TWI648107B - 凹型結核海綿刷 - Google Patents

凹型結核海綿刷 Download PDF

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Publication number
TWI648107B
TWI648107B TW102110519A TW102110519A TWI648107B TW I648107 B TWI648107 B TW I648107B TW 102110519 A TW102110519 A TW 102110519A TW 102110519 A TW102110519 A TW 102110519A TW I648107 B TWI648107 B TW I648107B
Authority
TW
Taiwan
Prior art keywords
brush
length
cleaning
tuberculosis
radius
Prior art date
Application number
TW102110519A
Other languages
English (en)
Chinese (zh)
Other versions
TW201347862A (zh
Inventor
泰瑞爾傑夫利Ｊ
維斯爾布蘭迪Ｓ
Original Assignee
伊利諾工具工程公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 伊利諾工具工程公司 filed Critical 伊利諾工具工程公司
Publication of TW201347862A publication Critical patent/TW201347862A/zh
Application granted granted Critical
Publication of TWI648107B publication Critical patent/TWI648107B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0412—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
    • B08B1/34—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members rotating about an axis parallel to the surface
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/60—Cleaning only by mechanical processes

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Cleaning In General (AREA)
TW102110519A 2012-04-03 2013-03-25 凹型結核海綿刷 TWI648107B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201261619525P 2012-04-03 2012-04-03
US61/619,525 2012-04-03
US13/804,428 2013-03-14
US13/804,428 US20130255721A1 (en) 2012-04-03 2013-03-14 Concave nodule sponge brush

Publications (2)

Publication Number Publication Date
TW201347862A TW201347862A (zh) 2013-12-01
TWI648107B true TWI648107B (zh) 2019-01-21

Family

ID=49233229

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102110519A TWI648107B (zh) 2012-04-03 2013-03-25 凹型結核海綿刷

Country Status (5)

Country Link
US (1) US20130255721A1 (https=)
JP (2) JP6329126B2 (https=)
KR (1) KR102169190B1 (https=)
TW (1) TWI648107B (https=)
WO (1) WO2013151967A1 (https=)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD710062S1 (en) * 2011-06-09 2014-07-29 Ebara Corporation Roller shaft for semiconductor cleaning
US9202723B2 (en) 2011-11-29 2015-12-01 Illinois Tool Works, Inc. Brush with cantilevered nodules
US8778087B2 (en) 2012-04-03 2014-07-15 Illinois Tool Works Inc. Conical sponge brush for cleaning semiconductor wafers
USD735430S1 (en) * 2013-09-24 2015-07-28 Ebara Corporation Roller shaft for substrate cleaning
USD735429S1 (en) * 2013-09-24 2015-07-28 Ebara Corporation Roller shaft for substrate cleaning
USD735431S1 (en) * 2013-09-24 2015-07-28 Ebara Corporation Roller shaft for substrate cleaning
US10790167B2 (en) * 2014-02-20 2020-09-29 Entegris, Inc. Nodule ratios for targeted enhanced cleaning performance
JP6316730B2 (ja) * 2014-10-31 2018-04-25 株式会社荏原製作所 ロール部材、ペンシル部材、及びそれらの少なくともいずれか一方を含む基板処理装置
US10271636B2 (en) * 2014-11-10 2019-04-30 Illinois Tool Works Inc. Archimedes brush for semiconductor cleaning
JP7341227B2 (ja) 2018-06-14 2023-09-08 フィリップ・モーリス・プロダクツ・ソシエテ・アノニム ピロ触媒材料を有するエアロゾル発生装置
CN109037116B (zh) * 2018-08-31 2021-05-28 上海华力微电子有限公司 晶圆清洗装置
CN109225973A (zh) * 2018-09-10 2019-01-18 麦斯克电子材料有限公司 一种用于硅抛光片擦片清洗机的擦片刷装置
US10758946B2 (en) * 2019-01-23 2020-09-01 Tung An Development Ltd. Device of cleaning brush
EP4533528A4 (en) * 2022-05-31 2025-08-20 Entegris Inc Cleaning brush for semiconductor fabrication process
TWI827446B (zh) * 2023-01-16 2023-12-21 孫建忠 出水輪刷構造
TWI873778B (zh) * 2023-08-11 2025-02-21 碩晨生醫股份有限公司 清潔滾輪軸心
KR102848562B1 (ko) * 2024-07-11 2025-08-25 주식회사 아이맥 내부 돌기를 포함하는 반도체용 브러쉬

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060276108A1 (en) * 2003-08-08 2006-12-07 Benson Briant E Methods and materials for making a monolithic porous pad cast onto a rotatable base
TWM362051U (en) * 2009-02-26 2009-08-01 Tung An Dev Ltd Structure for cleaning
US20110162160A1 (en) * 2003-10-23 2011-07-07 R.E. Whittaker Company, Inc. Rollers and disks for carpet cleaning

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6502273B1 (en) 1996-11-08 2003-01-07 Kanebo, Ltd. Cleaning sponge roller
JP3403108B2 (ja) * 1999-02-26 2003-05-06 アイオン株式会社 洗浄用スポンジローラ
US6059888A (en) * 1997-11-14 2000-05-09 Creative Design Corporation Wafer cleaning system
DE19901243A1 (de) * 1999-01-14 2000-07-20 Heidelberger Druckmasch Ag Dosierbare Rasterwalze in einer Rotationsdruckmaschine
US6711775B2 (en) * 1999-06-10 2004-03-30 Lam Research Corporation System for cleaning a semiconductor wafer
JP2003051481A (ja) * 2001-08-07 2003-02-21 Hitachi Ltd 半導体集積回路装置の製造方法
TWI245671B (en) * 2005-03-08 2005-12-21 Quanta Display Inc Clean apparatus
KR20060116488A (ko) * 2005-05-10 2006-11-15 삼성전자주식회사 반도체 웨이퍼용 세정 브러쉬
JP2011112608A (ja) * 2009-11-30 2011-06-09 Okame Seisakusho:Kk 素材小欠陥深さ測定器
JP5535687B2 (ja) 2010-03-01 2014-07-02 株式会社荏原製作所 基板洗浄方法及び基板洗浄装置
US9202723B2 (en) * 2011-11-29 2015-12-01 Illinois Tool Works, Inc. Brush with cantilevered nodules

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060276108A1 (en) * 2003-08-08 2006-12-07 Benson Briant E Methods and materials for making a monolithic porous pad cast onto a rotatable base
US20110162160A1 (en) * 2003-10-23 2011-07-07 R.E. Whittaker Company, Inc. Rollers and disks for carpet cleaning
TWM362051U (en) * 2009-02-26 2009-08-01 Tung An Dev Ltd Structure for cleaning

Also Published As

Publication number Publication date
JP6820285B2 (ja) 2021-01-27
JP6329126B2 (ja) 2018-05-23
KR102169190B1 (ko) 2020-10-22
US20130255721A1 (en) 2013-10-03
KR20140141711A (ko) 2014-12-10
JP2018088546A (ja) 2018-06-07
TW201347862A (zh) 2013-12-01
WO2013151967A1 (en) 2013-10-10
JP2015517214A (ja) 2015-06-18

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