CN108111725B - Camera assembly, electronic equipment, camera decorating ring and processing method thereof - Google Patents

Camera assembly, electronic equipment, camera decorating ring and processing method thereof Download PDF

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Publication number
CN108111725B
CN108111725B CN201711395298.0A CN201711395298A CN108111725B CN 108111725 B CN108111725 B CN 108111725B CN 201711395298 A CN201711395298 A CN 201711395298A CN 108111725 B CN108111725 B CN 108111725B
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CN
China
Prior art keywords
camera
aluminum alloy
base material
alloy base
treatment
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Expired - Fee Related
Application number
CN201711395298.0A
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Chinese (zh)
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CN108111725A (en
Inventor
吴寿宽
曾武春
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guangdong Oppo Mobile Telecommunications Corp Ltd
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Guangdong Oppo Mobile Telecommunications Corp Ltd
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Priority to CN201711395298.0A priority Critical patent/CN108111725B/en
Publication of CN108111725A publication Critical patent/CN108111725A/en
Application granted granted Critical
Publication of CN108111725B publication Critical patent/CN108111725B/en
Expired - Fee Related legal-status Critical Current
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    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50Constructional details
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B24B1/04Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

Abstract

The embodiment of the application provides a camera assembly, electronic equipment, a camera decorative ring and a processing method thereof. The processing method of the camera decorating ring comprises the following steps: providing an aluminum alloy substrate having opposing first and second surfaces; carrying out first mechanical processing on the aluminum alloy base material to form a through hole, a sinking platform and a step formed by extending around the periphery of the sinking platform, wherein the sinking platform and the step are positioned on the first surface, the through hole penetrates through the sinking platform in the thickness direction of the aluminum alloy base material, and the height of the step is 0.03-0.1 mm; and carrying out secondary machining treatment on the aluminum alloy base material subjected to the primary machining treatment to form an inclined plane, wherein the step comprises a first surface, a step surface, the inclined plane and a second surface which are sequentially connected, the first surface is close to the sinking platform, the step surface is positioned at the free tail end of the step, and the second surface is far away from the sinking platform. This application embodiment can increase the camera and decorate the bulk strength of circle.

Description

Camera assembly, electronic equipment, camera decorating ring and processing method thereof
Technical Field
The application relates to the technical field of electronics, in particular to a camera assembly, electronic equipment, a camera decorative ring and a processing method thereof.
Background
With the development of communication technology, electronic devices such as smart phones are becoming more and more popular. In the use process of the electronic equipment, for example, a camera of the electronic equipment is used for photographing, and a decorative ring is usually sleeved on the camera.
Disclosure of Invention
The embodiment of the application provides a camera assembly, electronic equipment, a camera decorative ring and a processing method thereof, and the strength of the camera decorative ring can be improved.
The embodiment of the application provides a processing method of a camera decorative ring, which comprises the following steps:
providing an aluminum alloy substrate having opposing first and second surfaces;
carrying out first mechanical processing on the aluminum alloy base material to form a through hole, a sinking platform and a step formed by extending around the periphery of the sinking platform, wherein the sinking platform and the step are positioned on the first surface, the through hole penetrates through the sinking platform in the thickness direction of the aluminum alloy base material, and the height of the step is 0.03-0.1 mm;
the aluminum alloy base material after the first machining treatment is subjected to second machining treatment to form an inclined surface, the step comprises a first surface, a step surface and a second surface which are sequentially connected, the first surface is close to the sinking platform, the step surface is located at the free tail end of the step, and the second surface is far away from the sinking platform.
The embodiment of the application provides a processing method of a camera decorative ring, which comprises the following steps:
providing an aluminum alloy substrate having opposing first and second surfaces;
carrying out first mechanical processing on the aluminum alloy base material to form a through hole, a sinking platform and a step formed by extending around the periphery of the sinking platform, wherein the sinking platform and the step are positioned on the first surface, the through hole penetrates through the sinking platform in the thickness direction of the aluminum alloy base material, and the height of the step is 0.03-0.1 mm;
polishing the aluminum alloy base material subjected to the first machining treatment to form a high-gloss surface on the surface of the sinking platform; or carrying out sand blasting treatment on the aluminum alloy base material subjected to the first machining treatment to form a sand blasting surface on the surface of the sinking platform;
carrying out primary oxidation treatment on the polished or sand-blasted aluminum alloy base material;
performing second mechanical processing on the aluminum alloy base material subjected to the first oxidation treatment to form an inclined surface on the step, wherein the step comprises a first surface, a step surface, the inclined surface and a second surface which are sequentially connected, the first surface is close to the sinking platform, the step surface is positioned at the free tail end of the step, and the second surface is far away from the sinking platform;
carrying out secondary oxidation treatment on the aluminum alloy base material subjected to the secondary machining treatment;
and carrying out laser etching treatment on the aluminum alloy base material subjected to the second oxidation treatment to form a rough layer.
The embodiment of the application also provides a camera decorative ring, and the camera decorative ring is formed by processing according to the processing method of the camera decorative ring.
The embodiment of the application still provides a circle is decorated to camera, including heavy platform and center on the step that heavy platform periphery extended formation, the height of step is 0.03-0.1mm, the step is including the first face, step face, inclined plane and the second face that connect gradually, first face is close to heavy platform, the step face is located the free end of step, the second face is kept away from heavy platform, circle is decorated to camera still includes and runs through on thickness direction the through-hole of heavy platform, circle is decorated to camera adopts the aluminum alloy to make.
The embodiment of the application still provides a camera assembly, decorate the circle including camera and camera, the camera is decorated and is enclosed for arbitrary above arbitrary camera decorate the circle, the camera with the circle is decorated to the camera is connected, the camera lens with the through-hole is corresponding.
The embodiment of the application further provides electronic equipment, which comprises a shell and a camera assembly arranged on the shell, wherein the camera assembly is the camera assembly.
The electronic equipment that this application embodiment provided can protect heavy platform through the step, reduces heavy platform by the possibility of scratch, damage, and the height of step sets up to 0.03-0.1mm simultaneously, can keep step intensity, reduces the possibility that the step atress was deformed, can increase the bulk strength that the circle was decorated to the camera.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings used in the description of the embodiments will be briefly introduced below. It is obvious that the drawings in the following description are only some embodiments of the application, and that for a person skilled in the art, other drawings can be derived from them without inventive effort.
Fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present application.
Fig. 2 is another schematic structural diagram of an electronic device according to an embodiment of the present application.
Fig. 3 is another schematic structural diagram of an electronic device according to an embodiment of the present application.
Fig. 4 is another schematic structural diagram of an electronic device according to an embodiment of the present application.
Fig. 5 is another schematic structural diagram of an electronic device according to an embodiment of the present application.
Fig. 6 is a block diagram of a camera head assembly provided by an embodiment of the present application.
Fig. 7 is a schematic structural diagram of a camera bezel provided in the embodiment of the present application.
Fig. 8 is another schematic structural diagram of a camera bezel provided in the embodiment of the present application.
Fig. 9 is another schematic structural diagram of a camera bezel provided in the embodiment of the present application.
Fig. 10 is a cross-sectional view in the direction a-a of fig. 8.
Fig. 11 is an enlarged view of C in fig. 10.
Fig. 12 is another schematic structural diagram of a camera bezel provided in the embodiment of the present application.
Fig. 13 is another schematic structural diagram of a camera bezel provided in the embodiment of the present application.
Fig. 14 is a cross-sectional view in the direction B-B of fig. 12.
Fig. 15 is an enlarged view of D in fig. 14.
Fig. 16 is a schematic flow chart of a processing method of a camera bezel according to an embodiment of the present application.
Fig. 17 is a schematic structural diagram of an aluminum alloy substrate according to an embodiment of the present application.
Fig. 18 is a schematic structural diagram of an intermediate provided in an embodiment of the present application.
Fig. 19 is a schematic structural diagram of a camera bezel provided in the embodiment of the present application.
Fig. 20 is another schematic flow chart of a processing method of a camera bezel according to an embodiment of the present application.
Fig. 21 is a schematic structural diagram of a second intermediate provided in an embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner, and are not to be construed as limiting the present application. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact of the first and second features, or may comprise contact of the first and second features not directly but through another feature in between. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
The following disclosure provides many different embodiments or examples for implementing different features of the application. In order to simplify the disclosure of the present application, specific example components and arrangements are described below. Of course, they are merely examples and are not intended to limit the present application. Moreover, the present application may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, examples of various specific processes and materials are provided herein, but one of ordinary skill in the art may recognize applications of other processes and/or use of other materials.
The embodiment of the application provides a camera assembly, electronic equipment, a camera decorative ring and a processing method thereof. The details will be described below separately. The camera decorative ring can be installed on the camera, the camera assembly can be arranged in the electronic equipment, and the electronic equipment can be a smart phone, a tablet computer and other equipment.
Referring to fig. 1 and fig. 2, fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present disclosure, and fig. 2 is another schematic structural diagram of the electronic device according to the embodiment of the present disclosure. The electronic device 10 may include a cover 11, a display 12, a circuit board 13, a battery 14, a housing 15, a rear camera 16, a camera bezel 19, and a fingerprint unlocking module 17. It should be noted that the electronic device 10 shown in fig. 1 and 2 is not limited to the above, and may also include other devices, or does not include the rear camera 16 and the camera bezel 19, or does not include the fingerprint unlocking module 17.
Wherein the cover plate 11 is mounted to the display screen 12 to cover the display screen 12. The cover 1 may be a transparent glass cover so that the display screen transmits light through the cover 11 to display. In some embodiments, the cover plate 11 may be a glass cover plate made of a material such as sapphire.
Wherein the housing 15 may form an outer contour of the electronic device 10. In some embodiments, the housing 15 may include a middle frame 151 and a rear cover 152, the middle frame 151 and the rear cover 152 may be combined with each other to form the housing 15, and the middle frame 151 and the rear cover 152 may form a receiving space to receive the printed circuit board 13, the display 12, the battery 14, and the like. Further, a cover plate 11 may be fixed to the housing 15, and the cover plate 11 and the housing 15 form a closed space to accommodate the printed circuit board 13, the display 12, the battery 14, and the like. In some embodiments, the cover plate 11 is disposed on the middle frame 151, the rear cover 152 is disposed on the middle frame 151, the cover plate 11 and the rear cover 152 are disposed on opposite sides of the middle frame 151, and the cover plate 11 and the rear cover 152 are disposed opposite to each other.
In some embodiments, the housing 15 may be a metal housing, such as a metal such as magnesium alloy, stainless steel, and the like. It should be noted that the material of the housing 15 in the embodiment of the present application is not limited to this, and other manners may also be adopted, such as: the housing 15 may be a plastic housing. Also for example: the housing 15 is a ceramic housing. Also for example: a glass housing. For another example: the housing 15 may include a plastic part and a metal part, and the housing 15 may be a housing structure in which metal and plastic are matched with each other, specifically, the metal part may be formed first, for example, a magnesium alloy substrate is formed by injection molding, and then plastic is injected on the magnesium alloy substrate to form a plastic substrate, so as to form a complete housing structure.
It should be noted that, the structure of the housing in the embodiment of the present application is not limited to this, for example: the rear cover and the middle frame are integrally formed to form a completed housing 15 structure, which directly has a receiving space for receiving the printed circuit board 13, the display 12, the battery 14, and the like.
The printed circuit board 13 is mounted in the housing 15, the printed circuit board 13 may be a motherboard of the electronic device 10, and one, two or more functional components of a motor, a microphone, a speaker, an earphone interface, a usb interface, a rear camera 16, a distance sensor, an ambient light sensor, a receiver, and a processor may be integrated on the printed circuit board 13.
In some embodiments, the printed circuit board 13 may be secured within the housing 15. Specifically, the printed circuit board 13 may be screwed to the middle frame 151 by screws, or may be snap-fitted to the middle frame 151. It should be noted that the way that the printed circuit board 13 is specifically fixed to the middle frame 151 in the embodiment of the present application is not limited to this, and other ways, such as a way of fixing by a snap and a screw together, may also be used.
Wherein the battery 14 is mounted in the housing 15, the battery 14 being electrically connected to the printed circuit board 13 for providing power to the electronic device 10. The housing 15 may serve as a battery cover for the battery 14. The case 15 covers the battery 14 to protect the battery 14, and particularly, the rear cover covers the battery 14 to protect the battery 14, reducing damage to the battery 14 due to collision, dropping, and the like of the electronic apparatus 10.
Wherein the display 12 is mounted in the housing 15, and the display 12 is electrically connected to the printed circuit board 13 to form a display surface of the electronic device 10. The display screen 12 may include a display area and a non-display area. The display area may be used to display a screen of the electronic device 10 or provide a user with touch control. The top area of the non-display area is provided with an opening for conducting sound and light, and the bottom of the non-display area can be provided with functional components such as a fingerprint module, a touch key and the like. The cover plate 11 is mounted on the display 12 to cover the display 12, and may form the same display area and non-display area as the display 12 or different display areas and non-display areas.
In some embodiments, the Display 12 may be a Liquid Crystal Display (LCD) or Organic Light-Emitting Diode (OLED) type Display. In some embodiments, when the display 12 is a liquid crystal display, the display 12 may include a backlight module, a lower polarizer, an array substrate, a liquid crystal layer, a color filter substrate, an upper polarizer, and the like, which are sequentially stacked. When the display 12 is an organic light emitting diode display, the display 12 may include a base layer, an anode layer, an organic layer, a conductive layer, an emission layer, and a cathode layer stacked in sequence. In some embodiments, the display 12 may be a transparent display, and the display 12 may have a transparent characteristic through which signals may pass. The display screen may also be a non-transparent display screen.
Note that the structure of the display screen 12 is not limited to this. For example, the display 12 may be a shaped screen.
Referring to fig. 3, fig. 3 is another schematic structural diagram of an electronic device according to an embodiment of the present disclosure. The electronic device in fig. 3 differs from the electronic device in fig. 1 in that: the electronic device 20 includes a display 22, a cover 21, a printed circuit board 23, a battery 24, and a housing 25. Wherein the display screen 22 has a light permeable area 28 formed directly thereon. Specifically, for example: the display screen 22 is provided with a through hole penetrating the display screen 22 in the thickness direction, and the light-permeable area 28 may include the through hole, and the through hole may be provided with functional components such as a front camera, an earphone, a sensor, and the like.
It should be noted that the structure of the display screen is not limited to this, for example: the display screen 22 is provided with non-display areas, which the light permeable areas 28 may comprise. It should be noted that, the housing 25 may refer to the housing 15, the printed circuit board 23 may refer to the printed circuit board 13, and the battery 24 may refer to the battery 14, which are not described in detail herein.
Referring to fig. 4, fig. 4 is a schematic structural diagram of another electronic device according to an embodiment of the present disclosure, where the electronic device in fig. 4 is different from the electronic device in fig. 1 in that: the electronic device 30 in fig. 4 may include a display screen 32, a cover plate 31, a printed circuit board 33, a battery 34, and a housing 35. The display screen 32 is provided with a notch 121 at its periphery, and the notch 121 can be used for placing functional components such as a front camera, an earphone, a sensor, and the like. The cover plate 31 is suitable for the structural arrangement of the display screen 31, the cover plate 31 may be provided with a large notch such as the notch 121, and the cover plate 31 may cover the notch 121. It should be noted that the housing 35 can refer to the housing 15, the printed circuit board 33 can refer to the printed circuit board 13, and the battery 34 can refer to the battery 14, which are not described herein again.
It should be noted that, in some embodiments, the display 12 may not include the non-display area, but may be configured as a full-screen structure, and the functional components such as the distance sensor and the ambient light sensor may be disposed below the display or at other positions. Specifically, please refer to fig. 5, and fig. 5 is another schematic structural diagram of the electronic device according to the embodiment of the present application. The electronic device 40 may include a display 42, a cover 41, a printed circuit board 43, a battery 44, and a housing 45. Wherein the display screen 42 is overlaid on the housing 45 without a non-display area. Wherein, the cover plate 41 is suitable for the size setting of the display screen 42. It should be noted that, the housing 45 may refer to the housing 15, the printed circuit board 43 may refer to the printed circuit board 13, and the battery 44 may refer to the battery 14, which are not described herein again.
The rear camera 16 may be a single-lens camera or a double-lens camera. That is, the rear camera 16 may include one lens or two lenses.
The camera head decorating ring 19 is sleeved on the rear camera head 16, and the camera head decorating ring 19 is arranged at the position of the lens end of the rear camera head 16. The camera decorating ring 19 is suitable for the structural arrangement of a rear camera 16, the camera decorating ring 19 can comprise a through hole for placing a lens, and can also comprise two through holes, and one of the two through holes is used for placing a lens. It should be noted that, two through holes of the camera head decorative ring 19 may be a through hole for placing a lens, and another through hole for placing a flash. It should be noted that the camera bezel 19 may include only one through hole, or three through holes.
In some embodiments, the camera bezel 19 may be made of a metal material such as stainless steel or aluminum alloy. The camera head bezel 19 will be described below as an example made of an aluminum alloy material. The material of the camera bezel 19 is not limited to this.
In some embodiments, the camera bezel 19 may be fitted over the rear camera 16 to form a camera assembly. Referring specifically to fig. 6, fig. 6 is a block diagram of a camera head assembly according to an embodiment of the present disclosure. The camera assembly 1 may include a rear camera 16 and a camera decorative ring 19, wherein the rear camera 16 may include a base 161 and a lens 162, the lens 161 is mounted on the housing, the lens 162 is mounted on the base 161, the number of the lens 161 may be one or two, and the above contents may be referred to specifically, and are not described herein again.
In some embodiments, please refer to fig. 7, and fig. 7 is a schematic structural diagram of a camera bezel provided in the embodiments of the present application. The camera bezel 19 may include a through hole 193 penetrating the camera bezel in the thickness direction, and the through hole 193 may refer to the above. The camera bezel 19 will be described below with an example in which two through holes 193 are provided.
Specifically, the through-hole 193 includes a first through-hole 1931 and a second through-hole 1932.
Wherein, this first through-hole 1931 can place the camera lens of rear camera 16, perhaps can counterpoint rear camera 16's camera lens and first through-hole 1931, and rear camera 16 can be through first through-hole 1931 transmission signal. This first through-hole 1931 also can place the flash lamp, or can counterpoint the flash lamp with first through-hole 1931, and this flash lamp can transmit signal through first through-hole 1931.
Wherein, this second through-hole 1932 can place the camera lens of rear camera 16, perhaps can counterpoint rear camera 16's camera lens and second through-hole 1932, and rear camera 16 can be through second through-hole 1932 transmission signal. The second through hole 1932 may also accommodate a flash, or the flash may be aligned with the second through hole 1932, and the flash may transmit a signal through the second through hole 1932.
It should be noted that, when the rear camera 16 has two lenses, that is, when the rear camera 16 takes two shots, one of the lenses of the rear camera 16, or one of the lenses of the rear camera 16 and the first through hole 1931 are aligned with each other; the second through hole 1932 may be used to place another lens of the rear camera 16, or the second through hole 1932 may be aligned with another lens of the rear camera 16. This rear camera 16 is through first through-hole 1931 and second through-hole 1932 simultaneously to external transmission signal, can realize shooing. It should be noted that the through hole 193 may further include a third through hole, and the third through hole is used for placing the flash lamp.
In some embodiments, the camera bezel 19 has a first surface 199, an angled surface 198, a side surface 197, and a second surface 196 that are connected in series. The first surface 199 may be an outer surface of the camera bezel 19, and a user can view the electronic device from the outside. The second surface 196 and the first surface 199 are two opposite surfaces, that is, the second surface 196 is mounted inside the electronic device 10, and the second surface 196 is close to the rear camera 16 or a surface that cannot be seen when the user views the electronic device 10 from the outside. Wherein the side 197 surrounds the periphery of the camera bezel 19, and the side 197 may be perpendicular to the second surface 196 or perpendicular to the first surface 199. The inclined surface 198 is inclined with respect to the first surface 199 and the side surface 197. The angled surface 198 may form an angle with the first surface 199 that is greater than 0 degrees and less than 90 degrees. In some embodiments, the inclined surface 198 may be formed with two high-gloss edges, may be formed by rapid cutting using a high-gloss knife, or may be formed by a high-gloss process.
In some embodiments, the camera bezel 19 may further include a placement groove 194, the placement groove 194 is formed at a peripheral position of the second through hole 1932, and a lens, such as a transparent glass, may be installed in the placement groove 194.
Above is a concrete structure of the camera dress circle 19 that this application embodiment provided, and this camera dress circle 19 plays the guard action to rearmounted camera 16. In order to further improve the protection effect of the camera trim ring 19 on the rear camera 16 and reduce the scratches on the outer surface of the camera trim ring 19, the applicant of the present application improves on the basis of the camera trim ring 19, as follows.
Referring to fig. 8 to 10, fig. 8 is another schematic structural view of a camera head bezel provided in the embodiment of the present application, fig. 9 is another schematic structural view of the camera head bezel provided in the embodiment of the present application, and fig. 10 is a cross-sectional view of fig. 8 in a direction a-a. The camera bezel 19a may include a through hole 193a, and the through hole 193a may include a first through hole 1931a and a second through hole 1932a, and specifically, the through hole 193a may refer to the through hole 193 above, which is not described herein again. The camera bezel 19a may further include a first surface 199a and a second surface 196a, where the first surface 199a is opposite to the second surface 196a, and the first surface 199a may refer to the first surface 199, and the second surface 196a may refer to the second surface 196a, which are not described herein again.
In some embodiments, fig. 8-10 differ from fig. 7 in that: the camera bezel 19a shown in fig. 8 to 10 may further include a counter 191a and a step 192 a.
Wherein, the sunken platform 191a is formed on the first surface 199a of the camera head decorative ring 19 a.
The step 192a is formed on the periphery of the sinking platform 191a, the step 192a extends outwards around the periphery of the sinking platform 191a, and specifically, the step 192a extends around the periphery of the sinking platform 191a from the second surface 196a to the first surface 199 a. In some embodiments, the step 192a has a first face 1921a, a step face 1922a, an inclined face 1923a, and a second face 1924a connected in this order.
First face 1921a is located at the inner circle of step 192a, that is, first face 1921a is located at the inner surface of step 192 a. The first face 1921a is adjacent to the sink 191 a.
Where the step face 1922a is located at a free end of the step 192a, or at a top end of the step 192 a. The stepped surface 1922a may be perpendicular to the first surface 1921a or perpendicular to the second surface 1924a, and the stepped surface 1922a may be parallel to the surface of the sink 191 a.
The inclined surface 1923a is inclined with respect to the step surface 1922a and the second surface 1924a, the inclined surface 1923a may form an angle greater than 0 degree and smaller than 90 degrees with respect to the step surface 1922a, the inclined surface 1923a may form an angle greater than 0 degree and smaller than 90 degrees with respect to the second surface 1924a, and the inclined surface 1923a may form an angle greater than 0 degree and smaller than 90 degrees with respect to the surface of the sinking platform 191 a. The inclined surface 1923a may be configured as a high bright edge, and reference may be made to the inclined surface 1923, which is not described herein. In some embodiments, the inclined surface 1923a is located between the sinker 191b and the stepped surface 1922 a.
Wherein second face 1924a is positioned outboard of step 192a, i.e., second face 1924a is positioned outboard of step 192 a. The second face 1924a may be opposite the first face 1921a and the second face 1924a may be parallel to the first face 1921 a. The second face 1924a is distal to the sink deck 191 a.
The step of the embodiment of the present application may include only the first surface, the step surface, and the second surface connected in this order, without including the inclined surface 1923 a.
In some embodiments, please refer to fig. 11, fig. 11 is an enlarged view of C in fig. 10. The height H1 of the step 192a may range from greater than 0.1mm to less than 0.5mm, i.e., 0.1mm < H1<0.5mm, and further, 0.25mm < H1< 0.35. Note that the height of the step 192a is the vertical distance from the step surface 1922a to the surface of the sink 191 a.
In some embodiments, the width L1 of the step 192a may range from a value greater than 0.3mm, less than 0.5mm, i.e., 0.3mm < L1<0.5mm, and further, 0.4mm < L1<0.45 mm. Note that the width L1 of the step 192a is the vertical distance between the first face 1921a and the second face 1922a, or the width L3 of the step 192a is the width of the step face 1922 a.
In some embodiments, the width L2 of the inclined surface 1923a may range from greater than 0.2mm to less than 0.3mm, i.e., 0.2mm < L2<0.3mm, and further, 0.2mm < L2<0.25 mm. The width of the inclined surface 1923a is a vertical distance from the stepped surface 1922a to the second surface 1924 a.
As can be seen from the above, in the embodiment of the present application, the sinking platform 191a and the step 192a are formed on the first surface 199a, and the step 192a protects the surface of the sinking platform 191a, so as to reduce the scratch and damage caused by the direct contact between the surface of the sinking platform 191a and an external object. In practical applications, since the height H1 of the step 192a is high, when the step 192a is made of an aluminum alloy material, the step is easily deformed by an applied force, and in order to reduce the deformation of the step 192a by the applied force, in some embodiments, the width L1 of the step 192a may be increased, but increasing the width L1 of the step 192a increases the material, increases the cost, and increases the overall volume of the camera bezel 19 a. In some embodiments, the height H1 of the step 192a can be reduced, and the width L1 of the step 192a can be reduced, so that not only the surface of the sinking platform 191a can be protected, but also the height of the step 192a can be reduced, and the possibility that the step 192a is deformed due to stress can be reduced. The following description will be made in detail by taking the example of lowering the height of the step 192 a.
In some embodiments, the through-hole 193a penetrates the stage 191a in the thickness direction of the stage 191 a.
In some embodiments, please refer to fig. 12 to 14, fig. 12 is another schematic structural diagram of a camera bezel provided in the embodiment of the present application, fig. 13 is another schematic structural diagram of a camera bezel provided in the embodiment of the present application, and fig. 14 is a cross-sectional view of fig. 12 in a B-B direction. The camera bezel 19b may include a through hole 193b, and the through hole 193b may include a first through hole 1931b and a second through hole 1932b, and specifically, the through hole 193b may refer to the through hole 193, which is not described herein. The camera bezel 19b can further include a first surface 199b and a second surface 196b, the first surface 199b and the second surface 196b are opposite, wherein the first surface 199b can refer to the first surface 199, and the second surface 196b can refer to the second surface 196a, which are not described herein again. The camera bezel 19b may further include a placement slot 194b, and the placement slot 194b may refer to the placement slot 194, which is not described in detail herein.
In some embodiments, fig. 12-14 differ from fig. 7 in that: the camera bezel 19b shown in fig. 12 to 14 may further include a counter 191b and a step 192 b.
Wherein, the sunken platform 191b is formed on the first surface 199b of the camera head decorative ring 19 b.
The step 192b is formed on the periphery of the sinking platform 191b, the step 192b extends outwards around the periphery of the sinking platform 191b, and specifically, the step 192b extends around the periphery of the sinking platform 191b from the second surface 196b to the first surface 199 b. In some embodiments, the step 192b has a first face 1921b, a step face 1922b, an inclined face 1923b, and a second face 1924b connected in series.
Wherein the first face 1921b is located at the inner circle of the step 192b, that is, the first face 1921b is located at the inner surface of the step 192b, and the first face 1921b is close to the sinking platform 191 b.
Where step face 1922b is located at a free end of step 192b or at a top end of step 192 b. The stepped surface 1922b may be perpendicular to the first surface 1921b or perpendicular to the second surface 1924b, and the stepped surface 1922b may be parallel to the surface of the sink 191 b.
The inclined surface 1923b is inclined with respect to the step surface 1922b and the second surface 1924b, the inclined surface 1923b may form an angle greater than 0 degree and smaller than 90 degrees with respect to the step surface 1922b, the inclined surface 1923b may form an angle greater than 0 degree and smaller than 90 degrees with respect to the second surface 1924b, and the inclined surface 1923b may form an angle greater than 0 degree and smaller than 90 degrees with respect to the surface of the sinking platform 191 b. The inclined surface 1923b may be configured as a high bright edge, and reference may be made to the inclined surface 1923, which will not be described herein. In some embodiments, the inclined surface 1923b extends from the step 192b toward the second surface 196b, and a side of the inclined surface 1923b connected to the second face 1924b is located between the depressed portion 191b and the second surface 196 b.
Wherein second face 1924b is positioned outboard of step 192b, i.e., second face 1924b is positioned outboard of step 192 b. The second face 1924b can be opposite the first face 1921b, and the second face 1924b can be parallel to the first face 1921 b. The second face 1924b is distal to the sink 191 b.
The step of the embodiment of the present application may include only the first surface, the step surface, and the second surface connected in this order, without including the inclined surface 1923 b.
In some embodiments, fig. 12-14 differ from fig. 8-11 in that: the height of step 192b is less than the height of step 192 a. Specifically, please refer to fig. 15, in which fig. 15 is an enlarged view of D in fig. 14. The height H2 of the step 192a may range from greater than 0.03mm to less than 0.1mm, i.e., 0.03mm < H2<0.1mm, and further, 0.06mm < H2<0.08 mm. Therefore, when the camera decorative ring 19b is made of an aluminum alloy material, the step height is small, an external object is not easy to directly touch the outer surface of the step, and even if the external object touches the step, the deformation is not easy to generate due to the low height of the step. Therefore, the steps of the embodiment of the application can protect the sunk platform of the camera decorating ring 19b, are not easy to damage, and can improve the overall strength of the camera decorating ring under the condition of not increasing the volume and the material.
In some embodiments, the width L3 of the step 192b may range from greater than 0.15mm to less than 0.3mm, i.e., 0.15mm < L3<0.3mm, and further, 0.2mm < L3<0.25 mm. Note that the width L3 of the step 192b is the vertical distance between the first face 1921b and the second face 1922b, or the width L3 of the step 192b is the width of the step face 1922 b.
In some embodiments, the width L4 of the inclined surface 1923b may range from greater than 0.15mm to less than 0.2mm, i.e., 0.15mm < L4<0.2mm, and further, 0.16mm < L4<0.18 mm. The width of the inclined surface 1923b is a vertical distance from the stepped surface 1922b to the second surface 1924 b. The width of the inclined surface 1923b may be set to 0.25 mm. The width of the step 192b is smaller, and the width of the step 192b is similar to the width of the inclined surface 1923b, so that when the step surface is scratched, the scratch position of the step surface is basically similar to the color of the inclined surface due to the narrow width of the step, and the step surface is not easily scratched when being observed from the outside.
Therefore, the width of the step 1922b can be reduced, the material can be saved on the basis of keeping the strength of the camera decorating ring 19b and preventing scratches, and the overall size of the camera decorating ring 19b can be reduced.
In some embodiments, the through hole 193b penetrates the stage 191b in the thickness direction of the stage 191 b.
In order to further describe the camera bezel of the embodiment of the present application, the following description is made in terms of a production process.
In some embodiments, please refer to fig. 16, and fig. 16 is a schematic flow chart illustrating a processing method of a camera bezel according to an embodiment of the present disclosure. With reference to fig. 1 to 15, the processing method of the camera head decorative ring includes:
in step 101, an aluminum alloy substrate is provided, the aluminum alloy substrate having opposing first and second surfaces.
Referring to fig. 17, fig. 17 is a schematic structural diagram of an aluminum alloy substrate according to an embodiment of the present disclosure. The aluminum alloy substrate 101 is a specific form of the embodiment, and it should be noted that other metal substrates, such as stainless steel substrate, can also be provided in the embodiment. The aluminum alloy substrate 101 may be a single body, i.e., a camera bezel may be formed by the one aluminum alloy substrate 101. The aluminum alloy base 101 may be a single large plate, and a plurality of camera head bezel units connected by a connecting rib may be formed on the same aluminum alloy base 101.
The first surface and the second surface can refer to the above contents, and are not described herein again.
In step 102, the aluminum alloy substrate 101 is subjected to a first machining process to form a through hole, a sinking platform and a step formed by extending around the periphery of the sinking platform, the sinking platform and the step are located on the first surface, the through hole penetrates through the sinking platform in the thickness direction of the aluminum alloy substrate 101, and the height of the step is 0.03-0.1 mm.
Referring to fig. 18, fig. 18 is a schematic structural diagram of an intermediate provided in the embodiment of the present application. The intermediate body 102 is formed by performing a first machining process on an aluminum alloy substrate, and the intermediate body 102 has a through hole 1023, a sunken platform 1021, a step 1022 and a placement groove 1024. The through holes 1023 may include a first through hole 10231 and a second through hole 10232, which may be referred to above and will not be described herein again. The platform 1021 is formed on the first surface 1039, and the first surface 1039 is opposite to the second surface 1036, which can be referred to above, and is not described herein again. The placing groove 1024 may be used to place a lens, such as transparent glass, which may be referred to above specifically and will not be described herein again.
Wherein the step 1022 is formed at the periphery of the sinking platform 1021, and has a first face 10221, a step face 10222 and a second face 10224 connected in sequence, the first face 10221 is close to the sinking platform 1021, the second face 10224 is far from the sinking platform, and the first face 10221 and the second face 10224 are opposite; where step surface 10222 is located at a free end of step 1022, reference is made to the above description, and further description is omitted here. In some embodiments, the height of the step 1022 is 0.03-0.1mm, which can reduce the possibility of deformation of the step 1022 due to stress and improve the strength of the step 1022. In some embodiments, the width of the step is 0.15-0.3mm, which can be referred to above and will not be described herein.
In step 103, the aluminum alloy substrate after the first machining is subjected to a second machining to form an inclined surface, the step comprises a first surface, a step surface, the inclined surface and a second surface which are sequentially connected, the first surface is close to the sinking platform, the step surface is located at the free tail end of the step, and the second surface is far away from the sinking platform.
Please refer to fig. 19, fig. 19 is a schematic structural diagram of a camera head bezel according to an embodiment of the present application. According to the embodiment of the application, the camera decorative ring 103 is formed by performing secondary machining treatment on the intermediate body. The camera bezel 103 has a through hole 1033, a counter land 1031, a step 1032, and a placement groove 1034. The through holes 1033 may include a first through hole 10331 and a second through hole 10332, which may be referred to above specifically and will not be described herein again. The sinking platform 1031 is formed on the first surface 1039, and the first surface and the second surface 1036 are opposite to each other. The placing groove 1034 can place a lens, such as a transparent glass, and reference is made to the above, which is not described herein again.
Wherein the step 1032 is formed at the periphery of the countertop 1031, and has a first surface 10321, a step surface 10322, an inclined surface 10323, and a second surface 10324 connected in sequence, the first surface 10321 is close to the countertop 1031, the second surface 10324 is far from the countertop, and the first surface 10321 and the second surface 10324 are opposite; the step surface 10322 is located at a free end of the step 1032, which can be referred to above, and is not described herein again. Here, the inclined surface 10323 may extend from the step 1032 toward the second surface 1036, and a side of the inclined surface 10323 connected to the second surface 10324 is located between the sink 1031 and the second surface 1036.
In some embodiments, the width of the inclined surface 10323 may be 0.15-0.2mm, which is not described herein.
In some embodiments, the second machining process may form the inclined surface by using a high gloss knife to cut quickly to form a high gloss edge on the inclined surface.
Therefore, the width of the step can be reduced, the camera decorating ring strength is kept, and the camera decorating ring is prevented from being scratched, so that materials can be saved, and the overall size of the camera decorating ring can be reduced.
It should be noted that, in other embodiments, the processing method of the camera head decorative ring is not limited to the above steps.
Referring to fig. 20, fig. 20 is another schematic flow chart of a processing method of a camera bezel according to an embodiment of the present application. The processing method of the camera decorative ring comprises the following steps:
in step 201, an aluminum alloy substrate is provided, the aluminum alloy substrate having opposing first and second surfaces.
Step 201 may specifically refer to step 101 and fig. 17, and is not described herein again.
In step 202, the aluminum alloy substrate is subjected to a first machining treatment to form a through hole, a sinking platform and a step formed by extending around the periphery of the sinking platform, the sinking platform and the step are located on the first surface, the through hole penetrates through the sinking platform in the thickness direction of the aluminum alloy substrate, and the height of the step is 0.03-0.1 mm.
The first machining process performed on the aluminum alloy substrate in step 202 may form a first intermediate, which may be referred to in step 102 and fig. 18, and is not described herein again.
In step 203, the aluminum alloy substrate after the first machining is polished to form a high-gloss surface on the surface of the stage.
Referring to fig. 21, fig. 21 is a schematic structural diagram of a second intermediate according to an embodiment of the present disclosure. The step 203 is performed with a polishing process to form a second intermediate 203, and the second intermediate 203 forms a high gloss surface 20311 on the surface of the stage 2031, or the second intermediate 203 forms a high gloss layer 20311 on the surface of the stage 2031.
The surface of the sinking platform can be polished by adopting a mechanical, chemical, electrochemical or ultrasonic mode and the like. So that the surface roughness of the sinking platform is reduced to obtain a bright and flat sinking platform surface. Wherein, the chemical polishing mode is to regularly dissolve the surface of the sinking platform to achieve smoothness and flatness. The electrochemical polishing mode is that the surface of the sinking platform is used as an anode, insoluble metal is used as a cathode, the two electrodes are immersed into an electrolytic bath at the same time, and direct current is conducted to generate selective anode solution, so that the brightness of the surface of the sinking platform is increased. The mechanical polishing mode is that the surface of the sinking platform is cut to make the surface of the sinking platform plastically deform to remove the polished convex part and obtain a smooth surface. The ultrasonic polishing mode is that the first intermediate body is put into the abrasive suspension and put into an ultrasonic field together, and the abrasive is ground and polished on the surface of the workpiece by means of the oscillation action of the ultrasonic wave.
In some embodiments, before polishing the surface of the sinking platform, the surface of the sinking platform may be polished, and then the polished surface of the sinking platform may be polished, so that the polishing effect is better, and the surface of the sinking platform is smoother. Here, it should be noted that the grinding process is understood as a rough process before the polishing process. Namely, the surface of the sinking platform can be roughly ground for one time and finely ground for the other time to finish the polishing treatment.
In some embodiments, the high gloss surface 20311 may be sandblasted to form a sandblasted surface, or sandblasted layer, on the high gloss surface 20311, which has a rough structure, and the sandblasted surface with the rough structure may increase the bonding force of the surface of the sink. In other embodiments, the sand blasting process may be performed directly without performing the polishing process on the surface of the stage, so as to form the sand blasting surface directly on the surface of the stage.
In step 204, the aluminum alloy substrate after the polishing treatment is subjected to a first oxidation treatment.
Specifically, the second intermediate may be subjected to a first oxidation process to form a third intermediate having a first oxide layer or first oxide film, i.e., the first oxide layer or first oxide film is formed during the first oxidation process. The oxidation process can be used to color and form a desired appearance color. Such as: the aluminum alloy substrate after the polishing treatment may be subjected to a first oxidation treatment to form an oxide layer, and subjected to a coloring treatment after the oxidation to form a desired color, such as silvery white, black, red, or the like.
In some embodiments, during the first oxidation, hard oxygen may be used. Specifically, the aluminum alloy substrate after polishing is subjected to hard oxidation treatment to form a hard oxide film, which can improve the strength.
In step 205, the aluminum alloy substrate after the first oxidation treatment is subjected to a second machining treatment, an inclined surface is formed on the step, the step comprises a first surface, a step surface, an inclined surface and a second surface which are sequentially connected, the first surface is close to the sinking platform, the step surface is located at the free tail end of the step, and the second surface is far away from the sinking platform.
Specifically, a fourth intermediate is formed after the aluminum alloy substrate is subjected to the second machining process, and the fourth intermediate is obtained by referring to step 203 and fig. 19, which is not described herein again.
In step 206, the aluminum alloy base material after the second machining process is subjected to a second oxidation process.
Specifically, the fourth intermediate may be subjected to a first oxidation treatment to form a fifth intermediate, and the fifth intermediate has a second oxide layer or a second oxide film, that is, the second oxide layer or the second oxide film is formed during the second oxidation treatment. The oxidation process can be used to color and form a desired appearance color. Such as: the aluminum alloy substrate after the second machining treatment may be subjected to a second oxidation treatment to form an oxide layer, and subjected to a coloring treatment after the oxidation to form a desired color, such as silver white, black, red, or the like.
In step 207, the aluminum alloy substrate after the second oxidation treatment is subjected to laser etching treatment to form a rough layer.
Specifically, carry out radium carving to the aluminum alloy substrate after the oxidation treatment of the second time and handle, form the camera and decorate the circle, this camera decorates the whole surface of circle and can have the coarse layer, form the coarse layer on the aluminum alloy substrate after radium carving handles promptly, perhaps be the rough surface, can increase the cohesion of camera decoration circle surface, can improve the fixed connection intensity of camera decoration circle and lens, casing or rearmounted camera.
The processing method of the camera decorative ring, the camera assembly and the electronic device provided by the embodiment of the application are described in detail, specific examples are applied in the description to explain the principle and the implementation mode of the application, and the description of the embodiment is only used for helping understanding the application. Meanwhile, for those skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.

Claims (18)

1. A processing method of a camera decorating ring is characterized by comprising the following steps:
providing an aluminum alloy substrate having opposing first and second surfaces;
carrying out first mechanical processing on the aluminum alloy base material to form a through hole, a sinking platform and a step formed by extending around the periphery of the sinking platform, wherein the sinking platform and the step are positioned on the first surface, the through hole penetrates through the sinking platform in the thickness direction of the aluminum alloy base material, the height of the step is 0.03-0.1mm, and the width of the step is 0.15-0.3 mm;
the aluminum alloy base material after the first machining treatment is subjected to second machining treatment to form an inclined surface, the step comprises a first surface, a step surface and a second surface which are sequentially connected, the first surface is close to the sinking platform, the step surface is located at the free tail end of the step, and the second surface is far away from the sinking platform.
2. The method of manufacturing a camera bezel according to claim 1, wherein the inclined surface extends from the step toward the second surface.
3. The processing method of the camera head decorative ring according to claim 2, wherein the width of the inclined surface is 0.15-0.2 mm.
4. The method for processing the camera decorative ring according to claim 3, wherein the step of performing the first machining process on the aluminum alloy base material further comprises:
polishing the aluminum alloy base material subjected to the first machining treatment to form a high-gloss surface on the surface of the sinking platform;
the step of performing the second machining treatment on the aluminum alloy base material after the first machining treatment specifically comprises:
and carrying out secondary machining treatment on the polished aluminum alloy base material.
5. The method for processing the camera decorative ring according to claim 3, wherein the step of performing the first machining process on the aluminum alloy base material further comprises:
polishing the aluminum alloy base material subjected to the first machining treatment to form a high-gloss surface on the surface of the sinking platform;
carrying out sand blasting treatment on the aluminum alloy base material subjected to polishing treatment to form a sand blasting surface on the surface of the sinking platform;
the step of performing the second machining treatment on the aluminum alloy base material after the first machining treatment specifically comprises:
and carrying out secondary machining treatment on the aluminum alloy base material subjected to the sand blasting treatment.
6. The method for processing the camera decorative ring according to claim 3, wherein the step of performing the first machining process on the aluminum alloy base material further comprises:
carrying out sand blasting treatment on the aluminum alloy base material subjected to the first machining treatment, and forming a sand blasting surface on the surface of the sinking platform;
the step of performing the second machining treatment on the aluminum alloy base material after the first machining treatment specifically comprises:
and carrying out secondary machining treatment on the aluminum alloy base material subjected to the sand blasting treatment.
7. The method for processing the camera decorative ring according to claim 3, wherein before the step of performing the second machining process on the aluminum alloy base material after the first machining process, the method further comprises:
carrying out first oxidation treatment on the aluminum alloy base material subjected to the first machining treatment;
the step of performing the second machining treatment on the aluminum alloy base material after the first machining treatment specifically comprises:
and carrying out secondary machining treatment on the aluminum alloy base material subjected to the primary oxidation treatment.
8. The method for processing the camera decorative ring according to claim 3, wherein after the step of performing the second machining process on the aluminum alloy base material after the first machining process, the method further comprises:
and carrying out secondary oxidation treatment on the aluminum alloy base material subjected to the secondary machining treatment.
9. The processing method of the camera head decorative ring according to claim 3, wherein after the step of performing the second oxidation treatment on the aluminum alloy base material after the second machining treatment, the processing method further comprises:
and carrying out laser etching treatment on the aluminum alloy base material subjected to the second oxidation treatment to form a rough layer.
10. A processing method of a camera decorating ring is characterized by comprising the following steps:
providing an aluminum alloy substrate having opposing first and second surfaces;
carrying out first mechanical processing on the aluminum alloy base material to form a through hole, a sinking platform and a step formed by extending around the periphery of the sinking platform, wherein the sinking platform and the step are positioned on the first surface, the through hole penetrates through the sinking platform in the thickness direction of the aluminum alloy base material, the height of the step is 0.03-0.1mm, and the width of the step is 0.15-0.3 mm;
polishing the aluminum alloy base material subjected to the first machining treatment to form a high-gloss surface on the surface of the sinking platform; or carrying out sand blasting treatment on the aluminum alloy base material subjected to the first machining treatment to form a sand blasting surface on the surface of the sinking platform;
carrying out primary oxidation treatment on the polished or sand-blasted aluminum alloy base material;
performing second machining treatment on the aluminum alloy base material subjected to the first oxidation treatment, forming an inclined surface on the step, wherein the step comprises a first surface, a step surface, the inclined surface and a second surface which are sequentially connected, the first surface is close to the sinking platform, the step surface is positioned at the free tail end of the step, the second surface is far away from the sinking platform, the inclined surface extends from the step towards the second surface, and the width of the inclined surface is 0.15-0.2 mm;
carrying out secondary oxidation treatment on the aluminum alloy base material subjected to the secondary machining treatment;
and carrying out laser etching treatment on the aluminum alloy base material subjected to the second oxidation treatment to form a rough layer.
11. A camera decorative ring, characterized in that the camera decorative ring is formed by the processing method of the camera decorative ring according to any one of claims 1 to 10.
12. The camera trim ring of claim 11, wherein the through-holes comprise first and second through-holes spaced apart from one another.
13. The utility model provides a circle is decorated to camera, its characterized in that, includes heavy platform and centers on the step that heavy platform periphery extended formation, the height of step is 0.03-0.1mm, the width of step is 0.15-0.3mm, the step is including the first face, step face, inclined plane and the second face that connect gradually, first face is close to heavy platform, the step face is located the free end of step, the second face is kept away from heavy platform, circle is decorated to camera still includes and runs through in thickness direction the through-hole of heavy platform, circle is decorated to camera adopts the aluminum alloy to make.
14. The camera bezel of claim 13, wherein the inclined face extends from the step in a direction toward the second face.
15. The camera trim ring of claim 14, wherein the width of the inclined surface is 0.15-0.2 mm.
16. The camera trim ring of claim 13, wherein the through-holes comprise first and second through-holes spaced apart from one another.
17. A camera assembly, characterized in that, includes camera and camera dress circle, camera dress circle be the camera dress circle of any one of claims 13 to 16, the camera with camera dress circle is connected, the camera lens of camera with the through-hole corresponds.
18. An electronic device comprising a housing and a camera assembly mounted on the housing, the camera assembly being the camera assembly of claim 17.
CN201711395298.0A 2017-12-21 2017-12-21 Camera assembly, electronic equipment, camera decorating ring and processing method thereof Expired - Fee Related CN108111725B (en)

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