TWM570416U - Vertical disc detection mechanism - Google Patents
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- TWM570416U TWM570416U TW107208813U TW107208813U TWM570416U TW M570416 U TWM570416 U TW M570416U TW 107208813 U TW107208813 U TW 107208813U TW 107208813 U TW107208813 U TW 107208813U TW M570416 U TWM570416 U TW M570416U
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Abstract
本創作直立式圓盤檢測機構,其包括:一本體,該本體係設有一入料位置、一影像檢測位置、一抗折檢測位置、一研磨位置、一出料位置及一不良位置;一影像檢測器,係設於該影像檢測位置;一抗折檢測器,係設於該抗折檢測位置;一研磨器,係設於該研磨位置;一出料頂針,係設於該出料位置;一不良頂針,係設於該不良位置;以及一直立式圓盤,該直立式圓盤係設於該本體上,且設有至少一收容槽,該收容槽可收容微鑽頭,藉由該直立式圓盤的轉動,該收容槽會依序經由該入料位置、該影像檢測位置、該抗折檢測位置、該研磨位置、該出料位置、該不良位置,最後再回到該入料位置。The present invention relates to a vertical disc detecting mechanism, comprising: a body, the system is provided with a feeding position, an image detecting position, a bending detecting position, a grinding position, a discharging position and a bad position; a detector is disposed at the image detecting position; a bending detector is disposed at the bending detection position; a grinder is disposed at the grinding position; and a discharge ejector is disposed at the discharge position; a bad thimble is disposed in the undue position; and a vertical disc is disposed on the body, and is provided with at least one receiving groove, the receiving groove can receive the micro drill bit, and the erecting body Rotation of the disc, the receiving slot sequentially passes the feeding position, the image detecting position, the folding detecting position, the grinding position, the discharging position, the defective position, and finally returning to the feeding position .
Description
本創作係有關一種直立式圓盤檢測機構,特別是針對一種微鑽頭的檢測與研磨裝置。The present invention relates to an upright disc detecting mechanism, and more particularly to a detecting and grinding device for a micro drill.
現有中華民國專利號M391431之「焊接機的檢測及研磨裝置」其包含有:一檢測裝置、一背光座、一旋轉夾臂、一抗折測試裝置與一研磨裝置;係由檢測裝置進行鑽頭之檢測作業,依據鑽頭遮住背光座之面積大小判別鑽頭之長度,並且由旋轉夾臂夾取鑽頭並移動至抗折測試裝置施以適當之推力於鑽頭,以測試鑽頭之抗折度,再由旋轉夾臂將鑽頭夾取並移動至研磨裝置進行鑽頭之研磨作業;然,該旋轉夾臂為水平旋轉,需要較大的作動空間,導致建築成本亦較高。The "detection and grinding device for welding machine" of the Republic of China Patent No. M391431 includes: a detecting device, a backlight holder, a rotating clamp arm, a bending test device and a grinding device; In the inspection operation, the length of the drill bit is determined according to the area of the drill bit covering the backlight seat, and the drill bit is gripped by the rotating clamp arm and moved to the bending test device to apply the appropriate thrust to the drill bit to test the bending resistance of the drill bit, and then The rotating clamp arm clamps and moves the drill bit to the grinding device to perform the grinding operation of the drill bit; however, the rotating clamp arm rotates horizontally, requiring a large working space, resulting in high construction cost.
有鑑於此,如何將上述缺失加以摒除,即為本案創作人所欲解決之技術困難點之所在;是而,本案創作人基於多年從事相關業界的經驗,經多年苦心孤詣潛心研究,試作改良,終於成功研發完成本案,並使本新型得以誕生,以增進功效者。In view of this, how to eliminate the above-mentioned deficiencies is the technical difficulty point that the creators of this case want to solve; however, the creators of this case are based on years of experience in relevant industries, and after many years of painstaking research, trial improvement, finally Successfully developed and completed the case, and enabled the new model to be born to enhance the efficacy.
有鑒於上述之缺點,本創作直立式圓盤檢測機構,其包括:一本體,該本體係設有一入料位置、一影像檢測位置、一抗折檢測位置、一研磨位置、一出料位置及一不良位置;一入料頂針,係設於該入料位置;一影像檢測器,係設於該影像檢測位置;一抗折檢測器,係設於該抗折檢測位置;一研磨器,係設於該研磨位置;一出料頂針,係設於該出料位置;一不良頂針,係設於該不良位置;以及一直立式圓盤,該直立式圓盤係設於該本體上,該直立式圓盤上設有至少一收容槽,該收容槽可收容微鑽頭,藉由該直立式圓盤的轉動,該收容槽會依序經由該入料位置、該影像檢測位置、該抗折檢測位置、該研磨位置、該出料位置、該不良位置,最後再回到該入料位置。In view of the above disadvantages, the present invention provides a vertical disc detecting mechanism comprising: a body, the system is provided with a feeding position, an image detecting position, a bending detecting position, a grinding position, a discharging position and a defective position; a feed thimble is disposed at the feeding position; an image detector is disposed at the image detecting position; a bending detector is disposed at the bending detection position; a grinder, Provided in the grinding position; a discharge ejector is disposed at the discharge position; a defective thimble is disposed at the defective position; and a vertical disc, the upright disc is disposed on the body, The vertical disc is provided with at least one receiving slot, and the receiving slot can receive the micro drill bit. The receiving slot can sequentially pass the feeding position, the image detecting position, and the bending resistance by the rotation of the vertical disc. The detection position, the grinding position, the discharge position, the defective position, and finally return to the feeding position.
承上所述,其中,當微鑽頭移至該入料位置後,該直立式圓盤會轉動將微鑽頭由該入料位置轉至該影響檢測位置。According to the above description, after the micro drill bit is moved to the feeding position, the vertical disc rotates to rotate the micro drill bit from the feeding position to the influence detecting position.
承上所述,其中,該影像檢測器係為電荷耦合裝置(Charge Coupled Device,CCD)。As described above, the image detector is a Charge Coupled Device (CCD).
承上所述,其中,該出料位置設有一出料區,當微鑽頭通過影像檢測、抗折檢測且完成研磨後,抵達該出料位置時,該出料頂針會將微鑽頭推入該出料區。According to the above description, the discharge position is provided with a discharge area, and when the micro drill bit passes the image detection, the anti-fold detection and the grinding is completed, and the discharge position is reached, the discharge ejector pushes the micro drill bit into the discharge position. Discharge area.
承上所述,該不良位置設有一不良區,當該影像檢測器感測出不良微鑽頭,則不良微鑽頭轉至該出料位置時,該出料頂針不作動,不良微鑽頭會轉至該不良位置,藉由該不良頂針作動,不良微鑽頭會落入該不良區。As described above, the defective position is provided with a defective area. When the image detector senses a defective micro drill bit, when the defective micro drill bit is turned to the discharge position, the discharge ejector pin does not move, and the defective micro drill bit will be transferred to The defective position is caused by the defective thimble, and the defective micro drill bit falls into the defective area.
承上所述,該抗折檢測裝置檢測出不良微鑽頭,則不良微鑽頭轉至該出料位置時,該出料頂針不作動,不良微鑽頭會轉至該不良位置,藉由該不良頂針作動,不良微鑽頭會落入該不良區。As described above, the anti-aliasing detecting device detects the defective micro-drill, and when the defective micro-drill is turned to the discharging position, the discharging ejector does not move, and the defective micro-drill will turn to the defective position, and the defective thimble Actuated, the bad micro drill will fall into the bad zone.
為使 貴審查委員方便瞭解本新型之內容,及所能達成之功效,茲配合圖式列舉具體實施例,詳細說明如下:In order to make it easier for your review committee to understand the contents of this new model and the efficiencies that can be achieved, the specific examples are listed in conjunction with the drawings, as detailed below:
請參照第一圖與第二圖所示,係為本創作之立體圖。如圖所示,本創作直立式圓盤檢測機構其包括:一本體1,該本體1係設有一入料位置11、一影像檢測位置12、一抗折檢測位置13、一研磨位置14、一出料位置15、一不良位置16及一直立式圓盤17。Please refer to the first figure and the second figure, which is a perspective view of the creation. As shown in the figure, the present invention relates to a vertical disc detecting mechanism comprising: a body 1 having a feeding position 11, an image detecting position 12, a bending detecting position 13, a grinding position 14, and a The discharge position 15, a defective position 16 and the upright disc 17 are provided.
該直立式圓盤17上設有至少一收容槽170,該收容槽170可收容微鑽頭A,藉由該直立式圓盤17的轉動,該收容槽170會依序經由該入料位置11、該影像檢測位置12、該抗折檢測位置13、該研磨位置14、該出料位置15、該不良位置16,最後再回到該入料位置11。The upright disc 17 is provided with at least one receiving slot 170. The receiving slot 170 can receive the micro drill bit A. Through the rotation of the upright disc 17, the receiving slot 170 passes through the feeding position 11 in sequence. The image detection position 12, the folding detection position 13, the polishing position 14, the discharge position 15, the defective position 16, and finally return to the feeding position 11.
當微鑽頭A移至該入料位置11後,藉由該直立式圓盤17轉動,微鑽頭A會由該入料位置11轉至該影像檢測位置12。After the micro drill bit A is moved to the feeding position 11, the micro drill bit A is rotated from the feeding position 11 to the image detecting position 12 by the rotation of the upright disc 17.
請參閱第三圖,該影像檢測位置12係設有一影像檢測器120與一轉輪121,該影像檢測器120係為電荷耦合裝置(Charge Coupled Device,CCD),當微鑽頭A轉至該影像檢測位置12時,該轉輪121會轉動並帶動微鑽頭A旋轉,該影像檢測器120藉由微鑽頭A旋轉可360度檢測鑽刃是否有焊接於規範位置內,若影像檢測器120判定微鑽頭A為良品,則該直立式圓盤17會轉動將微鑽頭A轉至該抗折檢測位置13。Referring to the third figure, the image detecting position 12 is provided with an image detector 120 and a rotating wheel 121. The image detecting device 120 is a charge coupled device (CCD). When the micro drill bit A is turned to the image, When the position 12 is detected, the wheel 121 rotates and drives the micro-bit A to rotate. The image detector 120 can detect whether the cutting edge is welded in the specification position by rotating the micro-bit A, if the image detector 120 determines If the drill bit A is good, the upright disc 17 will rotate to rotate the micro drill bit A to the bending detection position 13.
請參閱第四圖,該抗折檢測位置13係設有一抗折檢測器130,當微鑽頭A轉至該抗折檢測位置13時,該抗折檢測器130會向下移動產生一推力,藉此測試微鑽頭A之鑽刃焊接強度是否在規範內,若抗折檢測器130判定微鑽頭A為良品,則該直立式圓盤17會轉動將微鑽頭A轉至該研磨位置14。Referring to the fourth figure, the anti-folding detecting position 13 is provided with a folding detector 130. When the micro-drill A is turned to the anti-folding detecting position 13, the anti-folding detector 130 moves downward to generate a thrust. Whether the drill bit welding strength of the micro drill bit A is within the specification, if the folding detector 130 determines that the micro drill bit A is good, the upright disc 17 will rotate to rotate the micro drill bit A to the grinding position 14.
請參閱第一圖與第五圖,該研磨位置14設有一研磨器140,當微鑽頭A轉至該研磨位置14時,研磨器140會作動將微鑽頭A長度研磨至設定值,研磨完成後,則該直立式圓盤17會轉動將微鑽頭A轉至該出料位置15。Referring to the first and fifth figures, the grinding position 14 is provided with a grinder 140. When the micro drill bit A is turned to the grinding position 14, the grinder 140 is actuated to grind the length of the micro drill bit A to a set value. The upright disc 17 will rotate to rotate the micro drill bit A to the discharge position 15.
請參閱第二圖,該出料位置15設有一出料頂針150與一出料區151,當被影像檢測與抗折檢測判定為良品之微鑽頭A轉至該出料位置15時,該出料頂針150會水平作動將微鑽頭A頂出該收容槽170,使微鑽頭A落入該出料區151。Referring to the second figure, the discharge position 15 is provided with a discharge ejector pin 150 and a discharge area 151. When the micro drill bit A determined to be good by image detection and anti-fold detection is turned to the discharge position 15, the output is The ejector pin 150 will actuate horizontally to push the micro drill bit A out of the receiving groove 170, so that the micro drill bit A falls into the discharge zone 151.
若該影像檢測器120感測判定微鑽頭A為不良品時,則不良品轉至該出料位置15時,該出料頂針150不作動,不良品會轉至該不良位置16。When the image detector 120 senses that the micro drill A is a defective product, when the defective product is turned to the discharge position 15, the discharge ejector 150 does not move, and the defective product is turned to the defective position 16.
若抗折檢測器130判定微鑽頭A為不良品時,則不良品轉至該出料位置15時,該出料頂針150不作動,不良品會轉至該不良位置16。When the folding detector 130 determines that the micro drill A is a defective product, when the defective product is turned to the discharge position 15, the discharge ejector 150 does not move, and the defective product is turned to the defective position 16.
該不良區161設有一不良頂針160與一不良區,當被判定為不良品之微鑽頭A轉至該不良區161時,該不良頂針160會水平作動將不良之微鑽頭A頂出該收容槽170,使不良品落入該不良區161。The defective area 161 is provided with a defective thimble 160 and a defective area. When the micro drill bit A determined to be defective is turned to the defective area 161, the defective thimble 160 is horizontally actuated to push the defective micro drill A out of the receiving slot. 170, the defective product falls into the defective area 161.
藉由上述,本創作直立式圓盤檢測機構可藉由直立式圓盤設計,有效縮減配置面積並加快檢測與研磨速度,進而節省建構成本與時間成本。By the above, the original upright disc detecting mechanism can effectively reduce the arrangement area and speed up the detection and grinding speed by the upright disc design, thereby saving the cost of construction and time.
上列詳細說明係針對本新型之一可行實施例之具體說明,惟實施例並非用以限制本新型之專利範圍,凡未脫離本新型技藝精神所為之等效實施或變更,均應包含於本案之專利範圍中。The detailed description above is a detailed description of one of the possible embodiments of the present invention, and the embodiments are not intended to limit the scope of the present invention, and equivalent implementations or modifications that are not departing from the spirit of the present invention should be included in the present invention. In the scope of patents.
1‧‧‧本體1‧‧‧ Ontology
11‧‧‧入料位置11‧‧‧Feeding position
12‧‧‧影像檢測位置12‧‧‧Image detection location
120‧‧‧影像檢測器120‧‧‧Image Detector
121‧‧‧轉輪121‧‧‧Runner
13‧‧‧抗折檢測位置13‧‧‧Folding detection position
130‧‧‧抗折檢測器130‧‧‧Fracture detector
14‧‧‧研磨位置14‧‧‧ Grinding position
140‧‧‧研磨器140‧‧‧Mr.
15‧‧‧出料位置15‧‧‧Drawing position
150‧‧‧出料頂針150‧‧‧Drawing thimble
151‧‧‧出料區151‧‧‧Drawing area
16‧‧‧不良位置16‧‧‧Poor position
160‧‧‧不良頂針160‧‧‧bad thimble
161‧‧‧不良區161‧‧‧Unexpected area
17‧‧‧直立式圓盤17‧‧‧Upright disc
170‧‧‧收容槽170‧‧‧ Reception trough
A‧‧‧微鑽頭A‧‧‧Micro drill
第一圖係本創作之立體圖。 第二圖係本創作之前側視圖。 第三圖係本創作之影像檢測示意圖。 第四圖係本創作之抗折檢測示意圖。 第五圖係本創作之研磨示意圖。The first picture is a perspective view of the creation. The second picture is a side view of the original creation. The third picture is a schematic diagram of the image detection of this creation. The fourth picture is a schematic diagram of the folding detection of this creation. The fifth picture is a schematic diagram of the grinding of this creation.
Claims (6)
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TW107208813U TWM570416U (en) | 2018-06-29 | 2018-06-29 | Vertical disc detection mechanism |
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TW107208813U TWM570416U (en) | 2018-06-29 | 2018-06-29 | Vertical disc detection mechanism |
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TWM570416U true TWM570416U (en) | 2018-11-21 |
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2018
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