TWI676121B - Method of manufacturing an electrode film - Google Patents

Method of manufacturing an electrode film Download PDF

Info

Publication number
TWI676121B
TWI676121B TW107131399A TW107131399A TWI676121B TW I676121 B TWI676121 B TW I676121B TW 107131399 A TW107131399 A TW 107131399A TW 107131399 A TW107131399 A TW 107131399A TW I676121 B TWI676121 B TW I676121B
Authority
TW
Taiwan
Prior art keywords
electrostatic ring
area
electrode film
active
routing
Prior art date
Application number
TW107131399A
Other languages
Chinese (zh)
Other versions
TW202011163A (en
Inventor
陳彥華
Yen-Hua Chen
侯敦硯
Tun-Yen Hou
曾宜雯
I-Wen Tseng
張國書
Kuo-Shu Chang
Original Assignee
大陸商業成科技(成都)有限公司
Interface Technology (Chengdu) Co., Ltd.
大陸商業成光電(深圳)有限公司
Interface Optoelectronics (Shenzhen) Co., Ltd.
英特盛科技股份有限公司
General Interface Solution Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 大陸商業成科技(成都)有限公司, Interface Technology (Chengdu) Co., Ltd., 大陸商業成光電(深圳)有限公司, Interface Optoelectronics (Shenzhen) Co., Ltd., 英特盛科技股份有限公司, General Interface Solution Limited filed Critical 大陸商業成科技(成都)有限公司
Application granted granted Critical
Publication of TWI676121B publication Critical patent/TWI676121B/en
Publication of TW202011163A publication Critical patent/TW202011163A/en

Links

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Measurement And Recording Of Electrical Phenomena And Electrical Characteristics Of The Living Body (AREA)

Abstract

一種製造電極薄膜之方法,係包括提供第一導電基材;於該第一導電基材之第一主動區域中,包括第二主動區域和第二走線區域;形成具有相對之內側與外側的第二靜電環;以及移除位於該外側之部分該第一主動區域、第一走線區域和第一靜電環,並使該內側與該第二主動區域和第二走線區域電性隔絕。本發明復揭露一種主動區域、走線區域和靜電環為一體成形之電極薄膜之製造方法。A method for manufacturing an electrode film includes providing a first conductive substrate; a first active region of the first conductive substrate includes a second active region and a second routing region; and forming a substrate having opposite inner and outer sides. A second electrostatic ring; and removing a portion of the first active area, the first routing area, and the first electrostatic ring located on the outer side, and electrically isolating the inner side from the second active area and the second routing area. The invention further discloses a method for manufacturing an electrode film in which an active area, a routing area and an electrostatic ring are integrally formed.

Description

製造電極薄膜之方法Method for manufacturing electrode film

本發明係關於一種製造電極薄膜之方法,尤指一種以具有主動區域、走線區域和靜電環之電極薄膜作為基材,製造不同尺寸的電極薄膜的方法。The present invention relates to a method for manufacturing an electrode film, and more particularly to a method for manufacturing electrode films of different sizes using an electrode film having an active region, a routing region, and an electrostatic ring as a substrate.

觸控感測器的觸控面板包括依序相疊之信號傳輸電極(Transmit electrode,Tx電極)、光學膠(Optical Clear Adhhesive,OCA)和信號接受電極(Receive electrode,Rx電極)所構成,形成Tx電極和Rx電極之材料通常係為銦錫氧化物(Indium Tin Oxide,ITO)或金屬網格(metal mesh),其中,Tx電極和Rx電極通常包括具有主動區域(sensor channel)和提供該主動區域各種導電信號線連的走線區域。The touch panel of the touch sensor includes a signal transmitting electrode (Transmit electrode, Tx electrode), optical clear adhesive (OCA), and a signal receiving electrode (Rx electrode) which are sequentially stacked to form The materials of the Tx electrode and the Rx electrode are usually indium tin oxide (ITO) or metal mesh. Among them, the Tx electrode and the Rx electrode usually include a sensor channel and provide the active channel. Area A routing area where various conductive signal lines are connected.

為避免防止觸控感測器之觸控面板主動區域之靜電放電(Electrostatic Discharge, ESD)的損害,通常會於Tx電極和Rx電極上形成靜電環(guard ring)之走線,當發生ESD的時候,靜電可藉由靜電環引導到地線,藉此降低ESD對感測器的衝擊。為使此靜電環具有良好地ESD防範效果,此靜電環會延著Tx電極和Rx電極上的主動區域和走線區域,於TX、RX電極邊緣圍繞一圈並接地至地線。In order to prevent damage to Electrostatic Discharge (ESD) in the active area of the touch panel of the touch sensor, a guard ring trace is usually formed on the Tx electrode and the Rx electrode. When ESD occurs At this time, static electricity can be guided to the ground wire through the electrostatic ring, thereby reducing the impact of ESD on the sensor. In order to make the electrostatic ring have a good ESD prevention effect, the electrostatic ring will extend the active area and the routing area on the Tx electrode and the Rx electrode, surround the edge of the TX and RX electrodes and ground to the ground.

隨著電子裝置朝輕、薄、短、小發展,因應電子產品的觸控需求,觸控感測器的型態也不斷改變,多種不同尺寸的觸控面板油然而生。With the development of electronic devices that are light, thin, short, and small, in response to the touch needs of electronic products, the types of touch sensors are constantly changing, and a variety of different sizes of touch panels are emerging.

然而,因為ESD的設計考量,一般電極薄膜之尺寸大小確定後,無法隨意縮小電極薄膜的尺寸,就限制了電極薄膜尺寸向下共用的共通性。However, due to the design considerations of ESD, after the size of the general electrode film is determined, the size of the electrode film cannot be arbitrarily reduced, which limits the commonality of the downward sharing of the electrode film size.

為解決上述習知技術之問題,本發明揭露一種製造電極薄膜之方法,該方法係包括:提供第一導電基材,該第一導電基材係包括第一主動區域、位於該第一主動區域週邊包圍該第一主動區域的第一走線區域,該第一走線區域包含該第一主動區域所需的各種導電信號線,以及沿該第一主動區域和第一走線區域所設置之第一靜電環,於該第一主動區域中,包括第二主動區域和第二走線區域;沿著該第二主動區域和第二走線區域之側邊,形成具有相對之內側與外側的第二靜電環,且該第二靜電環係與部分該第一靜電環電性連接,其中,該第二靜電環與該第二主動區域和第二走線區域之間具有間隙,且電性隔絕,該內側係與該第二主動區域和第二走線區域相鄰之側;以及切割該第一導電基材,以移除位於該外側之部分該第一主動區域、第一走線區域和第一靜電環,並使該內側與該第二主動區域和第二走線區域電性隔絕。In order to solve the problems of the conventional technology, the present invention discloses a method for manufacturing an electrode film. The method includes: providing a first conductive substrate. The first conductive substrate includes a first active region and is located in the first active region. A first routing area that surrounds the first active area. The first routing area contains various conductive signal lines required by the first active area, and is disposed along the first active area and the first routing area. A first electrostatic ring includes a second active region and a second routing region in the first active region; along the sides of the second active region and the second routing region, a first and second electrostatic loops having opposite inner and outer sides are formed. A second electrostatic ring, and the second electrostatic ring is electrically connected to a part of the first electrostatic ring, wherein there is a gap between the second electrostatic ring and the second active area and the second routing area, and the electricity is electrically Isolated, the inner side is a side adjacent to the second active area and the second routing area; and cutting the first conductive substrate to remove a portion of the first active area and the first routing area located on the outer side And first Ring, and the inner isolation region and the second active region and a second electrical trace.

本發明亦提供另一種製造電極薄膜之方法,該方法係包括:提供一導電網狀材料,於該導電網狀材料定義並分離一第三靜電環,以得到被該第三靜電環所環繞之第三導電基材;圖案化該第三導電基材,以形成第三主動區域和第三走線區域,其中,該第三靜電環與該第三主動區域和第三走線區域之間具有間隙,且電性隔絕;以及,切割該導電網狀材料,以移除位於該外側之部分該第三主動區域以及該第三走線區域。The present invention also provides another method for manufacturing an electrode film. The method includes: providing a conductive mesh material; defining and separating a third electrostatic ring on the conductive mesh material to obtain a third electrostatic ring surrounded by the third electrostatic ring; A third conductive substrate; patterning the third conductive substrate to form a third active region and a third routing region, wherein the third electrostatic ring has a space between the third active region and the third routing region Gap, and is electrically isolated; and, cutting the conductive mesh material to remove a portion of the third active area and the third routing area located on the outer side.

由上可知,本發明之製造電極薄膜之方法中,係利用經圖案化之金屬網格或以增加線路的方式形成作為ESD防護之接地環,即,於具有較大尺寸之電極薄膜上形成新接地環,以將電極薄膜之尺寸縮小,進而達到可向下延伸其他尺寸共用的概念。本發明之方法得以在不改變相同製成下電極薄膜製程的形況下,製得具有不侷限於固定尺寸之電極薄膜,遂能使越大尺寸的電極薄膜具有更廣的向下延伸共用性。It can be known from the above that in the method for manufacturing an electrode film of the present invention, a patterned metal grid or a way to increase the wiring is used to form a ground ring as an ESD protection, that is, a new electrode film with a larger size is formed. The grounding ring reduces the size of the electrode film, thereby reaching the concept of extending down to other sizes. The method of the present invention can produce an electrode film having a size that is not limited to a fixed size without changing the same manufacturing process of the lower electrode film, so that a larger size electrode film can have a wider downward extension commonality. .

以下藉由特定的具體實施例說明本發明之實施方式,熟悉此技藝之人士可由本說明書所揭示之內容輕易地瞭解本發明之其他優點及功效。The following describes the implementation of the present invention through specific embodiments. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.

須知,本說明書所附圖式所繪示之結構、比例、大小等,均僅用以配合說明書所揭示之內容,以供熟悉此技藝之人士之瞭解與閱讀,並非用以限定本發明可實施之限定條件,故不具技術上之實質意義,任何結構之修飾、比例關係之改變或大小之調整,在不影響本發明所能產生之功效及所能達成之目的下,均應仍落在本發明所揭示之技術內容得能涵蓋之範圍內。同時,本說明書中所引用之如「一」、「上」等之用語,亦僅為便於敘述之明瞭,而非用以限定本發明可實施之範圍,其相對關係之改變或調整,在無實質變更技術內容下,當視為本發明可實施之範疇。It should be noted that the structures, proportions, sizes, etc. shown in the drawings in this specification are only used to match the content disclosed in the specification for the understanding and reading of those skilled in the art, and are not intended to limit the implementation of the present invention. The limited conditions are not technically significant. Any modification of the structure, change of the proportional relationship, or adjustment of the size should still fall within the scope of this invention without affecting the effects and goals that can be achieved by the present invention. The technical content disclosed by the invention can be covered. At the same time, the terms such as “一” and “上” used in this specification are for clarity only, and are not intended to limit the scope of the present invention. Substantially changing the technical content shall be regarded as the scope in which the present invention can be implemented.

本發明提供一種製造電極薄膜之方法,係直接於具有及/或不具有原接地環之尺寸較大的導電基材上,形成尺寸相對較小、且具有接地環之電極薄膜。The invention provides a method for manufacturing an electrode film, which is directly formed on an electrically conductive substrate having a large size with and / or without an original ground ring to form an electrode film with a relatively small size and a ground ring.

於一具體實施例中,該電極薄膜係為信號傳輸電極(Transmit electrode)或信號接受電極(Receive electrode),且係以經圖案化之信號傳輸電極或信號接受電極作為製作該電極薄膜之材料而完成者。In a specific embodiment, the electrode film is a signal transmitting electrode or a signal receiving electrode, and a patterned signal transmitting electrode or a signal receiving electrode is used as a material for making the electrode film. Completer.

第1A至1C’圖係為本發明製造電極薄膜之方法的第一實施例於不同階段的簡單示意圖。1A to 1C 'are schematic diagrams of the first embodiment of the method for manufacturing an electrode film according to the present invention at different stages.

於本實施例中,係以信號傳輸電極和信號接受電極為例,其中,第1A、1B和1C圖係以本發明所製造之電極薄膜為信號傳輸電極之示意圖,以及第1A’、1B’和1C’圖係以本發明所製造之電極薄膜為信號接受電極之示意圖。In this embodiment, the signal transmission electrode and the signal receiving electrode are taken as an example. Among them, FIGS. 1A, 1B, and 1C are schematic diagrams using the electrode film manufactured by the present invention as a signal transmission electrode, and 1A ′, 1B ′ And FIG. 1C ′ are schematic diagrams using the electrode film manufactured by the present invention as a signal receiving electrode.

如第1A和1A’圖所示,提供第一導電基材20,並於該第一導電基材20上定義出第二主動區域211和第二走線區域212。As shown in FIGS. 1A and 1A ′, a first conductive substrate 20 is provided, and a second active region 211 and a second routing region 212 are defined on the first conductive substrate 20.

於本實施例中,係以該第一導電基材20係包括第一主動區域201、位於該第一主動區域201週邊包圍該第一主動區域201的第一走線區域202,該第一走線區域202包含該第一主動區域201所需的各種導電信號線,以及沿該第一主動區域201和第一走線區域202所設置之第一靜電環203。具體而言,係以2A-2A切割線所定義之範圍,作為電極薄膜之範圍,該電極薄膜包括第二主動區域(其係由部分該第一主動區域所構成)和第二走線區域(其係由部分該第一主走線區域所構成)。於本發明之一實施例中,該電極薄膜之範圍也就是2A-2A切割線所定義之範圍係依據電極薄膜所欲應用的面板大小,由人為或機器自動判斷所定義。In this embodiment, the first conductive substrate 20 includes a first active region 201 and a first routing region 202 surrounding the first active region 201 around the first active region 201. The line area 202 includes various conductive signal lines required by the first active area 201 and a first electrostatic ring 203 disposed along the first active area 201 and the first routing area 202. Specifically, the range defined by the 2A-2A cutting line is used as the range of the electrode film. The electrode film includes a second active region (which is composed of a part of the first active region) and a second routing region ( It consists of part of the first main routing area). In one embodiment of the present invention, the range of the electrode film, that is, the range defined by the 2A-2A cutting line, is defined by human or machine judgment based on the panel size to which the electrode film is to be applied.

於本發明之一實施例中,該第二走線區域係設置於該第二主動區域之周圍,用以提供該第二主動區域運作時所需的各種導電信號線。In one embodiment of the present invention, the second routing area is disposed around the second active area to provide various conductive signal lines required for the operation of the second active area.

於前述實施例中,該第一主動區係包括網狀金屬細線,該網狀金屬細線之材質係選自銀、銅、金、鋁、鎢、黃銅、鐵、錫以及白金之任意組合。In the foregoing embodiment, the first active region includes a mesh metal wire, and the material of the mesh metal wire is selected from any combination of silver, copper, gold, aluminum, tungsten, brass, iron, tin, and platinum.

於一實施例中,該第一導電基材20復包括定位件204,係設置於該第一主動區域201、第一走線區域202和第一靜電環203以外之位置上。In one embodiment, the first conductive substrate 20 further includes a positioning member 204 disposed at a position other than the first active region 201, the first routing region 202, and the first electrostatic ring 203.

如第1B和1B’圖所示,形成具有相對之內側213a與外側213b的第二靜電環213。於本實施例中,該第二靜電環213係沿著該第二主動區域211和第二走線區域212之側邊,且該第二靜電環213係與部分該第一靜電環203電性連接,其中,該第二靜電環213與該第二主動區域211和第二走線區域之間211具有間隙d1, d2,且該第二靜電環213與該第二主動區域211彼此電性隔絕,該內側213a係與該第二主動區域211和第二走線區域212相鄰之側。更具體地,該第二靜電環213與第二走線區域212之間具有一間隙d2,且該第二靜電環213係維持穩定地間距沿著該第二走線區域212設置,此時,該第二走線區域212係位於該第二主動區域211和該第二靜電環213之間。再者,於未設有該第二走線區域212之處,該第二靜電環213則與該第二主動區域211之間具有一間隙d1,且維持穩定地間距沿著該第二主動區域211設置。As shown in FIGS. 1B and 1B ', a second electrostatic ring 213 having an inner side 213a and an outer side 213b opposite to each other is formed. In this embodiment, the second electrostatic ring 213 is along the sides of the second active area 211 and the second routing area 212, and the second electrostatic ring 213 is electrically connected to part of the first electrostatic ring 203. Connected, wherein the second electrostatic ring 213 has gaps d1, d2 between the second active area 211 and the second routing area 211, and the second electrostatic ring 213 and the second active area 211 are electrically isolated from each other The inner side 213a is a side adjacent to the second active region 211 and the second routing region 212. More specifically, there is a gap d2 between the second electrostatic ring 213 and the second routing area 212, and the second electrostatic ring 213 is disposed along the second routing area 212 while maintaining a stable distance. At this time, The second routing area 212 is located between the second active area 211 and the second electrostatic ring 213. Furthermore, where the second routing area 212 is not provided, there is a gap d1 between the second electrostatic ring 213 and the second active area 211, and a stable distance is maintained along the second active area. 211 settings.

於本實施例中,無論是信號傳輸電極或信號接受電極,如第1B和1B’圖所示,該第二靜電環213與第二主動區域211之間具有間隙d1,與該第二走線區域212之間具有間隙d2。In this embodiment, whether it is a signal transmission electrode or a signal receiving electrode, as shown in FIGS. 1B and 1B ′, there is a gap d1 between the second electrostatic ring 213 and the second active region 211, and the second wiring There is a gap d2 between the regions 212.

如第1C和1C’圖所示,切割該第一導電基材20,以移除位於該外側之部分該第一主動區域2011、第一走線區域2021和第一靜電環2031,並使該第二靜電環213與該第二主動區域211和第二走線區域212電性隔絕。於前述實施例中,該第二靜電環213與保留下來,未被移除之部分該第一靜電環2032形成尺寸較該第一靜電環203小、適用於縮小尺寸後之電極薄膜。As shown in FIGS. 1C and 1C ′, the first conductive substrate 20 is cut to remove portions of the first active region 2011, the first routing region 2021, and the first electrostatic ring 2031 located on the outer side, and make the The second electrostatic ring 213 is electrically isolated from the second active region 211 and the second wiring region 212. In the foregoing embodiment, the second electrostatic ring 213 and the remaining, unremoved portion of the first electrostatic ring 2032 form an electrode film smaller in size than the first electrostatic ring 203 and suitable for reducing the size of the electrode film.

於本實施例中,移除該部分該第一主動區域2011、第一走線區域2021和第一靜電環2031之方法包括,但不限於雷射切割、蝕刻或熔燒。於較佳實施例中,該移除係以雷射切割進行。In this embodiment, a method of removing the part of the first active region 2011, the first routing region 2021, and the first electrostatic ring 2031 includes, but is not limited to, laser cutting, etching, or melting. In a preferred embodiment, the removal is performed by laser cutting.

此外,移除部分該第一主動區域、第一走線區域和第一靜電環,以及使該第二靜電環與該第二主動區域和第二走線區域電性隔絕之步驟係於同一切割製程中所完成。In addition, the steps of removing part of the first active area, the first routing area, and the first electrostatic ring, and electrically isolating the second electrostatic ring from the second active area and the second routing area are at the same cut. Completed in the process.

請同時參閱第2圖所示,係本發明之製造電極薄膜之方法的第一實施例之流程圖。本發明製造電極薄膜之方法的第一實施例中,步驟S10係提供第一導電基材,於該第一導電基材之第一主動區域中,包括第二主動區域和第二走線區域;步驟S11係形成具有相對之內側與外側的第二靜電環;以及步驟S12係移除位於該外側之部分該第一主動區域、第一走線區域和第一靜電環,並使該內側與該第二主動區域和第二走線區域電性隔絕。Please also refer to FIG. 2, which is a flowchart of the first embodiment of the method for manufacturing an electrode film of the present invention. In a first embodiment of the method for manufacturing an electrode film of the present invention, step S10 is to provide a first conductive substrate, and the first active region of the first conductive substrate includes a second active region and a second routing region; Step S11 is to form a second electrostatic ring having opposite inner and outer sides; and step S12 is to remove a portion of the first active area, a first routing area, and a first electrostatic ring located on the outer side, and make the inner side and the The second active area is electrically isolated from the second routing area.

於本實施例中,該導電基材係包括第一主動區域、位於該第一主動區域週邊包圍該第一主動區域的第一走線區域,該第一走線區域包含該第一主動區域所需的各種導電信號線,以及沿該第一主動區域和第一走線區域所設置之第一靜電環。In this embodiment, the conductive substrate includes a first active region and a first routing region surrounding the first active region and surrounding the first active region. The first routing region includes the first active region. Various conductive signal lines required, and a first electrostatic ring disposed along the first active area and the first routing area.

於本實施例中,該第二靜電環係沿著該第二主動區域和第二走線區域之側邊形成,且該第二靜電環係與部分該第一靜電環電性連接,其中,該第二靜電環與該第二主動區域和第二走線區域之間具有間隙,且電性隔絕,該內側係與該第二主動區域和第二走線區域相鄰之側。In this embodiment, the second electrostatic ring system is formed along the sides of the second active region and the second routing region, and the second electrostatic ring system is electrically connected to a part of the first electrostatic ring. The second electrostatic ring has a gap between the second active area and the second routing area, and is electrically isolated. The inner side is a side adjacent to the second active area and the second routing area.

於另一具體實施例中,該電極薄膜係為信號傳輸電極或信號接受電極,且係以未經圖案化之導電網狀材料作為製作該電極薄膜之材料而完成者。In another specific embodiment, the electrode film is a signal transmission electrode or a signal receiving electrode, and is completed by using an unpatterned conductive mesh material as a material for making the electrode film.

於本實施例中,形成該第二靜電環之步驟係包括:於該第一導電基材上,以導電漿料沿著該第二主動區域和第二走線區域之側邊形成第二靜電環;以及切割該第一導電基材上的網狀金屬細線,於該第二靜電環與該第二主動區域和第二走線區域之間形成斷路,並移除該第二靜電環之該外側之部分該第一主動區域、第一走線區域和第一靜電環。於前述實施例中,該導電漿料之材質係選自銀、銅、金、鋁、鎢、黃銅、鐵、錫以及白金之任意組合。In this embodiment, the step of forming the second electrostatic ring includes: forming a second static electricity on the first conductive substrate along the sides of the second active region and the second routing region with a conductive paste. Ring; and cutting the mesh-shaped fine metal wire on the first conductive substrate to form a disconnection between the second electrostatic ring and the second active region and the second routing region, and removing the second electrostatic ring The outer part of the first active area, the first routing area, and the first electrostatic ring. In the foregoing embodiment, the material of the conductive paste is selected from any combination of silver, copper, gold, aluminum, tungsten, brass, iron, tin, and platinum.

於本發明之製造電極薄膜之方法,具有定位件204之實施例中,於步驟S12「移除位於該外側之部分該第一主動區域、第一走線區域和第一靜電環製得電極薄膜」前,可進行二電極薄膜之貼合步驟。以第1C和1C’圖之信號傳輸電極和信號接受電極為例,係依據該定位件204將信號傳輸電極(如1C圖所示之電極薄膜)、光學膠和信號接受電極(如1C’圖所示之電極薄膜)貼合,而後進行步驟S12,以移除位於該外側之部分該第一主動區域、第一走線區域和第一靜電環製得電極薄膜,得到縮小尺寸之觸控面板。In the method for manufacturing an electrode film of the present invention, in the embodiment having the positioning member 204, in step S12, "remove a portion of the first active region, a first wiring region, and a first electrostatic ring located on the outer side to obtain an electrode film. "Before, the two-electrode film bonding step can be performed. Taking the signal transmitting electrode and the signal receiving electrode in Figs. 1C and 1C 'as an example, the signal transmitting electrode (such as the electrode film shown in Fig. 1C), the optical glue, and the signal receiving electrode (such as in the 1C' diagram according to the positioning member 204 The electrode film shown in the figure is attached, and then step S12 is performed to remove the first active region, the first routing region, and the first electrostatic ring on the outer side to obtain an electrode film to obtain a reduced-size touch panel. .

第3圖係為本發明製造電極薄膜之方法的第二實施例的簡單示意圖,具體地,係以未經圖案化之導電網狀材料作為製作該電極薄膜之材料而完成之實施方式。於本實施例中,係以信號接受電極為例。FIG. 3 is a simple schematic diagram of a second embodiment of the method for manufacturing an electrode film according to the present invention. Specifically, it is an embodiment completed by using an unpatterned conductive mesh material as a material for making the electrode film. In this embodiment, the signal receiving electrode is taken as an example.

如第3圖所示,提供一導電網狀材料40,且該導電網狀材料40係包括相互分離之第三靜電環403,以及被該第三靜電環所環繞之第三主動區域402。As shown in FIG. 3, a conductive mesh material 40 is provided, and the conductive mesh material 40 includes a third electrostatic ring 403 separated from each other, and a third active region 402 surrounded by the third electrostatic ring.

於本實施例中,係依據所需面板大小,定義出第三靜電環403之尺寸,分離出該第三靜電環403,以及被該第三靜電環403所環繞之第三導電基材,且該第三靜電環和第三導電基材為電性隔絕,切割該導電網狀材料40,以移除位於該外側之部分該第三主動區域402以及該第三走線區域(移除部分為圖中所示斜線區域)。具體而言,該電極薄膜包括第三主動區域402(其係由部分該導電網狀材料40所構成)和第三走線區域(其係由部分該導電網狀材料40所構成)。於本發明之一實施例中,該電極薄膜之範圍係依據電極薄膜所欲應用的面板大小,由人為或機器自動判斷所定義。In this embodiment, the size of the third electrostatic ring 403 is defined according to the required panel size, the third electrostatic ring 403 and the third conductive substrate surrounded by the third electrostatic ring 403 are separated, and The third electrostatic ring and the third conductive substrate are electrically isolated, and the conductive mesh material 40 is cut to remove a portion of the third active area 402 and the third routing area (the removed portion is Diagonally shaded area). Specifically, the electrode film includes a third active region 402 (which is formed by a portion of the conductive mesh material 40) and a third routing region (which is formed by a portion of the conductive mesh material 40). In one embodiment of the present invention, the range of the electrode film is defined by human or machine judgment based on the panel size to which the electrode film is to be applied.

於前述實施例中,分離該第三靜電環和第三主動區域之手段係包括,但不限於雷射切割、蝕刻或熔燒。於較佳實施例中,分離該第三靜電環和第三導電基材係以雷射切割斷開其電性連接,使之電性隔絕。In the foregoing embodiment, the means for separating the third electrostatic ring and the third active region includes, but is not limited to, laser cutting, etching, or melting. In a preferred embodiment, the third electrostatic ring and the third conductive substrate are separated by laser cutting to disconnect the electrical connection, so that they are electrically isolated.

具體地,於本實施例中,係圖案化該導電網狀材料40,以形成第三主動區域402和第三靜電環403,且該第三靜電環403與該第三主動區域402之間具有間隙且電性隔絕。Specifically, in this embodiment, the conductive mesh material 40 is patterned to form a third active region 402 and a third electrostatic ring 403, and there is a gap between the third electrostatic ring 403 and the third active region 402. Clearance and electrical isolation.

於本實施例的一實施方式中,係以雷射切割方式形成該第三靜電環和第三主動區域。In an implementation manner of this embodiment, the third electrostatic ring and the third active region are formed by a laser cutting method.

於一具體實施例中,該第三靜電環為該第三主動區域地一部分。In a specific embodiment, the third electrostatic ring is a part of the third active region.

第4圖係本發明之製造電極薄膜之方法的第二實施例之流程圖。本發明製造電極薄膜之方法的第二實施例中,步驟S30係提供一導電網狀材料,係於該導電網狀材料定義並分離一第三靜電環,以得到被該第三靜電環所環繞之第三導電基材;步驟S31圖案化該第三導電基材,以形成第三主動區域和第三走線區域,其中,該第三靜電環與該第三主動區域和第三走線區域之間具有間隙,且電性隔絕;以及步驟S32切割該導電網狀材料,以移除位於該外側之部分該第三主動區域以及該第三走線區域。FIG. 4 is a flowchart of a second embodiment of the method for manufacturing an electrode film of the present invention. In a second embodiment of the method for manufacturing an electrode film according to the present invention, step S30 is to provide a conductive mesh material. The conductive mesh material defines and separates a third electrostatic ring to obtain the third electrostatic ring. A third conductive substrate; step S31 patterning the third conductive substrate to form a third active region and a third routing region, wherein the third electrostatic ring and the third active region and the third routing region There is a gap between them and they are electrically isolated; and step S32 cuts the conductive mesh material to remove a portion of the third active area and the third routing area located on the outer side.

於本實施例中,該第三靜電環、第三主動區域和第三走線區域係為一體成形者。於前述實施例中,該第三靜電環、第三主動區域和第三走線區域係為網狀金屬細線。In this embodiment, the third electrostatic ring, the third active area, and the third routing area are integrally formed. In the foregoing embodiment, the third electrostatic ring, the third active region, and the third routing region are thin metal wires.

於本實施例中,該導電網狀材料之材質係選自銀、銅、金、鋁、鎢、黃銅、鐵、錫以及白金之任意組合。In this embodiment, the material of the conductive mesh material is selected from any combination of silver, copper, gold, aluminum, tungsten, brass, iron, tin, and platinum.

綜上所述,本發明之製造電極薄膜的方法,係直接於具有及/或不具有原接地環之尺寸較大的導電基材上,形成尺寸相對較小、且具有接地環之電極薄膜,且利用經圖案化之金屬寸的電極薄膜具有更廣的向下延伸共用性。網格或以增加線路的方式形成作為ESD防護之接地環,即,於具有較大尺寸之電極薄膜上形成新接地環,以將電極薄膜之尺寸縮小,進而達到可向下延伸其他尺寸共用的概念。在不改變相同製成下電極薄膜製程的形況下,製得具有不侷限於固定尺寸之電極薄膜。In summary, the method for manufacturing an electrode film of the present invention is to directly form an electrode film with a relatively small size and a grounding ring on a conductive substrate having a larger size with and / or without an original grounding ring. Moreover, the electrode film using the patterned metal inch has a wider commonality of downward extension. The grid may be used to form a grounding ring as an ESD protection by adding lines, that is, a new grounding ring is formed on an electrode film with a larger size to reduce the size of the electrode film, thereby reaching a common extension of other sizes. concept. Without changing the shape of the same process for making the lower electrode film, an electrode film having a size that is not limited to a fixed size is produced.

上述二種的實施例設計下,只需開立一套公版尺寸的電極薄膜生產設備,即可向下延伸滿足各種尺寸電極薄膜的生產需求,可節省光罩開發費用及縮短樣品前期的開發時間。Under the design of the above two embodiments, only a set of public-size electrode film production equipment needs to be opened, which can be extended downwards to meet the production needs of electrode films of various sizes, which can save the development cost of photomasks and shorten the preliminary sample development time.

上述實施例係用以例示性說明本發明之原理及其功效,而非用於限制本發明。任何熟習此項技藝之人士均可在不違背本發明之精神及範疇下,對上述實施例進行修改。因此本發明之權利保護範圍,應如後述之申請專利範圍所列。The above embodiments are used to exemplify the principle of the present invention and its effects, but not to limit the present invention. Anyone skilled in the art can modify the above embodiments without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the rights of the present invention should be listed in the scope of patent application described later.

20‧‧‧第一導電基材20‧‧‧ the first conductive substrate

201‧‧‧第一主動區域201‧‧‧ the first active area

2011‧‧‧第一主動區域2011‧‧‧The first active area

202‧‧‧第一走線區域202‧‧‧First routing area

2021‧‧‧第一走線區域2021‧‧‧First routing area

203‧‧‧第一靜電環203‧‧‧The first electrostatic ring

2031‧‧‧第一靜電環2031‧‧‧The first electrostatic ring

2032‧‧‧第一靜電環2032‧‧‧The first electrostatic ring

204‧‧‧定位件204‧‧‧ Positioning piece

211‧‧‧第二主動區域211‧‧‧Second Active Area

212‧‧‧第二走線區域212‧‧‧Second routing area

213‧‧‧第二靜電環213‧‧‧Second electrostatic ring

213a‧‧‧內側213a‧‧‧ inside

213b‧‧‧外側213b‧‧‧outside

40‧‧‧導電網狀材料40‧‧‧ conductive mesh material

403‧‧‧第三靜電環403‧‧‧The third electrostatic ring

402‧‧‧第三主動區域402‧‧‧Third Active Area

d1, d1’, d2, d2’‧‧‧間隙d1, d1 ’, d2, d2’‧‧‧ clearance

S10, S11, S12, S30, S31, S32‧‧‧步驟S10, S11, S12, S30, S31, S32‧‧‧step

2A-2A‧‧‧切割線2A-2A‧‧‧cut line

第1A至1C’圖係為本發明製造電極薄膜之方法的第一實施例於不同階段的簡單示意圖; 第2圖係為本發明之製造電極薄膜之方法的第一實施例之流程圖; 第3圖係為本發明製造電極薄膜之方法的第二實施例的簡單示意圖;以及 第4圖係為本發明之製造電極薄膜之方法的第二實施例之流程圖。1A to 1C ′ are schematic diagrams of the first embodiment of the method for manufacturing an electrode film according to the present invention at different stages; FIG. 2 is a flowchart of the first embodiment of the method for manufacturing an electrode film according to the present invention; FIG. 3 is a simple schematic diagram of a second embodiment of the method of manufacturing an electrode film according to the present invention; and FIG. 4 is a flowchart of a second embodiment of the method of manufacturing an electrode film according to the present invention.

Claims (6)

一種製造電極薄膜之方法,該方法係包括:提供第一導電基材,該第一導電基材係包括第一主動區域、位於該第一主動區域週邊包圍該第一主動區域的第一走線區域,該第一走線區域包含該第一主動區域所需的各種導電信號線,以及沿該第一主動區域和第一走線區域所設置之第一靜電環,於該第一主動區域中,包括第二主動區域和第二走線區域;沿著該第二主動區域和第二走線區域之側邊,形成具有相對之內側與外側的第二靜電環,且該第二靜電環係與部分該第一靜電環電性連接,其中,該第二靜電環與該第二主動區域和第二走線區域之間具有間隙,且電性隔絕,該內側係與該第二主動區域和第二走線區域相鄰之側;以及切割該第一導電基材,以移除位於該外側之部分該第一主動區域、第一走線區域和第一靜電環,並使該內側與該第二主動區域和第二走線區域電性隔絕。A method for manufacturing an electrode film, the method comprises: providing a first conductive substrate, the first conductive substrate includes a first active region, and a first trace located around the first active region and surrounding the first active region; Area, the first routing area includes various conductive signal lines required by the first active area, and a first electrostatic ring disposed along the first active area and the first routing area, in the first active area Includes a second active area and a second routing area; along the sides of the second active area and the second routing area, a second electrostatic ring having opposite inner and outer sides is formed, and the second electrostatic ring system It is electrically connected to part of the first electrostatic ring, wherein the second electrostatic ring has a gap between the second active area and the second routing area and is electrically isolated. The inner side is connected to the second active area and Adjacent sides of the second routing area; and cutting the first conductive substrate to remove portions of the first active area, the first routing area, and the first electrostatic ring located on the outer side, so that the inner side and the Second active area and Two regions electrically isolated traces. 如申請專利範圍第1項所述之製造電極薄膜之方法,其中,該電極薄膜係為信號傳輸電極(Transmit electrode)或信號接受電極(Receive electrode)。The method for manufacturing an electrode film according to item 1 of the scope of patent application, wherein the electrode film is a signal transmitting electrode or a signal receiving electrode. 如申請專利範圍第1項所述之製造電極薄膜之方法,其中,形成該第二靜電環之步驟係包括:於該第一導電基材上,以導電漿料沿著該第二主動區域和第二走線區域之側邊形成第二靜電環;以及切割該第一導電基材,於該第二靜電環與該第二主動區域和第二走線區域之間形成斷路,並移除該第二靜電環之該外側之部分該第一主動區域、第一走線區域和第一靜電環。The method for manufacturing an electrode film according to item 1 of the scope of patent application, wherein the step of forming the second electrostatic ring includes: on the first conductive substrate, a conductive paste along the second active region and Forming a second electrostatic ring on the side of the second routing area; and cutting the first conductive substrate to form a disconnection between the second electrostatic ring and the second active area and the second routing area, and removing the The outer part of the second electrostatic ring is the first active area, the first routing area, and the first electrostatic ring. 如申請專利範圍第3項所述之製造電極薄膜之方法,其中,移除該第二靜電環之該外側之部分該第一主動區域、第一走線區域和第一靜電環方法包括雷射切割、蝕刻或熔燒。The method for manufacturing an electrode film according to item 3 of the scope of patent application, wherein the method of removing the outer part of the second electrostatic ring from the first active area, the first routing area, and the first electrostatic ring includes a laser Cut, etch or burn. 如申請專利範圍第1項所述之製造電極薄膜之方法,其中,該第一主動區係包括網狀金屬細線。The method for manufacturing an electrode film according to item 1 of the scope of patent application, wherein the first active region comprises a mesh-shaped metal thin wire. 如申請專利範圍第1項所述之製造電極薄膜之方法,其中,該第一導電基材復包括定位件,係設置於該第一主動區域、第一走線區域和第一靜電環以外之位置上。The method for manufacturing an electrode film according to item 1 of the scope of patent application, wherein the first conductive substrate further includes a positioning member, which is disposed outside the first active region, the first wiring region, and the first electrostatic ring. Location.
TW107131399A 2018-09-03 2018-09-07 Method of manufacturing an electrode film TWI676121B (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
??201811020271.8 2018-09-03
CN201811020271.8A CN109144323B (en) 2018-09-03 2018-09-03 Method for manufacturing electrode film
CN201811020271.8 2018-09-03

Publications (2)

Publication Number Publication Date
TWI676121B true TWI676121B (en) 2019-11-01
TW202011163A TW202011163A (en) 2020-03-16

Family

ID=64826374

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107131399A TWI676121B (en) 2018-09-03 2018-09-07 Method of manufacturing an electrode film

Country Status (2)

Country Link
CN (1) CN109144323B (en)
TW (1) TWI676121B (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI416384B (en) * 2009-10-06 2013-11-21 Wintek Corp Mother board of touch panel and touch panel
TWI496049B (en) * 2013-06-06 2015-08-11 Interface Optoelectronic Shenzhen Co Ltd Touch display module
TWI498783B (en) * 2013-07-10 2015-09-01 Htc Corp Touch panel
US20160179255A1 (en) * 2014-12-19 2016-06-23 Chunghwa Picture Tubes, Ltd. Touch display device and noise-shielding method for touch display device
TWI629624B (en) * 2017-08-25 2018-07-11 友達光電股份有限公司 Panel having electrostatic protection structure

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101995985A (en) * 2009-08-14 2011-03-30 义隆电子股份有限公司 Touch pad master sheet capable of improving electrostatic discharge in manufacturing process
CN102193667B (en) * 2010-03-12 2013-03-20 胜华科技股份有限公司 Mother board for touch panels
KR101797651B1 (en) * 2011-06-15 2017-11-15 미래나노텍(주) Wired electrode of touch screen panel and touch screen panel with the wired electrode
DE202013105363U1 (en) * 2013-11-25 2013-11-29 HengHao Technology Co. LTD. Touch-sensitive screen
US10228783B2 (en) * 2016-08-04 2019-03-12 Dell Products L.P. System and method for ESD protection in a touch screen display
CN107765923A (en) * 2017-11-07 2018-03-06 信利光电股份有限公司 A kind of preparation method of touch-screen
CN108319085B (en) * 2018-02-28 2020-02-18 武汉华星光电技术有限公司 Array substrate, display panel and preparation method thereof

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI416384B (en) * 2009-10-06 2013-11-21 Wintek Corp Mother board of touch panel and touch panel
TWI496049B (en) * 2013-06-06 2015-08-11 Interface Optoelectronic Shenzhen Co Ltd Touch display module
TWI498783B (en) * 2013-07-10 2015-09-01 Htc Corp Touch panel
US20160179255A1 (en) * 2014-12-19 2016-06-23 Chunghwa Picture Tubes, Ltd. Touch display device and noise-shielding method for touch display device
TWI629624B (en) * 2017-08-25 2018-07-11 友達光電股份有限公司 Panel having electrostatic protection structure

Also Published As

Publication number Publication date
CN109144323A (en) 2019-01-04
TW202011163A (en) 2020-03-16
CN109144323B (en) 2021-08-31

Similar Documents

Publication Publication Date Title
CN104656984B (en) Contact panel
TWI512568B (en) Touch panel and manufacturing method thereof
TWI490747B (en) Touch panel and manufacturing method thereof
WO2018036301A1 (en) Touch screen, display device, and method of manufacturing touch screen
TW201426474A (en) Touch panel
TW201327312A (en) Touch panel having electrostatic protecting structure
CN104900633B (en) A kind of manufacturing method of array base plate, array base palte and display device
WO2015096442A1 (en) Display panel and display device
TWI507940B (en) Touch panel and touch display panel
KR102326572B1 (en) Array substrate and manufacturing method thereof
CN104865764B (en) Wiring structure and array substrate
TWI676121B (en) Method of manufacturing an electrode film
JP6732965B2 (en) TFT liquid crystal display component and manufacturing method thereof
TWI491009B (en) Chip level emi shielding structure and manufacture method thereof
TWI416384B (en) Mother board of touch panel and touch panel
US20150121688A1 (en) Fabricating method of touch cover
TWM478870U (en) Touch panel
CN111090357B (en) Touch module, preparation method thereof and electronic equipment
CN102830831A (en) Production method of panel structures
TW201520845A (en) Touch panel
TWI692713B (en) Method for manufacturing capacitive touch panel and capacitive touch control panel
TWI478220B (en) Touch-sensing panel and manugacturing method thereof
CN111831167B (en) Manufacturing method of capacitive touch panel and capacitive touch panel
CN112533351B (en) Circuit board and manufacturing method thereof
TWM541054U (en) Frameless touch panel