., Ltd.). As for the measurement method, the four-terminal method was used and a current of 1 mA was passed.

藉由以下基準來評價。將結果示於表1-1。 Evaluation is based on the following criteria. The results are shown in Table 1-1.

○：0.2Ω以上，未滿0.5Ω ○: 0.2Ω or more, less than 0.5Ω

△：0.5Ω以上，未滿1.0Ω △: More than 0.5Ω, less than 1.0Ω

×：1.0Ω以上 ×: 1.0Ω or more

<維修的評價> <Evaluation of maintenance>

關於各接合體，將撓性印刷基板從陶瓷基板剝離，藉由將異丙醇(IPA,isopropyl alcohol)充分浸濕的綿棒50次反覆擦拭連接部，剝離殘存的各向異性導電薄膜者為○，無法剝離者為×。結果示於表1-1。 Regarding each bonded body, the flexible printed circuit board was peeled off from the ceramic substrate, and the connection part was wiped repeatedly by 50 times with a cotton rod sufficiently soaked in isopropyl alcohol (IPA, isopropyl alcohol) to peel off the remaining anisotropic conductive film. , Those who cannot be peeled off are ×. The results are shown in Table 1-1.

<高度偏差的測定> <Measurement of height deviation>

表面粗糙計(小坂研究所製作，Surfcoda SE-400)的觸針掃描陶瓷基板的端子上，得到凹凸的曲線。 A stylus of a surface roughness meter (manufactured by Kosaka Research Institute, Surfcoda SE-400) scans the terminals of the ceramic substrate to obtain an uneven curve.

所得到的曲線之大起伏的上部及下部之差來測定偏差。詳細的來說，於該上部中的短距離來看時之小起伏的上部及於該下部中的短距離來看時之小起伏的上部之差，來測定陶瓷基板的高度偏差。結果示於表1-1。 The difference between the upper and lower parts of the large undulation of the obtained curve was used to measure the deviation. In detail, the difference in the height of the ceramic substrate is measured by the difference between the small undulating upper portion when viewed at a short distance in the upper portion and the small undulating upper portion when viewed at a short distance in the lower portion. The results are shown in Table 1-1.

(實施例2-14、比較例1-4) (Example 2-14, Comparative Example 1-4) <各向異性導電薄膜的製作、及接合體的製造> <Fabrication of anisotropic conductive film and fabrication of bonded body>

於實施例1，除了材料的種類、壓著條件、壓力如表1-1及表1-2變更之外，與實施例1同樣地，進行各向異性導電薄膜的製作、及接合體的製造。 In Example 1, the anisotropic conductive thin film and the bonded body were produced in the same manner as in Example 1, except that the type of material, pressing conditions, and pressure were changed as shown in Table 1-1 and Table 1-2. .

而且，進行與實施例1同樣地評價。結果示於表1-1及表1-2。 Furthermore, evaluation was performed in the same manner as in Example 1. The results are shown in Table 1-1 and Table 1-2.

【表1-1】

Figure 104100297-A0202-12-0011-1
【Table 1-1】
Figure 104100297-A0202-12-0011-1

Figure 104100297-A0202-12-0011-2
Figure 104100297-A0202-12-0011-2
Figure 104100297-A0202-12-0012-3
Figure 104100297-A0202-12-0012-3

YP50：雙酚A苯氧基樹脂(新日鐵柱金劃學股份公司製作) YP50: Bisphenol A phenoxy resin (produced by Nippon Tiezhu Jinhuaxue Co., Ltd.)

EP828：環氧基樹脂(三菱化學股份公司製作) EP828: Epoxy resin (produced by Mitsubishi Chemical Corporation)

Novacure3941HP：硬化劑(旭化成股份公司製作) Novacure3941HP: Hardener (made by Asahi Kasei Corporation)

3002A：雙官能基環氧丙烯酸酯(共榮社化學股份公司製作) 3002A: Bifunctional epoxy acrylate (produced by Kyoeisha Chemical Co., Ltd.)

DCP：雙官能基丙烯酸酯(新中村化學工業股份公司製作) DCP: Bifunctional acrylate (produced by Shin Nakamura Chemical Industry Co., Ltd.)

XER-91：丙烯腈丁二烯橡膠(JSR股份公司製作) XER-91: Acrylonitrile butadiene rubber (produced by JSR Corporation)

SG-80H：含氫氧基的丙烯酸橡膠(Nagase ChemteX股份公司製作) SG-80H: Hydroxyl group-containing acrylic rubber (made by Nagase ChemteX Corporation)

YA010C-SM1：丙烯醯基表面處理二氧化矽(admatechs股份公司製作) YA010C-SM1: Acrylic-based surface-treated silica (produced by admatechs)

YA010C-SV2：乙烯基表面處理二氧化矽(admatechs股份公司製作) YA010C-SV2: Vinyl surface-treated silica (produced by admatechs)

YA010C-SP2：苯基表面處理二氧化矽(admatechs股份公司製作) YA010C-SP2: Phenyl surface-treated silica (produced by admatechs)

R202：二氧化矽(日本aerosil股份公司製作) R202: Silicon dioxide (produced by Japan Aerosil Corporation)

PEROYL：脂肪族系二醯基過氧化物(日油股份公司製作) PEROYL: Aliphatic diacyl peroxide (produced by NOF Corporation)

Ni/Au鍍敷丙烯醯樹脂粒子：平均粒徑10μm(日本化學股份公司製作) Ni/Au plated acrylic resin particles: average particle size 10 μm (manufactured by Nippon Chemical Co., Ltd.)

Ni/Au鍍敷丙烯醯樹脂粒子：平均粒徑15μm(日本化學股份公司製作) Ni/Au plated acrylic resin particles: average particle size 15 μm (manufactured by Nippon Chemical Co., Ltd.)

Ni/Au鍍敷丙烯醯樹脂粒子：平均粒徑20μm(日本化學股份公司製作) Ni/Au plated acrylic resin particles: average particle size 20 μm (manufactured by Nippon Chemical Co., Ltd.)

[產業上的利用可能性] [Industry use possibility]

只要是本發明的連接方法，即使陶瓷基板的端子高度有偏差，從易於維修及連接信賴性優異來看，特佳能使用於手機的相機模組。 As long as it is the connection method of the present invention, even if the terminal height of the ceramic substrate varies, from the standpoint of ease of maintenance and excellent connection reliability, Tegen can be used in a camera module of a mobile phone.

Claims (11)

一種連接方法，其係為將陶瓷基板的端子及電子組件的端子作各向異性導電連接的連接方法，包含：貼附製程，將各向異性導電薄膜貼附於該陶瓷基板的端子上；載置製程，將該電子組件載置於該各向異性導電薄膜上；加熱加壓製程，將該電子組件藉由加熱加壓構件以未滿2MPa的加壓力加熱加壓；其中，該陶瓷基板的高度偏差為20μm以上；該各向異性導電薄膜含有自由基聚合物質、熱自由基開始劑、及平均粒徑為13μm以上的導電性粒子；又，該導電性粒子的平均粒徑(μm)為陶瓷基板的高度偏差(μm)之35%-100%；及該高度偏差係藉由表面粗糙計測定，且其係含有端子的區域之陶瓷基板的掃描曲線之大起伏的上部及下部之差。 A connection method, which is an anisotropic conductive connection method of the terminal of the ceramic substrate and the terminal of the electronic component, including: a bonding process, an anisotropic conductive film is attached to the terminal of the ceramic substrate; Process, the electronic component is placed on the anisotropic conductive film; heat and pressure process, the electronic component is heated and pressurized by a heating and pressing member under a pressure of less than 2MPa; wherein, the ceramic substrate The height deviation is 20 μm or more; the anisotropic conductive film contains a radical polymer substance, a thermal radical starter, and conductive particles having an average particle size of 13 μm or more; and the average particle size (μm) of the conductive particles is 35%-100% of the height deviation (μm) of the ceramic substrate; and the height deviation is measured by a surface roughness meter, and it is the difference between the upper and lower portions of the large undulation of the scan curve of the ceramic substrate in the area containing the terminal. 一種連接方法，其係為將陶瓷基板的端子及電子組件的端子作各向異性導電連接的連接方法，包含：貼附製程，將各向異性導電薄膜貼附於該陶瓷基板的端子上；載置製程，將該電子組件載置於該各向異性導電薄膜上；加熱加壓製程，將該電子組件藉由加熱加壓構件以未滿2MPa的加壓力加熱加壓；其中，該陶瓷基板的高度偏差為20μm以上；該各向異性導電薄膜含有自由基聚合物質、熱自由基開始劑、及平均粒徑為13μm以上的導電性粒子；又，相對於該導電性粒子的平均粒徑(μm)之陶瓷基板的高度偏差 (μm)係23/20~40/15；及該高度偏差係藉由表面粗糙計測定，且其係含有端子的區域之陶瓷基板的掃描曲線之大起伏的上部及下部之差。 A connection method, which is an anisotropic conductive connection method of the terminal of the ceramic substrate and the terminal of the electronic component, including: a bonding process, an anisotropic conductive film is attached to the terminal of the ceramic substrate; Process, the electronic component is placed on the anisotropic conductive film; heat and pressure process, the electronic component is heated and pressurized by a heating and pressing member under a pressure of less than 2MPa; wherein, the ceramic substrate The height deviation is 20 μm or more; the anisotropic conductive film contains a radical polymer substance, a thermal radical starter, and conductive particles having an average particle size of 13 μm or more; and, relative to the average particle size of the conductive particles (μm ) Height deviation of the ceramic substrate (μm) is 23/20~40/15; and the height deviation is measured by a surface roughness meter, and it is the difference between the upper and lower parts of the large undulation of the scan curve of the ceramic substrate in the area containing the terminal. 一種連接方法，其係為將陶瓷基板的端子及電子組件的端子作各向異性導電連接的連接方法，包含：貼附製程，將各向異性導電薄膜貼附於該陶瓷基板的端子上；載置製程，將該電子組件載置於該各向異性導電薄膜上；加熱加壓製程，將該電子組件藉由加熱加壓構件以未滿2MPa的加壓力加熱加壓；其中，該陶瓷基板的高度偏差為20μm以上且40μm以下；該各向異性導電薄膜含有自由基聚合物質、熱自由基開始劑、及平均粒徑為13μm以上且30μm以下的導電性粒子；及該高度偏差係藉由表面粗糙計測定，且其係含有端子的區域之陶瓷基板的掃描曲線之大起伏的上部及下部之差。 A connection method, which is an anisotropic conductive connection method of the terminal of the ceramic substrate and the terminal of the electronic component, including: a bonding process, an anisotropic conductive film is attached to the terminal of the ceramic substrate; Process, the electronic component is placed on the anisotropic conductive film; heat and pressure process, the electronic component is heated and pressurized by a heating and pressing member under a pressure of less than 2MPa; wherein, the ceramic substrate The height deviation is 20 μm or more and 40 μm or less; the anisotropic conductive film contains a radical polymer substance, a thermal radical starter, and conductive particles having an average particle size of 13 μm or more and 30 μm or less; and the height deviation is determined by the surface The roughness is measured, and it is the difference between the upper and lower parts of the large undulation of the scan curve of the ceramic substrate in the area containing the terminal. 如請求項1~3中任一項所述之連接方法，其中，各向異性導電薄膜的表面含有3質量%-20質量%之具有有機基的二氧化矽粒子。 The connection method according to any one of claims 1 to 3, wherein the surface of the anisotropic conductive film contains 3 to 20% by mass of silicon dioxide particles having an organic group. 如請求項4所述之連接方法，其中，有機基為乙烯基或丙烯醯基之任一者。 The connection method according to claim 4, wherein the organic group is either a vinyl group or an acrylic group. 如請求項1~3中任一項所述之連接方法，其中，陶瓷基板為相機模組。 The connection method according to any one of claims 1 to 3, wherein the ceramic substrate is a camera module. 一種接合體，其係將各向異性導電薄膜熱硬化，使陶瓷基板的端子及電子組件的端子作各向異性導電連接，而形成的接合體，其特徵在於：該各向異性導電薄膜含有自由基聚合物質、熱自由基開始劑、及平均粒徑為13μm以上的導電性粒子，且該陶瓷基板的高度偏差為20μm以上；又，該導電性粒子的平均粒徑(μm)為陶瓷基板的高度偏差(μm)之35%-100%；及該高度偏差係藉由表面粗糙計測定，且其係含有端子的區 域之陶瓷基板的掃描曲線之大起伏的上部及下部之差。 A bonded body which is obtained by thermosetting an anisotropic conductive film to connect terminals of a ceramic substrate and an electronic component to an anisotropic conductive connection, and is characterized in that the anisotropic conductive film contains free Base polymer, thermal radical starter, and conductive particles with an average particle size of 13 μm or more, and the height deviation of the ceramic substrate is 20 μm or more; and the average particle size (μm) of the conductive particles is that of the ceramic substrate 35%-100% of the height deviation (μm); and the height deviation is measured by a surface roughness meter, and it is the area containing the terminal The difference between the upper and lower undulations of the scan curve of the ceramic substrate of the domain. 一種接合體，其係將各向異性導電薄膜熱硬化，使陶瓷基板的端子及電子組件的端子作各向異性導電連接，而形成的接合體，其特徵在於：該各向異性導電薄膜含有自由基聚合物質、熱自由基開始劑、及平均粒徑為13μm以上的導電性粒子，且該陶瓷基板的高度偏差為20μm以上；又，相對於該導電性粒子的平均粒徑(μm)之陶瓷基板的高度偏差(μm)係23/20~40/15；及該高度偏差係藉由表面粗糙計測定，且其係含有端子的區域之陶瓷基板的掃描曲線之大起伏的上部及下部之差。 A bonded body which is obtained by thermosetting an anisotropic conductive film to connect terminals of a ceramic substrate and an electronic component to an anisotropic conductive connection, and is characterized in that the anisotropic conductive film contains free The base polymer substance, the thermal radical starter, and the conductive particles with an average particle size of 13 μm or more, and the height deviation of the ceramic substrate is 20 μm or more; and, the ceramics have an average particle size (μm) relative to the conductive particles The substrate height deviation (μm) is 23/20~40/15; and the height deviation is measured by a surface roughness meter, and it is the difference between the upper and lower parts of the large fluctuation of the scan curve of the ceramic substrate in the area containing the terminal . 一種接合體，其係將各向異性導電薄膜熱硬化，使陶瓷基板的端子及電子組件的端子作各向異性導電連接，而形成的接合體，其特徵在於：該各向異性導電薄膜含有自由基聚合物質、熱自由基開始劑、及平均粒徑為13μm以上且30μm以下的導電性粒子，且該陶瓷基板的高度偏差為20μm以上且40μm以下；及該高度偏差係藉由表面粗糙計測定，且其係含有端子的區域之陶瓷基板的掃描曲線之大起伏的上部及下部之差。 A bonded body which is obtained by thermosetting an anisotropic conductive film to connect terminals of a ceramic substrate and an electronic component to an anisotropic conductive connection, and is characterized in that the anisotropic conductive film contains free Base polymer, thermal radical starter, and conductive particles with an average particle size of 13 μm or more and 30 μm or less, and the height deviation of the ceramic substrate is 20 μm or more and 40 μm or less; and the height deviation is measured by a surface roughness meter , And it is the difference between the upper and lower parts of the large undulation of the scan curve of the ceramic substrate in the area containing the terminal. 如請求項7~9中任一項所述之接合體，其中，陶瓷基板為相機模組。 The bonded body according to any one of claims 7 to 9, wherein the ceramic substrate is a camera module. 如請求項7~9中任一項所述之接合體，其中，其係可維修。 The joint according to any one of claims 7 to 9, wherein it is repairable.
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