TWI658771B - Electronic device and method for making same - Google Patents

Abstract

An electronic device includes a housing, a battery, and a display screen. The housing includes at least a glass back cover. One surface of the glass back cover forms an explosion-proof layer, and the battery is housed in the housing and disposed on the housing. A glass back cover is provided with one side of the explosion-proof layer, the display screen is provided on one side of the battery, and is accommodated and partially exposed to the casing. The invention also provides a method for manufacturing the electronic device.

Description

Electronic device and preparation method thereof

The invention relates to an electronic device and a preparation method thereof.

Currently, more and more electronic devices use glass cases as their housings. However, since the glass shell itself is fragile, and the glass is broken, it is easy to splash and cause harm to the human body.

In view of this, it is necessary to provide an electronic device that prevents the glass case from being broken and splashed.

The invention also provides a method for manufacturing the electronic device.

An electronic device includes a housing, a battery, and a display screen. The housing includes at least a glass back cover. One surface of the glass back cover forms an explosion-proof layer, and the battery is housed in the housing and disposed on the housing. A glass back cover is provided with one side of the explosion-proof layer, the display screen is provided on one side of the battery, and is accommodated and partially exposed to the casing.

An electronic device manufacturing method includes the following steps: providing a glass substrate to be processed; performing 3D molding processing on the glass substrate to form a glass back cover; spraying an explosion-proof paint on the surface of the glass back cover, and Forming an explosion-proof layer; providing a shell matching the glass back cover, the shell including a frame, the frame including a bottom plate, and a connector formed on one surface of the bottom plate; On the housing; dispensing, using a dispenser to form an adhesive layer on the surface of the connecting member facing away from the base plate; and The glass back cover is installed, and the glass back cover is disposed on the housing through the adhesive layer, and a peripheral edge of the glass back cover abuts against the frame.

In summary, one surface of the glass back cover in the electronic device is provided with an explosion-proof layer. The setting of the explosion-proof layer can prevent the glass back cover from being scattered and hurting when the electronic device is dropped.

100‧‧‧ electronic device

10‧‧‧shell

101‧‧‧ border

1011‧‧‧ floor

1013‧‧‧First protrusion

1015‧‧‧ second protrusion

1017‧‧‧ opening

102‧‧‧ Medium frame

1021‧‧‧Receiving slot

103‧‧‧ glass back cover

1031‧‧‧Plane Department

1033‧‧‧ Bend

1035‧‧‧Explosion-proof layer

104‧‧‧Connector

1041‧‧‧Mating faces

105‧‧‧ Gap

1051‧‧‧Adhesive layer

20‧‧‧ Battery

30‧‧‧ Display

40‧‧‧ glass front cover

50‧‧‧ protective shell

60‧‧‧Buffer layer

601‧‧‧Connection layer

200‧‧‧ accommodation space

FIG. 1 is a schematic structural diagram of an electronic device according to a preferred embodiment of the present invention.

FIG. 2 is an exploded schematic view of a part of the electronic device shown in FIG. 1.

FIG. 3 is an exploded view of the electronic device shown in FIG. 2 from another perspective.

FIG. 4 is a schematic partial cross-sectional view taken along the line IV-IV in FIG. 1.

In the following, the technical solutions in the embodiments of the present invention will be clearly and completely described with reference to the drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those with ordinary knowledge in the technical field without making creative work fall within the protection scope of the present invention.

It should be noted that when a component is called "fixed to" another component, it may be directly on another component or a centered component may exist. When a component is considered to be "connected" to another component, it can be directly connected to another component or a centered component may exist at the same time. When a component is considered to be “set on” another component, it can be directly set on another component or a centered component may exist at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to limit the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

Referring to FIG. 1, a preferred embodiment of the present invention provides an electronic device 100. The electronic device 100 may be a mobile phone, a tablet computer, or the like. In this embodiment, the electronic device 100 is taken as an example for description.

Please refer to FIG. 2 and FIG. 3 together. The electronic device 100 includes a casing 10, a battery 20 and a display screen 30. The battery 20 is housed in the casing 10. The display screen 30 is disposed on one side of the battery 20, and accommodates and is partially exposed on the casing 10 as an exterior surface of the casing 10. The battery 20 is electrically connected to the display screen 30 to provide power for the operation of the display screen 30.

The casing 10 includes a frame 101, a middle frame 102 and a glass back cover 103.

In this embodiment, the frame 101 is made of metal, such as stainless steel. The frame 101 has a hollow frame structure. The frame 101 includes a bottom plate 1011, a first protruding portion 1013 and a second protruding portion 1015. In this embodiment, the first protruding portion 1013 is disposed on one surface of the bottom plate 1011 and is located on a periphery of the bottom plate 1011. The second protruding portion 1015 is disposed on a surface of the bottom plate 1011 facing away from the first protruding portion 1013, and is located at a connection between the bottom plate 1011 and the first protruding portion 1013. That is, the first protruding portion 1013 and the second protruding portion 1015 are disposed on two opposite surfaces of the bottom plate 1011. Wherein, in this embodiment, the thickness of the frame 101 is approximately 2.3 mm to 2.5 mm, that is, the end portion of the first protruding portion 1013 far from the bottom plate 1011 to the second protruding portion 1015 are far from The distance between the ends of the bottom plate 1011 is approximately 2.3 mm to 2.5 mm.

It can be understood that an opening 1017 is defined in the middle of the bottom plate 1011. The opening 1017 is disposed through the bottom plate 1011. In this embodiment, a cross section of the middle frame 102 is substantially U-shaped. All The middle frame 102 is formed in the opening 1017 and is recessed with respect to the bottom plate 1011 to form a receiving groove 1021 together with the bottom plate 1011.

The glass back cover 103 is disposed on the frame 101. A peripheral edge of the glass back cover 103 abuts against the first protruding portion 1013 and forms a receiving space 200 (see FIG. 4) with the bottom plate 1011. The accommodating space 200 is configured to cooperate with the accommodating slot 1021 to receive the battery 20 together.

Specifically, in this embodiment, the glass back cover 103 is a 3D curved glass. The glass back cover 103 includes a flat portion 1031 and a curved portion 1033. The bent portion 1033 is formed by bending a peripheral edge of the flat portion 1031 in a direction away from the flat portion 1031. A peripheral edge of the curved portion 1033 abuts the first protruding portion 1013 of the frame 101, so that the glass back cover 103 is assembled on the frame 101.

Please refer to FIG. 4 together. In this embodiment, a length L of the curved portion 1033 with respect to the flat portion 1031 is approximately 6.3 mm to 6.6 mm, and a depth H of the curvature is approximately 3 mm to 3.3 mm.

Further, in this embodiment, an explosion-proof layer 1035 is formed on a surface of the glass back cover 103 facing the middle frame 102. The explosion-proof layer 1035 is used to prevent the glass back cover 103 from being scattered and hurting when the electronic device 100 is dropped. Specifically, the explosion-proof layer 1035 is formed by spraying a layer of explosion-proof paint on a surface of the glass back cover 103 facing the middle frame 102. The proportion of the explosion-proof paint is: 45% -55% water-based isocyanate resin, 30% -40% polyurethane resin, and 5% -25% pure water. The thickness of the explosion-proof layer 1035 is 0.03-0.05 mm. In this embodiment, the ratio of the water-based isocyanate resin and the polyurethane resin may be determined before determining the ratio of pure water.

Further, the casing 10 further includes a connecting member 104. The connecting member 104 is disposed on the bottom plate 1011 and is used to assist in setting the glass back cover 103 on the frame 101. In this embodiment, the connecting member 104 is a plastic member. The connecting member 104 may be formed on the bottom plate 1011 by injection molding or the like.

Specifically, the connecting member 104 is formed on a surface of the bottom plate 1011 facing the glass back cover 103 and is disposed opposite to the curved portion 1033. That is, the connecting member 104 and the first protruding portion 1013 are disposed on a surface of the bottom plate 1011 facing the glass back cover 103, and the two are disposed at intervals. In this embodiment, the cross-section of the connecting member 104 is substantially fan-shaped. A surface of the connecting member 104 facing the glass back cover 103 forms a mating surface 1041 matching the bending portion 1033. In this way, when the glass back cover 103 is disposed on the frame 101, the periphery of the curved portion 1033 abuts against the first protruding portion 1013 of the frame 101 and is spaced from the mating surface 1041, and further A gap 105 is formed. In this way, by filling the gap 105 with an adhesive to form an adhesive layer 1051 in the gap 105, the glass back cover 103 is effectively assisted to be disposed on the frame 101.

The display screen 30 is disposed on a surface of the middle frame 102 away from the battery 20. Preferably, the display screen 30 is a POLED (Plastic Organic Light-Emitting Diode) display screen.

It can be understood that, in other embodiments, the electronic device 100 further includes a glass front cover 40. The glass front cover 40 is a 3D curved glass. The glass front cover 40 is disposed on the display screen 30, and a peripheral edge of the glass front cover 40 abuts against the second protruding portion 1015 of the frame 101 to protect the display screen 30. In this embodiment, the thickness D of the electronic device 100 is 7.4 mm to 7.8 mm.

It can be understood that, in other embodiments, the electronic device 100 further includes a protective case 50. Specifically, the protective shell 50 is an inverted U-shape. The protective case 50 is disposed on the bottom plate 1011 and is located between the glass back cover 103 and the middle frame 102 to protect the battery 20. Wherein, the U-shaped opening of the protective shell 50 faces the middle frame 102 and corresponds to the receiving groove 1021.

It can be understood that, in other embodiments, the electronic device 100 further includes a buffer layer 60. The buffer layer 60 is disposed on a surface of the explosion-proof layer 1035. Specifically, a connection layer 601 is disposed on one surface of the buffer layer 60, so that the buffer layer 60 is disposed on the explosion-proof layer 1035 through the connection layer 601. The surface of the buffer layer 60 far from the glass back cover 103 resists the protection. Shell 50. In this way, when the electronic device 100 is dropped, the buffer layer 60 provides a reaction force to the glass back cover 103, so that the glass back cover 103 is buffered when dropped, thereby protecting the glass. Purpose of the back cover 103. In this embodiment, the buffer layer 60 is foam. The connection layer 601 is an adhesive layer.

The invention provides a method for preparing the electronic device 100, which includes the following steps: providing a glass substrate to be processed.

The glass substrate is subjected to a 3D molding process to form a glass back cover 103 and a glass front cover 40. The glass back cover 103 includes a flat portion 1031 and a curved portion 1033. The bent portion 1033 is formed by bending a peripheral edge of the flat portion 1031 in a direction away from the flat portion 1031. A length L of the curved portion 1033 with respect to the flat portion 1031 is approximately 6.3 mm to 6.6 mm, and a depth H of the curvature is approximately 3 mm to 3.3 mm.

The 3D molding process is performed on the glass back cover 103. Specifically, the glass back cover 103 is machined to form a plurality of through holes (not shown) in the glass back cover 103. The through hole may be a camera hole, a fingerprint recognition hole, or a flash hole.

Equipped with explosion-proof paint. The proportion of the explosion-proof paint is: 45% -55% water-based isocyanate resin, 30% -40% polyurethane resin, and 5% -25% pure water.

The explosion-proof paint with the above configuration is sprayed on one surface of the glass back cover 103, for example, the inner surface of the glass back cover 103.

The glass back cover 103 is subjected to a baking treatment to form the explosion-proof layer 1035. Wherein, the thickness of the explosion-proof layer 1035 is 0.03-0.05 mm.

A buffer layer 60 is provided, and the buffer layer 60 is disposed on a surface of the explosion-proof layer 1035. Specifically, a connection layer 601 is formed on the surface of the buffer layer 60, so that the buffer layer 60 is disposed on the explosion-proof layer 1035 through the connection layer 601. In this embodiment, the buffer layer 60 is foam. The connection layer 601 is an adhesive layer.

A frame 101 is provided to match the glass back cover 103.

In this embodiment, the frame 101 is made of metal, such as stainless steel. The frame 101 has a hollow frame structure. The frame 101 includes a bottom plate 1011, a first protruding portion 1013 and a second protruding portion 1015. In this embodiment, the first protruding portion 1013 is disposed on one surface of the bottom plate 1011 and is located on a periphery of the bottom plate 1011. The second protruding portion 1015 is disposed on a surface of the bottom plate 1011 facing away from the first protruding portion 1013, and is located at a connection between the bottom plate 1011 and the first protruding portion 1013. That is, the first protruding portion 1013 and the second protruding portion 1015 are disposed on two opposite surfaces of the bottom plate 1011. It can be understood that an opening 1017 is defined in the middle of the bottom plate 1011. The opening 1017 penetrates the bottom plate 1011.

A middle frame 102 is provided. In this embodiment, a cross section of the middle frame 102 is substantially U-shaped. The middle frame 102 is formed in the opening 1017 and is recessed relative to the bottom plate 1011 to form an accommodating groove 1021.

A connecting member 104 is formed on a surface of the bottom plate 1011, for example, a surface facing the glass back cover 103. Specifically, the connecting member 104 may be formed on a surface of the bottom plate 1011 away from the bottom plate 1011 by injection molding or the like. A cross-section of the connecting member 104 is substantially fan-shaped. A surface of the connecting member 104 facing away from the bottom plate 1011 forms a mating surface 1041 matching the bending portion 1033.

The battery 20, the display screen 30, the glass front cover 40 and the protective shell 50 are mounted on the frame 101 of the casing 10. Specifically, first, the display screen 30 is disposed on a surface of the middle frame 102 away from the receiving slot 1021. Next, the glass front cover 40 is mounted on the display screen 30 and abuts against the second protruding portion 1015 of the frame 101. Then, the battery 20 is disposed in the accommodating groove 1021, and the protective shell 50 is disposed on a surface of the battery 20 away from the middle frame 102 to fix the battery 20 together with the middle frame 102. Mentioned battery 20.

Dispensing. Specifically, a glue dispenser (not shown) is used to apply glue on the surface of the mating surface 1041 of the connecting member 104 to form an adhesive layer 1051.

Assembling the glass back cover 103. Specifically, the glass back cover 103 is disposed on the frame 101 of the casing 10 through an adhesive layer 1051, and a surface of the buffer layer 60 away from the glass back cover 103 abuts against the protective shell 50. At the same time, the peripheral edge of the curved portion 1033 abuts against the first protruding portion 1013 of the frame 101, and the surface of the curved portion 1033 corresponding to the connecting member 104 is adhered to the adhesive layer 1051, so that The glass back cover 103 is disposed on the frame to complete the assembly of the electronic device 100.

In summary, the inner surface of the glass back cover 103 in the electronic device 100 is provided with an explosion-proof layer 1035. The setting of the explosion-proof layer 1035 can prevent the glass back cover 103 from being scattered and hurting when the electronic device 100 is dropped. In addition, the electronic device 100 is further provided with a buffer layer 60. In this way, when the electronic device 100 is dropped, the buffer layer 60 provides a reaction force to the glass back cover 103, so that the glass back cover 103 is buffered when dropped, thereby effectively protecting the glass back Cover 103.

In summary, the present invention has indeed met the requirements for an invention patent, and a patent application has been filed in accordance with the law. However, the above is only a preferred embodiment of the present invention, and the scope of the present invention is not limited to the above embodiments. For those who are familiar with the technology of this case, equivalent modifications or changes made according to the spirit of the present invention should be Covered in the following patent applications.

Claims (14)

An electronic device includes a casing, a battery, and a display screen. The improvement is that the casing includes at least a glass back cover, one surface of the glass back cover forms an explosion-proof layer, and the battery is housed in the casing and The display is disposed on a side of the glass back cover provided with the explosion-proof layer, the display screen is disposed on a side of the battery, and is accommodated and partially exposed to the casing. The casing further includes a frame and a connection. Piece, the frame includes a bottom plate, the connecting piece is formed on a surface of the bottom plate facing the glass back cover, and a surface of the connecting piece facing away from the bottom plate forms an adhesive layer to make the glass back cover The adhesive layer is arranged on the frame. The electronic device according to item 1 of the scope of patent application, wherein the explosion-proof layer is formed by spraying an explosion-proof paint on one surface of the glass back cover, and the proportion of the explosion-proof paint is 45% -55% water-based. The thickness of the explosion-proof layer is isocyanate resin, 30% -40% polyurethane resin, and 5% -25% pure water. The electronic device according to item 1 of the scope of patent application, wherein the glass back cover includes a flat portion and a bent portion, and the bent portion is formed by bending a peripheral edge of the flat portion in a direction away from the flat portion. The length of the bent portion with respect to the flat portion is 6.3 mm to 6.6 mm, and the depth of the bent portion is 3 mm to 3.3 mm. The electronic device according to item 3 of the patent application scope, wherein the frame further includes a first protruding portion, and the first protruding portion is disposed on a surface of the bottom plate facing the glass back cover and is located on the surface A peripheral edge of the bottom plate and a peripheral edge of the curved portion abut against the first protruding portion. The electronic device according to item 4 of the scope of patent application, wherein the connecting member is disposed opposite to the curved portion, and a surface of the connecting member facing the glass back cover forms a mating surface matching the curved portion, The adhesive layer is formed on the mating surface, and the bent portion is attached to the adhesive layer to set the glass back cover on the frame. The electronic device according to item 5 of the scope of patent application, wherein an opening is opened in the middle of the bottom plate, the opening is provided through the bottom plate, the housing further includes a middle frame, and the middle frame is formed in the opening And is recessed with respect to the bottom plate so as to form an accommodating groove together with the bottom plate, and the battery is disposed in the accommodating groove. The electronic device according to item 4 of the patent application scope, wherein the electronic device further includes a glass front cover, the frame further includes a second protruding portion, and the second protruding portion is disposed on the base plate facing away from the substrate. The surface of the first protruding portion is located at a connection between the bottom plate and the first protruding portion, wherein the glass front cover is attached to a surface of the display screen away from the frame, and the glass A peripheral edge of the front cover abuts against the second protruding portion. The electronic device according to item 4 of the scope of patent application, wherein the material of the frame is stainless steel. The electronic device according to item 6 of the scope of patent application, wherein the electronic device further includes a protective case and a buffer layer, the protective case is disposed on the bottom plate and is located between the glass back cover and the middle frame. Meanwhile, the buffer layer is disposed on the surface of the explosion-proof layer and resists the protective shell. An electronic device manufacturing method includes the following steps: providing a glass substrate to be processed; performing 3D molding processing on the glass substrate to form a glass back cover; spraying an explosion-proof paint on the surface of the glass back cover, and Forming an explosion-proof layer; providing a shell matching the glass back cover, the shell including a frame, the frame including a bottom plate, and a connector formed on one surface of the bottom plate; On the housing; dispensing, using a dispenser to form an adhesive layer on the surface of the connecting member facing away from the bottom plate; and installing the glass back cover, passing the glass back cover through the adhesive An adhesive layer is disposed on the casing, and a peripheral edge of the glass back cover abuts against the frame. The method for manufacturing an electronic device according to item 10 of the scope of patent application, wherein the method for manufacturing the electronic device includes the steps of: performing a hole-opening treatment on the glass back cover to form a plurality of through holes in the glass back cover . The method for manufacturing an electronic device according to claim 10, wherein the glass back cover includes a flat portion and a bent portion, and the bent portion is formed by bending a peripheral edge of the flat portion in a direction away from the flat portion. The bent portion is attached to the adhesive layer. The method for manufacturing an electronic device according to item 12 of the scope of patent application, wherein the connecting member is formed on a surface of the bottom plate facing the glass back cover by injection molding, and the connecting member is disposed opposite to the curved portion. A mating surface matching the curved portion is formed on a surface facing the glass back cover, and the adhesive layer is formed on the mating surface. The method for preparing an electronic device according to item 10 of the scope of patent application, wherein the proportion of the explosion-proof paint is: 45% -55% water-based isocyanate resin, 30% -40% polyurethane resin, and 5%- 25% pure water, the thickness of the explosion-proof layer is 0.03-0.05mm.