TWI666233B - Photosensitive resin composition, method for producing hardened relief pattern, and semiconductor device - Google Patents

Abstract

The present invention provides a photosensitive resin composition capable of obtaining a resin layer having high adhesion without causing voids at the interface between the Cu layer and the cured photosensitive resin layer after a high temperature storage test. A method for forming a hardened relief pattern using the photosensitive resin composition, and a semiconductor device having the hardened relief pattern. Since the photosensitive resin composition of the present invention has a cyclic compound having a carbonyl group prepared in the photosensitive resin composition having a specific structure, it is possible to form a hardened cavity at the interface where the Cu layer is in contact with the Cu layer after a high-temperature storage test. membrane.

Description

Photosensitive resin composition, method for producing hardened relief pattern, and semiconductor device

The present invention relates to a photosensitive resin composition for forming embossed patterns such as insulating materials for electronic parts, and passivation films, buffer coating films, and interlayer insulating films in semiconductor devices, and hardened embossed patterns using the same. Formation method and semiconductor device.

Previously, polyimide resins and polybenzoxazole resins, which had excellent heat resistance, electrical properties, and mechanical properties, were used as insulating materials for electronic parts, and passivation films, surface protective films, and interlayer insulating films for semiconductor devices. , Phenol resin, etc. Among the polyfluorene imine resins, a thermal polyimide treatment performed by coating, exposing, developing, and curing the composition in the form of a photosensitive polyimide precursor composition, A heat-resistant embossed pattern film can be easily formed. Such a photosensitive polyfluorene imide precursor composition has a feature that it can significantly reduce the number of steps compared with a conventional non-photosensitive polyfluorine imide material. In addition, a semiconductor device (hereinafter also referred to as a “device”) is mounted on a printed circuit board by various methods depending on the purpose. The previous components are generally manufactured by wire bonding using thin wires to connect from the external terminals (pads) of the component to the lead frame. However, with the rapid development of components and the operating frequency has reached GHz, the difference in the wiring length of each terminal during installation may even affect the operation of the component. Therefore, in the installation of high-end components, it is necessary to accurately control the length of the installation wiring. If wire bonding is used, it is difficult to meet this requirement. Therefore, flip-chip mounting is proposed, that is, a redistribution layer is formed on the surface of a semiconductor wafer and bumps (electrodes) are formed thereon, and then the wafer is flipped (flip-mounted) and directly mounted on a printed substrate (for example, See Patent Document 1). The flip-chip mounting is used for high-end signal processing components because it can precisely control the wiring distance, or because of the small mounting size, it is used in mobile phones, etc., and its demand is rapidly expanding. When materials such as polyimide, polybenzoxazole, and phenol resin are used in flip-chip mounting, after the pattern of the resin layer is formed, a metal wiring layer forming step is performed. The metal wiring layer is usually formed by plasma-etching the surface of the resin layer to roughen the surface, and then forming a metal layer as a seed layer for plating by sputtering to a thickness of 1 μm or less, and then using the metal layer as an electrode. It is formed by electrolytic plating. At this time, Ti is generally used as a metal to be a seed layer, and Cu is used as a metal of a redistribution layer formed by electrolytic plating. For such a metal redistribution layer, the adhesion between the metal layer and the resin layer required for redistribution is high after the reliability test. Examples of the reliability test performed here include: a high-temperature storage test stored in the air at a high temperature of 125 ° C or higher for 100 hours or more; the wiring is assembled, and the voltage is confirmed in the air at a temperature of about 125 ° C. High temperature operation test of the operation under the state of storage for more than 100 hours; a temperature cycle test in which the low temperature state of about -65 to -40 ° C and the high temperature state of about 125 to 150 ° C are repeated in cycles; at a temperature of 85 High temperature and high humidity storage test stored under water vapor environment above ℃ and humidity above 85%; Assemble the wiring and perform the same test under high temperature and high humidity bias voltage while applying voltage; pass the test in air or nitrogen multiple times at 260 ℃ Reflow soldering test in a reflow oven. However, in the case of the high-temperature storage test in the reliability test described above, there was a problem that voids were generated at the interface where the Cu layer and the resin layer contacted with each other after the test. When voids are generated at the interface between the Cu layer and the resin layer, the adhesion between the two is reduced. [Prior Art Document] [Patent Document] [Patent Document 1] Japanese Patent Laid-Open No. 2001-338947

[Problems to be Solved by the Invention] The present invention is made in view of such previous actual situation research, and the object of the present invention is to provide a contact between the Cu layer and the cured photosensitive resin layer after a high temperature storage test. A photosensitive resin composition of a resin layer having high adhesion without causing voids at the interface, a method for forming a hardened relief pattern using the photosensitive resin composition, and a semiconductor device having the hardened relief pattern . [Technical means to solve the problem] The present inventors have found that by preparing a cyclic compound having a carbonyl group in a photosensitive resin composition, a cured film that is excellent in discoloration suppression even on copper or a copper alloy can be obtained. The photosensitive resin composition thus completed the present invention. That is, the present invention is as follows. [1] A photosensitive resin composition comprising: (A) selected from the group consisting of polyamic acid, polyamidate, polyamidate, polyhydroxyamidoamine, polyamidoamine, polyamidoamine, 100% by mass of at least one resin in the group consisting of polyamidoimine, polyamidoimide, polybenzoxazole, and novolac, polyhydroxystyrene, and phenol resin; (B) selected from the following compounds At least one compound in the group: 0.01 to 10 parts by mass based on 100 parts by mass of the above (A) resin, the compound is a cyclic compound having two or more carbonyl groups, and the carbonyl group is directly bonded to the above For a cyclic structure, in the case of a monocyclic compound, more than 1/3 of the atoms forming the ring structure are N atoms; in the case of a condensed ring compound, more than 1/3 of the atoms forming the ring structure having the carbonyl group are N atom; and (C) photosensitizer: 1 to 50 parts by mass based on 100 parts by mass of the above (A) resin. [2] The photosensitive resin composition according to [1], wherein the (A) resin is selected from the group consisting of a polyimide precursor containing the following general formula (1) and a polymer containing the following general formula (4) Amidine, a polyoxazole precursor containing the following general formula (5), a polyoximide containing the following general formula (6), and a novolak, polyhydroxystyrene, and a compound containing the following general formula (7) At least one of the group consisting of a phenol resin. The following general formula (1) is [Chemical Formula 1] {In the formula, X ₁ is a tetravalent organic group, Y ₁ is a divalent organic group, n ₁ is an integer of 2 to 150, and R ₁ and R ₂ are each independently a hydrogen atom and a saturated carbon number of 1 to 30. Aliphatic group, aromatic group, or the following general formula (2): [化 2] (Wherein R ₃ , R ₄ and R ₅ are each independently a hydrogen atom or an organic group having 1 to 3 carbon atoms, and m ₁ is an integer of 2 to 10) a monovalent organic group represented by 1 or a carbon number 1 A saturated aliphatic group of ∼4, or the following general formula (3): (Wherein R ₆ , R _7, and R ₈ are each independently a hydrogen atom or an organic group having 1 to 3 carbon atoms, and m ₂ is an integer of 2 to 10). The polyamidate precursor, polyamidate, polyamidate, or polyamidate, the following general formula (4) has the formula [Chem. 4] {In the formula, X ₂ is a trivalent organic group having 6 to 15 carbons, Y ₂ is a divalent organic group having 6 to 35 carbons, and may be the same structure or have a plurality of structures, and R ₉ is a compound having at least A radical polymerizable unsaturated organic group having 3 to 20 carbon atoms, and n ₂ is an integer of 1 to 1000} Polyamine having a structure represented by the following formula (5):化 5] {In the formula, Y ₃ is a tetravalent organic group having a carbon atom, Y ₄ , X _3, and X ₄ are each independently a divalent organic group having two or more carbon atoms, and n ₃ is an integer from 1 to 1,000. , n ₄ is an integer of 0 to _{500., n 3 / (n 3 +} n 4)> 0.5, and comprises X ₃ and Y ₃ of n ₃ dihydroxy two Amides unit and comprising X n ₄ and Y ₄ of ₄ The order of the arrangement of the diamidine units is arbitrary. Polyhydroxyamidine, which is a polyoxazole precursor, having a structure represented by}, the following general formula (6) has the formula [Chem. 6] {In the formula, X ₅ is a 4- to 14-valent organic group, Y ₅ is a 2- to 12-valent organic group, and R ₁₀ and R ₁₁ each independently have at least one selected from a phenolic hydroxyl group, a sulfonic acid group, or a thiol. In the organic group of the group, n ₅ is an integer of 3 to 200, and m ₃ and m ₄ represent an integer of 0 to 10}. Polyimide having a structure represented by}, and the following general formula (7) is [化 7] {In the formula, a is an integer of 1 to 3, b is an integer of 0 to 3, 1 ≦ (a + b) ≦ 4, and R ₁₂ represents a monovalent organic group selected from a carbon number of 1 to 20, a halogen atom, and a nitro group. A monovalent substituent in a group consisting of cyano and cyano. When b is 2 or 3, a plurality of R ₁₂ may be the same as or different from each other. X represents a group selected from the carbon number 2 which may have an unsaturated bond. Divalent aliphatic group of ～ 10, divalent alicyclic group of 3 to 20 carbon number, and the following general formula (8): [化 8] (In the formula, p is an integer of 1 to 10.) The divalent organic group represented by a divalent alkoxy group represented by a divalent group and a divalent organic group having an aromatic ring having 6 to 12 carbon atoms. Phenol resin. [3] The photosensitive resin composition according to [1] or [2], wherein the photosensitive resin composition includes a phenol resin having a repeating unit represented by the general formula (7), and the general formula (7) X is selected from the following general formula (9): {In the formula, R ₁₃ , R ₁₄ , R ₁₅ and R ₁₆ are each independently a hydrogen atom, a monovalent aliphatic group having 1 to 10 carbon atoms, or a carbon in which a part or all of a hydrogen atom is substituted with a fluorine atom A monovalent aliphatic group of 1 to 10, when n ₆ is an integer of 0 to 4, and when n ₆ is an integer of 1 to 4, R ₁₇ is a halogen atom, a hydroxyl group, or a carbon number of 1 to 12 Valence organic group, when at least one R ₁₇ is a hydroxyl group, and n ₆ is an integer of 2 to 4, a plurality of R ₁₇ may be the same as or different from each other} The divalent group represented by} and the following general formula (10): [化 10] {In the formula, R ₁₈ , R ₁₉ , R ₂₀ and R ₂₁ each independently represent a hydrogen atom, a monovalent aliphatic group having 1 to 10 carbon atoms, or a carbon in which a part or all of a hydrogen atom is replaced with a fluorine atom A monovalent aliphatic group of 1 to 10, W is a single bond, an alicyclic formula selected from an aliphatic group of 1 to 10 carbons that can be substituted by a fluorine atom, and a carbon number of 3 to 20 that can be substituted by a fluorine atom. And the following general formula (8): (Wherein p is an integer of 1 to 10) and a divalent alkoxy group represented by the following formula (11): [化 12] The divalent base in the group consisting of the divalent base represented} the divalent organic group in the group consisting of the divalent base represented by the divalent base}. [4] A method for producing a hardened relief pattern, comprising: (1) forming a photosensitive layer on the substrate by coating the photosensitive resin composition according to any one of [1] to [3] on the substrate; (2) a step of exposing the photosensitive resin layer; (3) a step of developing the photosensitive resin layer after the exposure to form a relief pattern; and (4) a step of The step of heating the embossed pattern to form a hardened embossed pattern. [5] The method according to [4], wherein the substrate is formed of copper or a copper alloy. [6] A semiconductor device including a hardened relief pattern obtained by the manufacturing method according to [4] or [5]. [Effects of the Invention] According to the present invention, by combining a specific photosensitive resin and a specific compound, it is possible to provide a Cu layer and a polyimide layer which can be obtained after a high temperature storage test. Photosensitive resin composition of photosensitive resin having no adhesion at interface and high adhesion, method for forming hardened relief pattern using the photosensitive resin composition, and semiconductor device having the hardened relief pattern .

The present invention will be specifically described below. In addition, in the present specification, when there are a plurality of structures represented by the same symbol in the general formula in a molecule, they may be the same as or different from each other. <Photosensitive resin composition> (Aspect A) The present invention uses the following components as essential components, that is, (A) is selected from the group consisting of polyamic acid, polyamidate, polyamidate, and polyhydroxyamido , At least one resin in the group consisting of polyamidoamine, polyamidoamine, polyamidoimide, polyamidoimide, polybenzoxazole, and novolac, polyhydroxystyrene, and phenol resin: 100 parts by mass, (B) a cyclic compound having a carbonyl group: 0.01 to 10 parts by mass based on 100 parts by mass of (A) resin, and (C) photosensitizer: 1 to 100 parts by mass of (A) resin 50 parts by mass. (A) Resin The (A) resin used in the present invention will be described. The resin (A) of the present invention is selected from the group consisting of polyamic acid, polyamidate, polyamidate, polyhydroxyamidoamine, polyamidoamine, polyamidoamine, polyamidoamine, At least one resin in the group consisting of polyimide, polybenzoxazole, and novolac, polyhydroxystyrene, and phenol resin is used as a main component. Here, the main component means that these resins are contained in an amount of 60% by mass or more of the entire resin, and preferably 80% by mass or more. Moreover, you may contain other resin as needed. The weight average molecular weight of these resins is preferably 200 or more, and more preferably 5,000 or more in terms of polystyrene conversion based on gel permeation chromatography from the viewpoint of heat resistance and mechanical properties after heat treatment. The upper limit is preferably 500,000 or less, and in the case of a photosensitive resin composition, it is more preferably 20,000 or less from the viewpoint of solubility in a developing solution. In the present invention, in order to form a relief pattern, the (A) resin is a photosensitive resin. The photosensitive resin is a resin that is used together with the following (C) photosensitizer to form a photosensitive resin composition, and that causes a phenomenon of dissolution or undissolution in a subsequent development step. As the photosensitive resin, polyamine, polyamidate, polyamidate, polyhydroxyamidoamine, polyamidoamine, polyamidoamine, polyamidoimine, polyamidoimide, Among polybenzoxazole and phenol resins containing novolac and polyhydroxystyrene, in terms of excellent heat resistance and mechanical properties of the resin after heat treatment, polyfluoric acid and polyfluorene can be preferably used. Urethane, polyamidate, polyamidoamine, polyhydroxyamidoamine, polyamidoimide and phenol resin. In addition, these photosensitive resins can be selected to prepare any photosensitive resin composition, such as a negative type or a positive type, together with the following (C) photosensitive agent, depending on the intended use. [(A) Polyamidic acid, polyamidate, polyamidate] An example of the (A) resin which is the best from the viewpoints of heat resistance and photosensitive characteristics in the photosensitive resin composition of the present invention Is the above-mentioned general formula (1): {Where, X ₁ Is a 4-valent organic group, Y ₁ Is a divalent organic group, n ₁ Is an integer from 2 to 150, R ₁ And R ₂ They are each independently a hydrogen atom, a saturated aliphatic group having 1 to 30 carbon atoms, or the above-mentioned general formula (2): [化 14] (Where, R ₃ , R ₄ And R ₅ Each independently is a hydrogen atom or an organic group having 1 to 3 carbon atoms, and m ₁ Is an integer of 2 to 10), a monovalent organic group represented by 1 or a saturated aliphatic group having 1 to 4 carbon atoms}, or a monovalent organic group represented by the following formula; or the following general formula (3): [化 15] (Where, R ₆ , R ₇ And R ₈ Each independently is a hydrogen atom or an organic group having 1 to 3 carbon atoms, and m ₂ It is an integer of 2 to 10), a polyvalent ammonium ion represented by a monovalent ammonium ion}, and a polyfluorinated acid, a polyfluorinated acid ester, or a polyfluorinated acid salt represented by a polyimide precursor. The polyfluorene imide precursor is converted into a polyfluorene by performing a cyclization treatment (for example, at a temperature of 200 ° C. or higher). Polyimide precursors are suitable for use in negative-type photosensitive resin compositions. In the general formula (1), X ₁ In terms of having both heat resistance and photosensitive properties, the tetravalent organic group indicated is preferably an organic group having 6 to 40 carbon atoms, and more preferably -COOR ₁ Base and -COOR ₂ An aromatic group or an alicyclic aliphatic group in which the group and the -CONH- group are adjacent to each other. As X ₁ The tetravalent organic group represented is preferably an organic group containing 6 to 40 carbon atoms containing an aromatic ring, and more preferably the following formula (30): {In the formula, R25 is a monovalent group selected from a hydrogen atom, a fluorine atom, a hydrocarbon group of C1 to C10, a fluorine-containing hydrocarbon group of C1 to C10, l is an integer selected from 0 to 2, and m is selected from 0 to 3 An integer, n is a structure represented by an integer selected from 0 to 4}, but is not limited to these. Again, X ₁ The structure may be one type or a combination of two or more types. X having the structure represented by the above formula ₁ It is particularly preferable in terms of both heat resistance and light-sensitive properties. In the general formula (1), Y ₁ The divalent organic group represented is preferably an aromatic group having 6 to 40 carbon atoms in terms of both heat resistance and photosensitivity. For example, the following formula (31) can be mentioned: [Wherein R25 is a monovalent group selected from a hydrogen atom, a fluorine atom, a hydrocarbon group of C1 to C10, a fluorine-containing hydrocarbon group of C1 to C10, and n is an integer selected from 0 to 4], but Not limited to these. Also, Y ₁ The structure may be one type or a combination of two or more types. Y having the structure represented by the above formula (31) ₁ It is particularly preferable in terms of both heat resistance and light-sensitive properties. R in the general formula (2) ₃ Preferably a hydrogen atom or a methyl group, R ₄ And R ₅ From the viewpoint of light-sensitive properties, a hydrogen atom is preferred. Again, m ₁ From a viewpoint of a light-sensitive characteristic, it is an integer of 2 or more and 10 or less, Preferably it is an integer of 2 or more and 4 or less. In the case of using a polyfluorene imide precursor as the (A) resin, examples of a method for imparting photosensitivity to a photosensitive resin composition include an ester bond type and an ion bond type. The former is a method in which a side chain of a polyfluorene imide precursor is introduced into the compound having a photopolymerizable group, that is, an olefinic double bond through an ester bond. A method in which an amine group of a (meth) acrylic compound is bonded via an ionic bond to give a photopolymerizable group. The above ester-bonded polyfluorene imide precursor is obtained by firstly making the tetravalent organic group X ₁ Tetracarboxylic dianhydride reacts with alcohols having photopolymerizable unsaturated double bonds and any saturated aliphatic alcohols having 1 to 4 carbon atoms to prepare partially esterified tetracarboxylic acid (hereinafter also referred to as Acid / ester)), and then it is combined with the above-mentioned divalent organic group Y ₁ The diamines undergo fluorinated condensation polymerization. (Preparation of acid / ester body) In the present invention, a tetravalent organic group X is used as a precursor of an ester-bonded polyimide ₁ Examples of the tetracarboxylic dianhydride include the tetracarboxylic dianhydride represented by the general formula (30), for example, pyromellitic dianhydride and diphenyl ether-3,3 ', 4,4'-tetracarboxylic acid. Carboxylic dianhydride, benzophenone-3,3 ', 4,4'-tetracarboxylic dianhydride, biphenyl-3,3', 4,4'-tetracarboxylic dianhydride, diphenylphosphonium -3,3 ', 4,4'-tetracarboxylic dianhydride, diphenylmethane-3,3', 4,4'-tetracarboxylic dianhydride, 2,2-bis (3,4-benzenediene Formic anhydride) propane, 2,2-bis (3,4-phthalic anhydride) -1,1,1,3,3,3-hexafluoropropane, etc., preferred examples include pyromellitic dianhydride, Diphenyl ether-3,3 ', 4,4'-tetracarboxylic dianhydride, benzophenone-3,3', 4,4'-tetracarboxylic dianhydride, biphenyl-3,3 ', 4,4'-tetracarboxylic dianhydride, but it is not limited to these. These may be used alone, but two or more of them may be used in combination. In the present invention, as the alcohol having a photopolymerizable unsaturated double bond suitable for preparing an ester-bonded polyfluorene imide precursor, for example, 2-propenyloxyethanol and 1-propenyloxy 3-propanol, 2-propenylaminoethanol, methylol vinyl ketone, 2-hydroxyethyl vinyl ketone, 2-hydroxy-3-methoxypropyl acrylate, 2-hydroxy-3-acrylate Butoxypropyl, 2-hydroxy-3-phenoxypropyl acrylate, 2-hydroxy-3-butoxypropyl acrylate, 2-hydroxy-3-third butoxypropyl acrylate, 2-acrylate Hydroxy-3-cyclohexyloxypropyl ester, 2-methacryloxyethanol, 1-methacryloxy-3-propanol, 2-methacrylaminoethanol, methylol vinyl Ketone, 2-hydroxyethyl vinyl ketone, 2-hydroxy-3-methoxypropyl methacrylate, 2-hydroxy-3-butoxypropyl methacrylate, 2-hydroxy-3-methacrylate Phenoxypropyl, 2-hydroxy-3-butoxypropyl methacrylate, 2-hydroxy-3-third butoxypropyl methacrylate, 2-hydroxy-3-cyclohexyl methacrylate Propyl ester, etc. A part of the above-mentioned alcohols may be used as a saturated aliphatic alcohol having 1 to 4 carbon atoms, such as methanol, ethanol, n-propanol, isopropanol, n-butanol, and third butanol. The tetracarboxylic dianhydride and the above-mentioned alcohols suitable in the present invention are dissolved in a solvent such as pyridine in a solvent described below at a temperature of 20 to 50 ° C. for 4 to 10 hours to dissolve, By mixing, an esterification reaction of an acid anhydride is performed, and a desired acid / ester body can be obtained. (Preparation of polyfluorene imine precursor) For the above-mentioned acid / ester (typically, the solution in the following solvent), an appropriate dehydration condensing agent such as bicyclic carbodiimide ( (E.g. dicyclohexylcarbodiimide), 1-ethoxycarbonyl-2-ethoxy-1,2-dihydroquinoline, 1,1-carbonyldioxy-di-1,2,3- After mixing benzotriazole, N, N'-dibutanebiiminocarbonate, etc. to make the acid / ester body into a polyanhydride, it is added dropwise into the polyvalent anhydride, and a divalent compound suitable for use in the present invention is added. Organic Y ₁ Those obtained by dissolving or dispersing the diamines in a solvent are subjected to fluorene condensation polymerization, thereby obtaining a target polyfluorene imine precursor. Alternatively, the target polyfluoreneimide precursor can be obtained by subjecting the acid portion of the acid / ester body to sulfonium chlorination using thionyl chloride and the like, and then reacting with a diamine compound in the presence of a base such as pyridine. As a divalent organic group Y suitable for use in the present invention ₁ Examples of the diamines include diamines having a structure represented by the general formula (31), for example, p-phenylenediamine, m-phenylenediamine, 4,4'-diaminodiphenyl ether, 3, 4'-diaminodiphenyl ether, 3,3'-diaminodiphenyl ether, 4,4'-diaminodiphenylsulfide, 3,4'-diaminodiphenylsulfide, 3, 3'-diaminodiphenylsulfide, 4,4'-diaminodiphenylphosphonium, 3,4'-diaminodiphenylphosphonium, 3,3'-diaminodiphenylphosphonium, 4,4'-diaminobiphenyl, 3,4'-diaminobiphenyl, 3,3'-diaminobiphenyl, 4,4'-diaminobenzophenone, 3,4 ' -Diaminobenzophenone, 3,3'-diaminobenzophenone, 4,4'-diaminodiphenylmethane, 3,4'-diaminodiphenylmethane, 3, 3'-diaminodiphenylmethane, 1,4-bis (4-aminophenoxy) benzene, 1,3-bis (4-aminophenoxy) benzene, 1,3-bis (3 -Aminophenoxy) benzene, bis [4- (4-aminophenoxy) phenyl] fluorene, bis [4- (3-aminophenoxy) phenyl] fluorene, 4,4-bis (4-Aminophenoxy) biphenyl, 4,4-bis (3-aminophenoxy) biphenyl, bis [4- (4-aminophenoxy) phenyl] ether, bis [4 -(3-aminophenoxy) phenyl] ether, 1,4-bis (4-aminophenyl) benzene, 1,3-bis (4-aminophenyl) , 9,10-bis (4-aminophenyl) anthracene, 2,2-bis (4-aminophenyl) propane, 2,2-bis (4-aminophenyl) hexafluoropropane, 2, 2-bis (4- (4-aminophenoxy) phenyl) propane, 2,2-bis [4- (4-aminophenoxy) phenyl) hexafluoropropane, 1,4-bis ( 3-aminopropyldimethylsilyl) benzene, o-tolylamine hydrazone, 9,9-bis (4-aminophenyl) fluorene, and a portion of the hydrogen atoms on the benzene ring are methylated , Ethyl, hydroxymethyl, hydroxyethyl, halogen, etc., such as 3,3'-dimethyl-4,4'-diaminobiphenyl, 2,2'-dimethyl-4,4 '-Diaminobiphenyl, 3,3'-dimethyl-4,4'-diaminodiphenylmethane, 2,2'-dimethyl-4,4'-diaminodiphenyl Methane, 3,3'-dimethoxy-4,4'-diaminobiphenyl, 3,3'-dichloro-4,4'-diaminobiphenyl, 2,2'-dimethyl Benzidine, 2,2'-bis (trifluoromethyl) -4,4'-diaminobiphenyl, 2,2'-bis (fluoro) -4,4'-diaminobiphenyl, 4, 4'-diamino octafluorobiphenyl, etc .; preferably, p-phenylenediamine, m-phenylenediamine, 4,4'-diaminodiphenyl ether, 2,2'-dimethylbenzidine, 2,2'-bis (trifluoromethyl) -4,4'-diaminobiphenyl, 2,2'-bis (fluoro) -4,4'-diaminobiphenyl, 4,4'- two Octafluoro biphenyl group and the like, and mixtures of these and the like, but not limited thereto. In addition, in order to improve the adhesion between the resin layer formed on the substrate and the various substrates by coating the photosensitive resin composition of the present invention on the substrate, when preparing a polyimide precursor, it can also be used with 1,3- Diaminosiloxanes such as bis (3-aminopropyl) tetramethyldisilazane and 1,3-bis (3-aminopropyl) tetraphenyldisilazane are copolymerized. After the ammonium condensation polymerization reaction is completed, if necessary, the water absorption by-products of the dehydration condensation agent coexisting in the reaction solution are filtered and separated, and water, an aliphatic lower alcohol, or a mixture thereof is added to the obtained polymer component. Poor solvents cause the polymer to be separated out, and then re-dissolved, re-precipitated, etc., to refine the polymer, and then vacuum-dried to isolate the target polyimide precursor. In order to improve the precision, the solution of the polymer may be passed through a column packed with an anion and / or cation exchange resin swelled with a suitable organic solvent to remove ionic impurities. On the other hand, the above-mentioned ion-bonded polyfluorene imide precursor is typically obtained by reacting a tetracarboxylic dianhydride with a diamine. In this case, R in the above general formula (1) ₁ And R ₂ At least one of them is a hydroxyl group. The tetracarboxylic dianhydride is preferably an anhydride of a tetracarboxylic acid containing the structure of the above formula (30), and the diamine is preferably a diamine containing the structure of the above formula (31). By adding the following (meth) acrylic compound having an amine group to the obtained polyamide precursor, a photopolymerizable group is imparted by an ionic bond between a carboxyl group and an amine group. As the (meth) acrylic compound having an amine group, for example, dimethylaminoethyl acrylate, dimethylaminoethyl methacrylate, diethylaminoethyl acrylate, and diethylamino methacrylate are preferable. Ethyl ester, dimethylaminopropyl acrylate, dimethylaminopropyl methacrylate, diethylaminopropyl acrylate, diethylaminopropyl methacrylate, dimethylaminobutyl acrylate, methacrylic acid Dimethylaminobutyl acrylate, diethylaminobutyl acrylate, diethylaminobutyl methacrylate, and other dialkylaminoalkyl acrylates or dialkylaminoalkyl methacrylates, among which, From the viewpoint of photosensitivity, a dialkylaminoalkyl acrylate or methacrylic acid diacrylate having 1 to 10 carbon atoms in the amine group and 1 to 10 carbon atoms in the alkyl chain is preferred. Alkyl amino alkyl esters. The blending amount of these (meth) acrylic compounds having an amine group is 1 to 20 parts by mass based on 100 parts by mass of the (A) resin, and is preferably 2 to 15 in terms of light sensitivity characteristics. Parts by mass. With respect to 100 parts by mass of the resin (A), the photosensitivity is excellent by blending 1 part by mass or more of the (meth) acrylic compound having an amine group as the (C) photosensitizer, and the thickness is thick by blending 20 parts by mass or less. Excellent hardenability. The molecular weight of the ester-bonded polyimide precursor and the ion-bonded polyimide precursor is preferably 8,000 to 150,000 when measured as a polystyrene-equivalent weight-average molecular weight based on gel permeation chromatography. , More preferably 9,000 to 50,000. When the weight average molecular weight is 8,000 or more, the mechanical properties are good, and when the weight average molecular weight is 150,000 or less, the dispersibility in the developing solution is good, and the relief performance of the relief pattern is good. As a developing solvent for gel permeation chromatography, tetrahydrofuran and N-methyl-2-pyrrolidone are recommended. The weight average molecular weight was determined from a calibration curve prepared using a standard monodisperse polystyrene. As the standard monodisperse polystyrene, it is recommended to select from the organic solvent series standard sample STANDARD SM-105 manufactured by Showa Denko Corporation. [(A) Polyamine] Another example of the preferable (A) resin in the photosensitive resin composition of the present invention has the following general formula (4): {Where, X ₂ Trivalent organic group having 6 to 15 carbon atoms, Y ₂ It is a divalent organic group having 6 to 35 carbon atoms, and may have the same structure or a plurality of structures. R ₉ An organic group having at least one radically polymerizable unsaturated bond group having 3 to 20 carbon atoms, and n ₂ Polyamine having a structure represented by an integer of 1 to 1000}. This polyamine is suitable for use in a negative photosensitive resin composition. In the general formula (4), as R ₉ The base represented is preferably the following general formula (32) in terms of both light-sensitive properties and chemical resistance. {Where R ₃₂ A group represented by an organic group having at least one radically polymerizable unsaturated bond having 2 to 19 carbon atoms}. In the general formula (4), as X ₂ The trivalent organic group represented is preferably a trivalent organic group having 6 to 15 carbon atoms, and is preferably selected from the following formula (33), for example: [化 20] The aromatic group in the represented group is more preferably an aromatic group obtained by removing a carboxyl group and an amine group from an amine-substituted isophthalic acid structure. In the general formula (4), as Y ₂ The divalent organic group shown is preferably an organic group having 6 to 35 carbon atoms, more preferably a cyclic organic group having 1 to 4 aromatic rings or aliphatic rings which may be substituted, or not Aliphatic or siloxane groups with cyclic structure. As Y ₂ Examples of the divalent organic group represented include the following general formula (I) and the following general formulas (34) and (35): [化 21] [Chemical 22] {Where R ₃₃ And R ₃₄ Are independently selected from the group consisting of hydroxy, methyl (-CH ₃ ), Ethyl (-C ₂ H ₅ ), Propyl (-C ₃ H ₇ ) Or butyl (-C ₄ H ₉ ), And the propyl and butyl groups include various isomers} [化 23] {Where m ₇ Is an integer from 0 to 8, m ₈ And m ₉ Each independently an integer of 0 to 3, m ₁₀ And m ₁₁ Each independently an integer of 0 to 10, and R ₃₅ And R ₃₆ For methyl (-CH ₃ ), Ethyl (-C ₂ H ₅ ), Propyl (-C ₃ H ₇ ), Butyl (-C ₄ H ₉ ) Or such isomers}. Regarding the aliphatic group or siloxy group which does not have a cyclic structure, the following general formula (36) can be mentioned as a preferable one: [化 24] {Where m ₁₂ Is an integer from 2 to 12, m ₁₃ Is an integer from 1 to 3, m ₁₄ Is an integer from 1 to 20, and R ₃₇ , R ₃₈ , R ₃₉ And R ₄₀ Each is independently an alkyl group having 1 to 3 carbon atoms or a substituted phenyl group}. The polyamide resin of the present invention can be synthesized, for example, as follows. (Synthesis of Terephthalate Compound) In the first step, a trivalent aromatic group X ₂ Compounds, for example, at least one compound selected from the group consisting of phthalic acid substituted with amine, phthalic acid substituted with amine, and terephthalic acid substituted with amine (hereinafter referred to as It is a "phthalic acid compound") 1 mole, and a compound that reacts with an amine group is reacted with 1 mole, and the amine group that synthesizes the phthalic acid compound undergoes the following radical containing a polymerizable unsaturated bond Modified and capped compounds (hereinafter referred to as "phthalic acid compound capped bodies"). These can be used alone or in combination. When the phthalic acid compound is terminated with the radical-polymerizable unsaturated bond-terminated structure, a negative-type photosensitivity (photocurability) can be imparted to the polyamide resin. As the radical containing a radically polymerizable unsaturated bond, an organic group having a radically polymerizable unsaturated bond group having 3 to 20 carbon atoms is preferred, and a methacrylfluorenyl group or acrylfluorenyl group is particularly preferred The base. The above-mentioned phthalic acid compound capping body can be made of an amine group of a phthalic acid compound and an at least one unsaturated polymerizable group having a free-radically polymerizable carbon number of 3 to 20, an isocyanate, an epoxy compound, or the like. Obtained by reaction. Examples of suitable chloro include (meth) acrylic chloro, 2-[(meth) acrylic oxy] acetic chloride, 3-[(meth) acrylic oxy] propyl chloride, and chlorine 2-[((Meth) acryloxy] oxy] ethyl formate, 3-[(meth) acryloxypropyl] chloroformate, and the like. Examples of suitable isocyanates include 2- (meth) acryloxyethyl isocyanate, 1,1-bis [(meth) acryloxymethyl] ethyl isocyanate, and isocyanate. 2- [2- (Meth) acryloxyethoxy] ethyl and the like. Examples of suitable epoxy compounds include glycidyl (meth) acrylate. These can be used singly or in combination, but it is particularly preferable to use methacrylic acid chloride and / or 2- (methacrylic acid) ethyl isocyanate. Furthermore, as the phthalic acid compound capping body, those having a phthalic acid compound of 5-aminoisophthalic acid can obtain polyamines which are excellent not only in photosensitivity but also in film properties after heat curing. . The above-mentioned capping reaction can be carried out by stirring and dissolving the phthalic acid compound and the capping agent in a solvent as described below in the presence of a basic catalyst such as pyridine or a tin-based catalyst such as di-n-butyltin dilaurate. Mixing is performed. Chlorine and the like will generate hydrogen chloride as a by-product during the capping reaction according to the type of capping agent. In this case, in order to prevent contamination of the subsequent steps, it is preferable to appropriately refine, that is, temporarily reprecipitate in water and wash and dry it, or pass it through a column filled with ion exchange resin to remove and reduce ions. Ingredients, etc. (Synthesis of Polyamide) The above-mentioned phthalic acid compound capping body and a divalent organic group Y ₂ The diamine compound is mixed with a solvent described below in the presence of a basic catalyst such as pyridine or triethylamine to carry out fluorene condensation polymerization, thereby obtaining the polyfluorene of the present invention. Examples of the ammonium condensation polymerization method include a method of using a dehydrating condensing agent to make a phthalic acid compound capped body into a symmetrical polyacid anhydride and mixing it with a diamine compound, or a known method to cap the phthalic acid compound capped body. A method for realizing mixing with a diamine compound after chlorination, a method for reacting a dicarboxylic acid component with an active esterifying agent in the presence of a dehydrating condensing agent to achieve active esterification and mixing with a diamine compound. Examples of preferred dehydration condensation agents include dicyclohexylcarbodiimide, 1-ethoxycarbonyl-2-ethoxy-1,2-dihydroquinoline, and 1,1'- Carbonyldioxy-di-1,2,3-benzotriazole, N, N'-dibutyldifluorene iminocarbonate, and the like. Examples of the chlorinating agent include thionyl chloride. Examples of the active esterifying agent include: N-hydroxysuccinimide or 1-hydroxybenzotriazole, N-hydroxy-5-oxo &#158665; ene-2,3-dicarboximide, 2 -Ethyl hydroxyimino-2-cyanoacetate, 2-hydroxyimino-2-cyanoacetamidine, and the like. As having organic group Y ₂ The diamine compound is preferably selected from the group consisting of an aromatic diamine compound, an aromatic bisaminophenol compound, an alicyclic diamine compound, a linear aliphatic diamine compound, and a siloxane diamine compound. At least one diamine compound may be used in combination, if necessary. Examples of the aromatic diamine compound include p-phenylenediamine, m-phenylenediamine, 4,4'-diaminodiphenyl ether, 3,4'-diaminodiphenyl ether, and 3,3'-diamine. Amino diphenyl ether, 4,4'-diamino diphenyl sulfide, 3,4'-diamino diphenyl sulfide, 3,3'-diamino diphenyl sulfide, 4,4'- Diaminodiphenylphosphonium, 3,4'-diaminodiphenylphosphonium, 3,3'-diaminodiphenylphosphonium, 4,4'-diaminobiphenyl, 3,4'- Diaminobiphenyl, 3,3'-diaminobiphenyl, 4,4'-diaminobenzophenone, 3,4'-diaminobenzophenone, 3,3'-diamine Benzophenone, 4,4'-diaminodiphenylmethane, 3,4'-diaminodiphenylmethane, 3,3'-diaminodiphenylmethane, 1,4-bis (4-aminophenoxy) benzene, 1,3-bis (4-aminophenoxy) benzene, 1,3-bis (3-aminophenoxy) benzene, bis [4- (4- Aminophenoxy) phenyl] fluorene, bis [4- (3-aminophenoxy) phenyl] fluorene, 4,4'-bis (4-aminophenoxy) biphenyl, 4,4 '-Bis (3-aminophenoxy) biphenyl, bis [4- (4-aminophenoxy) phenyl] ether, bis [4- (3-aminophenoxy) phenyl] ether , 1,4-bis (4-aminophenyl) benzene, 1,3-bis (4-aminophenyl) benzene, 9,10-bis (4-aminophenyl) anthracene, 2,2- Double (4- Phenyl) propane, 2,2-bis (4-aminophenyl) hexafluoropropane, 2,2-bis [4- (4-aminophenoxy) phenyl] propane, 2,2-bis [4- (4-Aminophenoxy) phenyl] hexafluoropropane, 1,4-bis (3-aminopropyldimethylsilyl) benzene, o-toluidine, 9,9-bis (4-Aminophenyl) pyrene and one of the hydrogen atoms on the benzene ring are selected from the group consisting of methyl, ethyl, hydroxymethyl, hydroxyethyl, and halogen atoms Diamine compounds substituted with the above. Examples of the diamine compound in which a hydrogen atom on the benzene ring is substituted include 3,3'-dimethyl-4,4'-diaminobiphenyl, 2,2'-dimethyl-4 , 4'-diaminobiphenyl, 3,3'-dimethyl-4,4'-diaminodiphenylmethane, 2,2'-dimethyl-4,4'-diaminediamine Phenylmethane, 3,3'-dimethoxy-4,4'-diaminobiphenyl, 3,3'-dichloro-4,4'-diaminobiphenyl and the like. Examples of the aromatic bisaminophenol compound include 3,3'-dihydroxybenzidine, 3,3'-diamino-4,4'-dihydroxybiphenyl, and 3,3'-dihydroxy-4. , 4'-diaminodiphenylphosphonium, bis- (3-amino-4-hydroxyphenyl) methane, 2,2-bis- (3-amino-4-hydroxyphenyl) propane, 2, 2-bis- (3-amino-4-hydroxyphenyl) hexafluoropropane, 2,2-bis- (3-hydroxy-4-aminophenyl) hexafluoropropane, bis- (3-hydroxy-4 -Aminophenyl) methane, 2,2-bis- (3-hydroxy-4-aminophenyl) propane, 3,3'-dihydroxy-4,4'-diaminobenzophenone, 3 , 3'-dihydroxy-4,4'-diaminodiphenyl ether, 4,4'-dihydroxy-3,3'-diaminodiphenyl ether, 2,5-dihydroxy-1,4- Diaminobenzene, 4,6-diaminoresorcinol, 1,1-bis (3-amino-4-hydroxyphenyl) cyclohexane, 4,4- (α-methylbenzylidene) ) -Bis (2-aminophenol) and the like. Examples of the alicyclic diamine compound include 1,3-diaminocyclopentane, 1,3-diaminocyclohexane, 1,3-diamino-1-methylcyclohexane, and 3 1,5-diamino-1,1-dimethylcyclohexane, 1,5-diamino-1,3-dimethylcyclohexane, 1,3-diamino-1-methyl- 4-isopropylcyclohexane, 1,2-diamino-4-methylcyclohexane, 1,4-diaminocyclohexane, 1,4-diamino-2,5-diethyl Cyclohexane, 1,3-bis (aminomethyl) cyclohexane, 1,4-bis (aminomethyl) cyclohexane, 2- (3-aminocyclopentyl) -2-propane Methylamine, mentanediamine, isophoronediamine, alkanediamine, 1-cycloheptene-3,7-diamine, 4,4'-methylenebis (cyclohexylamine) ), 4,4'-methylenebis (2-methylcyclohexylamine), 1,4-bis (3-aminopropyl) piper &#134116;, 3,9-bis (3-amino (Propyl) -2,4,8,10-tetraoxaspiro- [5,5] -undecane and the like. Examples of the linear aliphatic diamine compound include 1,2-diaminoethane, 1,4-diaminobutane, 1,6-diaminohexane, and 1,8-diaminooctyl Alkanes, 1,10-diaminodecane, 1,12-diaminododecane and other hydrocarbon-based diamines, or 2- (2-aminoethoxy) ethylamine, 2,2 '-( Alkylene oxide type diamines such as ethylenedioxy) diethylamine and bis [2- (2-aminoethoxy) ethyl] ether. Examples of the siloxane diamine compound include dimethyl (poly) siloxane diamine, such as PAM-E, KF-8010, X-22-161A, and the like manufactured by Shin-Etsu Chemical Industries. After the ammonium condensation polymerization reaction is completed, if necessary, the precipitate derived from the dehydration condensation agent and the like which are precipitated in the reaction solution are separated by filtration. Then, a poor solvent such as polyamine, such as water or an aliphatic lower alcohol or a mixture thereof, is added to the reaction solution to precipitate the polyamine. Further, the precipitated polyamide is dissolved again in a solvent, and a reprecipitation operation is repeatedly performed, thereby purifying and vacuum drying to isolate the target polyamide. Furthermore, in order to further improve the precision system, the polyamine solution can be passed through a column filled with an ion exchange resin to remove ionic impurities. The polystyrene-equivalent weight average molecular weight of polyamine based on gel permeation chromatography (hereinafter referred to as "GPC") is preferably 7,000 to 70,000, and more preferably 10,000 to 50,000. When the polystyrene-equivalent weight average molecular weight is 7,000 or more, the basic physical properties of the hardened relief pattern are ensured. When the polystyrene-equivalent weight-average molecular weight is 70,000 or less, the development solubility at the time of forming the relief pattern is ensured. As the eluent of GPC, tetrahydrofuran or N-methyl-2-pyrrolidone is recommended. In addition, the weight average molecular weight value was calculated | required from the calibration curve prepared using the standard monodisperse polystyrene. As the standard monodisperse polystyrene, it is recommended to select from the organic solvent series standard sample STANDARD SM-105 manufactured by Showa Denko. [(A) Polyhydroxyamidoamine] Another example of the preferable (A) resin in the photosensitive resin composition of the present invention has the following general formula (5): [Chem 25] {Where Y ₃ Is a tetravalent organic group having a carbon atom, preferably a tetravalent organic group having two or more carbon atoms, Y ₄ , X ₃ And X ₄ Each independently a divalent organic group having two or more carbon atoms, n ₃ Is an integer from 1 to 1000, n ₄ An integer from 0 to 500, n ₃ / (n ₃ + N ₄ )> 0.5 and contains X ₃ And Y ₃ N ₃ Dihydroxydiamine units and containing X ₄ And Y ₄ N ₄ The order of the arrangement of the two diamine units is arbitrary. Polyhydroxyamidoamine (polyoxazole precursor (hereinafter sometimes referred to as the polyhydroxyamido Precursor")). The polyoxazole precursor has n in the general formula (5) ₃ A polymer of two dihydroxydiamine units (hereinafter sometimes referred to as a dihydroxydiamine unit) may also have n in the general formula (5). ₄ Diamine units (hereinafter sometimes referred to simply as diamine units). X ₃ The number of carbon atoms is preferably 2 or more and 40 or less based on the purpose of obtaining light-sensitive properties. X ₄ The number of carbon atoms is preferably 2 or more and 40 or less based on the purpose of obtaining photosensitive properties. Y ₃ The number of carbon atoms is preferably 2 or more and 40 or less based on the purpose of obtaining photosensitive properties, and Y ₄ The number of carbon atoms is preferably 2 or more and 40 or less based on the purpose of obtaining the photosensitive properties. The dihydroxydiamine unit can be made to have Y ₃ (NH ₂ ) ₂ (OH) ₂ Structure of the diamine dihydroxy compound (preferably bisaminophenol) with X ₃ (COOH) ₂ A dicarboxylic acid having a structure is synthesized. In the following, a typical aspect will be described by taking the case where the diamino dihydroxy compound is a bisamino phenol as an example. The two groups of amine groups and hydroxyl groups of the bisaminophenol are located adjacent to each other respectively, and the dihydroxydioxamine unit is closed under heating at about 250 to 400 ° C to be converted into a heat-resistant polyoxazole structure. N in general formula (5) ₃ It is 1 or more for the purpose of obtaining a photosensitive characteristic, and 1000 or less for the purpose of obtaining a photosensitive characteristic. n ₃ The range is preferably 2 to 1,000, more preferably 3 to 50, and most preferably 3 to 20. Condensation on polyoxazole precursor as needed ₄ Diamine units described above. The diamine unit can be made by having Y ₄ (NH ₂ ) ₂ Structure of the diamine and X ₄ (COOH) ₂ A dicarboxylic acid having a structure is synthesized. N in general formula (5) ₄ A range of 0 to 500, with n ₄ When it is 500 or less, good photosensitive characteristics are obtained. n ₄ More preferably, it is in the range of 0 to 10. If the ratio of the diamidine unit to the dihydroxydiamidine unit is too high, the solubility in an alkaline aqueous solution used as a developing solution decreases, so n in the general formula (5) ₃ / (n ₃ + N ₄ The value of) exceeds 0.5, more preferably 0.7 or more, and most preferably 0.8 or more. About having Y ₃ (NH ₂ ) ₂ (OH) ₂ Examples of the bisaminophenol of the diaminodihydroxy compound having a structure include 3,3'-dihydroxybenzidine, 3,3'-diamino-4,4'-dihydroxybiphenyl, 4, 4'-diamino-3,3'-dihydroxybiphenyl, 3,3'-diamino-4,4'-dihydroxydiphenylphosphonium, 4,4'-diamino-3,3 '-Dihydroxydiphenylphosphonium, bis- (3-amino-4-hydroxyphenyl) methane, 2,2-bis- (3-amino-4-hydroxyphenyl) propane, 2,2-bis -(3-amino-4-hydroxyphenyl) hexafluoropropane, 2,2-bis- (4-amino-3-hydroxyphenyl) hexafluoropropane, bis- (4-amino-3-hydroxy Phenyl) methane, 2,2-bis- (4-amino-3-hydroxyphenyl) propane, 4,4'-diamino-3,3'-dihydroxybenzophenone, 3,3 '-Diamino-4,4'-dihydroxybenzophenone,4,4'-diamino-3,3'-dihydroxydiphenyl ether, 3,3'-diamino-4,4 ' -Dihydroxydiphenyl ether, 1,4-diamino-2,5-dihydroxybenzene, 1,3-diamino-2,4-dihydroxybenzene, 1,3-diamino-4,6 -Dihydroxybenzene and the like. These bisaminophenols can be used individually or in combination of 2 or more types. As Y in this bisaminophenol ₃ In terms of photosensitivity, the following formula (37) is preferred: {In the formula, Rs1 and Rs2 each independently represent a hydrogen atom, a methyl group, an ethyl group, a propyl group, a cyclopentyl group, a cyclohexyl group, a phenyl group, and a trifluoromethyl group}. Also, as having Y ₄ (NH ₂ ) ₂ Examples of the diamine having a structure include aromatic diamine, silamine, and the like. Among them, examples of the aromatic diamine include m-phenylenediamine, p-phenylenediamine, 2,4-toluenediamine, 3,3'-diaminodiphenyl ether, and 3,4'-diamine. Diphenyl ether, 4,4'-diaminodiphenyl ether, 3,3'-diaminodiphenylphosphonium, 4,4'-diaminodiphenylphosphonium, 3,4'-diamine Diphenylphosphonium, 3,3'-diaminodiphenylmethane, 4,4'-diaminodiphenylmethane, 3,4'-diaminodiphenylmethane, 4,4'-di Amino diphenyl sulfide, 3,3'-diamino diphenyl ketone, 4,4'-diamino diphenyl ketone, 3,4'-diamino diphenyl ketone, 2,2 ' -Bis (4-aminophenyl) propane, 2,2'-bis (4-aminophenyl) hexafluoropropane, 1,3-bis (3-aminophenoxy) benzene, 1,3- Bis (4-aminophenoxy) benzene, 1,4-bis (4-aminophenoxy) benzene, 4-methyl-2,4-bis (4-aminophenyl) -1-pentyl Ene, 4-methyl-2,4-bis (4-aminophenyl) -2-pentene, 1,4-bis (α, α-dimethyl-4-aminobenzyl) benzene, Aminodi-p-phenylenediamine, 1,5-diaminonaphthalene, 2,6-diaminonaphthalene, 4-methyl-2,4-bis (4-aminophenyl) pentane, 5 (or 6) -Amino-1- (4-aminophenyl) -1,3,3-trimethylindane, bis (p-aminophenyl) phosphine oxide, 4,4'-diaminoazo benzene 4,4'-diaminodiphenylurea, 4,4'-bis (4-aminophenoxy) biphenyl, 2,2-bis [4- (4-aminophenoxy) phenyl ] Propane, 2,2-bis [4- (4-aminophenoxy) phenyl] hexafluoropropane, 2,2-bis [4- (3-aminophenoxy) phenyl] diphenyl Ketone, 4,4'-bis (4-aminophenoxy) diphenylphosphonium, 4,4'-bis [4- (α, α-dimethyl-4-aminobenzyl) phenoxy ] Benzophenone, 4,4'-bis [4- (α, α-dimethyl-4-aminobenzyl) phenoxy] diphenylphosphonium, 4,4'-diaminobiphenyl , 4,4'-diaminobenzophenone, phenylindanediamine, 3,3'-dimethoxy-4,4'-diaminobiphenyl, 3,3'-dimethyl -4,4'-diaminobiphenyl, o-toluidine hydrazone, 2,2-bis (4-aminophenoxyphenyl) propane, bis (4-aminophenoxyphenyl) fluorene, bis (4-aminophenoxyphenyl) sulfide, 1,4- (4-aminophenoxyphenyl) benzene, 1,3- (4-aminophenoxyphenyl) benzene, 9, 9-bis (4-aminophenyl) fluorene, 4,4'-bis- (3-aminophenoxy) diphenylfluorene, 4,4'-diaminobenzidine aniline, etc., and the The hydrogen atom of the aromatic core of the aromatic diamine is selected from the group consisting of a chlorine atom, a fluorine atom, a bromine atom, a methyl group, a methoxy group, a cyano group, and a phenyl group. Substituent in the compound at least one atom or group. Further, as the diamine, a silicon diamine may be selected in order to improve the adhesion to the substrate. Examples of silamine include bis (4-aminophenyl) dimethylsilane, bis (4-aminophenyl) tetramethylsiloxane, and bis (4-aminophenyl) tetrasiloxane. Methyldisilazane, bis (γ-aminopropyl) tetramethyldisilaxane, 1,4-bis (γ-aminopropyldimethylsilyl) benzene, bis (4-amino Butyl) tetramethyldisilazane, bis (γ-aminopropyl) tetraphenyldisilazane, and the like. Also, as having X ₃ (COOH) ₂ Or X ₄ (COOH) ₂ Structure of the preferred dicarboxylic acid, including X ₃ And X ₄ Aliphatic or aromatic groups having a linear, branched, or cyclic structure, respectively. Among them, an organic group having 2 or more and 40 or less carbon atoms, which may contain an aromatic ring or an aliphatic ring, is preferred, and X ₃ And X ₄ Each can be preferably from the following formula (38): [化 27] {Where R ₄₁ Means selected from -CH ₂ -, -O-, -S-, -SO ₂ -, -CO-, -NHCO- and -C (CF ₃ ) ₂ -The divalent base in the formed group} is selected from the aromatic groups represented by the groups, which is preferable in terms of the sensitivity characteristics. The polyoxazole precursor may also be a terminal end group terminated with a specific organic group. In the case of using a polyoxazole precursor blocked with a capping group, it is expected that the physical properties (especially elongation) and the shape of the hardened relief pattern of the coating film after the heat curing of the photosensitive resin composition of the present invention will be changed. Well. As a preferable example of such a capping group, the following formula (39) can be enumerated: Represented. The polystyrene-equivalent weight average molecular weight of the polyoxazole precursor based on gel permeation chromatography is preferably 3,000 to 70,000, and more preferably 6,000 to 50,000. The weight average molecular weight is preferably 3,000 or more from the viewpoint of physical properties of the hardened relief pattern. From the viewpoint of resolvability, it is preferably 70,000 or less. As a developing solvent for gel permeation chromatography, tetrahydrofuran and N-methyl-2-pyrrolidone are recommended. The molecular weight was determined from a calibration curve prepared using a standard monodisperse polystyrene. As the standard monodisperse polystyrene, it is recommended to select from the organic solvent series standard sample STANDARD SM-105 manufactured by Showa Denko Corporation. [(A) Polyimide] Another example of a preferable (A) resin in the photosensitive resin composition of the present invention has the general formula (6): [Chem. 29] {Where, X ₅ Represents a 4- to 14-valent organic group, Y ₅ Represents a 2- to 12-valent organic group, R ₁₀ And R ₁₁ Represents an organic group having at least one group selected from a phenolic hydroxyl group, a sulfonic acid group, or a thiol group, and may be the same or different, n ₅ Is an integer from 3 to 200, and m ₃ And m ₄ Polyimide having a structure represented by an integer of 0 to 10}. Here, the resin represented by the general formula (6) does not need to undergo a chemical change through a heat treatment step when it exhibits sufficient film characteristics, and is therefore suitable for processing at a lower temperature, and is particularly preferred in this respect. X in the structural unit represented by the above general formula (6) ₅ A 4- to 14-valent organic group having 4 to 40 carbon atoms is preferred, and in terms of both heat resistance and photosensitivity, an aromatic ring or aliphatic ring containing 5 to 40 carbon atoms is more preferred. Of its organic base. The polyfluorene imide represented by the general formula (6) can be used with diamines, corresponding diisocyanate compounds, and trimethylsilane, such as tetracarboxylic acids, corresponding tetracarboxylic dianhydrides, and tetracarboxylic diester dichlorides. It is obtained by reacting a diacylated diamine. In general, polyimide can be chemically treated by heating or acid or alkali by subjecting polyimide as one of the polyimide precursors obtained by the reaction of tetracarboxylic dianhydride and diamine. And dehydration closed loop is obtained. Examples of suitable tetracarboxylic dianhydrides include pyromellitic dianhydride, 3,3 ', 4,4'-biphenyltetracarboxylic dianhydride, 2,3,3', 4'-biphenyl Tetracarboxylic dianhydride, 2,2 ', 3,3'-biphenyltetracarboxylic dianhydride, 3,3', 4,4'-benzophenonetetracarboxylic dianhydride, 2,2 ' , 3,3'-benzophenone tetracarboxylic dianhydride, 2,2-bis (3,4-dicarboxyphenyl) propane dianhydride, 2,2-bis (2,3-dicarboxyphenyl) ) Propane dianhydrous, 1,1-bis (3,4-dicarboxyphenyl) ethane dianhydrous, 1,1-bis (2,3-dicarboxyphenyl) ethane dianhydrous, bis ( 3,4-dicarboxyphenyl) methane dianhydrous, bis (2,3-dicarboxyphenyl) methane dianhydrous, bis (3,4-dicarboxyphenyl) fluorene dianhydrous, bis (3, 4-dicarboxyphenyl) ether dianhydride, 1,2,5,6-naphthalenetetracarboxylic dianhydride, 9,9-bis (3,4-dicarboxyphenyl) acetic acid dianhydride, 9,9 -Bis {4- (3,4-dicarboxyphenoxy) phenyl} arsinic dianhydride, 2,3,6,7-naphthalenetetracarboxylic dianhydride, 2,3,5,6-pyridinetetracarboxylic acid Aromatic tetracarboxylic dianhydride such as acid dianhydride, 3,4,9,10-fluorenetetracarboxylic dianhydride, 2,2-bis (3,4-dicarboxyphenyl) hexafluoropropane dianhydride, or Butane tetracarboxylic dianhydride, 1,2,3,4-cyclopentane tetracarboxylic dianhydride and other fats Group tetracarboxylic dianhydride, 3,3 ', 4,4'-diphenylphosphonium tetracarboxylic dianhydride and the following general formula (40): [化 30] {Where R ₄₂ Is selected from the group consisting of an oxygen atom, C (CF ₃ ) ₂ , C (CH ₃ ) ₂ Or SO ₂ In the base, and R ₄₃ And R ₄₄ It may be the same or different, and represents a compound represented by a group selected from a hydrogen atom, a hydroxyl group, or a thiol group}. Among these, 3,3 ', 4,4'-biphenyltetracarboxylic dianhydride, 2,3,3', 4'-biphenyltetracarboxylic dianhydride, and 2,2 'are preferred. , 3,3'-biphenyltetracarboxylic dianhydride, 3,3 ', 4,4'-benzophenone tetracarboxylic dianhydride, 2,2', 3,3'-benzophenone tetra Carboxylic dianhydride, 2,2-bis (3,4-dicarboxyphenyl) propane dianhydrous, 2,2-bis (2,3-dicarboxyphenyl) propane dianhydrous, 1,1-bis (3,4-Dicarboxyphenyl) ethane dianhydrous, 1,1-bis (2,3-dicarboxyphenyl) ethane dianhydrous, bis (3,4-dicarboxyphenyl) methane di Anhydrous, bis (2,3-dicarboxyphenyl) methane dianhydrous, bis (3,4-dicarboxyphenyl) fluorene dianhydrous, bis (3,4-dicarboxyphenyl) ether dianhydrous , 2,2-bis (3,4-dicarboxyphenyl) hexafluoropropane dianhydride, 3,3 ', 4,4'-diphenylphosphonium tetracarboxylic dianhydride, 9,9-bis (3 , 4-dicarboxyphenyl) acetic acid dianhydride, 9,9-bis {4- (3,4-dicarboxyphenoxy) phenyl} acetic acid dianhydride and the following general formula (41) [Chem. 31 ] {Where R ₄₅ Is selected from the group consisting of an oxygen atom, C (CF ₃ ) ₂ , C (CH ₃ ) ₂ Or SO ₂ In the base, and R ₄₆ And R ₄₇ It may be the same or different, and represents an acid dianhydride having a structure selected from the group consisting of a hydrogen atom, a hydroxyl group, or a thiol group. These can be used alone or in combination of two or more. Y of the general formula (6) ₅ Represents a structural component of a diamine. The diamine represents a 2- to 12-valent organic group containing an aromatic ring or an aliphatic ring, and an organic group having 5 to 40 carbon atoms is preferred. Specific examples of the diamine include 3,4'-diaminodiphenyl ether, 4,4'-diaminodiphenyl ether, 3,4'-diaminodiphenylmethane, 4,4 '-Diaminodiphenylmethane, 3,4'-diaminodiphenylphosphonium, 4,4'-diaminodiphenylphosphonium, 3,4'-diaminodiphenylsulfide, 4 , 4'-Diaminodiphenylsulfide, 1,4-bis (4-aminophenoxy) benzene, phenylyne, m-phenylenediamine, p-phenylenediamine, 1,5-naphthalenediamine, 2 , 6-naphthalenediamine, bis (4-aminophenoxyphenyl) fluorene, bis (3-aminophenoxyphenyl) fluorene, bis (4-aminophenoxy) biphenyl, bis { 4- (4-aminophenoxy) phenyl} ether, 1,4-bis (4-aminophenoxy) benzene, 2,2'-dimethyl-4,4'-diamino group Benzene, 2,2'-diethyl-4,4'-diaminobiphenyl, 3,3'-dimethyl-4,4'-diaminobiphenyl, 3,3'-diethyl -4,4'-diaminobiphenyl, 2,2 ', 3,3'-tetramethyl-4,4'-diaminobiphenyl, 3,3', 4,4'-tetramethyl -4,4'-diaminobiphenyl, 2,2'-bis (trifluoromethyl) -4,4'-diaminobiphenyl, 9,9-bis (4-aminophenyl) fluorene Or a compound in which an aromatic ring is substituted with an alkyl group or a halogen atom, or an aliphatic cyclohexyldiamine, methylenebiscyclohexylamine, and the following (42): [Formula 32] {Where R ₄₈ Is selected from the group consisting of an oxygen atom, C (CF ₃ ) ₂ , C (CH ₃ ) ₂ Or SO ₂ In the base, and R ₄₉ ~ R ₅₂ It may be the same or different, and represents a diamine selected from the group consisting of a hydrogen atom, a hydroxyl group, or a thiol group}, and the like. Among these, 3,4'-diaminodiphenyl ether, 4,4'-diaminodiphenyl ether, 3,4'-diaminodiphenylmethane, and 4,4'- Diaminodiphenylmethane, 3,4'-diaminodiphenylphosphonium, 4,4'-diaminodiphenylphosphonium, 3,4'-diaminodiphenylsulfide, 4,4 '-Diaminodiphenyl sulfide, m-phenylenediamine, P-phenylenediamine, 1,4-bis (4-aminophenoxy) benzene, 9,9-bis (4-aminophenyl)茀, and the following general formula (43): {Where R ₅₃ Is selected from the group consisting of an oxygen atom, C (CF ₃ ) ₂ , C (CH ₃ ) ₂ Or SO ₂ In the base, and R ₅₄ ~ R ₅₇ Diamine which may be the same or different and represents a structure selected from the group consisting of a hydrogen atom, a hydroxyl group or a thiol group}. Of these, 3,4'-diaminodiphenyl ether, 4,4'-diaminodiphenyl ether, 3,4'-diaminodiphenylmethane, 4,4'- Diaminodiphenylmethane, 3,4'-diaminodiphenylphosphonium, 4,4'-diaminodiphenylphosphonium, 1,4-bis (4-aminophenoxy) benzene, And the following general formula (44): {Where R ₅₈ Is selected from the group consisting of an oxygen atom, C (CF ₃ ) ₂ , C (CH ₃ ) ₂ Or SO ₂ In the base, and R ₅₉ And R ₆₀ Diamine which may be the same or different and represents a structure selected from the group consisting of a hydrogen atom, a hydroxyl group or a thiol group}. These can be used alone or in combination of two or more. R of general formula (6) ₁₀ And R ₁₁ Represents a phenolic hydroxyl group, a sulfonic acid group, or a thiol group. In the present invention, as R ₁₀ And R ₁₁ The phenolic hydroxyl group, sulfonic acid group and / or thiol group can be mixed. By controlling R ₁₀ And R ₁₁ The amount of the alkali-soluble group is changed in the dissolution rate in the alkaline aqueous solution. Therefore, a photosensitive resin composition having a moderate dissolution rate can be obtained by the adjustment. Furthermore, in order to improve the adhesion to the substrate, it may be used as X within a range that does not reduce heat resistance. ₅ , Y ₅ The aliphatic groups having a siloxane structure are copolymerized. Specific examples include bis (3-aminopropyl) tetramethyldisilazane and bis (p-aminophenyl) octamethylpentasiloxane with 1 to 10 mole% as the diamine component. There are copolymers of alkanes and the like. After the polyfluorene imine is obtained by the following methods, the polyfluorene imide can be completely fluorinated by a known method, or the gas can be stopped in the middle. A method of introducing a part of fluorene imine structure (polyamine fluorene imine in this case) by amination reaction, or by blending a fully fluorinated polymer with the polyfluorene imine precursor A method of introducing a part of the fluorene imine structure is used for synthesis. The method for obtaining a polyfluorene imine precursor is as follows: for example, tetracarboxylic dianhydride and a diamine compound (a part of which is replaced by a terminal blocking agent as a monoamine) at low temperature Reaction; reacting a tetracarboxylic dianhydride (part of which is replaced with an end-capping agent as an acid anhydride or a monochloro compound or a monoactive ester compound) with a diamine compound at a low temperature; obtaining a dicarboxylic acid from a tetracarboxylic dianhydride and an alcohol Ester, which is then reacted with a diamine (part of which is replaced by a terminal blocking agent as a monoamine) in the presence of a condensing agent; a diester is obtained from a tetracarboxylic dianhydride and an alcohol, and then the remaining dicarboxylic acid is subjected to醯 Chlorinated to make it with diamine (a part of the Substituted with a terminal capping agent of monoamine) reaction. It is preferable that the said polyfluorene imide has a polyfluorene imine so that it may be 15% or more with respect to the whole resin which comprises a photosensitive resin composition. It is more preferably 20% or more. The fluorene imidization ratio herein refers to the ratio of fluorene imidization present in the entire resin constituting the photosensitive resin composition. If the ratio of imidization of fluorene is less than 15%, the amount of shrinkage during heat curing becomes large, which is not suitable for thick film production. The hydrazone imidization ratio can be easily calculated by the following method. First, the infrared absorption spectrum of the polymer was measured, and it was confirmed that there are absorption peaks (near 1780 cm-1, near 1377 cm-1) derived from the polyimide structure of the polyimide. Then, the polymer was heat-treated at 350 ° C for 1 hour, the infrared absorption spectrum after the heat treatment was measured, and the peak intensity near 1377 cm-1 was compared with the intensity before the heat treatment, thereby calculating the醯 imidization rate. When the molecular weight of the said polyimide is measured as a polystyrene conversion weight average molecular weight based on the gel permeation chromatography method, it is preferably 3,000-200,000, More preferably, it is 5,000-50,000. When the weight average molecular weight is 3,000 or more, the mechanical properties are good, and when the weight average molecular weight is 50,000 or less, the dispersibility in the developing solution is good, and the relief performance of the relief pattern is good. As a developing solvent for gel permeation chromatography, tetrahydrofuran and N-methyl-2-pyrrolidone are recommended. The molecular weight was determined from a calibration curve prepared using a standard monodisperse polystyrene. As the standard monodisperse polystyrene, it is recommended to select from the organic solvent series standard sample STANDARD SM-105 manufactured by Showa Denko Corporation. Furthermore, in the present invention, a phenol resin can also be preferably used. [(A) Phenol resin] The phenol resin in this embodiment means a resin having a repeating unit containing a phenolic hydroxyl group. (A) The phenol resin does not undergo a structural change such as polyimide precursors undergoing cyclization (sulfonimidization) during thermal curing, and therefore has the advantage of being able to harden at low temperatures (eg, 250 ° C or lower). In this embodiment, the weight average molecular weight of the (A) phenol resin is preferably 700 to 100,000, more preferably 1,500 to 80,000, and even more preferably 2,000 to 50,000. The weight average molecular weight is preferably 700 or more in terms of applicability of reflow soldering treatment of the cured film, and is preferably 100,000 or less in terms of alkali solubility of the photosensitive resin composition. The measurement of the weight average molecular weight herein can be performed by gel permeation chromatography (GPC) and calculated from a calibration curve prepared using standard polystyrene. (A) The phenol resin is preferably selected from the group consisting of novolac, polyhydroxystyrene from the viewpoints of solubility in an alkaline aqueous solution, sensitivity and resolution when forming a resist pattern, and residual stress of a cured film. And has the following general formula (7): {Where a is an integer from 1 to 3, b is an integer from 0 to 3, 1 ≦ (a + b) ≦ 4, R ₁₂ A monovalent substituent selected from the group consisting of a monovalent organic group having 1 to 20 carbon atoms, a halogen atom, a nitro group, and a cyano group. When b is 2 or 3, a plurality of R ₁₂ They may be the same as or different from each other. X represents a group selected from a divalent aliphatic group having 2 to 10 carbon atoms which may have an unsaturated bond, a divalent alicyclic group having 3 to 20 carbon atoms, and the following general formula ( 8): [化 36] (In the formula, p is an integer of 1 to 10.) The divalent organic group represented by a divalent alkoxy group represented by a divalent group and a divalent organic group having an aromatic ring having 6 to 12 carbon atoms. At least one of a phenol resin having a repeating unit represented by the group} and a phenol resin modified with a compound having an unsaturated hydrocarbon group having 4 to 100 carbon atoms. (Novolac) As used herein, novolac means the entire polymer obtained by condensing phenols and formaldehyde in the presence of a catalyst. Generally, a novolac can be obtained by condensing 1 mol of phenols with formaldehyde less than 1 mol relative to the phenols. Examples of the phenols include phenol, o-cresol, m-cresol, p-cresol, o-ethylphenol, m-ethylphenol, p-ethylphenol, o-butylphenol, m-butylphenol, and p-butylphenol. Phenol, 2,3-xylenol, 2,4-xylenol, 2,5-xylenol, 2,6-xylenol, 3,4-xylenol, 3,5-xylenol , 2,3,5-trimethylphenol, 3,4,5-trimethylphenol, catechol, resorcinol, pyrogallol, α-naphthol, β-naphthol and the like. Specific examples of the novolak include phenol / formaldehyde condensation novolac resin, cresol / formaldehyde condensation novolac resin, phenol-naphthol / formaldehyde condensation novolac resin, and the like. The weight average molecular weight of the novolac is preferably 700 to 100,000, more preferably 1,500 to 80,000, and even more preferably 2,000 to 50,000. The weight average molecular weight is preferably 700 or more in terms of applicability of reflow soldering treatment of the cured film, and is preferably 100,000 or less in terms of alkali solubility of the photosensitive resin composition. (Polyhydroxystyrene) As used herein, the term "polyhydroxystyrene" means the entire polymer containing hydroxystyrene as a polymerization unit. Preferred examples of the polyhydroxystyrene include poly-p-vinylphenol. Poly-p-vinylphenol means the entire polymer containing p-vinylphenol as a polymerized unit. Therefore, as long as the object of the present invention is not violated, polyhydroxystyrene (for example, poly-p-vinylphenol) may be constituted by using polymerized units other than hydroxystyrene (for example, p-vinylphenol). In the polyhydroxystyrene, the ratio of the number of moles of the hydroxystyrene units based on the number of moles of all the polymerized units is preferably 10 mol% to 99 mol%, more preferably 20 to 97 mol%, It is more preferably 30 to 95 mole%. When the above ratio is 10 mol% or more, it is advantageous from the viewpoint of alkali solubility of the photosensitive resin composition. When it is 99 mol% or less, the composition containing the following copolymerization component is hardened. This is advantageous from the standpoint of reflow solderability of the resulting cured film. The polymerization unit other than hydroxystyrene (for example, p-vinylphenol) may be any polymerization unit capable of copolymerizing with hydroxystyrene (for example, p-vinylphenol). The copolymerization component for forming a polymerization unit other than hydroxystyrene (for example, p-vinylphenol) is not limited, and examples thereof include methyl acrylate, methyl methacrylate, hydroxyethyl acrylate, butyl methacrylate, and acrylic acid. Octyl ester, 2-ethoxyethyl methacrylate, tertiary butyl acrylate, 1,5-pentanediol diacrylate, N, N-diethylaminoethyl acrylate, ethylene glycol diacrylate , 1,3-propanediol diacrylate, decanediol diacrylate, decanediol dimethacrylate, 1,4-cyclohexanediol diacrylate, 2,2-dimethylolpropane diacrylate , Glycerin diacrylate, tripropylene glycol diacrylate, glycerin triacrylate, 2,2-di (p-hydroxyphenyl) propane dimethacrylate, triethylene glycol diacrylate, polyoxyethyl-2- 2-di (p-hydroxyphenyl) propane dimethacrylate, triethylene glycol dimethacrylate, polyoxypropyl trimethylolpropane triacrylate, ethylene glycol dimethacrylate, succinic acid Alcohol dimethacrylate, 1,3-propanediol dimethacrylate, butanediol dimethacrylate 1,3-propanediol dimethacrylate, 1,2,4-butanetriol trimethacrylate, 2,2,4-trimethyl-1,3-pentanediol dimethacrylate, pentaerythritol Trimethacrylate, 1-phenylethylene dimethacrylate, pentaerythritol tetramethacrylate, trimethylolpropane trimethacrylate, 1,5-pentanediol dimethyl Esters of acrylic acid and acrylic acid such as 1,4-benzenediol dimethacrylate; styrene and substituted styrenes such as 2-methylstyrene and vinyltoluene; such as vinyl acrylate and Vinyl ester monomers such as vinyl methacrylate; and o-vinylphenol, m-vinylphenol, etc. As the novolac and polyhydroxystyrene described above, one species may be used alone, or two or more species may be used in combination. The weight average molecular weight of the polyhydroxystyrene is preferably 700 to 100,000, more preferably 1,500 to 80,000, and still more preferably 2,000 to 50,000. The weight average molecular weight is preferably 700 or more in terms of applicability of reflow soldering treatment of the cured film, and is preferably 100,000 or less in terms of alkali solubility of the photosensitive resin composition. (Phenol resin represented by general formula (7)) In this embodiment, the (A) phenol resin also preferably contains the following general formula (7): {Where a is an integer from 1 to 3, b is an integer from 0 to 3, 1 ≦ (a + b) ≦ 4, R ₁₂ A monovalent substituent selected from the group consisting of a monovalent organic group having 1 to 20 carbon atoms, a halogen atom, a nitro group, and a cyano group. When b is 2 or 3, a plurality of R ₁₂ They may be the same as or different from each other. X represents a group selected from a divalent aliphatic group having 2 to 10 carbon atoms which may have an unsaturated bond, a divalent alicyclic group having 3 to 20 carbon atoms, and the following general formula ( 8): [Chem. 38] (In the formula, p is an integer of 1 to 10.) The divalent organic group represented by a divalent alkoxy group represented by a divalent group and a divalent organic group having an aromatic ring having 6 to 12 carbon atoms. A phenol resin having a repeating unit represented by}. A phenol resin having the above-mentioned repeating unit can harden at a lower temperature than, for example, previously used polyimide resins and polybenzoxazole resins, and can form a cured film having a good elongation, which is particularly special in this respect. advantageous. The above-mentioned repeating unit in the phenol resin molecule may be one type or a combination of two or more types. In the general formula (7), R ₁₂ From the viewpoint of reactivity when synthesizing a resin of the general formula (7), it is a monovalent substitution selected from the group consisting of a monovalent organic group having 1 to 20 carbon atoms, a halogen atom, a nitro group, and a cyano group. base. R ₁₂ From the viewpoint of alkali solubility, it is preferably selected from the group consisting of a halogen atom, a nitro group, a cyano group, an aliphatic group having 1 to 10 carbon atoms, an aromatic group having 6 to 20 carbon atoms, and The following general formula (45): {Where R ₆₁ , R ₆₂ And R ₆₃ Each independently represents a hydrogen atom, an aliphatic group having 1 to 10 carbon atoms which may have an unsaturated bond, an alicyclic group having 3 to 20 carbon atoms, or an aromatic group having 6 to 20 carbon atoms, and R ₆₄ A bivalent aliphatic group having 1 to 10 carbon atoms, a bivalent alicyclic group having 3 to 20 carbon atoms, or a bivalent aromatic group having 6 to 20 carbon atoms, which may have an unsaturated bond} A monovalent substituent in a group of four groups. In the present embodiment, in the general formula (7), a is an integer of 1 to 3, but in terms of alkali solubility and elongation, 2 is preferred. When a is 2, the substitution positions of the hydroxyl groups may be any of the ortho, meta, and para positions. In addition, when a is 3, the substitution positions of the hydroxyl groups may be any positions such as the 1,2,3-position, the 1,2,4-position, and the 1,3,5-position. In this embodiment, when a is 1 in the general formula (7), in order to improve alkali solubility, a phenol resin (hereinafter also referred to as (a1) having a repeating unit represented by the general formula (7) may be used. Resin) is further mixed with a phenol resin (hereinafter also referred to as (a2) resin) selected from novolac and polyhydroxystyrene. The mixing ratio of (a1) resin and (a2) resin is preferably in the range of (a1) / (a2) = 10/90 to 90/10 in terms of mass ratio. The mixing ratio is preferably (a1) / (a2) = 10/90 to 90/10, and more preferably (a1) / from the viewpoint of solubility in an alkaline aqueous solution and elongation of the cured film. (a2) = 20/80 to 80/20, and more preferably (a1) / (a2) = 30/70 to 70/30. Regarding the novolac and polyhydroxystyrene as the above-mentioned (a2) resin, the same resins as those shown in the above-mentioned (Novolac) and (Polyhydroxystyrene) can be used. In this embodiment, in the general formula (7), b is an integer of 0 to 3, but from the viewpoint of alkali solubility and elongation, it is preferably 0 or 1. When b is 2 or 3, a plurality of R ₁₂ They may be the same or different from each other. Furthermore, in this embodiment, in the general formula (7), a and b satisfy the relationship of 1 ≦ (a + b) ≦ 4. In the present embodiment, in the general formula (7), X is a divalent fat selected from the viewpoint of the shape of the hardened embossed pattern and the elongation of the hardened film. Consisting of a group group, a divalent alicyclic group having 3 to 20 carbon atoms, an alkoxy group represented by the general formula (8), and a divalent organic group having an aromatic ring having 6 to 12 carbon atoms Divalent organic group in the group. Among these divalent organic groups, from the viewpoint of the toughness of the cured film, X is preferably selected from the following general formula (9): {Where R ₁₃ , R ₁₄ , R ₁₅ And R ₁₆ Each is independently a hydrogen atom, a monovalent aliphatic group having 1 to 10 carbon atoms, or a monovalent aliphatic group having 1 to 10 carbon atoms in which a part or all of a hydrogen atom is substituted with a fluorine atom, n ₆ Is an integer from 0 to 4, and n ₆ R when it is an integer from 1 to 4 ₁₇ A halogen atom, a hydroxyl group, or a monovalent organic group having 1 to 12 carbon atoms, at least one R ₁₇ Is hydroxyl, n ₆ Plural R in the case of an integer of 2 to 4 ₁₇ They may be the same or different from each other} the divalent base represented by} and the following general formula (10): [化 41] {Where R ₁₈ , R ₁₉ , R ₂₀ And R _{twenty one} Each independently represents a hydrogen atom, a monovalent aliphatic group having 1 to 10 carbon atoms, or a monovalent aliphatic group having 1 to 10 carbon atoms in which a part or all of a hydrogen atom is substituted with a fluorine atom, W is a single A bond, selected from an aliphatic group having 1 to 10 carbon atoms which may be substituted with a fluorine atom, an alicyclic group having 3 to 20 carbon atoms which may be substituted with a fluorine atom, and the following general formula (8): (Wherein p is an integer of 1 to 10) and a divalent alkoxy group represented by the following formula (11): [Chem 43] Divalent organic group in the group consisting of divalent bases shown} Divalent organic group in the group consisting of divalent bases represented by divalent bases}. The carbon number of the divalent organic group X having the aromatic ring having 6 to 12 carbon atoms is preferably 8 to 75, and more preferably 8 to 40. In addition, the structure of the divalent organic group X having an aromatic ring having 6 to 12 carbon atoms is generally different from the structure in which the OH group and arbitrary R are bonded to the aromatic ring in the general formula (7). ₁₂ Foundation structure. Further, the divalent organic group represented by the general formula (10) is more preferably the following formula (12) from the viewpoints of good pattern formation properties of the resin composition and good elongation of the cured film after curing: [Chemical 44] The represented divalent organic group is more preferably the following formula (13): [Chem 45] The indicated divalent organic group. Among the structures represented by the general formula (7), X is particularly preferably the structure represented by the above formula (12) or (13), and the ratio of the portion of X represented by the structure represented by the formula (12) or (13) is From the viewpoint of elongation, it is preferably 20% by mass or more, and more preferably 30% by mass or more. From the viewpoint of alkali solubility of the composition, the above ratio is preferably 80% by mass or less, and more preferably 70% by mass or less. Among the phenol resins having the structure represented by the general formula (7), from the viewpoint of alkali solubility of the composition and elongation of the cured film, it is particularly preferable to have the following general formula in the same resin skeleton. The structure represented by the formula (14) and the structure represented by the following general formula (15) are both structures. [Chemical 46] {Where R _{twenty one} A monovalent group of 1 to 10 carbon atoms selected from the group consisting of a hydrocarbon group and an alkoxy group, n ₇ 2 or 3, n ₈ Is an integer from 0 to 2, m ₅ Is an integer from 1 to 500, 2 ≦ (n ₇ + N ₈ ) ≦ 4 in n ₈ In case of 2, plural R _{twenty one} May be the same or different from each other} [化 47] {Where R _{twenty two} And R _{twenty three} Each is independently a monovalent group having 1 to 10 carbon atoms selected from the group consisting of a hydrocarbon group and an alkoxy group, n ₉ Is an integer from 1 to 3, n ₁₀ An integer from 0 to 2, n ₁₁ Is an integer from 0 to 3, m ₆ Is an integer from 1 to 500, 2 ≦ (n ₉ + N ₁₀ ) ≦ 4 in n ₁₀ In case of 2, plural R _{twenty two} May be the same or different from each other, n ₁₁ When it is 2 or 3, plural R _{twenty three} May be the same or different from each other} m of the above general formula (14) ₅ And m of the above general formula (15) ₆ Represents the total number of the respective repeating units in the main chain of the phenol resin. That is, in the (A) phenol resin, for example, the repeating unit in the brackets in the structure represented by the general formula (14) and the repeating unit in the brackets in the structure represented by the general formula (15) may be random and embedded. Segments or combinations of these. m ₅ And m ₆ They are each independently an integer of 1 to 500, and the lower limit value is preferably 2, more preferably 3, and the upper limit value is preferably 450, more preferably 400, and even more preferably 350. m ₅ And m ₆ From the viewpoint of the toughness of the cured film, it is preferably independently 2 or more, and from the viewpoint of solubility in an alkaline aqueous solution, 450 or less is preferred. m ₅ With m ₆ The total is preferably 2 or more, more preferably 4 or more, and even more preferably 6 or more from the viewpoint of the toughness of the cured film, and more preferably from the viewpoint of solubility in an alkaline aqueous solution. It is 200 or less, more preferably 175 or less, and even more preferably 150 or less. Among the (A) phenol resins having both the structure represented by the general formula (14) and the structure represented by the general formula (15) in the same resin skeleton, the structure represented by the general formula (14) The higher the ear ratio, the better the physical properties of the cured film and the better the heat resistance. On the other hand, the higher the molar ratio of the structure represented by the general formula (15), the better the alkali solubility and the cured The better the pattern shape. Therefore, the ratio m of the structure represented by the general formula (14) to the structure represented by the general formula (15) ₅ / m ₆ From the viewpoint of the physical properties of the cured film, it is preferably 20/80 or more, more preferably 40/60 or more, and even more preferably 50/50 or more. From the viewpoint of alkali solubility and the shape of the hardened relief pattern, It is preferably 90/10 or less, more preferably 80/20 or less, and still more preferably 70/30 or less. A phenol resin having a repeating unit represented by the general formula (7) typically includes a phenol compound and a copolymerization component (specifically, a compound selected from compounds having an aldehyde group (including compounds that decompose to form aldehyde compounds like trioxane). 1 of the group consisting of a compound having a keto group, a compound having 2 hydroxymethyl groups in the molecule, a compound having 2 alkoxymethyl groups in the molecule, and a compound having 2 haloalkyl groups in the molecule The above compounds) are more typically synthesized by polymerizing a monomer component including these. For example, a phenol and / or a phenol derivative (hereinafter also collectively referred to as a "phenol compound") and an aldehyde compound, a ketone compound, a methylol compound, an alkoxymethyl compound, a diene compound, or a haloalkyl group can be used as described below. A copolymerization component such as a compound is polymerized to obtain (A) a phenol resin. In this case, in the general formula (7), an OH group and an arbitrary R are bonded to the aromatic ring. ₁₂ The part represented by the structure of the radical is derived from the above-mentioned phenol compound, and the part represented by X is derived from the above-mentioned copolymerization component. From the viewpoints of reaction control and stability of the obtained (A) phenol resin and photosensitive resin composition, the molar ratio (phenol compound): (copolymerization component) of the phenol compound and the above-mentioned copolymerization component is preferably: 5: 1 to 1.01: 1, more preferably 2.5: 1 to 1.1: 1. The weight average molecular weight of the phenol resin having a repeating unit represented by the general formula (7) is preferably 700 to 100,000, more preferably 1,500 to 80,000, and still more preferably 2,000 to 50,000. The weight average molecular weight is preferably 700 or more in terms of applicability of reflow soldering treatment of the cured film, and is preferably 100,000 or less in terms of alkali solubility of the photosensitive resin composition. Examples of the phenol compound that can be used to obtain a phenol resin having a repeating unit represented by the general formula (7) include cresol, ethylphenol, propylphenol, butylphenol, pentylphenol, cyclohexylphenol, and a hydroxyl group. Biphenyl, benzylphenol, nitrobenzylphenol, cyanobenzylphenol, adamantanephenol, nitrophenol, fluorophenol, chlorophenol, bromophenol, trifluoromethylphenol, N- (hydroxyphenyl)- 5-nor &#158665; ene-2,3-dicarboxyamidoimine, N- (hydroxyphenyl) -5-methyl-5-nor &#158665; ene-2,3-dicarboxyamidoimine , Trifluoromethylphenol, hydroxybenzoic acid, methyl hydroxybenzoate, ethyl hydroxybenzoate, benzyl hydroxybenzoate, hydroxybenzamide, hydroxybenzaldehyde, hydroxyacetophenone, hydroxybenzophenone, Hydroxybenzonitrile, resorcinol, xylenol, catechol, methylcatechol, ethylcatechol, hexylcatechol, benzylcatechol, nitrobenzylcatechol, methylol Resorcinol, ethylresorcinol, hexylresorcinol, benzylresorcinol, nitrobenzylresorcinol, hydroquinone, caffeic acid, dihydroxybenzoic acid, dihydroxybenzoic acid Methyl ester, ethyl dihydroxybenzoate, butyl dihydroxybenzoate, propyl dihydroxybenzoate, benzyl dihydroxybenzoate, dihydroxybenzamide, dihydroxybenzaldehyde, dihydroxyacetophenone, Hydroxybenzophenone, dihydroxybenzonitrile, N- (dihydroxyphenyl) -5-nor &#158665; ene-2,3-dicarboxyfluorenimine, N- (dihydroxyphenyl) -5 -Methyl-5-nor &#158665; ene-2,3-dicarboxyfluorenimine, nitrocatechol, fluorocatechol, chlorocatechol, bromocatechol, trifluoromethylcatechin Phenol, nitroresorcinol, fluororesorcinol, chlororesorcinol, bromoresorcinol, trifluoromethylresorcinol, pyrogallol, resorcinol, 1,2, 4-trihydroxybenzene, trihydroxybenzoic acid, methyl trihydroxybenzoate, ethyl trihydroxybenzoate, butyl trihydroxybenzoate, propyl trihydroxybenzoate, benzyl trihydroxybenzoate, trihydroxybenzoate Triamine, trihydroxybenzaldehyde, trihydroxyacetophenone, trihydroxybenzophenone, trihydroxybenzonitrile, etc. Examples of the aldehyde compound include acetaldehyde, propionaldehyde, trimethylacetaldehyde, butyraldehyde, valeraldehyde, hexanal, trioxane, glyoxal, cyclohexanal, diphenylacetaldehyde, and ethyl. Butyraldehyde, benzaldehyde, glyoxylic acid, 5-nor &#158665; ene-2-carboxyaldehyde, malonaldehyde, succinaldehyde, glutaraldehyde, salicylaldehyde, naphthaldehyde, terephthalaldehyde, etc. Examples of the ketone compound include acetone, methyl ethyl ketone, diethyl ketone, dipropyl ketone, dicyclohexyl ketone, dibenzyl ketone, cyclopentanone, cyclohexanone, dicyclohexanone, and cyclo Hexanedione, 3-butyn-2-one, 2-nor ketone, amantadone, 2,2-bis (4-oxelanyl) propane, and the like. Examples of the methylol compound include 2,6-bis (hydroxymethyl) p-cresol, 2,6-bis (hydroxymethyl) -4-ethylphenol, and 2,6-bis (hydroxymethyl) ) -4-propylphenol, 2,6-bis (hydroxymethyl) -4-n-butylphenol, 2,6-bis (hydroxymethyl) -4-third butylphenol, 2,6- Bis (hydroxymethyl) -4-methoxyphenol, 2,6-bis (hydroxymethyl) -4-ethoxyphenol, 2,6-bis (hydroxymethyl) -4-propoxyphenol, 2,6-bis (hydroxymethyl) -4-n-butoxyphenol, 2,6-bis (hydroxymethyl) -4-third-butoxyphenol, 1,3-bis (hydroxymethyl) urea , Ribitol, arabinitol, alosol, 2,2-bis (hydroxymethyl) butanoic acid, 2-benzyloxy-1,3-propanediol, 2,2-dimethyl-1,3-propanediol , 2,2-diethyl-1,3-propanediol, glyceryl monoacetate, 2-methyl-2-nitro-1,3-propanediol, 5-nor &#158665; ene-2,2-di Methanol, 5-nor &#158665; ene-2,3-dimethanol, pentaerythritol, 2-phenyl-1,3-propanediol, trimethylolethane, trimethylolpropane, 3,6-bis ( (Hydroxymethyl) mesitylene, 2-nitro-p-xylylene glycol, 1,10-dihydroxydecane, 1,12-dihydroxydodecane, 1,4-bis (hydroxymethyl) cyclohexyl , 1,4-bis (hydroxymethyl) cyclohexene, 1,6-bis (hydroxymethyl) adamantane, 1,4-benzenedimethanol, 1,3-benzenedimethanol, 2,6-bis ( (Hydroxymethyl) -1,4-dimethoxybenzene, 2,3-bis (hydroxymethyl) naphthalene, 2,6-bis (hydroxymethyl) naphthalene, 1,8-bis (hydroxymethyl) anthracene , 2,2'-bis (hydroxymethyl) diphenyl ether, 4,4'-bis (hydroxymethyl) diphenyl ether, 4,4'-bis (hydroxymethyl) diphenyl sulfide, 4,4 '-Bis (hydroxymethyl) benzophenone, 4-hydroxymethylbenzoic acid-4'-hydroxymethylphenyl ester, 4-hydroxymethylbenzoic acid-4'-hydroxymethylaniline, 4,4' -Bis (hydroxymethyl) phenylurea, 4,4'-bis (hydroxymethyl) phenylcarbamate, 1,8-bis (hydroxymethyl) anthracene, 4,4'-bis (hydroxy (Methyl) biphenyl, 2,2'-dimethyl-4,4'-bis (hydroxymethyl) biphenyl, 2,2-bis (4-hydroxymethylphenyl) propane, ethylene glycol, di Ethylene glycol, triethylene glycol, tetraethylene glycol, propylene glycol, dipropylene glycol, tripropylene glycol, tetrapropylene glycol, and the like. Examples of the alkoxymethyl compound include 2,6-bis (methoxymethyl) p-cresol, 2,6-bis (methoxymethyl) -4-ethylphenol, and 2, 6-bis (methoxymethyl) -4-propylphenol, 2,6-bis (methoxymethyl) -4-n-butylphenol, 2,6-bis (methoxymethyl)- 4-tert-butylphenol, 2,6-bis (methoxymethyl) -4-methoxyphenol, 2,6-bis (methoxymethyl) -4-ethoxyphenol, 2, 6-bis (methoxymethyl) -4-propoxyphenol, 2,6-bis (methoxymethyl) -4-n-butoxyphenol, 2,6-bis (methoxymethyl) ) -4-Third-butoxyphenol, 1,3-bis (methoxymethyl) urea, 2,2-bis (methoxymethyl) butanoic acid, 2,2-bis (methoxymethoxy) Group) -5-nor &#158665; ene, 2,3-bis (methoxymethyl) -5-nor &#158665; ene, 1,4-bis (methoxymethyl) cyclohexane, 1,4-bis (methoxymethyl) cyclohexene, 1,6-bis (methoxymethyl) adamantane, 1,4-bis (methoxymethyl) benzene, 1,3-bis (Methoxymethyl) benzene, 2,6-bis (methoxymethyl) -1,4-dimethoxybenzene, 2,3-bis (methoxymethyl) naphthalene, 2,6- Bis (methoxymethyl) naphthalene, 1,8-bis (methoxymethyl) anthracene, 2,2'-bis (methoxymethyl) diphenyl ether, 4 , 4'-bis (methoxymethyl) diphenyl ether, 4,4'-bis (methoxymethyl) diphenyl sulfide, 4,4'-bis (methoxymethyl) diphenyl Ketone, 4-methoxymethylbenzoic acid-4'-methoxymethylphenyl, 4-methoxymethylbenzoic acid-4'-methoxymethylaniline, 4,4'-bis ( Methoxymethyl) phenylurea, 4,4'-bis (methoxymethyl) phenylcarbamate, 1,8-bis (methoxymethyl) anthracene, 4,4'- Bis (methoxymethyl) biphenyl, 2,2'-dimethyl-4,4'-bis (methoxymethyl) biphenyl, 2,2-bis (4-methoxymethylbenzene) Base) propane, ethylene glycol dimethyl ether, diethylene glycol dimethyl ether, triethylene glycol dimethyl ether, tetraethylene glycol dimethyl ether, propylene glycol dimethyl ether, dipropylene glycol dimethyl ether, tripropylene glycol dimethyl ether Ether, tetrapropylene glycol dimethyl ether, and the like. Examples of the diene compound include butadiene, pentadiene, hexadiene, heptadiene, octadiene, 3-methyl-1,3-butadiene, and 1,3-butanediol. -Dimethacrylate, 2,4-hexadiene-1-ol, methylcyclohexadiene, cyclopentadiene, cyclohexadiene, cycloheptadiene, cyclooctadiene, dicyclopentadiene Ene, 1-hydroxydicyclopentadiene, 1-methylcyclopentadiene, methyldicyclopentadiene, diallyl ether, diallyl sulfide, diallyl adipate, 2, 5-nor &#158665; diene, tetrahydroindene, 5-ethylidene-2-nor &#158665; ene, 5-vinyl-2-nor &#158665; ene, triallyl cyanurate Esters, diallyl isocyanurate, diallyl isocyanate, diallyl isocyanate, and the like. Examples of the haloalkyl compound include dichloroxylene, bischloromethyldimethoxybenzene, bischloromethyl mesitylene, bischloromethylbiphenyl, and bischloromethyl-biphenylcarboxylic acid. Acid, bischloromethyl-biphenyldicarboxylic acid, bischloromethyl-methylbiphenyl, bischloromethyl-dimethylbiphenyl, bischloromethylanthracene, ethylene glycol bis (chloroethyl) Ether, diethylene glycol bis (chloroethyl) ether, triethylene glycol bis (chloroethyl) ether, tetraethylene glycol bis (chloroethyl) ether, and the like. (A) A phenol resin can be obtained by condensing the above-mentioned phenol compound and copolymerization component by dehydration, dehydrohalogenation, or dealcoholization, or polymerizing the unsaturated bond while breaking the unsaturated bond, and a catalyst can also be used during polymerization. . Examples of the acidic catalyst include hydrochloric acid, sulfuric acid, nitric acid, phosphoric acid, phosphorous acid, methanesulfonic acid, p-toluenesulfonic acid, dimethyl sulfuric acid, diethyl sulfuric acid, acetic acid, oxalic acid, and 1-hydroxyethylene. -1,1'-diphosphonic acid, zinc acetate, boron trifluoride, boron trifluoride-phenol complex, boron trifluoride-ether complex, and the like. On the other hand, examples of the alkaline catalyst include lithium hydroxide, sodium hydroxide, potassium hydroxide, calcium hydroxide, barium hydroxide, sodium carbonate, triethylamine, pyridine, 4-N, N- Dimethylaminopyridine, piperidine, piperidine, 1,4-diazabicyclo [2.2.2] octane, 1,8-diazabicyclo [5.4.0] -7-11 Ene, 1,5-diazabicyclo [4.3.0] -5-nonene, ammonia, hexamethylenetetramine, etc. The amount of the catalyst used to obtain a phenol resin having a repeating structure represented by the general formula (7) is preferably an aldehyde compound, relative to the total mole number of the copolymerization components (ie, components other than the phenol compound), The total mole number of the ketone compound, methylol compound, alkoxymethyl compound, diene compound, and haloalkyl compound is 100 mole%, preferably in the range of 0.01 mole% to 100 mole%. (A) In the synthesis reaction of a phenol resin, the reaction temperature is usually preferably in the range of 40 ° C to 250 ° C, more preferably in the range of 100 ° C to 200 ° C, and the reaction time is preferably about 1 to 10 hours. If necessary, a solvent capable of sufficiently dissolving the resin can be used. Furthermore, the phenol resin having a repeating structure represented by the general formula (7) may be a polymerized phenol compound that does not become a raw material of the structure of the general formula (7) within a range that does not impair the effect of the present invention. The range in which the effect of the present invention is not impaired is, for example, 30% or less of the total number of moles of the phenol compound that becomes the raw material of the (A) phenol resin. (Phenol resin modified with a compound having an unsaturated hydrocarbon group having 4 to 100 carbon atoms) A phenol resin modified with a compound having an unsaturated hydrocarbon group having 4 to 100 carbon atoms is phenol or a derivative thereof and 4 to 100 carbon atoms Polycondensation product of the reaction product of 100 unsaturated hydrocarbon-based compounds (hereinafter sometimes referred to as "unsaturated hydrocarbon-containing compounds") (hereinafter also referred to as "unsaturated hydrocarbon-modified phenol derivatives") and aldehydes, or It is a reaction product of a phenol resin and an unsaturated hydrocarbon group-containing compound. As a phenol derivative, the same thing as the phenol derivative described above as a raw material of the phenol resin which has a repeating unit represented by General formula (7) can be used. Regarding the unsaturated hydrocarbon group of the unsaturated hydrocarbon group-containing compound, it is preferable to include two or more unsaturated groups in terms of the residual stress of the cured film and the applicability of the reflow process. From the viewpoint of compatibility and residual stress of the cured film when the resin composition is made, the unsaturated hydrocarbon group is preferably 4 to 100 carbon atoms, more preferably 8 to 80 carbon atoms, and even more preferably carbon number. 10 to 60. Examples of the unsaturated hydrocarbon group-containing compound include unsaturated hydrocarbons having 4 to 100 carbon atoms, polybutadiene having a carboxyl group, epoxidized polybutadiene, linoleyl alcohol, oleyl alcohol, unsaturated fatty acids, and unsaturated fats. Acid ester. Examples of suitable unsaturated fatty acids include butenoic acid, myristic acid, palmitoleic acid, oleic acid, oleic acid, isoleic acid, cocoic acid, erucic acid, behenatenic acid, and linoleic acid , Alpha-linolenic acid, paulownic acid, octacosatenoic acid, arachidonic acid, eicosapentaenoic acid, herring acid and docosahexaenoic acid. Among these, a vegetable oil as an unsaturated fatty acid ester is particularly preferable from the viewpoint of the elongation of the cured film and the flexibility of the cured film. Vegetable oils usually include esters of glycerol and unsaturated fatty acids, and there are dry oils with an iodine value of 100 or less, semi-dry oils with a value of more than 100 and less than 130, or dry oils with a value of 130 or more. Examples of the non-drying oil include olive oil, morning glory seed oil, Polygonum multiflorum oil, camellia oil, camellia oil, castor oil, and peanut oil. Examples of the semi-dry oil include corn oil, cottonseed oil, and sesame oil. Examples of the dry oil include tung oil, linseed oil, soybean oil, walnut oil, safflower oil, sunflower oil, gardenia oil, and mustard oil. In addition, a processed vegetable oil processed from these vegetable oils may be used. Among the above-mentioned vegetable oils, a non-drying oil is preferably used from the viewpoint of preventing gelation due to the excessive progress of the reaction in the reaction between phenol or a derivative thereof or a phenol resin and a vegetable oil, and improving the yield. On the other hand, from the viewpoint of improving the adhesion, mechanical properties, and thermal shock resistance of the resist pattern, it is preferable to use a dry oil. Among the dry oils, tung oil, linseed oil, soybean oil, walnut oil, and safflower oil are preferred, and tung oil and linseed oil are more preferred in terms of exhibiting the effects of the present invention more effectively and reliably. These vegetable oils can be used individually by 1 type or in combination of 2 or more types. The reaction of phenol or its derivative with an unsaturated hydrocarbon group-containing compound is preferably performed at 50 to 130 ° C. Regarding the reaction ratio between phenol or its derivative and an unsaturated hydrocarbon group-containing compound, from the viewpoint of reducing the residual stress of the cured film, the unsaturated hydrocarbon group-containing compound is preferably 1 relative to 100 parts by mass of phenol or its derivative. 100 mass parts, more preferably 5 to 50 mass parts. If the unsaturated hydrocarbon group-containing compound is less than 1 part by mass, the flexibility of the cured film tends to decrease, and if it exceeds 100 parts by mass, the heat resistance of the cured film tends to decrease. In the above reaction, if necessary, p-toluenesulfonic acid, trifluoromethanesulfonic acid, or the like may be used as a catalyst. The unsaturated hydrocarbon group-modified phenol derivative and aldehydes generated by the above-mentioned reaction are subjected to polycondensation, thereby generating a phenol resin modified with an unsaturated hydrocarbon group-containing compound. Aldehydes such as formaldehyde, acetaldehyde, furfural, benzaldehyde, hydroxybenzaldehyde, methoxybenzaldehyde, hydroxyphenylacetaldehyde, methoxyphenylacetaldehyde, crotonaldehyde, chloroacetaldehyde, chlorophenylacetaldehyde , Acetone, glyceraldehyde, glyoxylic acid, methyl glyoxylate, phenyl glyoxylate, hydroxyphenyl glyoxylate, formamylacetic acid, methylformylacetate, 2-formamylpropionic acid, 2 -Methylformylpropionate, pyruvate, acetampropionate, 4-acetambutyric acid, acetone dicarboxylic acid, and 3,3'-4,4'-benzophenone tetracarboxylic acid. Also, formaldehyde precursors such as paraformaldehyde and trioxane may be used. These aldehydes can be used individually by 1 type or in combination of 2 or more types. The reaction between the aldehydes and the unsaturated hydrocarbon-based modified phenol derivative is a polycondensation reaction, and the synthetic conditions of a previously known phenol resin can be used. The reaction is preferably performed in the presence of a catalyst such as an acid or a base. From the viewpoint of the polymerization degree (molecular weight) of the resin, an acid catalyst is more preferably used. Examples of the acid catalyst include hydrochloric acid, sulfuric acid, formic acid, acetic acid, p-toluenesulfonic acid, and oxalic acid. These acid catalysts can be used alone or in combination of two or more. The above reaction is usually preferably performed at a reaction temperature of 100 to 120 ° C. The reaction time varies depending on the type or amount of the catalyst used, but it is usually 1 to 50 hours. After the reaction is completed, the reaction product is dehydrated under reduced pressure at a temperature of 200 ° C or lower to obtain a phenol resin modified with an unsaturated hydrocarbon group-containing compound. Furthermore, solvents such as toluene, xylene, and methanol can be used in the reaction. A phenol resin modified with an unsaturated hydrocarbon group-containing compound can also be obtained by polycondensing a compound other than phenol such as m-xylene and aldehydes with the unsaturated hydrocarbon group-modified phenol derivative. In this case, the compound added to the compound other than phenol is preferably less than 0.5 compared to the compound obtained by reacting the phenol derivative with the unsaturated hydrocarbon group-containing compound. A phenol resin modified with an unsaturated hydrocarbon group-containing compound can also be obtained by reacting a phenol resin with an unsaturated hydrocarbon group-containing compound. The phenol resin used in this case is a condensation polymerization product of a phenol compound (that is, phenol and / or a phenol derivative) and an aldehyde. In this case, as the phenol derivative and the aldehyde, the same as the phenol derivative and the aldehyde can be used, and a phenol resin can be synthesized under previously known conditions as described above. Specific examples of the phenol resin obtained from a phenol compound and an aldehyde suitable for forming a phenol resin modified with an unsaturated hydrocarbon group-containing compound include phenol / formaldehyde novolac resin, cresol / formaldehyde novolac resin , Resorcinol / formaldehyde novolac resin, resorcinol / formaldehyde novolac resin and phenol-naphthol / formaldehyde novolac resin. The unsaturated hydrocarbon group-containing compound to be reacted with the phenol resin may be the same as the unsaturated hydrocarbon group-containing compound to be used in the production of an unsaturated hydrocarbon group-modified phenol derivative that reacts with aldehydes. The reaction between the phenol resin and the unsaturated hydrocarbon group-containing compound is usually preferably performed at 50 to 130 ° C. In addition, regarding the reaction ratio of the phenol resin and the compound containing an unsaturated hydrocarbon group, from the viewpoint of improving the flexibility of the cured film (resist pattern), the compound containing an unsaturated hydrocarbon group is preferred to 100 parts by mass of the phenol resin. It is 1 to 100 parts by mass, more preferably 2 to 70 parts by mass, and even more preferably 5 to 50 parts by mass. If the unsaturated hydrocarbon group-containing compound is less than 1 part by mass, the flexibility of the cured film tends to decrease. If it exceeds 100 parts by mass, the possibility of gelation during the reaction tends to be high, and the cured film tends to be high. The heat resistance tends to decrease. When the phenol resin is reacted with the compound containing an unsaturated hydrocarbon group, p-toluenesulfonic acid, trifluoromethanesulfonic acid, etc. can also be used as a catalyst if necessary. In addition, solvents such as toluene, xylene, methanol, and tetrahydrofuran can be used in the reaction, which will be described in detail below. It is also possible to use a phenolic resin which is acid-modified by reacting a phenolic hydroxyl group remaining in a phenol resin modified with an unsaturated hydrocarbon group-containing compound produced by the method described above with a polybasic acid anhydride. By introducing a carboxyl group by acid modification with a polybasic acid anhydride, the solubility in an alkaline aqueous solution (for a developer) is further improved. The polybasic acid anhydride is not particularly limited as long as it has an acid anhydride group formed by dehydration condensation of a carboxyl group of a polybasic acid containing a plurality of carboxyl groups. Examples of the polybasic acid anhydride include phthalic anhydride, succinic anhydride, octenyl succinic anhydride, pentaenyl succinic anhydride, maleic anhydride, itaconic anhydride, tetrahydrophthalic anhydride, and hexahydro Phthalic anhydride, Methyltetrahydrophthalic anhydride, Methylhexahydrophthalic anhydride, Geo-anhydride, 3,6-Methylenetetrahydrophthalic anhydride, Methylene Dibasic acid anhydrides such as methyl tetrahydrophthalic anhydride, tetrabromophthalic anhydride, trimellitic anhydride, biphenyltetracarboxylic dianhydride, naphthalenetetracarboxylic dianhydride, and diphenyl ether tetracarboxylic acid di Aromatic tetracarboxylic dianhydrides such as anhydride, butanetetracarboxylic dianhydride, cyclopentanetetracarboxylic dianhydride, pyromellitic dianhydride and benzophenonetetracarboxylic dianhydride. These can be used individually by 1 type or in combination of 2 or more types. Among these, the polybasic acid anhydride is preferably a dibasic acid anhydride, and more preferably one or more members selected from the group consisting of tetrahydrophthalic anhydride, succinic anhydride, and hexahydrophthalic anhydride. In this case, there is an advantage that a resist pattern having a better shape can be formed. The reaction between the phenolic hydroxyl group and the polybasic acid anhydride can be performed at 50 to 130 ° C. In this reaction, a polyacid anhydride of 0.10 to 0.80 mol is preferably reacted with respect to 1 mol of the phenolic hydroxyl group, a reaction of 0.15 to 0.60 mol is more preferable, and a reaction of 0.20 to 0.40 mol is more preferable. The ear reacts. If the polybasic acid anhydride is less than 0.10 Molar, the developability tends to decrease, and if it exceeds 0.80 Molar, the alkali resistance of the unexposed portion tends to decrease. In addition, from the viewpoint of allowing the reaction to proceed rapidly, a catalyst may be contained in the reaction as necessary. Examples of the catalyst include tertiary amines such as triethylamine, quaternary ammonium salts such as triethylbenzyl ammonium chloride, imidazole compounds such as 2-ethyl-4-methylimidazole, and phosphorus compounds such as triphenylphosphine. . The acid value of the phenol resin modified with polybasic acid anhydride is preferably 30 to 200 mgKOH / g, more preferably 40 to 170 mgKOH / g, and still more preferably 50 to 150 mgKOH / g. If the acid value is less than 30 mgKOH / g, compared with the case where the acid value is in the above range, there is a tendency that the time required for alkaline development is longer. The developing solution resistance tends to be lower than that of the unexposed portion. Regarding the molecular weight of the phenol resin modified with an unsaturated hydrocarbon group-containing compound, considering the solubility in an alkaline aqueous solution, or the balance between the light-sensitive properties and the physical properties of the cured film, the weight average molecular weight is preferably 1,000 to 100,000, more It is preferably 2000 to 100,000. As the (A) phenol resin of this embodiment, it is also preferably selected from the group consisting of a phenol resin having a repeating unit represented by the general formula (7) and a compound modified with an unsaturated hydrocarbon group having 4 to 100 carbon atoms. A mixture of at least one phenol resin (hereinafter also referred to as (a3) resin) among phenol resins and a phenol resin (hereinafter also referred to as (a4) resin) selected from novolac and polyhydroxystyrene. The mixing ratio of (a3) resin and (a4) resin is in the range of (a3) / (a4) = 5/95 to 95/5 in terms of mass ratio. This mixing ratio is preferably (a3) / () from the viewpoints of solubility in an alkaline aqueous solution, sensitivity and resolution when forming a resist pattern, residual stress of a cured film, and applicability of a reflow process. a4) = 5/95 to 95/5, more preferably (a3) / (a4) = 10/90 to 90/10, and still more preferably (a3) / (a4) = 15/85 to 85/15. Regarding the novolak and polyhydroxystyrene as the (a4) resin described above, the same resins as those shown in the above-mentioned (Novolac) and (Polyhydroxystyrene) can be used. (B) A cyclic compound having a carbonyl group (B) A compound is at least one compound selected from the group consisting of a cyclic compound having two or more carbonyl groups, and the carbonyl group is directly bonded to the above For a cyclic structure, in the case of a monocyclic compound, more than 1/3 of the atoms forming the ring structure are N atoms; in the case of a condensed ring compound, more than 1/3 of the atoms forming the ring structure having the carbonyl group are N atom. From the viewpoint of migration resistance, at least one compound selected from the group consisting of the following compounds classified according to the ring structure, that is, a 5-membered ring compound, a 6-membered ring compound, a 5-membered ring, and a 5-membered ring is preferable. Ring condensed ring compounds, 5-membered ring and 6-membered ring condensed ring compounds, 6-membered ring and 6-membered ring condensed ring compounds. By having two or more carbonyl groups, the area of voids on the copper surface can be reduced. Furthermore, from the viewpoints of developability or sensitivity, in-plane uniformity after curing, and elongation after reflow, it is also preferable to have two or more carbonyl groups. When the number of carbonyl groups is two or more, the area of the voids on the copper surface is significantly smaller than that when the number of carbonyl groups is one. From the viewpoints of developability or sensitivity, in-plane uniformity after curing, and elongation after reflow, the case of two or more carbonyl groups is better than the case of one carbonyl group. As specific examples of the compound (B), examples of the 5-membered ring compound include 3-pyrazolinone, 5-pyrazolinone, 3-methyl-5-pyrazolinone, and 1,3-dimethylamine. 6-membered groups such as 5--5-pyrazolinone, 2-imidazolidinone, 1,3-dimethyl-2-imidazolidinone, hydantoin, allantoin, parabanic acid, etc. Examples of the cyclic compound include tetrahydro-2-pyrimidone, barbituric acid, 1,3-dimethylbarbituric acid, 1,3-dicyclohexylbarbituric acid, and 5-aminobarbituric acid. Acid (uramil), uridine, cyanuric acid, tris (2-hydroxyethyl) isocyanurate, etc. As the condensed ring compound of 5-membered ring and 5-membered ring, glycoluril etc. can be cited as 6 Condensed ring compounds of a member ring and a 5-membered ring include guanine, isoguanine, N-methylguanine, 7- (2-hydroxyethyl) guanine, N- (3-chlorophenyl) bird Purine, N- (3-ethylphenyl) guanine, hypoxanthine, 8-azahypoxanthine, 7-deazahypoxanthine, xanthine, 1-methylxanthine, 3-methyl Xanthine, 8-bromo-3-methylxanthine, theobromine, theophylline, 7- (2-chloroethyl) theophylline, caffeine, uric acid, 8-azaxanthine, etc., as 6 Condensed cyclic compounds of 6-membered ring and 6-membered ring, examples include: purine, dioxotetrahydropyridine, 7,8-dimethylrole &#134116;, 1,4-dihydro-6-methylquinone Phenolin-2,3-dione and the like may also be mentioned as a mixture thereof. Among these, it is preferable to use a condensed ring compound. Furthermore, from the viewpoint of migration resistance, the compound (B) is preferably selected from the following general formula (60): {In the formula, Rs3, Rs4, and Rs5 are each independently a hydrogen atom, a halogen atom, a hydroxyl group, an amine group that can be substituted by an aromatic group, an alkoxy group having 1 to 6 carbon atoms, a hydroxyalkyl group, or one having 1 to 10 carbon atoms. A compound represented by an alkyl group or an aromatic group} and the following general formula (61): {In the formula, Rs6, Rs7, and Rs8 are each independently a hydrogen atom, a halogen atom, a hydroxyl group, an amine group which may be substituted by an aromatic group, an alkoxy group having 1 to 6 carbon atoms, a hydroxyalkyl group, or one having 1 to 10 carbon atoms. A compound represented by an alkyl group or an aromatic group} and the following general formula (62): [化 50] {In the formula, Rs9, Rs10, Rs11, and Rs12 are each independently a hydrogen atom, a halogen atom, a hydroxyl group, an amine group that can be substituted by an aromatic group, an alkoxy group having 1 to 6 carbon atoms, a hydroxyalkyl group, or 1 to 6 carbon atoms. A compound represented by the alkyl or aromatic group of 10} and the following general formula (63): [化 51] {Where R _{twenty one} , R _{twenty two} , R _{twenty three} And R _{twenty four} Are independently a hydrogen atom, a halogen atom, a hydroxyl group, an amine group which may be substituted by an aromatic group, an alkoxy group having 1 to 6 carbon atoms, a hydroxyalkyl group or an alkyl group or aromatic group having 1 to 10 carbon atoms} At least one compound in a group of compounds. Specific examples of the compounds represented by the general formulae (60) to (63) include xanthine, 1-methylxanthine, 3-methylxanthine, theobromine, theophylline, caffeine, and uric acid. , 8-azaxanthine, dioxetrine and their derivatives. The compounding quantity of (B) compound is 0.01-10 mass parts with respect to 100 mass parts of (A) resin, Preferably it is 0.05-2 mass parts. From the viewpoint of migration resistance, it is more preferably 0.01 parts by mass or more, and from the viewpoint of solubility, it is more preferably less than 10 parts by mass. It is considered that these (B) components change the surface state of copper by coordination of a carbonyl group or a nitrogen atom contained in a ring structure with copper, thereby suppressing copper migration during a high-temperature storage test. It is thought that especially in the case of a condensed ring, migration resistance is improved by the synergy between a plurality of carbonyl groups and a nitrogen atom. (C) Photosensitizer The (C) photosensitizer used in the present invention will be described. (C) Photosensitizer The photosensitive resin composition according to the present invention is, for example, a negative type mainly using a polyimide precursor and / or polyimide as the (A) resin, or, for example, mainly using a polyoxazole precursor, At least one of the soluble polyfluorene imide and the phenol resin differs as a positive type of the (A) resin or the like. The blending amount of the (C) photosensitizer in the photosensitive resin composition is 1 to 50 parts by mass based on 100 parts by mass of the (A) resin. The blending amount is 1 part by mass or more in terms of light sensitivity or patternability, and 50 parts by mass or less in terms of curability of the photosensitive resin composition or physical properties of the photosensitive resin layer after curing. [(C) Negative-type photosensitizer: Photopolymerization initiator and / or photoacid generator] First, a case where a negative type is desired is described. In this case, a photopolymerization initiator and / or a photoacid generator is used as the (C) photosensitizer, and as the photopolymerization initiator, a photoradical polymerization initiator is preferred, and diphenyl is preferably listed: Benzophenone derivatives such as methanone, methyl benzophenone benzoate, 4-benzylidene-4'-methyldiphenyl ketone, dibenzyl ketone, and fluorenone, 2,2'-di Acetophenone derivatives such as ethoxyacetophenone, 2-hydroxy-2-methylphenylacetone, 1-hydroxycyclohexylphenyl ketone, 9-oxysulfur &#134079; , 2-methyl 9-oxysulfur &#134079; , 2-isopropyl 9-oxysulfur &#134079; , Diethyl 9-oxysulfur &#134079; 9-oxysulfur &#134079; Derivatives, benzoin derivatives such as benzoin, benzoin dimethyl ketal, benzoin-β-methoxyethyl acetal, benzoin derivatives such as benzoin, benzoin methyl ether, 1-phenyl -1,2-butanedione-2- (o-methoxycarbonyl) oxime, 1-phenyl-1,2-propanedione-2- (o-methoxycarbonyl) oxime, 1-phenyl- 1,2-propanedione-2- (o-ethoxycarbonyl) oxime, 1-phenyl-1,2-propanedione-2- (o-benzoylfluorenyl) oxime, 1,3-diphenyl Oximes such as propanetrione-2- (o-ethoxycarbonyl) oxime, 1-phenyl-3-ethoxypropanetrione-2- (o-benzylidene) oxime, N-phenylglycine N-aryl glycine, peroxides such as benzamyl perchloride, aromatic biimidazoles, titanocene, α- (n-octylsulfonyloxyimino) -4-methyl Photoacid generators such as oxybenzyl cyanide and the like are not limited thereto. Among the above-mentioned photopolymerization initiators, particularly in terms of photosensitivity, oximes are more preferred. When a photoacid generator is used as the (C) photosensitizer in a negative-type photosensitive resin composition, it exhibits acidity when irradiated with active light such as ultraviolet rays, and has the following effects by this effect. The cross-linking agent cross-links the resin as the component (A) or polymerizes the cross-linking agents to each other. Examples of the photoacid generator include diarylsulfonium salts, triarylsulfonium salts, dialkylbenzylmethylsulfonium salts, diarylsulfonium salts, aryldiazonium salts, and aromatic tetracarboxylic acids. Acid esters, aromatic sulfonates, nitrobenzyl esters, oxime sulfonates, aromatic N-oxyfluorenimines sulfonates, aromatic sulfonamides, halogenated alkyl-containing hydrocarbon compounds, halogenated Heterocyclic compounds of alkyl groups, naphthoquinonediazide-4-sulfonate, and the like. Such a compound may be used in combination of two or more kinds, or combined with other sensitizers as needed. Among the photoacid generators, particularly in terms of light sensitivity, an aromatic oxime sulfonate and an aromatic N-oxyfluorenimine sulfonate are more preferable. The blending amount of these photosensitizers is 1 to 50 parts by mass based on 100 parts by mass of the (A) resin, and is preferably 2 to 15 parts by mass in terms of light sensitivity characteristics. By blending (C) a photosensitizer of 1 part by mass or more with respect to 100 parts by mass of the resin (A), the photosensitivity is excellent, and by blending 50 parts by mass or less, the thick film hardenability is excellent. Furthermore, as described above, when the (A) resin represented by the general formula (1) is an ionic bond type, an amine group is used to impart a photopolymerizable group to the side chain of the (A) resin via an ionic bond. (Meth) acrylic compounds. In this case, the (meth) acrylic compound having an amine group is used as the (C) photosensitizer. As described above, for example, dimethylaminoethyl acrylate and dimethylaminoethyl methacrylate are preferred. , Diethylaminoethyl acrylate, diethylaminoethyl methacrylate, dimethylaminopropyl acrylate, dimethylaminopropyl methacrylate, diethylaminopropyl acrylate, diethylmethacrylate Dialkylamino alkyl acrylates such as aminopropyl, dimethylaminobutyl acrylate, dimethylaminobutyl methacrylate, diethylaminobutyl acrylate, diethylaminobutyl methacrylate, etc. Or a dialkylamino alkyl methacrylate, from the viewpoint of the photosensitivity, the number of carbon atoms of the alkyl group on the amine group is preferably 1 to 10, and the number of carbon atoms of the alkyl chain is 1 to 10. Dialkylaminoalkyl acrylate or dialkylaminoalkyl methacrylate. The blending amount of these (meth) acrylic compounds having an amine group is 1 to 20 parts by mass based on 100 parts by mass of the (A) resin, and is preferably 2 to 15 in terms of light sensitivity characteristics. Parts by mass. By blending (A) a (meth) acrylic compound having an amine group in an amount of 1 part by mass or more relative to 100 parts by mass of the (A) resin as the (C) photosensitizer, the photosensitivity is excellent, and the thickness is 20 parts by mass or less The film has excellent hardenability. Next, a case where expectations are positive will be described. In this case, a photoacid generator is used as the (C) photosensitizer. Specifically, a diazoquinone compound, an onium salt, a halogen-containing compound, or the like can be used. From the viewpoint of solvent solubility and storage stability, A compound having a diazoquinone structure is preferred. [(C) Positive-type photosensitizer: Compound having quinonediazide group] As the compound having (C) having a quinonediazide group (hereinafter also referred to as "(C) quinonediazide compound"), an example having Compounds having a 1,2-benzoquinonediazide structure and compounds having a 1,2-naphthoquinonediazide structure are U.S. Patent No. 2,772,972, U.S. Patent No. 2,797,213, and U.S. Patent No. 3,669,658 Well-known substances among others. The (C) quinonediazide compound is preferably selected from 1,2-naphthoquinonediazide-4-sulfonate of a polyhydroxy compound having a specific structure described in detail below, and 1 of the polyhydroxy compound, At least one compound in the group consisting of 2-naphthoquinonediazide-5-sulfonate (hereinafter also referred to as "NQD compound"). The NQD compound is obtained by sulfonating the naphthoquinonediazidesulfonic acid compound with chlorosulfonic acid or thionyl chloride according to a conventional method, so that the obtained naphthoquinonediazidesulfonyl chloride is obtained. Condensation with polyhydroxy compounds. It can be obtained, for example, by placing a polyhydroxy compound with a specific amount of 1,2-naphthoquinonediazide-5-sulfonyl chloride or 1,2-naphthoquinonediazide-4-sulfonyl chloride in dihydrazone. In a solvent such as alkane, acetone or tetrahydrofuran, esterification is carried out by reaction in the presence of a basic catalyst such as triethylamine, and the obtained product is washed with water and dried. In this embodiment, from the viewpoint of sensitivity and resolution when forming a resist pattern, the compound having a quinonediazide group (C) is preferably represented by the following general formulae (70) to (74) 1,2-naphthoquinonediazide-4-sulfonate and / or 1,2-naphthoquinonediazide-5-sulfonate of hydroxy compounds. General formula (70) consists of [Chem. 52] {Where, X ₁₁ And X ₁₂ Each independently represents a hydrogen atom or a monovalent organic group having 1 to 60 carbon atoms (preferably 1 to 30 carbon atoms), X ₁₃ And X ₁₄ Each independently represents a hydrogen atom or a monovalent organic group having 1 to 60 carbons (preferably 1 to 30 carbons), r1, r2, r3, and r4 are each independently an integer of 0 to 5, and at least one of r3 and r4 It is an integer of 1 to 5, (r1 + r3) ≦ 5, and (r2 + r4) ≦ 5}. General formula (71) consists of [Chem 53] {Wherein Z represents a tetravalent organic group having 1 to 20 carbon atoms, and X ₁₅ , X ₁₆ , X ₁₇ And X ₁₈ Each independently represents a monovalent organic group having a carbon number of 1 to 30, r6 is an integer of 0 or 1, r5, r7, r8, and r9 are each independently an integer of 0 to 3, and r10, r11, r12, and r13 are each independently 0 An integer of ˜2, and r10, r11, r12, and r13 are not all represented by 0}. And the general formula (72) consists of [Chem. 54] {In the formula, r14 represents an integer of 1 to 5, r15 represents an integer of 3 to 8, L of (r14 × r15) each independently represents a monovalent organic group of 1 to 20 carbon atoms, and (r15) of T ¹ And (r15) of T ² Each independently represents a hydrogen atom or a monovalent organic group having 1 to 20 carbon atoms}. And the general formula (73) consists of [Chem 55] {In the formula, A represents an aliphatic divalent organic group containing tertiary or quaternary carbon, and M represents a divalent organic group, preferably, it is selected from the following chemical formula: [化 56] A bivalent base out of the 3 bases shown}. Furthermore, the general formula (74) is given by [Chem 57] {In the formula, r17, r18, r19, and r20 are each independently an integer of 0 to 2, and at least one of r17, r18, r19, and r20 is 1 or 2, X ₂₀ ~ X ₂₉ Each independently represents a hydrogen atom, a halogen atom, a monovalent group selected from the group consisting of alkyl, alkenyl, alkoxy, allyl, and fluorenyl groups, and Y ₁₀ , Y ₁₁ And Y ₁₂ Each independently represents a single bond and is selected from -O-, -S-, -SO-, -SO ₂ -, -CO-, -CO ₂ -, A cyclopentylene group, a cyclohexylene group, a phenylene group, and a divalent organic group of a divalent organic group having 1 to 20 carbon atoms}. In another embodiment, in the general formula (74), Y ₁₀ ~ Y ₁₂ Preferably, each is independently from the following general formula: [化 58] [Chemical 59] [Chemical 60] {Where, X ₃₀ And X ₃₁ Each independently represents a hydrogen atom, at least one monovalent group selected from the group consisting of an alkyl group, an alkenyl group, an aryl group, and a substituted aryl group, X ₃₂ , X ₃₃ , X ₃₄ And X ₃₅ Each independently represents a hydrogen atom or an alkyl group, r21 is an integer of 1 to 5, and X ₃₆ , X ₃₇ , X ₃₈ And X ₃₉ These are independently selected from three types of divalent organic groups represented by a hydrogen atom or an alkyl group}. Examples of the compound represented by the general formula (70) include hydroxy compounds represented by the following formulae (75) to (79). Here, the general formula (75) is [Chem. 61] {In the formula, r16 is independently an integer of 0 to 2, and X ₄₀ Each independently represents a hydrogen atom or a monovalent organic group having 1 to 20 carbon atoms, ₄₀ When there is a plurality, X ₄₀ May be the same or different from each other, and X ₄₀ The following formula is preferred: (In the formula, r18 is an integer of 0 to 2, X ₄₁ Represents a hydrogen atom, a monovalent organic group selected from the group consisting of an alkyl group and a cycloalkyl group, and when r18 is 2, two X ₄₁ May be the same as or different from each other), and the general formula (76) is represented by [化 63] {Where, X ₄₂ A hydrogen atom, a monovalent organic group selected from the group consisting of an alkyl group having 1 to 20 carbon atoms, an alkoxy group having 1 to 20 carbon atoms, and a cycloalkyl group having 1 to 20 carbon atoms}. The general formula (77) is [Chem. 64] {In the formula, r19 is an integer of 0 to 2 independently, X ₄₃ Each independently represents a hydrogen atom or the following general formula: [Chem 65] (In the formula, r20 is an integer from 0 to 2, X ₄₅ Is selected from the group consisting of a hydrogen atom, an alkyl group, and a cycloalkyl group, and when r20 is 2, 2 X ₄₅ May be the same as or different from each other), a monovalent organic group represented by X, and X ₄₄ It is selected from the group consisting of a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, and a cycloalkyl group having 1 to 20 carbon atoms}, and the formulae (78) and (79) have the following structures. [Chemical 66] [Chemical 67] As the compound represented by the above-mentioned general formula (70), the following formula (80) is preferred in terms of sensitivity when it is made into an NQD compound and low precipitation in a photosensitive resin composition. ~ (82) is a hydroxy compound. The structures of the formulae (80) to (82) are shown below. [Chemical 68] [Chemical 69] [Chem 70] As the compound represented by the above general formula (76), the following formula (83) is preferred in terms of high sensitivity when it is made into an NQD compound and low precipitation in a photosensitive resin composition. ： [化 71] The indicated hydroxy compound. As the compound represented by the above general formula (77), the following formula (84) is preferred in terms of sensitivity when it is made into an NQD compound and low precipitation in a photosensitive resin composition. ~ (86) a hydroxy compound. The structures of the formulae (84) to (86) are shown below. [Chemical 72] [Chemical 73] [Chemical 74] In the general formula (71), Z is not particularly limited as long as it is a tetravalent organic group having 1 to 20 carbon atoms. From the viewpoint of sensitivity, it is preferable to have the following formula: The 4-valent base of the structure shown. Among the compounds represented by the general formula (71), the following formula (87) is preferred in terms of high sensitivity when it is made into an NQD compound and low precipitation in a photosensitive resin composition. ) To (90) a hydroxy compound. The structures of the formulae (87) to (90) are shown below. [Chemical 76] [Chemical 77] [Chem. 78] [Chem. 79] As the compound represented by the above-mentioned general formula (72), the following formula (91) is preferred in terms of high sensitivity when it is made into an NQD compound and low precipitation in a photosensitive resin composition. ： [化 80] {In the formula, r40 is independently an integer of 0 to 9}. As the compound represented by the above-mentioned general formula (73), the following formula (92) is preferred in terms of sensitivity when it is made into an NQD compound and low precipitation in a photosensitive resin composition. And the hydroxy compound represented by (93). The structures of formulae (92) and (93) are shown below. [Chemical 81] [Chem 82] As a compound represented by the said General formula (74), the point which has high sensitivity and low precipitation property in the photosensitive resin composition is, specifically, the following formula (94): 83] NQD compounds of the indicated polyhydroxy compounds. In the case where (C) the compound having a quinonediazide group has 1,2-naphthoquinonediazidesulfonyl, the group may be 1,2-naphthoquinonediazide-5-sulfonyl or 1 Any of 2-naphthoquinonediazide-4-sulfonyl. 1,2-naphthoquinonediazide-4-sulfofluorenyl group can absorb the i-ray region of a mercury lamp, so it is suitable for i-ray exposure. On the other hand, 1,2-naphthoquinonediazide-5-sulfonyl group can even absorb the g-ray region of a mercury lamp, so it is suitable for exposure using g-rays. In this embodiment, it is preferable to select one of 1,2-naphthoquinonediazide-4-sulfonate compound and 1,2-naphthoquinonediazide-5-sulfonate compound according to the wavelength of exposure. Or both. It is also possible to use 1,2-naphthoquinonediazide having 1,2-naphthoquinonediazide-4-sulfonyl and 1,2-naphthoquinonediazide-5-sulfonyl in the same molecule. As the sulfonate compound, 1,2-naphthoquinonediazide-4-sulfonate compound and 1,2-naphthoquinonediazide-5-sulfonate compound may be used in combination. (C) Among compounds having a quinonediazide group, the average esterification rate of the naphthoquinonediazidesulfonyl ester of the hydroxy compound is preferably from 10% to 100%, and more preferably, from the viewpoint of development contrast. It is 20% to 100%. From the viewpoint of the physical properties of the cured film such as sensitivity and elongation, as a preferable example of the NQD compound, for example, those represented by the following general formula group can be mentioned. [Chemical 84] Examples include {where Q is a hydrogen atom or a group of the following formula: [化 85] A naphthoquinonediazide sulfonate group represented by any one, but Q is not all represented by a hydrogen atom at the same time}. In this case, as the NQD compound, the naphthoquinonediazidesulfonyl ester compound having 4-naphthoquinonediazidesulfonyl group and 5-naphthoquinonediazidesulfonyl group in the same molecule can also be used. A 4-naphthoquinonediazidesulfonyl sulfonyl ester compound and a 5-naphthoquinonediazidesulfonyl sulfonyl ester compound may be used in combination. Among the naphthoquinonediazide sulfonate groups described in the paragraph [0196], the following general formula (95) is particularly preferred: Represented. Examples of the onium salt include a sulfonium salt, a sulfonium salt, a sulfonium salt, a sulfonium salt, an ammonium salt, and a diazonium salt, and the like is preferably selected from a diarylsulfonium salt, a triarylsulfonium salt, and a trialkylsulfonium salt. The onium salt in the group. Examples of the halogen-containing compound include a hydrocarbon compound containing a halogenated alkyl group, and trichloromethyltri &#134116; is preferred. The blending amount of these photoacid generators is 1 to 50 parts by mass, and preferably 5 to 30 parts by mass based on 100 parts by mass of the (A) resin. If the blending amount of the photoacid generator as the (C) photosensitizer is 1 part by mass or more, the patterning property of the photosensitive resin composition is good, and if it is 50 parts by mass or less, the photoresist composition after curing is cured. The tensile elongation of the film was good, and there was less developing residue (scum) in the exposed portion. These NQD compounds may be used alone or in combination of two or more. In this embodiment, the compounding amount of the compound (C) having a quinonediazide group in the photosensitive resin composition is from 0.1 to 70 parts by mass relative to 100 parts by mass of the resin (A), and more preferably 1 to 40 parts by mass, more preferably 3 to 30 parts by mass, and even more preferably 5 to 30 parts by mass. When the blending amount is 0.1 parts by mass or more, a good sensitivity is obtained, while when it is 70 parts by mass or less, the mechanical properties of the cured film are good. The photosensitive resin composition of the present invention may further contain components other than the components (A) to (C). The preferred component differs depending on, for example, a negative type using a polyimide precursor and polyimide as the (A) resin, or a positive type using a polyoxazole precursor and a soluble polyimide or the like. The polyimide precursor resin composition and polyimide resin composition as the negative resin composition in the present embodiment, or the polyoxazole resin composition and the soluble polyfluorene as the positive photosensitive resin composition The imine resin composition and the phenol resin composition may contain a solvent for dissolving these resins. Examples of the solvent include amidoamines, fluorenes, ureas, ketones, esters, lactones, ethers, halogenated hydrocarbons, hydrocarbons, alcohols, and the like. For example, N-methyl-2 can be used. -Pyrrolidone, N, N-dimethylacetamide, N, N-dimethylformamide, dimethylsulfine, tetramethylurea, acetone, methyl ethyl ketone, methyl isobutyl Ketone, cyclopentanone, cyclohexanone, methyl acetate, ethyl acetate, butyl acetate, diethyl oxalate, ethyl lactate, methyl lactate, butyl lactate, γ-butyrolactone, propylene glycol monomethyl ether Acetate, propylene glycol monomethyl ether, benzyl alcohol, phenyl ethylene glycol, tetrahydrofuran methanol, ethylene glycol dimethyl ether, diethylene glycol dimethyl ether, tetrahydrofuran, &#134156; morpholine, dichloromethane, 1,2 -Dichloroethane, 1,4-dichlorobutane, chlorobenzene, o-dichlorobenzene, anisole, hexane, heptane, benzene, toluene, xylene, mesitylene and the like. Among these, from the viewpoints of the solubility of the resin, the stability of the resin composition, and the adhesiveness to the substrate, N-methyl-2-pyrrolidone, dimethylsulfinium, and tetramethylurea are preferred. , Butyl acetate, ethyl lactate, γ-butyrolactone, propylene glycol monomethyl ether acetate, propylene glycol monomethyl ether, diethylene glycol dimethyl ether, benzyl alcohol, phenyl ethylene glycol, and tetrahydrofuran methanol. Among such solvents, those which can completely dissolve the formed polymer are particularly preferred. Examples include N-methyl-2-pyrrolidone, N, N-dimethylacetamide, and N, N-dimethylformamide. Methylformamide, dimethyl sulfenamide, tetramethylurea, γ-butyrolactone, and the like. Examples of the solvent suitable for the phenol resin include bis (2-methoxyethyl) ether, methyl cellosolve, ethyl cellosolve, propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, and Ethylene glycol dimethyl ether, dipropylene glycol dimethyl ether, cyclohexanone, cyclopentanone, toluene, xylene, γ-butyrolactone, N-methyl-2-pyrrolidone, and the like. The use amount of the solvent in the photosensitive resin composition of the present invention is preferably 100 to 1000 parts by mass, more preferably 120 to 700 parts by mass, and still more preferably 125 to 100 parts by mass of the resin (A). A range of 500 parts by mass. The photosensitive resin composition of the present invention may further contain components other than the components (A) to (C). For example, when using the photosensitive resin composition of the present invention to form a hardened film on a substrate containing copper or a copper alloy, in order to suppress discoloration on copper, nitrogen-containing heterocycles such as azole compounds and purine derivatives can be arbitrarily prepared Compound. Examples of the azole compound include 1H-triazole, 5-methyl-1H-triazole, 5-ethyl-1H-triazole, 4,5-dimethyl-1H-triazole, 5-phenyl -1H-triazole, 4-third butyl-5-phenyl-1H-triazole, 5-hydroxyphenyl-1H-triazole, phenyltriazole, p-ethoxyphenyltriazole, 5- Phenyl-1- (2-dimethylaminoethyl) triazole, 5-benzyl-1H-triazole, hydroxyphenyltriazole, 1,5-dimethyltriazole, 4,5-bis Ethyl-1H-triazole, 1H-benzotriazole, 2- (5-methyl-2-hydroxyphenyl) benzotriazole, 2- [2-hydroxy-3,5-bis (α, α -Dimethylbenzyl) phenyl] -benzotriazole, 2- (3,5-di-third-butyl-2-hydroxyphenyl) benzotriazole, 2- (3-third-butyl- 5-methyl-2-hydroxyphenyl) -benzotriazole, 2- (3,5-di-third-pentyl-2-hydroxyphenyl) benzotriazole, 2- (2'-hydroxy-5 '-Third octylphenyl) benzotriazole, hydroxyphenylbenzotriazole, tolutriazole, 5-methyl-1H-benzotriazole, 4-methyl-1H-benzotriazole , 4-carboxy-1H-benzotriazole, 5-carboxy-1H-benzotriazole, 1H-tetrazole, 5-methyl-1H-tetrazole, 5-phenyl-1H-tetrazole, 5- Amino-1H-tetrazole, 1-methyl-1H-tetrazole and the like. Particularly preferred examples are: tolutriazole, 5-methyl-1H-benzotriazole, and 4-methyl-1H-benzotriazole. These azole compounds may be used singly or as a mixture of two or more. Specific examples of the purine derivative include purine, adenine, guanine, hypoxanthine, xanthine, theobromine, caffeine, uric acid, isoguanine, 2,6-diaminopurine, 9-formyl Base adenine, 2-hydroxyadenine, 2-methyladenine, 1-methyladenine, N-methyladenine, N, N-dimethyladenine, 2-fluoroadenine, 9- ( 2-hydroxyethyl) adenine, guanine oxime, N- (2-hydroxyethyl) adenine, 8-amino adenine, 6-amino-8-phenyl-9H-purine, 1-ethyl Adenine, 6-ethylaminopurine, 1-benzyl adenine, N-methylguanine, 7- (2-hydroxyethyl) guanine, N- (3-chlorophenyl) guanine, N -(3-ethylphenyl) guanine, 2-azaadenine, 5-azaadenine, 8-azaadenine, 8-azaguanine, 8-azapurine, 8-aza Xanthine, 8-azahypoxanthine and its derivatives. About the compounding quantity when the photosensitive resin composition of this invention contains the said azole compound or a purine derivative, 0.1-20 mass parts is preferable with respect to 100 mass parts of (A) resin, from a viewpoint of a light sensitivity characteristic In particular, it is more preferably 0.5 to 5 parts by mass. When the compounding amount of the azole compound with respect to 100 parts by mass of the (A) resin is 0.1 part by mass or more, when the photosensitive resin composition of the present invention is formed on copper or a copper alloy, generation of copper or copper alloy surface is suppressed. Discoloration, on the other hand, if it is 20 parts by mass or less, the light sensitivity is excellent. Moreover, a hindered phenol compound can be mix | blended arbitrarily in order to suppress discoloration on a copper surface. Examples of the hindered phenol compound include 2,6-di-tertiary-butyl-4-methylphenol, 2,5-di-tertiary-butyl-hydroquinone, and 3- (3,5-di-tertiary-butyl- 4-hydroxyphenyl) octadecyl propionate, 3- (3,5-di-tert-butyl-4-hydroxyphenyl) isooctyl propionate, 4,4'-methylenebis (2 , 6-di-tert-butylphenol), 4,4'-thio-bis (3-methyl-6-tert-butylphenol), 4,4'-butylene-bis (3-methyl- 6-tert-butylphenol), triethylene glycol-bis [3- (3-tert-butyl-5-methyl-4-hydroxyphenyl) propionate], 1,6-hexanediol- Bis [3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionate], 2,2-thio-di-ethylene bis [3- (3,5-di-tert-butyl) 4-hydroxyphenyl) propionate], N, N'-hexamethylenebis (3,5-di-third-butyl-4-hydroxy-phenylpropanamine), 2,2'- Methyl-bis (4-methyl-6-tert-butylphenol), 2,2'-methylene-bis (4-ethyl-6-tert-butylphenol), tetra [3- (3 , 5-Di-tert-butyl-4-hydroxyphenyl) propionic acid] Pentaerythritol ester, Tris- (3,5-di-tert-butyl-4-hydroxybenzyl) isocyanurate, 1,3,5 -Trimethyl-2,4,6-tris (3,5-di-tert-butyl-4-hydroxybenzyl) benzene, 1,3,5-tris (3-hydroxy-2,6-dimethyl 4-Isopropylbenzyl ) -1,3,5-tris &#134116; -2,4,6- (1H, 3H, 5H) -trione, 1,3,5-tris (4-thirdbutyl-3-hydroxy -2,6-dimethylbenzyl) -1,3,5-tri &#134116; -2,4,6- (1H, 3H, 5H) -trione, 1,3,5-tris (4 -Second butyl-3-hydroxy-2,6-dimethylbenzyl) -1,3,5-tri &#134116; -2,4,6- (1H, 3H, 5H) -trione, 1,3,5-tri [4- (1-ethylpropyl) -3-hydroxy-2,6-dimethylbenzyl] -1,3,5-tri &#134116; -2,4, 6- (1H, 3H, 5H) -trione, 1,3,5-tri [4-triethylmethyl-3-hydroxy-2,6-dimethylbenzyl] -1,3,5- Tri &#134116; -2,4,6- (1H, 3H, 5H) -trione, 1,3,5-tri (3-hydroxy-2,6-dimethyl-4-phenylbenzyl) -1,3,5-tris &#134116; -2,4,6- (1H, 3H, 5H) -trione, 1,3,5-tris (4-thirdbutyl-3-hydroxy-2 , 5,6-trimethylbenzyl) -1,3,5-tri &#134116; -2,4,6- (1H, 3H, 5H) -trione, 1,3,5-tri (4 -Third-butyl-5-ethyl-3-hydroxy-2,6-dimethylbenzyl) -1,3,5-tri &#134116; -2,4,6- (1H, 3H, 5H ) -Trione, 1,3,5-tris (4-third butyl-6-ethyl-3-hydroxy-2-methylbenzyl) -1,3,5-tri &#134116; -2 , 4,6- (1H, 3H, 5H) -trione, 1,3,5-tris (4-third butyl-6-ethyl-3-hydroxy-2,5-dimethylbenzyl) -1,3,5-tris &#134116; -2,4,6- (1H, 3H, 5H) -trione, 1,3,5-tris (4-third butyl) -5,6-diethyl-3-hydroxy-2-methylbenzyl) -1,3,5-tri &#134116; -2,4,6- (1H, 3H, 5H) -trione, 1,3,5-tris (4-third butyl-3-hydroxy-2-methylbenzyl) -1,3,5-tris &#134116; -2,4,6- (1H, 3H, 5H) -trione, 1,3,5-tris (4-third butyl-3-hydroxy-2,5-dimethylbenzyl) -1,3,5-tri &#134116; -2, 4,6- (1H, 3H, 5H) -trione, 1,3,5-tris (4-third-butyl-5-ethyl-3-hydroxy-2-methylbenzyl) -1,3 , 5-Tri &#134116; -2,4,6- (1H, 3H, 5H) -trione and the like, but it is not limited thereto. Of these, 1,3,5-tris (4-third butyl-3-hydroxy-2,6-dimethylbenzyl) -1,3,5-tri &#134116;- 2,4,6- (1H, 3H, 5H) -trione and the like. The compounded amount of the hindered phenol compound is preferably 0.1 to 20 parts by mass relative to 100 parts by mass of the (A) resin, and more preferably 0.5 to 10 parts by mass from the viewpoint of light sensitivity characteristics. When the compounded amount of the hindered phenol compound with respect to 100 parts by mass of the (A) resin is 0.1 parts by mass or more, for example, when the photosensitive resin composition of the present invention is formed on copper or a copper alloy, the occurrence of copper or copper alloy is prevented Discoloration or corrosion, on the other hand, when it is 20 parts by mass or less, the light sensitivity is excellent. The photosensitive resin composition of the present invention may contain a crosslinking agent. The crosslinking agent may be (A) a resin that can be crosslinked when the relief pattern formed by using the photosensitive resin composition of the present invention is heat-cured, or the crosslinking agent itself can form a crosslinked network structure. Agent. The crosslinking agent can further strengthen the heat resistance and chemical resistance of the cured film formed from the photosensitive resin composition. Examples of the cross-linking agent include Cymel (registered trademark) 300, 301, 303, 370, 325, 327, 701, 266, 267, 238, a compound containing methylol and / or alkoxymethyl, 1141, 272, 202, 1156, 1158, 1123, 1170, 1174, UFR 65, 300, Micoat 102, 105 (the above are manufactured by Mitsui Cytec); NIKALAC (registered trademark) MX-270, -280, -290, NIKALAC MS-11, NIKALAC MW-30, -100, -300, -390, -750 (the above are manufactured by SANWA CHEMICAL); DML-OCHP, DML-MBPC, DML-BPC, DML-PEP, DML-34X, DML -PSBP, DML-PTBP, DML-PCHP, DML-POP, DML-PFP, DML-MBOC, BisCMP-F, DML-BisOC-Z, DML-BisOCHP-Z, DML-BisOC-P, DMOM-PTBT, TMOM -BP, TMOM-BPA, TML-BPAF-MF (above manufactured by the State Chemical Industry Corporation); benzyl alcohol, bis (hydroxymethyl) cresol, bis (hydroxymethyl) dimethoxybenzene, bis (hydroxy Methyl) diphenyl ether, bis (hydroxymethyl) benzophenone, hydroxymethylbenzoate, hydroxymethylphenyl ester, bis (hydroxymethyl) biphenyl, dimethylbis (hydroxymethyl) biphenyl, Bis (methoxymethyl) benzene, bis (methoxymethyl) cresol, bis (methyl Methylmethyl) dimethoxybenzene, bis (methoxymethyl) diphenyl ether, bis (methoxymethyl) benzophenone, methoxymethylbenzoic acid, methoxymethylphenyl ester, Bis (methoxymethyl) biphenyl, dimethylbis (methoxymethyl) biphenyl and the like. In addition, phenol novolac epoxy resin, cresol novolac epoxy resin, bisphenol epoxy resin, triphenol epoxy resin, tetraphenol epoxy resin, Phenol-xylylene epoxy resin, naphthol-xylylene epoxy resin, phenol-naphthol epoxy resin, phenol-dicyclopentadiene epoxy resin, alicyclic epoxy resin , Aliphatic epoxy resin, diethylene glycol diglycidyl ether, sorbitol polyglycidyl ether, propylene glycol diglycidyl ether, trimethylolpropane polyglycidyl ether, 1,1,2,2-tetra (pair (Hydroxyphenyl) ethane tetraglycidyl ether, glycerol triglycidyl ether, o-second butylphenyl glycidyl ether, 1,6-bis (2,3-glycidoxy) naphthalene, diglycerol polyglycidyl Glyceryl ether, polyethylene glycol glycidyl ether, YDB-340, YDB-412, YDF-2001, YDF-2004 (the above are trade names, manufactured by Nippon Steel Chemical Co., Ltd.), NC-3000-H, EPPN- 501H, EOCN-1020, NC-7000L, EPPN-201L, XD-1000, EOCN-4600 (the above are the trade names, manufactured by Nippon Kayaku Co., Ltd.), Epikote (registrar ) 1001, Epikote 1007, Epikote 1009, Epikote 5050, Epikote 5051, Epikote 1031S, Epikote 180S65, Epikote 157H70, YX-315-75 (The above are the trade names, manufactured by Japan Epoxy Resins Co., Ltd.), EHPE3150, PLACCEL G402, PUE101 , PUE105 (the above are trade names, manufactured by Diacel Chemical Industries Co., Ltd.), EPICLON (registered trademark) 830, 850, 1050, N-680, N-690, N-695, N-770, HP-7200, HP- 820, EXA-4850-1000 (the above are trade names, manufactured by DIC Corporation), DENACOL (registered trademark) EX-201, EX-251, EX-203, EX-313, EX-314, EX-321, EX-411 , EX-511, EX-512, EX-612, EX-614, EX-614B, EX-711, EX-731, EX-810, EX-911, EM-150 (The above are trade names, manufactured by Nagase chemteX Corporation ), Epolight (registered trademark) 70P, Epolight 100MF (the above are the trade names, manufactured by Kyoeisha Chemical Co., Ltd.), etc. In addition, as the isocyanate group-containing compound, 4,4'-diphenylmethane diisocyanate, toluene diisocyanate, 1,3-benzenedimethylene diisocyanate, and dicyclohexylmethane-4,4'- Diisocyanate, isophorone diisocyanate, hexamethylene diisocyanate, Takenate (registered trademark) 500, 600, Cosmonate (registered trademark) NBDI, ND (above are the trade names, manufactured by Mitsui Chemicals), Duranate (registered trademark) ) 17B-60PX, TPA-B80E, MF-B60X, MF-K60X, E402-B80T (the above are trade names, manufactured by Asahi Kasei Chemicals) and the like. In addition, examples include 4,4'-diphenylmethanebiscis butylenediimine, phenylmethanecis butadienediimine, and m-phenylenebisimide as biscisbutylenediimine compounds. Cis-butene diimide, bisphenol A diphenyl ether, bis-cis-butene diimide, 3,3'-dimethyl-5,5'-diethyl-4,4'-diphenylmethane Dicis-butenedifluorene imine, 4-methyl-1,3-phenylenebiscis-butenedifluoreneimine, 1,6'-biscis-butenedifluorene- (2,2,4 -Trimethyl) hexane, 4,4'-diphenyl ether biscis butylene diimide, 4,4'-diphenyl osmium biscis butylene diimide, 1,3-bis (3 -Cis-butene-diimidephenoxy) benzene, 1,3-bis (4-cis-butenediimidephenoxy) benzene, BMI-1000, BMI-1100, BMI-2000, BMI-2300 , BMI-3000, BMI-4000, BMI-5100, BMI-7000, BMI-TMH, BMI-6000, BMI-8000 (the above are the trade names, manufactured by Daiwa Chemical Industry Co., Ltd.), etc., but as long as it is as described above Compounds which are generally thermally crosslinked are not limited to these. In the case of using a crosslinking agent, the blending amount is preferably 0.5 to 20 parts by mass, and more preferably 2 to 10 parts by mass, with respect to 100 parts by mass of the (A) resin. When the blending amount is 0.5 parts by mass or more, good heat resistance and chemical resistance are exhibited. On the other hand, when it is 20 parts by mass or less, storage stability is excellent. The photosensitive resin composition of the present invention may further include an organic titanium compound. By including an organic titanium compound, a photosensitive resin layer excellent in chemical resistance can be formed even when it is cured at a low temperature of about 250 ° C. In addition, by including both (B) a cyclic compound having a carbonyl group and an organic titanium compound in the photosensitive resin composition, the cured resin layer has not only excellent substrate adhesion but also excellent chemical resistance. effect. Examples of usable organic titanium compounds include those in which an organic chemical substance is bonded to a titanium atom via a covalent bond or an ionic bond. Specific examples of the organic titanium compound are shown in the following I) to VII): I) Titanium chelate compound: Among them, in terms of storage stability of the negative photosensitive resin composition and obtaining a good pattern, it is more preferable Titanium chelates with two or more alkoxy groups, specific examples are as follows: titanium bis (triethanolamine) diisopropoxide, titanium bis (2,4-glutaric acid) di-n-butoxide, bis (2,4 -Titanium glutarate) titanium diisopropoxide, titanium bis (tetramethylpimelate) diisopropoxide, titanium bis (ethylacetoacetate) diisopropoxide, and the like. II) Tetraalkoxy titanium compounds: for example, titanium (n-butanol), titanium tetraethoxide, titanium (2-ethylhexanol), titanium tetraisobutoxide, titanium tetraisopropoxide, titanium tetramethoxide, Titanium methoxypropoxide, titanium tetramethylphenol, titanium (n-nonanol), titanium (n-propanol), titanium stearate, tetra [bis {2,2- (allyloxymethyl) ) Butanol}] titanium and the like. III) Titanocene compounds: for example, (pentamethylcyclopentadienyl) titanium trimethoxide, bis (η ⁵ -2,4-cyclopentadien-1-yl) bis (2,6-difluorophenyl) titanium, bis (η ⁵ -2,4-cyclopentadien-1-yl) bis (2,6-difluoro-3- (1H-pyrrole-1-yl) phenyl) titanium and the like. IV) Titanium monoalkoxide compounds: For example, titanium tris (dioctyl phosphate) isopropoxide, titanium tris (dodecylbenzenesulfonic acid) isopropoxide, and the like. V) Titanium oxide compounds: for example, bis (glutaric acid) titanyl oxide, bis (tetramethylpimelate) titanyl oxide, titanyl phthalocyanine, and the like. VI) Titanium tetraacetamidine pyruvate compounds: For example, titanium tetraacetamidine pyruvate and the like. VII) Titanate coupling agent: for example, tris (dodecylbenzenesulfonyl) isopropyl titanate and the like. Among these, from the viewpoint of exhibiting better chemical resistance, the organic titanium compound is preferably selected from the group consisting of the above-mentioned I) titanium chelate compounds, II) tetraalkoxy titanium compounds, and III) titanocene compounds. At least one compound in the group. Especially preferred are titanium bis (ethylacetoacetate) diisopropoxide, titanium (n-butanol), and bis (η ⁵ -2,4-cyclopentadien-1-yl) bis (2,6-difluoro-3- (1H-pyrrole-1-yl) phenyl) titanium. The amount of the organic titanium compound to be prepared is preferably 0.05 to 10 parts by mass, and more preferably 0.1 to 2 parts by mass based on 100 parts by mass of the resin (A). When the blending amount is 0.05 parts by mass or more, good heat resistance and chemical resistance are exhibited. On the other hand, when it is 10 parts by mass or less, storage stability is excellent. Furthermore, in order to improve the adhesiveness between the film and the substrate formed using the photosensitive resin composition of the present invention, an adjuvant can be arbitrarily formulated. Examples of the adhesion promoter include γ-aminopropyldimethoxysilane, N- (β-aminoethyl) -γ-aminopropylmethyldimethoxysilane, and γ-glycidyloxy Propylmethyldimethoxysilane, γ-mercaptopropylmethyldimethoxysilane, 3-methacryloxypropyldimethoxymethylsilane, 3-methacryloxysilane Propyltrimethoxysilane, dimethoxymethyl-3-piperidylpropylsilane, diethoxy-3-glycidyloxypropylmethylsilane, N- (3-diethoxymethyl Silylpropyl) succinimide, N- [3- (triethoxysilyl) propyl] xylylenediamine, benzophenone-3,3'-bis (N- [ 3-triethoxysilyl] propylamidoamine) -4,4'-dicarboxylic acid, benzene-1,4-bis (N- [3-triethoxysilyl] propylamidoamine)- 2,5-dicarboxylic acid, 3- (triethoxysilyl) propylsuccinic anhydride, N-phenylaminopropyltrimethoxysilane, 3-ureidopropyltrimethoxysilane, 3- Silane coupling agents such as ureidopropyltriethoxysilane, 3- (trialkoxysilyl) propylsuccinic anhydride, and aluminum tris (ethylacetoacetate), aluminum tris (acetacetate), ethyl乙基 Ethyl aluminum diiso Aluminum-based adhesives such as propyl ester. Among these adhesion promoters, in terms of adhesion, it is more preferable to use a silane coupling agent. When the photosensitive resin composition contains a co-agent, the blending amount of the co-agent is preferably in the range of 0.5 to 25 parts by mass based on 100 parts by mass of the resin (A). Examples of the silane coupling agent include 3-mercaptopropyltrimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd .: trade name KBM803, manufactured by Chisso Co., Ltd .: trade name Sila-Ace S810), and 3-mercaptopropyltrimethoxysilane. Ethoxysilane (manufactured by Azmax Co., Ltd .: trade name SIM6475.0), 3-mercaptopropylmethyldimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd .: trade name LS1375, manufactured by Azmax Co., Ltd .: merchandise Name SIM6474.0), mercaptomethyltrimethoxysilane (manufactured by Azmax Co., Ltd .: trade name SIM6473.5C), mercaptomethylmethyldimethoxysilane (manufactured by Azmax Co., Ltd .: trade name SIM6473.0) , 3-mercaptopropyldiethoxymethoxysilane, 3-mercaptopropylethoxydimethoxysilane, 3-mercaptopropyltripropoxysilane, 3-mercaptopropyldiethoxypropyl Oxysilane, 3-mercaptopropylethoxydipropoxysilane, 3-mercaptopropyldimethoxypropoxysilane, 3-mercaptopropylmethoxydipropoxysilane, 2-mercaptoethyl Trimethoxysilane, 2-mercaptoethyldiethoxymethoxysilane, 2-mercaptoethyl Ethoxydimethoxysilane, 2-mercaptoethyltripropoxysilane, 2-mercaptoethyltripropoxysilane, 2-mercaptoethylethoxydipropoxysilane, 2-mercaptoethyl Dimethoxypropoxysilane, 2-mercaptoethylmethoxydipropoxysilane, 4-mercaptobutyltrimethoxysilane, 4-mercaptobutyltriethoxysilane, 4-mercaptobutyl Tripropoxysilane, N- (3-triethoxysilylpropyl) urea (manufactured by Shin-Etsu Chemical Industry Co., Ltd .: trade name LS3610, Azmax Co., Ltd .: trade name SIU9055.0), N- ( 3-trimethoxysilylpropyl) urea (manufactured by Azmax Co., Ltd .: trade name SIU9058.0), N- (3-diethoxymethoxysilylpropyl) urea, N- (3-ethyl Oxydimethoxysilylpropyl) urea, N- (3-tripropoxysilylpropyl) urea, N- (3-diethoxypropoxysilylpropyl) urea, N- (3-ethoxydipropoxysilylpropyl) urea, N- (3-dimethoxypropoxysilylpropyl) urea, N- (3-methoxydipropoxysilyl) Propyl) urea, N- (3-trimethoxysilylethyl) urea, N- (3-ethoxydimethoxysilylethyl) urea, N -(3-tripropoxysilylethyl) urea, N- (3-tripropoxysilylethyl) urea, N- (3-ethoxydipropoxysilylethyl) urea, N- (3-dimethoxypropoxysilylethyl) urea, N- (3-methoxydipropoxysilylethyl) urea, N- (3-trimethoxysilylbutyl) ) Urea, N- (3-triethoxysilylbutyl) urea, N- (3-tripropoxysilylbutyl) urea, 3- (m-aminophenoxy) propyltrimethoxy Silane (manufactured by Azmax Corporation: trade name SLA0598.0), m-aminophenyltrimethoxysilane (manufactured by Azmax Corporation: trade name SLA0599.0), p-aminophenyltrimethoxysilane (Azmax Manufactured by a joint-stock company: trade name SLA0599.1), Aminophenyltrimethoxysilane (manufactured by Azmax Co., Ltd .: trade name SLA0599.2), 2- (trimethoxysilylethyl) pyridine (Azmax shares limited) Company manufacturing: trade name SIT8396.0), 2- (triethoxysilylethyl) pyridine, 2- (dimethoxysilylmethylethyl) pyridine, 2- (diethoxysilylmethyl) Ethyl) pyridine, urethane (3-triethoxysilylpropyl) third butyl ester, (3-glycidyloxy (Propyl) triethoxysilane, tetramethoxysilane, tetraethoxysilane, tetra-n-propoxysilane, tetraisopropoxysilane, tetra-n-butoxysilane, tetraisobutoxysilane, Tertiary butoxysilane, tetrakis (methoxyethoxysilane), tetrakis (methoxyn-propoxysilane), tetrakis (ethoxyethoxysilane), tetrakis (ethoxyethoxyethyl) Oxysilane), bis (trimethoxysilyl) ethane, bis (trimethoxysilyl) hexane, bis (triethoxysilyl) methane, bis (triethoxysilyl) ethane, Bis (triethoxysilyl) ethylene, bis (triethoxysilyl) octane, bis (triethoxysilyl) octadiene, bis (3- (triethoxysilyl) propyl ] Disulfide, bis [3- (triethoxysilyl) propyl] tetrasulfide, second and third butoxydiethoxysilane, diisobutoxyaluminumoxytriethoxysilane Bis (glutaric acid) titanium-O, O'-bis (oxyethyl) -aminopropyltriethoxysilane, phenylsilanetriol, methylphenylsilanediol, ethylphenyl Silanediol, n-propylphenylsilanediol, isopropylphenylsilanediol, n-butylphenylsilanediol , Isobutylphenylsilanediol, third butylphenylsilanediol, diphenylsilanediol, dimethoxydiphenylsilane, diethoxydiphenylsilane, dimethoxydiphenyl P-tolylsilane, ethylmethylphenylsilanol, n-propylmethylphenylsilanol, isopropylmethylphenylsilanol, n-butylmethylphenylsilanol, isobutylmethylphenylsilanol, Tert-butylmethylphenylsilanol, ethyl-n-propylphenylsilanol, ethylisopropylphenylsilanol, n-butylethylphenylsilanol, isobutylethylphenylsilanol, Tributylethylphenylsilanol, methyldiphenylsilanol, ethyldiphenylsilanol, n-propyldiphenylsilanol, isopropyldiphenylsilanol, n-butyldiphenyl Silanol, isobutyldiphenylsilanol, third butyldiphenylsilanol, triphenylsilanol, and the like are not limited thereto. These may be used alone or in combination. As the silane coupling agent, among the above-mentioned silane coupling agents, from the viewpoint of storage stability, phenylsilane triol, trimethoxyphenylsilane, trimethoxy (p-tolyl) silane, and diphenyl are preferred. Silanediol, dimethoxydiphenylsilane, diethoxydiphenylsilane, dimethoxydi-p-tolylsilane, triphenylsilanol, and a silane coupling agent represented by the following structure. [Chemical 87] The blending amount when a silane coupling agent is used is preferably 0.01 to 20 parts by mass based on 100 parts by mass of the resin (A). The photosensitive resin composition of the present invention may further contain components other than the components described above. The preferred component is based on, for example, a negative type using a polyimide precursor and polyimide as the (A) resin or a positive type using a polyoxazole precursor, a soluble polyimide, and a phenol resin. different. In the case where a polyimide precursor, polyamidine, or the like is used as the negative type of the (A) resin, a sensitizer can be arbitrarily blended in order to improve the light sensitivity. Examples of the sensitizer include Michelin, 4,4'-bis (diethylamino) benzophenone, and 2,5-bis (4'-diethylaminobenzylidene). ) Cyclopentane, 2,6-bis (4'-diethylaminobenzylidene) cyclohexanone, 2,6-bis (4'-diethylaminobenzylidene) -4-methyl Cyclohexanone, 4,4'-bis (dimethylamino) chalcone, 4,4'-bis (diethylamino) chalcone, p-dimethylaminocinnamidindanone , P-dimethylaminobenzylideneindanone, 2- (p-dimethylaminophenylphenylene) benzothiazole, 2- (p-dimethylaminophenylphenylene) benzothiazole , 2- (p-dimethylaminophenylphenylene) isonaphthothiazole, 1,3-bis (4'-dimethylaminobenzylidene) acetone, 1,3-bis (4'-di Ethylaminobenzylidene) acetone, 3,3'-carbonyl-bis (7-diethylaminocoumarin), 3-ethylamido-7-dimethylaminocoumarin, 3- Ethoxycarbonyl-7-dimethylaminocoumarin, 3-benzyloxycarbonyl-7-dimethylaminocoumarin, 3-methoxycarbonyl-7-diethylaminocoumarin Peptin, 3-ethoxycarbonyl-7-diethylaminocoumarin, N-phenyl-N'-ethylethanolamine, N-phenyldiethanolamine, N-p-toluene Diethanolamine, N-phenylethanolamine, 4-&#134156; phenobenzophenone, dimethylamino isobenzoate, diethylamino isobenzoate, 2-mercaptobenzimidazole , 1-phenyl-5-mercaptotetrazole, 2-mercaptobenzothiazole, 2- (p-dimethylaminostyryl) benzoxazole, 2- (p-dimethylaminostyryl) Benzothiazole, 2- (p-dimethylaminostyryl) naphtho (1,2-d) thiazole, 2- (p-dimethylaminobenzyl) styrene, and the like. These may be used alone or in a combination of, for example, 2 to 5. When the photosensitive resin composition contains a sensitizer for improving the light sensitivity, it is preferably 0.1 to 25 parts by mass relative to 100 parts by mass of the resin (A). In addition, in order to improve the resolution of the relief pattern, a monomer having a photopolymerizable unsaturated bond can be arbitrarily blended. As such a monomer, a (meth) acrylic compound which undergoes a radical polymerization reaction with a photopolymerization initiator is not particularly limited to the following, and examples include diethylene glycol dimethyl Mono- or diacrylates of ethylene glycol or polyethylene glycol such as methacrylate, tetraethylene glycol dimethacrylate, and methacrylate, propylene glycol or polypropylene glycol mono or diacrylate, and methacrylate, Mono-, di- or tri-acrylates and methacrylates of glycerol, cyclohexane diacrylates and dimethacrylates, 1,4-butanediol diacrylates and dimethacrylates, 1,6- Diacrylates and dimethacrylates of hexanediol, diacrylates and dimethacrylates of neopentyl glycol, mono or diacrylates and methacrylates of bisphenol A, benzenetrimethacrylates , Iso-acrylic acid esters and iso-methacrylic acid esters, acrylamide and its derivatives, methacrylamide and its derivatives, trimethylolpropane triacrylate and methacrylate , Two or three glycerol and methacrylate, pentaerythritol Compound of di-, tri- or tetra-acrylate and methacrylate, and ethylene oxide or propylene oxide adducts of such compounds and the like. When the photosensitive resin composition contains the monomer having a photopolymerizable unsaturated bond to improve the resolvability of the relief pattern, the blending amount of the monomer having a photopolymerizable unsaturated bond, 1-50 mass parts is preferable with respect to 100 mass parts of (A) resin. In the case of using a polyimide precursor or the like as the negative type of the (A) resin, it is particularly intended to improve the stability of the viscosity and light sensitivity of the photosensitive resin composition when stored in a solution containing a solvent. The thermal polymerization inhibitor can be arbitrarily formulated. As the thermal polymerization inhibitor, hydroquinone, N-nitrosodiphenylamine, p-tert-butylcatechol, phenothiamine, N-phenylnaphthylamine, ethylenediaminetetraacetic acid can be used. , 1,2-cyclohexanediaminetetraacetic acid, glycol ether diaminetetraacetic acid, 2,6-di-tert-butyl-p-methylphenol, 5-nitroso-8-hydroxyquinoline, 1-nitroso 2-naphthol, 2-nitroso-1-naphthol, 2-nitroso-5- (N-ethyl-N-sulfopropylamino) phenol, N-nitroso-N- Phenylhydroxylamine ammonium salt, N-nitroso-N (1-naphthyl) hydroxylamine ammonium salt, and the like. The blending amount when the thermal polymerization inhibitor is blended in the photosensitive resin composition is preferably in the range of 0.005 to 12 parts by mass relative to 100 parts by mass of the (A) resin. On the other hand, in the case of using a polyoxazole precursor or the like as the positive type of the (A) resin in the photosensitive resin composition of the present invention, a dye previously used as an additive of the photosensitive resin composition may be added as necessary. , Surfactants, and thermal acid generators, dissolution accelerators, and adhesion promoters to improve adhesion to substrates. <Dyes, Surfactants, and Adhesives> If the above additives are more specifically described, examples of the dyes include methyl violet, crystal violet, and malachite green. Examples of the surfactant include nonionic surfactants containing polyglycols such as polypropylene glycol or polyoxyethylene lauryl ether or derivatives thereof, such as Fluorad (trade name, manufactured by Sumitomo 3M Corporation), and MEGAFAC ( Trade name, such as fluorine-based surfactants such as Dainippon Ink & Chemical Industry) or Lumiflon (trade name, manufactured by Asahi Glass Co., Ltd.), such as KP341 (trade name, manufactured by Shin-Etsu Chemical Co., Ltd.), DBE (trade name, manufactured by Chisso) , Glano (trade name, manufactured by Kyoeisha Chemical Co., Ltd.) and other organosiloxane surfactants. Examples of the adhesion assistant include alkylimidazoline, butyric acid, alkyl acid, polyhydroxystyrene, polyvinyl methyl ether, tertiary butyl novolac, epoxy silane, epoxy polymer, and the like, and Various silane coupling agents. The blending amount of the dye and the surfactant is preferably 0.1 to 30 parts by mass based on 100 parts by mass of the resin (A). From the viewpoint of exhibiting good thermal and mechanical properties of the cured product even when the curing temperature is lowered, the thermal acid generator can be arbitrarily blended. From the viewpoint of exhibiting good thermal and mechanical properties of the cured product even when the curing temperature is lowered, it is preferable to blend a thermal acid generator. Examples of the thermal acid generator include a salt formed of a strong acid and a base such as an onium salt having a function of generating an acid by heat, or a sulfonium imine sulfonate. Examples of onium salts include diarylsulfonium salts such as aryldiazonium salts and diphenylphosphonium salts; di (alkylaryl) phosphonium salts such as bis (thirdbutylphenyl) phosphonium salts; and three Trialkylphosphonium salts such as methylphosphonium salts; dialkylmonoarylphosphonium salts such as dimethylphenylphosphonium salts; diarylmonoalkylphosphonium salts such as diphenylmethylphosphonium salts; triarylphosphonium salts Salt, etc. Among these, bis (third-butylphenyl) sulfonium salt of p-toluenesulfonic acid, bis (third-butylphenyl) sulfonium salt of trifluoromethanesulfonic acid, and three of trifluoromethanesulfonic acid are preferred. Methyl sulfonium salt, dimethylphenyl sulfonium salt of trifluoromethanesulfonic acid, diphenylmethyl sulfonium salt of trifluoromethanesulfonic acid, bis (third butylphenyl) sulfonium salt of nonafluorobutanesulfonic acid , Diphenylphosphonium salt of camphorsulfonic acid, diphenylphosphonium salt of ethanesulfonic acid, dimethylphenylphosphonium salt of benzenesulfonic acid, diphenylmethylphosphonium salt of toluenesulfonic acid, and the like. In addition, as the salt formed from a strong acid and a base, in addition to the onium salt described above, a salt formed from a strong acid and a base such as a pyridinium salt can also be used. Examples of the strong acid include arylsulfonic acids such as p-toluenesulfonic acid and benzenesulfonic acid, perfluoroalkylsulfonic acids such as camphorsulfonic acid, trifluoromethanesulfonic acid, and nonafluorobutanesulfonic acid, and methanesulfonic acid. Alkyl sulfonic acid such as ethanesulfonic acid, butanesulfonic acid, and the like. Examples of the base include pyridine, alkylpyridines such as 2,4,6-trimethylpyridine, N-alkylpyridines such as 2-chloro-N-methylpyridine, and halogenated-N-alkylpyridines Wait. Examples of the sulfonium imine sulfonate include naphthylimidine sulfonate, phthalimide sulfonate, and the like. The compound is not limited as long as it is a compound that generates an acid under the action of heat. In the case of using a thermal acid generator, the amount is preferably 0.1 to 30 parts by mass, more preferably 0.5 to 10 parts by mass, and still more preferably 1 to 5 parts by mass relative to 100 parts by mass of the resin (A). . In the case of a positive-type photosensitive resin composition, a dissolution accelerator may be used in order to promote the removal of useless resin after photosensitivity. A compound having, for example, a hydroxyl group or a carboxyl group is preferred. Examples of the compound having a hydroxyl group include ballasting agents for the naphthoquinonediazide compounds described above, and straight chains such as p-cumylphenol, bisphenols, resorcinols, and MtrisPC and MtetraPC. Phenol compounds, non-linear phenol compounds such as TrisP-HAP, TrisP-PHBA, and TrisP-PA (all manufactured by Honshu Chemical Industry Co., Ltd.), 2 to 5 phenol substitutions of diphenylmethane, 3,3-bis One to five phenol substitutions of phenylpropane, 2,2-bis- (3-amino-4-hydroxyphenyl) hexafluoropropane and 5-nor &#158665; ene-2,3-dicarboxylic acid A compound obtained by reacting an acid anhydride with a molar ratio of 1: 2, and a reaction of bis- (3-amino-4-hydroxyphenyl) fluorene and 1,2-cyclohexyldicarboxylic acid anhydride with a molar ratio of 1: 2 The obtained compound, N-hydroxysuccinimide, N-hydroxyphthalimide, N-hydroxy 5-nor &#158665; ene-2,3-dicarboximide, and the like. Examples of the compound having a carboxyl group include 3-phenyllactic acid, 4-hydroxyphenyllactic acid, 4-hydroxypicromantic acid, 3,4-dihydroxypicromantic acid, and 4-hydroxy-3-methoxy Amygdonic acid, 2-methoxy-2- (1-naphthyl) propionic acid, amygdonic acid, 2-phenyllactic acid, α-methoxyphenylacetic acid, O-ethyrylamic acid, Ikon Acid etc. The compounding amount when a dissolution accelerator is used is preferably 0.1 to 30 parts by mass based on 100 parts by mass of the (A) resin. (Aspect B) In another aspect of this embodiment, (B) a sulfur-containing compound may be used instead of (B) the cyclic compound having a carbonyl group. More specifically, there is provided a photosensitive resin composition comprising (A) selected from the group consisting of polyamic acid, polyamidate, polyamidate, polyhydroxyamidoamine, polyamidoamine, polyamidoamine At least one resin in the group consisting of amine, polyamidoimine, polyamidoimide, polybenzoxazole, and novolac, polyhydroxystyrene, and phenol resin: 100 parts by mass, (B) sulfur-containing Compound: 0.01 to 10 parts by mass based on 100 parts by mass of the above (A) resin, and (C) Photosensitizer: 1 to 50 parts by mass based on 100 parts by mass of the (A) resin. In this aspect, the (A) resin is preferably selected from the group consisting of a polyimide precursor containing the above-mentioned general formula (1), a polyfluorene containing the above-mentioned general formula (4), and a resin containing the above-mentioned general formula (5). A polyoxazole precursor, a polyimide comprising the general formula (6), and at least one selected from the group consisting of a novolac, a polyhydroxystyrene, and a phenol resin containing the general formula (7). The photosensitive resin composition preferably includes a phenol resin having a repeating unit represented by the general formula (7), and X in the general formula (7) is a divalent compound selected from the general formula (9). And a divalent organic group in the group consisting of a divalent group represented by the above general formula (10). By preparing a sulfur-containing compound in the photosensitive resin composition, a photosensitive resin composition capable of forming a cured film in which void generation at the interface in contact with the Cu layer after the high-temperature storage test is suppressed can be obtained. (B) The sulfur-containing compound is an organic compound having sulfur, preferably sulfur and nitrogen, and sulfur is preferably contained in the form of an atom or a thiocarbonyl group forming a ring structure. As for those useful as (B) sulfur-containing compounds, those containing sulfur as one atom forming a 5-membered ring structure include, for example, thiazole, 2-aminothiazole, and 2- (4-thiazolyl) benzo Imidazole, 1,3,4-thiadiazole, 2-amino-1,3,4-thiadiazole, 5-amino-1,2,3-thiadiazole, 2,4-thiazolidinedione , Benzothiazole, 2-aminobenzothiazole, etc., as those containing sulfur in the form of an atom forming a 6-membered ring structure, for example, phenothia &#134116;; Etc., as those containing sulfur in the form of thiocarbonyl group, for example, rhodan, N-allyl rhodan, diethylthiourea, dibutylthiourea, dicyclohexylthiourea, diphenyl Thiourea, 2-thiouracil, 4-thiouracil, 2,4-dimercaptopyrimidine, 2-9-oxothio &#134079; , 2-mercapto-4 (3H) -quinazolinone, and the like. Among these, it is preferable to use a compound having a thiourea structure. The blending amount of the (B) sulfur-containing compound is 0.01 to 10 parts by mass, and preferably 0.05 to 2 parts by mass with respect to 100 parts by mass of the resin (A). From the viewpoint of migration resistance, it is more preferably 0.01 parts by mass or more, and from the viewpoint of solubility, it is more preferably less than 10 parts by mass. Sulfur-containing compounds, especially thioureas, can coordinate with copper via sulfur atoms. Thereby, the state of the copper surface is changed, and copper migration is suppressed from occurring in the high-temperature storage test. (Aspect C) In another aspect of this embodiment, at least one compound (B) selected from the following general formulae (B-1), (B-2), and (B-3) may be used instead The (B) cyclic compound having a carbonyl group. More specifically, there is provided a photosensitive resin composition comprising (A) selected from the group consisting of polyamic acid, polyamidate, polyamidate, polyhydroxyamidoamine, polyamidoamine, polyamidoamine At least one resin in the group consisting of amine, polyamidoimine, polyamidoimide, polybenzoxazole, and novolac, polyhydroxystyrene, and phenol resin: 100 parts by mass, (B) selected from The following general formula (B-1): {Where R _q1 Represents an organic group having 1 to 10 carbon atoms formed by a carbon atom, a hydrogen atom, a nitrogen atom, and an oxygen atom} and the following general formula (B-2): {Where R _q2 , R _q3 Respectively represents an organic group selected from a hydroxyl group, an alkyl group having 1 to 10 carbon atoms or an alkoxy group, ll represents an integer selected from 1 to 10}, and the following general formula (B-3): [化 90] {Where R _q4 , R _q5 Respectively an organic group selected from a hydroxyl group, an alkyl group having 1 to 10 carbon atoms or an alkoxy group, and X _S Represents a bivalent hydrocarbon group having 1 to 10 carbon atoms, and mm and nn represent at least one compound selected from the integers 1 to 10: 0.01 to 10 parts by mass based on 100 parts by mass of the above (A) resin, and (C) Photosensitizer: 1 to 50 parts by mass based on 100 parts by mass of the resin (A). In this aspect, the (A) resin is preferably selected from the group consisting of a polyimide precursor containing the above-mentioned general formula (1), a polyfluorene containing the above-mentioned general formula (4), and a resin containing the above-mentioned general formula (5). A polyoxazole precursor, a polyimide comprising the general formula (6), and at least one selected from the group consisting of a novolac, a polyhydroxystyrene, and a phenol resin containing the general formula (7). The photosensitive resin composition preferably includes a phenol resin having a repeating unit represented by the general formula (7), and X in the general formula (7) is a divalent compound selected from the general formula (9). And a divalent organic group in the group consisting of a divalent group represented by the above general formula (10). (B) The compounds represented by the general formulae (B-1), (B-2) and (B-3), preferably the compounds represented by (B-1) Surface interactions can change the surface state of copper. Therefore, occurrence of copper migration during the high-temperature storage test is suppressed. As a specific example, (B-1) is an organic compound formed from a carbon atom, a hydrogen atom, a nitrogen atom, and an oxygen atom having a ureido group, and examples thereof include methyl urea, ethyl urea, butyl urea, and phenyl Urea, hydroxyethylurea, hydantoin, allantoin, citrulline, etc. and mixtures thereof. (B-2) is a polycondensate of ethylene glycol or a terminal etherified product thereof, and examples thereof include diethylene glycol, diethylene glycol monomethyl ether, diethylene glycol dimethyl ether, and diethylene glycol dibutyl ether. Ether, triethylene glycol, triethylene glycol monoethyl ether, triethylene glycol diethyl ether, tetraethylene glycol, tetraethylene glycol dimethyl ether, and the like and mixtures thereof. Furthermore, (B-3) is an alkoxy polyethylene oxide ester or alkoxyethyl ester of a dicarboxylic acid, and examples thereof include bis (2-methoxyethyl) adipate, and hexane Bis (2-butoxyethyl) diacid, bis (2-ethoxyethyl) sebacate, etc. and mixtures thereof. The (B) is selected from at least one compound of the general formulae (B-1), (B-2) and (B-3), and the compound represented by the general formula (B-1) can be preferably used . The compounding amount of (B) at least one compound selected from the general formulae (B-1), (B-2), and (B-3) is preferably 0.01 to 10 with respect to 100 parts by mass of the resin (A). It is more preferably 0.05 to 2 parts by mass. From the viewpoint of migration resistance, it is more preferably 0.01 parts by mass or more, and from the viewpoint of solubility, more preferably 10 parts by mass or less. (Aspect D) In another aspect of this embodiment, (B) an aromatic amine compound, that is, selected from the group consisting of an aniline derivative represented by the following general formula (I), and a general formula (II) At least one selected from the group consisting of the triazole derivative represented by the following formula (III) and the triazole derivative represented by the following general formula (III) is substituted for the cyclic compound having a carbonyl group (B). More specifically, there is provided a photosensitive resin composition comprising (A) selected from the group consisting of polyamic acid, polyamidate, polyamidate, polyhydroxyamidoamine, polyamidoamine, polyamidoamine At least one resin in the group consisting of amine, polyamidoimine, polyamidoimide, and polybenzoxazole: 100 parts by mass, (B) an aromatic amine compound, that is, the following general formula (I) ： [化 91] {Ra1 to Ra5 may be the same or different, respectively, and are a hydrogen atom or a hydroxyl group, or a saturated hydrocarbon group, an unsaturated hydrocarbon group, an aromatic group, or an amido group having an integer of 1 to 15 and a carbon number, and Ra6 to Ra7 may be the same. It may be different, and it is a saturated hydrocarbon group, an unsaturated hydrocarbon group, or an aromatic group represented by a hydrogen atom or an integer of 1 to 5 carbon atoms, or an aniline derivative represented by the following formula (II): [Chem 92 ] Each of Ra8 to Ra10 may be the same or different, and is a triazole derivative represented by a hydrogen atom or a hydroxyl group, or a saturated hydrocarbon group, unsaturated hydrocarbon group, aromatic group, or amido group having an integer of 1 to 15 carbon atoms} Or the following general formula (III): Each of R11 to R13 may be the same or different, and is a triazole derivative represented by a hydrogen atom or a hydroxyl group, or a saturated hydrocarbon group, unsaturated hydrocarbon group, aromatic group, or amido group having an integer of 1 to 15 carbon atoms} At least any one of them: 0.01 to 15 parts by mass based on 100 parts by mass of the above (A) resin, and (C) photosensitizer: 1 to 50 parts by mass based on 100 parts by mass of the (A) resin. In this aspect, the (A) resin is preferably selected from the group consisting of a polyimide precursor containing the above-mentioned general formula (1), a polyfluorene containing the above-mentioned general formula (4), and a resin containing the above-mentioned general formula (5). At least one of a polyoxazole precursor and a group consisting of polyoximine of the general formula (6). In the case where (B) the aromatic amine compound is used, as the photosensitive resin, polyamic acid, polyamidate, polyamidate, polyhydroxyamidoamine, polyamidoamine, polyamidoamine can be used. Polyamines, polyamidoimines, polyamidoimides, and polybenzoxazoles, among them, polyamines, polyfluorenes are preferably used in terms of excellent heat resistance and mechanical properties of the resin after heat treatment. Urethane, polyamidate, polyamidoamine, polyhydroxyamidoamine, polyamidoimide resin, and polyamidoimide precursors and polyamidoimide resins are most preferably used. By using the (B) aromatic amine compound, generation of voids at the interface between the Cu layer and the resin layer to be rewired after the high-temperature storage test can be suppressed. The reason for this has not yet been determined, and it is thought to be due to the effect that the lone electron pair of the aromatic amine compound is coordinated with the Cu element on the surface of the Cu layer, and the active Cu reaction site is blocked, thereby suppressing generation of voids. As the (B) aromatic amine compound, the following general formula (I) can be preferably used: {Ra1 to Ra5 may be the same or different, respectively, and are a hydrogen atom or a hydroxyl group, or a saturated hydrocarbon group, an unsaturated hydrocarbon group, an aromatic group, or an amido group having an integer of 1 to 15 and a carbon number, and Ra6 to Ra7 may be the same. It may be different, and it is an aniline derivative represented by a hydrogen atom or a saturated hydrocarbon group, unsaturated hydrocarbon group, or aromatic group having an integer of 1 to 5 carbon atoms. As examples of compounds suitable for use among the aniline derivatives represented by the general formula (I), N-phenylbenzylamine, salicylide aniline, naphthol AS, 2-acetamidinium hydrazone, Cirrhidine, N-allyl aniline, N-methyl aniline, N-ethyl aniline, indolin, N-n-butyl aniline, 2-aniline ethanol, 4-methoxyacetanilide, Ethyl acetoanilide, 1,2,3,4-tetrahydroquinoline, tertiary butyl phenylaminoformate, tertiary butyl (3-hydroxyphenyl) aminoformate, triclopidine, N, N'-diphenylethane-1,2-diamine and the like. Among them, N-phenylbenzylamine ((B) -1), N, N'-diphenylethane-1,2-diamine ((B) -2), aminocarboxylic acid can be particularly preferably used. Third butyl phenyl ester ((B) -3), (3-hydroxyphenyl) amino carboxylic acid third butyl ester ((B) -4). [Chem 95] [Chem 96] [Chem 97] [Chemical 98] As the (B) triazole derivative, the following general formula (II) can be preferably used: Each of Ra8 to Ra10 may be the same or different, and is a triazole derivative represented by a hydrogen atom or a hydroxyl group, or a saturated hydrocarbon group, unsaturated hydrocarbon group, aromatic group, or amido group having an integer of 1 to 15 carbon atoms} Or the following general formula (III): Each of Ra11 to Ra13 may be the same or different, and is a triazole derivative represented by a hydrogen atom or a hydroxyl group, or a saturated hydrocarbon group, unsaturated hydrocarbon group, aromatic group, or amido group having an integer of 1 to 15 carbon atoms} Thing. As specific examples of the compound of the triazole derivative represented by the general formula (II), benzotriazole, 1-hydroxybenzotriazole, 1-aminobenzotriazole, and 5-methyl are preferably used. -1H-benzotriazole, 1H-1,2,3-triazole, 2-hydroxy-N- (1H-1,2,4-triazol-3-yl) benzamide (ADEKA Corporation) Manufactured by Adekastab CDA-1), 2- (2H-benzo [d] [1,2,3] triazol-2-yl) -4- (2,4,4-trimethylpentane-2- ) Phenol (manufactured by ADEKA Corporation, Adekastab LA-29), 2- (2'-hydroxy-3 ', 5'-tertiary aminophenyl) benzotriazole, 2- (2'-hydroxy -5'-methylphenyl) benzotriazole. Among them, 2-hydroxy-N- (1H-1,2,4-triazol-3-yl) benzamide ((B) -5), 2- (2H-benzo [d ] [1,2,3] triazol-2-yl) -4- (2,4,4-trimethylpentane-2-yl) phenol ((B) -6). [Chemical 101] [Chemical 102] As a specific compound example of the triazole derivative represented by the general formula (III), (4-((1H-1,2,4-triazol-1-ylmethyl) phenyl) methanol) can be preferably used. , Trisazole, 1,2,4-1H-triazole, triapenthenol, bitertanol, 4- (1H-1,2,4-triazol-1-yl) benzaldehyde , 4- (1H-1,2,4-triazol-1-yl) benzoic acid, 3- (1H-1,2,4-triazol-1-ylmethyl) benzoic acid, 4-[(1H -1,2,4-triazol-1-ylmethyl) phenyl] methanol, 3- (1H-1,2,4-triazol-1-yl) benzaldehyde, 3- (1H-1,2 , 4-triazol-1-ylmethyl) benzaldehyde, 3- (1H-1,2,4-triazol-1-yl) benzoic acid, 2- (1H-1,2,4-triazole- 1-yl) aniline. Among them, (4-((1H-1,2,4-triazol-1-ylmethyl) phenyl) methanol ((B) -7) is particularly preferably used.) ] (B) Among the aromatic amine compounds, it is preferable that any of the amine atoms constituting the aniline derivative or the triazole derivative is a secondary amine in terms of the coordination ability with the Cu element. The content of the (B) aromatic amine compound is preferably 0.01 to 15 parts by mass, more preferably 0.1 to 10 parts by mass, and even more preferably 1 to 8 parts by mass based on 100 parts by mass of the resin (A). If the content is more than this range, storage stability is lowered, so it is not good. If the content is less than this range, voids are likely to occur with the copper surface. <Manufacturing method of hardened embossed pattern and semiconductor device> The present invention also provides a method of manufacturing hardened embossed pattern, comprising: (1) applying the photosensitive resin composition of the present invention to a substrate; A step of forming a resin layer on the substrate; (2) a step of exposing the resin layer; (3) a step of developing the exposed resin layer to form a relief pattern; and (4) a step of The step of heating the pattern to form a hardened relief pattern. The typical aspects of each step are described below. (1) Step of forming a resin layer on a substrate by coating a photosensitive resin composition on a substrate In this step, the photosensitive resin composition of the present invention is coated on a substrate, and then dried if necessary. A resin layer is formed. As the coating method, a method previously used for coating the photosensitive resin composition can be adopted, such as a spin coater, a bar coater, a blade coater, a curtain coater, a screen printing machine, and the like. A method for coating, a method for spray coating with a spray coater, and the like. The coating film containing a photosensitive resin composition can be dried as needed. As the drying method, methods such as air drying, heating drying using an oven or a hot plate, and vacuum drying can be used. Specifically, in the case of air-drying or heat-drying, drying can be performed at 20 ° C to 140 ° C for 1 minute to 1 hour. The resin layer can be formed on the substrate in the above manner. (2) Step of exposing the resin layer In this step, an exposure device such as a contact exposure machine, a mirror projection exposure machine, a stepper, etc. is used, and a patterned photomask or reticle, Alternatively, the formed resin layer is directly exposed by an ultraviolet light source or the like. Thereafter, in order to improve the light sensitivity, etc., a post-exposure baking (PEB) and / or a pre-development baking under any combination of temperature and time may be performed as needed. The range of the baking conditions is preferably temperature: 40 to 120 ° C, and time: 10 seconds to 240 seconds, but the range is not limited as long as the characteristics of the photosensitive resin composition of the present invention are not impaired. (3) Step of developing the exposed resin layer to form a relief pattern In this step, the exposed or unexposed portion of the photosensitive resin layer after exposure is developed and removed. When a negative type photosensitive resin composition is used (for example, when a polyimide precursor or polyimide is used as the (A) resin), the unexposed portion is developed and removed, and a positive type photosensitive resin is used. In the case of a composition (for example, when a polyoxazole precursor or a soluble polyimide is used as the (A) resin), the exposed portion is developed and removed. As the development method, any method may be selected from among previously known development methods of photoresist, such as a rotary spray method, a liquid coating method, an immersion method with ultrasonic treatment, and the like. In addition, after the development, in order to adjust the shape of the relief pattern, etc., if necessary, a post-development baking under a condition of a combination of temperature and time may be performed. As a developing solution used for development, a good solvent for a photosensitive resin composition or a combination of the good solvent and a poor solvent is preferred. For example, in the case of a photosensitive resin composition insoluble in an alkaline aqueous solution, as a good solvent, N-methylpyrrolidone, N-cyclohexyl-2-pyrrolidone, and N, N-dimethyl are preferred. Acetylamine, cyclopentanone, cyclohexanone, γ-butyrolactone, α-ethylfluorenyl-γ-butyrolactone, etc. As the poor solvent, toluene, xylene, methanol, ethanol, isopropanol is preferred , Ethyl lactate, propylene glycol methyl ether acetate and water. When a good solvent and a poor solvent are mixed and used, it is preferable to adjust the ratio of the poor solvent to the good solvent according to the solubility of the polymer in the photosensitive resin composition. In addition, two or more of each solvent, for example, a plurality of solvents may be used in combination. On the other hand, in the case of a photosensitive resin composition that is soluble in an alkaline aqueous solution, the developing solution used in the development is a solution that dissolves and removes the soluble polymer in the alkaline aqueous solution. Typically, the alkaline polymer is dissolved in the alkaline Aqueous solution. The basic compound dissolved in the developing solution may be any one of an inorganic basic compound and an organic basic compound. Examples of the inorganic basic compound include lithium hydroxide, sodium hydroxide, potassium hydroxide, diammonium hydrogen phosphate, dipotassium hydrogen phosphate, disodium hydrogen phosphate, lithium silicate, sodium silicate, potassium silicate, Lithium carbonate, sodium carbonate, potassium carbonate, lithium borate, sodium borate, potassium borate, and ammonia. Examples of the organic basic compound include tetramethylammonium hydroxide, tetraethylammonium hydroxide, trimethylhydroxyethylammonium hydroxide, methylamine, dimethylamine, trimethylamine, and monoethylamine. , Diethylamine, triethylamine, n-propylamine, di-n-propylamine, isopropylamine, diisopropylamine, methyldiethylamine, dimethylethanolamine, ethanolamine, and triethanolamine. Furthermore, if necessary, a suitable amount of a water-soluble organic solvent such as methanol, ethanol, propanol, or ethylene glycol, a surfactant, a storage stabilizer, and a resin dissolution inhibitor can be added to the alkaline aqueous solution. The embossed pattern can be formed in the above manner. (4) Step of forming a hardened embossed pattern by heat-treating the embossed pattern In this step, the hardened embossed pattern obtained by the above development is heated to be converted into a hardened embossed pattern. As the method of heating and hardening, various methods such as those using a hot plate, those using an oven, and those using a heating type oven with a temperature control program can be selected. Heating can be performed, for example, at 180 ° C to 400 ° C for 30 minutes to 5 hours. As the ambient gas during heating and hardening, air can be used, and inert gases such as nitrogen and argon can also be used. <Semiconductor Device> The present invention also provides a semiconductor device including a hardened relief pattern obtained by the method for manufacturing a hardened relief pattern of the present invention. The present invention also provides a semiconductor device including a substrate as a semiconductor element and a hardened embossed pattern of a resin formed on the base material by the above-mentioned hardened embossed pattern manufacturing method. In addition, the present invention is also applicable to a method for manufacturing a semiconductor device that uses a semiconductor element as a substrate and includes the above-mentioned method for manufacturing a hardened relief pattern as part of a step. The semiconductor device of the present invention can be formed into a surface protection film, an interlayer insulation film, a rewiring insulation film, a flip-chip device protection film, or the like by forming a hardened relief pattern formed using the hardened relief pattern manufacturing method described above. A protective film or the like of a semiconductor device having a bump structure is manufactured in combination with a known method for manufacturing a semiconductor device. The photosensitive resin composition of the present invention is applicable to semiconductor devices as described above, and can also be used for interlayer insulation of multilayer circuits, protective coatings for flexible copper-clad boards, solder resist films, and liquid crystal alignment films. In the above, aspects A to D have been described separately, but the present invention also includes combinations of aspects. [Examples] Hereinafter, the present invention will be specifically described by examples, but the present invention is not limited thereto. In Examples, Comparative Examples, and Production Examples, the physical properties of the photosensitive resin composition were measured and evaluated according to the following methods. (1) Weight average molecular weight The weight average molecular weight (Mw) of each resin was measured by gel permeation chromatography (standard polystyrene conversion). The column used for the measurement is the brand name "Shodex 805M / 806M in series" manufactured by Showa Denko Corporation. The standard monodisperse polystyrene is selected by the brand name "Shodex STANDARD SM-105" manufactured by Showa Denko Corporation. The solvent was N-methyl-2-pyrrolidone, and the detector used a brand name "Shodex RI-930" manufactured by Showa Denko Corporation. (2) Sputtering device (L-440S-FHL, manufactured by Canon Anelva) was used to produce the hardened relief pattern on Cu. It was fabricated on a 6-inch silicon wafer (manufactured by Fujimi Electronic Industry Co., Ltd., thickness 625 ± 25). μm) Ti was sequentially sputtered with 200 nm thick Cu and 400 nm thick Cu. Then, using a coating developer (Coater Developer) (D-Spin60A type, manufactured by SOKUDO), the photosensitive resin composition prepared by the following method was spin-coated on the wafer and dried to form a film. Coating film with a thickness of 6 to 10 μm. Using a photomask with a test pattern, a collimated photomask alignment exposure machine (PLA-501FA, manufactured by Canon) was used to irradiate the coating film with 300 mJ / cm ² Of energy. Then, in the case of negative type, cyclopentanone is used as a developing solution, and in the case of positive type, 2.38% TMAH (tetramethylammonium hydroxide) is used as a developing solution, and a coating developing device (D-Spin60A (Type, manufactured by SOKUDO)) This coating film is spray-developed. In the case of negative type, propylene glycol methyl ether acetate is used for rinsing, and in the case of positive type, pure water is used for rinsing to obtain embossment on Cu. pattern. Using a temperature-programming type curing furnace (VF-2000 type, manufactured by Koyo Lindberg), a wafer having the relief pattern formed on Cu was subjected to a heat treatment under a nitrogen atmosphere at a temperature described in each embodiment for 2 hours. Thus, a hardened relief pattern containing a resin having a thickness of about 6 to 7 μm is obtained on Cu. (3) High temperature storage test of hardened embossed pattern on Cu and subsequent evaluations A temperature-programming type curing furnace (VF-2000 type, manufactured by Koyo Lindberg) was used in the air at 150 ° C. The wafer with the hardened relief pattern formed on Cu was heated for 168 hours. Then, a plasma surface treatment apparatus (EXAM type, manufactured by Shinko Seiki Co., Ltd.) was used to remove all the resin layers on Cu by plasma etching. The plasma etching conditions are as follows. Output: 133 W Gas type, flow rate: O ₂ : 40 ml / min ＋ CF ₄ : 1 ml / min Gas pressure: 50 Pa Mode: Hard mode Etching time: 1800 seconds Using FE-SEM (field emission-scanning electron microscope) (S-4800, Hitachi High -Technologies Co., Ltd.) Observe the Cu surface where all the resin layers have been removed, and use an image analysis software (A like Jun, manufactured by Asahi Kasei Co., Ltd.) to calculate the area ratio of the voids to the surface of the Cu layer. (4) Evaluation of varnish storage stability The photosensitive resin compositions obtained in the examples and comparative examples were left to stand in an environment of 23 ° C. and 50% Rh for 3 weeks, and the change in viscosity was observed. The viscosity was measured using a TV-25 viscometer (manufactured by Toki Sangyo) to measure the viscosity at 23 ° C. ○: The viscosity change rate (described below) of the composition after being left is within 10%. ×: The viscosity change rate of the composition after being left is greater than 10%. Viscosity change rate (%) = {(initial viscosity)-(absolute value after standing)} 100 / (initial viscosity) Example A <Manufacturing Example A1> ((A) Polymerization as a precursor of polyimide Synthesis of product A) 155.1 g of 4,4'-oxydiphthalic dianhydride (ODPA) was placed in a separable flask with a volume of 2 L, and 131.2 g of 2-hydroxyethyl methacrylate (HEMA) was added. With 400 ml of γ-butyrolactone and stirring at room temperature, 81.5 g of pyridine was added while stirring to obtain a reaction mixture. After the exothermic heat generated by the reaction was completed, it was left to cool to room temperature and left for 16 hours. Next, while cooling in an ice bath, the solution obtained by dissolving 206.3 g of dicyclohexylcarbodiimide (DCC) in 180 ml of γ-butyrolactone was added to the reaction mixture while stirring for 40 minutes, and then stirred while stirring. One side was added over a period of 60 minutes to obtain a suspension of 93.0 g of 4,4'-diaminodiphenyl ether (DADPE) in 350 ml of γ-butyrolactone. After further stirring at room temperature for 2 hours, 30 ml of ethanol was added and stirred for 1 hour, and then 400 ml of γ-butyrolactone was added. The precipitate formed in the reaction mixture was removed by filtration to obtain a reaction solution. The obtained reaction solution was added to 3 L of ethanol to form a precipitate containing a crude polymer. The produced crude polymer was separated by filtration and dissolved in 1.5 L of tetrahydrofuran to obtain a crude polymer solution. The obtained crude polymer solution was dropped into 28 L of water to precipitate a polymer, and the obtained precipitate was separated by filtration and then vacuum-dried to obtain a powdery polymer (polymer A). When the molecular weight of the polymer A was measured by gel permeation chromatography (standard polystyrene conversion), the weight average molecular weight (Mw) was 20,000. The weight-average molecular weight of the resin obtained in each production example was measured by gel permeation chromatography (GPC) under the following conditions to determine the weight-average molecular weight in terms of standard polystyrene. Pump: JASCO PU-980 Detector: JASCO RI-930 Column oven: JASCO CO-965 40 ° C Column: 2 Shodex KD-806M Tandem mobile phases: 0.1 mol / L LiBr / NMP (N-methylpyrrolidone, N- Methylpyrrolidone) Flow rate: 1 ml / min. <Manufacturing example A2> ((A) Synthesis of polymer B as a polyimide precursor) Using 3,3 ', 4,4'-biphenyl Except that 147.1 g of tetracarboxylic dianhydride (BPDA) was used instead of 15,5.1 g of 4,4'-oxydiphthalic dianhydride (ODPA) in Production Example A1, the same method as described in Production Example A1 was used. The reaction was carried out in such a manner that polymer B was obtained. When the molecular weight of the polymer B was measured by gel permeation chromatography (standard polystyrene conversion), the weight average molecular weight (Mw) was 22,000. <Manufacturing Example A3> ((A) Synthesis of polymer C as a polyimide precursor) 2,2'-bistrifluoromethyl-4,4'-diaminobiphenyl (TFMB) 147.8 g Instead of 93.0 g of 4,4'-diaminodiphenyl ether (DADPE) in Production Example A1, a polymer C was obtained by reacting in the same manner as in the method described in Production Example A1 above. When the molecular weight of the polymer C was measured by gel permeation chromatography (standard polystyrene conversion), the weight average molecular weight (Mw) was 21,000. <Manufacturing Example A4> ((A) Synthesis of Polymer D as Polyamide) (Synthesis of Terephthalate Compound AIPA-MO) A 5-L separable flask was charged with a 5-amino group. 543.5 g of phthalic acid {hereinafter abbreviated as AIPA} and 1700 g of N-methyl-2-pyrrolidone were mixed and stirred, and heated to 50 ° C. in a water bath. A solution obtained by diluting 512.0 g (3.3 mol) of 2-methacryloxyethyl isocyanate with 500 g of γ-butyrolactone was added dropwise thereto using a dropping funnel, and the mixture was directly stirred at 50 ° C for about 2 hours. . After confirming the completion of the reaction (the disappearance of 5-aminoisophthalic acid) by low molecular weight gel permeation chromatography {hereinafter referred to as low molecular weight GPC}, the reaction solution was poured into 15 L of ion-exchanged water and stirred, It was left to stand, and after the crystalline precipitate of the reaction product appeared, it was separated by filtration, washed with appropriate water, and then dried under vacuum at 40 ° C for 48 hours, thereby obtaining an amine group and isocyanide from 5-aminoisophthalic acid. AIPA-MO obtained by the isocyanate action of 2-methacrylic acid ethoxyethyl. The purity of the obtained low molecular weight GPC of AIPA-MO was about 100%. (Synthesis of Polymer D) Put the obtained AIPA-MO 100.89 g (0.3 mol), pyridine 71.2 g (0.9 mol), GBL (butyrolactone, γ-butyrolactone) 400 into a separable flask with a volume of 2 L. g, mix and cool to 5 ° C with an ice bath. Under ice-cooling, a solution obtained by dissolving and diluting 125.0 g (0.606 mol) of dicyclohexylcarbodiimide (DCC) with GBL 125 g was added dropwise over about 20 minutes. Then, the solution was added dropwise over about 20 minutes. 4,4'-bis (4-aminophenoxy) biphenyl {hereinafter referred to as BAPB} 103.16 g (0.28 mol) dissolved in 168 g of NMP, and maintained in an ice bath for 3 hours to less than 5 ° C, and then The ice bath was removed and stirred at room temperature for 5 hours. The precipitate formed in the reaction mixture was removed by filtration to obtain a reaction solution. A mixed solution of 840 g of water and 560 g of isopropyl alcohol was added dropwise to the obtained reaction solution, and the precipitated polymer was separated and redissolved in 650 g of NMP. The obtained crude polymer solution was dropped into 5 L of water to precipitate a polymer, and the obtained precipitate was separated by filtration, and then vacuum-dried to obtain a powdery polymer (Polymer E). When the molecular weight of the polymer D was measured by gel permeation chromatography (standard polystyrene conversion), the weight average molecular weight (Mw) was 34,700. <Manufacturing Example A5> ((A) Synthesis of polymer E as a polyoxazole precursor) In a separable flask with a volume of 3 L, 2,2-bis (3-amino-4-hydroxyphenyl) -183.1 g of hexafluoropropane, 640.9 g of N, N-dimethylacetamide (DMAc), and 63.3 g of pyridine were mixed and stirred at room temperature (25 ° C) to prepare a homogeneous solution. A solution obtained by dissolving 11,8.0 g of 4,4'-diphenyl ether dimethylarsine chloride in 354 g of diethylene glycol dimethyl ether (DMDG) was added dropwise thereto using a dropping funnel. At this time, the separable flask was cooled in a water bath at 15-20 ° C. The time required for dripping was 40 minutes, and the temperature of the reaction solution was 30 ° C at the highest. 3 hours after the end of the dripping, 30.8 g (0.2 mol) of 1,2-cyclohexyl dicarboxylic anhydride was added to the reaction solution, and the mixture was left to stir at room temperature for 15 hours, so that the polymer chain accounted for 99% of the total amines. The terminal group is terminated with a carboxycyclohexylamidoamine group. The reaction rate at this time can be easily calculated by tracking the remaining amount of the 1,2-cyclohexyl dicarboxylic anhydride which has been introduced by high performance liquid chromatography (HPLC). Thereafter, the reaction solution was added dropwise to 2 L of water under high-speed stirring to disperse and precipitate the polymer. The polymer was recovered, washed with appropriate water, dehydrated, and vacuum-dried to obtain gel permeation chromatography (GPC). A crude polybenzoxazole precursor having a weight average molecular weight of 9,000 (in terms of polystyrene) measured by) method. The crude polybenzoxazole precursor obtained above was re-dissolved in γ-butyrolactone (GBL), and then treated with a cation exchange resin and an anion exchange resin, and the solution thus obtained was put into ion exchanged water. The precipitated polymer was separated by filtration, washed with water and dried under vacuum, thereby obtaining a purified polybenzoxazole precursor (polymer E). <Manufacturing Example A6> ((A) Synthesis of polymer F as polyimide) A glass separable four-necked flask equipped with an anchor stirrer made of Teflon (registered trademark) was attached with Dean-Star G separator cooling tube. While the nitrogen gas was bubbled in, the flask was immersed in a silicone oil bath and stirred. Added 2,2-bis (3-amino-4-hydroxyphenyl) propane (manufactured by Clariant Japan) (hereinafter referred to as BAP) 72.28 g (280 mmol), 5- (2,5-dioxotetrahydro) -3-furanyl) -3-methyl-cyclohexene-1,2 dicarboxylic anhydride (manufactured by Tokyo Chemical Industry Co., Ltd.) (hereinafter referred to as MCTC) 70.29 g (266 mmol), γ-butyrolactone 254.6 g, 60 g of toluene, and stirred at 100 rpm for 4 hours at room temperature, and then added 5-decene-2,3-dicarboxylic anhydride (manufactured by Tokyo Chemical Industry Co., Ltd.) 4.6 g (28 mmol) Heat and stir at 100 rpm in a silicon bath at 50 ° C for 8 hours while introducing nitrogen gas. Thereafter, it was heated to a temperature of 180 ° C in a silicon bath, and stirred at 100 rpm for 2 hours. The toluene and water distilled off during the reaction were removed. After the imidization reaction is completed, the temperature is returned to room temperature. Thereafter, the reaction solution was added dropwise to 3 L of water under high-speed stirring to disperse and precipitate the polymer. The polymer was recovered, washed with appropriate water, dehydrated, and vacuum-dried to obtain gel permeation chromatography (GPC). Crude polyimide (Polymer F) having a weight-average molecular weight of 23,000 (in terms of polystyrene) measured by the method. <Manufacturing Example A7> ((A) Synthesis of polymer G as a phenol resin) In a separable flask with a Dean-Stark apparatus having a volume of 0.5 L, methyl 3,5-dihydroxybenzoate 128.3 g (0.76 mol), 4,4'-bis (methoxymethyl) biphenyl (hereinafter also referred to as `` BMMB '') 121.2 g (0.5 mol), diethyl sulfuric acid 3.9 g (0.025 mol), diethyl 140 g of diol dimethyl ether was mixed and stirred at 70 ° C to dissolve the solid matter. The mixed solution was heated to 140 ° C in an oil bath, and it was confirmed that methanol was produced from the reaction solution. The reaction solution was stirred directly at 140 ° C for 2 hours. Then, the reaction vessel was cooled in the atmosphere, and 100 g of tetrahydrofuran was added thereto and stirred. The reaction diluent was added dropwise to 4 L of water under high-speed stirring to disperse and precipitate the resin. The resin was recovered, washed with appropriate water, dehydrated, and then vacuum-dried to obtain 3,5-dihydroxy containing 70% yield. Copolymer of methyl benzoate / BMMB (Polymer G). The weight average molecular weight of this polymer G calculated by standard polystyrene conversion by the GPC method was 21,000. <Manufacturing example A8> ((A) Synthesis of polymer H as a phenol resin) A separable flask with a Dean-Stark apparatus with a volume of 1.0 L was replaced with nitrogen, and then the separable flask was 81.3 g (0.738 mol) of resorcinol, 84.8 g (0.35 mol) of BMMB, 3.81 g (0.02 mol) of p-toluenesulfonic acid, and 116 g of propylene glycol monomethyl ether (hereinafter also referred to as PGME) were performed at 50 ° C. Mix and stir to dissolve the solids. The mixed solution was heated to 120 ° C in an oil bath, and it was confirmed that methanol was produced from the reaction solution. The reaction solution was stirred directly at 120 ° C for 3 hours. Then, in another container, 24.9 g (0.150 mol) of 2,6-bis (hydroxymethyl) p-cresol and 249 g of PGME were mixed and stirred to dissolve uniformly, and the obtained solution was used in a dropping funnel for a period of time. The solution was added dropwise to the separable flask for 1 hour, and the solution was further stirred for 2 hours after dropping. After completion of the reaction, the same treatment as in Production Example A7 was performed, and a resorcinol / BMMB / 2,6-bis (hydroxymethyl) -p-cresol copolymer (polymer H) was obtained in a yield of 77%. The weight average molecular weight of this polymer H calculated by standard polystyrene conversion by GPC method was 9,900. <Example A1> Using the polymers A and B, a negative-type photosensitive resin composition was prepared by the following method, and the prepared photosensitive resin composition was evaluated. Polymers A 50 g and B 50 g (corresponding to (A) resin) and xanthine (corresponding to (B) a cyclic compound having a carbonyl group) as polyimide precursors 0.2 g, 1-phenyl- 1,2-propanedione-2- (O-ethoxycarbonyl) -oxime (denoted as "PDO" in Table 1) (equivalent to (C) photosensitizer) 4 g, tetraethylene glycol dimethacrylic acid 8 g of ester, 1.5 g of N- [3- (triethoxysilyl) propyl] benzamide were dissolved together in N-methyl-2-pyrrolidone (hereinafter referred to as NMP) 80 g and ethyl lactate 20 g mixed solvent. The viscosity of the obtained solution was adjusted to about 35 poise by further adding a small amount of the above-mentioned mixed solvent to prepare a negative photosensitive resin composition. The composition was cured at 230 ° C by the above method to produce a hardened relief pattern on the Cu layer. After a high-temperature storage test was performed, the area ratio of voids on the surface of the Cu layer was evaluated, and a result of 5.2% was obtained. <Example A2> A negative-type photosensitive resin composition solution was prepared in the same manner as in Example A1 except that the amount of xanthine added was changed to 0.05 g as the component (B) in Example A1. For this composition, a cured relief pattern was formed on the Cu layer by curing at 230 ° C by the method described above, and after performing a high-temperature storage test, the area ratio of voids on the surface of the Cu layer was evaluated, and a result of 6.4% was obtained. <Example A3> A negative-type photosensitive resin composition solution was prepared in the same manner as in Example A1 except that the amount of xanthine added was changed to 5 g as the component (B) in Example A1. With respect to this composition, a hardened relief pattern was formed on the Cu layer by curing at 230 ° C. by the method described above, and after performing a high-temperature storage test, the area ratio of voids on the surface of the Cu layer was evaluated, and a result of 4.9% was obtained. <Example A4> In the above-mentioned Example A1, except that 8-azaxanthine was used instead of xanthine as the component (B), a negative-type photosensitive resin composition solution was prepared in the same manner as in Example A1. . The composition was cured at 230 ° C. to produce a hardened relief pattern on the Cu layer by the method described above. After a high-temperature storage test, the area ratio of voids on the surface of the Cu layer was evaluated, and a 5.1% result was obtained. <Example A5> A negative-type photosensitive resin composition solution was prepared in the same manner as in Example A1 except that uric acid was used instead of xanthine as the component (B) in Example A1. With respect to this composition, a hardened relief pattern was produced on the Cu layer by curing at 230 ° C by the method described above, and after performing a high-temperature storage test, the area ratio of voids on the surface of the Cu layer was evaluated, and a result of 5.4% was obtained. <Example A6> A negative-type photosensitive resin composition solution was prepared in the same manner as in Example A1, except that dioxotetrahydropyridine was used as the component (B) in place of xanthine. . For this composition, a cured relief pattern was formed on the Cu layer by curing at 230 ° C. by the method described above, and after performing a high-temperature storage test, the ratio of the area occupied by the voids on the surface of the Cu layer was evaluated to obtain a result of 5.5%. <Example A7> A negative-type photosensitive resin composition solution was prepared in the same manner as in Example A1, except that barbituric acid was used instead of xanthine as the component (B) in the above-mentioned Example A1. The composition was cured at 230 ° C by the above method to produce a hardened relief pattern on the Cu layer. After a high-temperature storage test was performed, the area ratio of voids on the surface of the Cu layer was evaluated, and a result of 7.3% was obtained. <Example A8> A negative-type photosensitive resin composition solution was prepared in the same manner as in the above-mentioned Example A1, and a hardened relief pattern was produced on the Cu layer by curing the composition at 350 ° C. by the method described above. After the high-temperature storage test, the area ratio of voids to the surface of the Cu layer was evaluated, and a result of 4.5% was obtained. <Example A9> In the above-mentioned Example A1, as the (A) resin, polymer A 50 g and polymer B 50 g were changed to polymer A 100 g, and as component (C), PDO 4 g was changed to 1 In addition, 2.5 g of 2-octanedione-1- {4- (phenylthio) -2- (O-benzylidene oxime)} (Irgacure OXE01 (trade name) manufactured by BASF), A negative-type photosensitive resin composition solution was prepared in the same manner as in Example A1. The composition was cured at 230 ° C. to produce a hardened relief pattern on the Cu layer by the method described above. After a high-temperature storage test, the area ratio of voids on the surface of the Cu layer was evaluated, and a 5.1% result was obtained. <Example A10> In the above-mentioned Example A1, as the resin (A), polymer A 50 g and polymer B 50 g were changed to polymer A 100 g, and as component (C), PDO 4 g was changed to 1 2.5 g of 2-octanedione-1- {4- (phenylthio) -2- (O-benzylidene oxime)} (Irgacure OXE01 (manufactured by BASF, trade name)) 2.5 g A negative-type photosensitive resin composition solution was prepared in the same manner as in Example A1, except for 85 g of γ-butyrolactone and 15 g of dimethyl sulfene. The composition was cured at 230 ° C by the above method to produce a hardened relief pattern on the Cu layer. After a high-temperature storage test was performed, the area ratio of voids on the surface of the Cu layer was evaluated, and a result of 5.2% was obtained. <Example A11> In the above-mentioned Example A1, except that the polymer A 50 g and the polymer B 50 g were changed to the polymer C 100 g as the (A) resin, the same method as in Example A1 was used. A negative-type photosensitive resin composition solution was prepared. With respect to this composition, a hardened relief pattern was formed on the Cu layer by curing at 350 ° C. by the method described above, and after performing a high-temperature storage test, the area ratio of voids on the surface of the Cu layer was evaluated, and a result of 4.9% was obtained. <Example A12> In the above-mentioned Example A1, except that the polymer A 50 g and the polymer B 50 g were changed to the polymer D 100 g as the (A) resin, the same method as in Example A1 was used. A negative-type photosensitive resin composition solution was prepared. With respect to this composition, a hardened relief pattern was produced on the Cu layer by curing at 250 ° C. by the method described above, and after performing a high-temperature storage test, the area ratio of voids on the surface of the Cu layer was evaluated to obtain a result of 5.0%. <Example A13> Using the polymer E, a positive-type photosensitive resin composition was prepared by the following method, and the prepared photosensitive resin composition was evaluated. A polymer E 100 g (corresponding to (A) resin) as a polyoxazole precursor and the following formula (96): 77% of the indicated phenolic hydroxyl groups are naphthoquinonediazide-4-sulfonated photosensitive diazoquinone compounds (manufactured by Toyo Kosei, equivalent to (C) photosensitizer) (C1) 20 g, yellow Purine (equivalent to (B) a cyclic compound having a carbonyl group) 0.2 g, 6 g of 3-tert-butoxycarbonylaminopropyltriethoxysilane, both dissolved in γ-butyrolactone (as a solvent) 100 g. The viscosity of the obtained solution was adjusted to about 20 poise by further adding a small amount of γ-butyrolactone to prepare a positive-type photosensitive resin composition. With respect to this composition, a hardened relief pattern was formed on the Cu layer by curing at 350 ° C. by the method described above, and after performing a high-temperature storage test, the area ratio of voids on the surface of the Cu layer was evaluated to obtain a result of 5.5%. <Example A14> In the above-mentioned Example A13, except that the polymer E 100 g was changed to the polymer F 100 g as the (A) resin, a positive-type photosensitive resin was prepared in the same manner as in Example A13. Composition solution. The composition was cured at 250 ° C. to produce a hardened relief pattern on the Cu layer by the method described above. After a high-temperature storage test, the area ratio of voids on the surface of the Cu layer was evaluated to obtain a result of 5.7%. <Example A15> In the above-mentioned Example A13, except that the polymer E 100 g was changed to the polymer G 100 g as the (A) resin, a positive-type photosensitive resin was prepared in the same manner as in Example A13. Composition solution. With respect to this composition, a hardened relief pattern was produced on the Cu layer by curing at 220 ° C. by the method described above, and after performing a high-temperature storage test, the area ratio of voids on the surface of the Cu layer was evaluated, and a result of 5.3% was obtained. <Example A16> In the above-mentioned Example A13, except that the polymer E 100 g was changed to the polymer H 100 g as the (A) resin, a positive-type photosensitive resin was prepared in the same manner as in Example A13. Composition solution. With respect to this composition, a hardened relief pattern was produced on the Cu layer by curing at 220 ° C. by the method described above, and after performing a high-temperature storage test, the area ratio of voids on the surface of the Cu layer was evaluated, and a result of 5.2% was obtained. <Comparative Example A1> A negative-type photosensitive resin composition was prepared in the same manner as in Example A1, except that 0.2 g of benzotriazole was added instead of 0.2 g of xanthine to the composition of Example A1. The evaluation was the same as in Example A1. Since the compound (B) of the present invention was not contained, the evaluation result was 15.2%. <Comparative example A2> Except that xanthine was not added to the composition of Example A1, a negative-type photosensitive resin composition was prepared in the same manner as in Example A1, and the same evaluation as in Example A1 was performed. Since the compound (B) of the present invention was not contained, the evaluation result was 14.3%. <Comparative Example A3> Except that xanthine was not added to the composition of Example A10, a negative-type photosensitive resin composition was prepared in the same manner as in Example A10, and the same evaluation as in Example A10 was performed. Since the compound (B) of the present invention was not contained, the evaluation result was 15.7%. <Comparative Example A4> Except that xanthine was not added to the composition of Example A11, a negative-type photosensitive resin composition was prepared in the same manner as in Example A11, and the same evaluation as in Example A11 was performed. Since the compound (B) of the present invention was not contained, the evaluation result was 14.9%. The results of Examples A1 to 16 and Comparative Examples A1 to 4 are summarized in Table 1. Example B <Manufacturing Example B1> ((A) Synthesis of polymer A as a polyimide precursor) Into a separable flask with a volume of 2 L, 4,4'-oxydiphthalic acid di 155.1 g of anhydride (ODPA), 131.2 g of 2-hydroxyethyl methacrylate (HEMA) and 400 ml of γ-butyrolactone were added and stirred at room temperature, and 81.5 g of pyridine was added while stirring to obtain a reaction mixture. After the exothermic heat generated by the reaction was completed, it was left to cool to room temperature and left for 16 hours. Next, while cooling in an ice bath, the solution obtained by dissolving 206.3 g of dicyclohexylcarbodiimide (DCC) in 180 ml of γ-butyrolactone was added to the reaction mixture while stirring for 40 minutes, and then stirred while stirring. One side was added over a period of 60 minutes to obtain a suspension of 93.0 g of 4,4'-diaminodiphenyl ether (DADPE) in 350 ml of γ-butyrolactone. After further stirring at room temperature for 2 hours, 30 ml of ethanol was added and stirred for 1 hour, and then 400 ml of γ-butyrolactone was added. The precipitate formed in the reaction mixture was removed by filtration to obtain a reaction solution. The obtained reaction solution was added to 3 L of ethanol to form a precipitate containing a crude polymer. The produced crude polymer was separated by filtration and dissolved in 1.5 L of tetrahydrofuran to obtain a crude polymer solution. The obtained crude polymer solution was dropped into 28 L of water to precipitate a polymer, and the obtained precipitate was separated by filtration and then vacuum-dried to obtain a powdery polymer (polymer A). When the molecular weight of the polymer A was measured by gel permeation chromatography (standard polystyrene conversion), the weight average molecular weight (Mw) was 20,000. In addition, the weight average molecular weight of the resin obtained in each Production Example B was measured by gel permeation chromatography (GPC) under the following conditions to determine the weight average molecular weight in terms of standard polystyrene. Pump: JASCO PU-980 Detector: JASCO RI-930 Column oven: JASCO CO-965 40 ° C Column: 2 Shodex KD-806M mobile phases in series: 0.1 mol / L LiBr / NMP Flow rate: 1 ml / min. <Manufacturing example B2> ((A) Synthesis of polymer B as a polyimide precursor) 3,3 ', 4,4'-biphenyltetracarboxylic dianhydride (BPDA) 147.1 g was used instead of the manufacturing example A polymer B was obtained in the same manner as in the method described in Production Example B1 except that 155.1 g of 4,4′-oxydiphthalic dianhydride (ODPA) of B1 was reacted. When the molecular weight of the polymer B was measured by gel permeation chromatography (standard polystyrene conversion), the weight average molecular weight (Mw) was 22,000. <Production Example B3> ((A) Synthesis of polymer C as a polyimide precursor) Using 2,2'-bistrifluoromethyl-4,4'-diaminobiphenyl (TFMB) 147.8 g Instead of 93.0 g of 4,4'-diaminodiphenyl ether (DADPE) in Production Example B1, a polymer C was obtained by performing a reaction in the same manner as in the method described in Production Example B1 above. When the molecular weight of the polymer C was measured by gel permeation chromatography (standard polystyrene conversion), the weight average molecular weight (Mw) was 21,000. <Manufacturing Example B4> ((A) Synthesis of Polymer D as Polyamide) (Synthesis of Terephthalate Compound AIPA-MO) A 5-L separable flask was charged with 5-amino groups. 543.5 g of phthalic acid {hereinafter abbreviated as AIPA} and 1700 g of N-methyl-2-pyrrolidone were mixed and stirred, and heated to 50 ° C. in a water bath. A solution obtained by diluting 512.0 g (3.3 mol) of 2-methacryloxyethyl isocyanate with 500 g of γ-butyrolactone was added dropwise thereto using a dropping funnel, and the mixture was directly stirred at 50 ° C for about 2 hours. . After confirming the completion of the reaction (the disappearance of 5-aminoisophthalic acid) by low molecular weight gel permeation chromatography {hereinafter referred to as low molecular weight GPC}, the reaction solution was poured into 15 L of ion-exchanged water and stirred, It was left to stand, and after the crystalline precipitate of the reaction product appeared, it was separated by filtration, washed with appropriate water, and then dried under vacuum at 40 ° C for 48 hours, thereby obtaining an amine group and isocyanide from 5-aminoisophthalic acid. AIPA-MO obtained by the isocyanate action of 2-methacrylic acid ethoxyethyl. The purity of the obtained low molecular weight GPC of AIPA-MO was about 100%. (Synthesis of Polymer D) Put the obtained AIPA-MO 100.89 g (0.3 mol), pyridine 71.2 g (0.9 mol), and GBL 400 g into a separable flask with a volume of 2 L, and mix them with an ice bath. Cool to 5 ° C. Under ice-cooling, a solution obtained by dissolving and diluting 125.0 g (0.606 mol) of dicyclohexylcarbodiimide (DCC) with GBL 125 g was added dropwise over about 20 minutes. Then, the solution was added dropwise over about 20 minutes. 4,4'-bis (4-aminophenoxy) biphenyl {hereinafter referred to as BAPB} 103.16 g (0.28 mol) dissolved in 168 g of NMP, and maintained in an ice bath for 3 hours to less than 5 ° C, and then The ice bath was removed and stirred at room temperature for 5 hours. The precipitate formed in the reaction mixture was removed by filtration to obtain a reaction solution. A mixed solution of 840 g of water and 560 g of isopropyl alcohol was added dropwise to the obtained reaction solution, and the precipitated polymer was separated and redissolved in 650 g of NMP. The obtained crude polymer solution was dropped into 5 L of water to precipitate a polymer, and the obtained precipitate was separated by filtration, and then vacuum-dried to obtain a powdery polymer (Polymer E). When the molecular weight of the polymer D was measured by gel permeation chromatography (standard polystyrene conversion), the weight average molecular weight (Mw) was 34,700. <Manufacturing example B5> ((A) Synthesis of polymer E as a polyoxazole precursor) In a separable flask with a volume of 3 L, 2,2-bis (3-amino-4-hydroxyphenyl) -183.1 g of hexafluoropropane, 640.9 g of N, N-dimethylacetamide (DMAc), and 63.3 g of pyridine were mixed and stirred at room temperature (25 ° C) to prepare a homogeneous solution. A solution obtained by dissolving 11,8.0 g of 4,4'-diphenyl ether dimethylarsine chloride in 354 g of diethylene glycol dimethyl ether (DMDG) was added dropwise thereto using a dropping funnel. At this time, the separable flask was cooled in a water bath at 15-20 ° C. The time required for dripping was 40 minutes, and the temperature of the reaction solution was 30 ° C at the highest. 3 hours after the end of the dripping, 30.8 g (0.2 mol) of 1,2-cyclohexyl dicarboxylic anhydride was added to the reaction solution, and the mixture was left to stir at room temperature for 15 hours, so that the polymer chain accounted for 99% of the total amines. The terminal group is terminated with a carboxycyclohexylamidoamine group. The reaction rate at this time can be easily calculated by tracking the remaining amount of the 1,2-cyclohexyl dicarboxylic anhydride which has been introduced by high performance liquid chromatography (HPLC). Thereafter, the reaction solution was added dropwise to 2 L of water under high-speed stirring to disperse and precipitate the polymer. The polymer was recovered, washed with appropriate water, dehydrated, and vacuum-dried to obtain gel permeation chromatography (GPC). A crude polybenzoxazole precursor having a weight average molecular weight of 9,000 (in terms of polystyrene) measured by) method. The crude polybenzoxazole precursor obtained above was re-dissolved in γ-butyrolactone (GBL), and then treated with a cation exchange resin and an anion exchange resin, and the solution thus obtained was put into ion exchanged water. The precipitated polymer was separated by filtration, washed with water and dried under vacuum, thereby obtaining a purified polybenzoxazole precursor (polymer E). <Manufacturing Example B6> ((A) Synthesis of Polymer F as Polyimide) A glass separable four-neck flask equipped with an anchor stirrer made of Teflon (registered trademark) was attached with Dean-Star G separator cooling tube. While the nitrogen gas was bubbled in, the flask was immersed in a silicone oil bath and stirred. Added 2,2-bis (3-amino-4-hydroxyphenyl) propane (manufactured by Clariant Japan) (hereinafter referred to as BAP) 72.28 g (280 mmol), 5- (2,5-dioxotetrahydro) -3-furanyl) -3-methyl-cyclohexene-1,2 dicarboxylic anhydride (manufactured by Tokyo Chemical Industry Co., Ltd.) (hereinafter referred to as MCTC) 70.29 g (266 mmol), γ-butyrolactone 254.6 g, 60 g of toluene, and stirred at 100 rpm for 4 hours at room temperature, and then added 5-decene-2,3-dicarboxylic anhydride (manufactured by Tokyo Chemical Industry Co., Ltd.) 4.6 g (28 mmol) Heat and stir at 100 rpm in a silicon bath at 50 ° C for 8 hours while introducing nitrogen gas. Thereafter, it was heated to a temperature of 180 ° C in a silicon bath, and stirred at 100 rpm for 2 hours. The toluene and water distilled off during the reaction were removed. After the imidization reaction is completed, the temperature is returned to room temperature. Thereafter, the reaction solution was added dropwise to 3 L of water under high-speed stirring to disperse and precipitate the polymer. The polymer was recovered, washed with appropriate water, dehydrated, and vacuum-dried to obtain gel permeation chromatography (GPC). Crude polyimide (Polymer F) having a weight-average molecular weight of 23,000 (in terms of polystyrene) measured by the method. <Manufacturing Example B7> ((A) Synthesis of polymer G as a phenol resin) In a separable flask with a Dean-Stark apparatus having a volume of 0.5 L, methyl 3,5-dihydroxybenzoate 128.3 g (0.76 mol), 4,4'-bis (methoxymethyl) biphenyl (hereinafter also referred to as `` BMMB '') 121.2 g (0.5 mol), diethyl sulfuric acid 3.9 g (0.025 mol), diethyl 140 g of diol dimethyl ether was mixed and stirred at 70 ° C to dissolve the solid matter. The mixed solution was heated to 140 ° C in an oil bath, and it was confirmed that methanol was produced from the reaction solution. The reaction solution was stirred directly at 140 ° C for 2 hours. Then, the reaction vessel was cooled in the atmosphere, and 100 g of tetrahydrofuran was added thereto and stirred. The reaction diluent was added dropwise to 4 L of water under high-speed stirring to disperse and precipitate the resin. The resin was recovered, washed with appropriate water, dehydrated, and then vacuum-dried to obtain 3,5-dihydroxy containing 70% yield. Copolymer of methyl benzoate / BMMB (Polymer G). The weight average molecular weight of this polymer G calculated by standard polystyrene conversion by the GPC method was 21,000. <Manufacturing Example B8> ((A) Synthesis of polymer H as a phenol resin) A separable flask with a Dean-Stark apparatus with a volume of 1.0 L was replaced with nitrogen, and then the separable flask was 81.3 g (0.738 mol) of resorcinol, 84.8 g (0.35 mol) of BMMB, 3.81 g (0.02 mol) of p-toluenesulfonic acid, and 116 g of propylene glycol monomethyl ether (hereinafter also referred to as PGME) were performed at 50 ° C. Mix and stir to dissolve the solids. The mixed solution was heated to 120 ° C in an oil bath, and it was confirmed that methanol was produced from the reaction solution. The reaction solution was stirred directly at 120 ° C for 3 hours. Then, in another container, 24.9 g (0.150 mol) of 2,6-bis (hydroxymethyl) p-cresol and 249 g of PGME were mixed and stirred to dissolve uniformly, and the obtained solution was used in a dropping funnel for a period of time. The solution was added dropwise to the separable flask for 1 hour, and the solution was further stirred for 2 hours after dropping. After completion of the reaction, the same treatment as in Production Example B7 was performed, and a resorcinol / BMMB / 2,6-bis (hydroxymethyl) -p-cresol copolymer (polymer H) was obtained in a yield of 77%. The weight average molecular weight of this polymer H calculated by standard polystyrene conversion by GPC method was 9,900. <Example B1> Using the polymers A and B, a negative-type photosensitive resin composition was prepared by the following method, and the prepared photosensitive resin composition was evaluated. Polymers A 50 g and B 50 g (corresponding to (A) resin) and polycyclohexyl thiourea (corresponding to (B) sulfur-containing compound) as polyimide precursors 0.5 g, 1-phenyl- 1,2-propanedione-2- (O-ethoxycarbonyl) -oxime (denoted as "PDO" in Table 2) (equivalent to (C) photosensitizer) 4 g, tetraethylene glycol dimethacrylic acid 8 g of ester, 1.5 g of N- [3- (triethoxysilyl) propyl] benzamide were dissolved together in N-methyl-2-pyrrolidone (hereinafter referred to as NMP) 80 g and ethyl lactate 20 g mixed solvent. The viscosity of the obtained solution was adjusted to about 35 poise by further adding a small amount of the above-mentioned mixed solvent to prepare a negative photosensitive resin composition. For this composition, a cured relief pattern was formed on the Cu layer by curing at 230 ° C. by the method described above, and after performing a high-temperature storage test, the ratio of the area occupied by the voids on the surface of the Cu layer was evaluated to obtain a result of 5.5%. <Example B2> In the above-mentioned Example B1, except that the amount of dicyclohexylthiourea was changed to 0.1 g as the component (B), a negative-type photosensitive resin combination was prepared in the same manner as in Example B1.物 溶液。 The solution. The composition was cured at 230 ° C by the above method to produce a hardened relief pattern on the Cu layer. After performing a high-temperature storage test, the area ratio of voids on the surface of the Cu layer was evaluated, and a result of 6.9% was obtained. <Example B3> In the above Example B1, except that the addition amount of dicyclohexylthiourea was changed to 4 g as the component (B), a negative-type photosensitive resin combination was prepared in the same manner as in Example B1.物 溶液。 The solution. The composition was cured at 230 ° C by the above method to produce a hardened relief pattern on the Cu layer. After a high-temperature storage test was performed, the area ratio of voids on the surface of the Cu layer was evaluated, and a result of 4.8% was obtained. <Example B4> A negative-type photosensitive resin composition solution was prepared in the same manner as in Example B1 except that benzothiazole was used as the component (B) in the above-mentioned Example B1, instead of dicyclohexylthiourea. . The composition was cured at 230 ° C by the above method to produce a hardened relief pattern on the Cu layer. After a high-temperature storage test was performed, the area ratio of voids on the surface of the Cu layer was evaluated, and a result of 7.3% was obtained. <Example B5> A negative-type photosensitive resin composition solution was prepared in the same manner as in Example B1, except that rhodamine was used instead of dicyclohexylthiourea as the component (B) in Example B1. . The composition was cured at 230 ° C by the above method to produce a hardened relief pattern on the Cu layer. After a high-temperature storage test was performed, the area ratio of voids on the surface of the Cu layer was evaluated, and a result of 7.2% was obtained. <Example B6> In the above-mentioned Example B1, as the (B) component, 2-9-oxysulfur &# 134079 was used; A negative-type photosensitive resin composition solution was prepared in the same manner as in Example B1, except that instead of dicyclohexylthiourea. The composition was cured at 230 ° C by the above method to produce a hardened relief pattern on the Cu layer. After a high-temperature storage test was performed, the area ratio of voids on the surface of the Cu layer was evaluated, and a result of 7.3% was obtained. <Example B7> A negative-type photosensitive resin composition solution was prepared in the same manner as in the above-mentioned Example B1, and a hardened relief pattern was formed on the Cu layer by curing the composition at 350 ° C. by the method described above. After the high-temperature storage test, the area ratio of voids on the surface of the Cu layer was evaluated, and a result of 4.9% was obtained. <Example B8> In the above-mentioned Example B1, as the resin (A), polymer A 50 g and polymer B 50 g were changed to polymer A 100 g, and as component (C), PDO 4 g was changed to 1 In addition, 2.5 g of 2-octanedione-1- {4- (phenylthio) -2- (O-benzylidene oxime)} (Irgacure OXE01 (trade name) manufactured by BASF), A negative-type photosensitive resin composition solution was prepared in the same manner as in Example B1. The composition was cured at 230 ° C by the above method to produce a hardened relief pattern on the Cu layer. After a high-temperature storage test was performed, the area ratio of voids on the surface of the Cu layer was evaluated, and a result of 5.7% was obtained. <Example B9> In the above-mentioned Example B1, as the resin (A), polymer A 50 g and polymer B 50 g were changed to polymer A 100 g, and as component (C), PDO 4 g was changed to 1 2.5 g of 2-octanedione-1- {4- (phenylthio) -2- (O-benzylidene oxime)} (Irgacure OXE01 (manufactured by BASF, trade name)) 2.5 g A negative-type photosensitive resin composition solution was prepared in the same manner as in Example B1, except for 85 g of γ-butyrolactone and 15 g of dimethyl sulfene. The composition was cured at 230 ° C by the above method to produce a hardened relief pattern on the Cu layer. After a high-temperature storage test was performed, the area ratio of voids on the surface of the Cu layer was evaluated, and a result of 5.6% was obtained. <Example B10> In the above-mentioned Example B1, except that the polymer A 50 g and the polymer B 50 g were changed to the polymer C 100 g as the (A) resin, the same method as in Example B1 was used. A negative-type photosensitive resin composition solution was prepared. With respect to this composition, a hardened relief pattern was formed on the Cu layer by curing at 350 ° C. by the method described above, and after performing a high-temperature storage test, the area ratio of voids on the surface of the Cu layer was evaluated, and a result of 4.9% was obtained. <Example B11> In the above-mentioned Example B1, except that the polymer A 50 g and the polymer B 50 g were changed to the polymer D 100 g as the resin (A), the same method as in Example B1 was used. A negative-type photosensitive resin composition solution was prepared. With respect to this composition, a hardened relief pattern was produced on the Cu layer by curing at 250 ° C. by the method described above, and after performing a high-temperature storage test, the area ratio of voids on the surface of the Cu layer was evaluated, and a result of 5.3% was obtained. <Example B12> Using the polymer E, a positive-type photosensitive resin composition was prepared by the following method, and the prepared photosensitive resin composition was evaluated. A polymer E 100 g (corresponding to (A) resin) as a polyoxazole precursor and the following formula (96): 77% of the indicated phenolic hydroxyl groups are naphthoquinonediazide-4-sulfonated photosensitive diazoquinone compounds (manufactured by Toyo Gosei, equivalent to (C) photosensitizer) (C1) 15 g, two 0.5 g of cyclohexylthiourea (equivalent to (B) sulfur-containing compound), 6 g of 3-tert-butoxycarbonylaminopropyltriethoxysilane, dissolved in γ-butyrolactone (as solvent) 100 g. The viscosity of the obtained solution was adjusted to about 20 poise by further adding a small amount of γ-butyrolactone to prepare a positive-type photosensitive resin composition. With respect to this composition, a hardened relief pattern was formed on the Cu layer by curing at 350 ° C. by the method described above, and after performing a high-temperature storage test, the area ratio of voids on the surface of the Cu layer was evaluated, and a result of 5.4% was obtained. <Example B13> In the above-mentioned Example B12, except that the polymer E 100 g was changed to the polymer F 100 g as the (A) resin, a positive-type photosensitive resin was prepared in the same manner as in Example B12. Composition solution. With respect to this composition, a hardened relief pattern was produced on the Cu layer by curing at 250 ° C. by the method described above, and after performing a high-temperature storage test, the area ratio of voids on the surface of the Cu layer was evaluated, and a result of 5.5% was obtained. <Example B14> In the above Example B12, except that the polymer E 100 g was changed to the polymer G 100 g as the (A) resin, a positive-type photosensitive resin was prepared in the same manner as in Example B12. Composition solution. For the composition, a hardened relief pattern was formed on the Cu layer by curing at 220 ° C by the method described above, and after performing a high-temperature storage test, the area ratio of voids on the surface of the Cu layer was evaluated to obtain a result of 5.7%. <Example B15> In the above Example B12, except that the polymer E 100 g was changed to the polymer H 100 g as the (A) resin, a positive-type photosensitive resin was prepared in the same manner as in Example B12. Composition solution. With respect to this composition, a hardened relief pattern was formed on the Cu layer by curing at 220 ° C by the method described above, and after performing a high-temperature storage test, the area ratio of voids on the surface of the Cu layer was evaluated, and a result of 5.6% was obtained. <Comparative Example B1> Except that dicyclohexylthiourea was not added to the composition of Example B1, a negative-type photosensitive resin composition was prepared in the same manner as in Example B1, and the same procedure as in Example B1 was performed. Evaluation. Since the compound (B) of the present invention was not contained, the evaluation result was 14.3%. <Comparative Example B2> Except that dicyclohexylthiourea was not added to the composition of Example B11, a negative-type photosensitive resin composition was prepared in the same manner as in Example B11, and was performed in the same manner as in Example B11. Evaluation. Since the compound (B) of the present invention was not contained, the evaluation result was 15.5%. <Comparative Example B3> Except that dicyclohexylthiourea was not added to the composition of Example B12, a positive-type photosensitive resin composition was prepared in the same manner as in Example B12, and the same procedure as in Example B12 was performed. Evaluation. Since the compound (B) of the present invention was not contained, the evaluation result was 14.6%. The results of Examples B1 to 15 and Comparative Examples B1 to 3 are summarized in Table 2. Example C <Manufacturing Example C1> ((A) Synthesis of polymer A as a polyimide precursor) Into a separable flask with a volume of 2 L, 4,4'-oxydiphthalic acid di 155.1 g of anhydride (ODPA), 131.2 g of 2-hydroxyethyl methacrylate (HEMA) and 400 ml of γ-butyrolactone were added and stirred at room temperature, and 81.5 g of pyridine was added while stirring to obtain a reaction mixture. After the exothermic heat generated by the reaction was completed, it was left to cool to room temperature and left for 16 hours. Next, while cooling in an ice bath, the solution obtained by dissolving 206.3 g of dicyclohexylcarbodiimide (DCC) in 180 ml of γ-butyrolactone was added to the reaction mixture while stirring for 40 minutes, and then stirred while stirring. One side was added over a period of 60 minutes to obtain a suspension of 93.0 g of 4,4'-diaminodiphenyl ether (DADPE) in 350 ml of γ-butyrolactone. After further stirring at room temperature for 2 hours, 30 ml of ethanol was added and stirred for 1 hour, and then 400 ml of γ-butyrolactone was added. The precipitate formed in the reaction mixture was removed by filtration to obtain a reaction solution. The obtained reaction solution was added to 3 L of ethanol to form a precipitate containing a crude polymer. The produced crude polymer was separated by filtration and dissolved in 1.5 L of tetrahydrofuran to obtain a crude polymer solution. The obtained crude polymer solution was dropped into 28 L of water to precipitate a polymer, and the obtained precipitate was separated by filtration and then vacuum-dried to obtain a powdery polymer (polymer A). When the molecular weight of the polymer A was measured by gel permeation chromatography (standard polystyrene conversion), the weight average molecular weight (Mw) was 20,000. The weight-average molecular weight of the resin obtained in each Production Example C was measured by gel permeation chromatography (GPC) under the following conditions to determine the weight-average molecular weight in terms of standard polystyrene. Pump: JASCO PU-980 Detector: JASCO RI-930 Column oven: JASCO CO-965 40 ° C Column: 2 Shodex KD-806M mobile phases in series: 0.1 mol / L LiBr / NMP Flow rate: 1 ml / min. <Manufacturing example C2> ((A) Synthesis of polymer B as a polyimide precursor) 3,3 ', 4,4'-biphenyltetracarboxylic dianhydride (BPDA) 147.1 g was used instead of the manufacturing example Except for 155.1 g of 4,4′-oxydiphthalic dianhydride (ODPA) of C1, a polymer B was obtained by a reaction in the same manner as in the method described in Production Example C1 above. When the molecular weight of the polymer B was measured by gel permeation chromatography (standard polystyrene conversion), the weight average molecular weight (Mw) was 22,000. <Manufacturing Example C3> ((A) Synthesis of polymer C as a polyimide precursor) Using 2,2'-bistrifluoromethyl-4,4'-diaminobiphenyl (TFMB) 147.8 g Instead of 93.0 g of 4,4'-diaminodiphenyl ether (DADPE) in Production Example C1, a polymer C was obtained by reacting in the same manner as in the method described in Production Example C1 above. When the molecular weight of the polymer C was measured by gel permeation chromatography (standard polystyrene conversion), the weight average molecular weight (Mw) was 21,000. <Manufacturing Example C4> ((A) Synthesis of polymer D as polyamidoamine) (Synthesis of phthalate compound capping body AIPA-MO) A 5-L separable flask was charged with a 5-amino group. 543.5 g of phthalic acid {hereinafter abbreviated as AIPA} and 1700 g of N-methyl-2-pyrrolidone were mixed and stirred, and heated to 50 ° C. in a water bath. A solution obtained by diluting 512.0 g (3.3 mol) of 2-methacryloxyethyl isocyanate with 500 g of γ-butyrolactone was added dropwise thereto using a dropping funnel, and the mixture was directly stirred at 50 ° C for about 2 hours. . After confirming the completion of the reaction (the disappearance of 5-aminoisophthalic acid) by low molecular weight gel permeation chromatography {hereinafter referred to as low molecular weight GPC}, the reaction solution was poured into 15 L of ion-exchanged water and stirred, It was left to stand, and after the crystalline precipitate of the reaction product appeared, it was separated by filtration, washed with appropriate water, and then dried under vacuum at 40 ° C for 48 hours, thereby obtaining an amine group and isocyanide from 5-aminoisophthalic acid. AIPA-MO obtained by the isocyanate action of 2-methacrylic acid ethoxyethyl. The purity of the obtained low molecular weight GPC of AIPA-MO was about 100%. (Synthesis of Polymer D) Put the obtained AIPA-MO 100.89 g (0.3 mol), pyridine 71.2 g (0.9 mol), and GBL 400 g into a separable flask with a volume of 2 L, and mix them with an ice bath. Cool to 5 ° C. Under ice-cooling, a solution obtained by dissolving and diluting 125.0 g (0.606 mol) of dicyclohexylcarbodiimide (DCC) with GBL 125 g was added dropwise over about 20 minutes. Then, the solution was added dropwise over about 20 minutes. 4,4'-bis (4-aminophenoxy) biphenyl {hereinafter referred to as BAPB} 103.16 g (0.28 mol) dissolved in 168 g of NMP, and maintained in an ice bath for 3 hours to less than 5 ° C, and then The ice bath was removed and stirred at room temperature for 5 hours. The precipitate formed in the reaction mixture was removed by filtration to obtain a reaction solution. A mixed solution of 840 g of water and 560 g of isopropyl alcohol was added dropwise to the obtained reaction solution, and the precipitated polymer was separated and redissolved in 650 g of NMP. The obtained crude polymer solution was dropped into 5 L of water to precipitate a polymer, and the obtained precipitate was separated by filtration, and then vacuum-dried to obtain a powdery polymer (Polymer E). When the molecular weight of the polymer D was measured by gel permeation chromatography (standard polystyrene conversion), the weight average molecular weight (Mw) was 34,700. <Production Example C5> ((A) Synthesis of polymer E as a polyoxazole precursor) In a separable flask with a volume of 3 L, 2,2-bis (3-amino-4-hydroxyphenyl) -183.1 g of hexafluoropropane, 640.9 g of N, N-dimethylacetamide (DMAc), and 63.3 g of pyridine were mixed and stirred at room temperature (25 ° C) to prepare a homogeneous solution. A solution obtained by dissolving 11,8.0 g of 4,4'-diphenyl ether dimethylarsine chloride in 354 g of diethylene glycol dimethyl ether (DMDG) was added dropwise thereto using a dropping funnel. At this time, the separable flask was cooled in a water bath at 15-20 ° C. The time required for dripping was 40 minutes, and the temperature of the reaction solution was 30 ° C at the highest. 3 hours after the end of the dripping, 30.8 g (0.2 mol) of 1,2-cyclohexyl dicarboxylic anhydride was added to the reaction solution, and the mixture was left to stir at room temperature for 15 hours, so that the polymer chain accounted for 99% of the total amines. The terminal group is terminated with a carboxycyclohexylamidoamine group. The reaction rate at this time can be easily calculated by tracking the remaining amount of the 1,2-cyclohexyl dicarboxylic anhydride which has been introduced by high performance liquid chromatography (HPLC). Thereafter, the reaction solution was added dropwise to 2 L of water under high-speed stirring to disperse and precipitate the polymer. The polymer was recovered, washed with appropriate water, dehydrated, and vacuum-dried to obtain gel permeation chromatography (GPC). A crude polybenzoxazole precursor having a weight average molecular weight of 9,000 (in terms of polystyrene) measured by) method. The crude polybenzoxazole precursor obtained above was re-dissolved in γ-butyrolactone (GBL), and then treated with a cation exchange resin and an anion exchange resin, and the solution thus obtained was put into ion exchanged water. The precipitated polymer was separated by filtration, washed with water and dried under vacuum, thereby obtaining a purified polybenzoxazole precursor (polymer E). <Manufacturing Example C6> ((A) Synthesis of polymer F as polyimide) A glass separable four-necked flask equipped with an anchor stirrer made of Teflon (registered trademark) was attached with Dean-Star G separator cooling tube. While the nitrogen gas was bubbled in, the flask was immersed in a silicone oil bath and stirred. Added 2,2-bis (3-amino-4-hydroxyphenyl) propane (manufactured by Clariant Japan) (hereinafter referred to as BAP) 72.28 g (280 mmol), 5- (2,5-dioxotetrahydro) -3-furanyl) -3-methyl-cyclohexene-1,2 dicarboxylic anhydride (manufactured by Tokyo Chemical Industry Co., Ltd.) (hereinafter referred to as MCTC) 70.29 g (266 mmol), γ-butyrolactone 254.6 g, 60 g of toluene, and stirred at 100 rpm for 4 hours at room temperature, and then added 5-decene-2,3-dicarboxylic anhydride (manufactured by Tokyo Chemical Industry Co., Ltd.) 4.6 g (28 mmol) Heat and stir at 100 rpm in a silicon bath at 50 ° C for 8 hours while introducing nitrogen gas. Thereafter, it was heated to a temperature of 180 ° C in a silicon bath, and stirred at 100 rpm for 2 hours. The toluene and water distilled off during the reaction were removed. After the imidization reaction is completed, the temperature is returned to room temperature. Thereafter, the reaction solution was added dropwise to 3 L of water under high-speed stirring to disperse and precipitate the polymer. The polymer was recovered, washed with appropriate water, dehydrated, and vacuum-dried to obtain gel permeation chromatography (GPC). Crude polyimide (Polymer F) having a weight-average molecular weight of 23,000 (in terms of polystyrene) measured by the method. <Manufacturing Example C7> ((A) Synthesis of polymer G as a phenol resin) In a separable flask with a Dean-Stark apparatus with a volume of 0.5 L, 3,5-dihydroxybenzoic acid methyl ester 128.3 g (0.76 mol), 4,4'-bis (methoxymethyl) biphenyl (hereinafter also referred to as `` BMMB '') 121.2 g (0.5 mol), diethyl sulfuric acid 3.9 g (0.025 mol), diethyl 140 g of diol dimethyl ether was mixed and stirred at 70 ° C to dissolve the solid matter. The mixed solution was heated to 140 ° C in an oil bath, and it was confirmed that methanol was produced from the reaction solution. The reaction solution was stirred directly at 140 ° C for 2 hours. Then, the reaction vessel was cooled in the atmosphere, and 100 g of tetrahydrofuran was added thereto and stirred. The reaction diluent was added dropwise to 4 L of water under high-speed stirring to disperse and precipitate the resin. The resin was recovered, washed with appropriate water, dehydrated, and then vacuum-dried to obtain 3,5-dihydroxy containing 70% yield. Copolymer of methyl benzoate / BMMB (Polymer G). The weight average molecular weight of this polymer G calculated by standard polystyrene conversion by the GPC method was 21,000. <Manufacturing Example C8> ((A) Synthesis of polymer H as a phenol resin) A separable flask with a Dean-Stark apparatus with a volume of 1.0 L was replaced with nitrogen, and then the separable flask was 81.3 g (0.738 mol) of resorcinol, 84.8 g (0.35 mol) of BMMB, 3.81 g (0.02 mol) of p-toluenesulfonic acid, and 116 g of propylene glycol monomethyl ether (hereinafter also referred to as PGME) were performed at 50 ° C. Mix and stir to dissolve the solids. The mixed solution was heated to 120 ° C in an oil bath, and it was confirmed that methanol was produced from the reaction solution. The reaction solution was stirred directly at 120 ° C for 3 hours. Then, in another container, 24.9 g (0.150 mol) of 2,6-bis (hydroxymethyl) p-cresol and 249 g of PGME were mixed and stirred to dissolve uniformly, and the obtained solution was used in a dropping funnel for a period of time. The solution was added dropwise to the separable flask for 1 hour, and the solution was further stirred for 2 hours after dropping. After completion of the reaction, the same treatment as in Production Example C7 was performed, and a resorcinol / BMMB / 2,6-bis (hydroxymethyl) -p-cresol copolymer (polymer H) was obtained in a yield of 77%. The weight average molecular weight of this polymer H calculated by standard polystyrene conversion by GPC method was 9,900. <Example C1> Using the polymers A and B, a negative-type photosensitive resin composition was prepared by the following method, and the prepared photosensitive resin composition was evaluated. Polymers A 50 g and B 50 g (corresponding to (A) resin) and butyl urea (corresponding to (B-1) compound) 1 g of polyimide precursor, 1-phenyl-1, 2-propanedione-2- (O-ethoxycarbonyl) -oxime (denoted as "PDO" in Table 3) (equivalent to (C) photosensitizer) 4 g, tetraethylene glycol dimethacrylate 8 g, 1.5 g of N- [3- (triethoxysilyl) propyl] xylylenediamine was dissolved together in 80 g of N-methyl-2-pyrrolidone (hereinafter referred to as NMP) and A mixed solvent of 20 g of ethyl lactate. The viscosity of the obtained solution was adjusted to about 35 poise by further adding a small amount of the above-mentioned mixed solvent to prepare a negative photosensitive resin composition. For this composition, a cured relief pattern was formed on the Cu layer by curing at 230 ° C. by the method described above, and after performing a high-temperature storage test, the ratio of the area occupied by the voids on the surface of the Cu layer was evaluated to obtain a result of 5.5%. <Example C2> In the above Example C1, except that the amount of butylurea was changed to 0.1 g as the component (B), a negative-type photosensitive resin composition solution was prepared in the same manner as in Example C1. . The composition was cured at 230 ° C by the above method to produce a hardened relief pattern on the Cu layer. After a high-temperature storage test was performed, the area ratio of voids to the surface of the Cu layer was evaluated, and a result of 6.8% was obtained. <Example C3> In the above Example C1, except that the amount of butylurea was changed to 5 g as the component (B), a negative-type photosensitive resin composition solution was prepared in the same manner as in Example C1. . The composition was cured at 230 ° C by the above method to produce a hardened relief pattern on the Cu layer. After a high-temperature storage test was performed, the area ratio of voids on the surface of the Cu layer was evaluated, and a result of 4.8% was obtained. <Example C4> In the above-mentioned Example C1, except that tetraethylene glycol (equivalent to the (B-2) compound) was used as the component (B) instead of butyl urea, the same method as in Example C1 was used. A negative-type photosensitive resin composition solution was prepared. For this composition, a cured relief pattern was formed on the Cu layer by curing at 230 ° C. by the method described above, and after performing a high-temperature storage test, the area ratio of voids on the surface of the Cu layer was evaluated to obtain a result of 6.2%. <Example C5> In the above Example C1, bis (2-methoxyethyl) adipate (corresponding to the (B-3) compound) was used instead of butyl urea as the component (B). A negative-type photosensitive resin composition solution was prepared in the same manner as in Example C1. With respect to this composition, a hardened relief pattern was produced on the Cu layer by curing at 230 ° C by the method described above, and after performing a high-temperature storage test, the area ratio of voids on the surface of the Cu layer was evaluated, and a result of 6.3% was obtained. <Example C6> A negative-type photosensitive resin composition solution was prepared in the same manner as in the above-mentioned Example C1, and a hardened relief pattern was formed on the Cu layer by curing the composition at 350 ° C. by the method described above. After the high-temperature storage test, the area ratio of voids to the surface of the Cu layer was evaluated, and a result of 4.7% was obtained. <Example C7> In the above-mentioned Example C1, as the resin (A), polymer A 50 g and polymer B 50 g were changed to polymer A 100 g, and as component (C), PDO 4 g was changed to 1 In addition, 2.5 g of 2-octanedione-1- {4- (phenylthio) -2- (O-benzylidene oxime)} (Irgacure OXE01 (trade name) manufactured by BASF), A negative-type photosensitive resin composition solution was prepared in the same manner as in Example C1. With respect to this composition, a hardened relief pattern was produced on the Cu layer by curing at 230 ° C by the method described above, and after performing a high-temperature storage test, the area ratio of voids on the surface of the Cu layer was evaluated, and a result of 5.4% was obtained. <Example C8> In the above-mentioned Example C1, as the resin (A), polymer A 50 g and polymer B 50 g were changed to polymer A 100 g, and as component (C), PDO 4 g was changed to 1 2.5 g of 2-octanedione-1- {4- (phenylthio) -2- (O-benzylidene oxime)} (Irgacure OXE01 (manufactured by BASF, trade name)) 2.5 g A negative-type photosensitive resin composition solution was prepared in the same manner as in Example C1, except for 85 g of γ-butyrolactone and 15 g of dimethyl sulfene. For this composition, a cured relief pattern was formed on the Cu layer by curing at 230 ° C. by the method described above, and after performing a high-temperature storage test, the ratio of the area occupied by the voids on the surface of the Cu layer was evaluated to obtain a result of 5.5%. <Example C9> In the above-mentioned Example C1, except that the polymer A 50 g and the polymer B 50 g were changed to the polymer C 100 g as the (A) resin, the same method as in Example C1 was used. A negative-type photosensitive resin composition solution was prepared. With respect to this composition, a hardened relief pattern was produced on the Cu layer by curing at 350 ° C. by the method described above, and after performing a high-temperature storage test, the area ratio of voids on the surface of the Cu layer was evaluated to obtain a result of 4.7%. <Example C10> In the above-mentioned Example C1, except that the polymer A 50 g and the polymer B 50 g were changed to the polymer D 100 g as the (A) resin, the same method as in Example C1 was used. A negative-type photosensitive resin composition solution was prepared. With respect to this composition, a hardened relief pattern was produced on the Cu layer by curing at 250 ° C. by the method described above, and after performing a high-temperature storage test, the area ratio of voids on the surface of the Cu layer was evaluated, and a result of 5.8% was obtained. <Example C11> Using the polymer E, a positive-type photosensitive resin composition was prepared by the following method, and the prepared photosensitive resin composition was evaluated. 100 g of polymer E (equivalent to (A) resin) as a polyoxazole precursor and the following formula (96): 77% of the phenolic hydroxyl group represented by naphthoquinonediazide-4-sulfonated photosensitive diazoquinone compound (manufactured by Toyo Kosei, equivalent to (C) photosensitizer) 15 g, C1 1 g of carbamide (corresponding to (B-1) compound) and 6 g of 3-tert-butoxycarbonylaminopropyltriethoxysilane were dissolved in 100 g of γ-butyrolactone (as a solvent). The viscosity of the obtained solution was adjusted to about 20 poise by further adding a small amount of γ-butyrolactone to prepare a positive-type photosensitive resin composition. With respect to this composition, a hardened relief pattern was produced on the Cu layer by curing at 350 ° C by the method described above, and after performing a high-temperature storage test, the area ratio of voids to the surface of the Cu layer was evaluated, and a result of 5.6% was obtained. <Example C12> In the above-mentioned Example C11, except that the polymer E 100 g was changed to the polymer F 100 g as the (A) resin, a positive-type photosensitive resin was prepared in the same manner as in Example C11. Composition solution. With respect to this composition, a hardened relief pattern was produced on the Cu layer by curing at 250 ° C. by the method described above, and after performing a high-temperature storage test, the area ratio of voids on the surface of the Cu layer was evaluated, and a result of 5.9% was obtained. <Example C13> In the above-mentioned Example C11, except that the polymer E 100 g was changed to the polymer G 100 g as the (A) resin, a positive-type photosensitive resin was prepared in the same manner as in Example C11. Composition solution. With respect to this composition, a hardened relief pattern was produced on the Cu layer by curing at 220 ° C. by the method described above, and after performing a high-temperature storage test, the area ratio of voids on the surface of the Cu layer was evaluated, and a result of 5.5% was obtained. <Example C14> In the above-mentioned Example C11, except that the polymer E 100 g was changed to the polymer H 100 g as the (A) resin, a positive-type photosensitive resin was prepared in the same manner as in Example C13. Composition solution. With respect to this composition, a hardened relief pattern was produced on the Cu layer by curing at 220 ° C. by the method described above, and after performing a high-temperature storage test, the area ratio of voids on the surface of the Cu layer was evaluated, and a result of 5.4% was obtained. <Comparative Example C1> Except that butylurea was not added to the composition of Example C1, a negative-type photosensitive resin composition was prepared in the same manner as in Example C1, and the same evaluation as in Example C1 was performed. . Since the compound (B) of the present invention was not contained, the evaluation result was 14.3%. <Comparative Example C2> Except that butylurea was not added to the composition of Example C12, a positive-type photosensitive resin composition was prepared in the same manner as in Example C12, and the same evaluation as in Example C12 was performed. . Since the compound (B) of the present invention was not contained, the evaluation result was 15.5%. <Comparative Example C3> Except that butylurea was not added to the composition of Example C13, a positive-type photosensitive resin composition was prepared in the same manner as in Example C13, and the same evaluation as in Example C11 was performed. . Since the compound (B) of the present invention was not contained, the evaluation result was 15.7%. Example D <Manufacturing Example D1> ((A) Synthesis of polymer (A) -1 as polyimide precursor)) 4,4'-oxydi-neo was placed in a separable flask with a volume of 2 L 155.1 g of phthalic dianhydride (ODPA), 131.2 g of 2-hydroxyethyl methacrylate (HEMA) and 400 ml of γ-butyrolactone were stirred at room temperature, and 81.5 g of pyridine was added while stirring, to obtain a reaction mixture. After the exothermic heat generated by the reaction was completed, it was left to cool to room temperature and left for 16 hours. Next, while cooling in an ice bath, the solution obtained by dissolving 206.3 g of dicyclohexylcarbodiimide (DCC) in 180 ml of γ-butyrolactone was added to the reaction mixture while stirring for 40 minutes, and then stirred while stirring. One side was added over a period of 60 minutes to obtain a suspension of 93.0 g of 4,4'-diaminodiphenyl ether (DADPE) in 350 ml of γ-butyrolactone. After further stirring at room temperature for 2 hours, 30 ml of ethanol was added and stirred for 1 hour, and then 400 ml of γ-butyrolactone was added. The precipitate formed in the reaction mixture was removed by filtration to obtain a reaction solution. The obtained reaction solution was added to 3 L of ethanol to form a precipitate containing a crude polymer. The produced crude polymer was separated by filtration and dissolved in 1.5 L of tetrahydrofuran to obtain a crude polymer solution. The obtained crude polymer solution was dropped into 28 L of water to precipitate a polymer, and the obtained precipitate was separated by filtration, and then vacuum-dried to obtain a powdery polymer (Polymer (A) -1). When the molecular weight of the polymer (A) -1 was measured by gel permeation chromatography (standard polystyrene conversion), the weight average molecular weight (Mw) was 20,000. The weight-average molecular weight of the resin obtained in each Production Example D was measured by gel permeation chromatography (GPC) under the following conditions to determine the weight-average molecular weight in terms of standard polystyrene. Pump: JASCO PU-980 Detector: JASCO RI-930 Column oven: JASCO CO-965 40 ° C Column: 2 Shodex KD-806M mobile phases in series: 0.1 mol / L LiBr / NMP Flow rate: 1 ml / min. <Production Example D2> ((A) Synthesis of polymer (A) -2 as a polyimide precursor)) 3,3 ', 4,4'-biphenyltetracarboxylic dianhydride (BPDA) 147.1 was used g Instead of 15,4'-oxydiphthalic dianhydride (ODPA) 155.1 g in Production Example D1, a polymer was obtained by reacting in the same manner as in the method described in Production Example D1 above. (A) -2. When the molecular weight of the polymer (A) -2 was measured by gel permeation chromatography (standard polystyrene conversion), the weight average molecular weight (Mw) was 22,000. <Manufacturing Example D3> ((A) Synthesis of polymer (A) -3 as polyimide precursor)) 2,2'-bistrifluoromethyl-4,4'-diaminobiphenyl ( TFMB) was replaced by 147.8 g of 4,4'-diaminodiphenyl ether (DADPE) of Production Example D1, and 93.0 g. Except for this, polymerization was performed by the same method as described in Production Example D1 to obtain polymerization.物 (A) -3. When the molecular weight of the polymer (A) -3 was measured by gel permeation chromatography (standard polystyrene conversion), the weight average molecular weight (Mw) was 21,000. <Manufacturing example D4> ((A) Synthesis of polyamine polymer (A) -4) (Synthesis of phthalic acid compound capping body AIPA-MO) Put 5 into a separable flask with a volume of 5 L. -543.5 g of amino isophthalic acid {hereinafter abbreviated as AIPA}, 1700 g of N-methyl-2-pyrrolidone, and mixing and heating to 50 ° C in a water bath. A solution obtained by diluting 512.0 g (3.3 mol) of 2-methacryloxyethyl isocyanate with 500 g of γ-butyrolactone was added dropwise thereto using a dropping funnel, and the mixture was directly stirred at 50 ° C for about 2 hours. . After confirming the completion of the reaction (the disappearance of 5-aminoisophthalic acid) by low molecular weight gel permeation chromatography {hereinafter referred to as low molecular weight GPC}, the reaction solution was poured into 15 L of ion-exchanged water and stirred, It was left to stand, and after the crystalline precipitate of the reaction product appeared, it was separated by filtration, washed with appropriate water, and then dried under vacuum at 40 ° C for 48 hours, thereby obtaining an amine group and isocyanide from 5-aminoisophthalic acid. AIPA-MO obtained by the isocyanate action of 2-methacrylic acid ethoxyethyl. The purity of the obtained low molecular weight GPC of AIPA-MO was about 100%. (Synthesis of polymer (A) -4) In a separable flask with a volume of 2 L, put the obtained AIPA-MO 100.89 g (0.3 mol), pyridine 71.2 g (0.9 mol), and GBL 400 g, and mix them. Cool to 5 ° C with an ice bath. Under ice-cooling, a solution obtained by dissolving and diluting 125.0 g (0.606 mol) of dicyclohexylcarbodiimide (DCC) with GBL 125 g was added dropwise over about 20 minutes. Then, the solution was added dropwise over about 20 minutes. 4,4'-bis (4-aminophenoxy) biphenyl {hereinafter referred to as BAPB} 103.16 g (0.28 mol) dissolved in 168 g of NMP, and maintained in an ice bath for 3 hours to less than 5 ° C, and then The ice bath was removed and stirred at room temperature for 5 hours. The precipitate formed in the reaction mixture was removed by filtration to obtain a reaction solution. A mixed solution of 840 g of water and 560 g of isopropyl alcohol was added dropwise to the obtained reaction solution, and the precipitated polymer was separated and redissolved in 650 g of NMP. The obtained crude polymer solution was dropped into 5 L of water to precipitate a polymer, and the obtained precipitate was separated by filtration and then vacuum-dried to obtain a powdery polymer (Polymer (A) -4). When the molecular weight of the polymer (A) -4 was measured by gel permeation chromatography (standard polystyrene conversion), the weight average molecular weight (Mw) was 34,700. <Manufacturing Example D5> (Synthesis of polymer (A) -5 as (A) polyoxazole precursor) In a separable flask with a volume of 3 L, 2,2-bis (3-amino-4- 183.1 g of hydroxyphenyl) -hexafluoropropane, 640.9 g of N, N-dimethylacetamide (DMAc), and 63.3 g of pyridine were mixed and stirred at room temperature (25 ° C) to prepare a homogeneous solution. A solution obtained by dissolving 11,8.0 g of 4,4'-diphenyl ether dimethylarsine chloride in 354 g of diethylene glycol dimethyl ether (DMDG) was added dropwise thereto using a dropping funnel. At this time, the separable flask was cooled in a water bath at 15-20 ° C. The time required for dripping was 40 minutes, and the temperature of the reaction solution was 30 ° C at the highest. 3 hours after the end of the dripping, 30.8 g (0.2 mol) of 1,2-cyclohexyl dicarboxylic anhydride was added to the reaction solution, and the mixture was left to stir at room temperature for 15 hours, so that the polymer chain accounted for 99% of the total amines. The terminal group is terminated with a carboxycyclohexylamidoamine group. The reaction rate at this time can be easily calculated by tracking the remaining amount of the 1,2-cyclohexyl dicarboxylic anhydride which has been introduced by high performance liquid chromatography (HPLC). Thereafter, the reaction solution was added dropwise to 2 L of water under high-speed stirring to disperse and precipitate the polymer. The polymer was recovered, washed with appropriate water, dehydrated, and vacuum-dried to obtain gel permeation chromatography (GPC). A crude polybenzoxazole precursor having a weight average molecular weight of 9,000 (in terms of polystyrene) measured by) method. The crude polybenzoxazole precursor obtained above was re-dissolved in γ-butyrolactone (GBL), and then treated with a cation exchange resin and an anion exchange resin, and the solution thus obtained was put into ion exchanged water. The precipitated polymer was separated by filtration, washed with water and dried under vacuum, thereby obtaining a purified polybenzoxazole precursor (polymer (A) -5). <Manufacturing Example D6> ((A) Synthesis of Polyimide Polymer (A) -6)) A glass separable four-necked flask equipped with an anchor stirrer made of Teflon (registered trademark) was attached. Cooling tube for An-Stark separator. While the nitrogen gas was bubbled in, the flask was immersed in a silicone oil bath and stirred. Added 2,2-bis (3-amino-4-hydroxyphenyl) propane (manufactured by Clariant Japan) (hereinafter referred to as BAP) 72.28 g (280 mmol), 5- (2,5-dioxotetrahydro) -3-furanyl) -3-methyl-cyclohexene-1,2 dicarboxylic anhydride (manufactured by Tokyo Chemical Industry Co., Ltd.) (hereinafter referred to as MCTC) 70.29 g (266 mmol), γ-butyrolactone 254.6 g, 60 g of toluene, and stirred at 100 rpm for 4 hours at room temperature, and then added 5-decene-2,3-dicarboxylic anhydride (manufactured by Tokyo Chemical Industry Co., Ltd.) 4.6 g (28 mmol) Heat and stir at 100 rpm in a silicon bath at 50 ° C for 8 hours while introducing nitrogen gas. Thereafter, it was heated to a temperature of 180 ° C in a silicon bath, and stirred at 100 rpm for 2 hours. The toluene and water distilled off during the reaction were removed. After the imidization reaction is completed, the temperature is returned to room temperature. Thereafter, the reaction solution was added dropwise to 3 L of water under high-speed stirring to disperse and precipitate the polymer. The polymer was recovered, washed with appropriate water, dehydrated, and vacuum-dried to obtain gel permeation chromatography (GPC). Crude polyimide (Polymer (A) -6) having a weight average molecular weight of 23,000 (in terms of polystyrene) measured by the method. <Example D1> Using the polymers (A) -1 and (A) -2, a negative-type photosensitive resin composition was prepared by the following method, and the photosensitive resin composition was evaluated. Polymers (A) -1 50 g and (A) -2 50 g (equivalent to (A) resin), which are precursors of polyimide, and N-phenylbenzylamine (manufactured by Tokyo Chemical Industry Co., Ltd.) , Equivalent to (B) -1) 3 g, 1-phenyl-1,2-propanedione-2- (O-ethoxycarbonyl) -oxime (denoted as "PDO" in Table 4) (equivalent to (C) Photosensitizer) 4 g, tetraethylene glycol dimethacrylate 8 g, and 1.5 g of N- [3- (triethoxysilyl) propyl] xylylenediamine were dissolved together A mixed solvent of 80 g of N-methyl-2-pyrrolidone (hereinafter referred to as NMP) and 20 g of ethyl lactate. The viscosity of the obtained solution was adjusted to about 35 poise by further adding a small amount of the above-mentioned mixed solvent to prepare a negative photosensitive resin composition. The composition was cured at 230 ° C. to produce a hardened relief pattern on the Cu layer by the method described above. After a high temperature storage test was performed, the area ratio of voids on the surface of the Cu layer was evaluated, and a result of 4.5% was obtained. The viscosity change rate of the obtained varnish after the storage stability test was within 10%. <Example D2> In the above Example D1, the component (B) was changed to N, N'-diphenylethane-1,2-diamine (manufactured by Tokyo Chemical Industry Co., Ltd.). A negative-type photosensitive resin composition solution was prepared in the same manner as in Example D1. The composition was cured at 230 ° C. to produce a hardened relief pattern on the Cu layer by the method described above. After a high-temperature storage test was performed, the area ratio of voids on the surface of the Cu layer was evaluated, and a result of 4.2% was obtained. The viscosity change rate of the obtained varnish after the storage stability test was within 10%. <Example D3> In the above-mentioned Example D1, except that the component (B) was changed to the third butyl phenyl carbamate (manufactured by Tokyo Chemical Industry Co., Ltd.), the same method as in Example D1 was used. A negative-type photosensitive resin composition solution was prepared. The composition was cured at 230 ° C. to produce a hardened relief pattern on the Cu layer by the method described above. After a high-temperature storage test, the area ratio of voids on the surface of the Cu layer was evaluated, and a 5.1% result was obtained. The viscosity change rate of the obtained varnish after the storage stability test was within 10%. <Example D4> In the above Example D1, except that the component (B) was changed to (3-hydroxyphenyl) amino formic acid tertiary butyl ester (manufactured by Tokyo Chemical Industry Co., Ltd.), it was implemented by In Example D1, a negative-type photosensitive resin composition solution was prepared in the same manner. With respect to this composition, a hardened relief pattern was produced on the Cu layer by curing at 230 ° C by the method described above, and after performing a high temperature storage test, the area ratio of the voids to the surface of the Cu layer was evaluated, and a result of 5.8% was obtained. The viscosity change rate of the obtained varnish after the storage stability test was within 10%. <Example D5> In the above Example D1, the component (B) was changed to 2-hydroxy-N- (1H-1,2,4-triazol-3-yl) benzamide (manufactured by ADEKA Corporation) Except for Adekastab CDA-1), a negative-type photosensitive resin composition solution was prepared in the same manner as in Example D1. The composition was cured at 230 ° C by the above method to produce a hardened relief pattern on the Cu layer. After a high-temperature storage test was performed, the area ratio of voids on the surface of the Cu layer was evaluated, and a result of 4.8% was obtained. The viscosity change rate of the obtained varnish after the storage stability test was within 10%. <Example D6> In the above Example D1, the component (B) was changed to 2- (2H-benzo [d] [1,2,3] triazol-2-yl) -4- (2,4, Except for 4-trimethylpentane-2-yl) phenol (Adekastab LA-29, manufactured by ADEKA Corporation), a negative-type photosensitive resin composition solution was prepared in the same manner as in Example D1. The composition was cured at 230 ° C. to produce a hardened relief pattern on the Cu layer by the method described above. After a high-temperature storage test was performed, the area ratio of voids on the surface of the Cu layer was evaluated, and a result of 4.2% was obtained. The viscosity change rate of the obtained varnish after the storage stability test was within 10%. <Example D7> In the above Example D1, the component (B) was changed to (4-((1H-1,2,4-triazol-1-yl) methyl) phenyl) methanol (Tokyo Chemical Industry Co., Ltd. Co., Ltd.), except that a negative-type photosensitive resin composition solution was prepared in the same manner as in Example D1. For the composition, a cured relief pattern was formed on the Cu layer by curing at 230 ° C. by the method described above, and after performing a high-temperature storage test, the area ratio of voids on the surface of the Cu layer was evaluated to obtain a result of 6.1%. The viscosity change rate of the obtained varnish after the storage stability test was within 10%. <Example D8> A negative-type photosensitive resin composition solution was prepared in the same manner as in Example D1, except that the addition amount of the component (B) -1 was changed to 1 g in Example D1. The composition was cured at 230 ° C by the above method to produce a hardened relief pattern on the Cu layer. After a high-temperature storage test was performed, the area ratio of voids on the surface of the Cu layer was evaluated, and a result of 8.5% was obtained. The viscosity change rate of the obtained varnish after the storage stability test was within 10%. <Example D9> In Example D1 described above, a negative-type photosensitive resin composition solution was prepared in the same manner as in Example D1, except that the addition amount of the component (B) -1 was changed to 6 g. With respect to this composition, a hardened relief pattern was formed on the Cu layer by curing at 230 ° C. by the method described above, and after performing a high-temperature storage test, the area ratio of voids on the surface of the Cu layer was evaluated, and a result of 4.9% was obtained. The viscosity change rate of the obtained varnish after the storage stability test was within 10%. <Example D10> In Example D1 described above, a negative-type photosensitive resin composition solution was prepared in the same manner as in Example D1, except that the addition amount of the component (B) -1 was changed to 10 g. The composition was cured at 230 ° C by the above method to produce a hardened relief pattern on the Cu layer. After a high-temperature storage test was performed, the area ratio of voids on the surface of the Cu layer was evaluated, and a result of 5.0% was obtained. The viscosity change rate of the obtained varnish after the storage stability test was within 10%. <Example D11> In Example D1, except that the curing temperature was changed from 230 ° C to 350 ° C, a negative-type photosensitive resin composition solution was prepared in the same manner as in Example D1. With respect to this composition, a hardened relief pattern was produced on the Cu layer, and after performing a high-temperature storage test, the area ratio of voids on the surface of the Cu layer was evaluated, and a result of 6.1% was obtained. The viscosity change rate of the obtained varnish after the storage stability test was within 10%. <Example D12> In the above-mentioned Example D1, as the (A) resin, the polymer (A) -1 50 g and the polymer (A) -2 50 g were changed to the polymer (A) -1 100 g. (C) The component is changed from PDO to 1,2-octanedione-1- {4- (phenylthio) -2- (O-benzylidene oxime)} (Irgacure OXE01 (manufactured by BASF, trade name) )) Except for 2.5 g, a negative-type photosensitive resin composition solution was prepared in the same manner as in Example D1. With respect to this composition, a hardened relief pattern was produced on the Cu layer, and after performing a high-temperature storage test, the area ratio of voids on the surface of the Cu layer was evaluated, and a result of 5.8% was obtained. The viscosity change rate of the obtained varnish after the storage stability test was within 10%. <Example D13> In the above Example D12, a negative-type photosensitive resin was prepared in the same manner as in Example D12, except that the solvent was changed to 85 g of γ-butyrolactone and 15 g of dimethylsulfinium. Composition solution. With respect to this composition, a hardened relief pattern was produced on the Cu layer, and after performing a high-temperature storage test, the area ratio of voids on the surface of the Cu layer was evaluated, and a result of 5.4% was obtained. The viscosity change rate of the obtained varnish after the storage stability test was within 10%. <Example D14> In the above-mentioned Example D1, as the (A) resin, the polymer (A) -1 50 g and the polymer (A) -2 50 g were changed to the polymer (A) -3 100 g. A negative-type photosensitive resin composition solution was prepared in the same manner as in Example D1, except that the curing temperature was changed from 230 ° C to 350 ° C. With respect to this composition, a hardened relief pattern was produced on the Cu layer, and after performing a high-temperature storage test, the area ratio of voids on the surface of the Cu layer was evaluated, and a result of 7.2% was obtained. The viscosity change rate of the obtained varnish after the storage stability test was within 10%. <Example D15> In the above-mentioned Example D1, as the (A) resin, the polymer (A) -1 50 g and the polymer (A) -2 50 g were changed to the polymer (A) -4 100 g. Other than that, a negative-type photosensitive resin composition solution was prepared in the same manner as in Example D1. For this composition, a hardened relief pattern was produced on the Cu layer, and after performing a high-temperature storage test, the area ratio occupied by the voids on the surface of the Cu layer was evaluated, and a result of 4.9% was obtained. The viscosity change rate of the obtained varnish after the storage stability test was within 10%. <Example D16> Using the polymer (A) -5, a positive-type photosensitive resin composition was prepared by the following method, and the prepared photosensitive resin composition was evaluated. A polymer (A) -5 100 g (corresponding to (A) resin) as a polyoxazole precursor and the following formula (96): 77 g of the indicated phenolic hydroxyl group was photosensitized by the naphthoquinonediazide-4-sulfonic acid diazoquinone compound (manufactured by Toyo Gosei, equivalent to component (C)) 15 g (C1) dissolved in γ -100 g of butyrolactone (as solvent). The viscosity of the obtained solution was adjusted to about 20 poise by further adding a small amount of γ-butyrolactone to prepare a positive-type photosensitive resin composition. With respect to this composition, a hardened relief pattern was produced on the Cu layer by curing at 350 ° C. by the method described above, and after performing a high-temperature storage test, the area ratio of voids on the surface of the Cu layer was evaluated, and a result of 6.9% was obtained. The viscosity change rate of the obtained varnish after the storage stability test was within 10%. <Example D17> In the above-mentioned Example D16, the polymer (A) -5 100 g was changed to the polymer (A) -6 100 g as the resin (A), except that it was the same as in Example D12. In this manner, a positive-type photosensitive resin composition solution was prepared. With respect to this composition, a hardened relief pattern was produced on the Cu layer by curing at 250 ° C. by the method described above, and after performing a high-temperature storage test, the area ratio of voids to the surface of the Cu layer was evaluated, and a 6.0% result was obtained. The viscosity change rate of the obtained varnish after the storage stability test was within 10%. <Comparative example D1> Except that component (B) -1 was not added to the composition of Example D1, a negative-type photosensitive resin composition was prepared in the same manner as in Example D1, and was performed in the same manner as in Example D1. The same evaluation. Since the component (B) of the present invention was not included, the evaluation result was 15.2%. The viscosity change rate of the obtained varnish after the storage stability test was within 10%. <Comparative example D2> Except that component (B) -1 was not added to the composition of Example D15, a negative-type photosensitive resin composition was prepared in the same manner as in Example D15, and was performed in the same manner as in Example D15. The same evaluation. Since the component (B) of the present invention was not included, the evaluation result was 14.3%. The viscosity change rate of the obtained varnish after the storage stability test was within 10%. <Comparative example D3> Except that component (B) -1 was not added to the composition of Example D13, a negative-type photosensitive resin composition was prepared in the same manner as in Example D13, and was performed in the same manner as in Example D13. The same evaluation. Since the component (B) of the present invention was not contained, the evaluation result was 15.7%. The viscosity change rate of the obtained varnish after the storage stability test was within 10%. <Comparative example D4> Except that component (B) -1 was not added to the composition of Example D17, a positive-type photosensitive resin composition was prepared in the same manner as in Example D17, and was performed in the same manner as in Example D17. The same evaluation. Since the component (B) of the present invention was not included, the evaluation result was 16.3%. The viscosity change rate of the obtained varnish after the storage stability test was within 10%. <Comparative Example D5> A negative-type photosensitive resin composition was prepared in the same manner as in Example D1, except that the amount of component (B) -1 was changed to 25 g in the composition of Example D1, and The same evaluation as in Example D1 was performed. The evaluation result was 7.2%. The viscosity change rate of the obtained varnish after the storage stability test was 10% or more. The results of Examples D1 to 17 and Comparative Examples D1 to 5 are summarized in Table 4. [表 1] Table 1 [表 2] Table 2 [表 3] Table 3 [表 4] Table 4 [Industrial Applicability] The photosensitive resin composition of the present invention can be preferably used in the field of photosensitive materials useful for the manufacture of electrical and electronic materials such as semiconductor devices and multilayer wiring boards.

Claims (7)

A photosensitive resin composition comprising: (A) selected from the group consisting of polyamic acid, polyamidate, polyamidate, polyhydroxyamidoamine, polyamidoamine, polyamidoamine, polyamidoamine Peryleneimine, polyimide, polybenzo Azole, and at least one resin in the group consisting of novolac, polyhydroxystyrene, and phenol resin: 100 parts by mass; (B) selected from the following general formula (B-1): {In the formula, R _q1 represents an organic group having 1 to 10 carbon atoms formed by a carbon atom and a hydrogen atom}, and the following general formula (B-2): {In the formula, R _q2 represents an organic group selected from a hydroxyl group, an alkyl group having 1 to 10 carbon atoms or an alkoxy group, R _q3 represents a hydrogen atom or an alkyl group having 1 to 10 carbon atoms, and ll represents one selected from 1 to 10 An integer}, and the following general formula (B-3): {In the formula, R _q4 and R _q5 respectively represent an organic group selected from a hydroxyl group, an alkyl group having 1 to 10 carbon atoms or an alkoxy group, X _S represents a divalent hydrocarbon group having 1 to 10 carbon atoms, and mm and nn are respectively Represents at least one compound selected from the integers 1 to 10: 0.01 to 10 parts by mass based on 100 parts by mass of the above (A) resin; and (C) photosensitizer: based on 100 parts by mass of the (A) resin as 1 to 50 parts by mass. The photosensitive resin composition according to claim 1, wherein the (A) resin is selected from the group consisting of a polyimide precursor containing the following general formula (1), a polyfluoride containing the following general formula (4), Polymerization of the following general formula (5) An azole precursor, a polyimide comprising the following general formula (6), and at least one of the group consisting of a novolac, a polyhydroxystyrene, and a phenol resin containing the following general formula (7). Equation (1) is {In the formula, X ₁ is a tetravalent organic group, Y ₁ is a divalent organic group, n ₁ is an integer of 2 to 150, and R ₁ and R ₂ are each independently a hydrogen atom and a saturated carbon number of 1 to 30. Aliphatic group, aromatic group, or the following general formula (2): (Wherein R ₃ , R ₄ and R ₅ are each independently a hydrogen atom or an organic group having 1 to 3 carbon atoms, and m ₁ is an integer of 2 to 10) a monovalent organic group represented by 1 or a carbon number 1 ~ 4 saturated aliphatic group, or the following general formula (3): (Wherein R ₆ , R ₇ and R ₈ are each independently a hydrogen atom or an organic group having 1 to 3 carbon atoms, and m ₂ is an integer of 2 to 10). The polyamidate precursor, polyamidate, polyamidate, or polyamidate, has the following general formula (4): {Wherein X ₂ is a trivalent organic group having 6 to 15 carbons, Y ₂ is a divalent organic group having 6 to 35 carbons, and may be the same structure or have a plurality of structures, and R ₉ is a compound having at least A polyamine having a structure of a radically polymerizable unsaturated bond having 3 to 20 carbon atoms, and n ₂ is an integer of 1 to 1,000}. The following general formula (5) is {In the formula, Y ₃ is a tetravalent organic group having a carbon atom, Y ₄ , X _3, and X ₄ are each independently a divalent organic group having two or more carbon atoms, and n ₃ is an integer from 1 to 1000. , N ₄ is an integer from 0 to 500, n ₃ / (n ₃ + n ₄ )> 0.5, and includes n ₃ dihydroxydiamine units of X ₃ and Y ₃ and n ₄ of X ₄ and Y ₄ The order of the diamine units is arbitrary. The polyhydroxyamidoamine of the azole precursor has the following general formula (6): {In the formula, X ₅ is a 4- to 14-valent organic group, Y ₅ is a 2- to 12-valent organic group, and R ₁₀ and R ₁₁ each independently have at least one selected from a phenolic hydroxyl group, a sulfonic acid group, or a thiol. In the organic group of the group, n ₅ is an integer of 3 to 200, and m ₃ and m ₄ represent integers of 0 to 10}, and polyimide having a structure represented by}, and the following general formula (7) is {In the formula, a is an integer of 1 to 3, b is an integer of 0 to 3, 1 ≦ (a + b) ≦ 4, and R ₁₂ represents a monovalent organic group selected from a carbon number of 1 to 20, a halogen atom, In the case of a monovalent substituent in a group consisting of a nitro group and a cyano group, when b is 2 or 3, a plurality of R ₁₂ may be the same as or different from each other, and X represents a group selected from carbons which may have an unsaturated bond. Divalent aliphatic group of 2 to 10, divalent alicyclic group of 3 to 20 carbons, and the following general formula (8): -C _p H _2p O- (8) (where p is An integer of 1 to 10), a divalent alkoxy group represented by a divalent alkoxy group, and a divalent organic group of the group consisting of a divalent organic group having an aromatic ring having 6 to 12 carbon atoms; a phenol represented by a divalent organic group} Resin. The photosensitive resin composition according to claim 2, wherein the photosensitive resin composition includes a phenol resin having a repeating unit represented by the general formula (7), and X in the general formula (7) is selected from the following general formula: Equation (9): {In the formula, R ₁₃ , R ₁₄ , R ₁₅ and R ₁₆ are each independently a hydrogen atom, a monovalent aliphatic group having 1 to 10 carbon atoms, or a carbon in which a part or all of a hydrogen atom is replaced with a fluorine atom A monovalent aliphatic group having a number of 1 to 10, where n ₆ is an integer of 0 to 4, and when n ₆ is an integer of 1 to 4, R ₁₇ is a halogen atom, a hydroxyl group, or a carbon number of 1 to 12 Valent organic group, at least one R ₁₇ is a hydroxyl group, and a plurality of R ₁₇ when n ₆ is an integer of 2 to 4 may be the same as or different from each other} The divalent group represented by} and the following general formula (10): {In the formula, R ₁₈ , R ₁₉ , R ₂₀ and R ₂₁ each independently represent a hydrogen atom, a monovalent aliphatic group having 1 to 10 carbon atoms, or a carbon in which a part or all of a hydrogen atom is replaced with a fluorine atom A monovalent aliphatic group having a number of 1 to 10, W is a single bond, selected from an aliphatic group having a carbon number of 1 to 10 that may be substituted by a fluorine atom, and an alicyclic group having a carbon number of 3 to 20 that may be substituted by a fluorine atom Group, the following general formula (8): a divalent alkoxy group represented by -C _p H _2p O- (8) (wherein p is an integer of 1 to 10), and the following formula (11) : The divalent base in the group consisting of the divalent base represented} the divalent organic group in the group consisting of the divalent base represented by the divalent base}. The photosensitive resin composition according to any one of claims 1 to 3, wherein (B) is the following general formula (B-1), {In the formula, R _q1 represents an organic group having 1 to 10 carbon atoms formed by a carbon atom and a hydrogen atom}. A method for manufacturing a hardened relief pattern, comprising: (1) forming a photosensitive resin layer on the substrate by coating the photosensitive resin composition according to any one of claims 1 to 4 on the substrate; (2) a step of exposing the photosensitive resin layer; (3) a step of developing the embossed pattern by developing the photosensitive resin layer after the exposure; and (4) heat-treating the embossed pattern The step of forming a hardened relief pattern. The method of claim 5, wherein the substrate is formed of copper or a copper alloy. A semiconductor device including a hardened relief pattern obtained by a manufacturing method as claimed in claim 5 or 6.