TWI660375B - Method for manufacturing shunt resistor - Google Patents

Abstract

A method for manufacturing a shunt resistor. In this method, a first electrode plate body and a second electrode plate body are provided. The first electrode plate body has a first perforation, and the second electrode plate body has a second perforation. A resistance plate body is provided, and the resistance plate body has a first opening and a second opening. The first electrode plate body and the second electrode plate body are arranged on the resistance plate body, and the first perforations are correspondingly located on the first openings, and the second perforations are correspondingly located on the second openings. The first rivet is pressurized and disposed in the corresponding first perforation and first opening, and the second rivet is pressurized and disposed in the corresponding second perforation and second opening. An electric current is applied to the first rivet and the second rivet, whereby the first rivet is fused to the first electrode plate body and the resistance plate body, and the second rivet is fused to the second electrode plate body and the resistance plate body.

Description

Manufacturing method of shunt resistor

The present invention relates to a resistor, and more particularly, to a method for manufacturing a shunt resistor.

When manufacturing shunt resistors, technologies such as E-beam welding, seam welding, or laser beam welding are generally used to combine highly conductive electrode materials with resistance alloy materials. A resistive composite is formed. The resistive composite material is cut and punched to form a preliminary model of a plurality of shunt resistors. Then, the resistance of the initial model of the shunt resistor is adjusted by using a resistance adjustment machine, so as to make the resistance of the shunt resistor accurate.

However, the electron beam welding operation must be performed under vacuum throughout, so the welding processing cost is high. In addition, the material spray phenomenon is easy to occur during electron beam welding, which not only affects the body of the resistance alloy material, but also makes it difficult to control the resistance value of the shunt resistor. It also forms holes and / or splash protrusions on the surface of the shunt resistor And the appearance of the shunt resistor is poor. In addition, if the electron beam depth is not adjusted properly during welding, an obvious bead will be formed, and the resistance of the shunt resistor will be difficult to control. Therefore, using electron beam welding technology The shunt resistor made by surgery takes a lot of time to repair the resistance. In addition, the remaining portion of the resistive composite material after stamping is not easy to recycle because it is a composite material of an electrode material and a resistive alloy material.

When using the laser to position the welding resistance composite material up and down, the laser light is often slightly larger or smaller, which will cause the appearance of the bead to be poor and the resistance control of the shunt resistor difficult. In addition, the laser welding technology also has the disadvantages that the remaining part of the material is not easy to recycle and time-consuming.

An object of the present invention is to provide a method for manufacturing a shunt resistor, which can firstly make a highly conductive electrode material and a resistance alloy material into an electrode plate body and a resistance plate body that can form a resistor module, and then use rivets to The resistance plate body is combined with the electrode plate body located on the resistance plate body. Therefore, the material utilization of the electrode material and the resistance material is high, the rest of the electrode material and the resistance material is easy to recycle, and the shunt resistor can have various appearances according to the use requirements.

Another object of the present invention is to provide a method for manufacturing a shunt resistor, which can use rivets to predetermine the electrode plate body on the resistance plate body, and can apply external force and current to the rivets so that the current is mainly concentrated at the rivets. Therefore, the heat generated by the passing current is also concentrated at the joint of the rivet and the resistance plate body, so that the joint surfaces of the rivet and the electrode plate body and the resistance plate body are welded together due to melting and pressure. Therefore, the application of this method can effectively improve production efficiency, greatly reduce the energy consumption of the fusion resistor module, and further reduce the production cost of the shunt resistor. In addition, rivets are fused to the electrode plate body and the resistance plate body. The combination method can strengthen the structure of the shunt resistor, and thus can improve the stability of the shunt resistor.

Another object of the present invention is to provide a method for manufacturing a shunt resistor, which can adjust the resistance value of the shunt resistor by changing the distance between the first electrode plate body and the second electrode plate body. The resistance value is easy to control.

According to the above object of the present invention, a method for manufacturing a shunt resistor is proposed. In this method, a first electrode plate body and a second electrode plate body are provided, wherein the first electrode plate body has at least one first perforation and the second electrode plate body has at least one second perforation. A resistance plate body is provided, wherein the resistance plate body has at least one first opening and at least one second opening. The first electrode plate body and the second electrode plate body are disposed on one surface of the resistance plate body, and the first perforation of the first electrode plate body is correspondingly located on the first opening of the resistance plate body, and the second electrode The second perforation of the plate body is correspondingly located on the second opening of the resistance plate body. At least one first rivet is pressurized and disposed in the corresponding first perforation and first opening, and at least one second rivet is pressurized and disposed in the corresponding second perforation and second opening. An electric current is applied to the first rivet and the second rivet, whereby the first rivet is fused to the first electrode plate body and the resistance plate body, and the second rivet is fused to the second electrode plate body and the resistance plate body.

According to an embodiment of the present invention, the sizes of the first electrode plate body and the second electrode plate body are different from each other.

According to an embodiment of the present invention, when the current is applied to the first rivet and the second rivet, the method includes using a plurality of carbon rod plates or a plurality of tungsten rod plates to press the first rivet, the second rivet, and the resistor plate respectively. .

According to an embodiment of the present invention, the application of the current to the first rivet and the second rivet is performed under an inert gas environment.

According to the above object of the present invention, another method for manufacturing a shunt resistor is proposed. In this method, a resistance plate is set on a conveying mechanism. Arranging a plurality of electrode plate groups on one surface of the resistance plate, wherein each electrode plate group includes a first electrode plate body and a second electrode plate body, and each of the first electrode plate bodies has at least one first perforation, Each second electrode plate body has at least one second perforation, and the resistance plate has a plurality of first openings and a plurality of second openings, wherein the first perforations are respectively located on the first openings of the resistance plate, The second perforations are respectively located on the second openings of the resistance plate. The plurality of first rivets are pressurized and disposed in the corresponding first perforations and first openings, respectively, and the plurality of second rivets are pressurized and disposed in the corresponding second perforations and second openings, respectively. Applying a current to the first rivet and the second rivet in each electrode plate group, so that the first rivet in the first electrode plate of each electrode plate group is welded to the first electrode plate and the resistance plate, and The second rivet in the second electrode plate body of each electrode plate body group is welded to the second electrode plate body and the resistance plate. The resistive plate is divided to form a plurality of shunt resistors, each of which includes one of the electrode plate body groups.

According to an embodiment of the present invention, the sizes of the first electrode plate body and the second electrode plate body of the electrode plate group in each of the shunt resistors are different from each other.

According to an embodiment of the present invention, when the current is applied to the first rivet and the second rivet in each electrode plate group, the method includes using a plurality of rivets. The carbon rod plate or a plurality of tungsten rod plates are respectively pressed on the first rivet, the second rivet, and the resistance plate.

According to an embodiment of the present invention, the first rivet is pressurized and disposed in the corresponding first perforation and the second opening, and the second rivet is pressurized and disposed in the corresponding second perforation and the second. The opening includes pressing a carbon rod plate or a tungsten rod plate with the first pressing element and the second pressing element.

According to an embodiment of the present invention, the materials of the first rivet and the second rivet are the same as those of the first electrode plate body and the second electrode plate body.

According to an embodiment of the present invention, the application of the current is performed under an inert gas environment.

100‧‧‧ resistance plate

100a‧‧‧first surface

100b‧‧‧Second surface

102‧‧‧The first opening

104‧‧‧first opening

106‧‧‧Second opening

108‧‧‧Second opening

110‧‧‧first electrode plate

110w‧‧‧Width

112‧‧‧first perforation

114‧‧‧ first perforation

120‧‧‧Second electrode plate body

120w‧‧‧Width

122‧‧‧second perforation

124‧‧‧ second perforation

130‧‧‧ Resistor Module

140‧‧‧First Rivet

142‧‧‧First Rivet

144‧‧‧Second Rivet

146‧‧‧Second Rivet

150‧‧‧ pressure

152‧‧‧first pressurizing element

154‧‧‧Second pressure element

160‧‧‧ Power

162‧‧‧first lead

164‧‧‧Second Lead

170‧‧‧ the first conductive element

172‧‧‧Second conductive element

180‧‧‧ inert gas

200‧‧‧ steps

210‧‧‧ steps

220‧‧‧step

230‧‧‧ steps

240‧‧‧ steps

300‧‧‧ shunt resistor

310‧‧‧Resistance plate

310a‧‧‧Resistance plate

312‧‧‧first surface

314‧‧‧Second Surface

316‧‧‧The first opening

318‧‧‧Second opening

320‧‧‧ Delivery agency

322‧‧‧direction

324‧‧‧Export

330‧‧‧electrode plate group

332‧‧‧first electrode plate

332a‧‧‧first perforation

332w‧‧‧Width

334‧‧‧Second electrode plate body

334a‧‧‧second perforation

334w‧‧‧Width

340‧‧‧First Rivet

342‧‧‧Second Rivet

350‧‧‧ Pressure

352‧‧‧first pressurizing element

354‧‧‧Second pressure element

360‧‧‧ Power

362‧‧‧First Lead

364‧‧‧Second Lead

370‧‧‧First conductive element

372‧‧‧Second conductive element

380‧‧‧ split element

400‧‧‧ steps

410‧‧‧step

420‧‧‧step

430‧‧‧step

440‧‧‧step

p‧‧‧pitch

p’‧‧‧ pitch

In order to make the above and other objects, features, advantages, and embodiments of the present invention more comprehensible, the description of the drawings is as follows: [FIG. 1A] and [FIG. 1B] show a first embodiment according to the present invention A flowchart of a device for manufacturing a shunt resistor; [FIG. 2] is a flowchart showing a first method of manufacturing a shunt resistor according to an embodiment of the present invention; [FIG. 3A] is a diagram showing a second method according to the present invention A schematic diagram of an apparatus for manufacturing a shunt resistor according to an embodiment; [FIG. 3B] is a schematic perspective view illustrating a shunt resistor according to a second embodiment of the present invention; and [FIG. 4] A flowchart showing a method of manufacturing a shunt resistor according to a second embodiment of the present invention.

Please refer to FIG. 1A, FIG. 1B, and FIG. 2 at the same time, wherein FIG. 1A and FIG. 1B are flowcharts of a device for manufacturing a shunt resistor according to a first embodiment of the present invention, and FIG. A flowchart of manufacturing a shunt resistor according to an embodiment. In this embodiment, when manufacturing a shunt resistor, step 200 is first performed to provide a first electrode plate body 110 and a second electrode plate body 120. The first electrode plate body 110 has at least one first perforation, such as the first perforations 112 and 114. The second electrode plate body 120 has at least one second perforation, such as the second perforations 122 and 124. The first electrode plate body 110 and the second electrode plate body 120 may be formed into an electrode plate having a desired shape and size by using a method of punching a conductive electrode material. The material of the first electrode plate body 110 and the second electrode plate body 120 is preferably a highly conductive material, such as copper. The first electrode plate body 110 and the second electrode plate body 120 may have the same size. In some examples, in order to adjust the distance p (that is, the width of the resistance channel) between the first electrode plate body 110 and the second electrode plate body 120 to achieve the accuracy of adjusting the resistance value and reduce the trimming resistance time after welding The sizes of the first electrode plate body 110 and the second electrode plate body 120 may be designed to be different from each other. For example, the width 110w of the first electrode plate body 110 may be different from the width 120w of the second electrode plate body 120.

Go to step 210 to provide the resistance plate body 100. The resistor plate body 100, the first electrode plate body 110 and the second electrode plate body 120 may form a resistor module 130. The resistance plate body 100 has a first surface 100a opposite to each other And the second surface 100b. The resistance plate body 100 has at least one first opening and at least one second opening, such as the first openings 102 and 104 and the second openings 106 and 108, wherein the first openings 102 and 104 and the second opening The holes 106 and 108 are provided in the first surface 100a. The first openings 102 and 104 correspond to the first through holes 112 and 114 of the first electrode plate body 110, respectively, and the second openings 106 and 108 correspond to the second through holes 122 and 124 of the second electrode plate body 120, respectively. The resistance plate body 100 can be used to form a resistance plate with a desired shape and size by stamping a resistance alloy material. For example, the material of the resistance plate body 100 includes, but is not limited to, a manganese copper tin (MnCuSn) alloy, manganese copper nickel ( MnCuNi) alloy, manganese copper (MnCu) alloy, nickel chromium aluminum (NiCrAl) alloy, nickel chromium aluminum silicon (NiCrAlSi) alloy, and iron chromium aluminum (FeCrAl) alloy.

Next, step 220 is performed, the first electrode plate body 110 and the second electrode plate body 120 are disposed on the first surface 100 a of the resistance plate body 100, and the first electrode plate body 110 and the second electrode plate body 120 are placed on each other. Separately, the first electrode plate body 110 and the second electrode plate body 120 are preferably respectively disposed on opposite sides of the first surface 100 a of the resistance plate body 100. As shown in FIG. 1A, when the first electrode plate body 110 is provided, the first through holes 112 and 114 of the first electrode plate body 110 are respectively located on the first openings 102 and 104 of the resistance plate body 100, and the first A through hole 112 and 114 are aligned with the corresponding first openings 102 and 104. In addition, when the second electrode plate body 120 is provided, the second through holes 122 and 124 of the second electrode plate body 120 are respectively located on the second openings 106 and 108 of the resistance plate body 100, and the second holes 122 and 124 is aligned with the corresponding second openings 106 and 108.

Next, step 230 is performed, inserting the first rivets 140 and 142 into the corresponding first perforations 112 and the first openings 102 and the first perforations 114 and the first openings 104, and respectively inserting the second rivets 144 and 146. Insert the corresponding second through-holes 122 and second openings 106, and the second through-holes 124 and second openings 108, so that the first electrode plate body 110 and the resistance plate body 100 can be used by the first rivets 140 and 142. It is pre-bonded, and the second electrode plate body 120 and the resistor plate body 100 can be pre-bonded by using the second rivets 144 and 146, as shown in FIG. 1B. In a preferred embodiment, the first rivets 140 and 142 protrude slightly from the first electrode plate body 110, and the second rivets 144 and 146 protrude slightly from the second electrode plate body 120. The materials of the first rivets 140 and 142 and the second rivets 144 and 146 may be the same as those of the first electrode plate body 110 and the second electrode plate body 120. In some specific examples, the materials of the first rivets 140 and 142 and the second rivets 144 and 146 may be different from the materials of the first electrode plate body 110 and the second electrode plate body 120.

After completing the setting of the first rivets 140 and 142 and the second rivets 144 and 146, a pressure 150 may be applied to the second surface 100b, the first rivets 140 and 142, and the second rivets 144 and 146 of the resistance plate body 100 to The first rivets 140 and 142 and the first electrode plate body 110 are more closely joined with the resistance plate body 100, and the second rivets 144 and 146 and the second electrode plate body 120 are more closely joined with the resistance plate body 100. The second surface 100 b of the resistance plate body 100 and the first electrode plate body 110 and the second electrode plate body 120 are opposed to each other. In some examples, as shown in FIG. 1B, a plurality of first pressing elements 152 may be used to apply pressure 150 to the first rivets 140 and 142, and the second rivets 144 and 146, respectively, and a second pressing element may be used. 154 to the second of the resistance plate body 100 The surface 100b applies a pressure of 150. The material of the first pressure element 152 and the second pressure element 154 may be a material with high temperature resistance and high hardness, such as a stainless steel material or a carbon plate or a tungsten plate. In a specific example, only one first pressing element 152 may be used to apply pressure 150 to the first rivets 140 and 142 and the second rivets 144 and 146 simultaneously.

Then, step 240 is performed, and a current is applied to the first rivets 140 and 142 and the second rivets 144 and 146 by the power source 160. The power source 160 may be a DC power source or an AC power source. In some examples, the power source 160 can apply a current through a plurality of high temperature resistant first conductive elements 170 and a second conductive element 172. The first conductive element 170 and the second conductive element 172 are preferably high conductive elements such as carbon. Rod plate or tungsten rod plate. The first conductive elements 170 can press the first rivets 140 and 142 and the second rivets 144 and 146 simultaneously or sequentially, and the second conductive element 172 presses the second surface 100 b of the resistance plate body 100. In some exemplary examples, a plurality of first pressure elements 152 may be used to apply pressure 150 to the first conductive element 170, and a second pressure element 154 may be used to apply pressure 150 to the second conductive element 172. The first conductive element 170 is pressed against the first rivets 140 and 142 and the second rivets 144 and 146, respectively, and the second conductive element 172 is pressed against the second surface 100b of the resistance plate body 100. In a preferred embodiment, the first pressing member 152 is integrated into one pressing member, so that the first rivets 140 and 142 and the second rivets 144 and 146 can be applied with pressure 150 at the same time. , 142 and the second rivets 144 and 146 obtain the same pressing force, and the time required for pressing the first rivets 140 and 142 and the second rivets 144 and 146 can be reduced. Similarly, the first conductive element 170 can also be integrated into a Conductive elements to apply current to the first rivets 140 and 142 and the second rivets 144 and 146 simultaneously.

The power source 160 preferably applies a high current to the first rivets 140 and 142 and the second rivets 144 and 146. For example, the current applied by the power source 160 may be about 700A to about 800A, or higher. In some examples, the two poles of the power source 160 are connected to the first conductive element 170 and the second conductive element 172 through the first conductive line 162 and the second conductive line 164, respectively. The power source 160 applies a current to the first rivets 140 and 142 and the second rivets 144 and 146 and the resistor plate 100 via the first lead 162 and the first conductive element 170 and the second lead 164 and the second conductive element 172. When a current is applied, it is preferable to individually apply a current to the first rivets 140 and 142 and the second rivets 144 and 146 through a power switching method. In a specific example, current may be applied to the first rivets 140 and 142 and the second rivets 144 and 146 simultaneously.

Since the current is mainly concentrated on the first rivets 140 and 142 and the second rivets 144 and 146, and the current passes through the resistance plate body 100, the heat generated is also concentrated on the first rivets 140 and 142 and the second rivets 144 and 146 and The joints of the resistance plate body 100, that is, the first openings 102 and 104 and the second openings 106 and 108, are first melted due to heat. At this time, under an applied pressure of 150, the joint surfaces of the first rivets 140 and 142 and the first electrode plate body 110 and the resistance plate body 100 are welded together due to melting and pressure, and the second rivets 144 and 146 and the second electrode are welded together. The joint surfaces of the plate body 120 and the resistance plate body 100 are welded together due to melting and pressure to form a shunt resistor. Therefore, the first rivets 140 and 142 can couple the first electrode plate body 110 to the resistance plate body. The first surface 100 a of 100, and the second rivets 144 and 146 may bond the second electrode plate body 120 to the first surface 100 a of the resistance plate body 100.

The material of the first conductive element 170 and the second conductive element 172 may be a conductive material with a melting point exceeding 3000 degrees Celsius. In some exemplary examples, the first conductive element 170 and the second conductive element 172 may be a carbon rod plate or a tungsten rod plate. In some exemplary examples, when applying current to the first rivets 140 and 142 and the second rivets 144 and 146, welding is preferably performed in an inert gas 180 (such as nitrogen or argon) environment to protect the welding place and prevent welding.处 Oxidation.

In this method, an electrode material and a resistance alloy material are first made into a first electrode plate body 110, a second electrode plate body 120, and a resistance plate body 100, respectively, and then the first rivets 140 and 142 are used to combine the resistance plate body 100 and the first An electrode plate body 110 and the second rivets 144 and 146 are used to combine the resistance plate body 100 and the second electrode plate body 120. Therefore, the material utilization of the electrode material and the resistance material is high, the rest of the electrode material and the resistance material is easy to recycle, and the shunt resistor can have various appearances according to the use requirements. In addition, the first rivets 140 and 142 may pre-position the first electrode plate body 110 on the resistance plate body 100, and the second rivets 144 and 146 may pre-position the second electrode plate body 120 on the resistance plate body 100 and pass through. Directly applying pressure 150 and current to the first rivets 140 and 142 and the second rivets 144 and 146 can accelerate the welding of the first rivets 140 and 142, the first electrode plate body 110, and the resistance plate body 100, and can accelerate the first The two rivets 144 and 146, the second electrode plate bodies 120 and 120, and the resistance plate body 100 are welded. Therefore, the application of this method can effectively improve production efficiency, and can greatly reduce the energy consumption of the fusion resistor module 130, thereby reducing the shunt current. Production cost of resistors. In addition, the use of a combination of welding the first rivets 140 and 142 to the first electrode plate body 110 and the resistance plate body 100 and welding of the second rivets 144 and 146 to the second electrode plate body 120 and the resistance plate body 100 can improve the shunt The structural strength of the resistor can further improve the use stability of the shunt resistor. Furthermore, the resistance value of the shunt resistor can be adjusted by changing the distance p between the first electrode plate body 110 and the second electrode plate body 120, so the resistance value of the shunt resistor is easy to adjust and control.

Please refer to FIG. 3A, FIG. 3B and FIG. 4 at the same time, wherein FIG. 3A is a flowchart of a device for manufacturing a shunt resistor according to a second embodiment of the present invention, and FIG. 3B is a second embodiment of the present invention. A perspective view of a shunt resistor is shown in FIG. 4. FIG. 4 is a flowchart of a shunt resistor manufactured according to a second embodiment of the present invention. In this embodiment, when manufacturing the shunt resistor 300, step 400 is first performed to provide a resistance plate 310, and the resistance plate 310 is set on the transfer mechanism 320. The resistance plate 310 may be a resistance alloy plate roll, and is partially placed on the conveying mechanism 320 in a spread manner. The conveying mechanism 320 can transport the resistance plate 310 toward the forward exit end 324 along the direction 322, and continuously pull off the resistance alloy plate roll. The materials of the resistance plate 310 include, but are not limited to, manganese copper tin alloy, manganese copper nickel alloy, manganese copper alloy, nickel chromium aluminum alloy, nickel chromium aluminum silicon alloy, and iron chromium aluminum alloy. The resistance plate 310 has a first surface 312 and a second surface 314 opposite to each other. As shown in FIG. 3B, the first surface 312 of the resistance plate 310 may be provided with a plurality of first openings 316 and a plurality of second openings 318. In this embodiment, the first openings 316 and the second openings 318 do not penetrate the resistance plate 310.

Next, step 410 is performed to arrange a plurality of electrode plate body groups 330 on the first surface 312 of the resistance plate 310. In this embodiment, each electrode plate body group 330 includes a first electrode plate body 332 and a second electrode plate body 334, and the first electrode plate body 332 and the second electrode plate body 334 are separated from each other. The first electrode plate body 332 has at least one first through hole 332a, and the second electrode plate body 334 has at least one second through hole 334a. When the electrode plate body group 330 is arranged on the resistance plate 310, the first hole 332a of the first electrode plate body 332 and the second hole 334a of the second electrode plate body 334 correspond to the first opening 316 of the resistance plate 310, respectively. And the second opening 318, and align the first opening 332a and the second opening 334a with the corresponding first opening 316 and the second opening 318, respectively.

The first electrode plate body 332 and the second electrode plate body 334 can be formed into an electrode plate having a desired size and shape by punching a conductive electrode material. The material of the first electrode plate body 332 and the second electrode plate body 334 is a highly conductive material, such as copper. In an electrode plate body group 330, the first electrode plate body 332 and the second electrode plate body 334 may have the same size or different sizes. For example, in order to adjust the distance p ′ between the first electrode plate body 332 and the second electrode plate body 334 of each electrode plate body group 330, thereby adjusting the resistance value of the shunt resistor 300, the first electrode plate body 332 The width 332w and the width 334w of the second electrode plate body 334 may be different from each other.

Next, step 420 is performed, inserting a plurality of first rivets 340 into the corresponding first perforations 332a and first openings 316, and simultaneously inserting a plurality of second rivets 342 into the corresponding second perforations 334a and second openings, respectively. In 318, the first electrode plate 332 and the resistor plate are connected by using the first rivet 340. The material 310 is pre-bonded, and the second electrode plate 334 and the resistance plate 310 are pre-bonded by using the second rivet 342. In a preferred embodiment, the first rivet 340 protrudes slightly from the first electrode plate body 332 and the second rivet 342 protrudes slightly from the second electrode plate body 334. Materials of the first rivet 340 and the second rivet 342 may be the same as those of the first electrode plate body 332 and the second electrode plate body 334. However, in some specific examples, the materials of the first rivet 340 and the second rivet 342 may be different from the materials of the first electrode plate body 332 and the second electrode plate body 334.

After the first rivet 340 is inserted into the corresponding first perforation 332a and the first opening 316, and the second rivet 342 is inserted into the corresponding second perforation 334a and the second opening 318, the conveyed mechanism 320 can be conveyed and The second surface 314 of the front end portion of the resistance plate 310 protruding from the outlet end 324 and the first rivet 340 and the second rivet 342 on the electrode plate body group 330 on the front end portion apply a pressure of 350 to thereby make the first rivet 340 and the first electrode plate body 332 of the electrode plate body group 330 and the resistance plate 310 are more tightly connected, and the second rivet 342 and the second electrode plate body 334 of the electrode plate body group 330 and the resistance plate 310 are more closely connected. Tightly joined. The second surface 314 of the resistance plate 310 and the first electrode plate body 332 and the second electrode plate body 334 are opposed to each other. In some examples, as shown in FIG. 3A, the first pressing element 352 and the second pressing element 354 can be used to apply a pressure 350 to the first rivet 340, the second rivet 342, and the resistance plate 310, where the first pressure The element 352 and the second pressurizing element 354 are adjacent to the exit end 324 of the transfer mechanism 320. The material of the first pressure element 352 and the second pressure element 354 may be a material with high temperature resistance and high hardness, such as a stainless steel material or a carbon rod plate or a tungsten rod plate.

Next, step 430 is performed, using the power source 360 to pass through the first rivet 340 on the first electrode plate 332 and the second rivet 342 on the second electrode plate 334 on the front end portion of the resistance plate 310 and the front end portion. A current is applied to the first rivet 340 and the second rivet 342. The power source 360 may be a DC power source or an AC power source. In some examples, the power supply 360 can apply a current through the high temperature resistant first conductive element 370 and the second conductive element 372, wherein the first conductive element 370 and the second conductive element 372 are adjacent to the outlet end 324 of the transmission mechanism 320. The first conductive element 370 can simultaneously press the first rivet 340 and the second rivet 342 on the front end portion of the resistance plate 310, and the second conductive element 372 presses the second surface 314 at the front end portion of the resistance plate 310. In some examples, as shown in FIG. 3A, two first conductive elements 370 may be used to press the first rivet 340 and the second electrode plate 332 on the first electrode plate 332 on the front end portion of the resistance plate 310, respectively. The second rivet 342 on 334. In some exemplary examples, the first pressurizing element 352 and the second pressurizing element 354 may be used to apply pressure 350 to the first conductive element 370 and the second conductive element 372, respectively, so that the first conductive element 370 is pressed against A rivet 340 and a second rivet 342 simultaneously press the second conductive element 372 onto the second surface 314 of the resistance plate 310. At the same time, a current is applied to the first rivet 340 and the second rivet 342 by the power source 360 via the first conductive element 370 and the second conductive element 372. The power source 360 preferably applies a high current to the first rivet 340 and the second rivet 342, for example, about 700A to about 800A, or higher. In some examples, the two poles of the power source 360 are connected to the first conductive element 370 and the second conductive element 372 through the first conductive wire 362 and the second conductive wire 364, respectively. The power source 360 passes through the first lead 362 and the second lead 364, and the first The conductive element 370 and the second conductive element 372 apply a current to the first rivet 340 from the resistance plate 310 and the first rivet 340, and apply a current to the second rivet 342 from the resistance plate 312 and the second rivet 342. The material of the first conductive element 370 and the second conductive element 372 may be a conductive material having a melting point exceeding 3000 degrees Celsius. The first conductive element 370 and the second conductive element 372 are preferably highly conductive elements such as a carbon rod plate or a tungsten rod plate.

Since the current is mainly concentrated at the first rivet 340 and the second rivet 342, and the current passes through the resistance plate 310, the heat generated is also concentrated at the joints of the first rivet 340 and the second rivet 342 and the resistance plate 310, so these joints The place melts first due to heat. At this time, the joint surface of the first rivet 340 and the first electrode plate body 332 and the resistance plate 310 is welded together due to melting and pressure, and the joint surface of the second rivet 340 and the second electrode plate body 334 and the resistance plate 310 is fused together. Welded together due to melting pressure. Therefore, the first rivet 340 and the second rivet 342 can respectively couple the first electrode plate body 332 and the second electrode plate body 334 to the first surface 312 of the resistance plate 310. In some exemplary examples, the operation of applying a current to the first rivet 340 and the second rivet is performed in an inert gas (such as nitrogen or argon) environment to protect the weld and prevent oxidation at the weld. In this embodiment, the resistance plate 310 and the first rivet 340 and the second rivet 342 located on the resistance plate 310 and the first rivet 340 and the second rivet 342 on the transmission mechanism 320 which are transmitted to the outlet end 324 thereof are sequentially applied to sequentially assemble the electrode plate group. 330 is bonded to the first surface 312 of the resistance plate 310.

Then, step 440 is performed to divide the resistive plate 310 using the dividing element 380 to form a plurality of shunt resistors 300. The separating element 380 may be, for example, a stamping element or a cutting element. The resistance plate 310 is formed after being divided A plurality of resistor plates 310a. As shown in FIG. 3B, each shunt resistor 300 includes a resistance plate body 310a, an electrode plate body group 330 on the resistance plate body 310a, and a first electrode plate body 332 and a first electrode plate body 332 of the electrode plate body group 330, respectively. The two electrode plate body 334 is coupled to the first rivet 340 and the second rivet 342 on the resistance plate body 310a.

Because the method can sequentially apply pressure 350 and current to the front end of the resistance plate 310 and the first rivets 340 and second rivets 342 on the resistance plate 310 as the conveyance mechanism 320 conveys, the first rivets 340 and the first The two rivets 342 are used for welding the electrode plate body group 330 and the resistance plate 310. By further dividing the resistance plate 310, the shunt resistor 300 can be continuously produced, so the application of this method can greatly improve the production efficiency of the shunt resistor 300.

Although the present invention has been disclosed as above by way of example, it is not intended to limit the present invention. Any person with ordinary knowledge in this technical field can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be determined by the scope of the appended patent application.

Claims (10)

A method for manufacturing a shunt resistor includes: providing a first electrode plate body and a second electrode plate body, wherein the first electrode plate body has at least one first perforation, and the second electrode plate body has at least one second Perforation; providing a resistance plate body, wherein the resistance plate body has at least a first opening and at least a second opening; the first electrode plate body and the second electrode plate body are arranged in one of the resistance plate bodies On the surface, the first perforation of the first electrode plate body is correspondingly located on the first opening of the resistance plate body, and the second perforation of the second electrode plate body is correspondingly located on the resistance plate body. On the second opening; pressing and setting at least one first rivet in the corresponding first perforation and the first opening; and pressing and setting at least one second rivet in the corresponding second perforation And the second opening; and applying a current to the first rivet and the second rivet, thereby welding the first rivet with the first electrode plate body and the resistance plate body, and making the second rivet Fusion welding with the second electrode plate body and the resistance plate body. For example, the manufacturing method of a shunt resistor according to item 1 of the patent application, wherein the sizes of the first electrode plate body and the second electrode plate body are different from each other. For example, the method for manufacturing a shunt resistor according to item 1 of the patent application, wherein applying the current to the first rivet and the second rivet includes using a plurality of carbon rod plates or a plurality of tungsten rod plates to be pressed on the first The rivet and the second rivet and the resistor plate body. For example, the method for manufacturing a shunt resistor according to item 1 of the application, wherein the current is applied to the first rivet and the second rivet under an inert gas environment. A method for manufacturing a shunt resistor includes: setting a resistance plate on a conveying mechanism; arranging a plurality of electrode plate groups on one surface of the resistance plate, wherein each of the electrode plate groups includes a first An electrode plate body and a second electrode plate body, each of the first electrode plate bodies has at least one first perforation, each of the second electrode plate bodies has at least one second perforation, and the resistance plate has a plurality of A plurality of first openings and a plurality of second openings, wherein the first perforations are respectively located on the first openings, and the second perforations are respectively located on the second openings; A rivet is pressurized and disposed in the corresponding first perforations and the first openings, and a plurality of second rivets are pressurized and disposed in the corresponding second perforations and the second openings, respectively. A hole; applying a current to the first rivets and the second rivets in each of the electrode plate groups, so that the first rivets in the first electrode plate of each of the electrode plate groups Welding with the first electrode plate body and the resistance plate, and The second rivet in the second electrode plate body of each of the electrode plate body groups is welded to the second electrode plate body and the resistance plate; and a division operation is performed on the resistance plate to form a plurality of shunt resistors. Each of the shunt resistors includes one of the electrode plate groups. For example, the manufacturing method of a shunt resistor according to item 5 of the application, wherein the size of the first electrode plate body and the second electrode plate body of the electrode plate group in each of the shunt resistors are different from each other. For example, the method for manufacturing a shunt resistor according to item 5 of the patent application, wherein applying the current to the first rivet and the second rivet in each of the electrode plate groups includes using a plurality of carbon rod plates or a plurality of carbon rod plates. The tungsten rod plate is respectively pressed on the first rivet, the second rivet, and the resistance plate. For example, the method for manufacturing a shunt resistor according to item 7 of the patent application, wherein the first rivets are respectively pressed and disposed in the corresponding first perforations and the second openings, and the second The rivets are respectively pressurized and disposed in the corresponding second perforations and the second openings, and the application of the first or second pressing element to the carbon rod plates or the tungsten rod plates is performed. Pressure. For example, the manufacturing method of the shunt resistor according to item 5 of the patent application, wherein the materials of the first rivets and the second rivets are the same as those of the first electrode plates and the second electrode plates. For example, the method for manufacturing a shunt resistor according to item 5 of the application, wherein the application of the current is performed under an inert gas environment.