TWI663291B - 用於銀奈米線的蝕刻劑組合物 - Google Patents

用於銀奈米線的蝕刻劑組合物 Download PDF

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Publication number
TWI663291B
TWI663291B TW104131148A TW104131148A TWI663291B TW I663291 B TWI663291 B TW I663291B TW 104131148 A TW104131148 A TW 104131148A TW 104131148 A TW104131148 A TW 104131148A TW I663291 B TWI663291 B TW I663291B
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TW
Taiwan
Prior art keywords
etchant composition
silver nanowires
weight
etching
protective coating
Prior art date
Application number
TW104131148A
Other languages
English (en)
Chinese (zh)
Other versions
TW201621087A (zh
Inventor
權玟廷
沈慶輔
勳
Original Assignee
南韓商東友精細化工有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 南韓商東友精細化工有限公司 filed Critical 南韓商東友精細化工有限公司
Publication of TW201621087A publication Critical patent/TW201621087A/zh
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Publication of TWI663291B publication Critical patent/TWI663291B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/30—Acidic compositions for etching other metallic material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K13/00—Etching, surface-brightening or pickling compositions
    • C09K13/04—Etching, surface-brightening or pickling compositions containing an inorganic acid
    • C09K13/08—Etching, surface-brightening or pickling compositions containing an inorganic acid containing a fluorine compound

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Inorganic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)
TW104131148A 2014-09-30 2015-09-21 用於銀奈米線的蝕刻劑組合物 TWI663291B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020140130711A KR102254561B1 (ko) 2014-09-30 2014-09-30 은 나노 와이어의 식각액 조성물
??10-2014-0130711 2014-09-30

Publications (2)

Publication Number Publication Date
TW201621087A TW201621087A (zh) 2016-06-16
TWI663291B true TWI663291B (zh) 2019-06-21

Family

ID=55601610

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104131148A TWI663291B (zh) 2014-09-30 2015-09-21 用於銀奈米線的蝕刻劑組合物

Country Status (3)

Country Link
KR (1) KR102254561B1 (ko)
CN (1) CN105463462B (ko)
TW (1) TWI663291B (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107452615B (zh) * 2017-08-14 2019-11-05 通威太阳能（安徽）有限公司 一种电池片湿法刻蚀液
CN109135752A (zh) * 2018-09-21 2019-01-04 湖北兴福电子材料有限公司 一种磷酸基蚀刻液及其配制方法
CN109439329A (zh) * 2018-10-29 2019-03-08 苏州博洋化学股份有限公司 平板显示阵列制程用新型igzo蚀刻液

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102597162A (zh) * 2009-10-30 2012-07-18 东友Fine-Chem股份有限公司 蚀刻液组合物
KR20140011840A (ko) * 2012-07-20 2014-01-29 서종현 식각액 조성물, 및 다중금속막 식각 방법

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101323458B1 (ko) 2007-06-15 2013-10-29 동우 화인켐 주식회사 은 식각액 조성물
EP2587564A1 (en) * 2011-10-27 2013-05-01 Merck Patent GmbH Selective etching of a matrix comprising silver nanowires or carbon nanotubes
KR101925305B1 (ko) * 2011-12-28 2018-12-05 엘지이노텍 주식회사 금속 나노 입자를 함유한 전도성 고분자 전극 형성 방법 및 에칭액
CN102634805B (zh) * 2012-05-04 2014-03-19 西南大学 一种表面具有超疏水膜层的镁合金的制备方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102597162A (zh) * 2009-10-30 2012-07-18 东友Fine-Chem股份有限公司 蚀刻液组合物
KR20140011840A (ko) * 2012-07-20 2014-01-29 서종현 식각액 조성물, 및 다중금속막 식각 방법

Also Published As

Publication number Publication date
KR20160038236A (ko) 2016-04-07
KR102254561B1 (ko) 2021-05-21
CN105463462B (zh) 2019-01-15
TW201621087A (zh) 2016-06-16
CN105463462A (zh) 2016-04-06

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