CN210137422U - Electronic equipment - Google Patents

Electronic equipment Download PDF

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Publication number
CN210137422U
CN210137422U CN201921653335.8U CN201921653335U CN210137422U CN 210137422 U CN210137422 U CN 210137422U CN 201921653335 U CN201921653335 U CN 201921653335U CN 210137422 U CN210137422 U CN 210137422U
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China
Prior art keywords
sound
sound transmission
electronic device
transmission channel
hole
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CN201921653335.8U
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Chinese (zh)
Inventor
李敬
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Guangdong Oppo Mobile Telecommunications Corp Ltd
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Guangdong Oppo Mobile Telecommunications Corp Ltd
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Priority to CN201921653335.8U priority Critical patent/CN210137422U/en
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Abstract

The utility model mainly relates to an electronic equipment, this electronic equipment include display module assembly, back shroud, center, support and microphone subassembly, and display module assembly, back shroud are connected with the center respectively, and the support setting is between back shroud and center and with the center concatenation, and the microphone subassembly sets up between display module assembly and support, and back shroud and center cooperation form the breach, and the breach is as the pickup hole of microphone subassembly. Compare in the sound hole of picking up that the microphone was directly seted up on the cell-phone casing in correlation technique, this application passes through the indirect breach that forms of cooperation between back shroud and the center, and this breach is used as the sound hole of microphone, can increase the disguise of picking up the sound hole to can increase the whole uniformity of electronic equipment in appearance.

Description

Electronic equipment
Technical Field
The application relates to the technical field of electronic equipment, in particular to electronic equipment.
Background
With the continuous popularization of electronic devices, electronic devices have become indispensable social and entertainment tools in people's daily life, and people have higher and higher requirements for electronic devices. In the conventional electronic device (e.g., a mobile phone), a hole is generally formed in a housing of the electronic device to serve as a sound collecting hole of a microphone in the mobile phone. The holes are large, the aperture of the holes is generally 1.2mm, and the overall consistency of the appearance of the mobile phone is damaged.
SUMMERY OF THE UTILITY MODEL
The embodiment of the application provides an electronic equipment, wherein, this electronic equipment includes display module assembly, back shroud, center, support and microphone subassembly, and display module assembly, back shroud are connected with the center respectively, and the support setting is between back shroud and center and with the center concatenation, and the microphone subassembly sets up between display module assembly and support, and back shroud and center cooperation form the breach, and the breach is as the pickup hole of microphone subassembly.
The beneficial effect of this application is: compare in the sound hole of picking up that the microphone was directly seted up on the cell-phone casing in correlation technique, this application passes through the indirect breach that forms of cooperation between back shroud and the center, and this breach is used as the sound hole of microphone, can increase the disguise of picking up the sound hole to can increase the whole uniformity of electronic equipment in appearance.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a schematic structural diagram of an embodiment of an electronic device provided in the present application;
FIG. 2 is an exploded view of the electronic device of FIG. 1;
FIG. 3 is a schematic diagram of a partial structure of the electronic device of FIG. 1;
FIG. 4 is a partially enlarged schematic view of portion A of FIG. 1;
FIG. 5 is a partially enlarged schematic view of a portion B of FIG. 2;
FIG. 6 is a schematic cross-sectional view of the electronic device of FIG. 3 along the direction XI-XI;
FIG. 7 is a schematic cross-sectional view of the middle frame of FIG. 6;
FIG. 8 is a schematic cross-sectional view of the stent of FIG. 6;
fig. 9 is an exploded view of the electronic device of fig. 3.
Detailed Description
The present application will be described in further detail with reference to the following drawings and examples. It is to be noted that the following examples are only illustrative of the present application, and do not limit the scope of the present application. Likewise, the following examples are only some examples and not all examples of the present application, and all other examples obtained by a person of ordinary skill in the art without any inventive work are within the scope of the present application.
Reference in the specification to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the specification. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.
Referring to fig. 1 to fig. 3 together, fig. 1 is a schematic structural diagram of an embodiment of an electronic device provided in the present application, fig. 2 is a schematic exploded structural diagram of the electronic device in fig. 1, and fig. 3 is a schematic partial structural diagram of the electronic device in fig. 1.
The electronic device 10 of the embodiment of the present application may be a portable device such as a mobile phone, a tablet computer, a notebook computer, and a wearable device. The embodiment of the present application takes the electronic device 10 as a mobile phone as an example for description. The electronic device 10 includes a display module 11, a rear cover 12, a middle frame 13, a bracket 14, and a microphone assembly 15, as shown in fig. 2. The display module 11 and the rear cover plate 12 are respectively connected with the middle frame 13, so that the display module 11 and the rear cover plate 12 form a basic structure for clamping the middle frame 13 together after being assembled, as shown in fig. 1. For example, the display module 11 and the rear cover plate 12 are respectively covered on two opposite surfaces of the middle frame 13 by one or a combination of assembling manners such as clamping, gluing, welding and the like. The support 14 is disposed between the rear cover plate 12 and the middle frame 13, and is spliced with the middle frame 13, and can play a role of supporting the rear cover plate 12, so as to prevent the rear cover plate 12 from deforming or breaking under the action of external force. Further, a microphone assembly 15 and other structural members such as a battery, a main board, a camera module, a fingerprint module are disposed between the display module 11 and the rear cover 12, so that the electronic device 10 can implement corresponding functions. In the embodiment of the present application, the microphone assembly 15 may be disposed between the display module 11 and the bracket 14, so that the bracket 14 can support the rear cover 12.
In the embodiment of the present application, the rear cover 12 and the middle frame 13 cooperate to form a gap 16, as shown in fig. 3, and the gap 16 serves as a sound pickup hole of the microphone assembly 15. Wherein the gap 16 may be a minute gap, and the detailed structure will be described later. Compared with the prior art in which the sound pickup hole of the microphone is directly formed in the mobile phone shell, in the embodiment of the present application, the notch 16 is indirectly formed by the cooperation between the rear cover plate 12 and the middle frame 13, so that the notch 16 is used as the sound pickup hole of the microphone assembly 15, the concealment of the sound pickup hole can be increased, and the overall consistency of the electronic device 10 in appearance can be increased. Furthermore, the middle frame 13 is provided with a first sound transmission channel, and the first sound transmission channel is communicated with the notch 16; the bracket 14 is provided with a second sound transmission channel which is communicated with the first sound transmission channel; the microphone assembly 15 is disposed at an end of the second sound transmission channel away from the first sound transmission channel, so that the microphone assembly 15 can communicate with the external environment, and the detailed structure will be described later. In other words, the middle frame 13 and the bracket 14 of the embodiment of the present application can not only support the back cover 12, but also cooperate with each other to form a sound transmission channel of the microphone assembly 15.
The display module 11 may be a screen such as an lcd (liquid Crystal display), an OLED (Organic Light-Emitting Diode), a Mini-LED, or a Micro-LED. Generally, the display module 11 includes a display panel 111 and a transparent cover plate 112, as shown in fig. 2; the transparent cover 112 may be attached to the display panel 111 by using a sealant such as OCA (optical Clear Adhesive) or PSA (Pressure Sensitive Adhesive). The display panel 111 is mainly used for displaying a screen and serves as an interactive interface between a user and the electronic device 10. The transparent cover 112 may be tempered glass or a polyimide film, and is mainly used to protect the display panel 111 and serve as an outer surface of the electronic device 10, so that a user can perform touch operations such as clicking and sliding. In some other embodiments, the outer surface of the electronic device 10 (i.e., the outer surface of the transparent cover plate 112) may be further provided with any one of other functional film layers, such as a tempered film, a frosted film, a decoration film, a peep-proof film, a water condensation film, and the like, so that the electronic device 10 provides different use effects for users.
The rear cover 12 is a battery cover of the electronic device 10, and may be made of glass, metal, hard plastic, or other electrochromic materials. The back cover 12 has a structural strength that is primarily used to protect the electronic device 10 along with the transparent cover 112. Accordingly, the material of the middle frame 13 may be glass, metal, hard plastic, or the like. The middle frame 13 also has a certain structural strength, and is mainly used for supporting and fixing the microphone assembly 15 of the embodiment of the present application and other structural members such as a battery, a main board, a fingerprint module, a camera module, and the like. Further, since the rear cover plate 12 and the middle frame 13 are generally directly exposed to the external environment, the rear cover plate 12 and the middle frame 13 may preferably have certain wear-resistant, corrosion-resistant, scratch-resistant, and other properties, or the outer surfaces of the rear cover plate 12 and the middle frame 13 (i.e., the outer surfaces of the electronic device 10) may be coated with a layer of functional material for wear-resistant, corrosion-resistant, scratch-resistant. In some embodiments, the rear cover plate 12 and the middle frame 13 may be two separate structural members, as shown in fig. 1, and they may be assembled by one or a combination of clamping, gluing, welding, and the like. In other embodiments, the rear cover plate 12 and the middle frame 13 may also be integrally formed, such as by stamping, injection molding, etc.
Generally, the electronic device 10 may have a box-like appearance structure as a whole, that is, the display module 11, the rear cover 12 and the middle frame 13 may be rectangular. The display module 11 has four side edges, the rear cover plate 12 also has four side edges, and the middle frame 13 also has four side edges correspondingly; the two side edges of each structure are generally rounded to enhance the aesthetic appearance and grip of the electronic device 10. Further, at least one side edge of at least one of the display module 11 and the rear cover 12 connected to the middle frame 13 is a structure bent toward the middle frame 13. In other words, at least one of the four side edges of the display module 11 is bent toward the middle frame 13; and/or at least one of the four side edges of the rear cover plate 12 is bent toward the middle frame 13.
It should be noted that the side edges in the embodiment of the present application are a simple expression, and the width of the side edges is not considered, and the dimensions of the display module 11, the rear cover 12, and the middle frame 13 in the thickness direction of the electronic device 10 are not considered. Further, the side edges described in the embodiments of the present application should not be simply understood as lines in a general sense.
In some embodiments, the four side edges of the display module 11 and the four side edges of the rear cover plate 12 may be curved toward the middle frame 13, as shown in fig. 1 and fig. 2, that is, the side edges may be curved, and the effect of reducing or even hiding the width of the black edge of the display module 11 is achieved by four-side bending, so that a user can obtain a larger display view when using the electronic device 10. Further, in the embodiment of the present disclosure, the display module 11 and the rear cover 12 may have symmetrical structures with respect to the middle frame 13, as shown in fig. 1, so that a user can obtain better aesthetic appearance and grip feel when using the electronic device 10. In other embodiments, the display module 11 and the rear cover 12 may have a single-curved, double-curved, or triple-curved structure, or only one of the display module 11 and the rear cover 12 may have the curved structure. The electronic device 10 in the embodiment of the present application is described by taking a structure in which the display module 11 and the back cover 12 are all four-sided curved as an example. The electronic device 10 shown in fig. 1 and 2 only describes a portion (e.g., one quarter) of the display module 11, the rear cover 12 and the middle frame 13, and the structures of the other portions are the same as or similar to those in the drawings, and are not repeated herein. The specific structure of this quarter of the electronic device 10 is described in detail below.
With reference to fig. 1 to 3, the display module 11 includes a first straight portion 113 and a first curved portion 114, which are integrally formed, and the first curved portion 114 surrounds the first straight portion 113 and is in smooth transition with the first straight portion 113. The rear cover plate 12 includes a second straight portion 121 and a second curved portion 122, which are integrally formed, and the second curved portion 122 surrounds the second straight portion 121 and is in smooth transition with the second straight portion 121. The first bending portion 114 and the second bending portion 122 are both bent toward the middle frame 13, that is, the bending directions of the two portions are toward each other. Further, the first bending portion 114 and the second bending portion 122 can be connected to two opposite surfaces of the middle frame 13 by one or a combination of clamping, gluing, welding, and the like.
It should be noted that the integrally formed structure in the embodiment of the present application means that the structure of the product is an organic whole, and the product cannot be easily split or divided. For example: in the embodiment of the present invention, the tempered glass in a flat plate shape may be bent into the transparent cover plate 112 in the bent shape according to predetermined process parameters by using a hot bending technique, as shown in fig. 1 and 2, and the bent portion and the flat plate portion are naturally in a circular arc transition. The above process parameters can be reasonably designed according to factors such as the type of raw material, the bending angle and the curvature radius, and are not limited herein. Further, the OLED screen in a flat plate form may be attached to the transparent cover 112 to form the display panel 111 in the curved shape. Therefore, the line between the first straight portion 113 and the first curved portion 114 and the line between the second straight portion 121 and the second curved portion 122 in fig. 1 and 2 are only for illustrating the boundary between the above-mentioned portions. In other words, for the display panel 111 and the transparent cover plate 112 in an actual product, the lines are not true, i.e., the transition between the parts is smooth.
Further, the rear cover 12 of the embodiment of the present application is provided with a notch 123, and the notch 123 is specifically provided in the second bending portion 122, as shown in fig. 2, so that the rear cover 12 and the middle frame 13 cooperate to form a notch 16 at the notch 123, as shown in fig. 3, and the notch 16 serves as a sound pickup hole of the microphone assembly 15. Wherein, the width of the notch 123 (i.e. the size of the gap between the rear cover plate 12 and the middle frame 13) may be 0.1-0.3 mm; preferably, the width may be 0.15-0.2mm, and the length of the notch 123 may be 3-4mm, that is, the notch 123 may be rectangular in appearance on the rear cover plate 12. Further, the depth of the notch 123 is determined to penetrate through the rear cover 12, so that the notch 16 formed by the rear cover 12 and the middle frame 13 at the notch 123 can be used as a sound pickup hole of the microphone assembly 15. So configured, the notch 16 may be a narrow, slight gap in the appearance of the electronic device 10 to the user. Since the small gap is small, the small gap is not easily perceived by a user, and the concealment of the sound pickup hole can be increased, so that the overall consistency of the electronic device 10 in appearance can be increased. In other embodiments, the notches 123 may be saw-toothed, and include a series of micro-notches, which may be in one or more of a regular shape such as a semi-circle, a rectangle, a square, a triangle, etc. Furthermore, the rear cover plate 12 and the middle frame 13 may further be provided with functional members having grid-shaped holes at the notch 123, so that the sound pickup hole function of the notch 16 is not affected, and the waterproof and dustproof requirements of the electronic device 10 at the notch 16 can be met.
It should be noted that the notch 123 described in the embodiment of the present application may also be opened in the middle frame 13, or opened in both the back cover plate 12 and the middle frame 13, and the notch 16 may also be formed at the notch 123 by matching the middle frame 13 and the back cover plate 12.
The middle frame 13 includes a frame 131 and a middle plate 132, wherein the middle plate 132 is connected to the frame 131 and extends away from the frame 131. The frame 131 is mainly exposed to the external environment, has an appearance surface, and can play a decorative role; the middle plate 132 is mainly located inside the electronic device 10, and can function as a support and fixing member for supporting and fixing the bracket 14, the microphone assembly 15, and the like. Further, the middle plate 132 and the side frame 131 may be integrally formed, that is, the middle frame 13 may be an integrally formed structural member, which can simplify the structure of the middle frame 13, thereby reducing the manufacturing cost of the middle frame 13. In other embodiments, the middle plate 132 and the frame 131 may be connected by one or a combination of clamping, gluing, and welding. In the embodiment of the present application, the frame 131 cooperates with the second bending portion 122 of the rear cover 12 to form the notch 16.
Referring to fig. 4 and 5 together, fig. 4 is a schematic partial enlarged structure view of a portion a in fig. 1, and fig. 5 is a schematic partial enlarged structure view of a portion B in fig. 2.
Based on the above detailed description, since the display module 11 and the rear cover 12 may be both curved structures that are curved toward the middle frame 13, when the display module 11, the rear cover 12 and the middle frame 13 are connected, an arc-shaped space is formed between the display module 11 and the rear cover 12. Therefore, one surface of the middle plate 132 close to the display module 11 may be a curved surface having the same or similar curvature radius as the display module 11 (specifically, the first bending portion 114), and one surface of the middle plate 132 close to the rear cover 12 may be a curved surface having the same or similar curvature radius as the rear cover 12 (specifically, the second bending portion 122), as shown in fig. 4 and 5, so that the middle plate 132 can better support the display module 11 and the rear cover 12 through the curved surface structure, thereby increasing the structural strength of the whole electronic device 10 and further increasing the reliability of the electronic device 10. In other embodiments, for example, when the curvature radius of the first curved portion 114 and the second curved portion 122 is larger, one surface of the middle plate 132 close to the display module 11 and the rear cover 12 may be a straight plane, so as to simplify the structure of the middle plate 132, and reduce the processing difficulty of the middle frame 13.
Furthermore, two sides of the border between the frame 131 and the middle plate 132 may be recessed to form a first groove 133 and a second groove 134. Wherein, the first groove 133 is close to the display module 11, and the second groove 134 is close to the rear cover 12, as shown in fig. 5; and the distance between the first groove 133 and the second groove 134 is smaller than the width of the outer surface of the frame 131 in the thickness direction of the electronic device 10, as shown in fig. 4, so that the display module 11 can extend to the first groove 133 along the curved surface of the middle plate 132, and the rear cover 12 can extend to the second groove 134 along the curved surface of the middle plate 132, as shown in fig. 5, so that the display module 11 and the rear cover 12 can be partially hidden in the middle frame 13. That is, the middle frame 13 can protect the edges of the display module 11 and the rear cover 12 to some extent, thereby increasing the reliability of the electronic device 10.
In the embodiment of the present application, the width of the appearance surface of the frame 131 in the thickness direction of the electronic device 10 is less than or equal to 1.8 mm; preferably, the width is greater than or equal to 1.4mm and less than or equal to 1.6mm, so that the display module 11 and the rear cover plate 12 can extend more toward each other along the middle plate 132, thereby enabling the electronic device 10 to obtain a larger display field of view. Accordingly, the appearance surface of the frame 131 may be a straight plane or an arc convex surface, so that the electronic device 10 can obtain better appearance and holding feeling. Further, the middle frame 13 is thinned from the inside to the outside of the electronic device 10 as a whole, as shown in fig. 4 and 5, so that the middle frame 13 can meet both requirements of ultra-thinning and structural strength, thereby increasing the reliability of the middle frame 13. Obviously, the ultra-thin middle frame 13 (especially the frame 131) is difficult to meet the requirement of directly forming the sound pickup hole on the mobile phone shell in the related art. For this purpose, the present application develops a new approach to indirectly form the sound pickup hole of the microphone assembly 15 by the back cover plate 12 cooperating with the middle frame 13, as mentioned above.
The detailed structure of the stand 14, the microphone assembly 15 and the fitting relationship with the middle frame 13 will be described in detail below.
Referring to fig. 6 to 9 together, fig. 6 is a schematic cross-sectional structure of the electronic device in fig. 3 along the direction VI-VI, fig. 7 is a schematic cross-sectional structure of the middle frame in fig. 6, fig. 8 is a schematic cross-sectional structure of the cradle in fig. 6, and fig. 9 is a schematic exploded structure of the electronic device in fig. 3. It should be noted that the electronic device shown in fig. 6 to 9 mainly includes partial structures related to the rear cover plate 12, the middle frame 13, the bracket 14 and the microphone assembly 15; the display module 11 and its related structure are not shown.
In the embodiment of the present application, the bracket 14 is disposed between the second flat portion 122 of the rear cover plate 12 and the middle plate 132; the bracket 14 can be spliced with the middle plate 132 as shown in fig. 6, so that the bracket 14 and the middle frame 13 support the rear cover plate 12 together, thereby increasing the structural strength of the electronic device 10. Further, the middle plate 132 is provided with a first sound transmission channel, as shown in fig. 7; the support 14 is provided with a second sound transmission channel, as shown in fig. 8; the second sound transmission channel communicates with the first sound transmission channel to form a sound transmission channel of the microphone assembly 15, as shown in fig. 6. Wherein the microphone assembly 15 is disposed between the middle plate 132 and the bracket 14, the first sound transmission channel is communicated with the notch 16, and the second sound transmission channel extends to the microphone assembly 15, as shown in fig. 6, so that the middle frame 13 and the bracket 14 cooperate with each other to form a sound transmission channel of the microphone assembly 15. The sound transmission channel of the microphone assembly 15 will be described in detail below.
A sound inlet 1322 is formed on the first surface 1321 of the middle plate 132 close to the second bending portion 122 of the rear cover plate 12, as shown in fig. 7 and 9; the sound inlet 1322 communicates with the gap 16, as shown in fig. 6. The sound inlet 1322 may be expanded from the first surface 1321 to the second groove 134 (i.e., the boundary between the frame 131 and the middle plate 132), as shown in fig. 9, so as to increase the communication area between the sound inlet 1322 and the gap 16, thereby increasing the sound collecting effect of the microphone assembly 15. Further, a first through hole 1324 is formed in the first end surface 1323 of the middle plate 132 and the bracket 14, and the first through hole 1324 extends to the sound inlet 1322, as shown in fig. 7; so that the middle plate 132 can form the first sound-conveying channel.
A sound outlet 142 is formed on a second surface 141 of the second straight portion 121 of the bracket 14 away from the rear cover plate 12, as shown in fig. 8; the sound outlet 142 is connected to the microphone assembly 15, as shown in fig. 6. Further, a second through hole 144 is formed in a second end surface 143 of the bracket 14 and the middle plate 132, and the second through hole 144 extends to the sound outlet 142, as shown in fig. 8 and 9; so that the holder 14 can form a second sound transmission channel.
Based on the above detailed description, the second through hole 144 communicates with the first through hole 1324, so that the second sound transmission channel can communicate with the first sound transmission channel, so that the middle frame 13 and the bracket 14 cooperate with each other to form a sound transmission channel of the microphone assembly 15. Further, a first sealing ring 17 is disposed between the second end surface 143 and the first end surface 1323, as shown in fig. 6 and 9; so that the stand 14 is sealingly connected to the middle plate 132 to increase the sound pickup effect of the microphone assembly 15. The first sealing ring 17 may be a sealing member such as foam, a silica gel sleeve, or a sealing structure formed by curing such as glue or glue dispensing. Further, the first surface 1321 is partially convex toward the rear cover plate 12, as shown in fig. 7 and 9; and/or, the second surface 141 partially protrudes toward the middle plate 132, as shown in fig. 8 and 9, to increase the contact area between the first end surface 1323 and the second end surface 143, as shown in fig. 6, so as to increase the sealing area of the first sealing ring 17, i.e., to increase the sealing performance between the first end surface 1323 and the second end surface 143, thereby increasing the sound pickup effect of the microphone assembly 15.
Generally, the space inside the electronic device 10 is limited, but requires a large number of structural members to be accommodated; the structure of the electronic device 10 also tends to be of ultra-thin design, for example, having a thickness of only 7-8mm, resulting in the thickness of structural components inside the electronic device 10 also tending to be small. For the embodiment of the present application, the support 14 is joined to the middle frame 13 to support not only the back cover plate 12, but also the second through hole 144 is communicated with the first through hole 1324, so that the second sound transmission channel can be communicated with the first sound transmission channel, and the middle frame 13 and the support 14 are mutually matched to form a sound transmission channel of the microphone assembly 15; microphone assembly 15 is also disposed between middle plate 132 and stand 14. In the case that the middle frame 13 (especially the middle plate 132) and/or the bracket 14 is thin, the stacking requirement of multiple structural members may cause the second through hole 144 and the first through hole 1324 to be misaligned in the thickness direction of the electronic device 10, so as to affect the communication performance between the second sound transmission channel and the first sound transmission channel, and further affect the sound pickup effect of the microphone assembly 15. To this end, in the embodiment of the present application, the first through hole 1324 is provided as a stepped hole near one end of the bracket 14, as shown in fig. 7; and/or, one end of the second through hole 144 close to the middle plate 132 is provided with a stepped hole, as shown in fig. 8, so as to increase the communication area between the first through hole 1324 and the second through hole 144, as shown in fig. 6, thereby increasing the communication performance between the second sound transmission channel and the first sound transmission channel, and further increasing the sound pickup effect of the microphone assembly 15.
Based on the above detailed description, the sound inlet 1322 of the middle frame 13 and the first through hole 1324 are disposed at a substantially right angle in structure, as shown in fig. 7; the sound outlet 142 and the second through hole 144 of the holder 14 are also arranged at a substantially right angle in structure, as shown in fig. 8. That is, the first sound transmission channel and the second sound transmission channel are both arranged at a substantially right angle in structure, so that the sound transmission channel formed by splicing the middle frame 13 and the support 14 is substantially zigzag in structure. Therefore, in order to satisfy the feasibility of the process, the middle frame 13 and the support 14 may be manufactured separately and then spliced together. For example: the middle plate 132 made of hard plastic and the frame 131 made of metal are processed into the middle frame 13 of an integral structure by injection molding, and the middle plate 132 can form the sound inlet 1322 and the first through hole 1324 by core setting. The metal frame 131 can enhance the aesthetic appearance and the wear-resistant, corrosion-resistant, scratch-resistant properties of the middle frame 13, and the hard plastic middle plate 132 can enhance the overall strength of the middle frame 13. Similarly, the holder 14 is manufactured by injection molding, and the core is disposed so that the sound outlet 142 and the second through hole 144 can be formed in the holder 14. In other embodiments, the sound inlet 1322 of the middle frame 13 and the sound outlet 142 of the middle plate 14 may also be formed by machining. Further, the minimum distance between the maximum depth position of the second through hole 144 and the wall of the sound outlet 142 may be less than or equal to 0.1mm, so as to reduce the volume of the second through hole 144, that is, the volume of the sound transmission channel, thereby increasing the sound transmission effect of the sound transmission channel (because an excessively large sound transmission channel affects the high-frequency cut-off frequency of sound); and the demoulding requirement of the core in the bracket 14 is considered, so that the hole blocking phenomenon caused by the mould slide is avoided, and the reliability of the bracket 14 is improved.
Further, the material of the bracket 14 may be the same as or similar to that of the middle plate 132. In the embodiment of the present application, the material of the bracket 14 and the middle plate 132 is hard plastic. Compared with soft rubber materials, the bracket 14 and the middle plate 132 of the embodiment of the present application are made of hard plastics, so that on one hand, the structural strength is better, and the problem of sound transmission channel deformation caused by external force extrusion during splicing and using processes of the bracket 14 and the middle plate 132 can be improved; on the other hand, the problem that burrs are easily formed in the sound transmission channel during the injection molding process of the bracket 14 and the middle plate 132 can be solved, so that the sound transmission effect of the sound transmission channel is increased, and the communication quality of the electronic device 10 is further improved.
With continued reference to fig. 6 and 9, the microphone assembly 15 includes a main board 151 and a microphone 152 electrically connected to each other. The main board 151 is disposed on one side of the bracket 14 close to the middle plate 132, and is provided with a sound transmission through hole 1511, as shown in fig. 9; the microphone 152 is disposed on a side of the main board 151 close to the middle plate 132, and is communicated with the sound outlet 142 of the bracket 14 through the sound transmission through hole 1511, so that the microphone 152 can be communicated with the external environment through the gap 16 formed by the rear cover plate 12 and the middle frame 13, and the sound transmission channel (mainly, the first through hole 1324 and the second through hole 144) formed by splicing the middle frame 13 and the bracket 14, as shown in fig. 6, so that the microphone 152 can pick up sound. In the embodiment of the present application, the microphone 152 may be first attached to the motherboard (or other circuit boards) 151 through a Surface Mounting Technology (SMT), and then the second sealing ring 153 is used to realize the sealing connection between the motherboard 151 and the bracket 14, as shown in fig. 6, so as to meet the sealing requirement between the motherboard 151 and the bracket 14. The second sealing ring 153 may be a sealing member such as a foam, a silicone sleeve, or a sealing structure formed by curing such as glue or glue dispensing.
In the embodiment of the present application, a groove 1325 may be further disposed on a side of the middle plate 132 close to the bracket 14, as shown in fig. 9; so that the microphone 152 can be partially received in the recess 1325 during assembly of the electronic device 10, as shown in fig. 6, thereby increasing the compactness of the electronic device 10 in construction. The recess 1325 may further include a filler such as foam, glue, etc. to further increase the compactness and reliability between the microphone 152 and the middle plate 132. Further, an avoiding groove 1512 may be further disposed at one end of the main board 151 close to the middle frame 13 (specifically, the frame 131), as shown in fig. 9; so that the main board 151 can be surrounded by the avoiding groove 1512 at the portion of the bracket 14 (specifically, the second surface 141) protruding toward the middle plate 132 during the assembly process of the electronic device 10, as shown in fig. 6, thereby increasing the compactness of the electronic device 10 in structure.
Generally, for a functional element such as a microphone, the function is mainly to pick up the voice of a user and convert the voice signal into an electric signal during the interaction of the user such as making a call, sending a voice message and chatting a video (including voice). Further, as the user demands higher and higher call quality during the above interaction process, two microphones are generally disposed in the electronic device 10, wherein one of the two microphones is mainly used for picking up the user sound (which may be referred to as a main microphone), and the other microphone is mainly used for picking up the environmental sound (which may be referred to as a secondary microphone). The electronic device 10 may perform denoising processing according to the user sound picked up by the primary microphone and the environmental sound picked up by the secondary microphone, so as to increase the resolution (reduction degree) of the electronic device 10 to the user sound, thereby increasing the call quality of the electronic device 10 and improving the user experience. Therefore, the microphone 152 according to the embodiment of the present application may be a main microphone of the electronic device 10, or may be a sub-microphone of the electronic device 10.
It is well known that the sealing of the acoustic channel is critical in order to ensure the speech quality of the electronic device 10. Based on the above detailed description, the second sound transmission channel of the bracket 14 and the first sound transmission channel of the middle frame 13 can be sealed by the first sealing ring 17, and the main plate 151 of the microphone assembly 15 and the sound outlet 142 of the bracket 14 can be sealed by the second sealing ring 153. The following description will be made mainly of the sealing property between the sound inlet 1322 of the center frame 13 and the notch 16.
A sealing member 18 is disposed between the first surface 1321 of the middle plate 132 and the second bending portion 122 of the rear cover plate 12, as shown in fig. 6, so as to hermetically connect the rear cover plate 12 and the middle frame 13, thereby reducing moisture and the like in the external environment from entering the electronic device 10 through the gap between the above structural members, and further increasing the reliability of the electronic device 10. Further, the sealing element 18 is provided with a sound transmission gap 181, for example, the sound transmission gap 181 is U-shaped, as shown in fig. 9, the opening direction of the sound transmission gap 181 faces the notch 16, so that the sealing element 18 can meet the sealing requirement, and can also realize that the notch 16 is communicated with the sound inlet 1322, and sound leakage of the sound transmission channel is avoided. Wherein the seal 18 may be foam.
Further, in the process of assembling the rear cover plate 12 and the middle frame 13, one or a combination of foam, glue and the like may be further disposed between the second bending portion 122 of the rear cover plate 12 and the second groove 134 of the middle frame 13, so as to increase the waterproof and dustproof performance of the electronic device 10, and thus increase the reliability of the electronic device 10.
The above description is only a part of the embodiments of the present application, and not intended to limit the scope of the present application, and all equivalent devices or equivalent processes performed by the content of the present application and the attached drawings, or directly or indirectly applied to other related technical fields, are also included in the scope of the present application.

Claims (10)

1. The electronic equipment is characterized by comprising a display module, a rear cover plate, a middle frame, a support and a microphone assembly, wherein the display module and the rear cover plate are respectively connected with the middle frame, the support is arranged between the rear cover plate and the middle frame and spliced with the middle frame, the microphone assembly is arranged between the display module and the support, the rear cover plate and the middle frame are matched to form a notch, and the notch serves as a sound pickup hole of the microphone assembly.
2. The electronic device according to claim 1, wherein the rear cover plate and/or the middle frame are provided with a notch, so that the rear cover plate and the middle frame are matched to form the notch at the notch.
3. The electronic device of claim 1, wherein the middle frame defines a first sound transmission channel, the first sound transmission channel is communicated with the gap, the bracket defines a second sound transmission channel, the second sound transmission channel is communicated with the first sound transmission channel, and the microphone assembly is disposed at an end of the second sound transmission channel away from the first sound transmission channel.
4. The electronic device of claim 3, wherein the display module comprises a first straight portion and a first curved portion of an integrally formed structure, the first curved portion surrounds the first straight portion, the rear cover plate comprises a second straight portion and a second curved portion of an integrally formed structure, the second curved portion surrounds the second straight portion, and both the second curved portion and the first curved portion are curved toward the middle frame.
5. The electronic device of claim 4, wherein the middle frame comprises a rim and a middle plate, the middle plate is connected to the rim and extends away from the rim, the rim and the second curved portion cooperate to form the notch, the bracket is disposed between the second straight portion and the middle plate and is joined to the middle plate, the first sound transmission channel is opened in the middle plate, the microphone assembly is disposed between the middle plate and the bracket, and the second sound transmission channel extends to the microphone assembly.
6. The electronic device of claim 5, wherein a sound inlet is opened on a first surface of the middle plate near the second bending portion, the sound inlet is communicated with the gap, a first through hole is arranged on the first end face of the middle plate spliced with the bracket and extends to the sound inlet, so that the middle plate can form the first sound transmission channel, a sound outlet is arranged on the second surface of the bracket far away from the second straight part, the sound outlet is communicated with the microphone assembly, a second through hole is formed in a second end face of the support, which is spliced with the middle plate, the second through hole extends to the sound outlet, so that the bracket can form the second sound transmission channel, and the second through hole is communicated with the first through hole, so that the second sound transmission channel can be communicated with the first sound transmission channel.
7. The electronic device of claim 6, wherein the first through hole is arranged in a stepped hole at an end close to the bracket; and/or one end of the second through hole close to the middle plate is arranged in a stepped hole manner.
8. The electronic device of claim 6, wherein the first surface portion protrudes toward the rear cover plate to increase a contact area between the first end surface and the second end surface, and a first sealing ring is disposed between the second end surface and the first end surface to enable the bracket to be in sealing connection with the middle plate.
9. The electronic device of claim 6, wherein the microphone assembly comprises a main board and a microphone electrically connected to each other, the main board is disposed on a side of the bracket near the middle plate and has a sound transmission through hole, the microphone is disposed on a side of the main board near the middle plate and is communicated with the sound outlet through the sound transmission through hole, and a second sealing ring is disposed between the main board and the bracket, so that the main board and the bracket are hermetically connected.
10. The electronic device according to claim 6, wherein a sealing member is disposed between the middle plate and the second bending portion, so that the rear cover plate is connected to the middle frame in a sealing manner, the sealing member is provided with a sound transmission gap, and an opening direction of the sound transmission gap faces the gap, so that the gap is communicated with the sound inlet.
CN201921653335.8U 2019-09-29 2019-09-29 Electronic equipment Active CN210137422U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201921653335.8U CN210137422U (en) 2019-09-29 2019-09-29 Electronic equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201921653335.8U CN210137422U (en) 2019-09-29 2019-09-29 Electronic equipment

Publications (1)

Publication Number Publication Date
CN210137422U true CN210137422U (en) 2020-03-10

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Application Number Title Priority Date Filing Date
CN201921653335.8U Active CN210137422U (en) 2019-09-29 2019-09-29 Electronic equipment

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Country Link
CN (1) CN210137422U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112291391A (en) * 2020-10-28 2021-01-29 维沃移动通信有限公司 Electronic device
CN113037894A (en) * 2019-12-24 2021-06-25 Oppo广东移动通信有限公司 Electronic equipment
CN113556417A (en) * 2020-04-24 2021-10-26 Oppo广东移动通信有限公司 Bracket component and electronic equipment

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113037894A (en) * 2019-12-24 2021-06-25 Oppo广东移动通信有限公司 Electronic equipment
CN113037894B (en) * 2019-12-24 2023-03-03 Oppo广东移动通信有限公司 Electronic equipment
CN113556417A (en) * 2020-04-24 2021-10-26 Oppo广东移动通信有限公司 Bracket component and electronic equipment
CN113556417B (en) * 2020-04-24 2024-03-08 Oppo广东移动通信有限公司 Bracket assembly and electronic equipment
CN112291391A (en) * 2020-10-28 2021-01-29 维沃移动通信有限公司 Electronic device
WO2022089347A1 (en) * 2020-10-28 2022-05-05 维沃移动通信有限公司 Electronic device

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