TWI676554B - Bonding tape, protective piece using the same and polarizing plate using the same - Google Patents
Bonding tape, protective piece using the same and polarizing plate using the same Download PDFInfo
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- TWI676554B TWI676554B TW106120442A TW106120442A TWI676554B TW I676554 B TWI676554 B TW I676554B TW 106120442 A TW106120442 A TW 106120442A TW 106120442 A TW106120442 A TW 106120442A TW I676554 B TWI676554 B TW I676554B
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- G—PHYSICS
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- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/30—Polarising elements
- G02B5/3025—Polarisers, i.e. arrangements capable of producing a definite output polarisation state from an unpolarised input state
- G02B5/3033—Polarisers, i.e. arrangements capable of producing a definite output polarisation state from an unpolarised input state in the form of a thin sheet or foil, e.g. Polaroid
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Abstract
一種接合膠帶、應用其之保護片及偏光板。保護片包括第一保護層、第二保護層及接合膠帶。第二保護層與該第一保護層以邊對邊方式並排。接合膠帶接合第一保護層與第二保護層。 A bonding tape, a protective sheet to which the adhesive tape is applied, and a polarizing plate. The protective sheet includes a first protective layer, a second protective layer, and a bonding tape. The second protective layer and the first protective layer are side by side. The adhesive tape joins the first protective layer and the second protective layer.
Description
本發明是有關於一種接合膠帶、應用其之保護片及偏光板,且特別是有關於一種可接合二保護層的接合膠帶、應用其之保護片及偏光板。 The present invention relates to a bonding tape, a protective sheet and a polarizing plate using the same, and particularly to a bonding tape capable of bonding two protective layers, a protective sheet and a polarizing plate using the same.
傳統上,可透過壓合設備,將二保護片與偏光層壓合成一偏光板。然而,保護片在製作過程中會需要用到黏膠,此黏膠在壓合過程中會溢出而汙染到壓合設備,進而汙染到後續製程的偏光板或其它種類的光學產品。因此,如何改善前述汙染問題是本技術領域業者努力的目標之一。 Traditionally, two protective sheets and polarized light can be laminated into a polarizing plate through a laminating device. However, the protective sheet needs to use adhesive during the manufacturing process. This adhesive will overflow during the lamination process and contaminate the lamination equipment, which will contaminate the polarizing plate or other types of optical products in subsequent processes. Therefore, how to improve the aforementioned pollution problem is one of the goals of those skilled in the art.
本發明係有關於一種接合膠帶、應用其之保護片及偏光板,可改善前述汙染問題。 The invention relates to a bonding tape, a protective sheet and a polarizing plate using the same, which can improve the aforementioned pollution problem.
本發明一實施例提出一種接合膠帶。接合膠帶包括一基材及一接合層。基材具有一接合面與相對之一第一基材側面與一第二基材側面。接合層形成於基材之接合面上,接合層與第一基材側面間隔一第一距離且與第二基材側面間隔一第二距離。 An embodiment of the invention provides a bonding tape. The bonding tape includes a substrate and a bonding layer. The substrate has a joint surface and a first substrate side and a second substrate side opposite to each other. The bonding layer is formed on the bonding surface of the substrate. The bonding layer is spaced a first distance from the side surface of the first substrate and a second distance from the side surface of the second substrate.
本發明另一實施例提出一種保護片。保護片包括一第一保護層、一第二保護層及一前述之接合膠帶。第二保護層與該第一保護層以邊對邊方式並排。接合膠帶接合並排之第一保護層與第二保護層。 Another embodiment of the present invention provides a protective sheet. The protective sheet includes a first protective layer, a second protective layer, and the aforementioned bonding tape. The second protective layer and the first protective layer are side by side. The adhesive tape joins the first protective layer and the second protective layer side by side.
本發明另一實施例提出一種偏光板。偏光板包括一第一保護片、一第二保護片及一偏光層。偏光層配置在第一保護片與第二保護片之間。第一保護片與第二保護片至少一者具有如前述之保護片的結構。 Another embodiment of the present invention provides a polarizing plate. The polarizing plate includes a first protective sheet, a second protective sheet, and a polarizing layer. The polarizing layer is disposed between the first protective sheet and the second protective sheet. At least one of the first protective sheet and the second protective sheet has the structure of the aforementioned protective sheet.
本發明另一實施例提出一種保護片。保護片包括一第一保護層、一第二保護層、一接合膠帶及一裁切膠帶。第二保護層與該第一保護層以邊對邊方式並排。接合膠帶接合並排之第一保護層與第二保護層。第一保護層具有表面處理層,裁切膠帶黏貼在第一保護層相對表面處理層之另一表面上,且接合膠帶覆蓋整個裁切膠帶。 Another embodiment of the present invention provides a protective sheet. The protective sheet includes a first protective layer, a second protective layer, a bonding tape, and a cutting tape. The second protective layer and the first protective layer are side by side. The adhesive tape joins the first protective layer and the second protective layer side by side. The first protective layer has a surface treatment layer, a cutting tape is stuck on the other surface of the first protective layer opposite to the surface treatment layer, and the bonding tape covers the entire cutting tape.
本發明另一實施例提出一種偏光板。偏光板包括一第一保護片、一第二保護片及一偏光層。偏光層配置在第一保護片與第二保護片之間。第一保護片與第二保護片至少一者具有如前述之保護片的結構。 Another embodiment of the present invention provides a polarizing plate. The polarizing plate includes a first protective sheet, a second protective sheet, and a polarizing layer. The polarizing layer is disposed between the first protective sheet and the second protective sheet. At least one of the first protective sheet and the second protective sheet has the structure of the aforementioned protective sheet.
為了對本發明之上述及其他方面有更佳的瞭解,下文特舉實施例,並配合所附圖式詳細說明如下: In order to have a better understanding of the above and other aspects of the present invention, the following specific examples are described in detail below in conjunction with the accompanying drawings:
100、200‧‧‧偏光板 100, 200‧‧‧ polarizing plates
110、210、310、410、510、610‧‧‧第一保護片 110, 210, 310, 410, 510, 610‧‧‧ first protective film
111‧‧‧第一保護層 111‧‧‧first protective layer
111a、112a‧‧‧第一面 111a, 112a ‧ ‧ first side
111b‧‧‧第二面 111b‧‧‧Second Side
111s‧‧‧第一保護層側面 111s‧‧‧ side of the first protective layer
112‧‧‧第二保護層 112‧‧‧Second protective layer
112s‧‧‧第二保護層側面 112s‧‧‧Side of the second protective layer
113‧‧‧接合膠帶 113‧‧‧Joint tape
1131、2141‧‧‧基材 1111, 2141‧‧‧ substrate
1131a、2141a‧‧‧接合面 1131a, 2141a ‧‧‧ joint surface
1131b、2141b‧‧‧第一基材側面 1131b, 2141b‧‧‧ side of the first substrate
1131c、2141c‧‧‧第二基材側面 1131c, 2141c‧‧‧Side of the second substrate
1131d‧‧‧第三基材側面 1131d‧‧‧side of the third substrate
1131e‧‧‧第四基材側面 1131e‧‧‧Four side substrate
1132、2142‧‧‧接合層 1132, 2142‧‧‧ bonding layer
120、220‧‧‧第二保護片 120, 220‧‧‧Second protective film
130‧‧‧偏光層 130‧‧‧polarizing layer
214‧‧‧裁切膠帶 214‧‧‧cut tape
2142b‧‧‧第一接合層側面 2142b‧‧‧ Side of the first bonding layer
2142c‧‧‧第二接合層側面 2142c‧‧‧Side of the second bonding layer
215‧‧‧表面處理層 215‧‧‧Surface treatment layer
A1‧‧‧夾角 A1‧‧‧ angle
S1‧‧‧第一距離 S1‧‧‧First distance
S2‧‧‧第二距離 S2‧‧‧Second Distance
S3‧‧‧距離 S3‧‧‧ Distance
S4‧‧‧第三距離 S4‧‧‧ Third distance
SP1、SP2‧‧‧容膠空間 SP1, SP2 ‧‧‧ Adhesive Space
P1、P11~P15‧‧‧切割道 P1, P11 ~ P15‧‧‧ cutting road
第1A圖繪示依照本發明一實施例之第一保護片的俯視圖。 FIG. 1A illustrates a top view of a first protective sheet according to an embodiment of the present invention.
第1B圖繪示第1A圖之第一保護片沿方向1B-1B’的剖視圖。 FIG. 1B is a cross-sectional view of the first protective sheet in FIG. 1A along the direction 1B-1B '.
第2圖繪示依照本發明一實施例之偏光板的剖視圖。 FIG. 2 is a cross-sectional view of a polarizing plate according to an embodiment of the present invention.
第3圖繪示依照本發明另一實施例之第一保護片的剖視圖。 FIG. 3 is a cross-sectional view of a first protective sheet according to another embodiment of the present invention.
第4A~4D圖繪示第3圖之第一保護片的製造過程圖。 4A to 4D illustrate manufacturing process diagrams of the first protective sheet of FIG. 3.
第5圖繪示依照本發明另一實施例之偏光板的俯視圖。 FIG. 5 is a top view of a polarizing plate according to another embodiment of the present invention.
第6~9圖繪示依照本發明其它數個實施例的保護片的示意圖。 6 to 9 are schematic diagrams of protection sheets according to other embodiments of the present invention.
請參照第1A及1B圖,第1A圖繪示依照本發明一實施例之第一保護片110的俯視圖,而第1B圖繪示第1A圖之第一保護片110沿方向1B-1B’的剖視圖。 Please refer to FIGS. 1A and 1B. FIG. 1A illustrates a top view of the first protection sheet 110 according to an embodiment of the present invention, and FIG. 1B illustrates the first protection sheet 110 of FIG. 1A along the direction 1B-1B '. Sectional view.
第一保護片110包括第一保護層111、第二保護層112及接合膠帶113,其中接合膠帶113接合分離之第一保護層111與第二保護層112,以形成一延長保護層結構。本實施例的第一保護片110例如是裁切成至少一偏光片產品前的第一保護片材,其具有一定連續長度,能被捲繞在一捲料輪,且可連續傳輸於壓合設備中。 The first protection sheet 110 includes a first protection layer 111, a second protection layer 112, and a bonding tape 113. The bonding tape 113 bonds the separated first protection layer 111 and the second protection layer 112 to form an extended protection layer structure. The first protection sheet 110 in this embodiment is, for example, a first protection sheet before being cut into at least one polarizer product, which has a certain continuous length, can be wound on a reel, and can be continuously transmitted in a lamination. Device.
第一保護層111與第二保護層112以邊對邊方式並排。例如,第一保護層111及第二保護層112分別具有第一保護層側面111s及第二保護層側面112s,第一保護層側面111s與第二保護層側面112s相對配置。此外,第一保護層側面111s及第二保護層側面112s可彼此接觸,然亦可彼此間隔。 The first protective layer 111 and the second protective layer 112 are arranged side by side. For example, the first protective layer 111 and the second protective layer 112 have a first protective layer side surface 111s and a second protective layer side surface 112s, respectively, and the first protective layer side surface 111s and the second protective layer side surface 112s are oppositely disposed. In addition, the first protective layer side surface 111s and the second protective layer side surface 112s may be in contact with each other, but may also be spaced apart from each other.
接合膠帶113黏貼在第一保護層111的第一面111a與第二保護層112的第一面112a,以接合第一保護層111與第二保護層 112。第一保護層111的第一面111a與第二保護層112的第一面112a係第一保護片110之同側的表面。 The adhesive tape 113 is adhered to the first surface 111a of the first protective layer 111 and the first surface 112a of the second protective layer 112 to bond the first protective layer 111 and the second protective layer. 112. The first surface 111 a of the first protective layer 111 and the first surface 112 a of the second protective layer 112 are surfaces on the same side of the first protective sheet 110.
接合膠帶113包括基材1131及接合層1132,其中接合層1132預形成於基材1131之接合面1131a上。接合膠帶113透過接合層1132接合第一保護層111與第二保護層112。此外,接合層1132例如是黏膠,其可由例如是(甲基)丙烯酸共聚物之材料製成,例如是可包含但不限於官能基的材料,如(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸丁酯、(甲基)丙烯酸2-乙基己酯等材料。 The bonding tape 113 includes a base material 1131 and a bonding layer 1132. The bonding layer 1132 is formed in advance on the bonding surface 1131 a of the base material 1131. The bonding tape 113 bonds the first protective layer 111 and the second protective layer 112 through the bonding layer 1132. In addition, the bonding layer 1132 is, for example, an adhesive, which may be made of a material such as a (meth) acrylic copolymer, such as a material that may include, but is not limited to, a functional group, such as methyl (meth) acrylate, (meth) ) Ethyl acrylate, butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate and the like.
基材1131更具有相對之第一基材側面1131b與第二基材側面1131c,前述接合面1131a延伸於第一基材側面1131b與一第二基材側面1131c之間。接合層1132與第一基材側面1131b間隔第一距離S1且與第二基材側面1131c間隔一第二距離S2。如此,在偏光板100(如第2圖所示)的壓合製程中,可避免在壓合力作用下,接合層1132的膠溢出超過第一基材側面1131b及第二基材側面1131c,進而避免接合層1132的膠汙染到壓合設備,如滾輪。 The substrate 1131 further has a first substrate side surface 1131b and a second substrate side surface 1131c opposite to each other. The aforementioned bonding surface 1131a extends between the first substrate side surface 1131b and a second substrate side surface 1131c. The bonding layer 1132 is spaced a first distance S1 from the first substrate side surface 1131b and is spaced a second distance S2 from the second substrate side surface 1131c. In this way, in the lamination process of the polarizing plate 100 (as shown in FIG. 2), it is possible to prevent the adhesive of the bonding layer 1132 from overflowing beyond the first substrate side 1131 b and the second substrate side 1131 c under the action of the lamination force, and furthermore, Avoid contamination of the adhesive of the bonding layer 1132 to the pressing equipment, such as a roller.
第一距離S1與第二距離S2之和占第一基材側面1131b與第二基材側面1131c之間的距離S3的比例可介於約2%~約20%、或約5%~約20%或約10%~約20%,可確保接合層1132不會溢出第一基材側面1131b及第二基材側面1131c。 The ratio of the sum of the first distance S1 and the second distance S2 to the distance S3 between the first substrate side surface 1131b and the second substrate side surface 1131c may be between about 2% to about 20%, or about 5% to about 20 % Or about 10% to about 20%, to ensure that the bonding layer 1132 does not overflow the first substrate side surface 1131b and the second substrate side surface 1131c.
在一實施例中,如第1A圖所示,接合層1132與基材1131的另外相對之第三基材側面1131d與第四基材側面1131e也可具 有類似第一基材側面1131b與第二基材側面1131c之設計,以達到相似的效果。 In an embodiment, as shown in FIG. 1A, the third substrate side surface 1131d and the fourth substrate side surface 1131e of the bonding layer 1132 and the substrate 1131 which are opposite to each other may also There are designs similar to the first substrate side 1131b and the second substrate side 1131c to achieve similar effects.
請參照第2圖,其繪示依照本發明一實施例之偏光板100的剖視圖。偏光板100包括第一保護片110、第二保護片120及偏光層130。第二保護片120具有相同於或類似於第一保護片110的結構,於此不再贅述。偏光層130位於第一保護片110與第二保護片120之間,以受到第一保護片110與第二保護片120的保護。在另一實施例中,第二保護片120為一連續延伸的單一保護片結構,可不包含接合膠帶113。本實施例的第二保護片120例如是裁切成至少一偏光片產品前的第二保護片材,其具有一定連續長度,能被捲繞在一捲料輪,且可連續傳輸於壓合設備中。此外,本實施例的偏光板100例如是裁切成至少一偏光片產品前的偏光板材,其具有一定連續長度,能被捲繞在一捲料輪,且可連續傳輸於壓合設備中。 Please refer to FIG. 2, which illustrates a cross-sectional view of a polarizing plate 100 according to an embodiment of the present invention. The polarizing plate 100 includes a first protective sheet 110, a second protective sheet 120, and a polarizing layer 130. The second protective sheet 120 has a structure that is the same as or similar to the first protective sheet 110, and details are not described herein again. The polarizing layer 130 is located between the first protective sheet 110 and the second protective sheet 120 to be protected by the first protective sheet 110 and the second protective sheet 120. In another embodiment, the second protection sheet 120 is a continuously extending single protection sheet structure, and may not include the bonding tape 113. The second protection sheet 120 in this embodiment is, for example, a second protection sheet before being cut into at least one polarizer product, which has a certain continuous length, can be wound on a reel, and can be continuously transferred to the lamination Device. In addition, the polarizing plate 100 in this embodiment is, for example, a polarizing plate before being cut into at least one polarizer product, which has a certain continuous length, can be wound on a reel, and can be continuously transmitted in a laminating device.
偏光層130可為吸附配向之二色性色素之聚乙烯醇(polyvinyl alcohol,PVA)薄膜或由液晶材料摻附具吸收染料分子所形成。聚乙烯醇可藉由皂化聚乙酸乙烯酯而形成。在一些實施例中,聚乙酸乙烯酯可為乙酸乙烯酯之單聚物或乙酸乙烯酯及其它單體之共聚物等。上述其它單體可為不飽和羧酸類、烯烴類、不飽和磺酸類或乙烯基醚類等。在另一些實施例中,聚乙烯醇可為經改質的聚乙烯醇,例如,經醛類改質的聚乙烯甲醛、聚乙烯乙醛或聚乙烯丁醛等。 The polarizing layer 130 may be a polyvinyl alcohol (PVA) film that adsorbs and aligns dichroic pigments, or is formed by mixing liquid crystal material with absorbing dye molecules. Polyvinyl alcohol can be formed by saponifying polyvinyl acetate. In some embodiments, the polyvinyl acetate may be a single polymer of vinyl acetate or a copolymer of vinyl acetate and other monomers. The other monomers may be unsaturated carboxylic acids, olefins, unsaturated sulfonic acids, vinyl ethers, and the like. In other embodiments, the polyvinyl alcohol can be modified polyvinyl alcohol, for example, aldehyde-modified polyvinyl formaldehyde, polyvinyl acetaldehyde, or polyvinyl butyral, and the like.
此外,第2圖之偏光板100形成後,可將偏光板100裁切成至少一偏光片產品,並切除接合膠帶113。此偏光片產品可配置在一顯示裝 置中。換言之,接合膠帶113不會保留在此些偏光片產品上,可避免接合膠帶113影響偏光片產品的光學效果。如圖所示,二接合膠帶113相對配置,如此可在同一次裁切中切除二接合膠帶113,提升裁切效率。在另一實施例中,第一保護片110的接合膠帶113與第二保護片120的接合膠帶113可沿長度方向錯開,不限於一定要相對配置。 In addition, after the polarizing plate 100 of FIG. 2 is formed, the polarizing plate 100 can be cut into at least one polarizer product, and the bonding tape 113 can be cut off. This polarizer product can be configured in a display device Set in. In other words, the bonding tape 113 will not remain on these polarizer products, and the bonding tape 113 can be prevented from affecting the optical effect of the polarizer products. As shown in the figure, the two-adhesive tape 113 is disposed oppositely, so that the two-adhesive tape 113 can be cut in the same cutting, and the cutting efficiency is improved. In another embodiment, the bonding tape 113 of the first protective sheet 110 and the bonding tape 113 of the second protective sheet 120 may be staggered in the length direction, and are not limited to be oppositely disposed.
由於在壓合前接合層1132與第一基材側面1131b間隔第一距離S1(如第1B圖所示)且與第二基材側面1131c間隔第二距離S2(如第1B圖所示),因此在偏光層130、第一保護片110與第二保護片120壓合後,如第2圖所示,接合層1132的膠並未溢出超過第一基材側面1131b及第二基材側面1131c。如此,接合層1132的膠不會汙染壓合設備的滾輪,自然不會汙染後續傳輸於滾輪上的任何光學膜。 Since the bonding layer 1132 is separated from the first substrate side surface 1131b by a first distance S1 (as shown in FIG. 1B) and is separated from the second substrate side surface 1131c by a second distance S2 (as shown in FIG. 1B) before the lamination, Therefore, after the polarizing layer 130, the first protective sheet 110, and the second protective sheet 120 are laminated, as shown in FIG. 2, the adhesive of the bonding layer 1132 does not overflow beyond the first substrate side 1131b and the second substrate side 1131c. . In this way, the glue of the bonding layer 1132 will not contaminate the rollers of the laminating equipment, and naturally will not contaminate any optical film subsequently transmitted on the rollers.
在一實施例中,如第2圖所示,第一保護片110的接合膠帶113與第二保護片120的接合膠帶113係與偏光層130直接接觸,可更避免接合層1132的膠溢出而汙染壓合設備的滾輪及後續傳輸於滾輪上的任何光學膜。 In an embodiment, as shown in FIG. 2, the bonding tape 113 of the first protective sheet 110 and the bonding tape 113 of the second protective sheet 120 are in direct contact with the polarizing layer 130, which can further prevent the adhesive of the bonding layer 1132 from overflowing and Contaminates the rollers of the laminating equipment and any subsequent optical films transmitted on the rollers.
請參照第3圖,其繪示依照本發明另一實施例之第一保護片210的剖視圖。第一保護片210包括第一保護層111、第二保護層112、接合膠帶113及裁切膠帶214。裁切膠帶214黏貼在具有表面處理層215且經過裁切的保護層上,如第一保護層111。在一實施例中,裁切膠帶214的寬度可介於約1.5公分~約3公分,或約2公分~約2.5公分。 Please refer to FIG. 3, which is a cross-sectional view of a first protection sheet 210 according to another embodiment of the present invention. The first protective sheet 210 includes a first protective layer 111, a second protective layer 112, a bonding tape 113, and a cutting tape 214. The cutting tape 214 is affixed to a cut protective layer having a surface treatment layer 215, such as the first protective layer 111. In one embodiment, the width of the cutting tape 214 may be between about 1.5 cm and about 3 cm, or between about 2 cm and about 2.5 cm.
在一實施例中,表面處理層215例如是硬塗層、抗反射層、抗黏附層、擴散層或抗眩層等。一般而言,表面處理層215的水接觸角可介於約90度~約110度。 In one embodiment, the surface treatment layer 215 is, for example, a hard coating layer, an anti-reflection layer, an anti-adhesion layer, a diffusion layer, or an anti-glare layer. Generally, the water contact angle of the surface treatment layer 215 can be between about 90 degrees and about 110 degrees.
在此實施例中,第一保護層111具有表面處理層215,因此表面硬度高,使第一保護層111不易進行平整的裁切,而易產生鋸齒狀的裁切面。為避免裁切時產生的異物影響產線環境潔淨度、或污染壓合設備滾輪或傳輸滾輪,故預先黏貼裁切膠帶214後再進行第一保護層111之裁切,以避免上述缺點。 In this embodiment, the first protective layer 111 has a surface treatment layer 215, so the surface hardness is high, so that the first protective layer 111 is not easy to be cut flat, and it is easy to generate a sawtooth-shaped cutting surface. In order to avoid foreign objects generated during cutting from affecting the environmental cleanliness of the production line, or polluting the rollers or transfer rollers of the laminating equipment, the cutting tape 214 is affixed before cutting the first protective layer 111 to avoid the above disadvantages.
在一實施例中,第二保護層112雖然具有表面處理層215,但因未經過裁切,因此可不黏貼有裁切膠帶214,然本發明實施例不受此限。 In an embodiment, although the second protective layer 112 has a surface treatment layer 215, it is not cut, so the cutting tape 214 may not be affixed. However, the embodiment of the present invention is not limited thereto.
如第3圖所示,裁切膠帶214及表面處理層215可分別形成第一保護層111的二不同表面上。例如,第一保護層111具有相對之第一面111a與第二面111b,裁切膠帶214黏貼於第一面111a上,而表面處理層215位於第二面111b。 As shown in FIG. 3, the cutting tape 214 and the surface treatment layer 215 may be respectively formed on two different surfaces of the first protective layer 111. For example, the first protective layer 111 has a first surface 111a and a second surface 111b opposite to each other, a cutting tape 214 is stuck on the first surface 111a, and a surface treatment layer 215 is located on the second surface 111b.
第一保護層111具有第一保護層側面111s。裁切膠帶214包括基材2141及接合層2142,其中基材2141具有接合面2141a及相對之第一基材側面2141b與第二基材側面2141c,其中接合面2141a延伸於第一基材側面2141b與第二基材側面2141c之間,而接合層2142具有相對之第一接合層側面2142b與第二接合層側面2142c。第一接合層側面2142b與第一基材側面2141b共同定義裁切膠帶214的一膠帶側面。由於第一保護層側面111s、第一基材側面2141b與第一接合層側面 2142b是在同一裁切中形成,因此第一保護層側面111s、第一基材側面2141b與第一接合層側面2142b可大致切齊。此外,接合層2142的材料類似接合層1132,於此不再贅述。 The first protective layer 111 has a first protective layer side surface 111s. The cutting tape 214 includes a substrate 2141 and a bonding layer 2142, wherein the substrate 2141 has a bonding surface 2141a and opposite first substrate side 2141b and second substrate side 2141c, and the bonding surface 2141a extends on the first substrate side 2141b And the second substrate side surface 2141c, and the bonding layer 2142 has a first bonding layer side surface 2142b and a second bonding layer side surface 2142c opposite to each other. The first bonding layer side surface 2142b and the first substrate side surface 2141b together define a tape side surface of the cutting tape 214. Since the first protective layer side surface 111s, the first substrate side surface 2141b, and the first bonding layer side surface 2142b is formed in the same cut, so the first protective layer side surface 111s, the first substrate side surface 2141b, and the first bonding layer side surface 2142b can be roughly aligned. In addition, the material of the bonding layer 2142 is similar to that of the bonding layer 1132, and details are not described herein again.
如第3圖所示,裁切膠帶214的接合層2142可塗佈於整個接合面2141a,即接合層2142可延伸到第一基材側面2141b及第二基材側面2141c。在另一實施例中,接合層2142亦可與第一基材側面2141b及/或第二基材側面2141c彼此間隔。由於裁切膠帶214的接合層2142的第二接合層側面2142c與基材1131的第二基材側面1131c間隔一第三距離S4,因此即使接合層2142延伸到第二基材側面2141c,在後續壓合製程中接合層2142的膠不致溢出超過基材1131的第二基材側面1131c,而是被保持在第二基材側面2141c與第二基材側面1131c之間的容膠空間SP1內。如此,接合層2142不會汙染到壓合設備。 As shown in FIG. 3, the bonding layer 2142 of the cutting tape 214 can be applied to the entire bonding surface 2141a, that is, the bonding layer 2142 can extend to the first substrate side 2141b and the second substrate side 2141c. In another embodiment, the bonding layer 2142 may be spaced apart from the first substrate side surface 2141b and / or the second substrate side surface 2141c. Since the second bonding layer side 2142c of the bonding layer 2142 of the cutting tape 214 is spaced a third distance S4 from the second substrate side 1131c of the substrate 1131, even if the bonding layer 2142 extends to the second substrate side 2141c, During the lamination process, the adhesive of the bonding layer 2142 does not overflow beyond the second substrate side surface 1131c of the substrate 1131, but is kept in the adhesive space SP1 between the second substrate side surface 2141c and the second substrate side surface 1131c. As such, the bonding layer 2142 does not contaminate the crimping equipment.
如第3圖所示,由於接合膠帶113突出超過接合層2142的第一接合層側面2142b而黏貼在第二保護層112上,使接合膠帶113、第二保護層112與基材2141之間形成一容膠空間SP2。如此,即使接合層2142延伸到第一基材側面2141b,在後續壓合製程中接合層2142的膠會被保持在容膠空間SP2內,而不會汙染到壓合設備。 As shown in FIG. 3, since the bonding tape 113 protrudes beyond the first bonding layer side 2142 b of the bonding layer 2142 and is adhered to the second protective layer 112, the bonding tape 113, the second protective layer 112, and the substrate 2141 are formed. One plastic space SP2. In this way, even if the bonding layer 2142 extends to the side surface 2141b of the first substrate, the glue of the bonding layer 2142 will be kept in the glue-containing space SP2 in the subsequent pressing process without contaminating the pressing equipment.
請參照第4A~4D圖,其繪示第3圖之第一保護片210的製造過程圖。 Please refer to FIGS. 4A to 4D, which illustrate manufacturing processes of the first protective sheet 210 of FIG. 3.
如第4A圖所示,提供第一保護層111’。第一保護層111’具有相對之第一面111a與第二面111b,裁切膠帶214黏貼在第一面111a,而表面處理層215形成於第二面111b。裁切膠帶214包括基材 2141及接合層2142,裁切膠帶214透過接合層2142黏貼於第一保護層111’上。 As shown in FIG. 4A, a first protective layer 111 'is provided. The first protective layer 111 'has a first surface 111a and a second surface 111b opposite to each other, a cutting tape 214 is stuck on the first surface 111a, and a surface treatment layer 215 is formed on the second surface 111b. Cutting tape 214 includes a substrate 2141 and the bonding layer 2142, the cutting tape 214 is adhered to the first protective layer 111 'through the bonding layer 2142.
如第4B圖所示,在一裁切製程中,形成一裁切道P1切斷第一保護層111’與裁切膠帶214,以形成第一保護層111。裁切後,第一保護層111、基材2141及接合層2142並分別形成切齊之第一保護層側面111s、第一基材側面2141b與第一接合層側面2142b。在一實施例中,裁切方向可以是從第一保護層111’往裁切膠帶214的方向,或從裁切膠帶214往第一保護層111’的方向,或沿垂直紙面的方向。由於裁切膠帶214預黏貼於裁切前的第一保護層111’上,使在裁切出第一保護層111過程中,可減少裁切到表面處理層215所產生的切屑。此外,裁切膠帶214有沾黏切屑的效果,可減少切屑自第一保護層111脫離的數量。此外,裁切道P1例如是採用沖壓器、裁切直刀、圓刀、雷射或剪刀形成。 As shown in FIG. 4B, in a cutting process, a cutting path P1 is formed to cut off the first protective layer 111 'and the cutting tape 214 to form the first protective layer 111. After cutting, the first protective layer 111, the substrate 2141, and the bonding layer 2142 are respectively formed into a first protective layer side surface 111s, a first substrate side surface 2141b, and a first bonding layer side surface 2142b. In an embodiment, the cutting direction may be a direction from the first protective layer 111 'to the cutting tape 214, a direction from the cutting tape 214 to the first protective layer 111', or a direction perpendicular to the paper surface. Since the cutting tape 214 is pre-adhered to the first protective layer 111 'before cutting, during the process of cutting out the first protective layer 111, cutting chips generated by cutting to the surface treatment layer 215 can be reduced. In addition, the cutting tape 214 has the effect of sticking chips, which can reduce the number of chips detached from the first protective layer 111. The cutting path P1 is formed by using a punch, a cutting straight blade, a round blade, a laser, or scissors, for example.
如第4C圖所示,提供第二保護層112。第一保護層111與第二保護層112以邊對邊的方式並排。例如,與第一保護層111的第一保護層側面111s與第二保護層112的第二保護層側面112s相接,然亦可彼此間隔。第二保護層112可以是裁切後的保護層,或未裁切的保護層。若第二保護層112是經過裁切的保護層,另一裁切膠帶214可預黏貼在第二保護層112上,此類似第4B圖的結構,於此不再贅述。 As shown in FIG. 4C, a second protective layer 112 is provided. The first protective layer 111 and the second protective layer 112 are arranged side by side. For example, the first protective layer side 111s of the first protective layer 111 and the second protective layer side 112s of the second protective layer 112 are in contact with each other, but they may be spaced apart from each other. The second protective layer 112 may be a cut protective layer or an uncut protective layer. If the second protective layer 112 is a cut protective layer, another cutting tape 214 may be pre-adhered to the second protective layer 112, which is similar to the structure shown in FIG. 4B and will not be repeated here.
如第4D圖所示,以接合膠帶113接合並排的第一保護層111與第二保護層112,接合膠帶113覆蓋整個裁切膠帶214。如此,即使接合層2142塗佈於基材2141的整個接合面2141a,在後續偏光板的 壓合製程中接合層2142的膠溢出超過基材2141的第一基材側面2141b與第二基材側面2141c,在受到接合膠帶113的覆蓋下而不致汙染到壓合設備。如圖所示,在接合膠帶113形成後,接合膠帶113的第二基材側面1131c與裁切膠帶214的第二接合層側面2142c間隔第三距離S4,使接合層2142的溢膠可被保持在此第三距離S4的空間SP1內,而不致汙染到壓合設備。此外,在接合膠帶113形成後,接合膠帶113突出超過接合層2142的第一接合層側面2142b而黏貼在第二保護層112上,使接合膠帶113、第二保護層112與基材2141之間形成容膠空間SP2,進而使接合層2142的溢膠被保持在容膠空間SP2內,而不會汙染到壓合設備。 As shown in FIG. 4D, the first protective layer 111 and the second protective layer 112 are bonded side by side with a bonding tape 113, and the bonding tape 113 covers the entire cutting tape 214. In this way, even if the bonding layer 2142 is coated on the entire bonding surface 2141a of the substrate 2141, During the pressing process, the adhesive of the bonding layer 2142 overflows the first substrate side 2141b and the second substrate side 2141c of the substrate 2141, and is covered by the bonding tape 113 without contaminating the bonding equipment. As shown in the figure, after the bonding tape 113 is formed, the second substrate side surface 1131c of the bonding tape 113 and the second bonding layer side 2142c of the cutting tape 214 are separated by a third distance S4, so that the overflow of the bonding layer 2142 can be maintained. In the space SP1 of the third distance S4, the pressing equipment is not polluted. In addition, after the bonding tape 113 is formed, the bonding tape 113 protrudes beyond the first bonding layer side 2142b of the bonding layer 2142 and is stuck on the second protective layer 112, so that the bonding tape 113, the second protective layer 112, and the substrate 2141 are adhered to each other. The adhesive-containing space SP2 is formed, so that the overflowing glue of the bonding layer 2142 is kept in the adhesive-containing space SP2 without contaminating the pressing equipment.
請參照第5圖,其繪示依照本發明另一實施例之偏光板200的俯視圖。偏光板200包括第一保護片210、第二保護片220及偏光層130。偏光層130位於第一保護片210與第二保護片220之間,以受到第一保護片210與第二保護片220的保護。本實施例的偏光板200例如是裁切成至少一偏光片產品前的偏光板材,其具有一定連續長度,能被捲繞在一捲料輪,且可連續傳輸於壓合設備中。 Please refer to FIG. 5, which illustrates a top view of a polarizing plate 200 according to another embodiment of the present invention. The polarizing plate 200 includes a first protective sheet 210, a second protective sheet 220, and a polarizing layer 130. The polarizing layer 130 is located between the first protection sheet 210 and the second protection sheet 220 to be protected by the first protection sheet 210 and the second protection sheet 220. The polarizing plate 200 in this embodiment is, for example, a polarizing plate before being cut into at least one polarizer product, which has a certain continuous length, can be wound on a reel, and can be continuously transmitted in a laminating device.
如第5圖所示,裁切膠帶214黏貼在具有表面處理層215的保護片上,如第一保護片210。此外,第二保護片220具有相同於或類似於第一保護片210的結構,差異在於第二保護片220的保護層不具有表面處理層215,因此,第二保護片220可不包含裁切膠帶214。在另一實施例中,若第二保護片220的保護層(第一保護層111及/或第二保護層112)具有表面處理層215,第二保護片220可更包括另一裁切膠帶214。在其它實施例中,即使 第二保護片220的保護層不具有表面處理層215,第二保護片220亦可選擇性包括另一裁切膠帶214。此外,第二保護片220也可由前述第一保護片110取代。 As shown in FIG. 5, the cutting tape 214 is adhered to a protective sheet having a surface treatment layer 215, such as the first protective sheet 210. In addition, the second protective sheet 220 has a structure that is the same as or similar to the first protective sheet 210. The difference is that the protective layer of the second protective sheet 220 does not have a surface treatment layer 215. Therefore, the second protective sheet 220 may not include a cutting tape. 214. In another embodiment, if the protective layer (the first protective layer 111 and / or the second protective layer 112) of the second protective sheet 220 has a surface treatment layer 215, the second protective sheet 220 may further include another cutting tape. 214. In other embodiments, even The protective layer of the second protective sheet 220 does not have a surface treatment layer 215, and the second protective sheet 220 may optionally include another cutting tape 214. In addition, the second protective sheet 220 may be replaced by the aforementioned first protective sheet 110.
此外,第5圖之偏光板200形成後,可將偏光板200裁切成至少一偏光片產品,並切除接合膠帶113及裁切膠帶214。換言之,接合膠帶113及裁切膠帶214不會保留在此些偏光片產品上,可避免接合膠帶113及裁切膠帶214影響偏光片產品的光學效果。 In addition, after the polarizing plate 200 of FIG. 5 is formed, the polarizing plate 200 can be cut into at least one polarizer product, and the bonding tape 113 and the cutting tape 214 can be cut out. In other words, the bonding tape 113 and the cutting tape 214 will not remain on these polarizer products, which can prevent the bonding tape 113 and the cutting tape 214 from affecting the optical effect of the polarizer products.
請參照第6~9圖所示,其繪示依照本發明其它數個實施例的保護片的示意圖。第6~9圖的保護片的結構類似前述保護片,差異處在於裁切道的幾何形狀。 Please refer to FIG. 6 to FIG. 9, which are schematic diagrams of protection sheets according to other embodiments of the present invention. The structure of the protective sheet in Figs. 6 to 9 is similar to that of the aforementioned protective sheet, with the difference in the geometry of the cutting path.
如第6圖所示,保護片310包括裁切膠帶214、接合膠帶113及對接的第一保護層111與第二保護層112,其中裁切膠帶214黏貼在第一保護層111上,而接合膠帶113貼合在裁切膠帶214及第二保護層112,以接合第一保護層111與第二保護層112。相較於第4B圖直切式的裁切道P1,第6圖的裁切道P1為斜切式。第7圖的保護片410類似第6圖的保護片310,不同處在於保護片410包括二分段斜切的裁切道P1,二分段裁切道P1之間的夾角A1可為銳角或鈍角。第8圖的保護片510類似第7圖的保護片310,不同處在於保護片510的裁切道為數量更多的分段裁切道。例如,保護片510包括五個裁切道P11~P15,其中裁切道P11、P13與P15沿同一方向延伸,裁切道P12及P14沿另一不同方向延伸,其中裁切道P12連接裁切道P11與P13,而裁切道P14連接裁 切道P13與P15。第9圖的保護片610類似第6圖的保護片310,不同處在於保護片610的裁切道P1為曲線形。 As shown in FIG. 6, the protective sheet 310 includes a cutting tape 214, a bonding tape 113, and a first protective layer 111 and a second protective layer 112 that are connected to each other. The cutting tape 214 is adhered to the first protective layer 111 and is bonded. The adhesive tape 113 is attached to the cutting adhesive tape 214 and the second protective layer 112 to bond the first protective layer 111 and the second protective layer 112. Compared to the straight-cut cutting path P1 in FIG. 4B, the cutting path P1 in FIG. 6 is a bevel-cut type. The protective sheet 410 in FIG. 7 is similar to the protective sheet 310 in FIG. 6, except that the protective sheet 410 includes a two-section oblique cutting path P1. The angle A1 between the two-section cutting path P1 may be an acute angle or Obtuse angle. The protective sheet 510 of FIG. 8 is similar to the protective sheet 310 of FIG. 7, except that the cutting path of the protective sheet 510 is a larger number of segmented cutting paths. For example, the protective film 510 includes five cutting lanes P11 to P15, where the cutting lanes P11, P13, and P15 extend in the same direction, and the cutting lanes P12 and P14 extend in different directions, wherein the cutting lane P12 connects the cutting Road P11 and P13, and the cut road P14 connects the cut Cut through P13 and P15. The protective sheet 610 in FIG. 9 is similar to the protective sheet 310 in FIG. 6, except that the cutting path P1 of the protective sheet 610 is curved.
如第6~9圖可知,裁切道的數量及幾何型態可決定保護層側面的幾何形狀。例如,當裁切道為直線形時,裁切出的保護層側面為平面;當裁切道為曲線形時,裁切出的保護層側面為曲面;當裁切道為多段相接線形時,裁切出的保護層側面為多段相接面。本發明不限制裁切道的幾何形態,其可沿一直線、一曲線或其組合延伸。 As can be seen in Figures 6-9, the number and geometry of the cutting paths can determine the geometry of the side of the protective layer. For example, when the cutting path is straight, the side of the protective layer that is cut is flat; when the cutting path is curved, the side of the protective layer that is cut is curved; when the cutting path is a multi-phase phase line , The side of the protective layer cut out is a multi-section abutting surface. The present invention does not limit the geometry of the cutting path, which may extend along a straight line, a curve, or a combination thereof.
此外,如第6~9圖所示,裁切後的第一保護層111、基材2141及接合層2142並分別形成第一保護層側面111s、第一基材側面2141b與第一接合層側面2142b。由於第一保護層側面111s、第一基材側面2141b與第一接合層側面2142b是在同一裁切中形成,因此此些側面彼此對齊。 In addition, as shown in FIGS. 6 to 9, the first protective layer 111, the base material 2141, and the bonding layer 2142 are cut to form the first protective layer side surface 111s, the first base material side surface 2141 b, and the first bonding layer side surface, respectively. 2142b. Since the first protective layer side surface 111s, the first substrate side surface 2141b, and the first bonding layer side surface 2142b are formed in the same cut, these side surfaces are aligned with each other.
綜上,本發明實施例的保護片包括二保護層及接合膠帶,其中二保護層以接合膠帶接合成一延長保護層結構,以增加壓合製程的連續性(若保護片的長度不足,製程需要常停機以更換上新保護片)。在一實施例中,接合膠帶包括基材及接合層。由於接合層與基材的基材側面彼此間隔,因此在壓合製程中,接合層的膠不致突出超過基材側面而汙染到壓合設備。在另一實施例中,保護片包括二保護層、裁切膠帶及接合膠帶。裁切膠帶預黏貼在具有表面處理層且需要經過裁切的保護層上,可減少在裁切出該保護層時所產生的切屑。接合膠帶黏貼在裁切膠帶及另一保護層上,以接合二保護層。在一實施例中,由於接合膠帶覆蓋整個裁切膠帶,因此可避免裁切膠帶的膠汙染到壓 合設備。此外,本發明實施例的偏光板及保護片例如是裁切成至少一偏光片產品前的捲材,其具有一定連續長度,能被捲繞在一捲料輪,且可連續傳輸於壓合設備中。 In summary, the protective sheet according to the embodiment of the present invention includes two protective layers and a bonding tape, wherein the two protective layers are joined by an adhesive tape to form an extended protective layer structure to increase the continuity of the lamination process (if the length of the protective sheet is insufficient, the manufacturing process Need to stop frequently to replace with new protection sheet). In one embodiment, the bonding tape includes a substrate and a bonding layer. Since the bonding layer and the substrate side of the substrate are spaced apart from each other, during the pressing process, the glue of the bonding layer does not protrude beyond the side of the substrate and contaminates the pressing equipment. In another embodiment, the protective sheet includes two protective layers, a cutting tape and a bonding tape. The cutting tape is pre-adhered on the protective layer having a surface treatment layer and needs to be cut, so as to reduce chipping generated when the protective layer is cut out. The adhesive tape is stuck on the cutting tape and another protective layer to join the two protective layers. In one embodiment, since the bonding tape covers the entire cutting tape, the adhesive of the cutting tape can be prevented from being contaminated to the press. 合 设备。 Equipment. In addition, the polarizing plate and the protective sheet according to the embodiment of the present invention are, for example, a roll material before being cut into at least one polarizer product. Device.
綜上所述,雖然本發明已以實施例揭露如上,然其並非用以限定本發明。本發明所屬技術領域中具有通常知識者,在不脫離本發明之精神和範圍內,當可作各種之更動與潤飾。因此,本發明之保護範圍當視後附之申請專利範圍所界定者為準。 In summary, although the present invention has been disclosed as above with the embodiments, it is not intended to limit the present invention. Those with ordinary knowledge in the technical field to which the present invention pertains can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be determined by the scope of the attached patent application.
Claims (10)
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TW106120442A TWI676554B (en) | 2017-06-19 | 2017-06-19 | Bonding tape, protective piece using the same and polarizing plate using the same |
CN201710541604.0A CN107189707B (en) | 2017-06-19 | 2017-07-05 | Adhesive tape, protective sheet using the same, and polarizing plate |
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TW106120442A TWI676554B (en) | 2017-06-19 | 2017-06-19 | Bonding tape, protective piece using the same and polarizing plate using the same |
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TWI676554B true TWI676554B (en) | 2019-11-11 |
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JP2002207286A (en) * | 2001-01-09 | 2002-07-26 | Mitsui Mining & Smelting Co Ltd | Method for aligning films joining device and gage member for the same as well as film joining device |
TW200923043A (en) * | 2007-11-23 | 2009-06-01 | David Kuo | Using-zero tape |
TW201625995A (en) * | 2014-10-24 | 2016-07-16 | 住友化學股份有限公司 | Polarizing plate roll |
TW201641967A (en) * | 2015-05-28 | 2016-12-01 | 三星Sdi股份有限公司 | Polarizing plate and display device including the same |
CN206311785U (en) * | 2016-12-15 | 2017-07-07 | 昆山之奇美材料科技有限公司 | Polarizing plate protective film gas line improves structure |
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CN2438718Y (en) * | 2000-08-31 | 2001-07-11 | 九和胶带(上海)有限公司 | Double-side double-edge seal adhesive tape |
JP2007084722A (en) * | 2005-09-22 | 2007-04-05 | Nitto Denko Corp | Pressure-sensitive adhesive sheet, production method thereof and method of processing article |
JP4853877B2 (en) * | 2007-11-19 | 2012-01-11 | 日東電工株式会社 | MANUFACTURING METHOD FOR CONNECTED SHEET PRODUCT, CONNECTING SHEET PRODUCT, AND METHOD FOR MANUFACTURING OPTICAL DISPLAY UNIT |
CN204779454U (en) * | 2015-06-26 | 2015-11-18 | 群亿光电(深圳)有限公司 | A OCA membrane for preventing overflow and glue |
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Publication number | Priority date | Publication date | Assignee | Title |
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JP2002207286A (en) * | 2001-01-09 | 2002-07-26 | Mitsui Mining & Smelting Co Ltd | Method for aligning films joining device and gage member for the same as well as film joining device |
TW200923043A (en) * | 2007-11-23 | 2009-06-01 | David Kuo | Using-zero tape |
TW201625995A (en) * | 2014-10-24 | 2016-07-16 | 住友化學股份有限公司 | Polarizing plate roll |
TW201641967A (en) * | 2015-05-28 | 2016-12-01 | 三星Sdi股份有限公司 | Polarizing plate and display device including the same |
CN206311785U (en) * | 2016-12-15 | 2017-07-07 | 昆山之奇美材料科技有限公司 | Polarizing plate protective film gas line improves structure |
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TW201904766A (en) | 2019-02-01 |
CN107189707A (en) | 2017-09-22 |
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