TWI673801B - Fingerprint identification chip package structure - Google Patents
Fingerprint identification chip package structure Download PDFInfo
- Publication number
- TWI673801B TWI673801B TW107107779A TW107107779A TWI673801B TW I673801 B TWI673801 B TW I673801B TW 107107779 A TW107107779 A TW 107107779A TW 107107779 A TW107107779 A TW 107107779A TW I673801 B TWI673801 B TW I673801B
- Authority
- TW
- Taiwan
- Prior art keywords
- circuit substrate
- light
- lens
- package structure
- disposed
- Prior art date
Links
- 239000000758 substrate Substances 0.000 claims abstract description 81
- 238000004806 packaging method and process Methods 0.000 claims abstract description 23
- 239000010410 layer Substances 0.000 claims description 29
- 239000012790 adhesive layer Substances 0.000 claims description 10
- 239000002313 adhesive film Substances 0.000 claims description 2
- 238000000034 method Methods 0.000 claims description 2
- 230000001681 protective effect Effects 0.000 description 10
- 230000003287 optical effect Effects 0.000 description 8
- 239000008393 encapsulating agent Substances 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 210000001015 abdomen Anatomy 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1324—Sensors therefor by using geometrical optics, e.g. using prisms
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Optics & Photonics (AREA)
- Human Computer Interaction (AREA)
- Multimedia (AREA)
- Theoretical Computer Science (AREA)
- Image Input (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
Abstract
一種指紋辨識晶片封裝結構，包括線路基板、晶片、至少一發光元件、透光層、透鏡以及封裝膠體。晶片配置於線路基板上並電性連接線路基板。發光元件配置於線路基板上並電性連接線路基板。發光元件位於晶片的至少一側。透光層配置於線路基板上，並包覆晶片與發光元件。透鏡配置於透光層上，且透鏡與線路基板分別位於透光層的相對兩側。封裝膠體配置於線路基板上，且位於透光層與透鏡的周圍。A fingerprint identification chip packaging structure includes a circuit substrate, a chip, at least one light emitting element, a light transmitting layer, a lens, and a packaging gel. The chip is disposed on the circuit substrate and is electrically connected to the circuit substrate. The light emitting element is disposed on the circuit substrate and is electrically connected to the circuit substrate. The light emitting element is located on at least one side of the wafer. The light-transmitting layer is disposed on the circuit substrate, and covers the wafer and the light-emitting element. The lens is disposed on the light-transmitting layer, and the lens and the circuit substrate are located on opposite sides of the light-transmitting layer, respectively. The encapsulating gel is disposed on the circuit substrate and is located around the light transmitting layer and the lens.
Description
本發明是有關於一種晶片封裝結構，且特別是有關於一種指紋辨識晶片封裝結構。The present invention relates to a chip packaging structure, and more particularly, to a fingerprint recognition chip packaging structure.
目前，因資安意識的提高，智慧型手機、行動電話、平板電腦、筆記型電腦以及個人數位助理(PDA)等電子設備的鎖定狀態通常需透過辨識程序才能解除，其中辨識程序又以指紋辨識最為常見，且指紋辨識器依其辨識原理可區分為電容式指紋辨識器及光學式指紋辨識器。At present, due to increased awareness of security, electronic devices such as smartphones, mobile phones, tablets, notebooks, and personal digital assistants (PDAs) usually need to be unlocked through an identification process, which is identified by fingerprints. The most common, and fingerprint readers can be divided into capacitive fingerprint readers and optical fingerprint readers based on their recognition principles.
光學式指紋辨識器由於需具有光源輔助照明辨識，因此，體積較無法縮減，反觀電容式指紋辨識器具有結構輕薄的優勢，近年來大受業者青睞。電容式指紋辨識器利用感測晶片及感測電極相對於手指表面之脊紋與溝紋所形成的電容差異來取得指紋影像，因此手指的指腹與感測晶片之間的距離不能過遠，否則可能造成辨識功能失常。一般而言，配設於上述電子設備中的電容式指紋辨識器的上方設有保護蓋板，在進行指紋辨識時，使用者需將手指的指腹貼附於保護蓋板的外表面，為縮短保護蓋板的外表面與感測晶片之間的距離，保護蓋板的外表面中對位於感測晶片的區塊需設有凹槽，從而影響到上述電子設備的外觀的完整性。因此，不會影響到上述電子設備的外觀的完整性的光學式指紋辨識器又再次地被探討，然而如何縮減其體積則是成為目前重要的議題之一。Optical fingerprint readers need to have a light source to assist in lighting identification, so the volume cannot be reduced. On the other hand, capacitive fingerprint readers have the advantage of light and thin structures, and have been favored by large industry players in recent years. The capacitive fingerprint reader uses the difference in capacitance between the ridges and grooves of the sensing chip and the sensing electrode relative to the finger surface to obtain a fingerprint image, so the distance between the fingertip of the finger and the sensing chip cannot be too far, otherwise May cause malfunction of recognition. Generally speaking, a protective cover is provided above the capacitive fingerprint reader provided in the above-mentioned electronic device. When performing fingerprint recognition, the user needs to attach the abdomen of the finger to the outer surface of the protective cover. The distance between the outer surface of the protective cover and the sensing chip is shortened. The outer surface of the protective cover needs to be provided with a groove in the block located on the sensing chip, thereby affecting the appearance integrity of the electronic device. Therefore, an optical fingerprint reader that does not affect the integrity of the appearance of the electronic device is being explored again. However, how to reduce its volume has become one of the important issues at present.
本發明提供一種指紋辨識晶片封裝結構，有助於維持電子設備外觀的完整性。The invention provides a fingerprint identification chip package structure, which is helpful for maintaining the integrity of the appearance of electronic equipment.
本發明的指紋辨識晶片封裝結構，包括線路基板、晶片、至少一發光元件、透光層、透鏡以及封裝膠體。晶片配置於線路基板上並電性連接線路基板。發光元件配置於線路基板上並電性連接線路基板。發光元件位於晶片的至少一側。透光層配置於線路基板上，並包覆晶片與發光元件。透鏡配置於透光層上，且透鏡與線路基板分別位於透光層的相對兩側。封裝膠體配置於線路基板上，且位於透光層與透鏡的周圍。The fingerprint identification chip packaging structure of the present invention includes a circuit substrate, a chip, at least one light emitting element, a light transmitting layer, a lens, and a packaging gel. The chip is disposed on the circuit substrate and is electrically connected to the circuit substrate. The light emitting element is disposed on the circuit substrate and is electrically connected to the circuit substrate. The light emitting element is located on at least one side of the wafer. The light-transmitting layer is disposed on the circuit substrate, and covers the wafer and the light-emitting element. The lens is disposed on the light-transmitting layer, and the lens and the circuit substrate are located on opposite sides of the light-transmitting layer, respectively. The encapsulating gel is disposed on the circuit substrate and is located around the light transmitting layer and the lens.
在本發明的一實施例中，上述的晶片的主動表面朝向透鏡，其中指紋辨識晶片封裝結構更包括多條導線，且這些導線配置用以電性連接主動表面與線路基板。In an embodiment of the present invention, the active surface of the chip is oriented toward the lens. The fingerprint recognition chip packaging structure further includes a plurality of wires, and the wires are configured to electrically connect the active surface and the circuit substrate.
在本發明的一實施例中，上述的這些導線與發光元件分別位於晶片的不同側。In an embodiment of the present invention, the wires and the light-emitting element are located on different sides of the wafer, respectively.
在本發明的一實施例中，上述的發光元件的發光面與晶片的主動表面齊平。In an embodiment of the present invention, the light-emitting surface of the light-emitting element is flush with the active surface of the wafer.
在本發明的一實施例中，上述的透鏡在線路基板上的正投影覆蓋晶片在線路基板上的正投影與發光元件在線路基板上的正投影。In an embodiment of the present invention, the orthographic projection of the lens on the circuit substrate covers the orthographic projection of the wafer on the circuit substrate and the orthographic projection of the light emitting element on the circuit substrate.
在本發明的一實施例中，上述的指紋辨識晶片封裝結構更包括透光基板。透光基板配置於透鏡上，且透光基板與透光層分別位於透鏡的相對兩側。In an embodiment of the present invention, the above-mentioned fingerprint identification chip packaging structure further includes a light-transmitting substrate. The light-transmitting substrate is disposed on the lens, and the light-transmitting substrate and the light-transmitting layer are respectively located on opposite sides of the lens.
在本發明的一實施例中，上述的指紋辨識晶片封裝結構更包括黏著層，配置用以將透光基板固定於透鏡上。In an embodiment of the present invention, the above-mentioned fingerprint identification chip packaging structure further includes an adhesive layer configured to fix the transparent substrate on the lens.
在本發明的一實施例中，上述的指紋辨識晶片封裝結構更包括被動元件，配置於線路基板上並電性連接線路基板，且被動元件被封裝膠體所包覆。In an embodiment of the present invention, the above-mentioned fingerprint identification chip packaging structure further includes a passive component, which is disposed on the circuit substrate and is electrically connected to the circuit substrate, and the passive component is covered by the packaging gel.
在本發明的一實施例中，上述的透光層包括線包覆膠膜。In an embodiment of the present invention, the light-transmitting layer includes a wire-clad adhesive film.
在本發明的一實施例中，上述的透鏡為聚光透鏡。In an embodiment of the present invention, the lens is a condenser lens.
基於上述，本發明的指紋辨識晶片封裝結構能藉由透鏡會聚出射光線與反射光線，以確保出射光線能集中投射到待辨識的外界物體(例如手指的指腹)，並確保反射光線能集中投射到晶片的主動表面，從而確保光學式指紋辨識的辨識可靠度。也就是說，基於透鏡的聚光功能，不僅能確保光學式指紋辨識的辨識可靠度，也能提高感測距離，使得產品設計更具彈性，舉例來說，配設有本發明的指紋辨識晶片封裝結構的電子設備無需刻意縮減部分區塊的厚度，故能維持電子設備的外觀的完整性。Based on the above, the fingerprint recognition chip packaging structure of the present invention can focus the emitted light and the reflected light through the lens, so as to ensure that the emitted light can be concentratedly projected to an external object to be identified (for example, a fingertip of a finger) and ensure that the reflected light can be concentratedly projected To the active surface of the chip, thereby ensuring the recognition reliability of optical fingerprint recognition. That is, the lens-based light focusing function can not only ensure the recognition reliability of optical fingerprint recognition, but also increase the sensing distance, making the product design more flexible. For example, it is equipped with the fingerprint recognition chip of the present invention. The electronic device with the packaging structure does not need to deliberately reduce the thickness of some blocks, so the appearance integrity of the electronic device can be maintained.
為讓本發明的上述特徵和優點能更明顯易懂，下文特舉實施例，並配合所附圖式作詳細說明如下。In order to make the above features and advantages of the present invention more comprehensible, embodiments are hereinafter described in detail with reference to the accompanying drawings.
圖1是本發明一實施例的指紋辨識晶片封裝結構的俯視示意圖。圖2是圖1的指紋辨識晶片封裝結構沿Ⅰ-Ⅰ’剖線的剖面示意圖。圖3是圖1的指紋辨識晶片封裝結構沿Ⅱ-Ⅱ’剖線的剖面示意圖。特別說明的是，圖2與圖3示意地繪示出電子設備中的保護蓋板200貼合於指紋辨識晶片封裝結構10上的態樣，以便於說明。請參照圖1至圖3，在本實施例中，指紋辨識晶片封裝結構10包括線路基板100、晶片110、至少一發光元件120(示意地繪示出兩個)、透光層130、透鏡140以及封裝膠體150，其中晶片110具有相對的主動表面112與背表面114，且背表面114透過膠層116連接線路基板100，使晶片110固定於線路基板100上。FIG. 1 is a schematic top view of a fingerprint identification chip package structure according to an embodiment of the present invention. FIG. 2 is a schematic cross-sectional view of the fingerprint recognition chip package structure of FIG. 1 taken along the line I-I '. FIG. 3 is a schematic cross-sectional view of the fingerprint identification chip packaging structure of FIG. 1 along a line II-II '. In particular, FIG. 2 and FIG. 3 schematically illustrate a state in which the protective cover 200 in the electronic device is attached to the fingerprint identification chip packaging structure 10 for easy explanation. Please refer to FIG. 1 to FIG. 3. In this embodiment, the fingerprint identification chip packaging structure 10 includes a circuit substrate 100, a chip 110, at least one light emitting element 120 (schematically two are shown), a light transmitting layer 130, and a lens 140. And a packaging gel 150, in which the chip 110 has an active surface 112 and a back surface 114 opposite to each other, and the back surface 114 is connected to the circuit substrate 100 through the adhesive layer 116 so that the chip 110 is fixed on the circuit substrate 100.
另一方面，晶片110的主動表面112作為指紋影像感測面，且背向於線路基板100。晶片110可透過打線接合的方式電性連接於線路基板100，因此，指紋辨識晶片封裝結構10還包多條導線160，各導線160的其中一端電性接合於晶片110的主動表面112，且各導線160的另一端電性接合於線路基板100。這些發光元件120例如是發光二極體，設置於線路基板100上，且電性連接線路基板100。這些發光元件120位於晶片110的至少一側，且這些導線160的配置是以不阻礙這些發光元件120所發出的感測光線為原則，因此這些導線160與這些發光元件120分別位於晶片110的不同側。On the other hand, the active surface 112 of the chip 110 serves as a fingerprint image sensing surface and faces away from the circuit substrate 100. The chip 110 can be electrically connected to the circuit substrate 100 by wire bonding. Therefore, the fingerprint recognition chip packaging structure 10 also includes a plurality of wires 160, and one end of each wire 160 is electrically connected to the active surface 112 of the chip 110, and each The other end of the lead 160 is electrically connected to the circuit substrate 100. These light emitting elements 120 are, for example, light emitting diodes, are disposed on the circuit substrate 100, and are electrically connected to the circuit substrate 100. The light-emitting elements 120 are located on at least one side of the chip 110, and the arrangement of the wires 160 is based on the principle that the sensing light emitted by the light-emitting elements 120 is not blocked. Therefore, the wires 160 and the light-emitting elements 120 are respectively located on different sides of the chip 110. side.
透光層130可以是具透光性之封裝膠體，配置於線路基板100上並包覆晶片110、這些導線160以及這些發光元件120。透鏡140貼合於透光層130，且透鏡140與線路基板100分別位於透光層130的相對兩側。透鏡140位於晶片110與這些發光元件120的正上方，且透鏡140在線路基板上的正投影覆蓋晶片110在線路基板100上的正投影與各發光元件120在線路基板100上的正投影。另一方面，晶片110的主動表面112與各發光元件120的發光面122皆朝向透鏡140，且晶片110的主動表面112與各發光元件120的發光面122可以是互為齊平。在其他實施例中，晶片的主動表面與各發光元件的發光面之間可存在高低落差，並以各發光元件的發光面高於晶片的主動表面為宜。The light-transmitting layer 130 may be a light-transmitting packaging gel, which is disposed on the circuit substrate 100 and covers the chip 110, the wires 160, and the light-emitting elements 120. The lens 140 is attached to the light-transmitting layer 130, and the lens 140 and the circuit substrate 100 are located on opposite sides of the light-transmitting layer 130, respectively. The lens 140 is located directly above the wafer 110 and the light emitting elements 120, and the orthographic projection of the lens 140 on the circuit substrate covers the orthographic projection of the wafer 110 on the circuit substrate 100 and the orthographic projection of each light emitting element 120 on the circuit substrate 100. On the other hand, the active surface 112 of the wafer 110 and the light emitting surface 122 of each light emitting element 120 both face the lens 140, and the active surface 112 of the wafer 110 and the light emitting surface 122 of each light emitting element 120 may be flush with each other. In other embodiments, there may be a height difference between the active surface of the wafer and the light emitting surface of each light emitting element, and it is preferable that the light emitting surface of each light emitting element is higher than the active surface of the wafer.
在本實施例中，透光層130例如是線包覆膠膜(film over wire, FOW)，在將線包覆膠膜貼附於線路基板100上時，晶片110、這些發光元件120以及這些導線160可穿入線包覆膠膜，且晶片110的主動表面112與各發光元件120的發光面122皆被線包覆膠膜所覆蓋。另一方面，指紋辨識晶片封裝結構10更包括透光基板170，且配置於透鏡140上。透光基板170透過可透光的粘著層180固定於透鏡140，且透光基板170與透光層130分別位於透鏡140的相對兩側。In this embodiment, the light-transmitting layer 130 is, for example, a film over wire (FOW). When the film over wire is attached to the circuit substrate 100, the wafer 110, the light emitting elements 120, and these The conductive wires 160 can pass through the wire coating film, and the active surface 112 of the chip 110 and the light emitting surface 122 of each light emitting element 120 are covered by the wire coating film. On the other hand, the fingerprint recognition chip package structure 10 further includes a light-transmitting substrate 170 and is disposed on the lens 140. The light-transmitting substrate 170 is fixed to the lens 140 through a light-transmissive adhesive layer 180, and the light-transmitting substrate 170 and the light-transmitting layer 130 are located on opposite sides of the lens 140, respectively.
另一方面，指紋辨識晶片封裝結構10更包括被動元件190，例如電阻、電容或電感等。被動元件190設置於線路基板100上，且例如是位於透光層130之外。被動元件190與晶片110位於線路基板100的同一側，且電性連接於線路基板100。封裝膠體150連接透光層130、透鏡140、粘著層180以及透光基板170，且環繞透光層130、透鏡140、粘著層180以及透光基板170的周圍。進一步而言，封裝膠體150與透光層130可用以阻隔水氣，以避免對晶片110、這些發光元件120、這些導線160以及被動元件190造成損害。除此之外，封裝膠體150也可用以提高結構的可靠度，避免透鏡140、粘著層180以及透光基板170相對於透光層130偏移。並且，封裝膠體150與透光層130可用以防止晶片110、這些發光元件120以及這些導線160與線路基板100的電性連接關係受外力作用而遭破壞。On the other hand, the fingerprint recognition chip package structure 10 further includes a passive element 190 such as a resistor, a capacitor, or an inductor. The passive element 190 is disposed on the circuit substrate 100 and is, for example, located outside the light transmitting layer 130. The passive element 190 and the chip 110 are located on the same side of the circuit substrate 100 and are electrically connected to the circuit substrate 100. The encapsulant 150 is connected to the transparent layer 130, the lens 140, the adhesive layer 180, and the transparent substrate 170, and surrounds the periphery of the transparent layer 130, the lens 140, the adhesive layer 180, and the transparent substrate 170. Further, the encapsulant 150 and the light-transmitting layer 130 can be used to block moisture, so as to avoid damage to the chip 110, the light-emitting elements 120, the wires 160, and the passive element 190. In addition, the encapsulant 150 can also be used to improve the reliability of the structure and prevent the lens 140, the adhesive layer 180, and the transparent substrate 170 from being offset relative to the transparent layer 130. In addition, the encapsulant 150 and the light-transmitting layer 130 can be used to prevent the chip 110, the light-emitting elements 120, and the electrical connection relationship between the wires 160 and the circuit substrate 100 from being damaged by external forces.
此處，透光基板170可用以防止外界物體直接接觸透鏡140，且透鏡140可以是聚光透鏡。因透鏡140在線路基板上的正投影覆蓋晶片110在線路基板100上的正投影與各發光元件120在線路基板100上的正投影，各發光元件120所發出的感測光線能在穿過透鏡140後會聚。Here, the light-transmitting substrate 170 may be used to prevent external objects from directly contacting the lens 140, and the lens 140 may be a condenser lens. Since the orthographic projection of the lens 140 on the circuit substrate covers the orthographic projection of the wafer 110 on the circuit substrate 100 and the orthographic projection of each light emitting element 120 on the circuit substrate 100, the sensing light emitted by each of the light emitting elements 120 can pass through the lens. Meet after 140.
另一方面，保護蓋板200例如是電子設備(例如智慧型手機、平板電腦、筆記型電腦或其他適用的電子產品)的一部分，且為透光蓋板。保護蓋板200連接透光基板170與封裝膠體150，於操作上，使用者可以手指貼附於保護蓋板200的外表面，且對應於晶片110所在處。因透鏡140在線路基板上的正投影覆蓋晶片110在線路基板100上的正投影與各發光元件120在線路基板100上的正投影，各發光元件120所發出的感測光線能在穿過透鏡140後會聚，並於穿過透光基板170後集中投射在碰觸保護蓋板200的外表面的手指的指腹。相對地，感測光線自手指的指腹反射後會先穿過透光基板170，接著在穿過透鏡140後會聚，以集中投射在晶片110的主動表面112上。基於透鏡140的聚光功能，不僅能確保光學式指紋辨識的辨識可靠度，也能使產品設計更具彈性。另一方面，本發明之結構整合了被動元件、發光元件及透鏡等元件將其模封於同一單元中，使其形成為一模組化元件，如此一來，有效節省了空間及體積。On the other hand, the protective cover 200 is, for example, a part of an electronic device (such as a smart phone, a tablet computer, a notebook computer, or other applicable electronic products), and is a transparent cover. The protective cover 200 is connected to the light-transmitting substrate 170 and the encapsulant 150. In operation, a user can attach a finger to the outer surface of the protective cover 200 and correspond to the location of the chip 110. Since the orthographic projection of the lens 140 on the circuit substrate covers the orthographic projection of the wafer 110 on the circuit substrate 100 and the orthographic projection of each light emitting element 120 on the circuit substrate 100, the sensing light emitted by each of the light emitting elements 120 can pass through the lens. After 140, they converge, and after they pass through the light-transmitting substrate 170, they are concentrated on the fingertips of the fingers touching the outer surface of the protective cover 200. In contrast, after the sensing light reflects from the fingertip of the finger, it will first pass through the light-transmitting substrate 170 and then converge after passing through the lens 140 to be focused on the active surface 112 of the wafer 110. The light focusing function based on the lens 140 can not only ensure the recognition reliability of the optical fingerprint recognition, but also make the product design more flexible. On the other hand, the structure of the present invention integrates components such as passive components, light-emitting components, and lenses and molds them into the same unit to form a modular component. In this way, space and volume are effectively saved.
綜上所述，本發明的指紋辨識晶片封裝結構能藉由透鏡會聚出射光線與反射光線，以確保出射光線能集中投射到待辨識的外界物體(例如手指的指腹)，並確保反射光線能集中投射到晶片的主動表面，從而確保光學式指紋辨識的辨識可靠度。也就是說，基於透鏡的聚光功能，不僅能確保光學式指紋辨識的辨識可靠度，也能提高感測距離，使得產品設計更具彈性，舉例來說，配設有本發明的指紋辨識晶片封裝結構的電子設備無需刻意縮減部分區塊的厚度，故能維持電子設備的外觀的完整性。In summary, the fingerprint recognition chip package structure of the present invention can focus the emitted light and reflected light through the lens, so as to ensure that the emitted light can be concentratedly projected to an external object to be identified (for example, a fingertip of a finger), and ensure that the reflected light can Focus on the active surface of the chip to ensure the reliability of optical fingerprint recognition. That is, the lens-based light focusing function can not only ensure the recognition reliability of optical fingerprint recognition, but also increase the sensing distance, making the product design more flexible. For example, it is equipped with the fingerprint recognition chip of the present invention. The electronic device with the packaging structure does not need to deliberately reduce the thickness of some blocks, so the appearance integrity of the electronic device can be maintained.
另一方面，封裝膠體與透光層可用以阻隔水氣，以避免對晶片、發光元件、導線以及被動元件造成損害。除此之外，封裝膠體也可用以提高結構的可靠度，避免透鏡、粘著層以及透光基板相對於透光層偏移。並且，封裝膠體與透光層可用以防止晶片、發光元件以及導線與線路基板的電性連接關係因受外力作用而遭到破壞。On the other hand, the encapsulating gel and the light-transmitting layer can be used to block moisture, so as to avoid damage to the chip, the light-emitting element, the wire, and the passive element. In addition, the encapsulating gel can also be used to improve the reliability of the structure and avoid the lens, the adhesive layer, and the transparent substrate from being offset relative to the transparent layer. In addition, the encapsulating gel and the light-transmitting layer can be used to prevent the electrical connection relationship between the chip, the light-emitting element, and the wire and the circuit substrate from being damaged due to an external force.
雖然本發明已以實施例揭露如上，然其並非用以限定本發明，任何所屬技術領域中具有通常知識者，在不脫離本發明的精神和範圍內，當可作些許的更動與潤飾，故本發明的保護範圍當視後附的申請專利範圍所界定者為準。Although the present invention has been disclosed as above with the examples, it is not intended to limit the present invention. Any person with ordinary knowledge in the technical field can make some modifications and retouching without departing from the spirit and scope of the present invention. The protection scope of the present invention shall be determined by the scope of the attached patent application.
10：指紋辨識晶片封裝結構 100：線路基板 110：晶片 112：主動表面 114：背表面 116：膠層 120：發光元件 122：發光面 130：透光層 140：透鏡 150：封裝膠體 160：導線 170：透光基板 180：黏著層 190：被動元件 200：保護蓋板10: Fingerprint identification chip package structure 100: Circuit substrate 110: Wafer 112: Active surface 114: Back surface 116: Adhesive layer 120: Light-emitting element 122: Light-emitting surface 130: Light-transmitting layer 140: Lens 150: Encapsulant 160: Wire 170 : Transparent substrate 180: Adhesive layer 190: Passive element 200: Protective cover
圖1是本發明一實施例的指紋辨識晶片封裝結構的俯視示意圖。 圖2是圖1的指紋辨識晶片封裝結構沿Ⅰ-Ⅰ’剖線的剖面示意圖。 圖3是圖1的指紋辨識晶片封裝結構沿Ⅱ-Ⅱ’剖線的剖面示意圖。FIG. 1 is a schematic top view of a fingerprint identification chip package structure according to an embodiment of the present invention. FIG. 2 is a schematic cross-sectional view of the fingerprint recognition chip package structure of FIG. 1 taken along the line I-I '. FIG. 3 is a schematic cross-sectional view of the fingerprint recognition chip package structure of FIG. 1 taken along the line II-II '.
Claims (9)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW107107779A TWI673801B (en) | 2018-03-07 | 2018-03-07 | Fingerprint identification chip package structure |
| CN201810714944.3A CN110246833B (en) | 2018-03-07 | 2018-07-03 | Fingerprint identification chip packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW107107779A TWI673801B (en) | 2018-03-07 | 2018-03-07 | Fingerprint identification chip package structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201939619A TW201939619A (en) | 2019-10-01 |
| TWI673801B true TWI673801B (en) | 2019-10-01 |
Family
ID=67882899
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW107107779A TWI673801B (en) | 2018-03-07 | 2018-03-07 | Fingerprint identification chip package structure |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN110246833B (en) |
| TW (1) | TWI673801B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201310353A (en) * | 2011-08-24 | 2013-03-01 | Gingy Technology Inc | Fingerprint touch panel |
| TW201714257A (en) * | 2015-10-15 | 2017-04-16 | 力成科技股份有限公司 | Chip package having protection piece compliantly attached on chip sensor surface |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6774471B2 (en) * | 2002-04-30 | 2004-08-10 | Intel Corporation | Protected bond fingers |
| JP2007202588A (en) * | 2006-01-30 | 2007-08-16 | Mitsubishi Electric Corp | Fingerprint verification system |
| US20080239285A1 (en) * | 2007-03-30 | 2008-10-02 | Chuan Liang Industrial Co., Ltd. | Fingerprint identification system |
| KR100908753B1 (en) * | 2007-05-11 | 2009-07-22 | 앰코 테크놀로지 코리아 주식회사 | Semiconductor package |
| US8582837B2 (en) * | 2007-12-31 | 2013-11-12 | Authentec, Inc. | Pseudo-translucent integrated circuit package |
| JP2011022860A (en) * | 2009-07-16 | 2011-02-03 | Sony Corp | Biometric authentication apparatus |
| CN204946030U (en) * | 2015-06-23 | 2016-01-06 | 天津市卓扬世纪科技发展有限公司 | A kind of Novel connecting triggers the fingerprint induction installation that optical sensor directly contacts |
-
2018
- 2018-03-07 TW TW107107779A patent/TWI673801B/en active
- 2018-07-03 CN CN201810714944.3A patent/CN110246833B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201310353A (en) * | 2011-08-24 | 2013-03-01 | Gingy Technology Inc | Fingerprint touch panel |
| TW201714257A (en) * | 2015-10-15 | 2017-04-16 | 力成科技股份有限公司 | Chip package having protection piece compliantly attached on chip sensor surface |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201939619A (en) | 2019-10-01 |
| CN110246833B (en) | 2021-04-06 |
| CN110246833A (en) | 2019-09-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US10235555B2 (en) | Optical fingerprint recognition sensor package | |
| US20140042305A1 (en) | Optical package module | |
| US10061962B2 (en) | Fingerprint identification module and manufacturing method thereof | |
| US20160150133A1 (en) | Electronic device module having an imaging unit | |
| US9978673B2 (en) | Package structure and method for fabricating the same | |
| WO2018227399A1 (en) | Optical biological recognition module, display device, and electronic equipment | |
| US20170243045A1 (en) | Fingerprint identification module and manufacturing method thereof | |
| US11688750B2 (en) | Modular fingerprint recognition package having reduced size | |
| US11308730B2 (en) | Display device | |
| US8593560B2 (en) | Image-capturing module for simplifying optical component | |
| US10060789B2 (en) | Electronic device with high electrostatic protection | |
| TWI673801B (en) | Fingerprint identification chip package structure | |
| CN105205483B (en) | Fingerprint sensing device | |
| US20110057130A1 (en) | Flip-chip type image-capturing module | |
| KR20180016245A (en) | Fingerprint sensor package and fingerprint sensor module comprising the same | |
| US10734435B2 (en) | Image capturing module and manufacturing method thereof | |
| WO2017084003A1 (en) | Fingerprint system and mobile phone | |
| KR101872755B1 (en) | Optical sensor package | |
| CN210983440U (en) | Image capturing device and electronic device using same | |
| KR20200014017A (en) | Underglas fingerprint sensor package using flexible substrate and method of manufacturing the same | |
| US20180300524A1 (en) | Image capturing module and manufacturing method thereof | |
| TWM504287U (en) | Touch panel with fingerprint identification function | |
| US9578733B2 (en) | Esd protection of electronic device | |
| KR20190105249A (en) | Optical sensor package and method of manufacturing thereof | |
| TWI653725B (en) | Fingerprint identification package structure |