TWI668069B - Apparatus for mounting solder ball or solder paste - Google Patents

Abstract

The present invention relates to a solder ball or solder paste mounting device, and more particularly, to a solder ball or solder paste mounting device for mounting a solder ball or solder paste to a pad portion of a material. The solder ball or solder paste mounting device of the present invention has the effect that the solder ball or solder paste can be easily mounted or printed on the electrode pads evenly through the mask.

Description

Device for mounting solder balls or solder paste

The present invention relates to a solder ball or solder paste mounting device, and more particularly, to a solder ball or solder paste mounting device for mounting a solder ball or solder paste to a pad portion of a material.

Materials such as printed circuit boards (PCBs) are often used as substrates for electronic products. A large number of electronic components are attached to the PCB and are electrically connected to each other to cause the electronic product to operate.

Electronic components are attached to the electrode pads of the PCB. A method widely used as a method of attaching the electronic component to an electrode pad of a PCB is soldering. The electronic components are attached to the electrode pads of the PCB by soldering, thereby achieving an electrical connection between the electronic components and the PCB.

Various methods are used for soldering, but typically a method using a solder ball or solder paste is generally used. The method using a solder ball or a solder paste refers to a method of mounting the solder ball on an electrode pad of a PCB using a solvent such as a flux, or printing the solder paste by a method such as screen printing. Optionally, also used after printing solder paste on electrode pads Method for carrying solder balls. When soldering in this manner, a mask is usually used in order to print a solder paste on an electrode pad of a PCB and mount a solder ball.

However, in the case of using a curtain, there are several problems. In the case of printing a solder paste, the solder paste is inserted into a mask hole and the solder paste is printed on an electrode pad of a PCB. In this process, if the solder paste cannot be smoothly detached from the mask hole, a problem arises that the solder paste cannot be printed on the electrode pads of the PCB. In addition, when the solder balls are sprayed onto the mask, and the sprayed solder balls are mounted on the electrode pads of the PCB through the mask holes, the solder balls sprayed frequently on the mask cannot be inserted into all the mask holes. The problem.

Therefore, there is an increased demand for appliances that can effectively pass solder balls or solder paste through the mask holes.

The present invention has been made in order to solve the above-mentioned needs, and an object thereof is to provide a solder ball or solder paste mounting device that allows a solder ball or solder paste to be easily attached to an electrode pad through a cover.

The solder ball or solder paste mounting device of the present invention for achieving the above object is a method of mounting a solder ball or a printed solder paste on the plurality of pad portions having a material of the plurality of pad portions, and includes a material supporting unit Has a material fixing portion configured to fix the material; a cover member arranged to an upper portion of the material support unit has A plurality of mask holes for the solder balls or solder paste to pass through; gap members formed to at least one of the material supporting unit and the mask member to maintain a gap between the material supporting unit and the mask member And make the space between the material supporting unit and the cover member air-tight; and a solder suction flow path formed to the material supporting unit so as to surround the space surrounded by the cover member, the material supporting unit, and the gap member. The vacuum is formed and the solder balls or solder paste are sucked in through the plurality of mask holes of the mask member to guide the plurality of pad portions of the material.

The solder ball or solder paste mounting device of the present invention has the effect that the solder ball or solder paste can be easily mounted or printed on the electrode pads evenly through the mask.

10‧‧‧Materials

11‧‧‧ Pad Department

100‧‧‧ Canopy parts

110‧‧‧Cover

200‧‧‧Material support unit

210‧‧‧ Material fixing part

211‧‧‧Material Installation Department

212‧‧‧Material adsorption hole

213‧‧‧Material adsorption flow path

220‧‧‧ Clearance part fixing part

300‧‧‧ Clearance parts

310‧‧‧First clearance part

320‧‧‧Second clearance part

400‧‧‧solder suction flow path

500‧‧‧The first vacuum pump

600‧‧‧Second Vacuum Pump

B‧‧‧Solder Ball

III-III‧‧‧line

FIG. 1 is a perspective view of a solder ball or solder paste mounting apparatus according to an embodiment of the present invention.

FIG. 2 is an exploded perspective view of the solder ball or solder paste mounting apparatus shown in FIG. 1.

3 is a cross-sectional view of the solder ball or solder paste mounting apparatus shown in FIG. 1, taken along line III-III.

4 is a cross-sectional view of a solder ball or solder paste mounting apparatus according to another embodiment of the present invention.

Hereinafter, a solder ball or solder paste mounting apparatus according to an embodiment of the present invention will be described with reference to the drawings.

1 is a perspective view of a solder ball or solder paste mounting device according to an embodiment of the present invention, FIG. 2 is an exploded perspective view of the solder ball or solder paste mounting device shown in FIG. 1, and FIG. 3 is a solder ball or solder paste mounting device shown in FIG. A cross-sectional view of the solder paste mounting device taken along the line III-III.

The solder ball or solder paste mounting apparatus of this embodiment relates to a solder ball or solder paste mounting apparatus for mounting the solder ball B on the material 10 through the cover member 100 or printing the solder paste on the material 10. A variety of materials having pads for electrical connection can be used as the material 10 of the present invention. Examples of such a material include a printed circuit board (PCB) or a flexible printed circuit board (FPCB).

1 to 3, the solder ball or solder paste mounting apparatus of this embodiment includes a cover member 100, a material support unit 200, a gap member 300, and a solder suction flow path 400.

The mask member 100 is configured to guide the solder ball B or the solder paste so that the solder ball B or the solder paste is adhered to the plurality of pad portions 11 of the material 10. To this end, the mask member 100 has a plurality of mask holes 110. The mask hole 110 is a hole formed for the solder ball B or solder paste to pass through. The mask holes 110 are arranged at positions corresponding to the pad portions 11 of the material 10. The thickness of the mask member 100 is determined according to the size of the solder ball B. In this embodiment, the thickness of the mask member 100 is preferably larger than the radius of the solder ball B and smaller than the solder ball. The diameter of B.

The material support unit 200 is a structure for fixing a material 10 having a plurality of pad portions 11. The material supporting unit 200 includes a material fixing portion 210 in which the fixing material 10 is arranged, and a gap member fixing portion 220. The material fixing portion 210 includes a material mounting portion 211, a material adsorption hole 212, and a material adsorption flow path 213.

The material mounting portion 211 of the material fixing portion 210 is formed in a shape corresponding to the material 10 so that the material 10 can be embedded and mounted on the material fixing portion 210. Referring to FIG. 2, the material mounting portion 211 is a portion where a part of the material fixing portion 210 is recessed in the same shape as the material 10. A plurality of material suction holes 212 of the material fixing portion 210 are formed to the material mounting portion 211. The plurality of material adsorption holes 212 are a plurality of holes formed in the material mounting portion 211 so that the lower surface of the material 10 can be vacuum-adsorbed. The material adsorption flow path 213 is formed to the material support unit 200. The material adsorption flow path 213 is connected to the plurality of material adsorption holes 212. Referring to FIG. 3, a material adsorption flow path 213 is formed in the material support unit 200 at the lower ends of the plurality of material adsorption holes 212. The end of the material adsorption flow path 213 is connected to the second vacuum pump 600. When the second vacuum pump 600 operates, a vacuum is formed in the material adsorption hole 212 through the material adsorption flow path 213.

The gap member 300 maintains a space between the cover member 100 and the material supporting unit 200 and makes the space between the cover member and the material supporting unit 200 air-tight. In this embodiment, as shown in FIG. 3, the gap member 300 is protruded and formed on the lower surface of the outer peripheral portion of the cover member 100. The gap member 300 is formed of the same raw material as the cover member 100 and is formed integrally with the cover member 100. Referring to FIG. 3, a part of the lower surface of the gap member 300 is formed in a protruding manner. Protruded part of the lower surface of the gap member 300 Engages with the clearance member fixing portion 220 formed in the material supporting unit 200. If the lower surface of the gap member 300 is engaged with the gap member fixing portion 220 of the material supporting unit 200, the gap between the mask member 100 and the material supporting unit 200 is maintained as described above, and the mask member 100 and the material supporting unit 200 are maintained. The space between them remains airtight.

The solder suction flow path 400 forms a vacuum in a space surrounded by the cover member 100, the material support unit 200, and the gap member 300. Referring to FIG. 3, the solder suction flow path 400 is a passage formed in the material support unit 200 in such a manner that it starts from a portion remote from the material fixing portion 210 of the material support unit 200 and ends on the side of the material support unit 200. The first vacuum pump 500 is connected to one end of the solder suction flow path 400 formed on the side of the material supporting unit 200. In this embodiment, each of the two sides of the material supporting unit 200 has an end of a solder suction flow path 400 connected to the first vacuum pump 500. The solder suction flow path 400 is made vacuum by the first vacuum pump 500, and the space surrounded by the cover member 100, the material support unit 200, and the gap member 300 is also made vacuum by the solder suction flow path 400 which is in a vacuum state.

The operation of the solder ball or solder paste mounting device of the present embodiment configured as described above will be described below.

First, an operation of fixing the material 10 to the material supporting unit 200 will be described. The material 10 is transferred to the material fixing portion 210 of the material support unit 200 by a transfer device provided separately. The transferred material 10 is fitted into the material mounting portion 211 of the material fixing portion 210. As described above, the material mounting portion 211 is a groove formed in the material fixing portion 210 in a shape corresponding to the material 10, so that the material 10 can be inserted into the material. 料 Installation section 211. On the other hand, the second vacuum pump 600 is connected to the material adsorption flow path 213, and the plurality of material adsorption holes 212 are connected to the material adsorption flow path 213. When the second vacuum pump 600 operates, a vacuum is formed in the material adsorption flow path 213 and the plurality of material adsorption holes 212. Referring to FIG. 3, the material 10 is embedded in the material mounting portion 211 to cover the upper surface of the material adsorption hole 212. In this state, if a vacuum is formed in the material adsorption flow path 213 and the plurality of material adsorption holes 212, a pressure difference between the upper portion of the material 10 and the lower portion of the material 10 is generated. Due to the pressure difference, the material 10 receives air pressure in a direction toward the plurality of material adsorption holes 212 that abut the lower surface of the material 10. That is, the material 10 embedded in the material mounting portion 211 is adsorbed to the material mounting portion 211 through the plurality of material adsorption holes 212. In particular, when a soft material such as FPCB (Flexible Printed Circuit Board) is used as the material, the flatness of the material is important. The reason is that if the material 10 is placed on the material supporting unit 200 in a bent state, it is difficult to uniformly mount the solder ball B or the solder paste to the plurality of pad portions 11 of the material 10 afterwards. The plurality of material adsorption holes 212 are evenly distributed on the lower surface of the material 10, and the plurality of material adsorption holes 212 are connected to the material adsorption flow path 213 to form a uniform air pressure. Therefore, the material supporting unit 200 of the solder ball or solder paste mounting apparatus of this embodiment can fix the material 10 in a state of being excellent in flatness.

After the material 10 is fixed in this manner, the material 10 and the mask member 100 are aligned. Aligning the material 10 and the mask member 100 is to place the plurality of mask holes 110 of the mask member 100 at positions corresponding to the plurality of pad portions 11 of the material 10. Various publicly known methods can be used in this sorting. For example, the mask member 100 and the material 10 can be aligned in the following manner: The mask member 100 and the material 10 are photographed by a camera. For the material 10, the control unit returns the image captured by the camera, and the control unit sends a signal to another transfer device and the material support unit 200 is transferred by the transfer device.

After the cover member 100 and the material 10 are aligned, the material 10 is brought close to the cover member 100. If the material supporting unit 200 rises, the material 10 approaches the mask member 100. If the material supporting unit 200 continues to rise, the gap member 300 formed on the lower surface of the outer peripheral portion of the cover member 100 and the gap member fixing portion 220 of the material supporting unit 200 are engaged with each other. As described above, if the gap member 300 is engaged with the gap member fixing portion 220 of the material supporting unit 200, a space is formed between the cover member 100 and the material supporting unit 200 as shown in FIG. 3. The space is hermetically sealed by the gap member 300.

The solder ball or solder paste mounting device of this embodiment is brought into the state shown in FIGS. 1 and 3 by the above-mentioned operation. In this state, the first vacuum pump 500 operates to generate a vacuum in the solder suction flow path 400. When a vacuum is formed in the solder suction flow path 400, the space surrounded by the cover member 100, the material support unit 200, and the gap member 300 connected to the solder suction flow path 400 also becomes a vacuum state. Due to this vacuum state, air pressure is formed in the mask hole 110 of the mask member 100 toward the material supporting unit 200.

In this state, the solder ball B application device or the solder paste application device located on the upper portion of the mask member 100 applies the solder ball B or the solder paste on the upper portion of the mask member 100.

First, a case where a solder paste is applied will be described. The solder paste can be applied by various methods. For example, the following screen printing method can be used: After applying a portion of the solder paste, the solder paste is pushed into the plurality of mask holes 110 of the mask member 100 by scraping the solder paste from the upper surface of the mask member 100 with a doctor blade. After the solder paste is respectively inserted into the plurality of mask holes 110 in this manner, the inserted solder paste is lowered by receiving air pressure toward the material supporting unit 200. The pad portion 11 of the material 10 is located below each of the mask holes 110. Therefore, the solder paste lowered by the air pressure can be printed on the pad portion 11 of the material 10. The present invention has the effect of improving the release property of the solder paste by lowering the solder paste by the air pressure like the above. Conventionally, a problem has frequently occurred in that the solder paste inserted into the mask hole 110 of the mask member 100 does not fall and remains in the mask hole 110 and remains. If the solder paste adheres to the mask hole 110 as described above, the solder paste does not contaminate the pad portion 11 of the material 10 and causes a defect. If the solder paste is not printed on the specific pad portion 11 of the material 10, the electrical connection of the corresponding material 10 is not formed, and the entire product using the material 10 is defective. The above-mentioned problem is caused by the gravity of the solder paste acting to lower the solder paste inserted into the mask hole 110. In the solder ball or solder paste mounting device of the present invention, the solder paste inserted into the cover hole 110 receives not only gravity but also air pressure acting in a direction toward the material supporting unit 200, thereby effectively preventing the solder paste from adhering to the cover. Case where the curtain hole 110 remains.

Next, a case where the solder ball B is applied will be described. The solder ball B can be applied to the upper surface of the mask member 100 by various methods. For example, the solder ball B ejected from the ejection port connected to the rotating drum may be moved on the upper surface of the cover member 100 to apply the solder ball B. The solder ball B coated on the upper surface of the mask member 100 in this manner meets the mask hole 110 and is inserted into the hole after the upper surface of the mask member 100 moves relatively freely. in. Referring to FIG. 3, the solder ball B is rolled into the mask hole 110 in the vicinity of the mask hole 110 after rolling on the mask member 100 in the vicinity of the mask hole 110. Conventionally, only the gravity acting on the solder ball B and the force ejected from the solder ball B from the solder ball B coating device have been used to guide the solder ball B to be inserted into the mask hole 110. If the solder ball B is mounted on the pad portion 11 of the material 10 in this way, the force of the solder ball B to escape through the mask hole 110 of the mask member 100 is insufficient, and the solder ball B cannot be mounted on all pads frequently. Question for Department 11. The solder ball or solder paste mounting device of the present invention generates air pressure in the mask hole 110. The air pressure generated in the mask hole 110 attracts the solder ball B located around the mask hole 110 and guides it to be inserted into the mask hole 110. Therefore, the solder ball or solder paste mounting device of the present invention can effectively mount the solder ball B to all the pad portions 11 by adding a force that allows the solder ball B to pass through the cover hole 110, thereby guiding the solder ball B more quickly. It is effectively inserted into the mask hole 110.

After the solder ball B or the solder paste is mounted on the plurality of pad portions 11 of the material 10 in this manner, the material support unit 200 may be transferred for the next process. The solder ball or solder paste mounting device of this embodiment can further adjust the air pressure generated in the cover hole 110 and the air pressure generated in the material adsorption hole 212 by the first vacuum pump 500 and the second vacuum pump 600. Therefore, in the process of separating the material supporting unit 200 from the cover member 100 and transferring it to the next process, the air pressure generated in the material adsorption hole 212 can be maintained and only the air pressure generated in the cover hole 110 can be removed.

Next, a solder ball or solder paste mounting apparatus according to another embodiment of the present invention will be described with reference to FIG. 4.

Mounted with a solder ball or solder paste according to an embodiment of the present invention described above Compared with the device, the solder ball or solder paste mounting device according to another embodiment of the present invention differs only in the configuration of the gap member 300. The gap member 300 includes a first gap member 310 and a second gap member 320. The first gap member 310 protrudes from a lower surface of an outer peripheral portion of the cover member 100. The second gap member 320 is formed so as to be engaged with the first gap member 310. Referring to FIG. 4, a protruding portion formed on a lower surface of the first gap member 310 is engaged with a depressed portion formed on an upper surface of the second gap member 320. The second gap member 320 is formed on the upper surface of the material supporting unit 200 at a position separated from the material fixing portion 210 of the material supporting unit 200. If the first gap member 310 and the second gap member 320 are engaged, the space between the mask member 100 and the material supporting unit 200 is maintained as described above, and the space between the mask member 100 and the material supporting unit 200 is maintained as Airtight state.

In the solder ball or solder paste mounting apparatus according to another embodiment of the present invention, the gap members 310 and 320 are respectively formed between the cover member 100 and the material support unit 200 to mesh with each other, thereby having the following effects: The space forming the vacuum is airtight, and the material 10 and the cover member 100 can be aligned more accurately.

The present invention has been described with reference to preferred examples, but the scope of the present invention is not limited to the form described and illustrated above.

For example, it has been described that a plurality of material adsorption holes 212 are formed in the material fixing portion 210 of the material supporting unit 200, but the material fixing portion may be formed of a porous ceramic material. In this case, micropores existing in the porous ceramic material function instead of a plurality of material adsorption holes.

It should be noted that the material fixing portion passed through the material supporting unit 200 has been described previously. The material mounting portion 211 and the material adsorption hole 212 of 210 fix the material 10 to the material fixing portion 210 of the material support unit 200, but the material may be fixed to the material fixing portion by magnetic force. In particular, this method can be effectively used when the material is a metal material.

Although the gap member 300 has been described as being integrally formed with the mask member 100 on the lower surface of the outer peripheral portion of the mask member 100, the gap member may be formed of a different material from the mask member and bonded to the lower surface of the mask member.

In addition, as described above, the gap member 300 is engaged with the gap member fixing portion 220, but the gap member may not be provided but the gap member may be closely contacted to the material supporting unit to maintain the gap between the cover member and the material supporting unit, and Make the space between the cover part and the material support unit airtight.

In addition, the gap member 300 may be formed on the upper surface of the outer peripheral portion of the material supporting unit, instead of being formed on the lower surface of the outer peripheral portion of the cover member 100. In this case, the gap member fixing portion is formed to the curtain member instead of the material supporting unit. The gap member formed on the material supporting unit is engaged with the gap member fixing portion formed on the cover member, so as to maintain the space between the cover member and the material supporting unit, and to make the space between the cover member and the material supporting unit airtight. .

In addition, it was explained that the air pressure generated in the mask hole 110 and the material suction hole 212 are adjusted by the first vacuum pump 500 and the second vacuum pump 600 separately. However, the solder ball or the solder paste of the present invention can also be adjusted by a vacuum pump. The mounted device generates air pressure. In addition, the pressure may be adjusted by combining a valve with the material adsorption flow path and the solder adsorption flow path.

In addition, as described above, the material of the material supporting unit 200 and the material supporting unit 200 are aligned to transfer the material of the material supporting unit 200 to the cover member 100. However, the material of the material supporting unit may be transferred to the material of the supporting member 200 and the material of the material supporting unit For the entire row, the mask member and the material support unit may be transferred together to arrange the mask member and the material support unit together.

In addition, it was explained that the thickness of the mask member 100 is larger than the radius of the solder ball B and smaller than the diameter of the solder ball B. However, the above case is only an example of the preferred embodiment, and the thickness of the mask member can be variously changed. For example, when the air pressure generated from the lower side of the mask member is strong, it is effective to make the thickness of the mask member larger than the diameter of the solder ball.

Claims (3)

A solder ball or solder paste mounting device for mounting a solder ball or a printed solder paste on the plurality of pad portions having a material of a plurality of pad portions includes a material support unit having a material fixing configured to fix the material Part, wherein the material fixing part of the material support unit includes: a material mounting part formed in a shape corresponding to the material so that the material is embedded and mounted to the material fixing part; a plurality of material adsorption holes are formed Into the material mounting portion so as to vacuum-adsorb the material fixing portion; and a material adsorption flow path formed in the material supporting unit so as to form a vacuum in the plurality of material adsorption holes; a cover member, a configuration The material supporting unit has a plurality of mask holes for the solder ball or the solder paste to pass through; a gap member is formed on at least one of the material supporting unit and the mask member, To maintain a space between the material supporting unit and the cover member, and to make the space between the material supporting unit and the cover member airtight, wherein the gap portion It includes: a first gap member formed on a lower surface of an outer peripheral portion of the cover member; and a second gap member formed on an upper surface of the material supporting unit so as to be engaged with the first gap member and Making the space between the material support unit and the cover member air-tight; and a solder suction flow path formed into the material support unit so that the cover member, the material support unit The space surrounded by the gap member forms a vacuum, and sucks the solder ball or the solder paste through the plurality of mask holes of the mask member to guide the plurality of pads of the material. The solder ball or solder paste mounting device according to item 1 of the patent application scope further includes a first vacuum pump connected to the solder suction flow path and supported by the cover member and the material. The space surrounded by the unit and the gap member forms a vacuum. The solder ball or solder paste mounting device according to item 2 of the scope of patent application, further comprising a second vacuum pump connected to the material adsorption flow path of the material fixing portion of the material support unit and A vacuum is formed in the plurality of material adsorption holes of the material fixing portion.