CN111383545A - Lamp panel module for LED display screen - Google Patents
Lamp panel module for LED display screen Download PDFInfo
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- CN111383545A CN111383545A CN201910113447.2A CN201910113447A CN111383545A CN 111383545 A CN111383545 A CN 111383545A CN 201910113447 A CN201910113447 A CN 201910113447A CN 111383545 A CN111383545 A CN 111383545A
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- emitting diode
- lamp panel
- diode chip
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- 238000004806 packaging method and process Methods 0.000 claims abstract description 40
- 239000005022 packaging material Substances 0.000 claims abstract description 23
- 239000000758 substrate Substances 0.000 claims abstract description 10
- 238000000034 method Methods 0.000 claims description 4
- 238000005520 cutting process Methods 0.000 description 20
- 239000000463 material Substances 0.000 description 7
- 239000011159 matrix material Substances 0.000 description 3
- 239000011295 pitch Substances 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Theoretical Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Led Device Packages (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The utility model provides a lamp plate module for LED display screen, contains lamp plate and a plurality of packaging body. The packaging bodies are arranged on the lamp panel at intervals, each packaging body comprises a substrate, at least two pixels arranged on the substrate and packaging materials covering the pixels, each pixel is provided with a first light-emitting diode chip, a second light-emitting diode chip and a third light-emitting diode chip, each packaging material is provided with a groove positioned among the pixels, and the width of each groove is equal to the interval distance among the packaging bodies. The grooves among the pixels are formed on the packaging material, so that the total reflection of a single pixel in the packaging material is reduced, the color expression is more consistent, the width of the groove is further limited to be equal to the spacing distance among the packaging bodies, and the occurrence of mosaic-like conditions can be visually reduced.
Description
Technical Field
The invention relates to a lamp panel module, in particular to a lamp panel module with multi-pixel packaging and used for an LED display screen.
Background
In order to achieve a better display effect, a common method of the conventional light emitting diode display screen is to reduce the volume of a package of each pixel on a display screen with the same size so as to enable more pixels to be arranged in a closer proximity manner, thereby improving the resolution of the display screen.
Therefore, another way is to directly package multiple groups of pixels with a packaging material, so that a single package has multiple groups of pixels, and the led chips in each pixel can be arranged closer to each other, however, this way is to directly package multiple groups of pixels, and the led chips of each pixel in the package are all packaged in the same layer of packaging material, and there is no structure between two adjacent groups of pixels, and the pixels in the middle or around the packaging material are easy to have different light-emitting angles due to the physical phenomenon of total reflection, thereby increasing the light mixing among the pixels inside the package, and affecting the color performance of the display screen.
Disclosure of Invention
The invention aims to provide a lamp panel module for an LED display screen.
The invention discloses a lamp panel module for an LED display screen, which comprises a lamp panel and a plurality of packaging bodies, wherein the packaging bodies are arranged on the lamp panel at intervals, each packaging body comprises a substrate, at least two pixels arranged on the substrate and packaging materials covering the pixels, each pixel is provided with a first light-emitting diode chip, a second light-emitting diode chip and a third light-emitting diode chip, the packaging materials are provided with grooves positioned among the pixels, and the width of each groove is equal to the interval distance among the packaging bodies.
In the embodiment of the lamp panel module for the LED display screen, each packaging body comprises four pixels, the pixels are separated by the grooves in a criss-cross mode, the grooves are transversely wide and longitudinally wide, transverse spacing distances are arranged between the packaging bodies in the transverse direction, longitudinal spacing distances are arranged in the longitudinal direction, the transverse width is equal to the transverse spacing distances, and the longitudinal width is equal to the longitudinal spacing distances.
Preferably, the first led chip, the second led chip, and the third led chip in each pixel are arranged along a longitudinal direction, each of the packages is divided by the groove into four sub-packages respectively having the pixel, and the distances from the centers of the pixels of two adjacent sub-packages in a transverse direction to the periphery of the package and the edge of the groove in the same transverse direction are equal.
Preferably, the distance from the center of the first led chip of the pixel of two adjacent sub-packaging portions in the longitudinal direction to the periphery of the package and the edge of the groove in the direction away from the second led chip in the longitudinal direction is equal, and the lengths of the sub-packaging portions in the longitudinal direction are equal to each other.
In another embodiment of the lamp panel module for an LED display panel according to the present invention, the first LED chip, the second LED chip, and the third LED chip in each pixel are arranged along a transverse direction, each of the packages is divided by the groove into four sub-packages respectively having the pixels, the distances from the centers of the third LED chips of the pixels of two adjacent sub-packages in the transverse direction to the periphery of the package and the edge of the groove in the direction away from the second LED chip in the transverse direction are equal, and the widths of the sub-packages in the transverse direction are equal to each other.
Preferably, the distance from the center of the pixel of two longitudinally adjacent sub-package portions to the periphery of the package body and the edge of the groove in the same direction along the longitudinal direction is equal.
The invention has the beneficial effects that: the grooves among the pixels are formed on the packaging material, so that the total reflection of a single pixel in the packaging material is reduced, the color performance is more consistent, the width of the groove is further limited to be equal to the spacing distance among the packaging bodies, the pixel pitch in the packaging material can be the same as the pixel pitch of the adjacent packaging body, and the occurrence of mosaic-like conditions can be reduced visually.
Drawings
FIG. 1 is a schematic top view illustrating a first embodiment of a lamp panel module for an LED display panel according to the present invention;
FIG. 2 is a schematic sectional side view of the first embodiment of FIG. 1;
FIG. 3 is a schematic top view illustrating a second embodiment of the lamp panel module for an LED display panel according to the present invention; and
fig. 4 is a schematic sectional side view to assist in explaining the second embodiment of fig. 3.
Detailed Description
The present invention will be described in detail below with reference to the accompanying drawings and examples.
Referring to fig. 1 and 2, a lamp panel module for an LED display panel according to a first embodiment of the present invention includes a lamp panel 2 and a plurality of packages 3 disposed on the lamp panel 2.
Specifically, the lamp panel 2 is a lamp panel substrate selected from display screens, the packages 3 are arranged in an array and spaced from each other on the lamp panel 2, and a transverse spacing distance D is provided between the adjacent packages 3 in the transverse direction X1The packages 3 adjacent to each other in the longitudinal direction Y have a longitudinal spacing distance D therebetween2。
Each of the packages 3 includes a substrate 30, four groups of pixels 31 disposed on the substrate 30 and respectively having three led chips, and a package material 32 covering the pixels 31, wherein the substrate 30 is selected from a circuit board, and the package material 32 has grooves 320 between the pixels 31, the grooves 320 are criss-cross configured to separate the pixels 31, so as to separate the package 3 into four sub-packages 33 respectively having the pixels 31; the groove 320 has a transverse width W1 in the transverse direction X and a longitudinal width W2 in the longitudinal direction Y. It should be noted that the present invention mainly packages the pixels 31 into a single package 3 by the packaging material 32, and each package 3 at least includes two groups of pixels 31, in this embodiment, the number of the groups of pixels 31 in each package 3 is four, but not limited thereto, and may be two, three, or more than four. The material suitable for the package material 32 of the present embodiment may be selected from transparent polymer materials or other materials for packaging the light emitting diode chip, and the selection of the material is well known in the art and will not be described herein.
The number and arrangement of the pixels 31 are not particularly limited, and the pixels may be arranged in a one-dimensional manner such as a row of 1 × 2, 1 × 3, 1 × 4, 1 × 5 …, or may be arranged in a row of 2n×2m(n, m are natural numbers, and n, m are between 1 and 3) in a two-dimensional matrix. In the present embodiment, the pixels 31 are arranged in a two-dimensional matrix manner, and each of the pixels 31 has a first led chip 311, a second led chip 312, and a third led chip 313, and the three led chips are sequentially arranged along the longitudinal direction Y, in addition, the first led chip 311 is a red led chip capable of emitting light with a wavelength between 605nm and 645nm, the second led chip 312 is a green led chip capable of emitting light with a wavelength between 510nm and 545nm, and the third led chip 313 is a blue led chip capable of emitting light with a wavelength between 450nm and 485 nm.
In detail, the groove 320 is disposed between the pixels 31, so as to reduce total reflection of the single pixel 31 in the single package 3 due to the increased inner side of the package material 32, so that when the lamp panel module of the present invention is applied to a display screen, the color performance of the lamp panel module is more consistent, and in addition, the arrangement of the groove 320 can prevent light mixing between adjacent pixels 31 in the single package.
Preferably, in the present embodiment, the width of the groove 320 is further equal to the spacing distance between the packages 3, that is, the lateral width W of the groove 3201A transverse spacing distance D from the package body 31Equal to the longitudinal width W of the groove 3202A longitudinal spacing distance D from the package body 32Are equal. By letting the width (W) of the groove 3201、W2) A distance (D) from each package 31、D2) The sub-packaging portions 33 in a single package 3 and the space between the sub-packaging portions 33 may be the same as the size and the space between the sub-packaging portions 33 of the adjacent package 3, in other words, the sub-packaging portions 33 in the lamp panel module have the same size and the same space, and when the lamp panel module is applied to a display screen, the occurrence of mosaic-like situations can be visually reduced, especially when the lamp panel module is viewed at a close distance.
It should be noted that the present embodiment is designed to have a lateral width W1Laterally spaced apart by a distance D1Longitudinal width W2And a longitudinal separation distance D2Equal to each other, but the transverse direction X and the longitudinal direction Y may have different widths and spacing distances, respectively, depending on the application, as long as the transverse width W is allowed1Is spaced apart from the transverse direction by a distance D1Equal to the longitudinal width W2Is spaced apart from the longitudinal direction by a distance D2Equal.
Furthermore, in the present embodiment, the distances from the center of the pixel 31 of two adjacent sub-packages 33 in the transverse direction X to the periphery of the package 3 and the edge of the groove 320 in the same direction as the transverse direction X are equal. For example, in the present embodiment, the four sets of pixels 31 are arranged in a two-dimensional matrix, defining that the first set of pixels 31 is located at the first row and the first column of each package 3, and the pixels 31 adjacent to the first set of pixels 31 in the transverse direction X are the second set of pixels 31, the pixels 31 adjacent to the first set of pixels 31 in the longitudinal direction Y are the third set of pixels 31, and the last pixel 31 is the fourth set of pixels 31. Therefore, the first group of pixels 31 and the third group of pixels 31 are in the lateral directionX to the periphery of the package 31A distance E from the second group of pixels 31 and the fourth group of pixels 32 to the edge of the groove 320 along the transverse direction X2Equal; similarly, the distance E from the first group of pixels 31 to the edge of the groove 320 along the transverse direction X is between the third group of pixels 31 and the first group of pixels 313A distance E from the second group of pixels 31 and the fourth group of pixels 31 to the periphery of the package 3 along the transverse direction X4Are equal.
In addition, in the center of the first led chip 311 of the pixel 31 in two adjacent sub-packages 33 in the longitudinal direction Y, the distance from the peripheral edge of the package 3 to the edge of the groove 320 in the direction away from the second led chip 312 in the longitudinal direction Y is equal, and the lengths L of the sub-packages 33 in the longitudinal direction Y are equal to each other. For example, the distance F from the center of the first led chip 311 of the first group of pixels 31 or the second group of pixels 31 to the periphery of the package 3 is reversed from the center of the second led chip 312 to the longitudinal direction Y1The distance F from the second LED chip 312 to the edge of the recess 320 is reversed along the longitudinal direction Y from the center of the first LED chip 311 of the third or fourth group of pixels 31, 312Are equal.
It should be noted that, when the light-emitting angle of the conventional display screen is adjusted, the entire display screen is usually adjusted by the mounting mechanism to control the light-emitting angle, or the lens is additionally installed to control the light-emitting angle, and in contrast, when the light panel module according to the first embodiment of the present invention is applied to the display screen, the distance E can be adjusted1、E3(distance E)2、E4) And the light-emitting angle of the transverse direction X of the lamp panel module is directly controlled, namely, when the distance E is allowed1When it becomes larger, the distance E3It will be relatively smaller so that the light emitting chip is spaced by a distance E1The light emitting angle of the light emitting diode becomes larger and is increased by the distance E3The light emission angle of (2) becomes relatively small.
The lamp panel module for the LED display screen is formed by packaging the pixels 31 covered by the packaging material 32 and then cutting the packaging material 32 through the cutting tool, so that the pixels 31 are formed between the pixelsA groove 320, and adjusting the distance E while forming the groove 3201A distance E2A distance E3And a distance E4. The method for forming the groove 320 is not limited to the cutting tool, and the encapsulant 32 with the groove 320 can be directly formed on the pixel 31 by using a mold for molding.
It should be noted that, when the cutting tool is used to form the groove 320, since the cutting tool itself has a fixed cutting width, the width of the groove 320 formed subsequently is limited, and even the sub-package portions 33 and the pixels 31 in the package 3 cannot be symmetrically arranged, so that the lamp panel module for LED display panel of the present invention uses a symmetrical cutting method to form the groove 320.
For example, the cutting width of a general cutting tool is divided into 0.5mm and 1.0mm, when the width of the groove 320 is 1.4mm, if the cutting tool is used to cut out 1.0mm, and then the cutting tool is used to cut out 0.4mm by a second cutting, the cutting tool must cut out 0.4mm along the packaging material 32 and only has a single side force, which is easy to cause skimming or breaking of the cutting tool, therefore, when the lamp panel module for LED display panel of the present invention is used to cut out 1.4mm width, the cutting tool with the cutting width of 0.5mm is used to cut out three times, specifically, the packaging material 32 is cut out grooves with a width of 0.5mm which are symmetrical but not communicated, the width of the packaging material 32 in the middle of the two grooves is 0.4mm, and finally the packaging material 32 with a middle width of 0.4mm is cut out, when the groove 320 is formed in this way, the cutting tool does not have a single side force, the phenomenon of knife skimming or knife breaking can be avoided.
Referring to fig. 3 and 4, a second embodiment of the lamp panel module for an LED display panel according to the present invention is substantially the same as the first embodiment, except that the first LED chip 311, the second LED chip 312, and the third LED chip 313 of the second embodiment are arranged along the transverse direction X. Specifically, the second embodiment is similar in structure to the first embodiment, and therefore, the second embodimentIn the center of the third led chip 313 of the pixel 31 of two adjacent sub-packages 33 in the transverse direction X, the distance from the peripheral edge of the package 3 to the edge of the groove 320 in the direction away from the second led chip 312 in the transverse direction X is equal, and the widths of the sub-packages 33 in the transverse direction X are equal to each other; the distances from the centers of the pixels 31 of two adjacent sub-packaging parts 33 in the longitudinal direction Y to the periphery of the package 3 and the edge of the groove 320 in the same direction as the longitudinal direction Y are equal. Likewise, by adjusting the distance E1、E3(distance E)2、E4) And the light-emitting angle of the longitudinal direction Y of the lamp panel module is directly controlled. Since the second embodiment is different from the first embodiment only in the arrangement direction of the led chips, and the arrangement manner and logic of the pitches are the same as those of the first embodiment, they are not described in detail herein.
To sum up, in the lamp panel module for the LED display panel according to the present invention, the grooves 320 are formed on the packaging material 32 and located between the pixels 31, so as to reduce the total reflection of the single pixel 31 in the packaging material 32, so as to make the color appearance more consistent, and further make the width of the groove 320 equal to the distance between the packaging bodies 3, so that the size of the sub-packaging part 33 in a single packaging body 3 and the distance between the sub-packaging parts 33 are the same as the size and the distance between the sub-packaging parts 33 in the adjacent packaging bodies 3, that is, the size of each sub-packaging part 33 in the lamp panel module is the same and the distance between the sub-packaging parts is the same, when the lamp panel module is applied to the display panel, the occurrence of the mosaic-like situation can be reduced visually, and in addition, when the grooves 320 are formed in a symmetrical cutting manner, the situation of unilateral stress of the cutting tool does not occur during the cutting process, so as to avoid the phenomenon of skimming or knife breaking, and the purpose of the invention can be achieved.
Claims (6)
1. A lamp panel module for an LED display screen; the method is characterized in that:
the lamp panel module for the LED display screen comprises a lamp panel and a plurality of packaging bodies, wherein the packaging bodies are arranged on the lamp panel at intervals, each packaging body comprises a substrate, at least two pixels arranged on the substrate and packaging materials covering the pixels, each pixel is provided with a first light-emitting diode chip, a second light-emitting diode chip and a third light-emitting diode chip, each packaging material is provided with a groove located among the pixels, and the width of each groove is equal to the interval distance among the packaging bodies.
2. The lamp panel module for the LED display screen according to claim 1, wherein: each of the packages includes four pixels, the grooves are criss-crossed to separate the pixels, and the grooves have a transverse width in a transverse direction and a longitudinal width in a longitudinal direction, and have a transverse spacing distance in the transverse direction and a longitudinal spacing distance in the longitudinal direction between the packages, and the transverse width is equal to the transverse spacing distance and the longitudinal width is equal to the longitudinal spacing distance.
3. The lamp panel module for the LED display screen according to claim 2, wherein: the first light emitting diode chip, the second light emitting diode chip and the third light emitting diode chip in each pixel are arranged along the longitudinal direction, each package is divided into four sub-package parts respectively provided with the pixel by the groove, and the distances from the centers of the pixels of two adjacent sub-package parts in the transverse direction to the periphery of the package and the edge of the groove in the same direction in the transverse direction are equal.
4. The lamp panel module for the LED display screen according to claim 3, wherein: the distances from the center of the first light emitting diode chip of the pixel of two adjacent sub-packaging parts in the longitudinal direction to the periphery of the packaging body and the edge of the groove in the direction away from the second light emitting diode chip in the longitudinal direction are equal, and the lengths of the sub-packaging parts in the longitudinal direction are equal to each other.
5. The lamp panel module for the LED display screen according to claim 2, wherein: the first light emitting diode chip, the second light emitting diode chip and the third light emitting diode chip in each pixel are arranged along the transverse direction, each package is divided into four sub-package parts respectively provided with the pixel by the groove, the distance from the direction far away from the second light emitting diode chip to the periphery of the package and the edge of the groove in the center of the third light emitting diode chip of the pixel of two adjacent sub-package parts in the transverse direction is equal, and the width of each sub-package part in the transverse direction is equal to each other.
6. The lamp panel module for the LED display screen according to claim 5, wherein: and the distances from the centers of the pixels of the two adjacent sub-packaging parts in the longitudinal direction to the periphery of the packaging body and the edge of the groove in the same direction in the longitudinal direction are equal.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW107147367A TWI676845B (en) | 2018-12-27 | 2018-12-27 | Light board module for LED display |
| TW107147367 | 2018-12-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111383545A true CN111383545A (en) | 2020-07-07 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910113447.2A Pending CN111383545A (en) | 2018-12-27 | 2019-02-14 | Lamp panel module for LED display screen |
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| Country | Link |
|---|---|
| CN (1) | CN111383545A (en) |
| TW (1) | TWI676845B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114141912A (en) * | 2021-11-24 | 2022-03-04 | 东莞市中麒光电技术有限公司 | LED display module and manufacturing method |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI836602B (en) * | 2021-09-30 | 2024-03-21 | 隆達電子股份有限公司 | Display device |
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| US6205259B1 (en) * | 1992-04-09 | 2001-03-20 | Olympus Optical Co., Ltd. | Image processing apparatus |
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| US20140291637A1 (en) * | 2013-03-29 | 2014-10-02 | Samsung Display Co., Ltd. | Organic light emitting display apparatus |
| US20140353694A1 (en) * | 2013-05-29 | 2014-12-04 | Cree Huizhou Solid State Lighting Company Limited | Multiple pixel surface mount device package |
| CN203465907U (en) * | 2013-08-28 | 2014-03-05 | 深圳市奥拓电子股份有限公司 | Ultra-small dot spacing SMD (surface mount device) composite LED (light emitting diode) lamp |
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| CN108022526A (en) * | 2017-12-01 | 2018-05-11 | 深圳市锐拓显示技术有限公司 | A kind of encapsulating structure and display screen of light-emitting diode chip for backlight unit and drive integrated circult |
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| CN114141912A (en) * | 2021-11-24 | 2022-03-04 | 东莞市中麒光电技术有限公司 | LED display module and manufacturing method |
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| Publication number | Publication date |
|---|---|
| TWI676845B (en) | 2019-11-11 |
| TW202024746A (en) | 2020-07-01 |
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Application publication date: 20200707 |