KR102040096B1 - Multilayer antenna device and preparation method thereof - Google Patents

Abstract

Since the antenna element according to the embodiment has three or more pattern layers while using a magnetic sheet as the base layer, it is possible to include more and more antenna patterns in the antenna element, and to arrange various antenna patterns for each pattern layer. By adjusting the magnetic properties of the individual base layers so as to correspond to the type of antenna pattern, a single antenna element can exhibit a complex function.

Description

Multi-layer antenna device and its manufacturing method {MULTILAYER ANTENNA DEVICE AND PREPARATION METHOD THEREOF}

Embodiments relate to antenna elements that can be used in such areas as near field communication, wireless charging, magnetic secure transmission, and the like. More specifically, the embodiment relates to a multi-functional multilayer antenna element having a plurality of pattern layers, a method for manufacturing the same, and a portable terminal including the same.

Recently, mobile devices such as mobile phones, tablet PCs, and notebook PCs are equipped with antennas for realizing functions such as near field communication (NFC), magnetic secure transmission (MST), and wireless charging. However, there are other components of metal material inside such mobile devices, and when an alternating magnetic field formed inside the device is applied to these metal parts, eddy currents occur, which degrades the performance of the antenna and reduces the recognition distance. There is a problem.

In order to solve this problem, conventionally, a high permeability ferrite sheet is attached to the other surface of a general antenna substrate such as a polyimide substrate having an antenna pattern layer formed on one surface thereof, and used as an antenna element for a composite use (Korean Patent Publication No. 2013-50633). Reference). This uses a principle that a magnetic material such as a ferrite sheet focuses the magnetic flux of the antenna to prevent magnetic field penetration into the metal surface and generation of eddy currents and to improve operating characteristics.

In addition, recently, there has been an attempt to manufacture an antenna element by forming an antenna pattern by etching after laminating a conductive foil thereon with a magnetic sheet as a base layer. Specifically, as shown in Figure 9, (a) manufacturing a laminate in which the conductive foils (511, 512) are laminated on both sides of the polymeric magnetic sheet (100); (b) forming a via hole 310 penetrating the stack; (c) plating the inner wall of the via hole 310 to form a via 320; (d) etching the conductive foil to form antenna patterns (521, 522); (e) forming a protective layer 550 by coating an insulating polymer resin on the antenna pattern; And (f) forming a terminal 400 connecting the antenna pattern inside the protective layer 550 to the outside.

Korean Unexamined Patent Publication No. 2013-50633

In the case of the antenna element having the structure shown in FIG. 9 described above, there is a limit in the type and number of antenna patterns that can be included in the pattern layer.

In addition, the thickness of the antenna pattern should be increased in order to decrease the resistance in a limited substrate area. However, when the thickness of the antenna pattern is increased, it is difficult to process the pattern into various shapes.

Therefore, through the following embodiments, it is intended to provide an antenna element having various types and a plurality of antenna patterns by using a magnetic sheet as a base layer but increasing the number of pattern layers.

In addition, through the following embodiments, it is to provide a method for effectively manufacturing an antenna element having a plurality of pattern layers by thermal pressure by using a thermosetting magnetic sheet.

In addition, through the following embodiments, to provide a portable terminal including the antenna element.

According to an embodiment of the present invention, there is provided a laminate including three or more pattern layers including an antenna pattern and a base layer interposed between the pattern layers, wherein at least one of the base layers is a magnetic powder and a thermosetting binder resin. Provided is a magnetic sheet including an antenna element.

According to another embodiment, the method includes a step of manufacturing a laminate by thermally pressing three or more pattern layers including an antenna pattern and a base layer respectively inserted between the pattern layers, wherein at least one of the base layers is a magnetic powder. And a thermosetting binder resin, wherein the binder resin is cured by the thermal pressing, and the magnetic sheet is bonded to an adjacent layer.

According to another embodiment, a portable terminal including the antenna element is provided.

According to the above embodiment, since the magnetic sheet is used as the base layer and has three or more pattern layers, it is possible to include more types and number of antenna patterns in the antenna element.

Accordingly, by increasing the pattern width or increasing the number without increasing the thickness of the antenna pattern, the resistance can be further lowered by keeping the inductance of the antenna pattern the same.

In addition, by arranging various antenna patterns for each pattern layer and adjusting magnetic properties of individual base layers so as to correspond to the type of antenna pattern, a single antenna element can exhibit a complex function.

In addition, by using the non-sintered polymer magnetic sheet having excellent permeability, chemical resistance, heat resistance, insulation, and adhesion as the base layer, the performance and fairness of the antenna element can be further improved.

Preferably, since the antenna pattern is embedded in the magnetic sheet through the thermal pressing, the thin film characteristics and the magnetic field focusing effect may be further improved, and the magnetic powder may be further improved because the orientation of the magnetic powder in the magnetic sheet is aligned during the thermal pressing. Can be.

Accordingly, the antenna element according to the embodiment can be used in a portable terminal and the like to perform a complex function such as short-range communication, magnetic security transmission, wireless charging.

1A illustrates a stacked structure of an antenna element according to an embodiment.
1B illustrates a cross-sectional view of an antenna element according to one embodiment.
2 shows the manufacture of an antenna substrate using a magnetic sheet.
Figure 3 shows the manufacture of the laminate by thermal pressing according to one embodiment.
4 illustrates a process of forming holes and vias according to one embodiment.
Figure 5 shows the manufacture of the laminate by thermal pressing according to another embodiment.
6 illustrates a structure in which an antenna pattern is embedded in an antenna element according to an embodiment.
7A and 7B illustrate a plan view and a cross-sectional view of an antenna substrate according to one embodiment.
8A and 8B illustrate signal transmission and reception between an antenna substrate and an external terminal.
9 shows a method of manufacturing an antenna element according to a comparative example.

In the description of the embodiments below, when each layer, foil or sheet or the like is described as being formed "on" or "under" of each layer, foil or sheet, the "phase" (on) and "under" include both "directly" or "indirectly" formed. In addition, the criteria for the upper or lower parts of each component will be described with reference to the drawings. In addition, in the accompanying drawings, sizes, intervals, etc. may be exaggerated for clarity and may be omitted for clarity to those skilled in the art.

Antenna elements

According to an embodiment of the present invention, there is provided a laminate including three or more pattern layers including an antenna pattern and a base layer interposed between the pattern layers, wherein at least one of the base layers is a magnetic powder and a thermosetting binder resin. Provided is a magnetic sheet comprising an antenna element.

For example, referring to FIG. 1A, the antenna element 10 according to the above embodiment may include the first pattern layer 210, the first substrate layer 110, the second pattern layer 220, and the second substrate from above. The layer 120 and the third pattern layer 230 may include a laminate stacked in order.

The antenna element according to the embodiment may further include an insulating layer or an adhesive layer, holes, vias, terminals, etc. in addition to the base layer and the pattern layer.

Hereinafter, each component of the antenna element will be described in detail.

Pattern layer

The antenna element according to the embodiment includes three or more pattern layers. That is, the antenna element has a pattern layer at both outer sides and at least one pattern layer therein. For example, the number of the pattern layer may be three to ten, or three to five.

At least one of the three or more pattern layers includes an antenna pattern.

Or two or more of the three or more pattern layers comprise an antenna pattern.

In addition, the pattern layer may include other conductive patterns such as a terminal pattern.

Preferably, each of the individual pattern layers includes an antenna pattern. Specifically, the individual pattern layers include one antenna pattern or two or more antenna patterns. For example, the individual pattern layers may include one to three antenna patterns. The antenna pattern may be a short range communication antenna pattern, a magnetic security transmission antenna pattern, or a wireless charging antenna pattern.

The antenna pattern may include a conductive material. For example, the antenna pattern may include a conductive metal. Specifically, the antenna pattern may include at least one metal selected from the group consisting of copper, nickel, gold, silver, zinc, and tin.

The antenna pattern may have a thickness of about 6 to 200 μm, more specifically about 10 to 150 μm, about 10 to 100 μm, about 10 to 50 μm, or about 10 to 30 μm.

The shape of the antenna pattern is not particularly limited, and for example, a line shape or a flat spiral shape may be used.

Such an antenna pattern, with reference to FIG. 8A, may generate an electromagnetic signal 50 due to a current flowing through the antenna pattern. The electromagnetic signal 50 enables signal transmission and reception between the antenna element 20 and the external terminal 40.

In addition, the antenna pattern may be a printed circuit pattern.

The antenna pattern may be partially or entirely embedded in an adjacent substrate layer. In particular, when the adjacent substrate layer is a magnetic sheet, the antenna pattern may be partially or entirely embedded in the magnetic sheet. In other words, the antenna pattern included in the pattern layer adjacent to the magnetic sheet may be partially or entirely embedded in the magnetic sheet.

Specifically, as shown in FIG. 6, the antenna pattern 500 has one side S1 bonded to the other layer 110, and the other surfaces S2, S3, and S4 have the magnetic sheet 100. It may be impregnated therein to contact the binder resin 102 in the magnetic sheet 100.

For example, the antenna pattern 500 may have side surfaces S2 and S3 perpendicular to the surface direction of the magnetic sheet 100, and both side surfaces S2 and S3 may be formed on the magnetic sheet 100. The buried material may be buried in contact with the binder resin 102.

Substrate layer

The substrate layer is inserted between the pattern layers, respectively.

Therefore, the number of the base layer may be one less than the number of the pattern layer.

The base layer may be a magnetic sheet or an insulating sheet.

Magnetic sheet

The magnetic sheet includes magnetic powder and binder resin. That is, the magnetic sheet may be a polymeric magnetic sheet (PMS). In addition, the magnetic sheet may be a flexible magnetic sheet, specifically, may be a sintered cured sheet having flexibility.

According to an embodiment, at least one of the base layers is a magnetic sheet including magnetic powder and a thermosetting binder resin. Preferably, the base layer is a non-sintered type magnetic sheet, all of which includes magnetic powder and thermosetting binder resin.

For example, the number of the pattern layer is 3 to 10, the base layer may be a magnetic sheet containing all of the magnetic powder and thermosetting binder resin.

Magnetic powder

The magnetic sheet includes magnetic powder.

The magnetic powder may be an oxide magnetic powder such as ferrite (Ni-Zn-based, Mg-Zn-based, Mn-Zn-based ferrite, etc.); Metal magnetic powders such as permalloy, sanddust, Fe-Si-Cr alloys and Fe-Si-nanocrystals; Or mixed powders thereof. For example, the magnetic powder may be a sand dust powder having a Fe—Si—Al alloy composition.

As a specific example, the magnetic powder may have a composition of Formula 1 below.

[Formula 1]

Fe _1-abc Si _a X _b Y _c

Where

X is Al, Cr, Ni, Cu, or a combination thereof;

Y is Mn, B, Co, Mo, or a combination thereof;

0.01 ≦ a ≦ 0.2, 0.01 ≦ b ≦ 0.1, and 0 ≦ c ≦ 0.05.

The particle diameter of the magnetic powder may range from about 3 nm to about 1 mm. More specifically, the magnetic powder may have a particle size in the range of about 1 to 300 μm, about 1 to 50 μm, or about 1 to 10 μm. When the average particle diameter of the magnetic powder is within the above preferred range, shorting can be prevented when forming vias or the like on the magnetic sheet while exhibiting sufficient magnetic properties.

The magnetic powder may have a spherical shape, a flake shape, a rod shape, or the like. Preferably, the magnetic powder may have a flake shape, so that the aspect ratio of the particles is large, the magnetic properties can be more effectively exhibited. In particular, the magnetic powder on the flakes can be evenly aligned by the thermal pressure performed during the manufacture of the antenna element.

The magnetic powder may be coated with a functional material. For example, the magnetic powder may be an insulating coating on the surface of each particle. According to one example, the magnetic powder may be coated with an organic component, specifically, may be coated with an insulating polymer resin.

Accordingly, the individual particles of the magnetic powder may consist of a core and a shell surrounding the surface of the core. At this time, the core is an oxide magnetic material such as ferrite; Magnetic metals such as permalloy, sandust, Fe-Si-Cr alloy and Fe-Si-nanocrystal; Or mixed components thereof. In addition, the shell may contain an insulating polymer resin. The thickness of the shell may be in the range of 0.1 to 20 μm, or in the range of 1 to 10 μm.

Binder resin

Curable resin can be used as said binder resin. Specifically, the binder resin may include a photocurable resin, a thermosetting resin, and / or a high heat resistant thermoplastic resin, and may preferably include a thermosetting resin.

As the resin that can be cured to exhibit adhesiveness as described above, it includes one or more functional groups or sites capable of curing by heat such as glycidyl group, isocyanate group, hydroxy group, carboxyl group or amide group; Or one or more functional groups or moieties that can be cured by an active energy such as an epoxide group, a cyclic ether group, a sulfide group, an acetal group or a lactone group. Resin to be used can be used. Such functional groups or moieties can be, for example, isocyanate groups (-NCO), hydroxy groups (-OH), or carboxyl groups (-COOH).

Specifically, the curable resin may include, but is not limited to, a polyurethane resin, an acrylic resin, a polyester resin, an isocyanate resin, an epoxy resin, or the like having at least one functional group or moiety as described above.

According to one embodiment, the binder resin may include a polyurethane-based resin, an isocyanate-based curing agent and an epoxy-based resin.

The polyurethane-based resin may include repeating units represented by the following Chemical Formulas 2a and 2b.

[Formula 2a] [Formula 2b]

Where

R ₁ and R ₃ are each independently a C _1-5 alkylene group, urea group, or ether group;

R ₂ and R ₄ are each independently a C _1-5 alkylene group;

In this case, each of the C _1-5 alkylene groups may or may not have one or more substituents selected from the group consisting of halogen, cyano, amino and nitro.

The polyurethane-based resin may include a repeating unit represented by Formula 2a and a repeating unit represented by Formula 2b in a molar ratio of 1:10 to 10: 1.

The polyurethane-based resin may have a number average molecular weight in the range of about 500 to 50,000 g / mol, in the range of about 10,000 to 50,000 g / mol, or in the range of about 10,000 to 40,000 g / mol.

The isocyanate-based curing agent may be an organic diisocyanate.

For example, the isocyanate curing agent may be an aromatic diisocyanate, aliphatic diisocyanate, alicyclic diisocyanate, or a mixture thereof.

The aromatic diisocyanate may be, for example, diisocyanate having 1 to 2 C _6-20 aryl groups, and specifically 1,5-naphthalene diisocyanate, 4,4'-diphenylmethane diisocyanate, 4,4 ' -Diphenyl-dimethylmethane diisocyanate, 4,4'-benzyl isocyanate, dialkyl-diphenylmethane diisocyanate, tetraalkyl-diphenylmethane diisocyanate, 1,3-phenylene diisocyanate, 1,4-phenylene Diisocyanate, tolylene diisocyanate, xylene diisocyanate and the like.

The alicyclic diisocyanates include, for example no more than two C _{6 ~ 20} may be a diisocyanate having a cycloalkyl group, in particular cyclohexane-1,4-diisocyanate, isophorone diisocyanate, dicyclohexyl methane -4 , 4'-diisocyanate, 1,3-bis (isocyanatemethyl) cyclohexane, methylcyclohexane diisocyanate and the like.

Preferably, the isocyanate-based curing agent may be alicyclic diisocyanate, in particular isophorone diisocyanate.

Examples of the epoxy resins include bisphenol epoxy resins such as bisphenol A epoxy resins, bisphenol F epoxy resins, bisphenol S epoxy resins, tetrabromobisphenol A epoxy resins, and the like; Spiro cyclic epoxy resins; Naphthalene type epoxy resins; Biphenyl type epoxy resins; Terpene type epoxy resins; Glycidyl ether type epoxy resins such as tris (glycidyloxyphenyl) methane, tetrakis (glycidyloxyphenyl) ethane and the like; Glycidyl amine type epoxy resins such as tetraglycidyl diaminodiphenylmethane; Novolak-type epoxy resins, such as a cresol novolak-type epoxy resin, a phenol novolak-type epoxy resin, (alpha)-naphthol novolak-type epoxy resin, a brominated phenol novolak-type epoxy resin, etc. are mentioned. These epoxy resins can be used individually by 1 type or in combination of 2 or more types.

Among these, in consideration of adhesiveness and heat resistance, it is preferable to use a bisphenol A type epoxy resin, a cresol novolac type epoxy resin, or a tetrakis (glycidyloxyphenyl) ethane type epoxy resin.

The epoxy resin may have an epoxy equivalent of about 80 to 1,000 g / eq, or about 100 to 300 g / eq. In addition, the epoxy resin may have a number average molecular weight in the range of about 10,000 ~ 50,000 g / mol.

Magnetic sheet composition

The magnetic sheet may include magnetic powder in an amount of 50 wt% or more, or 70 wt% or more. For example, the magnetic sheet is 50-95%, 70-95%, 70-90%, 75-90%, 75-95%, 80-95%, or 80-% of magnetic powder It may be contained in an amount of 90% by weight. In addition, the magnetic powder may have a composition of Formula 1.

In addition, the magnetic sheet may contain the binder resin in an amount of 5 to 40% by weight, 5 to 20% by weight, 5 to 15% by weight, or 7 to 15% by weight.

In addition, the magnetic sheet, based on the total weight of the magnetic sheet, as the binder resin, 6 to 12% by weight of polyurethane-based resin, 0.5 to 2% by weight of isocyanate-based curing agent and 0.3 to 1.5% by weight of epoxy-based resin It may include.

As a specific example, the magnetic sheet contains the magnetic powder in an amount of 70 to 90% by weight based on the total weight of the magnetic sheet, and as the binder resin, 6 to 12% by weight of polyurethane resin, 0.5 to It may include 2% by weight of isocyanate-based curing agent and 0.3 to 1.5% by weight of the epoxy resin. In addition, in this case, the magnetic powder has a composition of Chemical Formula 1, the polyurethane-based resin includes repeating units represented by Chemical Formulas 2a and 2b, the isocyanate-based curing agent is an alicyclic diisocyanate, and the epoxy-based resin is bisphenol A type epoxy resin, cresol novolak-type epoxy resin, or tetrakis (glycidyloxyphenyl) ethane type epoxy resin.

Magnetic sheet properties

The magnetic sheet 100 may have a thickness of about 10 μm to 3000 μm. More specifically, the magnetic sheet may have a thickness of about 10 to 500 μm, about 40 to 500 μm, about 40 to 250 μm, about 50 to 250 μm, about 50 to 200 μm, or about 50 to 100 μm.

The magnetic sheet has a magnetic permeability of 100 to 300 for an alternating current of 3 MHz frequency, a magnetic permeability of 80 to 270 for an alternating current of 6.78 MHz and a magnetic permeability of 60 to 250 for an alternating current of 13.56 MHz frequency. Can have.

Alternatively, the magnetic sheet has a permeability of about 190 to 250 for an alternating current of 3 MHz frequency, a permeability of about 180 to 230 for an alternating current of 6.78 MHz, and about 140 for an alternating current of 13.56 MHz frequency. It can have a permeability of ~ 180.

In addition, the magnetic sheet may have flexibility to be applied to various devices. For example, the magnetic sheet may not be cut after 100, 1,000, or 10,000 bendings in the MIT folding test under 90 ° and 35 RPM conditions. In addition, the magnetic sheet may have a change in permeability of about 10% or less, or about 5% or less after 100, 1,000, or 10,000 bendings in an MIT bending test under 90 ° and 35 RPM conditions.

In addition, the magnetic sheet may have heat resistance that can withstand high temperature conditions. For example, the magnetic sheet may have a volume change of about 25% or less, 15% or less, 10% or less, or about 5% or less when heat treated at about 150 ° C. for about 30 minutes. In addition, the magnetic sheet may have a permeability change of about 25% or less, 15% or less, 10% or less, or about 5% or less when heat treated at about 150 ° C. for about 30 minutes.

In addition, the magnetic sheet is heated to 30 ° C to 240 ° C at a constant rate for 200 seconds, and then subjected to heat treatment to the magnetic sheet twice under conditions of decreasing the temperature at a constant rate from 240 ° C to 130 ° C for 100 seconds. When repeated, it may have a thickness change of about 5% or less and a permeability change of about 5% or less. Specifically, when the heat treatment conditions are repeated twice, the magnetic sheet may have a thickness change of about 3% or less and a permeability change of about 3% or less, and more specifically, a thickness change of about 1% or less and about 1 It can have a permeability change of less than%.

In addition, the magnetic sheet may have a high breakdown voltage. For example, the magnetic sheet may have a breakdown voltage of at least 3 kV, at least 3.5 kV, or at least 4 kV. More specifically, the magnetic sheet may have a breakdown voltage in a range of 3 to 6 kV, a range of 3.5 to 5.5 kV, a range of 4 to 5 kV, or a range of 4 to 4.5 kV.

In addition, the magnetic sheet may exhibit a resistance value of 1 × 10 ⁵ mA or more, 1 × 10 ⁷ mA or more, or 1 × 10 ⁹ mA or more when the current flows between two points separated from each other by 500 μm or more on the sheet. Preferably, the magnetic sheet may not measure resistance or exhibit infinite resistance when flowing current between two points separated from each other by 500 μm or more on the sheet.

Insulating sheet

According to one embodiment, the base layer of the antenna element may include an insulating sheet in addition to the magnetic sheet.

The insulating sheet is not particularly limited as long as it is a sheet of material that can protect the antenna pattern by having electrical insulation, and may be a sheet of insulating polymer resin used in a general flexible printed circuit board (FPCB).

Specifically, the insulating polymer resin, polyimide (PI), polyamide (PA), polycarbonate (PC), poly isesulfone (PES), epoxy resin, acrylic resin, acrylonitrile-butadiene-styrene (ABS ), Polyethylene terephthalate (PET), polyethylene (PE), polypropylene (PP) and the like, or a polymer resin in which two or more of them are copolymerized or blended.

Also, preferably, the insulating substrate may have flexibility.

For example, the insulating substrate may not be cut after 100, 1,000, or 10,000 bendings in the MIT folding test under 90 ° and 35 RPM conditions.

In addition, the thickness of the insulating substrate may range from about 2 to 100 μm, or about 6 to 20 μm.

Insulation layer or adhesive layer

In addition, the antenna element may further include an insulating layer or an adhesive layer interposed between the pattern layer and the base layer.

The insulating layer or the adhesive layer may include a binder resin, and preferably may include a thermosetting binder resin. For example, the binder resin may include a polyurethane-based resin, an isocyanate-based curing agent, an epoxy-based resin, and the like, and more specifically, the insulating layer may include a binder resin having a component similar to or the same as the binder resin of the magnetic sheet. Can be.

The thickness of the insulating layer or adhesive layer may be in the range of about 1 to 20 μm, or in the range of about 1 to 10 μm.

Via

The antenna element may further include a via that electrically connects at least two of the pattern layers while passing through at least one of the substrate layers in a thickness direction.

Specifically, the antenna element may include a hole penetrating at least one of the substrate layers in a thickness direction, and a via is formed in the hole to electrically connect at least two of the pattern layers.

The hole may have a diameter in the range of 100 to 300 μm, or in the range of 120 to 170 μm, for example.

There may be a plurality of holes in the laminate as needed.

The via may comprise a conductive material. For example, the via may comprise one or more metals selected from the group consisting of copper, nickel, gold, silver, zinc and tin.

The via may be formed by filling an inside of the hole with a conductive material, inserting a solder or a conductive rod, or plating. As a preferred example, the via may be formed by plating the inside of the hole.

The via electrically connects the antenna patterns of the pattern layer, for example, electrically connects the antenna patterns of both outer pattern layers, or between the antenna pattern of the outer pattern layer and the antenna pattern of the inner pattern layer. Can be electrically connected.

Terminal pattern

In addition, the pattern layer of the antenna element may include a terminal pattern for electrically connecting with the outside.

The terminal pattern may be electrically connected to the via, so that the antenna pattern of the inner pattern layer may be electrically connected to the outside through the via and the terminal pattern.

The terminal pattern may be formed on an outer base layer of the base layer.

The terminal pattern 400 may include a conductive material. For example, the terminal pattern may include a conductive metal. Specifically, the terminal pattern may include at least one metal selected from the group consisting of copper, nickel, gold, silver, zinc and tin.

Preferably, the terminal pattern may be made of the same component as the antenna pattern.

The shape of the terminal pattern according to the above embodiment is not particularly limited, but in general, the pattern size and pattern spacing may be large and simple rectangular shape.

The terminal pattern may be a conductive paste cured or formed by plating.

Alternatively, the terminal pattern may be a printed circuit pattern formed by a conventional printed circuit board manufacturing method.

Multi-layer structure example

As a preferable example, the laminate includes a first pattern layer, a first substrate layer, a second pattern layer, a second substrate layer, a third pattern layer, a third substrate layer, and a fourth pattern layer in order from above. The first pattern layer, the second pattern layer, the third pattern layer, and the fourth pattern layer may each include a short range communication antenna pattern, a magnetic security transmission antenna pattern, a wireless charging antenna pattern, or a combination thereof.

In this case, the first base layer and the third base layer is a magnetic sheet containing magnetic powder and thermosetting binder resin, the antenna pattern of the second pattern layer is partially or fully embedded in the first base layer, An antenna pattern of three pattern layers may be partially or wholly embedded in the third base layer.

Referring to FIG. 1B, the laminate has a first pattern layer 210, a first substrate layer 110, a second pattern layer 220, a second substrate layer 120, and a third pattern layer 230 from above. , The third base layer 130 and the fourth pattern layer 240 in this order, and the antenna pattern of the second pattern layer 220 is partially or fully embedded in the first base layer 110, and the third The antenna pattern of the pattern layer 230 may be partially or entirely embedded in the third base layer 130.

In addition, an insulating layer may be inserted and disposed between the base layer composed of a magnetic sheet and a pattern layer adjacent thereto, and in this case, the antenna pattern of the pattern layer may have the surface of the base layer wrapped with the insulating layer. It can be embedded in the (magnetic sheet).

In addition, the antenna element may include a hole 310 penetrating at least one of the base layers in a thickness direction, and a via 320 formed in the hole 310 to electrically connect at least two of the pattern layers. It may further comprise.

Alternatively, the second base layer may be a magnetic sheet including magnetic powder and a thermosetting binder resin, and antenna patterns of the second pattern layer and the third pattern layer may be partially or fully embedded in the second base layer, respectively. .

Referring to FIG. 5B, the laminate has a first pattern layer 210, a first base layer 110, a second pattern layer 220, a second base layer 120, and a third pattern from above. The layer 230, the third base layer 130, and the fourth pattern layer 240 may be included in this order, and the antenna patterns of the second pattern layer 220 and the third pattern layer 230 may be the second base layer ( In part or in part 120). In addition, an insulating layer may be inserted and disposed between the base layer composed of a magnetic sheet and a pattern layer adjacent thereto, and in this case, the antenna pattern of the pattern layer may have the surface of the base layer wrapped with the insulating layer. It can be embedded in the (magnetic sheet). The antenna element may further include a hole penetrating at least one of the substrate layers in a thickness direction, and a via formed in the hole to electrically connect at least two of the pattern layers.

Antenna element configuration example 1

As another preferred example, the antenna element may include a substrate A including a substrate layer and a pattern layer formed thereon; A substrate B including a substrate layer and pattern layers formed on and under the substrate layer; And a substrate C including a substrate layer and a pattern layer formed below the substrate layer, wherein the pattern layer of the substrate B includes an antenna pattern, and the substrate layers of the substrate A and the substrate C include magnetic powder and a thermosetting binder resin. It is a magnetic sheet that includes, the pattern layer formed on the substrate layer of the substrate B is partially or entirely embedded in the substrate layer of the substrate A, the pattern layer formed below the substrate layer of the substrate B is the substrate of the substrate C Some or all of the layers may be embedded.

The pattern layers of the substrate A, the substrate B, and the substrate C may have various antenna patterns as described above.

As an example, the substrate B further includes a plurality of vias penetrating through the substrate layer of the substrate B in a thickness direction, and antenna patterns of the upper and lower portions of the substrate B are electrically connected by the plurality of vias. In addition, a solenoid coil wound around a central portion of the substrate layer of the substrate B may be formed.

Antenna element configuration example 2

As another preferred example, the antenna element may include a substrate A including a substrate layer and pattern layers formed on and under the substrate layer; A substrate B including a substrate layer and pattern layers formed on and under the substrate layer; And a magnetic sheet inserted between the substrate A and the substrate B, the magnetic sheet including a magnetic powder and a thermosetting binder resin, wherein the pattern layers of the substrate A and the substrate B include an antenna pattern, and the magnetic pattern of the antenna patterns. An antenna pattern adjacent to the sheet may be partially or fully embedded in the magnetic sheet.

In this case, the substrate layer of the substrate A may be a magnetic sheet including magnetic powder and a thermosetting binder resin, and the substrate layer of the substrate B may be an insulating sheet.

In addition, the substrate layer of the substrate A is a magnetic sheet containing a magnetic powder and a thermosetting binder resin, the substrate A further includes a plurality of vias penetrating the substrate layer in the thickness direction, the lower portion of the substrate A The antenna pattern and the antenna pattern of the upper may be electrically connected by the plurality of vias, thereby forming a solenoid coil wound around the center of the base layer.

Structure example of substrate having solenoid coil

For example, the substrate on which the solenoid coil is formed may include a magnetic sheet; A plurality of first conductive line patterns spaced apart from each other on one surface of the magnetic sheet; A plurality of second conductive line patterns spaced apart from each other on the other surface of the magnetic sheet; And a plurality of vias disposed through the magnetic sheet, wherein the first conductive line patterns and the second conductive line patterns extend in the same direction, and the vias are formed of the first conductive line patterns and the first conductive line patterns. 2 Connect the conductive line patterns.

Specifically, the vias alternately connect the first conductive line patterns and the second conductive line patterns arranged side by side to be spaced apart from each other, so that one end and the other end of one of the first conductive line patterns are adjacent to each other. Each of the second conductive line patterns may be connected to two second conductive line patterns, and one end and the other end of one of the second conductive line patterns may be respectively connected to two first conductive line patterns adjacent to each other.

In addition, when the magnetic sheet is divided into a core region and a peripheral region around the core region, the first conductive line patterns and the second conductive line patterns cross the core region and both ends thereof are disposed in the peripheral region. The vias may be disposed in the peripheral area to connect ends of the first conductive line patterns and the second conductive line patterns.

In this case, the first conductive line patterns, the second conductive line patterns, and the vias may be connected to each other to form a coil winding the core region.

7A and 7B, the substrate may include a magnetic sheet 100, a plurality of first conductive line patterns 531, a plurality of second conductive line patterns 532, and a plurality of vias 320. It includes.

The magnetic sheet may be divided into a core region CR and a peripheral region OR adjacent to the core region.

The core region is disposed in the central portion of the magnetic sheet. The core region may have a shape extending in one direction.

The peripheral region is disposed around the core region. The peripheral region may have a shape extending in the same direction as the core region. The peripheral region may be disposed at both sides of the core region.

The first conductive line patterns are disposed on the magnetic sheet. In more detail, the first conductive line patterns are bonded to one surface of the magnetic sheet.

The first conductive line patterns may extend in a direction crossing the direction in which the core region extends. In more detail, the first conductive line patterns may extend to cross the core region. The first conductive line patterns may extend from a peripheral region disposed on one side of the core region to a peripheral region disposed on the other side.

The first conductive line patterns may extend in parallel with each other. In addition, the first conductive line patterns may be spaced apart from each other.

The second conductive line patterns are disposed on the other surface of the magnetic sheet. In more detail, the second conductive line patterns are bonded to the other surface of the magnetic sheet.

The second conductive line patterns may extend in a direction crossing the direction in which the core region extends. In more detail, the second conductive line patterns may extend to cross the core region. The second conductive line patterns may extend from a peripheral region disposed on one side of the core region to a peripheral region disposed on the other side.

The second conductive line patterns may extend in parallel with each other. In addition, the second conductive line patterns may be spaced apart from each other.

The via penetrates through the magnetic sheet. The via connects the first conductive line patterns and the second conductive line patterns. In more detail, the via may be connected to one end of the first conductive line pattern and one end of the second conductive line pattern.

The via may alternately connect the first conductive line patterns and the second conductive line patterns. For example, the first conductive line pattern, the via, the second conductive line pattern, the via, the first conductive line pattern, the via, the second conductive line pattern, and the via may be sequentially connected.

The first conductive line pattern, the second conductive line pattern, and the via may be connected to each other to form a coil wound around the core region. In detail, the first conductive line pattern, the second conductive line pattern, and the via may be connected to each other to form a coil wound solenoid around the core region.

Accordingly, when an AC current flows through the first conductive line pattern, the second conductive line pattern, and the via, an electromagnetic signal may be formed through both ends of the core region.

As shown in FIG. 8B, the substrate may generate an electromagnetic signal flowing in a direction perpendicular to the extending direction of the first conductive line patterns and the second conductive line patterns. In this case, even if the substrate is disposed in the case 30 including the electromagnetic wave transmitting region 32 and the electromagnetic wave non-transmitting region 31, the narrow gap between the electromagnetic wave transmitting region 32 and the external terminal 40 effectively prevents the electromagnetic signal 50. ) Can be exchanged.

As a preferable example, the magnetic sheet is thinly formed, and the electromagnetic signal may be formed through the end of the core region at a high magnetic flux density. Accordingly, the antenna element having the substrate can have an improved reception sensitivity, and can easily transmit and receive electromagnetic signals even with a narrow gap.

Manufacturing Method of Antenna Element

According to another embodiment, the method includes a step of manufacturing a laminate by thermally pressing three or more pattern layers including an antenna pattern and a base layer respectively inserted between the pattern layers, wherein at least one of the base layers is a magnetic powder. And a thermosetting binder resin, wherein the binder resin is cured by the thermal pressing, and the magnetic sheet is bonded to an adjacent layer.

Method of manufacturing an antenna element according to the embodiment includes a step of forming a hole and a via, in addition to the heat pressing step; And forming the terminal pattern.

Manufacture of magnetic sheet

First, the method of manufacturing the antenna element according to the embodiment uses a magnetic sheet containing a magnetic powder and a thermosetting binder resin, its specific composition and physical properties may be as described above.

The magnetic sheet may be prepared according to a conventional manufacturing process of the sintered polymeric magnetic sheet.

According to one example, the magnetic sheet may be manufactured by a method comprising mixing the magnetic powder and the binder resin, and forming and drying the sheet.

Specifically, the magnetic sheet comprises the steps of (i) dispersing the magnetic powder in a binder resin and a solvent to prepare a slurry; And (ii) forming the sheet using the slurry and then drying the sheet.

According to a preferred example, the method of manufacturing the magnetic sheet comprises the steps of: (i) preparing a binder resin by mixing a polyurethane-based resin, an isocyanate-based curing agent, and an epoxy-based resin; (ii) mixing a magnetic powder and an organic solvent to the binder resin to prepare a slurry; And (iii) forming the slurry into a sheet and drying the slurry, wherein the magnetic sheet is 6 to 12 wt% of poly as the binder resin based on the total weight of the magnetic sheet. Urethane-based resins; 0.5-2% by weight of isocyanate-based curing agent; And 0.3 to 1.5% by weight of the epoxy resin.

As a more specific example, magnetic powder is first added to a solvent together with a polyurethane resin, an epoxy resin, and an isocyanate curing agent, and then dispersed by a disperser (planetary mixer, homo mixer, no-bead mill, etc.) to about 100 to 10,000 cPs. A slurry having a viscosity is prepared. Thereafter, the slurry is coated on a carrier film by a comma coater or the like to form a dry magnetic sheet. The dry magnetic sheet may be manufactured as a polymeric magnetic sheet (PMS) by adjusting the speed and temperature according to the thickness to be formed, removing the solvent through a dryer, and winding the molded sheet.

When the manufacturing process of the dry magnetic sheet is performed in a roll-to-roll process, a slurry containing magnetic powder and a binder resin may be coated on a carrier film by a coater and then dried to prepare a dry magnetic sheet. At this time, the dry magnetic sheet may include a binder resin in an uncured or partially cured state.

Therefore, the magnetic sheet thus dried may be a magnetic sheet in which curing of the binder resin is not completed.

Preferably, the binder resin may have a high embedding property in an uncured state and maintain an appropriate shape when manufactured in a sheet form.

Accordingly, the magnetic sheet may well maintain the sheet shape even in an uncured state, and may not generate bubbles even in a step (for example, 100 μm) due to embedding of the antenna pattern. Accordingly, a gap may not occur between the antenna pattern and the magnetic sheet.

Heat pressure

According to the embodiment, a laminate including the pattern layer and the base layer is manufactured by thermal pressure.

The thermal pressing may be performed at a pressure of 1 ~ 100 MPa and a temperature condition of 100 ~ 300 ℃. Alternatively, the thermal pressurization may be performed at a pressure of 5 to 30 MPa and a temperature of 150 to 200 ° C. In addition, the thermal pressure may be performed for about 0.1 to 5 hours.

By the thermal pressing, the binder resin in the magnetic sheet is cured.

Specifically, the binder resin in the magnetic sheet is initially uncured or semi-cured (that is, the curing is not completed) state, the curing of the binder resin can be completed by the thermal pressure.

By hardening the binder resin in the magnetic sheet, the magnetic sheet is bonded to an adjacent pattern layer, whereby it can be easily bonded without using a separate adhesive layer.

In addition, an antenna pattern may be embedded in the magnetic sheet by the thermal pressing.

Specifically, the antenna pattern included in the pattern layer adjacent to the magnetic sheet may be partially or fully embedded in the magnetic sheet by the thermal pressure.

Specifically, the antenna pattern included in the pattern layer adjacent to the magnetic sheet is pressed to the surface of the magnetic sheet by the thermal pressure, the binder resin constituting the magnetic sheet is not hardened state, so the antenna pattern is easily Can penetrate

As the thermal pressurization proceeds, penetration of the antenna pattern is further intensified, so that the antenna pattern may be partially or completely embedded in the magnetic sheet.

As a result, as shown in FIG. 6, the antenna pattern 500 has all the surfaces S2, S3, and S4 attached to the magnetic sheet 100 with one surface S1 attached to the other layer 110. An area in which the antenna pattern 500 is not bonded among the surfaces of the other layer 110 may be closely adhered to the surface of the magnetic sheet 100.

In addition, by the thermal pressing, the magnetic sheet may be compressed in the thickness direction.

Preferably, after the thermal pressing, the magnetic sheet may have a thickness in the range of 1/4 to 3/4 compared with before the thermal pressing. More preferably, after the thermal pressing, the magnetic sheet may have a thickness in the range of 1/4 to 1/2 compared with before the thermal pressing. When the compression ratio is within the above preferred range, the antenna pattern can be more effectively embedded in the magnetic sheet.

In addition, as the thickness of the magnetic sheet is compressed in this way, as shown in FIG. 6, the orientation of the magnetic powder 101 dispersed in the binder resin 102 of the magnetic sheet 100 may be further aligned, and thus the magnetic sheet 100 may be aligned. ) Can further improve the magnetic properties.

The thermal pressurization may be performed by a roll-to-roll process or a batch process.

Formation of vias

Vias may be further formed in the laminate manufactured by the thermal pressing.

In detail, the method of manufacturing the antenna element may further include forming a via penetrating at least one of the substrate layers in a thickness direction to electrically connect at least two of the pattern layers.

More specifically, the via is formed by forming a hole penetrating the thickness direction of the laminate; And forming a via in the hole.

In the hole forming step, a hole penetrating the laminate in the thickness direction is formed.

The hole penetrates the substrate layer, the insulating layer and the like constituting the laminate in the thickness direction.

The hole may have a diameter in the range of 100 to 300 μm, or in the range of 120 to 170 μm, for example.

The hole may be formed using a drill or the like.

A plurality of holes may be formed in the laminate as necessary.

In the via forming step, a via is formed in the hole.

A conductive material may be inserted into the hole to form a via.

Vias may be formed by plating the insides of the holes. Thus, when the vias are formed by the plating process, the vias formed in the large area can be formed at once. That is, when the via is formed of a plating layer, it may be formed more efficiently.

Alternatively, vias may be formed by filling a conductive composition in the holes and then curing and / or sintering the conductive composition. Alternatively, vias may be formed by inserting solder or a conductive rod into the via holes.

The via is electrically connected to an antenna pattern embedded in the antenna element.

Terminal formation

In addition, the antenna element may be further formed with a terminal for electrically connecting to the outside.

The terminal may be connected to the via.

In this case, since the via is connected to the antenna pattern of the inner pattern layer of the antenna element, the antenna pattern may be electrically connected to the outside through a terminal connected to the via.

The terminal may be formed using, for example, a conductive paste.

In this case, the conductive paste may be curable and / or sintered.

In addition, the terminal may be configured by further forming a plating layer on the conductive paste.

Preparation Example 1 of an Antenna Element

As a preferred example, the step of manufacturing the laminate may include forming a conductive layer on top of the substrate layer to manufacture the substrate A; Manufacturing a substrate B by forming a pattern layer having an antenna pattern on upper and lower portions of the base layer; Manufacturing a substrate C by forming a conductive layer under the substrate layer; Placing the substrate A, the substrate B, and the substrate C in order from the top and thermally pressing to obtain a laminate; And patterning the conductive layers of the substrate A and the substrate C to form a pattern layer, wherein the substrate layer of the substrate B is a magnetic sheet including magnetic powder and a thermosetting binder resin, The magnetic sheet may be bonded to an adjacent layer while the binder resin is cured.

Specifically, as shown in FIG. 2, conductive layers 220 ′ and 230 ′ are formed on the upper and lower portions of the second base layer 120. Subsequently, the conductive layer is etched to manufacture a substrate B on which the second pattern layer 220 and the third pattern layer 230 are formed. In this case, the insulating layer 300 may be inserted between the base layer and the pattern layer.

Next, as shown in FIG. 3, the substrate A on which the conductive layer 210 'is formed on the first substrate layer 110 and the substrate on which the conductive layer 240' is formed on the lower portion of the third substrate layer 130 are formed. B is prepared, and the substrate A, the substrate B, and the substrate C are arranged in this order and thermally pressurized to obtain a laminate. In this case, the second base layer 120 is a magnetic sheet including magnetic powder and a thermosetting binder resin, and the magnetic sheet may be bonded to an adjacent layer while the binder resin is cured by the thermal pressing. In addition, the second pattern layer 220 may be partially or entirely embedded in the first base layer 110, and the third pattern layer 230 may be partially or entirely embedded in the third base layer 130. . In addition, an insulating layer may be inserted and disposed between the base layer composed of a magnetic sheet and a pattern layer adjacent thereto, and in this case, the antenna pattern of the pattern layer may have the surface of the base layer wrapped with the insulating layer. It can be embedded in the (magnetic sheet).

Thereafter, as shown in (a) of FIG. 4, a plurality of holes 310 penetrating the laminate in the thickness direction are formed, and as shown in FIG. 4 (b), vias 320 are formed in the hole 310. ) Can be formed. Finally, as shown in FIG. 4C, the first conductive layer 210 and the fourth conductive layer 240 may be manufactured by patterning the outer conductive layers to form the antenna pattern 500. .

Manufacturing Example 2 of Antenna Element

As a preferable example, the step of manufacturing the laminate may include forming a pattern layer having an antenna pattern on and under the substrate layer to manufacture the substrate A; Preparing a magnetic sheet comprising a magnetic powder and an uncured or partially cured binder resin as a base layer; Manufacturing a substrate B by forming a pattern layer having an antenna pattern on upper and lower portions of the base layer; And arranging the substrate A, the magnetic sheet, and the substrate B in order from the top, and thermally pressing to obtain a laminate, wherein the binder resin is cured by the thermal pressing to bond the magnetic sheet to an adjacent layer. Can be.

Specifically, as shown in FIG. 5A, a substrate A having a first pattern layer 210 and a second pattern layer 220 formed on and under the first substrate layer 110 is manufactured, and a third A substrate B having a third pattern layer 230 and a fourth pattern layer 240 formed on and under the substrate layer 130 is prepared, and the second substrate layer 120 is disposed between the substrate A and the substrate B. As an example, a magnetic sheet containing magnetic powder and a thermosetting binder resin is disposed and thermally pressurized (600).

As a result, as shown in FIG. 5B, the magnetic sheet may be bonded to an adjacent layer while the binder resin of the magnetic sheet is cured. In addition, the antenna patterns of the second pattern layer 220 and the third pattern layer 230 may be embedded in the second base layer 120.

Handheld terminal

According to another embodiment, a portable terminal including the antenna element is provided.

The portable terminal may be a portable terminal including a case and an antenna element disposed in the case.

At this time, the antenna element included in the portable terminal may have the same configuration as the antenna element according to the above-described embodiment.

Example

Hereinafter, more specific embodiments will be described by way of example.

The materials used in the following examples are as follows:

Sandust Powder: C1F-02A, Crystallite Technology

-Polyurethane resin: UD1357, Daiichi Seika Industry Co., Ltd.

Isocyanate-based curing agents: isophorone diisocyanate, Sigma-Aldrich

-Epoxy resin: bisphenol A epoxy resin (epoxy equivalent = 189 g / eq), Epikote ^TM 828, Japan Epoxy Resin

Preparation Example 1 Preparation of Magnetic Sheet

Step (1) Preparation of Magnetic Powder Slurry

As magnetic powder, 42.8 parts by weight of sand dust powder, 15.4 parts by weight of polyurethane resin dispersion (25% by weight of polyurethane resin, 75% by weight of 2-butanone), 1.0 parts by weight of isocyanate curing agent dispersion (62% by weight of isocyanate curing agent, n -25% by weight of butyl acetate, 13% by weight of 2-butanone), 0.4 parts by weight of epoxy resin dispersion (70% by weight of epoxy resin, 3% by weight of n-butyl acetate, 15% by weight of 2-butanone, 13% by weight of toluene) ) And 40.5 parts by weight of toluene were mixed in a planetary mixer at a speed of about 40-50 rpm for about 2 hours to prepare a magnetic powder slurry.

Step (2) Preparation of Magnetic Sheets

The magnetic powder slurry prepared above was coated on a carrier film by a comma coater and dried at a temperature of about 110 ° C. to form a dry magnetic sheet. The dry magnetic sheet was compression set in a hot press process for about 30 minutes at a pressure of about 9 MPa at a temperature of about 170 ° C. to obtain a final magnetic sheet.

Preparation Example 2 Preparation of a Conductive Magnetic Composite Sheet

Epoxy resin was coated on both surfaces of the magnetic sheet obtained in Preparation Example 1 to form an insulating layer having a thickness of about 4 μm. Thereafter, a copper foil having a thickness of about 37 μm was disposed on one surface of the magnetic sheet on which the insulating layer was formed, thereby preparing a conductive magnetic composite sheet in which copper foil was laminated on one surface.

Preparation Example 3 Fabrication of Antenna Substrate (Plan Spiral Coil Formation)

The same procedure as in Preparation Example 2 was repeated, but a conductive magnetic composite sheet in which copper foils were laminated on both surfaces by thermally pressing copper foils on both surfaces of the magnetic sheets.

Subsequently, a mask pattern was formed on both surfaces of the conductive magnetic composite sheet, and a portion of the copper foil was etched through an etching process. Thereby, an antenna substrate on which antenna patterns of planar spiral coils were formed on both surfaces of the magnetic sheet was obtained.

Preparation Example 4 Fabrication of Antenna Substrate (Solenoid Coil Formation)

The same procedure as in Preparation Example 3 was repeated, but an antenna substrate having a plurality of conductive line patterns arranged side by side on each side of the magnetic sheet and spaced from each other was obtained. Thereafter, a plurality of holes having a diameter of about 0.15 mm was formed by using a drill in the antenna substrate. Thereafter, the inside of the hole was electroless copper plated to form a via connecting the plurality of conductive line patterns formed on both surfaces of the magnetic sheet. As a result, an antenna substrate having an antenna pattern of a solenoid coil wound around a central portion of the magnetic sheet was manufactured.

Test Example 1. Permeability Measurement

Through the impedance analysis equipment, the magnetic permeability and the investment loss of the magnetic sheet of Preparation Example 1 were measured. The results are summarized in Table 1 below.

Frequency 3 MHz Frequency 6.78 MHz Frequency 13.56 MHz Permeability Investment loss Permeability Investment loss Permeability Investment loss 210 16.8 195 49.5 156 60

As shown in Table 1, the magnetic sheet of Preparation Example 1 was excellent in permeability in all three bands.

Test Example 2 Heat Resistance Measurement-Reflow Test

The magnetic sheet of Preparation Example 1 was placed in an oven, the temperature was raised from 30 ° C. to 240 ° C. at a constant rate for 200 seconds, and then subjected to heat treatment conditions to lower the temperature at a constant speed from 240 ° C. to 130 ° C. for 100 seconds. Two reflow tests were performed. Then, the thickness change, the magnetic permeability change, and the bonding force change of the magnetic sheet were measured.

As a result, no blister was observed on the surface of the magnetic sheet even after two reflow tests. In addition, after two reflow tests, both the thickness and permeability change of the magnetic sheet were measured to be less than 5%. In addition, both peel strengths of the magnetic sheet with copper were measured to be 0.6 kgf / cm or more after two reflow tests.

Test Example 3 Heat Resistance Measurement-Pb Floating Test

The magnetic sheet of Preparation Example 1 was floated in a molten solder bath and left for 40 seconds, and then the surface thereof was observed. As a result, no blister was observed on the surface of the magnetic sheet.

Test Example 4 Chemical Resistance Measurement

After immersing the magnetic sheet in a 2N HCl aqueous solution for about 30 minutes, the mass change, thickness change, and permeability change of the magnetic sheet of Preparation Example 1 were measured. Further, after immersing the magnetic sheet in a 2N NaOH aqueous solution for about 30 minutes, the mass change, thickness change, and permeability change of the magnetic sheet were measured. As a result, precipitation of magnetic powder did not occur in the lower part of the solution, and mass change, mass change of magnetic sheet, thickness change, and permeability change were all measured to be 5% or less.

Test Example 5 Antirust Property

By the salt spray test method of KS D9502, the magnetic sheet of Preparation Example 1 was sprayed with 5% NaCl neutral saline at an average of 1 to 2 mL per hour at 35 ° C. for 72 hours, and then rust was observed. As a result of measuring the occurrence of rust by the area method (rating number method), it was measured to be 9.8 or more (rating number method is an evaluation method indicating the degree of corrosion by the ratio of the corrosion area and the effective area. Are separated).

Test Example 6 Measurement of Peel Strength

Using a universal testing machine (UTM), the peel strength between the magnetic sheet and the copper foil of the conductive magnetic composite sheet of Preparation Example 2 was measured. As a result, the peel strength was measured to be 0.6 kgf / cm or more.

Test Example 7 Bonding Force Measurement-Crosscut Test

By the crosscut test (ASTM D3369), the bonding force between the magnetic sheet and the copper foil of the conductive magnetic composite sheet of Preparation Example 2 was measured. Crosscut test results were measured between 0/100 and 5/100.

Test Example 8. Measurement of high temperature and high humidity characteristics

After leaving the magnetic sheet of Preparation Example 1 in an 85 ° C./85% RH constant temperature and humidity oven for 72 hours, the thickness change and the permeability change of the magnetic sheet were measured. As a result, both the thickness change and the permeability change of the magnetic sheet were measured to be 5% or less.

Test Example 9. Breakdown Voltage Measurement

Breakdown voltage was measured by installing electrodes on both sides of each magnetic sheet obtained in Preparation Example 1 and gradually applying a voltage. As a result, the magnetic sheet exhibited a breakdown voltage of about 4 kV.

Example 1 Fabrication of Multilayer Antenna Devices

Step 1) Preparation of Laminate

According to the procedure of Preparation Example 2, two magnetic sheets having copper foils laminated on one surface thereof were prepared, and the surfaces on which the copper foils were not laminated were disposed to face each other, and then the antenna substrate of Preparation Example 3 was placed therebetween. Insertion batch. The conductive magnetic composite sheet and the antenna substrate thus arranged are thermally pressurized at a temperature of 170 ° C. at a pressure of about 9 MPa for about 30 minutes, so that an antenna pattern formed on both surfaces of the antenna substrate is partially formed on the magnetic sheet of the conductive magnetic composite sheet. A buried laminate was prepared.

Step 2) Via Formation

In the laminate obtained in the previous step, a drill was used to form a plurality of holes having a diameter of about 0.15 mm. Then, the inside of the hole was electroless copper plated to form a via connecting the antenna patterns.

Example 2 Fabrication of Multi-Layer Antenna Devices

By a conventional pattern formation process, a double-sided flexible printed circuit board (FPCB) was produced from double-sided copper foil laminates (FCCL, SK Innovation).

The magnetic sheet obtained in Production Example 1 was disposed between the substrate obtained in Production Example 4 and the double-sided FPCB, and thermally pressurized for about 30 minutes at a pressure of about 9 MPa at a temperature of 170 ° C. As a result, a laminate in which an antenna pattern was partially embedded in both surfaces of the magnetic sheet of Preparation Example 1 was prepared.

10: antenna element,
20: antenna substrate, 30: case,
31: electromagnetic wave transmission region, 32: electromagnetic wave transmission region,
40: external terminal, 50: electromagnetic signal,
100: magnetic sheet, 101: magnetic powder,
102: binder resin, 110: first base material layer,
120: second substrate layer, 130: third substrate layer,
210 ', 220', 230 ', 240': conductive layer 210: first pattern layer,
220: second pattern layer, 230: third pattern layer,
240: fourth pattern layer, 300: insulating layer,
310: hall, 320: vias,
400: terminal pattern, 500: antenna pattern,
511, 512: conductive foil, 521, 522: antenna pattern,
531: first conductive line pattern, 532: second conductive line pattern,
600: heat pressure,
S1, S2, S3, S4: faces of the antenna pattern,
CR: core region, OR: peripheral region.

Claims (20)

A laminate including three or more pattern layers including an antenna pattern and a substrate layer interposed between the pattern layers,
At least one of the base layers is a magnetic sheet including magnetic powder and thermosetting binder resin, the antenna pattern included in the pattern layer adjacent to the magnetic sheet is partially or completely embedded in the magnetic sheet, and the antenna pattern is embedded The magnetic sheet is a compressed cured sheet.
delete The method of claim 1,
The number of the pattern layer is 3 to 10,
The antenna element, wherein the base layer is a magnetic sheet containing all of magnetic powder and thermosetting binder resin.
The method of claim 1,
The magnetic sheet is
Have a thickness of 10-500 μm,
With permeability of 190 to 250 for alternating current of 3 MHz frequency,
Has a permeability of 180 to 230 for alternating current of 6.78 MHz frequency,
An antenna element having a permeability of 140 to 180 for an alternating current of 13.56 MHz frequency.
The method of claim 1,
And the antenna element further comprises an insulating layer or an adhesive layer interposed between the pattern layer and the base layer.
The method of claim 1,
The antenna element further comprises a via penetrating at least one of the substrate layers in the thickness direction to electrically connect at least two of the pattern layers.
The method of claim 1,
The laminate includes a first pattern layer, a first substrate layer, a second pattern layer, a second substrate layer, a third pattern layer, a third substrate layer, and a fourth pattern layer in order from above,
The first pattern layer, the second pattern layer, the third pattern layer, and the fourth pattern layer each include a near field communication antenna pattern, a magnetic security transmission antenna pattern, a wireless charging antenna pattern, or a combination thereof device.
The method of claim 7, wherein
The first base layer and the third base layer are magnetic sheets containing magnetic powder and thermosetting binder resin,
The antenna pattern of the second pattern layer is partially or wholly embedded in the first base layer,
And an antenna pattern of the third pattern layer is partially or wholly embedded in the third base layer.
The method of claim 7, wherein
The second base material layer is a magnetic sheet containing magnetic powder and thermosetting binder resin,
Antenna elements of the second pattern layer and the third pattern layer are partially or wholly embedded in the second base layer, respectively.
The method of claim 1,
The antenna element
A substrate A including a substrate layer and a pattern layer formed thereon;
A substrate B including a substrate layer and pattern layers formed on and under the substrate layer; And
It includes a substrate C including a substrate layer and a pattern layer formed below it,
The pattern layer of the substrate B includes an antenna pattern,
The base material layers of the said board | substrate A and the board | substrate C are magnetic sheets containing a magnetic powder and a thermosetting binder resin,
The pattern layer formed on the substrate layer of the substrate B is partially or wholly embedded in the substrate layer of the substrate A,
The pattern element formed below the base material layer of the said board | substrate B is partially or fully embedded in the base material layer of the said board | substrate C. The antenna element.
The method of claim 1,
The antenna element
A substrate A including a substrate layer and pattern layers formed on and under the substrate layer;
A substrate B including a substrate layer and pattern layers formed on and under the substrate layer; And
A magnetic sheet inserted between the substrate A and the substrate B and comprising a magnetic powder and a thermosetting binder resin,
The pattern layer of the substrate A and the substrate B includes an antenna pattern,
The antenna pattern of the antenna pattern adjacent to the magnetic sheet is partially or wholly embedded in the magnetic sheet.
The method of claim 11,
The base material layer of the said board | substrate A is a magnetic sheet containing magnetic powder and thermosetting binder resin,
An antenna element, wherein the substrate layer of the substrate B is an insulating sheet.
The method of claim 11,
The base material layer of the said board | substrate A is a magnetic sheet containing magnetic powder and thermosetting binder resin,
The substrate A further includes a plurality of vias penetrating the substrate layer in a thickness direction;
And a lower antenna pattern and an upper antenna pattern of the substrate A are electrically connected by the plurality of vias to form a solenoid coil wound around the center portion of the base layer.
Comprising a step of manufacturing a laminate by thermally pressing the three or more pattern layers including the antenna pattern and the substrate layer respectively inserted between the pattern layer,
At least one of the base layers is a magnetic sheet including magnetic powder and a thermosetting binder resin, and the antenna pattern included in the pattern layer adjacent to the magnetic sheet is partially or entirely embedded in the magnetic sheet by the thermal pressing. And bonding the magnetic sheet with an adjacent layer while the binder resin is cured and compresses the magnetic sheet in a thickness direction.
delete delete The method of claim 14,
The manufacturing method of the antenna element,
And forming a via that electrically connects at least two of the pattern layers while penetrating at least one of the substrate layers in a thickness direction.
The method of claim 14,
The manufacturing step of the laminate,
Manufacturing a substrate A by forming a conductive layer on top of the substrate layer;
Manufacturing a substrate B by forming a pattern layer having an antenna pattern on upper and lower portions of the base layer;
Manufacturing a substrate C by forming a conductive layer under the substrate layer;
Placing the substrate A, the substrate B, and the substrate C in order from the top and thermally pressing to obtain a laminate; And
Patterning the conductive layers of the substrate A and the substrate C to form a pattern layer,
The base material layer of the said board | substrate B is a magnetic sheet containing a magnetic powder and a thermosetting binder resin, Comprising: The said binder resin is hardened | cured by the said thermal pressurization, The said magnetic sheet is bonded with an adjacent layer, The manufacturing method of the antenna element.
The method of claim 14,
The manufacturing step of the laminate,
Manufacturing a substrate A by forming a pattern layer having an antenna pattern on upper and lower portions of the base layer;
Preparing a magnetic sheet comprising a magnetic powder and an uncured or partially cured binder resin as a base layer;
Manufacturing a substrate B by forming a pattern layer having an antenna pattern on upper and lower portions of the base layer; And
And arranging the substrate A, the magnetic sheet, and the substrate B in order from the top and thermally pressing to obtain a laminate.
Bonding the magnetic sheet to an adjacent layer while the binder resin is cured by the thermal pressing.
A portable terminal comprising the antenna element of claim 1.

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