TWI676845B - Light board module for LED display - Google Patents
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Abstract
一種用於LED顯示屏的燈板模組，包含一燈板及多個封裝體。該等封裝體彼此間隔地設置在該燈板上，每一該封裝體包括一基板、至少二設置在該基板上的像素，及一覆蓋該等像素的封裝材，每一個該像素具有一第一發光二極體晶片、一第二發光二極體晶片，及一第三發光二極體晶片，該封裝材具有位在各像素之間的凹槽，且該凹槽的寬度與各封裝體之間的間隔距離相等。A light board module for an LED display screen includes a light board and a plurality of packages. The packages are disposed on the light board at a distance from each other. Each package includes a substrate, at least two pixels disposed on the substrate, and a packaging material covering the pixels. Each of the pixels has a first A light-emitting diode wafer, a second light-emitting diode wafer, and a third light-emitting diode wafer, the packaging material has grooves located between the pixels, and the width of the grooves and the package body The distance between them is equal.
Description
本發明是有關於一種燈板模組，特別是指一種具有多像素封裝並用於LED顯示屏的燈板模組。The invention relates to a light board module, in particular to a light board module having a multi-pixel package and used for an LED display screen.
現有的發光二極體顯示屏為了具有更加的顯示效果，常見的方式是在相同尺寸的顯示屏上，透過縮小各像素的封裝體的體積以讓更多像素更緊鄰的設置，從而提高顯示屏的解析度，然而，當各該封裝體的體積越做越小時，對應連接各像素中的發光二極體晶片的多個外接電極也會越來越密集，使得後續電路製作更密集而提高整體製作成本與製作難度。In order to improve the display effect of the existing light-emitting diode display, a common method is to reduce the volume of each pixel package to make more pixels closer to each other on the same size display, thereby improving the display. However, as the volume of each package becomes smaller, the multiple external electrodes corresponding to the light-emitting diode chips in each pixel will become denser and denser, making subsequent circuits more dense and improving the overall performance. Production cost and production difficulty.
因此，另一種方式則是以封裝材直接封裝多組像素，讓單一個封裝體內具有多組像素，使各像素中的發光二極體晶片能彼此更靠近設置，然而，此方式是直接封裝多組像素，封裝體內的各像素的各發光二極體晶片均被封裝在同一層封裝材中，相鄰的兩像素之間並沒有設置任何結構，且在中間或封裝材周圍的像素容易因全反射的物理現象造成出光角度不同，進而增加了封裝體內部的各像素間的混光，而影響顯示屏的色彩表現。Therefore, another method is to directly encapsulate multiple groups of pixels with a packaging material, so that there are multiple groups of pixels in a single package body, so that the light-emitting diode chips in each pixel can be arranged closer to each other. However, this method is to directly encapsulate multiple groups of pixels. Group of pixels, each light-emitting diode chip of each pixel in the package is packaged in the same layer of packaging material, there is no structure between the two adjacent pixels, and the pixels in the middle or around the packaging material are easy to The physical phenomenon of reflection causes different light emitting angles, thereby increasing the light mixing between the pixels inside the package, and affecting the color performance of the display screen.
因此，本發明的目的，即在提供一種用於LED顯示屏的燈板模組。Therefore, an object of the present invention is to provide a lamp board module for an LED display screen.
於是，本發明用於LED顯示屏的燈板模組，包含一燈板及多個封裝體。該等封裝體彼此間隔地設置在該燈板上，每一該封裝體包括一基板、至少二設置在該基板上的像素，及一覆蓋該等像素的封裝材，每一個該像素具有一第一發光二極體晶片、一第二發光二極體晶片，及一第三發光二極體晶片，該封裝材具有位在各像素之間的凹槽，且該凹槽的寬度與各封裝體之間的間隔距離相等。Therefore, the light board module for LED display of the present invention includes a light board and a plurality of packages. The packages are disposed on the light board at a distance from each other. Each package includes a substrate, at least two pixels disposed on the substrate, and a packaging material covering the pixels. Each of the pixels has a first A light-emitting diode wafer, a second light-emitting diode wafer, and a third light-emitting diode wafer, the packaging material has grooves located between the pixels, and the width of the grooves and the package body The distance between them is equal.
本發明的功效在於，在該封裝材上形成位在各像素之間的凹槽，減少單一像素在該封裝材內的全反射，使得色彩表現更為一致性，並進一步限制讓該凹槽的寬度與各封裝體之間的間隔距離相等，可以讓該封裝材內的該等像素間距與相鄰的該封裝體的該等像素的間距相同，在視覺上可減少類似馬賽克的情況發生。The effect of the present invention is that grooves between pixels are formed on the packaging material, reducing the total reflection of a single pixel in the packaging material, making the color performance more consistent, and further restricting the The width is equal to the separation distance between the packages, so that the pixel pitch in the packaging material is the same as the pixel pitch of the adjacent package, which can reduce the occurrence of mosaic-like situations visually.
在本發明被詳細描述之前，應當注意在以下的說明內容中，類似的元件是以相同的編號來表示。Before the present invention is described in detail, it should be noted that in the following description, similar elements are represented by the same numbers.
參閱圖1與圖2，本發明用於LED顯示屏的燈板模組的一第一實施例，包含一燈板2，及多個設置在該燈板2上的封裝體3。Referring to FIG. 1 and FIG. 2, a first embodiment of a light board module for an LED display according to the present invention includes a light board 2 and a plurality of packages 3 disposed on the light board 2.
具體地說，該燈板2為選自用於顯示屏的燈板基板，該等封裝體3陣列且彼此間隔地設置在該燈板2上，且在橫向方向X之相鄰的該封裝體3之間具有一橫向間隔距離D 1，在縱向方向Y之相鄰的該封裝體3之間具有一縱向間隔距離D 2。 Specifically, the light board 2 is selected from a light board substrate for a display screen, the packages 3 are arrayed and spaced apart from each other on the light board 2, and the packages 3 adjacent to each other in the lateral direction X There is a lateral separation distance D 1 between them, and there is a longitudinal separation distance D 2 between the packages 3 adjacent to each other in the longitudinal direction Y.
每一個該封裝體3包括一基板30、四組設置在該基板30上且分別具有三個發光二極體晶片的像素31，及一覆蓋該等像素31的封裝材32，該基板30選自一電路板，且該封裝材32具有位在各像素31之間的凹槽320，該凹槽320是呈縱橫交錯地分隔該等像素31，而將該封裝體3分隔出四個分別具有該等像素31的子封裝部33；其中，該凹槽320在橫向方向X具有一橫向寬度W 1，在縱向方向Y具有一縱向寬度W 2。要說明的是，本發明主要是透過該封裝材32將多個像素31封裝成單一個封裝體3，每一個該封裝體3中至少包括二組像素31，於本實施例中，每一個該封裝體3中的像素31組數量是以四組為例作說明，但並不以此為限制，也可以為二組、三組，或大於四組以上的數量。適用於本實施例的該封裝材32的材料可選自透明高分子材料，或其他用以封裝發光二極體晶片的材料，此材料的選用為本領域人員所周知，於此不加以贅述。 Each package 3 includes a substrate 30, four groups of pixels 31 disposed on the substrate 30 and having three light-emitting diode wafers, and a packaging material 32 covering the pixels 31. The substrate 30 is selected from A circuit board, and the packaging material 32 has grooves 320 located between the pixels 31. The grooves 320 divide the pixels 31 in a crisscross pattern, and the package 3 is divided into four with the The sub-packaging portion 33 of the equal pixel 31; wherein the groove 320 has a lateral width W 1 in the lateral direction X and a longitudinal width W 2 in the longitudinal direction Y. It should be noted that the present invention mainly encapsulates multiple pixels 31 into a single package 3 through the packaging material 32, and each package 3 includes at least two groups of pixels 31. In this embodiment, each of the The number of 31 groups of pixels in the package 3 is described by taking four groups as an example, but it is not limited thereto, and may be two, three, or more than four groups. The material suitable for the packaging material 32 in this embodiment may be selected from transparent polymer materials or other materials for packaging light-emitting diode wafers. The selection of this material is well known to those skilled in the art, and will not be repeated here.
該等像素31的數量與排列也沒有無特別限制，能以行列為1×2、1×3、1×4、1×5…等一維的方式排列，也能以行列為2 n×2 m(n、m為自然數，且n、m介於1~3)的二維矩陣方式排列。於本實施例中，該等像素31是以二維矩陣方式排列，且每一個該像素31具有一個第一發光二極體晶片311、一個第二發光二極體晶片312，及一個第三發光二極體晶片313，而此三個發光二極體晶片是沿縱向方向Y依序排列，此外，該第一發光二極體晶片311為能發出波長介於605nm~645nm的紅色發光二極體晶片，該第二發光二極體晶片312為能發出波長介於510nm~545nm的綠色發光二極體晶片，該第三發光二極體晶片313為能發出波長介於450nm~485nm的藍色發光二極體晶片為例做說明。 The number and arrangement of the pixels 31 are also not particularly limited, and can be arranged in a one-dimensional manner such as 1 × 2, 1 × 3, 1 × 4, 1 × 5, etc., or 2 n × 2 m (n, m are natural numbers, and n, m are between 1 and 3) are arranged in a two-dimensional matrix. In this embodiment, the pixels 31 are arranged in a two-dimensional matrix, and each pixel 31 has a first light-emitting diode wafer 311, a second light-emitting diode wafer 312, and a third light-emitting diode. Diode wafer 313, and the three light-emitting diode wafers are sequentially arranged along the longitudinal direction Y. In addition, the first light-emitting diode wafer 311 is a red light-emitting diode capable of emitting a wavelength between 605 nm and 645 nm. The second light-emitting diode wafer 312 is a green light-emitting diode wafer capable of emitting a wavelength between 510 nm and 545 nm, and the third light-emitting diode wafer 313 is a blue light-emitting diode capable of emitting a wavelength between 450 nm and 485 nm. A diode wafer is used as an example.
詳細地說，該凹槽320設置在各像素31之間，能減少單一個封裝體3內單一個像素31因為該封裝材32內側所增加的全反射，進而讓本發明燈板模組應用於顯示屏時，其色彩表現更為一致，此外，該凹槽320的設置還能避免單一個封裝體內3相鄰的像素31之間的混光。In detail, the groove 320 is disposed between the pixels 31, which can reduce the total reflection of a single pixel 31 in a single package 3 due to the inside of the packaging material 32, thereby allowing the lamp panel module of the present invention to be applied to When the display screen is used, the color performance is more consistent. In addition, the arrangement of the groove 320 can also avoid light mixing between the adjacent pixels 31 in a single package body.
更佳地，於本實施例中，進一步的讓該凹槽320的寬度與各封裝體3之間的間隔距離相等，也就是說，該凹槽320的橫向寬度W 1與該封裝體3之間的橫向間隔距離D 1相等，而該凹槽320的縱向寬度W 2與該封裝體3之間的縱向間隔距離D 2相等。透過讓凹槽320的寬度(W 1、W 2)與各封裝體3之間的間隔距離(D 1、D 2)相等，可以使得單一個該封裝體3內的子封裝部33的大小，及該等子封裝部33之間的間距，與相鄰的該封裝體3的該子封裝部33的大小及間距相同，換句話說，就是讓燈板模組中的各個子封裝部33的大小相同且彼此間距也相同，當應用在顯示屏上時，在視覺上可減少類似馬賽克的情況發生，特別是近距離觀賞時。 More preferably, in this embodiment, the width of the groove 320 and the spacing distance between the packages 3 are further made equal, that is, the lateral width W 1 of the groove 320 is equal to that of the package 3. between the lateral spacing distance D is equal to 1, and the longitudinal groove 22 of the width W 320 is equal to the longitudinal distance D between the package 3. By making the width (W 1 , W 2 ) of the groove 320 and the separation distance (D 1 , D 2 ) between the packages 3 equal, the size of the sub-package portion 33 in the package 3 can be made single. And the pitch between the sub-package parts 33 is the same as the size and pitch of the sub-package parts 33 of the adjacent package 3, in other words, the The same size and the same spacing between each other, when applied on the display, can reduce the occurrence of mosaic-like situations visually, especially when viewed at close range.
此處要說明的是，本實施例是讓橫向寬度W 1、橫向間隔距離D 1、縱向寬度W 2，及縱向間隔距離D 2彼此相等，但也可以視應用情況讓橫向方向X與縱向方向Y各自具有不同的寬度與間隔距離，只要讓橫向寬度W 1與橫向間隔距離D 1相等，讓縱向寬度W 2與縱向間隔距離D 2相等即可。 It should be explained here that in this embodiment, the horizontal width W 1 , the horizontal separation distance D 1 , the vertical width W 2 , and the vertical separation distance D 2 are equal to each other, but the horizontal direction X and the vertical direction may also be made according to the application. Y has a different width and separation distance, as long as the horizontal width W 1 and the horizontal separation distance D 1 are equal, and the vertical width W 2 and the vertical separation distance D 2 are equal.
更進一步地，在本實施例中，在橫向方向X的相鄰兩個該子封裝部33的該像素31的中心，往橫向方向X之相同方向至該封裝體3的周緣與至該凹槽320的邊緣的距離相等。舉例來說，在本實施例中，該四組像素31是以二維矩陣方式排列，定義第一組像素31是位於每一個封裝體3的第一排第一列處，而在橫向方向X與第一組像素31相鄰的像素31為第二組像素31，在縱向方向Y與第一組像素31相鄰的像素31為第三組像素31，最後一個像素31則為第四組像素31。因此，第一組像素31與第三組像素31往橫向方向X至該封裝體3的周緣的距離E 1，會與第二組像素31與第四組像素32往橫向方向X至該凹槽320的邊緣的距離E 2相等；同樣地，第一組像素31與第三組像素31往橫向方向X至該凹槽320的邊緣的距離E 3，會與第二組像素31與第四組像素32往橫向方向X至該封裝體3的周緣的距離E 4相等。 Furthermore, in this embodiment, the centers of the pixels 31 of the two adjacent sub-package portions 33 in the lateral direction X go to the same direction in the lateral direction X to the periphery of the package 3 and to the groove. The distances of the edges of 320 are equal. For example, in this embodiment, the four groups of pixels 31 are arranged in a two-dimensional matrix manner. It is defined that the first group of pixels 31 are located at the first row and the first column of each package 3, and in the lateral direction X The pixels 31 adjacent to the first group of pixels 31 are the second group of pixels 31. The pixels 31 adjacent to the first group of pixels 31 in the longitudinal direction Y are the third group of pixels 31. The last pixel 31 is the fourth group of pixels. 31. Therefore, the distance E 1 between the first group of pixels 31 and the third group of pixels 31 in the lateral direction X and the periphery of the package 3 will be the horizontal direction X to the grooves from the second group of pixels 31 and the fourth group of pixels 32. the edge 320 a distance equal to E 2; Likewise, the first set of pixels and the third set of pixels 31 31 to the X-direction transverse to the edge of the recess 320 a distance E 3, and a second group of pixels will be 31 and the fourth group The distance E 4 between the pixels 32 in the lateral direction X and the periphery of the package 3 is equal.
此外，在縱向方向Y的相鄰兩個該子封裝部33中的該像素31的該第一發光二極體晶片311的中心，往縱向方向Y之遠離該第二發光二極體晶片312的方向至該封裝體3的周緣與至該凹槽320的邊緣的距離相等，且各子封裝部33往縱向方向Y的長度L彼此相等。舉例來說，第一組像素31或第二組像素31的該第一發光二極體晶片311的中心往縱向方向Y反向該第二發光二極體晶片312至該封裝體3的周緣的距離F 1，會與第三組像素31或第四組像素31的該第一發光二極體晶片311的中心往縱向方向Y反向該第二發光二極體晶片312至該凹槽320的邊緣的距離F 2相等。 In addition, the center of the first light emitting diode wafer 311 of the pixel 31 in the two adjacent sub-package portions 33 in the longitudinal direction Y is away from the center of the second light emitting diode wafer 312 in the longitudinal direction Y. The distance from the direction to the peripheral edge of the package body 3 and the edge of the groove 320 is equal, and the lengths L of the sub-package portions 33 in the longitudinal direction Y are equal to each other. For example, the center of the first light-emitting diode wafer 311 of the first group of pixels 31 or the second group of pixels 31 is reversed from the center of the second light-emitting diode wafer 312 to the periphery of the package 3 in the longitudinal direction Y. The distance F 1 is opposite to the center of the first light-emitting diode wafer 311 of the third group of pixels 31 or the fourth group of pixels 31 in the longitudinal direction Y, and the distance from the second light-emitting diode wafer 312 to the groove 320 is reversed. The distance F 2 of the edges is equal.
此處要說明的是，現有顯示屏在調整發光角度時，通常是透過安裝機構來調整整片顯示屏以控制其發光角度，或是額外加裝透鏡來控制發光角度，反觀本發明該第一實施例的燈板模組應用於顯示屏時，能透過調整該距離E 1、E 3(距離E 2、E 4)，而直接控制燈板模組的橫向方向X的發光角度，也就是說，當讓距離E 1變大時，距離E 3則會相對變小，使得該等發光晶片由距離E 1處的發光角度變大，而由距離E 3的發光角度則相對變小。 It should be explained here that when adjusting the light emitting angle of the existing display screen, the whole display screen is usually adjusted by a mounting mechanism to control the light emitting angle, or an additional lens is used to control the light emitting angle. When the light board module of the embodiment is applied to a display screen, it is possible to directly control the light emitting angle of the lateral direction X of the light board module by adjusting the distances E 1 and E 3 (distances E 2 and E 4 ), that is, When the distance E 1 is made larger, the distance E 3 will be relatively smaller, so that the light emitting angles of the light emitting chips from the distance E 1 become larger, and the light emitting angles from the distance E 3 become relatively smaller.
本發明用於LED顯示屏的燈板模組是在該封裝材32覆蓋該等像素31進行封裝後，再透過切割刀具對該封裝材32進行切割，從而在各像素31之間形成該凹槽320，並在形成該凹槽320的同時，即調整距離E1、距離E2、距離E3與距離E4。形成該凹槽320的方式並不限於以切割刀具，也可以使用模具灌膠成型，直接在該等像素31上形成具有該凹槽320的該封裝材32。In the light board module for an LED display screen of the present invention, after the encapsulation material 32 covers the pixels 31 for encapsulation, the encapsulation material 32 is cut through a cutting tool to form the groove between the pixels 31. 320, and while forming the groove 320, the distance E1, the distance E2, the distance E3, and the distance E4 are adjusted. The method of forming the grooves 320 is not limited to cutting tools, but can also be formed by using a mold to mold the encapsulation material 32 having the grooves 320 directly on the pixels 31.
此處值得說明的是，當使用切割刀具來形成該凹槽320時，由於該切割刀具本身即具有固定的切割寬度，因而限制了後續形成該凹槽320的寬度，甚至導致該封裝體3中的各子封裝部33與該等像素31無法對稱設置，因此，本發明用於LED顯示屏的燈板模組以切割刀具形成該凹槽320時，是使用對稱切割方式來達成所需的凹槽寬度。It is worth noting here that when a cutting tool is used to form the groove 320, since the cutting tool itself has a fixed cutting width, the width of the subsequent formation of the groove 320 is limited, and even results in the package 3 Each of the sub-package parts 33 and the pixels 31 cannot be symmetrically arranged. Therefore, when the lamp board module for an LED display screen of the present invention uses a cutting tool to form the groove 320, a symmetrical cutting method is used to achieve the desired recess. Slot width.
舉例來說，一般切割刀具的切割寬度分成0.5mm與1.0mm，當要讓該凹槽320的寬度為1.4mm時，若先以切割刀具切割出1.0mm的寬度後，再進行第二次切割而切割出0.4mm時，該切割刀具須沿該封裝材32切割出0.4mm而僅有單邊受力，容易造成切割刀具撇刀或斷刀，因此，本發明用於LED顯示屏的燈板模組在切割1.4mm的寬度時，會使用具有切割寬度為0.5mm的切割刀具並進行三次切割，具體地說，先對該封裝材32切出彼此對稱而不相連通且寬度為0.5mm溝槽，讓此兩溝槽中間的該封裝材32的寬度為0.4mm，最後再中間寬度為0.4mm的封裝材32切除，以此方式形成該凹槽320時，切割刀具並不會有單邊受力的情況產生，能避免撇刀或斷刀的現象發生。For example, the cutting width of a general cutting tool is divided into 0.5mm and 1.0mm. When the width of the groove 320 is to be 1.4mm, if the cutting tool is used to cut the width of 1.0mm first, then the second cutting is performed. When cutting 0.4mm, the cutting tool must cut 0.4mm along the encapsulation material 32 with only one side of the force, which may easily cause the cutting tool to skim or break. Therefore, the present invention is used for a lamp panel of an LED display screen. When the module cuts a width of 1.4mm, it will use a cutting tool with a cutting width of 0.5mm and perform three cuts. Specifically, first cut out the packaging material 32 symmetrically but not connected with each other and a width of 0.5mm. Groove, so that the width of the packaging material 32 in the middle of the two grooves is 0.4 mm, and finally the packaging material 32 with a middle width of 0.4 mm is cut off. When the groove 320 is formed in this way, the cutting tool does not have a single edge. Forced conditions can be generated, which can avoid the phenomenon of skimming or breaking the knife.
參閱圖3與圖4，本發明用於LED顯示屏的燈板模組的一第二實施例，大致與該第一實施例相同，不同處在於，該第二實施例的該第一發光二極體晶片311、第二發光二極體晶片312，及第三發光二極體晶片313是沿橫向方向X排列。具體地說，該第二實施例的結構與該第一實施例相似，因此，該第二實施例中，在橫向方向X的相鄰兩個該子封裝部33的該像素31的該第三發光二極體晶片313的中心，往橫向方向X之遠離該第二發光二極體晶片312的方向至該封裝體3的周緣與至該凹槽320的邊緣的距離相等，且各子封裝部33往橫向方向X的寬度彼此相等；在縱向方向Y的相鄰兩個該子封裝部33的該像素31的中心，往縱向方向Y之相同方向至該封裝體3的周緣與至該凹槽320的邊緣的距離相等。同樣地，透過調整該距離E 1、E 3(距離E 2、E 4)，而直接控制燈板模組的縱向方向X的發光角度。由於該第二實施例與該第一實施例僅是該等發光二極體晶片的排列方向不同，而各個間距排列方式與邏輯相同於該第一實施例，於此不詳加贅述。 Referring to FIG. 3 and FIG. 4, a second embodiment of a lamp panel module for an LED display screen according to the present invention is substantially the same as the first embodiment, except that the first light-emitting module 2 of the second embodiment is The polar wafer 311, the second light-emitting diode wafer 312, and the third light-emitting diode wafer 313 are arranged in the lateral direction X. Specifically, the structure of the second embodiment is similar to that of the first embodiment. Therefore, in the second embodiment, the third The distance from the center of the light-emitting diode wafer 313 to the lateral direction X away from the second light-emitting diode wafer 312 to the periphery of the package 3 and the edge of the groove 320 is equal, and each sub-package portion The widths from 33 to the lateral direction X are equal to each other; the centers of the pixels 31 of the two adjacent sub-package portions 33 in the longitudinal direction Y go to the same direction in the longitudinal direction Y to the periphery of the package 3 and to the groove The distances of the edges of 320 are equal. Similarly, by adjusting the distances E 1 and E 3 (distances E 2 and E 4 ), the light emitting angle of the longitudinal direction X of the lamp board module is directly controlled. Since the second embodiment is different from the first embodiment only in the arrangement direction of the light-emitting diode wafers, and the arrangement and logic of each pitch is the same as that of the first embodiment, it is not described in detail here.
綜上所述，本發明用於LED顯示屏的燈板模組，在該封裝材32上形成位在各像素31之間的凹槽320，減少單一像素31在該封裝材32內的全反射，使色彩表現更為一致性，並進一步讓凹槽320的寬度與各封裝體3之間的間隔距離相等，使得單一個該封裝體3內的該子封裝部33的大小及該等子封裝部33之間的間距，與相鄰的該封裝體3內的該子封裝部33的大小及間距相同，也就是讓燈板模組中的各個子封裝部33的大小相同且彼此間距也相同，當應用在顯示屏上時，在視覺上可減少類似馬賽克的情況發生，此外，以對稱切割方式來形成該凹槽320時，能讓切割刀具在切割過程中不出現單邊受力的情況，以避免撇刀或斷刀的現象發生，故確實能達成本發明的目的。In summary, in the light board module for LED display screens of the present invention, grooves 320 are formed on the packaging material 32 between the pixels 31 to reduce the total reflection of a single pixel 31 in the packaging material 32. To make the color performance more consistent, and further make the width of the groove 320 and the spacing distance between the packages 3 equal, so that the size of the sub-package portion 33 in the package 3 and the sub-packages are single The spacing between the portions 33 is the same as the size and spacing of the sub-package portions 33 in the adjacent package 3, that is, the size of each sub-package portion 33 in the light board module is the same and the distance between them is also the same. When applied on the display screen, the occurrence of mosaic-like situations can be reduced visually. In addition, when the groove 320 is formed by a symmetrical cutting method, the cutting tool can not be subjected to unilateral force during the cutting process. In order to avoid the phenomenon of skimming or breaking the knife, it can really achieve the purpose of the invention.
惟以上所述者，僅為本發明的實施例而已，當不能以此限定本發明實施的範圍，凡是依本發明申請專利範圍及專利說明書內容所作的簡單的等效變化與修飾，皆仍屬本發明專利涵蓋的範圍內。However, the above are only examples of the present invention. When the scope of implementation of the present invention cannot be limited by this, any simple equivalent changes and modifications made according to the scope of the patent application and the contents of the patent specification of the present invention are still Within the scope of the invention patent.
2‧‧‧燈板2‧‧‧light board
D2‧‧‧縱向間隔距離 D2‧‧‧Vertical distance
3‧‧‧封裝體 3‧‧‧ Package
E1‧‧‧距離 E1‧‧‧Distance
30‧‧‧基板 30‧‧‧ substrate
E2‧‧‧距離 E2‧‧‧Distance
31‧‧‧像素 31‧‧‧ pixels
E3‧‧‧距離 E3‧‧‧Distance
311‧‧‧第一發光二極體 311‧‧‧First Light Emitting Diode
E4‧‧‧距離 E4‧‧‧Distance
312‧‧‧第二發光二極體 312‧‧‧Second light emitting diode
F1‧‧‧距離 F1‧‧‧distance
313‧‧‧第三發光二極體 313‧‧‧ third light emitting diode
F2‧‧‧距離 F2‧‧‧distance
32‧‧‧封裝材 32‧‧‧Packaging material
L‧‧‧長度 L‧‧‧ length
320‧‧‧凹槽 320‧‧‧ groove
W1‧‧‧橫向寬度 W1‧‧‧Horizontal width
33‧‧‧子封裝部 33‧‧‧Sub-Packaging Department
W2‧‧‧縱向寬度 W2‧‧‧vertical width
D1‧‧‧橫向間隔距離 D1‧‧‧Horizontal distance
本發明的其他的特徵及功效，將於參照圖式的實施方式中清楚地呈現，其中： 圖1是一俯視示意圖，說明本發明用於LED顯示屏的燈板模組的一第一實施例； 圖2是一剖面側視示意圖，輔助說明圖1的該第一實施例； 圖3是一俯視示意圖，說明本發明用於LED顯示屏的燈板模組的一第二實施例；及 圖4是一剖面側視示意圖，輔助說明圖1的該第二實施例。Other features and effects of the present invention will be clearly presented in the embodiment with reference to the drawings, wherein: FIG. 1 is a schematic top view illustrating a first embodiment of a lamp panel module for an LED display screen of the present invention Figure 2 is a schematic cross-sectional side view to assist in explaining the first embodiment of Figure 1; Figure 3 is a schematic top view to illustrate a second embodiment of a lamp panel module for an LED display screen of the present invention; and 4 is a schematic cross-sectional side view to assist in explaining the second embodiment of FIG. 1.
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| US7415167B2 (en) * | 1992-04-09 | 2008-08-19 | Olympus Optical Co., Ltd. | Image processing apparatus |
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