TWI665414B - Device for regulating the environmental condition - Google Patents

Abstract

An environmental adjustment device is used to solve the problem that the conventional water-cooling fan has a limited cooling effect and cannot achieve air purification. The system includes: a casing having a first accommodating space and a second accommodating space, wherein the first accommodating space is connected to an air outlet, and the second accommodating space is connected to an air inlet; a water cooling module is located Between the first accommodating space and the second accommodating space, the water-cooling module has a container and a liquid storage space at a periphery of the container, and a channel is formed between the top and bottom ends of the container, and the bottom of the container Having a plurality of small holes, the channel is in communication with the second accommodating space; a fan is located above the water cooling module; and a uniform cold wafer is located in the second accommodating space, the chilled wafer has a relatively uniform cold The surface and the uniform hot surface, the cooling surface faces the water cooling module.

Description

Environmental conditioning device

The present invention relates to an adjustment device, and more particularly to an environmental adjustment device for reducing ambient temperature.

In order to reduce the indoor temperature in summer, in addition to the common electric fans and cold air, many water-cooled fans have appeared in recent years. Water-cooled fans use the principle of absorbing heat when water evaporates to cool the air. The conventional water-cooling fan has a fan and a water storage tank for storing water, and the water in the water storage tank is naturally evaporated to lower the temperature of the air around the water storage tank, and the fan is used to blow the cooled air. Out, in order to allow indoor air to circulate and lower the room temperature.

However, the water temperature in the water storage tank of the above-mentioned conventional water-cooling fan is relatively easily increased by the influence of the ambient temperature, resulting in an increase in the temperature of the air blown by the water-cooling fan, in particular, the operating temperature in the factory is higher than that of the general room. The higher the temperature, the effect of cooling is quite limited, so it is easy to cause the indoor humid and sultry situation to be more serious. Moreover, the water in the water storage tank may contain some impurities, so that the air blown by the water cooling fan cannot truly achieve air purification.

In view of this, the conventional water-cooled fans do still have to be improved.

In order to solve the above problems, it is an object of the present invention to provide an environment regulating device which can reduce the temperature of a blown air stream and at the same time reach an air purifier.

A second object of the present invention is to provide an environmental conditioning device that can cool water and recycle water.

It is still another object of the present invention to provide an environmental conditioning apparatus which is capable of distributing a cold air flow evenly.

It is still another object of the present invention to provide an environmental conditioning device which is capable of increasing the heat dissipation area.

The following directionality or its similar terms, such as "before", "after", "left", "right", "upper (top)", "lower (bottom)", "inside", "outside" The singularity of the present invention is intended to be illustrative only and not to limit the invention.

The environment adjustment device of the present invention comprises: a housing having a first accommodating space and a second accommodating space, wherein the first accommodating space is connected to an air outlet, and the second accommodating space is connected to an air inlet; a water-cooling module is disposed between the first accommodating space and the second accommodating space, the water-cooling module has a container and a liquid storage space at a periphery of the container, and a top and a bottom end of the container are formed a channel, the bottom of the container has a plurality of small holes, the channel is connected to the second receiving space; a fan is located above the water cooling module; and a uniform cold chip is located in the second receiving space, the cooling The wafer has a relatively uniform cold surface and a uniform hot surface that faces the water cooling module.

According to the present invention, the environmental conditioning device of the present invention is located in the second accommodating space by using the chilled wafer, and the airflow is attracted by the fan to enter the second accommodating space from the air inlet, and the temperature difference in the second accommodating space It is easy to condense water droplets to cover the dust or suspended particles in the air, and other clean airflows will go up and enter the channel through several small holes of the water-cooling module to cool down again; thereby, the fan is discharged The temperature of the airflow blown by the tuyere can be further reduced, and at the same time, the effect of air purification can be achieved.

Wherein, the housing has a bottom plate and a cover member located above the bottom plate, the cover Between the cover member and the bottom plate, a partition wall portion is disposed on the bottom plate, the first recessed portion and the second recessed portion are respectively located on the bottom plate The water cooling module and the second cavity portion together form the second accommodating space on both sides of the partition wall portion. In this way, it has the effect of making the overall space configuration better.

The cover member has a receiving portion and a top cover. The top cover is connected to the top edge of the receiving portion to form the first receiving space. The fan is located in the first receiving space. In this way, the system has the advantages of simple structure and improved assembly convenience.

The air outlet is located at a top cover of the cover member, and the fan is axially located between the water cooling module and the air outlet. Thus, it has the effect of making the fan form a blower fan type.

Wherein, the air outlet is located at a receiving portion of the covering member, and the air outlet is located laterally opposite to the fan. Thus, it has the effect of forming the fan into a centrifugal fan type.

Wherein, the housing has a first-class track, and the flow channel is located at a bottom edge of the partition wall portion. In this way, the water liquid in the second accommodating space is discharged through the flow path.

Wherein, the first pocket portion is for placing a plant pot, and the lower surface of the covering member has an illuminant, and the illuminant is potted against the plant. In this way, the illuminant can be irradiated to the plant pot, and the pedestal can promote the pot growth of the plant.

Wherein, the water cooling module has an inner layer member and an outer layer member, and the bottom edge of the outer layer member is connected with the bottom edge of the inner layer member to form the liquid storage space. In this way, the structure is simple and the manufacturing cost can be reduced.

Wherein, the inner wall of the inner layer member abuts against the outer wall of the container. Thus, it has the effect of allowing the temperature of the liquid in the liquid storage space to be easily conducted to the container.

Wherein, the water cooling module has a grip portion, and the grip portion is connected to the outer layer member. In this way, it has the effect of improving the convenience of use.

Among them, the container is made of aluminum material. So, it has a lifting effect The effect.

Wherein, the refrigerating wafer has a cold end fin group, and the cold end fin group extends from the cooling surface toward the water cooling module. In this way, it has the effect of making the cold air flow evenly distributed.

Wherein, the refrigerating wafer has a hot end fin group extending from the heating surface toward a bottom plate of the housing. Thus, it has the effect of increasing the heat dissipation area of the refrigerant chip.

In addition, a cooling module is further disposed under the housing, the cooling module has a body and a liquid storage member, and the liquid storage member is detachably coupled to the base body, and the housing has A consistent hole that communicates with the interior of the reservoir. In this way, the water in the second accommodating space flows into the liquid storage member through the through hole, and has the effect of cooling the water liquid.

The cooling module has a motor located in the housing, the motor is connected with an inlet pipe member and an outlet pipe member, and the other end of the inlet pipe member extends into the second accommodating space, and the other end of the outlet pipe member extends to the storage Inside the liquid. In this way, the cooled water in the liquid storage member can be re-delivered into the second accommodating space, which has the effects of improving recycling and cost saving.

The sensor further includes a sensor, and the sensor is located in the first accommodating space of the housing. As such, the sensor can be used to sense the temperature of the surrounding environment, and has the effect of improving ease of use.

〔this invention〕

1‧‧‧shell

1a‧‧‧floor

1b‧‧‧ Covering parts

1c‧‧‧ partition wall

10‧‧‧Tongkong

11‧‧‧First cavity

12‧‧‧Second cavity

13‧‧‧Support Department

14‧‧‧Top cover

15‧‧‧Lights

16‧‧‧Air inlet

17‧‧‧air outlet

18‧‧‧ flow path

2‧‧‧Water cooling module

21‧‧‧ Inner parts

22‧‧‧Extreme parts

23‧‧‧ Container

24‧‧‧ hole

25‧‧‧ grip

26‧‧‧ Cover

261‧‧‧through hole

27‧‧‧ porous parts

3‧‧‧Fan

4‧‧‧Chilled wafer

41‧‧‧Chill noodles

42‧‧‧Hot surface

43‧‧‧Cold end fin set

44‧‧‧hot end fin set

5‧‧‧Cooling module

51‧‧‧ body

52‧‧‧ liquid storage parts

53‧‧‧Motor

54‧‧‧Inlet pipe fittings

55‧‧‧Outlet pipe fittings

6‧‧‧ sensor

C‧‧‧Crystal Ball

L‧‧‧ channel

P‧‧‧Plant potted plants

S1‧‧‧First accommodation space

S2‧‧‧Second accommodating space

S3‧‧‧ liquid storage space

N‧‧‧ Fragrance pieces

[Fig. 1] An exploded perspective view of a first embodiment of the present invention.

[Fig. 2] A partially enlarged exploded perspective view as shown in Fig. 1.

[Fig. 3] A sectional view showing the combination of the first embodiment of the present invention.

[Fig. 4] A sectional view showing a combination of a second embodiment of the present invention.

The above and other objects, features, and advantages of the present invention will become more apparent from the aspects of the appended claims. The first embodiment of the environmental conditioning device of the present invention comprises a housing 1, a water cooling module 2, a fan 3, and a uniform cold wafer 4. The water cooling module 2 is detachably disposed in the housing 1. The fan 3 is located in the casing 1 and is located above the water cooling module 2 . The cooling chip 4 is located in the casing 1 and is located below the water cooling module 2 .

The housing 1 can have a bottom plate 1a and a cover member 1b located above the bottom plate 1a. The cover member 1b and the bottom plate 1a have a partition wall portion 1c. In detail, the housing 1 can have a first receiving portion 11 and a second receiving portion 12 on the bottom plate 1a. The first receiving portion 11 and the second receiving portion 12 are respectively located at the partition wall. The bottom plate 1a can have a uniform hole 10 in the embodiment, the through hole 10 is located in the range of the first groove portion 11, and the first groove portion 11 can be used to place a plant pot. P, the outer shape and size of the first groove portion 11 and the second groove portion 12 are not limited in the present invention. In the embodiment, the first groove portion 11 and the second groove portion 12 are The ring shape is formed, and the height of the second groove portion 12 is preferably higher than the height of the first groove portion 11.

As shown in the first and third embodiments, the cover member 1b can have a receiving portion 13 and a top cover 14. The top cover 14 is connected to the top edge of the receiving portion 13 to form a first receiving space S1. In detail, the lower surface of the receiving portion 13 may have an illuminant 15 that preferably aligns the plant pot P so that the light source of the illuminant 15 can illuminate the plant pot P. In addition, the housing 1 has an air inlet 16 and an air outlet 17, the air inlet 16 is located on the side of the second pocket portion 12, and the air inlet 16 communicates with the second pocket portion 12, the air outlet 17 is located in the covering member 1b. In the embodiment, the air outlet 17 is located on the top cover 14 of the covering member 1b and is located above the second receiving portion 12.

In addition, the housing 1 can also have a first-stage channel 18, the flow channel 18 is located at the bottom edge of the partition wall portion, and the flow channel 18 is connected to the first groove portion 11 and the second groove portion 12, so that the The first pocket portion 11 communicates with the second pocket portion 12, so that the water in the second pocket portion 12 can flow into the first pocket portion 11 via the runner 18 to provide moisture to the The plant potted P; and if there is excess water, it can flow out through the through hole 10.

The water-cooling module 2 is detachably connected to the second accommodating portion 12, and the water-cooling module 2 and the second accommodating portion 12 form a second accommodating space. S2, the water-cooling module 2 may have an inner layer member 21 and an outer layer member 22. The bottom edge of the outer layer member 22 is connected to the bottom edge of the inner layer member 21 to form a liquid storage space S3. The liquid storage space S3 is available. To store ice water or refrigerant. The water-cooling module 2 has a container 23 located inside the inner layer member 21. The inner wall of the inner layer member 21 preferably abuts against the outer wall of the container 23. A channel L is formed between the top and bottom ends of the container 23. The bottom of the container 23 has a plurality of small holes 24 for communicating the passage L with the second receiving space S2. Specifically, the container 23 is preferably made of an aluminum material.

In addition, the water-cooling module 2 can also have a holding portion 25, the holding portion 25 is connected to the outer layer member 22. The water-cooling module 2 can also have a cover body 26, and the cover body 26 is connected to the outer layer member 22. And the top edge of the inner layer member 21, the cover body 26 can close the liquid storage space S3, and the liquid in the liquid storage space S3 can be prevented from overflowing. The cover body 26 has a through hole 261 to face the opening of the container 23. The channel L can be connected to the first accommodating space S1. Preferably, the water-cooling module 2 can also have a porous member 27 at the opening of the container 23.

Referring to the first and third figures, the fan 3 is located in the first accommodating space S1 of the casing 1. The type and position of the fan 3 are based on the principle that the airflow can be smoothly driven, and the present invention does not The limitation is not limited to the drawings disclosed in the embodiment. In this embodiment, the fan 3 is axially disposed between the water-cooling module 2 and the air outlet 17 to form a fan type fan; thus, when the fan 3 rotates, the airflow can be made from the air inlet. The tuyere 16 flows in and passes through the second accommodation The space S2 and the passage L are further flowed out from the air outlet 17.

The refrigerating wafer 4 is located in the second accommodating space S2. The refrigerating wafer 4 has a relatively uniform cold surface 41 and a uniform hot surface 42 facing the water-cooling module 2, and the cooling surface 41 A cold end fin set 43 extending toward the water cooling module 2, the heating surface 42 facing the bottom plate 1a, the heating surface 42 may extend toward the bottom plate 1a with a hot end fin group 44; When the airflow flows from the air inlet 16 through the second accommodating space S2, the cooling surface 41 of the chilled wafer 4 can lower the temperature of the airflow, and the cold airflow can be distributed by the cold end fin group 43. Uniform, in addition, the hot end fin set 44 can increase the heat dissipation area of the cryostat 4 .

The environment adjustment device of the present invention may further include a cooling module 5 located below the bottom plate 1a of the casing 1. The cooling module 5 may have a body 51 and a liquid storage member 52. The member 52 is detachably coupled to the seat body 51. The position of the seat body 51 and the liquid storage member 52 is not limited in the present invention. In this embodiment, the seat body 51 is located below the plant pot P. The liquid storage member 52 is located below the cooling wafer 4.

The cooling module 5 can also have a motor 53 located in the base 51. The motor 53 can be connected with a water inlet member 54 and an outlet member 55. The other end of the inlet member 54 is connected to the second housing portion of the housing 1. 12, the other end of the water outlet member 55 extends into the liquid storage member 52; thus, when the motor 53 is driven, the water outlet member 55 can extract the water liquid in the liquid storage member 52, and input the water through the water inlet member 54. The second cavity portion 12 is further configured to further dissipate heat from the hot end fin group 44.

The environment adjustment device of the present invention may further include a sensor 6 located in the first accommodating space S1 of the housing 1, and the sensor 6 may be used to sense the temperature of the surrounding environment. If the temperature of the surrounding environment is too high, the environmental adjustment device can be automatically activated to rotate the fan 3 to drive the airflow.

Referring to FIG. 3, according to the foregoing structure, when the fan 3 rotates, the airflow can be The second accommodating space S2 flows into the second accommodating space S2. Since the chilled wafer 4 has the chilling surface 41 and the heating surface 42, the cold air and heat are simultaneously present in the second accommodating space S2. Therefore, the airflow in the second accommodating space S2 is easily condensed into water droplets due to a temperature difference, and the water droplets cover the dust or suspended particles in the air and go down, and flow through the through holes 10 through the through holes 18. The liquid storage member 52 of the cooling module 5, the other clean air flow will go up and enter the channel L through the plurality of small holes 24 of the water cooling module 2, by the ice water or the refrigerant in the liquid storage space S3. The temperature of the airflow in the passage L can be further lowered. At this time, the cooled airflow continues to be attracted by the fan 3 and flows upward through the air outlet 17.

Wherein, the fragrance member N may be placed in the passage L, so that the airflow flowing out of the air outlet 17 may have a fragrant taste in addition to the cold air; preferably, the channel L may also be placed with chlorine at the same time. Materials such as magnesium can further purify the air and deodorize it. In addition, after the water flowing into the liquid storage member 52 is cooled, it can be taken out by the water outlet member 55 and input into the second pocket portion 12 via the water inlet member 54 to further heat the refrigerant wafer 4. The end fin set 44 dissipates heat. Specifically, since the water-cooling module 2 is detachably connected to the second tank portion 12, the user can also put the water-cooling module 2 into the freezer to make the liquid storage space S3. After the water liquid can be condensed into ice, the water-cooling module 2 is placed above the second tank portion 12, whereby the temperature of the airflow in the passage L can be accelerated.

Referring to FIG. 4, which is a second embodiment of the environment adjusting device of the present invention, in the embodiment, the air outlet 17 of the casing 1 is located at the receiving portion 13 of the covering member 1b, and the air outlet is provided. The 17 series is laterally located on the fan 3 to form a centrifugal fan. In addition, the bottom plate 1a of the casing 1 can also be selectively placed with a crystal ball C. The pair of crystal balls C are located below the illuminant 15 so that the light source of the illuminant 15 can illuminate the crystal ball C so that the user can feel To different situations; by this, the mood can be relaxed, and the purpose of relieving depression can be achieved.

In summary, the environmental conditioning device of the present invention utilizes the refrigerated wafer at the first In the second accommodating space, the airflow is attracted by the fan and enters the second accommodating space from the air inlet. The second accommodating space is easy to condense water droplets due to the temperature difference, and the dust or suspended particles in the air are covered downward, and the other is clean. The airflow will go up and enter the channel through several small holes of the water cooling module to cool down again; thereby, the temperature of the airflow blown by the fan from the air outlet can be further reduced, and at the same time, the air purification is achieved. efficacy.

While the invention has been described in connection with the preferred embodiments described above, it is not intended to limit the scope of the invention. The technical scope of the invention is protected, and therefore the scope of the invention is defined by the scope of the appended claims.

Claims (16)

An environmental adjustment device includes: a casing having a first accommodating space and a second accommodating space, wherein the first accommodating space is connected to an air outlet, and the second accommodating space is connected to an air inlet; a module, located between the first accommodating space and the second accommodating space, the water-cooling module has a container and a liquid storage space at a periphery of the container, and a channel is formed between the top and bottom ends of the container The bottom of the container has a plurality of small holes, the channel is in communication with the second accommodating space; a fan is located above the water cooling module; and a uniform cold wafer is located in the second accommodating space, the chilled wafer has The relatively uniform cold surface and the uniform hot surface, the cooling surface faces the water cooling module. The environmental adjustment device of claim 1, wherein the housing has a bottom plate and a cover member located above the bottom plate, and the cover member and the bottom plate have a partition wall portion The bottom plate has a first receiving groove portion and a second receiving groove portion, wherein the first receiving groove portion and the second receiving groove portion are respectively located at two sides of the partition wall portion, the water cooling module and the second receiving groove The portions together form the second accommodating space. The environmental adjustment device of claim 2, wherein the covering member has a receiving portion and a top cover, the top cover is connected to the top edge of the receiving portion to form the first receiving space, The fan is located in the first accommodating space. The environmental adjustment device of claim 3, wherein the air outlet is located at a top cover of the cover member, and the fan is axially located between the water cooling module and the air outlet. The environmental adjustment device according to claim 3, wherein the air outlet is located at a receiving portion of the covering member, and the air outlet is laterally located on the fan. The environmental conditioning device of claim 2, wherein the housing has a first-class track, and the flow path is located at a bottom edge of the partition wall portion. The environmental conditioning device of claim 2, wherein the first pocket portion is for placing a plant pot, and the lower surface of the covering member has an illuminant, and the illuminant is potted against the plant. The environmental conditioning device of claim 1, wherein the water cooling module has an inner layer member and an outer layer member, and the bottom edge of the outer layer member is connected to the bottom edge of the inner layer member to form the liquid storage space. . The environmental conditioning device of claim 8, wherein the inner wall of the inner layer member abuts against the outer wall of the container. The environmental conditioning device of claim 8, wherein the water cooling module has a grip portion connected to the outer layer member. The environmental conditioning device of claim 1, wherein the container is made of aluminum. The environmental conditioning device of claim 1, wherein the refrigerating wafer has a cold end fin set extending from the cooling surface toward the water cooling module. The environmental conditioning device of claim 1, wherein the refrigerating wafer has a hot end fin set extending from the heating surface toward a bottom plate of the housing. The environmental adjustment device according to any one of claims 1 to 13, further comprising a cooling module, the cooling module is located under the housing, the cooling module has a body and a liquid storage member, The liquid reservoir is detachably coupled to the seat body, the housing having a consistent bore that communicates with the interior of the liquid reservoir. The environmental conditioning device of claim 14, wherein the cooling module has a motor located in the housing, the motor is connected to an inlet pipe member and an outlet pipe member, and the other end of the inlet pipe member extends to the second capacity. In the space, the other end of the outlet pipe extends to the storage Inside the liquid. The environmental conditioning device of claim 14, further comprising a sensor, the sensor being located in the first accommodating space of the housing.