TWI661172B - Heat dissipation component and manufacturing method thereof - Google Patents
Heat dissipation component and manufacturing method thereof Download PDFInfo
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Abstract
一種散熱元件及其製造方法,所述散熱元件具有一本體,該本體具有 一第一金屬板體及一第二金屬板體並共同界定一腔室,該腔室內具有一毛細結構層,並填充有工作液體,該本體腔室外緣具有一唇部,該唇部具有一燒結焊部垂直連結該第一、二金屬板體,並本案製造方法透過電阻輪焊直接垂直對該第一、二金屬板體焊接結合之工法,藉以提升第一、二金屬板體焊接後之結合度與密閉性者。 A heat dissipation element and a manufacturing method thereof, the heat dissipation element has a body, and the body has A first metal plate body and a second metal plate body together define a cavity. The cavity has a capillary structure layer and is filled with a working liquid. The outer edge of the body cavity has a lip, and the lip has a The sintered welded part is vertically connected to the first and second metal plate bodies, and the manufacturing method of this case directly and vertically welds and combines the first and second metal plate bodies through resistance wheel welding, thereby improving the first and second metal plate bodies after welding. Combination and tightness.
Description
一種散熱元件及其製造方法,尤指一種提升散熱元件焊接之結合度及密閉性的散熱元件及其製造方法。 A heat radiation element and a manufacturing method thereof, in particular, a heat radiation element and a manufacturing method thereof that improve the welding degree and tightness of welding of the heat radiation element.
均溫板或平板式熱管普遍被使用在作為熱傳導元件使用,這兩項熱傳導元件具有高導熱之特性,由於內部真空密閉腔室填充工作液體使得透過氣液兩相特性之轉換快速達到熱傳導之效果,均溫板及平板式熱管係透過以上、下至少兩金屬板體進行疊合後進行封邊注水抽真空封閉等作業,均溫板及平板式熱管最常使用之材料係為銅、鋁、不銹鋼等金屬材質,其中又以銅最為常使用,因銅本身具有高熱傳導特性,故最常被使用。 The temperature equalizing plate or flat plate heat pipe is generally used as a heat conduction element. These two heat conduction elements have high thermal conductivity. The internal vacuum sealed chamber is filled with working liquid, which allows the conversion of the two-phase characteristics of gas and liquid to quickly achieve the effect of heat conduction. The temperature equalizing plate and flat-type heat pipe are stacked through at least two metal plate bodies, and then the edge sealing, water injection, vacuum sealing and other operations are performed. The most commonly used materials for the temperature equalizing plate and flat-type heat pipe are copper, aluminum, Metal materials such as stainless steel, of which copper is the most commonly used, because copper itself has the highest thermal conductivity, so it is most commonly used.
多數均溫板及平板式熱管主要透過擴散接合(Diffusion Bonding)與硬焊(Brazing)及點焊之方式進行封邊之工作,而擴散接合(Diffusion Bonding)與硬焊(Brazing)適用於多數材質,但若兩種相異材質之結合例如銅與鋁或銅與不銹鋼則並不適用擴散接合此項工法。 Most temperature equalizing plates and flat heat pipes are mainly used for edge bonding by diffusion bonding and brazing and spot welding. Diffusion bonding and brazing are suitable for most materials. However, if the combination of two dissimilar materials such as copper and aluminum or copper and stainless steel is not suitable for the diffusion bonding method.
點焊的缺點在於雖可連續加工但無法完整密閉封邊,則若使用在均溫板封邊之工作則無法維持內部腔室之真空度以及工作液體容易因為密閉性不佳而產生外洩,進而失去熱傳導效果。 The disadvantage of spot welding is that although continuous processing can be performed, but the edge sealing cannot be completely closed, if the work used on the edge of the temperature equalizing plate cannot maintain the vacuum of the internal chamber and the working fluid is easy to leak due to poor sealing, As a result, the heat conduction effect is lost.
亦有業者透過使用電阻輪焊之方式進行焊接接合的工作,而現行電阻輪焊之均溫板或平板式熱管,主要由一上板3a(表面積較小)及一下板3b(表面 積較大)相互疊合後,再透過於上、下板3a、3b搭接重合的直角角落位置進行電阻輪焊(Fillet Weld)(如第1、1a圖所示),雖電阻輪焊可提供大小不一致的上、下板3a、3b的焊接結合,但習知電阻輪焊的焊接方式及材料的結合處仍具有缺點,如上、下板3a、3b為了形成可提供焊接之垂直角落部位,選擇上板3a小於下板3b,故上、下板3a、3b必須要準確對位,甚至必須有專用治具對該上、下板3a、3b進行定位。 There are also companies who perform welding and joining by using resistance wheel welding. The current temperature-welding plate or flat-plate heat pipe of resistance wheel welding mainly consists of an upper plate 3a (smaller surface area) and a lower plate 3b (surface (Larger product) after being superimposed on each other, and then through the right and corner positions where the upper and lower plates 3a and 3b are overlapped to perform resistance wheel welding (as shown in Figures 1 and 1a), although resistance wheel welding can Provides welding of upper and lower plates 3a and 3b with inconsistent sizes. However, the conventional welding method and material of resistance wheel welding still have disadvantages. For example, the upper and lower plates 3a and 3b are used to form vertical corners that can provide welding. The upper plate 3a is selected to be smaller than the lower plate 3b, so the upper and lower plates 3a, 3b must be accurately aligned, and even a special jig must be used to position the upper and lower plates 3a, 3b.
再者,當電阻輪焊之焊接路徑當遇到圓角時則會因路徑必需由直線慢慢修正為弧形,則會採用多段短直線進行拼湊為弧形之路徑,故使電阻輪焊之部位重複或停留時間增長,令材料過度燒熔甚至破壞至均溫板或平板式熱管內部之毛細結構或令內部腔室縮減等缺點,並且為了形成可焊接之垂直角落部位,則必須選用形狀大小不同之上、下板3a、3b,使下板3b外緣唇邊容易產生多餘無效之唇邊,形成材料浪費之缺點。 Furthermore, when the welding path of resistance wheel welding encounters rounded corners, the path must be slowly modified from a straight line to an arc shape, and multiple short straight lines will be used to piece together the arc path. Repeated parts or increased dwell time will cause the material to over-melt or even destroy the capillary structure inside the soaking plate or flat heat pipe or shrink the internal cavity. In addition, in order to form a weldable vertical corner, you must choose a shape and size Different upper and lower plates 3a and 3b make the outer edge lip of the lower plate 3b easy to produce unnecessary and invalid lips, forming the disadvantage of material waste.
習知具有下列缺點:1.材料浪費;2.密閉性不佳;3.必須額外進行定位;4.異材料不易結合。 Knowing has the following disadvantages: 1. waste of materials; 2. poor sealing; 3. additional positioning must be performed; 4. different materials are not easy to combine.
爰此,為解決上述習知技術之缺點,本發明之主要目的,係提供一種具有較佳結合性及密閉性的散熱元件。 Therefore, in order to solve the shortcomings of the above-mentioned conventional technologies, the main object of the present invention is to provide a heat-dissipating element with better combination and tightness.
本發明之另一目的,係提供一種可提升均溫板結合性及密閉性的散熱元件製造方法。 Another object of the present invention is to provide a method for manufacturing a heat dissipation element capable of improving the bonding and sealing performance of a temperature equalizing plate.
為達上述之目的,本發明係提供一種散熱元件,係包含:一本體; 所述本體具有一第一金屬板體及一第二金屬板體,所述第一、二金屬板體共同界定一腔室,所述腔室表面具有至少一毛細結構層並填充有一工作液體,該本體腔室外緣具有一唇部,所述唇部具有一燒結焊部,所述燒結焊部垂直連結該第一、二金屬板體。 In order to achieve the above object, the present invention provides a heat dissipation element, which includes: a body; The body has a first metal plate body and a second metal plate body, the first and second metal plate bodies together define a cavity, and the surface of the cavity has at least one capillary structure layer and is filled with a working liquid, The outer edge of the body cavity has a lip portion, the lip portion has a sintered welding portion, and the sintered welding portion is vertically connected to the first and second metal plate bodies.
為達上述之目的,本發明係提供一種散熱元件製造方法,係包含下列步驟:提供一第一金屬板體及一第二金屬板體;於前述第一、二金屬板體其中任一的一側形成一毛細結構;將所述第一、二金屬板體對應疊合,並透過電阻輪焊之方式,垂直對應該第一、二金屬板體對應疊合之部位進行封邊作業並預留一注水抽氣區域;進行抽真空及注水作業,最後將注水抽氣區域透過電阻輪焊之方式進封閉。 In order to achieve the above object, the present invention provides a method for manufacturing a heat dissipation element, which includes the following steps: providing a first metal plate body and a second metal plate body; A capillary structure is formed on the side; the first and second metal plates are overlapped correspondingly, and the edge sealing operation corresponding to the corresponding overlap of the first and second metal plates is performed by resistance wheel welding and reserved. A water injection and air extraction area; vacuum and water injection operations are performed, and finally the water injection and air extraction area is closed by means of resistance wheel welding.
本發明主要透過改善電阻輪焊與該第一、二金屬板體之焊接角度結構及方法藉以改善均溫板結合性及密閉性不佳之缺失者。 The present invention mainly improves the lack of the uniformity and tightness of the isothermal plate by improving the angle structure and method of welding between the resistance wheel welding and the first and second metal plates.
1‧‧‧本體 1‧‧‧ Ontology
1a‧‧‧第一金屬板體 1a‧‧‧First metal plate body
1b‧‧‧第二金屬板體 1b‧‧‧Second metal plate body
1c‧‧‧支撐結構 1c‧‧‧Support structure
1d‧‧‧毛細結構 1d‧‧‧capillary structure
1e‧‧‧密閉腔室 1e‧‧‧closed chamber
1f‧‧‧注水抽氣之區域 1f‧‧‧Injection area
1g‧‧‧工作液體 1g‧‧‧working fluid
1h‧‧‧唇部 1h‧‧‧lip
1i‧‧‧燒結焊部 1i‧‧‧Sintered Welding Section
2‧‧‧電阻輪焊機具 2‧‧‧ resistance wheel welding machine
3‧‧‧毛細結構件 3‧‧‧ Capillary Structure
第1圖係為習知均溫板示意圖;第1a圖係為習知均溫板示意圖;第2圖係為本發明散熱元件之第一實施例之立體分解圖;第3圖係為本發明散熱元件之第一實施例之剖視圖;第4圖係為本發明散熱元件之第二實施例之立體分解圖;第5圖係為本發明散熱元件製造方法之第一實施例步驟流程圖;第6圖係為本發明散熱元件製造方法之第一實施例加工示意圖;第7圖係為本發明散熱元件製造方法之第一實施例加工示意圖; 第8圖係為本發明散熱元件製造方法之第二實施例步驟流程圖;第9圖係為本發明散熱元件製造方法之第三實施例步驟流程圖。 Figure 1 is a schematic diagram of a conventional temperature equalizing plate; Figure 1a is a schematic diagram of a conventional temperature equalizing plate; Figure 2 is a three-dimensional exploded view of a first embodiment of a heat dissipation component of the present invention; and Figure 3 is a present invention A cross-sectional view of the first embodiment of the heat-dissipating element; FIG. 4 is an exploded perspective view of the second embodiment of the heat-dissipating element of the present invention; FIG. 5 is a flowchart of the steps of the first embodiment of the method of manufacturing the heat-dissipating element of the present invention; FIG. 6 is a processing schematic diagram of the first embodiment of the manufacturing method of the heat dissipation element of the present invention; FIG. 7 is a processing schematic diagram of the first embodiment of the manufacturing method of the heat dissipation element of the present invention; FIG. 8 is a flowchart of the steps of the second embodiment of the method for manufacturing a heat dissipation element according to the present invention; FIG. 9 is a flowchart of the steps of the third embodiment of the method for manufacturing a heat dissipation element according to the present invention.
請參閱第2、3圖,係為本發明散熱元件之第一實施例之立體分解及組合圖,如圖所示,所述散熱元件,係包含:一本體; 所述本體1具有一第一金屬板體1a及一第二金屬板體1b,所述第一、二金屬板體1a、1b之材質為金、銀、鐵、銅、鋁、商業純鈦、不銹鋼或其他具導熱特性之金屬其中任一,所述第一、二金屬板體1a、1b共同界定一密閉腔室1e,所述密閉腔室1e表面具有至少一毛細結構1d(可係為燒結粉末體或纖維體或網格體或溝槽其中任一),所述毛細結構1d係選擇設置於前述第一、二金屬板體1a、1b其中任一,所述密閉腔室1e填充有一工作液體1g,該本體1密閉腔室1e外緣具有一唇部1h,所述唇部1h具有一燒結焊部1i,所述燒結焊部1i垂直連結該第一、二金屬板體1a、1b,所述燒結焊部1i垂直貫穿所述第一金屬板體1a整個板厚並延伸至所述第二金屬板體1b板厚之三分之一至三分之二處。 Please refer to Figs. 2 and 3, which are three-dimensional exploded and assembled diagrams of the first embodiment of the heat dissipation element of the present invention. As shown in the figure, the heat dissipation element includes: a body; The body 1 has a first metal plate body 1a and a second metal plate body 1b. The materials of the first and second metal plate bodies 1a, 1b are gold, silver, iron, copper, aluminum, commercial pure titanium, Any of stainless steel or other metal with thermal conductivity, the first and second metal plates 1a, 1b together define a closed chamber 1e, and the surface of the closed chamber 1e has at least one capillary structure 1d (which can be sintered Powder body or fiber body or grid body or groove), the capillary structure 1d is selected to be installed in any of the first and second metal plate bodies 1a, 1b, and the closed chamber 1e is filled with a work Liquid 1g, the outer edge of the sealed chamber 1e of the body 1 has a lip portion 1h, the lip portion 1h has a sintered welding portion 1i, and the sintered welding portion 1i is vertically connected to the first and second metal plate bodies 1a, 1b, The sintered welding portion 1i vertically penetrates the entire thickness of the first metal plate body 1a and extends to one third to two thirds of the plate thickness of the second metal plate body 1b.
所述本體1具有一支撐結構1c,所述支撐結構1c係可為透過外力變形或透過切銷加工或透過外加元件作為支撐之支撐件,所述切銷加工係為選擇於該第一、二金屬板體1a、1b其中任一板體之一側透過切銷加工方式(如銑削加工)形成凸出結構向另一板體抵頂支撐;所述外力形變之支撐結構1c係為選擇於該第一、二金屬板體1a、1b其中任一板體的一側施加外力向另一側凹陷所形成的支撐結構1c;所述外加元件係透過於該第一、二金屬板體1a、1b兩者之間設置支撐體如支撐柱作為支撐結構1c,並不引以為限。 The body 1 has a supporting structure 1c. The supporting structure 1c can be a supporting member that can be deformed by external force, or can be processed by cutting pins, or through external components. The cutting pin processing is selected from the first and second One side of any one of the metal plate bodies 1a, 1b is formed by a cutout processing method (such as milling) to form a protruding structure to support the other plate body; the supporting structure 1c deformed by the external force is selected from this Any one of the first and second metal plate bodies 1a, 1b is a support structure 1c formed by applying an external force to one side of the first and second metal plate bodies to be recessed to the other side; the external element is transmitted through the first and second metal plate bodies 1a, 1b. It is not limited to provide a support body such as a support column as the support structure 1c between the two.
請參閱第4圖,係為本發明散熱元件之第二實施例立體分解圖,如圖所示,本實施例部分說明實施與前述第一實施例相同,故在此將不再贅述,惟本實施 例與前述第一實施例之差異在於所述第一、二金屬板體之間放置一毛細結構件3,此一步驟之毛細結構件係為單一結構體,該毛細結構件3設置於該第一、二金屬板體1a、1b之間,所述毛細結構件3係為燒結粉末板體或纖維體或網格體或波浪板或具有複數溝槽之板體其中任一,並透過該毛細結構件3可提供輔助之毛細力,增加汽液循環之效率。 Please refer to FIG. 4, which is an exploded perspective view of the second embodiment of the heat dissipation element of the present invention. As shown in the figure, the description and implementation of this embodiment are the same as those of the first embodiment, so it will not be repeated here. Implement The difference between this example and the first embodiment is that a capillary structure 3 is placed between the first and second metal plate bodies. The capillary structure in this step is a single structure, and the capillary structure 3 is provided in the first Between one or two metal plate bodies 1a, 1b, the capillary structure 3 is any one of sintered powder plate body, fiber body, grid body, wave plate or plate body with a plurality of grooves, and passes through the capillary The structural member 3 can provide auxiliary capillary force and increase the efficiency of vapor-liquid circulation.
請參閱第5圖,係為本發明散熱元件製造方法之第一實施例步驟流程圖,一併參閱第6、7圖加工示意圖,如圖所示,本發明之散熱元件製造方法,係包含下列步驟: Please refer to FIG. 5, which is a flowchart of the steps of the first embodiment of the manufacturing method of the heat dissipation element of the present invention, and refer to the processing schematic diagrams of FIGS. 6 and 7. As shown in the figure, the manufacturing method of the heat dissipation element of the present invention includes the following step:
S1:提供一第一金屬板體及一第二金屬板體;提供一第一金屬板體1a及一第二金屬板體1b,所述第一、二金屬板體1a、1b大小相同或不同其中任一,所述第一、二金屬板體1a、1b係可為銅、鋁、不銹鋼、鈦合金、商業純鈦其中任一,本實施例係選擇以商業純鈦與銅搭配作為說明實施例但並不引以為限。 S1: providing a first metal plate body and a second metal plate body; providing a first metal plate body 1a and a second metal plate body 1b, the first and second metal plate bodies 1a, 1b being the same or different in size Any one of the first and second metal plate bodies 1a and 1b may be any one of copper, aluminum, stainless steel, titanium alloy, and commercial pure titanium. In this embodiment, the combination of commercial pure titanium and copper is used as an example. Examples are not limited.
S2:於前述第一、二金屬板體其中任一的一側形成一毛細結構;選擇於前述第一、二金屬板體1a、1b其中任一或任二相互對應之一側形成一毛細結構1d,所述毛細結構1d係為燒結粉末或網格體或溝槽或纖維體其中任一。 S2: A capillary structure is formed on either side of the first and second metal plate bodies; a capillary structure is formed on any one or any two sides of the first and second metal plate bodies 1a, 1b corresponding to each other 1d, the capillary structure 1d is any of a sintered powder, a mesh body, a groove or a fibrous body.
S3:將所述第一、二金屬板體對應疊合,並透過電阻輪焊之方式,垂直對應該第一、二金屬板體對應疊合之部位進行封邊作業並預留一注水抽氣區域;將前述第一、二金屬板體1a、1b對應疊合並於兩者之間形成一密閉腔室1e,並於所述第一、二金屬板體1a、1b對應疊合的外緣部分透過電阻輪焊之方式進行結合,進行電阻輪焊工作時,所述電阻輪焊機具主要與該第一、二金屬板體1a、1b呈垂直設置,令所述 電阻輪焊機具2所產生之放電熔熔垂直穿設進入該第一、二金屬板體1a、1b,並直接穿透設置於上部之第一金屬板體1a整體後再穿透位於該第一金屬板體1a下部之第二金屬板體1b板厚約三分之一至三分之二處,最後保留欲進行注水抽氣之區域1f將其他部位封閉,進行所述電阻輪焊工作時較佳係於該所述電阻輪焊機具2與該第一、二金屬板體1a、1b處通以氬氣進行惰性氣體保護,避免進行電阻輪焊工作時產生氧化反應,亦可將電阻輪焊之工作環境設置於真空環境之下進行藉以避免焊接工作中遭受污染或氧化反應產生。 S3: Laminate the first and second metal plates correspondingly, and use resistance wheel welding to vertically perform edge sealing operations corresponding to the corresponding overlapping portions of the first and second metal plates and reserve a water injection pump. Area; the aforementioned first and second metal plate bodies 1a, 1b are stacked correspondingly to form a closed chamber 1e, and the outer edges of the first and second metal plate bodies 1a, 1b are overlapped correspondingly Combined by means of resistance wheel welding. When resistance wheel welding is performed, the resistance wheel welding tool is mainly disposed perpendicular to the first and second metal plate bodies 1a and 1b, so that the The discharge fusion generated by the resistance wheel welding machine 2 penetrates vertically into the first and second metal plate bodies 1a, 1b, directly penetrates the entire first metal plate body 1a provided on the upper part, and then penetrates the first metal plate body 1a. The second metal plate 1b in the lower part of a metal plate body 1a has a thickness of about one third to two thirds. Finally, the area 1f to be filled with water and air is reserved to close other parts. When performing the resistance wheel welding work, Preferably, the resistance wheel welding tool 2 and the first and second metal plate bodies 1a and 1b are protected by inert gas with argon gas to avoid oxidation reaction during resistance wheel welding work, and the resistance can also be changed. The working environment of wheel welding is set in a vacuum environment to avoid contamination or oxidation reactions during welding.
S4:進行抽真空及注水作業,最後將注水抽氣區域透過電阻輪焊之方式進行封閉。 S4: Vacuuming and water injection are performed. Finally, the water injection and air extraction area is closed by resistance wheel welding.
進行抽氣注水作業,對進行封邊後之第一、二金屬板體1a、1b進行抽真空注入工作液體之作業,並最後將預留之注水抽氣區域1f相同透過電阻輪焊之方式進行封閉。 Carry out air-pumping and water-injection operations, and vacuum-inject working fluid into the first and second metal plates 1a and 1b after edge-sealing. Finally, the reserved water-injection and air-exhausting area 1f is conducted by resistance wheel welding Closed.
請參閱第8圖,係為本發明散熱元件製造方法之第二實施例步驟流程圖,如圖所示,本實施例部分說明實施與前述第一實施例相同,故在此將不再贅述,惟本實施例與前述第一實施例之差異在於前述第一、二金屬板體其中任一的一側形成一毛細結構此一步驟後更具有一步驟S5:於該第一、二金屬板體之間放置一毛細結構件,此一步驟之毛細結構件3係為單一結構體,該毛細結構件3設置於該第一、二金屬板體1a、1b之間,所述毛細結構件係為燒結粉末板體或纖維體或網格體或波浪板或具有複數溝槽之板體其中任一。 Please refer to FIG. 8, which is a flowchart of the steps of the second embodiment of the method for manufacturing a heat dissipation component according to the present invention. As shown in the figure, the implementation of this embodiment is the same as that of the first embodiment, so it will not be repeated here. However, the difference between this embodiment and the first embodiment is that a capillary structure is formed on either side of the first and second metal plate bodies. After this step, there is a step S5: on the first and second metal plate bodies. A capillary structure is placed between them. The capillary structure 3 of this step is a single structure. The capillary structure 3 is disposed between the first and second metal plate bodies 1a and 1b. The capillary structure is Either a sintered powder plate body or a fiber body or a grid body or a wave plate or a plate body having a plurality of grooves.
請參閱第9圖,係為本發明散熱元件製造方法之第三實施例步驟流程圖,如圖所示,本實施例部分說明實施與前述第一實施例相同,故在此將不再 贅述,惟本實施例與前述第一實施例之差異在於前述第一、二金屬板體其中任一的一側形成一毛細結構;此一步驟後更具有一步驟S6:於前述第一、二金屬板體其中任一的一側形成一支撐結構;所述支撐結構1c係可為透過外力變形或透過切銷加工或透過外加元件作為支撐之支撐件,所述切銷加工係為選擇於該第一、二金屬板體1a、1b其中任一板體之一側透過切銷方式形成凸出結構向另一板體抵頂支撐;所述外力形變之支撐結構係為選擇於該第一、二金屬板體1a、1b其中任一板體的一側施加外力向另一側凹陷所形成的支撐結構;所述外加元件係透過於該第一、二金屬板體1a、1b兩者之間設置支撐體如支撐柱作為支撐結構,本實施例係選擇以外力加壓加工所形成之支撐結構作為說明實施例並不引以為限。 Please refer to FIG. 9, which is a flowchart of the steps of the third embodiment of the method for manufacturing a heat dissipation component of the present invention. As shown in the figure, the implementation of this embodiment is the same as that of the first embodiment, so it will not be repeated here. To repeat, the difference between this embodiment and the first embodiment is that a capillary structure is formed on either side of the first and second metal plate bodies; after this step, there is a step S6: A support structure is formed on any one side of the metal plate body; the support structure 1c is a support member that can be deformed by external force, or processed by cutting pins, or through external components, and the cutting pins are selected from One side of any one of the first and second metal plate bodies 1a, 1b is formed by a protruding pin to form a protruding structure to support the other plate body; the supporting structure deformed by the external force is selected from the first, Any one of the two metal plate bodies 1a, 1b is a supporting structure formed by applying an external force to one side of the plate body and recessing the other side; the external component is penetrated between the first and two metal plate bodies 1a, 1b A support body such as a support column is set as the support structure. In this embodiment, the support structure formed by external force press processing is selected as an illustrative embodiment and is not limited thereto.
本發明主要透過以電阻輪焊之方式改善商業純鈦或鈦金屬或銅材質不易結合之缺點,並改善電阻輪焊時電阻輪焊器具與欲接受電阻輪焊之第一、二金屬板體1a、1b垂直對應設置,令電阻輪焊所產生之放電熔熔相同垂直穿透該第一金屬板體1a及第二金屬板體1b厚度的三分之一至三分之二處最後令兩者完整接合,提升第一、二金屬板體1a、1b之結合性及密閉性,及改善習知均溫板或平板式熱管對位不易之缺失。 The invention mainly improves the defect that the commercial pure titanium or titanium metal or copper material is not easy to combine by means of resistance wheel welding, and improves the resistance wheel welding device and the first and second metal plate bodies 1a that are to be subjected to resistance wheel welding during resistance wheel welding. And 1b are arranged vertically correspondingly, so that the discharge fusion generated by resistance wheel welding penetrates the first metal plate body 1a and the second metal plate body 1b one-third to two-thirds of the thickness at the same time. Complete joining, improving the binding and sealing properties of the first and second metal plate bodies 1a, 1b, and improving the lack of alignment of conventional temperature equalizing plates or flat heat pipes.
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Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201403017A (en) * | 2012-07-13 | 2014-01-16 | Forcecon Technology Co Ltd | Thinned heat conduction device with tube-less sealing structure and forming method thereof |
TW201544221A (en) * | 2014-05-19 | 2015-12-01 | Forcecon Technology Co Ltd | Thermal dissipating device and the manufacturing method thereof |
TWM549332U (en) * | 2017-06-23 | 2017-09-21 | 雙鴻科技股份有限公司 | Vapor chamber |
-
2018
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Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201403017A (en) * | 2012-07-13 | 2014-01-16 | Forcecon Technology Co Ltd | Thinned heat conduction device with tube-less sealing structure and forming method thereof |
TW201544221A (en) * | 2014-05-19 | 2015-12-01 | Forcecon Technology Co Ltd | Thermal dissipating device and the manufacturing method thereof |
TWM549332U (en) * | 2017-06-23 | 2017-09-21 | 雙鴻科技股份有限公司 | Vapor chamber |
Cited By (2)
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---|---|---|---|---|
CN116984773A (en) * | 2023-09-26 | 2023-11-03 | 江苏辅星电子有限公司 | Copper mesh capillary element assembly equipment and method |
CN116984773B (en) * | 2023-09-26 | 2023-12-12 | 江苏辅星电子有限公司 | Copper mesh capillary element assembly equipment and method |
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