TWI668457B - Inspecting device - Google Patents

Abstract

A detecting device comprises a circuit board, a wiring carrier and a detecting unit. The wiring carrier has a conductive medium, and the conductive medium is electrically connected to the circuit board. The detecting unit comprises a spring, and the outer surface of the spring is fixed to one side of the wiring carrier along a part of the length direction thereof, and is electrically connected to the conductive medium. When the detecting device detects a semiconductor component, the outer surface of the spring simultaneously contacts at least two contacts of the semiconductor component along another portion of its length.

Description

Testing device

The invention relates to a detecting device, in particular to a detecting device using a spring body as a detecting head.

In general, after a semiconductor element (for example, a semiconductor circuit wafer) is fabricated, a semiconductor element (hereinafter referred to as a test element, DUT) is electrically detected to ensure the quality of the device under inspection. During the electrical detection, a plurality of probes of a test device are respectively pressed against a plurality of conductive contacts of the test object to obtain test results of the test object through signal transmission and signal analysis.

However, when testing the power supply region (Vdd) and the connection region (Vss) of the component to be tested, the test device needs to be configured with the same number of probes as the conductive contacts to electrically touch the component. Conductive contacts for conducting and grounding tests. As such, the industry is still unable to effectively reduce costs and simplify the structure.

An embodiment of the invention provides a detection device. The detecting device comprises a circuit board, a wiring carrier and at least one first detecting unit. The wiring carrier has a first conductive medium, and the first conductive medium is electrically connected to the circuit board. The first detecting unit includes a first spring. The outer surface of the first spring is partially fixed to one side of the wiring carrier along one of its length directions, and is electrically connected to the first conductive medium. When the detecting device detects a semiconductor component, the outer surface of the first spring simultaneously contacts at least two first contacts of the semiconductor component along another portion of its length.

According to one or more embodiments of the present invention, in the above detecting device, the detecting device further includes at least one second detecting unit. The second detecting unit includes a second spring. The outer surface of the second spring is partially secured to the face of the wiring carrier along a portion of its length. The wiring carrier further has a second conductive medium, and the second conductive medium is electrically connected to the circuit board, and the second spring is electrically connected to the second conductive medium. When the detecting device detects the semiconductor component, the outer surface of the second spring simultaneously contacts at least two second contacts of the semiconductor component along another portion of the length direction.

In accordance with one or more embodiments of the present invention, in the above detection apparatus, the first conductive medium includes a plurality of first via holes. These first via holes are spaced apart from each other on the wiring carrier. The outer surface of the first detecting unit is soldered to the side of the wiring carrier along the length of the surface, and electrically connects the first guiding holes. The second conductive medium includes a plurality of second conductive vias. These second via holes are spaced apart from each other on the wiring carrier. The outer surface of the second detecting unit is soldered to the surface of the wiring carrier along a portion of the length of the second detecting unit, and electrically leads to the second guiding hole.

According to one or more embodiments of the present invention, in the detecting device, at least one of the first spring and the second spring comprises a flexible strip body, a tin plating layer and a palladium plating layer. The flexible strip body is divided along its length a first half and a second half. The tin plating is applied to the entire surface of the flexible strip body and soldered to the side of the wiring carrier. The palladium plating layer is coated on the entire surface of the second half of the tin plating layer.

According to one or more embodiments of the present invention, in the above detecting device, the first spring and the second spring are arranged linearly or curved.

According to one or more embodiments of the present invention, in the detecting device described above, the first spring and the second spring are each a plurality, and the first springs are arranged in parallel with each other, and the second springs are arranged in parallel with each other.

According to one or more embodiments of the present invention, in the detecting device described above, the first spring and the second spring are each a plurality, and the first spring and the second spring are alternately arranged with each other.

According to one or more embodiments of the present invention, in the above detecting device, the first spring and the second spring are arranged in accordance with the arrangement of concentric circles.

According to one or more embodiments of the present invention, in the detecting device, the detecting device further includes a space conversion substrate, a probe holder body and a plurality of probes. The space conversion substrate is located between the circuit board and the wiring carrier, and electrically connects the circuit board and the wiring carrier. The first detecting unit and the second detecting unit are electrically connected to the circuit board through the space conversion substrate. The probe holder is disposed on one side of the space conversion substrate facing away from the circuit board and surrounds the wiring carrier. The probes are spaced apart from the probe base and electrically connected to the circuit board through the space conversion substrate for contacting a plurality of third contacts of the semiconductor component.

According to one or more embodiments of the present invention, in the detecting device, the circuit board transmits the substrate through a first soldering space, the space converting substrate is transmitted through a second solder-welded wiring carrier, and the wiring carrier is transmitted through a third solder. weld Connect the first spring. The second solder has a melting point between the first solder and the third solder, and the third solder is larger than the first solder.

Thus, with the architecture described in the above embodiments, the user can simultaneously contact a plurality of conductive contacts or ground contacts through the long sides of each spring without having to spend a large number of probes to contact each of the conductive contacts. It not only effectively reduces equipment costs and maintenance costs, but also simplifies the overall structure.

The above description is only for explaining the problems to be solved by the present invention, the technical means for solving the problems, the effects thereof, and the like, and the specific details of the present invention will be described in detail in the following embodiments and related drawings.

10‧‧‧Detection device

100‧‧‧ boards

101‧‧‧First solder

200‧‧‧ Space Conversion Substrate

201‧‧‧Second solder

300‧‧‧ probe body

310‧‧‧Probe

400‧‧‧Wiring carrier board

401‧‧‧ top surface

402‧‧‧ bottom

410‧‧‧First Conductive Medium

411‧‧‧First lead pad

412‧‧‧First lead hole

420‧‧‧Secondary medium

421‧‧‧Second guide pad

422‧‧‧Second guide hole

500‧‧‧First detection unit

501‧‧‧First spring

510‧‧‧ first part

520‧‧‧Part 2

530‧‧‧Flexible strip body

531‧‧‧ first half

532‧‧‧ second half

540‧‧‧ tin plating

550‧‧‧palladium plating

600‧‧‧Second detection unit

601‧‧‧Second spring

610‧‧‧Part III

620‧‧‧Part 4

700, 700A, 700B‧‧‧ semiconductor components

701‧‧‧The length of the side

710‧‧‧ top surface

711‧‧‧Power connection area

712‧‧‧Signal area

720‧‧‧Power contacts

730‧‧‧ Grounding contacts

740‧‧‧Signal contacts

751‧‧‧First column structure

752‧‧‧Second column structure

761‧‧‧ first ring structure

762‧‧‧second ring structure

770‧‧‧ stage

800‧‧‧ welding fixture

810‧‧‧Frame

820‧‧‧Long space

830‧‧‧Fixed feet

900‧‧‧Wiring carrier board

910‧‧‧ Guide pad

920‧‧‧Positioning holes

930‧‧‧Band solder

940‧‧‧Spring body

L1, L2‧‧‧ length direction

M‧‧‧ moving direction

S1‧‧‧ test signal

S2‧‧‧ grounding signal

The above and other objects, features, advantages and embodiments of the present invention will become more <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; 1 is a bottom view of the wiring carrier; FIG. 3 is a top view of the semiconductor element of FIG. 1; FIG. 4 is a longitudinal side view of one of the first springs according to FIG. 2; FIG. 6A to FIG. 6C are schematic diagrams showing the continuous operation of the first detecting unit according to an embodiment of the present invention; and FIG. 7A is a partial schematic view showing the power connection region of another semiconductor component. FIG. 7B is a partial schematic view showing a power connection region of another semiconductor component; FIG. 8 is a schematic view showing a soldering fixture according to an embodiment of the present invention; and FIG. 9A to FIG. 9E are welding fixtures using FIG. A continuous schematic.

The embodiments of the present invention are disclosed in the following drawings, and for the purpose of illustration However, it should be understood that these practical details are not intended to limit the invention. That is to say, in the embodiment of the present invention, these practical details are not necessary. In addition, some of the conventional structures and elements are shown in the drawings in a simplified schematic manner in order to simplify the drawings.

1 is a schematic view of a detecting device 10 according to an embodiment of the present invention. Fig. 2 is a bottom view of the wiring carrier 400 of Fig. 1. As shown in FIGS. 1 and 2, the detecting device 10 is for detecting a semiconductor device 700. The detecting device 10 includes a circuit board 100, a wiring carrier 400, a plurality of first detecting units 500, and a second detecting unit 600. The wiring carrier 400 includes opposing top and bottom surfaces 401, 402. The circuit board 100 is located on the top surface 401 of the wiring carrier 400 and electrically connected to the wiring carrier 400. Each first detecting unit 500 includes a first spring 501. The first spring 501 is laid flat and fixed to the bottom surface 402 of the wiring carrier 400 and electrically connected to the circuit board 100 through the wiring carrier 400. For example, the outer surface of each of the first springs 501 has a first portion 510 (such as a long side) and a second portion 520 (such as the other long side) disposed opposite each other along a length direction L1 thereof. Each of the first springs 501 is soldered to the bottom surface 402 of the wiring carrier 400 through all of the first portions 510. Each second detecting unit 600 includes a second spring 601. The second spring 601 is laid flat and fixed to the bottom surface 402 of the wiring carrier 400 and electrically connected to the circuit board 100 through the wiring carrier 400. For example, the outer surface of each second spring 601 has an oppositely disposed third portion 610 (such as a long side) and a fourth portion 620 along its length direction L1 (such as another One long side). Each of the second springs 601 is soldered to the bottom surface 402 of the wiring carrier 400 through all of the third portions 610.

Fig. 3 is a top view of the semiconductor device 700 of Fig. 1. As shown in FIG. 3, the top surface 710 of the semiconductor device 700 includes a power connection region 711 and a signal region 712. The signal area 712 surrounds the power supply area 711. A plurality of power contacts 720 and ground contacts 730 are disposed in the power connection area 711. The power contacts 720 are arranged in the power connection area 711 according to the array manner. The ground contacts 730 are arranged in the power connection area 711 according to the array manner, and the power contacts 720 of each row and the ground contacts 730 of each row are interlaced with each other. The ground is mixed in the power connection area 711. A plurality of signal contacts 740 are disposed in the signal area 712. The signal contacts 740 are respectively spaced apart in the signal region 712 and surround the power contacts 720 and the ground contacts 730.

Therefore, when the detecting device 10 contacts and detects the semiconductor component 700 on a loading stage 770 according to a moving direction M, the second portion 520 of the first spring 501 simultaneously contacts multiple (eg, at least two) of the semiconductor components 700. Power contact 720. The fourth portion 620 of the second spring 601 simultaneously contacts a plurality (eg, at least two) of ground contacts 730 of the semiconductor component 700. Further, the moving direction M is orthogonal to the longitudinal direction L1 of the second spring 601 and the first spring 501.

Thus, with the structure described in the above embodiment, the user can simultaneously contact a plurality of conductive contacts through the second portion 520 of each first spring 501, and the fourth portion 620 of each second spring 601 is simultaneously Touching the plurality of ground contacts 730 does not require a large number of probes 310 to contact each of the conductive contacts, which not only reduces equipment cost and maintenance cost, but also simplifies the overall structure.

Figure 4 is a longitudinal view of one of the first springs 501 according to Figure 2 Side view. More specifically, as shown in FIG. 4, the wiring carrier 400 includes a first conductive medium 410. The first conductive medium 410 is electrically connected to the circuit board 100 . Specifically, the first conductive medium 410 includes a plurality of first conductive pads 411 and a plurality of first conductive vias 412 . The first via holes 412 are disposed on the wiring carrier 400 at intervals, and penetrate the top surface 401 and the bottom surface 402 of the wiring carrier 400, respectively. Each of the first via pads 411 is formed on the bottom surface 402 of the wiring carrier 400 and simultaneously connects a plurality of first via holes 412 in the wiring carrier 400. The first portion 510 of each first spring 501 is soldered to the first conductive pad 411. As such, when the second portion 520 of each of the first springs 501 simultaneously contacts a plurality of (eg, at least two) power contacts 720 of the semiconductor component 700, the circuit board 100 issues a test signal S1 to the wiring carrier 400, such that The test signal passes through the first via 412 to the first spring 501 and from the first spring 501 to the corresponding power contact 720 of the semiconductor component 700.

Fig. 5 is a longitudinal side view of one of the second springs 601 according to Fig. 2. As shown in FIG. 5, the wiring carrier 400 further includes a second conductive medium 420. The second conductive medium 420 is electrically connected to the circuit board 100 . Specifically, the second conductive medium 420 includes a plurality of second conductive pads 421 and a plurality of second conductive vias 422 . The second via holes 422 are disposed on the wiring carrier 400 at intervals, and penetrate the top surface 401 and the bottom surface 402 of the wiring carrier 400, respectively. Each of the second via pads 421 is formed on the bottom surface 402 of the wiring carrier 400 and simultaneously connects a plurality of second via holes 422 in the wiring carrier 400. The third portion 610 of each second spring 601 is soldered to the second conductive pad 421. Thus, when the fourth portion 620 of each of the second springs 601 simultaneously contacts a plurality of (eg, at least two) ground contacts 730 of the semiconductor component 700, the ground contacts 730 simultaneously pass through the second spring 601 respectively. Grouping the plurality of second guiding holes 422 to transmit the ground signal S2 to the circuit board 100. In this way, since the first spring 501 and the second spring 601 respectively contact a plurality of contacts at the same time, the opportunity for sharing the loop resources can be improved.

Referring back to FIG. 1, the detecting device 10 further includes a space conversion substrate 200, a probe holder 300 and a plurality of probes 310. The space conversion substrate 200 is located between the circuit board 100 and the wiring carrier 400, and electrically connects the circuit board 100 and the wiring carrier 400. The first spring 501 and the second spring 601 are electrically connected to the circuit board 100 through the space conversion substrate 200, respectively. The probe holder 300 is disposed on one side of the space conversion substrate 200 facing away from the circuit board 100 and surrounds the wiring carrier 400. The probes 310 are spaced apart from the probe base 300 and electrically connected to the circuit board 100 through the space conversion substrate 200.

Therefore, when the detecting device 10 contacts and detects the semiconductor component 700, in addition to the second portion 520 of the first spring 501, a plurality of (for example, at least two) power contacts 720 and a second spring of the semiconductor component 700 are simultaneously contacted. The fourth portion 620 of the 601 simultaneously contacts a plurality of (eg, at least two) ground contacts 730 of the semiconductor component 700, and the probes 310 respectively touch the signal contacts 740.

It should be understood that the circuit board 100 is soldered to the space conversion substrate 200 through a first solder 101. The space conversion substrate 200 is soldered to the wiring carrier 400 through a second solder 201, and the wiring carrier 400 is transmitted through a third solder (not shown). The first spring 501 and the second spring 601 are welded. The melting point of the second solder 201 is between the first solder 101 and the third solder, and the third solder is larger than the first solder 101. Thus, by controlling the appropriate soldering temperature, the first solder 101 to the third solder are not undesirably melted, and the circuit board 100, the space conversion substrate 200, and the wiring carrier 400 are smoothly separated, respectively.

As shown in FIG. 2, these first springs 501 and second springs 601 They are respectively located on the bottom surface 402 of the wiring carrier 400. Each of the first springs 501 is linearly disposed on the bottom surface 402 of the wiring carrier 400, and the first springs 501 are parallel to each other. In other words, each of the first springs 501 has a length direction L1, and the length direction of the first spring 501 The L1 are parallel to each other, and the length direction L1 of each of the first springs 501 is parallel to the side of the bottom surface 402 of the wiring carrier 400. Each of the second springs 601 is linearly disposed on the bottom surface 402 of the wiring carrier 400, and the second springs 601 are parallel to each other. In other words, each of the second springs 601 has a length direction L1 and a length direction of the second spring 601. L1 is parallel to each other, and the longitudinal direction L1 of each of the second springs 601 is parallel to the longitudinal direction 701 of the side of the bottom surface 402 of the wiring carrier 400. Further, these first springs 501 and second springs 601 are alternately arranged with each other. However, the present invention is not limited thereto. In other embodiments, the first spring 501 and the second spring 601 are also bendably disposed on the bottom surface 402 of the wiring carrier 400.

In each of the above embodiments, the first spring 501 and the second spring 601 are linear or axial, respectively, and are wound by a coil. For example, the first spring 501 and the second spring 601 are respectively a tension spring, and the tension spring has a hollow pipe and a circumferential surface. The circumferential surface completely surrounds the hollow pipe. Therefore, when one of the circumferential faces of the tension spring is pressed to any of the contacts, the tension spring can provide space and stress buffering due to the elasticity of the tension spring. However, the present invention is not limited thereto. In other embodiments, the first spring 501 and the second spring 601 may also be inferior conductive coils.

6A to 6C are schematic views showing the continuous operation of the first spring 501 according to an embodiment of the present invention. The first spring 501 can be plated with a functional coating to increase the life of the spring product. For example, the process of plating the first spring 501 with a plating layer includes the following steps. First provide a flexible strip of one tension spring The flexible body 530 is divided into a first half 531 and a second half 532 along the length direction L1 thereof. Then, the entire surface of the flexible strip body 530 is plated with tin metal ( Sn), a tin plating layer 540 is coated on the entire surface of the flexible strip body 530; then, the second half 532 of the flexible strip body 530 coated with the tin plating layer 540 is plated with palladium metal ( Pb) such that a palladium plating layer 550 is coated on the entire surface of the tin plating layer 540 corresponding to the second half 532.

As such, the first spring 501 includes a flexible strip body 530, a tin plating layer 540, and a palladium plating layer 550. The tin plating layer 540 is coated on the entire surface of the flexible strip body 530 and soldered to the side of the wiring carrier 400. The tin plating 540 facilitates soldering of the first portion 510 of each of the first springs 501 to the first via pads 411. The palladium plating layer 550 is coated on the entire surface of the tin plating layer 540 corresponding to the second half 532. Since the hardness of the palladium metal is high, it is less prone to wear, and its oxidation resistance is good. When the second portion 520 of the first spring 501 contacts the plurality of power contacts 720 of the semiconductor component 700, the first spring 501 The second portion 520 does not cause rapid damage. However, the present invention is not limited to the above plating materials.

In addition, the second spring 601 can also be plated with a functional coating to increase the life of the spring product. The functional plating of the second spring 601 is the same as that of the first spring 501 as described above, and will not be further described herein.

FIG. 7A is a partial schematic view of a power connection region 711 of another semiconductor component 700A. As shown in FIG. 7A, the power contacts 720 and the ground contacts 730 are alternately arranged in a staggered manner. The power contacts 720 are arranged in a plurality of first column structures 751, and each of the first column structures 751 is arranged in a single row. The plurality of power contacts 720, the first column structures 751 are parallel to each other and are arranged obliquely within the power connection region 711. In other words, each first column structure 751 has a length In the direction L2, the length direction L2 is not parallel to the longitudinal direction 701 of one side of the semiconductor element 700A. The grounding contacts 730 are arranged in a plurality of second column structures 752, each of the second column structures 752 comprising a plurality of grounding contacts 730 arranged in a row, the second column structures 752 being parallel to each other, and the first columns The structure 751 is arranged obliquely in the power connection area 711. In other words, each of the second column structures 752 has a length direction L2 that is not parallel to the length direction 701 of one of the sides of the semiconductor element 700.

Thus, according to the arrangement of the power contacts 720 of the first column structure 751 and the ground contacts 730 of the second column structures 752 in FIG. 7A, the detection device 10 in another embodiment is embodied. The arrangement of a spring 501 and a second spring 601. However, in this embodiment, the configuration of the first spring 501 and the second spring 601 is substantially the same except that the arrangement of the first spring 501 and the second spring 601 is different from that of the detecting device 10 of FIG.

FIG. 7B is a partial schematic view of a power connection region 711 of another semiconductor device 700B. As shown in FIG. 7B, these power contacts 720 are arranged in a plurality of first annular structures 761. These ground contacts 730 are arranged in a plurality of second annular structures 762. The first annular structure 761 and the second annular structure 762 are alternately arranged with each other. Each of the first ring structures 761 includes a plurality of power contacts 720 arranged in a single row, and each of the second ring structures 762 includes a plurality of ground contacts 730 arranged in a single row.

Thus, according to the arrangement of the power contact 720 of the first annular structure 761 and the ground contact 730 of the second annular structure 762 according to FIG. 7B, the detecting device 10 of another embodiment is embodied. The arrangement of the first spring 501 and the second spring 601. That is, the first spring 501 and the second spring 601 Arranged according to the arrangement of concentric circles. More specifically, the first spring 501 is crimped into a circular shape by a linear spring, and the power contact 720 of the first annular structure 761 is simultaneously contacted with one side of the annular shape. The second spring 601 is crimped into a circular shape by a linear spring, and one side of the annular shape simultaneously contacts the power contact 720 of the second annular structure 762. However, in this embodiment, except that the arrangement of the first spring 501 and the second spring 601 is different from that of the detecting device 10 of Fig. 2, the rest of the structure is substantially the same.

Figure 8 is a schematic view of a welding jig 800 according to an embodiment of the present invention. As shown in FIG. 8, in order to enable the detection unit to be effectively positioned, a welding jig 800 is provided in one embodiment of the present invention. The welding jig 800 includes a frame 810 and a plurality of fixing legs 830. The frame 810 has an elongated space 820 that extends through the opposite sides of the frame 810 for matingly receiving a spring.

9A to 9E are continuous schematic views of the welding jig 800 using Fig. 8. For example, the process of soldering the detection unit to the wiring carrier 900 includes the following steps. As shown in FIG. 9A, a wiring carrier 900 is provided. The wiring carrier 900 has a conductive pad 910 and a plurality of positioning holes 920. Then, as shown in FIG. 9B, a strip solder 930 is applied to the conductive connection. On the pad 910; next, as shown in FIG. 9C, the soldering jig 800 is mounted on the wiring carrier 900, wherein the fixing legs 830 of the bonding jig 800 are respectively inserted into the positioning holes 920, so that the frame 810 of the welding jig 800 is The elongated space 820 is aligned and exposes the strip solder 930 on the pad 910; then, as shown in FIG. 9D, a spring body 940 is matchedly filled into the elongated space 820, and the spring body 940 is inside the frame 810. The strip solder 930 is contacted; then, the wiring carrier 900 having the solder jig 800 and the spring body 940 is fed into the soldering furnace, so that the spring body 940 is soldered to the soldering pad 910 through the strip solder 930. The welding jig 800 is removed as shown in Fig. 9E.

Finally, the various embodiments disclosed above are not intended to limit the invention, and those skilled in the art can be protected in various modifications and refinements without departing from the spirit and scope of the invention. In the invention. Therefore, the scope of the invention is defined by the scope of the appended claims.

Claims (10)

A detecting device comprising: a circuit board; a wiring carrier having a first conductive medium, the first conductive medium electrically connected to the circuit board, the first conductive medium comprising a plurality of first guiding holes, The first guiding holes are spaced apart from the wiring carrier; and the at least one first detecting unit includes a first spring, and the outer surface of the first spring is fixed to the wiring along a part of the length direction thereof One side of the board and electrically connected to the first conductive holes of the first conductive medium, wherein when the detecting device detects a semiconductor component, the outer surface of the first spring is along the length direction thereof A portion simultaneously contacts at least two first contacts of the semiconductor component. The detecting device of claim 1, further comprising: at least one second detecting unit comprising a second spring, the outer surface of the second spring being fixed to the wiring carrier along a portion of the length direction thereof The wiring carrier further has a second conductive medium, and the second conductive medium is electrically connected to the circuit board, and the second spring is electrically connected to the second conductive medium, wherein when the detecting device is connected to the semiconductor component When detecting, the outer surface of the second spring simultaneously contacts at least two second contacts of the semiconductor component along another portion of the length direction. The detecting device of claim 2, wherein the second conductive medium comprises a plurality of second guiding holes, and the second guiding holes are spacedly disposed on the wiring carrier, wherein the second spring is external Surface along its length The portion is soldered to the surface of the wiring carrier and electrically connected to the second vias. The detecting device of claim 2, wherein at least one of the first spring and the second spring comprises: a flexible strip-shaped body, the flexible strip-shaped body being divided into a first length along a length thereof a half portion and a second portion; a tin plating layer covering the entire surface of the flexible strip body and soldered to the surface of the wiring carrier; and a palladium plating layer coated on the tin plating layer It should be on the entire surface of the second half. The detecting device of claim 2, wherein the first spring and the second spring are linearly or curvedly arranged. The detecting device of claim 2, wherein the at least one first spring and the at least one second spring are respectively plural, the first springs are arranged in parallel with each other, and the second springs are arranged in parallel with each other. The detecting device of claim 2, wherein the at least one first spring and the at least one second spring are respectively plural, and the first springs and the second springs are alternately arranged with each other. The detecting device of claim 2, wherein the at least one first spring and the at least one second spring are arranged according to an arrangement of concentric circles. The detecting device of claim 2, further comprising: a space conversion substrate between the circuit board and the wiring carrier, and electrically connecting the circuit board and the wiring carrier, wherein the first detecting unit is The second detecting unit is electrically connected to the circuit board through the space conversion substrate; a probe holder body disposed on the surface of the space conversion substrate facing the circuit board and surrounding the wiring carrier; and a plurality of probes The circuit board is electrically connected to the circuit board through the space conversion substrate for contacting the plurality of third contacts of the semiconductor component. The detecting device of claim 9, wherein the circuit board is soldered to the space conversion substrate through a first solder, the space conversion substrate is soldered to the wiring carrier through a second solder, and the wiring carrier is transmitted through a third Solder is soldered to the first spring, wherein a melting point of the second solder is between the first solder and the third solder, and the third solder is larger than the first solder.