TWI651845B - Image sensing module system-in-package and manufacturing method therof - Google Patents

Abstract

The invention relates to an image sensing module system-level package body and a manufacturing method thereof. The image sensing module system-level packaging system comprises a first redistribution layer, a plurality of image sensors, at least one functional chip and a colloid The first and second surfaces of the first redistribution layer are respectively formed with a plurality of first and second contacts, wherein the plurality of image sensors are electrically connected to the first contacts, respectively, and the at least one function The wafer is electrically connected to the second contact, and the sealant covers the at least one functional wafer and the second surface of the first redistribution layer; thus, the present invention does not need to use a pre-formed substrate to complete image sensing. The system-level package of the device and its functional chip can be reduced in size and thickness, and the image sensing module system-level package of the present invention can include a plurality of image sensors.

Description

Image sensing module system-level package and manufacturing method thereof

The invention relates to an image sensing module system-level package and a manufacturing method thereof, in particular to a miniaturized image sensing module system-level package and a manufacturing method thereof.

FIG. 15 shows an image sensing module system-level package 70 in the prior art. In order to reduce the size of the whole package, the image sensor uses a wafer level packaging process (WLP) to enable the image sensor. 71 is reduced in size, and another system-level packaging process is performed to complete the image sensing module system-level package 70. In the system-level packaging process, an image sensor 71, a substrate 72, and a processor chip 73 are prepared. And soldering the image sensor 71 and the processor chip 73 to the upper and lower surfaces of the substrate 72 to form an image sensing module system-level package 70; and then An optical lens holder 80 and an optical lens 81 are disposed outside the upper surface of the substrate 72, and are aligned with the image sensor 71.

Although the image sensor 71 is reduced in size by a miniaturized wafer level process, after the wafer level packaging process is completed, a pre-formed substrate 72 needs to be prepared for the next system packaging process to image. The sensor 71 and the processing chip 73 are integrated into an image sensing module system-level package 70; therefore, the current image sensing module system-level package 70 only includes a single image sensor 71 for use in an array camera. In terms of modules, the overall size of a system-in-package is too large to meet the increasingly compact array camera module, so further improvements are needed.

In view of the above, the main object of the present invention is to provide a new image sensing module system-level package and a manufacturing method thereof, so as to overcome the problem of excessive size of the current image sensing module system-level package.

The main technical means used to achieve the above purpose is to make the image sensing module system-level package include:

In order to achieve the object of the present invention, the technical means adopted by the present invention is to create an image sensing module system-level package, comprising: a first redistribution layer, comprising a body, a plurality of first contacts, a plurality of metal contacts and a plurality of second contacts; wherein the first contacts are exposed on a first surface of the body, and the second contacts are exposed on a second surface of the body, the metal connections a wire system is formed in the body to electrically connect the first contacts and the second contacts; the plurality of image sensors are respectively electrically connected to the corresponding first contacts; at least one functional chip And the plurality of second contacts corresponding to the electrical connection; and a glue covering the at least one functional wafer and the second surface of the first redistribution layer.

It can be seen from the above description that the image sensing module system-level package of the present invention does not need to use a pre-formed substrate to complete the system-level packaging of the image sensor and its functional chip, so the size and thickness thereof can be further reduced. The image sensing module system-level package of the present invention can include a plurality of image sensors, which can conform to the miniaturized array camera module application.

In order to achieve another object of the present invention, the technical means adopted by the present invention is a method for manufacturing an image sensing module system-level package, which comprises the following steps: (a) providing a carrier board; (b) Forming a redistribution layer on the carrier; wherein the body of the repetitive layer includes a plurality of metal connection lines, and forming a plurality of second contacts on the second surface of the body of the rewiring layer, the second contacts Electrically connecting with the metal connecting wires and exposing to the second surface; (c) electrically connecting the plurality of functional wafers to the second contacts; (d) forming a gel to cover the at least one functional wafer And the second surface of the redistribution layer; (e) removing the carrier, exposing a portion of the metal connection line to the first surface of the body of the redistribution layer to form a plurality of first contacts; (f) The image sensor is electrically connected to the corresponding first contacts; and (g) the plurality of image sensing module system-level packages are cut out; wherein the image sensing module system-level packaging system comprises multiple The image sensing chip and the at least one functional wafer.

It can be seen from the above description that the present invention completes the manufacture of the image sensing module system-level package in the same wafer level process, and does not use the pre-formed substrate to complete the system-level packaging of the image sensor and its functional chip. Therefore, the overall size and thickness can be further reduced. In addition, the image sensing module system-level package of the present invention can include a plurality of image sensors, which can conform to the miniaturized array camera module application.

The technical means adopted by the present invention for achieving the intended purpose of the invention are further illustrated in the following description of the embodiments of the invention, wherein the drawings have been simplified for illustrative purposes only, and by describing between the elements and components of the invention The relationship is to illustrate the structure or method invention of the present invention, and therefore, the elements shown in the drawings are not presented in actual number, actual shape, actual size, and actual scale, and the size or size ratio has been enlarged or simplified, thereby providing better Note that the actual quantity, actual shape, or actual size ratio has been selectively designed and configured, and the detailed component layout may be more complicated.

Referring to FIG. 1 , the image sensing module system package 1 of the present invention includes a first redistribution layer 10 , a plurality of image sensors 20 , at least one functional wafer 30 , and a gel 40 .

The first redistribution layer 10 includes a body 11 , a plurality of first contacts 12 , a plurality of metal connection lines 14 , and a plurality of second contacts 13 . The first contacts 12 are exposed to one of the bodies 11 . a first surface 101, the second contacts 13 are exposed on the second surface 102 of the body 11. The metal connecting wires 14 are formed in the body 11 to electrically connect the first contacts 12 and The second contact layer 13 further includes a plurality of third contacts 15 exposed on the first surface 101 of the body 11 and through the plurality of contacts The metal connecting wires 14 are electrically connected to the second contacts 13 . Each of the first contacts 12 may further be formed with a metal bump 121 protruding from the first surface 101 of the body 11. Each of the third contacts 15 may further be formed with a metal bump 151 to protrude therefrom. The first surface 101 of the body 11 and each of the second contacts 13 may further be formed with a metal bump 131 protruding from the second surface 102 of the body 11. The metal bumps 121, 151, and 131 may be copper. And a three-layer metal bump of nickel or gold, but not limited thereto; the first contact 12 and the third contact 15 may also be directly exposed on the first surface 101, and the first surface 101 A common plane (not shown), and the second contact 13 can also be directly exposed on the second surface 102 and coplanar with the second surface 102 (not shown). In this embodiment, the body 11 material is a polymer dielectric material.

The plurality of image sensors 20 are disposed on the first surface 101 of the first redistribution layer 10 and respectively associated with the first contacts 12 located on the first surface 101 of the first redistribution layer 10. The metal bumps 121 are electrically connected. In this embodiment, each of the image sensors 20 includes an image sensing chip 21, a transparent cover 22, a second redistribution layer 23, a plurality of metal posts 24, and a bezel 25; The image sensing wafer 21 includes an active surface 210, a back surface 212, and a plurality of turns 213. The active surface 210 includes an image sensing area 211 and a plurality of external pads 215 on the periphery of the image sensing area 211 . The through holes 213 extend through the back surface 212 to the external pad 215 to be electrically connected to the external pad 215 . The plastic frame 25 covers the periphery of the image sensing area 211 and covers the external pads 215. The transparent cover 22 covers the top surface of the plastic frame 25 and the image sensing wafer 21 The image sensing area 211 is maintained at a distance. The second redistribution layer 23 is formed on the back surface 212 of the image sensing wafer 21, and is electrically connected to each of the turns 213, and the metal posts 24 are transparent. The second redistribution layer 23 is electrically connected to the corresponding via hole 213, and protrudes downwardly from the second redistribution layer 23, and covers a metal layer 24 on the metal layer 24, and then The metal posts 24 are electrically connected to the metal bumps 121 of the first contacts 12 corresponding to the first surface 101 of the first redistribution layer 10, and are protected after the adhesive layer 26 is cured. The metal posts 24 and the metal bumps 121 of the first contacts 12 are protected from external moisture; preferably, the metal posts 24 are copper posts, but are not limited thereto.

The at least one functional chip 30 is disposed on the second surface 102 of the first redistribution layer 10 and electrically connected to the metal bumps 131 of the second contact 13 of the first redistribution layer 10 to transmit the The metal connecting wires 14 in the body 11 of the first redistribution layer 10 are electrically connected to the corresponding first contacts 12 and the third contacts 15 . In this embodiment, since the density of the plurality of second contacts 13 of the first redistribution layer 10 is high, a plurality of functional wafers 30 can be further electrically connected, such as a digital processing chip, a memory chip, and an autofocus drive. Control wafers and the like to form a more powerful and complete image sensing module. Each of the functional chips 30 is formed with a plurality of metal pillars 31 on the bottom surface thereof to be electrically connected to the corresponding metal bumps 131 of the second contacts 13 and through the metal connecting wires 14 and the first interfaces. The point 12 and the third contacts 15 are electrically connected; preferably, each of the metal pillars 31 is a copper pillar, but is not limited thereto.

The encapsulant 40 covers the at least one functional wafer 30 and the second surface 102 of the first redistribution layer 10 to protect the metal pillar 31 of the at least one functional wafer 30 and the second connection of the electrically connected portions thereof The metal bump 131 of the point 13 is not damaged or damaged by external moisture.

Since the image sensing module system-level package 1 must be electrically connected to other electronic components after being fabricated, as shown in FIG. 14, the first surface 101 of the first redistribution layer 10 is The metal bumps 151 of the third contact 15 can be electrically connected to components such as a flexible circuit board (FPC) 50, and the optical lens assembly 51 can be further aligned with the image sensor 20 and fixed to the first redistribution. The upper surface 101 of the layer 10 constitutes a complete image sensing module.

The above is the structure of the image sensing module system-level package 1 of the present invention. The method for manufacturing the image sensing module system-level package 1 is further described below, as shown in FIG. 2 to FIG. There are the following steps (a) to (k):

As shown in FIG. 2 and FIG. 3, a carrier 60 is provided. The carrier 60 is coated with a release layer 61.

As shown in step (b) of FIG. 4, a first redistribution layer 10 is formed on the carrier 60; that is, a polymer dielectric material is used in combination with a redistribution layer (RDL) process, and After the plurality of first contacts 12 and the third contacts 15 are formed, the plurality of metal wires 14 are formed upward; wherein the first contacts 12 and the third contacts 15 are electrically connected to the metal wires 14; After the insulating layer 110 is covered on the metal connecting lines 14, a plurality of openings 111 are formed in the insulating layer 110. Referring to FIG. 5, metal pillars are formed in each of the openings 111 to form a plurality of openings. In the present embodiment, further, the second bumps 13 are formed with metal bumps 131 protruding from the insulating layer 110 and composed of three layers of copper, nickel and gold.

Step (c) shown in FIG. 6 is such that the metal posts 31 on the bottom surface of the plurality of functional chips 30 are aligned with the metal bumps 131 of the second contacts 13 and electrically connected to each other, as shown in FIG.

As shown in step (d) of FIG. 8, a colloid 40 is formed to cover the plurality of functional wafers 30 and the second surface 102 of the first redistribution layer 10, such that the metal pillars 31 on the bottom surface of the functional wafers 30 are The metal bumps 131 of the electrically connected second contacts 13 are all covered in the sealant 40; in the embodiment, the step (d) is formed by a molding process and a curing process. Sealant 40.

As shown in FIG. 9 and FIG. 10 (e), in the present embodiment, the carrier 60 is turned upside up, and the carrier 60 is irradiated with the laser light L to cleave the release layer 61 thereon. Disengaging the first surface 101 of the first redistribution layer 10, the carrier 60 can be removed, and the second contacts 12 and the third contacts 15 are exposed to the first of the first redistribution layer 10. The surface 101; further, as shown in FIG. 11, each of the first contact 12 and each of the third contacts 15 respectively form metal bumps 121 and 151 composed of three layers of copper, nickel and gold, but not the metal material. Limited. In addition, as shown in FIG. 10, the exposed first and third contacts 12, 15 are coplanar with the first surface 101, so that they can be directly used as solder joints for electrical connection with the components.

As shown in FIG. 12, the metal posts 24 of the plurality of image sensors 20 are respectively aligned and electrically connected to the corresponding metal bumps 121, as shown in FIG. 13; The metal pillars 24 of the image sensors 20 may be coated with a soft adhesive layer 26, and then joined and electrically connected to the corresponding metal bumps 121. After waiting for a period of time, the soft adhesive layer 26 is cured. . Preferably, the soft adhesive layer 26 is an anisotropic conductive film (NCF).

As shown in step (g) of FIG. 13, the structure of the step (f) is temporarily fixed on a tape 63 to cut out the plurality of image sensing module system-level packages 1; wherein the image sensing modules are respectively The system-in-package 1 includes a plurality of image sensors 20 and at least one functional chip 30. In this embodiment, each of the image sensing module system-level packages 1 includes a plurality of functional wafers 30, such as digital processing chips. , memory chip, autofocus drive control chip, etc., but also not limited to this.

In summary, since the manufacturing method of the present invention is completed in a wafer level packaging process, the foreign matter is adhered to the image sensor to reduce the yield in the subsequent assembly process; The number of image sensors required by the camera module directly produces the image sensing module that meets the requirements, and the technology of the present invention does not require the use of a pre-formed substrate to complete the system-level packaging of the image sensor and its functional chip. The image sensing module system-level package of the present invention can include a plurality of image sensors, and can further integrate a plurality of image processing chips into a single package. In the case of the array camera module, the focus and continuous shooting speed can be greatly improved.

The above is only the embodiment of the present invention, and is not intended to limit the scope of the present invention. The present invention has been disclosed by the embodiments, but is not intended to limit the invention, and any one of ordinary skill in the art, In the scope of the technical solutions of the present invention, equivalent modifications may be made to the equivalents of the embodiments of the present invention without departing from the technical scope of the present invention. Any simple modifications, equivalent changes and modifications made to the above embodiments are still within the scope of the technical solutions of the present invention.

1‧‧‧Image Sensing Module System Level Package

10‧‧‧First redistribution layer

101‧‧‧ first surface

102‧‧‧ second surface

11‧‧‧Ontology

12‧‧‧ first joint

121‧‧‧Metal bumps

13‧‧‧second junction

131‧‧‧Metal bumps

14‧‧‧Metal cable

15‧‧‧ third joint

151‧‧‧Metal bumps

20‧‧‧Image Sensor

21‧‧‧Image sensing wafer

210‧‧‧Active surface

211‧‧‧Image Sensing Area

212‧‧‧Back

213‧‧‧矽Perforated

215‧‧‧External mat

22‧‧‧Transparent cover

23‧‧‧Second redistribution layer

24‧‧‧ metal column

25‧‧‧ plastic frame

26‧‧‧ glue layer

30‧‧‧Functional Wafer

31‧‧‧Metal column

40‧‧‧ Sealant

50‧‧‧Soft circuit board

51‧‧‧Optical lens assembly

60‧‧‧ Carrier Board

61‧‧‧Separation layer

63‧‧‧ Tape

70‧‧‧Image Sensing Module System Level Package

71‧‧‧Image sensor

72‧‧‧Substrate

73‧‧‧Processing chip

80‧‧‧Optical lens holder

81‧‧‧Optical lenses

1 is a cross-sectional view of a system level package of an image sensing module of the present invention. 2 to FIG. 13 are cross-sectional views showing the system level package of the image sensing module of the present invention in each process step. Figure 14 is a cross-sectional view of the image sensing module system package of the present invention plus an optical lens assembly. Figure 15 is a cross-sectional view of a system-in-package of an existing image sensing module.

Claims (9)

An image sensing module system-level package includes: a first redistribution layer comprising a body, a plurality of first contacts, a plurality of metal connections, a plurality of second contacts, and a plurality of third contacts; wherein The first contacts are exposed on a first surface of the body, the second contacts are exposed on a second surface of the body, and the third contacts are exposed on the first surface of the body, The metal connection wires are formed in the body to electrically connect the first contacts and the second contacts, and electrically connect the second contacts and the third contacts; The detector is electrically connected to the first contact; the at least one functional chip is electrically connected to the plurality of second contacts; and a gel covering the at least one functional chip and the a second surface of the first redistribution layer. The image sensing module system-level package of claim 1, wherein each of the first contacts further comprises a metal bump protruding from the first surface of the first redistribution layer; The second contact is further formed with a metal bump protruding from the second surface of the first redistribution layer; and each of the third contacts is further formed with a metal bump to protrude from the first redistribution layer The first surface. The image sensing module system-level package according to claim 2, wherein each of the metal bumps is a copper, nickel, and gold three-layer bump. The image sensing module system-level package of claim 1, wherein each of the image sensors comprises: an image sensing chip, comprising an active surface, a back surface, and a plurality of perforations; wherein the active bread An external pad having an image sensing area and a plurality of bits on the periphery of the image sensing area, each of the through holes extending through the back surface to the external pad to be electrically connected to the external pad; a plastic frame covering the outer pads of the periphery of the image sensing area; a transparent cover covering the top surface of the frame and maintaining the image sensing area of the image sensing chip a second redistribution layer is formed on the back surface of the corresponding image sensing wafer and electrically connected to each of the turns; and a plurality of metal pillars are transmitted through the second redistribution layer The cymbal is electrically connected to the through hole and protrudes downward from the second redistribution layer to be electrically connected to the corresponding first contact. The image sensing module system-level package according to claim 4, further comprising a plurality of adhesive layers, each of the adhesive layers covering the plurality of metal posts corresponding to the image sensor and the electrically connected A contact. The image sensing module system-level package according to claim 5, wherein each of the adhesive layers is an anisotropic conductive adhesive. A method for manufacturing an image sensing module system-level package comprises the steps of: (a) providing a carrier; (b) forming a redistribution layer on the carrier; wherein the redistribution layer is formed sequentially from bottom to top a plurality of first contacts, a plurality of metal wires, and a plurality of second contacts, wherein the first contacts and the second contacts are electrically connected to the metal wires; wherein the second contacts are exposed a second surface of the redistribution layer; (c) electrically connecting the plurality of functional wafers to the second contacts; (d) forming a gel to cover the at least one functional wafer and the second surface of the redistribution layer (e) removing the carrier to expose the first contacts to the first surface of the redistribution layer; (f) electrically connecting the plurality of image sensors to the corresponding first contacts And (g) cutting out the plurality of image sensing module system-level packages; wherein each of the image sensing module system-level packaging systems comprises a plurality of image sensing chips and at least one functional wafer. The method for manufacturing an image sensing module system-level package according to claim 7, wherein in the step (f), an anisotropic conductive paste covers a plurality of metal pillars on the bottom surface of each image sensor, and then The metal post is electrically connected to the corresponding first contact. The method for manufacturing an image sensing module system-level package according to claim 7 or 8, wherein in step (b), a metal bump is further formed on each of the second contacts by a bump process step. And in step (e), a metal bump is further formed on each of the first contacts by a bump process step.