CN110712117B - Grinder applied to non-horizontal grinding surface - Google Patents

Grinder applied to non-horizontal grinding surface Download PDF

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Publication number
CN110712117B
CN110712117B CN201810762497.9A CN201810762497A CN110712117B CN 110712117 B CN110712117 B CN 110712117B CN 201810762497 A CN201810762497 A CN 201810762497A CN 110712117 B CN110712117 B CN 110712117B
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deformation
grinding
grinder
horizontal
polishing
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CN110712117A (en
Inventor
陈邦和
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Ding Peng Enterprise Co ltd
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Ding Peng Enterprise Co ltd
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Priority to CN201810762497.9A priority Critical patent/CN110712117B/en
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B23/00Portable grinding machines, e.g. hand-guided; Accessories therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/11Lapping tools
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00Component parts such as frames, beds, carriages, headstocks
    • B24B41/04Headstocks; Working-spindles; Features relating thereto

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

A deformation device is arranged between a grinding power source and a grinding pad driven by the grinding power source, and a group of offset units and deformation pieces which generate deformation included angles are independently arranged on any side of the grinding pad through the deformation device, so that any side of the grinding pad can be correspondingly attached to various non-horizontal grinding surfaces independently through the change angles of the deformation included angles, and particularly, the grinding machine has good grinding benefit aiming at continuous irregular non-horizontal grinding surfaces.

Description

Grinder applied to non-horizontal grinding surface
Technical Field
The present invention relates to a polishing machine for non-horizontal polishing surfaces, and more particularly, to a polishing machine capable of effectively bonding a polishing pad to a non-horizontal polishing surface for a polishing process.
Background
Related art for grinding non-horizontal grinding surfaces such as concave or convex surfaces is disclosed in patents CN 101743096A, CN 103231320A, GB 680866A, JP, Japanese patent application laid-open Nos. Hei 5-329762, JP 8-11046, JP 2000-A117609, JP 2001-A113453, JP 2009-A233810, US5947803, US9833871, etc.
The grinding machine applied to the non-horizontal grinding surface is mainly connected to a bearing plate through a driving unit, the two sides of the bearing plate and the grinding pad are respectively connected through a deformation piece, the grinding pad and the bearing plate are in a horizontal state and the deformation piece does not generate a deformation state under an initial state or a horizontal state of the grinding surface, when a user grinds the non-horizontal grinding surface, the central line of the grinding pad is taken as an axis, and the two sides of the grinding pad are relatively deviated along the radian of the non-horizontal grinding surface relative to the axis through the deformation state of the deformation piece to be attached to the non-horizontal grinding surface for grinding.
The deformable members of the above patents, whether they are designed by lever-coupling or elastic elements such as springs, have only a single deformation state between the polishing pad and the receiving plate and have a limited degree of deformation, so that the polishing pad can not be effectively attached to the polishing surface for polishing at a large arc, and in addition, the prior art uses the lever-coupling method such as the one disclosed in US9833871, in order to maintain the receiving plate in a horizontal state relative to the polishing pad, the deformable members at both sides must be deformed at the same time, however, in practice, the non-horizontal polishing surface cannot provide the same arc corresponding to both sides of the polishing pad, especially on the continuous concave-convex wavy non-horizontal polishing surface, such a polishing machine cannot effectively conform to the change of the non-horizontal polishing surface for polishing.
Disclosure of Invention
The main objective of the present invention is to solve the problem that the prior art cannot effectively bond the non-horizontal polishing surfaces for the polishing process due to the continuous and irregular surfaces.
In order to achieve the above objects, the present invention provides a polishing machine for non-horizontal polishing surfaces, wherein a deformation device is disposed between a polishing power source and a polishing pad driven by the polishing power source, the deformation device at least comprises a receiving unit for receiving the polishing power source and defining a reference horizontal line, and a set of offset units, a first deformation element and a second deformation element for generating a first deformation angle and a second deformation angle are independently disposed on either side of the polishing pad through the deformation device, such that either side of the polishing pad can be independently attached to various non-horizontal polishing surfaces through one or a combination of the first and second deformation angles, and particularly, for continuous and irregular non-horizontal polishing surfaces, the receiving unit of the present invention can maintain the reference horizontal line during the polishing operation and provide good polishing benefits.
In one embodiment, two relative second deformation members and a first deformation member disposed at a central position relative to the two second deformation members are present to assist the polishing pad in generating a deformation state in response to the non-horizontal polishing surface.
In one embodiment, two sets of second deformation members opposite to each other and respectively disposed at four end points of the offset unit and two sets of first deformation members disposed at a central position of the second deformation members are present to assist the polishing pad in generating a deformation state in response to the non-horizontal polishing surface.
In one embodiment, the polishing power source is manual, and the receiving unit includes a housing for assisting external force application, and further includes an opening extending to the covering portion of the polishing pad for connecting to an external dust remover.
In one embodiment, the power source is a power grinder, which is one of an electric grinder and a pneumatic grinder, and the power grinder has a power shaft connected to the polishing pad for performing a polishing process.
Compared with the prior art, the invention has the following characteristics: any side of the grinding pad can be correspondingly attached to various non-horizontal grinding surfaces independently through the change angle of the deformation included angle, and particularly, the grinding pad is used for continuously and irregularly grinding the non-horizontal grinding surfaces.
Drawings
Fig. 1 is a schematic cross-sectional view of an initial state according to an embodiment of the present invention.
FIG. 2 is an exploded view of any side of the deformation apparatus according to an embodiment of the present invention.
FIG. 3-1 is a schematic view (one) of the deformed state in which the non-horizontal polishing surface is concave according to an embodiment of the present invention.
Fig. 3-2 schematically illustrate a deformed state in which the non-horizontal polishing surface is concave according to an embodiment of the present invention (ii).
FIG. 4-1 is a schematic view showing a deformed state in which a non-horizontal polishing surface is convex according to an embodiment of the present invention.
Fig. 4-2 is a schematic diagram showing a deformed state in which the non-horizontal polishing surface is convex according to an embodiment of the present invention (ii).
Fig. 5 is a schematic diagram illustrating a deformation state of a concave-convex surface on a non-horizontal polishing surface according to an embodiment of the present invention.
Fig. 6 is a schematic cross-sectional view of a power grinder according to an embodiment of the present invention.
Fig. 7 is an exploded view of a hand grinder according to an embodiment of the present invention.
Fig. 8 is a schematic view of an external appearance of a hand grinder according to an embodiment of the present invention.
Wherein the reference numerals are:
10. a
.
.
21. 21a
211
A
The opening is used as a
.
23. A
.
232. 233
24. A
The 241
242. A 243
.
R1, R3
R2, R4
Detailed Description
The present invention is described in detail and technical content with reference to the accompanying drawings, wherein:
referring to fig. 1 to 2, the present invention provides a polishing machine applied to a non-horizontal polishing surface, including a polishing power source 10 and a polishing pad 30 driven by the polishing power source 10 to perform a polishing process on the non-horizontal polishing surface, where the polishing pad 30 is made of an elastic material capable of generating a deformation state in response to the non-horizontal polishing surface, the polishing pad 30 is divided into a flexible metal layer, a compression layer made of a flexible material such as rubber or sponge, and a deformable soft polishing layer from top to bottom, and the polishing pad 30 capable of generating the deformation state belongs to the prior art and has various embodiments, and will not be described in detail in order to avoid other embodiments of the polishing pad 30.
The present invention is to provide a deformation device 20 between the polishing power source 10 and the elastic polishing pad 30, the deformation device 20 is disposed between the polishing power source 10 and the polishing pad 30, the deformation device 20 at least comprises a receiving unit 21 for receiving the polishing power source 10 and defining a reference horizontal line, and two offset units 22 respectively disposed at two sides of the receiving unit 21 and between the polishing pads 30, at least one first deformation member 23 is connected between each offset unit 22 and the receiving unit 21, and at least two second deformation members 24 are connected between each offset unit 22 and the polishing pad 30, such that when any side of the polishing pad 30 is in the deformation state due to the polishing process on the non-horizontal polishing surface, the first deformation member 23 forms a first deformation R1 with respect to the reference horizontal line of the receiving unit 21 independently corresponding to the offset unit 22 on any side of the polishing pad 30, and a second deformation included angle R2 is formed on either side of the polishing pad 30 by the second deformation element 24 relative to the reference horizontal line of the receiving unit 21, as shown in fig. 1, the second deformation element 24 and the first deformation element 23 are in a staggered arrangement, and the first deformation element 23 and the second deformation element 24 include two end fixing sections 232, 233, 242, 243 and central deformation sections 231, 241, the fixing sections 232, 233 of the first deformation element 23 are used to connect the receiving unit 21 and the offset unit 22, and the fixing sections 242, 243 of the second deformation element 24 are used to connect the offset unit 22 and the polishing pad 30, wherein the first deformation element 23 and the second deformation element 24 may be one of a spring, an elastic sheet or rubber.
In order to facilitate understanding of the deformation operation state of the present invention, in the embodiment, a spring is first used as the first deformation element 23 and the second deformation element 24, please refer to fig. 1 and fig. 2, in the initial state or when a user performs a polishing operation on a horizontal polishing surface, the receiving unit 21 and the polishing pad 30 are relatively horizontal, and the offset unit 22 and the receiving unit 21 can also be relatively horizontal.
Referring to fig. 3-1 and 3-2, which are schematic diagrams illustrating a deformation state of the polishing pad 30 on a non-horizontal polishing surface being a concave surface according to the present invention, when a user manually applies a force to the receiving unit 21 by the polishing power source 10 to polish the curved polishing surface, in order to make both sides of the polishing pad 30 generate a deformation state according to the curvature of the curved surface, at this time, the external force applied from the polishing power source 10 and the force fed back from both sides of the polishing pad 30 will cause the central deformation sections 231, 241 of the first deformation member 23 and the second deformation member 24 having deformation to deform, the deformation modes of the central deformation sections 231, 241 are different according to the material, including but not limited to one or a combination of compression or bending of the central deformation sections 231, 241, and at this time, when the central deformation section 231 of the first deformation member 23 deforms, the other fixing section 232, 241 will be interlocked, The offset unit 22 connected to 233 allows the offset unit 22 to form a first deformation angle R1 with respect to the reference horizontal line defined by the receiving unit 21 by the deformation amount of the central deformation segment 231, and any side of the polishing pad 30 also allows the deformation amount of the second deformation element 24 to form a second deformation angle R2 with respect to the reference horizontal line of the receiving unit 21, and the deformation state of the polishing pad 30 is configured by the relative change values of the first deformation angle R1 and the second deformation angle R2, so that the polishing pad 30 can effectively conform to the curved surface pattern of fig. 3-1. In the same manner, referring to fig. 4-1 and 4-2, when the polishing surface is convex, a second deformation included angle R4 is formed on any side of the polishing pad 30 by the deformation amount of the second deformation element 24 relative to the reference horizontal line of the receiving unit 21, and a first deformation included angle R3 is formed by the offset unit 22 relative to the reference horizontal line defined by the receiving unit 21, so that the deformation state of the polishing pad 30 is formed by the relative change values of the first deformation included angle R3 and the second deformation included angle R4, and the polishing pad 30 can effectively conform to the convex state shown in fig. 4-1.
Referring to fig. 5, when the polishing pad 30 changes its curvature positions with different curved surfaces during the polishing process, the deformation amounts of the first deformation element 23 and the second deformation element 24 change, and the first deformation included angles R1, R3 and the second deformation included angles R2, R4 change to a changed angle or a combined angle when the polishing pad 30 conforms to different curved surfaces or convex curvatures, and because the present invention separately sets the offset units 22, the first deformation element 23 and the second deformation element 24 on both sides of the polishing pad 30, both sides of the polishing pad 30 can independently conform to a non-horizontal polishing surface by using the changed angles of the first deformation included angles R1, R3 and the second deformation included angles R2, R4, which is important for the non-regular and continuous non-horizontal polishing surface shown in fig. 5, when the polishing surface equal to the region of the polishing pad 30 simultaneously presents convex and curved surfaces, the two sides of the polishing pad 30 of the present invention can be independently deformed by the deformation device 20 without being interlocked, so that the polishing pad 30 can be bonded to the polishing surface in the deformed state of the two sides with different curvatures, or as shown in fig. 5, the polishing pad 30 of the present invention can still maintain the polishing pad 30 bonded to each side of the polishing surface in the independently deformed state, so as to effectively perform the polishing process, in the case that the polishing surface of one side of the polishing pad 30 is convex and the polishing surface of the other side is concave.
Referring to fig. 6, the grinding power source 50 of the present invention can also be applied to a power grinder, which is one of an electric grinder and a pneumatic grinder, the power grinder has a power shaft 51 connected to the grinding pad 30, and the power shaft 51 drives the grinding pad 30 to perform a linear or eccentric grinding stroke by using the power grinder as the grinding power source 50.
Referring to fig. 7 and 8, the polishing pad 30 of the present invention is mainly rectangular in shape, and the number of sets of the first deformation elements 23a and the second deformation elements 24a is different according to the size of the polishing pad 30, for example, if a larger size polishing pad 30 requires finer and more stable deformation balance in the polishing process, the first deformation elements 23a can be disposed in more than two sets, the first deformation elements 23a are preferably disposed in two sets, and the second deformation elements 24a are disposed at four ends of the offset unit 22, so that the central position of each first deformation element 23a disposed in the corresponding second deformation element 24a is maintained in the vertical line arrangement as the optimal arrangement, and the deformation amount of the central segment 231 of the first deformation element 23a can be greater than or equal to the deformation amount of the second deformation element 24 according to the different states required by different interlaced deformation polishing surfaces a amount of deformation of the central deformation segment 231 of a.
For the convenience of the present invention, the receiving unit 21 may be a rectangle shape corresponding to the polishing pad 30, the polishing power source 10 may be located at the center or both sides according to the size of the polishing pad 30, and fig. 8 further discloses that the receiving unit 21a includes a covering portion 211 extending to the polishing pad 30, and the receiving unit 21a further includes a cover 212 covering the receiving unit 21a and the covering portion 211 for assisting the external force application, and the covering portion 211 and the cover 212 may further have an opening 213 for connecting an external dust remover (not shown) for performing the polishing process of the polishing pad 30 and removing the internal dust.
In summary, according to the deformation device 20 installed between the polishing power source 10, 50 and the polishing pad 30 of the present invention, since a set of the offset unit 22, the first deformation member 23, 23a and the second deformation member 24, 24a are independently installed between any side of the polishing pad 30 and the receiving unit 21, 21a, any side of the polishing pad 30 can independently generate the variation angles of the first deformation included angle R1 and the second deformation included angle R2 to correspondingly attach to various non-horizontal polishing surfaces, especially to a continuous irregular non-horizontal polishing surface, the present invention has a better polishing effect compared to the prior art.

Claims (16)

1. A grinder for use with non-horizontal grinding surfaces, comprising: a grinding power source and a grinding pad driven by the grinding power source to carry out a grinding stroke on a non-horizontal grinding surface, wherein the grinding pad is made of an elastic material capable of generating a deformation state corresponding to the non-horizontal grinding surface; a deformation device arranged between the grinding power source and the grinding pad, the deformation device at least comprises a bearing unit bearing the grinding power source and defining a reference horizontal line and two offset units respectively arranged at two sides of the bearing unit and between the grinding pads, at least one first deformation piece is connected between each offset unit and the bearing unit, and at least two second deformation members are oppositely arranged between each offset unit and the polishing pad, so that any side of the polishing pad is subjected to the polishing process on the non-horizontal polishing surface to generate the deformation state, and the offset unit corresponding to any side of the polishing pad independently forms a first deformation included angle with the first deformation piece relative to the reference horizontal line of the supporting unit, and a second deformation included angle is formed on either side of the polishing pad by the second deformation piece relative to the reference horizontal line of the supporting unit.
2. A grinder for use with non-horizontal grinding surfaces as claimed in claim 1, wherein the second shape-changing members are arranged in two sets in opposition to each other.
3. The grinding machine of claim 2, wherein two sets of the second deformation elements are respectively disposed at four ends of the offset unit.
4. A grinder for non-horizontal grinding surfaces as in claim 1 or 2 or 3 wherein the first shape-changing element is arranged in a single central position with respect to the second shape-changing element.
5. A grinder for non-horizontal grinding surfaces as in claim 1 or 2 or 3 wherein the first shape-changing element is provided in two opposing positions.
6. The grinding machine for non-horizontal grinding surfaces of claim 5, wherein each first deformation element is disposed at a central position relative to the second deformation element.
7. The grinding machine of claim 1, wherein the first deformable member and the second deformable member comprise two end fixing sections and a central deformable section.
8. A grinding machine for non-horizontal grinding surfaces according to claim 7, characterized in that the deformation of the central deformation of the first deformation element is greater than or equal to the deformation of the central deformation of the second deformation element.
9. The apparatus of claim 1, 7 or 8, wherein the first deformation member and the second deformation member are one of a spring, a resilient plate or a rubber.
10. The grinder of claim 1, wherein the receiving unit is substantially equal to the shape of the grinding pad.
11. The polishing machine of claim 10, wherein the receiving unit further comprises a covering portion extending to the polishing pad.
12. The grinder of claim 11, wherein the shroud has an opening for connection to an external dust collector.
13. The grinder of claim 1, wherein the grinding power source is manually applied to directly apply an external force to the receiving unit.
14. The grinder of claim 13, wherein the receiving unit further comprises a housing for assisting the external force.
15. The grinder of claim 1, wherein the grinding power source is a power grinder having a power shaft coupled to the grinding pad.
16. A grinder for use with a non-horizontal grinding surface as claimed in claim 15 wherein the powered grinder is one of an electric grinder and a pneumatic grinder.
CN201810762497.9A 2018-07-12 2018-07-12 Grinder applied to non-horizontal grinding surface Active CN110712117B (en)

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Application Number Priority Date Filing Date Title
CN201810762497.9A CN110712117B (en) 2018-07-12 2018-07-12 Grinder applied to non-horizontal grinding surface

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CN110712117B true CN110712117B (en) 2021-08-10

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Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1133898A (en) * 1997-07-18 1999-02-09 Nikon Corp Grinding device
TW380078B (en) * 1997-11-25 2000-01-21 Speedfam Co Ltd Surface polishing pad
TW467803B (en) * 1999-04-06 2001-12-11 Applied Materials Inc Improved CMP polishing PAD
TW200534956A (en) * 2004-03-16 2005-11-01 Noritake Co Ltd CMP pad conditioner having working surface inclined in radially outer portion
KR200401367Y1 (en) * 2005-08-04 2005-11-16 이석재 Curved surface grinding is possible grinding whirl
CN2829879Y (en) * 2005-09-16 2006-10-25 坤纪企业股份有限公司 Verticle stirring grinding machine
CN101786262A (en) * 2009-01-28 2010-07-28 株式会社荏原制作所 Be used to repair equipment, chemical-mechanical grinding device and the method for grinding pad
CN107297680A (en) * 2016-04-14 2017-10-27 胜高股份有限公司 Chip end surface grinding pad, chip end-face grinder and chip end surface grinding method
CN107471103A (en) * 2017-08-07 2017-12-15 东莞华晶粉末冶金有限公司 A kind of ceramic cambered surface abrasive machining apparatus and processing method
CN208601318U (en) * 2018-07-12 2019-03-15 鼎朋企业股份有限公司 Grinder applied to non-horizontal lapped face

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW560388U (en) * 1998-12-02 2003-11-01 Taiwan Semiconductor Mfg Improved apparatus of chemical mechanical polishing for reducing wafer scratch
KR20040093402A (en) * 2003-04-22 2004-11-05 제이에스알 가부시끼가이샤 Polishing Pad and Method of Polishing a Semiconductor Wafer

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1133898A (en) * 1997-07-18 1999-02-09 Nikon Corp Grinding device
TW380078B (en) * 1997-11-25 2000-01-21 Speedfam Co Ltd Surface polishing pad
TW467803B (en) * 1999-04-06 2001-12-11 Applied Materials Inc Improved CMP polishing PAD
TW200534956A (en) * 2004-03-16 2005-11-01 Noritake Co Ltd CMP pad conditioner having working surface inclined in radially outer portion
KR200401367Y1 (en) * 2005-08-04 2005-11-16 이석재 Curved surface grinding is possible grinding whirl
CN2829879Y (en) * 2005-09-16 2006-10-25 坤纪企业股份有限公司 Verticle stirring grinding machine
CN101786262A (en) * 2009-01-28 2010-07-28 株式会社荏原制作所 Be used to repair equipment, chemical-mechanical grinding device and the method for grinding pad
CN107297680A (en) * 2016-04-14 2017-10-27 胜高股份有限公司 Chip end surface grinding pad, chip end-face grinder and chip end surface grinding method
CN107471103A (en) * 2017-08-07 2017-12-15 东莞华晶粉末冶金有限公司 A kind of ceramic cambered surface abrasive machining apparatus and processing method
CN208601318U (en) * 2018-07-12 2019-03-15 鼎朋企业股份有限公司 Grinder applied to non-horizontal lapped face

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