TWI664046B - Laser surface treatment apparatus - Google Patents

Laser surface treatment apparatus Download PDF

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Publication number
TWI664046B
TWI664046B TW107110272A TW107110272A TWI664046B TW I664046 B TWI664046 B TW I664046B TW 107110272 A TW107110272 A TW 107110272A TW 107110272 A TW107110272 A TW 107110272A TW I664046 B TWI664046 B TW I664046B
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Taiwan
Prior art keywords
laser
surface treatment
drive
driving mechanism
item
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TW107110272A
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Chinese (zh)
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TW201938307A (en
Inventor
王建剛
許進福
游家麒
戴大淵
趙錕
高必甲
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中國商武漢華工激光工程有限責任公司
緯創資通股份有限公司
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    • B23K26/0066
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/0869Devices involving movement of the laser head in at least one axial direction
    • B23K26/0876Devices involving movement of the laser head in at least one axial direction in at least two axial directions
    • B23K26/0884Devices involving movement of the laser head in at least one axial direction in at least two axial directions in at least in three axial directions, e.g. manipulators, robots
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/362Laser etching
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/38Removing material by boring or cutting
    • B23K26/382Removing material by boring or cutting by boring

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Robotics (AREA)
  • Laser Beam Processing (AREA)

Abstract

一種雷射表面處理設備,包含一第一移動件、一第一驅動機構、一第二移動件、一第二驅動機構、一承載件、一第三驅動機構以及一雷射發射器。第一驅動機構是配置以驅動第一移動件沿著一第一方向移動。第二驅動機構是設置於第一移動件上,配置以驅動第二移動件沿著一第二方向移動。承載件是配置以承載一物體。第三驅動機構是設置於第二移動件上,配置以驅動承載件與物體繞一旋轉軸旋轉。雷射發射器是配置以發出一雷射光束,以於物體沿著第一方向移動、沿著第二方向移動或繞旋轉軸轉動時對物體進行雷射表面處理。 A laser surface treatment device includes a first moving member, a first driving mechanism, a second moving member, a second driving mechanism, a carrier, a third driving mechanism, and a laser emitter. The first driving mechanism is configured to drive the first moving member to move along a first direction. The second driving mechanism is disposed on the first moving member and configured to drive the second moving member to move along a second direction. The carrier is configured to carry an object. The third driving mechanism is disposed on the second moving member and configured to drive the bearing member and the object to rotate about a rotation axis. The laser transmitter is configured to emit a laser beam to perform laser surface treatment on the object when the object moves in the first direction, moves in the second direction, or rotates about a rotation axis.

Description

雷射表面處理設備 Laser surface treatment equipment

本發明係關於一種雷射表面處理設備,特別係關於一種可對物體不同表面連續進行雷射表面處理之雷射表面處理設備。 The present invention relates to a laser surface treatment device, and more particularly, to a laser surface treatment device capable of continuously performing laser surface treatment on different surfaces of an object.

隨著科技的發展,可發出雷射光束的設備已逐漸發展得很成熟。雷射光束具有不會有色散現象的單色性,以及具有集中的低發散性。另外,雷射也具有高強度,可控制雷射光束聚焦一個很小的點,以對物體進行雷射表面處理。 With the development of technology, the equipment that can emit laser beams has gradually developed into a mature one. Laser beams are monochromatic without dispersion, and have a concentrated, low divergence. In addition, the laser also has high intensity, which can control the laser beam to focus on a small point to perform laser surface treatment on the object.

一般而言,雷射可應用在很多領域,例如可用來對高硬度的金屬進行切割處理,醫學上可用來切割組織或腫瘤,或可對各種物體進行雷射表面處理。此外,雷射表面處理也可應用於人體上或是應用在工業產品上。舉例來說,雷射可用來消除人體上的刺青、胎記等。而在工業上可對產品進行雷射雕刻或是雷射打孔。 Generally speaking, laser can be applied in many fields, for example, it can be used to cut high hardness metal, medically it can be used to cut tissue or tumor, or it can be used for laser surface treatment on various objects. In addition, laser surface treatment can also be applied to the human body or to industrial products. For example, lasers can be used to eliminate tattoos, birthmarks, etc. on the human body. In the industry, laser engraving or laser drilling can be performed on products.

雖然現有的雷射表面處理設備已經可符合上述一般之目的,但這些雷射表面處理設備仍不能在各方面令人滿意。 Although the existing laser surface treatment equipment can already meet the general purpose described above, these laser surface treatment equipment are still not satisfactory in all aspects.

有鑑於此,本發明提出一種雷射表面處理設備,以解決上述之問題。 In view of this, the present invention proposes a laser surface treatment device to solve the above problems.

本發明之實施例揭露了一種雷射表面處理設備,包含一第一移動件、一第一驅動機構、一第二移動件、一第二驅動機構、一承載件、一第三驅動機構以及一雷射發射器。該第一驅動機構是配置以驅動該第一移動件沿著一第一方向移動。該第二驅動機構是設置於該第一移動件上,配置以驅動該第二移動件沿著一第二方向移動。該承載件是配置以承載一物體。該第三驅動機構是設置於該第二移動件上,配置以驅動該承載件與該物體繞一旋轉軸旋轉。該雷射發射器是配置以發出一雷射光束,以於該物體沿著該第一方向移動、沿著該第二方向移動或繞該旋轉軸轉動時對該物體進行雷射表面處理。 An embodiment of the present invention discloses a laser surface treatment device including a first moving member, a first driving mechanism, a second moving member, a second driving mechanism, a carrier, a third driving mechanism, and a Laser launcher. The first driving mechanism is configured to drive the first moving member to move along a first direction. The second driving mechanism is disposed on the first moving member and configured to drive the second moving member to move along a second direction. The carrier is configured to carry an object. The third driving mechanism is disposed on the second moving member and configured to drive the bearing member and the object to rotate about a rotation axis. The laser transmitter is configured to emit a laser beam, so that the object is subjected to laser surface treatment when the object moves along the first direction, moves along the second direction, or rotates about the rotation axis.

在部分實施例中,該雷射發射器發射垂直於該物體的一第一表面之該雷射光束至該物體,以對該第一表面進行一第一雷射表面處理,該雷射發射器係於該物體旋轉後發射垂直於該物體之一第二表面之該雷射光束至該物體,以對該第二表面進行一第二雷射表面處理,並且該第一表面不平行於該第二表面。 In some embodiments, the laser emitter emits the laser beam perpendicular to a first surface of the object to the object to perform a first laser surface treatment on the first surface. The laser emitter After the object is rotated, the laser beam perpendicular to a second surface of the object is emitted to the object to perform a second laser surface treatment on the second surface, and the first surface is not parallel to the first surface. Two surfaces.

在部分實施例中,該物體更具有一第三表面,該第一表面大致平行於該第三表面,並且該雷射光束的焦點設置於該第一表面與該第三表面之間的一中間位置。 In some embodiments, the object further has a third surface, the first surface is substantially parallel to the third surface, and the focal point of the laser beam is set at a middle between the first surface and the third surface position.

在部分實施例中,該雷射光束係配置以使該物體上形成複數個穿孔,並且每一穿孔貫穿該第一表面與該第三表面。 In some embodiments, the laser beam is configured to form a plurality of perforations on the object, and each perforation penetrates the first surface and the third surface.

在部分實施例中,該物體具有一管狀結構,並且該雷射發射器配置以於該第三驅動機構旋轉該承載件與該物 體時發出大致上垂直於該物體之一側面之該雷射光束,以對該物體之該側面進行雷射表面處理。 In some embodiments, the object has a tubular structure, and the laser transmitter is configured to rotate the carrier and the object by the third driving mechanism. The body emits the laser beam substantially perpendicular to one side of the object to perform laser surface treatment on the side of the object.

在部分實施例中,該第一驅動機構更包含一第一座體以及一第一驅動件。該第一座體具有沿著該第一方向延伸之一第一軌道。該第一驅動件是配置以驅動該第一移動件沿著該第一軌道移動。 In some embodiments, the first driving mechanism further includes a first base and a first driving member. The first base has a first track extending along the first direction. The first driving member is configured to drive the first moving member to move along the first track.

在部分實施例中,該第二驅動機構更包含一第二座體以及一第二驅動件。該第二座體具有沿著該第二方向延伸之一第二軌道。該第二驅動件是配置以驅動該第二移動件沿著該第二軌道移動。 In some embodiments, the second driving mechanism further includes a second base and a second driving member. The second base has a second track extending along the second direction. The second driving member is configured to drive the second moving member to move along the second track.

在部分實施例中,該第三驅動機構更包含一第三座體、一轉動件以及一第三驅動件。該轉動件是連接於該承載件,並且該轉動件以可旋轉之方式連接於該第三座體。該第三驅動件是配置以驅動該轉動件相對於該第三座體繞該旋轉軸旋轉。 In some embodiments, the third driving mechanism further includes a third base, a rotating member, and a third driving member. The rotating member is connected to the bearing member, and the rotating member is rotatably connected to the third base body. The third driving member is configured to drive the rotating member to rotate about the rotation axis relative to the third base.

在部分實施例中,該雷射發射器更包含一第一鏡片模組、一第二鏡片模組以及一第三鏡片模組,配置以控制該雷射光束的方向以及一焦點位置。 In some embodiments, the laser transmitter further includes a first lens module, a second lens module, and a third lens module, which are configured to control the direction of the laser beam and a focus position.

在部分實施例中,該第一方向實質上垂直於該第二方向,並且該第一方向實質地平行於該旋轉軸。 In some embodiments, the first direction is substantially perpendicular to the second direction, and the first direction is substantially parallel to the rotation axis.

在部分實施例中,該雷射表面處理設備更包含一旋轉驅動件,並且該承載件包含一底座以及一承載部。該旋轉驅動件設置於該底座上,並且該承載部是配置以承載該物體。其中該旋轉驅動件設置於該底座與該承載部之間,配置以驅動 該承載部與該物體繞一轉軸旋轉,並且該轉軸實質地平行於該第二方向。 In some embodiments, the laser surface treatment apparatus further includes a rotary driving member, and the carrier includes a base and a carrier. The rotation driving member is disposed on the base, and the bearing portion is configured to carry the object. The rotary driving member is disposed between the base and the bearing portion, and is configured to drive The bearing portion and the object rotate around a rotation axis, and the rotation axis is substantially parallel to the second direction.

在部分實施例中,該第一驅動機構更包含一移動承載件、一第一座體、一第一驅動件、一導引座以及一驅動馬達。該第一座體具有沿著該第一方向延伸之一第一軌道,且該第一驅動件是配置以驅動該移動承載件沿著該第一軌道移動。該導引座是設置於該移動承載件上,且該導引座具有沿著一第三方向延伸之一導引軌道。該驅動馬達是配置以驅動該第一移動件沿著該導引軌道移動。 In some embodiments, the first driving mechanism further includes a moving carrier, a first base, a first driving member, a guide base, and a driving motor. The first base has a first track extending along the first direction, and the first driving member is configured to drive the moving carrier to move along the first track. The guide base is disposed on the moving carrier, and the guide base has a guide rail extending along a third direction. The driving motor is configured to drive the first moving member to move along the guide rail.

本揭露提供一種雷射表面處理設備,具有第一驅動機構、第二驅動機構與第三驅動機構。藉由控制第一驅動機構、第二驅動機構與第三驅動機構來移動並轉動待處理的物體,使得雷射光束在雷射表面處理的過程中始終與物體的表面互相垂直,便可以得到所需的處理效果,例如在對不同表面進行雷射雕刻時,不同表面交界處的圖案可以維持連續而不會有斷開或拼接的痕跡產生。 The present disclosure provides a laser surface treatment apparatus having a first driving mechanism, a second driving mechanism, and a third driving mechanism. By controlling the first driving mechanism, the second driving mechanism, and the third driving mechanism to move and rotate the object to be processed, so that the laser beam is always perpendicular to the surface of the object during the laser surface treatment, the obtained The required processing effect, for example, when laser engraving on different surfaces, the patterns at the interface of different surfaces can be maintained continuously without the occurrence of disconnection or splicing marks.

基於本揭露雷射表面處理設備之設計,在對物體的不同表面進行雷射表面處理時,不需要中斷處理過程來額外設置對應於物體形狀的治具(例如利用治具調整物體的待處理表面使雷射光束與待處理表面垂直),因此不僅可以減少雷射表面處理的步驟,更可以縮短整體處理的時間。再者,雷射發射器中可設置有多個鏡片模組,可進一步調整雷射光束的前進方向與其焦點位置,以進一步縮短雷射表面處理的時間,並可進一步改善雷射表面處理的效果。 Based on the design of the laser surface treatment equipment disclosed in this disclosure, when performing laser surface treatment on different surfaces of an object, there is no need to interrupt the processing process to additionally set a jig corresponding to the shape of the object (for example, use the jig to adjust the surface to be processed of the object Make the laser beam perpendicular to the surface to be processed), so not only can you reduce the number of laser surface processing steps, but also shorten the overall processing time. In addition, the laser transmitter can be provided with multiple lens modules, which can further adjust the forward direction of the laser beam and its focal position to further shorten the laser surface treatment time and further improve the laser surface treatment effect. .

本發明中之額外的功能及優點將會在後面說明中揭示,且部分可由後述說明書中清楚了解,或是可由所揭示的原則經由練習而學得。本發明之功能及優點可由後述申請專利範圍中所特別指出的儀器或裝置的組合而實現及獲得。本發明之這些及其他特點會由後述之說明書及申請專利範圍而變得更清楚、或是可由本發明所揭示之原則經由練習而學得。 The additional functions and advantages of the present invention will be disclosed in the following description, and some of them can be clearly understood in the following description, or can be learned through practice through the disclosed principles. The functions and advantages of the present invention can be realized and obtained by the combination of the instruments or devices specifically pointed out in the scope of patent application mentioned later. These and other features of the present invention will become clearer from the scope of the following description and patent application, or may be learned through practice from the principles disclosed by the present invention.

100、100A、100B‧‧‧雷射表面處理設備 100, 100A, 100B‧‧‧ laser surface treatment equipment

102‧‧‧基座 102‧‧‧ base

1021‧‧‧容置槽 1021‧‧‧Receiving slot

104‧‧‧驅動裝置 104‧‧‧Drive

106‧‧‧控制裝置 106‧‧‧Control device

200‧‧‧雷射發射器 200‧‧‧Laser Launcher

202‧‧‧雷射光束 202‧‧‧laser beam

204‧‧‧雷射光源 204‧‧‧laser light source

205‧‧‧聚焦透鏡 205‧‧‧Focus lens

206‧‧‧第一鏡片模組 206‧‧‧The first lens module

2061‧‧‧第一控制馬達 2061‧‧‧The first control motor

2063‧‧‧第一反射鏡 2063‧‧‧First Mirror

208‧‧‧第二鏡片模組 208‧‧‧Second lens module

2081‧‧‧第二控制馬達 2081‧‧‧Second Control Motor

2083‧‧‧第二反射鏡 2083‧‧‧Second Mirror

210‧‧‧第三鏡片模組 210‧‧‧Third lens module

2101‧‧‧控制器 2101‧‧‧controller

2103‧‧‧透鏡 2103‧‧‧Lens

300‧‧‧第一驅動機構 300‧‧‧first drive mechanism

302‧‧‧第一移動件 302‧‧‧First moving piece

304‧‧‧第一座體 304‧‧‧First Block

3041‧‧‧第一軌道 3041‧‧‧First track

306‧‧‧第一驅動件 306‧‧‧First drive

308‧‧‧移動承載件 308‧‧‧mobile carrier

310‧‧‧導引座 310‧‧‧Guide Block

3101‧‧‧導引軌道 3101‧‧‧Guide

312‧‧‧驅動馬達 312‧‧‧Drive motor

400‧‧‧第二驅動機構 400‧‧‧Second driving mechanism

402‧‧‧第二移動件 402‧‧‧Second moving piece

404‧‧‧第二座體 404‧‧‧Second Block

4041‧‧‧第二軌道 4041‧‧‧Second Track

406‧‧‧第二驅動件 406‧‧‧Second driver

500‧‧‧第三驅動機構 500‧‧‧third drive mechanism

502‧‧‧轉動件 502‧‧‧Rotating parts

504‧‧‧第三座體 504‧‧‧Third Block

506‧‧‧第三驅動件 506‧‧‧third drive

508‧‧‧承載件 508‧‧‧carrying parts

5081‧‧‧容置槽 5081‧‧‧Receiving slot

5083‧‧‧底座 5083‧‧‧Base

5085‧‧‧承載部 5085‧‧‧Loading Department

510‧‧‧承載件 510‧‧‧carriage

512‧‧‧承載件 512‧‧‧carriage

600‧‧‧物體 600‧‧‧ objects

600A‧‧‧物體 600A‧‧‧ Object

600B‧‧‧物體 600B‧‧‧ Object

602‧‧‧第一表面 602‧‧‧ first surface

604‧‧‧第二表面 604‧‧‧Second surface

606‧‧‧第三表面 606‧‧‧ third surface

608‧‧‧表面 608‧‧‧ surface

610‧‧‧表面 610‧‧‧ surface

612‧‧‧側面 612‧‧‧side

700‧‧‧旋轉驅動件 700‧‧‧rotary drive

CP‧‧‧雕刻圖案 CP‧‧‧Carving pattern

FC‧‧‧焦點位置 FC‧‧‧ focus position

H1‧‧‧穿孔 H1‧‧‧perforation

P1‧‧‧第一位置 P1‧‧‧First position

P2‧‧‧第二位置 P2‧‧‧Second position

P3‧‧‧第三位置 P3‧‧‧Third position

P4‧‧‧第四位置 P4‧‧‧Fourth position

RG‧‧‧可移動範圍 RG‧‧‧movable range

SA1~SA5‧‧‧區域 SA1 ~ SA5‧‧‧‧Area

TC‧‧‧軌跡 TC‧‧‧Track

第1圖為根據本發明一些實施例之一雷射表面處理設備之立體示意圖。 FIG. 1 is a schematic perspective view of a laser surface treatment apparatus according to some embodiments of the present invention.

第2圖為根據本發明第1圖之實施例中的物體之立體示意圖。 Fig. 2 is a schematic perspective view of an object in the embodiment of Fig. 1 according to the present invention.

第3圖為根據本發明第2圖之實施例中沿著A-A’線段之剖視圖。 Fig. 3 is a sectional view taken along line A-A 'in the embodiment according to Fig. 2 of the present invention.

第4圖為根據本發明第2圖之實施例中的物體旋轉後之立體示意圖。 FIG. 4 is a schematic perspective view of an object after the object is rotated according to the embodiment of FIG. 2 of the present invention.

第5圖為根據本發明一些實施例之一承載件連接於第三驅動機構之示意圖。 FIG. 5 is a schematic diagram of a carrier connected to a third driving mechanism according to some embodiments of the present invention.

第6圖為根據本發明另一實施例之一物體連接於第三驅動機構之立體示意圖。 FIG. 6 is a schematic perspective view of an object connected to a third driving mechanism according to another embodiment of the present invention.

第7圖為根據本發明另一實施例之一雷射表面處理設備之示意圖。 FIG. 7 is a schematic diagram of a laser surface treatment apparatus according to another embodiment of the present invention.

第8圖為根據本發明另一實施例之一雷射表面處理設備之示意圖。 FIG. 8 is a schematic diagram of a laser surface treatment apparatus according to another embodiment of the present invention.

第9圖為根據本發明一些實施例之雷射發射器的元件示意圖。 FIG. 9 is a schematic diagram of components of a laser transmitter according to some embodiments of the present invention.

第10圖為根據本發明一些實施例之物體的剖面示意圖。 FIG. 10 is a schematic cross-sectional view of an object according to some embodiments of the present invention.

為了讓本揭露之目的、特徵、及優點能更明顯易懂,下文特舉實施例,並配合所附圖示做詳細說明。其中,實施例中的各元件之配置係為說明之用,並非用以限制本揭露。且實施例中圖式標號之部分重複,係為了簡化說明,並非意指不同實施例之間的關聯性。以下實施例中所提到的方向用語,例如:上、下、左、右、前或後等,僅是參考附加圖式的方向。因此,使用的方向用語是用來說明並非用來限制本揭露。 In order to make the purpose, features, and advantages of this disclosure more obvious and easy to understand, the embodiments are exemplified below and described in detail with the accompanying drawings. Wherein, the arrangement of the elements in the embodiments is for the purpose of illustration and is not intended to limit the disclosure. In addition, part of the figure numbers in the embodiments are repeated for the sake of simplifying the description, and do not mean the correlation between different embodiments. The directional terms mentioned in the following embodiments, such as: up, down, left, right, front, or rear, are only directions referring to the attached drawings. Therefore, the directional terms used are used to illustrate and are not intended to limit the disclosure.

此外,實施例中可能使用相對性的用語,例如「較低」或「底部」及「較高」或「頂部」,以描述圖示的一個元件對於另一元件的相對關係。能理解的是,如果將圖示的裝置翻轉使其上下顛倒,則所敘述在「較低」側的元件將會成為在「較高」側的元件。 In addition, relative terms such as "lower" or "bottom" and "higher" or "top" may be used in the embodiments to describe the relative relationship of one element to another element in the illustration. It can be understood that if the illustrated device is turned upside down and turned upside down, the component described on the "lower" side will become the component on the "higher" side.

在此,「約」、「大約」之用語通常表示在一給定值或範圍的20%之內,較佳是10%之內,且更佳是5%之內。在此給定的數量為大約的數量,意即在沒有特定說明的情況下,仍可隱含「約」、「大約」之含義。 Here, the terms "about" and "approximately" usually indicate within 20% of a given value or range, preferably within 10%, and more preferably within 5%. The quantity given here is an approximate quantity, which means that the meanings of "about" and "approximately" can still be implied without specific instructions.

請參考第1圖,第1圖為本發明一實施例之一雷射表面處理設備100之立體示意圖。如第1圖所示,雷射表面處理設備100包含一基座102、一驅動裝置104、一控制裝置106以及一雷射發射器200。於此實施例中,基座102上形成一容置槽 1021,並且驅動裝置104是固定地設置在容置槽1021內。另外,控制裝置106是可設置於基座102內,並且控制裝置106可發送驅動訊號至驅動裝置104,藉以控制驅動裝置104的作動。於此實施例中,控制裝置106可為雷射表面處理設備100中的一電腦裝置,例如可包含有一處理器以及一儲存電路(圖中未表示)。 Please refer to FIG. 1. FIG. 1 is a schematic perspective view of a laser surface treatment apparatus 100 according to an embodiment of the present invention. As shown in FIG. 1, the laser surface treatment apparatus 100 includes a base 102, a driving device 104, a control device 106, and a laser emitter 200. In this embodiment, a receiving groove is formed on the base 102 1021, and the driving device 104 is fixedly disposed in the accommodation groove 1021. In addition, the control device 106 can be disposed in the base 102, and the control device 106 can send a driving signal to the driving device 104 to control the operation of the driving device 104. In this embodiment, the control device 106 may be a computer device in the laser surface processing apparatus 100, for example, it may include a processor and a storage circuit (not shown in the figure).

處理器可為一微處理器或一中央處理器,而儲存電路可為一隨機存取記憶體(Random Access Memory,RAM)、快閃記憶體(flash memory)、唯讀記憶體(Read-Only Memory,ROM)、可抹除可規劃唯讀記憶體(EPROM)、電子抹除式可複寫唯讀記憶體(Electrically-Erasable Programmable Read-Only Memory,EEPROM)、暫存器、硬碟、可攜式硬碟、光碟唯讀記憶體(Compact Disc Read-Only Memory,CD-ROM)或在此領域習知技術中任何其它電腦可讀取之儲存媒體格式。儲存電路中可儲存有控制驅動裝置104以及雷射發射器200的相關程式,處理器可執行該些程式以產生驅動訊號來控制驅動裝置104以及雷射發射器200的作動。 The processor may be a microprocessor or a central processing unit, and the storage circuit may be a random access memory (RAM), flash memory, read-only memory Memory (ROM), erasable and programmable read-only memory (EPROM), electronically erasable rewritable read-only memory (Electrically-Erasable Programmable Read-Only Memory (EEPROM)), scratchpad, hard disk, portable Hard disk, compact disc read-only memory (CD-ROM), or any other computer-readable storage media format known in the art. Relevant programs for controlling the driving device 104 and the laser transmitter 200 may be stored in the storage circuit, and the processor may execute these programs to generate driving signals to control the operations of the driving device 104 and the laser transmitter 200.

如第1圖所示,驅動裝置104可包含有一第一驅動機構300、一第一移動件302、一第二驅動機構400、一第二移動件402、一第三驅動機構500以及一轉動件502。於此實施例中,第一驅動機構300是配置以驅動第一移動件302沿著一第一方向(X軸方向)來回移動。第二驅動機構400是設置於第一移動件302上,並且第二驅動機構400是配置以驅動第二移動件402沿著一第二方向(Z軸方向)移動。另外,在某些實施例中,驅動裝置104也可更包含另一驅動機構(圖中未表示),相似 於第一驅動機構300,所述驅動機構是可配置以驅動第一移動件302沿著Y軸方向移動。 As shown in FIG. 1, the driving device 104 may include a first driving mechanism 300, a first moving member 302, a second driving mechanism 400, a second moving member 402, a third driving mechanism 500, and a rotating member. 502. In this embodiment, the first driving mechanism 300 is configured to drive the first moving member 302 to move back and forth along a first direction (X-axis direction). The second driving mechanism 400 is disposed on the first moving member 302, and the second driving mechanism 400 is configured to drive the second moving member 402 to move along a second direction (Z-axis direction). In addition, in some embodiments, the driving device 104 may further include another driving mechanism (not shown in the figure), similarly. In the first driving mechanism 300, the driving mechanism is configured to drive the first moving member 302 to move along the Y-axis direction.

具體而言,第一驅動機構300可包含一第一座體304以及一第一驅動件306。第一座體304可具有一第一軌道3041,沿著所述第一方向延伸於第一座體304上。第一移動件302是連接於第一座體304並可沿著第一軌道3041移動。第一驅動件306可為一伺服馬達,但不限於此實施例。再者,於此實施例中,第一座體304內可設置有一螺桿(圖中未表示),並且第一移動件302底部可形成有配合所述螺桿的結構,使得當第一驅動件306驅動所述螺桿轉動時,螺桿可進一步帶動第一移動件302沿著第一軌道3041移動。 Specifically, the first driving mechanism 300 may include a first base 304 and a first driving member 306. The first base 304 may have a first rail 3041 extending on the first base 304 along the first direction. The first moving member 302 is connected to the first base 304 and can move along the first rail 3041. The first driving member 306 may be a servo motor, but is not limited to this embodiment. Furthermore, in this embodiment, a screw (not shown) may be disposed in the first base 304, and a structure matching the screw may be formed at the bottom of the first moving member 302, so that when the first driving member 306 When the screw is driven to rotate, the screw can further drive the first moving member 302 to move along the first track 3041.

相似地,第二驅動機構400可包含一第二座體404以及一第二驅動件406。第二座體404可具有一第二軌道4041,沿著所述第二方向(Z軸方向)延伸於第二座體404上。第二移動件402是連接於第二座體404並可沿著第二軌道4041移動。第二驅動件406可為一伺服馬達,但不限於此實施例。於此實施例中,第二座體404內可設置有一螺桿(圖中未表示),並且第二移動件402底部可形成有配合所述螺桿的結構,使得當第二驅動件406驅動所述螺桿轉動時,螺桿可進一步帶動第二移動件402沿著第二軌道4041移動。 Similarly, the second driving mechanism 400 may include a second base 404 and a second driving member 406. The second base 404 may have a second track 4041 extending on the second base 404 along the second direction (Z-axis direction). The second moving member 402 is connected to the second base 404 and can move along the second rail 4041. The second driving member 406 may be a servo motor, but is not limited to this embodiment. In this embodiment, a screw (not shown) may be disposed in the second base 404, and a structure matching the screw may be formed at the bottom of the second moving member 402, so that when the second driving member 406 drives the screw When the screw rotates, the screw can further drive the second moving member 402 to move along the second track 4041.

要注意的是,用來驅動第一移動件302以及第二移動件402移動之機構不限於前述之伺服馬達以及螺桿,只要是可以驅動第一移動件302與第二移動件402之機構皆符合本揭露之範疇。 It should be noted that the mechanism used to drive the movement of the first moving member 302 and the second moving member 402 is not limited to the aforementioned servo motor and screw, as long as it can drive the first moving member 302 and the second moving member 402. The scope of this disclosure.

再者,第三驅動機構500是固定地設置於第二移動件402上,並且第三驅動機構500可更包含一第三座體504、一第三驅動件506以及一承載件508。承載件508是配置以承載一物體600(例如一筆記型電腦之機殼),並且承載件508是以可拆卸之方式連接於轉動件502。轉動件502是以可旋轉之方式連接於第三座體504。第三驅動件506可為一伺服馬達,配置以驅動轉動件502相對於第三座體504繞一旋轉軸旋轉,並且所述旋轉軸是平行於X軸方向(例如為轉動件502之中心軸)。舉例而言,第三驅動件506可透過第三座體504內的一渦桿以及一齒輪組(圖中未表示)來帶動轉動件502旋轉,但轉動件502的驅動方式不限於此。 Furthermore, the third driving mechanism 500 is fixedly disposed on the second moving member 402, and the third driving mechanism 500 may further include a third base 504, a third driving member 506, and a bearing member 508. The supporting member 508 is configured to carry an object 600 (such as a casing of a notebook computer), and the supporting member 508 is detachably connected to the rotating member 502. The rotating member 502 is rotatably connected to the third base 504. The third driving member 506 may be a servo motor configured to drive the rotating member 502 to rotate about a rotation axis relative to the third base 504, and the rotation axis is parallel to the X-axis direction (for example, the central axis of the rotation member 502) ). For example, the third driving member 506 can drive the rotating member 502 to rotate through a scroll rod and a gear set (not shown) in the third base 504, but the driving method of the rotating member 502 is not limited to this.

承載件508可具有一容置槽5081,對應於物體600的形狀,以使物體600可穩定地設置在容置槽5081內。當物體600放置於容置槽5081內後,控制裝置106可控制第一驅動機構300驅動第一移動件302移動,以使物體600沿著所述第一方向移動並對位於雷射發射器200。接著,控制裝置106可控制雷射發射器200發出一雷射光束202沿著Z軸方向前進,以對物體600進行雷射表面處理。在某些實施例中,雷射光束202的波長範圍為9200nm至9600nm之間。 The supporting member 508 may have a receiving groove 5081 corresponding to the shape of the object 600 so that the object 600 can be stably disposed in the receiving groove 5081. After the object 600 is placed in the accommodating slot 5081, the control device 106 may control the first driving mechanism 300 to drive the first moving member 302 to move the object 600 along the first direction and be located on the laser emitter 200. . Then, the control device 106 can control the laser transmitter 200 to emit a laser beam 202 to advance along the Z-axis direction to perform laser surface treatment on the object 600. In some embodiments, the wavelength of the laser beam 202 is between 9200 nm and 9600 nm.

請同時參考第1圖至第2圖,第2圖為根據本發明第1圖之實施例中的物體600之立體示意圖。如第2圖所示,於此實施例中,物體600具有一第一表面602以及一第二表面604,並且第一表面602不平行於第二表面604。於此實施例中,雷射發射器200是配置以對第一表面602以及第二表面604進行雷射 打孔處理。 Please refer to FIG. 1 to FIG. 2 at the same time. FIG. 2 is a schematic perspective view of the object 600 in the embodiment of FIG. 1 according to the present invention. As shown in FIG. 2, in this embodiment, the object 600 has a first surface 602 and a second surface 604, and the first surface 602 is not parallel to the second surface 604. In this embodiment, the laser emitter 200 is configured to perform laser irradiation on the first surface 602 and the second surface 604. Punch processing.

首先,控制裝置106可控制雷射發射器200發出雷射光束202至第一表面602上之一第一位置P1,以進行雷射打孔處理。其中,雷射光束202的前進方向是垂直於第一表面602(意即第一表面602垂直於Z軸方向)。接著,控制裝置106可控制第一驅動機構300驅動承載件508以及物體600沿著第一方向(X軸方向)移動,使得雷射光束202可接續地對一第二位置P2進行雷射打孔處理(第一雷射表面處理),接著以此類推,使得物體600之第一表面602上形成有複數個沿著X軸方向排列的穿孔。 First, the control device 106 can control the laser transmitter 200 to emit a laser beam 202 to a first position P1 on the first surface 602 to perform laser drilling processing. The advancing direction of the laser beam 202 is perpendicular to the first surface 602 (that is, the first surface 602 is perpendicular to the Z-axis direction). Then, the control device 106 can control the first driving mechanism 300 to drive the carrier 508 and the object 600 to move along the first direction (X-axis direction), so that the laser beam 202 can successively perform laser drilling on a second position P2 Processing (first laser surface processing), and so on, so that a plurality of perforations arranged along the X-axis direction are formed on the first surface 602 of the object 600.

請參考第3圖,第3圖為根據本發明第2圖之實施例中沿著A-A’線段之剖視圖。在進行雷射打孔處理的過程中,控制裝置106可控制第二驅動機構400以帶動承載件508沿著Z軸方向移動,藉以調整雷射光束202於Z軸方向上的焦點位置。如第3圖所示,物體600更具有一第三表面606,大致上平行於第一表面602,並且雷射光束202的焦點位置FC是設置在第一表面602與第三表面606之間的一中間位置,以使雷射光束202在物體600上的第二位置P2形成穿孔H1,並且穿孔H1是貫穿第一表面602與第三表面606。 Please refer to FIG. 3, which is a cross-sectional view taken along line A-A 'in the embodiment of FIG. 2 according to the present invention. During the laser drilling process, the control device 106 may control the second driving mechanism 400 to drive the carrier 508 to move along the Z-axis direction, thereby adjusting the focal position of the laser beam 202 in the Z-axis direction. As shown in FIG. 3, the object 600 further has a third surface 606, which is substantially parallel to the first surface 602, and the focal position FC of the laser beam 202 is disposed between the first surface 602 and the third surface 606. An intermediate position, so that the laser beam 202 forms a perforation H1 at a second position P2 on the object 600, and the perforation H1 penetrates the first surface 602 and the third surface 606.

請參考第4圖,第4圖為根據本發明第2圖之實施例中的物體600旋轉後之立體示意圖。在完成第一表面602上的雷射打孔處理後,控制裝置106可控制第三驅動機構500帶動承載件508與物體600繞旋轉軸旋轉,以使物體600的第二表面604大致上垂直於雷射光束202的前進方向(意即第二表面604垂直於 Z軸方向)。接著雷射發射器200發出雷射光束202以對第二表面604進行雷射打孔處理(第二雷射表面處理),其打孔程序與前述在第一表面602打孔相似,故在此不再贅述。 Please refer to FIG. 4. FIG. 4 is a schematic perspective view of the object 600 in the embodiment according to FIG. 2 after the object is rotated. After the laser punching process on the first surface 602 is completed, the control device 106 can control the third driving mechanism 500 to drive the carrier 508 and the object 600 to rotate around the rotation axis, so that the second surface 604 of the object 600 is substantially perpendicular to The forward direction of the laser beam 202 (meaning that the second surface 604 is perpendicular to Z axis direction). Then, the laser transmitter 200 emits a laser beam 202 to perform laser punching processing on the second surface 604 (second laser surface processing). The punching procedure is similar to the aforementioned punching on the first surface 602, so here No longer.

值得注意的是,雷射發射器200在物體600上打孔的位置與順序不限於先對第一表面602處理後再對第二表面604進行處理。舉例來說,雷射發射器200也可按著物體600上的第一位置P1、一第三位置P3、一第四位置P4以及第二位置P2(如第2圖)之順序依序地對物體600進行打孔。 It is worth noting that the position and order of punching of the laser emitter 200 on the object 600 is not limited to the first surface 602 and then the second surface 604. For example, the laser transmitter 200 can also sequentially order the first position P1, a third position P3, a fourth position P4, and a second position P2 (as shown in FIG. 2) on the object 600. The object 600 is punched.

請參考第5圖,第5圖為根據本發明一些實施例之一承載件510連接於第三驅動機構500之示意圖(為了清楚表示,第5圖中僅表示第三驅動機構500)。於此實施例中,承載件510是以可拆卸之方式連接於第1圖中之轉動件502,並且承載件510可承載一物體600A。物體600A具有一管狀結構,並且套設於承載件510上。物體600A具有互相連接的一表面608以及一表面610,配置以進行雷射表面處理。 Please refer to FIG. 5. FIG. 5 is a schematic diagram of a carrier 510 connected to a third driving mechanism 500 according to some embodiments of the present invention (for clarity, only the third driving mechanism 500 is shown in FIG. 5). In this embodiment, the supporting member 510 is detachably connected to the rotating member 502 in the first figure, and the supporting member 510 can carry an object 600A. The object 600A has a tubular structure and is sleeved on the carrier 510. The object 600A has a surface 608 and a surface 610 connected to each other, and is configured to perform laser surface treatment.

接著,控制裝置106可藉由第一驅動機構300以及第三驅動機構500使物體600A旋轉並沿著X軸方向來回移動,以使雷射發射器200發出的雷射光束202可連續地對表面608與表面610進行雷射雕刻處理,以獲得連續的雕刻圖案CP。藉由這樣的操作程序,可以使表面608與表面610的交界處的雕刻圖案CP維持連續而不會有斷開或拼接的痕跡產生。另外,要注意的是,在雷射雕刻處理的過程中,雷射光束202是大致上垂直於表面608與表面610。 Then, the control device 106 can rotate the object 600A and move back and forth along the X-axis direction by the first driving mechanism 300 and the third driving mechanism 500, so that the laser beam 202 emitted by the laser transmitter 200 can continuously face the surface 608 performs laser engraving with the surface 610 to obtain a continuous engraving pattern CP. With such an operation procedure, the engraving pattern CP at the interface between the surface 608 and the surface 610 can be maintained continuously without any trace of disconnection or splicing. In addition, it should be noted that during the laser engraving process, the laser beam 202 is substantially perpendicular to the surface 608 and the surface 610.

請參考第6圖,第6圖為根據本發明另一實施例之 一物體600B連接於第三驅動機構500之立體示意圖。相似於前述實施例,物體600B具有一圓管狀結構,套設於一承載件512上,承載件512對應於物體600B的形狀。於此實施例中,雷射發射器200是配置以於第一驅動機構300以及第三驅動機構500使物體600B旋轉並沿著X軸方向來回移動時發出雷射光束202對物體600B的環形的一側面612進行雷射打孔處理(為了清楚表示,第6圖中僅表示第三驅動機構500)。藉由這樣的操作程序,可以使側面612上形成的複數個穿孔彼此之間的距離維持固定,而不會有斷開或拼接痕跡產生。相似地,在雷射雕刻處理的過程中,雷射光束202是大致上垂直於側面612,以使得每一個形成的穿孔的孔徑大小一致。 Please refer to FIG. 6, which is a diagram illustrating another embodiment of the present invention. An isometric view of an object 600B connected to the third driving mechanism 500. Similar to the foregoing embodiment, the object 600B has a circular tubular structure, which is sleeved on a carrier 512, and the carrier 512 corresponds to the shape of the object 600B. In this embodiment, the laser emitter 200 is configured to emit a laser beam 202 to the object 600B when the first driving mechanism 300 and the third driving mechanism 500 rotate the object 600B and move back and forth along the X-axis direction. One side 612 performs laser punching processing (for clarity, only the third driving mechanism 500 is shown in FIG. 6). With such an operation procedure, the distances between the plurality of perforations formed on the side surface 612 can be maintained constant, without the occurrence of disconnection or splicing marks. Similarly, during the laser engraving process, the laser beam 202 is substantially perpendicular to the side 612 so that the aperture size of each of the formed perforations is uniform.

請參考第7圖,第7圖為根據本發明另一實施例之一雷射表面處理設備100A之示意圖。雷射表面處理設備100A與雷射表面處理設備100的結構相似,其差異在於雷射表面處理設備100A可更包含一旋轉驅動件700,並且承載件508可包含一底座5083以及一承載部5085。為了清楚說明,第7圖中省略了基座102、控制裝置106以及雷射發射器200。 Please refer to FIG. 7, which is a schematic diagram of a laser surface treatment apparatus 100A according to another embodiment of the present invention. The structure of the laser surface treatment device 100A is similar to that of the laser surface treatment device 100. The difference is that the laser surface treatment device 100A may further include a rotation driving member 700, and the bearing member 508 may include a base 5083 and a bearing portion 5085. For clarity, the base 102, the control device 106, and the laser transmitter 200 are omitted in FIG.

如第7圖所示,旋轉驅動件700設置在底座5083上且位於底座5083與承載部5085之間,並且承載部5085是配置以承載物體600,例如承載部5085具有容置槽5081,而物體600設置於其內。於此實施例中,旋轉驅動件700例如可為一旋轉馬達,電性連接於第1圖中之控制裝置106,控制裝置106可控制旋轉驅動件700繞一轉軸旋轉,並且所述轉軸是實質地平行於第二方向(Z軸方向)。因此,旋轉驅動件700可驅動承載部5085 與物體600旋轉。 As shown in FIG. 7, the rotation driving member 700 is disposed on the base 5083 and is located between the base 5083 and the bearing portion 5085. The bearing portion 5085 is configured to carry the object 600. For example, the bearing portion 5085 has a receiving slot 5081 and the object 600 is set in it. In this embodiment, the rotary driving member 700 may be, for example, a rotary motor, which is electrically connected to the control device 106 in the first figure. The control device 106 may control the rotary driving member 700 to rotate around a rotation axis, and the rotation axis is substantially The ground is parallel to the second direction (Z-axis direction). Therefore, the rotation driving member 700 can drive the bearing portion 5085. Rotate with object 600.

舉例來說,當物體600的一區域SA1完成雷射表面處理後(區域SA1包含第4圖中的第一表面602與第二表面604),控制裝置106可控制旋轉驅動件700,使承載部5085帶動物體600繞Z軸逆時針旋轉90度,接著便可對物體600的一區域SA2進行雷射表面處理。相似地,承載部5085也可帶動物體600繞Z軸順時針旋轉90度,使物體600的一區域SA3進行雷射表面處理,或者承載部5085帶動物體600繞Z軸逆時針旋轉180度,使物體600的一區域SA4與一區域SA5進行雷射表面處理。 For example, after a laser surface treatment is performed on an area SA1 of the object 600 (the area SA1 includes the first surface 602 and the second surface 604 in FIG. 4), the control device 106 may control the rotation driving member 700 so that the bearing portion The 5085 belt animal body 600 is rotated 90 degrees counterclockwise around the Z axis, and then a laser surface treatment can be performed on an area SA2 of the object 600. Similarly, the bearing part 5085 can also rotate the animal body 600 clockwise 90 degrees around the Z axis to perform laser surface treatment on a region SA3 of the object 600, or the bearing part 5085 can rotate the animal body 600 counterclockwise 180 degrees around the Z axis so An area SA4 and an area SA5 of the object 600 are subjected to laser surface treatment.

要注意的是,於此實施例中,區域S2與區域S3定義為物體600的相反兩個短邊側的區域,區域S4定義為區域S1相反側之平面區域,並且區域S5定義為連接於區域S4之一斜面(相似於第4圖中的第二表面604)。藉由此實施例之結構設計,雷射表面處理設備100A可對物體600上的不同區域進行雷射表面處理。 It should be noted that, in this embodiment, the region S2 and the region S3 are defined as regions on the opposite two short sides of the object 600, the region S4 is defined as a planar region on the opposite side of the region S1, and the region S5 is defined as being connected to the region One of the slopes of S4 (similar to the second surface 604 in FIG. 4). With the structural design of this embodiment, the laser surface treatment apparatus 100A can perform laser surface treatment on different regions on the object 600.

請參考第8圖,第8圖為根據本發明另一實施例之一雷射表面處理設備100B之示意圖。雷射表面處理設備100B與雷射表面處理設備100A的結構相似,其差異在於雷射表面處理設備100B中的第一驅動機構300可更包含一移動承載件308、一導引座310以及一驅動馬達312。 Please refer to FIG. 8, which is a schematic diagram of a laser surface treatment apparatus 100B according to another embodiment of the present invention. The structure of the laser surface treatment device 100B is similar to that of the laser surface treatment device 100A. The difference is that the first driving mechanism 300 in the laser surface treatment device 100B may further include a moving carrier 308, a guide base 310, and a drive. Motor 312.

如第8圖所示,於此實施例中,移動承載件308是連接於第一座體304,並且第一驅動件306是配置以驅動移動承載件308沿著第一軌道3041移動,例如沿著所述第一方向(X軸方向)移動。再者,導引座310是固定地設置於移動承載件 308上,使得移動承載件308可帶動導引座310移動。其中,導引座310上可具有一導引軌道3101,沿著一第三方向(Y軸方向)延伸形成於導引座310上,並且驅動馬達312是配置以驅動第一移動件302沿著導引軌道3101移動。 As shown in FIG. 8, in this embodiment, the moving bearing 308 is connected to the first base 304, and the first driving member 306 is configured to drive the moving bearing 308 to move along the first track 3041, for example, along In the first direction (X-axis direction). Furthermore, the guide base 310 is fixedly disposed on the moving carrier. 308, so that the moving bearing 308 can drive the guide base 310 to move. The guide base 310 may have a guide track 3101 extending along the third direction (Y-axis direction) and formed on the guide base 310, and the driving motor 312 is configured to drive the first moving member 302 along The guide rail 3101 moves.

藉由本實施例之結構設計,雷射表面處理設備100B可驅使物體600沿著第一方向、第二方向以及第三方向移動,並且也可驅使物體600繞著X軸方向以及Z軸方向旋轉,因此雷射表面處理設備100B可更順暢地對物體600上的不同位置進行雷射表面處理。 With the structural design of this embodiment, the laser surface processing device 100B can drive the object 600 to move along the first direction, the second direction, and the third direction, and can also drive the object 600 to rotate around the X-axis direction and the Z-axis direction. Therefore, the laser surface treatment apparatus 100B can perform the laser surface treatment on different positions on the object 600 more smoothly.

請參考第9圖,第9圖為根據本發明一些實施例之雷射發射器200的元件示意圖。於此實施例中,雷射發射器200可包含一雷射光源204、一聚焦透鏡205、一第一鏡片模組206、一第二鏡片模組208以及一第三鏡片模組210。聚焦透鏡205是配置以將由雷射光源204發出的雷射光束集中。 Please refer to FIG. 9, which is a schematic diagram of components of a laser transmitter 200 according to some embodiments of the present invention. In this embodiment, the laser emitter 200 may include a laser light source 204, a focusing lens 205, a first lens module 206, a second lens module 208, and a third lens module 210. The focusing lens 205 is configured to focus a laser beam emitted from the laser light source 204.

再者,第一鏡片模組206具有一第一控制馬達2061以及一第一反射鏡2063,第二鏡片模組208具有一第二控制馬達2081以及一第二反射鏡2083。第一控制馬達2061與第二控制馬達2081是電性連接於前述之控制裝置106。當雷射光束202由聚焦透鏡205依序射向第一反射鏡2063與第二反射鏡2083時,第一控制馬達2061與第二控制馬達2081可分別控制第一反射鏡2063與第二反射鏡2083的轉動角度,藉以調整雷射光束202的前進方向,例如在雷射光束202的一可移動範圍RG內沿著一軌跡TC移動。 Furthermore, the first lens module 206 has a first control motor 2061 and a first reflector 2063, and the second lens module 208 has a second control motor 2081 and a second reflector 2083. The first control motor 2061 and the second control motor 2081 are electrically connected to the aforementioned control device 106. When the laser beam 202 is sequentially directed to the first mirror 2063 and the second mirror 2083 by the focusing lens 205, the first control motor 2061 and the second control motor 2081 can control the first mirror 2063 and the second mirror, respectively. The rotation angle of 2083 is used to adjust the forward direction of the laser beam 202, for example, it moves along a track TC within a movable range RG of the laser beam 202.

另外,第三鏡片模組210可包含一控制器2101以及 一透鏡2103。控制器2101例如可包含一馬達以及一線性軌道(圖中未表示),以控制透鏡2103沿著Y軸方向來回移動。藉由透鏡2103在Y軸方向的移動,可以調整雷射光束202的焦點在Z軸方向的位置。舉例來說,請參考第10圖,第10圖為根據本發明一些實施例之物體600的剖面示意圖。在使用雷射光束202對物體600打孔的過程中,控制裝置106可控制第三鏡片模組210,使得雷射光束202的焦點由第3圖中的焦點位置FC沿著-Z軸方向移動到第三表面606的位置。藉由這樣的操作,可使得穿孔H1在第一表面602的孔徑大小與在第三表面606的孔徑大小實質上維持一致,不會有孔徑大小不均的問題產生。 In addition, the third lens module 210 may include a controller 2101 and One lens 2103. The controller 2101 may include, for example, a motor and a linear track (not shown) to control the lens 2103 to move back and forth along the Y-axis direction. By moving the lens 2103 in the Y-axis direction, the position of the focal point of the laser beam 202 in the Z-axis direction can be adjusted. For example, please refer to FIG. 10, which is a schematic cross-sectional view of an object 600 according to some embodiments of the present invention. In the process of punching the object 600 using the laser beam 202, the control device 106 can control the third lens module 210 so that the focus of the laser beam 202 is moved from the focal position FC in FIG. 3 along the -Z axis direction To the third surface 606. With this operation, the pore size of the perforation H1 on the first surface 602 and the pore size on the third surface 606 can be maintained substantially the same, and the problem of uneven pore size will not occur.

綜上所述,本揭露提供一種雷射表面處理設備100,具有第一驅動機構300、第二驅動機構400與第三驅動機構500。藉由控制第一驅動機構300、第二驅動機構400與第三驅動機構500來移動並轉動待處理的物體,使得雷射光束202在雷射表面處理的過程中始終與物體的表面互相垂直,便可以得到所需的處理效果,例如在對不同表面進行雷射雕刻時,不同表面交界處的圖案可以維持連續而不會有斷開或拼接的痕跡產生。 In summary, the present disclosure provides a laser surface processing apparatus 100 having a first driving mechanism 300, a second driving mechanism 400, and a third driving mechanism 500. By controlling the first driving mechanism 300, the second driving mechanism 400, and the third driving mechanism 500 to move and rotate the object to be processed, the laser beam 202 is always perpendicular to the surface of the object during the laser surface treatment. The desired processing effect can be obtained, for example, when laser engraving on different surfaces, the patterns at the interface of different surfaces can be maintained continuously without the occurrence of disconnection or splicing marks.

基於本揭露雷射表面處理設備100之設計,在對物體的不同表面進行雷射表面處理時,不需要中斷處理過程來額外設置對應於物體形狀的治具(例如利用治具調整物體的待處理表面使雷射光束202與待處理表面垂直),因此不僅可以減少雷射表面處理的步驟,更可以縮短整體處理的時間。再者,雷射發射器200中可設置有多個鏡片模組,可進一步調整雷射 光束202的前進方向與其焦點位置,以進一步縮短雷射表面處理的時間,並可進一步改善雷射表面處理的效果。 Based on the design of the laser surface treatment device 100 disclosed in this disclosure, when performing laser surface treatment on different surfaces of an object, there is no need to interrupt the processing process to additionally set a jig corresponding to the shape of the object (for example, use the jig to adjust the object to be processed) The surface makes the laser beam 202 perpendicular to the surface to be processed), so not only the steps of laser surface processing can be reduced, but also the overall processing time can be shortened. Furthermore, the laser transmitter 200 may be provided with a plurality of lens modules, which can further adjust the laser. The advancing direction of the light beam 202 and its focal position can further shorten the laser surface treatment time, and can further improve the effect of the laser surface treatment.

雖然本揭露的實施例及其優點已揭露如上,但應該瞭解的是,任何所屬技術領域中具有通常知識者,在不脫離本揭露之精神和範圍內,當可作更動、替代與潤飾。此外,本揭露之保護範圍並未侷限於說明書內所述特定實施例中的製程、機器、製造、物質組成、裝置、方法及步驟,任何所屬技術領域中具有通常知識者可從本揭露揭示內容中理解現行或未來所發展出的製程、機器、製造、物質組成、裝置、方法及步驟,只要可以在此處所述實施例中實施大抵相同功能或獲得大抵相同結果皆可根據本揭露使用。因此,本揭露之保護範圍包括上述製程、機器、製造、物質組成、裝置、方法及步驟。另外,每一申請專利範圍構成個別的實施例,且本揭露之保護範圍也包括各個申請專利範圍及實施例的組合。 Although the embodiments and advantages of this disclosure have been disclosed as above, it should be understood that anyone with ordinary knowledge in the technical field can make changes, substitutions, and decorations without departing from the spirit and scope of this disclosure. In addition, the scope of protection of this disclosure is not limited to the processes, machines, manufacturing, material composition, devices, methods and steps in the specific embodiments described in the description. Any person with ordinary knowledge in the technical field to which this disclosure pertains may disclose content from this disclosure To understand the current or future development of processes, machines, manufacturing, material composition, devices, methods and steps, as long as they can implement substantially the same functions or achieve approximately the same results in the embodiments described herein, they can be used according to this disclosure. Therefore, the scope of protection of this disclosure includes the aforementioned processes, machines, manufacturing, material composition, devices, methods and steps. In addition, each patent application scope constitutes a separate embodiment, and the protection scope of this disclosure also includes a combination of each patent application scope and embodiment.

Claims (12)

一種雷射表面處理設備,包含:一第一移動件;一第一驅動機構,配置以驅動該第一移動件沿著一第一方向移動;一第二移動件;一第二驅動機構,設置於該第一移動件上,配置以驅動該第二移動件沿著一第二方向移動:一承載件,配置以承載一物體;一第三驅動機構,設置於該第二移動件上,配置以驅動該承載件與該物體繞一旋轉軸旋轉;以及一雷射發射器,配置以發出一雷射光束,以於該物體沿著該第一方向移動、沿著該第二方向移動或繞該旋轉軸轉動時對該物體進行雷射表面處理。A laser surface treatment equipment includes: a first moving member; a first driving mechanism configured to drive the first moving member to move in a first direction; a second moving member; a second driving mechanism, provided On the first moving member, configured to drive the second moving member to move in a second direction: a bearing member configured to carry an object; a third driving mechanism is provided on the second moving member, configured To drive the carrier and the object to rotate about a rotation axis; and a laser transmitter configured to emit a laser beam so that the object moves along the first direction, moves along the second direction, or around The object is subjected to laser surface treatment when the rotation axis is rotated. 如申請專利範圍第1項所述之雷射表面處理設備,其中該雷射發射器發射垂直於該物體的一第一表面之該雷射光束至該物體,以對該第一表面進行一第一雷射表面處理,該雷射發射器係於該物體旋轉後發射垂直於該物體之一第二表面之該雷射光束至該物體,以對該第二表面進行一第二雷射表面處理,並且該第一表面不平行於該第二表面。The laser surface treatment device according to item 1 of the patent application scope, wherein the laser emitter emits the laser beam perpendicular to a first surface of the object to the object to perform a first A laser surface treatment. The laser emitter emits the laser beam perpendicular to a second surface of the object to the object after the object rotates to perform a second laser surface treatment on the second surface. And the first surface is not parallel to the second surface. 如申請專利範圍第2項所述之雷射表面處理設備,其中該物體更具有一第三表面,該第一表面大致平行於該第三表面,並且該雷射光束的焦點設置於該第一表面與該第三表面之間的一中間位置。The laser surface treatment device according to item 2 of the scope of patent application, wherein the object further has a third surface, the first surface is substantially parallel to the third surface, and the focal point of the laser beam is set at the first An intermediate position between the surface and the third surface. 如申請專利範圍第3項所述之雷射表面處理設備,其中該雷射光束係配置以使該物體上形成複數個穿孔,並且每一穿孔貫穿該第一表面與該第三表面。The laser surface treatment device according to item 3 of the patent application scope, wherein the laser beam is configured to form a plurality of perforations on the object, and each perforation penetrates the first surface and the third surface. 如申請專利範圍第1項所述之雷射表面處理設備,其中該物體具有一管狀結構,並且該雷射發射器配置以於該第三驅動機構旋轉該承載件與該物體時發出大致上垂直於該物體之一側面之該雷射光束,以對該物體之該側面進行雷射表面處理。The laser surface treatment device according to item 1 of the patent application scope, wherein the object has a tubular structure, and the laser emitter is configured to emit substantially perpendicularly when the third driving mechanism rotates the carrier and the object The laser beam on one side of the object to perform laser surface treatment on the side of the object. 如申請專利範圍第1項所述之雷射表面處理設備,其中該第一驅動機構更包含:一第一座體,具有沿著該第一方向延伸之一第一軌道;以及一第一驅動件,配置以驅動該第一移動件沿著該第一軌道移動。The laser surface treatment equipment according to item 1 of the scope of patent application, wherein the first driving mechanism further comprises: a first base body having a first track extending along the first direction; and a first drive Component configured to drive the first moving component to move along the first track. 如申請專利範圍第6項所述之雷射表面處理設備,其中該第二驅動機構更包含:一第二座體,具有沿著該第二方向延伸之一第二軌道;以及一第二驅動件,配置以驅動該第二移動件沿著該第二軌道移動。The laser surface treatment equipment according to item 6 of the patent application scope, wherein the second driving mechanism further comprises: a second base body having a second track extending along the second direction; and a second drive Component, configured to drive the second moving component to move along the second track. 如申請專利範圍第7項所述之雷射表面處理設備,其中該第三驅動機構更包含:一第三座體;一轉動件,連接於該承載件,並且該轉動件以可旋轉之方式連接於該第三座體;以及一第三驅動件,配置以驅動該轉動件相對於該第三座體繞該旋轉軸旋轉。According to the laser surface treatment equipment described in item 7 of the patent application scope, the third driving mechanism further includes: a third base body; a rotating member connected to the bearing member, and the rotating member is rotatable. Connected to the third base; and a third driving member configured to drive the rotating member to rotate about the rotation axis relative to the third base. 如申請專利範圍第1項所述之雷射表面處理設備,其中該雷射發射器更包含一第一鏡片模組、一第二鏡片模組以及一第三鏡片模組,配置以控制該雷射光束的方向以及一焦點位置。The laser surface treatment equipment as described in the first item of the patent application scope, wherein the laser emitter further comprises a first lens module, a second lens module and a third lens module, configured to control the laser The direction of the beam and a focal position. 如申請專利範圍第1項所述之雷射表面處理設備,其中該第一方向實質上垂直於該第二方向,並且該第一方向實質地平行於該旋轉軸。The laser surface treatment apparatus according to item 1 of the scope of patent application, wherein the first direction is substantially perpendicular to the second direction, and the first direction is substantially parallel to the rotation axis. 如申請專利範圍第1項所述之雷射表面處理設備,其中該雷射表面處理設備更包含一旋轉驅動件,並且該承載件包含:一底座,該旋轉驅動件設置於該底座上;以及一承載部,配置以承載該物體;其中該旋轉驅動件設置於該底座與該承載部之間,配置以驅動該承載部與該物體繞一轉軸旋轉,並且該轉軸實質地平行於該第二方向。The laser surface treatment device according to item 1 of the scope of the patent application, wherein the laser surface treatment device further includes a rotation driving member, and the carrier includes: a base, the rotation driving member is disposed on the base; and A bearing portion configured to carry the object; wherein the rotation driving member is disposed between the base and the bearing portion and configured to drive the bearing portion and the object to rotate about a rotation axis, and the rotation axis is substantially parallel to the second direction. 如申請專利範圍第11項所述之雷射表面處理設備,其中該第一驅動機構更包含:一移動承載件;一第一座體,具有沿著該第一方向延伸之一第一軌道;一第一驅動件,配置以驅動該移動承載件沿著該第一軌道移動;一導引座,設置於該移動承載件上,該導引座具有沿著一第三方向延伸之一導引軌道;以及一驅動馬達,配置以驅動該第一移動件沿著該導引軌道移動。The laser surface treatment equipment according to item 11 of the scope of patent application, wherein the first driving mechanism further comprises: a moving carrier; a first base body having a first track extending along the first direction; A first driving member is configured to drive the moving carrier to move along the first track; a guide seat is disposed on the moving carrier, and the guide seat has a guide extending along a third direction. A track; and a drive motor configured to drive the first moving member to move along the guide track.
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