TWI675720B - Operation method of vertical disc detecting grinding device - Google Patents

Operation method of vertical disc detecting grinding device Download PDF

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TWI675720B
TWI675720B TW107122492A TW107122492A TWI675720B TW I675720 B TWI675720 B TW I675720B TW 107122492 A TW107122492 A TW 107122492A TW 107122492 A TW107122492 A TW 107122492A TW I675720 B TWI675720 B TW I675720B
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micro
defective
drill
grinding
turned
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TW107122492A
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TW202000366A (en
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姚志金
古明篷
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欣竑科技有限公司
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  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)

Abstract

本發明提供一種直立式圓盤檢測研磨設備的操作方法,其包括:其包括:一本體,該本體係設有一入料位置、一影像檢測位置、一抗折檢測位置、一研磨位置、一出料位置及一不良位置;一入料頂針,係設於該入料位置;一影像檢測器,係設於該影像檢測位置;一抗折檢測器,係設於該抗折檢測位置;一研磨器,係設於該研磨位置;一出料頂針,係設於該出料位置;一不良頂針,係設於該不良位置;以及一直立式圓盤,該直立式圓盤係設於該本體上,且設有至少一收容槽,該收容槽可收容微鑽頭,藉由該直立式圓盤的轉動,該收容槽會依序經由該入料位置、該影像檢測位置、該抗折檢測位置、該研磨位置、該出料位置、該不良位置,最後再回到該入料位置。 The invention provides a method for operating an upright disc detection and grinding device, which includes: a body, the system is provided with a feeding position, an image detection position, a bending detection position, a grinding position, and an output Material position and a defective position; a feeding thimble is set at the feeding position; an image detector is set at the image detection position; a flexure detector is set at the flexion detection position; a grinding An ejector pin is set at the discharge position; a bad ejector pin is set at the bad position; and a straight disc is set at the body It is provided with at least one receiving slot, which can receive a micro drill. With the rotation of the upright disc, the receiving slot will sequentially pass through the feeding position, the image detection position, and the anti-bend detection position. , The grinding position, the discharging position, the defective position, and finally return to the feeding position.

Description

直立式圓盤檢測研磨設備的操作方法 Operation method of upright disc detection grinding equipment

本發明係為一種直立式圓盤檢測研磨設備,特別是針對一種微鑽頭的檢測與研磨裝置的操作方法。 The invention relates to an upright disc detection and grinding equipment, in particular to a method for operating a micro-drill detection and grinding device.

現有中華民國專利號M391431之「焊接機的檢測及研磨裝置」其包含有:一檢測裝置、一背光座、一旋轉夾臂、一抗折測試裝置與一研磨裝置;係由檢測裝置進行鑽頭之檢測作業,依據鑽頭遮住背光座之面積大小判別鑽頭之長度,並且由旋轉夾臂夾取鑽頭並移動至抗折測試裝置施以適當之推力於鑽頭,以測試鑽頭之抗折度,再由旋轉夾臂將鑽頭夾取並移動至研磨裝置進行鑽頭之研磨作業;然,該旋轉夾臂為水平旋轉,需要較大的作動空間,導致建築成本亦較高。 The existing "detection and grinding device for welding machine" of the Republic of China Patent No. M391431 includes: a detection device, a backlight base, a rotating clamp arm, a flex test device and a grinding device; In the inspection operation, the length of the drill bit is judged according to the area of the backlight block covered by the drill bit, and the drill bit is taken by the rotating clamp arm and moved to the anti-bend test device to apply an appropriate thrust to the bit to test the anti-bend degree of the bit. The rotary clamp arm clamps the drill bit and moves it to the grinding device to perform the grinding operation of the drill bit; however, the rotary clamp arm rotates horizontally and requires a large operating space, resulting in higher construction costs.

有鑑於此,本發明人乃潛心研思、設計組製,期能提供一種應用直立式圓盤檢測研磨設備及其操作方法,以解決前述的習知技術問題。 In view of this, the inventor has devoted himself to thinking and designing the system, and hopes to provide an upright disc detection and grinding device and an operation method thereof to solve the aforementioned conventional technical problems.

本發明之主要目的,在於提供一種直立式圓盤檢測研磨設備的操作方法,其包括:一本體,該本體係設有一入料位置、一影像檢測位置、一抗折檢測位置、一研磨位置、一出料位置及一不良位置;一入料頂針,係設於該入料位置;一影像檢測器,係設於該影像檢測位置;一抗折檢測器,係設於該抗折檢測位置;一研磨器,係設於該研磨位置;一出料頂針,係設於該出料位 置;一不良頂針,係設於該不良位置;以及一直立式圓盤,該直立式圓盤係設於該本體上,該直立式圓盤上設有至少一收容槽,該收容槽可收容微鑽頭,藉由該直立式圓盤的轉動,該收容槽會依序經由該入料位置、該影像檢測位置、該抗折檢測位置、該研磨位置、該出料位置、該不良位置,最後再回到該入料位置。 The main object of the present invention is to provide an operating method of an upright disc detection and grinding equipment, which includes: a body, the system is provided with a feeding position, an image detection position, a bending detection position, a grinding position, A discharging position and a defective position; a feeding ejector pin is set at the feeding position; an image detector is set at the image detection position; a flexure detector is set at the flexure detection position; A grinder is set at the grinding position; a ejector pin is set at the discharge level A bad thimble, which is set at the bad position; and a vertical disc, which is set on the body, and the vertical disc is provided with at least one receiving slot, which can be accommodated With the micro-drill, by the rotation of the upright disc, the receiving slot will sequentially pass through the feeding position, the image detection position, the anti-bend detection position, the grinding position, the discharging position, the defective position, and finally Return to the feed position again.

較佳地,當微鑽頭移至該入料位置後,該直立式圓盤會轉動將微鑽頭由該入料位置轉至該影像檢測位置。 Preferably, after the micro drill is moved to the feeding position, the upright disc is rotated to rotate the micro drill from the feeding position to the image detection position.

較佳地,該影像檢測器係為電荷耦合裝置(Charge Coupled Device,CCD)。 Preferably, the image detector is a charge coupled device (Charge Coupled Device, CCD).

較佳地,該出料位置設有一出料區,當微鑽頭通過影像檢測、抗折檢測且完成研磨後,抵達該出料位置時,該出料頂針會將微鑽頭推入該出料區。 Preferably, the discharge position is provided with a discharge area. When the micro drill reaches the discharge position after passing the image detection, anti-bend detection and grinding, the discharge thimble pushes the micro drill into the discharge area. .

較佳地,該不良位置設有一不良區,當該影像檢測器感測出不良微鑽頭,則不良微鑽頭轉至該出料位置時,該出料頂針不作動,不良微鑽頭會轉至該不良位置,藉由該不良頂針作動,不良微鑽頭會落入該不良區。 Preferably, a defective area is provided in the defective position. When the image detector detects a defective micro-drill, the defective micro-drill will not move when the defective micro-drill is turned to the discharging position, and the defective micro-drill will be transferred to the defective position. In the defective position, the defective micro-drill will fall into the defective area by the defective thimble.

較佳地,該抗折檢測裝置檢測出不良微鑽頭,則不良微鑽頭轉至該出料位置時,該出料頂針不作動,不良微鑽頭會轉至該不良位置,藉由該不良頂針作動,不良微鑽頭會落入該不良區。 Preferably, the anti-bending detection device detects a bad micro-drill, and when the bad micro-drill is turned to the discharging position, the ejection pin is not activated, and the bad micro-drill is turned to the defective position, and is actuated by the bad thimble , The bad micro drill will fall into the bad area.

為了能夠更進一步瞭解本發明之特徵、特點和技術內容,請參閱以下有關本發明之詳細說明與附圖,惟所附圖式僅提供參考與說明用,非用以限制本發明。 In order to further understand the features, characteristics, and technical contents of the present invention, please refer to the following detailed description and accompanying drawings of the present invention, but the drawings are provided for reference and description only, and are not intended to limit the present invention.

1‧‧‧本體 1‧‧‧ Ontology

11‧‧‧入料位置 11‧‧‧ Feeding position

12‧‧‧影像檢測位置 12‧‧‧Image detection position

120‧‧‧影像檢測器 120‧‧‧Image Detector

121‧‧‧轉輪 121‧‧‧ runner

13‧‧‧抗折檢測位置 13‧‧‧ Anti-bend detection position

130‧‧‧抗折檢測器 130‧‧‧Anti-bend detector

14‧‧‧研磨位置 14‧‧‧ Grinding position

140‧‧‧研磨器 140‧‧‧ Grinder

15‧‧‧出料位置 15‧‧‧Discharging position

150‧‧‧出料頂針 150‧‧‧ discharge thimble

151‧‧‧出料區 151‧‧‧Discharge area

16‧‧‧不良位置 16‧‧‧ bad location

160‧‧‧不良頂針 160‧‧‧ Bad thimble

161‧‧‧不良區 161‧‧‧ Bad area

17‧‧‧直立式圓盤 17‧‧‧ Upright Disc

170‧‧‧收容槽 170‧‧‧container

A‧‧‧微鑽頭 A‧‧‧Micro drill

第一圖本發明實施例之立體圖。 First view is a perspective view of an embodiment of the present invention.

第二圖本發明實施例之前側視圖。 FIG. 2 is a front side view of an embodiment of the present invention.

第三圖本發明實施例之影像檢測示意圖。 FIG. 3 is a schematic diagram of image detection according to an embodiment of the present invention.

第四圖本發明實施例之抗折檢測示意圖。 FIG. 4 is a schematic diagram of anti-bend detection according to an embodiment of the present invention.

第五圖本發明實施例之研磨示意圖。 FIG. 5 is a schematic diagram of grinding according to an embodiment of the present invention.

請參閱第一圖與第二圖所示,本發明提供一種應用直立式圓盤檢測研磨設備的操作方法,其包含:一本體1,該本體1係設有一入料位置11、一影像檢測位置12、一抗折檢測位置13、一研磨位置14、一出料位置15、一不良位置16及一直立式圓盤17。 Please refer to the first figure and the second figure. The present invention provides an operation method using an upright disc detection and grinding device, which includes: a body 1 which is provided with a feeding position 11 and an image detection position. 12. An anti-bending detection position 13, a grinding position 14, a discharge position 15, a defective position 16 and a straight vertical disc 17.

該直立式圓盤17上設有至少一收容槽170,該收容槽170可收容微鑽頭A,藉由該直立式圓盤17的轉動,該收容槽170會依序經由該入料位置11、該影像檢測位置12、該抗折檢測位置13、該研磨位置14、該出料位置15、該不良位置16,最後再回到該入料位置11。 The upright disc 17 is provided with at least one receiving slot 170, which can receive the micro drill A. With the rotation of the upright disc 17, the receiving slot 170 will sequentially pass through the feeding position 11, The image detection position 12, the anti-bend detection position 13, the grinding position 14, the discharging position 15, the defective position 16, and finally return to the feeding position 11.

當微鑽頭A移至該入料位置11後,藉由該直立式圓盤17轉動,微鑽頭A會由該入料位置11轉至該影像檢測位置12。 After the micro drill A is moved to the feeding position 11, the micro drill A is rotated from the feeding position 11 to the image detection position 12 by rotating the upright disc 17.

請參閱第三圖,該影像檢測位置12係設有一影像檢測器120與一轉輪121,該影像檢測器120係為電荷耦合裝置(Charge Coupled Device,CCD),當微鑽頭A轉至該影像檢測位置12時,該轉輪121會轉動並帶動微鑽頭A旋轉,該影像檢測器120藉由微鑽頭A旋轉可360度檢測鑽刃是否有焊接於規範位置內,若影像檢測器120判定微鑽頭A為良品,則該直立式圓盤17會轉動將微鑽 頭A轉至該抗折檢測位置13。 Please refer to the third figure. The image detection position 12 is provided with an image detector 120 and a rotating wheel 121. The image detector 120 is a Charge Coupled Device (CCD). When the micro drill A is turned to the image When the detection position is 12, the rotary wheel 121 will rotate and drive the micro drill A to rotate. The image detector 120 can detect whether the cutting edge is welded in the standard position by 360 degrees of the micro drill A. If the image detector 120 judges the micro Bit A is a good product, and the upright disc 17 will rotate to drill slightly. The head A is turned to the anti-bend detection position 13.

請參閱第四圖,該抗折檢測位置13係設有一抗折檢測器130,當微鑽頭A轉至該抗折檢測位置13時,該抗折檢測器130會向下移動產生一推力,藉此測試微鑽頭A之鑽刃焊接強度是否在規範內,若抗折檢測器130判定微鑽頭A為良品,則該直立式圓盤17會轉動將微鑽頭A轉至該研磨位置14。 Please refer to the fourth figure. The anti-bend detection position 13 is provided with a anti-bend detector 130. When the micro drill A is turned to the anti-bend detection position 13, the anti-bend detector 130 will move downward to generate a thrust. In this test, whether the welding strength of the drill edge of the micro-bit A is within the specification. If the anti-bend detector 130 determines that the micro-bit A is a good product, the upright disc 17 will rotate to turn the micro-bit A to the grinding position 14.

請參閱第一圖與第五圖,該研磨位置14設有一研磨器140,當微鑽頭A轉至該研磨位置14時,研磨器140會作動將微鑽頭A長度研磨至設定值,研磨完成後,則該直立式圓盤17會轉動將微鑽頭A轉至該出料位置15。 Please refer to the first and fifth figures. The grinding position 14 is provided with a grinder 140. When the micro drill A is turned to the grinding position 14, the grinder 140 will operate to grind the length of the micro drill A to a set value. After the grinding is completed, Then, the upright disc 17 will be rotated to turn the micro drill A to the discharge position 15.

請參閱第二圖,該出料位置15設有一出料頂針150與一出料區151,當被影像檢測與抗折檢測判定為良品之微鑽頭A轉至該出料位置15時,該出料頂針150會水平作動將微鑽頭A頂出該收容槽170,使微鑽頭A落入該出料區151。 Please refer to the second figure. The discharge position 15 is provided with a discharge thimble 150 and a discharge area 151. When the micro drill A judged to be a good product by image detection and anti-bend detection is turned to the discharge position 15, the output The material ejector pin 150 is actuated horizontally to push the micro-drill A out of the receiving groove 170, so that the micro-drill A is dropped into the discharge area 151.

若該影像檢測器120感測判定微鑽頭A為不良品時,則不良品轉至該出料位置15時,該出料頂針150不作動,不良品會轉至該不良位置16。 If the image detector 120 senses that the micro-drill A is defective, when the defective product is turned to the discharging position 15, the ejection pin 150 is not moved, and the defective product is transferred to the defective position 16.

若抗折檢測器130判定微鑽頭A為不良品時,則不良品轉至該出料位置15時,該出料頂針150不作動,不良品會轉至該不良位置16。 When the anti-bend detector 130 determines that the micro drill A is a defective product, when the defective product is turned to the discharging position 15, the ejection pin 150 does not move, and the defective product is transferred to the defective position 16.

該不良區161設有一不良頂針160與一不良區,當被判定為不良品之微鑽頭A轉至該不良區161時,該不良頂針160會水平作動將不良之微鑽頭A頂出該收容槽170,使不良品落入該不良區161。 The defective area 161 is provided with a defective thimble 160 and a defective area. When the micro drill A judged as a defective product is transferred to the defective area 161, the defective thimble 160 will act horizontally to push the defective micro drill A out of the receiving slot. 170, the defective product falls into the defective area 161.

藉由上述,本發明直立式圓盤檢測研磨設備可藉由直立式圓盤設計,有效縮減配置面積並加快檢測與研磨速度,進而節省建構成本與時間成本。 Based on the above, the vertical disc testing and grinding device of the present invention can effectively reduce the configuration area and speed up the inspection and grinding speed by the vertical disc design, thereby saving construction cost and time cost.

惟以上所述者,僅為本發明之較佳實施例,當不能用以限定本發明可實施之範圍,凡習於本業之人士所明顯可作的變化與修飾,皆應視為不悖離本發明之實質內容。 However, the above are only preferred embodiments of the present invention. When it cannot be used to limit the scope of the present invention, all changes and modifications obvious to those skilled in the art should be deemed not to be inconsistent. The essence of the invention.

Claims (1)

一種直立式圓盤檢測研磨設備的操作方法,其包括:一本體,其係設有一入料位置、一影像檢測位置並設有一影像檢測器、一抗折檢測位置並設有一抗折檢測器、一研磨位置並設有一研磨器、一出料位置並設有一出料頂針及一不良位置並設有一不良頂針以及一直立式圓盤,該直立式圓盤係設於該本體上,該直立式圓盤上設有至少一收容槽,該收容槽可收容微鑽頭,該操作方法包括:1.當微鑽頭移至該入料位置後,該直立式圓盤轉動,微鑽頭會由該入料位置轉至該影像檢測位置,該影像檢測位置係設有一轉輪,該影像檢測器係為電荷耦合裝置,當該微鑽頭轉至該影像檢測位置時,該轉輪會轉動並帶動該微鑽頭360度旋轉,由影像檢測器檢測微鑽頭的鑽刃是否有焊接於規範位置內,若影像檢測器判定微鑽頭為良品,則該直立式圓盤會轉動將該微鑽頭轉至該抗折檢測位置;2.當該微鑽頭轉至該抗折檢測位置時,該抗折檢測器會向下移動產生一推力,測試該微鑽頭之鑽刃焊接強度是否在規範內,當抗折檢測器判定微鑽頭為良品,則該直立式圓盤會轉動將該微鑽頭轉至該研磨位置,當抗折檢測器判定該微鑽頭為不良品時,則不良品轉至該出料位置時,該出料頂針不作動,不良品之微鑽頭會轉至該不良位置;3.當該微鑽頭轉至該研磨位置時,該研磨器會作動將該微鑽頭長度研磨至設定值,研磨完成後,該直立式圓盤會轉動將該微鑽頭轉至該出料位置;4.該出料位置更設有一出料區,當被影像檢測與抗折檢測判定為良品之微鑽頭轉至該出料位置時,該出料頂針會水平作動將該微鑽頭頂出該收容槽,使該微鑽頭落入該出料區,當該影像檢測器感測判定該微鑽頭為不良品時,則不良品之微鑽頭轉至該出料位置時,該出料頂針不作動,不良品之微鑽頭會轉至該不良位置;5.該不良位置設有一不良區,當被判定為不良品之微鑽頭轉至該不良區時,該不良頂針會水平作動將不良之微鑽頭頂出該收容槽,使不良品之微鑽頭落入該不良區。An operating method of an upright disc detection and grinding equipment includes: a body, which is provided with a feeding position, an image detection position and an image detector, an anti-fold detection position and an anti-fold detector, A grinding position is provided with a grinder, a discharging position is provided with a discharging thimble and a defective position is provided with a defective thimble and a vertical disc, the vertical disc is arranged on the body, and the vertical type The disk is provided with at least one receiving slot, and the receiving slot can receive a micro drill. The operation method includes: 1. After the micro drill is moved to the feeding position, the upright disc is rotated, and the micro drill is fed by the feeding material. The position is turned to the image detection position. The image detection position is provided with a wheel. The image detector is a charge coupled device. When the micro drill is turned to the image detection position, the wheel will rotate and drive the micro drill. 360-degree rotation, the image detector detects whether the drill bit of the micro-bit is welded in the standard position. If the image detector determines that the micro-bit is good, the upright disc will rotate to turn the micro-bit to Anti-buckling detection position; 2. When the micro drill is turned to the anti-buckling detection position, the anti-buckling detector will move downward to generate a thrust, and test whether the welding strength of the drill bit of the micro-bit is within the specification. The detector determines that the micro drill is a good product, and the upright disc will rotate to turn the micro drill to the grinding position. When the anti-bend detector determines that the micro drill is a defective product, the defective product is transferred to the discharge position If the ejection pin is not activated, the micro drill of the defective product will be turned to the defective position; 3. When the micro drill is turned to the grinding position, the grinder will be operated to grind the length of the micro drill to a set value, and the grinding is completed After that, the upright disc will rotate to turn the micro drill to the discharge position. 4. The discharge position is further provided with a discharge area. When the micro drill that is judged to be good by image detection and anti-bend detection is transferred to the At the discharge position, the discharge thimble will act horizontally to eject the micro-drill bit out of the receiving slot, so that the micro-drill bit falls into the discharge area. When the image detector senses and determines that the micro-drill bit is defective, then When the micro drill of the defective product is turned to the discharge position, The ejection pin is not moved, and the micro drill bit of the defective product will be turned to the defective position; 5. The defective position is provided with a defective area. When the micro drill bit judged as a defective product is turned to the defective area, the defective ejector pin will be horizontal. Acting pushes the defective micro-drill out of the receiving slot, so that the defective micro-drill falls into the defective area.
TW107122492A 2018-06-29 2018-06-29 Operation method of vertical disc detecting grinding device TWI675720B (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4890268U (en) * 1972-02-01 1973-10-30
TW494046B (en) * 2001-04-20 2002-07-11 Taiwan Union Tool Corp Drill bit grinding system and dust powder removing device
TWM391431U (en) * 2010-06-03 2010-11-01 Cin Phown Technology Co Ltd Detecting and grinding device for soldering machine

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4890268U (en) * 1972-02-01 1973-10-30
TW494046B (en) * 2001-04-20 2002-07-11 Taiwan Union Tool Corp Drill bit grinding system and dust powder removing device
TWM391431U (en) * 2010-06-03 2010-11-01 Cin Phown Technology Co Ltd Detecting and grinding device for soldering machine

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