TWI663019B - Grinders for non-horizontal grinding surfaces - Google Patents

Abstract

A grinding machine applied to a non-horizontal grinding surface. A deformation device is provided between a grinding power source and a grinding pad driven by the grinding power source. Through the deformation device, deformation is independently provided on either side of the grinding pad. A set of offset units and deformation parts at an included angle, so that any side of the polishing pad can independently adapt to various non-horizontal polishing surfaces through the angle of change of the deformation included angle, especially for continuous and irregular non-horizontal polishing surfaces. The invention has better grinding efficiency.

Description

Grinders for non-horizontal grinding surfaces

The invention relates to a grinder applied to a non-horizontal polishing surface, and in particular to a grinder which achieves that the polishing pad can still effectively adhere to a polishing stroke in response to a continuous irregular non-horizontal polishing surface.

Relevant technologies applied to polishing non-horizontal polished surfaces such as concave or convex surfaces have been disclosed in CN 101743096A, CN 103231320A, GB 680866A, JP-A 5-329762, JP-A 8-11046, JP-A 2000-117609, JP JP 2001-113453, JP 2009-233810, US5947803, US9833871 and other patents.

Based on the above-mentioned patents, the grinding machine applied to non-horizontal polishing surfaces is mainly connected to a receiving plate through a driving unit, and the receiving plate and the polishing pad are connected by a deformation member on both sides, in the initial state or the polishing surface is horizontal. Below, the polishing pad and the receiving plate are in a horizontal state and the deformed parts are not deformed. When the user grinds a non-horizontal polishing surface, the center line of the polishing pad is used as the axis, and the sides of the polishing pad will follow the arc of the non-horizontal polishing surface Relative to the axis, the deformation state of the deformation member is relatively shifted, and the non-horizontal polishing surface is adhered and polished.

The deformed parts of the patents listed above, whether they adopt the lever shaft connection method or the design of elastic elements such as springs, have only a single deformation state between the polishing pad and the receiving plate and the deformation degree is limited, resulting in a large polishing pad. In radians, it is actually impossible to achieve an effective fit to the grinding surface for grinding operations. In addition, the previous technology used a lever shaft connection method such as that disclosed in US9833871. In order to maintain the receiving plate to maintain a relatively horizontal state with the polishing pad, the deformation parts on both sides must be At the same time, a deformed state is generated. However, in practice, non-horizontal polished surfaces cannot provide corresponding The same radian on both sides of the polishing pad, especially on the continuous uneven wavy non-horizontal polishing surface, this type of grinder will be unable to effectively adapt to the changes of the non-horizontal polishing surface to perform the polishing operation.

The main purpose of the present invention is to solve the problem that the conventional technology fails to effectively conform to the grinding stroke due to continuous and irregular non-horizontal grinding surfaces.

To achieve the above object, the present invention provides a grinding machine applied to a non-horizontal polishing surface. A deformation device is provided between a grinding power source and a grinding pad driven by the grinding power source. The deformation device is provided with at least one receiving unit. The grinding power source defines a receiving unit of a reference horizontal line, and a set of offset units, a first deformation element, and a first deformation angle and a second deformation angle are independently provided on either side of the polishing pad through the deformation device. The second deforming piece allows each side of the polishing pad to independently conform to various non-horizontal polishing surfaces through one or a combination of the first and second deformation angles, especially for continuous irregular non-horizontal polishing surfaces. , So that the receiving unit of the present invention can still maintain the reference horizontal line in the grinding operation and has better grinding efficiency.

In one embodiment, two opposite second deformation members and a first deformation member disposed at the center of the second relative second deformation members are presented to assist the polishing pad to generate a deformed state in response to the non-horizontal polishing surface.

In one embodiment, two sets of second deforming members opposite to each other and disposed at four ends of the offset unit and two first deforming members disposed centrally relative to the second deforming member are presented to assist the polishing pad in response to non-horizontal polishing The surface is deformed.

In one embodiment, it is shown that the grinding power source is manual, and the receiving unit includes a cover to assist external force application, and further includes a covering portion extending to the grinding pad to have an opening for connecting an external dust collector.

In one embodiment, the power source for grinding is one of an electric grinder or a pneumatic grinder, and the power grinder is provided with a power shaft connected to the polishing pad for grinding stroke.

10, 50‧‧‧ grinding power source

51‧‧‧ Power shaft

20‧‧‧ Deformation device

21, 21a‧‧‧ Undertake unit

211‧‧‧Covered

212‧‧‧Cover

213‧‧‧ opening

22‧‧‧ Offset Unit

23, 23a‧‧‧First deformation

231‧‧‧central deformation section

232, 233‧‧‧ fixed section

24, 24a‧‧‧Second Deformation

241‧‧‧central deformation section

242, 243‧‧‧Fixed sections

30‧‧‧ Abrasive pad

R1, R3‧‧‧‧First deformation angle

R2, R4‧‧‧‧Second deformation angle

FIG. 1 is a schematic cross-sectional view of an initial state of an embodiment of the present invention.

FIG. 2 is an exploded view of either side of the deformation device according to an embodiment of the present invention.

FIG. 3-1 is a schematic diagram (a) of a deformed state where a non-horizontal grinding surface is a concave surface according to an embodiment of the present invention.

FIG. 3-2 is a schematic diagram of a deformed state where a non-horizontal grinding surface is concave according to an embodiment of the present invention (2).

FIG. 4-1 is a schematic diagram (a) of a deformation state of a non-horizontal grinding surface with a convex surface according to an embodiment of the present invention.

FIG. 4-2 is a schematic view of a deformed state where the non-horizontal grinding surface is convex according to an embodiment of the present invention (2).

FIG. 5 is a schematic diagram of a deformed state where a non-horizontal polishing surface is an uneven surface according to an embodiment of the present invention.

FIG. 6 is a schematic cross-sectional view of an embodiment of the present invention applied to a power grinder.

FIG. 7 is an exploded view of an embodiment of the present invention applied to a manual grinder.

FIG. 8 is a schematic diagram of the appearance of an embodiment of the present invention applied to a manual grinder.

The detailed description and technical contents of the present invention are described below with reference to the drawings: Please refer to FIGS. 1 to 2. The present invention provides a grinding machine for non-horizontal grinding surfaces, which includes a grinding power source 10 and a grinding power source. Source 10 drives against a non-horizontal abrasive surface A polishing pad 30 that performs a polishing stroke. The polishing pad 30 is made of an elastic material capable of generating a deformed state according to a non-horizontal polishing surface. The polishing pad 30 can be distinguished into a flexible metal layer and a rubber from top to bottom. Compressive layer made of flexible material such as sponge or sponge and a deformable soft abrasive layer. The abrasive pad 30 that can produce a deformed state is a well-known technology and has a variety of implementation forms, because it is not a technical limitation of this description. Embodiments of other polishing pads 30 will not be described in detail, and will be described together.

In the present invention, a deformation device 20 is provided between the grinding power source 10 and the elastic grinding pad 30. The deformation device 20 is provided between the grinding power source 10 and the grinding pad 30. The deformation device 20 is provided with at least one receiving unit. Grinding the power source 10 and defining a reference horizontal line receiving unit 21 and two offset units 22 respectively installed on two sides of the receiving unit 21 and interposed between the polishing pads 30, each of the offset unit 22 and the offset unit 22 At least one first deforming member 23 is connected between the receiving units 21, and at least two second deforming members 24 are disposed oppositely between each of the offset units 22 and the polishing pad 30, so that the polishing pad 30 can be used as When the deformation state is generated when the polishing stroke is performed on a non-horizontal polishing surface on one side, the offset unit 22 corresponding to any side of the polishing pad 30 is independently formed by the first deformation member 23 relative to the reference horizontal line of the receiving unit 21. The first deformation included angle R1, and either side of the polishing pad 30 allows the second deformation component 24 to form a second deformation included angle R2 relative to the reference horizontal line of the receiving unit 21. As shown in FIG. 1, the second deformation component 24 and the first deformation member 23 are staggered The arrangement form, and the first deforming member 23 and the second deforming member 24 include fixed ends 232, 233, 242, and 243 at both ends and a central deformed section 231, 241. The fixed sections 232 of the first deforming member 23, 233 is used to connect the receiving unit 21 and the offset unit 22, and the fixed sections 242, 243 of the second deformation member 24 are used to connect the offset unit 22 and the polishing pad 30, wherein the first deformation member 23 And the second deforming member 24 may be one of a spring, a spring sheet, or rubber.

In order to facilitate understanding of the deformation and actuation state of the present invention, a spring will be used as the first deformation element 23 and the second deformation element 24 in the embodiment. Please refer to FIGS. 1 and 2 in the initial state or when When a user performs a polishing operation on a horizontal polishing surface, the receiving unit 21 and the polishing pad 30 are relatively horizontal, and the offset unit 22 and the receiving unit 21 may also be relatively horizontal.

Please refer to FIGS. 3-1 and 3-2, which are schematic diagrams of the deformed state of a concave surface on a non-horizontal polishing surface of the present invention. When a user manually applies a force to the grinding power source 10 to the receiving unit 21, the polishing pad 30 is provided on a curved polishing surface. During polishing, in order to make the two sides of the polishing pad 30 conform to the curvature of the curved surface, a deformation state is generated. At this time, the external force applied from the polishing power source 10 and the feedback force on both sides of the polishing pad 30 will promote the first A deformation piece 23 and a central deformation section 231, 241 of the second deformation piece 24 are deformed. The deformation manner of the central deformation section 231, 241 varies according to different materials, including but not limited to the central deformation section 231, 241. Either one of compression or bending, or a combination, at this time, when the central deforming section 231 of the first deforming member 23 is deformed, the offset unit 22 connected to the other fixed sections 232 and 233 is connected to the central deforming section 231. The amount of deformation allows the offset unit 22 to form a first deformation included angle R1 with respect to the reference horizontal line defined by the receiving unit 21, and either side of the polishing pad 30 can also receive the deformation of the second deformation member 24 relative to the receiving Unit 2 The reference horizontal line of 1 forms a second deformation included angle R2, and the relative change values of the first deformation included angle R1 and the second deformation included angle R2 constitute the deformation state of the polishing pad 30, so that the polishing pad 30 can effectively fit the drawing Surface shape of 3-1. For the same application, please refer to FIGS. 4-1 and 4-2. In a state where the polishing surface is convex, either side of the polishing pad 30 is also formed by the deformation of the second deformation member 24 relative to the reference horizontal line of the receiving unit 21. A second deformation included angle R4, and the offset unit 22 forms a first deformation included angle R3 relative to the reference horizontal line defined by the receiving unit 21, and the relative changes of the first deformation included angle R3 and the second deformation included angle R4 The deformed state of the polishing pad 30 is configured, so that the polishing pad 30 can effectively conform to the convex shape of FIG. 4-1.

Please refer to FIG. 5, when the polishing pad 30 changes the arc position of different curved surfaces during the grinding stroke, the deformations of the first deformation member 23 and the second deformation member 24 will change accordingly, and the lamination pad 30 does not fit properly. In the state of the same curved surface or convex radian, the first deformation included angle R1, R3 and the second deformation included angle R2, R4 will be a change angle or a combination angle thereof. Moreover, since the present invention is independently provided on the two sides of the polishing pad 30 Each set of the offset unit 22, the first deformation member 23, and the second deformation member 24, so that both sides of the polishing pad 30 can independently use the changes in the first deformation included angle R1, R3 and the second deformation included angle R2, R4 The angle corresponds to the non-horizontal polishing surface, which is very important for the irregular and continuous non-horizontal polishing surface shown in Figure 5. When the polishing surface equivalent to the area of the polishing pad 30 has both convex and curved surfaces, Since the two sides of the polishing pad 30 of the present invention can be deformed independently by using the deformation device 20 without interlocking, it can be achieved that the polishing surface is maintained in a deformed state with different radians on the two sides of the polishing pad 30, as shown in Figure 5, the polishing pad When the polishing surface on one side is convex and the polishing surface on the other side is concave, the polishing pad 30 of the present invention can still maintain the independent deformation state of each side of the polishing pad 30 against the polishing surface. Grinding stroke.

Please refer to FIG. 6. The grinding power source 50 of the present invention can also be applied as a power grinding machine of an electric grinding machine or a pneumatic grinding machine. The power grinding machine has a power shaft 51 connected to the grinding pad 30. And using the power grinding machine as the grinding power source 50 to drive the grinding pad 30 with the power shaft 51 to perform a linear or eccentric trajectory grinding stroke.

Please refer to FIG. 7 and FIG. 8, the polishing pad 30 of the present invention is generally rectangular in shape according to the general embodiment. However, based on the size of the polishing pad 30, compared with the first deformation member 23 a and the second deformation member 24 a, The number of sets is also different. For example, if the polishing pad 30 has a larger size, it needs a finer and more stable deformation balance during the grinding stroke. At this time, the first deformation member 23a may be provided in two or more relative settings. It is better that the first deformation members 23a are two sets of relative configuration, and the two sets of the second deformation members 24a are respectively disposed at the four ends of the offset unit 22, and each of the first deformation members is maintained in the vertical line arrangement. 23a is arranged at the center of the second and second deformation members 24a. It is best to stagger the arrangement. In addition, according to different deformation states of different grinding surfaces, the first deformation member of the present invention The deformation amount of the central deformation section 231 of 23a may be greater than or equal to the deformation amount of the central deformation section 241 of the second deformation member 24a.

In order to facilitate the operation of the present invention, the receiving unit 21 may be rectangular in shape with the polishing pad 30, and the grinding power source 10 may be determined at a central position or a two-sided position according to the size of the polishing pad 30. FIG. 8 further discloses the receiving The unit 21a includes a covering portion 211 extending to the polishing pad 30, and the receiving unit 21a further includes a cover 212 covering the receiving unit 21a and the covering portion 211 to assist the external force and apply a force to the covering portion 211. And, the cover 212 may further be provided with an opening 213 to be connected to an external dust remover (not shown in the figure) to perform a grinding stroke on the polishing pad 30 while removing internal dust.

To sum up, through the deformation device 20 installed between the polishing power sources 10, 50 and the polishing pad 30 according to the present invention, since one set of the polishing pad 30 is independently provided between the polishing pad 30 and the receiving unit 21, 21a The offset unit 22, the first deformation pieces 23, 23a, and the second deformation pieces 24, 24a. Therefore, the change angle of the first deformation included angle R1 and the second deformed included angle R2 can be independently generated on either side of the polishing pad 30. To correspondingly fit various non-horizontal abrasive surfaces, especially for continuous irregular non-horizontal abrasive surfaces, the present invention will have a better and more effective grinding efficiency than the conventional technology.

The present invention has been described in detail above, but the above is only a preferred embodiment of the present invention. When the scope of implementation of the present invention cannot be limited by this, that is, all equality made according to the scope of patent application of the present invention Changes and modifications should still be covered by the patent of the present invention.

Claims (16)

A grinding machine applied to a non-horizontal grinding surface includes a grinding power source and a grinding pad driven by the grinding power source to perform a grinding stroke on a non-horizontal grinding surface. The grinding pad is a non-horizontal grinding surface. An elastic material composition that generates a deformation state; a deformation device is disposed between the grinding power source and the grinding pad, and the deformation device is provided with at least a receiving unit for receiving the grinding power source and defining a reference horizontal line, and two separate installations An offset unit disposed on two sides of the receiving unit and interposed between the polishing pads, at least one first deformation member is connected between each of the offset unit and the receiving unit, and each of the offset unit and the At least two second deforming members are arranged in a relative arrangement between the polishing pads, so that the polishing stroke is performed on any side of the polishing pad on a non-horizontal polishing surface, and the deformation state corresponding to either side of the polishing pad is caused. The moving unit independently forms a first deformation angle with the first deformation piece relative to the reference horizontal line of the receiving unit, and either side of the polishing pad is phased by the second deformation piece. The reference level of the receiving unit to form a second deformation angle. The grinding machine applied to a non-horizontal grinding surface as described in claim 1, wherein the second deformation member is preferably arranged in two groups. The grinding machine applied to a non-horizontal grinding surface as described in claim 2, wherein it is best that two sets of the second deformation members are respectively disposed at four ends of the offset unit. The grinding machine applied to a non-horizontal polishing surface as described in claim 1 or 2 or 3, wherein the first deformation member is disposed at a single central position relative to the second and second deformation members. The grinding machine applied to a non-horizontal grinding surface as described in claim 1 or 2 or 3, wherein the first deformation member is preferably two relative settings. The grinding machine applied to a non-horizontal polishing surface as described in claim 5, wherein each of the first deformation members is preferably disposed at a center position relative to the two second deformation members. The grinding machine applied to a non-horizontal grinding surface as described in claim 1, wherein the first deformation part and the second deformation part include a fixed end section and a central deformation section. The grinder applied to a non-horizontal polishing surface according to claim 7, wherein a deformation amount of a central deformation section of the first deformation member is greater than or equal to a deformation amount of a central deformation section of the second deformation member. The grinding machine applied to a non-horizontal grinding surface as described in claim 1 or 7 or 8, wherein the first deformation member and the second deformation member may be one of a spring, an elastic piece, or rubber. The polishing machine applied to a non-horizontal polishing surface as described in claim 1, wherein the receiving unit is equal to the shape of the polishing pad. The polishing machine applied to a non-horizontal polishing surface according to claim 10, wherein the receiving unit further includes a covering portion extending to the polishing pad. The grinder applied to a non-horizontal polishing surface according to claim 11, wherein the covering portion is provided with an opening to be connected to an external dust collector. The grinding machine applied to a non-horizontal grinding surface as described in claim 1, wherein the grinding power source is a manual external force directly applied to the receiving unit. The grinder applied to a non-horizontal polishing surface as described in claim 13, wherein the exterior of the receiving unit further includes a cover to assist external force application. The grinding machine applied to a non-horizontal grinding surface according to claim 1, wherein the grinding power source may be a power grinding machine, and the power grinding machine is provided with a power shaft connected to the grinding pad. The grinding machine applied to a non-horizontal grinding surface according to claim 15, wherein the power grinding machine may be one of an electric grinding machine or a pneumatic grinding machine.