TWI665954B - Heat sink unit fixture structure - Google Patents
Heat sink unit fixture structure Download PDFInfo
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- TWI665954B TWI665954B TW107122921A TW107122921A TWI665954B TW I665954 B TWI665954 B TW I665954B TW 107122921 A TW107122921 A TW 107122921A TW 107122921 A TW107122921 A TW 107122921A TW I665954 B TWI665954 B TW I665954B
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Abstract
一種散熱單元治具結構,係包含:一本體;所述本體內部具有一腔室 及上側具有一頂部,並所述頂部具有至少一開放口,所述開放口設置至少一二氧化矽層,所述腔室係呈真空氣密或正壓惰性氣氛,透過本發明散熱單元治具結構提供雷射加工或雷射焊接工作更佳之環境及加工彈性者。 A heat dissipation unit fixture structure includes: a body; the body has a cavity inside And the upper side has a top, and the top has at least one open port, the open port is provided with at least a silicon dioxide layer, and the chamber is in a vacuum airtight or positive pressure inert atmosphere, and passes through the heat dissipation unit fixture of the present invention The structure provides a better environment for laser processing or laser welding and processing flexibility.
Description
一種散熱單元治具結構,尤指一種防止雷射焊接工作焊接物遭受污染及氧化的散熱單元治具結構。 The utility model relates to a heat dissipation unit fixture structure, in particular to a heat dissipation unit fixture structure for preventing laser welding work welding objects from being polluted and oxidized.
現行均溫板係採用至少兩金屬板體相互疊合並透過擴散接合或焊接等方式結合,於兩金屬板體之間形成氣密腔室,並該氣密腔室中具有毛細結構及工作液體,進而透過汽液循環之原理加速熱傳導之效能。 The current temperature-equalizing plate is formed by stacking at least two metal plates on top of each other by diffusion bonding or welding to form an air-tight chamber between the two metal plates, and the air-tight chamber has a capillary structure and a working liquid. Furthermore, the efficiency of heat conduction is accelerated by the principle of vapor-liquid circulation.
一般均溫板係透過兩片銅或鋁或不銹鋼或鈦或鎂等金屬材質其中任一進行疊合並焊接所構成之結構體,但若為相異材質相互組合之搭配則無法透過普通焊接或擴散接合之方式進行結合,故熟悉該項技藝之人士透過雷射焊接之方式對所述相異材質之兩板體進行結合,而雷射焊接進行時需要透過通入惰性氣體或真空之環境避免材料污染或氧化反應之產生,則透過設置一具有密閉腔室之雷射焊接工具機台進行雷射焊接作業,於密閉腔室中所提供之真空環境或通入惰性氣體之環境係可解決污染或氧化反應之產生,但若工件大過於密閉腔室則無法進行加工,故雖改善了雷射焊接部分缺點但工件尺寸過大之問題則尚待改善。 Generally, the temperature equalizing plate is a structure formed by stacking and welding two metal materials such as copper, aluminum, stainless steel, titanium, or magnesium. However, if it is a combination of different materials, it cannot be passed through ordinary welding or diffusion. The joining method is combined, so people who are familiar with the technology combine the two plates of different materials by laser welding. When laser welding is performed, the material must be avoided by passing in an inert gas or vacuum environment. If pollution or oxidation reaction occurs, laser welding is performed by setting a laser welding tool machine with a closed chamber. The vacuum environment provided in the closed chamber or the environment in which inert gas is passed can solve the pollution or The generation of oxidation reaction, but if the workpiece is too large in a closed chamber, it cannot be processed, so although the disadvantages of the laser welding part are improved, the problem of excessively large workpiece size still needs to be improved.
爰此,為解決上述習知技術之缺點,本發明之主要目的,係提供一種雷射焊接使用之治具。 Therefore, in order to solve the disadvantages of the above-mentioned conventional technology, the main object of the present invention is to provide a fixture for laser welding.
為達上述之目的,本發明係提供一種散熱單元治具結構,係包含:一本體;所述本體內部具有一腔室及上側具有一頂部,並所述頂部具有至少一開放口,所述開放口設置至少一二氧化矽層,所述腔室係呈真空氣密或正壓惰性氣氛。透過本發明係可提供需進行雷射焊接之工件一氣密之環境進行雷射焊接工作,不論選擇真空環境或通入惰性氣體之氣氛下皆可,不僅可防止工件進行雷射焊接時遭受污染亦可防止氧化反應之發生。 In order to achieve the above-mentioned object, the present invention provides a jig structure for a heat dissipation unit, comprising: a body; the body has a cavity inside and a top on the upper side, and the top has at least one opening, The open port is provided with at least a silicon dioxide layer, and the chamber is in a vacuum airtight or positive pressure inert atmosphere. Through the present invention, it is possible to provide an air-tight environment for laser welding of the workpiece to be laser welded, regardless of the choice of vacuum environment or an atmosphere of inert gas, which can not only prevent the workpiece from being contaminated during laser welding, but also Can prevent the occurrence of oxidation reactions.
故僅針對工件之大小選擇適用之治具使用,使用彈性大,則可增加雷射加工之彈性選擇。 Therefore, only suitable fixtures are selected for the size of the workpiece. If the use flexibility is large, the flexibility of laser processing can be increased.
1‧‧‧本體 1‧‧‧ Ontology
1a‧‧‧第一部分 1a‧‧‧Part I
1b‧‧‧第二部分 1b‧‧‧Part II
11‧‧‧腔室 11‧‧‧ chamber
12‧‧‧頂部 12‧‧‧Top
13‧‧‧開放口 13‧‧‧ open mouth
14‧‧‧二氧化矽層 14‧‧‧ Silicon dioxide layer
141‧‧‧抗反射薄膜 141‧‧‧Anti-reflective film
15‧‧‧通道 15‧‧‧channel
2‧‧‧散熱單元治具 2‧‧‧ Cooling unit fixture
3‧‧‧雷射加工機具 3‧‧‧laser processing tools
31‧‧‧工作台 31‧‧‧Workbench
4‧‧‧工件 4‧‧‧ Workpiece
第1圖係為本發明散熱單元治具結構之立體分解圖;第2圖係為本發明散熱單元治具結構之組合剖視圖;第3圖係為本發明散熱單元治具結構之示意圖。 Figure 1 is an exploded perspective view of the structure of the heat sink unit fixture of the present invention; Figure 2 is a sectional view of the structure of the heat sink unit fixture of the present invention; and Figure 3 is a schematic view of the structure of the heat sink unit fixture of the present invention.
本發明之上述目的及其結構與功能上的特性,將依據所附圖式之較佳實施例予以說明。 The above-mentioned object of the present invention and its structural and functional characteristics will be described based on the preferred embodiments of the drawings.
請參閱第1、2圖,係為本發明散熱單元治具結構之立體分解及組合剖視,如圖所示,所述散熱單元治具結構,係包含:一本體1;所述本體1內部具有一腔室11及上側具有一頂部12,並所述頂部12具有至少一開放口13,所述開放口13設置至少一二氧化矽層14,所述腔室11係呈真空氣密,所述本體1係為鋁或不鏽鋼其中任一材質。 Please refer to FIGS. 1 and 2 for a three-dimensional exploded and combined sectional view of the structure of the heat dissipation unit fixture of the present invention. As shown in the figure, the structure of the heat dissipation unit fixture includes: a body 1; the inside of the body 1 There is a chamber 11 and a top 12 on the upper side, and the top 12 has at least one open port 13 provided with at least one silicon dioxide layer 14. The chamber 11 is vacuum-tight and air-tight. The main body 1 is made of aluminum or stainless steel.
所述本體1具有一第一部分1a及一第二部分1b,所述第一、二部分1a、1b對應組合並共同界定所述腔室11,所述頂部12位於該第一部分1a之一側,所 述本體1具有至少一通道15,所述通道15連接該腔室11,所述通道15係可進行抽真空或通入惰性氣體其中任一工作。 The body 1 has a first portion 1a and a second portion 1b. The first and second portions 1a and 1b are correspondingly combined and collectively define the cavity 11. The top portion 12 is located on one side of the first portion 1a. All The main body 1 has at least one channel 15 which is connected to the chamber 11. The channel 15 can perform any task of evacuating or introducing an inert gas.
所述二氧化矽層14係為石英,並所述二氧化矽層14之光線在260nm~1100nm時之平均穿透率為92%。並更可於所述二氧化矽層14兩側表面設置一抗反射薄膜141,而所述具有抗反射薄膜141的二氧化矽層14於光線波長400nm~1100nm時其穿透率可達98%~100%,可增加所述雷射之穿透率。 The silicon dioxide layer 14 is quartz, and the average transmittance of light from the silicon dioxide layer 14 at 260 nm to 1100 nm is 92%. Furthermore, an anti-reflection film 141 can be provided on both surfaces of the silicon dioxide layer 14, and the transmittance of the silicon dioxide layer 14 having the anti-reflection film 141 can reach 98% at a light wavelength of 400 nm to 1100 nm. ~ 100%, which can increase the penetration of the laser.
請參閱第3圖,係為本發明散熱單元治具結構之示意圖,如圖所示,當進行雷射焊接工作時,先將散熱單元治具2放置於該雷射加工機具3之工作台31上,並將欲進行雷射焊接之工件4放置於該散熱單元治具2中,並確實將該散熱單元治具2密合,並可選擇透過該散熱單元治具2之通道15處進行抽真空或通入惰性氣體(氬氣)進行保護防止污染及氧化反應產生,並開始透過設置於該散熱單元治具2上方處之雷射頭32進行雷射焊接或雷射加工,所述雷射頭32所產生之雷射光束33係透過該本體1上側所設置之二氧化矽層14穿透進入該散熱單元治具2中對工件4進行雷射加工或雷射焊接,由於本發明之二氧化矽層14使用石英,故其雷射之穿透率至少可達92%以上,相對雷射加工及雷射焊接之功率損耗低,同時亦可維持真空氣密或惰性氣體保護之加工環境。 Please refer to FIG. 3, which is a schematic diagram of the structure of the heat dissipation unit fixture of the present invention. As shown in the figure, when performing laser welding, the heat dissipation unit fixture 2 is first placed on the workbench 31 of the laser processing machine 3. The workpiece 4 to be laser-welded is placed in the heat sink unit fixture 2 and the heat sink unit fixture 2 is tightly closed, and it can be selected to pass through the channel 15 of the heat sink unit fixture 2 Vacuum or inert gas (argon) is introduced to protect it from pollution and oxidation reaction, and laser welding or laser processing is started through the laser head 32 provided above the heat sink unit fixture 2. The laser The laser beam 33 generated by the head 32 penetrates through the silicon dioxide layer 14 provided on the upper side of the body 1 and enters the heat dissipation unit jig 2 to perform laser processing or laser welding on the workpiece 4. The silicon oxide layer 14 uses quartz, so its laser transmittance can be at least 92% or higher. Compared with laser processing and laser welding, the power loss is low. At the same time, it can maintain a vacuum-tight or inert gas-protected processing environment.
本發明之散熱單元治具結構主要增加雷射加工或雷射焊接工作的彈性,針對工件大小選擇設計散熱單元治具之尺寸大小,進而節省製造成本以及增加雷射加工或雷射焊接之彈性者。 The heat dissipation unit fixture structure of the present invention mainly increases the flexibility of laser processing or laser welding work. The size of the heat dissipation unit fixture is selected according to the size of the workpiece, thereby saving manufacturing costs and increasing the flexibility of laser processing or laser welding. .
Claims (7)
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TW107122921A TWI665954B (en) | 2018-07-03 | 2018-07-03 | Heat sink unit fixture structure |
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Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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TW200740492A (en) * | 2006-04-28 | 2007-11-01 | Ota Precision Ind Co Ltd | A producing method for golf club head using laser to welding different materials |
TW200808480A (en) * | 2006-08-04 | 2008-02-16 | Foxsemicon Integrated Tech Inc | Laser cutting apparatus and method |
CN101564796A (en) * | 2009-01-22 | 2009-10-28 | 番禺得意精密电子工业有限公司 | Welding device and use method thereof |
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Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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TW200740492A (en) * | 2006-04-28 | 2007-11-01 | Ota Precision Ind Co Ltd | A producing method for golf club head using laser to welding different materials |
TW200808480A (en) * | 2006-08-04 | 2008-02-16 | Foxsemicon Integrated Tech Inc | Laser cutting apparatus and method |
CN101564796A (en) * | 2009-01-22 | 2009-10-28 | 番禺得意精密电子工业有限公司 | Welding device and use method thereof |
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