CN208926382U - Percutaneous microneedle array patch - Google Patents
Percutaneous microneedle array patch Download PDFInfo
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- CN208926382U CN208926382U CN201820441256.XU CN201820441256U CN208926382U CN 208926382 U CN208926382 U CN 208926382U CN 201820441256 U CN201820441256 U CN 201820441256U CN 208926382 U CN208926382 U CN 208926382U
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Abstract
A kind of percutaneous microneedle array patch, comprising: lower cover；Upper cover；Substrate is set to inside the upper cover；And first probe and the second probe, it is set between the lower cover and the upper cover and is electrically connected the substrate, wherein be open circuit between first probe and second probe；Wherein, when the lower cover combination upper cover forms the percutaneous microneedle array patch, access is formed between first probe and second probe.
Description
Technical field
The utility model relates to a kind of percutaneous microneedle array patch, espespecially a kind of deserted percutaneous microneedle array patch.
Background technique
The tissue fluid of human body is mainly flowed in subcutaneous tissue.Due to tissue fluid amino acid rich in, fatty acid, sugar,
Waste caused by salt, hormone, coenzyme and cell etc., therefore through the mode of each constituent concentration in analysis tissue fluid, can have
Effect judges body physiological state.
In another example drug can also discharge for a long time and slowly in tissue fluid, and have dense when taking or injection drug
The variation of degree, thus analyze tissue fluid drug concentration, also can effective monitoring drug effect.
Existing physiological detection equipment is mostly worn out in a manner of cuticula carrys out extracting interstitial fluid by acupuncture treatment and carries out analysis detection,
Such as transcutaneous sensor etc., the low invasive puncture of this transcutaneous sensor can effectively mitigate the pain of user, and simultaneously may be used
Acquire tissue fluid.
However, existing physiological detection equipment not can use for a long time, such as transcutaneous sensor mostly can only single detection,
If that must replace a new transcutaneous sensor when must detect again, and the data detected all can directly spread out of to reader or
It is mobile phone, transcutaneous sensor itself can't save data.Also, existing physiological detection equipment is in continuous detection a period of time
When, detection can not be interrupted halfway, has the defect of waste systematic electricity, and frequently replacement transcutaneous sensor also has waste of resource
Problem.
Utility model content
The main purpose of the utility model is to provide a kind of percutaneous microneedle array patches, comprising: lower cover；Upper cover；Substrate,
Inside upper cover；And first probe and the second probe, it is set between lower cover and upper cover and is electrically connected substrate, wherein the
It is open circuit between one probe and the second probe；Wherein, lower cover combination upper cover is when forming percutaneous microneedle array patch, the first probe and
Access is formed between second probe.
By the separation of lower cover and upper cover and the design of detachable of the percutaneous microneedle array patch of the utility model, can distinguish
Micropin group set is set to lower cover, signal processing unit and power supply unit and is set to upper cover, two spies are made after lower cover and top cover combination
Access is formed between needle, and signal processing unit can be made to start, and then enables micropin group set obtain voltage appropriate to make subcutaneous group
The ferment that knitting the determinand in liquid can close with micropin group collection is electrochemically reacted, and the electric signal reacted can be by signal
Reason unit is read out and intercepts.User can replace the lower cover part comprising micropin group set easily, include without replacing
The upper cover part of signal processing unit and power supply unit, and because needing to monitor for a long time, detection can be interrupted in midway, can avoid because replacing
The signal processing unit changed in cover and the situation for causing data to be lost, can also be adjusted according to use demand using the time and
Has the effect of saving systematic electricity.
Detailed description of the invention
Fig. 1 is the combination diagram of the percutaneous microneedle array patch of the utility model；
Fig. 2 is the diagrammatic cross-section of the percutaneous microneedle array patch of the utility model；
Fig. 3 is the diagrammatic cross-section of substrate in X-X line segment in Fig. 1；
Fig. 4 is the combination schematic front view of another embodiment of the percutaneous microneedle array patch of the utility model；
Fig. 5 is the combination diagrammatic rear view of the another embodiment of the percutaneous microneedle array patch of the utility model；
Fig. 6 is the schematic diagram that micropin group collection unifies embodiment in the percutaneous microneedle array patch of the utility model；
Fig. 7 is the schematic diagram of another embodiment of micropin group set in the percutaneous microneedle array patch of the utility model；
Fig. 8 is the diagrammatic cross-section of another embodiment of the percutaneous microneedle array patch of the utility model；And
Fig. 9 is the diagrammatic cross-section of substrate in Fig. 8.
Component label instructions
1: percutaneous microneedle array patch
11: lower cover
111: 312: the second thin slice of first surface
112: second surface 3121: the second is perforated
113: 3122: the second bur of sheet metal
12: upper cover 3123: barb
121: inner surface 3124: leading handle
122: signal processing unit 313: third thin slice
123: power supply unit 3131: third perforation
13: probe 3132: third bur
14: 314: the four thin slice of substrate
141: dielectric layer 3141: the four is perforated
142: 3142: the four bur of line layer
143: 32: the second micropin group of insulating layer
144: opening 321: thin slice
15: current path 3211: perforation
16: micropin group set 3212: bur
17: skin 3213: barb
18: electric contact 3214: leading handle
19: conductive column 33: third micropin group
20: flexible gasket 331: thin slice
21: opening 3311: perforation
31: the first micropin groups 3312: bur
311: the first thin slices 3313: barb
3111: the first perforation 3314: handle is led
3112: the first burs
Specific embodiment
The embodiments of the present invention is illustrated by particular specific embodiment below, and those skilled in the art
Other advantages and effect of the utility model can be understood easily by content disclosed in the present specification, it also can be by other differences
Specific embodiment implemented or applied.
Fig. 1, Fig. 2 and Fig. 3 are please referred to, the percutaneous microneedle array patch 1 of the utility model includes lower cover 11 and upper cover 12.
Lower cover 11 has first surface 111 and the second surface 112 relative to first surface 111, and first surface 111 is equipped with a metal
Piece 113.Substrate 14 is equipped with inside upper cover 12, substrate 14 has two probes 13 of the inner surface 121 for exposing to upper cover 12, wherein
Off state is presented in two probes 13 each other.
In an embodiment, two probes 13 can not be located at simultaneously on substrate 14, and be provided between lower cover 11 and upper cover 12
And it is electrically connected substrate 14, such as a probe 13 can be set on substrate 14, and another probe 13 can be set on sheet metal 113, this
Utility model is not limited thereto.
In an embodiment, as shown in Fig. 3, substrate 14 includes dielectric layer 141, and is formed on dielectric layer 141
Line layer 142.Dielectric layer 141, which has, penetrates through the opening 144 secondly surface, and two probes 13 are set in opening 144.It changes
Yan Zhi, two probes 13 penetrate through dielectric layer 141 and are located therein, at this point, two probes 13 of perforation dielectric layer 141 expose to dielectric
The one end on one of 141 surface of layer and line layer 142 be electrically connected, and two probes 13 for penetrating through dielectric layer 141 expose to dielectric
The other end on another surface of layer 141 then exposes to the inner surface 121 of upper cover 12.Substrate 14 further includes insulating layer 143, insulating layer
143 are set on line layer 142, and insulating layer 143 is set to and is not provided on the dielectric layer 141 of line layer 142.
The percutaneous microneedle array patch 1 of the utility model further includes micropin group set 16, set on the second surface of lower cover 11
On 112.Micropin group set 16 can allow user to be covered on skin 17.
Signal processing unit 122 and power supply unit 123 are additionally provided with inside upper cover 12.Signal processing unit 122 penetrates route
Layer 142 and be electrically connected with two probes 13, power supply unit 123 then gives signal processing unit 122 to supply working power.
When the combination of lower cover 11 upper cover 12 forms percutaneous microneedle array patch 1, the contact of sheet metal 113 of lower cover 11 is exposed to
When two probe 13 of the inner surface 121 of lid 12, access is formed between two probes 13, that is, forms current path 15, and starts signal
Processing unit 122.At this point, the electric signal of micropin group set 16 can effectively through conductive column 19 and with signal processing unit 122
Electric contact 18 is electrically connected, and obtains suitable electrochemical reaction voltage, to generate after being reacted with determinand in tissue fluid
Current/voltage signal, current/voltage signal can be transmitted to signal processing unit 122, and signal processing unit 122 can produce accordingly
Raw sensing signal is to carry out interception and analyze internal testing concentration.This sensing signal can be stored in the storage element in upper cover 12
In (not shown).
In an embodiment, two probes 13 can not also form access by sheet metal 113, such as two probes 13 can be
When being squeezed by lower cover 11, two probes 13 are close to each other and are mutually connected into access.
When using the percutaneous microneedle array patch 1 of the utility model, user can will be equipped under micropin group set 16
Lid 11 is first covered on skin 17, and upper cover 12 is then incorporated into lower cover 11, two probes 13 is connected by sheet metal 113, in turn
Start signal processing unit 122, each constituent concentration in the tissue fluid to measure subcutaneous tissue.Due between lower cover 11 and upper cover 12
To be detachable, when needing to replace micropin group set 16, user can first removal upper cover 12, replacement includes micropin group set 16
Lower cover 11, i.e., a new lower cover 11 comprising micropin group set 16 is covered on again on skin 17, at this time can will be same
In 12 recombinant of upper cover to new lower cover 11, therefore user is not necessary to the upper cover 12 that replacement includes signal processing unit 122.It is removable
The formula of unloading can be as shown in Figure 1, lower cover 11 can be combined easily with upper cover 12 by the structure of annular groove and corresponding annular tongue
Together, and it can pass through trip and be fixed, and this class formation also can reversely allow user's delamination lower cover 11 and upper cover
12, the utility model is not limited thereto.In other words, due to the circuit in the micropin group set 16 of the utility model and upper cover 12
It can separate, and there is jettisonable characteristic and electricity-saving characteristic, user can facilitate after can only replacing micropin group set 16 merely
It uses, is not necessary to all abandon entire circuit.Detected physiological signal can store up simultaneously when the utility model is using different lower covers 11
There are the situations that in same upper cover 12, can effectively avoid data loss.Further, since not needing replacement upper cover 12, also there is section
The effect of resource-saving.
Fig. 4 and Fig. 5 is please referred to, micropin group set 16 included by the percutaneous microneedle array patch 1 of the utility model is led to
It crosses conductive column 19 and is electrically connected with the electric contact 18 of signal processing unit 122 on substrate 14, in the present embodiment, signal processing
Unit 122 and power supply unit 123 can be set on the same surface of substrate 14, and electric contact 18 can then be set to another table of substrate 14
On face.Between micropin group set 16 and substrate 14, more settable one flexible gasket 20.Flexible gasket 20 has an opening
21 pass through for the conductive column 19 of micropin group set 16.Since the percutaneous microneedle array patch 1 of the utility model includes flexible
Property gasket 20, the muscle profile for operating Shi Keyu user is conformal and be in close contact.
In the present embodiment, micropin group set 16 further includes the first micropin group 31, the second micropin group 32 and third micropin group
33, wherein the first micropin group 31 is used as working electrode, and the second micropin group 32 is used as reference electrode, and 33 conduct of third micropin group
Counterelectrode.Further referring to Fig. 6, to understand the detailed construction of micropin group set 16 in more detail.
In this present embodiment, the first micropin group 31 can be folded by the first thin slice 311, the second thin slice 312 and third thin slice 313
It sets.At least one first perforation 3111 is provided on first thin slice 311 and positioned at least the one of the first 3111 edges of perforation
First bur 3112.It is provided at least one second perforation 3121 on second thin slice 312 and perforates 3121 edges extremely positioned at second
Few one second bur 3122.It is provided at least third perforation 3131 on third thin slice 313 and is located at 3131 edges of third perforation
An at least third bur 3132.Wherein, third thin slice 313 is set between the first thin slice 311 and the second thin slice 312, and first
When thin slice 311, the second thin slice 312 and third thin slice 313 stack together, passed through with the second bur 3122 of the second thin slice 312
First perforation 3111, third of the third perforation 3131 of relative position and the first relative position on thin slice 311 on third thin slice 313
The mode that the third bur 3132 of thin slice 313 passes through the first perforation 3111 of relative position on the first thin slice 311, which is stacked, to be formed, and is made
Obtaining the first bur 3112, the second bur 3122 and third bur 3132 is in triangular pyramidal after stacked.
In addition, on the edge of the second thin slice 312 settable barb 1323 and engage with the hole on a circuit board.It is real one
It applies in example, it is settable on the edge of the second thin slice 312 to lead handle 3124 and insert on circuit boards and be electrically connected with conductive column 19.
Similarly, the second micropin group 32 has thin slice 321, and at least one perforation 3211 is provided on thin slice 321,3211 sides of perforating
Edge is provided with bur 3212, and on the edge of thin slice 321 settable barb 3213 and engage with the hole on circuit board, and thin slice
It is settable on 321 edge to lead handle 3214 and insert on circuit boards and be electrically connected with conductive column 19.
Similarly, third micropin group 33 has thin slice 331, is provided at least one perforation 3311 on thin slice 331, perforation 3311 it
Edge is provided with bur 3312, and on the edge of thin slice 331 settable barb 3313 and engage with the hole on circuit board, and it is thin
It is settable on the edge of piece 331 to lead handle 3314 and insert on circuit boards and be electrically connected with conductive column 19.
In one embodiment, first the 3111, second perforation 3121 of perforation and 3131 respective quantity of third perforation correspond to each other
And be a plurality of, and a plurality of the 3111, second perforation 3121 of first perforation and third perforation 3131 can form array format, such as
Shown in Fig. 6, the number of holes is 12 and forms 3 × 4 array format, but the utility model is not intended to limit the number of holes and institute
The array format of formation.The quantity of another first bur 3112, the second bur 3122 and third bur 3132 corresponds respectively to first
The 3111, second perforation 3121 of perforation and third perforation 3131.
In an embodiment, each bur of the first micropin group 31, the second micropin group 32 and third micropin group 33 can pass through
Punching press or etch process and formed, and the material of these burs can be selected from stainless steel, nickel, nickel alloy, titanium, titanium alloy, nano-sized carbon
Pipe, silicon materials or resin and its surface deposition have the metal, such as gold, palladium etc. of bio-compatibility.Resin may be, for example, poly- carbon
Acid esters, polymethacrylic acid copolymer, ethylene/vinyl acetate copolymer, Teflon (polytetrafluoroethylene (PTFE)) or polyesters.Bur
Height can be 300-600 microns, base widths can be 150-450 microns, the interval between the point of these burs can
It is 500-3000 microns.
Fig. 7 is another embodiment of micropin group set 16 in the utility model, technology contents as described in this embodiment
Part is identical to previous embodiment, repeats no more in this.In this present embodiment, the first micropin group 31 can be by the first thin slice
311, the second thin slice 312, third thin slice 313 and the 4th thin slice 314 are stacked together.At least one is provided on first thin slice 311
First perforation 3111 and positioned at first perforation 3111 edges at least one first bur 3112.It is provided on second thin slice 312
At least one second perforation 3121 and positioned at second perforation 3121 edges at least one second bur 3122.It is set on third thin slice 313
It is equipped at least third perforation 3131 and at least third bur 3132 positioned at 3131 edges of third perforation.4th thin slice 314
On be provided at least one the 4th perforation 3141 and positioned at the 4th perforation 3141 edges at least one the 4th bur 3142.Wherein,
Three thin slices 313 and the 4th thin slice 314 are set between the first thin slice 311 and the second thin slice 312, and the first thin slice 311, the second thin slice
312, when third thin slice 313 and the 4th thin slice 314 stack together, the 4th is passed through with the second bur 3122 of the second thin slice 312
4th perforation 3141 of relative position, the third perforation 3131 of relative position and the first thin slice on third thin slice 313 on thin slice 314
The 4th bur 3142 of the first the 3111, the 4th thin slice 314 of perforation of relative position passes through opposite position on third thin slice 313 on 311
First perforation 3111 of the third perforation 3131 and the first relative position on thin slice 311 set, third thin slice 313 third bur
3132 modes for passing through the first perforation 3111 of relative position on the first thin slice 311, which are stacked, to be formed, so that the first bur 3112,
Second bur 3122, third bur 3132 and the 4th bur 3142 are in quadrangle taper after stacked.
In one embodiment, first the 3111, second perforation 3121 of perforation, third perforation 3131 and the 4th perforation 3141 are respective
Quantity system corresponds to each other and to be a plurality of, and a plurality of the 3111, second perforation 3121 of first perforation, third perforation 3131 and the
Four perforation 3141 can form array format, and as shown in the figure 7, the number of holes is 12 and forms 3 × 4 array format, but
The utility model is not intended to limit the number of holes and is formed by array format.Another first bur 3112, the second bur 3122, third
The quantity of bur 3132 and the 4th bur 3142 corresponds respectively to the first perforation 3111, second perforation 3121, third perforation 3131
And the 4th perforation 3141.
The another embodiment of micropin group set 16 in the utility model, the first micropin group 31 can only by the first thin slice 311 and
Second thin slice 312 is stacked together, and the utility model is not intended to limit number of sheets in the first micropin group 31.In the present embodiment
The detailed technology content of one thin slice 311 and the second thin slice 312 is identical to previous embodiment, repeats no more in this.
In above-described embodiment, each bur 3112,3122,3132,3142 of the first micropin group 31 may include a point
And a base portion, wherein the perforation on a thin slice is after the bur of the perforated edge of relative position on remaining thin slice passes through, each point
End is not in sustained height.The height of its bur can be pre-designed according to the order that thin slice is stacked, so that wherein on a thin slice
Perforation is after the bur of the perforated edge of relative position on remaining thin slice passes through, and each point is in sustained height.
Each bur surface of micropin group set 16 can be according to target point in the percutaneous microneedle array patch of the utility model
Son is modified, wherein target molecule can be biomolecule, such as blood glucose, cortisol, fatty acid etc..Target molecule also may be used
To be drug molecule, such as antibiotic.Therefore, it can be applied on the inner surface of each bur of the first micropin group 31 of micropin group set 16
There is sensing macromolecule, sensing macromolecule may be, for example, antibody, aptamer, recombination monomer, carbohydrate, glucose oxidase or hydroxybutyric acid
Deoxygenase.And the drug of anti-skin allergy is coated on the outer surface of each bur.For example, fixed Portugal can be passed through when measuring blood glucose
Grape carbohydrate oxidase is on the inner surface of each bur.And the connection type of general antibody or aptamer is to the as working electrode
The metal layer of each bur of one micropin group 31, after application self-assembled monolayer (self-assemble monolayer, SAM)
Bound antibody or aptamer then apply barrier molecule again, fill up the self-assembled monolayer for not connecting antibody or aptamer, to ensure it specially
One property, will such as increase sensitivity, and carbon nanotubes can be further mixed in metal layer.
The 8th and 9 figures are please referred to, are another embodiment of the percutaneous microneedle array patch of the utility model.With above-mentioned reality
It applies example to compare, only the setting position of probe 13 is different, remaining technology contents is all the same, repeats no more in this.It only states below not
Same place.
In the present embodiment, two probes 13 are set on sheet metal 113, rather than are set on substrate 14.Inside upper cover 12
Substrate 14 then include dielectric layer 141 and the line layer being formed on dielectric layer 141 142, wherein line layer 142 presents disconnected
Line state.
In an embodiment, two probes 13 can not be set on sheet metal 113 simultaneously, but be set on line layer 142 simultaneously,
Or one probe 13 be set to line layer 142 on and another probe 13 be set to sheet metal 113.Two probes 13 are set to line layer simultaneously
It when on 142, can be squeezed by lower cover 11 and phase close to each other is connected into access, therefore not need sheet metal 113, but the utility model is not
As limit.
When the combination of lower cover 11 upper cover 12 forms percutaneous microneedle array patch 1, two probes 13 contact line layer 142, at this time line
Access will be presented with sheet metal 113 by two probes 13 in road floor 142, that is, current path 15 is formed, to start signal processing
Unit 122.
Above-mentioned implementation form be only be illustrated the utility model technical principle, feature and its effect, not to
The implementable scope of the utility model is limited, anyone skilled in the art can be in the spirit and model without prejudice to the utility model
Under farmland, above-mentioned implementation form is modified and changed.It is so any to be completed equivalent with the utility model institute's teachings
Modification and change, still should be above-mentioned claim and are covered.And the rights protection scope of the utility model, it should be as above
Listed by the claim stated.
Claims (15)
1. a kind of percutaneous microneedle array patch characterized by comprising
Lower cover；
Upper cover；
Substrate is set to inside the upper cover；And
First probe and the second probe are set between the lower cover and the upper cover and are electrically connected the substrate, wherein is described
It is open circuit between first probe and second probe；
Wherein, when the lower cover combines the upper cover and forms the percutaneous microneedle array patch, first probe and described the
Access is formed between two probes.
2. percutaneous microneedle array patch according to claim 1, which is characterized in that wherein, the lower cover has the first table
The first surface of face and second surface relative to the first surface, the lower cover is equipped with a sheet metal, the lower cover
When combining the upper cover and forming the percutaneous microneedle array patch, the sheet metal of the lower cover contact first probe and
Second probe makes to form access between first probe and second probe, and wherein, the lower cover and it is described on
Group between lid is combined into detachable.
3. percutaneous microneedle array patch according to claim 2, which is characterized in that wherein, first probe and described
Second probe is set on the substrate simultaneously and exposes to surface or first probe and second probe of the upper cover
One of them be set on the substrate and expose to the surface of the upper cover, and first probe and second probe
Another is set on the sheet metal of the lower cover.
4. percutaneous microneedle array patch according to claim 1, which is characterized in that wherein, the lower cover combines on described
When lid forms the percutaneous microneedle array patch, first probe and second probe are squeezed by the lower cover and are leaned on each other
Closely mutually it is connected into access.
5. percutaneous microneedle array patch according to claim 1, which is characterized in that wherein, the substrate further includes Jie
It electric layer, the line layer being formed on the dielectric layer and set on the line layer and is not provided on the dielectric layer of line layer
Insulating layer, and wherein, first probe and second probe penetrate through the dielectric layer, first probe and described the
One end of two probes and the line layer are electrically connected, and the other end of first probe and second probe exposes to institute
State the inner surface of upper cover.
6. percutaneous microneedle array patch according to claim 5, which is characterized in that further include micropin group set, at signal
Unit and power supply unit are managed, the micropin group set is set on the lower lid and is electrically connected the substrate, the signal processing
Unit be set to the upper cover inside, between first probe and second probe or the line layer formed access
When, start the signal processing unit to generate sensing signal, the power supply unit is set to inside the upper cover, to supply work
Make power supply to the signal processing unit.
7. percutaneous microneedle array patch according to claim 6, which is characterized in that wherein, the micropin group set is more wrapped
The first micropin group, the second micropin group and third micropin group being included, and wherein, the first micropin group is as working electrode, and described
Two micropin groups are as reference electrode, and the third micropin group is as counterelectrode.
8. percutaneous microneedle array patch according to claim 7, which is characterized in that wherein, the first micropin group is by extremely
Few two thin slices are stacked together, and at least one perforation are respectively arranged on each at least two thin slices and positioned at the perforated edge
An at least bur, and wherein, the bur of described at least one of two thin slices passes through opposite position on another of at least two thin slices
The perforation set and it is opposite at least another the bur of two thin slices, and wherein, each at least two thin slices it is prominent
The respective quantity of thorn corresponds to each other and is a plurality of, and wherein, and the perforation of each at least two thin slices is formed as array format.
9. percutaneous microneedle array patch according to claim 8, which is characterized in that wherein, at least two thin slices include
First thin slice, the second thin slice and third thin slice are provided at least one first perforation on first thin slice and are located at described first
At least one first bur of perforated edge is provided at least one second perforation on second thin slice and is located at second perforation
It is provided with the perforation of an at least third at least one second bur at edge and the third thin slice and is located at the third and perforates
An at least third bur at edge, and wherein, second bur and the third bur pass through on first thin slice relatively
First perforation of position and be in triangular pyramidal with first bur, and wherein, first perforation, second perforation
And the respective quantity of the third perforation corresponds to each other and is a plurality of, and wherein, a plurality of first perforation, described second
Perforation or third perforation are formed as array format.
10. percutaneous microneedle array patch according to claim 8, which is characterized in that wherein, at least two thin slices include
First thin slice, the second thin slice, third thin slice and the 4th thin slice are provided at least one first perforation on first thin slice and are located at
At least one first bur of first perforated edge is provided at least one second perforation on second thin slice and is located at described
At least one second bur of second perforated edge is provided with the perforation of an at least third on the third thin slice and is located at the third
At least one the 4th perforation is provided on an at least third bur for perforated edge and the 4th thin slice and positioned at the described 4th
At least one the 4th bur of perforated edge, and wherein, second bur, the third bur and the 4th bur pass through institute
State first perforation of relative position on the first thin slice and with first bur in quadrangle taper, and wherein, described first
Perforation, second perforation, third perforation and the respective quantity of the 4th perforation correspond to each other and are a plurality of, and its
In, a plurality of first perforation, second perforation, third perforation or the 4th perforation are formed as array format.
11. percutaneous microneedle array patch according to claim 8, which is characterized in that wherein, the first micropin group it is every
One bur includes a point and a base portion, wherein perforated edge of the perforation through relative position on remaining thin slice on a thin slice
Bur pass through after, each point is not in sustained height or in sustained height.
12. a kind of percutaneous microneedle array patch characterized by comprising
Lower cover；
Upper cover；
Substrate is set to inside the upper cover, including a dielectric layer and the line layer being formed on the dielectric layer, wherein institute
Line layer is stated as open circuit；And
First probe and the second probe are set between the lower cover and the upper cover；
Wherein, when the lower cover combines the upper cover and forms the percutaneous microneedle array patch, first probe and described the
Two probes contact the line layer, and the line layer is made to form access.
13. percutaneous microneedle array patch according to claim 12, which is characterized in that wherein, the lower cover has first
The first surface of surface and second surface relative to the first surface, the lower cover is equipped with a sheet metal, under described
When the lid combination upper cover forms the percutaneous microneedle array patch, the sheet metal of the lower cover contacts first probe
And second probe, so that the line layer is formed access.
14. percutaneous microneedle array patch according to claim 13, which is characterized in that wherein, first probe and institute
It states the second probe while being set on the line layer of the substrate, or simultaneously on the sheet metal of the lower cover, or
One be set to the substrate the line layer on and another be set to the lower cover the sheet metal on.
15. percutaneous microneedle array patch according to claim 12, which is characterized in that wherein, described in the lower cover combination
When upper cover forms the percutaneous microneedle array patch, first probe and second probe squeezed by the lower cover and each other
It is close to be mutually connected into access.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820441256.XU CN208926382U (en) | 2018-03-29 | 2018-03-29 | Percutaneous microneedle array patch |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820441256.XU CN208926382U (en) | 2018-03-29 | 2018-03-29 | Percutaneous microneedle array patch |
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| CN208926382U true CN208926382U (en) | 2019-06-04 |
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| CN201820441256.XU Active CN208926382U (en) | 2018-03-29 | 2018-03-29 | Percutaneous microneedle array patch |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI735138B (en) * | 2019-08-02 | 2021-08-01 | 華廣生技股份有限公司 | Physiological signal sensing device |
| US11707213B2 (en) | 2019-08-02 | 2023-07-25 | Bionime Corporation | Physiological signal monitoring device |
| US11717198B2 (en) | 2019-08-02 | 2023-08-08 | Bionime Corporation | Physiological signal monitoring device |
| US11737689B2 (en) | 2019-08-02 | 2023-08-29 | Bionime Corporation | Physiological signal monitoring device |
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2018
- 2018-03-29 CN CN201820441256.XU patent/CN208926382U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI735138B (en) * | 2019-08-02 | 2021-08-01 | 華廣生技股份有限公司 | Physiological signal sensing device |
| US11707213B2 (en) | 2019-08-02 | 2023-07-25 | Bionime Corporation | Physiological signal monitoring device |
| US11717198B2 (en) | 2019-08-02 | 2023-08-08 | Bionime Corporation | Physiological signal monitoring device |
| US11737689B2 (en) | 2019-08-02 | 2023-08-29 | Bionime Corporation | Physiological signal monitoring device |
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