TWI666034B - Transdermal microneedle array patch - Google Patents

Abstract

A percutaneous microneedle array patch includes: a lower cover; an upper cover; a substrate provided inside the upper cover; and a first probe and a second probe provided between the lower cover and the upper cover and electrically connected to the A substrate, wherein the first probe and the second probe are disconnected; wherein, when the lower cover is combined with the upper cover to form the percutaneous microneedle array patch, the first probe and the second probe A path is formed between the needles.

Description

   Percutaneous microneedle array patch   

The invention relates to a percutaneous microneedle array patch, in particular to a disposable percutaneous microneedle array patch.

The tissue fluid of the human body mainly flows in the subcutaneous tissue. Because tissue fluids are rich in amino acids, fatty acids, sugars, salts, hormones, coenzymes, and wastes produced by cells, etc., by analyzing the concentrations of various components in tissue fluids, the physiological condition of the human body can be effectively judged.

For another example, when taking or administering a drug, the drug will also be released in the tissue fluid for a long time and slowly, and there is a change in concentration. Therefore, analyzing the concentration of the drug in the tissue fluid can also effectively monitor the effectiveness of the drug.

Most of the existing physiological detection devices use puncture to cut through the stratum corneum to extract tissue fluid for analysis and detection, such as a percutaneous sensor. The low-invasive puncture of this percutaneous sensor can effectively reduce the pain of the user. And can collect tissue fluid at the same time.

However, the existing physiological detection equipment can not be used for a long time. For example, transdermal sensors can only be used for a single test. If a new transdermal sensor is required to be re-tested, the detected data will be directly Transmitted to a reader or mobile phone, the transcutaneous sensor itself does not save data. In addition, the existing physiological detection equipment cannot interrupt the detection midway during continuous detection for a period of time, there is a defect of wasting system power, and frequent replacement of transdermal sensors also has a problem of wasting resources.

The main object of the present invention is to provide a percutaneous microneedle array patch, including: a lower cover; an upper cover; a substrate provided inside the upper cover; and a first probe and a second probe provided on the lower cover and the upper cover The substrate is electrically connected between the first probe and the second probe, and the first probe and the second probe are disconnected. When the lower cover is combined with the upper cover to form the percutaneous microneedle array patch, the first A path is formed between the probe and the second probe.

With the separate and detachable design of the lower cover and the upper cover of the percutaneous microneedle array patch of the present invention, the microneedle set can be assembled on the lower cover, the signal processing unit, and the power supply unit respectively on the upper cover, and the lower cover and the upper cover can be combined. Then, a path is formed between the two probes, so that the signal processing unit can be started, so that the microneedle set can obtain an appropriate voltage so that the test object in the subcutaneous tissue fluid can electrochemically react with the enzyme on the microneedle set. The response electric signal can be read and intercepted by the signal processing unit. The user can easily replace the lower cover part containing the microneedle set without having to replace the upper cover part containing the signal processing unit and the power supply unit, in order to respond to long-term monitoring, and can interrupt the detection midway, and can avoid the replacement. In the case of data loss caused by the signal processing unit in the cover part, the use time can also be adjusted according to the use needs to have the effect of saving system power.

1‧‧‧ percutaneous microneedle array patch

11‧‧‧ lower cover

111‧‧‧first surface

112‧‧‧Second surface

113‧‧‧metal sheet

12‧‧‧ Upper cover

121‧‧‧Inner surface

122‧‧‧Signal Processing Unit

123‧‧‧Power supply unit

13‧‧‧ Probe

14‧‧‧ substrate

141‧‧‧Dielectric layer

142‧‧‧Line layer

143‧‧‧Insulation

144‧‧‧ opening

15‧‧‧ current path

16‧‧‧ Micro Needle Set Collection

17‧‧‧Skin

18‧‧‧ electric contact

19‧‧‧ conductive post

20‧‧‧ Flexible gasket

21‧‧‧ opening

31‧‧‧The first microneedle set

311‧‧‧First sheet

3111‧‧‧first perforation

3112‧‧‧The first spike

312‧‧‧Second sheet

3121‧‧‧second perforation

3122‧‧‧Second Strike

3123‧‧‧Barb

3124‧‧‧Guide

313‧‧‧ Third sheet

3131‧‧‧ third perforation

3132‧‧‧Third Strike

314‧‧‧ Fourth sheet

3141‧‧‧ fourth perforation

3142‧‧‧The fourth spike

32‧‧‧Second Micro Needle Set

321‧‧‧sheet

3211‧‧‧perforation

3212‧‧‧ Spike

3213‧‧‧Barb

3214‧‧‧Guide

33‧‧‧The third microneedle set

331‧‧‧sheet

3311‧‧‧perforation

3312‧‧‧Spike

3313‧‧‧Barb

3314‧‧‧Guide

Fig. 1 is a schematic diagram of the combination of the percutaneous microneedle array patch of the present invention; Fig. 2 is a schematic sectional view of the percutaneous microneedle array patch of the present invention; and Fig. 3 is the XX line segment in Fig. 1 A schematic cross-sectional view of a substrate; FIG. 4 is a schematic front view of a combination of another embodiment of the percutaneous microneedle array patch of the present invention; and FIG. 5 is another implementation of the percutaneous microneedle array patch of the present invention The combination of the examples is a schematic rear view; FIG. 6 is a schematic diagram of an embodiment of a microneedle group set in the percutaneous microneedle array patch of the present invention; and FIG. 7 is a percutaneous microneedle array patch of the present invention. A schematic view of another embodiment of the microneedle set collection; FIG. 8 is a schematic sectional view of another embodiment of the percutaneous microneedle array patch of the present invention; and FIG. 9 is a schematic sectional view of the substrate in FIG. 8 .

The following describes the implementation of the present invention through specific specific embodiments. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification, and can also use other different specific embodiments. To implement or apply.

Please refer to FIGS. 1, 2 and 3. The percutaneous microneedle array patch 1 of the present invention includes a lower cover 11 and an upper cover 12. The lower cover 11 has a first surface 111 and a second surface 112 opposite to the first surface 111, and the first surface 111 is provided with a metal sheet 113. A substrate 14 is provided inside the upper cover 12, and the substrate 14 has two probes 13 exposed on the inner surface 121 of the upper cover 12, wherein the two probes 13 are in an open state with each other.

In an embodiment, the two probes 13 may not be disposed on the substrate 14 at the same time, but may be disposed between the lower cover 11 and the upper cover 12 and electrically connected to the substrate 14. For example, a probe 13 may be disposed on the substrate 14. In addition, another probe 13 may be disposed on the metal sheet 113, which is not limited in the present invention.

In an embodiment, as shown in FIG. 3, the substrate 14 includes a dielectric layer 141 and a circuit layer 142 formed on the dielectric layer 141. The dielectric layer 141 has an opening 144 penetrating through two surfaces thereof, so that the two probes 13 can be disposed in the opening 144. In other words, the two probes 13 are disposed through the dielectric layer 141, and at this time, one end of the two probes 13 penetrating the dielectric layer 141 exposed on one surface of the dielectric layer 141 is electrically connected to the wiring layer 142. The other end of the probe 13 that penetrates through the dielectric layer 141 and is exposed on the other surface of the dielectric layer 141 is exposed on the inner surface 121 of the upper cover 12. The substrate 14 further includes an insulating layer 143. The insulating layer 143 is disposed on the circuit layer 142 and is disposed on the dielectric layer 141 on which the circuit layer 142 is not provided.

The percutaneous microneedle array patch 1 of the present invention further includes a microneedle set 16, which is arranged on the second surface 112 of the lower cover 11. The microneedle set 16 allows the user to attach the skin 17.

The upper cover 12 further includes a signal processing unit 122 and a power supply unit 123. The signal processing unit 122 is electrically connected to the two probes 13 through the circuit layer 142, and the power supply unit 123 is used to supply working power to the signal processing unit 122.

When the lower cover 11 is combined with the upper cover 12 to form a percutaneous microneedle array patch 1, when the metal piece 113 of the lower cover 11 contacts the two probes 13 exposed on the inner surface 121 of the upper cover 12, a path is formed between the two probes 13, that is, A current path 15 is formed, and the signal processing unit 122 is activated. At this time, the electrical signal of the microneedle set 16 can be effectively connected to the electrical contact 18 of the signal processing unit 122 through the conductive column 19 to obtain a suitable electrochemical reaction voltage to react with the test object in the tissue fluid. A current / voltage signal is generated, and the current / voltage signal is passed to the signal processing unit 122. The signal processing unit 122 can generate a sensing signal for interception and analysis of the concentration of the analyte in the body. The sensing signal can be stored in a storage unit (not shown) in the upper cover 12.

In an embodiment, the two probes 13 may not form a path through the metal sheet 113. For example, when the two probes 13 are pressed by the lower cover 11, the two probes 13 are close to each other to form a path.

When using the transdermal microneedle array patch 1 of the present invention, the user can apply the lower cover 11 provided with the microneedle set 16 to the skin 17 first, and then combine the upper cover 12 to the lower cover 11 through metal. The chip 113 turns on the two probes 13 and then activates the signal processing unit 122 to measure the concentration of each component in the tissue fluid of the subcutaneous tissue. Because the lower cover 11 and the upper cover 12 are detachable, when the microneedle set 16 needs to be replaced, the user can first remove the upper cover 12 and replace the lower cover 11 containing the microneedle set 16, which is about to include a new one. The lower cover 11 of the microneedle set 16 is reattached to the skin 17, and at this time, the same upper cover 12 can be reassembled to the new lower cover 11, so the user does not need to replace the upper cover 12 including the signal processing unit 122. . The detachable type can be easily combined as shown in Figure 1. The lower cover 11 and the upper cover 12 can be easily combined through the structure of the annular groove and the corresponding annular convex groove, and can be fixed by the tenon. Such a structure can also allow the user to easily separate the lower cover 11 and the upper cover 12 in reverse, which is not limited in the present invention. In other words, since the microneedle set 16 of the present invention can be separated from the circuit in the upper cover 12 and has disposable characteristics and power saving characteristics, the user can simply use the microneedle set 16 simply after replacing the microneedle set 16 without having to Discard the entire circuit. The invention can respond to long-term monitoring, and the physiological signals detected when different lower covers 11 are used can be stored in the same upper cover 12 at the same time, which can effectively avoid the situation of data loss. In addition, since the upper cover 12 does not need to be replaced, it also has the effect of saving resources.

Please refer to FIGS. 4 and 5. The microneedle set 16 included in the percutaneous microneedle array patch 1 of the present invention is electrically connected to the electrical contact 18 of the signal processing unit 122 on the substrate 14 through the conductive pillar 19. In this embodiment, the signal processing unit 122 and the power supply unit 123 may be disposed on the same surface of the substrate 14, and the electrical contact 18 may be disposed on the other surface of the substrate 14. Between the microneedle set 16 and the substrate 14, a flexible spacer 20 may be further provided. The flexible gasket 20 has an opening 21 for the conductive posts 19 of the microneedle set 16 to pass through. Since the percutaneous microneedle array patch 1 of the present invention includes a flexible gasket 20, it can conform to the user's muscle contour and come into close contact during operation.

In this embodiment, the microneedle group set 16 further includes a first microneedle group 31, a second microneedle group 32, and a third microneedle group 33. The first microneedle group 31 serves as a working electrode, and the second microneedle group 31 serves as a working electrode. The needle group 32 serves as a reference electrode, and the third microneedle group 33 serves as a counter electrode. Please refer to FIG. 6 to understand the detailed structure of the microneedle set 16 in more detail.

In this embodiment, the first microneedle group 31 may be formed by stacking a first sheet 311, a second sheet 312, and a third sheet 313. The first sheet 311 is provided with at least one first perforation 3111 and at least one first spike 3112 located at an edge of the first perforation 3111. The second sheet 312 is provided with at least one second perforation 3121 and at least one second spike 3122 located at an edge of the second perforation 3121. The third sheet 313 is provided with at least one third perforation 3131 and at least one third thorn 3132 located at an edge of the third perforation 3131. Wherein, the third sheet 313 is disposed between the first sheet 311 and the second sheet 312, and when the first sheet 311, the second sheet 312, and the third sheet 313 are stacked together, the second sheet 312 is punctured 3122 penetrates the third perforation 3131 of the relative position on the third sheet 313 and the first perforation 3111 of the relative position on the first sheet 311 and the third spike 3132 of the third sheet 313 passes through the first relative position on the first sheet 311 The perforations 3111 are stacked in such a manner that the first thorn 3112, the second thorn 3122, and the third thorn 3132 have a triangular pyramid shape after being stacked.

In addition, a barb 3123 may be provided on the edge of the second sheet 312 to engage with a hole on a circuit board. In an embodiment, a guide handle 3124 may be disposed on an edge of the second sheet 312 and inserted into the circuit board and electrically connected to the conductive pillar 19.

Similarly, the second microneedle set 32 has a sheet 321, at least one perforation 3211 is provided on the sheet 321, a spike 3212 is provided on the edge of the perforation 3211, and a barb 3213 can be provided on the edge of the sheet 321 to communicate with the circuit board. The holes are engaged, and a guide handle 3214 can be provided on the edge of the sheet 321 to be inserted on the circuit board and electrically connected to the conductive pillar 19.

Similarly, the third microneedle group 33 has a sheet 331. At least one perforation 3311 is provided on the sheet 331. A spike 3312 is provided on the edge of the perforation 3311. A barb 3313 can be provided on the edge of the sheet 331 to communicate with the circuit board. The holes are engaged, and a guide handle 3314 can be provided on the edge of the sheet 331 to be inserted on the circuit board and electrically connected to the conductive pillar 19.

In an embodiment, the respective numbers of the first through holes 3111, the second through holes 3121, and the third through holes 3131 correspond to each other and are plural, and a plurality of the first through holes 3111, the second through holes 3121, and the third through holes 3131 may be formed. The array form, as shown in FIG. 6, has a number of perforations of 12 and forms a 3x4 array form, but the present invention does not limit the number of perforations and the array form formed. In addition, the numbers of the first thorn 3112, the second thorn 3122, and the third thorn 3132 correspond to the first perforation 3111, the second perforation 3121, and the third perforation 3131, respectively.

In an embodiment, each of the thorns of the first microneedle group 31, the second microneedle group 32, and the third microneedle group 33 may be formed by a stamping or etching process, and the materials of these thorns may be selected from stainless steel and nickel. , Nickel alloy, titanium, titanium alloy, nano carbon tube, silicon material or resin, and biocompatible metals such as gold and palladium are deposited on the surface. The resin may be, for example, polycarbonate, polymethacrylic acid copolymer, ethylene / vinyl acetate copolymer, Teflon (polytetrafluoroethylene) or polyester. The height of the spikes may be 300-600 microns, the width of the substrate may be 150-450 microns, and the distance between the tips of the spikes may be 500-3000 microns.

FIG. 7 is another embodiment of the microneedle set 16 in the present invention. The technical content described in this embodiment is the same as that in the previous embodiment, and details are not described herein again. In this embodiment, the first microneedle group 31 may be formed by stacking a first sheet 311, a second sheet 312, a third sheet 313, and a fourth sheet 314. The first sheet 311 is provided with at least one first perforation 3111 and at least one first spike 3112 located at an edge of the first perforation 3111. The second sheet 312 is provided with at least one second perforation 3121 and at least one second spike 3122 located at an edge of the second perforation 3121. The third sheet 313 is provided with at least one third perforation 3131 and at least one third thorn 3132 located at an edge of the third perforation 3131. The fourth sheet 314 is provided with at least one fourth perforation 3141 and at least one fourth spike 3142 located on an edge of the fourth perforation 3141. Wherein, the third sheet 313 and the fourth sheet 314 are disposed between the first sheet 311 and the second sheet 312, and when the first sheet 311, the second sheet 312, the third sheet 313, and the fourth sheet 314 are stacked together The second puncture 3122 of the second sheet 312 passes through the fourth perforation 3141 of the fourth sheet 314 at a relative position, the third perforation 3131 of the third sheet 313 at a relative position, and the first perforation of the first sheet 311 at a relative position. 3111, the fourth spur 3142 of the fourth sheet 314 passes through the third perforation 3131 of the third sheet 313 at a relative position, and the first perforation 3111 of the third sheet 311, the third perforation of the third sheet 313 is passed through The first perforations 3111 on the first sheet 311 are stacked in a relative manner, so that the first thorn 3112, the second thorn 3122, the third thorn 3132, and the fourth thorn 3142 have a quadrangular pyramid shape after being stacked.

In an embodiment, the respective numbers of the first perforations 3111, the second perforations 3121, the third perforations 3131, and the fourth perforations 3141 correspond to each other and are plural, and the plurality of first perforations 3111, second perforations 3121, first The three perforations 3131 and the fourth perforations 3141 may form an array form. As shown in FIG. 7, the number of perforations is 12 and a 3 × 4 array form is formed, but the present invention does not limit the number of perforations and the formed array form. In addition, the numbers of the first thorns 3112, the second thorns 3122, the third thorns 3132, and the fourth thorns 3142 correspond to the first perforations 3111, the second perforations 3121, the third perforations 3131, and the fourth perforations 3141, respectively.

In another embodiment of the microneedle group set 16 in the present invention, the first microneedle group 31 may be formed only by stacking the first sheet 311 and the second sheet 312, and the present invention does not limit the Number of slices. In this embodiment, the detailed technical content of the first sheet 311 and the second sheet 312 is the same as the foregoing embodiment, and details are not described herein again.

In the above embodiment, each of the spikes 3112, 3122, 3132, and 3142 of the first microneedle group 31 may include a tip portion and a base portion, and the perforations on one sheet are punctured by the protruding edges of the perforated edges on the other sheets. After that, the respective tip portions are not at the same height. The height of the spikes can be pre-designed in accordance with the stacking order of the slices, so that the perforations on one of the slices are at the same height after passing through the spikes of the perforated edges on the other slices.

The surface of each spike of the microneedle set 16 in the percutaneous microneedle array patch of the present invention can be modified according to the target molecule, wherein the target molecule can be a biomolecule, such as blood glucose, cortisol, and fatty acids. The target molecule can also be a drug molecule, such as an antibiotic. Therefore, the inner surface of each spur of the first microneedle group 31 of the microneedle set 16 may be coated with a sensing polymer. The sensing polymer may be, for example, an antibody, an aptamer, a recombinant monomer, a saccharide, or glucose. Oxidase or hydroxybutyrate deoxygenase. The surface of each spike is coated with anti-allergic drugs. For example, blood glucose can be measured by immobilizing glucose oxidase on the inner surface of each spike. The general antibody or aptamer connection method is to apply a self-assemble monolayer (SAM) to the gold surface layer of each of the spikes of the first microneedle group 31 as a working electrode, and then join the antibody or aptamer, and then Blocking molecules are then applied to fill the self-assembled monolayer without antibodies or aptamers to ensure its specificity. If you want to increase the sensitivity, you can further mix the nano carbon tube in the gold surface layer.

Please refer to FIGS. 8 and 9, which are another embodiment of the percutaneous microneedle array patch of the present invention. Compared with the above embodiment, only the setting position of the probe 13 is different, and the remaining technical contents are the same, and details are not described herein again. Only the differences are stated below.

In this embodiment, the two probes 13 are disposed on the metal sheet 113 instead of the substrate 14. The substrate 14 provided inside the upper cover 12 includes a dielectric layer 141 and a circuit layer 142 formed on the dielectric layer 141, wherein the circuit layer 142 is in a disconnected state.

In one embodiment, the two probes 13 may not be provided on the metal sheet 113 at the same time, but may be provided on the circuit layer 142 at the same time, or one probe 13 is provided on the circuit layer 142 and the other probe 13 is provided on the metal. Tablet 113. When the two probes 13 are provided on the circuit layer 142 at the same time, they can be squeezed by the lower cover 11 and contact each other to form a path, so the metal sheet 113 is not required, but the invention is not limited thereto.

When the lower cover 11 is combined with the upper cover 12 to form a percutaneous microneedle array patch 1, the two probes 13 contact the circuit layer 142, and the circuit layer 142 will present a path through the two probes 13 and the metal sheet 113, that is, a current path is formed. 15. To activate the signal processing unit 122.

The above-mentioned embodiments are only for illustrative purposes to explain the technical principles, features, and effects of the present invention, and are not intended to limit the implementable scope of the present invention. Any person familiar with this technology can make changes to the invention without departing from the spirit and scope of the present invention. The above embodiments are modified and changed. However, any equivalent modifications and changes made using the teachings of the present invention should still be covered by the scope of patent application described below. The scope of protection of the rights of the present invention should be as listed in the following patent application scope.

Claims (13)

A percutaneous microneedle array patch includes: a lower cover; an upper cover; a substrate provided inside the upper cover, including: a dielectric layer; a circuit layer formed on the dielectric layer; and an insulating layer provided on the circuit layer And the dielectric layer without a circuit layer; and a first probe and a second probe, which are disposed between the lower cover and the upper cover and are electrically connected to the substrate, wherein the first probe and the There is an open circuit between the second probes, and the first probe and the second probe are penetrating the dielectric layer, and one end of the first probe and the second probe is electrically connected to the circuit layer. And the other ends of the first probe and the second probe are exposed on the inner surface of the upper cover; wherein, when the lower cover is combined with the upper cover to form the percutaneous microneedle array patch, the first probe and A path is formed between the second probes. The percutaneous microneedle array patch according to item 1 of the patent application scope, wherein the lower cover has a first surface and a second surface opposite to the first surface, and the first surface of the lower cover is provided with a metal Sheet, when the lower cover is combined with the upper cover to form the percutaneous microneedle array patch, the metal piece of the lower cover contacts the first probe and the second probe, so that the first probe and the second probe A path is formed between the probes, and the combination between the lower cover and the upper cover is detachable. The percutaneous microneedle array patch according to item 2 of the scope of the patent application, wherein the first probe and the second probe are both provided on the substrate and exposed on the surface of the upper cover, or the first One of the probe and the second probe is provided on the substrate and exposed on the surface of the upper cover, and the other of the first probe and the second probe is provided on the lower cover. On a metal plate. The percutaneous microneedle array patch according to item 1 of the patent application scope, wherein when the lower cover is combined with the upper cover to form the percutaneous microneedle array patch, the first probe and the second probe are subjected The lower covers are squeezed to be close to each other to form a passage. The percutaneous microneedle array patch according to item 1 of the scope of patent application, further comprising a microneedle set assembly, a signal processing unit, and a power supply unit. The microneedle set assembly is disposed on the lower cover and is electrically connected to the substrate. The signal processing unit is disposed inside the upper cover, and is used to start the signal processing unit to generate a sensing signal when a path is formed between the first probe and the second probe or the circuit layer. The power unit is provided at The upper cover is used to supply working power to the signal processing unit. The percutaneous microneedle array patch according to item 5 of the scope of patent application, wherein the microneedle group set further includes a first microneedle group, a second microneedle group, and a third microneedle group, and wherein the first One microneedle group is used as a working electrode, the second microneedle group is used as a reference electrode, and the third microneedle group is used as a counter electrode. The percutaneous microneedle array patch according to item 6 of the scope of patent application, wherein the first microneedle group is formed by stacking at least two sheets, and each of the at least two sheets is provided with at least one perforation and is located at At least one spike of the edge of the perforation, and wherein the spike of one of the at least two sheets passes through the perforation at a relative position on the other of the at least two sheets to oppose the spike of the other of the at least two sheets And, the respective numbers of the spurs of each of the at least two sheets are corresponding to each other and are plural, and wherein the perforations of each of the at least two sheets are formed in an array form. The percutaneous microneedle array patch according to item 7 of the patent application scope, wherein the at least two sheets include a first sheet, a second sheet, and a third sheet, and the first sheet is provided with at least one first perforation and At least one first spike located at the edge of the first perforation, at least one second hole located at the edge of the second perforation and at least one second spike located at the edge of the second perforation, and at least one third protrusion located on the third sheet. A third perforation and at least one third burr located at an edge of the third perforation, and wherein the second burr and the third burr pass through the first perforation at a relative position on the first sheet and communicate with the first perforation The spikes have a triangular pyramid shape, and the respective numbers of the first, second, and third perforations correspond to each other and are plural, and wherein the plurality of the first, second, or The third perforation is formed in an array. The percutaneous microneedle array patch according to item 7 of the scope of patent application, wherein the at least two sheets include a first sheet, a second sheet, a third sheet, and a fourth sheet, and at least one A first perforation and at least a first burr located at an edge of the first perforation, at least a second perforation and at least a second burr located at an edge of the second perforation, on the third sheet; At least one third perforation and at least one third burr located at an edge of the third perforation, and at least one fourth perforation and at least one fourth burr located at an edge of the fourth perforation, And, the second spur, the third spur, and the fourth stab pass through the first perforation at a relative position on the first sheet to form a quadrangular pyramid with the first spur, and wherein the first perforation, The respective numbers of the second perforation, the third perforation, and the fourth perforation are corresponding to each other and are plural, and wherein the first perforation, the second perforation, the third perforation, or the fourth perforation are plural. The lines are formed in an array. The percutaneous microneedle array patch according to item 7 of the scope of the patent application, wherein each spur of the first microneedle group includes a tip portion and a base portion, and the perforations on one sheet are opposed to each other on the other sheets. After the puncture at the perforated edge of the position passes through, the tip portions are not at the same height or at the same height. A percutaneous microneedle array patch includes: a lower cover having a first surface and a second surface opposite to the first surface; an upper cover; a metal sheet provided on the first surface of the lower cover; and a substrate provided on The inside of the upper cover includes a dielectric layer and a circuit layer formed on the dielectric layer, wherein the circuit layer is an open circuit; and a first probe and a second probe are provided between the lower cover and the upper cover. Wherein the first probe and the second probe are disconnected; wherein, when the lower cover is combined with the upper cover to form the percutaneous microneedle array patch, the metal piece of the lower cover contacts the first The probe and the second probe and the first probe and the second probe contact the circuit layer, so that the circuit layer forms a via. The percutaneous microneedle array patch according to item 11 of the scope of patent application, wherein the first probe and the second probe are provided on the circuit layer of the substrate or on the lower cover at the same time. On the metal sheet, or one on the circuit layer of the substrate and the other on the metal sheet of the lower cover. A percutaneous microneedle array patch includes: a lower cover; an upper cover; a substrate disposed inside the upper cover, including a dielectric layer and a circuit layer formed on the dielectric layer, wherein the circuit layer is open; and The first probe and the second probe are disposed between the lower cover and the upper cover, wherein the first probe and the second probe are disconnected; wherein when the lower cover is combined with the upper cover to form the When the percutaneous microneedle array is applied, the first probe and the second probe are squeezed by the lower cover to be close to each other to form a path, and the circuit layer forms a path.