TWI657278B - 電漿界面及製造電漿界面的方法 - Google Patents

電漿界面及製造電漿界面的方法 Download PDF

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Publication number
TWI657278B
TWI657278B TW103127087A TW103127087A TWI657278B TW I657278 B TWI657278 B TW I657278B TW 103127087 A TW103127087 A TW 103127087A TW 103127087 A TW103127087 A TW 103127087A TW I657278 B TWI657278 B TW I657278B
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TW
Taiwan
Prior art keywords
layer
optical waveguide
plasma
metal component
stack
Prior art date
Application number
TW103127087A
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English (en)
Chinese (zh)
Other versions
TW201520621A (zh
Inventor
克里斯塔佛 凱摩
約翰 休格利
瓊恩 比塞拉
Original Assignee
美商通用電機股份有限公司
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Application filed by 美商通用電機股份有限公司 filed Critical 美商通用電機股份有限公司
Publication of TW201520621A publication Critical patent/TW201520621A/zh
Application granted granted Critical
Publication of TWI657278B publication Critical patent/TWI657278B/zh

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/02—Optical fibres with cladding with or without a coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/24—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer not being coherent before laminating, e.g. made up from granular material sprinkled onto a substrate
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C25D11/04—Anodisation of aluminium or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C25D11/26—Anodisation of refractory metals or alloys based thereon
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/122—Basic optical elements, e.g. light-guiding paths
    • G02B6/1226—Basic optical elements, e.g. light-guiding paths involving surface plasmon interaction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/24—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer not being coherent before laminating, e.g. made up from granular material sprinkled onto a substrate
    • B32B2037/243—Coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/20—Inorganic coating
    • B32B2255/205—Metallic coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/28—Multiple coating on one surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/40—Properties of the layers or laminate having particular optical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/40—Properties of the layers or laminate having particular optical properties
    • B32B2307/412—Transparent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2551/00—Optical elements

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optical Integrated Circuits (AREA)
TW103127087A 2013-08-20 2014-08-07 電漿界面及製造電漿界面的方法 TWI657278B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/970,852 US9465160B2 (en) 2013-08-20 2013-08-20 Plasmonic interface and method of manufacturing thereof
US13/970,852 2013-08-20

Publications (2)

Publication Number Publication Date
TW201520621A TW201520621A (zh) 2015-06-01
TWI657278B true TWI657278B (zh) 2019-04-21

Family

ID=51298566

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103127087A TWI657278B (zh) 2013-08-20 2014-08-07 電漿界面及製造電漿界面的方法

Country Status (6)

Country Link
US (1) US9465160B2 (enExample)
EP (1) EP2840422A3 (enExample)
JP (1) JP6636238B2 (enExample)
KR (1) KR20150021477A (enExample)
CA (1) CA2859421A1 (enExample)
TW (1) TWI657278B (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10026421B1 (en) 2016-02-18 2018-07-17 Seagate Technology Llc Hyperbolic metamaterial-based near-field transducer for heat assisted magnetic recording head
RU2689479C1 (ru) * 2017-12-28 2019-05-28 Общество с ограниченной ответственностью "СУАЛ-ПМ" Способ получения плазмонной пленочной структуры из аддитивных порошков на основе алюминия
KR102732518B1 (ko) * 2019-01-03 2024-11-20 삼성전자주식회사 Sers 패치 및 이를 적용한 라만 분광 시스템
CN111766661A (zh) * 2020-06-28 2020-10-13 武汉邮电科学研究院有限公司 一种等离激元波导的制备方法

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WO2010056306A1 (en) * 2008-11-12 2010-05-20 Eastman Kodak Company Polymeric conductive donor and transfer method
US20100329085A1 (en) * 2009-06-24 2010-12-30 Tdk Corporation Near-field light generating device including near-field light generating element disposed over waveguide with buffer layer and adhesion layer therebetween
TWI354782B (enExample) * 2007-09-14 2011-12-21 Council Of Agriculture Executive Yuan
US20130120752A1 (en) * 2011-11-11 2013-05-16 Kyeong Seok Lee Fiber-optic surface plasmon resonance sensor and sensing method using the same

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US7265845B2 (en) 2003-01-27 2007-09-04 Lake Shore Cryotronics, Inc. Surface corrugation enhanced magneto-optical indicator film
JP2005010025A (ja) 2003-06-19 2005-01-13 Tama Tlo Kk 光ファイバセンサおよびこれを用いた測定方法
KR100546773B1 (ko) 2003-09-18 2006-01-26 한국전자통신연구원 누설 플라즈몬 모드 커플러 및 이를 이용한 광자기 픽업헤드용 편광 측정 모듈
US20060169592A1 (en) * 2005-01-31 2006-08-03 Hewlett-Packard Development Company, L.P. Periodic layered structures and methods therefor
JP2008059691A (ja) * 2006-08-31 2008-03-13 Tdk Corp 熱アシスト磁気ヘッド、ヘッドジンバルアセンブリ及びハードディスク装置
KR100783365B1 (ko) 2006-09-29 2007-12-07 한국전자통신연구원 광도파로 소자
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JP2003207667A (ja) * 2002-01-17 2003-07-25 National Institute Of Advanced Industrial & Technology 極微小光導波路およびその製造方法
TWI354782B (enExample) * 2007-09-14 2011-12-21 Council Of Agriculture Executive Yuan
WO2010056306A1 (en) * 2008-11-12 2010-05-20 Eastman Kodak Company Polymeric conductive donor and transfer method
US20100329085A1 (en) * 2009-06-24 2010-12-30 Tdk Corporation Near-field light generating device including near-field light generating element disposed over waveguide with buffer layer and adhesion layer therebetween
US20130120752A1 (en) * 2011-11-11 2013-05-16 Kyeong Seok Lee Fiber-optic surface plasmon resonance sensor and sensing method using the same

Also Published As

Publication number Publication date
JP2015041107A (ja) 2015-03-02
KR20150021477A (ko) 2015-03-02
US20150055924A1 (en) 2015-02-26
US9465160B2 (en) 2016-10-11
EP2840422A2 (en) 2015-02-25
CA2859421A1 (en) 2015-02-20
TW201520621A (zh) 2015-06-01
JP6636238B2 (ja) 2020-01-29
EP2840422A3 (en) 2015-06-03

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