TWI681832B - Raw material source, selective laser melting molding equipment, manufacturing method of raw material source, and selective laser melting molding method - Google Patents

Raw material source, selective laser melting molding equipment, manufacturing method of raw material source, and selective laser melting molding method Download PDF

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TWI681832B
TWI681832B TW106145647A TW106145647A TWI681832B TW I681832 B TWI681832 B TW I681832B TW 106145647 A TW106145647 A TW 106145647A TW 106145647 A TW106145647 A TW 106145647A TW I681832 B TWI681832 B TW I681832B
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raw material
powder
material layer
material source
particle size
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TW106145647A
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TW201829096A (en
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陳國鋒
姚志奇
李長鵬
程宣
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德商西門子移動股份公司
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00Additive manufacturing of workpieces or articles from metallic powder
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/20Direct sintering or melting
    • B22F10/28Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM]
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B33ADDITIVE MANUFACTURING TECHNOLOGY
    • B33YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y10/00Processes of additive manufacturing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B33ADDITIVE MANUFACTURING TECHNOLOGY
    • B33YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y30/00Apparatus for additive manufacturing; Details thereof or accessories therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F12/00Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
    • B22F12/50Means for feeding of material, e.g. heads
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00Technologies related to metal processing
    • Y02P10/25Process efficiency

Abstract

本發明提供了一種原料源、包括該原料源的選擇性雷射熔化成型設備及方法。所述原料源包括沿供料方向順序設置的多個原料層,所述多個原料層包括粉體,且所述多個原料層的粉體的平均粒徑沿供料方向減小。因此,通過使用所述原料源進行諸如選擇性雷射熔化工藝的增材製造工藝,可以改善所得產品的機械性能和表面品質。 The invention provides a raw material source, a selective laser melting molding equipment and method including the raw material source. The raw material source includes a plurality of raw material layers sequentially arranged along the feed direction, the multiple raw material layers include powder, and the average particle diameter of the powder of the plurality of raw material layers decreases along the feed direction. Therefore, by using the raw material source for an additive manufacturing process such as a selective laser melting process, the mechanical properties and surface quality of the resulting product can be improved.

Description

原料源、選擇性雷射熔化成型設備、原料源的製造方法及選擇性雷射熔化成型方法 Raw material source, selective laser melting molding equipment, manufacturing method of raw material source, and selective laser melting molding method

本發明涉及一種原料源、包括該原料源的選擇性雷射熔化成型設備及方法。 The invention relates to a raw material source, a selective laser melting molding equipment and method including the raw material source.

增材製造(Additive Manufacturing)是一種採用材料逐漸累加的方法進行製造的技術。在增材製造技術中,提出了一種選擇性雷射熔化(SLM,Selective laser melting)技術。即,諸如金屬或金屬合金的粉體在雷射的作用下被選擇性地熔化並然後經冷卻凝固而成型。粉體的粒徑以及不同粒徑的粉體的分佈對由SLM技術得到的產品的機械性能具有十分顯著的影響。如果選擇的粒徑不當,則可能使最終得到的產品中存在氣孔、裂紋等缺陷,使得產品的緻密度下降,從而可能嚴重影響產品的機械性能,例如強度,延伸率,以及疲勞和持久的性能,而且也會影響產品的表面品質。 Additive Manufacturing (Additive Manufacturing) is a technology that uses the method of gradually accumulating materials for manufacturing. In the additive manufacturing technology, a selective laser melting (SLM) technology is proposed. That is, powders such as metals or metal alloys are selectively melted under the action of lasers and then cooled and solidified to form. The particle size of the powder and the distribution of powders with different particle sizes have a very significant effect on the mechanical properties of the product obtained by SLM technology. If the selected particle size is improper, it may cause defects such as pores and cracks in the final product, which reduces the density of the product, which may seriously affect the mechanical properties of the product, such as strength, elongation, fatigue and long-term performance , And also affect the surface quality of the product.

本發明旨在解決上述及/或其他技術問題,並因此提供一種可以改善增材製造工藝所得產品的機械性能和表面品質的原料源、包括該原料源的選擇性雷射熔化成型設備及方法。The present invention aims to solve the above-mentioned and/or other technical problems, and thus provides a raw material source that can improve the mechanical properties and surface quality of products obtained by the additive manufacturing process, and a selective laser melting molding equipment and method including the raw material source.

根據示例性實施例,提供了一種原料源,所述原料源包括沿供料方向順序設置的多個原料層,所述多個原料層包括粉體,且所述多個原料層的粉體的平均粒徑沿供料方向減小。在諸如選擇性雷射熔化工藝的增材製造工藝中,所述原料源可以按照平均粒徑不斷增大的方式提供的作為原料的粉體。因此,可以防止所得的產品出現致命缺陷,改善了所得的最終產品的機械性能和表面品質。 According to an exemplary embodiment, a raw material source is provided, the raw material source including a plurality of raw material layers sequentially arranged along a feeding direction, the plurality of raw material layers including powder, and the powder of the plurality of raw material layers The average particle size decreases along the feeding direction. In an additive manufacturing process such as a selective laser melting process, the raw material source may provide the powder as a raw material in such a manner that the average particle diameter continuously increases. Therefore, fatal defects of the resulting product can be prevented, and the mechanical properties and surface quality of the resulting final product can be improved.

所述多個原料層包括順序設置的第1原料層至第N原料層,其中,包括在第i原料層中的粉體的粒徑的範圍的最小值大於包括在第i-1原料層中的粉體的粒徑的範圍的最小值,且小於或等於包括在第i-1原料層中的粉體的粒徑的範圍的最大值,其中,1<i

Figure 106145647-A0202-12-0002-4
N。例如,所述多個原料層包括四個原料層,其中,第1原料層包括的粉體的粒徑在10微米至50微米的範圍內,第2原料層包括的粉體的粒徑在20微米至60微米的範圍內,第3原料層包括的粉體的粒徑在30微米至70微米的範圍內,第4原料層包括的粉體的粒徑在40微米至80微米的範圍內。或者,所述多個原料層包括四個原料層,其中,第1原料層包括的粉體的平均粒徑為30微米,第2原料層包括的粉體的平均粒徑為40微米,第3原料層包括的粉體的平均粒徑為50微米,第4原料層包括的粉體的平均粒徑為60微米。此外,所述原料源的粉體包括適用於選擇性雷射熔化的金屬或金屬合金,例如,Inconel 718合金(IN718)。因此,所述原料源可以更加充分的使 用各種粒徑的粉末,從而減少了原料,節約成本。 The plurality of raw material layers include a first raw material layer to an N-th raw material layer that are sequentially arranged, wherein the minimum value of the range of the particle diameter of the powder included in the i-th raw material layer is greater than that included in the i-1th raw material layer The minimum value of the range of the particle size of the powder, and less than or equal to the maximum value of the range of the particle size of the powder included in the i-1th raw material layer, where 1<i
Figure 106145647-A0202-12-0002-4
N. For example, the plurality of raw material layers includes four raw material layers, wherein the particle size of the powder included in the first raw material layer is in the range of 10 to 50 microns, and the particle size of the powder included in the second raw material layer is 20 In the range of microns to 60 microns, the particle size of the powder included in the third raw material layer is in the range of 30 microns to 70 microns, and the particle size of the powder included in the fourth raw material layer is in the range of 40 microns to 80 microns. Alternatively, the plurality of raw material layers includes four raw material layers, wherein the average particle diameter of the powder included in the first raw material layer is 30 μm, and the average particle diameter of the powder included in the second raw material layer is 40 μm, and the third The average particle diameter of the powder included in the raw material layer is 50 μm, and the average particle diameter of the powder included in the fourth raw material layer is 60 μm. In addition, the powder of the raw material source includes a metal or metal alloy suitable for selective laser melting, for example, Inconel 718 alloy (IN718). Therefore, the raw material source can more fully use powders of various particle sizes, thereby reducing raw materials and saving costs.

根據另一示例性實施例,提供了一種選擇性雷射熔化成型設備,所述設備包括一雷射成型裝置和如上所述的原料源,所述原料源被構造為向雷射成型裝置提供原料。因此,當所述選擇性雷射熔化成型設備進行選擇性雷射熔化成型操作時,所述原料源可以按照平均粒徑不斷增大的方式提供的作為原料的粉體。因此,可以防止所得的產品出現致命缺陷,改善了所得的最終產品的機械性能和表面品質。例如,所述原料源被構造為在選擇性雷射熔化成型過程中沿供料方向順序地將所述多個原料層中包括的粉體提供到雷射成型裝置。 According to another exemplary embodiment, there is provided a selective laser melting molding apparatus including a laser molding apparatus and a raw material source as described above, the raw material source configured to provide raw materials to the laser molding apparatus . Therefore, when the selective laser melting molding apparatus performs the selective laser melting molding operation, the raw material source may provide the powder as the raw material in a manner that the average particle diameter continuously increases. Therefore, fatal defects of the resulting product can be prevented, and the mechanical properties and surface quality of the resulting final product can be improved. For example, the raw material source is configured to sequentially supply the powders included in the plurality of raw material layers to the laser forming device along the feed direction during the selective laser melting forming process.

根據又一示例性實施例,提供了一種原料源的製造方法,所述方法包括:在原料源的原料容納空間中設置多個原料層,以使所述多個原料層沿供料方向順序排列,其中,所述多個原料層包括粉體,且所述多個原料層的粉體的平均粒徑沿供料方向減小。 According to yet another exemplary embodiment, there is provided a method of manufacturing a raw material source, the method comprising: providing a plurality of raw material layers in a raw material accommodating space of the raw material source, so that the plurality of raw material layers are sequentially arranged along a feeding direction , Wherein the plurality of raw material layers include powders, and the average particle diameter of the powders of the plurality of raw material layers decreases in the feeding direction.

根據又一示例性實施例,提供了一種選擇性雷射熔化成型方法,其特徵在於,所述方法包括:沿供料方向順序地將原料源中包括的多個原料層中的粉體提供到雷射成型裝置,其中,多個原料層沿供料方向順序設置在原料源中,且所述多個原料層的粉體的平均粒徑沿供料方向減小;對提供到雷射成型裝置的粉體執行選擇性雷射熔化成型工藝。此外,根據又一示例性實施例,提供了通過如上選擇性雷射熔化成型方法製造的產品。 According to yet another exemplary embodiment, there is provided a selective laser melting molding method, characterized in that the method comprises: sequentially providing powders in a plurality of raw material layers included in a raw material source to a feed direction to Laser forming device, wherein a plurality of raw material layers are sequentially arranged in the raw material source along the feeding direction, and the average particle size of the powder of the multiple raw material layers decreases along the feeding direction; The powder is subjected to a selective laser melting molding process. Furthermore, according to still another exemplary embodiment, a product manufactured by the selective laser melting molding method as above is provided.

根據示例性實施例,當進行例如選擇性雷射熔化工藝的增材製造工藝時,首先可以對平均粒徑較小的粉體層進行成型,然後可以對平均粒徑較大的粉體層進行成型,從而可以減小由於高溫熔化收縮導致粉體層和得到的實際產品層之間的偏差。此外,因為提供的粉體的平均粒徑逐漸增加,所以可以防止上述偏差隨著產品層數的增加,(或者說產品的高度的增加)而逐漸增大,從而防止最終產品出現致命缺陷,提高了最終產品的機械性能和表面品質。另外,根據示例性實施例的原料源可以更加充分的使用各種粒徑的粉末,從而減少了原料,節約成本。According to an exemplary embodiment, when performing an additive manufacturing process such as a selective laser melting process, a powder layer with a smaller average particle diameter may be molded first, and then a powder layer with a larger average particle diameter may be formed Molding, so that the deviation between the powder layer and the actual product layer obtained due to high-temperature melting shrinkage can be reduced. In addition, because the average particle size of the provided powder gradually increases, the above deviation can be prevented from gradually increasing with the increase in the number of product layers (or the height of the product), thereby preventing fatal defects in the final product and improving The mechanical properties and surface quality of the final product. In addition, the raw material source according to the exemplary embodiment can more fully use powders of various particle sizes, thereby reducing raw materials and saving costs.

1、2、......、N‧‧‧原料層 1, 2, ..., N‧‧‧ raw material layer

100‧‧‧原料源 100‧‧‧Raw material source

300‧‧‧選擇性雷射成型設備 300‧‧‧Selective laser forming equipment

310‧‧‧原料源 310‧‧‧Raw material source

311‧‧‧原料缸 311‧‧‧ Raw material cylinder

313‧‧‧供料活塞 313‧‧‧ feeding piston

315‧‧‧供料輥 315‧‧‧Feeding roller

330‧‧‧雷射成型裝置 330‧‧‧Laser forming device

331‧‧‧成型缸 331‧‧‧forming cylinder

333‧‧‧成型活塞 333‧‧‧forming piston

335‧‧‧雷射器 335‧‧‧Laser

以下附圖僅旨在於對本發明做示意性說明和解釋,並不限定本發明的範圍,在附圖中,圖1是示出根據示例性實施例的原料源的示意圖;圖2是示出根據示例性實施例的原料層的分佈和粉體的粒徑的示圖;圖3是示出根據示例性實施例的選擇性雷射熔化成型設備的示意圖。 The following drawings are only intended to schematically illustrate and explain the present invention and do not limit the scope of the present invention. In the drawings, FIG. 1 is a schematic diagram showing a raw material source according to an exemplary embodiment; FIG. 2 is a diagram showing FIG. 3 is a schematic diagram showing a selective laser melting molding apparatus according to an exemplary embodiment.

為了對本發明的技術特徵、目的和效果有更加清楚的理解,現對照附圖說明本發明的具體實施方式。 In order to have a clearer understanding of the technical features, purposes and effects of the present invention, the specific embodiments of the present invention will now be described with reference to the drawings.

圖1是示出根據示例性實施例的原料源的示意圖。如圖1所示,根據示例性實施例的原料源100可以包括多個原料層,例如,第1原料層1、第2原料層2、......、第N原料層N。 FIG. 1 is a schematic diagram illustrating a raw material source according to an exemplary embodiment. As shown in FIG. 1, the raw material source 100 according to the exemplary embodiment may include a plurality of raw material layers, for example, a first raw material layer 1, a second raw material layer 2, ..., an N-th raw material layer N.

根據示例性實施例的原料源100可以為用於增材製造工藝或設備的原料源。因此,多個原料層1、2、......、N可以包括粉體。在一個示例性實施例中,原料源100可以為用於選擇性雷射熔化(SLM,Selective Laser Melting)工藝或設備的原料源。例如,多個原料層1、2、......、N包括的粉體可以包括適用於選擇性雷射熔化的金屬或金屬合金,例如,Inconel 718合金(IN718)。IN718是一種含鈮、鉬的析出硬化型鎳鉻鐵合金。IN718具有很高的強度、良好的韌性及耐高溫性能。然而,示例性實施例不限於此,包括在原料源中的粉體還可為其他具有高強度及耐高溫性能的材料。 The raw material source 100 according to the exemplary embodiment may be a raw material source for an additive manufacturing process or equipment. Therefore, the plurality of raw material layers 1, 2, ..., N may include powder. In an exemplary embodiment, the raw material source 100 may be a raw material source used in a selective laser melting (SLM, Selective Laser Melting) process or equipment. For example, the powders included in the plurality of raw material layers 1, 2, ..., N may include metals or metal alloys suitable for selective laser melting, for example, Inconel 718 alloy (IN718). IN718 is a precipitation hardening nickel-chromium-iron alloy containing niobium and molybdenum. IN718 has high strength, good toughness and high temperature resistance. However, the exemplary embodiments are not limited thereto, and the powder included in the raw material source may also be other materials having high strength and high temperature resistance.

多個原料層1、2、......、N可以沿供料方向順序設置,如圖1中所示。同時,多個原料層1、2、......、N中包括的粉體的平均粒徑可以彼此不同,例如,可以沿供料方向減小。如此,當使用根據示例性實施例的原料源100進行增材製造或SLM工藝時,可以沿供料方向首先提供平均粒徑最小的第1原料層中的粉體。然後,提供平均粒徑大於第1原料層的第2原料層至第N原料層中的粉體。即,根據示例性實施例的原料源100可以按照平均粒徑不斷增大的方式提供的作為原料的粉體。因此,如將在下文中進行詳細描述的,當進行諸如選擇性雷射熔化工藝的增材製造工藝時,首先對平均粒徑較小的粉體層進行成型,然後對平均粒徑較大的粉體層進行成型,從而可以減小由於高溫熔化收縮導致粉體層和得到的實際產品層之間的偏差。此外,因為提供的粉體的平均粒徑逐漸增加,所以可以防止上述偏差隨著產品層數的增加,(或者說產品的高度的增加)而逐漸增大,從而防止最終產品出現致命缺陷,改善了所得的最終產品的機械性能和表面品質。另外,根據示例性實施例的原料源可以更加充分的使用各種粒徑的粉末,從而減少了原料,節約成本。 The multiple raw material layers 1, 2, ..., N can be sequentially arranged along the feeding direction, as shown in FIG. Meanwhile, the average particle diameters of the powders included in the plurality of raw material layers 1, 2, ..., N may be different from each other, for example, may be reduced in the feeding direction. As such, when the raw material source 100 according to the exemplary embodiment is used for the additive manufacturing or SLM process, the powder in the first raw material layer with the smallest average particle diameter can be first provided along the feeding direction. Then, the powder in the second raw material layer to the Nth raw material layer having an average particle diameter larger than the first raw material layer is provided. That is, the raw material source 100 according to the exemplary embodiment may provide the powder as the raw material in such a manner that the average particle diameter continuously increases. Therefore, as will be described in detail below, when performing an additive manufacturing process such as a selective laser melting process, the powder layer with a smaller average particle diameter is first molded, and then the powder with a larger average particle diameter is formed The body layer is formed so that the deviation between the powder layer and the actual product layer resulting from the high-temperature melting shrinkage can be reduced. In addition, because the average particle size of the provided powder is gradually increased, the above deviation can be prevented from gradually increasing with the increase of the number of product layers (or the height of the product), thereby preventing fatal defects in the final product and improving The mechanical properties and surface quality of the final product obtained. In addition, the raw material source according to the exemplary embodiment can more fully use powders of various particle sizes, thereby reducing raw materials and saving costs.

圖2是示出根據示例性實施例的原料層的分佈和粉體的粒徑的關係的示圖。如圖2中所示,多個原料層1、2、......、N的粉體的平均粒徑沿供料方向減小。在圖2中示出的示例性實施例中,多個原料層1、2、......、N可以包括四個原料層1、2、3、4,其中,第1原料層包括的粉體的平均粒徑為30微米,第2原料層包括的粉體的平均粒徑為40微米,第3原料層包括的粉體的平均粒徑為50微米,第4原料層包括的粉體的平均粒徑為60微米。 FIG. 2 is a diagram illustrating the relationship between the distribution of the raw material layer and the particle diameter of the powder according to an exemplary embodiment. As shown in FIG. 2, the average particle diameter of the powder of the plurality of raw material layers 1, 2, ..., N decreases in the feeding direction. In the exemplary embodiment shown in FIG. 2, the plurality of raw material layers 1, 2, ..., N may include four raw material layers 1, 2, 3, 4, wherein the first raw material layer includes The average particle diameter of the powder is 30 microns, the average particle diameter of the powder included in the second raw material layer is 40 microns, the average particle diameter of the powder included in the third raw material layer is 50 microns, and the powder included in the fourth raw material layer The average particle size of the volume is 60 microns.

為此,每個原料層可以包括在粒徑在一定範圍內的粉體。例如,在第1原料層至第N原料層中,包括在第i原料層中的粉體的粒徑的範圍的最小值可以大於包括在第i-1原料層中的粉體的粒徑的範圍的最小值,且可以小於或等於包括在第i-1原料層中的粉體的粒徑的範圍的最大值,其中,1<i

Figure 106145647-A0202-12-0006-5
N。 For this reason, each raw material layer may include powder having a particle size within a certain range. For example, in the first raw material layer to the Nth raw material layer, the minimum value of the range of the particle diameter of the powder included in the i-th raw material layer may be larger than the particle diameter of the powder included in the i-1 raw material layer The minimum value of the range, and may be less than or equal to the maximum value of the range of the particle size of the powder included in the i-1th raw material layer, where 1<i
Figure 106145647-A0202-12-0006-5
N.

在圖2中示出的示例性實施例中,多個原料層1、2、......、N可以包括四個原料層1、2、3、4。第1原料層包括的粉體的粒徑可以在10微米至50微米的範圍內,第2原料層包括的粉體的粒徑可以在20微米至 60微米的範圍內,第3原料層包括的粉體的粒徑可以在30微米至70微米的範圍內,第4原料層包括的粉體的粒徑可以在40微米至80微米的範圍內。 In the exemplary embodiment shown in FIG. 2, the plurality of raw material layers 1, 2, ..., N may include four raw material layers 1, 2, 3, 4. The particle size of the powder included in the first raw material layer may be in the range of 10 to 50 microns, the particle size of the powder included in the second raw material layer may be in the range of 20 to 60 microns, and the particle size of the third raw material layer The particle size of the powder may be in the range of 30 microns to 70 microns, and the particle size of the powder included in the fourth raw material layer may be in the range of 40 microns to 80 microns.

在圖2中示出的實施例性實施例中,每個原料層中包括的粒徑不同的粉體的分佈可以的關係可以符合常態分佈。然而,示例性實施例不限於此,在其他的示例性實施例中,每個原料層中包括的粒徑不同的粉體可以具有各種分佈形式,或者,每個原料層中包括的粉體的粒徑可以基本相同。 In the exemplary embodiment shown in FIG. 2, the distribution of the powders with different particle sizes included in each raw material layer may have a relationship that can conform to the normal distribution. However, the exemplary embodiments are not limited thereto, and in other exemplary embodiments, powders with different particle sizes included in each raw material layer may have various distribution forms, or, the powders included in each raw material layer The particle size can be substantially the same.

圖3是示出根據示例性實施例的選擇性雷射熔化(SLM)成型設備的示意圖。如圖3中所示,根據示例性實施例的選擇性雷射熔化成型設備300可以包括原料源310和雷射成型裝置330。 FIG. 3 is a schematic diagram illustrating a selective laser melting (SLM) molding apparatus according to an exemplary embodiment. As shown in FIG. 3, the selective laser melting molding apparatus 300 according to an exemplary embodiment may include a raw material source 310 and a laser molding apparatus 330.

原料源310可以是上面描述的根據示例性實施例的原料源。原料源310可以向雷射成型裝置330提供原料。 The raw material source 310 may be the raw material source according to the exemplary embodiment described above. The raw material source 310 may supply raw materials to the laser forming device 330.

具體地將,原料源310可以包括供給原料缸311、供料活塞313和供料輥315。供料活塞313設置在原料缸311中,並可在原料缸311中運動。因此,原料缸311和供料活塞313一起限定了原料容納空間。多個原料層可以順序設置在原料容納空間中,且多個原料層的粉體的平均粒徑可以沿供料方向減小。供料輥315可以設置在原料剛311的原料供給口處。當供料活塞313在原料缸311中運動以使多個原料層中最靠近原料供給口的原料層的一部分或全部通過原料供給口暴露到原料 缸311之外時,供料輥315可以推動暴露的原料,以將暴露的原料提供或運送到雷射成型裝置330。 Specifically, the raw material source 310 may include a supply raw material cylinder 311, a supply piston 313, and a supply roller 315. The feed piston 313 is provided in the raw material cylinder 311 and can move in the raw material cylinder 311. Therefore, the raw material cylinder 311 and the feed piston 313 together define the raw material accommodation space. A plurality of raw material layers can be sequentially arranged in the raw material accommodating space, and the average particle diameter of the powder of the plurality of raw material layers can be reduced along the feeding direction. The feed roller 315 may be provided at the raw material supply port of the raw material 311. When the feed piston 313 moves in the raw material cylinder 311 so that part or all of the raw material layer closest to the raw material supply port among the multiple raw material layers is exposed outside the raw material cylinder 311 through the raw material supply port, the feed roller 315 may push the exposure Raw materials to provide or transport the exposed raw materials to the laser forming device 330.

雷射成型裝置330可以包括成型缸331和成型活塞333。成型塞333設置在成型缸331中,並可以在成型缸331中運動。因此,成型剛331和成型活塞333一起限定了成型空間。此外,雷射成型裝置330還可以包括雷射器335。雷射器335可以生產雷射光束並將產生的雷射照射到成型空間。 The laser forming device 330 may include a forming cylinder 331 and a forming piston 333. The molding plug 333 is provided in the molding cylinder 331 and can move in the molding cylinder 331. Therefore, the molding 331 and the molding piston 333 together define the molding space. In addition, the laser forming device 330 may further include a laser 335. The laser 335 can produce a laser beam and irradiate the generated laser to the molding space.

下面簡要描述根據示例性實施例的選擇性雷射熔化成型設備300的操作。 The operation of the selective laser melting molding apparatus 300 according to an exemplary embodiment is briefly described below.

首先,供料活塞313可以在原料缸311中運動,以使多個原料層中最靠近原料供給口的原料層的一部分或全部通過原料供給口暴露到原料缸311之外。然後,供料輥315可以推動將暴露的原料,以將暴露的原料提供或運送到雷射成型裝置330,以填充在由成型缸331和成型活塞333一起限定的成型空間中。 First, the feed piston 313 may move in the raw material cylinder 311 so that a part or all of the raw material layers closest to the raw material supply port among the plurality of raw material layers are exposed outside the raw material cylinder 311 through the raw material supply port. Then, the feed roller 315 may push the exposed raw material to supply or transport the exposed raw material to the laser forming device 330 to fill the forming space defined by the forming cylinder 331 and the forming piston 333 together.

然後,雷射器335可以將雷射光束照射到成型空間中的原料,從而選擇性地使被照射的原料地熔化並凝固成期望的圖案。然後,成型活塞333在成型缸331中運動,以在成型缸中333形成新的成型空間。 Then, the laser 335 may irradiate the laser beam to the raw material in the molding space, thereby selectively melting and solidifying the irradiated raw material into a desired pattern. Then, the forming piston 333 moves in the forming cylinder 331 to form a new forming space in the forming cylinder 333.

可以重複上述操作,直到最終得到期望的成型產品。 The above operation can be repeated until the desired molded product is finally obtained.

如上所述,原料源310可以包括沿供料方向順序設置的多個原料層,且多個原料層的粉體的平均粒徑可以沿供料方向減。因此,在上述的選擇性雷射成型 工藝過程中,原料源310可以沿供料方向順序地將多個原料層中包括的粉體提供到雷射成型裝置。換句話說,根據示例性實施例的原料源310可以按照平均粒徑不斷增大的方式提供的作為原料的粉體。具體地講,在根據示例性實施例的選擇性雷射熔化成型方法中,首先,原料源310可以將第1原料層中包括的平均粒徑最小的粉體提供到雷射成型裝置330,並由雷射成型裝置330對平均粒徑最小的粉體進行雷射成型工藝。然後,當第1原料層中包括的粉體全部被提供到雷射成型裝置330之後,原料源310可以將第2原料層中包括的平均粒徑大於第1原料層中的粉體的平均粒徑的粉體提供到雷射成型裝置330,並由雷射成型裝置330進行雷射成型工藝。最後,原料源310可以將第N原料層中包括的平均粒徑最大的粉體提供到雷射成型裝置330,並由雷射成型裝置330進行雷射成型工藝,從而最終得到根據示例性實施例的選擇性雷射熔化成型方法製造的產品。 As described above, the raw material source 310 may include a plurality of raw material layers sequentially arranged along the feeding direction, and the average particle diameter of the powder of the multiple raw material layers may be reduced along the feeding direction. Therefore, in the above-mentioned selective laser forming process, the raw material source 310 can sequentially supply the powders included in the multiple raw material layers to the laser forming device along the feeding direction. In other words, the raw material source 310 according to the exemplary embodiment may provide the powder as the raw material in such a manner that the average particle diameter continuously increases. Specifically, in the selective laser melting molding method according to the exemplary embodiment, first, the raw material source 310 may provide the powder with the smallest average particle diameter included in the first raw material layer to the laser molding device 330, and The powder with the smallest average particle diameter is subjected to a laser forming process by the laser forming device 330. Then, after all the powders included in the first raw material layer are supplied to the laser forming apparatus 330, the raw material source 310 may increase the average particle size of the second raw material layer to be greater than the average particle size of the powder in the first raw material layer The powder of the diameter is supplied to the laser forming device 330, and the laser forming device 330 performs the laser forming process. Finally, the raw material source 310 may provide the powder with the largest average particle size included in the N-th raw material layer to the laser forming device 330, and the laser forming device 330 performs the laser forming process, thereby finally obtaining the exemplary embodiment according to Products manufactured by the selective laser melting molding method.

根據示例性實施例的原料源310可以通過下面的方法來製造,即,可以在原料源310的原料容納空間中設置多個原料層,以使所述多個原料層沿供料方向順序排列,其中,所述多個原料層包括粉體,且所述多個原料層的粉體的平均粒徑沿供料方向減小。例如,可以首先將平均粒徑最小的粉體填充到原料源310的原料容納空間中,以形成與原料源310的原料提供口相鄰的第N原料層。然後,可以將平均粒徑大於第N原料層的粉體的平均粒徑的粉體填充到原料源310的原料容納空間中,以形成與第N原料層相鄰的第N-1原料層。最終,將平均粒徑最大的粉體填充到原料源310的原料容納空間中,以形成第1原料層,從而得到根據示例性實施例的原料源310。然而,示例性實施例不限於此,可以以與供料方向相反的方向順序設置第1原料層至第N原料層,以得到根據示例性實施例的原料源350。 The raw material source 310 according to the exemplary embodiment may be manufactured by a method in which a plurality of raw material layers may be provided in the raw material accommodating space of the raw material source 310 so that the multiple raw material layers are sequentially arranged along the feeding direction, Wherein, the plurality of raw material layers include powders, and the average particle size of the powders of the plurality of raw material layers decreases along the feeding direction. For example, the powder with the smallest average particle diameter may be first filled into the raw material accommodating space of the raw material source 310 to form the N-th raw material layer adjacent to the raw material supply port of the raw material source 310. Then, powder having an average particle diameter larger than that of the powder of the N-th raw material layer may be filled into the raw material accommodating space of the raw material source 310 to form an N-1 raw material layer adjacent to the N-th raw material layer. Finally, the powder having the largest average particle diameter is filled into the raw material accommodating space of the raw material source 310 to form the first raw material layer, thereby obtaining the raw material source 310 according to the exemplary embodiment. However, the exemplary embodiment is not limited thereto, and the first raw material layer to the N-th raw material layer may be sequentially arranged in a direction opposite to the feeding direction to obtain the raw material source 350 according to the exemplary embodiment.

因此,根據示例性實施例,當進行例如選擇性雷射熔化工藝的增材製造工藝時,首先可以對平均粒徑較小的粉體層進行成型,然後可以對平均粒徑較大的粉體層進行成型,從而可以減小由於高溫熔化收縮導致粉體層和得到的實際產品層之間的偏差。此外,因為提供的粉體的平均粒徑逐漸增加,所以可以防止上述偏差隨著產品層數的增加,(或者說產品的高度的增加)而逐漸增大,從而防止最終產品出現致命缺陷,提高了最終產品的機械性能和表面品質。另外,根據示例性實施例的原料源可以更加充分的使用各種粒徑的粉末,從而減少了原料,節約成本。 Therefore, according to an exemplary embodiment, when performing an additive manufacturing process such as a selective laser melting process, a powder layer with a smaller average particle diameter can be molded first, and then a powder with a larger average particle diameter can be formed The layer is formed so that the deviation between the powder layer and the actual product layer due to high-temperature melting shrinkage can be reduced. In addition, because the average particle size of the provided powder gradually increases, the above deviation can be prevented from gradually increasing with the increase in the number of product layers (or the height of the product), thereby preventing fatal defects in the final product and improving The mechanical properties and surface quality of the final product. In addition, the raw material source according to the exemplary embodiment can more fully use powders of various particle sizes, thereby reducing raw materials and saving costs.

應當理解,雖然本說明書是按照各個實施例描述的,但並非每個實施例僅包含一個獨立的技術方案,說明書的這種敍述方式僅僅是為清楚起見,本領域技術人員應當將說明書作為一個整體,各實施例中的技術方案也可以經適當組合,形成本領域技術人員可以理解的其他實施方式。 It should be understood that although this specification is described according to various embodiments, not every embodiment contains only an independent technical solution. This description of the specification is only for clarity, and those skilled in the art should use the specification as a Overall, the technical solutions in the embodiments can also be appropriately combined to form other implementations that can be understood by those skilled in the art.

以上所述僅為本發明示意性的具體實施方式,並非用以限定本發明的範圍。任何本領域的技術人員,在不脫離本發明的構思和原則的前提下所作的均等變化、修改與結合,均應屬於本發明保護的範圍。 The above are only schematic specific embodiments of the present invention, and are not intended to limit the scope of the present invention. Any equivalent changes, modifications and combinations made by those skilled in the art without departing from the concept and principles of the present invention shall fall within the protection scope of the present invention.

1、2、......、N‧‧‧原料層 1, 2, ..., N‧‧‧ raw material layer

100‧‧‧原料源 100‧‧‧Raw material source

Claims (9)

一種原料源(100、310),其特徵在於,所述原料源包括沿供料方向順序設置的多個原料層,所述多個原料層包括粉體,且所述多個原料層的粉體的平均粒徑沿供料方向減小。 A raw material source (100, 310), characterized in that the raw material source includes a plurality of raw material layers sequentially arranged along a feeding direction, the multiple raw material layers include powders, and the powders of the multiple raw material layers The average particle size decreases along the feeding direction. 如請求項1的原料源,其中,所述多個原料層包括順序設置的第1原料層至第N原料層,其中,包括在第i原料層中的粉體的粒徑的範圍的最小值大於包括在第i-1原料層中的粉體的粒徑的範圍的最小值,且小於或等於包括在第i-1原料層中的粉體的粒徑的範圍的最大值,其中,1<i
Figure 106145647-A0305-02-0014-1
N。
The raw material source according to claim 1, wherein the plurality of raw material layers include a first raw material layer to an N-th raw material layer arranged in sequence, wherein the minimum value of the range of the particle diameter of the powder included in the i-th raw material layer Is greater than the minimum value of the range of the particle size of the powder included in the i-1 raw material layer, and less than or equal to the maximum value of the range of the particle size of the powder included in the i-1 raw material layer, where 1 <i
Figure 106145647-A0305-02-0014-1
N.
如請求項2的原料源,其中,所述多個原料層包括四個原料層,其中,第1原料層包括的粉體的粒徑在10微米至50微米的範圍內,第2原料層包括的粉體的粒徑在20微米至60微米的範圍內,第3原料層包括的粉體的粒徑在30微米至70微米的範圍內,第4原料層包括的粉體的粒徑在40微米至80微米的範圍內。 The raw material source according to claim 2, wherein the plurality of raw material layers includes four raw material layers, wherein the particle size of the powder included in the first raw material layer is in the range of 10 to 50 μm, and the second raw material layer includes The particle size of the powder is in the range of 20 microns to 60 microns, the particle size of the powder included in the third raw material layer is in the range of 30 microns to 70 microns, and the particle size of the powder included in the fourth raw material layer is 40 In the range of microns to 80 microns. 如請求項1的原料源,其中,所述多個原料層包括四個原料層,其中,第1原料層包括的粉體的平均粒徑為30微米,第2原料層包括的粉體的平均粒徑為40微米,第3原料層包括的粉體的平均粒徑為50微米,第4原料層包括的粉體的平均粒徑為60微米。 The raw material source according to claim 1, wherein the plurality of raw material layers includes four raw material layers, wherein the average particle diameter of the powder included in the first raw material layer is 30 μm, and the average value of the powder included in the second raw material layer The particle size is 40 μm, the average particle size of the powder included in the third raw material layer is 50 μm, and the average particle size of the powder included in the fourth raw material layer is 60 μm. 如請求項1的原料源,其中,所述粉體包括適用於選擇性雷射熔化的金屬或金屬合金。 The raw material source according to claim 1, wherein the powder includes a metal or metal alloy suitable for selective laser melting. 一種選擇性雷射熔化成型設備,其特徵在於,所述設 備包括:一雷射成型裝置(330);一如請求項1至5中任一項的原料源(310),被構造為向所述雷射成型裝置提供原料。 A selective laser melting molding equipment, characterized in that The preparation includes: a laser forming device (330); and a raw material source (310) according to any one of claims 1 to 5, which is configured to supply raw materials to the laser forming device. 如請求項6的選擇性雷射熔化成型設備,其中,所述原料源被構造為在選擇性雷射熔化成型過程中沿供料方向順序地將所述多個原料層中包括的粉體提供到所述雷射成型裝置。 The selective laser melting molding apparatus according to claim 6, wherein the raw material source is configured to sequentially provide the powders included in the plurality of raw material layers along the feeding direction during the selective laser melting molding process To the laser forming device. 一種原料源的製造方法,其特徵在於,所述方法包括:在原料源的原料容納空間中設置多個原料層,以使所述多個原料層沿供料方向順序排列,其中,所述多個原料層包括粉體,且所述多個原料層的粉體的平均粒徑沿供料方向減小。 A method for manufacturing a raw material source, characterized in that the method includes: providing a plurality of raw material layers in a raw material accommodating space of the raw material source, so that the multiple raw material layers are sequentially arranged along the feeding direction, wherein the multiple Each raw material layer includes powder, and the average particle diameter of the powder of the plurality of raw material layers decreases along the feeding direction. 一種選擇性雷射熔化成型方法,其特徵在於,所述方法包括:沿供料方向順序地將原料源中包括的多個原料層中的粉體提供到雷射成型裝置,其中,多個原料層沿供料方向順序設置在原料源中,且所述多個原料層的粉體的平均粒徑沿供料方向減小;對提供到雷射成型裝置的粉體執行選擇性雷射熔化成型工藝。 A selective laser melting molding method, characterized in that the method includes sequentially supplying powders in a plurality of raw material layers included in a raw material source to a laser molding device along a feeding direction, wherein a plurality of raw materials The layers are sequentially arranged in the raw material source along the feeding direction, and the average particle size of the powder of the plurality of raw material layers decreases along the feeding direction; selective laser melting molding is performed on the powder provided to the laser molding device Craftsmanship.
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