CN111383545A - Light board module for LED display - Google Patents
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Abstract
一种用于LED显示屏的灯板模组,包含灯板及多个封装体。所述封装体彼此间隔地设置在所述灯板上,每一所述封装体包括基板、至少两个设置在所述基板上的像素,及覆盖所述像素的封装材,每一个所述像素具有第一发光二极管芯片、第二发光二极管芯片,及第三发光二极管芯片,所述封装材具有位在各像素之间的凹槽,且所述凹槽的宽度与各封装体之间的间隔距离相等。在所述封装材上形成位在各像素之间的凹槽,减少单一像素在所述封装材内的全反射,使得色彩表现更为一致性,并进一步限制让所述凹槽的宽度与各封装体之间的间隔距离相等,在视觉上可减少类似马赛克的情况发生。
A light panel module for an LED display screen, including a light panel and multiple packages. The packages are spaced apart from each other on the light panel. Each package includes a substrate, at least two pixels provided on the substrate, and an packaging material covering the pixels. Each of the pixels It has a first light-emitting diode chip, a second light-emitting diode chip, and a third light-emitting diode chip. The packaging material has grooves between the pixels, and the width of the grooves is equal to the spacing between the packages. The distance is equal. Forming grooves between each pixel on the packaging material reduces the total reflection of a single pixel in the packaging material, making the color performance more consistent, and further limiting the width of the groove to each pixel. The spacing distance between packages is equal, which can visually reduce the occurrence of mosaic-like situations.
Description
技术领域technical field
本发明涉及一种灯板模组,特别是涉及一种具有多像素封装并用于LED显示屏的灯板模组。The invention relates to a light panel module, in particular to a light panel module with multi-pixel encapsulation and used in an LED display screen.
背景技术Background technique
现有的发光二极管显示屏为了具有更佳的显示效果,常见的方式是在相同尺寸的显示屏上,通过缩小各像素的封装体的体积以让更多像素更紧邻的设置,从而提高显示屏的解析度,然而,当各该封装体的体积越做越小时,对应连接各像素中的发光二极管芯片的多个外接电极也会越来越密集,使得后续电路制作更密集而提高整体制作成本与制作难度。In order to have a better display effect on the existing LED display screen, a common method is to reduce the volume of the package body of each pixel on a display screen of the same size to allow more pixels to be arranged in close proximity, thereby improving the display screen. However, when the volume of each package body is getting smaller and smaller, the plurality of external electrodes corresponding to connecting the LED chips in each pixel will be denser and denser, making the subsequent circuit fabrication more dense and increasing the overall fabrication cost and production difficulty.
因此,另一种方式则是以封装材直接封装多组像素,让单一个封装体内具有多组像素,使各像素中的发光二极管芯片能彼此更靠近设置,然而,此方式是直接封装多组像素,封装体内的各像素的各发光二极管芯片均被封装在同一层封装材中,相邻的两组像素之间并没有设置任何结构,且在中间或封装材周围的像素容易因全反射的物理现象造成出光角度不同,进而增加了封装体内部的各像素间的混光,而影响显示屏的色彩表现。Therefore, another method is to directly encapsulate multiple groups of pixels with packaging materials, so that there are multiple groups of pixels in a single package, so that the LED chips in each pixel can be placed closer to each other. However, this method is to directly package multiple groups of pixels. Pixels, each light-emitting diode chip of each pixel in the package is encapsulated in the same layer of packaging material, and there is no structure between the adjacent two groups of pixels, and the pixels in the middle or around the packaging material are prone to total reflection. The physical phenomenon results in different light emitting angles, which in turn increases the light mixing between the pixels inside the package, which affects the color performance of the display screen.
发明内容SUMMARY OF THE INVENTION
本发明的目的在于提供一种用于LED显示屏的灯板模组。The purpose of the present invention is to provide a light panel module for an LED display screen.
本发明用于LED显示屏的灯板模组,包含灯板,及多个封装体,所述封装体彼此间隔地设置在所述灯板上,每一个所述封装体包括基板、至少两个设置在所述基板上的像素,及覆盖所述像素的封装材,每一个所述像素具有第一发光二极管芯片、第二发光二极管芯片,及第三发光二极管芯片,所述封装材具有位在各像素之间的凹槽,且所述凹槽的宽度与各封装体之间的间隔距离相等。The light panel module used for the LED display screen of the present invention includes a light panel and a plurality of encapsulation bodies, the encapsulation bodies are arranged on the lamp board at intervals, and each of the encapsulation bodies includes a substrate, at least two Pixels disposed on the substrate, and a packaging material covering the pixels, each of the pixels has a first light-emitting diode chip, a second light-emitting diode chip, and a third light-emitting diode chip, and the packaging material has a There are grooves between the pixels, and the width of the grooves is equal to the spacing between the packages.
本发明用于LED显示屏的灯板模组的实施例中,每一个所述封装体包括四个像素,所述凹槽呈纵横交错地分隔所述像素,且所述凹槽在横向具有横向宽度,在纵向具有纵向宽度,各封装体之间在横向具有横向间隔距离,在纵向具有纵向间隔距离,所述横向宽度与所述横向间隔距离相等,所述纵向宽度与所述纵向间隔距离相等。In the embodiment of the light panel module used in the LED display screen of the present invention, each of the package bodies includes four pixels, the grooves are arranged to separate the pixels in a criss-cross pattern, and the grooves have a transverse direction in the transverse direction. The width has a longitudinal width in the longitudinal direction, and each package has a lateral spacing distance in the lateral direction and a longitudinal spacing distance in the longitudinal direction, the lateral width is equal to the lateral spacing distance, and the longitudinal width is equal to the longitudinal spacing distance .
较佳地,每一个像素中的所述第一发光二极管芯片、所述第二发光二极管芯片,与所述第三发光二极管芯片沿纵向方向排列,每一个所述封装体被所述凹槽分隔出四个分别具有所述像素的子封装部,在横向方向相邻的两个所述子封装部的所述像素的中心,往横向方向相同方向至所述封装体的周缘与至所述凹槽的边缘的距离相等。Preferably, the first light emitting diode chip, the second light emitting diode chip and the third light emitting diode chip in each pixel are arranged in a longitudinal direction, and each of the package bodies is separated by the groove. Four sub-encapsulation parts with the pixels respectively are obtained, and the centers of the pixels of the two adjacent sub-encapsulation parts in the lateral direction are in the same direction in the lateral direction to the periphery of the packaging body and to the concave The edges of the grooves are equidistant.
更佳地,在纵向方向的相邻两个所述子封装部的所述像素的所述第一发光二极管芯片的中心,往纵向方向远离所述第二发光二极管芯片的方向至所述封装体的周缘与至所述凹槽的边缘的距离相等,且各子封装部往纵向方向的长度彼此相等。More preferably, at the center of the first light-emitting diode chip of the pixels of the two adjacent sub-package parts in the longitudinal direction, the direction of the longitudinal direction away from the second light-emitting diode chip reaches the package body. The distance from the peripheral edge of the groove to the edge of the groove is equal, and the lengths of the sub-package parts in the longitudinal direction are equal to each other.
本发明用于LED显示屏的灯板模组的另一个实施例,每一像素中的所述第一发光二极管芯片、所述第二发光二极管芯片,与所述第三发光二极管芯片为沿横向方向排列,每一所述封装体被所述凹槽分隔出四个分别具有所述像素的子封装部,在横向方向相邻的两个所述子封装部的所述像素的所述第三发光二极管芯片的中心,往横向方向远离所述第二发光二极管芯片的方向至所述封装体的周缘与至所述凹槽的边缘的距离相等,且各子封装部往横向方向的宽度彼此相等。In another embodiment of the light panel module used in the LED display screen of the present invention, the first light emitting diode chip, the second light emitting diode chip, and the third light emitting diode chip in each pixel are in the lateral direction arranged in a direction, each of the package bodies is divided by the groove into four sub-package parts with the pixels respectively, and the third sub-package parts of the pixels of the two adjacent sub-package parts in the lateral direction The distance from the center of the light-emitting diode chip to the direction away from the second light-emitting diode chip in the lateral direction to the periphery of the package body and the edge of the groove are equal, and the widths of the sub-packages in the lateral direction are equal to each other .
较佳地,在纵向方向相邻的两个所述子封装部的所述像素的中心,往纵向方向相同方向至所述封装体的周缘与至所述凹槽的边缘的距离相等。Preferably, in the center of the pixels of the two adjacent sub-package parts in the longitudinal direction, the distances from the periphery of the package body and the edge of the groove in the same direction in the longitudinal direction are equal.
本发明的有益效果在于:在该封装材上形成位在各像素之间的凹槽,减少单一像素在该封装材内的全反射,使得色彩表现更为一致性,并进一步限制让该凹槽的宽度与各封装体之间的间隔距离相等,可以让该封装材内的所述像素间距与相邻的该封装体的所述像素的间距相同,在视觉上可减少类似马赛克的情况发生。The beneficial effects of the present invention are: forming grooves between the pixels on the packaging material, reducing the total reflection of a single pixel in the packaging material, making the color performance more consistent, and further limiting the use of the grooves The width of the package is equal to the spacing between the packages, so that the pixel pitch in the package can be the same as the pixel spacing of the adjacent package, which can visually reduce the occurrence of mosaic-like situations.
附图说明Description of drawings
图1是一俯视示意图,说明本发明用于LED显示屏的灯板模组的一第一实施例;FIG. 1 is a schematic top view illustrating a first embodiment of a light panel module for an LED display screen according to the present invention;
图2是一剖面侧视示意图,辅助说明图1的该第一实施例;FIG. 2 is a schematic cross-sectional side view to assist in explaining the first embodiment of FIG. 1;
图3是一俯视示意图,说明本发明用于LED显示屏的灯板模组的一第二实施例;及3 is a schematic top view illustrating a second embodiment of a light panel module for an LED display screen of the present invention; and
图4是一剖面侧视示意图,辅助说明图3的该第二实施例。FIG. 4 is a schematic cross-sectional side view to assist in explaining the second embodiment of FIG. 3 .
具体实施方式Detailed ways
下面结合附图及实施例对本发明进行详细说明。The present invention will be described in detail below with reference to the accompanying drawings and embodiments.
参阅图1与图2,本发明用于LED显示屏的灯板模组的一第一实施例,包含一灯板2,及多个设置在该灯板2上的封装体3。Referring to FIG. 1 and FIG. 2 , a first embodiment of a lamp panel module for an LED display screen of the present invention includes a
具体地说,该灯板2为选自用于显示屏的灯板基板,所述封装体3阵列且彼此间隔地设置在该灯板2上,且在横向方向X相邻的该封装体3之间具有一横向间隔距离D 1,在纵向方向Y相邻的该封装体3之间具有一纵向间隔距离D2。Specifically, the
每一个该封装体3包括一基板30、四组设置在该基板30上且分别具有三个发光二极管芯片的像素31,及一覆盖所述像素31的封装材32,该基板30选自一电路板,且该封装材32具有位在各像素31之间的凹槽320,该凹槽320是呈纵横交错地分隔所述像素31,而将该封装体3分隔出四个分别具有所述像素31的子封装部33;其中,该凹槽320在横向方向X具有一横向宽度W1,在纵向方向Y具有一纵向宽度W2。要说明的是,本发明主要是通过该封装材32将多个像素31封装成单一个封装体3,每一个该封装体3中至少包括二组像素31,于本实施例中,每一个该封装体3中的像素31组数量是以四组为例作说明,但并不以此为限制,也可以为二组、三组,或大于四组以上的数量。适用于本实施例的该封装材32的材料可选自透明高分子材料,或其他用于封装发光二极管芯片的材料,此材料的选用为本领域人员所周知,于此不加以赘述。Each of the
所述像素31的数量与排列也没有特别限制,能以行列为1×2、1×3、1×4、1×5…等一维的方式排列,也能以行列为2n×2m(n、m为自然数,且n、m介于1至3)的二维矩阵方式排列。于本实施例中,所述像素31是以二维矩阵方式排列,且每一个该像素31具有一个第一发光二极管芯片311、一个第二发光二极管芯片312,及一个第三发光二极管芯片313,而此三个发光二极管芯片是沿纵向方向Y依序排列,此外,该第一发光二极管芯片311为能发出波长介于605nm至645nm的红色发光二极管芯片,该第二发光二极管芯片312为能发出波长介于510nm至545nm的绿色发光二极管芯片,该第三发光二极管芯片313为能发出波长介于450nm至485nm的蓝色发光二极管芯片为例做说明。The number and arrangement of the
详细地说,该凹槽320设置在各像素31之间,能减少单一个封装体3内单一个像素31因为该封装材32内侧所增加的全反射,进而让本发明灯板模组应用于显示屏时,其色彩表现更为一致,此外,该凹槽320的设置还能避免单一个封装体内相邻的像素31之间的混光。In detail, the
更佳地,于本实施例中,进一步的让该凹槽320的宽度与各封装体3之间的间隔距离相等,也就是说,该凹槽320的横向宽度W1与该封装体3之间的横向间隔距离D1相等,而该凹槽320的纵向宽度W2与该封装体3之间的纵向间隔距离D2相等。通过让凹槽320的宽度(W1、W2)与各封装体3之间的间隔距离(D1、D2)相等,可以使得单一个该封装体3内的子封装部33的大小,及所述子封装部33之间的间距,与相邻的该封装体3的该子封装部33的大小及间距相同,换句话说,就是让灯板模组中的各个子封装部33的大小相同且彼此间距也相同,当应用在显示屏上时,在视觉上可减少类似马赛克的情况发生,特别是近距离观赏时。More preferably, in this embodiment, the width of the
此处要说明的是,本实施例是让横向宽度W1、横向间隔距离D1、纵向宽度W2,及纵向间隔距离D2彼此相等,但也可以视应用情况让横向方向X与纵向方向Y各自具有不同的宽度与间隔距离,只要让横向宽度W1与横向间隔距离D1相等,让纵向宽度W2与纵向间隔距离D2相等便可。It should be noted here that, in this embodiment, the horizontal width W 1 , the horizontal separation distance D 1 , the vertical width W 2 , and the vertical separation distance D 2 are equal to each other, but the horizontal direction X and the vertical direction can also be set depending on the application. Each Y has different widths and spacing distances, as long as the horizontal width W 1 is equal to the horizontal spacing distance D 1 , and the vertical width W 2 is equal to the vertical spacing distance D 2 .
更进一步地,在本实施例中,在横向方向X的相邻两个该子封装部33的该像素31的中心,往横向方向X相同方向至该封装体3的周缘与至该凹槽320的边缘的距离相等。举例来说,在本实施例中,该四组像素31是以二维矩阵方式排列,定义第一组像素31是位于每一个封装体3的第一排第一列处,而在横向方向X与第一组像素31相邻的像素31为第二组像素31,在纵向方向Y与第一组像素31相邻的像素31为第三组像素31,最后一个像素31则为第四组像素31。因此,第一组像素31与第三组像素31往横向方向X至该封装体3的周缘的距离E1,会与第二组像素31与第四组像素32往横向方向X至该凹槽320的边缘的距离E2相等;同样地,第一组像素31与第三组像素31往横向方向X至该凹槽320的边缘的距离E3,会与第二组像素31与第四组像素31往横向方向X至该封装体3的周缘的距离E4相等。Further, in this embodiment, in the lateral direction X, the centers of the
此外,在纵向方向Y的相邻两个该子封装部33中的该像素31的该第一发光二极管芯片311的中心,往纵向方向Y远离该第二发光二极管芯片312的方向至该封装体3的周缘与至该凹槽320的边缘的距离相等,且各子封装部33往纵向方向Y的长度L彼此相等。举例来说,第一组像素31或第二组像素31的该第一发光二极管芯片311的中心往纵向方向Y反向该第二发光二极管芯片312至该封装体3的周缘的距离F1,会与第三组像素31或第四组像素31的该第一发光二极管芯片311的中心往纵向方向Y反向该第二发光二极管芯片312至该凹槽320的边缘的距离F2相等。In addition, in the center of the
此处要说明的是,现有显示屏在调整发光角度时,通常是通过安装机构来调整整片显示屏以控制其发光角度,或是额外加装透镜来控制发光角度,反观本发明该第一实施例的灯板模组应用于显示屏时,能通过调整该距离E1、E3(距离E2、E4),而直接控制灯板模组的横向方向X的发光角度,也就是说,当让距离E1变大时,距离E3则会相对变小,使得所述发光芯片由距离E1处的发光角度变大,而由距离E3的发光角度则相对变小。It should be noted here that, when adjusting the light-emitting angle of the existing display screen, the entire display screen is usually adjusted by an installation mechanism to control the light-emitting angle, or an additional lens is added to control the light-emitting angle. When the light panel module of an embodiment is applied to a display screen, the light-emitting angle in the lateral direction X of the light panel module can be directly controlled by adjusting the distances E 1 , E 3 (distances E 2 , E 4 ), that is, That is, when the distance E1 is increased, the distance E3 will be relatively small, so that the light - emitting angle of the light - emitting chip increases from the distance E1 to the light - emitting angle from the distance E3 to relatively small.
本发明用于LED显示屏的灯板模组是在该封装材32覆盖所述像素31进行封装后,再通过切割刀具对该封装材32进行切割,从而在各像素31之间形成该凹槽320,并在形成该凹槽320的同时,调整距离E1、距离E2、距离E3与距离E4。形成该凹槽320的方式并不限于以切割刀具,也可以使用模具灌胶成型,直接在所述像素31上形成具有该凹槽320的该封装材32。In the light panel module used for the LED display screen of the present invention, after the
此处值得说明的是,当使用切割刀具来形成该凹槽320时,由于该切割刀具本身就具有固定的切割宽度,因而限制了后续形成该凹槽320的宽度,甚至导致该封装体3中的各子封装部33与所述像素31无法对称设置,因此,本发明用于LED显示屏的灯板模组以切割刀具形成该凹槽320时,是使用对称切割方式来达成所需的凹槽宽度。It is worth noting here that when a cutting tool is used to form the
举例来说,一般切割刀具的切割宽度分成0.5mm与1.0mm,当要让该凹槽320的宽度为1.4mm时,若先以切割刀具切割出1.0mm的宽度后,再进行第二次切割而切割出0.4mm时,该切割刀具须沿该封装材32切割出0.4mm而仅有单边受力,容易造成切割刀具撇刀或断刀,因此,本发明用于LED显示屏的灯板模组在切割1.4mm的宽度时,会使用具有切割宽度为0.5mm的切割刀具并进行三次切割,具体地说,先对该封装材32切出彼此对称而不相连通且宽度为0.5mm的沟槽,让此两沟槽中间的该封装材32的宽度为0.4mm,最后再将中间宽度为0.4mm的封装材32切除,以此方式形成该凹槽320时,切割刀具并不会有单边受力的情况产生,能避免撇刀或断刀的现象发生。For example, the cutting width of the general cutting tool is divided into 0.5 mm and 1.0 mm. When the width of the
参阅图3与图4,本发明用于LED显示屏的灯板模组的一第二实施例,大致与该第一实施例相同,不同处在于,该第二实施例的该第一发光二极管芯片311、第二发光二极管芯片312,及第三发光二极管芯片313是沿横向方向X排列。具体地说,该第二实施例的结构与该第一实施例相似,因此,该第二实施例中,在横向方向X的相邻两个该子封装部33的该像素31的该第三发光二极管芯片313的中心,往横向方向X远离该第二发光二极管芯片312的方向至该封装体3的周缘与至该凹槽320的边缘的距离相等,且各子封装部33往横向方向X的宽度彼此相等;在纵向方向Y的相邻两个该子封装部33的该像素31的中心,往纵向方向Y相同方向至该封装体3的周缘与至该凹槽320的边缘的距离相等。同样地,通过调整该距离E1、E3(距离E2、E4),而直接控制灯板模组的纵向方向Y的发光角度。由于该第二实施例与该第一实施例仅是所述发光二极管芯片的排列方向不同,而各个间距排列方式与逻辑相同于该第一实施例,于此不详加赘述。Referring to FIG. 3 and FIG. 4 , a second embodiment of a light panel module for an LED display screen of the present invention is substantially the same as the first embodiment, except that the first light emitting diode of the second embodiment The
综上所述,本发明用于LED显示屏的灯板模组,在该封装材32上形成位在各像素31之间的凹槽320,减少单一像素31在该封装材32内的全反射,使色彩表现更为一致性,并进一步让凹槽320的宽度与各封装体3之间的间隔距离相等,使得单一个该封装体3内的该子封装部33的大小及所述子封装部33之间的间距,与相邻的该封装体3内的该子封装部33的大小及间距相同,也就是让灯板模组中的各个子封装部33的大小相同且彼此间距也相同,当应用在显示屏上时,在视觉上可减少类似马赛克的情况发生,此外,以对称切割方式来形成该凹槽320时,能让切割刀具在切割过程中不出现单边受力的情况,以避免撇刀或断刀的现象发生,所以确实能达成本发明的目的。To sum up, in the light panel module of the present invention for an LED display screen,
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