TWI665752B - 重複地測量位於自動裝配機區域中的元件載體 - Google Patents

重複地測量位於自動裝配機區域中的元件載體 Download PDF

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Publication number
TWI665752B
TWI665752B TW105109102A TW105109102A TWI665752B TW I665752 B TWI665752 B TW I665752B TW 105109102 A TW105109102 A TW 105109102A TW 105109102 A TW105109102 A TW 105109102A TW I665752 B TWI665752 B TW I665752B
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TW
Taiwan
Prior art keywords
component carrier
components
mark
assembly
detected
Prior art date
Application number
TW105109102A
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English (en)
Chinese (zh)
Other versions
TW201642730A (zh
Inventor
克里斯托夫 格魯伯
賴克特 蕾芙
西爾維斯特 德梅爾
鮑里斯 布爾德克
Original Assignee
德商先進裝配系統有限責任兩合公司
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Application filed by 德商先進裝配系統有限責任兩合公司 filed Critical 德商先進裝配系統有限責任兩合公司
Publication of TW201642730A publication Critical patent/TW201642730A/zh
Application granted granted Critical
Publication of TWI665752B publication Critical patent/TWI665752B/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0015—Orientation; Alignment; Positioning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0456—Mounting of components, e.g. of leadless components simultaneously punching the circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0815—Controlling of component placement on the substrate during or after manufacturing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/083—Quality monitoring using results from monitoring devices, e.g. feedback loops
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/089—Calibration, teaching or correction of mechanical systems, e.g. of the mounting head
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Automatic Assembly (AREA)
TW105109102A 2015-04-22 2016-03-24 重複地測量位於自動裝配機區域中的元件載體 TWI665752B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102015106224.0A DE102015106224B4 (de) 2015-04-22 2015-04-22 Verfahren zum wiederholten Vermessen eines in einem Bestückbereich eines Bestückautomaten befindlichen Bauelementeträgers sowie Bestückautomat und Computerprogramm zur Durchführung dieses Verfahrens
??102015106224.0 2015-04-22

Publications (2)

Publication Number Publication Date
TW201642730A TW201642730A (zh) 2016-12-01
TWI665752B true TWI665752B (zh) 2019-07-11

Family

ID=57110795

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105109102A TWI665752B (zh) 2015-04-22 2016-03-24 重複地測量位於自動裝配機區域中的元件載體

Country Status (4)

Country Link
CN (1) CN106068073B (de)
AT (1) AT517157B1 (de)
DE (1) DE102015106224B4 (de)
TW (1) TWI665752B (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107498286A (zh) * 2017-10-09 2017-12-22 上海玖锶自动化技术有限公司 一种适用于agv的装配方法及系统及流水线
DE102017131322B4 (de) * 2017-12-27 2019-07-04 Asm Assembly Systems Gmbh & Co. Kg Verwenden von bestückfähigen Markierungsbausteinen für ein stufenweises Bestücken eines Trägers mit Bauelementen
DE102020113002B3 (de) * 2020-05-13 2021-08-26 Asm Assembly Systems Gmbh & Co. Kg Bestimmen der Genauigkeit einer Bestückmaschine bei mehrfacher Verwendung eines Test-Bauelements
DE102020115598B3 (de) * 2020-06-12 2021-08-26 Asm Assembly Systems Gmbh & Co. Kg Verfahren und Bestückmaschine zum Bestücken von Bauelementeträgern basierend auf einem Rekalibrieren der Bestückmaschine im realen Bestückbetrieb, Computerprogramm zum Steuern einer Bestückmaschine

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0413530A (ja) * 1990-04-27 1992-01-17 Mitsubishi Electric Corp 産業用組立ロボット教示方法
JPH07273494A (ja) * 1994-03-30 1995-10-20 Matsushita Electric Ind Co Ltd 電子部品実装方法
US20020044432A1 (en) * 2000-06-12 2002-04-18 Matsushita Electric Industrial Co., Ltd. Component mounting method and component mounting apparatus
EP1437933A2 (de) * 2003-01-09 2004-07-14 Siemens Aktiengesellschaft Vorrichtung zum Bestücken von Substraten mit Bauelementen und Verfahren zum Kalibrieren einer solchen Vorrichtung
JP2004260223A (ja) * 2004-06-17 2004-09-16 Fujitsu Ltd 半導体ベアチップ実装装置
US20040245319A1 (en) * 2003-06-03 2004-12-09 Asm Assembly Automation Ltd. Substrate alignment method and apparatus
TW200715436A (en) * 2005-08-24 2007-04-16 Shibaura Mechatronics Corp Electronic component mounting device and method
TW201337483A (zh) * 2012-03-14 2013-09-16 Giga Byte Tech Co Ltd 電路板定位校正系統及方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008083701A1 (de) * 2006-12-22 2008-07-17 Kulicke & Soffa Die Bonding Gmbh Verfahren zum kalibrieren der x-y positionierung eines positionierwerkzeugs, sowie vorrichtung mit einem derartigen positionierwerkzeug
WO2009047214A2 (en) * 2007-10-09 2009-04-16 Oerlikon Assembly Equipment Ag, Steinhausen Method for picking up semiconductor chips from a wafer table and mounting the removed semiconductor chips on a substrate
CH698334B1 (de) * 2007-10-09 2011-07-29 Esec Ag Verfahren für die Entnahme und Montage von auf einem Wafertisch bereitgestellten Halbleiterchips auf einem Substrat.
US8492175B1 (en) * 2011-11-28 2013-07-23 Applied Micro Circuits Corporation System and method for aligning surface mount devices on a substrate
DE102013204590B3 (de) * 2013-03-15 2014-07-24 Asm Assembly Systems Gmbh & Co. Kg Erkennen eines schwingenden Bauelementeträgers während einer Bestückung mit Bauelementen

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0413530A (ja) * 1990-04-27 1992-01-17 Mitsubishi Electric Corp 産業用組立ロボット教示方法
JPH07273494A (ja) * 1994-03-30 1995-10-20 Matsushita Electric Ind Co Ltd 電子部品実装方法
US20020044432A1 (en) * 2000-06-12 2002-04-18 Matsushita Electric Industrial Co., Ltd. Component mounting method and component mounting apparatus
EP1437933A2 (de) * 2003-01-09 2004-07-14 Siemens Aktiengesellschaft Vorrichtung zum Bestücken von Substraten mit Bauelementen und Verfahren zum Kalibrieren einer solchen Vorrichtung
US20040245319A1 (en) * 2003-06-03 2004-12-09 Asm Assembly Automation Ltd. Substrate alignment method and apparatus
JP2004260223A (ja) * 2004-06-17 2004-09-16 Fujitsu Ltd 半導体ベアチップ実装装置
TW200715436A (en) * 2005-08-24 2007-04-16 Shibaura Mechatronics Corp Electronic component mounting device and method
TW201337483A (zh) * 2012-03-14 2013-09-16 Giga Byte Tech Co Ltd 電路板定位校正系統及方法

Also Published As

Publication number Publication date
AT517157A3 (de) 2017-09-15
CN106068073A (zh) 2016-11-02
AT517157B1 (de) 2019-10-15
TW201642730A (zh) 2016-12-01
DE102015106224A1 (de) 2016-10-27
CN106068073B (zh) 2020-05-01
DE102015106224B4 (de) 2022-09-01
AT517157A2 (de) 2016-11-15

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