TWM563657U - Detection apparatus for wafer position - Google Patents

Abstract

The present invention discloses a wafer positioning and identification device for identifying the correct position and positioning of a wafer during wafer rotation. The wafer positioning and identification device includes a base, a carrier, a rotating mechanism, a bracket, a base, a light source module, and a sense of image. The test module and the control circuit module; the base is a stable platform with an opening, the carrier is located on the base for carrying the wafer, the rotating mechanism is combined with the base, and the rotating power is provided to rotate the wafer, the bracket and the base The base is combined with the bracket, the light source module is disposed on the base for providing a lighting function, the image sensing module is disposed on the base for providing a wafer alignment sensing function, and the control circuit module is electrically connected to the rotating mechanism The light source module and the image sensing module are used to control the rotating mechanism, the light source module and the image sensing module.

Description

Wafer positioning identification device

The present invention relates to a wafer positioning and recognizing device, and more particularly to a wafer positioning and recognizing device for recognizing a surface feature of a wafer by image sensing.

In semiconductor manufacturing, it is often necessary to use automated equipment to load wafers into a variety of reaction chambers/processing chambers. Typical automation equipment is mostly a repetitive and repeatable machine that performs wafer transfer operations. An arm, the robot arm is disposed in the transfer processing chamber, and can enter one or more process chambers connected to the transfer processing chamber. It is conceivable that the wafer is accurately placed in the optimal position of the processing chamber. very important. In addition, the accuracy of the center position and azimuth angle of the wafer in the process chamber has a significant impact on process yield. Therefore, accurate location identification will help maximize and optimize the process benefits of the wafer.

In the past, if the initial position and positioning of the wafer were to be determined, the notch reference point (Notch) of the edge of the wafer was often aligned with an orientation indicator by manual, manual and visual recognition. However, the error of this method is very large, and it is not possible to accurately rotate the wafer by a predetermined angle according to the needs of subsequent processing procedures, which has an adverse effect on the yield and efficiency of wafer processing; another common scheme is in the wafer. A transmissive sensor is mounted on the edge to detect the presence of a corner notch (Notch), and the orientation of the wafer is determined based on the position of the notch. However, this transmissive sensor may be affected by parameters such as wafer thickness, substrate material, surface treatment, etc., and cause misjudgment, or when the wafer comes to the back of the process, the edge of the wafer is prone to cornering and chipping. Such phenomena, called crystal collapse, also affect the occurrence of misjudgment caused by the sensing results. In addition, the notch reference point (Notch) must be visible to the worker, so it typically extends from a few microns to a few centimeters, thus causing considerable space utilization losses for the wafer. Therefore, how to solve the above problems and shortcomings in the past is the direction of the creators of this creation and the related manufacturers engaged in this industry.

In view of this, the present invention provides a wafer positioning and identifying device for identifying the correct position and positioning of the wafer when the wafer is rotated. The wafer positioning and identifying device comprises: a base, a carrier, a rotating mechanism, and a bracket. , base, light source module, image sensing module and control circuit module. The pedestal is a stable platform having an opening; the carrier is located on the pedestal and is used for carrying the wafer; the rotating mechanism is combined with the pedestal assembly to provide rotational power to rotate the carrier when the rotating mechanism rises to hold the wafer; The base is parallel to the base and combined with the bracket assembly; the light source module is disposed on the base for providing illumination function; the image sensing module is disposed on the base for providing the wafer The position sensing function; the control circuit module is electrically connected to the rotating mechanism, the light source module and the image sensing module for controlling the rotating mechanism, the light source module and the image sensing module.

The wafer positioning and identifying device, wherein the bracket is disposed on a plane above and below the base.

The wafer positioning and identification device, wherein the wafer has a front side and a back side, the front side has a first feature, and the back side has a second feature.

The wafer location identification device, wherein the first feature is a symmetrical specific pattern.

The wafer location identification device, wherein the second feature is a specific pattern of unequal edges.

The wafer positioning and identifying device, wherein the control circuit module can record at least one identification rule.

The wafer positioning and identifying device, wherein the control circuit module is electrically connected to the linear motor module.

The wafer positioning and identification device, wherein the image sensing module is an AI series sensing module of KEYENCE Corporation.

The wafer sensing function provided by the image sensing module identifies the features on the wafer and then controls the rotating mechanism through the control circuit module, so that the wafer can stop rotating and accurately during the rotation process. Positioning to avoid poor yield of wafer processing due to poor positioning.

In addition, the present invention also provides a wafer positioning and identifying device for identifying the correct position and positioning of the wafer when the wafer is rotated. The wafer positioning and identifying device comprises: a base, a carrier, a rotating mechanism, a bracket, a base, The light source module, the image sensing module, the detecting module and the control circuit module. The pedestal is a stable platform; the carrier is located on the pedestal and is used to carry the wafer; the rotating mechanism is combined with the pedestal assembly, and when the rotating mechanism rises to hold the wafer, the rotating power is provided to rotate the carrier; the bracket and the pedestal The base is parallel to the base and combined with the bracket assembly; the light source module is disposed on the base for providing illumination function; the image sensing module is disposed on the base to provide a sense of alignment of the wafer The detection module is disposed on the base for providing the wafer detection function; the control circuit module is electrically connected to the rotation mechanism, the light source module, the image sensing module and the detection module for controlling Rotating mechanism, light source module, image sensing module and detection module.

The wafer positioning and identifying device, wherein the base has an opening.

The first sensing feature and the second feature on the wafer are captured by the image sensing function provided by the image sensing module, and the first feature and the second feature on the wafer are identified and then transmitted through the control circuit module. The rotation mechanism is controlled, so that the wafer can be stopped and accurately positioned during the rotation process, so as to avoid the poor yield of the wafer processing due to the inaccurate positioning.

In the following, a plurality of embodiments of the present invention will be disclosed in the drawings. For the sake of clarity, a number of practical details will be described in the following description. However, it should be understood that these practical details are not applied to limit the creation. That is to say, in the implementation part of this creation, these practical details are not necessary. In addition, some of the conventional structures and elements are shown in the drawings in a simplified schematic manner in order to simplify the drawings.

Please refer to FIG. 1 , which is a schematic diagram of an embodiment of a wafer positioning and identification device proposed by the present invention. The present invention provides a wafer positioning and identifying device 1 for purpose of identifying the correct position of the wafer and stopping the rotation and positioning when the wafer 10 is rotated. The wafer positioning and identifying device comprises: a base 11 and a carrier 12. Rotating mechanism 13, bracket 14, base 15, light source module 16, image sensing module 17, and control circuit module (not shown). The base 11 is a stable platform having an opening 110, and the opening 110 is a hole penetrating the base 11, that is, if the item is placed on the base 11, the placed item can be directly seen from under the base 11. The number of the openings 110 may be one or more, and the position of the opening 110 may be in the middle of the base 11 or may be opened at any position of the base 11. The number and position of the openings 110 are not here. Special restrictions. The carrier 12 is located on the pedestal 11 for carrying the wafer 10. The carrier 12 and the pedestal 11 are arranged in two or different components, or the carrier 12 and the pedestal. 11 is an integrally formed arrangement. In addition, the number and the aspect of the carrier 12 are not particularly limited herein, and any method that can be used to carry the wafer 10 is the present embodiment. The rotating mechanism 13 is combined with the base 11 , and the rotating mechanism 13 can freely rise or fall according to actual operating conditions. When the rotating mechanism 13 is raised and held to the wafer 10 , the motor in the rotating mechanism 13 is not shown (not shown). Providing rotational power to rotate the wafer 10, and the rotational power provided is not limited to clockwise rotation or counterclockwise rotation. The bracket 14 is combined with the base 11 . In more detail, the bracket 14 is disposed on the upper plane and the lower plane of the base 11 , so the number of the brackets 14 may be a single number (directly through the base 11 ), or The number of the brackets 14 is not particularly limited herein, and the angle and manner of the assembly are not particularly limited herein. For example, the bracket 14 and the base 11 can be set at an angle of ninety degrees. Right angle, the way to set up can be screwed or welded. The base 15 is combined with the bracket 14 and disposed parallel to the base 11. In more detail, the base 15 is disposed above and below the plane of the base 11 by the support or connection of the bracket 14 The manner in which the connection is made is not particularly limited herein. The light source module 16 is disposed on the base 15 , and the manner of the light source module 16 is not particularly limited. In more detail, the light source module 16 can be pivoted on the upper plane of the base 11 by the platform of the base 15 . The platform and the platform below the lower plane of the pedestal 11 are provided to provide sufficient light source illumination function to assist in improving the recognition rate of the wafer identification device of the present invention. In addition, the number of the light source modules 16 may be one. In one embodiment, the number of the light source modules 16 is preferably six groups; the image sensing module 17 is disposed on the base 15 and is disposed. The manner is not particularly limited herein. In more detail, the image sensing module 17 can be pivoted on the platform above the upper plane of the base 11 and the lower plane of the base 11 by the platform of the base 15 . The lower platform is used to provide the alignment sensing function of the wafer 10. In addition, the number of the image sensing modules 17 may be one or more, and the number thereof may be flexibly added according to the requirements and the space constraints. In this embodiment, the shadow The number of the sensing modules 17 is preferably six; the control circuit module (not shown) is electrically connected to the rotating mechanism 13, the light source module 16, and the image sensing module 17 for controlling the rotating mechanism 13 and the light source. The module 16 and the image sensing module 17 actuate it.

Referring to FIG. 1 , the control circuit module (not shown) can record at least one identification rule, preferably twelve sets of identification rules, to provide image sensing module 17 for sensing and identifying, for example, For example, the wafer positioning and identifying device 1 has six sets of light source modules 16 (three groups above the pedestal 11, three groups below the pedestal 11) and six groups of image sensing modules 17 (three groups above the pedestal 11, the pedestal 11 In the lower three groups, when the device is activated, the six groups of light source modules 16 and the six groups of image sensing modules 17 can simultaneously provide and sense light sources for the same wafer 10, or can be respectively different and specific light sources. The module 16 and the image sensing module 17 perform light source supply and sensing on the same wafer 10. In more detail, all the light source modules 16 and the image sensing module 17 can be simultaneously operated or in response to the wafer. The type selectivity of 10 is activated by the specific light source module 16 and the image sensing module 17. In short, the wafer positioning and identifying device 1 can recognize three different kinds of wafers 10 at a time and complete subsequent processing. .

Please also refer to Fig. 2 and Fig. 3 for the front view of the wafer and the back side of the wafer for the wafer positioning and identification device proposed by the author. The wafer 10 has a front side 101 having a first feature 1010 and a back side 102 having a second feature 1020. More specifically, the front and back sides of the wafer are divided into a plurality of crystal lattices in each of the crystal lattices. The inner feature (the lattice is a square), the first feature 1010 is located at a specific position on the front side of each wafer 10 (the following periphery), and is a symmetrical specific pattern, such as a square, an equilateral triangle, etc., and an equilateral pattern, the present embodiment For example, a square is a preferred embodiment. For example, each of the crystal lattices (squares) further includes a first feature 1010 (square); the second feature 1020 is located on the back of each wafer 10, but the position may be a specific position. It may also be covered in all lattices (squares) on the back side, and the second feature 1020 is a specific pattern of unequal sides, such as a rectangle, etc., so that each of the lattices (squares) is formed to include a second feature 1020 (rectangle). ). The image sensing module 17 can sense the front side 101 and the back side 102 of the wafer 10 and sense and position the symmetrical pattern on the front side by using the pattern on the first feature 1010 and the second feature 1020. The specific pattern of the unequal sides is sensed and positioned on the back side, so that the alignment of the wafer 10 is completed by sensing the alignment of the front side 101 and the back side 102 of the wafer 10.

Please continue to refer to FIG. 2 and FIG. 3 , such as wafer 10 manufactured by different manufacturers, or wafer 10 for different purposes, first feature 1010 and second feature 1020 on front side 101 and back side 102 of wafer 10 There may be different aspects, such as the size of the square, the short side of the rectangle and the ratio of the long side. In order to identify the wafer 10 for many different aspects, the control circuit module of the wafer positioning and identification device 1 of the present invention ( Not shown) at least one identification rule can be recorded to occur in response to such a situation, thereby improving convenience and utility. In addition, the control circuit module can be electrically connected to the linear motor module (not shown), and the linear motor module is the wafer 10, in addition to the electrical connection between the rotating mechanism 13, the light source module 16, and the image sensing module 17. The wafer positioning device 1 of the present invention performs the pre-processing actuating component. In detail, after the wafer 10 is sent to the susceptor 11 through the linear motor module, the subsequent series of wafer positioning is performed. The identification circuit can be electrically connected to the linear motor module and communicated with each other to smooth the transmission process of the entire wafer 10.

In the wafer positioning and identification device 1 of the present invention, the image sensing module 17 is an AI series sensing module of KEYENCE, for example, models: AI-H010, AI-H020, AI-H050, AI-H100, and AI. -H160, etc., the above models are models with separate amplifier type, so it is necessary to match the amplifiers such as model AI-1000 and AI-1000C to complete the assembly. In addition, this creation can also use the built-in sensing module of the amplifier, such as model AI-B050, AI-B100 and AI-B160, etc., using KEYENCE AI series sensing module as the implementation state of this creation. In this way, the recognition rate can be greatly improved, but the image sensing module 17 of the present invention is not limited by this.

Referring to FIG. 1 to FIG. 3 simultaneously, the wafer positioning and identification device 1 proposed by the present invention firstly transfers the wafer 10 to a robot arm (not shown) via a linear motor module (not shown). The carrier 12 on the susceptor 11 is further supported by the lifting and lowering mechanism 13 to hold the wafer 10 and apply a rotational power to rotate the wafer 10. The rotational rotational speed is preferably less than 40 RPM, but not In this way, the light source module 16 and the image sensing module 17 perform light source supply and image sensing recognition on the rotating wafer 10 , and the image sensing module 17 located above the susceptor 110 can The image recognition of the first feature 1010 is performed directly on the front side 101 of the wafer 10, and the through hole 110 has an opening 110 for allowing the image sensing module 17 located under the susceptor 110 to pass through the opening 110 for the wafer 10. The back side 102 performs image recognition of the second feature 1020, and secondly, performs image matching and recognition on the front side 101 and the back side 102 of the wafer 10 through an identification rule preset and stored in a control circuit module (not shown). , the wafer 10 is rapidly rotated by image recognition By drop and stop the rotation mechanism 13 so as to ride wafer 10 to complete the operation of positioning the wafer 10 on the carrier member 12.

In addition, please refer to FIG. 4 , which is a schematic diagram of still another embodiment of the wafer positioning and identification device 2 proposed by the present invention. This embodiment is similar to the embodiment of FIG. 1 , and the components of the present invention are not described in detail here. Only the differences are specifically described herein. Compared with the embodiment of FIG. 1 , the detection module 28 is further included. The detection module 28 is also used for detecting and positioning the wafer 20 on the pedestal 21 , but the detection principle and the image are detected. The sensing module 27 is different, and the detection principle used by the detecting module 28 is well known to those skilled in the art and has common knowledge. It is not specifically described herein, nor is it a limitation of the present invention. . In addition, the wafer positioning and identifying device 2 also includes a control circuit module (not shown). The control circuit module is electrically connected to the rotating mechanism 23, the light source module 26, and the image sensing module 27, In addition to controlling the rotating mechanism 23, the light source module 26 and the image sensing module 27 to operate, an additional electrical connection detection module 28 is further provided, and the control circuit module can freely control whether to detect it according to the operator. The module 28, the light source module 26 and the image sensing module 27 are activated. For example, the operator may select only the motion detection module 28, or may only select the motion source module 26 and the image sensing module. In group 27, all modules: detection module 28, light source module 26, and image sensing module 27 can also be activated to improve positioning accuracy, that is, identification efficiency.

Please refer to FIG. 5, which is a schematic diagram of still another embodiment of the wafer positioning and identification device 3 proposed by the present invention. The component composition and arrangement of the wafer positioning and identifying device 3 of the present embodiment are substantially the same as those of the foregoing embodiment, and will not be further described herein. It should be particularly noted that the pedestal 31 of the present embodiment is a stable platform made of a transparent material, and the material is not particularly limited herein, and may be a transparent material such as acrylic or glass. Implemented in this embodiment. The base 31 does not have an opening, that is, if the object is placed on the base 31, the placed article can be directly seen from the bottom of the base 31. Therefore, if the wafer 30 is to be positioned and positioned in this embodiment, When the image sensing module 37 disposed on the lower surface of the pedestal 31 and the light source module 36 are activated, the back surface of the wafer 30 can be detected by the transparent pedestal 31, thereby performing rotational wafer identification and positioning.

The technical problem can solve the problem of poor wafer positioning efficiency in the prior art, and the first feature and the second feature on the wafer are identified by capturing the first feature and the second feature on the wafer. Then, through the control circuit module, the rotating mechanism is controlled, so that the wafer can be stopped and accurately positioned during the rotation process, thereby avoiding the poor yield of the wafer processing due to the inaccurate positioning; meanwhile, the user also The module to be identified can be freely selected. Through the electrical connection of the control circuit module, the light source module, the image sensing module and the detection module can be selectively selected according to the situation, thereby increasing the flexibility of use of the user. .

The above description is only a preferred embodiment of the present invention, and is not intended to limit the patent application rights of the present invention; at the same time, the above description should be understood and implemented by those skilled in the art, so that the other does not deviate from the present invention. Equivalent changes or modifications made in the spirit of the disclosure should be included in the scope of the patent application.

1, 2, 3‧‧‧ wafer positioning identification device
10, 20, 30‧‧‧ wafers
101‧‧‧ positive
1010‧‧‧ first feature
102‧‧‧Back
1020‧‧‧ second feature
11, 21, 31‧‧‧ Pedestal
110, 210‧‧‧ openings
12, 22, 32‧‧‧ Carrying parts
13, 23, 33‧‧‧ rotating mechanism
14, 24, 34‧‧‧ bracket
15, 25, 35‧‧‧ base
16, 26, 36‧‧‧ Light source module
17, 27, 37‧‧‧ image sensing module

The above and other objects, features, advantages and embodiments of the present invention can be more clearly understood. The description of the drawings is as follows: FIG. 1 is a schematic view showing an embodiment of a wafer positioning and recognizing device according to the present invention. FIG. 2 is a front view showing the wafer of the wafer positioning and identifying device according to the present invention. FIG. 3 is a schematic diagram showing the back side of the wafer according to the present invention. FIG. 4 is a schematic view showing still another embodiment of the wafer positioning and identifying device according to the present invention. FIG. 5 is a schematic view showing still another embodiment of the wafer positioning and identifying device according to the present invention. Unless otherwise indicated, the same numbers and symbols in the different figures are generally regarded as the corresponding parts. The illustrations are drawn to clearly illustrate the relevant associations of the embodiments and not to depict the actual dimensions.

Claims (10)

A wafer positioning and identifying device is used for identifying a correct position and positioning of a wafer when a wafer is rotated. The wafer positioning and identifying device comprises: a base, which is a stable platform having an opening; and a carrier On the pedestal for carrying the wafer; a rotating mechanism coupled with the pedestal assembly, when the rotating mechanism rises and holds the wafer, providing a rotational power to rotate the wafer; at least one The bracket is combined with the base assembly; at least one base is parallel to the base and combined with the bracket assembly; at least one light source module is disposed on the base for providing sufficient light source illumination function; at least one An image sensing module is disposed on the base for providing the alignment sensing function of the wafer; and a control circuit module electrically connecting the rotating mechanism, the light source modules, and the image sensing The module is configured to control the rotating mechanism, the light source modules, and the image sensing modules. The wafer positioning device of claim 1, wherein the at least one bracket is disposed on a plane above and below the base. The wafer positioning device of claim 1, wherein the wafer has a front surface and a back surface, the front surface having a first feature and the back surface having a second feature. The wafer location identification device of claim 3, wherein the first feature is a symmetrical specific pattern. The wafer location identification device of claim 3, wherein the second feature is a specific pattern of unequal edges. The wafer location identification device of claim 1, wherein the control circuit module can record at least one identification rule. The wafer positioning and identification device of claim 1, wherein the control circuit module is electrically connected to a linear motor module. The wafer location identification device according to claim 1, wherein the at least one image sensing module is an AI series sensing module of KEYENCE Corporation. A wafer positioning and identifying device is used for identifying a correct position and positioning of a wafer when a wafer is rotated. The wafer positioning and identifying device comprises: a base as a stable platform; and a carrier located at the a susceptor for carrying the wafer; a rotating mechanism coupled with the pedestal assembly, when the rotating mechanism rises to hold the wafer, providing a rotational power to rotate the wafer; at least one bracket, and The base assembly is combined; at least one base is parallel to the base and combined with the bracket assembly; at least one light source module is disposed on the base for providing sufficient light source illumination function; at least one image sensing a module disposed on the base for providing a alignment sensing function of the wafer; a detection module disposed on the base for providing a wafer detection function; and a control circuit module Electrically connecting the rotating mechanism, the light source modules, the image sensing modules, and the detecting module for controlling the rotating mechanism, the light source modules, the image sensing modules, and the Detection module. The wafer positioning identification device of claim 9, wherein the base has at least one opening.