TW202009500A - Inspecting device - Google Patents

Abstract

An inspecting device includes a circuit board, a wiring load board and a strip detecting unit having a shaft spring. The wiring load board has a conductive medium path electrically connected to the circuit board. One part of the outer surface of the shaft spring along its length is fixed to one surface of the wiring load board, and is electrically connected to the conductive medium. When the inspecting device tests a semiconductor component, the shaft spring simultaneously contacts at least two power contacts of the semiconductor component by another part of the outer surface of the shaft spring along its length.

Description

Testing device

The invention relates to a detection device, especially a detection device using a spring body as a detection head.

Generally speaking, after a semiconductor device (such as a semiconductor circuit chip) is completed, it will perform electrical testing on the semiconductor device (hereinafter referred to as a test device, DUT) to ensure the quality of the test device when it is shipped. When conducting electrical testing, a plurality of probes of a testing device are used to respectively press a plurality of conductive contacts of the test object, so as to obtain the test result of the test object through signal transmission and signal analysis.

However, when testing the power supply area (Vdd) and the connection area (Vss) of the device under test, the test device needs to be equipped with the same number of probes as the above-mentioned conductive contacts in order to electrically touch the test element one by one Conductive contacts for conducting and grounding tests. In this way, the industry is still unable to effectively reduce costs and simplify the structure.

An embodiment of the present invention provides a detection device. The detection device includes a circuit board, a wiring carrier and at least one first detection unit. The wiring carrier has a first conductive medium, and the first conductive medium is electrically connected to the circuit board. The first detection unit includes a first spring. A portion of the outer surface of the first spring is fixed to a surface of the wiring carrier along its length, and is electrically connected to the first conductive medium. When the detecting device detects a semiconductor element, another part of the outer surface of the first spring along its length direction simultaneously contacts at least two first contacts of the semiconductor element.

According to one or more embodiments of the present invention, in the above detection device, the detection device further includes at least one second detection unit. The second detection unit includes a second spring. The outer surface of the second spring is fixed to the surface of the wiring carrier along a part of its length. The wiring carrier further has a second conductive medium, and the second conductive medium is electrically connected to the circuit board, and the second spring is electrically connected to the second conductive medium. When the detection device detects the semiconductor element, another part of the outer surface of the second spring along the length direction simultaneously contacts at least two second contacts of the semiconductor element.

According to one or more embodiments of the present invention, in the above detection device, the first conductive medium includes a plurality of first conductive holes. These first via holes are arranged on the wiring carrier at intervals. The outer surface of the first detection unit is soldered to the surface of the wiring carrier along its length, and at the same time electrically connects the first conductive holes. The second conductive medium includes a plurality of second conductive holes. These second via holes are arranged on the wiring carrier at intervals. A part of the outer surface of the second detection unit along the length direction is soldered to this surface of the wiring carrier board, and at the same time electrically connects the second guide hole.

According to one or more embodiments of the present invention, in the above detection device, at least one of the first spring and the second spring includes a flexible strip body, a tin plating layer, and a palladium plating layer. The flexible strip-shaped body is divided into a first half and a second half along its length. The tin plating layer covers the entire surface of the flexible strip body and is soldered to this surface of the wiring carrier board. The palladium plating layer covers the entire surface of the tin plating layer corresponding to the second half.

According to one or more embodiments of the present invention, in the above detection device, the first spring and the second spring are arranged linearly or curvedly.

According to one or more embodiments of the present invention, in the above detection device, there are a plurality of first springs and second springs respectively, these first springs are arranged in parallel with each other, and these second springs are arranged in parallel with each other.

According to one or more embodiments of the present invention, in the above detection device, there are a plurality of first springs and second springs, respectively, and these first springs and second springs are alternately arranged with each other.

According to one or more embodiments of the present invention, in the above detection device, the first spring and the second spring are arranged according to the arrangement of concentric circles.

According to one or more embodiments of the present invention, in the above detection device, the detection device further includes a space conversion substrate, a probe base and a plurality of probes. The space conversion substrate is located between the circuit board and the wiring carrier, and is electrically connected to the circuit board and the wiring carrier. The first detection unit and the second detection unit are respectively electrically connected to the circuit board through the space conversion substrate. The probe base body is disposed on a side of the space conversion substrate facing away from the circuit board, and surrounds the wiring carrier board. The probes are located on the probe base at intervals, and are electrically connected to the circuit board through the space conversion substrate for contacting a plurality of third contacts of the semiconductor device.

According to one or more embodiments of the present invention, in the above detection device, the circuit board solders the space conversion substrate through a first solder, the space conversion substrate solders the wiring carrier through a second solder, and the wiring carrier passes through a third solder Weld the first spring. The melting point of the second solder is between the first solder and the third solder, and the third solder is larger than the first solder.

In this way, with the structure described in the above embodiment, the user can simultaneously contact multiple conductive contacts or ground contacts through the long side of each spring without spending a lot of probes to contact each conductive contact , Not only effectively reduce equipment costs and maintenance costs, but also simplify the overall structure.

The above is only for explaining the problem to be solved by the present invention, the technical means for solving the problem, and the resulting effect, etc. The specific details of the present invention will be described in detail in the following embodiments and related drawings.

10‧‧‧Detection device

100‧‧‧ circuit board

101‧‧‧First solder

200‧‧‧Space conversion substrate

201‧‧‧Second solder

300‧‧‧Probe seat

310‧‧‧Probe

400‧‧‧Wiring carrier board

401‧‧‧Top

402‧‧‧Bottom

410‧‧‧The first medium of transmission

411‧‧‧ First guide pad

412‧‧‧First guide hole

420‧‧‧Second transmission medium

421‧‧‧Second guide pad

422‧‧‧Second guide hole

500‧‧‧First detection unit

501‧‧‧First spring

510‧‧‧Part 1

520‧‧‧Part Two

530‧‧‧Flexible strip body

531‧‧‧First half

532‧‧‧Second half

540‧‧‧tin plating

550‧‧‧Palladium coating

600‧‧‧Second detection unit

601‧‧‧second spring

610‧‧‧Part Three

620‧‧‧Part IV

700, 700A, 700B

701‧‧‧ Length of side

710‧‧‧Top

711‧‧‧Power connection area

712‧‧‧Signal area

720‧‧‧Power contact

730‧‧‧Ground contact

740‧‧‧Signal contact

751‧‧‧ First column structure

752‧‧‧Second column structure

761‧‧‧The first ring structure

762‧‧‧Second ring structure

770‧‧‧ stage

800‧‧‧Welding fixture

810‧‧‧Frame

820‧‧‧long space

830‧‧‧fixed feet

900‧‧‧Wiring carrier board

910‧‧‧Guide pad

920‧‧‧Locating hole

930‧‧‧ Ribbon solder

940‧‧‧Spring body

L1, L2‧‧‧ length direction

M‧‧‧Movement direction

S1‧‧‧Test signal

S2‧‧‧Ground signal

In order to make the above and other objects, features, advantages and embodiments of the present invention more obvious and understandable, the drawings are described as follows: FIG. 1 is a schematic diagram of a detection device of an embodiment of the present invention; FIG. 2 is a Figure 1 is the bottom view of the wiring carrier; Figure 3 is the top view of the semiconductor device of Figure 1; Figure 4 is a longitudinal side view of one of the first springs according to Figure 2; Figure 5 is based on the second A longitudinal side view of one of the second springs in the figure; Figures 6A to 6C are schematic diagrams of the continuous operation of the first detection unit according to an embodiment of the present invention; Figure 7A is a partial schematic diagram of the power connection area of another semiconductor device FIG. 7B is a partial schematic view of another semiconductor device power connection area; FIG. 8 is a schematic view of a welding jig according to an embodiment of the invention; and FIGS. 9A to 9E are welding jigs using FIG. 8 Continuous schematic.

In the following, a plurality of embodiments of the present invention will be disclosed in the form of diagrams. For the sake of clarity, many practical details will be described together in the following description. However, it should be understood that these practical details should not be used to limit the present invention. That is to say, in the embodiments of the present invention, these practical details are unnecessary. In addition, in order to simplify the drawings, some conventional structures and elements will be shown in a simple schematic manner in the drawings.

FIG. 1 is a schematic diagram of a detection device 10 according to an embodiment of the invention. FIG. 2 is a bottom view of the wiring carrier 400 of FIG. 1. As shown in FIGS. 1 and 2, the detection device 10 is used to detect a semiconductor element 700. The detection device 10 includes a circuit board 100, a wiring carrier 400, a plurality of first detection units 500 and second detection units 600. The wiring carrier 400 includes opposing top surfaces 401 and bottom surfaces 402. The circuit board 100 is located on the top surface 401 of the wiring carrier 400 and is electrically connected to the wiring carrier 400. Each first detection unit 500 includes a first spring 501. The first spring 501 is lying down and fixed to the bottom surface 402 of the wiring carrier 400, and is electrically connected to the circuit board 100 through the wiring carrier 400. For example, the outer surface of each first spring 501 has a first portion 510 (such as the long side) and a second portion 520 (such as the other long side) opposite to each other along its length L1. Each first spring 501 is soldered to the bottom surface 402 of the wiring carrier 400 through the entirety of the first portion 510. Each second detection unit 600 includes a second spring 601. The second spring 601 lies flat and fixed to the bottom surface 402 of the wiring carrier 400, and is electrically connected to the circuit board 100 through the wiring carrier 400. For example, the outer surface of each second spring 601 has a third portion 610 (such as a long side) and a fourth portion 620 (such as another long side) that are oppositely arranged along the length direction L1 thereof. Each second spring 601 is soldered to the bottom surface 402 of the wiring carrier 400 through the entirety of the third portion 610.

FIG. 3 is a top view of the semiconductor device 700 of FIG. As shown in FIG. 3, the top surface 710 of the semiconductor device 700 includes a power connection area 711 and a signal area 712. The signal area 712 surrounds the power connection area 711. A plurality of power contacts 720 and a ground contact 730 are arranged in the power connection area 711. The power contacts 720 are arranged in the power contact area 711 according to the array, the ground contacts 730 are arranged in the power contact area 711 according to the array, and the power contacts 720 of each row and the ground contacts 730 of each row are interleaved with each other Ground is mixed in the power supply area 711. The signal area 712 is provided with a plurality of signal contacts 740. The signal contacts 740 are arranged in the signal area 712 at intervals, and surround the power contacts 720 and the ground contact 730.

Therefore, when the detection device 10 contacts and detects the semiconductor element 700 on a stage 770 according to a moving direction M, the second portion 520 of the first spring 501 simultaneously contacts a plurality of semiconductor elements 700 (for example, at least two) Power contact 720. The fourth portion 620 of the second spring 601 simultaneously contacts a plurality (eg at least two) of the ground contacts 730 of the semiconductor device 700. In addition, the moving direction M is orthogonal to the longitudinal direction L1 of the second spring 601 and the first spring 501.

In this way, with the structure described in the above embodiment, the user can simultaneously contact multiple conductive contacts through the second portion 520 of each first spring 501, and the fourth portion 620 of each second spring 601 simultaneously Touching multiple ground contacts 730 does not require a large number of probes 310 to contact each conductive contact, which not only effectively reduces equipment costs and maintenance costs, but also simplifies the overall structure.

Figure 4 is a longitudinal side view of one of the first springs 501 according to Figure 2. More specifically, as shown in FIG. 4, the wiring carrier 400 includes a first conductive medium 410. The first conductive medium 410 is electrically connected to the circuit board 100. Specifically, the first conductive medium 410 includes a plurality of first conductive pads 411 and a plurality of first conductive holes 412. The first guide holes 412 are arranged on the wiring carrier 400 at intervals, and respectively penetrate the top surface 401 and the bottom surface 402 of the wiring carrier 400. Each first conductive pad 411 is formed on the bottom surface 402 of the wiring carrier 400 and connects to a plurality of first conductive holes 412 in the wiring carrier 400 at the same time. The first portion 510 of each first spring 501 is welded to the first lead pad 411. In this way, when the second portion 520 of each first spring 501 simultaneously contacts a plurality (for example, at least two) of power contacts 720 of the semiconductor element 700, the circuit board 100 sends a test signal S1 to the wiring carrier 400, so that The test signal simultaneously passes through the first contact hole 412 to the first spring 501 and is transmitted from the first spring 501 to the corresponding power contact 720 of the semiconductor element 700.

Figure 5 is a longitudinal side view of one of the second springs 601 according to Figure 2. As shown in FIG. 5, the wiring carrier 400 further includes a second conductive medium 420. The second conductive medium 420 is electrically connected to the circuit board 100. Specifically, the second conductive medium 420 includes a plurality of second conductive pads 421 and a plurality of second conductive holes 422. The second guide holes 422 are arranged on the wiring carrier 400 at intervals, and respectively penetrate the top surface 401 and the bottom surface 402 of the wiring carrier 400. Each second guide pad 421 is formed on the bottom surface 402 of the wiring carrier 400 and simultaneously connects to a plurality of second guide holes 422 in the wiring carrier 400. The third portion 610 of each second spring 601 is welded to the second lead pad 421. In this way, when the fourth portion 620 of each second spring 601 simultaneously contacts a plurality of (eg, at least two) ground contacts 730 of the semiconductor element 700, these ground contacts 730 pass through the The above-mentioned plurality of second via holes 422 transmit the ground signal S2 to the circuit board 100. In this way, since the first spring 501 and the second spring 601 respectively contact a plurality of contacts at the same time, the chance of sharing loop resources can be improved.

Referring back to FIG. 1, the detection device 10 further includes a space conversion substrate 200, a probe base 300 and a plurality of probes 310. The space conversion substrate 200 is located between the circuit board 100 and the wiring carrier 400, and is electrically connected to the circuit board 100 and the wiring carrier 400. The first spring 501 and the second spring 601 are electrically connected to the circuit board 100 through the space conversion substrate 200 respectively. The probe base 300 is disposed on a side of the space conversion substrate 200 that faces away from the circuit board 100 and surrounds the wiring carrier 400. The probes 310 are located on the probe base 300 at intervals, and are electrically connected to the circuit board 100 through the space conversion substrate 200.

Therefore, when the detecting device 10 contacts and detects the semiconductor element 700, a plurality of (eg, at least two) power contacts 720 and the second spring of the semiconductor element 700 are simultaneously contacted through the second portion 520 of the first spring 501 The fourth part 620 of 601 simultaneously contacts a plurality of (eg at least two) ground contacts 730 of the semiconductor device 700, and the probes 310 respectively contact the signal contacts 740 one by one.

It should be understood that the circuit board 100 solders the space conversion substrate 200 through a first solder 101, and the space conversion substrate 200 solders the wiring carrier 400 through a second solder 201, and the wiring carrier 400 through a third solder (not shown) The first spring 501 and the second spring 601 are welded. The melting point of the second solder 201 is between the first solder 101 and the third solder, and the third solder is larger than the first solder 101. In this way, by controlling the appropriate soldering temperature, the first solder 101 to the third solder do not melt unexpectedly, and the circuit board 100, the space conversion substrate 200, and the wiring carrier 400 are smoothly separated, respectively.

As shown in FIG. 2, these first spring 501 and second spring 601 are located on the bottom surface 402 of the wiring carrier 400, respectively. Each first spring 501 is linearly arranged on the bottom surface 402 of the wiring carrier 400, and the first springs 501 are parallel to each other. In other words, each first spring 501 has a length direction L1, and the length direction of the first spring 501 L1 is parallel to each other, and the length direction L1 of each first spring 501 is parallel to the side of the bottom surface 402 of the wiring carrier 400. Each second spring 601 is linearly arranged on the bottom surface 402 of the wiring carrier 400, and the second springs 601 are parallel to each other. In other words, each second spring 601 has a length direction L1, and the length direction of the second spring 601 L1 is parallel to each other, and the length direction L1 of each second spring 601 is parallel to the length direction 701 of the side of the bottom surface 402 of the wiring carrier 400. In addition, these first springs 501 and second springs 601 are alternately arranged with each other. However, the present invention is not limited to this. In other embodiments, the first spring 501 and the second spring 601 can also be flexibly arranged on the bottom surface 402 of the wiring carrier 400.

In the above embodiments, the first spring 501 and the second spring 601 are linear or shaft-shaped, respectively, and are made of coils. For example, the first spring 501 and the second spring 601 are respectively an extension spring, and the extension spring has a hollow pipe and a circumferential surface. The circumferential surface completely surrounds the hollow pipe. Therefore, when a part of the circumferential surface of the tension spring is pressed to any contact point, since the tension spring has elasticity, the tension spring can provide functions of space and stress buffering. However, the present invention is not limited to this. In other embodiments, the first spring 501 and the second spring 601 may also be conductive coils with poor elasticity.

6A to 6C are schematic diagrams of the continuous operation of the first spring 501 according to an embodiment of the invention. The first spring 501 can be plated with a functional coating to increase the product life of the spring. For example, the process of plating the first spring 501 with a plating layer includes the following steps. Firstly, a flexible strip body 530 of a tension spring is provided. The flexible strip body 530 is divided into a first half 531 and a second half 532 along its length L1; then, the flexible The entire surface of the strip body 530 is plated with tin metal (Sn), so that a tin plating layer 540 covers the entire surface of the flexible strip body 530; then, the flexible strip body covered with the tin plating layer 540 The second half 532 of 530 is plated with palladium metal (Pb), so that a palladium plating 550 covers the entire surface of the tin plating 540 corresponding to the second half 532.

As such, the first spring 501 includes a flexible strip body 530, a tin plating layer 540 and a palladium plating layer 550. The tin plating layer 540 covers the entire surface of the flexible strip body 530 and is soldered to this surface of the wiring carrier 400. The tin plating layer 540 helps the first portion 510 of each first spring 501 to be soldered to the first pad 411. The palladium plating layer 550 is coated on the entire surface of the tin plating layer 540 corresponding to the second half 532. Because the hardness of palladium metal is very high, it is less prone to wear, and its oxidation resistance is very good. When the second part 520 of the first spring 501 contacts the multiple power contacts 720 of the semiconductor element 700, the first spring 501 The second part 520 does not cause rapid damage. However, the present invention is not limited to the above plating materials.

In addition, the second spring 601 can also be plated with a functional coating to increase the product life of the spring. The functional plating of the second spring 601 is the same as the first spring 501 described above, and will not be repeated here.

FIG. 7A is a partial schematic view of the power connection area 711 of another semiconductor device 700A. As shown in FIG. 7A, the power contacts 720 and the ground contacts 730 are alternately arranged in a staggered manner. The power contacts 720 are arranged in a plurality of first-row structures 751, and each first-row structure 751 includes a single-row interval arrangement. For the plurality of power contacts 720, the first row structures 751 are parallel to each other and are arranged obliquely in the power connection area 711. In other words, each first column structure 751 has a length direction L2 that is not parallel to the length direction 701 of one side of the semiconductor device 700A. The ground contacts 730 are arranged in a plurality of second column structures 752. Each second column structure 752 includes a plurality of ground contacts 730 arranged in a single row at intervals. The second column structures 752 are parallel to each other and are parallel to the first columns Structure 751, and arranged obliquely in the power supply connection area 711. In other words, each second column structure 752 has a length direction L2 that is not parallel to the length direction 701 of one side of the semiconductor device 700.

In this way, the arrangement of the power contacts 720 of the first row structures 751 and the ground contacts 730 of the second row structures 752 shown in FIG. 7A can reflect the first embodiment of the detection device 10 in another embodiment. The arrangement of a spring 501 and a second spring 601. However, in this embodiment, except that the arrangement of the first spring 501 and the second spring 601 is different from the detection device 10 of FIG. 2, the rest of the structure is substantially the same.

FIG. 7B is a partial schematic view of the power connection area 711 of another semiconductor device 700B. As shown in FIG. 7B, these power contacts 720 are arranged in a plurality of first ring structures 761. The ground contacts 730 are arranged in a plurality of second ring structures 762. The first ring structure 761 and the second ring structure 762 are alternately arranged with each other. Each first ring structure 761 includes a plurality of power contacts 720 arranged in a single row, and each second ring structure 762 includes a plurality of ground contacts 730 arranged in a single row.

In this way, the arrangement of the power contact 720 of the first ring structure 761 and the ground contact 730 of the second ring structure 762 shown in FIG. 7B can reflect the arrangement of the detection device 10 in another embodiment The arrangement of the first spring 501 and the second spring 601. That is, the first spring 501 and the second spring 601 are arranged according to the arrangement of concentric circles. More specifically, the first spring 501 is curled into a ring shape by a linear spring, and one side of the ring shape simultaneously contacts the power contact 720 of the first ring structure 761. The second spring 601 is curled into a ring shape by a linear spring, and one side of the ring shape simultaneously contacts the power contact 720 of the second ring structure 762. However, in this embodiment, except that the arrangement of the first spring 501 and the second spring 601 is different from the detection device 10 of FIG. 2, the rest of the structure is substantially the same.

FIG. 8 is a schematic diagram of a welding jig 800 according to an embodiment of the invention. As shown in FIG. 8, in order to enable the detection unit to be positioned effectively, a welding jig 800 is provided in an embodiment of the present invention. The welding jig 800 includes a frame 810 and a plurality of fixing legs 830. The frame 810 has an elongated space 820. The elongated space 820 penetrates two opposite surfaces of the frame 810 to accommodate a spring.

FIGS. 9A to 9E are continuous schematic diagrams using the welding jig 800 of FIG. 8. For example, the process of soldering the inspection unit to the wiring carrier 900 includes the following steps. As shown in FIG. 9A, a wiring carrier 900 is first provided, and the wiring carrier 900 has a lead pad 910 and a plurality of positioning holes 920; then, as shown in FIG. 9B, a ribbon solder 930 is applied to the lead Then, as shown in FIG. 9C, the solder jig 800 is mounted on the wiring carrier 900, wherein the fixing feet 830 of the solder jig 800 are inserted into the positioning holes 920, respectively, so that the frame 810 of the solder jig 800 The elongated space 820 is aligned to expose the strip solder 930 on the lead pad 910; then, as shown in FIG. 9D, a spring body 940 is matched to fill the elongated space 820, and the spring body 940 is inside the frame 810 Contact the strip solder 930; then, send the wiring carrier 900 with the solder jig 800 and the spring body 940 into the tin furnace, so that the spring body 940 is soldered to the lead pad 910 through the strip solder 930, and then, as in the 9E As shown in the figure, the welding jig 800 is removed.

Finally, the above disclosed embodiments are not intended to limit the present invention. Anyone who is familiar with this skill can be protected and protected from various changes and modifications within the spirit and scope of the present invention. Invented. Therefore, the protection scope of the present invention shall be subject to the scope defined in the appended patent application.

10‧‧‧Detection device

100‧‧‧ circuit board

101‧‧‧First solder

200‧‧‧Space conversion substrate

201‧‧‧Second solder

300‧‧‧Probe seat

310‧‧‧Probe

400‧‧‧Wiring carrier board

401‧‧‧Top

402‧‧‧Bottom

500‧‧‧First detection unit

501‧‧‧First spring

510‧‧‧Part 1

520‧‧‧Part Two

700‧‧‧Semiconductor components

711‧‧‧Power connection area

712‧‧‧Signal area

720‧‧‧Power contact

740‧‧‧Signal contact

770‧‧‧ stage

L1‧‧‧Long

M‧‧‧Movement direction

Claims (10)

A detection device includes: a circuit board; a wiring carrier board having a first conductive medium electrically connected to the circuit board; and at least a first detection unit including a first spring, the first A part of the outer surface of a spring is fixed to a surface of the wiring carrier along its length, and is electrically connected to the first conductive medium, wherein, when the detection device detects a semiconductor element, the first spring Another part of the outer surface along its length direction simultaneously contacts at least two first contacts of the semiconductor device. The detection device according to claim 1, further comprising: at least a second detection unit, including a second spring, the outer surface of the second spring is fixed to a part of the wiring carrier along its length On the surface, the wiring carrier further has a second conductive medium, and the second conductive medium is electrically connected to the circuit board, and the second spring is electrically connected to the second conductive medium, wherein, when the detection device is connected to the semiconductor element During detection, another part of the outer surface of the second spring along its longitudinal direction simultaneously contacts at least two second contacts of the semiconductor device. The detection device according to claim 2, wherein the first conductive medium includes a plurality of first conductive holes, the first conductive holes are arranged at intervals on the wiring carrier, wherein the outer portion of the first spring The portion of the surface along the length of the surface is soldered to the surface of the wiring carrier, and at the same time electrically connects the first guide holes; and the second conductive medium includes a plurality of second guide holes, the The second guide holes are arranged at intervals on the wiring carrier board, wherein the outer surface of the second spring is welded to the surface of the wiring carrier board along the length of the longitudinal direction, and at the same time electrically connect the The second guide hole. The detection device according to claim 2, wherein at least one of the first spring and the second spring comprises: a flexible strip body, the flexible strip body is divided into a first along its length A half and a second half; a tin plating layer covering the entire surface of the flexible strip body and soldering to the surface of the wiring carrier; and a palladium plating layer covering the pair of tin plating layers It should be on the entire surface of the second half. The detection device according to claim 2, wherein the first spring and the second spring are arranged linearly or curvedly. The detection device according to claim 2, wherein the at least one first spring and the at least one second spring are plural respectively, the first springs are arranged parallel to each other, and the second springs are arranged parallel to each other. The detection device according to claim 2, wherein the at least one first spring and the at least one second spring are plural respectively, and the first springs and the second springs are alternately arranged with each other. The detection device according to claim 2, wherein the at least one first spring and the at least one second spring are arranged according to the arrangement of concentric circles. The detection device according to claim 2, further comprising: a space conversion substrate, located between the circuit board and the wiring carrier, and electrically connecting the circuit board and the wiring carrier, wherein the first detection unit and The second detection unit is electrically connected to the circuit board through the space conversion substrate; a probe base body is disposed on a side of the space conversion substrate opposite to the circuit board and surrounds the wiring carrier board; and a plurality of probes , Located on the probe base body at intervals, and electrically connected to the circuit board through the space conversion substrate for contacting a plurality of third contacts of the semiconductor device. The inspection device according to claim 9, wherein the circuit board is soldered to the space conversion substrate through a first solder, the space conversion substrate is soldered to the wiring carrier through a second solder, and the wiring carrier is through a third The solder is soldered to the first spring, wherein the melting point of the second solder is between the first solder and the third solder, and the third solder is larger than the first solder.

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