TW202024746A - Light board module for LED display screen capable of reducing total reflection occurred in the packaging material and having consistent color performance - Google Patents

Light board module for LED display screen capable of reducing total reflection occurred in the packaging material and having consistent color performance Download PDF

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TW202024746A
TW202024746A TW107147367A TW107147367A TW202024746A TW 202024746 A TW202024746 A TW 202024746A TW 107147367 A TW107147367 A TW 107147367A TW 107147367 A TW107147367 A TW 107147367A TW 202024746 A TW202024746 A TW 202024746A
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light
emitting diode
package
pixels
groove
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TW107147367A
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TWI676845B (en
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張仁鴻
蕭松益
莊峰輝
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宏齊科技股份有限公司
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    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
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  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
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  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

A light board module for LED display screen includes a light board and a plurality of packages. The packages are spaced apart from each other on the light board, each of which includes a substrate, at least two pixels disposed on the substrate, and a packaging material covering the pixels. Each pixel has a first light-emitting diode chip, a second light-emitting diode chip, and a third light-emitting diode chip. The packaging material has a groove provided between the pixels, and the width of the groove is equal to a separation distance between the packages.

Description

用於LED顯示屏的燈板模組Light board module for LED display

本發明是有關於一種燈板模組，特別是指一種具有多像素封裝並用於LED顯示屏的燈板模組。The invention relates to a light board module, in particular to a light board module with a multi-pixel package and used for an LED display screen.

現有的發光二極體顯示屏為了具有更加的顯示效果，常見的方式是在相同尺寸的顯示屏上，透過縮小各像素的封裝體的體積以讓更多像素更緊鄰的設置，從而提高顯示屏的解析度，然而，當各該封裝體的體積越做越小時，對應連接各像素中的發光二極體晶片的多個外接電極也會越來越密集，使得後續電路製作更密集而提高整體製作成本與製作難度。In order to have a better display effect on the existing LED display, the common way is to reduce the volume of the package of each pixel on the display of the same size to allow more pixels to be arranged in close proximity, thereby improving the display However, when the volume of each package becomes smaller and smaller, the multiple external electrodes corresponding to the light-emitting diode chip in each pixel will become denser, making subsequent circuit production more dense and improving the overall Production cost and production difficulty.

因此，另一種方式則是以封裝材直接封裝多組像素，讓單一個封裝體內具有多組像素，使各像素中的發光二極體晶片能彼此更靠近設置，然而，此方式是直接封裝多組像素，封裝體內的各像素的各發光二極體晶片均被封裝在同一層封裝材中，相鄰的兩像素之間並沒有設置任何結構，且在中間或封裝材周圍的像素容易因全反射的物理現象造成出光角度不同，進而增加了封裝體內部的各像素間的混光，而影響顯示屏的色彩表現。Therefore, another method is to directly encapsulate multiple groups of pixels with the packaging material, so that there are multiple groups of pixels in a single package, so that the light-emitting diode chips in each pixel can be placed closer to each other. However, this method is to directly package multiple groups of pixels. Group of pixels, each light-emitting diode chip of each pixel in the package is packaged in the same layer of packaging material. There is no structure between two adjacent pixels, and the pixels in the middle or around the packaging material are easily affected by The physical phenomenon of reflection causes different light exit angles, which in turn increases the light mixing between the pixels inside the package, and affects the color performance of the display screen.

因此，本發明的目的，即在提供一種用於LED顯示屏的燈板模組。Therefore, the purpose of the present invention is to provide a light panel module for LED display screens.

於是，本發明用於LED顯示屏的燈板模組，包含一燈板及多個封裝體。該等封裝體彼此間隔地設置在該燈板上，每一該封裝體包括一基板、至少二設置在該基板上的像素，及一覆蓋該等像素的封裝材，每一個該像素具有一第一發光二極體晶片、一第二發光二極體晶片，及一第三發光二極體晶片，該封裝材具有位在各像素之間的凹槽，且該凹槽的寬度與各封裝體之間的間隔距離相等。Therefore, the light board module used for the LED display screen of the present invention includes a light board and a plurality of packages. The packages are arranged on the lamp board at intervals, and each package includes a substrate, at least two pixels arranged on the substrate, and an encapsulation material covering the pixels. Each pixel has a first A light-emitting diode chip, a second light-emitting diode chip, and a third light-emitting diode chip, the packaging material has a groove between each pixel, and the width of the groove is the same as each package body The separation distance between is equal.

本發明的功效在於，在該封裝材上形成位在各像素之間的凹槽，減少單一像素在該封裝材內的全反射，使得色彩表現更為一致性，並進一步限制讓該凹槽的寬度與各封裝體之間的間隔距離相等，可以讓該封裝材內的該等像素間距與相鄰的該封裝體的該等像素的間距相同，在視覺上可減少類似馬賽克的情況發生。The effect of the present invention is to form grooves between pixels on the packaging material, reduce the total reflection of a single pixel in the packaging material, make the color performance more consistent, and further restrict the grooves. The width is equal to the spacing distance between each package body, so that the pixel pitch in the package material can be the same as the pixel pitch of the adjacent package body, which can reduce the occurrence of similar mosaics visually.

在本發明被詳細描述之前，應當注意在以下的說明內容中，類似的元件是以相同的編號來表示。Before the present invention is described in detail, it should be noted that in the following description, similar elements are represented by the same numbers.

參閱圖1與圖2，本發明用於LED顯示屏的燈板模組的一第一實施例，包含一燈板2，及多個設置在該燈板2上的封裝體3。Referring to FIGS. 1 and 2, a first embodiment of a light board module for an LED display screen of the present invention includes a light board 2 and a plurality of packages 3 arranged on the light board 2.

具體地說，該燈板2為選自用於顯示屏的燈板基板，該等封裝體3陣列且彼此間隔地設置在該燈板2上，且在橫向方向X之相鄰的該封裝體3之間具有一橫向間隔距離D1 ，在縱向方向Y之相鄰的該封裝體3之間具有一縱向間隔距離D2 。Specifically, the light board 2 is selected from light board substrates for display screens, and the packages 3 are arranged on the light board 2 in an array and spaced apart from each other, and the packages 3 adjacent to each other in the transverse direction X There is a horizontal separation distance D 1 therebetween, and there is a longitudinal separation distance D 2 between the adjacent packages 3 in the longitudinal direction Y.

每一個該封裝體3包括一基板30、四組設置在該基板30上且分別具有三個發光二極體晶片的像素31，及一覆蓋該等像素31的封裝材32，該基板30選自一電路板，且該封裝材32具有位在各像素31之間的凹槽320，該凹槽320是呈縱橫交錯地分隔該等像素31，而將該封裝體3分隔出四個分別具有該等像素31的子封裝部33；其中，該凹槽320在橫向方向X具有一橫向寬度W1 ，在縱向方向Y具有一縱向寬度W2 。要說明的是，本發明主要是透過該封裝材32將多個像素31封裝成單一個封裝體3，每一個該封裝體3中至少包括二組像素31，於本實施例中，每一個該封裝體3中的像素31組數量是以四組為例作說明，但並不以此為限制，也可以為二組、三組，或大於四組以上的數量。適用於本實施例的該封裝材32的材料可選自透明高分子材料，或其他用以封裝發光二極體晶片的材料，此材料的選用為本領域人員所周知，於此不加以贅述。Each package 3 includes a substrate 30, four sets of pixels 31 arranged on the substrate 30 and each having three light-emitting diode chips, and a package material 32 covering the pixels 31. The substrate 30 is selected from A circuit board, and the packaging material 32 has grooves 320 located between the pixels 31. The grooves 320 separate the pixels 31 in a crisscross pattern, and the package body 3 is divided into four. Equivalent to the sub-encapsulation portion 33 of the pixel 31; wherein the groove 320 has a lateral width W 1 in the lateral direction X and a longitudinal width W 2 in the longitudinal direction Y. It should be noted that the present invention mainly encapsulates a plurality of pixels 31 into a single package body 3 through the packaging material 32. Each package body 3 includes at least two groups of pixels 31. In this embodiment, each The number of groups of pixels 31 in the package 3 is illustrated by taking four groups as an example, but it is not limited to this, and can also be two groups, three groups, or more than four groups. The material of the packaging material 32 suitable for this embodiment can be selected from transparent polymer materials or other materials for packaging light-emitting diode chips. The selection of this material is well known to those skilled in the art and will not be repeated here.

該等像素31的數量與排列也沒有無特別限制，能以行列為1×2、1×3、1×4、1×5…等一維的方式排列，也能以行列為2n ×2m (n、m為自然數，且n、m介於1~3)的二維矩陣方式排列。於本實施例中，該等像素31是以二維矩陣方式排列，且每一個該像素31具有一個第一發光二極體晶片311、一個第二發光二極體晶片312，及一個第三發光二極體晶片313，而此三個發光二極體晶片是沿縱向方向Y依序排列，此外，該第一發光二極體晶片311為能發出波長介於605nm~645nm的紅色發光二極體晶片，該第二發光二極體晶片312為能發出波長介於510nm~545nm的綠色發光二極體晶片，該第三發光二極體晶片313為能發出波長介於450nm~485nm的藍色發光二極體晶片為例做說明。The number and arrangement of the pixels 31 are also not particularly limited. They can be arranged in a one-dimensional manner such as 1×2, 1×3, 1×4, 1×5, etc., or 2 n ×2 rows and columns. m (n and m are natural numbers, and n and m are between 1 and 3) arranged in a two-dimensional matrix. In this embodiment, the pixels 31 are arranged in a two-dimensional matrix, and each pixel 31 has a first light-emitting diode chip 311, a second light-emitting diode chip 312, and a third light-emitting diode chip. The diode chip 313, and the three light-emitting diode chips are sequentially arranged along the longitudinal direction Y. In addition, the first light-emitting diode chip 311 is a red light-emitting diode capable of emitting a wavelength between 605 nm and 645 nm The second light-emitting diode chip 312 is a green light-emitting diode chip with a wavelength between 510nm and 545nm, and the third light-emitting diode chip 313 is a blue light-emitting diode chip with a wavelength between 450nm and 485nm. Take a diode chip as an example for illustration.

詳細地說，該凹槽320設置在各像素31之間，能減少單一個封裝體3內單一個像素31因為該封裝材32內側所增加的全反射，進而讓本發明燈板模組應用於顯示屏時，其色彩表現更為一致，此外，該凹槽320的設置還能避免單一個封裝體內3相鄰的像素31之間的混光。In detail, the groove 320 is provided between the pixels 31, which can reduce the total reflection of a single pixel 31 in a single package 3 due to the increase in the inside of the package material 32, thereby allowing the lamp panel module of the present invention to be applied to In the case of a display screen, the color performance is more consistent. In addition, the arrangement of the groove 320 can also avoid light mixing between 3 adjacent pixels 31 in a single package.

更佳地，於本實施例中，進一步的讓該凹槽320的寬度與各封裝體3之間的間隔距離相等，也就是說，該凹槽320的橫向寬度W1 與該封裝體3之間的橫向間隔距離D1 相等，而該凹槽320的縱向寬度W2 與該封裝體3之間的縱向間隔距離D2 相等。透過讓凹槽320的寬度(W1 、W2 )與各封裝體3之間的間隔距離(D1 、D2 )相等，可以使得單一個該封裝體3內的子封裝部33的大小，及該等子封裝部33之間的間距，與相鄰的該封裝體3的該子封裝部33的大小及間距相同，換句話說，就是讓燈板模組中的各個子封裝部33的大小相同且彼此間距也相同，當應用在顯示屏上時，在視覺上可減少類似馬賽克的情況發生，特別是近距離觀賞時。More preferably, in this embodiment, the width of the groove 320 is further made equal to the separation distance between the packages 3, that is, the width W 1 of the groove 320 is the same as the distance between the packages 3 The lateral separation distance D 1 between the two is equal, and the longitudinal width W 2 of the groove 320 is equal to the longitudinal separation distance D 2 between the package body 3. By making the width (W 1 , W 2 ) of the groove 320 equal to the separation distance (D 1 , D 2 ) between the packages 3, the size of the sub-package 33 in the package 3 can be made, And the spacing between the sub-package parts 33 are the same as the size and spacing of the sub-package parts 33 of the adjacent package body 3. In other words, the distance between the sub-package parts 33 in the light board module With the same size and the same distance from each other, when applied to the display, it can reduce the occurrence of similar mosaics visually, especially when viewing at close range.

此處要說明的是，本實施例是讓橫向寬度W1 、橫向間隔距離D1 、縱向寬度W2 ，及縱向間隔距離D2 彼此相等，但也可以視應用情況讓橫向方向X與縱向方向Y各自具有不同的寬度與間隔距離，只要讓橫向寬度W1 與橫向間隔距離D1 相等，讓縱向寬度W2 與縱向間隔距離D2 相等即可。What is to be explained here is that in this embodiment, the horizontal width W 1 , the horizontal separation distance D 1 , the vertical width W 2 , and the vertical separation distance D 2 are equal to each other, but the horizontal direction X and the vertical direction can also be set depending on the application. Each Y has a different width and separation distance, as long as the horizontal width W 1 and the horizontal separation distance D 1 are equal, and the vertical width W 2 and the vertical separation distance D 2 are equal.

更進一步地，在本實施例中，在橫向方向X的相鄰兩個該子封裝部33的該像素31的中心，往橫向方向X之相同方向至該封裝體3的周緣與至該凹槽320的邊緣的距離相等。舉例來說，在本實施例中，該四組像素31是以二維矩陣方式排列，定義第一組像素31是位於每一個封裝體3的第一排第一列處，而在橫向方向X與第一組像素31相鄰的像素31為第二組像素31，在縱向方向Y與第一組像素31相鄰的像素31為第三組像素31，最後一個像素31則為第四組像素31。因此，第一組像素31與第三組像素31往橫向方向X至該封裝體3的周緣的距離E1 ，會與第二組像素31與第四組像素32往橫向方向X至該凹槽320的邊緣的距離E2 相等；同樣地，第一組像素31與第三組像素31往橫向方向X至該凹槽320的邊緣的距離E3 ，會與第二組像素31與第四組像素32往橫向方向X至該封裝體3的周緣的距離E4 相等。Furthermore, in this embodiment, the centers of the pixels 31 of the two adjacent sub-package portions 33 in the lateral direction X are in the same direction in the lateral direction X to the periphery of the package 3 and to the groove The distances of the edges of 320 are equal. For example, in this embodiment, the four groups of pixels 31 are arranged in a two-dimensional matrix, and it is defined that the first group of pixels 31 are located in the first row and the first column of each package 3, and in the lateral direction X The pixels 31 adjacent to the first group of pixels 31 are the second group of pixels 31, the pixels 31 adjacent to the first group of pixels 31 in the longitudinal direction Y are the third group of pixels 31, and the last pixel 31 is the fourth group of pixels 31. Therefore, the distance E 1 from the first group of pixels 31 and the third group of pixels 31 in the lateral direction X to the periphery of the package 3 will be from the second group of pixels 31 and the fourth group of pixels 32 in the lateral direction X to the groove the edge 320 a distance equal to E 2; Likewise, the first set of pixels and the third set of pixels 31 31 to the X-direction transverse to the edge of the recess 320 a distance E 3, and a second group of pixels will be 31 and the fourth group The distance E 4 from the pixel 32 in the lateral direction X to the periphery of the package 3 is equal.

此外，在縱向方向Y的相鄰兩個該子封裝部33中的該像素31的該第一發光二極體晶片311的中心，往縱向方向Y之遠離該第二發光二極體晶片312的方向至該封裝體3的周緣與至該凹槽320的邊緣的距離相等，且各子封裝部33往縱向方向Y的長度L彼此相等。舉例來說，第一組像素31或第二組像素31的該第一發光二極體晶片311的中心往縱向方向Y反向該第二發光二極體晶片312至該封裝體3的周緣的距離F1 ，會與第三組像素31或第四組像素31的該第一發光二極體晶片311的中心往縱向方向Y反向該第二發光二極體晶片312至該凹槽320的邊緣的距離F2 相等。In addition, the center of the first light-emitting diode chip 311 of the pixel 31 in the two adjacent sub-package parts 33 in the longitudinal direction Y is far away from the second light-emitting diode chip 312 in the longitudinal direction Y The distance from the peripheral edge of the package body 3 to the edge of the groove 320 is equal, and the lengths L of the sub-package parts 33 in the longitudinal direction Y are equal to each other. For example, the center of the first light-emitting diode chip 311 of the first group of pixels 31 or the second group of pixels 31 is opposite to the longitudinal direction Y from the second light-emitting diode chip 312 to the periphery of the package 3 The distance F 1 is opposite to the center of the first light-emitting diode chip 311 of the third group of pixels 31 or the fourth group of pixels 31 in the longitudinal direction Y. The second light-emitting diode chip 312 to the groove 320 The edge distance F 2 is equal.

此處要說明的是，現有顯示屏在調整發光角度時，通常是透過安裝機構來調整整片顯示屏以控制其發光角度，或是額外加裝透鏡來控制發光角度，反觀本發明該第一實施例的燈板模組應用於顯示屏時，能透過調整該距離E1 、E3 (距離E2 、E4 )，而直接控制燈板模組的橫向方向X的發光角度，也就是說，當讓距離E1 變大時，距離E3 則會相對變小，使得該等發光晶片由距離E1 處的發光角度變大，而由距離E3 的發光角度則相對變小。What I want to explain here is that when adjusting the light-emitting angle of the existing display screen, the whole display is usually adjusted through the mounting mechanism to control the light-emitting angle, or additional lenses are added to control the light-emitting angle. When the light panel module of the embodiment is applied to a display screen, the distance E 1 , E 3 (distance E 2 , E 4 ) can be adjusted to directly control the light emitting angle of the light panel module in the lateral direction X, that is to say When the distance E 1 becomes larger, the distance E 3 will be relatively smaller, so that the light-emitting angle of the light-emitting chips from the distance E 1 becomes larger, and the light-emitting angle from the distance E 3 is relatively smaller.

本發明用於LED顯示屏的燈板模組是在該封裝材32覆蓋該等像素31進行封裝後，再透過切割刀具對該封裝材32進行切割，從而在各像素31之間形成該凹槽320，並在形成該凹槽320的同時，即調整距離E1、距離E2、距離E3與距離E4。形成該凹槽320的方式並不限於以切割刀具，也可以使用模具灌膠成型，直接在該等像素31上形成具有該凹槽320的該封裝材32。The light board module used in the LED display screen of the present invention is that after the packaging material 32 covers the pixels 31 for packaging, the packaging material 32 is cut by a cutting tool, thereby forming the groove between the pixels 31 320, and while forming the groove 320, the distance E1, the distance E2, the distance E3, and the distance E4 are adjusted. The method of forming the groove 320 is not limited to using a cutting tool, and a mold can be used for molding to form the packaging material 32 with the groove 320 directly on the pixels 31.

此處值得說明的是，當使用切割刀具來形成該凹槽320時，由於該切割刀具本身即具有固定的切割寬度，因而限制了後續形成該凹槽320的寬度，甚至導致該封裝體3中的各子封裝部33與該等像素31無法對稱設置，因此，本發明用於LED顯示屏的燈板模組以切割刀具形成該凹槽320時，是使用對稱切割方式來達成所需的凹槽寬度。It is worth noting here that when a cutting tool is used to form the groove 320, the cutting tool itself has a fixed cutting width, which limits the width of the groove 320 to be subsequently formed, and even causes the package 3 The sub-packages 33 and the pixels 31 of the present invention cannot be symmetrically arranged. Therefore, when the light board module for the LED display screen of the present invention uses a cutting tool to form the groove 320, a symmetrical cutting method is used to achieve the required concave Slot width.

舉例來說，一般切割刀具的切割寬度分成0.5mm與1.0mm，當要讓該凹槽320的寬度為1.4mm時，若先以切割刀具切割出1.0mm的寬度後，再進行第二次切割而切割出0.4mm時，該切割刀具須沿該封裝材32切割出0.4mm而僅有單邊受力，容易造成切割刀具撇刀或斷刀，因此，本發明用於LED顯示屏的燈板模組在切割1.4mm的寬度時，會使用具有切割寬度為0.5mm的切割刀具並進行三次切割，具體地說，先對該封裝材32切出彼此對稱而不相連通且寬度為0.5mm溝槽，讓此兩溝槽中間的該封裝材32的寬度為0.4mm，最後再中間寬度為0.4mm的封裝材32切除，以此方式形成該凹槽320時，切割刀具並不會有單邊受力的情況產生，能避免撇刀或斷刀的現象發生。For example, the cutting width of a general cutting tool is divided into 0.5mm and 1.0mm. When the width of the groove 320 is to be 1.4mm, if the width of 1.0mm is cut with the cutting tool, the second cutting is performed When 0.4mm is cut, the cutting tool must cut 0.4mm along the packaging material 32 and only one side is forced, which is likely to cause the cutting tool to skim or break. Therefore, the present invention is used for the light board of the LED display screen. When the module cuts a width of 1.4mm, it will use a cutting tool with a cutting width of 0.5mm and perform three cuts. Specifically, the packaging material 32 is first cut out of symmetrical but not connected grooves with a width of 0.5mm. Groove, so that the width of the packaging material 32 between the two grooves is 0.4mm, and finally the packaging material 32 with a middle width of 0.4mm is cut off. When the groove 320 is formed in this way, the cutting tool does not have one side When the force is applied, it can avoid the phenomenon of skewing or breaking the knife.

參閱圖3與圖4，本發明用於LED顯示屏的燈板模組的一第二實施例，大致與該第一實施例相同，不同處在於，該第二實施例的該第一發光二極體晶片311、第二發光二極體晶片312，及第三發光二極體晶片313是沿橫向方向X排列。具體地說，該第二實施例的結構與該第一實施例相似，因此，該第二實施例中，在橫向方向X的相鄰兩個該子封裝部33的該像素31的該第三發光二極體晶片313的中心，往橫向方向X之遠離該第二發光二極體晶片312的方向至該封裝體3的周緣與至該凹槽320的邊緣的距離相等，且各子封裝部33往橫向方向X的寬度彼此相等；在縱向方向Y的相鄰兩個該子封裝部33的該像素31的中心，往縱向方向Y之相同方向至該封裝體3的周緣與至該凹槽320的邊緣的距離相等。同樣地，透過調整該距離E1 、E3 (距離E2 、E4 )，而直接控制燈板模組的縱向方向X的發光角度。由於該第二實施例與該第一實施例僅是該等發光二極體晶片的排列方向不同，而各個間距排列方式與邏輯相同於該第一實施例，於此不詳加贅述。Referring to Figures 3 and 4, a second embodiment of the lamp panel module used in the LED display screen of the present invention is roughly the same as the first embodiment, except that the first light-emitting second embodiment of the second embodiment The pole body chip 311, the second light emitting diode chip 312, and the third light emitting diode chip 313 are arranged along the lateral direction X. Specifically, the structure of the second embodiment is similar to that of the first embodiment. Therefore, in the second embodiment, the third embodiment of the pixel 31 of the two adjacent sub-package portions 33 in the lateral direction X The distance from the center of the light-emitting diode chip 313 in the lateral direction X away from the second light-emitting diode chip 312 to the periphery of the package 3 and the edge of the groove 320 is equal, and each sub-package part The widths of 33 to the transverse direction X are equal to each other; the centers of the pixels 31 of the two adjacent sub-encapsulation portions 33 in the longitudinal direction Y are the same direction in the longitudinal direction Y to the periphery of the package 3 and to the groove The distances of the edges of 320 are equal. Similarly, by adjusting the distances E 1 and E 3 (distances E 2 , E 4 ), the light-emitting angle of the light panel module in the longitudinal direction X is directly controlled. Since the second embodiment and the first embodiment are only different in the arrangement direction of the light-emitting diode chips, and the arrangement and logic of the pitches are the same as in the first embodiment, it will not be described in detail here.

綜上所述，本發明用於LED顯示屏的燈板模組，在該封裝材32上形成位在各像素31之間的凹槽320，減少單一像素31在該封裝材32內的全反射，使色彩表現更為一致性，並進一步讓凹槽320的寬度與各封裝體3之間的間隔距離相等，使得單一個該封裝體3內的該子封裝部33的大小及該等子封裝部33之間的間距，與相鄰的該封裝體3內的該子封裝部33的大小及間距相同，也就是讓燈板模組中的各個子封裝部33的大小相同且彼此間距也相同，當應用在顯示屏上時，在視覺上可減少類似馬賽克的情況發生，此外，以對稱切割方式來形成該凹槽320時，能讓切割刀具在切割過程中不出現單邊受力的情況，以避免撇刀或斷刀的現象發生，故確實能達成本發明的目的。To sum up, the present invention is used for the lamp panel module of the LED display screen. The encapsulation material 32 forms the groove 320 between the pixels 31 to reduce the total reflection of a single pixel 31 in the encapsulation material 32. , Make the color performance more consistent, and further make the width of the groove 320 equal to the spacing distance between the packages 3, so that the size of the sub-package 33 in the package 3 and the sub-packages The spacing between the portions 33 is the same as the size and spacing of the sub-package 33 in the adjacent package 3, that is, the size of the sub-package 33 in the light board module is the same and the distance between each sub-package 33 is the same. When applied to the display screen, it can reduce the occurrence of mosaic-like situations visually. In addition, when the groove 320 is formed by a symmetrical cutting method, the cutting tool can be free from unilateral force during the cutting process. In order to avoid the phenomenon of skimming or breaking the knife, it can indeed achieve the purpose of the invention.

惟以上所述者，僅為本發明的實施例而已，當不能以此限定本發明實施的範圍，凡是依本發明申請專利範圍及專利說明書內容所作的簡單的等效變化與修飾，皆仍屬本發明專利涵蓋的範圍內。However, the foregoing are only examples of the present invention. When the scope of implementation of the present invention cannot be limited by this, all simple equivalent changes and modifications made according to the scope of the patent application of the present invention and the content of the patent specification still belong to Within the scope of the patent of the present invention.

2:燈板 D2:縱向間隔距離 3:封裝體 E1:距離 30:基板 E2:距離 31:像素 E3:距離 311:第一發光二極體 E4:距離 312:第二發光二極體 F1:距離 313:第三發光二極體 F2:距離 32:封裝材 L:長度 320:凹槽 W1:橫向寬度 33:子封裝部 W2:縱向寬度 D1:橫向間隔距離 2: Light board D2: Longitudinal separation distance 3: Package body E1: distance 30: substrate E2: distance 31: pixel E3: distance 311: The first light-emitting diode E4: distance 312: second light emitting diode F1: distance 313: third light-emitting diode F2: distance 32: Packaging material L: length 320: groove W1: horizontal width 33: Sub-package department W2: vertical width D1: Horizontal separation distance

本發明的其他的特徵及功效，將於參照圖式的實施方式中清楚地呈現，其中： 圖1是一俯視示意圖，說明本發明用於LED顯示屏的燈板模組的一第一實施例； 圖2是一剖面側視示意圖，輔助說明圖1的該第一實施例； 圖3是一俯視示意圖，說明本發明用於LED顯示屏的燈板模組的一第二實施例；及 圖4是一剖面側視示意圖，輔助說明圖1的該第二實施例。Other features and effects of the present invention will be clearly presented in the embodiments with reference to the drawings, in which: FIG. 1 is a top view schematic diagram illustrating a first embodiment of the light panel module used in the LED display screen of the present invention Fig. 2 is a schematic cross-sectional side view to assist in explaining the first embodiment of Fig. 1; Fig. 3 is a schematic top view showing a second embodiment of the lamp panel module used in the LED display screen of the present invention; and 4 is a schematic cross-sectional side view to assist in explaining the second embodiment of FIG. 1.

3:封裝體 3: Package body

31:像素 31: pixel

311:第一發光二極體 311: The first light-emitting diode

312:第二發光二極體 312: second light emitting diode

313:第三發光二極體 313: third light-emitting diode

320:凹槽 320: groove

33:子封裝部 33: Sub-package department

D1:橫向間隔距離 D 1 : Horizontal separation distance

D2:縱向間隔距離 D 2 : Longitudinal separation distance

E1:距離 E 1 : distance

E2:距離 E 2 : Distance

E3:距離 E 3 : Distance

E4:距離 E 4 : Distance

F1:距離 F 1 : distance

F2:距離 F 2 : distance

L:長度 L: length

W1:橫向寬度 W 1 : horizontal width

W2:縱向寬度 W 2 : Vertical width

Claims (6)

一種用於LED顯示屏的燈板模組，包含： 一燈板；及 多個封裝體，彼此間隔地設置在該燈板上，每一該封裝體包括一基板、至少二設置在該基板上的像素，及一覆蓋該等像素的封裝材，每一個該像素具有一第一發光二極體晶片、一第二發光二極體晶片，及一第三發光二極體晶片，該封裝材具有位在各像素之間的凹槽，且該凹槽的寬度與各封裝體之間的間隔距離相等。A light board module for an LED display screen, comprising: a light board; and a plurality of packages arranged on the light board at intervals, each package body includes a substrate, and at least two are arranged on the substrate And a packaging material covering the pixels, each of the pixels has a first light-emitting diode chip, a second light-emitting diode chip, and a third light-emitting diode chip, the packaging material has The groove is located between the pixels, and the width of the groove is equal to the spacing distance between the packages. 如請求項1所述的用於LED顯示屏的燈板模組，其中，每一該封裝體包括四個像素，該凹槽呈縱橫交錯地分隔該等像素，且該凹槽在橫向具有一橫向寬度，在縱向具有一縱向寬度，各封裝體之間在橫向具有一橫向間隔距離，在縱向具有一縱向間隔距離，該橫向寬度與該橫向間隔距離相等，該縱向寬度與該縱向間隔距離相等。The light panel module for an LED display screen according to claim 1, wherein each package includes four pixels, the groove is criss-crossed to separate the pixels, and the groove has a transverse direction Horizontal width, a vertical width in the vertical direction, a horizontal separation distance in the horizontal direction between each package, and a vertical separation distance in the vertical direction, the horizontal width is equal to the horizontal separation distance, and the vertical width is equal to the vertical separation distance . 如請求項2所述的用於LED顯示屏的燈板模組，其中，每一像素中的該第一發光二極體晶片、該第二發光二極體晶片，與該第三發光二極體晶片沿縱向方向排列，每一該封裝體被該凹槽分隔出四個分別具有該等像素的子封裝部，在橫向方向的相鄰兩個該子封裝部的該像素的中心，往橫向方向之相同方向至該封裝體的周緣與至該凹槽的邊緣的距離相等。The light panel module for an LED display screen according to claim 2, wherein the first light-emitting diode chip, the second light-emitting diode chip, and the third light-emitting diode in each pixel The body chips are arranged in the longitudinal direction, and each package body is separated by the groove into four sub-package parts each having the pixels. The centers of the pixels of the two adjacent sub-package parts in the lateral direction are towards the lateral direction. In the same direction, the distance from the periphery of the package body to the edge of the groove is equal. 如請求項3所述的用於LED顯示屏的燈板模組，其中，在縱向方向的相鄰兩個該子封裝部的該像素的該第一發光二極體晶片的中心，往縱向方向之遠離該第二發光二極體晶片的方向至該封裝體的周緣與至該凹槽的邊緣的距離相等，且各子封裝部往縱向方向的長度彼此相等。The light panel module for an LED display screen according to claim 3, wherein the center of the first light emitting diode chip of the pixel of the two adjacent sub-package parts in the longitudinal direction is toward the longitudinal direction The distance from the direction away from the second light emitting diode chip to the peripheral edge of the package body and the edge of the groove is equal, and the lengths of the sub-package parts in the longitudinal direction are equal to each other. 如請求項2所述的用於LED顯示屏的燈板模組，其中，每一像素中的該第一發光二極體晶片、該第二發光二極體晶片，與該第三發光二極體晶片為沿橫向方向排列，每一該封裝體被該凹槽分隔出四個分別具有該等像素的子封裝部，在橫向方向的相鄰兩個該子封裝部的該像素的該第三發光二極體晶片的中心，往橫向方向之遠離該第二發光二極體晶片的方向至該封裝體的周緣與至該凹槽的邊緣的距離相等，且各子封裝部往橫向方向的寬度彼此相等。The light panel module for an LED display screen according to claim 2, wherein the first light-emitting diode chip, the second light-emitting diode chip, and the third light-emitting diode in each pixel The bulk chips are arranged along the lateral direction, and each package body is separated by the groove into four sub-package parts each having the pixels. In the lateral direction, two adjacent sub-package parts of the pixel of the third The distance from the center of the light emitting diode chip in the lateral direction away from the second light emitting diode chip to the periphery of the package and the edge of the groove is equal, and the width of each sub-package in the lateral direction Equal to each other. 如請求項5所述的用於LED顯示屏的燈板模組，其中，在縱向方向的相鄰兩個該子封裝部的該像素的中心，往縱向方向之相同方向至該封裝體的周緣與至該凹槽的邊緣的距離相等。The light panel module for an LED display screen according to claim 5, wherein the center of the pixel of the two adjacent sub-package parts in the longitudinal direction is the same direction in the longitudinal direction to the periphery of the package body It is equal to the distance to the edge of the groove.
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