TWI662648B - Wafer positioning identification device and method thereof - Google Patents

Abstract

A wafer positioning and identifying device and method thereof are used to identify the correct position and positioning of a wafer during wafer rotation. The wafer positioning and identifying device includes a base, a carrier, a rotating mechanism, a bracket, a base, a light source module, Image sensing module and control circuit module; the base is a stable platform with an opening, the carrier is located on the base to carry the wafer, the rotation mechanism is combined with the base, and the rotation power is provided to rotate the wafer, the bracket Combined with the base, combined with the base, the light source module is set on the base to provide the lighting function, the image sensing module is set on the base to provide the wafer alignment sensing function, and the control circuit module is electrically connected The rotating mechanism, the light source module and the image sensing module are used to control the rotating mechanism, the light source module and the image sensing module.

Description

Wafer positioning identification device and method

The invention provides a wafer positioning and identifying device and a method thereof, and particularly relates to a wafer positioning and identifying device and a method for identifying a surface feature of a wafer through image sensing and performing rotary positioning.

In the semiconductor process, wafers are often loaded into various reaction chambers / processing chambers for processing using automated equipment. Most of the typical automated equipment is a machine that can correctly and repeatedly perform wafer transfer work Arm, the robotic arm is set in a transfer processing chamber, which can enter and exit one or more process processing chambers connected to the transfer processing chamber. It is conceivable that the wafer is accurately placed in the most ideal position of the process processing chamber is very important. In addition, the accuracy of the center point position and the azimuth angle of the wafer in the processing chamber has a significant impact on the yield of the process. Therefore, accurate positioning and identification will help to maximize and optimize the process efficiency of the wafer.

In the past, if the initial position and positioning of the wafer were to be determined, manual, manual and visual recognition methods were often used to align the notch reference point (Notch) on the edge of the wafer with an azimuth index. However, the error of this method is very large, and the wafer cannot be accurately rotated by a predetermined angle according to the needs of subsequent processing procedures, which adversely affects the yield and efficiency of wafer processing. Another common solution is to A penetrating sensor is installed at the edge to detect the presence of a notch at the edge, and the wafer orientation is determined based on the position of the notch. However, this penetrating sensor may be affected by parameters such as wafer thickness, substrate material, surface treatment, etc., causing misjudgment, or when the wafer reaches the later stage of the process, the edge of the wafer is prone to chipping and chipping. Other phenomena are called crystal avalanches. Crystal avalanches also affect the sensing results and cause misjudgments. In addition, the notch reference point (Notch) must be visible to workers, so it usually extends from a few microns to a few centimeters, which results in a considerable space utilization loss on the wafer. Therefore, how to solve the above-mentioned conventional problems and shortcomings is the direction that the inventors of the present invention and related manufacturers engaged in this industry are eager to study and improve.

In view of this, the present invention provides a wafer positioning and identifying device for identifying the correct position and positioning of a wafer during wafer rotation. The wafer positioning and identifying device includes: a base, a carrier, a rotating mechanism, and a support. , Base, light source module, image sensing module and control circuit module. The base is a stable platform with an opening; the carrier is located on the base and is used to carry the wafer; the rotation mechanism is combined with the base to provide rotation power to rotate the carrier when the rotation mechanism rises to support the wafer; the bracket Combined with the base assembly; the base is parallel to the base and combined with the bracket assembly; the light source module is arranged on the base to provide the lighting function; the image sensing module is arranged on the base to provide the wafer Alignment sensing function; the control circuit module is electrically connected to the rotation mechanism, the light source module and the image sensing module, and is used to control the rotation mechanism, the light source module and the image sensing module.

In the wafer positioning and identifying device, the bracket is disposed on an upper plane and a lower plane of the base.

In the wafer positioning and identifying device, the wafer has a front surface and a back surface, the front surface has a first feature, and the back surface has a second feature.

In the wafer positioning and identifying device, the first feature is a symmetrical specific pattern.

In the wafer positioning and identifying device, the second feature is a specific pattern with unequal sides.

In the wafer positioning identification device, the control circuit module can record at least one identification rule.

In the wafer positioning identification device, the control circuit module is electrically connected to the linear motor module.

In the wafer positioning and identifying device, the image sensing module is an AI series sensing module from KEYENCE.

With the wafer sensing function provided by the image sensing module, after identifying the features on the wafer and then controlling the rotation mechanism through the control circuit module, the wafer can immediately stop rotating and be accurate during the rotation process. Positioning to avoid poor wafer processing yield due to inaccurate positioning.

In addition, the present invention also proposes a wafer positioning identification method, which is used to identify the correct position and positioning of the wafer during wafer rotation. The wafer positioning identification method steps include: (a) providing a control circuit module, and Write identification rules in the control circuit module; (b) provide the light source module and the image sensing module, and electrically connect the control circuit module; (c) use the image sensing module to capture the first on the wafer Feature and the second feature, the rotation mechanism is controlled by comparing the identification rules in the control circuit module; (d) the rotation mechanism immediately stops rotation at the correct position to complete the wafer positioning operation.

In the wafer positioning and identifying method, the first feature in step (c) is located on the front side of the wafer, the second feature is located on the back side of the wafer, and the first feature is a symmetrical specific pattern, and the second feature is an unequal side. Specific graphics.

With the wafer sensing function provided by the image sensing module, the first feature and the second feature on the wafer are captured, and the first feature and the second feature on the wafer are identified and then passed through the control circuit module. The rotation mechanism is controlled, so that the wafer can immediately stop rotation and accurate positioning during the rotation process, to avoid poor wafer processing yield due to inaccurate positioning.

Since the present invention discloses a wafer positioning and identifying device and method thereof, the related basic principles such as the used image recognition and rotary positioning have been understood by those with ordinary knowledge in the relevant technical field, so the descriptions in the following are no longer Make a full description. At the same time, the drawings contrasted in the following text are structural illustrations related to the features of the present invention. They are not and need not be completely drawn according to actual dimensions.

Please refer to FIG. 1, which is a schematic diagram of an embodiment of a wafer positioning and identifying device according to the present invention. The present invention proposes a wafer positioning identification device 1 for identifying the correct position of the wafer and stopping rotation and positioning when the wafer 10 rotates. The wafer positioning identification device includes a base 11 and a carrier. 12. Rotating mechanism 13, bracket 14, base 15, light source module 16, image sensing module 17, and control circuit module (not shown). The base 11 is a stable platform with an opening 110, and the opening 110 is a hole penetrating the base 11, that is, if there is an article placed on the base 11, the placed article can be directly seen from below the base 11 The number of the openings 110 may be one or more than one. The position of the openings 110 may be in the middle of the base 11 or may be opened at any position of the base 11. The number and position of the openings 110 are not here. Special restrictions. The carrier 12 is located on the base 11 for the purpose of carrying the wafer 10, and the assembly relationship between the carrier 12 and the base 11 may be an assembly of two dissimilar components, or the carrier 12 and the base 11 is an integrally formed setting. In addition, the number and appearance of the carrier 12 are not particularly limited herein, as long as it can be used to carry the wafer 10, it is a presentation manner of this embodiment. The rotation mechanism 13 is combined with the base 11 and the rotation mechanism 13 can be freely raised or lowered according to the actual operating conditions. When the rotation mechanism 13 rises and supports the wafer 10, it will be driven by a motor (not shown) in the rotation mechanism 13 ) The rotation power is provided to rotate the wafer 10, and the rotation power provided is not limited to clockwise rotation or counterclockwise rotation. The brackets 14 are combined with the base 11. In more detail, the brackets 14 are arranged on the upper and lower planes of the base 11, so the number of the brackets 14 can be singular (directly through the base 11), or it can be There are multiple. The number of brackets 14 is not particularly limited here, and the angle and manner of the arrangement are not particularly limited here. For example, the angle between the bracket 14 and the base 11 may be ninety degrees. Right-angled, the way of assembly can be screwed or welded. The base 15 and the bracket 14 are combined and arranged in parallel to the base 11. More specifically, the base 15 is arranged above the plane of the base 11 and below the plane of the base 11 by the support or connection of the bracket 14. The connection method is not particularly limited here. The light source module 16 is disposed on the base 15. The manner of installation is not particularly limited here. More specifically, the platform of the base 15 enables the light source module 16 to be pivoted on the upper plane of the base 11. The platform and the platform under the lower plane of the base 11 are used to provide sufficient light source illumination functions to help improve the recognition rate of the wafer positioning and identification device of the present invention. In addition, the number of the light source modules 16 may be one. It can also be more than one, and the number can be flexibly increased according to requirements and installation space restrictions. In this embodiment, the number of light source modules 16 is preferably six. The image sensing module 17 is disposed on the base 15 and is provided. The method is not particularly limited here. In more detail, the platform of the base 15 enables the image sensing module 17 to be pivotally disposed between the platform above the upper plane of the base 11 and the lower plane of the base 11. The lower platform is used to provide the alignment sensing function of the wafer 10. In addition, the number of image sensing modules 17 can be one, or more than one, and the number can be flexibly increased according to needs and space constraints. In this embodiment, the shadow The number of the sensing modules 17 is preferably six; the control circuit module (not shown) is electrically connected to the rotation mechanism 13, the light source module 16, and the image sensing module 17, and is used to control the rotation mechanism 13, the light source The module 16 and the image sensing module 17 make it operate.

Please continue to refer to FIG. 1. The control circuit module (not shown) can record at least one identification rule, preferably twelve sets of identification rules, to provide the image sensing module 17 for sensing and identification. For example, For example, the wafer positioning identification device 1 has six groups of light source modules 16 (three groups above the base 11 and three groups below the base 11) and six image sensing modules 17 (three groups above the base 11 and the base 11). The three groups below), when the device is operating, six sets of light source modules 16 and six sets of image sensing modules 17 can provide and sense light sources for the same wafer 10 at the same time, or they can be provided by different and specific light sources respectively The module 16 and the image sensing module 17 provide light sources and sense the same wafer 10. In more detail, all the light source modules 16 and the image sensing module 17 can operate at the same time, and can also respond to the wafer. The type of 10 is selectively operated by a specific light source module 16 and an image sensing module 17. In short, the wafer positioning identification device 1 can identify three different types of wafers 10 at a time to complete subsequent processing. .

Please refer to FIG. 2 and FIG. 3 at the same time, which are a schematic diagram of a front surface of the wafer and a schematic diagram of a rear surface of the wafer positioning and identification device according to the present invention. The wafer 10 has a front surface 101 and a back surface 102. The front surface 101 has a first feature 1010 and the back surface 102 has a second feature 1020. In more detail, the front surface 101 and the back surface 102 of the wafer 10 are divided into many lattices. Within a lattice (lattice is square), the first feature 1010 is located at a specific position on the front side of each wafer 10 (as shown below), and is a symmetrical specific pattern, such as a symmetrical pattern such as a square, a regular triangle, and an equilateral pattern In this embodiment, a square is a preferred embodiment. For example, each lattice (square) contains a first feature 1010 (square); a second feature 1020 is located on the back of each wafer 10, but the location may be The specific position may also be in all the lattices (squares) on the back surface, and the second feature 1020 is a specific figure with unequal sides, such as a rectangle. Therefore, the second feature is included in each lattice (square). 1020 (rectangular). With the patterns on the first feature 1010 and the second feature 1020, the image sensing module 17 can sense the front side 101 and the back side 102 of the wafer 10, and sense and locate the symmetrical patterns on the front side. A specific pattern with unequal sides is sensed and positioned on the back surface, so that the positioning process of the wafer 10 can be completed by sensing and aligning the front surface 101 and the back surface 102 of the wafer 10.

Please continue to refer to FIG. 2 and FIG. 3, if the wafer 10 manufactured by different manufacturers or the wafer 10 for different purposes, the first feature 1010 and the second feature 1020 on the front side 101 and the back side 102 of the wafer 10 It may have different aspects, such as different sizes of squares, and different ratios of short sides to long sides of rectangles. In order to identify many different wafers 10, the control circuit module of the wafer positioning identification device 1 of the present invention ( (Not shown), at least one identification rule can be recorded to respond to such a situation, thereby improving convenience and practicality. In addition, the control circuit module may be electrically connected to a linear motor module (not shown) in addition to the rotation mechanism 13, the light source module 16, and the image sensing module 17. The linear motor module is the wafer 10. After entering the wafer positioning and identifying device 1 of the present invention to perform processing elements before processing, in detail, the wafer 10 is sent to the base 11 through the linear motor module before the subsequent series of wafer positioning is performed. Recognize actions, so the control circuit module and the linear motor module can be electrically connected to each other and communicate with each other to smooth the entire wafer 10 transfer process.

In the wafer positioning and identification device 1 of the present invention, the image sensing module 17 is an AI series sensing module of KEYENCE, for example, models: AI-H010, AI-H020, AI-H050, AI-H100, and AI -H160, etc., the above models are amplifier-separated models, so it needs to be matched with amplifiers such as models AI-1000, AI-1000C to complete the assembly. In addition, the present invention can also use built-in amplifier-type sensing modules, such as models AI-B050, AI-B100, and AI-B160, etc., and use KEYENCE's AI-series sensing modules as the implementation of the present invention. In this way, the recognition rate can be greatly improved, but the image sensing module 17 of the present invention is not used as an implementation limitation.

Please refer to FIG. 1 to FIG. 3 at the same time. The wafer positioning and identification device 1 proposed by the present invention firstly transmits the wafer 10 to the robot arm (not shown) via a linear motor module (not shown). The carrier 12 on the base 11 is further lifted by the rotating mechanism 13 to hold the wafer 10 and apply a rotating power to rotate the wafer 10. The rotating speed of the rotating power is preferably less than 40 RPM, but not This is used as a limitation. At this time, the light source module 16 and the image sensing module 17 will provide light source and image sensing identification for the wafer 10 being rotated. The image sensing module 17 located above the base 110 may The image recognition of the first feature 1010 is directly performed on the front surface 101 of the wafer 10, and the opening 11 is provided through the base 11 to allow the image sensing module 17 located below the base 110 to be directed to the wafer 10 through the opening 110. The back surface 102 performs image recognition of the second feature 1020. Secondly, the front surface 101 and the back surface 102 of the wafer 10 are image-matched and identified through recognition rules set in advance and stored in a control circuit module (not shown). , Through the image recognition, the wafer 10 is quickly rotated in a rotating state. By drop and stop the rotation mechanism 13 so as to ride wafer 10 to complete the operation of positioning the wafer 10 on the carrier member 12.

In addition, please refer to FIG. 4, which is a schematic diagram of another embodiment of the wafer positioning and identifying device 2 proposed by the present invention. This embodiment is similar to the embodiment in FIG. 1, and the components are the same in the same way and will not be repeated here. Only the differences will be specifically described here. Another embodiment of the wafer positioning and identification device 2 Compared with the embodiment in FIG. 1, the detection module 28 is further included. The detection module 28 is also used to detect and locate the wafer 20 on the base 21, but its detection principle and image The sensing module 27 is different. The detection principle used by the detection module 28 is well known to those who are familiar with the basic principles in the field and has ordinary knowledge. It is not specifically described here and is not a limitation of the present invention. . In addition, the wafer positioning identification device 2 also includes a control circuit module (not shown). In addition to the control circuit module being electrically connected to the rotation mechanism 23, the light source module 26, and the image sensing module 27, It is used to control the rotating mechanism 23, light source module 26 and image sensing module 27 to make it move. In addition, it is electrically connected to the detection module 28. The control circuit module can freely control whether to make it detect according to the operator. The module 28, the light source module 26, and the image sensing module 27 are operated. For example, the operator may choose to operate only the detection module 28, and may also choose to operate only the light source module 26 and the image sensing module. In group 27, all the modules: the detection module 28, the light source module 26, and the image sensing module 27 can all be operated to improve the positioning accuracy, that is, the identification efficiency.

Please refer to FIG. 5, which is a schematic diagram of another embodiment of the wafer positioning and identifying device 3 according to the present invention. The component composition and arrangement of the wafer positioning and identifying device 3 in this embodiment are substantially the same as those in the previous embodiment, and will not be described again here. It is worth noting that the base 31 in this embodiment is a stable platform made of a transparent material. The material is not particularly limited here. It can be transparent materials such as acrylic and glass. It is implemented in this embodiment. The base 31 does not have an opening, that is, if there are items placed on the base 31, the placed items can be directly seen from below the base 31. Therefore, if the wafer 30 is to be identified and positioned in this embodiment, When the image sensing module 37 and the light source module 36 disposed on the lower plane of the pedestal 31 are actuated, the rear surface of the wafer 30 can be detected by the transparent pedestal 31, so that the rotating wafer can be identified and positioned.

Please refer to FIG. 6. The present invention also proposes a wafer positioning identification method, which is used to identify the correct position and positioning of the wafer when the wafer is rotating. The method steps can be operated with the wafer positioning identification device 1 described above. The wafer positioning and identification method steps include: (a) providing a control circuit module and writing identification rules in the control circuit module in advance; (b) providing a light source module and an image sensing module, and electrically connecting the control circuit Module; (c) use the image sensing module to capture the first feature and the second feature on the wafer, and control the rotation mechanism after comparing the identification rules in the control circuit module; (d) the rotation mechanism immediately Stop rotation at the correct position to complete the wafer positioning operation. Among them, the first feature in step (c) is located on the front side of the wafer, the second feature is located on the back side of the wafer, and the first feature is a specific pattern of symmetry, and the second feature is a specific pattern of asymmetry. In addition, the identification rule can be preliminarily Load twelve sets into the control circuit module, and the control circuit module can be used to control the light source module, the image sensing module and the rotating mechanism. The image sensing module and the light source module are located above and below the wafer. The module applies a light source to the front and back of the wafer, supplemented by an image sensing module for image recognition. After the image sensing module recognizes the first feature on the front of the wafer and the second feature on the back of the wafer, it compares After identifying the rules, wafer positioning is then performed. The implementation patterns implemented by this implementation method are all based on the previously disclosed embodiments. In more detail, for example: the front side of the wafer is composed of many square lattices, the first feature exists in a lattice at a specific location, and the first feature is a square pattern, and the light source module located above the wafer is It will provide a light source supplemented by an image sensing module for image recognition. The image sensing module will capture the first feature and perform calculations and comparisons with the recognition rules. The back of the wafer is also composed of many square lattices. The second feature exists in a lattice at a specific position, and the second feature is a rectangular figure. The light source module located below the wafer will provide a light source supplemented by an image sensing module for image recognition. The image sensing module is The second feature will be captured and calculated and compared with the recognition rules. By sensing the first feature and the second feature, and performing calculation and comparison with the recognition rules, the rotating wafer can be stopped and positioned immediately.

This technology can solve the problem of poor wafer positioning efficiency in the previous technology. By extracting the first feature and the second feature on the wafer, the first feature and the second feature on the wafer can be identified. Later, the rotation mechanism is controlled by the control circuit module, so that the wafer can immediately stop rotation and be accurately positioned during the rotation process, to avoid poor wafer processing yield due to inaccurate positioning; at the same time, users also You can freely choose the module you want to identify. Through the electrical connection of the control circuit module, you can selectively operate the light source module, image sensing module and detection module according to the situation, and increase the flexibility of its users. .

The above description is only a preferred embodiment of the present invention, and is not intended to limit the patent application rights of the present invention. At the same time, the above description should be clear and implementable to those skilled in the technical field, so others do not depart from the present invention. Equivalent changes or modifications made under the spirit of disclosure should be included in the scope of patent application.

1,2,3‧‧‧wafer positioning and identification device

10, 20, 30‧‧‧ wafers

101‧‧‧ Positive

1010‧‧‧First feature

102‧‧‧Back

1020‧‧‧Second feature

11, 21, 31‧‧‧ base

110, 210‧‧‧ opening

12, 22, 32‧‧‧ Carrying parts

13, 23, 33‧‧‧rotating mechanism

14, 24, 34 ‧ ‧ ‧ bracket

15, 25, 35‧‧‧ base

16, 26, 36‧‧‧‧ light source modules

17, 27, 37‧‧‧Image sensor module

a, b, c, d‧‧‧ steps

FIG. 1 is a schematic diagram of an embodiment of a wafer positioning and identifying device according to the present invention.

FIG. 2 is a schematic front view of a wafer of the wafer positioning and identification device proposed by the present invention.

FIG. 3 is a schematic diagram of a wafer backside of the wafer positioning and identification device proposed by the present invention.

FIG. 4 is a schematic diagram of another embodiment of a wafer positioning and identifying device according to the present invention.

FIG. 5 is a schematic diagram of another embodiment of a wafer positioning and identifying device according to the present invention.

FIG. 6 is a flowchart of a wafer positioning identification method proposed by the present invention.

Claims (9)

A wafer positioning and identifying device is used to identify the correct position and positioning of a wafer when a wafer rotates. The wafer positioning and identifying device includes: a base, a stable platform with at least one opening; a bearing Pieces are located on the base to carry the wafer; wherein the surface and the bottom of the wafer have a first feature and a second feature respectively; a rotating mechanism is combined with the base assembly, and when the When the rotating mechanism lifts and holds the wafer, it provides a rotating power to rotate the wafer; at least two light source modules are respectively arranged on the upper and lower planes of the base; at least two image sensing modules are respectively arranged on An upper plane and a lower plane of the base; and a control circuit module electrically connecting the rotation mechanism, the light source modules and the image sensing modules; wherein the control circuit module is used to control the The light source modules on the upper plane of the base and the image sensing modules complete the identification of the first feature, and the control circuit module simultaneously controls the light source modules and the light source module on the lower plane of the base. These image sensing modules pass Open a hole to complete the identification of the second feature; wherein, according to the identification results of the first feature and the second feature, the control circuit module controls the rotation mechanism to stop rotating at the correct position to complete the positioning operation of the wafer . The wafer positioning and identifying device according to item 1 of the scope of the patent application, further comprising: at least two brackets respectively disposed on the upper and lower planes of the base; and at least two bases respectively disposed on the base A plane and a lower plane; wherein each base is connected to the bracket for a light source module and an image sensing module to be arranged thereon. The wafer positioning and identifying device according to item 1 of the scope of patent application, wherein the first feature is a symmetrical specific pattern. The wafer positioning and identifying device according to item 1 of the scope of patent application, wherein the second feature is a specific pattern of unequal sides. The wafer positioning and identifying device according to item 1 of the scope of patent application, wherein the control circuit module can record at least one identification rule. According to the wafer positioning identification device described in the first item of the patent application scope, wherein the control circuit module is electrically connected to a linear motor module. According to the wafer positioning and identification device described in item 1 of the scope of patent application, wherein the at least one image sensing module is an AI series sensing module of KEYENCE Corporation. A wafer positioning identification method is used to identify a correct position and positioning of a wafer when a wafer is rotated, wherein a surface and a bottom surface of the wafer respectively have a first feature and a second feature, and the wafer The positioning identification method steps include: (a) providing a base, a carrier and a control circuit module; wherein the base has an opening and at least one identification rule is written in the control circuit module (B) providing at least two light source modules and at least two image sensing modules electrically connected to the control circuit module, and setting the at least two light source modules on the upper and lower planes of the base, respectively; and At the same time, the at least two image sensing modules are respectively arranged on the upper and lower planes of the base; (c) the control circuit module controls the light source modules and the image sensors on the upper plane of the base; The measurement module completes the identification of the first feature, and the control circuit module controls the light source modules and the image sensing modules located on the lower plane of the base through the opening to complete the second feature. Identification; (d) completing the first feature and the second After the comparison with the identification sign rule, a rotation control mechanism actuated so that the rotating means is stopped in the correct position to complete the positioning operation of the rotation of the wafer. The wafer positioning and identifying method according to item 8 of the scope of the patent application, wherein the first feature is a symmetrical specific pattern, and the second feature is an unequal specific pattern.