TWI673731B - Method of preparing conductive magnetic composite sheet and antenna device - Google Patents

Method of preparing conductive magnetic composite sheet and antenna device Download PDF

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TWI673731B
TWI673731B TW106117922A TW106117922A TWI673731B TW I673731 B TWI673731 B TW I673731B TW 106117922 A TW106117922 A TW 106117922A TW 106117922 A TW106117922 A TW 106117922A TW I673731 B TWI673731 B TW I673731B
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magnetic sheet
magnetic
conductive foil
sheet
conductive
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TW201802837A (en
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金泰慶
朴鐘輝
金鎮哲
文賢坤
崔種鶴
金奈映
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南韓商Skc股份有限公司
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/12Supports; Mounting means
    • H01Q1/22Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2291Supports; Mounting means by structural association with other equipment or articles used in bluetooth or WI-FI devices of Wireless Local Area Networks [WLAN]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F1/00Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
    • H01F1/01Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
    • H01F1/03Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
    • H01F1/12Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
    • H01F1/14Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
    • H01F1/147Alloys characterised by their composition
    • H01F1/14766Fe-Si based alloys
    • H01F1/14775Fe-Si based alloys in the form of sheets
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F1/00Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
    • H01F1/01Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
    • H01F1/03Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
    • H01F1/12Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
    • H01F1/14Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
    • H01F1/20Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Electromagnetism (AREA)
  • Physics & Mathematics (AREA)
  • Soft Magnetic Materials (AREA)
  • Laminated Bodies (AREA)
  • Details Of Aerials (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Coils Or Transformers For Communication (AREA)
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  • Pressure Welding/Diffusion-Bonding (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)

Abstract

根據一種製造傳導性磁性複合片之方法,該方法包含製造包含磁粉及黏合劑樹脂之磁性片;堆疊該磁性片及第一傳導性箔;以及將熱及壓力施加至該獲得的堆疊以黏合該磁性片及該第一傳導性箔,可製造具有該磁性片與該傳導性箔之間的極好的層間黏著,同時在NFC、WPC及MST頻率下具有極好的磁性性質的傳導性磁性複合片。According to a method of manufacturing a conductive magnetic composite sheet, the method includes manufacturing a magnetic sheet including magnetic powder and a binder resin; stacking the magnetic sheet and a first conductive foil; and applying heat and pressure to the obtained stack to bond the stack The magnetic sheet and the first conductive foil can be used to produce a conductive magnetic composite having excellent interlayer adhesion between the magnetic sheet and the conductive foil, and having excellent magnetic properties at NFC, WPC, and MST frequencies sheet.

Description

製造傳導性磁性複合片及天線裝置之方法Method for manufacturing conductive magnetic composite sheet and antenna device

發明領域 實施例係關於製造可使用於諸如近場通訊、無線電力充電及磁性保全傳輸之領域中的傳導性磁性複合片之方法、及製造天線裝置之方法。FIELD OF THE INVENTION Embodiments relate to a method of manufacturing a conductive magnetic composite sheet that can be used in fields such as near field communication, wireless power charging, and magnetic security transmission, and a method of manufacturing an antenna device.

發明背景 最近,用於實現諸如近場通訊(NFC)、無線電力充電(WPC)及磁性保全傳輸(MST)之功能的天線正安裝於諸如行動電話、平板PC及筆記型PC之行動裝置中。然而,其他金屬部分存在於此類行動裝置中,且當形成於裝置中的交變磁場施加至此類金屬部分時渦流發生,此狀況導致天線效能之降級及辨識距離之減少。BACKGROUND OF THE INVENTION Recently, antennas for implementing functions such as near field communication (NFC), wireless power charging (WPC), and magnetic security transmission (MST) are being installed in mobile devices such as mobile phones, tablet PCs, and notebook PCs. However, other metal parts exist in such mobile devices, and eddy currents occur when an alternating magnetic field formed in the device is applied to such metal parts, which results in degradation of antenna performance and reduction in recognition distance.

按照慣例,為解決以上問題,藉由將高導磁率肥粒鐵片附接至諸如聚醯亞胺基板之典型電路板(天線)之一側來生產具有多個用途之天線裝置,該典型電路板具有形成於其另一側上的天線圖案層。此使用以下原理:諸如肥粒鐵片之磁性體使天線之磁通量聚焦,使得可防止磁場穿透至金屬表面中及渦流之產生且可改良操作特性。Conventionally, in order to solve the above problems, an antenna device having multiple uses is produced by attaching a high-permeability fertilizer iron sheet to one side of a typical circuit board (antenna) such as a polyimide substrate, which is a typical circuit The board has an antenna pattern layer formed on the other side thereof. This uses the following principle: a magnetic body, such as a fat iron sheet, focuses the magnetic flux of the antenna, prevents the penetration of magnetic fields into the metal surface and the generation of eddy currents, and improves the operating characteristics.

發明概要 技術問題 然而,在此狀況下,亦即,當磁性片所黏合至的電路板作為天線裝置安裝於行動裝置中時,行動裝置之不可避免地受各種部分之裝配限制的內部空間之效率變得降低。另外,由於電路板與磁性片之間的薄弱黏著性,脫層可發生。SUMMARY OF THE INVENTION Technical Problem However, in this situation, that is, when the circuit board to which the magnetic sheet is adhered is installed as an antenna device in a mobile device, the efficiency of the internal space of the mobile device inevitably limited by the assembly of various parts Becomes lower. In addition, delamination may occur due to the weak adhesion between the circuit board and the magnetic sheet.

因此,已試圖藉由使用磁性片作為基板以使傳導性箔疊層於該基板上及隨後藉由蝕刻形成天線圖案來製造天線裝置。然而,對於此試圖之達成,強力的層間黏著必須為緊固的,使得脫層在經執行以用於天線裝置之製造或該天線裝置至產品之施加的諸如迴焊或軟焊製程之高溫熱處置期間不發生。Therefore, an attempt has been made to manufacture an antenna device by using a magnetic sheet as a substrate so that a conductive foil is laminated on the substrate and then forming an antenna pattern by etching. However, for this attempt to be achieved, strong interlayer adhesion must be fastened so that delamination is performed at high temperatures such as reflow or soldering processes performed for the manufacture of the antenna device or the application of the antenna device to the product It does not occur during thermal treatment.

因此,實施例之一目標將提供製造具有極好的層間黏著以及磁性性質的傳導性磁性複合片之方法,該傳導性磁性複合片可用於諸如近場通訊(NFC)、無線電力充電(WPC)及磁性保全傳輸(MST)的多個應用。另外,實施例之另一目標將提供使用傳導性磁性複合片製造天線裝置之方法。 問題解決方案Therefore, one object of the embodiments is to provide a method for manufacturing a conductive magnetic composite sheet having excellent interlayer adhesion and magnetic properties. The conductive magnetic composite sheet can be used for applications such as near field communication (NFC) and wireless power charging (WPC). And multiple applications of magnetic security transmission (MST). In addition, another object of the embodiment is to provide a method for manufacturing an antenna device using a conductive magnetic composite sheet. Problem solution

根據一實施例,提供一種製造傳導性磁性複合片之方法,該方法包含製造包含磁粉及黏合劑樹脂之磁性片;堆疊該磁性片及第一傳導性箔;以及將熱及壓力施加至該獲得的堆疊以將該磁性片及該第一傳導性箔黏合在一起。According to an embodiment, there is provided a method of manufacturing a conductive magnetic composite sheet, the method including manufacturing a magnetic sheet including a magnetic powder and a binder resin; stacking the magnetic sheet and a first conductive foil; and applying heat and pressure to the obtained To stack the magnetic sheet and the first conductive foil together.

在實施例中,該黏合劑樹脂可為熱固性樹脂,且該黏合劑樹脂可在於將熱及壓力施加至該堆疊之該步驟中固化時將該磁性片黏合至該第一傳導性箔。In an embodiment, the adhesive resin may be a thermosetting resin, and the adhesive resin may adhere the magnetic sheet to the first conductive foil when curing in the step of applying heat and pressure to the stack.

另外,在實施例中,該第一傳導性箔可具有形成於其一側上的第一底漆層,且該磁性片及該第一傳導性箔可經堆疊,使得該磁性片之一側處於與該第一傳導性箔之該第一底漆層接觸。In addition, in an embodiment, the first conductive foil may have a first primer layer formed on one side thereof, and the magnetic sheet and the first conductive foil may be stacked such that one side of the magnetic sheet In contact with the first primer layer of the first conductive foil.

根據另一實施例,提供一種製造傳導性磁性複合片之方法,該方法包含製造包含磁粉及黏合劑樹脂之磁性片;堆疊第一傳導性箔、該磁性片及第二傳導性箔;以及將熱及壓力施加至該獲得的堆疊以將該第一傳導性箔、該磁性片及該第二傳導性箔黏合在一起。According to another embodiment, a method for manufacturing a conductive magnetic composite sheet is provided. The method includes manufacturing a magnetic sheet including magnetic powder and an adhesive resin; stacking a first conductive foil, the magnetic sheet, and a second conductive foil; and Heat and pressure are applied to the obtained stack to adhere the first conductive foil, the magnetic sheet, and the second conductive foil together.

根據另一實施例,提供一種製造天線裝置之方法,該方法包含製造包含磁粉及黏合劑樹脂之磁性片;堆疊該磁性片及第一傳導性箔;將熱及壓力施加至該獲得的堆疊以黏合該磁性片及該第一傳導性箔;以及蝕刻該第一傳導性箔以在該第一傳導性箔中形成天線圖案。 本發明之有利效應According to another embodiment, a method of manufacturing an antenna device is provided. The method includes manufacturing a magnetic sheet including magnetic powder and an adhesive resin; stacking the magnetic sheet and a first conductive foil; applying heat and pressure to the obtained stack to Bonding the magnetic sheet and the first conductive foil; and etching the first conductive foil to form an antenna pattern in the first conductive foil. Advantageous effects of the invention

根據實施例,可製造具有磁性片與傳導性箔之間的極好的層間黏著,同時在NFC、WPC、及MST頻率下具有極好的磁性性質的傳導性磁性複合片。特定而言,根據實施例製造的傳導性磁性複合片之層間脫層甚至在惡劣環境條件,例如用於該傳導性磁性複合片至產品之施加的高溫熱處置下可不發生。According to the embodiment, a conductive magnetic composite sheet having excellent interlayer adhesion between a magnetic sheet and a conductive foil and having excellent magnetic properties at NFC, WPC, and MST frequencies can be manufactured. In particular, interlayer delamination of the conductive magnetic composite sheet manufactured according to the embodiment may not occur even under severe environmental conditions, such as high-temperature heat treatment applied to the conductive magnetic composite sheet to a product.

根據一特定實施例,因為包含半固化或未固化熱固性樹脂之磁性片與傳導性箔堆疊且熱固性樹脂藉由熱及壓力固化,所以磁性片及傳導性箔可甚至在無分離黏著劑層的情況下以極好的黏著強度積層。因此,因為不需要藉由塗佈黏著劑及乾燥黏著劑塗層形成黏著劑層之製程,所以可改良製程效率及經濟效率。另外,總厚度可由於黏著劑層之缺失而減少且可防止歸因於黏著劑層的磁性性質之退化。According to a specific embodiment, because a magnetic sheet containing a semi-cured or uncured thermosetting resin is stacked with a conductive foil and the thermosetting resin is cured by heat and pressure, the magnetic sheet and the conductive foil can be used without a separate adhesive layer. It is laminated with excellent adhesive strength. Therefore, since the process of forming the adhesive layer by applying the adhesive and drying the adhesive coating is not required, the process efficiency and economic efficiency can be improved. In addition, the total thickness can be reduced due to the absence of the adhesive layer and degradation of magnetic properties due to the adhesive layer can be prevented.

另外,根據另一特定實施例,形成於傳導性箔之一側上的底漆層在與磁性片積層期間藉由熱及壓力固化,此舉可增強傳導性箔與磁性片之間的黏合強度。因此,脫層在執行來用於天線裝置之製造或該天線裝置至產品之施加的諸如迴焊或軟焊製程之高溫熱處置期間不發生。此外,固化底漆層可藉由亦充當磁性片之保護層防止可在各種外部環境中之磁性片中之磁粉中發生的生銹或變形,且亦可在保護磁性片免受在用於天線裝置之製造之圖案化中使用的蝕刻劑影響中起作用。In addition, according to another specific embodiment, the primer layer formed on one side of the conductive foil is cured by heat and pressure during lamination with the magnetic sheet, which can enhance the adhesion strength between the conductive foil and the magnetic sheet. . Therefore, delamination does not occur during high-temperature thermal processing such as reflow or soldering processes performed for the manufacture of the antenna device or the application of the antenna device to the product. In addition, the cured primer layer can prevent rust or deformation from occurring in the magnetic powder in the magnetic sheet in various external environments by also serving as a protective layer of the magnetic sheet, and can also protect the magnetic sheet from being used in an antenna. The etchant used in the patterning of the device plays a role.

此外,磁性片可不僅具有如基於聚合物之片的極好的可撓性,而且亦可含有大量磁粉以具有極好的磁性性質。In addition, the magnetic sheet may not only have excellent flexibility such as a polymer-based sheet, but also may contain a large amount of magnetic powder to have excellent magnetic properties.

因此,藉由根據實施例之方法製造的傳導性磁性複合片及天線裝置可適合於NFC、WPC、及MST。Therefore, the conductive magnetic composite sheet and the antenna device manufactured by the method according to the embodiment can be suitable for NFC, WPC, and MST.

較佳實施例之詳細說明 根據一實施例,提供一種製造傳導性磁性複合片之方法,該方法包含:製造包含磁粉及黏合劑樹脂之磁性片;堆疊該磁性片及第一傳導性箔;以及將熱及壓力施加至該獲得的堆疊以將該磁性片及該第一傳導性箔黏合在一起。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS According to an embodiment, a method for manufacturing a conductive magnetic composite sheet is provided. The method includes: manufacturing a magnetic sheet including magnetic powder and an adhesive resin; stacking the magnetic sheet and a first conductive foil; and Heat and pressure were applied to the obtained stack to adhere the magnetic sheet and the first conductive foil together.

在此實施例中,將熱及壓力施加至堆疊之步驟可在5 MPa至30 MPa之壓力及150℃至200℃之溫度下執行。In this embodiment, the steps of applying heat and pressure to the stack may be performed at a pressure of 5 MPa to 30 MPa and a temperature of 150 ° C to 200 ° C.

此外,堆疊步驟及將熱及壓力施加至堆疊之步驟可藉由輥對輥製程執行,該輥對輥製程藉由使用2至10對輥在150℃至200℃之輥溫度、5 MPa至30 MPa之輥壓力、及1 m/min至5 m/min之速度下執行。In addition, the stacking step and the step of applying heat and pressure to the stack can be performed by a roll-to-roll process which uses 2 to 10 pairs of rolls at a roll temperature of 150 ° C to 200 ° C, 5 MPa to 30 It is performed at a roll pressure of MPa and a speed of 1 m / min to 5 m / min.

此外,磁性片可為具有可撓性的具有10 μm至3,000 μm之厚度的未燒結片。In addition, the magnetic sheet may be an unsintered sheet having flexibility and a thickness of 10 μm to 3,000 μm.

此外,磁性片可基於磁性片之總重量包括70重量%至90重量%的磁粉,及6重量%至12重量%的基於聚胺基甲酸酯之樹脂、0.5重量%至2重量%的基於異氰酸酯之硬化劑、及0.3重量%至1.5重量%的基於環氧基之樹脂,作為黏合劑樹脂。In addition, the magnetic sheet may include 70% to 90% by weight of magnetic powder based on the total weight of the magnetic sheet, and 6% to 12% by weight of a polyurethane-based resin, and 0.5% to 2% by weight of a magnetic powder. Isocyanate hardeners, and 0.3 to 1.5% by weight of epoxy-based resins are used as binder resins.

此外,磁性片可具有基於具有3 MHz之頻率之交流電的100至300之磁導率、基於具有6.78 MHz之頻率的交流電的80至270之磁導率、及基於具有13.56 MHz之頻率的交流電的60至250之磁導率。In addition, the magnetic sheet may have a magnetic permeability of 100 to 300 based on an alternating current having a frequency of 3 MHz, a magnetic permeability of 80 to 270 based on an alternating current having a frequency of 6.78 MHz, and a magnetic permeability based on an alternating current having a frequency of 13.56 MHz. Permeability of 60 to 250.

此外,傳導性磁性複合片可具有在經受兩次熱處置時的介於磁性片與第一傳導性箔之間的0.6 kgf/cm或更大之剝離強度,該熱處置由以恆定速率自30℃加熱至240℃持續200秒及隨後以恆定速率自240℃冷卻至130℃持續100秒組成。In addition, the conductive magnetic composite sheet may have a peel strength of 0.6 kgf / cm or more between the magnetic sheet and the first conductive foil when subjected to two thermal treatments, which are performed at a constant rate from 30 The composition was heated to 240 ° C for 200 seconds and then cooled from 240 ° C to 130 ° C for 100 seconds at a constant rate.

此外,黏合劑樹脂可為熱固性樹脂,且黏合劑樹脂在將熱及壓力施加至堆疊之步驟中固化時可將磁性片黏合至第一傳導性箔。In addition, the adhesive resin may be a thermosetting resin, and the adhesive resin may adhere the magnetic sheet to the first conductive foil when the adhesive resin is cured in a step of applying heat and pressure to the stack.

在此狀況下,傳導性磁性複合片可具有在經受兩次熱處置時的介於磁性片與第一傳導性箔之間的0.6 kgf/cm或更大之剝離強度,該熱處置由以恆定速率自30℃加熱至240℃持續200秒及隨後以恆定速率自240℃冷卻至130℃持續100秒組成,其中該磁性片可為具有可撓性的具有10 μm至3,000 μm之厚度的未燒結片,且該磁性片可具有基於具有3 MHz之頻率之交流電的100至300之磁導率;基於具有6.78 MHz之頻率之交流電的80至270之磁導率;基於具有13.56 MHz之頻率之交流電的60至250之磁導率;在經受兩次熱處置時的5%或更少之厚度改變及5%或更少之磁導率改變,該熱處置由以恆定速率自30℃加熱至240℃持續200秒及隨後以恆定速率自240℃冷卻至130℃持續100秒組成;在浸入2 N鹽酸溶液中30分鐘時的5%或更少之厚度改變及5%或更少之磁導率改變;以及在浸入2 N氫氧化鈉溶液中30分鐘時的5%或更少之厚度改變及5%或更少之磁導率改變。In this case, the conductive magnetic composite sheet may have a peeling strength of 0.6 kgf / cm or more between the magnetic sheet and the first conductive foil when subjected to two thermal treatments, the thermal treatment being performed by a constant The composition is heated at a rate from 30 ° C to 240 ° C for 200 seconds, and then cooled at a constant rate from 240 ° C to 130 ° C for 100 seconds, wherein the magnetic sheet may be unsintered having a thickness of 10 μm to 3,000 μm with flexibility. And the magnetic sheet may have a permeability of 100 to 300 based on an alternating current having a frequency of 3 MHz; a permeability of 80 to 270 based on an alternating current having a frequency of 6.78 MHz; based on an alternating current having a frequency of 13.56 MHz A magnetic permeability of 60 to 250; a change of 5% or less in thickness and a permeability change of 5% or less when subjected to two thermal treatments, the thermal treatment being heated from 30 ° C to 240 at a constant rate ℃ for 200 seconds and then cooled at a constant rate from 240 ℃ to 130 ℃ for 100 seconds; 5% or less thickness change and 5% or less magnetic permeability when immersed in 2 N hydrochloric acid solution for 30 minutes Changes; and 5% or 30% immersion in 2 N sodium hydroxide solution And less change in thickness of 5% or less of the permeability change.

此外,第一傳導性箔可具有形成於其一側上的第一底漆層,且磁性片及第一傳導性箔可經堆疊,使得磁性片之一側處於與第一傳導性箔之第一底漆層接觸。In addition, the first conductive foil may have a first primer layer formed on one side thereof, and the magnetic sheet and the first conductive foil may be stacked such that one side of the magnetic sheet is in the first position with the first conductive foil. A primer layer is in contact.

在此狀況下,第一底漆層可包含熱固性樹脂,且第一底漆層中之熱固性樹脂可在將熱及壓力施加至堆疊之步驟中固化。In this case, the first primer layer may include a thermosetting resin, and the thermosetting resin in the first primer layer may be cured in a step of applying heat and pressure to the stack.

另外,熱固性樹脂可包含雙酚A型環氧樹脂、甲酚酚醛型環氧樹脂、或肆(縮水甘油基氧基苯基)乙烷型環氧樹脂。In addition, the thermosetting resin may include a bisphenol A type epoxy resin, a cresol novolac type epoxy resin, or a (glycidyloxyphenyl) ethane type epoxy resin.

此外,第一底漆層可具有0.01 μm至1 μm之厚度。In addition, the first primer layer may have a thickness of 0.01 μm to 1 μm.

根據另一實施例,提供一種製造傳導性磁性複合片之方法,該方法包含製造包含磁粉及黏合劑樹脂之磁性片;堆疊第一傳導性箔、該磁性片及第二傳導性箔;以及將熱及壓力施加至該獲得的堆疊以將該第一傳導性箔、該磁性片及該第二傳導性箔黏合在一起。According to another embodiment, a method for manufacturing a conductive magnetic composite sheet is provided. The method includes manufacturing a magnetic sheet including magnetic powder and an adhesive resin; stacking a first conductive foil, the magnetic sheet, and a second conductive foil; and Heat and pressure are applied to the obtained stack to adhere the first conductive foil, the magnetic sheet, and the second conductive foil together.

在此實施例中,黏合劑樹脂可為熱固性樹脂,且黏合劑樹脂在將熱及壓力施加至堆疊之步驟中固化時可將磁性片黏合至第一傳導性箔。In this embodiment, the adhesive resin may be a thermosetting resin, and the magnetic resin sheet may be adhered to the first conductive foil when the adhesive resin is cured in a step of applying heat and pressure to the stack.

此外,第一傳導性箔可具有形成於其一側上的第一底漆層,第二傳導性箔可具有形成其一側上的第二底漆層,磁性片及第一傳導性箔可經堆疊,使得磁性片之一側處於與第一傳導性箔之第一底漆層接觸,磁性片及第二傳導性箔可經堆疊,使得磁性片之另一側處於與第二傳導性箔之第二底漆層接觸,第一底漆層及第二底漆層可包含熱固性樹脂,且第一底漆層及第二底漆層中之熱固性樹脂可在將熱及壓力施加至堆疊之步驟中固化。In addition, the first conductive foil may have a first primer layer formed on one side thereof, the second conductive foil may have a second primer layer formed on one side thereof, and the magnetic sheet and the first conductive foil may After being stacked, one side of the magnetic sheet is in contact with the first primer layer of the first conductive foil, and the magnetic sheet and the second conductive foil may be stacked so that the other side of the magnetic sheet is in contact with the second conductive foil. The second primer layer is in contact, the first primer layer and the second primer layer may include a thermosetting resin, and the thermosetting resin in the first primer layer and the second primer layer may apply heat and pressure to the stack. Cured in steps.

根據另一實施例,提供一種製造天線裝置之方法,該方法包含製造包含磁粉及黏合劑樹脂之磁性片;堆疊該磁性片及第一傳導性箔;將熱及壓力施加至該獲得的堆疊以黏合該磁性片及該第一傳導性箔;以及蝕刻該第一傳導性箔以在該第一傳導性箔中形成天線圖案。According to another embodiment, a method of manufacturing an antenna device is provided. The method includes manufacturing a magnetic sheet including magnetic powder and an adhesive resin; stacking the magnetic sheet and a first conductive foil; applying heat and pressure to the obtained stack to Bonding the magnetic sheet and the first conductive foil; and etching the first conductive foil to form an antenna pattern in the first conductive foil.

在此實施例中,黏合劑樹脂可為熱固性樹脂,且黏合劑樹脂在將熱及壓力施加至堆疊之步驟中固化時可黏合磁性片及第一傳導性箔。In this embodiment, the adhesive resin may be a thermosetting resin, and the adhesive resin may adhere the magnetic sheet and the first conductive foil when the adhesive resin is cured in a step of applying heat and pressure to the stack.

此外,第一傳導性箔可具有形成於其一側上的第一底漆層,磁性片及第一傳導性箔可經堆疊,使得磁性片之一側處於與第一傳導性箔之第一底漆層接觸,第一底漆層可包含熱固性樹脂,且第一底漆層中之熱固性樹脂可在將熱及壓力施加至堆疊之步驟中固化。In addition, the first conductive foil may have a first primer layer formed on one side thereof, and the magnetic sheet and the first conductive foil may be stacked such that one side of the magnetic sheet is in first contact with the first conductive foil. The primer layer is in contact. The first primer layer may include a thermosetting resin, and the thermosetting resin in the first primer layer may be cured in a step of applying heat and pressure to the stack.

此外,磁性片可為具有可撓性的具有10 μm至3,000 μm之厚度的未燒結片,且磁性片可具有基於具有3 MHz之頻率之交流電的100至300之磁導率;基於具有6.78 MHz之頻率之交流電的80至270之磁導率;基於具有13.56 MHz之頻率之交流電的60至250之磁導率;在經受兩次熱處置時的5%或更少之厚度改變及5%或更少之磁導率改變,該熱處置由以恆定速率自30℃加熱至240℃持續200秒及隨後以恆定速率自240℃冷卻至130℃持續100秒組成;在浸入2 N鹽酸溶液中30分鐘時的5%或更少之厚度改變及5%或更少之磁導率改變;以及在浸入2 N氫氧化鈉溶液中30分鐘時的5%或更少之厚度改變及5%或更少之磁導率改變。In addition, the magnetic sheet may be an unsintered sheet having flexibility with a thickness of 10 μm to 3,000 μm, and the magnetic sheet may have a magnetic permeability of 100 to 300 based on AC power having a frequency of 3 MHz; based on having 6.78 MHz Permeability of AC to 80 to 270 frequency; 60 to 250 permeability based on AC with frequency of 13.56 MHz; 5% or less thickness change and 5% or less when subjected to two thermal treatments With less change in magnetic permeability, the thermal treatment consists of heating at a constant rate from 30 ° C to 240 ° C for 200 seconds and then cooling at a constant rate from 240 ° C to 130 ° C for 100 seconds; immersed in 2 N hydrochloric acid solution 30 5% or less thickness change at 5 minutes and 5% or less change in magnetic permeability; and 5% or less thickness change and 5% or less when immersed in 2 N sodium hydroxide solution for 30 minutes Less magnetic permeability changes.

在實施例之以下描述中,將理解,當層、箔或片稱為在另一層、箔或片「上」或「下方」時,「在……上」及「在……下方」之術語學包括「直接地」及「間接地」之兩個意義。此外,將基於圖式進行關於在每一元件上及在每一元件下方之參考。在圖式中,每一元件之大小或間隔可經誇示以用於較好的理解,且熟習此項技術者明白的內容可未經例示。In the following description of the embodiments, it will be understood that when a layer, foil or sheet is referred to as being "on" or "under" another layer, foil or sheet, the terms "on" and "under" Learning includes the two meanings of "directly" and "indirectly". In addition, references to each element and below each element will be made based on the drawings. In the drawings, the size or interval of each element may be exaggerated for better understanding, and the content understood by those skilled in the art may not be illustrated.

圖1為根據一實施例之磁性片的橫截面圖。FIG. 1 is a cross-sectional view of a magnetic sheet according to an embodiment.

磁性片100包含磁粉110及黏合劑樹脂120。The magnetic sheet 100 includes a magnetic powder 110 and a binder resin 120.

亦即,磁性片100可為聚合磁性片(PMS)。特定而言,磁性片100可為含有磁粉110及黏合劑樹脂120的未燒結固化片。另外,磁性片100可為可撓性磁性片。That is, the magnetic sheet 100 may be a polymerized magnetic sheet (PMS). Specifically, the magnetic sheet 100 may be an unsintered cured sheet containing the magnetic powder 110 and the binder resin 120. In addition, the magnetic sheet 100 may be a flexible magnetic sheet.

磁性片100含有磁粉110。The magnetic sheet 100 contains a magnetic powder 110.

磁粉可為氧化物磁粉諸如肥粒鐵(Ni-Zn基肥粒鐵、Mg-Zn基肥粒鐵、或Mn-Zn基肥粒鐵);金屬磁粉諸如高導磁合金、鋁矽鐵粉、Fe-Si-Cr合金、及Fe-Si奈米結晶;或上述各者之混合粉。例如,磁粉可為具有Fe-Si-Al合金組成的鋁矽鐵粉。The magnetic powder may be an oxide magnetic powder such as ferrous iron (Ni-Zn based ferrous iron, Mg-Zn based ferrous iron, or Mn-Zn based ferrous iron); a metal magnetic powder such as a high magnetic permeability alloy, an alumino-silicon iron powder, Fe-Si -Cr alloy, and Fe-Si nanocrystals; or mixed powders of each of the above. For example, the magnetic powder may be an alumino-silicon iron powder having a Fe-Si-Al alloy composition.

作為一特定實例,磁粉可具有以下式1之組成。 [式1] Fe1-a-b-c Sia Xb Yc 在式1中, X為鋁(Al)、鉻(Cr)、鎳(Ni)、銅(Cu)或上述各者之組合; Y為錳(Mn)、硼(B)、鈷(Co)、鉬(Mo)或上述各者之組合;且 0.01 ≤ a ≤ 0.2,0.01 ≤ b ≤ 0.1且0 ≤ c ≤ 0.05。As a specific example, the magnetic powder may have a composition of Formula 1 below. [Formula 1] Fe 1-abc Si a X b Y c In Formula 1, X is aluminum (Al), chromium (Cr), nickel (Ni), copper (Cu), or a combination thereof; Y is manganese (Mn), boron (B), cobalt (Co), molybdenum (Mo), or a combination thereof; and 0.01 ≤ a ≤ 0.2, 0.01 ≤ b ≤ 0.1, and 0 ≤ c ≤ 0.05.

磁粉之粒子直徑在約3 nm至約1 mm之範圍內。例如,磁粉之粒子直徑可在約1 μm至約300 μm、約1 μm至約50 μm、或約1 μm至約10 μm之範圍內。當磁粉之平均粒子直徑在以上較佳範圍內時,可達成充分的磁性性質且可在於磁性片中形成通路時防止短路。The particle diameter of the magnetic powder is in a range of about 3 nm to about 1 mm. For example, the particle diameter of the magnetic powder may be in a range of about 1 μm to about 300 μm, about 1 μm to about 50 μm, or about 1 μm to about 10 μm. When the average particle diameter of the magnetic powder is within the above preferred range, sufficient magnetic properties can be achieved and short circuits can be prevented when a path is formed in the magnetic sheet.

磁粉可以功能材料塗佈。例如,磁粉之單獨粒子之表面可經耐蝕塗佈或絕緣塗佈。Magnetic powder can be coated with functional materials. For example, the surface of the individual particles of the magnetic powder may be corrosion-resistant or insulatingly coated.

例如,磁粉可以有機材料塗佈,且可尤其以具有耐蝕性質及/或絕緣性質的聚合物塗佈。For example, the magnetic powder may be coated with an organic material, and may be coated with, in particular, a polymer having corrosion resistance and / or insulation properties.

因此,磁粉之單獨粒子可由磁心及包圍磁心之表面的外殼組成。在此狀況下,磁心可含有氧化物磁性材料諸如肥粒鐵;金屬磁性材料諸如高導磁合金、鋁矽鐵粉、Fe-Si-Cr合金、及Fe-Si奈米結晶;或上述各者之混合組分。另外,外殼可含有具有耐蝕性質及/或絕緣性質的聚合物樹脂。外殼之厚度可在0.1 μm至20 μm、或1 μm至10 μm之範圍內。Therefore, the individual particles of the magnetic powder may be composed of the magnetic core and a shell surrounding the surface of the magnetic core. In this case, the magnetic core may contain an oxide magnetic material such as ferrous iron; a metal magnetic material such as a high magnetic permeability alloy, alumino-silicon iron powder, Fe-Si-Cr alloy, and Fe-Si nanocrystals; or each Of mixed components. In addition, the housing may contain a polymer resin having corrosion resistance and / or insulation properties. The thickness of the shell can be in the range of 0.1 μm to 20 μm, or 1 μm to 10 μm.

可固化樹脂可用作黏合劑樹脂120。特定而言,黏合劑樹脂可包含可光固化樹脂、熱固性樹脂及/或高耐熱熱塑性樹脂,且可較佳地包含熱固性樹脂。A curable resin may be used as the adhesive resin 120. In particular, the binder resin may include a photo-curable resin, a thermosetting resin, and / or a highly heat-resistant thermoplastic resin, and may preferably include a thermosetting resin.

作為可經固化以展現黏著性的樹脂,可使用包含以下各項之樹脂:至少一可熱固化官能基或部分,諸如縮水甘油基、異氰酸酯基、羥基、羧基或醯胺基;或至少一活性可能量固化官能基或部分,諸如環氧基、環醚基、硫化物基、縮醛基或內酯基。此官能基或部分例如可為異氰酸酯基(-NCO)、羥基(-OH)或羧基(-COOH)。As the resin that can be cured to exhibit adhesion, a resin including: at least one heat-curable functional group or part such as glycidyl group, isocyanate group, hydroxyl group, carboxyl group, or amido group; or at least one reactive It is possible to cure functional groups or moieties, such as epoxy, cyclic ether, sulfide, acetal or lactone. This functional group or part may be, for example, an isocyanate group (-NCO), a hydroxyl group (-OH), or a carboxyl group (-COOH).

特定而言,可固化樹脂之實例可為具有如以上所描述之至少一官能基或部分的聚胺基甲酸酯樹脂、丙烯酸樹脂、聚酯樹脂、異氰酸樹脂或環氧樹脂,但可固化樹脂不限於以上各者。In particular, examples of the curable resin may be a polyurethane resin, an acrylic resin, a polyester resin, an isocyanate resin, or an epoxy resin having at least one functional group or part as described above, but may be The cured resin is not limited to each of the above.

根據一實施例,黏合劑樹脂可包含基於聚胺基甲酸酯之樹脂、基於異氰酸酯之硬化劑或基於環氧基之樹脂。According to an embodiment, the binder resin may include a polyurethane-based resin, an isocyanate-based hardener, or an epoxy-based resin.

基於聚胺基甲酸酯之樹脂可包含藉由以下式2a及2b表示的重複單元。 [式2a] [式2b] 在式2a及2b中, R1 及R3 各自獨立地為C1-5 伸烷基、脲基、或醚基; R2 及R4 各自獨立地為C1-5 伸烷基;且 C1-5 伸烷基中每一個為未取代或經選自由以下各項組成之群組的至少一取代基取代:鹵素、氰基、胺基、及硝基。The polyurethane-based resin may include a repeating unit represented by the following formulae 2a and 2b. [Formula 2a] [Formula 2b] In Formulas 2a and 2b, R 1 and R 3 are each independently C 1-5 alkylene, ureido, or ether group; R 2 and R 4 are each independently C 1-5 alkylene; and C Each of the 1-5 alkylene groups is unsubstituted or substituted with at least one substituent selected from the group consisting of halogen, cyano, amine, and nitro.

基於聚胺基甲酸酯之樹脂可以1:10至10:1之莫耳比率包含藉由式2a表示的重複單元及藉由式2b表示的重複單元。The polyurethane-based resin may include a repeating unit represented by Formula 2a and a repeating unit represented by Formula 2b in a molar ratio of 1:10 to 10: 1.

基於聚胺基甲酸酯之樹脂可具有約500 g/mol至約50,000 g/mol、約10,000 g/mol至約50,000 g/mol、或約10,000 g/mol至約40,000 g/mol之數目平均分子量。 異氰酸酯基硬化劑可為有機二異氰酸酯。Polyurethane-based resins may have a number average of about 500 g / mol to about 50,000 g / mol, about 10,000 g / mol to about 50,000 g / mol, or about 10,000 g / mol to about 40,000 g / mol Molecular weight. The isocyanate-based hardener may be an organic diisocyanate.

例如,基於異氰酸酯之硬化劑可為芳族二異氰酸酯、脂族二異氰酸酯、脂環族二異氰酸酯、或上述各者之混合物。For example, the isocyanate-based hardener may be an aromatic diisocyanate, an aliphatic diisocyanate, an alicyclic diisocyanate, or a mixture thereof.

芳族二異氰酸酯例如可為具有一個至二個C6-20 芳基之二異氰酸酯,且特定而言可為1,5-萘二異氰酸酯、4,4’-二苯甲烷二異氰酸酯、4,4’-二苯基-二甲基甲烷二異氰酸酯、4,4’-苄基異氰酸酯、二烷基-二苯甲烷二異氰酸酯、四烷基-二苯甲烷二異氰酸酯、1,3-伸苯基二異氰酸酯、1,4-伸苯基二異氰酸酯、伸甲苯基二異氰酸酯、或二甲苯二異氰酸酯。The aromatic diisocyanate may be, for example, a diisocyanate having one to two C 6-20 aryl groups, and specifically may be 1,5-naphthalene diisocyanate, 4,4′-diphenylmethane diisocyanate, 4,4 '-Diphenyl-dimethylmethane diisocyanate, 4,4'-benzyl isocyanate, dialkyl-diphenylmethane diisocyanate, tetraalkyl-diphenylmethane diisocyanate, 1,3-phenylene diisocyanate Isocyanate, 1,4-phenylene diisocyanate, xylylene diisocyanate, or xylene diisocyanate.

脂環族二異氰酸酯例如可為具有一個至二個C6-20 環烷基之二異氰酸酯,且特定而言可為環己烷-1,4-二異氰酸酯、異佛爾酮二異氰酸酯、二環己基甲烷-4,4’-二異氰酸酯、1,3-雙(甲基異氰酸酯)環己烷、或甲基環己烷二異氰酸酯。The alicyclic diisocyanate may be, for example, a diisocyanate having one to two C 6-20 cycloalkyl groups, and specifically may be cyclohexane-1,4-diisocyanate, isophorone diisocyanate, bicyclic Hexylmethane-4,4'-diisocyanate, 1,3-bis (methyl isocyanate) cyclohexane, or methylcyclohexane diisocyanate.

較佳地,異氰酸酯基硬化劑可為脂環族二異氰酸酯,且尤其可為異佛爾酮二異氰酸酯。Preferably, the isocyanate-based hardener may be an alicyclic diisocyanate, and may particularly be isophorone diisocyanate.

基於環氧基之樹脂之實例可為雙酚型環氧樹脂諸如雙酚A型環氧樹脂、雙酚F型環氧樹脂、雙酚S型環氧樹脂、及四溴雙酚A型環氧樹脂;螺環型環氧樹脂;萘型環氧樹脂;聯苯型環氧樹脂;萜烯型環氧樹脂;縮水甘油醚型環氧樹脂諸如三(縮水甘油基氧基苯基)甲烷及肆(縮水甘油基氧基苯基)乙烷;縮水甘油胺型環氧樹脂諸如四縮水甘油基二胺基二苯基甲烷;酚醛型環氧樹脂諸如甲酚酚醛型環氧樹脂、苯酚酚醛型環氧樹脂、α-萘酚酚醛型環氧樹脂、及溴化苯酚酚醛型環氧樹脂。此等基於環氧基之樹脂可單獨或以其兩個或兩個以上之組合使用。Examples of epoxy-based resins may be bisphenol type epoxy resins such as bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, and tetrabromobisphenol A type epoxy resin. Resin; Spiral epoxy resin; Naphthalene epoxy resin; Biphenyl epoxy resin; Terpene epoxy resin; Glycidyl ether epoxy resin such as tris (glycidyloxyphenyl) methane (Glycidyloxyphenyl) ethane; glycidylamine type epoxy resins such as tetraglycidyldiaminediphenylmethane; phenolic epoxy resins such as cresol novolac epoxy resin, phenol novolac type ring Oxygen resin, α-naphthol novolac epoxy resin, and brominated phenol novolac epoxy resin. These epoxy-based resins may be used alone or in a combination of two or more thereof.

在此等樹脂中,考慮到黏著性及耐熱性,可使用雙酚A型環氧樹脂、甲酚酚醛型環氧樹脂、或肆(縮水甘油基氧基苯基)乙烷型環氧樹脂。Among these resins, a bisphenol A type epoxy resin, a cresol novolac type epoxy resin, or a (glycidyloxyphenyl) ethane type epoxy resin can be used in consideration of adhesion and heat resistance.

基於環氧基之樹脂可具有約80 g/eq至約1,000 g/eq、或約100 g/eq至約300 g/eq之環氧當量。另外,基於環氧基之樹脂可具有約10,000 g/mol至約50,000 g/mol之數目平均分子量。The epoxy-based resin may have an epoxy equivalent weight of about 80 g / eq to about 1,000 g / eq, or about 100 g / eq to about 300 g / eq. In addition, the epoxy-based resin may have a number average molecular weight of about 10,000 g / mol to about 50,000 g / mol.

此外,磁性片100可包含腐蝕抑制劑。腐蝕抑制劑之實例可為有機腐蝕抑制劑及無機腐蝕抑制劑。In addition, the magnetic sheet 100 may include a corrosion inhibitor. Examples of the corrosion inhibitor may be an organic corrosion inhibitor and an inorganic corrosion inhibitor.

有機腐蝕抑制劑之特定實例可為胺類、尿素、巰基苯并噻唑(MBT)、苯并三唑、甲苯基三唑、醛類、雜環氮化合物、含硫化合物、炔屬化合物、抗壞血酸、丁二酸、色胺、或咖啡因。Specific examples of the organic corrosion inhibitor may be amines, urea, mercaptobenzothiazole (MBT), benzotriazole, tolyltriazole, aldehydes, heterocyclic nitrogen compounds, sulfur compounds, acetylenic compounds, ascorbic acid, Succinic acid, tryptamine, or caffeine.

例如,腐蝕抑制劑可為N-苄基-N,N-雙[(3,5-二甲基-1H-吡唑-1-基)甲基]胺、4-(1-甲基-1-苯乙基)-N-[4-(1-甲基-1-苯乙基)苯基]苯胺、三(苯并咪唑-2-基甲基)胺、N-(2-糠基)-對甲苯胺、N-(5-氯-2-糠基)-對甲苯胺、N-(5-硝基-2-糠基)-對甲苯胺、N-(5-甲基-2-糠基)-對甲苯胺、N-(N-哌啶基甲基)-3-[(伸二氫吡啶基)胺基]靛紅、肆[乙烯-3-(3,5-二第三丁基-4-羥苯基)丙酸酯]甲烷、或上述各者之混合物。For example, the corrosion inhibitor may be N-benzyl-N, N-bis [(3,5-dimethyl-1H-pyrazol-1-yl) methyl] amine, 4- (1-methyl-1 -Phenethyl) -N- [4- (1-methyl-1-phenethyl) phenyl] aniline, tris (benzimidazol-2-ylmethyl) amine, N- (2-furyl) -P-toluidine, N- (5-chloro-2-furyl) -p-toluidine, N- (5-nitro-2-furyl) -p-toluidine, N- (5-methyl-2- Furfuryl) -p-toluidine, N- (N-piperidinylmethyl) -3-[(dihydropyridyl) amino] isatin, [ethylene-3- (3,5-di-tert-butyl) 4-hydroxyphenyl) propionate] methane, or a mixture of each of the foregoing.

磁性片可包含以50重量%或更多、或70重量%或更多量的磁粉。例如,磁性片可包含以50重量%至95重量%、70重量%至90重量%、70重量%至90重量%、75重量%至90重量%、75重量%至95重量%、80重量%至95重量%、或80重量%至90重量%之量的磁粉。另外,在此狀況下,磁粉可具有式1之組成。The magnetic sheet may include magnetic powder in an amount of 50% by weight or more, or 70% by weight or more. For example, the magnetic sheet may include 50% to 95% by weight, 70% to 90% by weight, 70% to 90% by weight, 75% to 90% by weight, 75% to 95% by weight, and 80% by weight. To 95% by weight, or 80% to 90% by weight of magnetic powder. In this case, the magnetic powder may have a composition of Formula 1.

此外,磁性片可包含以5重量%至40重量%、5重量%至20重量%、5重量%至15重量%、或7重量%至15重量%之量的黏合劑樹脂。In addition, the magnetic sheet may include a binder resin in an amount of 5 to 40% by weight, 5 to 20% by weight, 5 to 15% by weight, or 7 to 15% by weight.

另外,磁性片可基於磁性片之總重量包含6重量%至12重量%的基於聚胺基甲酸酯之樹脂、0.5重量%至2重量%的基於異氰酸酯之硬化劑、及0.3重量%至1.5重量%的基於環氧基之樹脂,作為黏合劑樹脂。In addition, the magnetic sheet may include 6% to 12% by weight of a polyurethane-based resin, 0.5% to 2% by weight of an isocyanate-based hardener, and 0.3% to 1.5% by weight based on the total weight of the magnetic sheet. Epoxy resin based on weight% as a binder resin.

此外,磁性片可包含以1重量%至10重量%、1重量%至8重量%、或3重量%至7重量%之量的腐蝕抑制劑。In addition, the magnetic sheet may include a corrosion inhibitor in an amount of 1 to 10% by weight, 1 to 8% by weight, or 3 to 7% by weight.

根據一特定實例,磁性片可基於磁性片之總重量包含70重量%至90重量%的磁粉,及6重量%至12重量%的基於聚胺基甲酸酯之樹脂,0.5重量%至2重量%的基於異氰酸酯之硬化劑、及0.3重量%至1.5重量%的基於環氧基之樹脂,作為黏合劑樹脂。另外,在此狀況下,磁粉具有式1之組成,基於聚胺基甲酸酯之樹脂包含藉由式2a及2b表示的重複單元,基於異氰酸酯之硬化劑可為脂環族二異氰酸酯,且基於環氧基之樹脂可為雙酚A型環氧樹脂、甲酚酚醛型環氧樹脂、或肆(縮水甘油基氧基苯基)乙烷型環氧樹脂。According to a specific example, the magnetic sheet may include 70% to 90% by weight of magnetic powder based on the total weight of the magnetic sheet, and 6% to 12% by weight of a polyurethane-based resin, and 0.5% to 2% by weight. % Of the isocyanate-based hardener and 0.3% to 1.5% by weight of the epoxy-based resin as the binder resin. In addition, in this state, the magnetic powder has a composition of Formula 1, the polyurethane-based resin includes a repeating unit represented by Formulas 2a and 2b, and the isocyanate-based hardener may be an alicyclic diisocyanate, and based on The epoxy resin may be a bisphenol A epoxy resin, a cresol novolac epoxy resin, or a (glycidyloxyphenyl) ethane epoxy resin.

磁性片之厚度在約10 μm至約3,000 μm之範圍內。例如,磁性片100之厚度可在約10 μm至約500 μm、約40 μm至約500 μm、約40 μm至約250 μm、約50 μm至約250 μm、約50 μm至約200 μm、或約50 μm至約100 μm之範圍內。The thickness of the magnetic sheet is in a range of about 10 μm to about 3,000 μm. For example, the thickness of the magnetic sheet 100 may be about 10 μm to about 500 μm, about 40 μm to about 500 μm, about 40 μm to about 250 μm, about 50 μm to about 250 μm, about 50 μm to about 200 μm, or In the range of about 50 μm to about 100 μm.

磁性片可具有基於具有3 MHz之頻率之交流電的約100至約300之磁導率、基於具有6.78 MHz之頻率之交流電的約80至約270之磁導率、及基於具有13.56 MHz之頻率之交流電的約60至約250之磁導率。The magnetic sheet may have a magnetic permeability of about 100 to about 300 based on an alternating current having a frequency of 3 MHz, a magnetic permeability of about 80 to about 270 based on an alternating current having a frequency of 6.78 MHz, and a magnetic permeability based on a frequency of 13.56 MHz. Permeability of alternating current of about 60 to about 250.

另外,磁性片可具有基於具有3 MHz之頻率之交流電的約190至約250之磁導率,可具有基於具有6.78 MHz之頻率之交流電的約180至約230之磁導率,且可具有基於具有13.56 MHz之頻率之交流電的約140至約180之磁導率。In addition, the magnetic sheet may have a magnetic permeability of about 190 to about 250 based on an alternating current having a frequency of 3 MHz, may have a magnetic permeability of about 180 to about 230 based on an alternating current having a frequency of 6.78 MHz, and may have a magnetic permeability based on Permeability of an alternating current having a frequency of 13.56 MHz from about 140 to about 180.

此外,磁性片可具有可撓性以便使用於各種裝置中。例如,磁性片可甚至在90度及35 RPM之條件下的MIT折疊試驗中之100次、1,000次或10,000次彎曲之後未切開。另外,磁性片在90度及35 RPM之條件下的MIT折疊試驗中之100次、1,000次或10,000次彎曲之後的磁導率改變可為約10%或更少、或約5%或更少。In addition, the magnetic sheet may have flexibility for use in various devices. For example, the magnetic sheet may not be cut after 100, 1,000, or 10,000 bends in the MIT folding test at 90 degrees and 35 RPM. In addition, the magnetic sheet may have a magnetic permeability change of about 10% or less after 100, 1,000, or 10,000 bends in the MIT folding test at 90 degrees and 35 RPM. .

此外,磁性片可具有在經受兩次熱處置時的約5%或更少之厚度改變及約5%或更少之磁導率改變,該熱處置由以恆定速率自30℃加熱至240℃持續200秒及隨後以恆定速率自240℃冷卻至130℃持續100秒組成。特定而言,當熱處置重複兩次時,磁性片可具有約3%或更少之厚度改變及約3%或更少之磁導率改變,且更具體而言可具有約1%或更少之厚度改變及約1%或更少之磁導率改變。In addition, the magnetic sheet may have a change in thickness of about 5% or less and a change in permeability of about 5% or less when subjected to two thermal treatments, which are heated from 30 ° C to 240 ° C at a constant rate Composition for 200 seconds and subsequent cooling from 240 ° C to 130 ° C for 100 seconds at a constant rate. In particular, when the thermal treatment is repeated twice, the magnetic sheet may have a thickness change of about 3% or less and a magnetic permeability change of about 3% or less, and more specifically may have about 1% or less Less change in thickness and change in permeability of about 1% or less.

另外,磁性片可具有能夠耐受各種環境的耐化學性。例如,磁性片在浸入2 N鹽酸溶液中30分鐘時可具有約5%或更少之厚度改變及約5%或更少之磁導率改變,且在浸入2 N氫氧化鈉溶液中30分鐘時可具有約5%或更少之厚度改變及約5%或更少之磁導率改變。特定而言,磁性片在浸入2 N鹽酸溶液中30分鐘時可具有約3%或更少之厚度改變及約3%或更少之磁導率改變,且在浸入2 N氫氧化鈉溶液中30分鐘時可具有約3%或更少之厚度改變及約3%或更少之磁導率改變。更具體而言,磁性片在浸入2 N鹽酸溶液中30分鐘時可具有約1%或更少之厚度改變及約1%或更少之磁導率改變,且在浸入2 N氫氧化鈉溶液中30分鐘時可具有約1%或更少之厚度改變及約1%或更少之磁導率改變。In addition, the magnetic sheet may have chemical resistance capable of withstanding various environments. For example, a magnetic sheet may have a thickness change of about 5% or less and a permeability change of about 5% or less when immersed in a 2 N hydrochloric acid solution for 30 minutes, and immersed in a 2 N sodium hydroxide solution for 30 minutes. It may have a change in thickness of about 5% or less and a change in permeability of about 5% or less. Specifically, the magnetic sheet may have a thickness change of about 3% or less and a magnetic permeability change of about 3% or less when immersed in a 2 N hydrochloric acid solution for 30 minutes, and is immersed in a 2 N sodium hydroxide solution It may have a thickness change of about 3% or less and a magnetic permeability change of about 3% or less at 30 minutes. More specifically, the magnetic sheet may have a thickness change of about 1% or less and a magnetic permeability change of about 1% or less when immersed in a 2 N hydrochloric acid solution for 30 minutes, and when immersed in a 2 N sodium hydroxide solution It may have a thickness change of about 1% or less and a permeability change of about 1% or less at 30 minutes.

此外,磁性片可具有能夠耐受各種腐蝕環境的耐腐蝕性。例如,磁性片在根據KS D 9502之鹽噴試驗中可具有9.8或更大之額定數。額定數方法為藉由腐蝕面積與有效面積之比率指示腐蝕程度的評估方法,其中腐蝕程度在自0至10的標度上評級。In addition, the magnetic sheet may have corrosion resistance capable of withstanding various corrosive environments. For example, a magnetic sheet may have a rating of 9.8 or more in a salt spray test according to KS D 9502. The rating method is an evaluation method that indicates the degree of corrosion by the ratio of the corrosion area to the effective area, where the degree of corrosion is rated on a scale from 0 to 10.

另外,磁性片在浸入約2 N NaCl溶液中10分鐘時可具有約10%或更少、或約5%或更少之重量改變。另外,磁性片在浸入約2 N NaCl溶液中10分鐘時可具有約10%或更少、或約5%或更少之磁導率改變。In addition, the magnetic sheet may have a weight change of about 10% or less, or about 5% or less, when immersed in a solution of about 2 N NaCl for 10 minutes. In addition, the magnetic sheet may have a permeability change of about 10% or less, or about 5% or less, when immersed in a solution of about 2 N NaCl for 10 minutes.

另外,當磁性片經受85℃及85% RH之熱及濕條件72小時時,磁性片之厚度改變及磁導率改變中兩者可為10%或更少,特定而言5%或更少,且更特定而言2%或更少。In addition, when the magnetic sheet is subjected to heat and humidity conditions of 85 ° C and 85% RH for 72 hours, both the thickness change and the magnetic permeability change of the magnetic sheet may be 10% or less, and specifically 5% or less. , And more specifically 2% or less.

另外,磁性片可具有高擊穿電壓。例如,磁性片可具有3 kV或更大、3.5 kV或更大、或4 kV或更大之擊穿電壓。特定而言,磁性片可具有3 kV至6 kV、3.5 kV至5.5 kV、4 kV至5 kV、或4 kV至4.5 kV之擊穿電壓。In addition, the magnetic sheet may have a high breakdown voltage. For example, the magnetic sheet may have a breakdown voltage of 3 kV or more, 3.5 kV or more, or 4 kV or more. In particular, the magnetic sheet may have a breakdown voltage of 3 kV to 6 kV, 3.5 kV to 5.5 kV, 4 kV to 5 kV, or 4 kV to 4.5 kV.

此外,磁性片可具有極好的絕緣性質。例如,當電流施加在片上彼此間隔隔開500 μm或更大的兩個點之間時,磁性片可具有1 × 105 Ω或更大、1 × 107 Ω或更大、或1 × 109 Ω或更大之電阻值。較佳地,當電流施加在片上彼此間隔隔開500 μm或更大的兩個點之間時,磁性片之電阻值之量測可為不可能的,或磁性片可具有無限電阻值。In addition, the magnetic sheet may have excellent insulation properties. For example, when a current is applied between two points spaced 500 μm or more apart from each other on a sheet, the magnetic sheet may have 1 × 10 5 Ω or more, 1 × 10 7 Ω or more, or 1 × 10 9 Ω or greater resistance. Preferably, when a current is applied between two points spaced 500 μm or more apart from each other on the sheet, the measurement of the resistance value of the magnetic sheet may be impossible, or the magnetic sheet may have an infinite resistance value.

根據實施例之磁性片可藉由包含以下步驟之方法製造:混合磁粉及黏合劑樹脂、以片形式模製混合物、及乾燥片。在此狀況下,可使用與以上例證之該等磁粉及黏合劑樹脂相同類型及量的磁粉及黏合劑樹脂。The magnetic sheet according to the embodiment can be manufactured by a method including the following steps: mixing magnetic powder and a binder resin, molding the mixture in the form of a sheet, and drying the sheet. In this case, the same type and amount of magnetic powder and adhesive resin as the magnetic powder and adhesive resin exemplified above can be used.

特定而言,磁性片可藉由包含以下步驟之方法製造:(i)將磁粉分散在黏合劑樹脂及溶劑中以製造漿料;以及(ii)以片形式模製漿料及乾燥片。Specifically, the magnetic sheet may be manufactured by a method including the following steps: (i) dispersing magnetic powder in a binder resin and a solvent to produce a slurry; and (ii) molding the slurry and a dried sheet in the form of a sheet.

根據一實施例,製造磁性片之方法包含以下步驟:(1)混合基於聚胺基甲酸酯之樹脂、基於異氰酸酯之硬化劑、及基於環氧基之樹脂以製造黏合劑樹脂;(2)將磁粉及有機溶劑與黏合劑樹脂混合以製造漿料;以及(3)將漿料模製成片形式且乾燥片,其中磁性片基於磁性片之總重量包含6重量%至12重量%的基於聚胺基甲酸酯之樹脂、0.5重量%至2重量%的基於異氰酸酯之硬化劑、及0.3重量%至1.5重量%的基於環氧基之樹脂,作為黏合劑樹脂。According to an embodiment, a method for manufacturing a magnetic sheet includes the following steps: (1) mixing a polyurethane-based resin, an isocyanate-based hardener, and an epoxy-based resin to manufacture an adhesive resin; (2) Mixing magnetic powder and an organic solvent with a binder resin to produce a slurry; and (3) molding the slurry into a sheet form and a dry sheet, wherein the magnetic sheet includes 6 to 12% by weight based on the total weight of the magnetic sheet Polyurethane resins, 0.5 to 2% by weight of isocyanate-based hardeners, and 0.3 to 1.5% by weight of epoxy-based resins are used as binder resins.

作為一特定實例,磁粉以及基於聚胺基甲酸酯之樹脂、基於異氰酸酯之硬化劑、及基於環氧基之樹脂首先經添加至溶劑,且藉由分散機器(行星式混合器、高速混合器、無珠粉碎機等)分散以製造具有約100 cPs至約10,000 cPs之黏度的漿料。此後,載體膜藉由逗點(comma)塗佈機以漿料塗佈以經形成為乾磁性片。乾磁性片可藉由取決於所要的厚度控制速度及溫度、使用乾燥劑移除溶劑及捲繞模製片製造成聚合磁性片(PMS)。As a specific example, magnetic powder and polyurethane-based resins, isocyanate-based hardeners, and epoxy-based resins are first added to the solvent, and by means of a dispersing machine (planetary mixer, high-speed mixer) , Beadless pulverizer, etc.) to produce a slurry having a viscosity of about 100 cPs to about 10,000 cPs. Thereafter, the carrier film was coated with a slurry by a comma coater to be formed into a dry magnetic sheet. Dry magnetic sheets can be made into polymer magnetic sheets (PMS) by controlling the speed and temperature depending on the desired thickness, using a desiccant to remove the solvent, and winding the molded sheet.

參考圖3,在藉由輥對輥製程執行的乾磁性片101之製造製程之狀況下,包含磁粉及黏合劑樹脂的漿料可藉由塗佈機500塗佈於載體膜400上,且隨後經乾燥以製造乾磁性片101。在此狀況下,未固化或半固化狀態中的黏合劑樹脂121可包含在乾磁性片101中。Referring to FIG. 3, in a state of a manufacturing process of the dry magnetic sheet 101 performed by a roll-to-roll process, a slurry including magnetic powder and an adhesive resin may be coated on a carrier film 400 by a coating machine 500, and then After drying, a dry magnetic sheet 101 is manufactured. In this case, the adhesive resin 121 in an uncured or semi-cured state may be contained in the dry magnetic sheet 101.

因此,如此製造的乾磁性片可為黏合劑樹脂之固化未完成的磁性片。Therefore, the dry magnetic sheet thus manufactured may be a magnetic sheet in which the curing of the adhesive resin is not completed.

另外,磁性片可在乾燥之後藉由熱壓固化。In addition, the magnetic sheet can be cured by hot pressing after drying.

亦即,製造磁性片之方法可進一步包含以下步驟:在步驟(3)之後,在1 MPa至100 MPa之壓力及100℃至300℃之溫度下藉由熱壓磁性片固化磁性片中之黏合劑樹脂。That is, the method for manufacturing a magnetic sheet may further include the following steps: after step (3), the bonding in the magnetic sheet is cured by hot pressing the magnetic sheet at a pressure of 1 MPa to 100 MPa and a temperature of 100 ° C to 300 ° C.剂 材料。 Resin.

因此,所獲得的磁性片可為黏合劑樹脂之固化完成的磁性片。Therefore, the obtained magnetic sheet may be a magnetic sheet in which the curing of the adhesive resin is completed.

根據一實施例之傳導性磁性複合片包含磁性片及設置於該磁性片之至少一側上的傳導性箔。A conductive magnetic composite sheet according to an embodiment includes a magnetic sheet and a conductive foil provided on at least one side of the magnetic sheet.

圖2A及圖2B例示根據一實施例之傳導性磁性複合片的橫截面圖。參考圖2A,根據實施例之傳導性磁性複合片具有磁性片100、第一傳導性箔210、及第二傳導性箔220。參考圖2B,根據實施例之傳導性磁性複合片可進一步具有第一底漆層310及第二底漆層320。2A and 2B illustrate cross-sectional views of a conductive magnetic composite sheet according to an embodiment. Referring to FIG. 2A, a conductive magnetic composite sheet according to an embodiment has a magnetic sheet 100, a first conductive foil 210, and a second conductive foil 220. Referring to FIG. 2B, the conductive magnetic composite sheet according to the embodiment may further have a first primer layer 310 and a second primer layer 320.

根據一較佳實施例之傳導性磁性複合片包含:磁性片,其包含磁粉及黏合劑樹脂;以及第一傳導性箔,其直接黏合至磁性片之一側。傳導性磁性複合片可進一步包含第二傳導性箔,該第二傳導性箔直接黏合至磁性片之另一側。A conductive magnetic composite sheet according to a preferred embodiment includes: a magnetic sheet including a magnetic powder and an adhesive resin; and a first conductive foil which is directly adhered to one side of the magnetic sheet. The conductive magnetic composite sheet may further include a second conductive foil, which is directly bonded to the other side of the magnetic sheet.

根據另一較佳實施例之傳導性磁性複合片包含:磁性片,其包含磁粉及黏合劑樹脂;第一傳導性箔,其設置在磁性片之一側上;以及第一底漆層,其設置在磁性片與第一傳導性箔之間以將該磁性片及該第一傳導性箔黏合在一起。傳導性磁性複合片可進一步包含:第二傳導性箔,其設置在磁性片之另一側上;以及第二底漆層,其設置在磁性片與第二傳導性箔之間以將該磁性片及該第二傳導性箔黏合在一起。A conductive magnetic composite sheet according to another preferred embodiment includes: a magnetic sheet including a magnetic powder and an adhesive resin; a first conductive foil provided on one side of the magnetic sheet; and a first primer layer, which It is disposed between the magnetic sheet and the first conductive foil to adhere the magnetic sheet and the first conductive foil together. The conductive magnetic composite sheet may further include: a second conductive foil provided on the other side of the magnetic sheet; and a second primer layer provided between the magnetic sheet and the second conductive foil to make the magnetic The sheet and the second conductive foil are bonded together.

因此,傳導性磁性複合片為傳導性箔及磁性片積層(藉由底漆層)的複合片。例如,傳導性磁性複合片可為銅箔積層磁性複合片。Therefore, the conductive magnetic composite sheet is a composite sheet in which a conductive foil and a magnetic sheet are laminated (by a primer layer). For example, the conductive magnetic composite sheet may be a copper foil laminated magnetic composite sheet.

包含在傳導性磁性複合片中的磁性片100可具有與根據以上所描述之實施例之磁性片大體上相同的組成及性質,且亦可藉由大體上相同的方法製造。The magnetic sheet 100 included in the conductive magnetic composite sheet may have substantially the same composition and properties as the magnetic sheet according to the embodiment described above, and may also be manufactured by a substantially same method.

磁性片100可具有基於具有3 MHz之頻率之交流電的100至300之磁導率、基於具有6.78 MHz之頻率之交流電的80至270之磁導率、及基於具有13.56 MHz之頻率之交流電的60至250之磁導率。The magnetic sheet 100 may have a permeability of 100 to 300 based on an alternating current having a frequency of 3 MHz, a permeability of 80 to 270 based on an alternating current having a frequency of 6.78 MHz, and a 60 based on an alternating current having a frequency of 13.56 MHz. Permeability to 250.

根據一特定實例,磁性片可基於磁性片之總重量包括70重量%至90重量%的磁粉,及6重量%至12重量%的基於聚胺基甲酸酯之樹脂、0.5重量%至2重量%的基於異氰酸酯之硬化劑、及0.3重量%至1.5重量%的基於環氧基之樹脂,作為黏合劑樹脂。另外,在此狀況下,磁粉具有式1之組成,基於聚胺基甲酸酯之樹脂包含藉由式2a及2b表示的重複單元,基於異氰酸酯之硬化劑可為脂環族二異氰酸酯,且基於環氧基之樹脂可為雙酚A型環氧樹脂、甲酚酚醛型環氧樹脂、或肆(縮水甘油基氧基苯基)乙烷型環氧樹脂。According to a specific example, the magnetic sheet may include 70% to 90% by weight of magnetic powder based on the total weight of the magnetic sheet, and 6% to 12% by weight of a polyurethane-based resin, 0.5% to 2% by weight. % Of the isocyanate-based hardener and 0.3% to 1.5% by weight of the epoxy-based resin as the binder resin. In addition, in this state, the magnetic powder has a composition of Formula 1, the polyurethane-based resin includes a repeating unit represented by Formulas 2a and 2b, and the isocyanate-based hardener may be an alicyclic diisocyanate, and based on The epoxy resin may be a bisphenol A epoxy resin, a cresol novolac epoxy resin, or a (glycidyloxyphenyl) ethane epoxy resin.

傳導性箔設置在磁性片之至少一側上。亦即,傳導性箔設置在磁性片之一側及/或另一側上。A conductive foil is provided on at least one side of the magnetic sheet. That is, the conductive foil is provided on one side and / or the other side of the magnetic sheet.

傳導性箔可包含傳導性材料。例如,傳導性箔可包含傳導性金屬。亦即,傳導性箔可為金屬層。例如,傳導性箔可包含選自由以下各項組成之群組的至少一金屬:銅、鎳、金、銀、鋅及錫。特定而言,傳導性箔可為金屬箔。例如,傳導性箔可為銅箔。The conductive foil may include a conductive material. For example, the conductive foil may include a conductive metal. That is, the conductive foil may be a metal layer. For example, the conductive foil may include at least one metal selected from the group consisting of copper, nickel, gold, silver, zinc, and tin. Specifically, the conductive foil may be a metal foil. For example, the conductive foil may be a copper foil.

傳導性箔之厚度可在約6 μm至約200 μm,例如,約10 μm至約150 μm、約10 μm至約100 μm、或約20 μm至約50 μm之範圍內。The thickness of the conductive foil may be in a range of about 6 μm to about 200 μm, for example, about 10 μm to about 150 μm, about 10 μm to about 100 μm, or about 20 μm to about 50 μm.

根據一較佳實施例,如圖2A中所例示,第一傳導性箔210及第二傳導性箔220可在無分離黏著劑層的情況下直接黏合至磁性片100。因此,傳導性箔可直接處於與磁性片之表面接觸。在此狀況下,傳導性箔可直接黏合至磁性片之黏合劑樹脂。特定而言,傳導性箔可直接黏合至構成黏合劑樹脂的熱固性樹脂。According to a preferred embodiment, as illustrated in FIG. 2A, the first conductive foil 210 and the second conductive foil 220 can be directly bonded to the magnetic sheet 100 without a separate adhesive layer. Therefore, the conductive foil can be directly in contact with the surface of the magnetic sheet. In this case, the conductive foil can be directly bonded to the adhesive resin of the magnetic sheet. In particular, the conductive foil can be directly bonded to a thermosetting resin constituting an adhesive resin.

另外,黏著劑層可設置在磁性片與傳導性箔之間。亦即,傳導性磁性複合片可進一步包含設置在磁性片與傳導性箔之間的黏著劑層,且在此狀況下,黏著劑層可直接處於與磁性片及傳導性箔接觸。The adhesive layer may be provided between the magnetic sheet and the conductive foil. That is, the conductive magnetic composite sheet may further include an adhesive layer provided between the magnetic sheet and the conductive foil, and in this case, the adhesive layer may be directly in contact with the magnetic sheet and the conductive foil.

因此,黏著劑層可將傳導性箔黏合至磁性片。黏著劑層之厚度可在約0.1 μm至約20 μm之範圍內。特定而言,黏著劑層之厚度可在約0.1 μm至約10 μm、約1 μm至約7 μm、或約1 μm至約5 μm之範圍內。Therefore, the adhesive layer can adhere the conductive foil to the magnetic sheet. The thickness of the adhesive layer may be in a range of about 0.1 μm to about 20 μm. Specifically, the thickness of the adhesive layer may be in a range of about 0.1 μm to about 10 μm, about 1 μm to about 7 μm, or about 1 μm to about 5 μm.

黏著劑層可包含熱固性樹脂或高耐熱熱塑性樹脂。特定而言,黏著劑層可包含基於環氧基之樹脂。黏著劑層可藉由熱固化將磁性片黏合至傳導性箔。因此,黏著劑層可具有高耐熱性及高黏著。The adhesive layer may include a thermosetting resin or a highly heat-resistant thermoplastic resin. In particular, the adhesive layer may include an epoxy-based resin. The adhesive layer can adhere the magnetic sheet to the conductive foil by thermal curing. Therefore, the adhesive layer can have high heat resistance and high adhesion.

例如,黏著劑層可藉由包含熱固性樹脂具有高耐化學性。因此,黏著劑層可在保護磁性片中起作用。亦即,當傳導性箔以蝕刻劑蝕刻時,黏著劑層可保護磁性片免受蝕刻劑影響。For example, the adhesive layer may have high chemical resistance by including a thermosetting resin. Therefore, the adhesive layer can play a role in protecting the magnetic sheet. That is, when the conductive foil is etched with an etchant, the adhesive layer can protect the magnetic sheet from the etchant.

因此,因為傳導性箔可直接黏合至磁性片或可藉由黏著劑層黏合至磁性片,所以傳導性箔可以高黏著強度黏合。特定而言,因為傳導性箔係藉由固化構成磁性片的熱固性樹脂或黏著劑層黏合,所以即使經受高溫熱處置製程,磁性片與傳導性箔之間的黏合強度亦可不降低。Therefore, since the conductive foil can be directly bonded to the magnetic sheet or can be bonded to the magnetic sheet through an adhesive layer, the conductive foil can be bonded with high adhesive strength. In particular, since the conductive foil is adhered by curing a thermosetting resin or an adhesive layer constituting the magnetic sheet, the adhesion strength between the magnetic sheet and the conductive foil does not decrease even when subjected to a high-temperature heat treatment process.

根據另一較佳實施例,如圖2B中所例示,第一底漆層310及第二底漆層320分別設置在磁性片100與第一傳導性箔210及第二傳導性箔220之間。亦即,傳導性磁性複合片進一步包含分別設置在磁性片100與第一傳導性箔210及第二傳導性箔220之間的第一底漆層310及第二底漆層320,且在此狀況下,底漆層直接處於與磁性片100以及第一傳導性箔210及第二傳導性箔220接觸。According to another preferred embodiment, as illustrated in FIG. 2B, the first primer layer 310 and the second primer layer 320 are respectively disposed between the magnetic sheet 100 and the first conductive foil 210 and the second conductive foil 220. . That is, the conductive magnetic composite sheet further includes a first primer layer 310 and a second primer layer 320 provided between the magnetic sheet 100 and the first conductive foil 210 and the second conductive foil 220, respectively, and here In this case, the primer layer is directly in contact with the magnetic sheet 100 and the first conductive foil 210 and the second conductive foil 220.

因此,底漆層可將傳導性箔黏合至磁性片。底漆層之厚度可在約0.01 μm至約20 μm之範圍內。特定而言,底漆層之厚度可在約0.01 μm至約10 μm、約0.01 μm至約7 μm、約0.01 μm至約5 μm、或約0.01 μm至約3 μm之範圍內。Therefore, the primer layer can adhere the conductive foil to the magnetic sheet. The thickness of the primer layer may be in a range of about 0.01 μm to about 20 μm. Specifically, the thickness of the primer layer may be in a range of about 0.01 μm to about 10 μm, about 0.01 μm to about 7 μm, about 0.01 μm to about 5 μm, or about 0.01 μm to about 3 μm.

作為一特定實例,第一底漆層(及第二底漆層)可具有0.01 μm至1 μm之厚度。As a specific example, the first primer layer (and the second primer layer) may have a thickness of 0.01 μm to 1 μm.

底漆層可包含熱固性樹脂或高耐熱熱塑性樹脂,且特定而言可包含基於環氧基之樹脂。The primer layer may include a thermosetting resin or a highly heat-resistant thermoplastic resin, and may specifically include an epoxy-based resin.

作為一特定實例,第一底漆層(及第二底漆層)可包含熱固性樹脂,且第一底漆層(及第二底漆層)中之熱固性樹脂可在將熱及壓力施加至堆疊之步驟中固化。As a specific example, the first primer layer (and the second primer layer) may include a thermosetting resin, and the thermosetting resin in the first primer layer (and the second primer layer) may apply heat and pressure to the stack. During the curing step.

基於環氧基之樹脂之實例可為雙酚型環氧樹脂諸如雙酚A型環氧樹脂、雙酚F型環氧樹脂、雙酚S型環氧樹脂、及四溴雙酚A型環氧樹脂;螺環型環氧樹脂;萘型環氧樹脂;聯苯型環氧樹脂;萜烯型環氧樹脂;縮水甘油醚型環氧樹脂諸如三(縮水甘油基氧基苯基)甲烷及肆(縮水甘油基氧基苯基)乙烷;縮水甘油胺型環氧樹脂諸如四縮水甘油基二胺基二苯基甲烷;酚醛型環氧樹脂諸如甲酚酚醛型環氧樹脂、苯酚酚醛型環氧樹脂、α-萘酚酚醛型環氧樹脂、及溴化苯酚酚醛型環氧樹脂。此等基於環氧基之樹脂可單獨或以其兩個或兩個以上之組合使用。Examples of epoxy-based resins may be bisphenol type epoxy resins such as bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, and tetrabromobisphenol A type epoxy resin. Resin; Spiral epoxy resin; Naphthalene epoxy resin; Biphenyl epoxy resin; Terpene epoxy resin; Glycidyl ether epoxy resin such as tris (glycidyloxyphenyl) methane (Glycidyloxyphenyl) ethane; glycidylamine type epoxy resins such as tetraglycidyldiaminediphenylmethane; phenolic epoxy resins such as cresol novolac epoxy resin, phenol novolac type ring Oxygen resin, α-naphthol novolac epoxy resin, and brominated phenol novolac epoxy resin. These epoxy-based resins may be used alone or in a combination of two or more thereof.

在此等樹脂中,考慮到黏著性及耐熱性,雙酚A型環氧樹脂、甲酚酚醛型環氧樹脂、或肆(縮水甘油基氧基苯基)乙烷型環氧樹脂可使用於第一底漆層(及第二底漆層)中。Among these resins, bisphenol A type epoxy resin, cresol novolac type epoxy resin, or (glycidyloxyphenyl) ethane type epoxy resin can be used in consideration of adhesion and heat resistance. In the first primer layer (and the second primer layer).

基於環氧基之樹脂可具有約80 g/eq至約1,000 g/eq、或約100 g/eq至約300 g/eq之環氧當量。另外,基於環氧基之樹脂可具有約10,000 g/mol至50,000 g/mol之數目平均分子量。The epoxy-based resin may have an epoxy equivalent weight of about 80 g / eq to about 1,000 g / eq, or about 100 g / eq to about 300 g / eq. In addition, the epoxy-based resin may have a number average molecular weight of about 10,000 g / mol to 50,000 g / mol.

作為一特定實例,第一底漆層(及第二底漆層)可具有0.01 μm至1 μm之厚度,且可包含雙酚A型環氧樹脂、甲酚酚醛型環氧樹脂、或肆(縮水甘油基氧基苯基)乙烷型環氧樹脂。As a specific example, the first primer layer (and the second primer layer) may have a thickness of 0.01 μm to 1 μm, and may include a bisphenol A type epoxy resin, a cresol novolac type epoxy resin, or Glycidyloxyphenyl) ethane type epoxy resin.

底漆層可藉由熱固化將磁性片黏合至傳導性箔。因此,底漆層可具有高耐熱性及高黏合強度。The primer layer can adhere the magnetic sheet to the conductive foil by thermal curing. Therefore, the primer layer can have high heat resistance and high adhesive strength.

另外,底漆層可藉由包含熱固性樹脂具有高耐化學性。因此,底漆層可在保護磁性片中起作用。亦即,當傳導性箔以蝕刻劑蝕刻時,底漆層可保護磁性片免受蝕刻劑影響。In addition, the primer layer may have high chemical resistance by including a thermosetting resin. Therefore, the primer layer can play a role in protecting the magnetic sheet. That is, when the conductive foil is etched with an etchant, the primer layer can protect the magnetic sheet from the etchant.

傳導性箔係藉由構成磁性片的熱固性樹脂或底漆層之固化黏合,即使傳導性箔經受執行來用於該傳導性箔至至產品之施加的諸如迴焊或軟焊製程之高溫熱處置製程,磁性片與傳導性箔之間的黏合強度可不降低。Conductive foil is adhered by curing of a thermosetting resin or primer layer constituting a magnetic sheet, even if the conductive foil is subjected to high-temperature heat such as reflow or soldering processes performed for the conductive foil to the product. During the treatment process, the adhesive strength between the magnetic sheet and the conductive foil can be maintained.

較佳地,傳導性磁性複合片具有介於傳導性箔與磁性片之間的0.6 kgf/cm或更大,例如,在0.6 kgf/cm至20 kgf/cm之範圍內、在0.6 kgf/cm至10 kgf/cm之範圍內、在0.6 kgf/cm至5 kgf/cm之範圍內、或在0.6 kgf/cm至3 kgf/cm之範圍內之剝離強度。Preferably, the conductive magnetic composite sheet has 0.6 kgf / cm or more between the conductive foil and the magnetic sheet, for example, in a range of 0.6 kgf / cm to 20 kgf / cm, in a range of 0.6 kgf / cm Peel strength in the range of 10 kgf / cm, in the range of 0.6 kgf / cm to 5 kgf / cm, or in the range of 0.6 kgf / cm to 3 kgf / cm.

另外,當傳導性磁性經受兩次熱處置時,該熱處置由以恆定速率自30℃加熱至240℃持續200秒及隨後以恆定速率自240℃冷卻至130℃持續100秒組成,傳導性磁性複合片可具有介於傳導性箔與磁性片之間的0.6 kgf/cm或更大,例如,0.6 kgf/cm至20 kgf/cm、0.6 kgf/cm至10 kgf/cm、0.6 kgf/cm至5 kgf/cm、或0.6 kgf/cm至3 kgf/cm之剝離強度。In addition, when the conductive magnetism was subjected to two thermal treatments, the thermal treatment consisted of heating from 30 ° C to 240 ° C at a constant rate for 200 seconds and then cooling from 240 ° C to 130 ° C for 100 seconds at a constant rate. The composite sheet may have 0.6 kgf / cm or more between the conductive foil and the magnetic sheet, for example, 0.6 kgf / cm to 20 kgf / cm, 0.6 kgf / cm to 10 kgf / cm, 0.6 kgf / cm to Peel strength of 5 kgf / cm, or 0.6 kgf / cm to 3 kgf / cm.

此外,當熱處置在以上條件下重複兩次時,傳導性箔與磁性片之間的剝離強度之改變率(下降率)可為20%或更少、15%或更少、或10%或更少。In addition, when the thermal treatment is repeated twice under the above conditions, the change rate (decrease rate) of the peel strength between the conductive foil and the magnetic sheet may be 20% or less, 15% or less, or 10% or less.

因此,關於根據實施例之傳導性磁性複合片,即使傳導性磁性複合片經受諸如迴焊製程之軟焊製程,諸如磁導率及厚度之物理性能存在極小改變,且諸如磁性片與傳導性箔之間的脫層之缺陷不發生。Therefore, with regard to the conductive magnetic composite sheet according to the embodiment, even if the conductive magnetic composite sheet is subjected to a soldering process such as a reflow process, there are minimal changes in physical properties such as magnetic permeability and thickness, and such as a magnetic sheet and a conductive foil. Defects between delaminations do not occur.

根據一實施例之製造傳導性磁性複合片之方法包含以下步驟:製造包含磁粉及黏合劑樹脂之磁性片;堆疊磁性片及第一傳導性箔;以及將熱及壓力施加至獲得的堆疊以黏合磁性片及第一傳導性箔。A method of manufacturing a conductive magnetic composite sheet according to an embodiment includes the following steps: manufacturing a magnetic sheet including magnetic powder and an adhesive resin; stacking the magnetic sheet and the first conductive foil; and applying heat and pressure to the obtained stack to bond A magnetic sheet and a first conductive foil.

在此實施例中,黏合劑樹脂可為熱固性樹脂,且黏合劑樹脂可在於將熱及壓力施加至堆疊之步驟中固化時將磁性片黏合至第一傳導性箔。In this embodiment, the adhesive resin may be a thermosetting resin, and the adhesive resin may adhere the magnetic sheet to the first conductive foil when curing in the step of applying heat and pressure to the stack.

此外,在此實施例中,第一傳導性箔可具有形成於其一側上的第一底漆層,且磁性片及第一傳導性箔可經堆疊,使得磁性片之一側處於與第一傳導性箔之第一底漆層接觸。In addition, in this embodiment, the first conductive foil may have a first primer layer formed on one side thereof, and the magnetic sheet and the first conductive foil may be stacked such that one side of the magnetic sheet is in contact with the first The first primer layer of a conductive foil is in contact.

根據另一實施例之製造傳導性磁性複合片之方法包含以下步驟:製造包含磁粉及黏合劑樹脂之磁性片;堆疊第一傳導性箔、磁性片及第二傳導性箔;以及將熱及壓力施加至獲得的堆疊以將第一傳導性箔、磁性片及第二傳導性箔黏合在一起。A method for manufacturing a conductive magnetic composite sheet according to another embodiment includes the following steps: manufacturing a magnetic sheet including magnetic powder and an adhesive resin; stacking a first conductive foil, a magnetic sheet, and a second conductive foil; and applying heat and pressure Apply to the obtained stack to bond the first conductive foil, the magnetic sheet, and the second conductive foil together.

在此實施例中,黏合劑樹脂可為熱固性樹脂,且黏合劑樹脂在於將熱及壓力施加至堆疊之步驟中固化時將第一傳導性箔、磁性片及第二傳導性箔黏合在一起。In this embodiment, the adhesive resin may be a thermosetting resin, and the adhesive resin bonds the first conductive foil, the magnetic sheet, and the second conductive foil together when curing in the step of applying heat and pressure to the stack.

此外,在此實施例中,第一傳導性箔具有形成於其一側上的第一底漆層,第二傳導性箔具有形成於其一側上的第二底漆層,磁性片及第一傳導性箔經堆疊,使得磁性片之一側處於與第一傳導性箔之第一底漆層接觸,磁性片及第二傳導性箔經堆疊,使得磁性片之另一側處於與第二傳導性箔之第二底漆層接觸。Further, in this embodiment, the first conductive foil has a first primer layer formed on one side thereof, and the second conductive foil has a second primer layer formed on one side thereof, the magnetic sheet, and the first A conductive foil is stacked so that one side of the magnetic sheet is in contact with the first primer layer of the first conductive foil, and a magnetic sheet and a second conductive foil are stacked so that the other side of the magnetic sheet is in contact with the second The second primer layer of the conductive foil is in contact.

根據一較佳實施例之製造傳導性磁性複合片之方法包含以下步驟:製造包含磁粉及熱固性黏合劑樹脂之磁性片;堆疊磁性片及第一傳導性箔;以及將熱及壓力施加至獲得的堆疊以藉由黏合劑樹脂之固化將磁性片黏合至第一傳導性箔。A method for manufacturing a conductive magnetic composite sheet according to a preferred embodiment includes the following steps: manufacturing a magnetic sheet including magnetic powder and a thermosetting adhesive resin; stacking the magnetic sheet and the first conductive foil; and applying heat and pressure to the obtained Stacked to adhere the magnetic sheet to the first conductive foil by curing of the adhesive resin.

根據另一較佳實施例之製造傳導性磁性複合片之方法包含以下步驟:製造包含磁粉及黏合劑樹脂之磁性片;堆疊第一傳導性箔、磁性片及第二傳導性箔;以及將熱及壓力施加至獲得的堆疊以藉由黏合劑樹脂之固化將第一傳導性箔、磁性片及第二傳導性箔黏合在一起。A method of manufacturing a conductive magnetic composite sheet according to another preferred embodiment includes the following steps: manufacturing a magnetic sheet including magnetic powder and an adhesive resin; stacking a first conductive foil, a magnetic sheet, and a second conductive foil; And pressure is applied to the obtained stack to bond the first conductive foil, the magnetic sheet, and the second conductive foil together by curing of the adhesive resin.

根據另一較佳實施例之製造傳導性磁性複合片之方法包含以下步驟:製造包含磁粉及黏合劑樹脂之磁性片;將第一底漆層形成於第一傳導性箔之一側上;堆疊磁性片及第一傳導性箔,使得磁性片之一側處於與第一傳導性箔之第一底漆層接觸;以及將熱及壓力施加至獲得的堆疊以將磁性片黏合至第一傳導性箔。A method for manufacturing a conductive magnetic composite sheet according to another preferred embodiment includes the following steps: manufacturing a magnetic sheet including magnetic powder and an adhesive resin; forming a first primer layer on one side of the first conductive foil; stacking The magnetic sheet and the first conductive foil such that one side of the magnetic sheet is in contact with the first primer layer of the first conductive foil; and applying heat and pressure to the obtained stack to bond the magnetic sheet to the first conductive Foil.

根據另一較佳實施例之製造傳導性磁性複合片之方法包含以下步驟:製造包含磁粉及黏合劑樹脂之磁性片;將第一底漆層形成於第一傳導性箔之一側上;將第二底漆層形成於第二傳導性箔之一側上;堆疊磁性片及第一傳導性箔,使得磁性片之一側處於與第一傳導性箔之第一底漆層接觸;堆疊磁性片及第二傳導性箔,使得磁性片之另一側處於與第二傳導性箔之第二底漆層接觸;以及將熱及壓力施加至獲得的堆疊以將第一傳導性箔、磁性片及第二傳導性箔黏合在一起。A method for manufacturing a conductive magnetic composite sheet according to another preferred embodiment includes the following steps: manufacturing a magnetic sheet including magnetic powder and an adhesive resin; forming a first primer layer on one side of the first conductive foil; The second primer layer is formed on one side of the second conductive foil; the magnetic sheet and the first conductive foil are stacked so that one side of the magnetic sheet is in contact with the first primer layer of the first conductive foil; the stacked magnetic Sheet and second conductive foil such that the other side of the magnetic sheet is in contact with the second primer layer of the second conductive foil; and applying heat and pressure to the obtained stack to place the first conductive foil, magnetic sheet And a second conductive foil.

方法中所使用之磁性片可具有與根據以上所描述之實施例之磁性片大體上相同的組成及性質,且亦可藉由大體上相同的方法製造。The magnetic sheet used in the method may have substantially the same composition and properties as the magnetic sheet according to the embodiment described above, and may also be manufactured by a substantially same method.

特定而言,磁性片可基於磁性片之總重量包含70重量%至90重量%的磁粉,及6重量%至12重量%的基於聚胺基甲酸酯之樹脂、0.5重量%至2重量%的基於異氰酸酯之硬化劑、及0.3重量%至1.5重量%的基於環氧基之樹脂,作為黏合劑樹脂。作為一特定實例,基於聚胺基甲酸酯之樹脂包含藉由式2a及2b表示的重複單元,基於異氰酸酯之硬化劑可為脂環族二異氰酸酯,且基於環氧基之樹脂可為雙酚A型環氧樹脂、甲酚酚醛型環氧樹脂、或肆(縮水甘油基氧基苯基)乙烷型環氧樹脂。Specifically, the magnetic sheet may include 70% to 90% by weight of magnetic powder based on the total weight of the magnetic sheet, and 6% to 12% by weight of a polyurethane-based resin, 0.5% to 2% by weight Isocyanate-based hardener, and 0.3 to 1.5% by weight of epoxy-based resins as the binder resin. As a specific example, the polyurethane-based resin includes a repeating unit represented by Formulas 2a and 2b, the isocyanate-based hardener may be an alicyclic diisocyanate, and the epoxy-based resin may be bisphenol A-type epoxy resin, cresol novolac-type epoxy resin, or a (glycidyloxyphenyl) ethane-type epoxy resin.

磁性片可為具有可撓性的具有10 μm至3,000 μm之厚度的未燒結片。The magnetic sheet may be an unsintered sheet having flexibility and a thickness of 10 μm to 3,000 μm.

另外,磁性片可具有基於具有3 MHz之頻率之交流電的100至300之磁導率、基於具有6.78 MHz之頻率之交流電的80至270之磁導率、及基於具有13.56 MHz之頻率之交流電的60至250之磁導率。In addition, the magnetic sheet may have a magnetic permeability of 100 to 300 based on an alternating current having a frequency of 3 MHz, a magnetic permeability of 80 to 270 based on an alternating current having a frequency of 6.78 MHz, and a magnetic permeability based on an alternating current having a frequency of 13.56 MHz Permeability of 60 to 250.

此後,傳導性箔經堆疊在乾磁性片之一側或兩側上。傳導性箔可為金屬箔,且例如可為銅箔。Thereafter, the conductive foil is stacked on one or both sides of the dry magnetic sheet. The conductive foil may be a metal foil, and may be, for example, a copper foil.

根據一較佳實施例,如圖4中所例示,與黏合劑樹脂之固化之完成同時地,第一傳導性箔210及第二傳導性箔220可經黏合至磁性片100。因為第一傳導性箔210及第二傳導性箔220藉由熱固化黏合至磁性片100,所以磁性片與傳導性箔之間的黏合強度可為極好的。特定而言,因為磁性片及傳導性箔係在與加壓700同時固化黏合劑樹脂時黏合在一起,所以黏合強度可為較好的。因此,傳導性箔可在無分離黏著劑層的情況下容易地黏合至磁性片。According to a preferred embodiment, as illustrated in FIG. 4, at the same time as the curing of the adhesive resin is completed, the first conductive foil 210 and the second conductive foil 220 may be bonded to the magnetic sheet 100. Since the first conductive foil 210 and the second conductive foil 220 are bonded to the magnetic sheet 100 by thermal curing, the adhesion strength between the magnetic sheet and the conductive foil can be excellent. In particular, since the magnetic sheet and the conductive foil are bonded together when the adhesive resin is cured at the same time as the pressure 700, the bonding strength can be better. Therefore, the conductive foil can be easily adhered to the magnetic sheet without a separate adhesive layer.

根據另一較佳實施例,傳導性箔可具有形成於其一側上的底漆層,且乾磁性片及傳導性箔經堆疊,使得乾磁性片之一側處於與傳導性箔之底漆層接觸。According to another preferred embodiment, the conductive foil may have a primer layer formed on one side thereof, and the dry magnetic sheet and the conductive foil are stacked so that one side of the dry magnetic sheet is on the primer with the conductive foil. Layer contact.

底漆層可包含熱固性樹脂。The primer layer may include a thermosetting resin.

用作第一底漆層(及第二底漆層)的熱固性樹脂之一實例可為基於環氧基之樹脂。An example of the thermosetting resin used as the first primer layer (and the second primer layer) may be an epoxy-based resin.

例如,第一底漆層(及第二底漆層)可包含雙酚A型環氧樹脂、甲酚酚醛型環氧樹脂、或肆(縮水甘油基氧基苯基)乙烷型環氧樹脂。For example, the first primer layer (and the second primer layer) may include a bisphenol A type epoxy resin, a cresol novolac type epoxy resin, or a (glycidyloxyphenyl) ethane type epoxy resin. .

底漆層之厚度可在約0.01 μm至約10 μm、約0.01 μm至約5 μm、或約0.01 μm至約1 μm之範圍內。此外,底漆層之厚度可在約0.1 μm至10 μm、或約1 μm至5 μm之範圍內。The thickness of the primer layer may be in a range of about 0.01 μm to about 10 μm, about 0.01 μm to about 5 μm, or about 0.01 μm to about 1 μm. In addition, the thickness of the primer layer may be in a range of about 0.1 μm to 10 μm, or about 1 μm to 5 μm.

特定而言,第一底漆層(及第二底漆層)包含熱固性樹脂,且第一底漆層(及第二底漆層)中之熱固性樹脂可在將熱及壓力施加至堆疊之步驟中固化。另外,黏合劑樹脂包含熱固性樹脂,且黏合劑樹脂中之熱固性樹脂可在將熱及壓力施加至堆疊之步驟中固化。Specifically, the first primer layer (and the second primer layer) includes a thermosetting resin, and the thermosetting resin in the first primer layer (and the second primer layer) may be subjected to a step of applying heat and pressure to the stack. Medium curing. In addition, the binder resin includes a thermosetting resin, and the thermosetting resin in the binder resin may be cured in a step of applying heat and pressure to the stack.

因此,與磁性片及底漆層之固化之完成同時地,第一傳導性箔及第二傳導性箔可經黏合至磁性片。因為第一傳導性箔及第二傳導性箔藉由熱固化的第一底漆層及第二底漆層黏合至磁性片,所以磁性片與傳導性箔之間的黏合強度可為極好的。特定而言,因為磁性片及傳導性箔係在底漆層與加壓同時固化時黏合在一起,所以黏合強度可為較好的。Therefore, simultaneously with the completion of the curing of the magnetic sheet and the primer layer, the first conductive foil and the second conductive foil may be bonded to the magnetic sheet. Since the first conductive foil and the second conductive foil are bonded to the magnetic sheet through the thermally cured first primer layer and the second primer layer, the adhesion strength between the magnetic sheet and the conductive foil can be excellent . In particular, since the magnetic sheet and the conductive foil are bonded together when the primer layer is cured while being pressed, the bonding strength can be better.

施加熱及壓力之步驟可在1 MPa至100 MPa之壓力及100℃至300℃之溫度下執行。另外,施加熱及壓力之步驟可在5 MPa至30 MPa之壓力及150℃至200℃之溫度下進行。此外,將熱及壓力施加至磁性片及傳導性箔之製程可執行約0.1小時至約5小時。The steps of applying heating and pressure can be performed at a pressure of 1 MPa to 100 MPa and a temperature of 100 ° C to 300 ° C. In addition, the steps of applying heat and pressure may be performed at a pressure of 5 MPa to 30 MPa and a temperature of 150 ° C to 200 ° C. In addition, the process of applying heat and pressure to the magnetic sheet and the conductive foil may be performed for about 0.1 hours to about 5 hours.

施加熱及壓力之步驟可藉由輥對輥製程或分批製程執行。The steps of applying heat and pressure can be performed by a roll-to-roll process or a batch process.

如圖5中所例示,施加熱及壓力之步驟可藉由輥對輥製程執行。在輥對輥製程中,第一傳導性箔210及第二傳導性箔220經堆疊在其中黏合劑樹脂之固化未完成的乾磁性片101之一側或兩側上,且通過輥子600。在此狀況下,因為輥子自身經加熱,所以輥子可將熱及壓力兩者施加至堆疊。亦即,磁性片及傳導性箔藉由輥子連續地積層。因此,其中黏合劑樹脂之固化完成的磁性片100經形成,且同時,第一傳導性箔210及第二傳導性箔220可經黏合至磁性片100。As illustrated in FIG. 5, the steps of applying heat and pressure may be performed by a roll-to-roll process. In the roll-to-roll process, the first conductive foil 210 and the second conductive foil 220 are stacked on one or both sides of the uncured dry magnetic sheet 101 in which the adhesive resin is cured, and pass through the roller 600. In this case, because the roller itself is heated, the roller can apply both heat and pressure to the stack. That is, the magnetic sheet and the conductive foil are continuously laminated by a roller. Therefore, the magnetic sheet 100 in which the adhesive resin is cured is formed, and at the same time, the first conductive foil 210 and the second conductive foil 220 can be bonded to the magnetic sheet 100.

在輥對輥製程中,輥子之溫度可在約100℃至約300℃之範圍內。另外,輥子之壓力可在約1 MPa至約100 MPa之範圍內。此外,約1至20對輥子可使用於輥對輥製程中。另外,堆疊之移動速度可在約0.1 m/min至10 m/min之範圍內。In the roll-to-roll process, the temperature of the roll can be in the range of about 100 ° C to about 300 ° C. In addition, the pressure of the roller may be in a range of about 1 MPa to about 100 MPa. In addition, about 1 to 20 pairs of rollers can be used in the roll-to-roll process. In addition, the stacking speed can range from about 0.1 m / min to 10 m / min.

根據一特定實例,堆疊步驟及施加熱及壓力之步驟可藉由輥對輥製程執行,且在此狀況下,輥對輥製程可藉由使用2至10對輥子在150℃至200℃之輥溫度、5 MPa至30 MPa之輥壓力、及1 m/min至5 m/min之速度下執行。According to a specific example, the stacking step and the step of applying heat and pressure can be performed by a roll-to-roll process, and in this case, the roll-to-roll process can be performed by using 2 to 10 pairs of rolls at 150 ° C to 200 ° C It is performed at a temperature, a roll pressure of 5 MPa to 30 MPa, and a speed of 1 m / min to 5 m / min.

如圖6中所例示,施加熱及壓力之步驟可藉由分批製程執行。特定而言,乾磁性片及傳導性箔經堆疊,且如此形成的堆疊在多個級段中再次堆疊。此後,在壓力經施加至在多個級段中堆疊的磁性片及傳導性箔之狀態中執行熱處置。因此,磁性片之黏合劑樹脂及黏合劑樹脂經固化,且可獲得其中第一傳導性箔210及第二傳導性箔220藉由固化的黏合劑樹脂黏合至磁性片100的堆疊10。As illustrated in FIG. 6, the steps of applying heat and pressure may be performed by a batch process. In particular, the dry magnetic sheet and the conductive foil are stacked, and the stack thus formed is stacked again in a plurality of stages. Thereafter, thermal treatment is performed in a state where pressure is applied to the magnetic sheet and the conductive foil stacked in a plurality of stages. Therefore, the adhesive resin and the adhesive resin of the magnetic sheet are cured, and a stack 10 in which the first conductive foil 210 and the second conductive foil 220 are adhered to the magnetic sheet 100 through the cured adhesive resin can be obtained.

在以上分批製程中,熱處置溫度可在約100℃至約300℃之範圍內。另外,施加至在多個級段中堆疊的堆疊之壓力可在約1 MPa至約100 MPa之範圍內。此外,施加熱及壓力的時間長度可在約0.1小時至約5小時之範圍內。In the above batch process, the heat treatment temperature may be in a range of about 100 ° C to about 300 ° C. In addition, a pressure applied to a stack stacked in a plurality of stages may be in a range of about 1 MPa to about 100 MPa. In addition, the length of time for which heat and pressure is applied may be in the range of about 0.1 hours to about 5 hours.

根據一實施例,如圖7中所例示,未固化或半固化第一底漆層311形成於第一傳導性箔210之一側上,且未固化或半固化第二底漆層321形成於第二傳導性箔220之一側上。此後,第一傳導性箔210及第二傳導性箔220分別經堆疊以允許第一底漆層311及第二底漆層321分別處於與乾磁性片101之一側及另一側接觸。According to an embodiment, as illustrated in FIG. 7, an uncured or semi-cured first primer layer 311 is formed on one side of the first conductive foil 210, and an uncured or semi-cured second primer layer 321 is formed on On one side of the second conductive foil 220. Thereafter, the first conductive foil 210 and the second conductive foil 220 are stacked to allow the first primer layer 311 and the second primer layer 321 to be in contact with one side and the other side of the dry magnetic sheet 101, respectively.

此後,如圖8中所例示,乾磁性片、底漆層、及傳導性箔藉由熱及壓力700積層。因此,乾磁性片及傳導性箔可經由底漆層積層。在此狀況下,積層可在熱及壓力條件下執行,且特定而言可在先前提及之溫度及壓力條件下藉由以上描述之輥對輥製程或分批製程執行。Thereafter, as illustrated in FIG. 8, the dry magnetic sheet, the primer layer, and the conductive foil are laminated by heat and pressure 700. Therefore, the dry magnetic sheet and the conductive foil can be laminated via a primer. Under this condition, lamination can be performed under heat and pressure conditions, and in particular, can be performed by the roll-to-roll process or batch process described above under the previously mentioned temperature and pressure conditions.

因此,可形成其中黏合劑樹脂之固化在積層製程中藉由熱完成的磁性片100。另外,因為底漆層係在積層期間固化,所以磁性片及傳導性箔可藉由固化的底漆層黏合在一起。亦即,固化的底漆層可充當經組配來將磁性片黏合至傳導性箔的黏著劑層。因此,可獲得其中磁性片100以及第一傳導性箔210及第二傳導性箔220經由固化的第一底漆層310及第二底漆層320黏合的傳導性磁性複合片。Therefore, the magnetic sheet 100 in which the curing of the binder resin is completed by heat in the lamination process can be formed. In addition, since the primer layer is cured during lamination, the magnetic sheet and the conductive foil can be bonded together by the cured primer layer. That is, the cured primer layer can serve as an adhesive layer that is configured to adhere a magnetic sheet to a conductive foil. Therefore, a conductive magnetic composite sheet in which the magnetic sheet 100 and the first conductive foil 210 and the second conductive foil 220 are bonded via the cured first primer layer 310 and the second primer layer 320 can be obtained.

根據一實例,因為第一底漆層310及第二底漆層320藉由固化熱固性樹脂形成,所以第一底漆層310及第二底漆層320可具有高耐化學性。因此,當傳導性箔以蝕刻劑蝕刻時,第一底漆層310及第二底漆層320可在保護包含在磁性片中的磁粉中起作用。According to an example, because the first primer layer 310 and the second primer layer 320 are formed by curing a thermosetting resin, the first primer layer 310 and the second primer layer 320 may have high chemical resistance. Therefore, when the conductive foil is etched with an etchant, the first primer layer 310 and the second primer layer 320 can play a role in protecting the magnetic powder contained in the magnetic sheet.

根據一實施例之天線裝置包含磁性片及設置在磁性片之至少一側上的天線圖案。An antenna device according to an embodiment includes a magnetic sheet and an antenna pattern disposed on at least one side of the magnetic sheet.

包含在天線裝置中的磁性片可具有與根據以上所描述之實施例之磁性片大體上相同的組成及性質,且亦可藉由大體上相同的方法製造。The magnetic sheet included in the antenna device may have substantially the same composition and properties as the magnetic sheet according to the embodiment described above, and may also be manufactured by a substantially same method.

因此,磁性片可具有基於具有3 MHz之頻率之交流電的100至300之磁導率、基於具有6.78 MHz之頻率之交流電的80至270之磁導率、及基於具有13.56 MHz之頻率之交流電的60至250之磁導率。Therefore, the magnetic sheet may have a magnetic permeability of 100 to 300 based on an alternating current having a frequency of 3 MHz, a magnetic permeability of 80 to 270 based on an alternating current having a frequency of 6.78 MHz, and a magnetic permeability based on an alternating current having a frequency of 13.56 MHz. Permeability of 60 to 250.

磁性片可包含黏合劑樹脂及分散在黏合劑樹脂中的磁粉。The magnetic sheet may include a binder resin and magnetic powder dispersed in the binder resin.

此外,磁性片可為具有可撓性的具有10 μm至3,000 μm之厚度的未燒結固化片。In addition, the magnetic sheet may be an unsintered cured sheet having flexibility and a thickness of 10 μm to 3,000 μm.

根據一特定實例,磁性片可基於磁性片之總重量包含70重量%至90重量%的磁粉,及6重量%至12重量%的基於聚胺基甲酸酯之樹脂、0.5重量%至2重量%的基於異氰酸酯之硬化劑、及0.3重量%至1.5重量%的基於環氧基之樹脂,作為黏合劑樹脂。另外,在此狀況下,磁粉具有式1之組成,基於聚胺基甲酸酯之樹脂包含藉由式2a及2b表示的重複單元,基於異氰酸酯之硬化劑可為脂環族二異氰酸酯,且基於環氧基之樹脂可為雙酚A型環氧樹脂、甲酚酚醛型環氧樹脂、或肆(縮水甘油基氧基苯基)乙烷型環氧樹脂。According to a specific example, the magnetic sheet may include 70% to 90% by weight of magnetic powder based on the total weight of the magnetic sheet, and 6% to 12% by weight of a polyurethane-based resin, and 0.5% to 2% by weight. % Of the isocyanate-based hardener and 0.3% to 1.5% by weight of the epoxy-based resin as the binder resin. In addition, in this state, the magnetic powder has a composition of Formula 1, the polyurethane-based resin includes a repeating unit represented by Formulas 2a and 2b, and the isocyanate-based hardener may be an alicyclic diisocyanate, and based on The epoxy resin may be a bisphenol A epoxy resin, a cresol novolac epoxy resin, or a (glycidyloxyphenyl) ethane epoxy resin.

天線圖案設置在磁性片之一側或兩側上。The antenna pattern is disposed on one or both sides of the magnetic sheet.

天線圖案可包含傳導性材料。例如,天線圖案可包含傳導性金屬。特定而言,天線圖案可包含選自由以下各項組成之群組的至少一金屬:銅、鎳、金、銀、鋅及錫。The antenna pattern may include a conductive material. For example, the antenna pattern may include a conductive metal. In particular, the antenna pattern may include at least one metal selected from the group consisting of copper, nickel, gold, silver, zinc, and tin.

根據一實施例之天線圖案之圖案形狀不特別地受限制,且例如,圖案可經形成使得可達成包含近場通訊(NFC)天線、無線電力充電(WPC)天線及磁性保全傳輸(MST)天線之該等功能的各種功能,且圖案形狀可在必要時不同地改變。另外,天線圖案可為印刷電路圖案。天線圖案可具有線圈形狀或螺旋形狀。The shape of the pattern of the antenna pattern according to an embodiment is not particularly limited, and for example, the pattern may be formed so that a near field communication (NFC) antenna, a wireless power charging (WPC) antenna, and a magnetic security transmission (MST) antenna can be achieved These functions have various functions, and the pattern shape can be changed differently if necessary. In addition, the antenna pattern may be a printed circuit pattern. The antenna pattern may have a coil shape or a spiral shape.

天線圖案可直接黏合至磁性片,且因此,天線圖案可直接處於與磁性片之一側或兩側接觸。另外,天線圖案可藉由底漆層堅固地黏合至磁性片。The antenna pattern may be directly bonded to the magnetic sheet, and thus, the antenna pattern may be directly in contact with one or both sides of the magnetic sheet. In addition, the antenna pattern can be firmly adhered to the magnetic sheet by a primer layer.

根據一較佳實施例,天線裝置包含:磁性片,其包含磁粉及黏合劑樹脂;以及第一天線圖案,其直接黏合至磁性片之一側。According to a preferred embodiment, the antenna device includes: a magnetic sheet including magnetic powder and an adhesive resin; and a first antenna pattern directly adhered to one side of the magnetic sheet.

根據另一較佳實施例,天線裝置包含:磁性片,其包含磁粉及黏合劑樹脂;第一天線圖案,其直接黏合至磁性片之一側;以及第二天線圖案,其直接黏合至磁性片之另一側。According to another preferred embodiment, the antenna device includes: a magnetic sheet including magnetic powder and an adhesive resin; a first antenna pattern directly adhered to one side of the magnetic sheet; and a second antenna pattern directly adhered to The other side of the magnetic sheet.

根據另一較佳實施例,天線裝置包含:磁性片,其包含磁粉及黏合劑樹脂;第一天線圖案,其設置在磁性片之一側上;以及第一底漆層,其設置在磁性片與第一天線圖案之間以將該磁性片及該第一天線圖案黏合在一起。According to another preferred embodiment, the antenna device includes: a magnetic sheet including a magnetic powder and an adhesive resin; a first antenna pattern provided on one side of the magnetic sheet; and a first primer layer provided on the magnetic And the first antenna pattern to adhere the magnetic sheet and the first antenna pattern together.

根據另一較佳實施例,天線裝置包含:磁性片,其包含磁粉及黏合劑樹脂;第一天線圖案,其設置在磁性片之一側上;第二天線圖案,其設置在磁性片之另一側上;第一底漆層,其設置在磁性片與第一天線圖案之間以將該磁性片及該第一天線圖案黏合在一起;以及第二底漆層,其設置在磁性片與第二天線圖案之間以將該磁性片及該第二天線圖案黏合在一起。According to another preferred embodiment, the antenna device includes: a magnetic sheet including a magnetic powder and an adhesive resin; a first antenna pattern provided on one side of the magnetic sheet; and a second antenna pattern provided on the magnetic sheet On the other side; a first primer layer provided between the magnetic sheet and the first antenna pattern to bond the magnetic sheet and the first antenna pattern together; and a second primer layer provided The magnetic sheet and the second antenna pattern are adhered together between the magnetic sheet and the second antenna pattern.

天線裝置可進一步包含穿透磁性片的通路。The antenna device may further include a passage through the magnetic sheet.

因此,天線裝置可包含磁性片;天線圖案,其設置在磁性片之一側或兩側上;以及至少一通路,其穿透磁性片且連接至天線圖案。Therefore, the antenna device may include a magnetic sheet; an antenna pattern disposed on one or both sides of the magnetic sheet; and at least one path penetrating the magnetic sheet and connected to the antenna pattern.

通路處於與設置在磁性片之兩側上的兩個天線圖案接觸以將天線圖案電氣地連接至彼此。通路可包含傳導性材料。例如,通路可包含選自由以下各項組成之群組的至少一金屬:銅、鎳、金、銀、鋅及錫。The via is in contact with two antenna patterns provided on both sides of the magnetic sheet to electrically connect the antenna patterns to each other. The pathway may include a conductive material. For example, the via may include at least one metal selected from the group consisting of copper, nickel, gold, silver, zinc, and tin.

此外,磁性片可包含垂直穿透該磁性片的通路孔。通路孔例如可具有100 μm至300 μm或120 μm至170 μm之直徑。In addition, the magnetic sheet may include a via hole that vertically penetrates the magnetic sheet. The via hole may have a diameter of, for example, 100 μm to 300 μm or 120 μm to 170 μm.

在此狀況下,第一通路孔之內壁經鍍覆,第一通路孔充滿傳導性材料,或焊料或傳導性條經插入第一通路孔中,且因此,第一通路孔可構成第一通路。例如,磁性片包含垂直穿透該磁性片的第一通路孔,且在此狀況下,第一通路孔之內壁可經鍍覆以構成第一通路。In this case, the inner wall of the first via hole is plated, the first via hole is filled with a conductive material, or solder or a conductive strip is inserted into the first via hole, and therefore, the first via hole may constitute the first path. For example, the magnetic sheet includes a first via hole penetrating the magnetic sheet vertically, and in this case, the inner wall of the first via hole may be plated to form the first via.

根據實施例之天線裝置可具有各種組態,包含天線圖案之形狀、通路及終端機之連接、或額外佈線。The antenna device according to the embodiment may have various configurations including the shape of the antenna pattern, the path and the connection of the terminal, or additional wiring.

根據一實施例,天線圖案包含設置在磁性片之一側上的第一天線圖案,天線裝置進一步包含設置在磁性片之另一側上的佈線圖案,且通路包含穿透磁性片且連接至第一天線圖案之一末端及佈線圖案之一末端的第一通路。According to an embodiment, the antenna pattern includes a first antenna pattern provided on one side of the magnetic sheet, the antenna device further includes a wiring pattern provided on the other side of the magnetic sheet, and the path includes a penetrating magnetic sheet and is connected to A first via at one end of the first antenna pattern and one end of the wiring pattern.

根據另一實施例,天線圖案由以下各者組成:多個第一傳導性線條圖案,其彼此間隔隔開平行地設置在磁性片之一側上;以及多個第二傳導性線條圖案,其彼此間隔隔開平行地設置在磁性片之另一側上,其中第一傳導性線條圖案及第二傳導性線條圖案之伸長方向為相同的,且通路由多個通路組成,該等多個通路穿透磁性片且連接第一傳導性線條圖案及第二傳導性線條圖案。According to another embodiment, the antenna pattern is composed of: a plurality of first conductive line patterns, which are disposed on one side of the magnetic sheet in parallel and spaced apart from each other; and a plurality of second conductive line patterns, which The first conductive line pattern and the second conductive line pattern have the same elongation direction and are arranged on the other side of the magnetic sheet in parallel and spaced apart from each other. The magnetic sheet penetrates and connects the first conductive line pattern and the second conductive line pattern.

在下文中,將示範性地描述天線裝置之特定實施例。Hereinafter, a specific embodiment of the antenna device will be exemplarily described.

根據一特定實施例,參考圖9,天線裝置包含磁性片100;第一天線圖案230,其設置在磁性片之一側上;佈線圖案240,其設置在磁性片之另一側上;以及用以將該磁性片及該第一天線圖案黏合在一起的佈線圖案;以及第一通路251,其穿透磁性片100,且在此狀況下,第一通路251連接至第一天線圖案230之一末端及佈線圖案240之一末端。According to a specific embodiment, referring to FIG. 9, the antenna device includes a magnetic sheet 100; a first antenna pattern 230 provided on one side of the magnetic sheet; a wiring pattern 240 provided on the other side of the magnetic sheet; and A wiring pattern for bonding the magnetic sheet and the first antenna pattern together; and a first via 251 that penetrates the magnetic sheet 100, and in this case, the first via 251 is connected to the first antenna pattern One end of 230 and one end of the wiring pattern 240.

根據一特定實施例之天線裝置可進一步包含磁性片100之一側或另一側上的第一終端機圖案及第二終端機圖案,可進一步包含第二通路252,該第二通路穿透磁性片100,且各種天線裝置可根據此等組件之位置及連接組態加以設計。The antenna device according to a specific embodiment may further include a first terminal pattern and a second terminal pattern on one side or the other side of the magnetic sheet 100, and may further include a second path 252 that penetrates the magnetic field. Chip 100, and various antenna devices can be designed according to the position and connection configuration of these components.

圖10A至圖10C為根據各種組態實例之天線裝置的平面圖(展示於圖案之黑色中的部分為前圖案、影線部分為後圖案,且指示為圓的部分為通路)。10A to 10C are plan views of antenna devices according to various configuration examples (the part shown in black in the pattern is the front pattern, the hatched part is the rear pattern, and the part indicated as a circle is a path).

在下文中,將參考圖式描述根據一特定實施例之天線裝置之更特定實例。Hereinafter, a more specific example of an antenna device according to a specific embodiment will be described with reference to the drawings.

首先,參考圖10A,根據一特定實施例之天線裝置進一步包含設置在磁性片100之一側上的第一終端機圖案271;以及穿透磁性片100的第二通路252,且在此狀況下,第二通路252可連接至第一終端機圖案271及佈線圖案240之另一末端。在此狀況下,天線裝置可進一步包含設置在磁性片100之一側上的第二終端機圖案272,且在此狀況下,第一天線圖案230之另一末端可連接至第二終端機圖案272。另外,在此狀況下,第一終端機圖案271及第二終端機圖案272可設置成彼此鄰接。First, referring to FIG. 10A, the antenna device according to a specific embodiment further includes a first terminal pattern 271 provided on one side of the magnetic sheet 100; and a second path 252 penetrating the magnetic sheet 100, and in this condition, The second via 252 may be connected to the other end of the first terminal pattern 271 and the wiring pattern 240. In this case, the antenna device may further include a second terminal pattern 272 provided on one side of the magnetic sheet 100, and in this case, the other end of the first antenna pattern 230 may be connected to the second terminal. Pattern 272. In addition, in this situation, the first terminal pattern 271 and the second terminal pattern 272 may be disposed adjacent to each other.

此外,參考圖10B,根據一特定實施例之天線裝置可進一步包含設置在磁性片100之另一側上的第一終端機圖案271,且第一終端機圖案271可連接至佈線圖案240之另一末端。在此狀況下,天線裝置可進一步包含設置在磁性片100之另一側上的第二終端機圖案272;以及穿透磁性片100的第二通路252,且第二通路252可連接至第二終端機圖案272及第一天線圖案230之另一末端。另外,在此狀況下,第一終端機圖案271及第二終端機圖案272可設置成彼此鄰接。In addition, referring to FIG. 10B, the antenna device according to a specific embodiment may further include a first terminal pattern 271 disposed on the other side of the magnetic sheet 100, and the first terminal pattern 271 may be connected to another of the wiring pattern 240. One end. In this case, the antenna device may further include a second terminal pattern 272 provided on the other side of the magnetic sheet 100; and a second path 252 penetrating the magnetic sheet 100, and the second path 252 may be connected to the second The other end of the terminal pattern 272 and the first antenna pattern 230. In addition, in this situation, the first terminal pattern 271 and the second terminal pattern 272 may be disposed adjacent to each other.

此外,參考圖10C,根據一特定實施例之天線裝置可進一步包含設置在磁性片100之另一側上的第一終端機圖案271,且第一終端機圖案271可連接至佈線圖案240之另一末端。在此狀況下,在另一組態實例中,天線裝置可進一步包含設置在磁性片100之一側上的第二終端機圖案272,且第二終端機圖案272可連接至第一天線圖案230之另一末端。In addition, referring to FIG. 10C, the antenna device according to a specific embodiment may further include a first terminal pattern 271 disposed on the other side of the magnetic sheet 100, and the first terminal pattern 271 may be connected to another of the wiring pattern 240. One end. In this case, in another configuration example, the antenna device may further include a second terminal pattern 272 provided on one side of the magnetic sheet 100, and the second terminal pattern 272 may be connected to the first antenna pattern The other end of 230.

在根據一特定實施例之天線裝置中,第一天線圖案及佈線圖案係由傳導性材料形成,第一天線圖案可黏合至磁性片之一側,且佈線圖案可黏合至磁性片之另一側。In the antenna device according to a specific embodiment, the first antenna pattern and the wiring pattern are formed of a conductive material, the first antenna pattern may be adhered to one side of the magnetic sheet, and the wiring pattern may be adhered to the other of the magnetic sheet. One side.

參考圖13,根據一特定實施例之天線裝置可藉由在第一天線圖案中流動的電流產生電磁信號50。電磁信號50致能天線裝置20與外部終端機40之間的信號傳輸及接收。Referring to FIG. 13, an antenna device according to a specific embodiment may generate an electromagnetic signal 50 by a current flowing in a first antenna pattern. The electromagnetic signal 50 enables signal transmission and reception between the antenna device 20 and the external terminal 40.

在根據一特定實施例之天線裝置中,因為第一天線圖案及佈線圖案分別設置在磁性片之不同側上且經由穿透磁性片的通路連接,所以不需要額外製程,諸如用以防止短路的佈線之綑紮,且因此,可提高製程效率。另外,因為根據實施例之天線裝置可由於用於絕緣之佈線織物而防止厚度增加,所以可進一步改良天線裝置之薄膜性質。In the antenna device according to a specific embodiment, since the first antenna pattern and the wiring pattern are respectively disposed on different sides of the magnetic sheet and connected through a path penetrating the magnetic sheet, no additional process is required, such as to prevent a short circuit The wiring is bundled, and therefore, process efficiency can be improved. In addition, since the antenna device according to the embodiment can prevent an increase in thickness due to the wiring fabric for insulation, the film properties of the antenna device can be further improved.

根據另一特定實施例,天線裝置包含磁性片;多個第一傳導性線條圖案,其彼此間隔隔開平行地設置在磁性片之一側上;多個第二傳導性線條圖案,其彼此間隔隔開平行地設置在磁性片之另一側上;以及多個通路,其經設置以穿透磁性片,且在此狀況下,第一傳導性線條圖案及第二傳導性線條圖案之伸長為相同的,且通路連接第一傳導性線條圖案及第二傳導性線條圖案。According to another specific embodiment, the antenna device includes a magnetic sheet; a plurality of first conductive line patterns disposed on one side of the magnetic sheet spaced apart from each other in parallel; a plurality of second conductive line patterns spaced from each other And spaced in parallel on the other side of the magnetic sheet; and a plurality of passages provided to penetrate the magnetic sheet, and in this case, the elongation of the first conductive line pattern and the second conductive line pattern is The same, and the vias connect the first conductive line pattern and the second conductive line pattern.

特定而言,因為通路交替地連接平行地設置成彼此間隔隔開的第一傳導性線條圖案及第二傳導性線條圖案,所以第一傳導性線條圖案之任何一末端及另一末端可分別連接至彼此鄰接的兩個第二傳導性線條圖案,且第二傳導性線條圖案之任何一末端及另一末端可分別連接至彼此鄰接的兩個第一傳導性線條圖案。In particular, since the vias are alternately connected to the first conductive line pattern and the second conductive line pattern which are arranged in parallel and spaced apart from each other, any one end and the other end of the first conductive line pattern may be connected respectively. To the two second conductive line patterns adjacent to each other, and any one end and the other end of the second conductive line pattern may be respectively connected to the two first conductive line patterns adjacent to each other.

另外,當磁性片劃分成磁心區及在磁心區周圍的周圍區時,第一傳導性線條圖案及第二傳導性線條圖案之兩個末端設置在周圍區中,同時第一傳導性線條圖案及第二傳導性線條圖案交叉磁心區,且通路設置在周圍區中以能夠連接第一傳導性線條圖案及第二傳導性線條圖案之末端。In addition, when the magnetic sheet is divided into a core region and a surrounding region around the core region, two ends of the first conductive line pattern and the second conductive line pattern are disposed in the surrounding region, and at the same time, the first conductive line pattern and The second conductive line pattern crosses the magnetic core region, and the via is disposed in the surrounding area to be able to connect the ends of the first conductive line pattern and the second conductive line pattern.

在此狀況下,第一傳導性線條圖案、第二傳導性線條圖案、及通路可彼此連接以形成包圍磁心區的線圈。In this case, the first conductive line pattern, the second conductive line pattern, and the via may be connected to each other to form a coil surrounding the magnetic core region.

參考圖11A及圖11B,根據另一特定實施例之天線裝置包含磁性片100、多個第一傳導性線條圖案231、多個第二傳導性線條圖案232、及多個通路250。11A and 11B, an antenna device according to another specific embodiment includes a magnetic sheet 100, a plurality of first conductive line patterns 231, a plurality of second conductive line patterns 232, and a plurality of vias 250.

磁性片可劃分成磁心區CR及與磁心區鄰接的周圍區OR。The magnetic sheet may be divided into a core region CR and a peripheral region OR adjacent to the core region.

磁心區設置在磁性片之中心部分中。磁心區可具有在一方向上伸長的形狀。The magnetic core region is provided in a central portion of the magnetic sheet. The magnetic core region may have a shape elongated in one direction.

周圍區設置在磁區周圍。周圍區可具有在與磁心區相同的方向上伸長的形狀。周圍區可設置在磁心區之兩個側上。The surrounding area is set around the magnetic area. The peripheral region may have a shape elongated in the same direction as the magnetic core region. The surrounding area may be provided on both sides of the magnetic core area.

第一傳導性線條圖案設置在磁性片上。特定而言,第一傳導性線條圖案黏合至磁性片之一側。The first conductive line pattern is disposed on the magnetic sheet. Specifically, the first conductive line pattern is adhered to one side of the magnetic sheet.

第一傳導性線條圖案可在交叉磁心區延伸方向的方向上延伸。特定而言,第一傳導性線條圖案可延伸以交叉磁心區。第一傳導性線條圖案可自設置在磁心區之一側上的周圍區延伸至設置在磁心區之另一側上的周圍區。The first conductive line pattern may extend in a direction crossing the extending direction of the magnetic core region. In particular, the first conductive line pattern may extend to cross the magnetic core region. The first conductive line pattern may extend from a peripheral region provided on one side of the magnetic core region to a peripheral region provided on the other side of the magnetic core region.

第一傳導性線條圖案可並排延伸。另外,第一傳導性線條圖案可彼此間隔隔開。The first conductive line pattern may extend side by side. In addition, the first conductive line patterns may be spaced apart from each other.

第二傳導性線條圖案設置在磁性片之另一側上。特定而言,第二傳導性線條圖案黏合至磁性片之另一側。The second conductive line pattern is disposed on the other side of the magnetic sheet. Specifically, the second conductive line pattern is adhered to the other side of the magnetic sheet.

第二傳導性線條圖案可在交叉磁心區延伸方向的方向上延伸。特定而言,第二傳導性線條圖案可延伸以交叉磁心區。第二傳導性線條圖案可自設置在磁心區之一側上的周圍區延伸至設置在磁心區之另一側上的周圍區。The second conductive line pattern may extend in a direction crossing the extending direction of the magnetic core region. In particular, the second conductive line pattern may extend to cross the magnetic core region. The second conductive line pattern may extend from a peripheral region provided on one side of the magnetic core region to a peripheral region provided on the other side of the magnetic core region.

第二傳導性線條圖案可並排延伸。另外,第二傳導性線條圖案可彼此間隔隔開。The second conductive line pattern may extend side by side. In addition, the second conductive line patterns may be spaced apart from each other.

通路穿透磁性片。通路連接第一傳導性線條圖案及第二傳導性線條圖案。特定而言,通路可連接至第一傳導性線條圖案之一末端及第二傳導性線條圖案之一末端。The path penetrates the magnetic sheet. The via connects the first conductive line pattern and the second conductive line pattern. Specifically, the via may be connected to one end of the first conductive line pattern and one end of the second conductive line pattern.

通路可交替地連接第一傳導性線條圖案及第二傳導性線條圖案。例如,第一傳導性線條圖案、通路、第二傳導性線條圖案、通路、第一傳導性線條圖案、通路、第二傳導性線條圖案、及通路可順序地連接。The vias may alternately connect the first conductive line pattern and the second conductive line pattern. For example, the first conductive line pattern, the via, the second conductive line pattern, the via, the first conductive line pattern, the via, the second conductive line pattern, and the via may be sequentially connected.

第一傳導性線條圖案、第二傳導性線條圖案、及通路可彼此連接以形成螺旋地包圍磁心區的線圈。The first conductive line pattern, the second conductive line pattern, and the via may be connected to each other to form a coil that spirally surrounds the magnetic core region.

因此,當交流電流過第一傳導性線條圖案、第二傳導性線條圖案及通路時,電磁信號可經由磁心區之兩個末端形成。Therefore, when an alternating current passes through the first conductive line pattern, the second conductive line pattern, and the path, an electromagnetic signal may be formed through both ends of the core region.

作為一較佳實例,磁性片可經薄薄地形成且電磁信號可以高磁通量密度經由磁心區之兩個末端形成。因此,根據實施例之天線裝置可具有改良之接收靈敏度,且可甚至在窄間隙中容易地傳輸且接收電磁信號。As a preferred example, the magnetic sheet can be formed thinly and the electromagnetic signal can be formed at both ends of the core region with a high magnetic flux density. Therefore, the antenna device according to the embodiment can have improved receiving sensitivity, and can easily transmit and receive electromagnetic signals even in a narrow gap.

根據一實施例之製造天線裝置之方法包含以下步驟:藉由將熱及壓力施加至磁性片及傳導性箔將該磁性片及該傳導性箔黏合在一起;以及蝕刻傳導性箔以在該傳導性箔中形成天線圖案。A method of manufacturing an antenna device according to an embodiment includes the steps of: bonding the magnetic sheet and the conductive foil together by applying heat and pressure to the magnetic sheet and the conductive foil; and etching the conductive foil to conduct the conductive An antenna pattern is formed in the flexible foil.

根據一較佳實施例,製造天線裝置之方法包含以下步驟:製造包含磁粉及黏合劑樹脂之磁性片;堆疊磁性片及第一傳導性箔;將熱及壓力施加至獲得的堆疊以黏合磁性片至第一傳導性箔;以及蝕刻第一傳導性箔以在該第一傳導性箔中形成第一天線圖案。According to a preferred embodiment, a method of manufacturing an antenna device includes the following steps: manufacturing a magnetic sheet including magnetic powder and an adhesive resin; stacking a magnetic sheet and a first conductive foil; applying heat and pressure to the obtained stack to bond the magnetic sheet To the first conductive foil; and etching the first conductive foil to form a first antenna pattern in the first conductive foil.

根據另一較佳實施例,製造天線裝置之方法包含以下步驟:製造包含磁粉及黏合劑樹脂之磁性片;堆疊第一傳導性箔、磁性片及第二傳導性箔;以及將熱及壓力施加至獲得的堆疊以將第一傳導性箔、磁性片及第二傳導性箔黏合在一起;以及蝕刻第一傳導性箔及第二傳導性箔以分別在該第一傳導性箔及該第二傳導性箔中形成第一天線圖案及第二天線圖案。According to another preferred embodiment, a method of manufacturing an antenna device includes the steps of: manufacturing a magnetic sheet including magnetic powder and an adhesive resin; stacking a first conductive foil, a magnetic sheet, and a second conductive foil; and applying heat and pressure To the obtained stack to bond the first conductive foil, the magnetic sheet, and the second conductive foil together; and etching the first conductive foil and the second conductive foil to the first conductive foil and the second conductive foil, respectively A first antenna pattern and a second antenna pattern are formed in the conductive foil.

根據另一較佳實施例,製造天線裝置之方法包含以下步驟:製造包含磁粉及黏合劑樹脂之磁性片;將第一底漆層形成於第一傳導性箔之一側上;堆疊磁性片及第一傳導性箔,使得磁性片之一側處於與第一傳導性箔之第一底漆層接觸;將熱及壓力施加至獲得的堆疊以將磁性片黏合至第一傳導性箔;以及蝕刻第一傳導性箔以在該第一傳導性箔中形成第一天線圖案。According to another preferred embodiment, a method of manufacturing an antenna device includes the following steps: manufacturing a magnetic sheet including magnetic powder and an adhesive resin; forming a first primer layer on one side of a first conductive foil; stacking the magnetic sheet and A first conductive foil such that one side of the magnetic sheet is in contact with the first primer layer of the first conductive foil; applying heat and pressure to the obtained stack to adhere the magnetic sheet to the first conductive foil; and etching The first conductive foil forms a first antenna pattern in the first conductive foil.

根據另一較佳實施例,製造天線裝置之方法包含以下步驟:製造包含磁粉及黏合劑樹脂之磁性片;將第一底漆層形成於第一傳導性箔之一側上;將第二底漆層形成於第二傳導性箔之一側上;堆疊磁性片及第一傳導性箔,使得磁性片之一側處於與第一傳導性箔之第一底漆層接觸;堆疊磁性片及第二傳導性箔,使得磁性片之另一側處於與第二傳導性箔之第二底漆層接觸;將熱及壓力施加至獲得的堆疊以將第一傳導性箔、磁性片及第二傳導性箔黏合在一起;以及蝕刻第一傳導性箔及第二傳導性箔以分別在該第一傳導性箔及該第二傳導性箔中形成第一天線圖案及第二天線圖案。According to another preferred embodiment, a method for manufacturing an antenna device includes the following steps: manufacturing a magnetic sheet including magnetic powder and an adhesive resin; forming a first primer layer on one side of a first conductive foil; and forming a second primer The lacquer layer is formed on one side of the second conductive foil; the magnetic sheet and the first conductive foil are stacked so that one side of the magnetic sheet is in contact with the first primer layer of the first conductive foil; the magnetic sheet and the first conductive foil are stacked; Two conductive foils so that the other side of the magnetic sheet is in contact with the second primer layer of the second conductive foil; heat and pressure are applied to the obtained stack to place the first conductive foil, the magnetic sheet, and the second conductive The conductive foils are bonded together; and the first conductive foil and the second conductive foil are etched to form a first antenna pattern and a second antenna pattern in the first conductive foil and the second conductive foil, respectively.

方法中所使用的磁性片可具有與根據實施例之以上描述之磁性片大體上相同的組成及性質。The magnetic sheet used in the method may have substantially the same composition and properties as the magnetic sheet described above according to the embodiment.

作為一特定實例,磁性片可基於磁性片之總重量包括70重量%至90重量%的磁粉,及6重量%至12重量%的基於聚胺基甲酸酯之樹脂、0.5重量%至2重量%的基於異氰酸酯之硬化劑、及0.3重量%至1.5重量%的基於環氧基之樹脂,作為黏合劑樹脂。另外,在此狀況下,磁粉具有式1之組成,基於聚胺基甲酸酯之樹脂包含藉由式2a及2b表示的重複單元,基於異氰酸酯之硬化劑可為脂環族二異氰酸酯,且基於環氧基之樹脂可為雙酚A型環氧樹脂、甲酚酚醛型環氧樹脂、或肆(縮水甘油基氧基苯基)乙烷型環氧樹脂。As a specific example, the magnetic sheet may include 70% to 90% by weight of magnetic powder based on the total weight of the magnetic sheet, and 6% to 12% by weight of a polyurethane-based resin, 0.5% to 2% by weight. % Of the isocyanate-based hardener and 0.3% to 1.5% by weight of the epoxy-based resin as the binder resin. In addition, in this state, the magnetic powder has a composition of Formula 1, the polyurethane-based resin includes a repeating unit represented by Formulas 2a and 2b, and the isocyanate-based hardener may be an alicyclic diisocyanate, and based on The epoxy resin may be a bisphenol A epoxy resin, a cresol novolac epoxy resin, or a (glycidyloxyphenyl) ethane epoxy resin.

另外,磁性片可藉由與根據實施例之製造磁性片之以上描述之方法大體上相同的條件及方法製造。In addition, the magnetic sheet can be manufactured by substantially the same conditions and methods as the method described above for manufacturing the magnetic sheet according to the embodiment.

特定而言,磁性片可藉由包含以下步驟之方法製造:(a)混合基於聚胺基甲酸酯之樹脂、基於異氰酸酯之硬化劑、及基於環氧基之樹脂以製造黏合劑樹脂;(b)將磁粉及有機溶劑與黏合劑樹脂混合以製造漿料;以及(c)將漿料模製成處形式且乾燥片。Specifically, the magnetic sheet can be manufactured by a method including the following steps: (a) mixing a polyurethane-based resin, an isocyanate-based hardener, and an epoxy-based resin to manufacture a binder resin; b) mixing magnetic powder and an organic solvent with a binder resin to produce a slurry; and (c) molding the slurry into a compact form and a dry sheet.

傳導性磁性複合片係藉由施加熱及壓力之步驟製造,且特定製程條件及方法與傳導性磁性複合片之以上描述之製造方法相同。The conductive magnetic composite sheet is manufactured by applying heat and pressure, and the specific process conditions and methods are the same as the manufacturing method of the conductive magnetic composite sheet described above.

在蝕刻步驟中,遮罩圖案係使用光阻劑形成於傳導性箔上,且傳導性箔使用遮罩圖案蝕刻以經圖案化。蝕刻可藉由使用諸如水性酸溶液之典型蝕刻劑執行,且在此狀況下,因為磁性片由底漆層保護,所以可存在藉由蝕刻劑的極少厚度或磁導率減少。另外,即使蝕刻劑穿透至磁性片中,亦可由於磁性片之極好的耐化學性而存在厚度或磁導率之極少減少。In the etching step, the mask pattern is formed on the conductive foil using a photoresist, and the conductive foil is etched using the mask pattern to be patterned. Etching may be performed by using a typical etchant such as an aqueous acid solution, and in this case, because the magnetic sheet is protected by a primer layer, there may be a very small thickness or a reduction in magnetic permeability by the etchant. In addition, even if the etchant penetrates into the magnetic sheet, there is little reduction in thickness or magnetic permeability due to the excellent chemical resistance of the magnetic sheet.

較佳地,施加熱及壓力係在1 MPa至100 MPa之壓力及100℃至300℃之溫度下執行,且蝕刻可藉由使用水性酸溶液執行。Preferably, the application of heat and pressure is performed at a pressure of 1 MPa to 100 MPa and a temperature of 100 ° C to 300 ° C, and the etching can be performed by using an aqueous acid solution.

製造天線裝置之方法可進一步包含在施加熱及壓力之步驟與蝕刻步驟之間形成經組配來穿透磁性片(及底漆層)的通路之製程。The method of manufacturing the antenna device may further include a process of forming a path configured to penetrate the magnetic sheet (and the primer layer) between the step of applying heat and pressure and the step of etching.

圖12A至圖12C例示製造具有通路之天線裝置之方法之一實例。12A to 12C illustrate an example of a method of manufacturing an antenna device having a via.

首先,如圖12A中所例示,多個通路孔260經形成於傳導性磁性複合片上。通路孔260穿透磁性片100,以及第一傳導性箔210及第二傳導性箔220。通路孔例如可具有100 μm至300 μm、或120 μm至170 μm之直徑。First, as illustrated in FIG. 12A, a plurality of via holes 260 are formed on a conductive magnetic composite sheet. The via hole 260 penetrates the magnetic sheet 100 and the first conductive foil 210 and the second conductive foil 220. The via hole may have a diameter of, for example, 100 μm to 300 μm, or 120 μm to 170 μm.

此後,如圖12B中所例示,通路250可藉由將鍍覆層形成於通路孔260之內表面上形成。在通路藉由鍍覆製程形成之狀況下,可立即形成形成於大面積中的通路。亦即,在通路經形成為鍍覆層之狀況下,可容易地且有效地形成通路。另外,通路可藉由在通路孔中充滿傳導性粉且隨後燒結傳導性粉形成。此外,通路可藉由將焊料或傳導性條插入通路孔中形成。Thereafter, as illustrated in FIG. 12B, the via 250 may be formed by forming a plating layer on the inner surface of the via hole 260. In the case where the via is formed by a plating process, a via formed in a large area can be immediately formed. That is, in the case where the via is formed as a plating layer, the via can be easily and efficiently formed. In addition, the via may be formed by filling the via hole with a conductive powder and then sintering the conductive powder. In addition, vias can be formed by inserting solder or conductive strips into the via holes.

此後,遮罩圖案藉由諸如用於覆蓋第一傳導性箔210及第二傳導性箔220之光阻劑製程之製程形成,且如圖12C中所例示,第一傳導性箔210藉由遮罩圖案選擇性地蝕刻以形成第一天線圖案230。Thereafter, the mask pattern is formed by a process such as a photoresist process for covering the first conductive foil 210 and the second conductive foil 220, and as illustrated in FIG. 12C, the first conductive foil 210 is masked by The mask pattern is selectively etched to form a first antenna pattern 230.

在此狀況下,磁性片之黏合劑樹脂緊密地附接至天線圖案。亦即,磁性片之黏合劑樹脂藉由熱固化製程黏合至天線圖案。因此,在刻蝕製程中,蝕刻劑在磁性片與天線圖案之間不穿透。因此,天線圖案可以改良之黏著強度黏合至磁性片。因此,厚度可減少且製造製程可藉由在無諸如聚醯亞胺之絕緣基板的情況下將傳導性箔或天線圖案直接形成於磁性片上簡化。In this state, the adhesive resin of the magnetic sheet is closely attached to the antenna pattern. That is, the adhesive resin of the magnetic sheet is adhered to the antenna pattern by a thermal curing process. Therefore, in the etching process, the etchant does not penetrate between the magnetic sheet and the antenna pattern. Therefore, the antenna pattern can be adhered to the magnetic sheet with improved adhesive strength. Therefore, the thickness can be reduced and the manufacturing process can be simplified by forming a conductive foil or antenna pattern directly on the magnetic sheet without an insulating substrate such as polyimide.

另外,在磁性片及傳導性箔藉由底漆層之熱固化彼此穩固地黏合之狀況下,藉由蝕刻製程形成的第一天線圖案亦可以改良之黏著強度黏合至磁性片。因此,關於根據實施例之天線裝置,磁性片與天線圖案之間的黏合強度可藉由設置在磁性片與天線圖案之間的底漆層改良,且底漆層可保護磁性片免受外部環境影響。In addition, under the condition that the magnetic sheet and the conductive foil are firmly adhered to each other by thermal curing of the primer layer, the first antenna pattern formed by the etching process can also be adhered to the magnetic sheet with improved adhesive strength. Therefore, regarding the antenna device according to the embodiment, the adhesion strength between the magnetic sheet and the antenna pattern can be improved by the primer layer provided between the magnetic sheet and the antenna pattern, and the primer layer can protect the magnetic sheet from the external environment. influences.

另外,根據實施例之天線裝置具有極好的磁性性質,所以天線裝置可用於多個應用,諸如NFC、WPC及MST。此外,因為使用聚合磁性片,所以根據實施例之天線裝置可改良可撓性,且因為天線裝置可藉由輥對輥製程製造,所以可改良加工性。In addition, the antenna device according to the embodiment has excellent magnetic properties, so the antenna device can be used in multiple applications such as NFC, WPC, and MST. In addition, since a polymeric magnetic sheet is used, the antenna device according to the embodiment can improve flexibility, and since the antenna device can be manufactured by a roll-to-roll process, processability can be improved.

特定而言,在磁性片中,因為黏合劑樹脂藉由熱固化以能夠更穩固地保持磁粉,所以即使環境改變,例如,執行蝕刻處置以用於圖案化,或執行迴焊或軟焊製程以用於磁性片至產品之施加,亦可存在極小的重量及厚度改變。In particular, in the magnetic sheet, because the adhesive resin is thermally cured to hold the magnetic powder more stably, even if the environment changes, for example, an etching process is performed for patterning, or a reflow or soldering process is performed to For the application of magnetic sheets to products, there can also be minimal weight and thickness changes.

根據一實施例之攜帶式終端機包含外殼及設置在外殼中的天線裝置,其中該外殼包含電磁波傳輸區電磁波非傳輸區,該天線裝置包含磁性片;多個第一傳導性線條圖案,其彼此間隔隔開平行地設置在磁性片之一側上;多個第二傳導性線條圖案,其彼此間隔隔開平行地設置在磁性片之另一側上;以及多個通路,其穿透磁性片,第一傳導性線條圖案及第二傳導性線條圖案之伸長方向為相同的,且電磁波傳輸區與第一傳導性線條圖案及第二傳導性線條圖案平行地設置。A portable terminal according to an embodiment includes a housing and an antenna device disposed in the housing, wherein the housing includes an electromagnetic wave transmission area and an electromagnetic wave non-transmission area, the antenna device includes a magnetic sheet, and a plurality of first conductive line patterns, which are A plurality of second conductive line patterns are provided on the other side of the magnetic sheet in parallel and spaced apart from each other; and a plurality of passages that penetrate the magnetic sheet are provided in parallel and spaced apart from each other. The elongation directions of the first conductive line pattern and the second conductive line pattern are the same, and the electromagnetic wave transmission region is disposed in parallel with the first conductive line pattern and the second conductive line pattern.

特定而言,磁性片劃分成磁心區及在磁心區周圍的周圍區,第一傳導性線條圖案及第二傳導性線條圖案之兩個末端設置在周圍區中,同時第一傳導性線條圖案及第二傳導性線條圖案交叉磁心區,且通路設置在周圍區中以連接第一傳導性線條圖案及第二傳導性線條圖案之末端。Specifically, the magnetic sheet is divided into a magnetic core region and a surrounding region around the magnetic core region, and two ends of the first conductive line pattern and the second conductive line pattern are disposed in the surrounding region, while the first conductive line pattern and The second conductive line pattern crosses the magnetic core region, and the path is disposed in the surrounding region to connect the ends of the first conductive line pattern and the second conductive line pattern.

此外,第一傳導性線條圖案、第二傳導性線條圖案、及通路可彼此連接以形成包圍磁心區的線圈。In addition, the first conductive line pattern, the second conductive line pattern, and the via may be connected to each other to form a coil surrounding the magnetic core region.

天線裝置在垂直於第一傳導性線條圖案及第二傳導性線條圖案之伸長方向的方向上產生電磁信號,且電磁信號經由電磁波傳輸區通向外殼外側。The antenna device generates an electromagnetic signal in a direction perpendicular to the elongation direction of the first conductive line pattern and the second conductive line pattern, and the electromagnetic signal is passed to the outside of the housing through the electromagnetic wave transmission area.

例如,電磁波傳輸區包含玻璃或塑膠,且電磁波非傳輸區包含金屬。For example, the electromagnetic wave transmission region includes glass or plastic, and the electromagnetic wave non-transmission region includes metal.

圖14例示其中使用根據一實施例之天線裝置的攜帶式終端機之一部分。參考圖14,天線裝置20設置在外殼30中。外殼30包含電磁波傳輸區32及電磁波非傳輸區31。電磁波非傳輸區可包含阻擋電磁波的材料,例如,金屬。電磁波傳輸區可包含電磁波可容易地穿透的材料,例如,玻璃或塑膠。即使傳輸區經狹窄地形成,根據實施例之天線裝置可與外部終端機40有效地傳輸且接收電磁信號50。FIG. 14 illustrates a part of a portable terminal in which an antenna device according to an embodiment is used. Referring to FIG. 14, the antenna device 20 is disposed in a case 30. The casing 30 includes an electromagnetic wave transmission region 32 and an electromagnetic wave non-transmission region 31. The electromagnetic wave non-transmission region may include a material that blocks electromagnetic waves, for example, a metal. The electromagnetic wave transmission region may include a material through which electromagnetic waves can easily penetrate, such as glass or plastic. Even if the transmission area is formed narrowly, the antenna device according to the embodiment can effectively transmit and receive the electromagnetic signal 50 with the external terminal 40.

因為習知天線裝置藉由其中天線圖案形成於諸如聚醯亞胺之絕緣基板層上的方法製造,且磁性片經添加至該絕緣基板層,所以即使傳導性線條圖案形成於基板層之兩側上且經由通路交替地連接,電磁信號亦藉由添加至基板層之一側上的磁性片阻擋。相反,關於根據實施例之天線裝置,因為磁性片經用作基板層以在該磁性片之兩側上形成傳導性線條圖案且傳導性線條圖案經由通路交替地連接以形成線圈,所以電磁信號之傳輸不受阻擋且可由於磁性片之極好的磁性性質而獲得改良之通訊靈敏度。實例 Since the conventional antenna device is manufactured by a method in which an antenna pattern is formed on an insulating substrate layer such as polyimide, and a magnetic sheet is added to the insulating substrate layer, even if a conductive line pattern is formed on both sides of the substrate layer Are connected alternately via vias, and electromagnetic signals are also blocked by magnetic sheets added to one side of the substrate layer. In contrast, regarding the antenna device according to the embodiment, since the magnetic sheet is used as a substrate layer to form conductive line patterns on both sides of the magnetic sheet and the conductive line patterns are alternately connected via a path to form a coil, the electromagnetic signals are Transmission is unobstructed and improved communication sensitivity can be obtained due to the excellent magnetic properties of the magnetic sheet. Examples

在下文中,將示範性地描述更特定實例。In the following, more specific examples will be exemplarily described.

以下實例中所使用的材料如下: -鋁矽鐵粉:CIF-02A, Crystallite Technology -聚胺基甲酸酯樹酯:UD1357, Dainichiseika Color & Chemicals Mfg. Co. Ltd. -異氰酸酯基硬化劑:異佛爾酮二異氰酸酯,Sigma-Aldrich -基於環氧基之樹脂:雙酚A型環氧樹脂(環氧當量=189 g/eq),EpikoteTM 828, Japan Epoxy Resin 實例1:磁性片之製造 步驟1)磁粉漿料之製造The materials used in the following examples are as follows:-Aluminosilicate iron powder: CIF-02A, Crystallite Technology-Polyurethane resin: UD1357, Dainichiseika Color & Chemicals Mfg. Co. Ltd.-Isocyanate-based hardener: iso Furone diisocyanate, Sigma-Aldrich-epoxy-based resin: bisphenol A epoxy resin (epoxy equivalent = 189 g / eq), Epikote TM 828, Japan Epoxy Resin Example 1: Manufacturing steps of magnetic sheet 1) Manufacturing of magnetic powder slurry

42.8重量份的鋁矽鐵粉作為磁粉、15.4重量份的基於聚胺基甲酸酯之樹脂分散液(25重量%的基於聚胺基甲酸酯之樹脂、75重量%的2-丁酮)、1.0重量份的基於異氰酸酯之硬化劑分散液(62重量%的基於異氰酸酯之硬化劑、25重量%的乙酸正丁酯、13重量%的2-丁酮)、0.4重量份的基於環氧基之樹脂分散液(70重量%的基於環氧基之樹脂、3重量%的乙酸正丁酯、15重量%的2-丁酮、13重量%的甲苯)、及40.5重量份的甲苯在行星式混合器中以約40 rpm至約50 rpm之速度混合約2小時以製造磁粉漿料。 步驟2)磁性片之製造42.8 parts by weight of aluminosilicon powder as magnetic powder, 15.4 parts by weight of polyurethane-based resin dispersion (25% by weight of polyurethane-based resin, 75% by weight of 2-butanone) 1.0 parts by weight of an isocyanate-based hardener dispersion (62% by weight of an isocyanate-based hardener, 25% by weight of n-butyl acetate, 13% by weight of 2-butanone), 0.4 parts by weight of an epoxy group Resin dispersion (70% by weight of epoxy-based resin, 3% by weight of n-butyl acetate, 15% by weight of 2-butanone, 13% by weight of toluene), and 40.5 parts by weight of toluene in a planetary system Mix in a mixer at a speed of about 40 rpm to about 50 rpm for about 2 hours to make a magnetic powder slurry. Step 2) Manufacturing of magnetic sheet

以上製造之磁粉漿料藉由逗點塗佈機塗佈於載體膜上且在約110℃之溫度下乾燥以製造乾磁性片。藉由使用熱壓製程在約170℃之溫度及約9 MPa之壓力下壓縮固化乾磁性片約30分鐘獲得最終磁性片。 實例2:銅箔積層磁性複合片之製造The magnetic powder slurry manufactured above was coated on a carrier film by a comma coater and dried at a temperature of about 110 ° C to manufacture a dry magnetic sheet. The final magnetic sheet was obtained by compressing and curing the dry magnetic sheet at a temperature of about 170 ° C. and a pressure of about 9 MPa using a hot pressing process for about 30 minutes. Example 2: Manufacturing of copper foil laminated magnetic composite sheet

約37 μm厚的銅箔之一側以基於環氧基之樹脂塗佈以形成約4 μm厚的底漆層。銅箔經設置於在實例1中獲得的磁性片之兩個側上,且堆疊經形成使得底漆層設置在磁性片與銅箔之間。此後,藉由熱壓製程在約170℃之溫度及約9 MPa之壓力下將堆疊壓縮約60分鐘以固化底漆層,且因此,製造銅箔積層磁性複合片。 實例3:天線裝置之製造One side of a copper foil having a thickness of about 37 μm was coated with an epoxy-based resin to form a primer layer having a thickness of about 4 μm. A copper foil was provided on both sides of the magnetic sheet obtained in Example 1, and a stack was formed so that a primer layer was provided between the magnetic sheet and the copper foil. Thereafter, the stack was compressed by a hot pressing process at a temperature of about 170 ° C. and a pressure of about 9 MPa for about 60 minutes to cure the primer layer, and thus, a copper foil laminated magnetic composite sheet was manufactured. Example 3: Manufacturing of antenna devices

使用鑽頭將具有約0.15 mm之直徑的多個通路孔形成於在實例2中獲得的銅箔積層磁性複合片中。此後,藉由鍍銅製程將鍍銅層形成於通路孔之內側上。鍍覆層充當將銅箔之頂部表面及底部表面彼此連接的通路。此後,將遮罩圖案形成於銅箔積層磁性複合片之頂部表面及底部表面上,且藉由蝕刻製程蝕刻銅箔之一部分。因此,獲得具有上圖案及下圖案的天線裝置。A plurality of via holes having a diameter of about 0.15 mm were formed in the copper foil laminated magnetic composite sheet obtained in Example 2 using a drill. Thereafter, a copper plating layer is formed on the inner side of the via hole by a copper plating process. The plating layer serves as a via connecting the top surface and the bottom surface of the copper foil to each other. Thereafter, a mask pattern is formed on the top surface and the bottom surface of the copper foil laminated magnetic composite sheet, and a part of the copper foil is etched by an etching process. Therefore, an antenna device having an upper pattern and a lower pattern is obtained.

根據以下程序測試在實例1中製造的磁性片、在實例2中製造的銅箔積層磁性複合片、及在實例3中製造的天線裝置。 實驗實例1.磁導率量測The magnetic sheet manufactured in Example 1, the copper foil laminated magnetic composite sheet manufactured in Example 2, and the antenna device manufactured in Example 3 were tested according to the following procedures. Experimental example 1. Permeability measurement

藉由使用阻抗分析器量測磁性片之磁導率及磁損耗。其結果概括於以下表1中。 [表1] The magnetic permeability and magnetic loss of the magnetic sheet are measured by using an impedance analyzer. The results are summarized in Table 1 below. [Table 1]

如表1中所例示,根據實施例之磁性片在所有三個頻帶中具有極好的磁導率。 實驗實例2.耐熱性量測(迴焊試驗)As exemplified in Table 1, the magnetic sheet according to the embodiment has excellent magnetic permeability in all three frequency bands. Experimental example 2. Heat resistance measurement (reflow test)

在熱處置條件下執行兩次迴焊試驗,其中磁性片、銅箔積層磁性複合片、及天線裝置經置放於爐中,爐之溫度以恆定速率自30℃增加至240℃持續200秒,且隨後爐之溫度以恆定速率自240℃降低至130℃持續100秒(參見圖15)。此後,量測磁性片、銅箔積層磁性複合片、及天線裝置中每一個之厚度、磁導率及黏合強度之改變。Two reflow tests were performed under thermal processing conditions, in which the magnetic sheet, copper foil laminated magnetic composite sheet, and antenna device were placed in a furnace, and the temperature of the furnace was increased at a constant rate from 30 ° C to 240 ° C for 200 seconds. And then the temperature of the furnace was reduced at a constant rate from 240 ° C to 130 ° C for 100 seconds (see Figure 15). Thereafter, changes in thickness, magnetic permeability, and adhesive strength of each of the magnetic sheet, the copper foil laminated magnetic composite sheet, and the antenna device were measured.

因此,甚至在迴焊試驗執行兩次之後,在磁性片之整個表面上未觀察到氣泡。另外,在迴焊試驗執行兩次之後,磁性片之厚度及磁導率之改變分別量測為小於5%。此外,在迴焊試驗執行兩次之後,磁性片與銅之間的剝離強度量測為0.6 kgf/cm或更大。 實驗實例3.耐熱性量測(Pb漂浮試驗)Therefore, even after the reflow test was performed twice, no bubbles were observed on the entire surface of the magnetic sheet. In addition, after the reflow test was performed twice, changes in the thickness and permeability of the magnetic sheet were measured to be less than 5%, respectively. In addition, after the reflow test was performed twice, the peel strength measurement between the magnetic sheet and copper was measured to be 0.6 kgf / cm or more. Experimental example 3. Heat resistance measurement (Pb floating test)

磁性片及銅箔積層磁性複合片經漂浮在熔融鉛浴中且靜置40秒,且隨後觀察其表面。因此,在磁性片及銅箔積層磁性複合片之整個表面上未觀察到氣泡。 實驗實例4.耐化學性量測The magnetic sheet and the copper foil laminated magnetic composite sheet were floated in a molten lead bath and allowed to stand for 40 seconds, and then the surfaces were observed. Therefore, no bubbles were observed on the entire surface of the magnetic sheet and the copper foil laminated magnetic composite sheet. Experimental example 4. Chemical resistance measurement

將磁性片浸入2N HCl水溶液中約30分鐘,且隨後量測磁性片之質量、厚度、及磁導率之改變。另外,將磁性片浸入2N NaOH水溶液中約30分鐘,且隨後量測磁性片之質量、厚度、及磁導率之改變。因此,磁粉之沉澱在溶液之底部處不發生,且磁性片之質量、厚度、及磁導率之改變分別量測為5%或更少。 實驗實例5.耐生銹性量測The magnetic sheet was immersed in a 2N HCl aqueous solution for about 30 minutes, and then changes in the mass, thickness, and permeability of the magnetic sheet were measured. In addition, the magnetic sheet was immersed in a 2N NaOH aqueous solution for about 30 minutes, and then changes in the mass, thickness, and permeability of the magnetic sheet were measured. Therefore, precipitation of magnetic powder does not occur at the bottom of the solution, and changes in the mass, thickness, and permeability of the magnetic sheet are measured as 5% or less, respectively. Experimental example 5. Measurement of rust resistance

根據基於KS D9502的鹽噴試驗在35℃下將具有5%之濃度的中性NaCl鹽水以1毫升/小時至2毫升/小時之平均速率噴塗於磁性片上持續72小時,且隨後觀察生銹之發生。作為藉由面積法(額定數方法)量測生銹之發生的結果,9.8或更大之額定數經量測(額定數方法為藉由腐蝕面積與有效面積之比率指示的腐蝕程度的評估方法,其中腐蝕程度在自0至10的標度上評級)。 實驗實例6.剝離強度量測According to the salt spray test based on KS D9502, neutral NaCl brine having a concentration of 5% was sprayed on the magnetic sheet at an average rate of 1 ml / hour to 2 ml / hour at 35 ° C for 72 hours, and then the rusty occur. As a result of measuring the occurrence of rust by the area method (rated number method), a rated number of 9.8 or more was measured (the rated number method is an evaluation method of the degree of corrosion indicated by the ratio of the corrosion area to the effective area). , Where the degree of corrosion is rated on a scale from 0 to 10). Experimental example 6. Peel strength measurement

使用萬能試驗機(UTM)量測銅箔積層磁性複合片之磁性片與銅箔之間的剝離強度。因此,0.6 kgf/cm或更大之剝離強度經量測。 實驗實例7.黏合強度量測(橫割試驗)The peel strength between the magnetic sheet of the copper foil laminated magnetic composite sheet and the copper foil was measured using a universal testing machine (UTM). Therefore, a peel strength of 0.6 kgf / cm or more is measured. Experimental example 7. Adhesive strength measurement (cross cutting test)

藉由橫割試驗(ASTM D3369)量測銅箔積層磁性複合片之磁性片與銅箔之間的黏合強度。作為橫割試驗之結果,0/100至5/100之黏合強度經量測。 實驗實例8.耐高溫及高濕度量測The cross-cut test (ASTM D3369) was used to measure the bonding strength between the magnetic sheet of the copper foil laminated magnetic composite sheet and the copper foil. As a result of the cross-cut test, the adhesive strength of 0/100 to 5/100 was measured. Experimental example 8. High temperature resistance and high humidity measurement

將磁性片靜置在85℃/85% RH下的恆溫恆濕爐中72小時,且隨後量測磁性片之厚度及磁導率之改變。因此,磁性片之厚度及磁導率之改變分別量測為5%或更少。 實例4:磁性片之製造The magnetic sheet was left to stand in a constant temperature and humidity furnace at 85 ° C / 85% RH for 72 hours, and then the thickness and magnetic permeability changes of the magnetic sheet were measured. Therefore, changes in the thickness and magnetic permeability of the magnetic sheet were measured as 5% or less, respectively. Example 4: Manufacturing of magnetic sheet

藉由重複實例1之步驟(1)及(2)之程序,但藉由在步驟(1)中將有機塗佈鋁矽鐵粉用作磁粉來製造磁性片。 實驗實例9.擊穿電壓量測A magnetic sheet was manufactured by repeating the procedures of steps (1) and (2) of Example 1, but by using an organic-coated alumino-silicon iron powder as the magnetic powder in step (1). Experimental example 9. Measurement of breakdown voltage

將電極安裝在於實例1及4中獲得的磁性片中每一個之兩個側上,且藉由施加電壓同時逐漸地增加電壓來量測擊穿電壓。The electrodes were mounted on both sides of each of the magnetic sheets obtained in Examples 1 and 4, and the breakdown voltage was measured by applying a voltage while gradually increasing the voltage.

因此,在實例1中獲得的磁性片具有4 kV之擊穿電壓,且在實例4中獲得的磁性片具有4.3 kV之擊穿電壓。 實驗實例10.絕緣性質量測Therefore, the magnetic sheet obtained in Example 1 had a breakdown voltage of 4 kV, and the magnetic sheet obtained in Example 4 had a breakdown voltage of 4.3 kV. Experimental example 10. Insulation quality test

藉由使用在實例4中獲得的磁性片以與實例2中相同的方式製造銅箔積層磁性複合片。此後,將具有400 μm之直徑的兩個通路孔形成於銅箔積層磁性複合片中,且以與實例3中相同的方式在通路孔之內側上執行鍍銅。另外,藉由以與實例3中相同的方式蝕刻銅箔形成上圖案及下圖案,但不允許兩個通路孔與圖案連接。此後,當電流流過兩個通路孔中,量測兩個通路孔之間的電阻。A copper foil laminated magnetic composite sheet was manufactured in the same manner as in Example 2 by using the magnetic sheet obtained in Example 4. Thereafter, two via holes having a diameter of 400 μm were formed in the copper foil laminated magnetic composite sheet, and copper plating was performed on the inside of the via holes in the same manner as in Example 3. In addition, the upper pattern and the lower pattern were formed by etching the copper foil in the same manner as in Example 3, but the two via holes were not allowed to be connected to the pattern. Thereafter, when a current flows through the two via holes, the resistance between the two via holes is measured.

在此狀況下,當將兩個通路孔之間的間隔不同地改變至500 μm、700 μm、900 μm、1,100 μm、1,400 μm、2,400 μm、4,400 μm、6,400 μm、及8,400 μm時量測電阻。In this case, the resistance was measured when the interval between the two via holes was changed to 500 μm, 700 μm, 900 μm, 1,100 μm, 1,400 μm, 2,400 μm, 4,400 μm, 6,400 μm, and 8,400 μm. .

此外,在聚醯亞胺層及黏著劑層進一步插入銅箔與磁性片之間以製造複合片且以不同間隔的兩個通路孔按以上描述之方式形成之後量測電阻。In addition, the resistance was measured after the polyimide layer and the adhesive layer were further inserted between the copper foil and the magnetic sheet to make a composite sheet, and two via holes at different intervals were formed in the manner described above.

因此,實施例之磁性片對於通路孔之間的所有間隔及複合片之組態具有無限電阻值。Therefore, the magnetic sheet of the embodiment has infinite resistance values for all spaces between via holes and the configuration of the composite sheet.

CR‧‧‧磁心區 CR‧‧‧Core Area

OR‧‧‧周圍區 OR‧‧‧ Surrounding area

10‧‧‧堆疊 10‧‧‧ stacked

20、20'‧‧‧天線裝置 20, 20'‧‧‧ Antenna device

30'‧‧‧金屬外殼 30'‧‧‧ metal case

30‧‧‧外殼 30‧‧‧ shell

31‧‧‧電磁波非傳輸區 31‧‧‧ electromagnetic wave non-transmission area

32‧‧‧電磁波傳輸區 32‧‧‧ electromagnetic wave transmission area

40‧‧‧外部終端 40‧‧‧ external terminal

40'‧‧‧外部終端機 40'‧‧‧ external terminal

50、50'‧‧‧電磁信號 50, 50'‧‧‧ electromagnetic signal

100‧‧‧磁性片/乾磁性片 100‧‧‧Magnetic sheet / Dry magnetic sheet

101‧‧‧乾磁性片 101‧‧‧ dry magnetic sheet

110‧‧‧磁粉 110‧‧‧ Magnetic Powder

120、121‧‧‧黏合劑樹脂 120, 121‧‧‧ Adhesive resin

210‧‧‧第一傳導性箔 210‧‧‧The first conductive foil

220‧‧‧第二傳導性箔 220‧‧‧Second conductive foil

230‧‧‧第一天線圖案 230‧‧‧First antenna pattern

231‧‧‧第一傳導性線條圖案 231‧‧‧The first conductive line pattern

232‧‧‧第二傳導性線條圖案 232‧‧‧Second conductive line pattern

240‧‧‧佈線圖案 240‧‧‧wiring pattern

250‧‧‧通路 250‧‧‧ access

251‧‧‧第一通路 251‧‧‧First Access

252‧‧‧第二通路 252‧‧‧Second Access

260‧‧‧通路孔 260‧‧‧via hole

271‧‧‧第一終端機圖案 271‧‧‧The first terminal pattern

272‧‧‧第二終端機圖案 272‧‧‧second terminal pattern

310、311‧‧‧第一底漆層 310, 311‧‧‧ the first primer layer

320、321‧‧‧第二底漆層 320, 321‧‧‧Second primer layer

400‧‧‧載體膜 400‧‧‧ carrier film

500‧‧‧塗佈機 500‧‧‧coating machine

600‧‧‧輥子 600‧‧‧ roller

700‧‧‧熱及壓力/加壓 700‧‧‧ heat and pressure / pressurization

圖1例示根據一實施例之磁性片的橫截面圖。 圖2A及圖2B例示根據一實施例之傳導性磁性複合片的橫截面圖。 圖3例示根據一實施例之製造磁性片之製程。 圖4例示根據一實施例之製造傳導性磁性複合片之製程。 圖5及圖6分別例示輥對輥(roll-to-roll)製程及分批製程。 圖7及圖8例示根據一實施例之製造傳導性磁性複合片之製程。 圖9例示根據一實施例之天線裝置的橫截面圖。 圖10A至圖10C例示根據一實施例之天線裝置的平面圖(展示於圖案之黑色中的部分為前圖案、影線部分為後圖案,且指示為圓的部分為通路)。 圖11A及圖11B分別例示根據一實施例之天線裝置的平面圖及橫截面圖。 圖12A至圖12C例示根據一實施例之製造天線裝置之製程。 圖13及圖14意性地例示根據一實施例之天線裝置與外部終端機之信號傳輸及接收。 圖15例示迴焊試驗中之熱處置條件。 圖16例示習知天線裝置與外部終端機之信號傳輸及接收。FIG. 1 illustrates a cross-sectional view of a magnetic sheet according to an embodiment. 2A and 2B illustrate cross-sectional views of a conductive magnetic composite sheet according to an embodiment. FIG. 3 illustrates a manufacturing process of a magnetic sheet according to an embodiment. FIG. 4 illustrates a manufacturing process of a conductive magnetic composite sheet according to an embodiment. 5 and 6 illustrate a roll-to-roll process and a batch process, respectively. 7 and 8 illustrate a process of manufacturing a conductive magnetic composite sheet according to an embodiment. FIG. 9 illustrates a cross-sectional view of an antenna device according to an embodiment. 10A to 10C illustrate plan views of an antenna device according to an embodiment (a portion shown in black in a pattern is a front pattern, a hatched portion is a rear pattern, and a portion indicated as a circle is a via). 11A and 11B illustrate a plan view and a cross-sectional view, respectively, of an antenna device according to an embodiment. 12A to 12C illustrate a process of manufacturing an antenna device according to an embodiment. 13 and 14 schematically illustrate signal transmission and reception of an antenna device and an external terminal according to an embodiment. Figure 15 illustrates the heat treatment conditions in the reflow test. FIG. 16 illustrates signal transmission and reception between a conventional antenna device and an external terminal.

Claims (18)

一種製造一傳導性磁性複合片之方法,該方法包含:製造包含一磁粉及一黏合劑樹脂之一磁性片;堆疊該磁性片及一第一傳導性箔;以及將熱及壓力施加至該獲得的堆疊以黏合該磁性片及該第一傳導性箔,並且(i)其中該傳導性磁性複合片具有在經受兩次熱處置後的介於該磁性片與該第一傳導性箔之間的0.6kgf/cm至20kgf/cm之一剝離強度,該熱處置構成自以一恆定速率自30℃加熱至240℃持續200秒及隨後以一恆定速率自240℃冷卻至130℃持續100秒;(ii)其中當該熱處置在以上條件下重複兩次後,該傳導性磁性複合片在該磁性片與該第一傳導性箔之間的剝離強度改變率(下降率)係10%或更少,且(iii)其中該磁性片具有基於具有3MHz之一頻率之一交流電的100至300之一磁導率、基於具有6.78MHz之一頻率之一交流電的80至270之一磁導率、及基於具有13.56MHz之一頻率之一交流電的60至250之一磁導率。A method of manufacturing a conductive magnetic composite sheet, the method comprising: manufacturing a magnetic sheet including a magnetic powder and a binder resin; stacking the magnetic sheet and a first conductive foil; and applying heat and pressure to the obtained Stack to bond the magnetic sheet and the first conductive foil, and (i) wherein the conductive magnetic composite sheet has between the magnetic sheet and the first conductive foil after being subjected to two heat treatments One peel strength of 0.6kgf / cm to 20kgf / cm, the heat treatment consists of heating at a constant rate from 30 ° C to 240 ° C for 200 seconds and then cooling at a constant rate from 240 ° C to 130 ° C for 100 seconds; ( ii) After the heat treatment is repeated twice under the above conditions, the rate of change (decrease rate) in peel strength of the conductive magnetic composite sheet between the magnetic sheet and the first conductive foil is 10% or less And (iii) wherein the magnetic sheet has a magnetic permeability of 100 to 300 based on an alternating current with a frequency of 3 MHz, a magnetic permeability of 80 to 270 based on an alternating current with a frequency of 6.78 MHz, and 6 based on alternating current with one of the frequencies of 13.56MHz One of 0 to 250 permeability. 如請求項1之方法,其中將熱及壓力施加至該堆疊之該步驟係在5MPa至30MPa之一壓力及150℃至200℃之一溫度下執行。The method of claim 1, wherein the step of applying heat and pressure to the stack is performed at a pressure of 5 MPa to 30 MPa and a temperature of 150 ° C to 200 ° C. 如請求項1之方法,該堆疊步驟及將熱及壓力施加至該堆疊之該步驟藉由一輥對輥製程執行,該輥對輥製程係藉由使用2至10對輥子在150℃至200℃之一輥子溫度、5MPa至30MPa之一輥子壓力、及1m/min至5m/min之一速度下執行。As in the method of claim 1, the stacking step and the step of applying heat and pressure to the stack are performed by a roll-to-roll process by using 2 to 10 pairs of rollers at 150 ° C to 200 It is performed at a roller temperature of ℃, a roller pressure of 5 MPa to 30 MPa, and a speed of 1 m / min to 5 m / min. 如請求項1之方法,其中該磁性片為具有可撓性的具有10μm至3,000μm之一厚度的一未燒結片。The method of claim 1, wherein the magnetic sheet is an unsintered sheet having flexibility and having a thickness of one of 10 μm to 3,000 μm. 如請求項1之方法,其中該磁性片基於該磁性片之總重量包含70重量%至90重量%的該磁粉,及6重量%至12重量%的一基於聚胺基甲酸酯之樹脂、0.5重量%至2重量%的一基於異氰酸酯之硬化劑、及0.3重量%至1.5重量%的一基於環氧基之樹脂,作為該黏合劑樹脂。The method of claim 1, wherein the magnetic sheet contains 70% to 90% by weight of the magnetic powder based on the total weight of the magnetic sheet, and 6% to 12% by weight of a polyurethane-based resin, As the binder resin, 0.5 to 2% by weight of an isocyanate-based hardener and 0.3 to 1.5% by weight of an epoxy-based resin are used. 如請求項1之方法,其中該黏合劑樹脂為一熱固性樹脂,且該黏合劑樹脂在於將熱及壓力施加至該堆疊之該步驟中固化時將該磁性片黏合至該第一傳導性箔。The method of claim 1, wherein the adhesive resin is a thermosetting resin, and the adhesive resin bonds the magnetic sheet to the first conductive foil when cured in the step of applying heat and pressure to the stack. 如請求項6之方法,其中該磁性片為具有可撓性的具有10μm至3,000μm之一厚度的一未燒結片,且該磁性片具有在經受兩次熱處置後的5%或更少之一厚度改變及5%或更少之一磁導率改變,該熱處置構成自以一恆定速率自30℃加熱至240℃持續200秒及隨後以一恆定速率自240℃冷卻至130℃持續100秒;該磁性片具有在浸入一2N鹽酸溶液中30分鐘時的5%或更少之一厚度改變及5%或更少之一磁導率改變;以及在浸入2N氫氧化鈉溶液中30分鐘時的5%或更少之一厚度改變及5%或更少之一磁導率改變。The method of claim 6, wherein the magnetic sheet is an unsintered sheet having a thickness of 10 μm to 3,000 μm having flexibility, and the magnetic sheet has 5% or Less one thickness change and 5% or less magnetic permeability change, the heat treatment consists of heating from 30 ° C to 240 ° C at a constant rate for 200 seconds and then cooling from 240 ° C to 130 at a constant rate ℃ for 100 seconds; the magnetic sheet has a thickness change of 5% or less and a permeability change of 5% or less when immersed in a 2N hydrochloric acid solution for 30 minutes; and immersion in a 2N sodium hydroxide solution At 30 minutes, the thickness of 5% or less changes and the permeability of 5% or less changes. 如請求項1之方法,其中該第一傳導性箔具有形成於其一側上的一第一底漆層,且磁性片及該第一傳導性箔經堆疊,使得該磁性片之一側處於與該第一傳導性箔之該第一底漆層接觸。The method of claim 1, wherein the first conductive foil has a first primer layer formed on one side thereof, and the magnetic sheet and the first conductive foil are stacked so that one side of the magnetic sheet is in It is in contact with the first primer layer of the first conductive foil. 如請求項8之方法,其中該第一底漆層包含一熱固性樹脂,且該第一底漆層中之該熱固性樹脂在將熱及壓力施加至該堆疊之該步驟中固化。The method of claim 8, wherein the first primer layer includes a thermosetting resin, and the thermosetting resin in the first primer layer is cured in the step of applying heat and pressure to the stack. 如請求項9之方法,其中該熱固性樹脂包含雙酚A型環氧樹脂、甲酚酚醛型環氧樹脂、或肆(縮水甘油基氧基苯基)乙烷型環氧樹脂。The method of claim 9, wherein the thermosetting resin comprises a bisphenol A type epoxy resin, a cresol novolac type epoxy resin, or a (glycidyloxyphenyl) ethane type epoxy resin. 如請求項8之方法,其中該第一底漆層具有0.01μm至1μm之一厚度。The method of claim 8, wherein the first primer layer has a thickness of 0.01 μm to 1 μm. 一種製造一傳導性磁性複合片之方法,該方法包含:製造包含一磁粉及一黏合劑樹脂之一磁性片;堆疊一第一傳導性箔、該磁性片及一第二傳導性箔;以及將熱及壓力施加至該獲得的堆疊以將該第一傳導性箔、該磁性片及該第二傳導性箔黏合在一起,並且(i)其中該傳導性磁性複合片具有在經受兩次熱處置後的介於該磁性片與該第一傳導性箔之間的0.6kgf/cm至20kgf/cm之一剝離強度,該熱處置構成自以一恆定速率自30℃加熱至240℃持續200秒及隨後以一恆定速率自240℃冷卻至130℃持續100秒;(ii)其中當該熱處置在以上條件下重複兩次後,該傳導性磁性複合片在該磁性片與該第一傳導性箔之間的剝離強度改變率(下降率)係10%或更少,且(iii)其中該磁性片具有基於具有3MHz之一頻率之一交流電的100至300之一磁導率、基於具有6.78MHz之一頻率之一交流電的80至270之一磁導率、及基於具有13.56MHz之一頻率之一交流電的60至250之一磁導率。A method of manufacturing a conductive magnetic composite sheet, the method comprising: manufacturing a magnetic sheet including a magnetic powder and a binder resin; stacking a first conductive foil, the magnetic sheet and a second conductive foil; and Heat and pressure are applied to the obtained stack to bond the first conductive foil, the magnetic sheet and the second conductive foil together, and (i) wherein the conductive magnetic composite sheet has been subjected to two heat treatments After the peel strength between 0.6kgf / cm and 20kgf / cm between the magnetic sheet and the first conductive foil, the heat treatment consists of heating from 30 ° C to 240 ° C at a constant rate for 200 seconds It is then cooled at a constant rate from 240 ° C to 130 ° C for 100 seconds; (ii) wherein after the heat treatment is repeated twice under the above conditions, the conductive magnetic composite sheet is between the magnetic sheet and the first conductive foil The rate of change (penetration rate) of peel strength between is 10% or less, and (iii) where the magnetic sheet has a magnetic permeability of 100 to 300 based on an alternating current having a frequency of Permeance of 80 to 270 of alternating current at one frequency Rate, and a permeability of 60 to 250 based on alternating current with a frequency of 13.56 MHz. 如請求項12之方法,其中該黏合劑樹脂為一熱固性樹脂,且該黏合劑樹脂在於將熱及壓力施加至該堆疊之該步驟中固化時將該第一傳導性箔、該磁性片及該第二傳導性箔黏合在一起。The method of claim 12, wherein the adhesive resin is a thermosetting resin, and the adhesive resin is cured by applying heat and pressure to the stack in the step of curing the first conductive foil, the magnetic sheet, and the The second conductive foil is glued together. 如請求項12之方法,其中該第一傳導性箔具有形成於其一側上的一第一底漆層,該第二傳導性箔具有形成於其一側上的一第二底漆層,該磁性片及該第一傳導性箔經堆疊,使得該磁性片之一側處於與該第一傳導性箔之該第一底漆層接觸,該磁性片及該第二傳導性箔經堆疊,使得該磁性片之另一側處於與該第二傳導性箔之該第二底漆層接觸,該第一底漆層及該第二底漆層包含一熱固性樹脂,且該第一底漆層及該第二底漆層中之該熱固性樹脂在將熱及壓力施加至該堆疊之該步驟中固化。The method of claim 12, wherein the first conductive foil has a first primer layer formed on one side thereof, and the second conductive foil has a second primer layer formed on one side thereof, The magnetic sheet and the first conductive foil are stacked so that one side of the magnetic sheet is in contact with the first primer layer of the first conductive foil, the magnetic sheet and the second conductive foil are stacked, The other side of the magnetic sheet is in contact with the second primer layer of the second conductive foil, the first primer layer and the second primer layer include a thermosetting resin, and the first primer layer And the thermosetting resin in the second primer layer is cured in the step of applying heat and pressure to the stack. 一種製造一天線裝置之方法,該方法包含:製造包含一磁粉及一黏合劑樹脂之一磁性片;堆疊該磁性片及一第一傳導性箔;將熱及壓力施加至該獲得的堆疊以黏合該磁性片及該第一傳導性箔以形成一傳導性磁性複合片;以及蝕刻該第一傳導性箔以在該第一傳導性箔中形成一天線圖案,並且(i)其中該傳導性磁性複合片具有在經受兩次熱處置後的介於該磁性片與該第一傳導性箔之間的0.6kgf/cm至20kgf/cm之一剝離強度,該熱處置構成自以一恆定速率自30℃加熱至240℃持續200秒及隨後以一恆定速率自240℃冷卻至130℃持續100秒;(ii)其中當該熱處置在以上條件下重複兩次後,該傳導性磁性複合片在該磁性片與該第一傳導性箔之間的剝離強度改變率(下降率)係10%或更少,且(iii)其中該磁性片具有基於具有3MHz之一頻率之一交流電的100至300之一磁導率、基於具有6.78MHz之一頻率之一交流電的80至270之一磁導率、及基於具有13.56MHz之一頻率之一交流電的60至250之一磁導率。A method of manufacturing an antenna device, the method comprising: manufacturing a magnetic sheet including a magnetic powder and a binder resin; stacking the magnetic sheet and a first conductive foil; applying heat and pressure to the obtained stack to bond The magnetic sheet and the first conductive foil to form a conductive magnetic composite sheet; and etching the first conductive foil to form an antenna pattern in the first conductive foil, and (i) wherein the conductive magnetic The composite sheet has a peel strength between 0.6kgf / cm and 20kgf / cm between the magnetic sheet and the first conductive foil after being subjected to two heat treatments, the heat treatment constitutes a constant rate from 30 Heating to 240 ° C for 200 seconds and then cooling from 240 ° C to 130 ° C for 100 seconds at a constant rate; (ii) wherein after the heat treatment is repeated twice under the above conditions, the conductive magnetic composite sheet is in the The rate of change (decrease rate) of peel strength between the magnetic sheet and the first conductive foil is 10% or less, and (iii) wherein the magnetic sheet has a frequency of 100 to 300 based on an alternating current having a frequency of 3 MHz One magnetic permeability, based on the Permeability of 27,080 to one of one of the frequencies of the alternating current, and based on one of the one having a magnetic permeability of the alternating current to one of the 13.56MHz frequency 25,060. 如請求項15之方法,其中該黏合劑樹脂為一熱固性樹脂,且該黏合劑樹脂在於將熱及壓力施加至該堆疊之該步驟中固化時黏合該磁性片及該第一傳導性箔。The method of claim 15, wherein the adhesive resin is a thermosetting resin, and the adhesive resin bonds the magnetic sheet and the first conductive foil when cured in the step of applying heat and pressure to the stack. 如請求項15之方法,其中該第一傳導性箔具有形成於其一側上的一第一底漆層,該磁性片及該第一傳導性箔經堆疊,使得該磁性片之一側處於與該第一傳導性箔之該第一底漆層接觸,該第一底漆層包含一熱固性樹脂,且該第一底漆層中之該熱固性樹脂在將熱及壓力施加至該堆疊之該步驟中固化。The method of claim 15, wherein the first conductive foil has a first primer layer formed on one side thereof, the magnetic sheet and the first conductive foil are stacked so that one side of the magnetic sheet is in In contact with the first primer layer of the first conductive foil, the first primer layer includes a thermosetting resin, and the thermosetting resin in the first primer layer is applying heat and pressure to the stack of the In the process of curing. 如請求項15之方法,其中該磁性片為具有可撓性的具有10μm至3,000μm之一厚度的一未燒結片,且該磁性片具有在經受兩次熱處置後的5%或更少之一厚度改變及5%或更少之一磁導率改變,該熱處置構成自以一恆定速率自30℃加熱至240℃持續200秒及隨後以一恆定速率自240℃冷卻至130℃持續100秒;該磁性片具有在浸入一2N鹽酸溶液中30分鐘時的5%或更少之一厚度改變及5%或更少之一磁導率改變;以及在浸入2N氫氧化鈉溶液中30分鐘時的5%或更少之一厚度改變及5%或更少之一磁導率改變。The method according to claim 15, wherein the magnetic sheet is a flexible green sheet having a thickness of one of 10 μm to 3,000 μm, and the magnetic sheet has 5% or less after being subjected to two heat treatments A change in thickness and a change in permeability of 5% or less, the heat treatment consists of heating from 30 ° C to 240 ° C for 200 seconds at a constant rate and then cooling from 240 ° C to 130 ° C for 100 at a constant rate Second; the magnetic sheet has a thickness change of 5% or less and a permeability change of 5% or less when immersed in a 2N hydrochloric acid solution for 30 minutes; and 30 minutes of immersion in a 2N sodium hydroxide solution One of 5% or less changes in thickness and one of 5% or less changes in permeability.
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WO2016061289A1 (en) * 2014-10-15 2016-04-21 Rogers Corporation Magneto-dielectric substrate, circuit material, and assembly having the same

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